Secondary feeding positioning device, single crystal furnace and secondary feeding method

Abstract

The invention provides a secondary charging positioning device, a single crystal furnace and a secondary charging method. The secondary charging positioning device can position a secondary charging pipe, and the secondary charging pipe is provided with a supporting structure; the secondary feeding positioning device comprises at least two positioning units which are arranged on the inner side wall of the single crystal furnace; the positioning unit comprises a bearing part and a buffering part arranged on the top bearing face of the bearing part, the buffering part comprises a first buffering pad, a second buffering pad and a movable connecting assembly, and the first buffering pad and the second buffering pad are connected through the movable connecting assembly and can be switched between a folded state and an unfolded state. In the folding state, the first buffer cushion and the second buffer cushion are stacked on the top bearing surface; in the unfolding state, the first buffering pad is stacked on the top bearing face, and at least part of the second buffering pad is located in the gap between every two adjacent positioning units. According to the secondary charging positioning device, the single crystal furnace and the secondary charging method disclosed by the invention, the secondary charging pipe can be protected, and the quality of single crystals can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a secondary feeding positioning device, a single crystal furnace, and a secondary feeding method. Background Art

[0002] The Czochralski method is the primary method used to produce single-crystal silicon wafers. This method involves placing high-purity polysilicon into a quartz crucible within a single crystal furnace. Through processes such as melting, stabilization, seeding, shouldering, shoulder rotation, equalizing diameters, finishing, cooling, and rod removal, single-crystal silicon rods are pulled and then processed through a series of steps into single-crystal silicon wafers. After the polysilicon is melted into liquid, a large gap exists between the silicon solution surface and the top edge of the quartz crucible, allowing for additional silicon to be added to increase production capacity. Therefore, the polysilicon requires a secondary addition to increase the quartz crucible's inventory and reduce production costs.

[0003] In related technologies, the secondary feeding device primarily consists of a secondary feeding tube, a quartz cone mounted at the bottom of the tube, and an intermediate connecting rod installed within the tube. A flange positioning plate is installed within the single crystal furnace to mate with the flange on the secondary feeding tube to position the tube. During secondary feeding, polysilicon material is placed in the quartz tube, and the intermediate connecting rod descends, pushing the quartz cone at the bottom down to discharge the material.

[0004] After adding materials, when the quartz cone is lifted upward, large pieces of silicon material may become stuck on the contact surface between the bottom of the secondary feeding tube and the quartz cone. At this time, it is necessary to lower the crucible and accelerate the secondary feeding tube so that it moves up and down, thereby shaking off the silicon material stuck on the contact surface. During this process, the flange of the secondary feeding tube is likely to collide with the flange support on the single crystal furnace. In particular, since there is currently a support on each of the four sides of the flange, the secondary feeding tube will first collide with the support on one of the four sides during a collision. This may not only damage the secondary feeding tube and shorten the life of the quartz in the secondary feeding tube, but may also cause quartz fragments or other impurities to fall into the furnace, adversely affecting the normal growth of single crystals. Summary of the Invention

[0005] In order to solve at least one technical problem in the above-mentioned related technologies, the embodiments of the present disclosure provide a secondary charging positioning device, a single crystal furnace, and a secondary charging method.

[0006] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0007] In a first aspect, an embodiment of the present disclosure provides a secondary feeding positioning device for positioning a secondary feeding pipe, wherein the outer wall of the secondary feeding pipe is provided with a support structure along the circumference; the secondary feeding positioning device includes at least two positioning units, at least two of which are provided on the inner wall of a single crystal furnace and are spaced apart along the circumference of the single crystal furnace; the positioning units include:

[0008] a supporting member having a top supporting surface for supporting the supporting structure; and

[0009] A buffer component is provided on the top supporting surface, the buffer component includes a first buffer pad, a second buffer pad and a movable connection component, the first buffer pad and the second buffer pad are connected by the movable connection component so that the buffer component can be switched between a folded state and an unfolded state; wherein,

[0010] In the folded state, the first buffer pad and the second buffer pad are both stacked on the top supporting surface; in the unfolded state, the first buffer pad is stacked on the top supporting surface, and the second buffer pad is at least partially located in the gap between two adjacent positioning units along the circumference of the single crystal furnace.

