Temporary bonding glue as well as preparation method and application thereof

Abstract

The invention provides a temporary bonding adhesive as well as a preparation method and application thereof. The temporary bonding adhesive comprises a combination of photosensitive resin and an organic solvent, the preparation raw materials of the photosensitive resin comprise a combination of epoxy resin and an amine curing agent. The temporary bonding adhesive provided by the invention does not contain a filler, and can be used as a release layer material for 355 nm laser de-bonding, the formed release layer film surface is smooth and uniform, the adhesion to a substrate is good, the absorption to 355 nm laser is relatively high, meanwhile, the temporary bonding adhesive has relatively good chemical resistance, and the temporary bonding adhesive can be cleaned by using a non-polar or low-polar solvent.

Description

Technical Field

[0001] The invention belongs to the technical field of polymer materials, and in particular relates to a temporary bonding adhesive and a preparation method and application thereof. Background Art

[0002] The rapid evolution of consumer electronics has fueled a boom in the chip market. Higher performance and lower energy consumption have become standard features of high-end chips. To achieve these high performance and low energy consumption, increasingly advanced chip manufacturing processes are essential. However, as feature sizes continue to shrink, Moore's Law is increasingly challenged by physical limitations. Consequently, another approach to improving chip performance has emerged: advanced packaging. Advanced packaging technology utilizes three-dimensional stacking to reduce package size, improve circuit performance, and mitigate parasitic effects and time delays. Currently, commonly used three-dimensional packaging technologies include chip-on-package (PIP), package-on-package (POP), multi-chip package (MCP), system-in-package (SIP), wafer-level packaging, and through-silicon via (TSV). Despite the diverse packaging methods, controlling and reducing the overall thickness of silicon wafers is an inevitable trend. As the thickness decreases, the strength decreases, making the wafer more susceptible to breakage during processing and resulting in low yield.

[0003] To ensure the stability of silicon wafers during processing, temporary bonding solutions are commonly used to achieve controlled handling of the wafers. Temporary bonding processes can be categorized by debonding method: thermal slip, chemical, mechanical, and laser. Each method has its own advantages and disadvantages. Thermal slip debonding offers low equipment cost, but requires temperatures of 200°C, which many flexible wearable materials and imaging devices cannot withstand. Chemical debonding is also low-cost, using solvents to dissolve the bonding adhesive to separate ultra-thin devices. However, solvent exchange is poor, and the debonding process takes 8 to 24 hours, making it unsuitable for large-scale production in the semiconductor industry. Mechanical debonding utilizes specialized fixtures to separate ultra-thin devices at room temperature, but this has limitations due to the thinness and brittleness of silicon wafers, which can easily break. Infrared laser debonding separates devices by instantly degrading polymer resins at high temperatures, but this high temperature can damage silicon devices and poses risks.

[0004] Existing release layer materials used for laser debonding mostly use thermosetting resins as the main resin. These resins generally require high temperatures (≥200°C) to cure. The cured resins have a high crosslink density and strong solvent resistance. As a result, the residual adhesive remaining on the silicon wafer after debonding is difficult to remove with solvents and can only be cleaned through dry etching (PLASMA). This cleaning process is slow, requires additional equipment, and is costly. Therefore, there is an urgent need to develop a temporary bonding adhesive that can cure at lower temperatures and can be cleaned using wet cleaning processes to meet the increasing requirements of advanced packaging processes. Summary of the Invention

[0005] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a temporary bonding adhesive and its preparation method and application. By designing the components of the temporary bonding adhesive, the temporary bonding adhesive has a high absorption of 355nm laser, and at the same time has good chemical resistance, and can be cleaned using non-polar or low-polarity solvents.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a temporary bonding adhesive, wherein the temporary bonding adhesive comprises a combination of a photosensitive resin and an organic solvent; the raw materials for preparing the photosensitive resin comprise a combination of an epoxy resin and an amine curing agent.

[0008] The present invention designs the components of temporary bonding adhesive, which can be used as a raw material for preparing a release layer and for temporary bonding of silicon wafers. The formed release layer has high absorption of 355nm laser, good adhesion to glass substrates, good chemical resistance, and can be cleaned using non-polar solvents or low-polarity solvents.

