Liquid cooling system, liquid cooling system control method and electronic equipment

Abstract

The present application discloses a liquid cooling system, a liquid cooling system control method and an electronic device, and relates to the field of equipment heat dissipation technology. In the present application, a two-phase cooling medium with low conductivity is used to avoid leakage and conductivity of the cooling medium; a shell is used to accommodate the power supply module, and the sensible heat of the two-phase cooling medium is used to cool the power supply module, so that the two-phase refrigerant is converted into a saturated liquid after absorbing heat; a cold plate assembly is used to fit the power consumption module of the electronic device to be cooled, and the heat emitted by the power consumption module is transferred to the two-phase cooling medium in a saturated state flowing through, so that the two-phase cooling medium undergoes a phase change, and the power consumption module is cooled using the two-phase vaporization latent heat with the highest heat exchange efficiency. Therefore, the above scheme combines the heat dissipation characteristics of each component and the absorption potential of the two-phase cooling medium, takes into account the heat dissipation requirements of the power supply module and the high-power power consumption module, avoids the problem that the system heat dissipation capacity cannot meet the heat dissipation requirements, and has high heat dissipation efficiency and good effect.

Description

Technical Field

[0001] The present application relates to the technical field of device heat dissipation, and in particular to a liquid cooling system, a liquid cooling system control method, and an electronic device. Background Art

[0002] With the development of data centers, the demand for computing power continues to grow, and the power density requirements for servers are getting higher and higher. When the power density reaches a certain level, the air cooling system has reached its economical and effective cooling limit.

[0003] In related technologies, single-phase liquid cooling solutions are being used to retrofit existing air-cooled data centers to improve power efficiency, ensuring efficient heat dissipation while reducing energy consumption and operating expenses. However, the coolant in single-phase liquid cooling solutions is a conductive medium, and leaks can damage critical power-consuming components in servers. Furthermore, as the heat flux density and total power consumption of power-consuming components continue to rise, single-phase liquid cooling solutions are becoming less effective. Summary of the Invention

[0004] The present application provides a liquid cooling system, a liquid cooling system control method and an electronic device to at least solve the problem.

[0005] The present application provides a liquid cooling system, comprising:

[0006] Condensation assembly for cooling the two-phase cooling medium;

[0007] a circulation pump, connected to the liquid outlet of the condensing assembly, for pumping out the two-phase cooling medium;

[0008] A shell for accommodating a power supply module; a liquid inlet of the shell is connected to a liquid outlet of the circulation pump; the liquid outlet of the shell is connected to a first branch; the first branch is also connected to a liquid inlet of the condensing assembly;

[0009] The cold plate assembly is fitted with the power consumption module and is used to transfer the heat of the power consumption module to the two-phase cooling medium; the liquid outlet of the shell is also connected to the second branch; the second branch is connected to the liquid inlet of the cold plate assembly; the liquid outlet of the cold plate assembly is connected to the liquid inlet of the condensing assembly.

[0010] The present application also provides a liquid cooling system control method, which is applied to the above-mentioned liquid cooling system, and the method includes:

[0011] obtaining a first temperature of a two-phase cooling medium flowing into a liquid inlet of a housing and a second temperature of the two-phase cooling medium flowing out of a liquid outlet of the housing;

[0012] calculating a difference between the second temperature and the first temperature to obtain a degree of supercooling;

[0013] The subcooling degree is compared with a preset temperature difference condition. If the subcooling degree does not meet the preset temperature difference condition, the refrigeration state of the condensing component is controlled until the subcooling degree meets the preset temperature difference condition.

[0014] The present application also provides an electronic device, comprising:

[0015] Cabinets;

[0016] A power supply module is provided in the cabinet;

[0017] A power consumption module is provided in the cabinet;

[0018] The liquid cooling system described above.

[0019] The present application also provides another electronic device, comprising: a memory for storing a computer program; and a processor for implementing the steps of any of the above-mentioned liquid cooling system control methods when executing the computer program.

[0020] The present application also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of any of the above-mentioned liquid cooling system control methods are implemented.

[0021] The present application also provides a computer program product, including a computer program, which implements the steps of any of the above-mentioned liquid cooling system control methods when executed by a processor.

[0022] Through the present application, due to the use of a two-phase cooling medium with low conductivity, the risk of leakage and conduction of the cooling medium can be avoided; due to the use of a shell to accommodate the power supply module of the electronic device to be cooled, the power supply module is cooled by immersion liquid cooling. The cooling process uses the sensible heat of the two-phase cooling medium to cool the power supply module, so that the two-phase refrigerant is converted into a saturated liquid after absorbing heat, and does not involve a phase change of the two-phase cooling medium; due to the use of a cold plate assembly and the power consumption module of the electronic device to be cooled, the heat emitted by the power consumption module can be transferred to the two-phase cooling medium in a saturated state flowing through, so that the two-phase cooling medium undergoes a phase change, and the power consumption module is cooled by using the two-phase vaporization latent heat with the highest heat exchange efficiency, thereby realizing the cooling of the power consumption module with a high heat dissipation requirement by a two-phase cold plate method. Therefore, the above scheme combines the heat dissipation characteristics of each component and the absorption potential of the two-phase cooling medium to achieve efficient heat dissipation, taking into account the heat dissipation requirements of the power supply module and the high-power power consumption module, avoiding the problem that the system heat dissipation capacity cannot meet the heat dissipation requirements, and has high heat dissipation efficiency and good effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 A schematic diagram of the principle of a liquid cooling system provided by an embodiment of the present invention;

[0025] Figure 2 A schematic structural diagram of a liquid cooling system provided in an embodiment of the present invention;

[0026] Figure 3 A front view of a rack-mount server provided in an embodiment of the present invention;

[0027] Figure 4 A side view of a whole cabinet server provided by an embodiment of the present invention;

[0028] Figure 5 A schematic structural diagram of a liquid collector provided in an embodiment of the present invention;

[0029] Figure 6 A schematic diagram of the flow direction of a two-phase cooling medium in a graphics processing node according to an embodiment of the present invention;

[0030] Figure 7 A schematic diagram of the flow direction of a two-phase cooling medium in an exchange node according to an embodiment of the present invention;

[0031] Figure 8 A schematic diagram of the flow direction of a two-phase cooling medium in a computing node according to an embodiment of the present invention;

[0032] Figure 9 A schematic diagram of the flow direction of a two-phase cooling medium in an immersion liquid-cooled power supply module provided in an embodiment of the present invention;

[0033] Figure 10 A graph showing changes in pressure and boiling point provided by an embodiment of the present invention;

[0034] Figure 11 This is a flow chart of a liquid cooling system control method provided by an embodiment of the present invention;

[0035] Figure 12 This is a flow chart of another liquid cooling system control method provided by an embodiment of the present invention;

[0036] Figure 13 This is a structural block diagram of a liquid cooling system control device according to an embodiment of the present application;

[0037] Figure 14This is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 1-Condensation assembly; 2-Circulating pump; 3-Casing; 31-Sub-casing; 4-Cold plate assembly; 5-Control module; 6-Manifold; 7-Distributor; 81-First valve; 82-Second valve; 83-Third valve; 91-First thermometer; 92-Second thermometer; 93-Third thermometer; 94-Fourth thermometer; 101-First pressure gauge; 102-Second pressure gauge; 111-First flowmeter; 112-Second flowmeter; 12-Data acquisition Module; 13-liquid reservoir; 14-power supply module; 15-power consumption module; 151-graphics processing node; 1511-first switching module; 1512-graphics processing module; 152-switching node; 1521-second switching module; 1522-first input / output module; 153-computing node; 1531-second input / output module; 1532-solid state drive / mechanical hard drive; 1533-memory module; 1534-computing module; 16-cabinet. DETAILED DESCRIPTION

[0040] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0041] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0042] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0043] With the rapid development of cloud computing and big data, data volumes have exploded, driving the rapid growth of data centers. To meet the growing demand for computing power, the power density requirements for single cabinets are becoming increasingly higher. However, when the power density of a single cabinet reaches a certain level, such as 60kW, air cooling systems reach their cost-effective cooling limits.

[0044] Against this backdrop, liquid cooling technology has emerged, offering low PUE (Power Usage Effectiveness) (the ratio of a data center's total energy consumption to the energy consumed by its IT equipment) and high heat dissipation density (the amount of heat dissipated per unit area or volume). Liquid cooling technology not only excels in energy conservation but also effectively reduces data center operating costs. Compared to traditional air-cooling systems, it significantly improves energy efficiency, ensuring efficient heat dissipation while reducing energy consumption and operating expenses. Single-phase liquid cooling solutions dominate the liquid cooling market due to their ease of operation and maintenance and suitability for retrofitting existing air-cooled data centers.

[0045] At the same time, as data centers evolve towards larger and more intensive operations, IT (Information Technology) infrastructure is shifting from traditional rack-mounted servers to whole-cabinet servers, which are becoming the mainstream product form factor in large-scale data centers. Whole-cabinet servers design the cabinet and the server nodes within it as a whole, centralizing and pooling infrastructure (such as power and cooling) and ICT (Information and Communication Technology) resources (such as memory and storage). This improves the utilization efficiency and flexibility of computing and heterogeneous acceleration resources, reduces data center cooling energy consumption, enhances power system efficiency, increases deployment density, and shortens delivery times.

[0046] Therefore, full liquid cooling for whole-rack servers has become the inevitable choice for heat dissipation. Related technologies for liquid-cooled whole-rack servers use single-phase liquid cooling. However, the coolant used in single-phase liquid cooling is a conductive medium, and leaks can damage the server. This is especially true given the numerous critical power-consuming components (such as graphics processing modules) deployed in whole-rack servers. A leak can cause significant damage. Furthermore, with rising heat flux (heat flux, which describes the amount of heat passing through a unit area per unit time) and total power consumption, the heat dissipation efficiency of single-phase liquid cooling solutions is increasingly insufficient.

