Resin composition, adhesive member, and display device including adhesive member

Abstract

Provided are a resin composition, an adhesive member formed by using the resin composition, and a display device including the adhesive member. The resin composition comprises at least one first monomer, and the first monomer contains one or two polymerizable unsaturated groups per monomer unit; at least one sub-polymer having a weight average molecular weight of from about 5,000 to about 40,000 and derived from a second monomer containing two or more polymerizable unsaturated groups per monomer unit; a UV absorber based on benzotriazole; a diisoprenyl glycerol ether; and at least one photoinitiator, the photoinitiator containing a bisacylphosphine oxide group.

Description

[0001] This application claims priority to and all benefits arising from Korean Patent Application No. 10-2024-0018632, filed on February 7, 2024, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] Embodiments of the disclosure herein relate to a resin composition, an adhesive member formed using the resin composition, and a display device including the adhesive member. Background Art

[0003] Various types of display devices are widely used as multimedia devices, such as televisions, mobile phones, tablet computers, navigation systems, and game consoles. The display device includes a plurality of components forming the display device, and an adhesive member is provided between the components. Summary of the Invention

[0004] In a display device, a resin composition may be used to form an adhesive member therein, and it is desired that the adhesive member included in the display device stably adheres components of the display device and exhibits no degradation in display quality in consideration of a user's usage environment.

[0005] Embodiments of the present disclosure provide a resin composition exhibiting high reliability after curing, an adhesive member formed using the resin composition, and a display device including the adhesive member.

[0006] Embodiments of the present invention provide a resin composition comprising at least one first monomer containing one or two polymerizable unsaturated groups per monomer unit; at least one subpolymer having a weight average molecular weight of about 5,000 to about 40,000 and derived from a second monomer containing two or more polymerizable unsaturated groups per monomer unit; a benzotriazole-based ultraviolet (UV) absorber; a diprenyl glycerin ether; and at least one photoinitiator containing a bisacylphosphine oxide group.

[0007] In an embodiment, after photocuring, the resin composition has a thickness of about 190 micrometers (μm) to about 210 μm, and the resin composition can have a transmittance greater than about 0% and less than or equal to about 5% for light within a wavelength range of about 405 nanometers (nm) or less.

[0008] In an embodiment, after photocuring, the resin composition has a thickness of about 40 μm to about 60 μm, and the resin composition may have a transmittance greater than about 0% and less than or equal to about 15% for light within a wavelength range of about 405 nm or less.

[0009] In an embodiment, the benzotriazole-based UV absorber may be included in an amount of about 0.5 weight percent (wt %) to about 2 wt % relative to the total content of the resin composition.

[0010] In an embodiment, the content of the diisoprene glyceryl ether may be about 0.1 wt % to about 1 wt % relative to the total content of the resin composition.

[0011] In an embodiment, the first monomer may include a (meth)acrylate monomer.

[0012] In an embodiment, the first monomer may include a first sub-monomer containing one polymerizable unsaturated group per monomer unit and a second sub-monomer containing two polymerizable unsaturated groups per monomer unit.

[0013] In an embodiment, the first monomer may include at least one selected from 2-ethylhexyl acrylate (2-EHA), 4-hydroxybutyl acrylate (4-HBA-LT), 2-ethylhexyl-diglycol acrylate (EHDG-AT), tetrahydrofurfuryl acrylate (THF-A), isobornyl acrylate (IBXA), isodecyl acrylate (IDAA) and 1,9-nonanediol diacrylate (NDDA).

[0014] In embodiments, the sub-polymer may include a urethane (meth)acrylate oligomer.

[0015] In an embodiment, the photoinitiator may include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0016] In embodiments, the resin composition may be provided by inkjet printing or dispensing.

[0017] In an embodiment of the present invention, the adhesive member comprises a polymer derived from a resin composition, wherein the resin composition comprises at least one first monomer containing one or two polymerizable unsaturated groups per monomer unit; at least one sub-polymer having a weight average molecular weight of about 5,000 to about 40,000 and derived from a second monomer containing two or more polymerizable unsaturated groups per monomer unit; a benzotriazole-based UV absorber; diisoprenylglycerol; and at least one photoinitiator containing a bisacylphosphine oxide group.

[0018] In an embodiment, when the adhesive member has a thickness of about 190 μm to about 210 μm, the adhesive member may have a transmittance greater than about 0% and less than or equal to about 5% with respect to light within a wavelength range of about 405 nm or less.

[0019] In an embodiment, when the adhesive member has a thickness of about 40 μm to about 60 μm, the adhesive member may have a transmittance greater than about 0% and less than or equal to about 15% with respect to light within a wavelength range of about 405 nm or less.

[0020] In an embodiment, the adhesive member may have a thickness of about 30 μm to about 300 μm.

[0021] In an embodiment, the benzotriazole-based UV absorber may be included in an amount of about 0.5 wt % to about 2 wt % relative to the total content of the resin composition.

[0022] In an embodiment, the content of the diisoprene glyceryl ether may be about 0.1 wt % to about 1 wt % relative to the total content of the resin composition.

[0023] In an embodiment, the first monomer may include a first sub-monomer containing one polymerizable unsaturated group per monomer unit and a second sub-monomer containing two polymerizable unsaturated groups per monomer unit.

[0024] In an embodiment, the first monomer may include at least one selected from 2-ethylhexyl acrylate (2-EHA), 4-hydroxybutyl acrylate (4-HBA-LT), 2-ethylhexyl-diglycol acrylate (EHDG-AT), tetrahydrofurfuryl acrylate (THF-A), isobornyl acrylate (IBXA), isodecyl acrylate (IDAA) and 1,9-nonanediol diacrylate (NDDA).

[0025] In embodiments, the sub-polymer may include a urethane (meth)acrylate oligomer.

[0026] In an embodiment, the photoinitiator may include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0027] In an embodiment of the present invention, a display device includes a display panel, a window disposed on the display panel, and a polymer disposed between the display panel and the window and comprising a polymer derived from a resin composition, wherein the resin composition comprises at least one first monomer containing one or two polymerizable unsaturated groups per monomer unit; at least one sub-polymer having a weight average molecular weight of about 5,000 to about 40,000 and derived from a second monomer containing two or more polymerizable unsaturated groups per monomer unit; a benzotriazole-based UV absorber; diisoprene glycerol ether; and at least one photoinitiator containing a bisacylphosphine oxide group.

[0028] In an embodiment, the adhesive member has a thickness of about 190 μm to about 210 μm, and the adhesive member may have a transmittance greater than about 0% and less than or equal to about 5% for light within a wavelength range of about 405 nm or less.

[0029] In an embodiment, the adhesive member has a thickness of about 40 μm to about 60 μm, and the adhesive member may have a transmittance greater than about 0% and less than or equal to about 15% for light within a wavelength range of about 405 nm or less.

[0030] In an embodiment, the adhesive member may have a thickness of about 30 μm to about 300 μm.

[0031] In an embodiment, the benzotriazole-based UV absorber may be included in an amount of about 0.5 wt % to about 2 wt % relative to the total content of the resin composition, and the diisoprene glyceryl ether may be included in an amount of about 0.1 wt % to about 1 wt % relative to the total content of the resin composition.

[0032] In an embodiment, the first monomer may include a first sub-monomer containing one polymerizable unsaturated group per monomer unit and a second sub-monomer containing two polymerizable unsaturated groups per monomer unit.

[0033] In an embodiment, the first monomer may include at least one selected from 2-ethylhexyl acrylate (2-EHA), 4-hydroxybutyl acrylate (4-HBA-LT), 2-ethylhexyl-diglycol acrylate (EHDG-AT), tetrahydrofurfuryl acrylate (THF-A), isobornyl acrylate (IBXA), isodecyl acrylate (IDAA) and 1,9-nonanediol diacrylate (NDDA).

[0034] In embodiments, the sub-polymer may include a urethane (meth)acrylate oligomer.

[0035] In an embodiment, the photoinitiator may include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0036] In an embodiment, the display device may further include a light management layer disposed between the adhesive member and the window, and an optical adhesive layer disposed between the light management layer and the window, wherein the optical adhesive layer may include a polymer derived from the resin composition.

[0037] In an embodiment, the display device may further include an input sensing component disposed between the display panel and the window, wherein the adhesive member may be disposed between the display panel and the input sensing component or between the input sensing component and the window. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The above and other features of the embodiments of the present invention will become more apparent by describing the embodiments of the present invention in further detail with reference to the accompanying drawings, in which:

[0039] Figure 1 is a perspective view showing a display device according to the embodiment;

[0040] Figure 2 is an exploded perspective view showing a display device according to the embodiment;

[0041] Figure 3 is shown along Figure 1 a cross-sectional view of a portion taken along line II';

[0042] Figure 4 is a cross-sectional view showing a portion of a display device according to the embodiment;

[0043] Figure 5A is a view schematically illustrating a method of manufacturing an adhesive member according to an embodiment;

[0044] Figure 5B is a view schematically illustrating a method of manufacturing an adhesive member according to an embodiment;

[0045] Figure 5C is a view schematically illustrating a method of manufacturing an adhesive member according to an embodiment;

[0046] Figure 5D is a view schematically illustrating a method of manufacturing an adhesive member according to an embodiment;

[0047] Figure 6A is a view schematically illustrating a method of manufacturing an adhesive member according to an embodiment;

[0048] Figure 6B is a view schematically illustrating a method of manufacturing an adhesive member according to an embodiment;

[0049] Figure 6C is a view schematically illustrating a method of manufacturing an adhesive member according to an embodiment;

[0050] Figure 7 is a cross-sectional view showing a display device according to the embodiment;

[0051] Figure 8 is a cross-sectional view showing a display device according to the embodiment; and

[0052] Figure 9 is a view showing a vehicle in which the display device according to the embodiment is provided. DETAILED DESCRIPTION

[0053] The present invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are shown. However, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those skilled in the art.

[0054] It should be understood that when an element (or region, layer, portion, etc.) is referred to as being "on," "connected to" or "coupled to" another element, it can be directly disposed on, directly connected to or directly coupled to the other element, or intervening elements may be disposed therebetween.

[0055] The same reference numerals refer to the same elements. In addition, in the drawings, the thickness, proportion and size of elements are exaggerated in order to effectively describe the technical contents.

