Electronic device
By designing sensor layers and sensor drivers in electronic devices and using differential operations to process electrode group signals, precise sensing of pen input is achieved, solving the problem of insufficient accuracy of existing devices when sensing pen input, and improving user experience.
Patent Information
- Application Number
- CN202411909019.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-02-06
- Filing Date
- 2024-12-24
- Publication Date
- 2025-08-08
AI Technical Summary
When existing multimedia electronic devices sense inputs through pens, especially for drawing or drawing applications, there is a problem of insufficient accuracy, and traditional touch input methods are difficult to meet users' needs for writing tools.
Using the design of a sensor layer and a sensor driver, the sensor layer includes multiple electrode groups arranged in different directions, and precise sensing of pen input is achieved through differential operations and signal processing.
It improves the sensing accuracy and sensitivity of electronic devices to pen input, meets users' input needs for writing tools, and enhances the device's user experience.
Smart Images

Figure CN120447769A_ABST
Abstract
Description
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] This application claims priority from Korean Patent Application No. 10-2024-0017966 filed on February 6, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field
[0003] The present disclosure herein relates to an electronic device capable of sensing input through a pen. Background Art
[0004] Multimedia electronic devices such as televisions, mobile phones, tablet computers, laptops, navigation devices, and game consoles include display devices for displaying images. In addition to typical input methods such as buttons, keyboards, mice, etc., electronic devices may also include a sensor layer (e.g., input sensor) that provides a touch-based input method that enables a user to easily, intuitively, and conveniently input information or commands. The sensor layer can sense the user's touch or pressure. However, for users who are familiar with using writing tools for information input or for specific applications (e.g., applications for drawing or painting), the demand for the use of pens for precise touch input is increasing. Summary of the Invention
[0005] The present disclosure provides an electronic device capable of sensing input performed through a pen.
[0006] According to an embodiment of the present invention, an electronic device includes: a sensor layer; and a sensor driver that drives the sensor layer and selectively operates in a first mode for sensing touch input and a second mode for sensing pen input. The sensor layer includes a plurality of first electrode groups arranged along a first direction. A plurality of second electrode groups are arranged along a second direction that intersects the first direction. The plurality of second electrode groups intersect the plurality of first electrode groups and include a 2-1 electrode group and a 2-2 electrode group spaced apart from each other in the second direction. A first crossing trace is connected to one side of the 2-1 electrode group. A second crossing trace is connected to one side of the 2-2 electrode group. One side of the 2-1 electrode group and one side of the 2-2 electrode group are opposite to each other relative to the first direction.
[0007] In an embodiment, at least one 2-1st electrode group includes a plurality of 2-1st electrode groups, and at least one 2-2nd electrode group includes a plurality of 2-2nd electrode groups. The plurality of 2-1st electrode groups and the plurality of 2-2nd electrode groups may be alternately arranged.
[0008] In an embodiment, a plurality of coupling capacitors may be defined between adjacent 2-1 electrode groups and 2-2 electrode groups among the plurality of 2-1 electrode groups and the plurality of 2-2 electrode groups.
[0009] In an embodiment, the sensor driver may output a first output signal by performing a differential operation on first signals received from the plurality of 2-1 electrode groups. The sensor driver may output a second output signal by performing a differential operation on second signals received from the plurality of 2-2 electrode groups.
[0010] In an embodiment, the sensor driver may include a first differential amplifier having an inverting terminal and a non-inverting terminal, and a second differential amplifier having an inverting terminal and a non-inverting terminal. The second mode may include a pen sensing drive mode. In the pen sensing drive mode, the inverting terminal of the first differential amplifier may be electrically connected to a first 2-1 electrode group among the plurality of 2-1 electrode groups, and the non-inverting terminal of the first differential amplifier may be electrically connected to a second 2-1 electrode group among the plurality of 2-1 electrode groups. In the pen sensing drive mode, the inverting terminal of the second differential amplifier may be electrically connected to a first 2-2 electrode group among the plurality of 2-2 electrode groups, and the non-inverting terminal of the second differential amplifier may be electrically connected to a second 2-2 electrode group among the plurality of 2-2 electrode groups.
[0011] In an embodiment, the sensor driver may convert a first signal received from the plurality of 2-1 electrode groups into a first digital signal and perform a differential operation on the first digital signal. The sensor driver may convert a second signal received from the plurality of 2-2 electrode groups into a second digital signal and perform a differential operation on the second digital signal.
[0012] In an embodiment, the sensor driver may obtain a first output signal by performing a differential operation on a first signal received from a plurality of 2-1 electrode groups, and obtain a second output signal by performing a differential operation on a second signal received from a plurality of 2-2 electrode groups. When the magnitude of the first output signal is smaller than the magnitude of the second output signal, the sensor driver may amplify the first output signal by applying a gain value to the first output signal.
[0013] In an embodiment, the plurality of first electrode groups may include at least one 1-1 electrode group and at least one 1-2 electrode group spaced apart from each other in the first direction, and the sensor layer may further include: a third cross trace connected to one side of at least one 1-1 electrode group; and a fourth cross trace connected to one side of at least one 1-2 electrode group, and the one side of at least one 1-1 electrode group and the one side of at least one 1-2 electrode group may be arranged in opposite directions relative to the second direction.
[0014] In an embodiment, at least one 1-1 electrode group includes a plurality of 1-1 electrode groups, and at least one 1-2 electrode group includes a plurality of 1-2 electrode groups. The plurality of 1-1 electrode groups and the plurality of 1-2 electrode groups may be alternately arranged.
[0015] In an embodiment, a plurality of coupling capacitors may be defined between adjacent 1-1 electrode groups and 1-2 electrode groups among the plurality of 1-1 electrode groups and the plurality of 1-2 electrode groups.
[0016] In an embodiment, each of at least one 2-1 electrode group may include a first sensing electrode, and each of at least one 2-2 electrode group may include a second sensing electrode, the first sensing electrode may include a first sensing pattern, a first bridging pattern connecting adjacent first sensing patterns among the first sensing patterns, and a first cross pattern electrically connected to each of the first sensing patterns, the second sensing electrode may include a second sensing pattern, a second bridging pattern connecting adjacent second sensing patterns among the second sensing patterns, and a second cross pattern electrically connected to each of the second sensing patterns, the first sensing pattern and the second sensing pattern and the first cross pattern and the second cross pattern may be set on different layers from each other, and at least a portion of the first cross pattern may overlap with the second sensing pattern among the second sensing patterns that is adjacent to the first cross pattern, and at least a portion of the second cross pattern may overlap with the first sensing pattern that is adjacent to the second cross pattern among the first sensing patterns.
[0017] In an embodiment, each of at least one 1-1 electrode group may include a third sensing electrode, and each of at least one 1-2 electrode group may include a fourth sensing electrode, the third sensing electrode may include a third sensing pattern, a third bridge pattern connecting adjacent third sensing patterns among the third sensing patterns, and a third cross pattern electrically connected to each of the third sensing patterns, the fourth sensing electrode may include a fourth sensing pattern, a fourth bridge pattern connecting adjacent fourth sensing patterns among the fourth sensing patterns, and a fourth cross pattern electrically connected to each of the fourth sensing patterns, the third sensing pattern and the fourth sensing pattern and the third cross pattern and the fourth cross pattern may be set on different layers from each other, and at least a portion of the third cross pattern may overlap with a fourth sensing pattern adjacent to the third cross pattern among the fourth sensing patterns, and at least a portion of the fourth cross pattern may overlap with a third sensing pattern adjacent to the fourth cross pattern among the third sensing patterns.
