Optical module and manufacturing method thereof

Abstract

The invention relates to the technical field of photoelectric connection, and discloses an optical module and a manufacturing method of the optical module. The optical module comprises a base, the base is provided with a first cavity and a second cavity which are arranged in a penetrating mode in the thickness direction, and the first cavity is communicated with the second cavity; the upper cover is matched with the base, a sealing gap is formed between the upper cover and the base, and the sealing gap is filled with a first sealing layer; the circuit board is accommodated in the first cavity, and a second sealing layer is arranged between the circuit board and the inner wall of the first cavity; the connector and the chip assembly are located on the two opposite sides of the circuit board respectively, and the connector is contained in the second cavity. By means of the mode, the effect of sealing and isolating the interior of the optical module from the external environment can be achieved, it is avoided that high-humidity air in the external environment enters the interior of the optical module to affect normal operation of elements such as an internal chip assembly and a circuit board, the service life of the optical module in special environments such as high humidity is prolonged, and the service life of the optical module is prolonged. The application range of the optical module is widened.

Description

Technical Field

[0001] The present application relates to the field of optoelectronic connection technology, and more particularly to an optical module and a method for manufacturing the optical module. Background Art

[0002] Optical modules are optoelectronic devices that perform photoelectric and electrical-optical conversion. The transmitting end of an optical module converts electrical signals into optical signals, while the receiving end converts optical signals into electrical signals. Optical modules are categorized by package type, with common ones including SFP, SFP+, SFF, and Gigabit Ethernet Interface Converter (GBIC).

[0003] When existing optical modules are used in some high-humidity environments, humid air can easily enter the interior of the optical module, easily corroding key components such as chip components and circuit boards inside the optical module, causing chip components and circuit boards to malfunction or be damaged, greatly reducing the service life of the optical module. It is difficult to operate for a long time in some special environments such as high humidity, which limits the application scope of the optical module. Summary of the Invention

[0004] The present application provides an optical module and a method for manufacturing the optical module, which can achieve the effect of sealing and isolating the interior of the optical module from the external environment, preventing high-humidity air from the external environment from entering the interior of the optical module and affecting the normal operation of internal chip components, circuit boards and other components, extending the service life of the optical module in special environments such as high humidity, and achieving the purpose of expanding the application range of the optical module.

[0005] The present application provides an optical module, comprising: a base, wherein the base is provided with a first cavity and a second cavity which are arranged through the base along a thickness direction, wherein the first cavity is connected to the second cavity;

[0006] an upper cover matched with the base, wherein a sealing gap is defined between the upper cover and the base, and the sealing gap is filled with a first sealing layer;

[0007] a circuit board housed in the first cavity, with a second sealing layer provided between the circuit board and the inner wall of the first cavity;

[0008] A connector and a chip assembly are respectively located on opposite sides of the circuit board, the connector is accommodated in the second cavity, and a heat-conducting matrix is provided between the chip assembly and the circuit board;

[0009] An optical fiber assembly is coupled to the chip assembly, and the optical fiber assembly passes through the upper cover and the base to extend from the first cavity to the outside of the upper cover and the base. The upper cover and the base are used to fill the position where the optical fiber assembly passes through with a third sealing layer.

[0010] In one embodiment of the present application, a first step is provided on the inner wall of the first cavity facing the upper cover, and the upper cover is provided with a second step matching the first step. When the upper cover is connected to the base, a sealed gap is formed between the first step and the second step.

[0011] In one embodiment of the present application, the first step is arranged along the circumference of the first cavity, and the second step is arranged along the circumference adjacent to the edge of the upper cover. When the upper cover is connected to the base, the second step is located above the first step to form a sealing gap between the outer side and the bottom of the second step.

[0012] In one embodiment of the present application, the upper cover has a first guide channel, and the base has a second guide channel. The first guide channel and the second guide channel constitute a channel for allowing the optical fiber assembly to extend from the first cavity to the outside of the upper cover and the base, and the third sealing layer is filled in the first guide channel and the second guide channel.

[0013] In one embodiment of the present application, a heat-conducting branch is provided on the heat-conducting base, and a first heat-conducting channel is formed between the end of the heat-conducting branch and the side wall of the first cavity. The first heat-conducting channel is filled with a first heat conductor to conduct the temperature of the heat-conducting branch to the base.

[0014] In one embodiment of the present application, the upper cover is provided with a heat conducting portion, a second heat conducting channel is formed between the heat conducting portion and the heat conducting branch, and the second heat conducting channel is filled with a second heat conductor to conduct the temperature of the heat conducting branch to the upper cover.