[0056] It should be understood that although the terms first, second, etc. can be used to describe various elements in this article, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the teachings of the present disclosure, a first element can be referred to as a second element, and similarly, a second element can be referred to as a first element.

[0057] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element as illustrated in the accompanying drawings. It should be understood that relative terms are intended to cover different orientations of the device in addition to the orientation depicted in the accompanying drawings. For example, if the device in one drawing is turned over, the element described as being on the "lower" side of the other elements will be oriented on the "upper" side of the other elements. Therefore, depending on the specific orientation of the drawing, the term "lower" can cover both the "lower" and "upper" directions. Similarly, if the device in one drawing is turned over, the element described as being "below" or "beneath" the other elements will be oriented "above" the other elements. Therefore, the term "below" or "beneath" can cover both the "upper" and "lower" directions.

[0058] The terms used herein are only for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, "a," "an," "the," and "at least one" do not represent a limit to quantity, but are intended to include both the singular and the plural, unless the context clearly indicates otherwise. Therefore, mentioning "an" element after mentioning "the" element in a claim includes one element and multiple elements. For example, "an element" has the same meaning as "at least one element" unless the context clearly indicates otherwise. "At least one" should not be interpreted as limiting "a" or "an." "Or" means "and / or." As used herein, the term "and / or" includes any combination and all combinations of one or more than one of the relevant listed items. It should be further understood that the terms “comprises” and / or “comprising” or “includes” and / or “including” when used in this specification specify the presence of specified features, regions, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components and / or groups thereof.

[0059] As used herein, "about" or "approximately" is inclusive of the stated value and means within an acceptable range of deviation of the specified value as determined by one of ordinary skill in the art taking into account the relevant measurements and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more than one standard deviation, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0060] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure belongs. It should also be understood that terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and are clearly defined herein, unless they are interpreted in an idealized or overly formal sense. In addition, terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless clearly defined as such herein.

[0061] Embodiments are described herein with reference to cross-sectional illustrations, which are schematic illustrations of idealized embodiments. As such, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances should be expected. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions as illustrated herein, but should include deviations in shapes resulting, for example, from manufacturing. For example, a region illustrated or described as flat may typically have rough and / or nonlinear features. Furthermore, illustrated sharp angles may be rounded. Therefore, the regions illustrated in the accompanying drawings are schematic in nature, and their shapes are not intended to illustrate the precise shape of the regions and are not intended to limit the scope of the present claims.

[0062] Hereinafter, an adhesive member and a display device including the adhesive member according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0063] Figure 1 is a perspective view showing a display device according to the embodiment. Figure 2 is an exploded perspective view of a display device according to an embodiment.

[0064] Figure 1 The embodiment of the display device DD shown in FIG may be a device that is activated in response to an electrical signal. For example, the display device DD may be a personal computer, a laptop computer, a personal digital terminal, a game console, a portable electronic device, a television, a monitor, an outdoor billboard, a car navigation system, or a wearable device, but is not limited thereto. Figure 1 , as an example, an embodiment is shown in which the display device DD is a mobile phone.

[0065] The display device DD according to the embodiment can display an image IM through the display area DA. The display area DA may include a plane defined by the first direction axis DR1 and the second direction axis DR2. The display area DA may further include a curved surface curved from one side of the plane defined by the first direction axis DR1 and the second direction axis DR2. Figure 1As shown in FIG, the display device DD according to the embodiment may include two curved surfaces, each curved from two opposite sides of a plane defined by the first direction axis DR1 and the second direction axis DR2. However, the shape of the display area DA is not limited thereto. In another embodiment, for example, the display area DA may include only the plane defined by the first direction axis DR1 and the second direction axis DR2, and the display area DA may further include curved surfaces, each curved from at least two sides of the plane defined by the first direction axis DR1 and the second direction axis DR2 (for example, four curved surfaces, each curved from four sides of the plane).

[0066] The display device DD according to the embodiment may be flexible. The term "flexible" refers to a bendable property and may include everything from fully foldable structures to structures that can bend down to a few nanometers. In the embodiment, for example, the display device DD may be a foldable display device. In another embodiment, the display device DD may be rigid.

[0067] The non-display area NDA may be an area adjacent to the display area DA. In an embodiment, the non-display area NDA may surround the display area DA. Therefore, the shape of the display area DA may be substantially defined by the non-display area NDA. In another embodiment, for example, the non-display area NDA may be provided adjacent to only one side of the display area DA, or the non-display area NDA may not be provided. The display area DA may be provided in various shapes and is not limited to any one embodiment.

[0068] Figure 1 The following figures illustrate the first to third direction axes DR1 to DR3, and the directions represented by the first to third direction axes DR1, DR2, and DR3 described herein are relative concepts and can therefore be changed to other directions. In addition, the directions represented by the first to third direction axes DR1, DR2, and DR3 can be described as the first to third directions, and the same reference symbols can be used. The first and second direction axes DR1 and DR2 herein can be perpendicular to each other, and the third direction axis DR3 can be a normal direction relative to the plane defined by the first and second direction axes DR1 and DR2.

[0069] The thickness direction of the display device DD can be parallel to a third directional axis DR3, which can be a normal direction relative to the plane defined by the first directional axis DR1 and the second directional axis DR2. As described herein, the front surface (or upper surface, upper surface, upper side) and rear surface (or lower surface, lower surface, lower side) of the components constituting the display device DD can be defined relative to the third directional axis DR3. In addition, as described herein, where the direction in which the third directional axis DR3 extends is parallel to the thickness direction, the front surface (or upper surface, upper surface, upper side) refers to a surface (or direction) adjacent to the surface on which the image IM is displayed, and the rear surface (or lower surface, lower surface, lower side) refers to a surface (or direction) spaced apart from the surface on which the image IM is displayed. As used herein, the term "plane" refers to a plane parallel to the plane defined by the first directional axis DR1 and the second directional axis DR2, and the term "cross-section" refers to a plane perpendicular to the plane defined by the first directional axis DR1 and the second directional axis DR2 and parallel to the thickness direction or the third directional axis DR3.

[0070] refer to Figure 2 , an embodiment of the display device DD may include a display module DM, a window WP disposed on the display module DM, and an adhesive member AP disposed between the display module DM and the window WP. In an embodiment, the display device DD may further include a housing HAU accommodating the display module DM.

[0071] In an embodiment of the display device DD, as Figure 1 and Figure 2 As shown in FIG, the window WP and the housing HAU can be combined together to form the exterior of the display device DD. The housing HAU can be arranged below the display module DM. The housing HAU can include a material with relatively high rigidity. In an embodiment, for example, the housing HAU can include a plurality of frames and / or plates including or formed from glass, plastic, or metal. The housing HAU can provide a predetermined position for accommodation. The display module DM can be accommodated in the accommodation position to be protected from external impact.

[0072] In an embodiment, the adhesive member AP may include a resin composition RC( Figure 5A and Figure 6A ) derived or formed polymer. The resin composition RC ( Figure 5A and Figure 6A ) is photocured to form an adhesive member AP. The display module DM and the window WP can be bonded to each other by the adhesive member AP. The adhesive member AP is made of a resin composition RC ( Figure 5A and Figure 6A) or using a resin composition RC containing an ultraviolet (UV) absorber, and thus can effectively prevent damage to the display module DM by external light (e.g., UV light). In an embodiment, the adhesive member AP can effectively prevent damage to the display module DM and also exhibit high adhesive strength. In an embodiment, the display device DD including the adhesive member AP can have improved display life and display quality and can exhibit high reliability.

[0073] The window WP may include a transmissive area TA and a frame area BZA. The transmissive area TA may overlap at least a portion of the active area AA-DM of the display module DM. The transmissive area TA may be an optically transparent area. The image IM ( Figure 1 ) provided to users.

[0074] The bezel area BZA may be an area having relatively lower light transmittance than the transmission area TA. The bezel area BZA may define the shape of the transmission area TA. The bezel area BZA may be adjacent to the transmission area TA and may surround the transmission area TA.

[0075] The bezel area BZA may have a predetermined color. The bezel area BZA covers the peripheral areas NAA-DM of the display module DM and can thus effectively prevent the peripheral areas NAA-DM from being seen from the outside. However, the embodiments of the present invention are not limited to those shown, and the bezel area BZA may be provided adjacent to only one side of the transmissive area TA, and at least a portion thereof may not be provided.

[0076] Figure 3 is shown along Figure 1 In particular, Figure 3 It shows Figure 2 FIG. 5 is a cross-sectional view of the display module DM, the adhesive member AP and the window WP. Figure 3 may be a cross-sectional view showing a display device DD according to the embodiment.

[0077] refer to Figure 3 Embodiments of the display module DM may include a display panel DP and an input sensing component TP disposed on the display panel DP. The display panel DP may be configured to generate an image. The display panel DP may include a base substrate BS, a circuit layer DP-CL disposed on the base substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and an encapsulation layer TFE covering the display element layer DP-EL. An adhesive member AP may be disposed between the display panel DP and the window WP.

[0078] It should be understood that Figure 3The components of the display panel DP shown in FIG. 1 and the like are examples, and the components of the display panel DP are not limited thereto. In an embodiment, for example, the display panel DP may include a liquid crystal display element, and in such an embodiment, the encapsulation layer TFE may not be provided.

[0079] The base substrate BS may provide a base surface on which the circuit layers DP-CL are disposed. The base substrate BS may be a flexible substrate that is bendable, foldable, or rollable. The base substrate BS may be a glass substrate, a metal substrate, or a polymer substrate. However, embodiments of the present invention are not limited thereto, and the base substrate BS may be an inorganic layer, an organic layer, or an organic-inorganic composite material layer.

[0080] The circuit layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern, a signal line, etc. In the embodiment, for example, the circuit layer DP-CL may include a switching transistor and a light emitting element ED for driving the display element layer DP-EL. Figure 4 ) of the driving transistor.

[0081] The display element layer DP-EL may include a light emitting element ( Figure 4 In the embodiment, for example, the light emitting element ( Figure 4 ) may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots or quantum rods. Figure 4 ) may include micro light emitting diodes (LEDs) or nano LEDs.