[0018] In an embodiment, each of at least one 2-1 electrode group may include a first sensing electrode, and each of at least one 2-2 electrode group may include a second sensing electrode, the first sensing electrode may include a first sensing pattern, a first bridging pattern connecting adjacent first sensing patterns among the first sensing patterns, and a first cross pattern electrically connected to each of the first sensing patterns, the second sensing electrode may include a second sensing pattern, a second bridging pattern connecting adjacent second sensing patterns among the second sensing patterns, and a second cross pattern electrically connected to each of the second sensing patterns, the first sensing pattern and the second sensing pattern and the first cross pattern and the second cross pattern may be arranged on the same layer as each other, and the first cross pattern may be arranged in an opening of the second sensing pattern adjacent to the first cross pattern among the second sensing patterns, and the second cross pattern may be arranged in an opening of the first sensing pattern adjacent to the second cross pattern among the first sensing patterns.
[0019] In an embodiment, each of at least one 1-1 electrode group may include a third sensing electrode, and each of at least one 1-2 electrode group may include a fourth sensing electrode, the third sensing electrode may include a third sensing pattern, a third bridge pattern connecting adjacent third sensing patterns among the third sensing patterns, and a third cross pattern electrically connected to each of the third sensing patterns, the fourth sensing electrode may include a fourth sensing pattern, a fourth bridge pattern connecting adjacent fourth sensing patterns among the fourth sensing patterns, and a fourth cross pattern electrically connected to each of the fourth sensing patterns, the third sensing pattern and the fourth sensing pattern and the third cross pattern and the fourth cross pattern may be arranged on the same layer as each other, and the third cross pattern may be arranged in a recessed portion of a fourth sensing pattern adjacent to the third cross pattern among the fourth sensing patterns, and the fourth cross pattern may be arranged in a recessed portion of the third sensing pattern adjacent to the fourth cross pattern among the third sensing patterns.
[0020] In an embodiment, the sensor layer may further include: a plurality of auxiliary electrodes respectively overlapping the plurality of first electrode groups; and connection traces connecting the plurality of auxiliary electrodes to each other.
[0021] In an embodiment, the sensor layer may further include a plurality of first traces electrically connected to the plurality of first electrode groups in a one-to-one correspondence, and the plurality of first traces may be spaced apart from the connecting traces with the plurality of first electrode groups therebetween.
[0022] In an embodiment, each of at least one 2-1 electrode group may include a first sensing electrode, each of at least one 2-2 electrode group may include a second sensing electrode, and each of the plurality of first electrode groups may include a third sensing electrode, the first sensing electrode may include a first sensing pattern, a first bridge pattern connecting adjacent first sensing patterns among the first sensing patterns, and a first cross pattern electrically connected to each of the first sensing patterns, the second sensing electrode may include a second sensing pattern, a second bridge pattern connecting adjacent second sensing patterns among the second sensing patterns, and a second cross pattern electrically connected to each of the second sensing patterns, the third sensing electrode may include a third sensing pattern and a third bridge pattern connecting adjacent third sensing patterns among the third sensing patterns, and each of the third sensing patterns may overlap with a corresponding auxiliary electrode among the plurality of auxiliary electrodes.
[0023] In an implementation, the plurality of auxiliary electrodes and the first, second, and third sensing patterns may be disposed on different layers from each other.
[0024] In an embodiment, the first sensing pattern and the second sensing pattern and the first intersection pattern and the second intersection pattern may be set on different layers from each other, and at least a portion of the first intersection pattern may overlap with the second sensing pattern adjacent to the first intersection pattern among the second sensing patterns, and at least a portion of the second intersection pattern may overlap with the first sensing pattern adjacent to the second intersection pattern among the first sensing patterns.
[0025] In an embodiment, the first sensing pattern and the second sensing pattern and the first cross pattern and the second cross pattern can be set on the same layer as each other, and the first cross pattern can be set in a recessed portion of the second sensing pattern adjacent to the first cross pattern among the second sensing patterns, and the second cross pattern can be set in a recessed portion of the first sensing pattern adjacent to the second cross pattern among the first sensing patterns.
[0026] In an embodiment, a plurality of holes respectively surrounding the third bridge patterns may be defined in one corresponding auxiliary electrode.
[0027] In an embodiment, the sensor layer may further include: a plurality of loop traces electrically connected to the plurality of auxiliary electrodes, the second mode may include a charging drive mode and a pen sensing drive mode, in which the sensor driver may apply a first signal to the connecting trace and at least one of the plurality of loop traces, and apply a second signal to the connecting trace and at least another one of the plurality of loop traces, and in the pen sensing drive mode, all of the plurality of loop traces may be electrically floating.
[0028] In an embodiment, in the first mode, the sensor driver may sequentially provide transmission signals to the plurality of first electrode groups and receive signals from the plurality of second electrode groups.
[0029] In an embodiment, in the first mode, the sensor driver may sequentially provide transmission signals to the plurality of second electrode groups and receive signals provided from the plurality of first electrode groups.
[0030] In an embodiment, the sensor layer may further include: a first additional trace connected to the other side of at least one 2-1 electrode group that is different from the side of at least one 2-1 electrode group; and a second additional trace connected to the other side of at least one 2-2 electrode group that is different from the side of at least one 2-2 electrode group, in which, in a first mode, the first additional trace may be electrically connected to the first cross trace, and the second additional trace may be electrically connected to the second cross trace, and in a second mode, each of the first additional trace and the second additional trace may be electrically floating.
[0031] In an embodiment, each of the at least one 2-1st electrode group and the at least one 2-2nd electrode group may cross all of the plurality of first electrode groups.
[0032] According to an embodiment of the present inventive concept, an electronic device includes: a sensor layer; and a sensor driver that drives the sensor layer and selectively operates in a first mode for sensing touch input and a second mode for sensing pen input. The sensor layer includes: a plurality of first electrode groups arranged along a first direction; and a plurality of second electrode groups arranged along a second direction intersecting the first direction. The plurality of second electrode groups intersect the plurality of first electrode groups, and a plurality of coupling capacitors are defined between adjacent second electrode groups within the plurality of second electrode groups.
[0033] In an embodiment, the plurality of second electrode groups may include a 2-1 electrode group and a 2-2 electrode group spaced apart from each other in the second direction, the 2-1 electrode group may include a first sensing electrode, and the 2-2 electrode group may include a second sensing electrode, the first sensing electrode may include a first sensing pattern, a first bridging pattern connecting adjacent first sensing patterns among the first sensing patterns, and a first cross pattern electrically connected to each of the first sensing patterns, and the second sensing electrode may include a second sensing pattern, a second bridging pattern connecting adjacent second sensing patterns among the second sensing patterns, and a second cross pattern electrically connected to each of the second sensing patterns.
[0034] In an embodiment, the first sensing pattern and the second sensing pattern and the first intersection pattern and the second intersection pattern may be set on different layers from each other, and at least a portion of the first intersection pattern may overlap with the second sensing pattern adjacent to the first intersection pattern among the second sensing patterns, and at least a portion of the second intersection pattern may overlap with the first sensing pattern adjacent to the second intersection pattern among the first sensing patterns.
[0035] In an embodiment, the first sensing pattern and the second sensing pattern and the first cross pattern and the second cross pattern can be set on the same layer as each other, and the first cross pattern can be set in an opening of the second sensing pattern adjacent to the first cross pattern among the second sensing patterns, and the second cross pattern can be set in an opening of the first sensing pattern adjacent to the second cross pattern among the first sensing patterns.