[0011] Illustratively, in the expanded state, in two adjacent positioning units, the second cushioning pad of one overlaps with the first cushioning pad of the other.

[0012] Exemplarily, the first buffer pad is fixedly connected to the supporting member, and the second buffer pad is movable relative to the supporting member.

[0013] Exemplarily, the supporting member is constructed as an arc-shaped positioning block concentrically arranged with the single crystal furnace, and either the first buffer pad or the second buffer pad is constructed as an arc-shaped pad concentrically arranged with the single crystal furnace.

[0014] Exemplarily, the arc radius of the first cushion and the second cushion are the same; wherein, in the folded state, the orthographic projections of the first cushion and the second cushion on the top supporting surface coincide; in the unfolded state, the first cushion and the second cushion are spliced together to form a continuous arc-shaped cushion block.

[0015] Exemplarily, the movable connection assembly includes a rotating shaft, and the first cushion and the second cushion are connected by the rotating shaft, and the first cushion and the second cushion can rotate relative to each other around the rotating shaft, so that the cushion component can be switched between the folded state and the unfolded state.

[0016] Exemplarily, the movable connection assembly further includes a ball bearing, the ball bearing is disposed on at least one of the first buffer pad and the second buffer pad, and the rotating shaft is inserted into the ball bearing.

[0017] Exemplarily, the positioning unit further includes a weighing component, and the weighing component includes:

[0018] a pressure sensing component, disposed between the top supporting surface and the buffer component, for obtaining pressure information borne by the top supporting surface; and

[0019] a processing module connected to the pressure sensing component, and configured to determine, based on the pressure information, whether the current pressure borne by the supporting member exceeds a preset threshold;

[0020] The alarm module is connected to the processing module and is used to send an alarm signal when the current pressure borne by the supporting member exceeds a preset threshold.

[0021] In a second aspect, an embodiment of the present disclosure provides a single crystal furnace, comprising the secondary charging and positioning device as described above.

[0022] In a third aspect, an embodiment of the present disclosure provides a secondary feeding method, which is applied to the secondary feeding positioning device described above, and the method includes:

[0023] Before secondary feeding into the single crystal furnace through the secondary feeding pipe, the buffer component is converted from the folded state to the unfolded state;

[0024] During the secondary feeding process into the single crystal furnace through the secondary feeding pipe, the buffer component in the expanded state cooperates with the support structure to position the secondary feeding pipe;

[0025] After secondary feeding into the single crystal furnace through the secondary feeding pipe is completed, the buffer component is converted from the expanded state to the folded state.

[0026] The beneficial effects brought about by the embodiments of the present disclosure are as follows:

[0027] In the above scheme, the positioning unit provided in the single crystal furnace for positioning the secondary feeding tube is designed to include a support member and a buffer component located on the top supporting surface of the support member. The buffer component is softer than the support member. The buffer component can buffer the collision impact force between the support member and the secondary feeding tube to avoid damage to the secondary feeding tube and prevent quartz fragments or other impurities from falling into the furnace, thereby reducing the risk of poor single crystal growth; and the buffer component is designed to be a first buffer pad and a second buffer pad that can be folded or opened. When secondary feeding is not required, the first buffer pad and the second buffer pad can be folded to stack on the support member. When secondary feeding is required, the first buffer pad and the second buffer pad can be unfolded so that the second buffer pad is at least partially located between two adjacent support members. In this way, the contact area between the support structure on the secondary feeding tube and the entire positioning unit can be greatly increased, which can effectively reduce the force per unit area between the support structure and the support member, thereby further effectively protecting the secondary feeding tube. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram showing the coordination between the secondary feeding positioning device and the secondary feeding pipe in some embodiments of the present disclosure;