[0009] In the present invention, the term "photosensitive resin" means that the resin is sensitive to laser light and can be debonded by laser light after being cured.

[0010] The following are preferred technical solutions of the present invention, but are not intended to limit the technical solutions provided by the present invention. Through the following preferred technical solutions, the objectives and beneficial effects of the present invention can be better achieved and realized.

[0011] As a preferred technical solution, the epoxy resin includes aliphatic epoxy resin and / or aromatic epoxy resin.

[0012] Preferably, the epoxy resin includes any one of poly 1,4-butylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, bisphenol A epoxy resin or bisphenol F epoxy resin, or a combination of at least two thereof.

[0013] Preferably, the epoxy equivalent of the epoxy resin is 150-350 g / mol, for example, it can be 160 g / mol, 170 g / mol, 180 g / mol, 190 g / mol, 200 g / mol, 210 g / mol, 220 g / mol, 230 g / mol, 240 g / mol, 250 g / mol, 260 g / mol, 270 g / mol, 280 g / mol, 290 g / mol, 300 g / mol, 310 g / mol, 320 g / mol, 330 g / mol, 340 g / mol, etc.

[0014] Preferably, the amine curing agent includes any one or a combination of at least two of aminoazo compounds, toluidine, m-aminophenol, 4-aminobiphenyl or aminosilane, and more preferably a combination of aminoazo compounds and aminosilane.

[0015] Preferably, the mass ratio of the aminoazo compound to aminosilane is (1-5):1, for example, it can be 1.2:1, 1.4:1, 1.6:1, 1.8:1, 2:1, 2.2:1, 2.4:1, 2.6:1, 2.8:1, 3:1, 3.2:1, 3.4:1, 3.6:1, 3.8:1, 4:1, 4.2:1, 4.4:1, 4.6:1, 4.8:1, etc.

[0016] Preferably, the aminoazo compound includes aminoazobenzene and / or 4-amino-2,3-dimethylazobenzene.

[0017] Preferably, the aminosilane includes (3-aminopropyl)triethoxysilane and / or N-phenyl-3-aminopropyltrimethoxysilane.

[0018] Preferably, in the raw materials for preparing the photosensitive resin, the epoxy resin is 30-70 parts by weight (for example, 32 parts by weight, 35 parts by weight, 38 parts by weight, 40 parts by weight, 42 parts by weight, 45 parts by weight, 48 parts by weight, 50 parts by weight, 52 parts by weight, 55 parts by weight, 58 parts by weight, 60 parts by weight, 62 parts by weight, 65 parts by weight, 68 parts by weight, etc.), and the amine curing agent is 20-60 parts by weight (for example, 22 parts by weight, 25 parts by weight, 28 parts by weight, 30 parts by weight, 32 parts by weight, 35 parts by weight, 38 parts by weight, 40 parts by weight, 42 parts by weight, 45 parts by weight, 48 parts by weight, 50 parts by weight, 52 parts by weight, 55 parts by weight, 58 parts by weight, etc.).

[0019] Preferably, the preparation method of the photosensitive resin includes:

[0020] The epoxy resin reacts with the amine curing agent to obtain the photosensitive resin.

[0021] Preferably, the reaction temperature is 50-200°C, for example, 60°C, 70°C, 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, 150°C, 160°C, 170°C, 180°C, 190°C, etc.

[0022] Preferably, the reaction time is 3-22 h, for example, 4 h, 5 h, 6 h, 7 h, 8 h, 9 h, 10 h, 11 h, 12 h, 13 h, 14 h, 15 h, 16 h, 17 h, 18 h, 19 h, 20 h, 21 h, etc.

[0023] Preferably, the reaction is carried out in a first solvent.

[0024] Preferably, the first solvent comprises any one of cyclopentanone, cyclohexanone, limonene, toluene or p-xylene, or a combination of at least two thereof.

[0025] Preferably, the mass ratio of the epoxy resin to the first solvent is 1:(0.5-4), for example, it can be 1:0.6, 1:0.8, 1:1, 1:1.2, 1:1.5, 1:1.8, 1:2, 1:2.2, 1:2.5, 1:2.8, 1:3, 1:3.2, 1:3.5, 1:3.8, etc.