[0036] In an embodiment, the sensor layer may further include: a first cross trace connected to one side of the first-second electrode group in the adjacent second electrode group; and a second cross trace connected to one side of the second-second electrode group in the adjacent second electrode group, and the side of the first-second electrode group in the adjacent second electrode group and the side of the second-second electrode group in the adjacent second electrode group may be opposite to each other relative to the first direction. BRIEF DESCRIPTION OF THE DRAWINGS
[0037] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:
[0038] Figure 1A is a perspective view of an electronic device according to an embodiment of the present inventive concept;
[0039] Figure 1B is a rear perspective view of an electronic device according to an embodiment of the present inventive concept;
[0040] Figure 2 is a perspective view of an electronic device according to an embodiment of the present inventive concept;
[0041] Figure 3 is a schematic cross-sectional view of a display panel according to an embodiment of the present inventive concept;
[0042] Figure 4 is a diagram illustrating an operation of an electronic device according to an embodiment of the present inventive concept;
[0043] Figure 5A is a diagram illustrating a pen according to an embodiment of the present inventive concept;
[0044] Figure 5B is a diagram illustrating a pen according to an embodiment of the present inventive concept;
[0045] Figure 5C is a diagram illustrating a pen according to an embodiment of the present inventive concept;
[0046] Figure 5D is a diagram illustrating an input device according to an embodiment of the present inventive concept;
[0047] Figure 6 is a cross-sectional view of a display panel according to an embodiment of the present inventive concept;
[0048] Figure 7 is a plan view of a sensor layer according to an embodiment of the present inventive concept;
[0049] Figure 8 is a diagram illustrating an operation of a sensor driver according to an embodiment of the present inventive concept;
[0050] Figure 9 is a diagram illustrating an operation of a sensor driver according to an embodiment of the present inventive concept;
[0051] Figure 10 is a diagram illustrating a portion of a second electrode group according to an embodiment of the present inventive concept;
[0052] Figure 11 is an equivalent circuit diagram illustrating a relationship between a second electrode group and a pen according to an embodiment of the present inventive concept;
[0053] Figure 12 is a graph showing the magnitude of current and the position of a pen relative to one channel according to an embodiment of the present inventive concept;
[0054] Figure 13 is a graph showing the magnitude of an output signal and the position of a pen relative to one channel according to an embodiment of the present inventive concept;
[0055] Figure 14 is a diagram illustrating four second electrode groups and a portion of a sensor driver according to an embodiment of the present inventive concept;
[0056] Figure 15A is a diagram illustrating currents sensed in a plurality of channels according to an embodiment of the present inventive concept;
[0057] Figure 15B is a graph illustrating currents obtained from differential pairs of multiple channels according to an embodiment of the inventive concept;
[0058] Figure 16A and Figure 16Bis a graph illustrating current obtained from a differential pair of first interdigitated electrodes and current obtained from a differential pair of second interdigitated electrodes according to an embodiment of the present inventive concept;
[0059] Figure 17 is a plan view illustrating a portion of a sensor layer according to an embodiment of the present inventive concept;
[0060] Figure 18 is a plan view illustrating four sensing units according to an embodiment of the present inventive concept;
[0061] Figure 19A is a plan view illustrating a second conductive layer of four sensing units according to an embodiment of the inventive concept;
[0062] Figure 19B is a plan view illustrating a first conductive layer of four sensing units according to an embodiment of the inventive concept;
[0063] Figure 20 is a plan view illustrating four sensing units according to an embodiment of the present inventive concept;
[0064] Figure 21A is a plan view illustrating a second conductive layer of four sensing units according to an embodiment of the inventive concept;
[0065] Figure 21B is a plan view illustrating a first conductive layer of four sensing units according to an embodiment of the inventive concept;
[0066] Figure 22 is a plan view illustrating a portion of a sensor layer according to an embodiment of the present inventive concept;
[0067] Figure 23 is a schematic diagram illustrating a channel according to an embodiment of the present inventive concept;
[0068] Figure 24 is an equivalent circuit diagram illustrating a relationship between one channel and a pen according to an embodiment of the present inventive concept;
[0069] Figure 25A is a graph showing the magnitude of current and the position of a pen relative to one channel according to an embodiment of the present inventive concept;
[0070] Figure 25B is a graph showing the magnitude of a total induced current and the position of a pen relative to one channel according to an embodiment of the present inventive concept;
[0071] Figure 26 is a plan view illustrating four sensing units according to an embodiment of the present inventive concept;
[0072] Figure 27A is a plan view illustrating a second conductive layer of four sensing units according to an embodiment of the inventive concept;
[0073] Figure 27B is a plan view illustrating a first conductive layer of four sensing units according to an embodiment of the inventive concept;
[0074] Figure 28 is a plan view illustrating four sensing units according to an embodiment of the present inventive concept;
[0075] Figure 29A is a plan view illustrating a second conductive layer of four sensing units according to an embodiment of the inventive concept;
[0076] Figure 29B is a plan view illustrating a first conductive layer of four sensing units according to an embodiment of the inventive concept;
[0077] Figure 30 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver according to an embodiment of the present inventive concept;
[0078] Figure 31 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver according to an embodiment of the present inventive concept;
[0079] Figure 32 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver according to an embodiment of the present inventive concept; and
[0080] Figure 33 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver according to an embodiment of the inventive concept. DETAILED DESCRIPTION
[0081] In this specification, it will be understood that when an element (or region, layer, portion, etc.) is referred to as being “on,” “connected to,” or “coupled to” another element, it may be directly disposed on, directly connected to, or directly coupled to the other element, or intervening elements may be disposed therebetween. When an element, region, layer, portion, etc. is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element, no intervening elements may be disposed therebetween.
[0082] Similar reference numerals or symbols represent similar elements. In addition, in the accompanying drawings, the thickness, proportion and size of the elements may be exaggerated in order to effectively describe the technical content. The term "and / or" includes all of one or more combinations that can be defined by the associated elements.
[0083] Although the terms first, second, etc. can be used to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the scope of the embodiments of the present disclosure, a first element can be referred to as a second element, and similarly, a second element can also be referred to as a first element. Singular forms also include plural forms, unless the context clearly indicates otherwise.
[0084] In addition, terms such as "below," "on the lower side," "above," and "on the upper side" may be used to describe the relationship of elements shown in the drawings. These terms have relative concepts and are described based on the directions shown in the drawings.
[0085] It will be understood that when used herein, terms such as “comprises” or “having” are intended to specify the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.
[0086] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. In addition, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted as idealized or overly formalized meanings unless explicitly defined as such herein.
[0087] The terms "part" and "unit" mean a software component or a hardware component that is used to perform a specific function. For example, a hardware component may include a field programmable gate array (FPGA) or an application specific integrated circuit (ASIC). A software component may refer to executable code and / or data used by the executable code in an addressable storage medium. Thus, for example, a software component may be an object-oriented software component, a class component, and a task component, and may include a process, a function, a property, a program, a subroutine, a program code segment, a driver, firmware, microcode, a circuit, data, a database, a data structure, a table, an array, or a variable.
[0088] Hereinafter, embodiments of the present inventive concept will be described with reference to the accompanying drawings.
[0089] Figure 1A is a perspective view of an electronic device according to an embodiment of the present inventive concept. Figure 1B is a rear perspective view of an electronic device according to an embodiment of the present inventive concept.
[0090] refer to Figure 1A and Figure 1B, the electronic device 1000 can be activated in response to an electrical signal. For example, the electronic device 1000 can display an image and sense input applied from the outside (e.g., the external environment). In an embodiment, the external input can be an input from a user. The user's input can include various forms of external input, such as input using a part of the user's body, a pen PN, light, heat, or pressure.