[0015] In one embodiment of the present application, the heat-conducting branch has a first heat-conducting area, the heat-conducting portion is provided with a second heat-conducting area, a second heat-conducting channel is formed between the first heat-conducting area and the second heat-conducting area, and the second heat conductor is located between the first heat-conducting area and the second heat-conducting area.

[0016] In one embodiment of the present application, the circuit board is located on the inner side of the first step, the inner side wall of the first step is provided with a female anti-fouling portion, and the circuit board is provided with a sub-anti-fouling portion corresponding to the female anti-fouling portion; and / or,

[0017] The thickness of the circuit board is smaller than the height of the first step, and a plurality of pressing parts are provided on the second step for pressing the circuit board when the upper cover is connected to the base.

[0018] In one embodiment of the present application, the upper cover is provided with an avoidance groove, and the avoidance groove corresponds to the optical fiber assembly to prevent the upper cover from squeezing the optical fiber assembly.

[0019] Accordingly, the present application also provides a method for manufacturing the optical module of the above embodiment, comprising:

[0020] Provide circuit boards;

[0021] Fixing the thermal conductive base on the circuit board through thermal conductive paste;

[0022] Mounting the chip component on the thermally conductive substrate;

[0023] coupling and connecting the optical fiber component with the chip component;

[0024] Providing a base, wherein the base is provided with a first cavity and a second cavity provided through the base in a thickness direction, wherein the first cavity is communicated with the second cavity;

[0025] Apply a second sealant on the inner wall of the first cavity and place the circuit board into the first cavity;

[0026] Continue applying the second sealant to the gap between the circuit board and the periphery of the first cavity;

[0027] Applying a first sealant on the first step;

[0028] Connect the upper cover to the base, and squeeze the first sealant on the first step with the second step;

[0029] placing the connector into the second cavity and electrically connecting it to the circuit board;

[0030] Filling a third sealant between the first guide channel and the second guide channel;

[0031] The first sealant, the second sealant and the third sealant are subjected to heat curing treatment.

[0032] The beneficial effects of this application are:

[0033] A second sealing layer is provided on the inner wall of the first cavity to seal the placement position of the circuit board and the base, preventing the base from passing through the second cavity and the gap between the circuit board and the first cavity, thereby affecting the air tightness between the circuit board and the base. By providing the first sealing layer in the sealing gap formed between the upper cover and the base, the upper cover and the base can be sealed to avoid air leakage at the connection between the upper cover and the base. In addition, a third sealing layer is provided at the position of the upper cover and the base for the optical fiber component to pass through, thereby sealing the optical port of the optical module, thereby achieving the effect of sealing and isolating the interior of the optical module from the external environment, preventing the high humidity air from the external environment from entering the interior of the optical module and affecting the normal operation of internal chip components, circuit boards and other components, extending the service life of the optical module in special environments such as high humidity, and achieving the purpose of improving the application range of the optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 This is a schematic diagram of the structure of an optical module in an exploded state according to an embodiment of the present application;

[0036] Figure 2 yes Figure 1 A structural diagram of the optical module in an exploded state from another perspective;

[0037] Figure 3 yes Figure 1 A schematic diagram of the top view of the optical module shown;

[0038] Figure 4 yes Figure 3 Schematic diagram of the cross-sectional structure along the AA direction;

[0039] Figure 5 yes Figure 4 Schematic diagram of the three-dimensional structure;

[0040] Figure 6 yes Figure 1 A schematic side view of the optical module shown;

[0041] Figure 7 yes Figure 6 Schematic diagram of the cross-sectional three-dimensional structure along the BB direction;

[0042] Figure 8 This is a structural diagram of the base of the optical module of the present application;

[0043] Figure 9 This is a schematic structural diagram of the upper cover of the optical module of the present application;

[0044] Figure 10 This is a schematic diagram of the structure of the optical module of the present application after the upper cover, chip assembly and optical fiber assembly are disassembled;

[0045] Figure 11 This is a schematic diagram of the split structure of the optical module of this application after the upper cover is removed;

[0046] Figure 12 yes Figure 10 A structural diagram from another perspective.

[0047] Description of reference numerals:

[0048] 10. Upper cover; 11. Second step; 111. Pressing part; 12. First guide channel; 13. Heat-conducting part; 131. Second heat-conducting area; 14. Avoidance groove; 15. Positioning hole; 20. Base; 21. First cavity; 211. First step; 212. First female anti-fouling block; 213. Second female anti-fouling block; 22. Second cavity; 23. Second guide channel; 24. Positioning column; 25. Mounting column; 30. Circuit board; 31. First sub-anti-fouling groove; 32. Second sub-anti-fouling groove; 40. Connector; 50. Heat-conducting base; 51. Heat-conducting branch; 511. First heat-conducting area; 52. First heat-conducting channel; 60. Chip assembly; 70. Optical fiber assembly; 80. Sealing gap. DETAILED DESCRIPTION

[0049] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "up", "down", "left", and "right", generally refer to the up, down, left, and right of the device in actual use or working state, specifically the drawing direction in the accompanying drawings.