[0082] The encapsulation layer TFE may be provided on the display element layer DP-EL. The encapsulation layer TFE may serve to protect the light-emitting element layer DP-EL from moisture, oxygen, and / or foreign matter such as dust particles. The encapsulation layer TFE may include at least one inorganic layer. In an embodiment, for example, the encapsulation layer TFE may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence.

[0083] The input sensing component TP may be disposed on the display panel DP. In an embodiment, for example, the input sensing component TP may be disposed directly on the encapsulation layer TFE of the display panel DP. Alternatively, an adhesive layer may be disposed between the input sensing component TP and the display panel DP.

[0084] Herein, when a component is directly provided on another component, it means that no third component is provided between the component and the other component. That is, when a component is “directly provided on” another component, it means that the component is “in contact with” the other component.

[0085] The input sensing part TP can sense external input to convert the input into a predetermined input signal and provide the input signal to the display panel DP. For example, in the display device DD according to the embodiment, the input sensing part TP can be a touch sensing part that detects touch. The input sensing part TP can recognize a direct touch of a user, an indirect touch of a user, a direct touch of an object, or an indirect touch of an object.

[0086] The input sensing part TP can sense at least any one of the position of the touch and the strength (pressure) of the touch applied from the outside. In the embodiment, the input sensing part TP can have various structures or be formed of various materials, and is not limited to any one embodiment. In the embodiment, for example, the input sensing part TP can use a capacitive method to detect external input. The display panel DP can receive an input signal from the input sensing part TP and generate an image corresponding to the input signal.

[0087] The window WP may include a base layer BL and a printed layer BM. Although not shown, the window WP may further include at least one functional layer (not shown) provided on the base layer BL. In an embodiment, for example, the functional layer (not shown) may be a hard coating layer, an anti-fingerprint coating layer, etc., but the embodiments of the present invention are not limited thereto.

[0088] The base layer BL may be a glass substrate. Alternatively, the base layer BL may be a plastic substrate. In embodiments, for example, the base layer BL may include or be formed of polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or a combination thereof.

[0089] The printed layer BM may be provided on one surface of the base layer BL. The printed layer BM may be provided on the lower surface of the base layer BL adjacent to the display module DM. The printed layer BM may be provided in the edge region of the base layer BL. The printed layer BM may be an ink-printed layer. Alternatively, the printed layer BM may be formed by including a pigment or dye. In the window WP, the bezel area BZA may be the portion where the printed layer BM is provided.

[0090] The adhesive member AP may be disposed between the input sensing part TP and the window WP. The adhesive member AP may have a thickness T0 of about 30 micrometers (μm) to about 300 μm. In an embodiment, for example, the adhesive member AP may have a thickness T0 of about 50 μm to about 200 μm. The adhesive member AP having a thickness T0 of about 30 μm to about 300 μm may stably adhere components forming the display device DD (e.g., a display panel, a window, etc.) without excessively increasing the thickness of the display device DD.

[0091] In embodiments where the adhesive member AP has a thickness T0 of about 40 μm to about 60 μm, the adhesive member AP may have a transmittance greater than about 0% and about 15% or less (i.e., less than or equal to about 15%) for light within a wavelength range of about 405 nanometers (nm) or less. In embodiments where the adhesive member AP has a thickness T0 of about 50 μm, the adhesive member AP may have a transmittance greater than about 0% and about 15% or less for light within a wavelength range of about 405 nm or less. For example, in embodiments where the adhesive member AP has a thickness T0 of about 50 μm, the adhesive member AP may have a transmittance from about 1% to about 9% for light within a wavelength range of about 405 nm or less.

[0092] In an embodiment in which the adhesive member AP has a thickness T0 of about 190 μm to about 210 μm, the adhesive member AP may have a transmittance greater than about 0% and about 5% or less (i.e., less than or equal to about 5%) for light within a wavelength range of about 405 nm or less. In an embodiment in which the adhesive member AP has a thickness T0 of about 200 μm, the adhesive member AP may have a transmittance greater than about 0% and about 5% or less for light within a wavelength range of about 405 nm or less. In an embodiment in which the adhesive member AP has a thickness T0 of about 200 μm, the adhesive member AP may have a transmittance from about 0.4% to about 4% for light within a wavelength range of about 405 nm or less.

[0093] Light within a wavelength range of about 405 nm or less includes UV rays and includes light within a wavelength range that significantly affects the degradation of the characteristics of the light-emitting element. Light within a wavelength range greater than about 405 nm and about 800 nm or less may correspond to visible light. Herein, the transmittance for light within a wavelength range of about 405 nm or less indicates the transmittance measured after a light resistance test according to the method of MIL-810G.

[0094] Adhesive member AP that meets the above-described transmittance range for light within a wavelength range of approximately 405 nm or less has low UV transmittance, and adhesive member AP can effectively prevent components disposed thereunder (e.g., light-emitting elements) from being degraded by UV rays. Light-emitting elements containing organic materials are generally susceptible to UV damage and degrade when exposed to UV rays. Furthermore, adhesive member AP that meets the above-described transmittance range for light within a wavelength range of approximately 405 nm or less can have minimal variation in yellowness index (YI) due to exposure to external light, such as UV rays. The use environment of a display device DD includes exposure to external light, such as UV rays, and adhesive member AP that exhibits significant variation in yellowness index due to exposure to external light degrades display quality when providing an image generated by a display module DM disposed thereunder. The image generated by the display module DM passes through adhesive member AP and is provided to the user. In embodiments, adhesive member AP having minimal variation in yellowness index allows a display device DD including adhesive member AP to exhibit high reliability, high display quality, and longevity.

[0095] For example, the adhesive member AP according to the embodiment may satisfy the following Inequality 1. However, this is presented as an example, and the embodiments of the present invention are not limited thereto.

[0096] [Inequality 1]

[0097] X2-X1<3

[0098] In Inequality 1, X1 represents a first coordinate, which is the CIE color coordinate b* measured using a spectrophotometer COH 7700 (NIPPON DENSHOKU INDUSTRIES Co., Ltd.), and X2 represents a second coordinate, which is the CIE color coordinate b* measured using the spectrophotometer COH 7700 after a light resistance test according to the method of MIL-810G. That is, Inequality 1 indicates that the difference (X2-X1) in the CIE color coordinate b* values before and after the light resistance test is less than 3. The adhesive member AP in which the difference in the CIE color coordinate b* values before and after the light resistance test is less than 3 is provided with a small variation in the color coordinate value and can therefore exhibit high reliability even when the time of UV exposure accumulates in the user's usage environment.

[0099] For example, the adhesive member AP according to the embodiment may satisfy the following Inequality 2. However, this is presented as an example, and the embodiments of the present invention are not limited thereto.

[0100] [Inequality 2]

[0101] Y2-Y1<5

[0102] In Inequality 2, Y1 represents a first yellow index measured using a spectrophotometer COH 7700, and Y2 represents a second yellow index measured using a spectrophotometer after a light resistance test according to the method of MIL-810G. That is, Inequality 2 indicates that the difference in yellow index values before and after the light resistance test (Y2-Y1) is less than 5. The adhesive member AP in which the difference in yellow index values before and after the light resistance test is less than 5 is provided with a small change in yellow index and can therefore exhibit high reliability even when the time of UV exposure accumulates in the user's usage environment.

[0103] Figure 4 It specifically shows Figure 3 4 is a cross-sectional view of the display module DM. Figure 4 The components of the display module DM shown in FIG. 5 are presented as examples, and embodiments of the present invention are not limited thereto.

[0104] In the embodiment, Figure 4 As shown in , the base substrate BS may include a single layer or multiple layers. In an embodiment, for example, the base substrate BS may include a first synthetic resin layer, a multilayer or single layer inorganic layer, and a second synthetic resin layer arranged on the multilayer or single layer inorganic layer. Each of the first synthetic resin layer and the second synthetic resin layer may include a polyimide-based resin. In addition, each of the first synthetic resin layer and the second synthetic resin layer may include at least one selected from acryl-based resins, methacryloyl-based resins, polyisoprene-based resins, vinyl-based resins, epoxy-based resins, urethane-based resins, cellulose-based resins, siloxane-based resins, polyamide-based resins, and perylene-based resins. In this article, the "~~-based" resin may be considered to include a "~~" functional group.

[0105] The display panel DP may include a transistor TR and a light emitting element ED. The transistor TR and the light emitting element ED may be disposed on a base substrate BS. Figure 4 One transistor TR is shown in FIG. 4 , but embodiments of the display panel DP may include a plurality of transistors and at least one capacitor for driving the light emitting element ED.

[0106] The circuit layer DP-CL may be provided on the base substrate BS. The circuit layer DP-CL may include a shielding electrode BML, a transistor TR, a connection electrode CNE, a buffer layer BFL, and a plurality of insulating layers INS1 to INS6. The plurality of insulating layers INS1 to INS6 may include first to sixth insulating layers INS1 to INS6. However, Figure 4 The stacking structure of the circuit layer DP-CL shown in FIG. 1 is presented as an example, and the stacking structure of the circuit layer DP-CL may vary according to components of the display panel DP and processes of the circuit layer DP-CL.

[0107] The shielding electrode BML may be disposed on the base substrate BS. The shielding electrode BML may overlap the transistor TR. The shielding electrode BML may protect the transistor TR by blocking light incident on the transistor TR from the lower portion of the display panel DP. The shielding electrode BML may include a conductive material. When a voltage is applied to the shielding electrode BML, the threshold voltage of the transistor TR disposed on the shielding electrode BML may be maintained. However, embodiments of the present invention are not limited thereto, and the shielding electrode BML may be a floating electrode. The shielding electrode BML may not be provided.

[0108] The buffer layer BFL may be disposed on the base substrate BS to cover the shielding electrode BML. The buffer layer BFL may include an inorganic layer. The buffer layer BFL may improve the bonding force between the base substrate BS and the semiconductor pattern or conductive pattern disposed on the buffer layer BFL.

[0109] The transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, channel C1, and drain D1 of the transistor TR may be formed or defined by a semiconductor pattern. The semiconductor pattern of the transistor TR may include polycrystalline silicon, amorphous silicon, or metal oxide, and may include any material as long as it has semiconductor characteristics, without particular limitation.