[0091] In an embodiment, the electronic device 1000 may include a first display panel DP1 and a second display panel DP2. The first display panel DP1 and the second display panel DP2 may be separate panels separated from each other (e.g., in a third direction DR3). The first display panel DP1 may be referred to as a main display panel, and the second display panel DP2 may be referred to as an auxiliary display panel or an external display panel.
[0092] In an embodiment, the first display panel DP1 may include a first display portion DA1-F, and the second display panel DP2 may include a second display portion DA2-F. The first display panel DP1 and the second display panel DP2 may further include a non-display portion NDA surrounding the respective display portions. In an embodiment, the area size of the second display panel DP2 (e.g., the area in a plane defined in the first direction DR1 and the second direction DR2) may be smaller than the area size of the first display panel DP1. Corresponding to the size of the first display panel DP1 and the size of the second display panel DP2, the area size of the first display portion DA1-F may be larger than the area size of the second display portion DA2-F.
[0093] In the unfolded state of the electronic device 1000, the first display portion DA1-F may have a plane substantially parallel to the first direction DR1 and the second direction DR2. The thickness direction of the electronic device 1000 may be parallel to a third direction DR3 that intersects the first direction DR1 and the second direction DR2. For example, in an embodiment, the first direction DR1 to the third direction DR3 may be perpendicular to each other. However, embodiments of the present inventive concept are not necessarily limited thereto, and the first direction DR1 to the third direction DR3 may intersect each other at various angles. Therefore, the front surface (e.g., upper surface) and the rear surface (e.g., lower surface) of the components constituting the electronic device 1000 may be defined based on the third direction DR3.
[0094] The first display panel DP1 or the first display portion DA1-F may include a folding area FA that can be folded and unfolded, and a plurality of non-folding areas NFA1 and NFA2 spaced apart from each other (e.g., in a first direction DR1), with the folding area FA located between the plurality of non-folding areas NFA1 and NFA2. The second display panel DP2 may overlap any of the plurality of non-folding areas NFA1 and NFA2. For example, the second display panel DP2 may overlap the first non-folding area NFA1.
[0095] The display direction of the first image IM1a displayed in a portion of the first display panel DP1 (e.g., the first non-folding area NFA1) and the display direction of the second image IM2a displayed in the second display panel DP2 may be opposite to each other. For example, in an embodiment, the first image IM1a may be displayed in a third direction DR3, and the second image IM2a may be displayed in a fourth direction DR4 that is the opposite direction of the third direction DR3.
[0096] In an embodiment of the present inventive concept, the folding area FA can be curved relative to a folding axis extending in a direction parallel to the long side of the electronic device 1000 (e.g., a direction parallel to the second direction DR2). When the electronic device 1000 is in a folded state, the folding area FA has a predetermined curvature and a predetermined radius of curvature. In an embodiment, the electronic device 1000 can be folded inward so that the first non-folding area NFA1 and the second non-folding area NFA2 face each other and the first display portion DA1-F is not exposed to the outside (e.g., the external environment).
[0097] In an embodiment of the present invention, the electronic device 1000 can be folded outward so that the first display portion DA1-F is exposed to the outside (e.g., the external environment). In an embodiment of the present invention, the electronic device 1000 can be folded both inward and outward in the unfolded state. However, embodiments of the present invention are not necessarily limited thereto.
[0098] Figure 1A As an example, one folding area FA is defined in the electronic device 1000. However, embodiments of the present inventive concept are not necessarily limited thereto. For example, multiple folding axes and multiple folding areas corresponding to the folding axes may be defined in the electronic device 1000, and the electronic device 1000 may be folded inward or outward in each of the multiple folding areas when in the unfolded state.
[0099] According to an embodiment of the present inventive concept, at least one of the first display panel DP1 and the second display panel DP2 can sense input via the pen PN even without a digitizer. Therefore, since the digitizer for sensing the pen PN can be omitted, the increase in thickness, weight, and deterioration in flexibility of the electronic device 1000 caused by the addition of the digitizer can be prevented. Therefore, the second display panel DP2 as well as the first display panel DP1 can be designed to sense the pen PN.
[0100] Figure 2 is a perspective view of an electronic device according to an embodiment of the present inventive concept.
[0101] Figure 2 The electronic device 1000-1 is shown to be a mobile phone and may include a display panel DP. However, embodiments of the present inventive concept are not necessarily limited thereto, and the electronic device 1000-1 may be various small-sized, medium-sized, or large-sized electronic devices.
[0102] In an embodiment of the present invention, the display panel DP may sense an input applied from the outside (eg, an external environment). In an embodiment, the external input may be a user's input. The user's input may include a part of the user's body, a pen PN (see FIG. 1 ), or a user's finger. Figure 1A ), various forms of external inputs such as light, heat or pressure.
[0103] According to an embodiment of the present inventive concept, the display panel DP can sense input through the pen PN even without including a digitizer. Therefore, since the digitizer for sensing the pen PN can be omitted, the increase in thickness and weight of the electronic device 1000-1 due to the addition of the digitizer can be prevented.
[0104] Figure 1A A foldable electronic device 1000 is shown, and Figure 2 A bar-type electronic device 1000-1 is shown. However, embodiments of the present invention are not necessarily limited thereto. For example, the following description may be applied to various electronic devices such as a rollable electronic device, a slidable electronic device, and a stretchable electronic device.
[0105] Figure 3 is a schematic cross-sectional view of a display panel according to an embodiment of the inventive concept.
[0106] refer to Figure 3 In an embodiment, the display panel DP may include a display layer 100 and a sensor layer 200 .
[0107] The display layer 100 may be a component that essentially generates an image. In an embodiment, the display layer 100 may be a light-emitting display layer, and for example, the display layer 100 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer. In an embodiment, the display layer 100 may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.
[0108] The base layer 110 may be a member that provides a base surface on which the circuit layer 120 is disposed. The base layer 110 may have a multi-layer structure or a single-layer structure. In an embodiment, the base layer 110 may be a glass substrate, a metal substrate, a silicon substrate, a polymer substrate, etc. However, embodiments of the present inventive concept are not necessarily limited thereto.
[0109] The circuit layer 120 may be disposed on the base layer 110 (e.g., directly on the base layer 110 in the third direction DR3). In an embodiment, the circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, a signal line, etc. In an embodiment, the insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 110 by coating, deposition, etc., and the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned by a photolithography process performed multiple times to form the circuit layer 120.
[0110] The light emitting element layer 130 may be disposed on the circuit layer 120 (e.g., directly on the circuit layer 120 in the third direction DR3). The light emitting element layer 130 may include a light emitting element. For example, in an embodiment, the light emitting element layer 130 may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED.
[0111] The encapsulation layer 140 may be disposed on the light emitting element layer 130 (eg, directly on the light emitting element layer 130). The encapsulation layer 140 may protect the light emitting element layer 130 from moisture, oxygen, and foreign matter such as dust particles.
[0112] The sensor layer 200 may be provided on the display layer 100 (e.g., directly on the display layer 100). The sensor layer 200 may sense external input applied from the outside (e.g., the external environment). In an embodiment, the sensor layer 200 may be an integrated sensor continuously formed in the manufacturing process for the display layer 100, or the sensor layer 200 may be an external sensor attached to the display layer 100. The sensor layer 200 may be referred to as a sensor, an input sensing layer, an input sensing panel, an electronic device for sensing input coordinates, etc.
