Optical module and forming method thereof, and optical module assembly and forming method thereof

Abstract

The invention provides an optical module and a forming method thereof, and an optical module assembly and a forming method thereof. The optical module comprises a circuit board, a chip assembly and an electric connector, the chip assembly is coupled with the circuit board; the electric connector is coupled with the circuit board, the electric connector is provided with a first surface, the first surface is provided with a connecting part, the connecting part is coupled with the chip assembly through the circuit board, the connecting part comprises a plurality of groups of differential signal pins and a plurality of power supply pins, and the distance from the differential signal pins to the power supply pins is greater than a first distance threshold value. Based on the technical scheme, an electromagnetic field generated by the power supply pin can be prevented from interfering transmission of differential signals, electromagnetic interference and signal crosstalk are avoided, the transmission quality of the differential signals is improved, and the working stability of the optical module is further improved.

Description

Technical Field

[0001] The present application relates to the field of optoelectronic communication technology, and in particular to an optical module and a forming method thereof, an optical module assembly and a forming method thereof. Background Art

[0002] Optical modules are common devices in the field of optoelectronic communications. Optical modules include a chip assembly and an electrical connector. The chip assembly and the electrical connector are coupled. The electrical connector has a signal transmission pin. The electrical connector receives an electrical signal from a first target device through the signal transmission pin. The chip assembly converts the electrical signal into an optical signal and transmits it to a second target device. Alternatively, the chip assembly receives an optical signal from a second target device and converts it into an electrical signal, which is then transmitted to the first target device through the signal transmission pin of the electrical connector. The optical module can be used to implement information exchange between the first target device and the second target device. The electrical connector also has a power pin for connecting to an external power supply for power supply. In the prior art, pins with different functions can affect each other. When the signal transmission pin and the power pin are set too close to each other, the power pin will generate electromagnetic interference and signal crosstalk, interfering with the normal operation of the signal transmission pin and affecting the transmission quality of the electrical signal. Summary of the Invention

[0003] The present application proposes an optical module and a method for forming the same, an optical module assembly and a method for forming the same, in order to solve the technical problems of electromagnetic interference and signal crosstalk when an optical module transmits signals in the prior art.

[0004] In a first aspect, an embodiment of the present application provides an optical module, comprising:

[0005] circuit boards;

[0006] a chip assembly coupled to the circuit board;

[0007] An electrical connector is coupled to the circuit board, the electrical connector having a first surface, the first surface having a connecting portion, the connecting portion being coupled to the chip assembly through the circuit board, the connecting portion including multiple groups of differential signal pins and multiple power pins, and the distance from the differential signal pins to the power pins being greater than a first distance threshold.

[0008] In some embodiments, the optical module further includes: a housing having a receiving cavity therein, and the circuit board and the chip assembly are located in the receiving cavity.

[0009] In some embodiments, each group of differential signal pins in the plurality of groups of differential signal pins includes a positive phase pin and a negative phase pin of the same channel; and a distance between the positive phase pin and the negative phase pin of the same channel is less than a second distance threshold.

[0010] In some embodiments, the first distance threshold is 1.0 mm.

[0011] In some embodiments, the connecting portion further comprises: a plurality of ground pins, the connecting portion being arranged in an array along a first direction and a second direction, the first direction and the second direction being parallel to the first surface, and the first direction and the second direction being different;

[0012] Each group of differential signal pins in the plurality of groups of differential signal pins is adjacent to the ground pin on at least one side in the first direction and at least one side in the second direction.

[0013] In some embodiments, the first surface includes a first region and a second region, and a distance between the first region and the second region is greater than a third distance threshold;

[0014] The multiple groups of differential signal pins include multiple groups of first function pins and multiple groups of second function pins. The multiple groups of first function pins are located in the first area, and the multiple groups of second function pins are located in the second area.

[0015] In some embodiments, the signal transmitted through the first function pin has a first power, the signal transmitted through the second function pin has a second power, and the first power is different from the second power.

[0016] In some embodiments, the circuit board comprises:

[0017] A substrate comprising a first functional surface and a second functional surface;

[0018] a first port structure located on the first functional surface, a second port structure located on the second functional surface, and a wiring structure located within the substrate, wherein the wiring structure is electrically connected between the first port structure and the second port structure, the first port structure is coupled to the chip assembly, and the second port structure corresponds to the connecting portion;

[0019] The second port structure includes a first port and a second port, the first port is coupled to the first function pin, and the second port is coupled to the second function pin;

[0020] The wiring structure includes a plurality of wirings, each wiring is coupled between at least one first port and at least one second port, and a minimum distance between the wirings is greater than a fourth distance threshold.

[0021] In some embodiments, the chip assembly includes multiple sets of optical chip assemblies and multiple sets of electrical chip assemblies.

[0022] In some embodiments, the number of the optical chip assemblies in each group of the chip assemblies ranges from two to three groups; and the number of the electrical chip assemblies in each group of the chip assemblies ranges from two to three groups.