[0029] Figure 2 A top view of a buffer component in a secondary feeding positioning device according to some embodiments of the present disclosure is shown, wherein the buffer component of one positioning unit is in an unfolded state, and the buffer components of other positioning units are in a folded state;

[0030] Figure 3 A diagram showing the principle of calculating the contact area between the buffer component and the supporting structure of the secondary feeding pipe in the secondary feeding positioning device of some embodiments of the present disclosure. DETAILED DESCRIPTION

[0031] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0032] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0033] As used in the embodiments of the present disclosure, the terms "parallel," "perpendicular," and "identical" include the strict sense of "parallel," "perpendicular," and "identical," as well as "approximately parallel," "approximately perpendicular," and "approximately identical" with respect to a certain tolerance, which, taking into account the tolerances associated with the measurement of a particular quantity (e.g., limitations of the measurement system), means within an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the stated value.

[0034] In addition, in this document, unless otherwise defined, the terms "substantially," "essentially," "approximately," and "about" are used to describe and explain small variations. When used in connection with an event or circumstance, these terms can encompass situations where the event or circumstance occurs exactly, as well as situations where the event or circumstance occurs approximately. For example, when used in connection with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being aligned along the same plane within the micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0035] The secondary charging and positioning device provided in the embodiment of the present invention can be installed on a single crystal furnace. The single crystal furnace can include a furnace body, which can include a furnace chamber, and the furnace chamber can be provided with a crucible, a crucible shaft, a heater, etc.

[0036] like Figure 1 and Figure 2 As shown, the secondary feeding positioning device provided by the embodiment of the present disclosure can be used to position the secondary feeding pipe 100. The outer wall of the secondary feeding pipe 100 is provided with a support structure 110 along the circumference. For example, the support structure 110 can be a positioning flange 110'.

[0037] like Figure 1 and Figure 2 As shown, the secondary feeding positioning device may include at least two positioning units 200, which are arranged on the inner side wall of the single crystal furnace 10 and spaced apart along the circumference of the single crystal furnace 10. The at least two positioning units 200 can be used to support the support structure 110 to position and limit the secondary feeding tube 100.

[0038] For example, Figure 1 and Figure 2 As shown, the secondary charging positioning device may include four positioning units 200 , which are evenly and symmetrically arranged on the inner peripheral side wall of the single crystal furnace 10 , and each positioning unit 200 may be regarded as a positioning claw.

[0039] See Figure 1 As shown, the positioning unit 200 includes a supporting member 210 and a buffer component 220. The supporting member 210 can be made of a hard material and primarily supports the support structure 110. For example, the supporting member 210 can be made of metal. The supporting member 210 has a top supporting surface for supporting the support structure 110.

[0040] In some embodiments, the supporting member 210 is movably disposed on the inner side wall of the single crystal furnace 10. For example, the supporting member 210 can be disposed on the single crystal furnace 10 in a retractable or liftable manner. In this way, when secondary charging is required, the supporting member 210 can be extended into the inner cavity of the single crystal furnace 10 to support the secondary charging tube 100. When secondary charging is no longer required, the supporting member 210 can be withdrawn from the inner cavity of the single crystal furnace 10.

[0041] The buffer component 220 may be disposed on the top supporting surface 210 a . The elastic modulus of the buffer component 220 is smaller than that of the supporting member 210 . That is, the buffer component 220 is softer than the supporting member 210 .

[0042] Figure 2 A top view of a buffer component in a secondary feeding positioning device according to some embodiments of the present disclosure is shown, wherein, in order to more clearly describe the present application, Figure 2 Only the buffer component of one positioning unit is in an expanded state, and the buffer components of the other positioning units are in a folded state.