[0113] According to an embodiment of the present inventive concept, the sensor layer 200 can sense both input from a passive input method such as a user's body and input from an input device that generates a magnetic field having a predetermined resonant frequency. The input device may be referred to as a pen, input pen, magnetic pen, stylus, or electromagnetic resonance pen.
[0114] Figure 4 is a diagram illustrating an operation of an electronic device according to an embodiment of the inventive concept.
[0115] refer to Figure 4 , the electronic device 1000 may include a display layer 100, a sensor layer 200, a display driver 100C, a sensor driver 200C, a main driver 1000C, and a power supply circuit 1000P.
[0116] The sensor layer 200 can sense a first input 2000 or a second input 3000 applied from the outside (e.g., the external environment). Each of the first input 2000 and the second input 3000 can be from an input method that can provide a change in the capacitance of the sensor layer 200 or an input method that can induce an induced current in the sensor layer 200. For example, in an embodiment, the first input 2000 can be from a passive type input method such as the user's body. The second input 3000 can be an input performed by a pen PN or an input performed by an RFIC tag. For example, the pen PN can be a passive type pen or an active type pen.
[0117] In an embodiment of the present inventive concept, the pen PN may be a device that generates a magnetic field having a predetermined resonant frequency. The pen PN may be configured to transmit an output signal based on an electromagnetic resonance method. The pen PN may be referred to as an input device, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance pen.
[0118] In an embodiment, the pen PN may include an RLC resonant circuit, and the RLC resonant circuit may include an inductor L and a capacitor C. In an embodiment of the present inventive concept, the RLC resonant circuit may be a variable resonant circuit that varies the resonant frequency. In this embodiment, the inductor L may be a variable inductor and / or the capacitor C may be a variable capacitor. However, embodiments of the present inventive concept are not necessarily limited thereto.
[0119] The inductor L generates a current due to the magnetic field formed in the sensor layer 200. However, embodiments of the present invention are not necessarily limited thereto. For example, if the pen PN operates as an active type, the pen PN can generate a current even if the pen PN is not provided with a magnetic field from the outside. The generated current is transmitted to the capacitor C. The capacitor C is charged with the current input from the inductor L and discharges the charged current to the inductor L. The inductor L can then emit a magnetic field having a resonant frequency. In an embodiment, an induced current can flow in the sensor layer 200 due to the magnetic field emitted by the pen PN, and the induced current can be transmitted to the sensor driver 200C as a received signal (or a sensing signal, a signal).
[0120] In an embodiment, the main driver 1000C can control the overall operation of the electronic device 1000. For example, the main driver 1000C can control the operation of the display driver 100C and the sensor driver 200C. The main driver 1000C may include at least one microprocessor and may also include a graphics controller. The main driver 1000C may be referred to as an application processor, a central processing unit, or a main processor.
[0121] The display driver 100C can drive the display layer 100. The display driver 100C can receive image data and control signals from the main driver 1000C. The control signals may include various signals. For example, in an embodiment, the control signals may include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock signal, a data enable signal, etc.
[0122] The sensor driver 200C can drive the sensor layer 200. The sensor driver 200C can receive a control signal from the main driver 1000C. In an embodiment, the control signal may include a clock signal of the sensor driver 200C. In addition, the control signal may also include a mode determination signal that determines the driving mode of the sensor driver 200C and the sensor layer 200.
[0123] In an embodiment, the sensor driver 200C may be implemented as an integrated circuit (IC) and electrically connected to the sensor layer 200. For example, the sensor driver 200C may be directly mounted in a predetermined area of the display panel DP, or mounted on a separate printed circuit board using a chip on film (COF) method and electrically connected to the sensor layer 200.
[0124] The sensor driver 200C and the sensor layer 200 can selectively operate in a first mode or a second mode. For example, the first mode may be a mode for sensing touch input (such as the first input 2000). The second mode may be a mode for sensing input performed by a pen PN (such as the second input 3000). The first mode may be referred to as a touch sensing mode, and the second mode may be referred to as a pen sensing mode.
[0125] The switching between the first mode and the second mode can be performed in various ways. For example, in an embodiment, the sensor driver 200C and the sensor layer 200 can be driven in the first mode and the second mode in a time-division manner, and sense the first input 2000 and the second input 3000. Alternatively, the switching between the first mode and the second mode can be caused by the user's selection or a specific action of the user, or either of the first mode and the second mode can be activated or disabled, or can be switched to the other by the activation or deactivation of a specific application. Alternatively, when the sensor driver 200C and the sensor layer 200 operate alternately in the first mode and the second mode, when the first input 2000 is sensed, the first mode can be maintained, or when the second input 3000 is sensed, the second mode can be maintained.
[0126] The sensor driver 200C can calculate the input coordinate information based on the signal received from the sensor layer 200 and provide a coordinate signal containing the coordinate information to the main driver 1000C. The main driver 1000C performs an operation corresponding to the user's input based on the coordinate signal. For example, in an embodiment, the main driver 1000C can operate the display driver 100C so that a new application image is displayed on the display layer 100.
[0127] The power supply circuit 1000P may include a power management integrated circuit (PMIC). The power supply circuit 1000P may generate a plurality of driving voltages for driving the display layer 100, the sensor layer 200, the display driver 100C, and the sensor driver 200C. For example, in an embodiment, the plurality of driving voltages may include a gate high voltage, a gate low voltage, a first driving voltage (e.g., an ELVSS voltage), a second driving voltage (e.g., an ELVDD voltage), an initialization voltage, etc. However, embodiments of the present inventive concept are not necessarily limited thereto.
[0128] Figure 5A is a diagram illustrating a pen according to an embodiment of the present inventive concept.
[0129] refer to Figure 4 and Figure 5AIn an embodiment, the pen PN may include a housing PN-H, a pen tip PN-T, an inductor L, a capacitor C, a resistor R, an elastomer PN-ED, a pressure capacitor CP, a switch SW-B, and a button capacitor CB. In an embodiment, the pen PN may not include active elements such as a power supply, a transistor, or a diode other than the switch SW-B connected to the button capacitor CB. The components included in the pen PN are not necessarily limited to the above components. At least some of the above components may be omitted, and other components may be added.
[0130] In an embodiment of the present inventive concept, the pen tip PN-T may include a non-conductive material. The pen tip PN-T may have a structure protruding from the outside of the housing PN-H. The pen tip PN-T may be detachably coupled to the housing PN-H and may be a replaceable component.
[0131] In an embodiment of the present inventive concept, the resistor R, inductor L, and capacitor C may be connected in series. Thus, the pen PN may have a resonant frequency and a selective structure that exhibits the characteristics of an RLC series circuit. In this embodiment, the frequency of the signal provided to and supplied to the sensor layer 200 when the sensor layer 200 is driven by charge may correspond to the resonant frequency of the pen PN. In an embodiment, the capacitor C, the pressure capacitor CP, and the button capacitor CB may be connected in parallel. For reference, when the switch SW-B is turned on, the button capacitor CB may be connected in parallel to the capacitor C.
[0132] In an embodiment of the present inventive concept, the button capacitor CB can be electrically connected to or separated from the capacitor C, depending on whether the switch SW-B is turned on or off. For example, the pen PN can be provided so as to react to a different resonant frequency by turning the switch SW-B on or off. For example, in an embodiment, the button can be provided on the outer peripheral surface of the housing PN-H. When the button is pressed by the user, the switch SW-B can be turned on, and the button capacitor CB can be electrically connected to the capacitor C, thereby increasing the total capacitance of the pen PN.