[0050] In this application, unless otherwise specified or limited, terms such as "connected," "connected," and "stacked" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integration; they may refer to direct connections or indirect connections through an intermediate medium; they may refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0051] Reference Figure 1 and Figure 2 The present application provides an optical module, including: a base 20, an upper cover 10 matched with the base 20, a circuit board 30, a connector 40, a chip assembly 60, a heat-conducting base 50, and an optical fiber assembly 70.

[0052] Specifically, the base 20 is provided with a first cavity 21 and a second cavity 22 which are arranged through the thickness direction, and the first cavity 21 is connected to the second cavity 22; the size of the first cavity 21 is generally larger than that of the second cavity 22, and the first cavity 21 and the second cavity 22 can generally be a rectangular or approximately rectangular groove structure, or a square or approximately square groove structure. In actual applications, the first cavity 21 and the second cavity 22 can also be set as other types of groove structures, which is not the only limitation here.

[0053] There is a sealing gap 80 between the upper cover 10 and the base 20, and the sealing gap 80 is filled with a first sealing layer; when the upper cover 10 and the base 20 are connected, the upper cover 10 and the base 20 can seal the sealing gap 80 at the connection through the first sealing layer to avoid air leakage in the sealing gap 80 between the upper cover 10 and the base 20.

[0054] The circuit board 30 is housed within the first cavity 21, with a second sealing layer disposed between the circuit board 30 and the inner wall of the first cavity 21. Specifically, before the circuit board 30 is placed within the first cavity 21, a second sealing layer is disposed on both the bottom wall and the side walls of the first cavity 21. This ensures that when the circuit board 30 is placed within the first cavity 21, a seal is achieved between the circuit board 30 and the bottom wall and side walls of the first cavity 21, preventing gaps between the circuit board 30 and the inner wall of the first cavity 21 and preventing air leakage between the circuit board 30 and the base 20 through the second cavity 22. The circuit board 30 is generally a rectangular parallelepiped or a substantially rectangular parallelepiped plate-shaped structure, but may also be a cube or a substantially cube-shaped plate-shaped structure. In practical applications, the circuit board 30 may also be configured as other types of plate-shaped structures, and this is not intended to be a single limitation.

[0055] Furthermore, after the circuit board 30 is placed in the first cavity 21, an additional sealing layer can be provided along the gap between the sidewalls of the first cavity 21 and the periphery of the circuit board 30 to further enhance the sealing effect between the circuit board 30 and the sidewalls of the first cavity 21. This additional sealing layer can be considered an extension of the third sealing layer and can be made of the same sealing material as the third sealing ring.

[0056] The connector 40 and chip assembly 60 are located on opposite sides of the circuit board 30. The connector 40 is housed in the second cavity 22, with a thermally conductive substrate 50 located between the chip assembly 60 and the circuit board 30. The connector 40 may be an LGA 200-pin connector. The chip assembly 60 includes a laser, a limiting amplifier, a transmitting optical chip, and a receiving optical chip. The thermally conductive substrate 50 may be constructed of aluminum nitride. The connector 40 is exposed from the bottom wall of the base 20 through the second cavity 22. This allows the pins of the connector 40 to connect with corresponding pins on the external motherboard when the optical module is mounted on the external motherboard via the base 20, achieving electrical continuity between the optical module and the external motherboard.

[0057] The optical fiber assembly 70 is coupled to the chip assembly 60. The optical fiber assembly 70 passes through the upper cover 10 and the base 20, extending from the first cavity 21 to the exterior of the upper cover 10 and the base 20. The portion of the upper cover 10 and the base 20 through which the optical fiber assembly 70 passes is filled with a third sealing layer. Specifically, the optical fiber assembly 70 can be coupled to the transmitting optical chip and the receiving optical chip. After the optical fiber assembly 70 is coupled, the optical fiber assembly 70 can be fixed to the thermally conductive substrate 50 using adhesive. The third sealing layer can seal the upper cover 10 and the base 20 at the portion through which the optical fiber assembly 70 passes, preventing air leakage in the upper cover 10 and the base 20 at the portion through which the optical fiber assembly 70 passes.