[0047] Based on this, an embodiment of the present application provides a liquid cooling system, Figure 1 A schematic diagram of the principle of a liquid cooling system provided by an embodiment of the present invention is shown in FIG. Figure 1 The heat dissipation control principle of the liquid cooling system is shown. Figure 2 A schematic structural diagram of a liquid cooling system provided by an embodiment of the present invention is shown. Figure 2 The specific structure of the liquid cooling system and the flow path of the two-phase cooling medium during heat dissipation control are shown. Figure 2As shown, the liquid cooling system includes a condensing assembly 1, a circulating pump 2, a housing 3, and a cold plate assembly 4. In actual application scenarios, the liquid cooling system can be applied to electronic equipment that needs to be cooled, such as single-node servers, whole-cabinet servers, switches, and routers. This is not limited here, and the liquid cooling system can be adaptively installed in the electronic equipment that needs to be cooled.

[0048] The condensing component 1 is a heat exchange device for cooling the refrigerant from a gaseous state and converting it into a liquid state in order to release heat and reduce the temperature. The refrigerant in this embodiment adopts a two-phase cooling medium. The cooling medium is a working medium circulating in the liquid cooling system. The two-phase cooling medium uses the phase change of the fluid between the liquid phase and the gas phase to efficiently dissipate heat. The condensing component 1 is used to cool the two-phase cooling medium. The condensing component 1 includes a condenser, which is used to cool the inflowing two-phase cooling medium. The condensing component 1 also includes a compressor, a condenser support structure, etc. The components included in the condensing component 1 can be set according to actual needs. The boiling point of the two-phase cooling medium is lower than that of the refrigerant in the single-phase liquid cooling scheme. For example, fluorinated liquids R134a, R513A, R515B, etc. can be used as the two-phase cooling medium.

[0049] The circulation pump 2 is connected to the liquid outlet of the condensing component 1 and is used to pump out the two-phase cooling medium cooled by the condensing component 1 and promote the two-phase cooling medium to circulate in the entire liquid cooling system.

[0050] The housing 3 is a sealed enclosure for accommodating the power supply module 14 (powershelf) of the electronic device. The liquid inlet of the housing 3 is connected to the liquid outlet of the circulating pump 2. The two-phase cooling medium can be injected into the housing 3 to cool the power supply module 14 by immersion liquid cooling. The liquid outlet of the housing 3 is connected to the first branch, which is also connected to the liquid inlet of the condensation assembly 1. In other words, the two-phase cooling medium flowing out of the liquid outlet of the housing 3 can flow through the first branch into the liquid inlet of the condensation assembly 1, entering the condensation assembly 1, completing the two-phase cooling medium flow cycle through the first branch.

[0051] It should be noted that since the power supply modules used in electronic equipment in the related art mostly use air cooling, if a full liquid cooling solution with better heat dissipation is to be achieved, the air cooling solution needs to be changed to a cold plate liquid cooling solution. However, due to the low heat flux density of the internal components of the power supply module, the large number of heat-generating components and their complex and diverse shapes, such as the circular curved shapes of transformers and capacitors, the power density per unit volume after the modification is greater than the air cooling effect, and the occupied volume is large. In addition, converting the power supply module from air cooling to cold plate liquid cooling requires a long and costly development cycle, while the development cycle of the entire cabinet server is relatively short. Therefore, it is difficult to meet the development cycle requirements of converting the power supply module from air cooling to cold plate liquid cooling.

[0052] Therefore, in this embodiment, the air-cooled power supply module in the related art can be transformed into an immersion liquid-cooled power supply module. Immersion liquid cooling is to completely immerse the heating element in a non-conductive, highly insulating coolant, and remove heat through the flow or phase change process of the coolant. In this embodiment, the coolant uses a two-phase cooling medium, and the two-phase cooling medium remains in a liquid state during the heat absorption process of the immersion liquid-cooled power supply module without undergoing a phase change. The heat is removed by the flow, and the two-phase cooling medium is converted into a saturated liquid state after flowing out of the immersion liquid-cooled power supply module. Specifically, the fan of the air-cooled power supply module in the related art is removed, replaced with a sealed shell, and a quick connector is added to transform it into an immersion liquid-cooled power supply module. This does not involve changes to the electrical components inside the air-cooled power supply module, such as circuit boards, capacitors, transformers, inductors, etc., thereby realizing the rapid utilization of the air-cooled power supply module in the related art. Therefore, this solution can be based on the electronic equipment in the relevant technology, and the air-cooled power supply module therein can be modified. It has a wide range of applications and does not require a large space. It avoids local air cooling of the power supply module in the electronic equipment, and cooperates with the cold plate assembly to perform liquid cooling on the power consumption module, realizing a full liquid cooling solution for electronic equipment, and improving the heat dissipation efficiency while being convenient and fast.

[0053] The cold plate assembly 4 is configured to be in close contact with the power consumption module 15 of the electronic device and is used to transfer heat from the power consumption module 15 to a two-phase cooling medium. Specifically, the two-phase cooling medium flows through the cold plate assembly 4. The cold plate assembly 4 can remove heat from the power consumption module 15 through contact with the power consumption module 15. The removed heat is then exchanged with the flowing two-phase cooling medium, thereby achieving cold plate heat dissipation for the power consumption module 15. The liquid outlet of the housing 3 is also connected to a second branch, which is connected to the liquid inlet of the cold plate assembly 4. In other words, the two-phase cooling medium flowing out of the liquid outlet of the housing 3 can also flow into the liquid inlet of the cold plate assembly 4 through the second branch. The liquid outlet of the cold plate assembly 4 is connected to the liquid inlet of the condensation assembly 1. In other words, the two-phase cooling medium flowing out of the liquid outlet of the cold plate assembly 4 also flows into the liquid inlet of the condensation assembly 1, entering the condensation assembly 1, completing the two-phase cooling medium flow cycle through the second branch.

[0054] During the circulation process, the two-phase cooling medium undergoes a phase change. Specifically, taking the two-phase cooling medium flow cycle through the second branch as an example, the two-phase cooling medium flowing out of the condensing assembly 1 passes through the circulating pump 2, the housing 3, and the cold plate assembly 4 in sequence before returning to the condensing assembly 1. The two-phase cooling medium is in a liquid state before entering the cold plate assembly 4. That is, the two-phase cooling medium does not undergo a phase change during the process of cooling the power module 14 contained in the housing 3. After absorbing heat from the power module 14, the two-phase cooling medium is converted into a saturated liquid state, which in turn cools the power module 15 equipped with the cold plate assembly 4. During the cooling process of the power module 15, a portion of the two-phase cooling medium absorbs heat and boils, undergoing a phase change from a saturated liquid state to a gaseous state. This phase change process absorbs heat, that is, the two-phase latent heat of vaporization with the highest heat exchange efficiency is utilized to cool the power module 15, resulting in high heat dissipation efficiency and good heat dissipation effect. After absorbing heat from the power module 15, the two-phase cooling medium is converted into a two-phase flow. The two-phase flow then enters the condensing assembly 1 and condenses into a liquid state, completing a cycle. Among them, two-phase flow refers to the flow phenomenon in which two phases exist simultaneously in a fluid system. The two-phase flow in this embodiment is a gas-liquid two-phase flow. Saturated liquid means that under specific pressure and temperature conditions, the refrigerant exists in liquid form and is in a saturated state, and the liquid molecules and gas molecules are in dynamic equilibrium, that is, the liquid molecules continue to evaporate into a gaseous state, and at the same time, the gaseous molecules continue to condense into a liquid state. The power supply module 14 is used to provide electrical energy to each power-consuming component in the electronic device. The power consumption module 15 is a power-consuming component in the electronic device with a large heat dissipation demand, such as a controller, a processor, etc. The primary side of the condensing component 1 is responsible for releasing heat, and the secondary side of the condensing component 1 is responsible for absorbing heat.

[0055] In an optional embodiment, the liquid cooling system also includes a control module 5, which is used to control the refrigeration state of the condensation component 1, ensuring that the two-phase cooling medium has a certain degree of supercooling before flowing into the power supply module 14, and cooling the power supply module 14 through sensible heat, so that the two-phase cooling medium is converted into a saturated liquid after flowing through the power supply module 14 and absorbing heat, avoiding premature generation of bubbles resulting in uneven two-phase flow, and making full use of the two-phase vaporization latent heat of the two-phase cooling medium to cool the power consumption module 15, efficiently transferring a large amount of heat, and meeting the large heat dissipation requirements of the high-power power consumption module 15, and by controlling the supercooling, the ratio of the sensible heat and the two-phase vaporization latent heat can be adjusted, affecting the stability of the two-phase flow, so that the two-phase flow is a preset dryness, ensuring that the two-phase cooling medium fully absorbs the heat of the power consumption module 15, avoiding excessive vaporization due to too high dryness, or liquid reflux due to too low dryness. Subcooling refers to the difference between the actual temperature of the liquid refrigerant at the condenser outlet and the saturation temperature at that pressure. In this embodiment, subcooling refers to the difference between the temperature of the two-phase cooling medium before it flows into the power supply module 14 and the temperature after it flows through the power supply module 14. Dryness refers to the ratio of the gas phase mass flow rate of the two-phase cooling medium to the total gas-liquid mass flow rate.