[0023] In some embodiments, each group of the optical chip assembly includes at least one optical receiving chip and at least one optical transmitting chip.

[0024] In some embodiments, each set of the electrical chip components includes at least one driver chip and at least one limiting amplifier.

[0025] In some embodiments, the optical module further includes: a plurality of heat sinks, wherein the plurality of heat sinks are located between the chip assembly and the circuit board.

[0026] In some embodiments, the heat sink is made of aluminum nitride.

[0027] In some embodiments, the optical module further includes: an optical fiber array coupled to the chip assembly.

[0028] In some embodiments, the shell includes a matching top cover and a base, and the accommodating cavity is located between the top cover and the base; the base has an accommodating groove running through the base, and the electrical connector is located in the accommodating groove.

[0029] In a second aspect, an embodiment of the present application provides an optical module assembly, comprising:

[0030] The optical module according to any one of the above embodiments;

[0031] An optical connector is coupled to the optical module.

[0032] In some embodiments, the optical connector has a second surface, a third surface, and a fourth surface, the second surface is parallel to the third surface, the second surface is connected to the fourth surface, and the fourth surface is connected to the third surface;

[0033] The fourth surface has a light emitting port and a light receiving port, the light emitting port is located on a side close to the second surface, and the light receiving port is located on a side close to the third surface;

[0034] An included angle formed by the second surface and the fourth surface ranges from 81 degrees to 83 degrees.

[0035] In some embodiments, the optical module assembly further includes: a protective pipe; the optical module includes an optical fiber array, the optical module is coupled to the optical connector through the optical fiber array, and the protective pipe is sleeved on the outside of the optical fiber array.

[0036] In a third aspect, an embodiment of the present application provides a method for forming an optical module as described in any of the above embodiments, comprising:

[0037] forming a circuit board;

[0038] Fixing a chip assembly on the surface of the circuit board, wherein the chip assembly is coupled to the circuit board;

[0039] The connecting portion of the electrical connector is coupled to the circuit board.

[0040] In a fourth aspect, an embodiment of the present application provides a method for forming an optical module assembly, comprising:

[0041] forming an optical module as described in any one of the above embodiments;

[0042] An optical connector is coupled to the optical module.

[0043] The present application can achieve the following beneficial effects: Based on the optical module provided in the embodiment of the present application, by setting the distance from the differential signal pin to the power pin to be greater than the first distance threshold, the electromagnetic field generated by the power pin can be prevented from interfering with the transmission of the differential signal, thereby avoiding electromagnetic interference and signal crosstalk, improving the transmission quality of the differential signal, and thereby improving the working stability of the optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0045] Figure 1 An exploded schematic diagram of an optical module provided in an embodiment of the present application;

[0046] Figure 2 A schematic diagram of the structure of an optical module provided in an embodiment of the present application;

[0047] Figure 3 A schematic structural diagram of a connector and a base in a separated state provided in an embodiment of the present application;

[0048] Figure 4 A schematic structural diagram of an electrical connector provided in an embodiment of the present application;

[0049] Figure 5 A schematic structural diagram of an electrical connector provided in an embodiment of the present application;

[0050] Figure 6A schematic structural diagram of a circuit board provided in an embodiment of the present application;

[0051] Figure 7 A schematic diagram of a partial structure of an optical module provided in an embodiment of the present application;

[0052] Figure 8 A schematic diagram of the structure of an optical module provided in an embodiment of the present application;

[0053] Figure 9 A front view of an optical module assembly provided in an embodiment of the present application;

[0054] Figure 10 A schematic structural diagram of an optical connector provided in an embodiment of the present application;

[0055] Figure 11 A schematic structural diagram of an optical connector provided in an embodiment of the present application;

[0056] Figure 12 A side view of an optical module assembly provided by an embodiment of the present application;

[0057] Figure 13 A rear view of an optical module assembly provided in an embodiment of the present application;

[0058] Figure 14 A schematic diagram of a connection method for an optical module assembly provided in an embodiment of the present application;

[0059] Figure 15 A schematic flow chart of a method for forming an optical module provided in an embodiment of the present application;

[0060] Figure 16 A schematic flow chart of a method for forming an optical module assembly provided in an embodiment of the present application.

[0061] Reference numerals:

[0062] 100 - optical module; 1 - housing; 11 - receiving cavity; 12 - top cover; 13 - base; 131 - receiving groove; 2 - circuit board; 21 - substrate; 211 - first functional surface; 212 - second functional surface; 22 - first port structure; 23 - second port structure; 231 - first port; 232 - second port; 24 - wiring structure; 241 - wiring; 3 - chip assembly; 31 - optical chip assembly; 32 - electrical chip assembly; 4 - heat sink; 5 - electrical connection Device; 51-first surface; 52-connecting portion; 53-first area; 54-second area; 55-first function pin; 56-second function pin; 6-fiber array; GND-ground pin; VCC-power pin; CML-differential signal pin; 200-optical connector; 7-second surface; 71-glue dispensing window; 8-third surface; 9-fourth surface; 91-optical transmitting port; 92-optical receiving port; 300-protective pipe; 400-optical module assembly;

[0063] X-first direction; Y-second direction; Z-thickness direction of the optical module. DETAILED DESCRIPTION

[0064] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making any creative work are within the scope of protection of this application.