[0058] It should be noted that, in this embodiment, the first sealing layer, the second sealing layer and the third sealing layer can all be sealing layer structures formed after the airtight glue is solidified.

[0059] Through the above method, a second sealing layer is provided on the inner wall of the first cavity 21 to seal the placement position of the circuit board 30 and the base 20, preventing the base 20 from passing through the second cavity 22 and the gap between the circuit board 30 and the first cavity 21, thereby affecting the air tightness between the circuit board 30 and the base 20. By providing a first sealing layer in the sealing gap 80 formed between the upper cover 10 and the base 20, the upper cover 10 and the base 20 can be sealed to avoid air leakage at the connection between the upper cover 10 and the base 20. In addition, a third sealing layer is provided at the position of the upper cover 10 and the base 20 for the optical fiber assembly 70 to pass through, thereby sealing the optical port of the optical module, thereby achieving the effect of sealing and isolating the interior of the optical module from the external environment, preventing the high humidity air from entering the interior of the optical module and affecting the normal operation of internal chip components 60, circuit board 30 and other components, extending the service life of the optical module in special environments such as high humidity, and achieving the purpose of improving the application range of the optical module.

[0060] In one embodiment, referring to Figures 3 to 7The inner wall of the first cavity 21 facing the upper cover 10 is provided with a first step 211, and the upper cover 10 is provided with a second step 11 that cooperates with the first step 211. When the upper cover 10 is connected to the base 20, a sealed gap 80 is formed between the first step 211 and the second step 11. Specifically, when the upper cover 10 is installed on the base 20, the second step 11 is located in the first cavity 21, and the bottom wall of the second step 11 does not contact the top wall of the first step 211. At the same time, the outer wall of the second step 11 does not contact the inner wall of the first cavity 21, thereby forming a sealed gap 80 between the upper cover 10 and the base 20. When assembling the optical module, after a second sealing layer composed of airtight glue is provided on the first step 211, the second step 11 can squeeze the second sealing layer to form a seal in the sealed gap 80, thereby ensuring airtightness between the upper cover 10 and the base 20.

[0061] It should be noted that the first Z-shaped surface structure can be formed by the top wall of the first step 211, the side wall of the first cavity 21 and the top wall of the base 20, and the second Z-shaped surface structure can be formed by the bottom wall of the second step 11, the side wall of the second step 11 and the bottom wall of the upper cover 10 located outside the second step 11. The first Z-shaped surface structure is the bottom edge of the sealing gap 80, and the second Z-shaped surface structure is the top edge of the sealing gap 80, so that the sealing gap 80 is a double Z-shaped surface structure gap. Compared with the matching method of keeping the first step 211 and the second step 11 in contact in the prior art, the use of the double Z-shaped surface structure gap can increase the matching area between the upper cover 10 and the base 20, which helps to fill more second sealing layers, such as those composed of airtight glue, and improve the sealing effect between the upper cover 10 and the base 20.

[0062] In one embodiment, further reference is made to Figure 8 and Figure 9 The first step 211 is provided along the circumference of the first cavity 21, and the second step 11 is provided along the circumference adjacent to the edge of the upper cover 10. When the upper cover 10 is connected to the base 20, the second step 11 is located above the first step 211, so as to form a sealing gap 80 on the outside and bottom of the second step 11. Specifically, the first step 211 is provided along the circumference of the first cavity 21, and the second step 11 is provided along the circumference adjacent to the edge of the upper cover 10, so that the second step 11 is located above the first step 211. When the upper cover 10 is connected to the base 20, it helps to form a sealing gap 80 that is approximately a circle along the upper cover 10 and the base 20. At the same time, by providing the second sealing layer along the first step 211, the second sealing layer forms a sealing structure located within the sealing gap 80, which can achieve sealing of the connection between the upper cover 10 and the base 20, thereby ensuring the airtightness of the connection between the upper cover 10 and the base 20.

[0063] In one embodiment, referring to Figures 4 to 9The upper cover 10 has a first guide channel 12, and the base 20 has a second guide channel 23. The first guide channel 12 and the second guide channel 23 constitute a channel for allowing the optical fiber assembly 70 to extend from the first cavity 21 to the outside of the upper cover 10 and the base 20. The third sealing layer is filled in the first guide channel 12 and the second guide channel 23. The first guide channel 12 and the upper cover 10 can be an integral structural component, and the second guide channel 23 and the base 20 can also be an integral structural component. When the upper cover 10 and the base 20 are connected, the first guide channel 12 and the second guide channel 23 correspond to each other to form a channel for the optical fiber assembly 70 to extend from the first cavity 21 to the outside of the upper cover 10 and the base 20. The third sealing layer can be filled in the channel to make the channel airtight and prevent high-humidity air from entering the interior of the optical module through the channel.