[0056] For example, taking the two-phase cooling medium as R134a (tetrafluoroethane), the liquid specific heat of R134a is 1.4 J / gK, and the corresponding latent heat of vaporization is about 175 J / g. When the supercooling degree is controlled at 5 degrees Celsius, the sensible heat absorbed after flowing through the power supply module 14 is 5×1.4=7 J / g. When the dryness after flowing through the power consumption module 15 is 0.8, the corresponding latent heat of vaporization is 140 J / g, so sensible heat / (sensible heat + latent heat) = 0.95, that is, 95%, that is, the heat absorbed by the two-phase cooling medium from the power consumption module 15 through the latent heat of vaporization accounts for 95% of the total heat absorbed in the cycle. Under normal circumstances, the efficiency of the power consumption module 15 is also around 95%. Utilizing this corresponding relationship, the energy losses of the liquid cooling system and the power supply module 14 can be collaboratively optimized. By controlling the supercooling of the two-phase cooling medium, it is possible to maintain the two-phase cooling medium in a saturated liquid state after flowing through the power supply module 14 and to achieve a preset dryness of the two-phase cooling medium after flowing through the power consumption module 15, thereby achieving the dryness target. The latent heat of vaporization refers to the energy required to convert a unit of substance from liquid to gas under two-phase equilibrium conditions.

[0057] It should be noted that the various modules in the liquid cooling system are connected by pipes, and the two-phase cooling medium flows in the pipes. For example, the condensation component 1 and the circulation pump 2 are connected by a first pipe, and the two-phase cooling medium flowing out of the liquid outlet of the condensation component 1 flows into the liquid inlet of the circulation pump 2 through the first pipe.

[0058] In an optional embodiment, the system also includes a manifold 6 for uniformly distributing and recovering the two-phase cooling medium. The manifold 6 includes a manifold and a collecting pipe. The first liquid inlet of the manifold is connected to the liquid outlet of the circulating pump 2, and the two-phase cooling medium flowing out of the liquid outlet of the circulating pump 2 flows into the first liquid inlet of the manifold. The first liquid outlet of the manifold is connected to the liquid inlet of the shell 3, and the two-phase cooling medium flowing out of the first liquid outlet of the manifold flows into the liquid inlet of the shell 3. The first liquid inlet of the collecting pipe is connected to the liquid outlet of the shell 3, and the first liquid outlet of the collecting pipe is connected to the second branch, and the two-phase cooling medium flowing out of the liquid outlet of the shell 3 flows into the first liquid inlet of the collecting pipe, then flows out from the first liquid outlet of the collecting pipe, and then flows into the second branch.

[0059] In an optional embodiment, the system further includes a liquid separator 7, wherein the first liquid inlet of the liquid separator 7 is connected to the first liquid outlet of the liquid separator pipe, the first liquid outlet of the liquid separator 7 is connected to the liquid inlet of the shell 3, the liquid outlet of the shell 3 is connected to the second liquid inlet of the liquid separator 7, and the second liquid outlet of the liquid separator 7 is connected to the first liquid inlet of the collecting pipe. In other words, the two-phase cooling medium flowing out of the first liquid outlet of the liquid separator pipe of the liquid separator 6 flows into the liquid separator 7 from the first liquid inlet of the liquid separator 7, flows out from the first liquid outlet of the liquid separator 7, flows into the liquid inlet of the shell 3, flows out from the liquid outlet of the shell 3, flows into the second liquid inlet of the liquid separator 7, flows out from the second liquid outlet of the liquid separator 7, and flows into the first liquid inlet of the collecting pipe of the liquid separator 6. The third liquid outlet of the liquid separator 7 is connected to the first branch. In other words, the two-phase cooling medium in the liquid separator 7 can flow through the second liquid outlet of the liquid separator 7 to the liquid collecting pipe and then to the second branch to cool the power consumption module 15, and can also flow through the third liquid outlet of the liquid separator 7 to the first branch and be directly recovered to the condensing assembly 1. By controlling the flow ratio of the two-phase cooling medium diverted to the first branch and the second branch, the cooling process of the power consumption module 15 can be more accurately controlled, the control accuracy of the two-phase flow dryness is improved, and the heat dissipation effect of the system is improved.

[0060] In an optional embodiment, the power supply module 14 includes multiple power supply units (Power Supply Unit, PSU), and the number of power supply units can be set according to actual needs. The housing 3 includes sub-housings 31 for accommodating the multiple power supply units, and the power supply units and sub-housings 31 correspond one to one. The liquid dispenser 7 also includes multiple first liquid outlets respectively connected to the liquid inlets of the multiple sub-housings 31, and the multiple sub-housings 31 correspond one to one with the multiple first liquid outlets of the liquid dispenser 7. The liquid dispenser 7 also includes multiple second liquid inlets respectively connected to the liquid outlets of the multiple sub-housings 31, and the multiple sub-housings 31 correspond one to one with the multiple second liquid inlets of the liquid dispenser 7. Taking the first sub-housing of the first power supply unit of the power supply module 14 as an example, the two-phase cooling medium in the liquid separator 7 enters the liquid inlet of the first sub-housing through the first liquid outlet of the liquid separator 7 corresponding to the first sub-housing, absorbs heat dissipated by the first power supply unit housed in the first sub-housing, flows out of the liquid outlet of the first sub-housing, and then flows back into the liquid separator 7 through the second liquid inlet of the liquid separator 7 corresponding to the first sub-housing. The process of the two-phase cooling medium in the liquid separator 7 flowing into each sub-housing 31 can be parallel.

[0061] In an optional embodiment, the cold plate assembly 4 includes a cold plate and a cold plate pipeline. The cold plate is positioned in contact with the power consumption module 15 to conduct heat away from the power consumption module 15. The cold plate pipeline is disposed on one side of the cold plate to circulate the two-phase cooling medium to exchange heat with the cold plate.

[0062] In an optional embodiment, the liquid separator further includes a second liquid inlet, which is connected to the first liquid outlet of the collecting pipe. That is, after the two-phase cooling medium cools the power supply module 14, it flows out from the first liquid outlet of the collecting pipe and then flows into the second liquid inlet of the liquid separator, thereby being used to cool the power consumption module 15. The liquid separator further includes a second liquid outlet, which is connected to the liquid inlet of the cold plate pipeline of the cold plate assembly 4. The two-phase cooling medium in the liquid separator flows out from the second liquid outlet of the liquid separator and enters the liquid inlet of the cold plate pipeline to absorb the heat dissipated by the power consumption module 15. The collecting pipe also includes a second liquid inlet, the liquid outlet of the cold plate pipeline is connected to the second liquid inlet of the collecting pipe, and the second liquid outlet of the collecting pipe is connected to the liquid inlet of the condensing component 1. After the two-phase cooling medium absorbs the heat dissipated by the power consumption module 15, it flows out from the liquid outlet of the cold plate pipeline, enters the second liquid inlet of the collecting pipe, and then flows out from the second liquid outlet of the collecting pipe, and then flows into the liquid inlet of the condensing component 1 and flows back to the condensing component 1.

[0063] In an optional embodiment, the power consumption module 15 includes a plurality of power consumption nodes, and the system further includes a plurality of cold plate assemblies 4 respectively arranged in contact with the plurality of power consumption nodes, and each power consumption node is provided with at least one cold plate assembly 4. The liquid distribution pipe further includes a plurality of second liquid outlets, and the plurality of second liquid outlets of the liquid distribution pipe are respectively connected to the liquid inlets of the cold plate pipelines corresponding to the plurality of power consumption nodes, and the plurality of second liquid outlets of the liquid distribution pipe correspond one-to-one with the plurality of power consumption nodes. The liquid collection pipe further includes a plurality of second liquid inlets, and the liquid outlets of the cold plate pipelines corresponding to the plurality of power consumption nodes are respectively connected to the plurality of second liquid inlets of the liquid collection pipe, and the plurality of second liquid inlets of the liquid collection pipe correspond one-to-one with the plurality of power consumption nodes.

[0064] In an optional embodiment, the electronic device is a whole cabinet server, and the multiple power consumption nodes include at least one graphics processing node 151, at least one switching node 152, and at least one computing node 153 arranged in sequence. The multiple second liquid outlets of the liquid distribution pipe send the two-phase cooling medium into the at least one graphics processing node 151, at least one switching node 152, and at least one computing node 153 in parallel. After the two-phase cooling medium absorbs heat, it is recycled into the collecting pipe through the multiple second liquid inlets of the collecting pipe. In this embodiment, there is no limit on the number of graphics processing nodes 151, switching nodes 152, and computing nodes 153, and they can be set according to actual needs. The layout position of the at least one graphics processing node 151, at least one switching node 152, and at least one computing node 153 in the height direction can also be adjusted according to actual needs, for example, two graphics processing nodes 151 are placed in the same row, etc., which is not limited in this embodiment.

[0065] For example, taking the electronic equipment as a whole cabinet server as an example, Figure 3 This is a front view of a rack-mount server provided by an embodiment of the present invention. The rack-mount server includes a rack 16, which contains, from top to bottom, a power supply module 14, multiple graphics processing nodes 151 (GPU nodes, GPU stands for Graphics Processing Unit), multiple switching nodes 152 (SW nodes, used to forward data packets between multiple nodes to ensure efficient data transmission and stable network operation, SW stands for Switch Chip), and multiple computing nodes 153 (CPU nodes, CPU stands for Central Processing Unit). It should be noted that Figure 3In the figure, 5 graphics processing nodes 151, 2 switching nodes 152 and 4 computing nodes 153 are taken as an example, that is, 1 power supply module 14, 5 graphics processing nodes 151, 2 switching nodes 152 and 4 computing nodes 153 are arranged in sequence from top to bottom in the cabinet 16. In actual application scenarios, the number of graphics processing nodes 151, switching nodes 152 and computing nodes 153 can be set according to needs. Figure 4 A side view of a whole cabinet server provided by an embodiment of the present invention, as shown in FIG. Figure 4 As shown, the manifold 6 is arranged on one side of the whole cabinet server. The manifold 6 can be fixed on the cabinet 16 by using relevant components, and blind plug quick connectors are used to connect each power consumption node with the manifold 6. Figure 5 A schematic diagram of the structure of a liquid collector provided in an embodiment of the present invention, Figure 5 correspond Figure 3 From the rear, it can be seen that the inlet and outlet of the manifold 6 are located on the same vertical pipe, which is separated by a partition plate. The Blind Mate Quick Disconnect (QD) is a fluid connector that automatically connects and disconnects without manual alignment and is suitable for use in confined spaces or environments with limited visibility.