[0043] like Figure 2 As shown, the buffer component 220 may include a first buffer pad 221, a second buffer pad 222 and a movable connection component 223, and the first buffer pad 221 and the second buffer pad 222 are connected by the movable connection component 223, so that the buffer component 220 can be switched between a folded state and an unfolded state; wherein, in the folded state, the first buffer pad 221 and the second buffer pad 222 are both stacked and arranged on the top supporting surface 210a; in the unfolded state, the first buffer pad 221 is stacked and arranged on the top supporting surface 210a, and the second buffer pad 222 is at least partially located in the gap between two adjacent positioning units 200 along the circumference of the single crystal furnace 10.

[0044] In the above scheme, the positioning unit 200 provided in the single crystal furnace 10 for positioning the secondary feeding tube 100 is designed to include the support member 210 and the buffer component 220 located on the top supporting surface 210a of the support member 210. The buffer component 220 is softer than the support member 210. The buffer component 220 can buffer the collision impact force between the support member 210 and the secondary feeding tube 100 to avoid damage to the secondary feeding tube 100 and prevent quartz fragments or other impurities from falling into the furnace, thereby reducing the risk of poor single crystal growth.

[0045] In addition, the buffer component 220 is designed to be the first buffer pad 221 and the second buffer pad 222 that can be folded or opened. When secondary feeding is not required, the first buffer pad 221 and the second buffer pad 222 can be folded to be stacked on the supporting member 210. For example, when the supporting member 210 needs to exit the inner cavity of the single crystal furnace 10, the first buffer pad 221 and the second buffer pad 222 are moved together with the supporting member 210; when secondary feeding is required, the first buffer pad 221 and the second buffer pad 222 can be unfolded so that the second buffer pad 222 is at least partially located between two adjacent supporting members 210. In this way, the contact area between the support structure 110 on the secondary feeding tube 100 and the entire positioning unit 200 can be greatly increased, which can effectively reduce the force per unit area between the support structure 110 and the supporting member 210, thereby further effectively protecting the secondary feeding tube 100.

[0046] In some exemplary embodiments, Figure 2 As shown, in the expanded state, in two adjacent positioning units 200 , the second buffer pad 222 of one overlaps with the first buffer pad 221 of the other.

[0047] In this way, when the buffer components 220 in each of the positioning units 200 are in an expanded state, the buffer components 220 in all of the positioning units 200 can be combined together to form a complete closed loop surrounding the periphery of the secondary feeding pipe 100, so as to maximize the contact area between the support structure 110 and all of the positioning units 200.

[0048] After the second cushion pad 222 of one of the two adjacent positioning units 200 overlaps with the first cushion pad 221 of the other, there may be a step difference. In order to minimize the step difference caused by the overlap between the first cushion pad 221 and the second cushion pad 222 and improve the overlap reliability, in some embodiments, the first cushion pad 221 and the second cushion pad 222 can be overlapped in a stepped manner. Specifically, a first stepped overlapping structure can be provided on the first cushion pad 221, and a second stepped overlapping structure can be provided on the second cushion pad 222, and the first stepped overlapping structure and the second stepped overlapping structure can be overlapped with each other.

[0049] It should be noted that in other embodiments, in the deployed state, the second cushioning pad 222 of one of two adjacent positioning units 200 may not overlap with the first cushioning pad 221 of the other, but may have a certain gap therebetween. In this way, although the second cushioning pad 222 is in a suspended state, it can still overlap with the support structure 110 to increase the contact area between the two.

[0050] Furthermore, in some exemplary embodiments, the first cushion 221 is fixedly connected to the supporting member 210, and the second cushion 222 is movable relative to the supporting member 210. For example, the first cushion 221 can be fixedly connected to the supporting member 210 by gluing or fastening with fasteners, and only the second cushion 222 is movable relative to the supporting member 210, thereby meeting the requirement that the cushion component 220 can be folded or unfolded.

[0051] Of course, it is understandable that, in other embodiments, the first buffer pad 221 and the second buffer pad 222 may also be movable relative to the supporting member 210 .