[0064] It should be noted that when connecting the upper cover 10 to the base 20, airtight glue can be applied along a circle on the top of the base 20 and the top wall of the second guide channel 23, so that the optical module can be airtight at the connection between the upper cover 10 and the base 20 and the first guide channel 12 and the second guide channel 23, thereby further improving the sealing effect of the optical module.

[0065] In one embodiment, referring to Figures 9 to 12 The heat-conducting base 50 is provided with a heat-conducting branch 51, and a first heat-conducting channel 52 is formed between the end of the heat-conducting branch 51 and the side wall of the first cavity 21. The first heat-conducting channel 52 is filled with a first heat conductor to conduct the temperature of the heat-conducting branch 51 to the base 20. For details, please refer to Figure 10 The heat-conducting base 50 is arranged on or near the symmetry axis of the circuit board 30, and the heat-conducting branches 51 can be symmetrically arranged on both sides of the heat-conducting base 50. The heat-conducting branches 51 and the heat-conducting base 50 can be an integrated structural component. After the circuit board 30 with the heat-conducting base 50 installed is placed in the first cavity 21, there is usually no direct contact between the end of the heat-conducting branch 51 and the inner wall of the first cavity 21, but there is a gap. The present application can use this gap as a first heat-conducting channel 52, and set a first heat conductor in the first heat-conducting channel 52, so that the heat-conducting branch 51 can be connected to the base 20 through the inner wall of the first cavity 21, which helps to conduct the temperature of the heat-conducting base 50 integrated with the chip to the base 20, and use the base 20 to achieve heat dissipation inside the optical module in a sealed state, thereby improving the heat dissipation effect of the optical module in a sealed setting state.

[0066] It should be noted that the first heat conductor can be a heat-conducting material such as heat-conducting silver paste. By filling the first heat conductor, a gap between the heat-conducting branch 51 and the inner wall of the first cavity 21 can be avoided, ensuring that the heat-conducting branch 51 is in close contact with the base 20, so that the heat-conducting branch 51 and the base 20 can achieve better heat conduction.

[0067] In one embodiment, referring to Figure 9 The upper cover 10 is provided with a heat-conducting portion 13, and a second heat-conducting channel is formed between the heat-conducting portion 13 and the heat-conducting branch 51. The second heat-conducting channel is filled with a second heat-conducting body to conduct the temperature of the heat-conducting branch 51 to the upper cover 10. The heat-conducting portion 13 is a protrusion relative to the bottom wall of the upper cover 10. When the upper cover 10 is connected to the base 20, there is usually no direct contact between the heat-conducting portion 13 and the heat-conducting branch 51, but there is a gap. The present application can use this gap as a second heat-conducting channel, and set a second heat-conducting body in the second heat-conducting channel, so that the heat-conducting branch 51 can be connected to the upper cover 10 through the heat-conducting portion 13, which helps to conduct the temperature of the heat-conducting substrate 50 integrated with the chip to the base 20, and achieve heat dissipation inside the optical module in a sealed state with the help of the base 20, thereby improving the heat dissipation effect of the optical module in a sealed setting state.

[0068] It should be noted that the second heat conductor and the first heat conductor can be made of the same material. The second heat conductor can be a heat-conducting material such as heat-conducting silver paste. By filling the second heat conductor, a gap between the heat-conducting branch 51 and the heat-conducting part 13 can be avoided, ensuring that the heat-conducting branch 51 is in close contact with the upper cover 10, so that the heat-conducting branch 51 and the upper cover 10 can achieve better heat conduction.

[0069] In one embodiment, further reference is made to Figure 9 and Figure 10 The heat-conducting branch 51 has a first heat-conducting area 511, and the heat-conducting portion 13 is provided with a second heat-conducting area 131. A second heat-conducting channel is formed between the first heat-conducting area 511 and the second heat-conducting area 131, and the second heat conductor is located between the first heat-conducting area 511 and the second heat-conducting area 131. Specifically, when the upper cover 10 is installed on the base 20, the second heat conductor can be set on the first heat-conducting area 511 of the heat-conducting branch 51, so that the second heat-conducting area 131 of the heat-conducting portion 13 can be connected to the first heat-conducting area 511 of the heat-conducting branch 51 through the second heat conductor, thereby achieving conduction between the heat-conducting branch 51 and the heat-conducting portion 13, which helps to transfer the temperature of the heat-conducting base 50 integrated with the chip to the upper cover 10. With the help of the upper cover 10, heat is dissipated inside the optical module in a sealed state, thereby improving the heat dissipation effect of the optical module in a sealed setting state.