[0065] In the description of this application, it should be noted that, unless otherwise specified or limited, the term "and / or" herein is merely a description of an association relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, and B exists alone. Furthermore, the character " / " herein, unless otherwise specified, generally indicates that the associated objects are in an "or" relationship.

[0066] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0067] Optical modules are common devices in the field of optoelectronic communications. They include a chip assembly and an electrical connector. The chip assembly and the electrical connector are coupled together. The electrical connector has signal transmission pins. The electrical connector receives electrical signals from a first target device through the signal transmission pins. The chip assembly converts the electrical signals into optical signals and transmits them to a second target device. Alternatively, the chip assembly receives optical signals from a second target device, converts them into electrical signals, and transmits the electrical signals to the first target device through the signal transmission pins of the electrical connector. Optical modules can be used to enable information exchange between the first and second target devices. The electrical connector also has power pins for connecting to an external power source.

[0068] Pins with different functions can affect each other. The current flowing through power pins is often large, especially in scenarios like switching power supplies, where current changes frequently and rapidly. In the prior art, if the power pins and signal transmission pins are set too close together, the electromagnetic field generated by the power pins can interfere with the signals transmitted by adjacent signal transmission pins. For example, in digital circuits, this can compromise signal integrity, causing signal distortion and glitches, making it difficult to accurately determine the logic level of the digital signal and affecting the normal logic function of the circuit. For analog signals, this can alter signal characteristics such as amplitude and frequency, increase signal noise, and reduce signal quality, thereby affecting the accuracy and reliability of subsequent signal processing, amplification, and filtering. Furthermore, if the power pins and signal transmission pins are set too close together, or in high-speed signal transmission scenarios, the spacing between the power pins and signal pins is too close, crosstalk can occur. Crosstalk can cause signals to couple with each other, resulting in additional, undesirable signal components along the signal transmission path. This can cause data errors and affect data accuracy and reliability.

[0069] To sum up, if the distance between the power pin and the signal transmission pin is too close, electromagnetic interference and signal crosstalk will be generated, which will interfere with the normal operation of the signal transmission pin and affect the transmission quality of the electrical signal.

[0070] In response to the technical problem in the prior art that electrical connectors are prone to generating electromagnetic interference and signal crosstalk, the embodiments of the present application propose an optical module and a method for forming the same, an optical module assembly and a method for forming the same, to overcome the above problems.

[0071] An optical module and a method for forming the same, an optical module assembly and a method for forming the same provided by the present application are introduced below with reference to the accompanying drawings.

[0072] See Figure 1 As shown, the embodiment of the present application provides an optical module 100, including:

[0073] Circuit board 2;

[0074] A chip assembly 3 is coupled to the circuit board 2;

[0075] Electrical connector 5 is coupled to circuit board 2 and has a first surface 51 with a connecting portion 52. Connecting portion 52 is coupled to chip assembly 3 via circuit board 2. Connecting portion 52 includes multiple groups of differential signal pins CML (not shown) and multiple power pins VCC (not shown). The distance between the differential signal pins CML and the power pin VCC is greater than a first distance threshold. The differential signal pins CML are used to transmit differential signals.

[0076] Specifically, the surface of the electrical connector 5 close to the circuit board 2 is the first surface 51 .

[0077] Based on the above embodiment, setting the distance from the differential signal pin CML to the power pin VCC to be greater than the first distance threshold can prevent the electromagnetic field generated by the power pin VCC from interfering with the transmission of the differential signal, avoid electromagnetic interference and signal crosstalk, improve the transmission quality of the differential signal, and further improve the working stability of the optical module 100.

[0078] In some embodiments, see Figure 1 As shown, the optical module 100 further includes: a housing 1 , wherein the housing 1 has a receiving cavity 11 , and the circuit board 2 and the chip assembly 3 are located in the receiving cavity 11 .

[0079] In some embodiments, see Figure 1 、 Figure 2 and Figure 3 As shown, the housing 1 includes a matching top cover 12 and a base 13 , and the accommodating cavity 11 is located between the top cover 12 and the base 13 ; the base 13 has an accommodating groove 131 passing through the base 13 , and the electrical connector 5 is located in the accommodating groove 131 .

[0080] In some embodiments, see Figure 4 As shown, the distance from the differential signal pin CML to the power pin VCC is greater than the first distance threshold.

[0081] In some embodiments, the first distance threshold is 1.0 mm.

[0082] In some embodiments, see Figure 4 and Figure 5 As shown, the differential signal pins CML can be divided into positive phase and negative phase groups. Each group of differential signal pins CML in the multiple groups of differential signal pins CML includes a positive phase pin and a negative phase pin of the same channel. The distance between the positive phase pin and the negative phase pin of the same channel is less than a second distance threshold. Specifically, the second distance threshold is 0.3 mm.