[0110] The semiconductor pattern may include a plurality of regions divided according to the level of conductivity. In the semiconductor pattern, the region doped with a dopant or reduced with a metal oxide may have high conductivity and may basically serve as the source electrode and the drain electrode of the transistor TR. The region with high conductivity in the semiconductor pattern may correspond to the source S1 and the drain D1 of the transistor TR. In the semiconductor pattern, the region that is undoped, doped with a low concentration, or not reduced with a metal oxide may have low conductivity and correspond to the channel C1 (or active) of the transistor TR.

[0111] The first insulating layer INS1 may cover the semiconductor pattern of the transistor TR and be disposed on the buffer layer BFL. The gate G1 of the transistor TR may be disposed on the first insulating layer INS1. When viewed in a planar manner or when viewed in a third direction DR3, the gate G1 may overlap with the channel C1 of the transistor TR. The gate G1 may serve as a mask during doping of the semiconductor pattern of the transistor TR.

[0112] The second insulating layer INS2 may cover the gate G1 and be disposed on the first insulating layer INS1. The third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0113] The connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2 to electrically connect the transistor TR and the light emitting element ED. However, the components of the connection electrode CNE electrically connecting the transistor TR and the light emitting element ED are not limited thereto, and one of the first connection electrode CNE1 and the second connection electrode CNE2 may be omitted, or an additional connection electrode may be further included.

[0114] The first connection electrode CNE1 may be disposed on the third insulating layer INS3. The first connection electrode CNE1 may be connected to the drain electrode D1 through a first contact hole CH1 defined through the first insulating layer INS1 to the third insulating layer INS3. The fourth insulating layer INS4 may cover the first connection electrode CNE1 and be disposed on the third insulating layer INS3. The fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0115] The second connection electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a second contact hole CH2 defined by the fourth insulating layer INS4 and the fifth insulating layer INS5. The sixth insulating layer INS6 may cover the second connection electrode CNE2 and be disposed on the fifth insulating layer INS5.

[0116] Each of the first to sixth insulating layers INS1 to INS6 may include an inorganic layer or an organic layer. In the embodiment, for example, the inorganic layer may include at least one selected from aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may include at least one selected from acryl-based resins, methacryl-based resins, polyisoprene-based resins, vinyl-based resins, epoxy-based resins, urethane-based resins, cellulose-based resins, siloxane-based resins, polyamide-based resins, and perylene-based resins.

[0117] The display element layer DP-EL includes a pixel defining layer (PDL) and a light-emitting element (ED). The light-emitting element (ED) may include a first electrode (AE), a hole control layer (HCL), an emission layer (EML), an electron control layer (TCL), and a second electrode (CE). The light-emitting element (ED) may include at least one organic material. In embodiments, for example, at least one of the hole control layer (HCL), the emission layer (EML), and the electron control layer (TCL) may include an organic material.

[0118] The first electrode AE may be disposed on the sixth insulating layer INS6 and connected to the second connection electrode CNE2 through a third contact hole CH3 defined in the sixth insulating layer INS6. The first electrode AE may be electrically connected to the drain D1 of the transistor TR through the first and second connection electrodes CNE1 and CNE2.

[0119] The first electrode AE may include or be formed of a metal material, a metal alloy, or a conductive compound. The first electrode AE may be an anode or a cathode. However, embodiments of the present invention are not limited thereto. In addition, the first electrode AE may be a pixel electrode. In embodiments, for example, the first electrode AE may be a transmissive electrode, a semi-transmissive reflective electrode, or a reflective electrode. The first electrode AE may include at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, a compound selected from two or more thereof, a mixture of two or more thereof, or an oxide thereof.

[0120] In embodiments where the first electrode AE is a transmissive electrode, the first electrode AE may include a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO). In embodiments where the first electrode AE is a transflective electrode or a reflective electrode, the first electrode AE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W, compounds thereof, or mixtures thereof (e.g., a mixture of Ag and Mg); or LiF / Ca (a stacked structure of LiF and Ca), or LiF / Al (a stacked structure of LiF and Al). Alternatively, the first electrode AE may have a multilayer structure including a reflective film or a transflective film formed from the materials described above, and a transparent conductive film formed from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), or the like. In the embodiment, for example, the first electrode AE may have a three-layer structure of ITO / Ag / ITO, but is not limited thereto. In addition, the embodiments of the present invention are not limited thereto, and the first electrode AE may include the metal material described above, a combination of two or more metal materials selected from the metal materials described above, or an oxide of the metal material described above.

[0121] A pixel defining film PDL may be disposed on the sixth insulating layer INS6 . A light emitting opening PX_OP exposing a portion of the first electrode AE may be defined in the pixel defining film PDL . The portion of the first electrode AE exposed by the light emitting opening PX_OP may be defined as a light emitting area LA .

[0122] The active area AA-DM of the display module DM may include a light emitting area LA and a light blocking area NLA. The area where the pixel defining film PDL is disposed may correspond to the light blocking area NLA. The light blocking area NLA may surround the light emitting area LA in the active area AA-DM.

[0123] The hole control layer HCL may be disposed on the first electrode AE and the pixel defining layer PDL. The hole control layer HCL may be provided as a common layer overlapping the emission area LA and the light-blocking area NLA. The hole control layer HCL may include at least one selected from a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer HCL may include a known hole injection material and / or a known hole transport material.

[0124] The emission layer EML may be provided on the hole control layer HCL. The emission layer EML may be provided in a region corresponding to the light-emitting opening PX_OP. Alternatively, the emission layer EML may be provided as a common layer. The emission layer EML may include an organic light-emitting material and / or an inorganic light-emitting material. In an embodiment, for example, the emission layer EML may emit light of any one of red, green, and blue colors. In an embodiment, for example, the emission layer EML may emit blue light.

[0125] The electron control layer (TCL) may be disposed on the emission layer (EML). The electron control layer (TCL) may be provided as a common layer overlapping the emission area (LA) and the light-blocking area (NLA). The electron control layer (TCL) may include at least one selected from an electron transport layer (ETL), an electron injection layer (EIL), and a hole blocking layer (HBL). The electron control layer (TCL) may include a known electron injection material and / or a known electron transport material.

[0126] The second electrode CE may be disposed on the electron control layer TCL. The second electrode CE may be provided as a common layer overlapping the light emitting area LA and the light blocking area NLA.

[0127] The second electrode CE may be a common electrode. The second electrode CE may be a cathode or an anode, but the embodiments of the present invention are not limited thereto. In the embodiment, for example, when the first electrode AE is an anode, the second electrode CE may be a cathode, or when the first electrode AE is a cathode, the second electrode CE may be an anode.

[0128] The second electrode CE may be a transmissive electrode, a semi-transmissive reflective electrode, or a reflective electrode. In an embodiment in which the second electrode CE is a transmissive electrode, the second electrode CE may include or be formed of a transparent metal oxide (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.).

[0129] In embodiments where the second electrode CE is a transflective or reflective electrode, the second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, Yb, W, compounds thereof, or mixtures thereof (e.g., AgMg, AgYb, or MgYb); or LiF / Ca, or LiF / Al. Alternatively, the second electrode CE may have a multilayer structure comprising a reflective or transflective film formed from the materials described above, and a transparent conductive film formed from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), or the like. In embodiments, for example, the second electrode CE may include the metal materials described above, a combination of two or more metal materials selected from the metal materials described above, or an oxide of the metal materials described above.

[0130] The encapsulation layer TFE may be disposed on the second electrode CE and may thus cover the light-emitting element ED. The encapsulation layer TFE may include a plurality of thin films. In embodiments, for example, the encapsulation layer TFE may include an inorganic layer disposed on the second electrode CE and an organic layer disposed between the inorganic layers. The inorganic film may protect the light-emitting element ED from moisture / oxygen, and the organic film may protect the light-emitting element ED from foreign matter such as dust particles.

[0131] The input sensing part TP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing part TP may include at least one conductive layer disposed on the sensing insulating layer. The input sensing part TP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0132] The first sensing insulating layer IL1 may be disposed on the encapsulation layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. The first sensing insulating layer IL1 may contact the encapsulation layer TFE. Alternatively, the first sensing insulating layer IL1 may be omitted, and the first conductive layer CDL1 may contact the encapsulation layer TFE.

[0133] The first conductive layer CDL1 may be disposed on the first sensing insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be disposed on the first sensing insulating layer IL1. The second sensing insulating layer IL2 may be disposed on the first sensing insulating layer IL1 to cover at least a portion of the first conductive layer CDL1.

[0134] The second conductive layer CDL2 may be disposed on the second sensing insulating layer IL2. The second conductive layer CDL2 may include a plurality of second conductive patterns. The plurality of second conductive patterns may be disposed on the second sensing insulating layer IL2. The plurality of second conductive patterns may each be connected to the plurality of first conductive patterns via a contact hole formed in the second sensing insulating layer IL2.

[0135] The plurality of first conductive patterns of the first conductive layer CDL1 and the plurality of second conductive patterns of the second conductive layer CDL2 may each be disposed to correspond to the light blocking area NLA. The plurality of first conductive patterns of the first conductive layer CDL1 and the plurality of second conductive patterns of the second conductive layer CDL2 may each correspond to a mesh pattern.

[0136] The third sensing insulating layer IL3 may be disposed on the second sensing insulating layer IL2 and may cover the second conductive layer CDL2. The second sensing insulating layer IL2 and the third sensing insulating layer IL3 may each include an inorganic insulating layer or an organic insulating layer.

[0137] The first conductive layer CDL1 and the second conductive layer CDL2 can each have a single-layer structure or a multi-layer structure stacked along the third direction DR3. The single-layer conductive layers CDL1 and CDL2 can include a metal layer or a transparent conductive layer. The metal layer can include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer can include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium zinc tin oxide (IZTO). In addition, the transparent conductive layer can include a conductive polymer, such as PEDOT, metal nanowires, graphene, etc.

[0138] The multilayer conductive layers CDL1 and CDL2 may include a metal layer. In an embodiment, for example, the metal layer may have a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti). The multilayer conductive layers CDL1 and CDL2 may include at least one metal layer and at least one transparent conductive layer.