[0133] In an embodiment of the present invention, the capacitor C can be provided by cutting a portion of a plurality of capacitors connected in parallel. For example, in order to achieve a target resonant frequency in the process of manufacturing the pen PN, a portion of the plurality of capacitors can be cut so that the capacitor C of the pen PN can be tuned.
[0134] In an embodiment of the present invention, when a portion of the pen tip PN-T is inserted into the housing PN-H due to pen pressure, the area size, distance, or both that form the capacitance of the pressure capacitor CP can be changed. Thus, the capacitance of the pressure capacitor CP can be changed. For example, when pen pressure is applied to the pen PN, the capacitance of the pressure capacitor CP can increase, and the resonant frequency of the pen PN can decrease based on the increased capacitance. When the pen pressure disappears, the capacitance of the pressure capacitor CP can be restored via the elastomer PN-ED.
[0135] Figure 5B is a diagram illustrating a pen according to an embodiment of the present inventive concept.
[0136] In reference Figure 5B When describing, refer to Figure 5A The components described will be denoted by the same reference numerals or symbols, and repeated description of the same or similar elements may be omitted for simplicity of explanation.
[0137] refer to Figure 4 and Figure 5B , in an embodiment, with Figure 5A Compared to the pen PN shown in FIG, the pen PN-1 may further include a power supply unit PN-BT and a control unit PN-IC. In an embodiment, the power supply unit PN-BT may include a battery or a high-capacitance capacitor. The control unit PN-IC may be supplied with power from the power supply unit PN-BT and may adjust the frequency of the signal output from the pen PN-1.
[0138] According to an embodiment of the present inventive concept, since the pen PN-1 can include an RLC resonant circuit, a power supply unit PN-BT, and a control unit PN-IC, the pen PN-1 can operate in both an active and passive mode. Therefore, the pen PN-1 can emit a magnetic field even when no magnetic field is provided by the sensor layer 200. Therefore, the sensor layer 200 can sense input from the pen PN-1, which outputs a magnetic field in a charging mode without generating a magnetic field.
[0139] Figure 5C is a diagram illustrating a pen according to an embodiment of the present inventive concept.
[0140] refer to Figure 4 and Figure 5C In an embodiment, the pen PN-2 may not include an RLC resonant circuit. For example, the pen PN-2 may include a housing PN-H, a pen tip PN-T, an inductor L, a power supply unit PN-BT, and a control unit PN-IC. The power supply unit PN-BT may include a battery or a high-capacitance capacitor. The control unit PN-IC may be supplied with power from the power supply unit PN-BT and may adjust the frequency of a signal output from the pen PN-2.
[0141] According to an embodiment of the present inventive concept, the pen PN-2 may operate as an active type. Therefore, even if a magnetic field is not provided from the sensor layer 200, the pen PN-2 may emit a magnetic field.
[0142] Figure 5D is a diagram illustrating an input device according to an embodiment of the inventive concept.
[0143] refer to Figure 4 and Figure 5D The sensor layer 200 can sense input from an input device TAG. The input device TAG can be referred to as an electronic tag, smart tag, or electronic marker. In an embodiment, the input device TAG may include a controller TAG-IC and an antenna TAG-CI connected to the controller TAG-IC. For example, the antenna TAG-CI can transmit radio waves with a unique code. The sensor layer 200 can detect the code of the input device TAG.
[0144] Figure 6 is a cross-sectional view of a display panel according to an embodiment of the inventive concept.
[0145] refer to Figure 6 , at least one buffer layer BFL is formed on the upper surface of the base layer 110 (for example, directly disposed on the upper surface of the base layer 110 in the third direction DR3). The buffer layer BFL can increase the bonding force between the base layer 110 and the semiconductor pattern. In an embodiment, the buffer layer BFL can be formed of a plurality of layers. Alternatively, the display layer 100 may further include a barrier layer. In an embodiment, the buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may have a structure in which silicon oxide layers and silicon nitride layers (for example, in the third direction DR3) are alternately stacked.
[0146] The semiconductor pattern may be disposed on the buffer layer BFL (e.g., directly on the buffer layer BFL in the third direction DR3). In an embodiment, the semiconductor pattern may include polysilicon. However, embodiments of the present inventive concept are not necessarily limited thereto, and the semiconductor pattern may include amorphous silicon, low-temperature polysilicon, or an oxide semiconductor.
[0147] Figure 6Only a portion of the semiconductor pattern is shown, and other semiconductor patterns may be further provided in another region. The semiconductor patterns may be arranged across pixels according to specific rules. Depending on whether the semiconductor pattern is doped, the semiconductor pattern may have different electrical properties. In an embodiment, the semiconductor pattern may include a first region having high conductivity and a second region having low conductivity. The first region may be doped with an N-type dopant or a P-type dopant. A P-type transistor may include a doped region doped with a P-type dopant, and an N-type transistor may include a doped region doped with an N-type dopant. The second region may be an undoped region or a region doped with a lower concentration than the first region.
[0148] The first region may include a source region SC, a drain region DR, and a connection signal line SCL, and the second region may include an active region AL. The first region may have a higher conductivity than the second region and may essentially function as an electrode or a signal line. The second region may essentially correspond to the active region AL (e.g., a channel) of the transistor 100PC. For example, a portion of the semiconductor pattern may be the active region AL of the transistor 100PC, another portion may be the source region SC or the drain region DR of the transistor 100PC, and yet another portion may be a connection electrode or a connection signal line SCL.
[0149] In an embodiment, each of the pixels may have an equivalent circuit including seven transistors, one capacitor, and a light emitting element. However, embodiments of the present inventive concept are not necessarily limited thereto, and the equivalent circuit diagram of the pixel may be changed in various forms. Figure 6 One transistor 100PC and a light emitting element 100PE included in a pixel are shown.
[0150] The source region SC, active region AL, and drain region DR of the transistor 100PC may be formed of a semiconductor pattern. In a cross-sectional view, the source region SC and drain region DR may extend from the active region AL in opposite directions (eg, a first direction DR1 and a direction opposite to the first direction DR1). Figure 6 A portion of a connection signal line SCL formed of a semiconductor pattern is shown. In an embodiment, in a plan view, the connection signal line SCL may be connected to the drain region DR of the transistor 100PC.
[0151] The first insulating layer 10 may be disposed on the buffer layer BFL (for example, directly on the buffer layer BFL in the third direction DR3). The first insulating layer 10 may overlap with a plurality of pixels in common and cover the semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer and have a single-layer or multi-layer structure. In an embodiment, the first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In this embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. The first insulating layer 10 and other insulating layers of the circuit layer 120 to be described later may be inorganic layers and / or organic layers and have a single-layer or multi-layer structure. The inorganic layer may include at least one of the above-mentioned materials. However, the embodiments of the present invention are not necessarily limited thereto.
[0152] The gate GT of the transistor 100PC is disposed on the first insulating layer 10 (e.g., directly on the first insulating layer 10 in the third direction DR3). The gate GT may be part of a metal pattern. The gate GT overlaps with the active area AL. The gate GT may be used as a mask in the process of doping or reducing the semiconductor pattern.
[0153] The second insulating layer 20 may be disposed on the first insulating layer 10 and cover the gate electrode GT. In an embodiment, the second insulating layer 20 may overlap with the pixel. The second insulating layer 20 may be an inorganic layer and / or an organic layer and have a single-layer or multi-layer structure. In an embodiment, the second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In this embodiment, the second insulating layer 20 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.