[0083] Based on the above embodiment, the positive and negative phase pins of the same channel form a tight differential pair. During differential signal transmission, the positive signal transmitted by the positive pin and the negative signal transmitted by the negative pin have opposite current directions. Because the positive and negative phase pins of the same channel are close together, this tight differential pair cancels out the electromagnetic fields around the two pins, thereby reducing the radiation of external electromagnetic interference and thus reducing electromagnetic interference and crosstalk.

[0084] In some embodiments, the differential signal pins CML can be further divided into first function pins 55 and second function pins 56 according to their functions. Multiple groups of differential signal pins CML include multiple groups of first function pins 55 and multiple groups of second function pins 56. In the embodiment of the present application, the first function is output and the second function is input.

[0085] Specifically, Figure 4 The CML in the figure represents a group of differential signal pins, and each group of differential signal pins CML includes a positive-phase pin and a negative-phase pin of the same channel.

[0086] Figure 5 In the figure, the positive-phase pins are represented by DoutnumP and DinnumP, where "out" represents the first function and "in" represents the second function. "num" represents the channel number of the optical module. In the embodiment of the present application, the optical module 100 has 12 receiving channels and 12 transmitting channels. The receiving channels correspond to the first-function pins 55 and the transmitting channels correspond to the second-function pins 56. "num" is an integer between 1 and 12. "P" represents the positive phase. The negative-phase pins are represented by DoutnumN and DinnumN, where "out" represents the first function and "in" represents the second function. "num" represents the channel number of the optical module, and "N" represents the negative phase.

[0087] For example, see Figure 5As shown, Dout12P and Dout12N form a group of first functional pins 55 and also constitute a group of differential signal pins CML. Dout12P represents the non-inverting pin in the first functional pins 55 of the 12th channel (receiving channel), and Dout12N represents the inverting pin in the first functional pins 55 of the 12th channel (receiving channel). Din2P and Din2N form a group of second functional pins 56 and also constitute a group of differential signal pins CML. Din2P represents the non-inverting pin in the second functional pins 56 of the second channel (transmitting channel), and Din2N represents the inverting pin in the second functional pins 56 of the second channel (transmitting channel).

[0088] In some embodiments, see Figure 5 As shown, the power pin VCC specifically includes: VCCT and VCCR, wherein VCCT is used to connect the second function pin 56 to a 3.3V power supply, and VCCR is used to connect the first function pin 55 to a 3.3V power supply.

[0089] In some embodiments, see Figure 5 As shown, the connection part 52 also includes a floating pin DNC, a signal detection pin SD, a first I2C (I2C, Inter-Integrated Circuit, a synchronous serial bus) clock interface pin SDA, a second I2C clock interface pin SCL, a CDR Bypass (CDR refers to Clock Data Recovery, clock data recovery; Bypass refers to bypass) enable pin CDR_EN, and an I2C selection control pin Modsel.

[0090] Dangling pin DNC: It is an internal pin. External connection will affect the function of the optical module 100. It must be left floating and is prohibited from being connected.

[0091] Signal detection pin SD: has an output function. Outputting a high-level signal indicates that the optical power of all first function pins 55 is higher than the threshold; outputting a low-level signal indicates that the optical power of at least one first function pin 55 is lower than the threshold;

[0092] The first I2C clock interface pin SDA has input / output function. The optical module 100 has been pulled up to 10K, and can also be left floating.

[0093] The second I2C clock interface pin SCL has an input function. The optical module 100 has been pulled up to 10K, and can also be left floating.

[0094] CDR Bypass enable pin CDR_EN: has input function and is pulled up by the optical module 100. A high-level output signal indicates that the CDR is on and the optical module 100 operates at 25.78125 Gbps. A low-level output signal indicates that the CDR is off and the optical module 100 can be used at a reduced speed.

[0095] I2C selection control pin Modsel: has input function, the optical module 100 has been pulled up; outputting a high-level signal indicates that I2C communication is disabled; outputting a low-level signal indicates that I2C communication is enabled.

[0096] In some embodiments, see Figure 4 As shown, the connecting portion 52 further includes: a plurality of ground pins GND, and the connecting portion 52 is arranged in an array along a first direction X and a second direction Y. The first direction X and the second direction Y are parallel to the first surface 51, and the first direction X and the second direction Y are different. Each group of differential signal pins CML in the plurality of groups of differential signal pins CML is adjacent to the ground pin GND on at least one side in the first direction X and at least one side in the second direction Y. The first direction X is perpendicular to the second direction Y.

[0097] Based on the above embodiment, since the ground pin GND does not interfere with the differential signal pin CML, disposing the ground pin GND near the differential signal pin CML can effectively utilize the space of the connecting portion 52 .