[0066] In an optional embodiment, the liquid inlet of the graphics processing node 151 is sequentially connected to the cold plate assembly corresponding to the first switching module 1511 , the cold plate assembly corresponding to the graphics processing module 1512 , and the liquid outlet of the graphics processing node 151 . Figure 6 Schematic diagram of the flow direction of the dual-phase cooling medium in the graphics processing node provided by the embodiment of the present invention (the cold plate assembly is not shown in the figure), corresponding to Figure 3 The graphics processing node 151 includes a first switching module 1511 and a graphics processing module 1512. Each of the first switching module 1511 and the graphics processing module 1512 is equipped with a corresponding cold plate assembly. After flowing into the graphics processing node 151 through its liquid inlet, the two-phase cooling medium passes through the cold plate assembly corresponding to the first switching module 1511 and the cold plate assembly corresponding to the graphics processing module 1512, becoming a two-phase flow with the desired dryness. The flow then flows out of the liquid outlet of the graphics processing node and is recovered into the liquid collection pipe.

[0067] In an optional embodiment, the liquid inlet of the exchange node 152 is sequentially connected to the cold plate assembly corresponding to the second exchange module 1521 , the cold plate assembly corresponding to the first input / output module 1522 , and the liquid outlet of the exchange node 152 . Figure 7 Schematic diagram of the flow direction of the two-phase cooling medium in the exchange node provided by the embodiment of the present invention (the cold plate assembly is not shown in the figure), corresponding to Figure 3The switching node 152 includes a second switching module 1521 and a first input / output chip (IO) 1522. Each of the second switching module 1521 and the IO chip is equipped with a corresponding cold plate assembly. After flowing into the switching node 152 through the liquid inlet, the two-phase cooling medium passes through the cold plate assembly corresponding to the second switching module 1521 and the cold plate assembly corresponding to the first IO module 1522, becoming a two-phase flow with the desired dryness. The flow then flows out of the switching node 152 through the liquid outlet and is recovered into the liquid collection pipe.

[0068] In an optional embodiment, the liquid inlet of the computing node 153 is connected in sequence to the cold plate assembly corresponding to the second input and output module 1531, the cold plate assembly corresponding to the solid-state drive / mechanical hard drive 1532, the cold plate assemblies corresponding to the cross-arranged memory module 1533 and the computing module 1534, and the liquid outlet of the computing node 153. Figure 8 Schematic diagram of the flow direction of the two-phase refrigerant in the computing node 153 provided by the embodiment of the present invention (the cold plate assembly is not shown in the figure), corresponding to Figure 3 The computing node 153 includes a second input / output module 1531, a solid-state drive (SSD) / hard disk drive (HDD), a cross-arranged memory module 1533, and a computing module 1534 (CPU). The memory module 1533 may be a dual in-line memory module (DIMM). Exemplarily, the cross-arranged memory modules 1533 and computing modules 1534 are arranged in the order of memory module 1533, computing module 1534, and memory module 1533, and so on. For example, a total of three memory modules 1533 and two computing modules 1534 are arranged in the order of memory module-computing module-memory module-computing module-memory module. The second input / output module 1531, solid-state drive / hard disk drive 1532, memory module 1533, and computing module 1534 are each provided with a corresponding cold plate assembly. After the two-phase cooling medium flows into the liquid inlet of the computing node 153, it passes through the cold plate assembly corresponding to the second input and output module 1531, the cold plate assembly corresponding to the solid-state drive / mechanical hard disk 1532, and the cold plate assemblies corresponding to the cross-arranged memory module 1533 and the computing module 1534, respectively, and becomes a two-phase flow with the expected dryness. It flows out from the liquid outlet of the computing node 153 and is recovered into the collecting pipe.

[0069] Figure 9 Schematic diagram of the flow direction of the two-phase cooling medium in the power supply module provided in the embodiment of the present invention, corresponding to Figure 3 The overlooking direction. Figure 9Taking the power supply module 14 including 4 power supply units as an example, the two-phase cooling medium flows in from the liquid inlet of the sub-shell 31 corresponding to each power supply unit, absorbs heat and is converted into a saturated liquid, and then flows out through the liquid outlet of the sub-shell 31 corresponding to each power supply unit and flows back to the liquid separator 7.

[0070] In an optional embodiment, the system further includes a first valve 81, which is arranged between the liquid outlet of the circulation pump 2 and the liquid inlet of the shell 3, and is used to control the flow rate of the two-phase cooling medium flowing through. The control module 5 is also used to control the opening of the first valve 81, so that the two-phase cooling medium is converted into a saturated liquid after flowing through the power supply module 14 and absorbing heat, and the two-phase flow is made to have a preset dryness. In actual application scenarios, the control module 5 can also coordinately control the refrigeration state of the condensing component 1, the speed of the circulation pump 2, and the opening of the first valve 81, so as to improve the control efficiency of the supercooling of the two-phase cooling medium and enhance the heat dissipation effect of the system.

[0071] In an optional embodiment, the system further includes a first thermometer 91 and a second thermometer 92. The first thermometer 91 is used to measure a first temperature of the two-phase cooling medium flowing into the liquid inlet of the housing 3, and the second thermometer 92 is used to measure a second temperature of the two-phase cooling medium flowing out of the liquid outlet of the housing 3. When the difference between the first temperature and the second temperature meets a preset temperature difference condition, the two-phase cooling medium, after absorbing heat from the power supply module 14, is in a saturated liquid state.

[0072] Since the pressure of the two-phase flow system is unstable, a certain degree of subcooling is required at the inlet of the circulating pump 2. If the subcooling is too low, vaporization is likely to occur, resulting in cavitation (bubble bursts and impacts the impeller of the circulating pump 2), affecting the life and reliability of the circulating pump 2. If the subcooling is too high, only single-phase liquid cooling can be achieved, and the heat dissipation efficiency drops sharply. Especially when multiple heat sources are connected in series, the heat transfer capacity of the front part of the series connection is weak due to the subcooling, and the convection heat transfer coefficient is one order of magnitude lower than the phase change boiling heat transfer coefficient; after the middle part of the series connection enters the two-phase heat exchange, as the pressure decreases, the boiling point gradually decreases, resulting in the temperature of the components in the rear part of the series connection being lower than the temperature of the components in the front part of the series connection, resulting in a temperature change trend opposite to that of the single-phase cold plate (the temperature gradually increases after absorbing heat). For example, Figure 10 The pressure and boiling point change curve provided in the embodiment of the present invention is shown in Table 1, which is a relationship table between pressure (unit: kilopascals, kpa) and boiling point (unit: degrees Celsius, °C). As the pressure increases, the boiling point temperature also gradually increases.

[0073] Table 1: Pressure and boiling point relationship table.

[0074]

[0075] Therefore, it is necessary to monitor the pressure changes during the heat dissipation process. In an optional embodiment, the system also includes a first pressure gauge 101 and a second pressure gauge 102, the first pressure gauge 101 is used to measure the first pressure at the measurement point of the first thermometer 91, and the second pressure gauge 102 is used to measure the second pressure at the measurement point of the second thermometer 92. When the saturated boiling point corresponding to the second pressure is consistent with the second temperature, the two-phase cooling medium flowing through the power supply module 14 after absorbing heat is in a saturated liquid state. By monitoring the pressure changes during the heat dissipation process, it is possible to more accurately obtain the saturation degree of the two-phase cooling medium after flowing out of the power supply module 14, under the premise that the supercooling degree meets the requirements, so that the two-phase cooling medium reaches a saturated liquid state as much as possible after flowing out of the power supply module 14, ensuring the subsequent heat dissipation effect on the power consumption module 15, thereby improving the heat dissipation efficiency of the system, and avoiding the risk of premature vaporization of the two-phase cooling medium causing cavitation of the fluid mechanical flow components in the electronic equipment, thereby ensuring the stable and reliable operation of the electronic components.

[0076] In an optional embodiment, the system further includes a first flow meter 111 and a second flow meter 112, wherein the first flow meter 111 is used to measure the first flow of the two-phase cooling medium flowing out of the liquid outlet of the circulation pump 2, and the second flow meter 112 is used to measure the second flow of the two-phase cooling medium in the second branch. In actual application scenarios, the flow of the two-phase cooling medium in the second branch can be calculated based on the heat dissipation power of the power supply module 14, the density and specific heat capacity of the two-phase cooling medium, which is called the third flow rate. The calculated third flow rate is compared with the measured second flow rate. If they are inconsistent, it means that the first flow meter 111 and the second flow meter 112 may have a fault, resulting in an error in the measured flow data, and then executing a sensor accuracy fault alarm, so that relevant technical personnel can promptly check and eliminate the system fault to ensure the cooling effect of the system. Among them, the first flow meter 111 can be set between the first valve 81 and the power supply module 14, and can be set between the circulation pump 2 and the first valve 81. The flow data measured at the two places should be the same, and the position of the first flow meter 111 can be set according to actual needs.

[0077] In an optional embodiment, the system further includes a data acquisition module 12. The data acquisition module 12 is connected to the first thermometer 91; the data acquisition module 12 is also connected to the second thermometer 92; the data acquisition module 12 is also connected to the first pressure gauge 101; the data acquisition module 12 is also connected to the second pressure gauge 102; the data acquisition module 12 is also connected to the first flow meter 111; the data acquisition module 12 is also connected to the second flow meter 112; the data acquisition module 12 is also connected to the power supply module 14; and the data acquisition module 12 is also connected to the control module 5. The data acquisition module 12 can respectively collect the first temperature, the second temperature, the first pressure, the second pressure, the first flow rate, the second flow rate, and the heat dissipation power and output power of the power supply module 14, and transmit the data to the control module 5 so that the control module 5 can control the operation process of the liquid cooling system.