[0139] 5A to 5D is a view schematically showing a method for manufacturing an adhesive member AP using a resin composition RC according to an embodiment. In an embodiment, for example, the method for manufacturing an adhesive member AP may include providing a resin composition RC on a substrate CF, providing (or emitting) a first light UV-1 to the resin composition RC to form a primary adhesive member P-AP, and providing a second light UV-2 to the primary adhesive member P-AP to form an adhesive member AP. In an embodiment, the adhesive member AP may be formed by a polymerization reaction of a material contained in the resin composition RC. In reference 5A to 5D In the description of the embodiment of the method for manufacturing the adhesive member AP using the resin composition RC, the above reference will be omitted. Figures 1 to 4 Any repeated detailed description of those same or similar elements will be described, and the differences will mainly be described.

[0140] refer to Figure 5A In an embodiment, the resin composition RC may be provided on the substrate CF. The resin composition RC may be provided on the substrate CF through a nozzle NZ. Figure 5A The resin composition RC is provided through the nozzle NZ, but the device for providing the resin composition RC is not limited thereto. In the embodiment, for example, the substrate CF on which the resin composition RC is provided may include polyethylene terephthalate (PET). The substrate CF is used to form the adhesive member AP ( Figure 3 ) of the temporary substrate, and can be used without limitation as long as the resin composition RC is easily removed after curing. The side of the substrate CF on which the resin composition RC is provided may be subjected to a peeling process.

[0141] In an embodiment, the resin composition RC may be provided by inkjet printing or dispensing (i.e., have properties that allow the resin composition RC to be provided). In an embodiment, for example, the resin composition RC may be a liquid resin composition RC that can be provided in a uniform amount and / or at a uniform rate by inkjet printing or dispensing.

[0142] In an embodiment, the resin composition RC may be a liquid resin composition that is curable or curable by active energy rays. Active energy rays include visible light, UV rays, electron beams, plasma, and thermal rays (infrared (IR) rays, etc.).

[0143] In an embodiment, the resin composition may include at least one first monomer containing one or two polymerizable unsaturated groups per monomer unit; at least one sub-polymer having a weight average molecular weight of about 5,000 to about 40,000 and derived from a second monomer containing two or more polymerizable unsaturated groups per monomer unit; a benzotriazole-based UV absorber; diisoprenylglycerol; and at least one photoinitiator containing a bisacylphosphine oxide group. Herein, a polymerizable unsaturated group refers to a group containing an unsaturated bond that can participate in a polymerization reaction.

[0144] The first monomer of the resin composition RC may include a (meth)acrylate monomer. Herein, a (meth)acryloyl group refers to an acryloyl group or a methacryloyl group, and a (meth)acrylate refers to an acrylate or a methacrylate.

[0145] The first monomer may include a monomer with a weight average molecular weight of about 100 to about 500. The first monomer may include at least one of a first sub-monomer selected from per monomer unit containing a polymerizable unsaturated group and a second sub-monomer selected from per monomer unit containing two polymerizable unsaturated groups. In an embodiment, a polymerizable unsaturated group included in the first sub-monomer may be identical to one of the two polymerizable unsaturated groups included in the second sub-monomer. Alternatively, a polymerizable unsaturated group included in the first sub-monomer may be different from the two polymerizable unsaturated groups included in the second sub-monomer.

[0146] The first monomer may include at least one selected from 2-ethylhexyl acrylate (2-EHA), 4-hydroxybutyl acrylate (4-HBA-LT), 2-ethylhexyl diglycol acrylate (EHDG-AT), tetrahydrofurfuryl acrylate (THF-A), isobornyl acrylate (IBXA), isodecyl acrylate (IDAA) and 1,9-nonanediol diacrylate (NDDA).

[0147] In an embodiment, for example, the first monomer may include multiple first sub-monomers. The first sub-monomer may include 2-ethylhexyl acrylate (2-EHA), 4-hydroxybutyl acrylate (4-HBA-LT), 2-ethylhexyl acrylate-diglycol ester (EHDG-AT), and tetrahydrofurfuryl acrylate (THF-A). Alternatively, the first monomer may include multiple first sub-monomers and a single second sub-monomer. The first sub-monomer may include 4-hydroxybutyl acrylate (4-HBA-LT), tetrahydrofurfuryl acrylate (THF-A), isobornyl acrylate (IBXA), and isodecyl acrylate (IDAA), and the second sub-monomer may include 1,9-nonanediol diacrylate (NDDA). However, this is presented only as an example, and the first sub-monomer and the second sub-monomer are not limited thereto.

[0148] The resin composition RC may include at least one sub-polymer having a weight average molecular weight of about 5,000 to about 40,000. The at least one sub-polymer having a weight average molecular weight of about 5,000 to about 40,000 may contain two or more polymerizable unsaturated groups. The at least one sub-polymer having a weight average molecular weight of about 5,000 to about 40,000 may be derived from a second monomer having two or more polymerizable unsaturated groups per monomer unit. The at least one sub-polymer having a weight average molecular weight of about 5,000 to about 40,000 may contain two or more polymerizable unsaturated groups.

[0149] The second monomer may be the same as or different from the first monomer. A subpolymer having a weight average molecular weight of about 5,000 to about 40,000 is included in the resin composition RC having a relatively high degree of polymerization and maintains a high degree of polymerization even after photocuring, thereby forming an adhesive member AP having high adhesiveness.

[0150] In the resin composition RC, at least one subpolymer having a weight average molecular weight of about 5,000 to about 40,000 may include a urethane (meth)acrylate oligomer. For example, in the resin composition RC, at least one subpolymer may have a weight average molecular weight of about 10,000 to about 38,000. In the resin composition RC, at least one subpolymer may be derived from a second monomer having two or more polymerizable unsaturated groups per monomer unit and may have a weight average molecular weight of 10,000, 13,000, 35,000, or 38,000.

[0151] For example, the content of the subpolymer having a weight average molecular weight of about 5,000 to about 40,000 and derived from the second monomer containing two or more polymerizable unsaturated groups per monomer unit may be about 3 wt % to about 13 wt % relative to the total content (100 wt %) of the resin composition RC. The sub-polymer having a weight average molecular weight of about 5,000 to about 40,000 and derived from a second monomer containing two or more polymerizable unsaturated groups per monomer unit may include at least one selected from UF-C051 (urethane acrylate, manufactured by Kyoeisha Chemical Co., Ltd.), UF-C052 (urethane acrylate, manufactured by Kyoeisha Chemical Co., Ltd.), UN6304 (urethane acrylate, manufactured by Negami Chemical Industrial Co., Ltd.), UV3700B (urethane acrylate, manufactured by Mitsubishi Chemical Corporation), UV3300B (urethane acrylate, manufactured by Mitsubishi Chemical Corporation).

[0152] In the resin composition RC, at least one photoinitiator may include a bisacylphosphine oxide group. For example, the photoinitiator of the resin composition RC may include a free radical polymerization initiator. In the resin composition RC, the free radical polymerization initiator may be an initiator containing a bisacylphosphine oxide group. In the resin composition RC, the photoinitiator may include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0153] The resin composition RC may include multiple photoinitiators. When the resin composition RC includes multiple photoinitiators, different photoinitiators may be activated by UV light having different central wavelengths.

[0154] In an embodiment, for example, the photoinitiator may further comprise at least one selected from 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-1-propionyl)-benzyl]-phenyl}-2-methylpropan-1-one.

[0155] In addition, the photoinitiator may further comprise 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, (2,4,6- at least one of ethyl trimethylbenzoyl)phenylphosphinate, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, [1-(4-phenylsulfanylbenzoyl)heptyleneamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino]acetate, and bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrrolyl)phenyl]titanium(IV).

[0156] In an embodiment, the resin composition RC may include a benzotriazole-based UV absorber. The benzotriazole-based UV absorber contains a benzotriazole group. For example, the benzotriazole-based UV absorber may include 2-(2H-benzotriazole-2-yl)-6-dodecyl-4-methylphenol.

[0157] In an embodiment in which the resin composition RC containing a benzotriazole-based UV absorber has a thickness of about 190 μm to about 210 μm after curing, the resin composition RC may have a transmittance of about 5% or less for light in a wavelength range of about 405 nm or less. In an embodiment in which the resin composition RC containing a benzotriazole-based UV absorber has a thickness of about 200 μm after curing, the resin composition RC may have a transmittance of about 5% or less for light in a wavelength range of about 405 nm or less. In an embodiment in which the resin composition RC containing a benzotriazole-based UV absorber has a thickness of about 40 μm to about 60 μm after curing, the resin composition RC may have a transmittance of 15% or less for light in a wavelength range of about 405 nm or less. In an embodiment in which the resin composition RC containing a benzotriazole-based UV absorber has a thickness of 50 μm after curing, the resin composition RC may have a transmittance of 15% or less with respect to light in a wavelength range of about 405 nm or less. That is, in an embodiment in which the adhesive member AP ( Figure 3 ) has a thickness T0 of about 190 μm to about 210 μm (eg, 200 μm) Figure 3), the adhesive member AP may have a transmittance of about 5% or less with respect to light in a wavelength range of about 405 nm or less. In the embodiment wherein the adhesive member AP is formed of the resin composition RC containing the benzotriazole-based UV absorbent ( Figure 3 ) has a thickness T0 ( Figure 3 ), the adhesive member AP may have a transmittance of about 15% or less for light in a wavelength range of about 405 nm or less. In an embodiment, the adhesive member AP ( Figure 3 ) is formed of a resin composition RC containing a benzotriazole-based UV absorber, and thus can satisfy the above-described transmittance range.

[0158] In an embodiment, the content of the benzotriazole-based UV absorber may be about 0.5 wt % to about 2 wt % relative to the total content of the resin composition RC. An adhesive member formed from a resin composition containing a benzotriazole-based UV absorber in an amount of less than 0.5 wt % relative to the total content of the resin composition cannot satisfy the UV transmittance range described above and exhibits high UV transmittance. An adhesive member having high UV transmittance and a display device including the adhesive member have reduced reliability. A resin composition containing a benzotriazole-based UV absorber in an amount greater than about 2 wt % relative to the total content of the resin composition may not be curable and therefore cannot form an adhesive member. The liquid resin composition RC cures when UV light is applied to form an adhesive member AP ( Figure 3 ), and when the weight of the benzotriazole-based UV absorber is too large (e.g., greater than about 2 wt%), the UV absorber absorbs UV light provided for curing the resin composition RC, thereby preventing the adhesive member AP ( Figure 3 ) is formed. In an embodiment, the resin composition RC contains a benzotriazole-based UV absorber in an amount of about 0.5 wt % to about 2 wt % relative to the total content of the resin composition RC, so that the resin composition RC can exhibit curing-promoting properties. In addition, the resin composition RC containing a benzotriazole-based UV absorber in an amount of about 0.5 wt % to about 2 wt % relative to the total content of the resin composition RC can form an adhesive member AP that satisfies the transmittance range described above.