[0098] In some embodiments, see Figure 4 、 Figure 5 As shown, the first surface 51 includes a first area 53 and a second area 54. The distance between the first area 53 and the second area 54 is greater than a third distance threshold. Multiple groups of first functional pins 55 are located in the first area 53, and multiple groups of second functional pins 56 are located in the second area 54. Specifically, the third distance threshold can be set to 0.3 mm.

[0099] In some embodiments, the signal transmitted through the first function pin 55 has a first power, and the signal transmitted through the second function pin 56 has a second power, and the first power is different from the second power.

[0100] Based on the above embodiments, crosstalk between signals of different transmission rates can be avoided, signal transmission quality can be improved, and the working stability of the optical module 100 can be improved.

[0101] In some embodiments, see Figure 6 As shown, the circuit board 2 includes:

[0102] The substrate 21 includes a first functional surface 211 and a second functional surface 212;

[0103] A first port structure 22 located on the first functional surface 211, a second port structure 23 located on the second functional surface 212, and a wiring structure 24 located within the substrate 21, wherein the wiring structure 24 is electrically connected between the first port structure 22 and the second port structure 23, the first port structure 22 is coupled to the chip assembly 3, and the second port structure 23 corresponds to the connecting portion 52;

[0104] The second port structure 23 includes a first port 231 and a second port 232 , wherein the first port 231 is coupled to the first function pin 55 , and the second port 232 is coupled to the second function pin 56 ;

[0105] The wiring structure 24 includes a plurality of wirings 241 . Each wiring 241 is coupled between at least one first port 231 and at least one second port 232 . The minimum distance between the wirings 241 is greater than a fourth distance threshold.

[0106] In some embodiments, the fourth distance threshold may be set to 0.3 mm.

[0107] Based on the above embodiment, setting the minimum distance between the wirings 241 to be greater than the fourth distance threshold can avoid crosstalk between the signal transmitted through the first function pin 55 and the signal transmitted through the second function pin 56 .

[0108] In some embodiments, see Figure 7 As shown, the chip assembly 3 includes multiple groups of optical chip assemblies 31 and multiple groups of electrical chip assemblies 32. The number of optical chip assemblies 31 in each chip assembly 3 ranges from two to three; the number of electrical chip assemblies 32 in each chip assembly 3 ranges from two to three. Each group of optical chip assemblies 31 includes at least one optical receiver chip and at least one optical transmitter chip. Each group of electrical chip assemblies 32 includes at least one driver chip and at least one limiting amplifier.

[0109] Specifically, three four-channel optical receiving chips and three four-channel limiting amplifiers are arranged at the first end of the circuit board 2; three four-channel optical transmitting chips and three four-channel driving chips are arranged at the second end of the circuit board 2.

[0110] The limiting amplifier and optical receiver chip form the receiver module of optical module 100, while the driver chip and optical transmitter chip form the transmitter module of optical module 100. The receiver module is coupled to the first function pin 55 via circuit board 2, while the transmitter module is coupled to the second function pin 56 via circuit board 2. VCCT in the power supply pin VCC is used to power the transmitter module via the second function pin 56, while VCCR in the power supply pin VCC is used to power the receiver module via the first function pin 55.

[0111] The optical receiving chip is used to receive optical signals from the optical fiber array 6, convert the optical signals into electrical signals, amplify them through a limiting amplifier, and output electrical signals of the corresponding bit rate to the electrical connector 5. The driver chip receives the electrical signals from the electrical connector 5 and drives the optical transmitting chip to emit optical signals of the corresponding bit rate. After the optical signals are coupled into the optical fiber array 6, they are transmitted to external optical fibers and then transmitted to other optical modules (or other devices) through the external optical fibers.

[0112] Optical module 100 has a total of 24 channels. Twelve of these channels form receive channels, which receive optical signals from the outside and transmit them to electrical connector 5 after optical-to-electrical conversion. The other 12 channels form transmit channels, which receive electrical signals from connector 5 and transmit them to the outside after electrical-to-optical conversion. Each channel has a data transmission capacity of 12G, resulting in a total data transmission capacity of 12 × 25G = 300Gbps.

[0113] Based on the above embodiment, a chip assembly 3 with 24 channels can be integrated and designed in a very small space, which greatly reduces the volume of the optical module 100.

[0114] In some embodiments, see Figure 1 and Figure 7 As shown, the optical module 100 further includes: a plurality of heat sinks 4, which are located between the chip assembly 3 and the circuit board 2. The heat sinks 4 are also connected to the housing 1. The heat sinks 4 are used to conduct heat generated by the chip assembly 3 to the housing 1, and the housing 1 then conducts the heat to the air, thereby facilitating heat dissipation of the optical module 100.

[0115] In some embodiments, the heat sink 4 is made of at least one of aluminum nitride and beryllium oxide. Aluminum nitride has a thermal conductivity of 170 W / (m·K) to 230 W / (m·K), while beryllium oxide has a thermal conductivity of 220 W / (m·K) to 250 W / (m·K). Beryllium oxide has better thermal conductivity than aluminum nitride, but aluminum nitride is less expensive than beryllium oxide. Therefore, an aluminum nitride heat sink 4 is more suitable for use in the optical module 100.