[0078] In an optional embodiment, the system further includes a liquid reservoir 13, the liquid outlet of the condensing component 1 is connected to the liquid inlet of the liquid reservoir 13, and the liquid outlet of the liquid reservoir 13 is connected to the liquid inlet of the circulating pump 2. The liquid reservoir 13 is used to store a two-phase cooling medium. The liquid separator 7 further includes a fourth liquid outlet, and the fourth liquid outlet of the liquid separator 7 is connected to the liquid inlet of the liquid reservoir 13, that is, the two-phase cooling medium in the liquid separator 7 can also flow to the liquid reservoir 13 through the fourth liquid outlet of the liquid separator 7. By controlling the flow ratio of the two-phase cooling medium diverted to the first branch, diverted to the second branch, and diverted to the liquid reservoir 13, the accuracy of controlling the cooling process of the power consumption module 15 can be further improved, thereby improving the accuracy of controlling the dryness of the two-phase flow and improving the cooling effect of the system.

[0079] In an optional embodiment, the system further includes a second valve 82 and a third valve 83. The second valve 82 is used to control the flow of the third liquid outlet of the liquid separator 7. When the opening of the second valve 82 changes, the flow of the two-phase cooling medium shunted from the liquid separator 7 to the first branch changes accordingly. The third valve 83 is used to control the flow of the fourth liquid outlet of the liquid separator 7. When the opening of the third valve 83 changes, the flow of the two-phase cooling medium shunted from the liquid separator 7 to the liquid reservoir 13 changes accordingly. During the cooling process, the control of the opening of the second valve 82 and the control of the opening of the third valve 83 can also be combined to more accurately control the liquid separation ratio and improve the heat dissipation effect of the system.

[0080] In an optional embodiment, the system further includes a third thermometer 93 and a fourth thermometer 94. The third thermometer 93 is used to measure the third temperature of the two-phase cooling medium diverted from the liquid separator 7 to the first branch. The fourth thermometer 94 is used to measure the fourth temperature of the two-phase cooling medium diverted from the liquid separator 7 to the liquid reservoir 13. By monitoring the third temperature / fourth temperature, the temperature of the two-phase cooling medium in the liquid separator 7 when it is diverted to the first branch / liquid reservoir 13 can be more accurately obtained, the cooling state of the condensing assembly 1 can be more accurately controlled / the ambient temperature of the liquid reservoir 13 can be monitored, and the stable operation of the system and the heat dissipation effect of the system can be maintained.

[0081] The liquid cooling system provided by this embodiment adopts a two-phase cooling medium with low conductivity, thereby avoiding the risk of leakage and conduction of the cooling medium; since the power supply module of the electronic device to be cooled is accommodated in a shell, the power supply module is cooled by immersion liquid cooling. The cooling process uses the sensible heat of the two-phase cooling medium to cool the power supply module, so that the two-phase refrigerant is converted into a saturated liquid after absorbing heat, and does not involve a phase change of the two-phase cooling medium; since the cold plate assembly is arranged in a close relationship with the power consumption module of the electronic device to be cooled, the heat emitted by the power consumption module can be transferred to the two-phase cooling medium in a saturated state flowing through, so that the two-phase cooling medium undergoes a phase change, and the power consumption module is cooled by using the two-phase vaporization latent heat with the highest heat exchange efficiency, thereby realizing a two-phase cold plate cooling method for the power consumption module with high heat dissipation requirements. Therefore, the above scheme combines the heat dissipation characteristics of each component and the absorption potential of the two-phase cooling medium to achieve efficient heat dissipation, taking into account the heat dissipation requirements of the power supply module and the high-power power consumption module, avoiding the problem that the system heat dissipation capacity cannot meet the heat dissipation requirements, and has high heat dissipation efficiency and good effect.

[0082] The embodiment of the present application provides a liquid cooling system control method, which is applied to Figure 1 The liquid cooling system shown in the embodiment is executed by the control module 5 in the liquid cooling system. Figure 11 This is a flow chart of a liquid cooling system control method provided by an embodiment of the present invention. Figure 11 As shown, the process includes the following steps.

[0083] The specific steps are as follows:

[0084] Step S1101 , obtaining a first temperature of the two-phase cooling medium flowing into the liquid inlet of the shell 3 and a second temperature of the two-phase cooling medium flowing out of the liquid outlet of the shell 3 .

[0085] Optionally, the first temperature of the two-phase cooling medium flowing into the liquid inlet of the shell 3 is measured by a first thermometer 91, and the second temperature of the two-phase cooling medium flowing out of the liquid outlet of the shell 3 is measured by a second thermometer 92. The first thermometer 91 is connected to the data acquisition module 12 in the liquid cooling system, and the second thermometer 92 is connected to the data acquisition module 12 in the liquid cooling system. The first temperature and the second temperature can be obtained through the data acquisition module 12.

[0086] Step S1102: Calculate the difference between the second temperature and the first temperature to obtain the degree of supercooling.

[0087] The second temperature of the two-phase cooling medium flowing out of the liquid outlet of the shell 3 and the first temperature of the two-phase cooling medium flowing into the liquid inlet of the shell 3 are calculated to obtain the temperature difference before and after the two-phase cooling medium cools the power module as the supercooling degree.

[0088] In step S1103 , the subcooling degree is compared with a preset temperature difference condition. If the subcooling degree does not meet the preset temperature difference condition, the refrigeration state of the condensing component 1 is controlled until the subcooling degree meets the preset temperature difference condition.

[0089] This preset temperature difference condition indicates a target subcooling value or target subcooling range that meets the system's heat dissipation requirements and can be set based on actual needs. If the subcooling does not meet the preset temperature difference condition, the cooling state of the condensing assembly 1 in the liquid cooling system is controlled until the two-phase cooling medium absorbs heat and converts to a saturated liquid state after cooling the power module 14, and the two-phase cooling medium absorbs heat and converts to a two-phase flow with a preset dryness. The cooling state of the condensing assembly 1 may include condensing pressure, condensing temperature, and heat transfer efficiency. The condensing pressure refers to the saturation pressure of the refrigerant when it transitions from gas to liquid in the condenser. It is expressed in MPa or kPa and is determined by the refrigerant type, system load, and cooling medium (in this embodiment, a two-phase cooling medium). For example, the condensing pressure of R410A at an ambient temperature of 35°C is approximately 2.4-2.8 MPa. In practical applications, it's necessary to maintain the condensing pressure within a certain range to avoid system overpressure. For example, during high summer temperatures, the condensing pressure is more likely to rise. Within a certain range, an increase in condensing pressure increases the refrigerant's enthalpy difference (e.g., an increase in the compressor's discharge pressure), thereby increasing the cooling capacity per unit mass of refrigerant. The condensing temperature, expressed in degrees Celsius, is the saturation temperature at which the refrigerant undergoes a phase change (e.g., from gas to liquid) at the condensing pressure. This temperature is positively correlated with the condensing pressure and can be found in a refrigerant saturation properties table. For example, the condensing temperature of R134a at a pressure of 1.0 MPa is approximately 40°C. Cooling capacity can be increased by lowering the condensing temperature (e.g., by increasing the fan / water pump flow rate. In this embodiment, this can be achieved by increasing the flow rate of circulating pump 2), but this requires a balance between cost and energy consumption. The heat exchange efficiency is the ratio of the actual heat exchange capacity of the condensing assembly 1 to the theoretical maximum heat exchange capacity, reflecting the adequacy of heat transfer. When controlling the refrigeration state of the condensing component 1, the condensing pressure, the condensing temperature and the heat exchange efficiency can be controlled in a coordinated manner. For example, an increase in the heat exchange efficiency can reduce the condensing temperature and pressure, thereby indirectly improving the refrigeration capacity. During daily monitoring and maintenance, the heat exchange efficiency can be ensured to be stable by regularly cleaning the condenser and checking the flow of the cooling medium. Ambient temperature, ambient humidity, etc. may also affect the refrigeration effect of the condensing component 1. When controlling the refrigeration state of the condensing component 1, the ambient temperature and ambient humidity can also be collected, and the condensing pressure, the condensing temperature and the heat exchange efficiency can be adjusted according to the ambient temperature and ambient humidity. For example, an excessively high ambient temperature may cause the condensing pressure and condensing temperature to increase, requiring enhanced heat dissipation measures.

[0090] In an optional embodiment, the preset temperature difference condition is equal to the preset temperature difference, which can be set according to actual needs. The subcooling degree is compared with the preset temperature difference condition, that is, the subcooling degree is compared with the preset temperature difference. If the subcooling degree is greater than the preset temperature difference, the condensing component 1 is controlled to increase the cooling capacity, for example, by lowering the condensing temperature and condensing pressure, thereby improving the heat exchange efficiency. If the subcooling degree is less than the preset temperature difference, the condensing component 1 is controlled to reduce the cooling capacity, for example, by raising the condensing temperature and condensing pressure, thereby reducing the heat exchange efficiency. Then, the process returns to the step of comparing the subcooling degree with the preset temperature difference until the subcooling degree is equal to the preset temperature difference.