[0052] Furthermore, in some exemplary embodiments, Figure 2 As shown, the support member 210 is constructed as an arc-shaped positioning block disposed concentrically with the single crystal furnace 10. Correspondingly, either the first buffer pad 221 or the second buffer pad 222 is constructed as an arc-shaped pad disposed concentrically with the single crystal furnace 10. In this way, the supporting force exerted on the support structure 110 by the support member 210 and the buffer member 220 is more uniform.

[0053] Furthermore, in some exemplary embodiments, Figure 2 As shown, the arc radius of the first cushion 221 and the second cushion 222 are the same; in the folded state, the orthographic projections of the first cushion 221 and the second cushion 222 on the top supporting surface 210a coincide; in the unfolded state, the first cushion 221 and the second cushion 222 are joined together to form a continuous arc-shaped cushion block. This further ensures that the supporting force from the supporting member 210 and the cushion component 220 on the support structure 110 is more uniform. Of course, it is understood that the specific shapes and structures of the supporting member 210 and the cushion component 220 are not limited to these.

[0054] Furthermore, in some exemplary embodiments, Figure 2 As shown, the movable connection component 223 includes a rotating shaft 2231, and the first buffer pad 221 and the second buffer pad 222 are connected by the rotating shaft 2231, and the first buffer pad 221 and the second buffer pad 222 can rotate relative to each other around the rotating shaft 2231, so that the buffer component 220 can be switched between the folded state and the unfolded state.

[0055] By adopting the above solution, the first cushion 221 and the second cushion 222 can be folded or unfolded by relatively rotating the first cushion 221 and the second cushion 222 around the rotating shaft 2231. This structure is simple and easy to operate.

[0056] It should be understood that in other embodiments, the first cushion 221 and the second cushion 222 can also be folded or unfolded in other ways. For example, the first cushion 221 and the second cushion 222 can also be folded or unfolded with each other by relative translation or splicing.

[0057] Furthermore, in some exemplary embodiments, the movable connection assembly 223 may further include a ball bearing, which is disposed on at least one of the first cushion 221 and the second cushion 222, and into which the rotating shaft 2231 is inserted. The provision of the ball bearing can reduce friction and thus reduce the generation of impurities, and the ball bearing can withstand loads, thereby improving rotational accuracy.

[0058] Furthermore, in some exemplary embodiments, Figure 1 As shown, the positioning unit 200 further includes a weighing component, which includes:

[0059] a pressure sensing component 230 disposed between the top supporting surface 210 a and the buffer component 220 and configured to obtain pressure information borne by the top supporting surface 210 a; and

[0060] a processing module connected to the pressure sensing component 230 and configured to determine, based on the pressure information, whether the current pressure on the supporting member 210 exceeds a preset threshold;

[0061] The alarm module is connected to the processing module and is used to send an alarm signal when the current pressure borne by the supporting member 210 exceeds a preset threshold.

[0062] By adopting the above scheme, the weight measuring component can perform force statistics on the pressure borne by the supporting member 210 during the secondary feeding process, so as to calculate the force applied to the secondary feeding tube 100 during the collision. When the force applied to the secondary feeding tube 100 reaches a preset threshold, it indicates that the secondary feeding tube 100 may be damaged. Therefore, an alarm can be used to remind the operator to pay further attention to the feeding status of the secondary feeding tube 100 to reduce the risk of damage to the secondary feeding tube 100.

[0063] Please combine Figure 3 As shown, taking a secondary feeding pipe 100 as an example, the radius of its positioning flange 110' can be R = 0.34m, corresponding to a central angle α; the arc inner diameter of the supporting member 210 is r = 0.28m, corresponding to a central angle β = 60°; the width of the supporting member 210 is l; and the weight of the secondary feeding pipe 100 is m.