[0026] In the present invention, after the reaction is carried out in the first solvent, a solution containing the photosensitive resin can be obtained, which can be directly used to prepare the temporary bonding adhesive. The first solvent contained in the solution serves as a part of the organic solvent in the temporary bonding adhesive.

[0027] Preferably, the temporary bonding adhesive further includes a leveling agent.

[0028] Preferably, the leveling agent includes any one of an organosilicon leveling agent, an acrylate leveling agent or a fluorocarbon surfactant, or a combination of at least two thereof.

[0029] Preferably, the leveling agent includes any one of polyacrylate, polyether-modified polydimethylsiloxane, polyether-siloxane copolymer, or non-ionic gemini fluorocarbon surfactant, or a combination of at least two thereof.

[0030] Preferably, based on the mass of the photosensitive resin as 100%, the mass of the leveling agent is 0.05-4%, for example, it can be 0.1%, 0.2%, 0.5%, 0.8%, 1%, 1.2%, 1.5%, 1.8%, 2%, 2.2%, 2.5%, 2.8%, 3%, 3.2%, 3.5%, 3.8%, etc.

[0031] Preferably, the organic solvent includes any one of cyclopentanone, cyclohexanone, limonene, toluene or p-xylene, or a combination of at least two thereof.

[0032] Preferably, the solid content of the temporary bonding glue is 5-50%, for example, 8%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, etc.

[0033] In a second aspect, the present invention provides a method for preparing the temporary bonding adhesive as described in the first aspect, the preparation method comprising:

[0034] The temporary bonding adhesive is obtained by mixing a photosensitive resin, optionally a leveling agent and an organic solvent.

[0035] Preferably, the mixing time is 6-18 hours, for example, it can be 7 hours, 8 hours, 9 hours, 10 hours, 11 hours, 12 hours, 13 hours, 14 hours, 15 hours, 16 hours, 17 hours, etc.

[0036] In a third aspect, the present invention provides a release layer, wherein the raw materials for preparing the release layer include the temporary bonding adhesive as described in the first aspect.

[0037] Preferably, the thickness of the release layer is 1-100 μm, for example, it can be 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm, etc.

[0038] In a fourth aspect, the present invention provides a method for preparing the release layer according to the third aspect, the method comprising:

[0039] The temporary bonding adhesive as described in the first aspect is applied to one surface of the substrate, and the release layer is obtained after curing.

[0040] Preferably, the curing temperature is 70-150°C, for example, 75°C, 80°C, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 115°C, 120°C, 125°C, 130°C, 135°C, 140°C, 145°C, etc.

[0041] Preferably, the curing time is 5-30 min, for example, it can be 6 min, 8 min, 10 min, 12 min, 14 min, 16 min, 18 min, 20 min, 22 min, 24 min, 26 min, 28 min, etc.

[0042] Preferably, the substrate is a glass substrate.

[0043] In a fifth aspect, the present invention provides use of the temporary bonding adhesive as described in the first aspect in semiconductor device processing.

[0044] Preferably, the semiconductor device comprises a wafer.

[0045] The numerical range described in the present invention includes not only the point values listed above, but also any point values between the above numerical ranges that are not listed. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values included in the range.

[0046] Compared with the prior art, the present invention has the following beneficial effects:

[0047] The temporary bonding adhesive provided by the present invention does not contain fillers and can be used as a release layer material for 355nm laser debonding. The formed release layer film surface is smooth and uniform, has good adhesion to the glass substrate, has high absorption of 355nm laser, and the 355nm light transmittance is 0.1-88%; it also has good chemical resistance. After soaking in 10% H2SO3 solution and 5% KOH solution, the corrosion thickness is 0-4μm; and it can be cleaned using non-polar or low-polarity solvents. After soaking in cyclohexanone, the thickness of the release layer is 0-4.5μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 This is a physical picture of the release layer provided in Application Example 1. DETAILED DESCRIPTION

[0049] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific embodiments. It should be understood by those skilled in the art that the embodiments are merely to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0050] The sources of some components in the following examples and comparative examples are as follows:

[0051] (1) Polyethylene glycol diglycidyl ether: purchased from Liaoning Kelong Fine Chemical Co., Ltd., KF-200·400, epoxy equivalent weight 350 g / mol;

[0052] (2) Polypropylene glycol diglycidyl ether: purchased from MacLean, P790564, epoxy equivalent weight 250 g / mol;

[0053] (3) Bisphenol A epoxy resin: purchased from Guangzhou Kaixin New Material Technology Co., Ltd., E44, epoxy equivalent weight 170 g / mol;

[0054] (4) Bisphenol F epoxy resin: purchased from Guangzhou Yezeng Chemical Co., Ltd., NPEF-170, epoxy equivalent weight 190 g / mol;

[0055] (5) Polyether-modified polydimethylsiloxane: purchased from BYK Chemicals, BYK378.

[0056] Example 1

[0057] A temporary bonding adhesive comprising 100 parts by weight of photosensitive resin A-1, 1 part by weight of polyether-modified polydimethylsiloxane, and cyclohexanone;

[0058] The preparation method of the photosensitive resin A-1 comprises:

[0059] 10 parts by weight of polypropylene glycol diglycidyl ether, 50 parts by weight of polyethylene glycol diglycidyl ether, 30 parts by weight of aminoazobenzene, 10 parts by weight of (3-aminopropyl)triethoxysilane and 100 parts by weight of cyclohexanone were added to a reaction vessel and stirred at room temperature for 0.5 h, then heated to 150° C. and maintained at 150° C. for 12 h to obtain a solution containing the photosensitive resin A-1;

[0060] The preparation method of the temporary bonding adhesive comprises:

[0061] The solution containing the photosensitive resin A-1 was diluted to 30% solid content using cyclohexanone, 1 part by weight of polyether-modified polydimethylsiloxane was added, and the mixture was stirred for 6 hours to obtain the temporary bonding adhesive.

[0062] Example 2

[0063] A temporary bonding adhesive comprising 4 parts by weight of photosensitive resin A-25, 1 part by weight of polyether-modified polydimethylsiloxane, and cyclohexanone;

[0064] The preparation method of the photosensitive resin A-2 comprises:

[0065] 30 parts by weight of bisphenol F epoxy resin, 20 parts by weight of 4-amino-2,3-dimethylazobenzene, 4 parts by weight of N-phenyl-3-aminopropyltrimethoxysilane and 100 parts by weight of cyclohexanone were added to a reaction vessel and stirred at room temperature for 0.5 hours, then heated to 150° C. and maintained at 150° C. for 12 hours to obtain a solution containing the photosensitive resin A-2;

[0066] The preparation method of the temporary bonding adhesive comprises:

[0067] The solution containing the photosensitive resin A-2 was diluted to 30% solid content using cyclohexanone, 1 part by weight of polyether-modified polydimethylsiloxane was added, and the mixture was stirred for 6 hours to obtain the temporary bonding adhesive.

[0068] Example 3

[0069] A temporary bonding adhesive comprising 100 parts by weight of photosensitive resin A-3, 1 part by weight of polyether-modified polydimethylsiloxane, and cyclohexanone;

[0070] The preparation method of the photosensitive resin A-3 comprises:

[0071] 30 parts by weight of bisphenol A epoxy resin, 20 parts by weight of bisphenol F epoxy resin, 25 parts by weight of 4-amino-2,3-dimethylazobenzene, 25 parts by weight of N-phenyl-3-aminopropyltrimethoxysilane and 100 parts by weight of cyclohexanone were added to a reaction vessel and stirred at room temperature for 0.5 hours, then heated to 150° C. and maintained at 150° C. for 12 hours to obtain a solution containing the photosensitive resin A-3;

[0072] The preparation method of the temporary bonding adhesive comprises:

[0073] The solution containing the photosensitive resin A-3 was diluted to 30% solid content using cyclohexanone, 1 part by weight of polyether-modified polydimethylsiloxane was added, and the mixture was stirred for 6 hours to obtain the temporary bonding adhesive.