[0159] In an embodiment, the resin composition RC may contain diisoprenylglycerol ether. In an embodiment in which the resin composition RC containing diisoprenylglycerol ether has a thickness of about 190 μm to about 210 μm (e.g., about 200 μm) after curing, the resin composition RC may have a transmittance of about 5% or less than 5% for light in a wavelength range of about 405 nm or less than 405 nm. The resin composition RC according to the embodiment may contain diisoprenylglycerol ether. In an embodiment in which the resin composition RC containing diisoprenylglycerol ether has a thickness of about 40 μm to about 60 μm (e.g., about 50 μm) after curing, the resin composition RC may have a transmittance of about 15% or less than 15% for light in a wavelength range of about 405 nm or less than 405 nm. That is, when the adhesive member AP ( Figure 3 ) has a thickness T0 of about 190 μm to about 210 μm (eg, about 200 μm) Figure 3 ), the adhesive member AP may have a transmittance of about 5% or less with respect to light in a wavelength range of about 405 nm or less. In the case where the adhesive member AP ( Figure 3 ) has a thickness T0 (about 40 μm to about 60 μm (for example, about 50 μm) Figure 3 ) embodiment, the adhesive member AP may have a transmittance of about 15% or less for light in a wavelength range of about 405 nm or less. The adhesive member AP according to the embodiment ( Figure 3 ) is formed of a resin composition RC containing diisoprene glyceryl ether, and thus can satisfy the transmittance range described above. In addition, the adhesive member AP ( Figure 3 ) is formed of a resin composition RC containing diisoprenyl glyceryl ether, and therefore can have a small change in yellowness index due to exposure to external light or the like.

[0160] In one embodiment, the content of diisoprene glyceryl ether may be from about 0.1 wt% to about 1 wt% relative to the total content of the resin composition RC. Resin compositions containing less than about 0.1 wt% of diisoprene glyceryl ether relative to the total content of the resin composition are insufficient to suppress discoloration and exhibit a significant change in the yellowness index after curing. That is, an adhesive member formed from a resin composition containing less than about 0.1 wt% of diisoprene glyceryl ether relative to the total content of the resin composition exhibits a greater yellowness index value after prolonged exposure to external light, such as UV light, and degrades display quality. In resin compositions containing greater than 0.1 wt% of diisoprene glyceryl ether relative to the total content of the resin composition, the excess diisoprene glyceryl ether acts as a plasticizer after curing, resulting in reduced mechanical properties of the adhesive member. In one embodiment, a resin composition RC containing from about 0.1 wt% to about 1 wt% of diisoprene glyceryl ether relative to the total content of the resin composition RC may exhibit curing-promoting properties. Furthermore, the adhesive member AP ( Figure 3 ) can have a small change in yellowness index due to exposure to external light and exhibit high reliability.

[0161] refer to Figure 5B , the first light UV-1 may be provided or emitted to the resin composition RC applied to the substrate CF with a constant thickness. The liquid resin composition RC may be cured by the first light UV-1 to form a primary adhesive member P-AP ( Figure 5C ). The first light UV-1 may be UV light. Figure 5B The first light UV-1 is shown to be directly irradiated to the resin composition RC applied on the substrate CF to form the primary adhesive member P-AP, but the embodiments of the present invention are not limited thereto. A carrier film (not shown) may be provided on the resin composition RC applied to a uniform thickness, and the carrier film (not shown) may transmit UV light.

[0162] refer to Figure 5C and Figure 5D , by using the first light UV-1 ( Figure 5B) The primary adhesive member P-AP formed by irradiating the resin composition RC can be separated from the substrate CF and provided on one side of the window WP or one side of the display module DM. One side of the primary adhesive member P-AP can be laminated on one side of the window WP or one side of the display module DM, and the unattached side of the window WP or the side of the display module DM can be attached to the other side of the primary adhesive member P-AP. Thereafter, the second light UV-2 can be irradiated to the primary adhesive member P-AP to form an adhesive member AP ( Figure 3 ). The second light UV-2 may be UV light. The second light UV-2 may be provided from an upper portion of the window WP, and the window WP may transmit the second light UV-2. The second light UV-2 may be transmitted through the window WP and provided to the primary adhesive member P-AP.

[0163] In an embodiment in which the resin composition RC has a thickness of about 190 μm to about 210 μm (e.g., about 200 μm) after being cured by light UV-1 and UV-2, the resin composition RC may have a transmittance of about 5% or less for light in a wavelength range of about 405 nm or less. In an embodiment in which the resin composition RC has a thickness of about 40 μm to about 60 μm (e.g., about 50 μm) after being cured by light UV-1 and UV-2, the resin composition RC may have a transmittance of about 15% or less for light in a wavelength range of about 405 nm or less. Therefore, the resin composition RC according to the embodiment may exhibit a high UV protection rate after curing.

[0164] 5A to 5D The adhesive member AP ( Figure 3 ) is formed by curing the resin composition RC twice (ie, curing by providing light twice), but the embodiment of the present invention is not limited thereto. In the embodiment, for example, the adhesive member AP ( Figure 3 ) can be formed by curing the resin composition RC once, or the adhesive member AP ( Figure 3 ) can be formed by curing the resin composition RC three or more times.

[0165] Figures 6A to 6C Schematically shows a method for manufacturing an adhesive member AP using a resin composition RC according to another embodiment. Figures 6A to 6C In the description of the embodiment of the method for manufacturing the adhesive member AP using the resin composition RC, the above reference will be omitted. Figures 1 to 5D Any repeated detailed description of those same or similar elements will be described, and the differences will mainly be described.

[0166] like Figures 6A to 6C, an embodiment of a method for manufacturing an adhesive member AP may include providing a resin composition RC on a display module DM, providing a first light UV-1 to the resin composition RC to form a primary adhesive member P-AP, and providing a second light UV-2 to the primary adhesive member P-AP to form an adhesive member AP. In addition to providing the resin composition RC on the display module DM, Figures 6A to 6C The manufacturing method shown in 5A to 5D The manufacturing method is the same as shown in .

[0167] The resin composition RC may be directly provided on one side of the display module DM or one side of the window WP. Figure 6A It is shown that the resin composition RC is directly provided on one surface of the display module DM.

[0168] refer to Figure 6B , the first light UV-1 is provided to the uniformly applied resin composition RC. When the first light UV-1 is provided to the resin composition RC, a primary adhesive member P-AP may be formed. A window WP may be provided on the primary adhesive member P-AP. Reference Figure 6C , the second light UV-2 may pass through the window WP and be provided to the primary adhesive member P-AP. The primary adhesive member P-AP may be cured by the second light UV-2 to form an adhesive member AP ( Figure 3 ).

[0169] Figure 7 is a cross-sectional view showing a display device according to another embodiment of the present invention. Figure 7 In the description of the display device of the embodiment shown in FIG, the above reference will be omitted. Figures 1 to 6C Any repeated detailed description of those same or similar elements will be described, and the differences will mainly be described.

[0170] In the embodiment, Figure 7 As shown in FIG, the display device DD-a may further include a light control layer PP and an optical adhesive layer AP-a. The display device DD-a according to the embodiment may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP. The light control layer PP may include a color filter layer or a polarizing plate.

[0171] The optical adhesive layer AP-a can be formed from the resin composition RC according to the embodiment. In such an embodiment, the optical adhesive layer AP-a containing the polymer derived from the resin composition RC has a thickness of about 190 μm to about 210 μm (e.g., about 200 μm), so that the optical adhesive layer AP-a can have a transmittance of about 5% or less for light in a wavelength range of about 405 nm or less. In such an embodiment, the optical adhesive layer AP-a containing the polymer derived from the resin composition RC has a thickness of about 40 μm to about 60 μm (e.g., about 50 μm), so that the optical adhesive layer AP-a can have a transmittance of about 15% or less for light in a wavelength range of about 405 nm or less. Therefore, the display device DD-a including the adhesive member AP can exhibit high reliability.

[0172] Figure 8 is a cross-sectional view showing a display device according to another embodiment of the present invention. Figure 8 In the description of the display device of the embodiment shown in FIG, the above reference will be omitted. Figures 1 to 7 Any repeated detailed description of those same or similar elements will be described, and the differences will mainly be described.

[0173] In the embodiment, Figure 8 As shown in FIG, the display device DD-b may further include a light control layer PP, an optical adhesive layer AP-a and an interlayer adhesive layer PIB. Figure 7 The display device DD-a of the embodiment shown in FIG. Figure 8 The display device DD-b of the embodiment shown in FIG may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP.

[0174] In the display device DD-b according to the embodiment, an adhesive member AP may be provided between the display panel DP and the input sensing part TP. That is, the input sensing part TP may not be directly provided on the display panel DP, and the display panel DP and the input sensing part TP may be combined by the adhesive member AP. In the embodiment, for example, the adhesive member AP may be provided on the encapsulation layer TFE ( Figure 3 ) between the input sensing component TP.

[0175] An interlayer adhesive layer PIB may be provided below the light control layer PP. The interlayer adhesive layer PIB may be provided between the input sensing part TP and the light control layer PP and may be formed of an adhesive material having a high moisture-proof property. In an embodiment, for example, an interlayer adhesive layer PIB comprising polyisobutylene may be formed. The interlayer adhesive layer PIB may be provided on the input sensing part TP to prevent corrosion of the sensing electrode of the input sensing part TP. The display device DD-b according to the embodiment includes an optical adhesive layer AP-a and an adhesive member AP formed of the resin composition RC according to the embodiment, and the display device DD-b including the optical adhesive layer AP-a and the adhesive member AP may exhibit high reliability.