[0070] By means of the above-mentioned structures such as the first heat conducting channel 52 and the second heat conducting channel, a first heat conductor is provided in the first heat conducting channel 52 to achieve conduction between the heat conducting base 50 and the base 20, and a second heat conductor is provided in the second heat conducting channel to achieve conduction between the heat conducting base 50 and the upper cover 10. The heat generated by the chip assembly 60 with high chip density and high power consumption is guided to the base 20 under the action of the heat conducting base 50 and the first heat conducting channel 52, and is guided to the upper cover 10 under the action of the heat conducting base 50 and the second heat conducting channel. The heat generated by the chip assembly 60 can be quickly conducted to the base 20 and the upper cover 10, and the heat is dissipated to the environment by the outer shell of the optical module, so that the optical module with a sealed internal setting can be cooled, thereby preventing the degradation of performance parameters such as optical eye diagram and sensitivity caused by excessive temperature, and improving the working stability of the optical module.

[0071] In one embodiment, referring to Figure 8 、 Figure 10 and Figure 11 The circuit board 30 is located inside the first step 211. The inner wall of the first step 211 is provided with a female anti-fouling portion, and the circuit board 30 is provided with a sub-fouling portion corresponding to the female anti-fouling portion. Specifically, the female anti-fouling portion may include a first female anti-fouling block 212 and a second female anti-fouling block 213, and the sub-fouling portion may include a first sub-fouling groove 31 and a second sub-fouling groove 32. The first female anti-fouling block 212 corresponds to the first sub-fouling groove 31, and the second female anti-fouling block 213 corresponds to the second sub-fouling groove 32. When the circuit board 30 is placed into the first cavity 21, the cooperation between the first female anti-fouling block 212 and the first sub-fouling groove 31 and the second female anti-fouling block 213 and the second sub-fouling groove 32 enables the circuit board 30 to be accurately and stably placed into the first cavity 21, facilitating the assembly of the optical module.

[0072] In one embodiment, referring to Figures 8 to 11 The thickness of the circuit board 30 is smaller than the height of the first step 211. The second step 11 is provided with a plurality of pressing portions 111 for pressing the circuit board 30 when the upper cover 10 is connected to the base 20. Specifically, there are three pressing portions 111, each provided along the first step 211. Since the thickness of the circuit board 30 is smaller than the height of the first step 211, when the upper cover 10 is mounted on the base 20, there is no contact between the upper cover 10 and the circuit board 30. However, the provision of the pressing portions 111 allows the circuit board 30 to be pressed downward when the upper cover 10 is mounted on the base 20, thereby improving the bonding between the circuit board 30 and the first sealing layer and enhancing the airtightness between the circuit board 30 and the inner wall of the first cavity 21.

[0073] In one embodiment, referring to Figure 4 、 Figure 7 and Figure 9The upper cover 10 is provided with an escape groove 14, which corresponds to the optical fiber assembly 70 to prevent the upper cover 10 from squeezing the optical fiber assembly 70. The escape groove 14 is a structure that is recessed inward relative to the bottom wall of the upper cover 10. Its shape corresponds to the shape of the optical fiber assembly 70 inside the optical module. When the upper cover 10 is installed on the base 20, the escape groove 14 can prevent the upper cover 10 from squeezing the optical fiber assembly 70, thereby preventing the operation of the optical fiber assembly 70 from being affected.

[0074] In one embodiment, referring to Figures 8 to 10 A plurality of positioning holes 15 are provided at the bottom of the upper cover 10, and a positioning column 24 corresponding to the positioning holes 15 is provided on the base 20. The positioning holes 15 and the positioning columns 24 can guide the assembly between the upper cover 10 and the base 20, thereby improving the accuracy of the optical module assembly and improving the assembly efficiency of the optical module.

[0075] In this embodiment, further reference is made to Figure 12 A plurality of mounting posts 25 are provided at the bottom of the base 20. The mounting posts 25 can be matched with corresponding holes on the mounting mainboard to achieve correct assembly of the optical module and the mounting mainboard, thereby improving the convenience of using the optical module.