[0074] Example 4

[0075] A temporary bonding adhesive and a preparation method thereof, which differs from Example 1 only in that the photosensitive resin A-1 is replaced with photosensitive resin A-4. The remaining raw materials, process parameters, and steps are the same as those in Example 1. The preparation method of the photosensitive resin A-4 comprises:

[0076] 10 parts by weight of polypropylene glycol diglycidyl ether, 50 parts by weight of polyethylene glycol diglycidyl ether, 30 parts by weight of m-aminophenol, 10 parts by weight of (3-aminopropyl)triethoxysilane and 100 parts by weight of cyclohexanone were added to a reaction vessel and stirred at room temperature for 0.5 h, then heated to 150° C. and maintained at 150° C. for 12 h to obtain a solution containing the photosensitive resin A-4.

[0077] Example 5

[0078] A temporary bonding adhesive and a preparation method thereof, which differs from Example 1 only in that the photosensitive resin A-1 is replaced with the photosensitive resin A-5. The remaining raw materials, process parameters, and steps are the same as those in Example 1. The preparation method of the photosensitive resin A-5 comprises:

[0079] 10 parts by weight of polypropylene glycol diglycidyl ether, 50 parts by weight of polyethylene glycol diglycidyl ether, 30 parts by weight of aminoazobenzene, 10 parts by weight of m-aminophenol and 100 parts by weight of cyclohexanone were added to a reaction vessel and stirred at room temperature for 0.5 h, then heated to 150° C. and maintained at 150° C. for 12 h to obtain a solution containing the photosensitive resin A-5.

[0080] Example 6

[0081] A temporary bonding adhesive and a preparation method thereof, which differs from Example 1 only in that the photosensitive resin A-1 is replaced with photosensitive resin A-6. The remaining raw materials, process parameters, and steps are the same as those in Example 1. The preparation method of the photosensitive resin A-6 comprises:

[0082] 10 parts by weight of polypropylene glycol diglycidyl ether, 50 parts by weight of polyethylene glycol diglycidyl ether, 40 parts by weight of aminoazobenzene and 100 parts by weight of cyclohexanone were added to a reaction vessel and stirred at room temperature for 0.5 hours, then heated to 150° C. and maintained at 150° C. for 12 hours to obtain a solution containing the photosensitive resin A-6.

[0083] Example 7

[0084] A temporary bonding adhesive and a preparation method thereof, which differs from Example 1 only in that the photosensitive resin A-1 is replaced with photosensitive resin A-7. The remaining raw materials, process parameters, and steps are the same as those in Example 1. The preparation method of the photosensitive resin A-7 comprises:

[0085] 10 parts by weight of polypropylene glycol diglycidyl ether, 50 parts by weight of polyethylene glycol diglycidyl ether, 40 parts by weight of (3-aminopropyl)triethoxysilane and 100 parts by weight of cyclohexanone were added to a reaction vessel and stirred at room temperature for 0.5 h, then heated to 150° C. and maintained at 150° C. for 12 h to obtain a solution containing the photosensitive resin A-7.

[0086] Example 8

[0087] A temporary bonding adhesive and a preparation method thereof, which differs from Example 1 only in that the photosensitive resin A-1 is replaced with photosensitive resin A-8, and the remaining raw materials, process parameters, and steps are the same as those in Example 1; the preparation method of the photosensitive resin A-8 comprises:

[0088] 10 parts by weight of polypropylene glycol diglycidyl ether, 50 parts by weight of polyethylene glycol diglycidyl ether, 10 parts by weight of aminoazobenzene, 30 parts by weight of (3-aminopropyl)triethoxysilane and 100 parts by weight of cyclohexanone were added to a reaction vessel and stirred at room temperature for 0.5 h, then heated to 150° C. and maintained at 150° C. for 12 h to obtain a solution containing the photosensitive resin A-8.