[0116] In some embodiments, see Figure 1 and Figure 8 As shown, the optical module 100 further includes an optical fiber array 6 coupled to the chip assembly 3. A portion of the optical fiber array 6 is located in the accommodating cavity 11 and coupled to the optical chip assembly 31, while another portion of the optical fiber array 6 passes through the housing 1 and is coupled to the optical connector 200 (not shown).

[0117] The present application also provides an optical module assembly 400, see Figure 9 As shown, Figure 94 shows a front view of the optical module assembly 400, which includes:

[0118] The optical module 100 according to any of the above embodiments;

[0119] The optical connector 200 is coupled to the optical module 100 .

[0120] In some embodiments, see Figure 10 and Figure 11 As shown, optical connector 200 has a second surface 7, a third surface 8, and a fourth surface 9. Second surface 7 is parallel to third surface 8 and connected to fourth surface 9, which in turn is connected to third surface 8. Fourth surface 9 has a light emitting port 91 and a light receiving port 92. Light emitting port 91 is located on the side closest to second surface 7, and light receiving port 92 is located on the side closest to third surface 8. The angle formed by second surface 7 and fourth surface 9 ranges from 81 to 83 degrees. A glue dispensing window 71 is provided on second surface 7 for securing the position of optical fiber array 6 within optical connector 200. Light emitting port 91 is coupled to optical module 100 via optical fiber array 6, and light receiving port 92 is coupled to optical module 100 via optical fiber array 6.

[0121] Preferably, the angle formed by the second surface 7 and the fourth surface 9 is equal to 82°.

[0122] Based on the above embodiment, the angle formed by the second surface 7 and the fourth surface 9 is in the range of 81 degrees to 83 degrees, in order to prevent the optical signal from being reflected back to the optical receiving chip or the optical transmitting chip and causing signal transmission errors.

[0123] In some embodiments, the optical transmission port 91 has 12 channels and is coupled to the optical transmission chip in the optical chip assembly 31 through the optical fiber array 6. The optical reception port 92 has 12 channels and is coupled to the optical reception chip in the optical chip assembly 31 through the optical fiber array 6.

[0124] In some embodiments, see Figure 9 As shown, the optical module assembly 400 further includes: a protective tube 300 ; the optical module 100 is coupled to the optical connector 200 via the optical fiber array 6 (not shown), and the protective tube 300 is sleeved on the outside of the optical fiber array 6 .

[0125] In some embodiments, see Figure 12 and Figure 13 As shown, Figure 12 4 shows a side view of the optical module assembly 400. Figure 13This figure shows a rear view of the optical module assembly 400. The length of the optical module 100 along the first direction X is 20 mm, the length along the second direction Y is 33.4 mm, the length along the thickness direction Z is 4.5 mm, and the diameter of the protective tube 300 is 3.8 mm. The optical module 100 weighs 15 g.

[0126] In some embodiments, see Figure 14 As shown, the two optical module assemblies 400 are connected via a ribbon fiber. The length of the ribbon fiber ranges from 1 meter to 100 meters, which is suitable for short-distance transmission. The optical module 100 can receive external control signals and 24 electrical signals through the electrical connector 5, and can also transmit control signals and 24 electrical signals to the outside.

[0127] See Figure 15 As shown, the embodiment of the present application provides a method for forming the optical module 100 as in any of the above embodiments, comprising:

[0128] S101: forming a circuit board;

[0129] S102: Fixing the chip assembly on the surface of the circuit board, coupling the chip assembly to the circuit board;

[0130] S103: coupling the connecting portion of the electrical connector to the circuit board.

[0131] The following will describe a method for forming the optical module 100 according to any of the above embodiments with reference to the accompanying drawings.

[0132] Please refer to Figure 1 and Figure 15 , execute step S101 to form a circuit board 2.

[0133] Please refer to Figure 6 , circuit board 2 includes:

[0134] The substrate 21 includes a first functional surface 211 and a second functional surface 212;

[0135] A first port structure 22 located on the first functional surface 211, a second port structure 23 located on the second functional surface 212, and a wiring structure 24 located within the substrate 21, wherein the wiring structure 24 is electrically connected between the first port structure 22 and the second port structure 23, the first port structure 22 is coupled to the chip assembly 3, and the second port structure 23 corresponds to the connecting portion 52;

[0136] The second port structure 23 includes a first port 231 and a second port 232 , wherein the first port 231 is coupled to the first function pin 55 , and the second port 232 is coupled to the second function pin 56 ;

[0137] The wiring structure 24 includes a plurality of wirings 241 . Each wiring 241 is coupled between at least one first port 231 and at least one second port 232 . The minimum distance between the wirings 241 is greater than a fourth distance threshold.

[0138] Please refer to Figure 1 and Figure 15 , execute step S102, fix the chip component 3 on the surface of the circuit board 2, and couple the chip component 3 to the circuit board 2.