[0076] Accordingly, the present application also provides a method for manufacturing the optical module of the above embodiment, comprising:

[0077] Provide a circuit board 30; please refer to Figure 10 , fix the heat-conducting base 50 on the circuit board 30 through the heat-conducting paste; please refer to Figure 11 , mount the chip assembly 60 on the heat-conducting substrate 50; please continue to refer to Figure 11 , coupling the optical fiber assembly 70 to the chip assembly 60; referring to Figure 8 , providing a base 20, the base 20 is provided with a first cavity 21 and a second cavity 22 provided along the thickness direction, the first cavity 21 is connected to the second cavity 22; please refer to Figure 8 and Figure 10 , apply the second sealant on the inner wall of the first cavity 21, and place the circuit board 30 into the first cavity 21; please refer to Figure 10 , continue to apply the second sealant to the gap between the circuit board 30 and the side of the first cavity 21; please continue to refer to Figure 8 , apply the first sealant on the first step 211; please refer to Figure 4 , connect the upper cover 10 to the base 20, and squeeze the first sealant on the first step 211 with the second step 11; please continue to refer to Figure 4 , place the connector 40 into the second cavity 22 and electrically connect it to the circuit board 30; please refer to Figure 4 or Figure 5The first guide channel 12 and the second guide channel 23 are filled with a third sealant, and the first, second, and third sealants are heat-cured. The first, second, and third sealants can all be made of the same material, such as airtight glue.

[0078] By the above method, the second sealant is applied to the inner wall of the first cavity 21 to seal the placement position of the circuit board 30 and the base 20, preventing the base 20 from passing through the second cavity 22 and the gap between the circuit board 30 and the first cavity 21, thereby affecting the airtightness between the circuit board 30 and the base 20. After the circuit board 30 is placed in the first cavity 21, the second sealant is continued to be applied along the gap between the circuit board 30 and the side of the first cavity 21 to further improve the airtightness between the circuit board 30 and the base 20. By applying the first sealant on the first step 211, A seal is formed between the first step 211 and the second step 11 to avoid air leakage at the connection between the upper cover 10 and the base 20, and a third sealant is filled between the first guide channel 12 and the second guide channel 23 to seal the optical port of the optical module, thereby achieving the effect of sealing and isolating the interior of the optical module from the external environment, preventing high-humidity air from the external environment from entering the interior of the optical module and affecting the normal operation of internal components such as the chip assembly 60 and the circuit board 30, thereby extending the service life of the optical module in special environments such as high humidity, and achieving the purpose of improving the application range of the optical module.

[0079] In one embodiment, the method for manufacturing the optical module further includes:

[0080] Please refer to Figure 10 , fill the first heat conduction channel 52 formed between the end of the heat conduction branch 51 and the side wall of the first cavity 21 with heat conduction paste; please continue to refer to Figure 10 , apply thermal paste on the first thermal conductive area 511 on the thermal conductive branch 51; please refer to Figure 6 and Figure 7 The upper cover 10 is connected to the base 20, and the second heat-conducting region 131 of the heat-conducting portion 13 is connected to the heat-conducting branch 51 through a heat-conducting paste. The heat-conducting paste can be a heat-conducting material such as heat-conducting silver paste.

[0081] Through the above method, thermal paste can be filled in the first thermal conductive channel 52 and the second thermal conductive channel, and the thermal conductive base 50 can be connected to the base 20 and the upper cover 10 respectively. The heat generated by the chip assembly 60 with high chip density and high power consumption can be guided to the base 20 under the action of the thermal conductive base 50 and the first thermal conductive channel 52, and guided to the upper cover 10 under the action of the thermal conductive base 50 and the second thermal conductive channel. The heat generated by the chip assembly 60 can be quickly conducted to the base 20 and the upper cover 10, and the heat is dissipated into the environment by using the outer shell of the optical module, so that the optical module with an internal sealing setting can be cooled, and the degradation of performance parameters such as optical eye diagram and sensitivity caused by excessive temperature can be prevented, thereby improving the working stability of the optical module.

[0082] The optical module and the manufacturing method of the optical module provided by the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of the present application. At the same time, for those skilled in the art, according to the ideas of the present application, there may be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. An optical module, characterized in that: include: A base (20), wherein the base (20) is provided with a first cavity (21) and a second cavity (22) which are arranged through the base along a thickness direction, and the first cavity (21) is communicated with the second cavity (22); An upper cover (10) matched with the base (20), a sealing gap (80) being defined between the upper cover (10) and the base (20), and a first sealing layer being filled in the sealing gap (80); A circuit board (30) is accommodated in the first cavity (21), and a second sealing layer is provided between the circuit board (30) and the inner wall of the first cavity (21); A connector (40) and a chip assembly (60) are respectively located on opposite sides of the circuit board (30), the connector (40) is accommodated in the second cavity (22), and a heat-conducting base (50) is provided between the chip assembly (60) and the circuit board (30); An optical fiber assembly (70) is coupled to the chip assembly (60), and the optical fiber assembly (70) passes through the upper cover (10) and the base (20) to extend from the first cavity (21) to the outside of the upper cover (10) and the base (20), and the upper cover (10) and the base (20) are filled with a third sealing layer at a position through which the optical fiber assembly (70) passes.