[0089] Example 9

[0090] A temporary bonding adhesive and a preparation method thereof, which differs from Example 1 only in that the photosensitive resin A-1 is replaced with photosensitive resin A-9. The remaining raw materials, process parameters, and steps are the same as those in Example 1. The preparation method of the photosensitive resin A-9 includes:

[0091] 10 parts by weight of polypropylene glycol diglycidyl ether, 50 parts by weight of polyethylene glycol diglycidyl ether, 38 parts by weight of aminoazobenzene, 2 parts by weight of (3-aminopropyl)triethoxysilane and 100 parts by weight of cyclohexanone were added to a reaction vessel and stirred at room temperature for 0.5 h, then heated to 150° C. and maintained at 150° C. for 12 h to obtain a solution containing the photosensitive resin A-9.

[0092] Comparative Example 1

[0093] A temporary bonding adhesive and a preparation method thereof, which differs from Example 1 only in that the photosensitive resin A-1 is replaced with photosensitive resin B. The remaining raw materials, process parameters, and steps are the same as those in Example 1. The preparation method of the photosensitive resin B comprises:

[0094] 10 parts by weight of polypropylene glycol diglycidyl ether, 50 parts by weight of polyethylene glycol diglycidyl ether, 40 parts by weight of phthalic anhydride and 100 parts by weight of cyclohexanone were added to a reaction container and stirred at room temperature for 0.5 hours, then heated to 150° C. and maintained at 150° C. for 12 hours to obtain a solution containing the photosensitive resin B.

[0095] Application Example 1

[0096] A release layer, wherein the raw materials for preparing the release layer include the temporary bonding adhesive provided in Example 1, and the thickness of the release layer is 5 μm;

[0097] The preparation method of the release layer comprises:

[0098] The temporary bonding adhesive provided in Example 1 was spin-coated onto one surface of a glass substrate and baked at 100° C. for 20 minutes to obtain the release layer. The actual image of the obtained release layer is shown in FIG. Figure 1 As shown by Figure 1 It can be seen that the surface of the release layer prepared using the temporary bonding adhesive provided by the present invention is uniform and smooth.

[0099] Application Examples 2-9, Comparative Application Example 1

[0100] A release layer and a preparation method thereof, which differs from Application Example 1 only in that the temporary bonding adhesive provided in Example 1 is replaced with the temporary bonding adhesive provided in Examples 2-9 and Comparative Example 1, and the remaining process parameters and steps are the same as those in Application Example 1.

[0101] Performance Testing

[0102] (1) 355nm light transmittance: Use a UV-Vis spectrophotometer to measure the 355nm wavelength light transmittance of the release layer;

[0103] (2) Chemical resistance: The release layer was soaked in 10% H2SO3 solution and 5% KOH solution at room temperature for 30 min, respectively. The thickness of the film layer before and after soaking was measured using a step profiler (DektakXT step profiler, Bruker, Germany). The corrosion thickness was calculated as follows: corrosion thickness = thickness before soaking - thickness after soaking.

[0104] (3) Cleaning test: The release layer was immersed in cyclohexanone at room temperature for 3 minutes, then taken out and dried, and the thickness of the film layer after immersion was tested using a step profiler (DektakXT step profiler, Bruker, Germany).

[0105] The release layers provided in Application Examples 1-9 and Comparative Application Example 1 were tested according to the above method. The test results are shown in Table 1:

[0106] Table 1

[0107]

[0108] It can be seen from Table 1 that, compared with Comparative Application Example 1, the release layer formed by the temporary bonding adhesive provided by the present invention has higher absorption of 355 nm laser, better chemical resistance, and is easy to clean.

[0109] As can be seen from Examples 4-7, aminoazobenzene has a stronger absorption coefficient than m-aminophenol and better absorption effect on 355nm laser; aminosilane can improve the chemical resistance of the release layer; aminoazobenzene can improve the light absorption of the release layer.

[0110] It can be seen from Examples 8-9 that the greater the mass ratio of aminoazobenzene to aminosilane coupling agent, the lower the 355nm laser transmittance of the release layer and the worse the chemical resistance. This is because azo compounds contain more conjugated structures and have stronger absorption of short-wavelength light. Aminosilane is a silicone resin that can improve the chemical resistance of the release layer. However, if too much is used, the release layer will be difficult to clean and remove.