[0139] In some embodiments, the chip assembly 3 includes multiple sets of optical chip assemblies 31 and multiple sets of electrical chip assemblies 32. The number of optical chip assemblies 31 in each set of chip assembly 3 ranges from two to three; the number of electrical chip assemblies 32 in each set of chip assembly 3 ranges from two to three. Each set of optical chip assemblies 31 includes at least one optical receiver chip and at least one optical transmitter chip. Each set of electrical chip assemblies 32 includes at least one driver chip and at least one limiting amplifier.

[0140] In some embodiments, a chip assembly 3 can be fixed to the surface of the circuit board 2 using a chip-on-board (COB) packaging process. COB is an integrated technology that directly packages a bare chip on the substrate 21. Because the chip assembly 3 used in the embodiment of the present application is a bare chip without a chip housing, its volume is smaller than that of a packaged chip with a chip housing, thus helping to reduce the volume of the optical module 100.

[0141] Please refer to Figure 1 and Figure 15 , execute step S103 to couple the connecting portion 52 of the electrical connector 5 to the circuit board 2 .

[0142] The connecting portion 52 of the electrical connector 5 includes multiple groups of differential signal pins CML, which include multiple groups of first function pins 55 and multiple groups of second function pins 56. The second function pins 56 are coupled to the second port 232 of the circuit board 2, and the first function pins 55 are coupled to the first port 231 of the circuit board 2.

[0143] See Figure 16 As shown, the embodiment of the present application provides a method for forming an optical module assembly 400, including:

[0144] S201: forming an optical module 100 according to any of the above embodiments;

[0145] S202 : coupling the optical connector 200 to the optical module 100 .

[0146] A method for forming an optical module assembly 400 will be described below with reference to the accompanying drawings.

[0147] Please refer to Figure 9and Figure 16 As shown, step S201 is performed to form the optical module 100 as any one of the above embodiments.

[0148] Please refer to Figure 1 , the optical module 100 includes:

[0149] Circuit board 2;

[0150] A chip assembly 3 is coupled to the circuit board 2;

[0151] The electrical connector 5 is coupled to the circuit board 2. The electrical connector 5 has a first surface 51. The first surface 51 has a connecting portion 52. The connecting portion 52 is coupled to the chip assembly 3 through the circuit board 2. The connecting portion 52 includes multiple groups of differential signal pins CML and multiple power pins VCC. The distance from the differential signal pins CML to the power pins VCC is greater than a first distance threshold.

[0152] The optical module 100 further includes an optical fiber array 6 , which is coupled to the chip assembly 3 and is used to transmit optical signals.

[0153] Please refer to Figure 9 and Figure 16 As shown, step S202 is executed to couple the optical connector 200 to the optical module 100 .

[0154] The optical connector 200 is coupled to the optical module 100 via the optical fiber array 6. Figure 10 The optical connector 200 has a second surface 7, a third surface 8, and a fourth surface 9. The second surface 7 is parallel to the third surface 8, the second surface 7 is connected to the fourth surface 9, and the fourth surface 9 is connected to the third surface 8. The fourth surface 9 has a light emitting port 91 and a light receiving port 92. The light emitting port 91 is located on a side close to the second surface 7, and the light receiving port 92 is located on a side close to the third surface 8. The light emitting port 91 and the light receiving port 92 of the optical connector 200 are coupled to the optical fiber array 6.

[0155] It should be noted that the above method may also include other implementation methods according to the description of the structural embodiment. The specific implementation methods can refer to the description of the relevant structural embodiment and will not be described in detail here.

[0156] The structural embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one location or distributed across multiple network elements. Some or all of the modules may be selected based on actual needs to achieve the objectives of this embodiment. Persons of ordinary skill in the art will be able to understand and implement the present invention without inventive effort.

[0157] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, or of course, by hardware. Based on this understanding, the essence of the above technical solution or the part that contributes to the existing technology can be embodied in the form of a software product. The computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a magnetic disk, an optical disk, etc., and includes a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or certain parts of the embodiments.

[0158] In summary, although the present application has been disclosed as above with preferred embodiments, the above preferred embodiments are not intended to limit the present application. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims.

Claims

1. An optical module, characterized in that: include: Circuit board (2); A chip assembly (3) coupled to the circuit board (2); An electrical connector (5) is coupled to the circuit board (2), the electrical connector (5) having a first surface (51), the first surface (51) having a connecting portion (52), the connecting portion (52) being coupled to the chip assembly (3) through the circuit board (2), the connecting portion (52) comprising a plurality of groups of differential signal pins (CML) and a plurality of power pins (VCC), the distance between the differential signal pins (CML) and the power pins (VCC) being greater than a first distance threshold.

2. The optical module according to claim 1, wherein Also includes: A housing (1) is provided with a receiving cavity (11) therein, and the circuit board (2) and the chip assembly (3) are located in the receiving cavity (11).

3. The optical module according to claim 1, wherein: Each group of differential signal pins (CML) in the plurality of groups of differential signal pins (CML) includes a positive phase pin and a negative phase pin of the same channel; and a distance between the positive phase pin and the negative phase pin of the same channel is less than a second distance threshold.