[0091] In an optional embodiment, the preset temperature difference condition is within a preset temperature difference range, which includes a preset temperature difference upper limit and a preset temperature difference lower limit. This prevents oversensitivity in determining whether the subcooling meets the preset temperature difference condition, which may result in sudden errors or fluctuations in the subcooling data affecting the control process and causing over-response. By setting the preset temperature difference condition to be within the preset temperature difference range, system robustness can be improved. The subcooling is compared with the preset temperature difference condition, that is, the subcooling is compared with the preset temperature difference range. If the subcooling is greater than the preset temperature difference upper limit, the condensing assembly 1 in the liquid cooling system is controlled to increase the cooling capacity, for example, by lowering the condensing temperature and condensing pressure, thereby improving heat exchange efficiency. If the subcooling is less than the preset temperature difference lower limit, the condensing assembly 1 is controlled to reduce the cooling capacity, for example, by raising the condensing temperature and condensing pressure, thereby reducing heat exchange efficiency. Then, the process returns to the step of comparing the subcooling with the preset temperature difference range until the subcooling is within the preset temperature difference range.

[0092] In an optional embodiment, the control of the refrigeration state of the condensing assembly 1 and the control of the speed of the circulating pump 2 can be combined for coordinated control to achieve the desired heat dissipation effect. The speed of the circulating pump 2 directly determines the flow rate of the two-phase cooling medium. When the flow rate increases, the flow rate of the two-phase cooling medium in the condensing assembly 1 increases, enhancing heat exchange. Insufficient flow may lead to laminar flow, reduce heat exchange efficiency, and increase the condensation temperature. Specifically, the supercooling degree is compared with the preset temperature difference condition. If the supercooling degree does not meet the preset condition, the refrigeration state of the condensing assembly 1 and the speed of the circulating pump 2 are controlled so that the two-phase cooling medium absorbs heat and converts to a saturated liquid state after cooling the power module 14, and the two-phase cooling medium absorbs heat and converts to a two-phase flow with a preset dryness after cooling the power module 15. By coordinated control of the refrigeration state of the condensing assembly 1 and the speed of the circulating pump 2, the heat dissipation efficiency can be improved, the supercooling degree can be made to meet the requirements as soon as possible, and the two-phase cooling medium absorbs heat and converts to a saturated liquid state after cooling the power module 14, and the two-phase cooling medium absorbs heat and converts to a two-phase flow with a preset dryness after cooling the power module 15.

[0093] In an optional embodiment, the preset temperature difference condition is equal to the preset temperature difference. The subcooling degree is compared with the preset temperature difference. If the subcooling degree is greater than the preset temperature difference, the condensing assembly 1 is controlled to increase the refrigeration capacity and the circulating pump 2 is controlled to increase the speed. If the subcooling degree is less than the preset temperature difference, the condensing assembly 1 is controlled to reduce the refrigeration capacity and the circulating pump 2 is controlled to reduce the speed. Then, the process returns to the step of comparing the subcooling degree with the preset temperature difference until the subcooling degree is equal to the preset temperature difference.

[0094] In an optional embodiment, the preset temperature difference condition is a preset temperature difference range. The subcooling degree is compared with the preset temperature difference range. If the subcooling degree is greater than the preset temperature difference upper limit, the condensing assembly 1 is controlled to increase the refrigeration capacity and the circulating pump 2 is controlled to increase the speed. If the subcooling degree is less than the preset temperature difference lower limit, the condensing assembly 1 is controlled to reduce the refrigeration capacity and the circulating pump 2 is controlled to reduce the speed. Then, the process returns to the step of comparing the subcooling degree with the preset temperature difference range until the subcooling degree is within the preset temperature difference range.

[0095] In an optional embodiment, the control of the refrigeration state of the condensing component 1, the control of the speed of the circulating pump 2 and the control of the opening of the first valve 81 can also be combined for coordinated control to achieve the desired heat dissipation effect. The opening of the first valve 81 affects the flow rate of the two-phase cooling medium. When other conditions remain unchanged, the larger the opening of the first valve 81, the larger the flow rate of the two-phase cooling medium. The supercooling degree is compared with the preset temperature difference condition. If the supercooling degree does not meet the preset temperature difference condition, the refrigeration state of the condensing component 1, the speed of the circulating pump 2 and the opening of the first valve 81 are controlled so that the two-phase cooling medium absorbs heat and is converted into a saturated liquid after cooling the power supply module 14, and the two-phase flow converted into a preset dryness after the two-phase cooling medium absorbs heat and cools the power consumption module 15. By coordinating the cooling state of the condensing component 1, the rotation speed of the circulating pump 2 and the opening of the first valve 81, the heat dissipation efficiency can be further improved, and the supercooling degree can be made to meet the demand as soon as possible, so that the two-phase cooling medium absorbs heat and is converted into a saturated liquid after cooling the power supply module 14, and the two-phase flow converted by the two-phase cooling medium after absorbing heat and cooling the power consumption module 15 is a preset dryness.

[0096] In an optional embodiment, the preset temperature difference condition is equal to the preset temperature difference. The subcooling degree is compared with the preset temperature difference. If the subcooling degree is greater than the preset temperature difference, the condensing assembly 1 is controlled to increase the refrigeration capacity, the circulating pump 2 is controlled to increase the speed, and the first valve 81 is controlled to increase the opening. If the subcooling degree is less than the preset temperature difference, the condensing assembly 1 is controlled to reduce the refrigeration capacity, the circulating pump 2 is controlled to reduce the speed, and the first valve 81 is controlled to decrease the opening. Then, the process returns to the step of comparing the subcooling degree with the preset temperature difference until the subcooling degree is equal to the preset temperature difference.

[0097] In an optional embodiment, the preset temperature difference condition is within a preset temperature difference range. The subcooling degree is compared with the preset temperature difference range. If the subcooling degree is greater than the preset temperature difference upper limit, the condensing assembly 1 is controlled to increase the refrigeration capacity, the circulating pump 2 is controlled to increase the speed, and the first valve 81 is controlled to increase the opening. If the subcooling degree is less than the preset temperature difference lower limit, the condensing assembly 1 is controlled to reduce the refrigeration capacity, the circulating pump 2 is controlled to reduce the speed, and the first valve 81 is controlled to reduce the opening. Then, the process returns to the step of comparing the subcooling degree with the preset temperature difference range until the subcooling degree is within the preset temperature difference range.

[0098] In an optional embodiment, when the supercooling degree reaches the target, the boiling point temperature of the two-phase cooling medium may change due to the change in pressure. For example, the higher the pressure, the higher the boiling point temperature of the two-phase cooling medium. The second temperature may be inconsistent with the temperature of the saturated boiling point corresponding to the second pressure, resulting in the two-phase cooling medium not reaching a saturated liquid state after cooling the power supply module 14, affecting the subsequent heat dissipation effect of the power consumption module 15. Therefore, it is necessary to detect the second pressure at the same time as detecting the second temperature. Specifically, if the supercooling degree meets the preset conditions, it is determined whether the second temperature is consistent with the saturated boiling point corresponding to the second pressure. If not, the condensing component 1 is controlled to increase the refrigeration capacity, and the step of determining whether the second temperature is consistent with the saturated boiling point corresponding to the second pressure is returned until the second temperature is consistent with the saturated boiling point corresponding to the second pressure. By detecting the second pressure while detecting the second temperature, the saturation level of the two-phase cooling medium after cooling the power supply module 14 can be obtained more accurately, so that the two-phase cooling medium can reach a saturated liquid state as much as possible after cooling the power supply module 14, thereby ensuring the subsequent heat dissipation effect of the power consumption module 15, thereby improving the heat dissipation efficiency of the system, and avoiding the risk of premature vaporization of the two-phase cooling medium causing cavitation of the fluid mechanical flow components in the electronic equipment, thereby ensuring the stable and reliable operation of the electronic equipment.

[0099] In an optional embodiment, the preset temperature difference condition is equal to the preset temperature difference. If the supercooling degree is equal to the preset temperature difference, it is determined whether the second temperature is consistent with the saturated boiling point corresponding to the second pressure. If not, the condensation component 1 is controlled to increase the refrigeration capacity, and the step of determining whether the second temperature is consistent with the saturated boiling point corresponding to the second pressure is returned until the second temperature is consistent with the saturated boiling point corresponding to the second pressure.

[0100] In an optional embodiment, the preset temperature difference condition is within a preset temperature difference range. If the supercooling degree is within the preset temperature difference range, it is determined whether the second temperature is consistent with the saturated boiling point corresponding to the second pressure. If not, the condensation component 1 is controlled to increase the refrigeration capacity, and the step of determining whether the second temperature is consistent with the saturated boiling point corresponding to the second pressure is returned until the second temperature is consistent with the saturated boiling point corresponding to the second pressure.

[0101] In an optional embodiment, the second temperature can also be made consistent with the saturated boiling point corresponding to the second pressure by collaboratively controlling the refrigeration state of the condensing assembly 1, the speed of the circulating pump 2, and the opening of the first valve 81. Specifically, if the degree of subcooling satisfies a preset temperature difference condition, a determination is made as to whether the second temperature is consistent with the saturated boiling point corresponding to the second pressure. If not, the condensing assembly 1 is controlled to increase its refrigeration capacity, the circulating pump 2 is controlled to decrease its speed, and the opening of the first valve 81 is controlled to decrease. The process then returns to the step of determining whether the second temperature is consistent with the saturated boiling point corresponding to the second pressure, until the second temperature is consistent with the saturated boiling point corresponding to the second pressure.