[0176] Figure 9 1 is a diagram showing a vehicle AM in which first to fourth display devices DD-1, DD-2, DD-3, and DD-4 are provided. At least one selected from the first to fourth display devices DD-1, DD-2, DD-3, and DD-4 may have the same Figures 1 to 3 、 Figure 7 and Figure 8 At least one of the first to fourth display devices DD-1, DD-2, DD-3, and DD-4 may include the same components in the embodiments of the display devices DD, DD-a, and DD-b described above. Figures 1 to 3 、 Figure 7 and Figure 8 An embodiment of the adhesive member AP is described.

[0177] Figure 9 Although an automobile is shown as a vehicle AM, this is presented as an example, and the first to fourth display devices DD-1, DD-2, DD-3, and DD-4 can be installed on other modes of transportation, such as bicycles, motorcycles, trains, ships, and airplanes. Furthermore, at least one of the first to fourth display devices DD-1, DD-2, DD-3, and DD-4, including the same components as one of the display devices DD, DD-a, and DD-b, can be used in other electronic devices without departing from the teachings herein.

[0178] At least one selected from the first to fourth display devices DD-1, DD-2, DD-3, and DD-4 may include the above-described adhesive member AP ( Figure 3 ) embodiment. Therefore, as described above, in at least one of the adhesive member AP ( Figure 3 ) is composed of a resin composition RC( Figure 5A and Figure 6A ) is formed or formed using a resin composition RC, and thus can exhibit high adhesiveness and high UV protection rate.

[0179] refer to Figure 9 The vehicle AM may include a steering wheel HA and a gear member GR for operating the vehicle AM, and has a front window GL disposed to face the driver.

[0180] The first display device DD-1 may be disposed in a first area overlapping the steering wheel HA. In an embodiment, for example, the first display device DD-1 may be a digital cluster component displaying first information about the vehicle AM. The first information may include a first scale indicating the vehicle AM's speed, a second scale indicating the engine speed (i.e., revolutions per minute (RPM)), and an image representing a fuel gauge. The first and second scales may be displayed as digital images.

[0181] The second display device DD-2 can be set in a second area facing the driver's seat and overlapping with the front window GL. The driver's seat can be a seat in which the steering wheel HA is arranged. In an embodiment, for example, the second display device DD-2 can be a head-up display (HUD) that displays the second information of the vehicle AM. The second display device DD-2 can be optically transparent. The second information includes a digital number indicating the driving speed of the vehicle AM, and can further include information such as the current time. Unlike what is shown, the second information of the second display device DD-2 can be projected and displayed on the front window GL.

[0182] The third display device DD-3 may be located in a third area adjacent to the shift member GR. In one embodiment, for example, the third display device DD-3 may be a center information display (CID) of the vehicle AM located between the driver's seat and the front passenger seat, and may display third information. The passenger seat may be spaced apart from the driver's seat, with the shift member GR located therebetween. The third information may include information about road conditions (e.g., navigation information), music or wireless playback, dynamic video (or image) playback, and the temperature inside the vehicle AM.

[0183] The fourth display device DD-4 may be disposed in a fourth area spaced apart from the steering wheel HA and the shift member GR and adjacent to a side of the vehicle AM. In an embodiment, for example, the fourth display device DD-4 may be a digital side mirror that displays fourth information. The fourth display device DD-4 may display an image of the exterior of the vehicle AM captured by a camera module CM disposed on the exterior of the vehicle AM. The fourth information may include an image of the exterior of the vehicle AM.

[0184] The first to fourth information described above are presented as examples, and the first to fourth display devices DD-1, DD-2, DD-3, and DD-4 may further display information about the interior or exterior of the vehicle AM. The first to fourth information may include different information. However, the present invention is not limited thereto, and some of the first to fourth information may include the same information.

[0185] Hereinafter, the resin composition according to the embodiment of the present invention and the adhesive member formed by the resin composition will be described in more detail with reference to Examples and Comparative Examples.In addition, the following examples are shown only for understanding the embodiments of the present invention, and the scope of the present invention is not limited thereto.

[0186] [Example]

[0187] 1. Preparation of resin composition

[0188] The resin compositions of Examples and Comparative Examples were prepared using the materials listed in Table 1. The materials listed in Table 1 were provided in corresponding amounts (g, gram) in a light-proof container. Thereafter, the materials were stirred at room temperature and uniformly mixed to prepare the resin compositions of Examples and Comparative Examples.

[0189] [Table 1]

[0190]

[0191]

[0192] <Data on Materials in Table 1>

[0193] 2-EHA: 2-ethylhexyl acrylate (manufactured by TOAGOSEI Co., Ltd.)

[0194] 4-HBA-LT: 4-Hydroxybutyl acrylate (manufactured by Osaka Organic Chemical Industry, Ltd.)

[0195] EHDG-AT: 2-Ethylhexyl diglycol acrylate (manufactured by Kyoeisha Chemical Co., Ltd.)

[0196] THF-A: Tetrahydrofurfuryl acrylate (manufactured by Kyoeisha Chemical Co., Ltd.)

[0197] IBXA: Isobornyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.)

[0198] IDAA: Isodecyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.)

[0199] NDDA: 1,9-nonanediol diacrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.)

[0200] UF-C051: Urethane acrylate (weight average molecular weight: 35,000, manufactured by Kyoeisha Chemical Co., Ltd.)

[0201] UF-C052: Urethane acrylate (weight average molecular weight: 10,000, manufactured by Kyoeisha Chemical Co., Ltd.)

[0202] UN6304: Urethane acrylate (weight average molecular weight: 10,000, manufactured by Negami Chemical Industry Co., Ltd.)

[0203] UV3700B: Urethane acrylate (weight average molecular weight: 38,000, manufactured by Mitsubishi Chemical Corporation)

[0204] UV3300B: Urethane acrylate (weight average molecular weight: 13,000, manufactured by Mitsubishi Chemical Corporation)

[0205] Tinuvin 970: (2H-Benzotriazol-2-yl)-6-dodecyl-4-methylphenol (manufactured by BASF)

[0206] DPNG: Diprenyl glyceryl ether (manufactured by Kuraray Co., Ltd.)

[0207] Omnirad 819: Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (made by IGM resin)

[0208] In Table 1, the resin compositions of Examples 1 to 3 are resin compositions according to the embodiment. Example 1 and Example 2 are the same resin compositions, and the materials contained in the resin compositions and the weights of the materials are the same as each other. The resin compositions of Examples 1 to 3 are compositions containing a benzotriazole-based UV absorber and diisoprene glycerol ether. In addition, the resin compositions of Examples 1 to 3 are compositions comprising: a first monomer containing one or two polymerizable unsaturated groups per monomer unit; at least one sub-polymer having a weight average molecular weight of about 5,000 to about 40,000 and derived from a second monomer containing two or more polymerizable unsaturated groups per monomer unit; and at least one photoinitiator containing a bisacylphosphine oxide group.

[0209] In each of the resin compositions of Examples 1 and 2, 0.3 g of a benzotriazole-based UV absorber was provided relative to a total weight of 21.1 g of the resin composition, and when the weight of the benzotriazole-based UV absorber was converted by taking 21.1 g as 100 wt%, the weight of the benzotriazole-based UV absorber was found to be approximately 1.42 wt%. In the resin composition of Example 3, 0.19 g of a benzotriazole-based UV absorber was provided relative to a total weight of 19.66 g of the resin composition, and when the weight of the benzotriazole-based UV absorber was converted by taking 19.66 g as 100 wt%, the weight of the benzotriazole-based UV absorber was found to be approximately 0.97 wt%. It was determined that the resin compositions of Examples 1 to 3 satisfied the weight range of the benzotriazole-based UV absorber according to the embodiment (i.e., a range of 0.5 wt% to 2 wt%).

[0210] In each of the resin compositions of Examples 1 and 2, 0.2 g of diisoprenylglycerol ether was provided relative to the total weight of 21.1 g of the resin composition, and when the weight of diisoprenylglycerol ether was converted by taking 21.1 g as 100 wt%, the weight of diisoprenylglycerol ether was found to be approximately 0.95 wt%. In the resin composition of Example 3, 0.19 g of diisoprenylglycerol ether was provided relative to the total weight of 19.66 g of the resin composition, and when the weight of diisoprenylglycerol ether was converted by taking 19.66 g as 100 wt%, the weight of diisoprenylglycerol ether was found to be approximately 0.97 wt%. The resin compositions of Examples 1 to 3 were determined to meet the weight range of diisoprenylglycerol ether according to the embodiment (i.e., the range of 0.1 wt% to 1 wt%).

[0211] Unlike the resin compositions of Examples 1 and 2, the resin compositions of Comparative Examples 1 and 2 do not contain diisoprenylglycerol. Comparative Examples 1 and 2 are identical resin compositions, and the materials and weights of the materials contained in the resin compositions are identical. The only difference between the resin compositions of Example 1 and Comparative Example 1 is the inclusion of diisoprenylglycerol. The only difference between the resin compositions of Example 2 and Comparative Example 2 is the inclusion of diisoprenylglycerol.

[0212] The resin composition of Comparative Example 3 does not contain diisoprenylglyceryl ether and a benzotriazole-based UV absorber, unlike the resin composition of Example 3. The resin composition of Comparative Example 3 has a composition similar to that of the resin composition of Example 3.

[0213] 2. Evaluation of adhesive components

[0214] Table 2 below shows the results of evaluating the transmittance, CIE color coordinate b* (CIE b*), and yellowness index (YI) of adhesive members formed from the resin compositions of Examples and Comparative Examples. The adhesive members of Examples 1A to 3A in Table 2 were formed from the resin compositions of Examples 1 to 3 in Table 1, respectively. The adhesive members of Comparative Examples 1B to 3B were formed from the resin compositions of Comparative Examples 1 to 3 in Table 1, respectively.

[0215] In Table 2, the initial values of transmittance, the initial values of CIE b*, and the initial values of YI are values measured before the light resistance test according to the method of MIL-810G. In Table 2, the subsequent values of transmittance, the subsequent values of CIE b*, and the subsequent values of YI are values measured after the light resistance test according to the method of MIL-810G.