[0154] The third insulating layer 30 may be disposed on the second insulating layer 20 (e.g., directly on the second insulating layer 20 in the third direction DR3). The third insulating layer 30 may have a single-layer or multi-layer structure. For example, in an embodiment, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.
[0155] The first connection electrode CNE1 may be disposed on the third insulating layer 30 (eg, directly on the third insulating layer 30 in the third direction DR3). In an embodiment, the first connection electrode CNE1 may be connected to the connection signal line SCL via a contact hole CNT-1 passing through the first, second, and third insulating layers 10, 20, and 30.
[0156] The fourth insulating layer 40 may be disposed on the third insulating layer 30 (e.g., directly on the third insulating layer 30 in the third direction DR3). In an embodiment, the fourth insulating layer 40 may be a single-layer silicon oxide layer. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40 (e.g., directly on the fourth insulating layer 40 in the third direction DR3). In an embodiment, the fifth insulating layer 50 may be an organic layer.
[0157] The second connection electrode CNE2 may be disposed on the fifth insulating layer 50 (eg, directly on the fifth insulating layer 50 in the third direction DR3 ) and connected to the first connection electrode CNE1 via a contact hole CNT- 2 passing through the fourth insulating layer 40 and the fifth insulating layer 50 .
[0158] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 (eg, directly on the fifth insulating layer 50 in the third direction DR3 ) and cover the second connection electrode CNE2 . In an embodiment, the sixth insulating layer 60 may be an organic layer.
[0159] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, in an embodiment, the light-emitting element layer 130 may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED. Hereinafter, as an example, the light-emitting element 100PE will be described as an organic light-emitting element. However, embodiments of the present inventive concept are not necessarily limited thereto.
[0160] The light emitting element 100PE may include a first electrode AE, an emission layer EL, and a second electrode CE.
[0161] The first electrode AE may be disposed on the sixth insulating layer 60 (eg, directly on the sixth insulating layer 60 in the third direction DR3 ). In an embodiment, the first electrode AE may be connected to the second connection electrode CNE2 via a contact hole CNT- 3 passing through the sixth insulating layer 60 .
[0162] The pixel defining film 70 may be disposed on the sixth insulating layer 60 (e.g., directly on the sixth insulating layer 60 in the third direction DR3) and cover a portion of the first electrode AE. An opening 70-OP is defined in the pixel defining film 70. The opening 70-OP of the pixel defining film 70 exposes at least a portion of the first electrode AE.
[0163] The first display part DA1-F (see Figure 1A) may include a light-emitting region PXA and a non-light-emitting region NPXA adjacent to the light-emitting region PXA. The non-light-emitting region NPXA may surround the light-emitting region PXA (e.g., in the first direction DR1 and / or the second direction DR2). In this embodiment, the light-emitting region PXA is defined to correspond to a portion of the first electrode AE exposed by the opening 70-OP.
[0164] The emission layer EL may be provided on the first electrode AE. The emission layer EL may be provided in a region corresponding to the opening 70-OP. For example, in an embodiment, the emission layer EL may be formed separately in each of the pixels. If the emission layer EL is formed separately in each of the pixels, each emission layer EL may emit at least one of blue light, red light, and green light. However, embodiments of the present invention are not necessarily limited thereto, and the emission layer EL may be connected to the pixels and commonly included in the pixels. In an embodiment, the emission layer EL may provide blue light, or may provide white light. However, embodiments of the present invention are not necessarily limited thereto.
[0165] The second electrode CE may be disposed on the emission layer EL. In an embodiment, the second electrode CE may have an integral shape and may be commonly included in a plurality of pixels.
[0166] In an embodiment of the present invention, a hole control layer may be provided between the first electrode AE and the emission layer EL (for example, in the third direction DR3). In an embodiment, the hole control layer may be provided in common in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and may further include a hole injection layer. The electron control layer may be provided between the emission layer EL and the second electrode CE (for example, in the third direction DR3). The electron control layer may include an electron transport layer and may further include an electron injection layer. In an embodiment, the hole control layer and the electron control layer may be formed in common in a plurality of pixels by using an open mask or an inkjet process.
[0167] The encapsulation layer 140 may be disposed on the light emitting element layer 130 (e.g., directly on the light emitting element layer 130 in the third direction DR3). The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence (e.g., in the third direction DR3). However, the embodiments of the present invention are not necessarily limited thereto, and the layers included in the encapsulation layer 140 may vary. The inorganic layer may protect the light emitting element layer 130 from moisture and oxygen, and the organic layer may protect the light emitting element layer 130 from foreign matter such as dust particles. In an embodiment, the inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, and the like. The organic layer may include an acrylic organic layer. However, the embodiments of the present invention are not necessarily limited thereto.
[0168] In an embodiment, the sensor layer 200 may include a base layer 201 , a first conductive layer 202 , an intermediate insulating layer 203 , a second conductive layer 204 , and a cover insulating layer 205 .
[0169] In an embodiment, the base layer 201 may be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the base layer 201 may be an organic layer including epoxy resin, acrylic resin, or imide-based resin. The base layer 201 may have a single-layer structure or a multi-layer structure in which layers are stacked along the third direction DR3.
[0170] In an implementation, each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or a multi-layer structure in which layers are stacked along the third direction DR3 .
[0171] In an embodiment in which each of the first conductive layer 202 and the second conductive layer 204 has a single-layer structure, each of the first conductive layer 202 and the second conductive layer 204 may include a metal layer or a transparent conductive layer. In an embodiment, the metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly (3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, graphene, etc.
[0172] The first conductive layer 202 and the second conductive layer 204, each having a multi-layer structure, may each include a metal layer. For example, the metal layer may have a three-layer structure of titanium / aluminum / titanium. The multi-layer conductive layer may include at least one metal layer and at least one transparent conductive layer.
[0173] In an embodiment of the present inventive concept, the thickness of the first conductive layer 202 (e.g., the length in the third direction DR3) may be greater than or equal to the thickness of the second conductive layer 204 (e.g., the length in the third direction DR3). In an embodiment in which the thickness of the first conductive layer 202 is greater than the thickness of the second conductive layer 204, the resistance of the components included in the first conductive layer 202 may be reduced. In addition, even if the thickness of the first conductive layer 202 is increased, since the first conductive layer 202 may be arranged lower than the second conductive layer 204, the pattern of the first conductive layer 202 may be less likely to be seen than the pattern of the second conductive layer 204 due to external light reflection.
[0174] In an embodiment of the present invention, the width of the first grid lines included in the first conductive layer 202 may be less than or equal to the width of the second grid lines included in the second conductive layer 204. Figure 1A ), since the first grid lines can have a smaller width than the second grid lines, the probability that the first grid lines will be viewed by the user can be reduced.
[0175] At least one of the intermediate insulating layer 203 and the capping insulating layer 205 may include an inorganic film. In an embodiment, the inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.
[0176] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 may include an organic film. In an embodiment, the organic film may include at least one of an acrylic resin (e.g., a methacrylic acid-based resin), a polyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyimide-based resin, a polyamide-based resin, and a perylene-based resin.
[0177] The sensor layer 200 is described above as including the first conductive layer 202 and the second conductive layer 204, that is, two conductive layers in total. However, embodiments of the present inventive concept are not necessarily limited thereto. For example, in some embodiments, the sensor layer 200 may include three or more conductive layers.
[0178] Figure 7 is a plan view of a sensor layer according to an embodiment of the present inventive concept.
[0179] refer to Figure 7 , a sensing region 200A and a peripheral region 200NA adjacent to the sensing region 200A may be defined in the sensor layer 200 .