[0064] For the supporting member 210 without the buffer component 220, the overall force is: when a collision occurs between the positioning flange 110' of the secondary feeding pipe 100 and the supporting member 210, assuming that the speed before the collision is v1, the speed after the collision is v2, and the total time of the collision process is t1, then the average acceleration of the positioning flange 110' is a = (v2-v1) / t1, and the average force is F1 = ma = m(v2-v1) / t1.

[0065] For the supporting member 210 with the buffer component 220, the overall force is: when a collision occurs between the positioning flange 110' of the secondary feeding pipe 100 and the supporting member 210, assuming that the speed before the collision is v1, the speed after the collision is v2, and the total time of the collision process is t2, then the average acceleration of the positioning flange 110' is a = (v2-v1) / t2, and the average force is F2 = ma = m(v2-v1) / t2.

[0066] Since the buffer component 220 is softer than the supporting component 210 and is more easily deformed, when the buffer component 220 is provided, the collision time t is longer during the collision process, and t2>t1, so it can be obtained that: F2<F1. It can be seen that by providing the buffer component 220, the force acting on the supporting component 210 can be reduced, thereby protecting the secondary feeding tube 100.

[0067] Furthermore, for the support member 210 without the buffer member 220, it is known that tan(α / 2) = r / (2R), which means that α is approximately 44.8°, and l = R*cos(α / 2) - r*sin 60°. Therefore, the contact area between the support member 210 and the positioning flange 110' is:

[0068] S3=(r*r*sin60°*0.5+l*r+α / 360°*π*R*RR*R*(sinα / 2)*cos(α / 2)*0.5-60° / 360°*π*r*r)*4=0.07m 2 .

[0069] For the supporting member 210 with the buffer component 220, when the buffer component 220 is in the expanded state, the contact area between the buffer component 220 and the positioning flange 110' is S4 = π*R*R-π*r*r = 0.1168m 2 .

[0070] When the overall force F is the same, S3 < S4, therefore, the force per unit area of the positioning flange 110' is: F / S3 > F / S4. Therefore, it can be concluded that since the buffer component 220 can be deployed, the force area of the positioning flange 110' increases and the force per unit area decreases. Therefore, during the collision, the positioning flange 110' of the secondary feeding tube 100 is subjected to less force, the positioning flange 110' is subjected to more uniform force, and is less likely to be damaged, thereby achieving the purpose of protecting the secondary feeding tube 100.

[0071] In addition, a single crystal furnace 10 is provided in an embodiment of the present disclosure, including the secondary charging positioning device provided in an embodiment of the present disclosure.

[0072] The other essential components of the single crystal furnace 10 are well understood by those skilled in the art and are not described in detail here, nor should they be construed as limitations of the present disclosure. Since the principles underlying the problems solved by the single crystal furnace 10 are similar to those of the aforementioned secondary charging and positioning device, the embodiments of the single crystal furnace 10 provided in the present disclosure can be referenced to the embodiments of the aforementioned secondary charging and positioning device provided in the present disclosure, and are not described in detail here.

[0073] In addition, the embodiment of the present disclosure provides a secondary feeding method, which is applied to the secondary feeding positioning device in the embodiment of the present disclosure, and the method includes:

[0074] Before secondary feeding into the single crystal furnace 10 through the secondary feeding pipe 100, the buffer component 220 is converted from the folded state to the unfolded state;

[0075] During the secondary feeding process into the single crystal furnace 10 through the secondary feeding pipe 100, the buffer component 220 in the expanded state cooperates with the support structure 110 to position the secondary feeding pipe 100;

[0076] After the secondary feeding into the single crystal furnace 10 is completed through the secondary feeding pipe 100 , the buffer member 220 is converted from the unfolded state to the folded state.

[0077] Obviously, the secondary feeding method provided in the embodiment of the present disclosure also has the beneficial effects brought about by the secondary feeding positioning device provided in the embodiment of the present disclosure, which will not be described in detail here.

[0078] There are a few points to note:

[0079] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure. Other structures may refer to conventional designs.