[0102] In an optional embodiment, heat dissipation control is performed using a main factor. When controlling the supercooling degree, the main factors are the rotation speed of the circulation pump 2 and the opening of the first valve 81. If the supercooling degree does not meet the preset conditions, the rotation speed of the circulation pump 2 is controlled so that the two-phase cooling medium is converted into a saturated liquid after cooling the power supply module 14, and the two-phase flow after the two-phase cooling medium cools the power consumption module 15 is a preset dryness. Specifically, if the preset temperature difference condition is equal to the preset temperature difference, the supercooling degree is compared with the preset temperature difference. If the supercooling degree is greater than the preset temperature difference, the circulation pump 2 is controlled to increase the rotation speed; if the supercooling degree is less than the preset temperature difference, the circulation pump 2 is controlled to reduce the rotation speed. The preset temperature difference condition is within the preset temperature difference range. The supercooling degree is compared with the preset temperature difference range. If the supercooling degree is greater than the preset temperature difference upper limit, the circulation pump 2 is controlled to increase the rotation speed; if the supercooling degree is less than the preset temperature difference lower limit, the circulation pump 2 is controlled to reduce the rotation speed. When the degree of supercooling meets the requirement and the second temperature needs to be controlled, the main factor is the refrigeration capacity of the condensing component 1, which will not be described here.

[0103] In an optional embodiment, whether to continue executing the heat dissipation control process can be determined by detecting whether a shutdown command is currently received. Specifically, under the premise that the second temperature is consistent with the saturated boiling point corresponding to the second pressure, it is determined whether a shutdown command has been received. If a shutdown command has been received, the shutdown operation is executed in response to the shutdown command, and the heat dissipation control process ends. If a shutdown command has not been received, the heat dissipation control process continues, returning to the step of obtaining the first temperature of the two-phase cooling medium flowing into the liquid inlet of the shell 3 and the second temperature of the two-phase cooling medium flowing out of the liquid outlet of the shell 3, and repeating the process until a shutdown command is currently received.

[0104] In an optional embodiment, a sensor accuracy fault alarm mechanism can be set. Specifically, the heat dissipation power of the power supply module 14, the density of the two-phase cooling medium, and the specific heat capacity of the two-phase cooling medium are obtained, and then based on the heat dissipation power of the power supply module 14, the density and specific heat capacity of the two-phase cooling medium and the supercooling, a third flow rate is calculated, and the third flow rate is used to indicate the calculated flow rate of the two-phase cooling medium of the second branch. Specifically, the density of the two-phase cooling medium, the specific heat capacity of the two-phase cooling medium and the supercooling can be multiplied to obtain an intermediate value, and then the heat dissipation power of the power supply module 14 is divided by the intermediate value to obtain the third flow rate. Finally, the calculated third flow rate is compared with the actually measured second flow rate of the two-phase cooling medium of the second branch. If there is any inconsistency, it means that the calculated third flow rate is different from the actually measured second flow rate, and the second flowmeter 112 may be faulty, then a sensor accuracy fault alarm is executed to notify relevant technical personnel to conduct system inspection and maintenance in a timely manner.

[0105] The liquid cooling system control method provided in this embodiment controls the refrigeration state of the condensing component 1 to ensure that the two-phase cooling medium absorbs heat and is converted into a saturated liquid after cooling the power supply module, and the two-phase flow of the two-phase cooling medium that absorbs heat and is converted after cooling the power consumption module is a preset dryness, thereby achieving precise control of the form of the two-phase cooling medium, combining the heat dissipation characteristics of each component and the absorption potential of the two-phase cooling medium, achieving efficient heat dissipation, taking into account the heat dissipation requirements of the power supply module and the high-power power consumption module, avoiding the problem that the system heat dissipation capacity cannot meet the heat dissipation requirements, having high heat dissipation efficiency and good effect, and avoiding the risk of cavitation of fluid mechanical flow components in electronic equipment caused by premature vaporization of the two-phase cooling medium, thereby ensuring stable and reliable operation of the electronic equipment.

[0106] An embodiment of the present application provides an electronic device, including a cabinet 16, a power supply module 14, a power consumption module 15 and the above-mentioned liquid cooling system.

[0107] The power supply module 14 is disposed in the cabinet 16. The power consumption module 15 is disposed in the cabinet 16. The liquid cooling system is adaptively installed in the cabinet 16 to dissipate heat from the electronic equipment.

[0108] As one or more specific application examples of the embodiments of the present invention, the optimal implementation scheme or the solution that the inventor most wants to embody is described below in combination with specific application scenarios.

[0109] Figure 12 This is a flow chart of a liquid cooling system control method provided by an embodiment of the present invention. Figure 12 Only the main factors for heat dissipation control are shown. The main factors can be set in a targeted manner according to the actual application scenario. For example, when controlling the supercooling degree, the main factors are the rotation speed of the circulation pump 2 and the opening of the first valve 81. When the supercooling degree meets the requirements and the second temperature T2 needs to be controlled, the main factor is the refrigeration capacity of the condensing component 1. In fact, the rotation speed of the circulation pump 2, the opening of the first valve 81 and the refrigeration capacity of the condensing component 1 work together in the heat dissipation control process.

[0110] like Figure 12 As shown, first, the liquid cooling system is put into operation. Next, the data acquisition module 12 in the liquid cooling system detects and records the subcooling degree of the two-phase cooling medium at the inlet of the electronic device's power supply module 14 (powershelf node) (corresponding to the difference between the second temperature T2 and the first temperature T1), the heat dissipation power of the power supply module 14, the output power of the power supply module 14, the flow rate of the two-phase cooling medium in the liquid cooling system, and the measurement data of the pressure sensors and temperature sensors installed at various locations within the liquid cooling system. The system then determines whether the difference between the second temperature T2 and the first temperature T1 (i.e., T2 - T1 (subcooling degree)) is equal to a preset value (corresponding to a preset temperature difference).

[0111] If T2-T1 (subcooling degree) is equal to the preset value, determine whether the second temperature T2 is consistent with the saturated boiling point corresponding to the second pressure P2. If the second temperature T2 is consistent with the saturated boiling point corresponding to the second pressure P2, determine whether a shutdown command is currently received. If no shutdown command is currently received, return to the step of detecting the subcooling degree of the two-phase cooling medium at the inlet of the power supply module 14 of the electronic device, the heat dissipation power of the power supply module 14, the output power of the power supply module 14, the two-phase cooling medium flow rate of the liquid cooling system, the measurement data of the pressure sensors provided at various parts of the liquid cooling system, and the measurement data of the temperature sensors provided at various parts of the liquid cooling system and record them. If a shutdown command is currently received, execute the shutdown and end the current control process. If the saturated boiling points corresponding to the second temperature T2 and the second pressure P2 are inconsistent, determine whether the second temperature T2 is less than the saturated boiling point corresponding to the second pressure P2. If The second temperature T2 is not less than the saturated boiling point corresponding to the second pressure P2, indicating that the temperature sensor measuring the second temperature T2 and / or the pressure sensor measuring the second pressure P2 may be faulty, and a sensor accuracy alarm is required to remind relevant technical personnel to check and troubleshoot in time. If the second temperature T2 is less than the saturated boiling point corresponding to the second pressure P2, it means that the temperature of the two-phase cooling medium at the outlet of the power supply module 14 cannot reach the saturated boiling point corresponding to the pressure, that is, it cannot reach a saturated liquid state. Therefore, it is necessary to increase the refrigeration capacity of the condensation component 1, and then lower the second temperature T2 so that the second temperature T2 is close to the saturated boiling point corresponding to the second pressure P2, and then return to the step of determining whether the second temperature T2 is consistent with the saturated boiling point corresponding to the second pressure P2. This process is repeated until the second temperature T2 and the saturated boiling point corresponding to the second pressure P2 are consistent, and then enter the step of determining whether there is a shutdown instruction.

[0112] If T2-T1 (subcooling) is not equal to the preset value, determine whether T2-T1 (subcooling) is greater than the preset value. If T2-T1 (subcooling) is greater than the preset value, determine whether the calculated flow is consistent with the measured flow based on the heat dissipation power of the power supply module 14, the output power of the power supply module 14 and T2-T1 (subcooling), wherein the calculated flow is the flow of the two-phase cooling medium at the outlet of the power supply module 14 calculated based on the heat dissipation power, the density of the two-phase cooling medium, the specific heat capacity of the two-phase cooling medium and T2-T1 (subcooling), and the measured flow is the flow of the two-phase cooling medium at the outlet of the power supply module 14 actually measured by the flow meter at the outlet of the power supply module 14. If the calculated flow is inconsistent with the measured flow, it indicates that the flow meter at the outlet of the power supply module 14 may be faulty, and a sensor accuracy alarm is required to remind relevant technical personnel to check and troubleshoot in time. If the calculated flow is consistent with the measured flow, increase the speed of the circulation pump 2 to increase the flow of the two-phase cooling medium at the outlet of the power supply module 14, thereby reducing T2-T1. (subcooling), so that T2-T1 (subcooling) is closer to the preset value, and return to the step of determining whether T2-T1 (subcooling) is equal to the preset value; if T2-T1 (subcooling) is less than the preset value, determine whether the calculated flow is consistent with the measured flow according to the heat dissipation power of the power supply module 14, the output power of the power supply module 14 and T2-T1 (subcooling); if the calculated flow is inconsistent with the measured flow, it indicates that the flow meter at the outlet of the power supply module 14 may be faulty, and a sensor accuracy alarm is required to remind relevant technical personnel to check and troubleshoot in time; if the calculated flow is consistent with the measured flow, reduce the speed of the circulating pump 2 and increase the opening of the first valve 81 at the same time to increase the flow of the two-phase cooling medium at the outlet of the power supply module 14, thereby increasing T2-T1 (subcooling) so that T2-T1 (subcooling) is closer to the preset value, and return to the step of determining whether T2-T1 (subcooling) is equal to the preset value. The above steps are repeated until T2-T1 (subcooling degree) is equal to a preset value, and the process proceeds to the step of determining whether the second temperature T2 is consistent with the saturated boiling point corresponding to the second pressure P2.

[0113] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method.

[0114] The embodiment of the present application also provides a liquid cooling system control device, which is applied to the liquid cooling system and can be set in the control module 5 of the liquid cooling system. Figure 13 As shown, the device includes an acquisition module 1301 , a supercooling module 1302 and a comparison module 1303 .