[0111] The applicant declares that the present invention uses the above-mentioned embodiments to illustrate the temporary bonding adhesive of the present invention, its preparation method, and its application, but the present invention is not limited to the above-mentioned embodiments, that is, it does not mean that the present invention must rely on the above-mentioned embodiments to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent replacement of various raw materials of the present invention product, addition of auxiliary ingredients, selection of specific methods, etc., all fall within the scope of protection and disclosure of the present invention.

Claims

1. A temporary bonding adhesive, characterized in that: The temporary bonding adhesive includes a combination of a photosensitive resin and an organic solvent; The raw materials for preparing the photosensitive resin include a combination of epoxy resin and amine curing agent.

2. The temporary bonding adhesive according to claim 1, characterized in that The epoxy resin includes an aliphatic epoxy resin and / or an aromatic epoxy resin; Preferably, the epoxy resin comprises any one of poly 1,4-butylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, bisphenol A epoxy resin or bisphenol F epoxy resin, or a combination of at least two thereof; Preferably, the epoxy equivalent weight of the epoxy resin is 150-350 g / mol.

3. The temporary bonding adhesive according to claim 1 or 2, characterized in that: The amine curing agent includes any one or a combination of at least two of aminoazo compounds, toluidine, m-aminophenol, 4-aminobiphenyl or aminosilane, and a combination of aminoazo compounds and aminosilane is more preferred; Preferably, the mass ratio of the aminoazo compound to the aminosilane is (1-5):1; Preferably, the aminoazo compound includes aminoazobenzene and / or 4-amino-2,3-dimethylazobenzene; Preferably, the aminosilane includes (3-aminopropyl)triethoxysilane and / or N-phenyl-3-aminopropyltrimethoxysilane.

4. The temporary bonding adhesive according to any one of claims 1 to 3, characterized in that: In the raw materials for preparing the photosensitive resin, the epoxy resin is 30-70 parts by weight, and the amine curing agent is 20-60 parts by weight; Preferably, the preparation method of the photosensitive resin includes: The epoxy resin reacts with the amine curing agent to obtain the photosensitive resin.

5. The temporary bonding adhesive according to claim 4, characterized in that The reaction temperature is 50-200°C; Preferably, the reaction time is 3-22h; Preferably, the reaction is carried out in a first solvent; Preferably, the first solvent comprises any one of cyclopentanone, cyclohexanone, limonene, toluene or p-xylene, or a combination of at least two thereof; Preferably, the mass ratio of the epoxy resin to the first solvent is 1:(0.5-4).

6. The temporary bonding adhesive according to any one of claims 1 to 5, characterized in that: The temporary bonding glue further includes a leveling agent; Preferably, the leveling agent includes any one of a silicone leveling agent, an acrylate leveling agent or a fluorocarbon surfactant, or a combination of at least two thereof; Preferably, the leveling agent comprises any one or a combination of at least two of polyacrylate, polyether-modified polydimethylsiloxane, polyether-siloxane copolymer or non-ionic gemini fluorocarbon surfactant; Preferably, based on the mass of the photosensitive resin being 100%, the mass of the leveling agent is 0.05-4%; Preferably, the organic solvent comprises any one of cyclopentanone, cyclohexanone, limonene, toluene or p-xylene, or a combination of at least two thereof; Preferably, the solid content of the temporary bonding adhesive is 5-50%.

7. A method for preparing a temporary bonding adhesive according to any one of claims 1 to 6, characterized in that: The preparation method comprises: Mixing a photosensitive resin, optionally a leveling agent, and an organic solvent to obtain the temporary bonding adhesive; Preferably, the mixing time is 6-18 hours.

8. A release layer, characterized in that The raw material for preparing the release layer includes the temporary bonding adhesive according to any one of claims 1 to 6; Preferably, the release layer has a thickness of 1-100 μm.

9. A method for preparing a release layer according to claim 8, characterized in that: The preparation method comprises: Applying the temporary bonding adhesive according to any one of claims 1 to 6 to one surface of a substrate, and curing to obtain the release layer; Preferably, the curing temperature is 70-150°C; Preferably, the curing time is 5-30 minutes.

10. Use of the temporary bonding adhesive according to any one of claims 1 to 6 in semiconductor device processing; Preferably, the semiconductor device comprises a wafer.

Images