[0080] (2) For the sake of clarity, the thickness of layers or regions in the drawings used to describe the embodiments of the present disclosure are exaggerated or reduced, i.e., these drawings are not drawn to scale. It is understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or intervening elements may be present.

[0081] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to form new embodiments.

[0082] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. The protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A secondary feeding positioning device for positioning a secondary feeding pipe, wherein the outer wall of the secondary feeding pipe is provided with a supporting structure along the circumference; characterized in that: The secondary charging positioning device includes at least two positioning units, at least two of which are arranged on the inner side wall of the single crystal furnace and spaced apart along the circumference of the single crystal furnace; at least one of the positioning units includes: a supporting member having a top supporting surface for supporting the supporting structure; and A buffer component is provided on the top supporting surface, the buffer component includes a first buffer pad, a second buffer pad and a movable connection component, the first buffer pad and the second buffer pad are connected by the movable connection component so that the buffer component can be switched between a folded state and an unfolded state; wherein, In the folded state, the first buffer pad and the second buffer pad are both stacked on the top supporting surface; in the unfolded state, the first buffer pad is stacked on the top supporting surface, and the second buffer pad is at least partially located in the gap between two adjacent positioning units along the circumference of the single crystal furnace.

2. The secondary feeding positioning device according to claim 1, characterized in that: In the expanded state, the second buffer pad of one of two adjacent positioning units overlaps with the first buffer pad of the other one.

3. The secondary feeding positioning device according to claim 1, characterized in that: The first buffer pad is fixedly connected to the supporting member, and the second buffer pad is movable relative to the supporting member.

4. The secondary feeding positioning device according to claim 1, characterized in that: The supporting member is constructed as an arc-shaped positioning block concentrically arranged with the single crystal furnace, and either the first buffer pad or the second buffer pad is constructed as an arc-shaped pad concentrically arranged with the single crystal furnace.

5. The secondary feeding positioning device according to claim 4, characterized in that: The arc radius of the first cushion and the second cushion are the same; wherein, in the folded state, the orthographic projections of the first cushion and the second cushion on the top supporting surface coincide; in the unfolded state, the first cushion and the second cushion are spliced together to form a continuous arc-shaped cushion block.

6. The secondary feeding positioning device according to claim 1, characterized in that: The movable connection assembly includes a rotating shaft, and the first buffer pad and the second buffer pad are connected by the rotating shaft. The first buffer pad and the second buffer pad can rotate relative to each other around the rotating shaft, so that the buffer component can be switched between the folded state and the unfolded state.

7. The secondary feeding positioning device according to claim 6, characterized in that: The movable connection assembly further includes a ball bearing, which is arranged on at least one of the first buffer pad and the second buffer pad, and the rotating shaft is inserted into the ball bearing.

8. The secondary feeding positioning device according to claim 1, characterized in that: The positioning unit further includes a weighing assembly, which includes: a pressure sensing component, disposed between the top supporting surface and the buffer component, for obtaining pressure information borne by the top supporting surface; and a processing module connected to the pressure sensing component, and configured to determine, based on the pressure information, whether the current pressure borne by the supporting member exceeds a preset threshold; The alarm module is connected to the processing module and is used to send an alarm signal when the current pressure borne by the supporting member exceeds a preset threshold.

9. A single crystal furnace, characterized in that: It comprises the secondary feeding positioning device as described in any one of claims 1 to 8.

10. A secondary feeding method, characterized in that: Applied to the secondary feeding positioning device according to any one of claims 1 to 8, the method comprises: Before secondary feeding into the single crystal furnace through the secondary feeding pipe, the buffer component is converted from the folded state to the unfolded state; During the secondary feeding process into the single crystal furnace through the secondary feeding pipe, the buffer component in the expanded state cooperates with the support structure to position the secondary feeding pipe; After secondary feeding into the single crystal furnace through the secondary feeding pipe is completed, the buffer component is converted from the expanded state to the folded state.

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