4. The optical module according to claim 1, wherein: The first distance threshold is 1.0 mm.

5. The optical module according to claim 1, wherein: The connecting portion (52) further includes: a plurality of ground pins (GND), the connecting portion (52) being arranged in an array along a first direction (X) and a second direction (Y), the first direction (X) and the second direction (Y) being parallel to the first surface (51), and the first direction (X) and the second direction (Y) being different; Each group of differential signal pins (CML) in the plurality of groups of differential signal pins (CML) is adjacent to the ground pin (GND) on at least one side in the first direction (X) and at least one side in the second direction (Y).

6. The optical module according to claim 1, wherein: The first surface (51) includes a first area (53) and a second area (54), and a distance between the first area (53) and the second area (54) is greater than a third distance threshold; The multiple groups of differential signal pins (CML) include multiple groups of first function pins (55) and multiple groups of second function pins (56), wherein the multiple groups of first function pins (55) are located in the first area (53), and the multiple groups of second function pins (56) are located in the second area (54).

7. The optical module according to claim 6, wherein: The signal transmitted through the first function pin (55) has a first power, and the signal transmitted through the second function pin (56) has a second power, and the first power is different from the second power.

8. The optical module according to claim 6, wherein: The circuit board (2) comprises: A substrate (21) comprising a first functional surface (211) and a second functional surface (212); a first port structure (22) located on the first functional surface (211), a second port structure (23) located on the second functional surface (212), and a wiring structure (24) located in the substrate (21), wherein the wiring structure (24) is electrically connected between the first port structure (22) and the second port structure (23), the first port structure (22) is coupled to the chip assembly (3), and the second port structure (23) corresponds to the connecting portion (52); The second port structure (23) includes a first port (231) and a second port (232), wherein the first port (231) is coupled to the first function pin (55), and the second port (232) is coupled to the second function pin (56); The wiring structure (24) includes a plurality of wirings (241), each wiring (241) is coupled between at least one first port (231) and at least one second port (232), and a minimum distance between the wirings (241) is greater than a fourth distance threshold.

9. The optical module according to claim 1, wherein: The chip assembly (3) comprises multiple groups of optical chip assemblies (31) and multiple groups of electrical chip assemblies (32).

10. The optical module according to claim 9, wherein: The number of the optical chip components (31) in each group of the chip components (3) ranges from two to three groups; the number of the electrical chip components (32) in each group of the chip components (3) ranges from two to three groups.

11. The optical module according to claim 10, wherein: Each group of optical chip components (31) includes at least one light receiving chip and at least one light emitting chip.

12. The optical module according to claim 10, wherein: Each group of the electric chip components (32) includes at least one driver chip and at least one limiting amplifier.

13. The optical module according to claim 10, wherein: Also includes: A plurality of heat sinks (4), wherein the plurality of heat sinks (4) are located between the chip assembly (3) and the circuit board (2).

14. The optical module according to claim 13, wherein: The material of the heat sink (4) includes aluminum nitride.

15. The optical module according to claim 1, wherein: Also includes: An optical fiber array (6) is coupled to the chip assembly (3).

16. The optical module according to claim 2, wherein: The housing (1) comprises a matching top cover (12) and a base (13); the accommodating cavity (11) is located between the top cover (12) and the base (13); the base (13) has an accommodating groove (131) that passes through the base (13); and the electrical connector (5) is located in the accommodating groove (131).

17. An optical module assembly, characterized in that: include: The optical module (100) according to any one of claims 1 to 16; An optical connector (200) is coupled to the optical module (100).

18. The optical module assembly according to claim 17, wherein: The optical connector (200) has a second surface (7), a third surface (8) and a fourth surface (9), the second surface (7) is parallel to the third surface (8), the second surface (7) is connected to the fourth surface (9), and the fourth surface (9) is connected to the third surface (8); The fourth surface (9) has a light emitting port (91) and a light receiving port (92), wherein the light emitting port (91) is located on a side close to the second surface (7), and the light receiving port (92) is located on a side close to the third surface (8); The included angle formed by the second surface (7) and the fourth surface (9) ranges from 81 degrees to 83 degrees.

19. The optical module assembly according to claim 17, wherein: Also includes: The protective pipe (300) comprises an optical fiber array (6), the optical module (100) is coupled to the optical connector (200) via the optical fiber array (6), and the protective pipe (300) is sleeved on the outside of the optical fiber array (6).

20. A method for forming an optical module according to any one of claims 1 to 16, characterized in that: include: forming a circuit board (2); A chip component (3) is fixed on the surface of the circuit board (2), and the chip component (3) is coupled to the circuit board (2); The connecting portion (52) of the electrical connector (5) is coupled to the circuit board (2).

21. A method for forming an optical module assembly, characterized in that: include: Forming the optical module (100) according to any one of claims 1 to 16; An optical connector (200) is coupled to the optical module (100).

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