2. The optical module according to claim 1, wherein A first step (211) is provided on the inner wall of the first cavity (21) facing the upper cover (10), and the upper cover (10) is provided with a second step (11) that matches the first step (211). When the upper cover (10) is connected to the base (20), a sealing gap (80) is formed between the first step (211) and the second step (11).

3. The optical module according to claim 1, wherein: The first step (211) is arranged along the circumference of the first cavity (21), and the second step (11) is arranged along the circumference adjacent to the edge of the upper cover (10). When the upper cover (10) is connected to the base (20), the second step (11) is located above the first step (211) to form a sealing gap (80) between the outer side and the bottom of the second step (11).

4. The optical module according to claim 1, wherein: The upper cover (10) has a first guide channel (12), and the base (20) has a second guide channel (23). The first guide channel (12) and the second guide channel (23) constitute a channel for extending the optical fiber assembly (70) from the first cavity (21) to the outside of the upper cover (10) and the base (20). The third sealing layer is filled in the first guide channel (12) and the second guide channel (23).

5. The optical module according to claim 3, wherein: A heat-conducting branch (51) is provided on the heat-conducting base (50), and a first heat-conducting channel (52) is formed between the end of the heat-conducting branch (51) and the side wall of the first cavity (21). The first heat-conducting channel (52) is filled with a first heat conductor to conduct the temperature of the heat-conducting branch (51) to the base (20).

6. The optical module according to claim 5, characterized in that The upper cover (10) is provided with a heat conducting portion (13), a second heat conducting channel is formed between the heat conducting portion (13) and the heat conducting branch (51), and the second heat conducting channel is filled with a second heat conductor to conduct the temperature of the heat conducting branch (51) to the upper cover (10).

7. The optical module according to claim 6, wherein: The heat-conducting branch (51) has a first heat-conducting region (511), the heat-conducting portion (13) is provided with a second heat-conducting region (131), a second heat-conducting channel is formed between the first heat-conducting region (511) and the second heat-conducting region (131), and the second heat conductor is located between the first heat-conducting region (511) and the second heat-conducting region (131).

8. The optical module according to claim 1, wherein: The circuit board (30) is located inside the first step (211), the inner wall of the first step (211) is provided with a female anti-fouling portion, and the circuit board (30) is provided with a sub-anti-fouling portion corresponding to the female anti-fouling portion; and / or, The thickness of the circuit board (30) is smaller than the height of the first step (211), and a plurality of pressing portions (111) are provided on the second step (11) for pressing the circuit board (30) when the upper cover (10) is connected to the base (20).

9. The optical module according to claim 1, wherein: The upper cover (10) is provided with an avoidance groove (14), and the avoidance groove (14) corresponds to the optical fiber assembly (70) to prevent the upper cover (10) from squeezing the optical fiber assembly (70).

10. A method for manufacturing an optical module according to any one of claims 1 to 9, characterized in that: include: Providing a circuit board (30); Fixing the heat-conducting base (50) on the circuit board (30) via heat-conducting paste; Mounting the chip assembly (60) on the heat-conducting substrate (50); coupling and connecting the optical fiber assembly (70) and the chip assembly (60); A base (20) is provided, wherein the base (20) is provided with a first cavity (21) and a second cavity (22) which are arranged through the base along a thickness direction, and the first cavity (21) is communicated with the second cavity (22); Applying a second sealant on the inner wall of the first cavity (21), and placing the circuit board (30) into the first cavity (21); Continue applying the second sealant to the gap between the circuit board (30) and the peripheral side of the first cavity (21); Applying a first sealant on the first step (211); The upper cover (10) is connected to the base (20), and the second step (11) squeezes the first sealant on the first step (211); placing the connector (40) into the second cavity (22) and electrically connecting it to the circuit board (30); Filling a third sealant between the first guide channel (12) and the second guide channel (23); The first sealant, the second sealant and the third sealant are subjected to heat curing treatment.

11. The method for manufacturing an optical module according to claim 10, wherein: The method further comprises: Filling a first heat-conducting channel (52) formed between the end of the heat-conducting branch (51) and the side wall of the first cavity (21) with heat-conducting slurry; Applying heat-conducting slurry to the first heat-conducting area (511) on the heat-conducting branch (51); The upper cover (10) is connected to the base (20), and the second heat-conducting region (131) of the heat-conducting portion (13) is connected to the heat-conducting branch (51) via heat-conducting paste.

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