[0216] <Transmittance of Adhesive Member>

[0217] The resin compositions of Examples and Comparative Examples were placed between slide glasses S112 manufactured by Matsunami Glass, and spacers having a thickness of 50 μm or 200 μm were attached thereto. Thereafter, the resin compositions were irradiated with UV light and cured.

[0218] UV-LED lamps having wavelength peaks at 365 nm and 395 nm were used as UV light, and the amounts of light provided were 800 mJ / cm2 and 800 mJ / cm2, respectively. 2 ) and 400mJ / cm 2 Then, a UV-LED lamp having a wavelength peak at 395 nm was used to emit UV light so that the amount of light provided was 4000 mJ / cm 2 , to obtain a sample of the adhesive member formed between the slide glasses. For the adhesive member sample, the transmittance of light of about 405 nm wavelength was measured using a spectrophotometer V770 (UV-Visible & NIR Spectrometer, JASCO Corporation).

[0219] In Table 2, Example 1A and Comparative Example 1B used a slide glass attached to a spacer having a thickness of 50 μm. Example 2A, Example 3A, Comparative Example 2B, and Comparative Example 3B used a slide glass attached to a spacer having a thickness of 200 μm. Therefore, Example 1A and Comparative Example 1B correspond to an adhesive member having a thickness of 50 μm. Example 2A, Example 3A, Comparative Example 2B, and Comparative Example 3B correspond to an adhesive member having a thickness of 200 μm. Example 1A and Example 2A are adhesive members formed from the same resin composition, and the only difference is the thickness of the adhesive member. Comparative Example 1B and Comparative Example 2B are adhesive members formed from the same resin composition, and the only difference is the thickness of the adhesive member.

[0220] <CIE Color Coordinates b* and Yellowness Index of Adhesive Member>

[0221] The CIE color coordinate b* and the yellowness index were measured for the adhesive member sample obtained from the transmittance measurement described above. The measurement was performed using a spectrophotometer COH 7700 (NIPPON DENSHOKU INDUSTRIES Co., Ltd.).

[0222] <Light Resistance Test for Adhesive Member>

[0223] The adhesive member samples obtained from the transmittance measurement described above were subjected to light resistance testing according to the MIL-810G method. Light resistance testing is performed to determine the adhesive member's resistance to discoloration and fading when exposed to UV, visible light, etc. The MIL-810G method is a test method according to U.S. military standards and was established in 2008.

[0224] [Table 2]

[0225]

[0226]

[0227] Referring to Table 2, the adhesive member of Example 1A, having a thickness of 50 μm, has a transmittance of 15% or less. That is, after the light resistance test according to the method of MIL-810G, the adhesive member of Example 1A has a transmittance of 15% or less for light at a wavelength of 405 nm. The adhesive members of Examples 2A and 3A, having a thickness of 200 μm, have a transmittance of 5% or less. That is, after the light resistance test according to the method of MIL-810G, the adhesive members of Examples 2A and 3A, having a thickness of 200 μm, have a transmittance of 5% or less for light at a wavelength of 405 nm.

[0228] Referring to Table 2, it is shown that the adhesive members of Example 1A and Example 3A have the same initial and subsequent values for the CIE color coordinate b* and yellow index (YI). That is, in the light fastness test according to the method of MIL-810G, the adhesive members of Example 1A and Example 3A do not show changes in the CIE color coordinate b* and yellow index. The CIE color coordinate b* and yellow index vary depending on the composition of the composition and the thickness of the cured product (i.e., adhesive member) formed by curing the composition.

[0229] The adhesive members of Examples 1A to 3A are adhesive members formed from the resin compositions of Examples 1 to 3, respectively, in Table 1. As described with reference to Table 1, the resin compositions of Examples 1 to 3 are resin compositions according to the embodiment and contain diisoprenylglycerol ether and a benzotriazole-based UV absorber. Therefore, in the embodiment, it was demonstrated that the adhesive member formed from the resin composition containing diisoprenylglycerol ether and a benzotriazole-based UV absorber is expected to exhibit high reliability even when the time of UV exposure accumulates in the user's usage environment.

[0230] With reference to Table 2, it is shown that the adhesive member of Comparative Example 1B with a thickness of 50 μm has a later value greater than 15% in terms of transmittance. That is, after the light resistance test according to the MIL-810G method, the adhesive member of Comparative Example 1B has a transmittance greater than 15% for light at a wavelength of 405 nm. In addition, compared with the adhesive member of Example 1A with the same thickness, the adhesive member of Comparative Example 1B has a relatively large difference between the initial value and the later value in terms of CIE color coordinates b* and yellow index (YI). The adhesive member of Comparative Example 1B is formed by the resin composition of Comparative Example 1 in Table 1, and the adhesive member of Example 1A is formed by the resin composition of Example 1 in Table 1. As described above, the only difference between the resin composition of Comparative Example 1 and the resin composition of Example 1 is that the resin composition of Example 1 contains diisoprene glyceryl ether, and the resin composition of Comparative Example 1 does not contain diisoprene glyceryl ether. Therefore, it is shown that the adhesive member of Comparative Example 1B has reduced reliability after the light resistance test.

[0231] Compared with the adhesive member of Example 2A with the same thickness, the adhesive member of Comparative Example 2B has a relatively significant large difference between the initial value and the subsequent value in terms of CIE color coordinate b* and yellow index (YI). The adhesive member of Comparative Example 2B is formed by the resin composition of Comparative Example 2 in Table 1, and the adhesive member of Example 2A is formed by the resin composition of Example 2 in Table 1. As described above, the only difference between the resin composition of Comparative Example 2 and the resin composition of Example 2 is that the resin composition of Example 2 contains diisoprene glyceryl ether, and the resin composition of Comparative Example 2 does not contain diisoprene glyceryl ether. Therefore, it is shown that the adhesive member of Comparative Example 2B has reduced reliability after the light resistance test.

[0232] Compared with the adhesive member of embodiment 3A with the same thickness, the adhesive member of comparative example 3B has a relatively large difference between the initial value and the latter value in terms of CIE color coordinate b* and yellow index (YI). The adhesive member of comparative example 3B is formed by the resin composition of comparative example 3 in table 1, and the adhesive member of embodiment 3A is formed by the resin composition of embodiment 3 in table 1. As described above, the resin composition of comparative example 3 includes a composition similar to the resin composition of embodiment 3, but does not include diisoprene glyceryl ether and a UV absorber based on benzotriazole. Therefore, it is shown that the adhesive member of comparative example 3B has reduced reliability after the light resistance test.

[0233] The display device according to the embodiment may include an adhesive member between the display panel and the window. The adhesive member according to the embodiment may be formed by a resin composition or formed using a resin composition. The resin composition according to the embodiment may include a UV absorber based on benzotriazole and diisoprene glycerol ether. Therefore, the resin composition according to the embodiment may exhibit properties that promote curing. The adhesive member formed by the resin composition according to the embodiment or formed using the resin composition according to the embodiment may exhibit a high UV protection rate. The adhesive member and the display device including the adhesive member may exhibit high reliability.

[0234] The resin composition according to the embodiment includes diprenyl glyceryl ether and a benzotriazole-based UV absorber, and thus may exhibit high reliability after curing.

[0235] The adhesive member according to the embodiment includes a polymer derived from a resin composition, and thus can exhibit high reliability.

[0236] The display device according to the embodiment includes the adhesive member and thus can exhibit high reliability.

[0237] The present invention should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the present invention to those skilled in the art.

[0238] While the invention has been particularly shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit or scope of the invention as defined by the appended claims.

Claims

1. A resin composition comprising: at least one first monomer containing one or two polymerizable unsaturated groups per monomer unit; at least one daughter polymer having a weight average molecular weight of 5,000 to 40,000 and derived from a second monomer containing two or more polymerizable unsaturated groups per monomer unit; Benzotriazole-based UV absorbers; Diprenyl glyceryl ether; and At least one photoinitiator containing a bisacylphosphine oxide group.

2. The resin composition according to claim 1, wherein after photocuring, the resin composition has a thickness of 190 μm to 210 μm, and The resin composition has a transmittance greater than 0% and less than or equal to 5% with respect to light within a wavelength range of 405 nm or less.

3. The resin composition according to claim 1, wherein after photocuring, the resin composition has a thickness of 40 μm to 60 μm, and The resin composition has a transmittance greater than 0% and less than or equal to 15% with respect to light in a wavelength range of 405 nm or less. 4 . The resin composition of claim 1 , wherein the content of the benzotriazole-based UV absorber is 0.5 wt % to 2 wt % relative to the total content of the resin composition. The resin composition according to claim 1 , wherein the content of the diisoprene glyceryl ether is 0.1 wt % to 1 wt % relative to the total content of the resin composition. The resin composition of claim 1 , wherein the first monomer comprises a (meth)acrylate monomer.

7. The resin composition of claim 1, wherein the first monomer comprises a first sub-monomer containing one polymerizable unsaturated group per monomer unit and a second sub-monomer containing two polymerizable unsaturated groups per monomer unit.

8. The resin composition of claim 1, wherein the first monomer comprises at least one selected from the group consisting of 2-ethylhexyl acrylate, 4-hydroxybutyl acrylate, 2-ethylhexyl diglycol acrylate, tetrahydrofurfuryl acrylate, isobornyl acrylate, isodecyl acrylate, and 1,9-nonanediol diacrylate.

9. The resin composition of claim 1, wherein the subpolymer comprises a urethane (meth)acrylate oligomer.

10. The resin composition of claim 1, wherein the photoinitiator comprises bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

11. The resin composition according to claim 1, wherein the resin composition is provided by inkjet printing or dispensing. 12 . An adhesive member comprising a polymer derived from the resin composition according to claim 1 .

13. A display device comprising: Display panel; a window disposed on the display panel; as well as An adhesive member provided between the display panel and the window and comprising a polymer derived from the resin composition according to any one of claims 1 to 11.

14. The display device of claim 13, further comprising a light management layer disposed between the adhesive member and the window, and an optical adhesive layer disposed between the light management layer and the window, The optical adhesive layer comprises a polymer derived from the resin composition.

15. The display device of claim 13, further comprising an input sensing component disposed between the display panel and the window, The adhesive member is disposed between the display panel and the input sensing component or between the input sensing component and the window.

Images