[0115] An acquisition module 1301 is configured to acquire a first temperature of the two-phase cooling medium flowing into the liquid inlet of the housing 3 and a second temperature of the two-phase cooling medium flowing out of the liquid outlet of the housing 3 ;

[0116] A subcooling module 1302 is configured to calculate a difference between the second temperature and the first temperature to obtain a subcooling degree;

[0117] The comparison module 1303 is configured to compare the subcooling degree with a preset temperature difference condition. If the subcooling degree does not meet the preset temperature difference condition, the refrigeration state of the condensing component 1 is controlled until the subcooling degree meets the preset temperature difference condition.

[0118] For the description of the features in the embodiment corresponding to the liquid cooling system control device, please refer to the relevant description of the embodiment corresponding to the liquid cooling system control method, and no further details will be given here.

[0119] The embodiment of the present application also provides an electronic device, such as Figure 14 As shown, it includes a memory 10 and a processor 20, the memory 10 stores a computer program, and the processor 20 is configured to run the computer program to execute the steps in any of the above-mentioned liquid cooling system control method embodiments.

[0120] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above-mentioned liquid cooling system control method embodiments when running.

[0121] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0122] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any of the above-mentioned liquid cooling system control method embodiments are implemented.

[0123] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium, the non-volatile computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, implementing the steps in any of the above-mentioned liquid cooling system control method embodiments.

[0124] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0125] The above is a detailed introduction to a liquid cooling system, a liquid cooling system control method, and an electronic device provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the present application.

Claims

1. A liquid cooling system, characterized in that: The system comprises: Condensation assembly for cooling the two-phase cooling medium; a circulation pump, connected to the liquid outlet of the condensing assembly, for pumping out the two-phase cooling medium; A shell for accommodating a power supply module; the liquid inlet of the shell is connected to the liquid outlet of the circulation pump; the liquid outlet of the shell is connected to a first branch; the first branch is also connected to the liquid inlet of the condensing assembly; the power supply module is an immersion liquid cooling power supply module; A cold plate assembly is provided in contact with the power consumption module and is used to transfer heat from the power consumption module to a two-phase cooling medium; the liquid outlet of the housing is also connected to a second branch; the second branch is connected to a liquid inlet of the cold plate assembly; the liquid outlet of the cold plate assembly is connected to a liquid inlet of the condensing assembly; The two-phase cooling medium is converted into a saturated liquid after flowing through the power supply module and absorbs heat, and the two-phase cooling medium is converted into a two-phase flow after flowing through the power consumption module and absorbs heat.

2. The liquid cooling system according to claim 1, characterized in that The system further comprises: The liquid distributor comprises a liquid distributor and a liquid collector; the first liquid inlet of the liquid distributor is connected to the liquid outlet of the circulation pump; the first liquid outlet of the liquid distributor is connected to the liquid inlet of the housing; The first liquid inlet of the liquid collecting pipe is communicated with the liquid outlet of the shell; the first liquid outlet of the liquid collecting pipe is communicated with the second branch.

3. The liquid cooling system according to claim 2, characterized in that: The system further comprises: Liquid separator; the first liquid inlet of the liquid separator is connected to the first liquid outlet of the liquid separator tube; the first liquid outlet of the liquid separator is connected to the liquid inlet of the shell; the liquid outlet of the shell is connected to the second liquid inlet of the liquid separator; the second liquid outlet of the liquid separator is connected to the first liquid inlet of the collecting pipe; the third liquid outlet of the liquid separator is connected to the first branch.

4. The liquid cooling system according to claim 3, characterized in that The power supply module includes a plurality of power supply units; the housing includes sub-housings for accommodating the plurality of power supply units respectively; The liquid separator further comprises a plurality of first liquid outlets respectively connected to the liquid inlets of the plurality of sub-shells; the liquid separator further comprises a plurality of second liquid inlets respectively connected to the liquid outlets of the plurality of sub-shells.

5. The liquid cooling system according to any one of claims 2 to 4, characterized in that: The cold plate assembly includes a cold plate and a cold plate pipeline; the cold plate is arranged in contact with the power consumption module to extract the heat of the power consumption module; the cold plate pipeline is arranged on one side of the cold plate to circulate the two-phase cooling medium so that the two-phase cooling medium exchanges heat with the cold plate.

6. The liquid cooling system according to claim 5, characterized in that: The liquid dispensing tube further includes a second liquid inlet; the second liquid inlet of the liquid dispensing tube is connected to the first liquid outlet of the liquid collecting tube; The liquid distribution pipe also includes a second liquid outlet; the second liquid outlet of the liquid distribution pipe is connected to the liquid inlet of the cold plate pipeline; the collecting pipe also includes a second liquid inlet; the liquid outlet of the cold plate pipeline is connected to the second liquid inlet of the collecting pipe; the second liquid outlet of the collecting pipe is connected to the liquid inlet of the condensing component.

7. The liquid cooling system according to claim 6, characterized in that: The power consumption module includes a plurality of power consumption nodes; the system further includes: a plurality of cold plate assemblies respectively arranged in contact with the plurality of power consumption nodes; The liquid distributing pipe further includes a plurality of second liquid outlets; the plurality of second liquid outlets of the liquid distributing pipe are respectively connected to the liquid inlets of the cold plate pipelines corresponding to the plurality of power consumption nodes; The liquid collecting pipe further includes a plurality of second liquid inlets; the liquid outlets of the cold plate pipelines corresponding to the plurality of power consumption nodes are respectively communicated with the plurality of second liquid inlets of the liquid collecting pipe.

8. The liquid cooling system according to claim 7, characterized in that: The plurality of power consumption nodes include at least one graphics processing node, at least one switching node, and at least one computing node arranged in sequence.

9. The liquid cooling system according to claim 8, characterized in that: The liquid inlet of the graphics processing node is sequentially connected to the cold plate assembly corresponding to the first switching module, the cold plate assembly corresponding to the graphics processing module, and the liquid outlet of the graphics processing node.

10. The liquid cooling system according to claim 8, characterized in that: The liquid inlet of the switching node is sequentially connected to the cold plate assembly corresponding to the second switching module, the cold plate assembly corresponding to the first input / output module, and the liquid outlet of the switching node.

11. The liquid cooling system according to claim 8, characterized in that: The liquid inlet of the computing node is connected in sequence to the cold plate assembly corresponding to the second input and output module, the cold plate assembly corresponding to the solid-state drive / mechanical hard disk, the cold plate assemblies corresponding to the cross-arranged memory module and computing module, and the liquid outlet of the computing node.

12. The liquid cooling system according to any one of claims 1 to 4, characterized in that: The system further comprises a first valve; the first valve is arranged between the liquid outlet of the circulation pump and the liquid inlet of the housing, and is used to control the flow rate of the two-phase cooling medium flowing through.

13. The liquid cooling system according to any one of claims 1 to 4, characterized in that: The system further includes a first thermometer and a second thermometer; the first thermometer is used to measure a first temperature of the two-phase cooling medium flowing into the liquid inlet of the shell; the second thermometer is used to measure a second temperature of the two-phase cooling medium flowing out of the liquid outlet of the shell.

14. The liquid cooling system according to claim 13, wherein: The system also includes a first pressure gauge and a second pressure gauge; The first pressure gauge is used to measure a first pressure at a measurement point of the first thermometer; the second pressure gauge is used to measure a second pressure at a measurement point of the second thermometer.

15. The liquid cooling system according to any one of claims 1 to 4, characterized in that: The system also includes a first flow meter and a second flow meter; The first flow meter is used to measure a first flow rate of the two-phase cooling medium flowing out of the liquid outlet of the circulation pump; the second flow meter is used to measure a second flow rate of the two-phase cooling medium in the second branch.

16. A liquid cooling system control method, characterized in that: Applicable to the liquid cooling system according to any one of claims 1 to 15; the method comprising: obtaining a first temperature of a two-phase cooling medium flowing into a liquid inlet of a housing and a second temperature of the two-phase cooling medium flowing out of a liquid outlet of the housing; calculating a difference between the second temperature and the first temperature to obtain a degree of supercooling; The subcooling degree is compared with a preset temperature difference condition. If the subcooling degree does not meet the preset temperature difference condition, the refrigeration state of the condensing component is controlled until the subcooling degree meets the preset temperature difference condition.

17. The control method according to claim 16, characterized in that: The step of comparing the subcooling degree with a preset temperature difference condition and controlling the refrigeration state of the condensing component if the subcooling degree does not meet the preset temperature difference condition comprises: The subcooling degree is compared with a preset temperature difference. If the subcooling degree is greater than the preset temperature difference, the condensing component is controlled to increase the refrigeration capacity; if the subcooling degree is less than the preset temperature difference, the condensing component is controlled to reduce the refrigeration capacity.

18. The control method according to claim 17, characterized in that: The method further comprises: If the degree of subcooling is equal to the preset temperature difference, determining whether the second temperature is consistent with the saturated boiling point corresponding to the second pressure; If they are inconsistent, the condensing component is controlled to increase the refrigeration capacity.

19. The control method according to any one of claims 16 to 18, characterized in that: The method further comprises: Obtaining the heat dissipation power of the power supply module, the density and specific heat capacity of the two-phase cooling medium; Calculating a third flow rate based on the heat dissipation power of the power supply module, the density and specific heat capacity of the two-phase cooling medium, and the degree of supercooling; the third flow rate is used to indicate the calculated flow rate of the two-phase cooling medium in the second branch; The third flow rate is compared with the second flow rate, and if they are inconsistent, a sensor accuracy failure alarm is executed.

20. An electronic device, characterized in that: include: Cabinets; A power supply module is provided in the cabinet; A power consumption module is arranged in the cabinet; The liquid cooling system according to any one of claims 1 to 15.

Images