[0180] The sensor layer 200 may include a plurality of first electrode groups 210G and a plurality of second electrode groups 220G disposed in the sensing region 200A. Each of the first electrode groups 210G may intersect with the second electrode groups 220G. In an embodiment, each of the first electrode groups 210G may extend longitudinally along the second direction DR2, and the first electrode groups 210G may be arranged to be spaced apart from each other in the first direction DR1. Each of the second electrode groups 220G may extend longitudinally along the first direction DR1, and the second electrode groups 220G may be arranged to be spaced apart from each other in the second direction DR2.
[0181] Figure 7Six first electrode groups 210G and ten second electrode groups 220G are shown. However, the number of first electrode groups 210G and the number of second electrode groups 220G are not necessarily limited thereto.
[0182] In an embodiment, the sensor layer 200 may further include a plurality of first traces 210 t and a plurality of second traces 220 t disposed in the peripheral area 200NA.
[0183] In an embodiment of the present inventive concept, the first traces 210t may be electrically connected to the first electrode group 210G in a one-to-one correspondence. For example, one first trace 210t may be connected to one first electrode group 210G. In an embodiment of the present inventive concept, the second traces 220t may be electrically connected to the second electrode group 220G in a one-to-one correspondence. For example, one second trace 220t may be electrically connected to one second electrode group 220G.
[0184] In an embodiment, the second electrode group 220G may include at least one 2-1st electrode group 221G and at least one 2-2nd electrode group 222G. In an embodiment of the present inventive concept, the second electrode group 220G may include a plurality of 2-1st electrode groups 221G and a plurality of 2-2nd electrode groups 222G, and the 2-1st electrode groups 221G and the 2-2nd electrode groups 222G may be arranged alternately (e.g., in the second direction DR2). The 2-1st electrode group 221G may correspond to the second electrode group disposed in the even-numbered positions within the second electrode group 220G, and the 2-2nd electrode group 222G may correspond to the second electrode group disposed in the odd-numbered positions within the second electrode group 220G.
[0185] In an embodiment, the second traces 220t may include at least one first crossing trace 221t and at least one second crossing trace 222t. Among the second traces 220t, the second trace 220t electrically connected to the 2-1st electrode group 221G may be referred to as a first crossing trace 221t. Among the second traces 220t, the second trace 220t electrically connected to the 2-2nd electrode group 222G may be referred to as a second crossing trace 222t.
[0186] The routing directions of the 2-1 electrode group 221G and the 2-2 electrode group 222G can be different from each other. As used herein, different routing directions mean different connection positions of electrodes and traces. For example, the first connection position of the first cross trace 221t electrically connected to the 2-1 electrode group 221G and the second connection position of the second cross trace 222t electrically connected to the 2-2 electrode group 222G can be different from each other. The first connection position can be the right end (for example, in the first direction DR1) of each of the 2-1 electrode group 221G, and the second connection position can be the left end (for example, in the direction opposite to the first direction DR1) of each of the 2-2 electrode group 222G. The side of the 2-1 electrode group 221G corresponding to the first connection position and the side of the 2-2 electrode group 222G corresponding to the second connection position can be arranged in opposite directions relative to the first direction DR1.
[0187] Figure 8 is a diagram illustrating an operation of a sensor driver according to an embodiment of the inventive concept.
[0188] refer to Figure 4 and Figure 8 , the sensor driver 200C may be configured to be selectively driven in any one of a first operation mode DMD1 , a second operation mode DMD2 , and a third operation mode DMD3 .
[0189] The first operating mode DMD1 may be referred to as a touch and pen standby mode, the second operating mode DMD2 may be referred to as a touch-activated and pen standby mode, and the third operating mode DMD3 may be referred to as a pen-activated mode. In an embodiment, the first operating mode DMD1 may be a mode for waiting for the first input 2000 and the second input 3000. The second operating mode DMD2 may be a mode for sensing the first input 2000 and waiting for the second input 3000. The third operating mode DMD3 may be a mode for sensing the second input 3000.
[0190] In an embodiment of the present inventive concept, the sensor driver 200C may be initially driven in the first operating mode DMD1. When a first input 2000 is sensed in the first operating mode DMD1, the sensor driver 200C may be switched (e.g., changed) to the second operating mode DMD2. Alternatively, when a second input 3000 is sensed in the first operating mode DMD1, the sensor driver 200C may be switched (e.g., changed) to the third operating mode DMD3.
[0191] In an embodiment of the present inventive concept, when the second input 3000 is sensed in the second operating mode DMD2, the sensor driver 200C may switch to the third operating mode DMD3. When the first input 2000 is released (e.g., not sensed) in the second operating mode DMD2, the sensor driver 200C may switch to the first operating mode DMD1. When the second input 3000 is released (e.g., not sensed) in the third operating mode DMD3, the sensor driver 200C may switch to the first operating mode DMD1.
[0192] Figure 9 is a diagram illustrating an operation of a sensor driver according to an embodiment of the inventive concept.
[0193] refer to Figure 4 、 Figure 8 and Figure 9 , according to an embodiment of the inventive concept, operations in the first operation mode DMD1 , the second operation mode DMD2 , and the third operation mode DMD3 are illustrated in sequence with time t.
[0194] In an embodiment, in the first operating mode DMD1, the sensor driver 200C may be repeatedly driven in the second mode MD2-d and the first mode MD1-d. During the second mode MD2-d, the sensor layer 200 may be scan-driven to detect the second input 3000. During the first mode MD1-d, the sensor layer 200 may be scan-driven to detect the first input 2000. Figure 9 It is shown that the sensor driver 200C is driven in the second mode MD2-d and then sequentially driven in the first mode MD1-d However, embodiments of the present inventive concept are not necessarily limited thereto, and the order may vary.
[0195] In an embodiment, in the second operating mode DMD2, the sensor driver 200C may be repeatedly driven in the second mode MD2-d and the first mode MD1. During the second mode MD2-d, the sensor layer 200 may be scan-driven to detect the second input 3000. During the first mode MD1, the sensor layer 200 may be scan-driven to detect coordinates based on the first input 2000.
[0196] In the third operating mode DMD3, the sensor driver 200C may be driven in the second mode MD2. During the second mode MD2, the sensor layer 200 may be scan-driven to detect coordinates based on the second input 3000. In the third operating mode DMD3, the sensor driver 200C may not operate in the first mode MD1-d or MD1 until the second input 3000 is released (e.g., not detected).
[0197] Figure 10is a diagram illustrating a portion of a second electrode group according to an embodiment of the present inventive concept.
[0198] refer to Figure 7 、 Figure 9 and Figure 10 In an embodiment, the second electrode group 220G may include a 2-1st electrode group 221G and a 2-2nd electrode group 222G. Figure 10 Two 2-1st electrode groups 221G and two 2-2nd electrode groups 222G are alternately arranged in a one-to-one manner (eg, in the second direction DR2 ).
[0199] The two 2-1 electrode groups 221G may correspond to the electrode group 221G1 disposed in the n-1 position and the electrode group 221G2 disposed in the n+1 position, respectively, and the two 2-2 electrode groups 222G may correspond to the electrode group 222G1 disposed in the n position and the electrode group 222G2 disposed in the n+2 position, respectively. Here, n is a natural number greater than or equal to 2. Hereinafter, the electrode group 221G1 disposed in the n-1 position, the electrode group 222G1 disposed in the n position, the electrode group 221G2 disposed in the n+1 position, and the electrode group 222G2 disposed in the n+2 position are referred to as the first group 221G1, the second group 222G1, the third group 221G2, and the fourth group 222G2, respectively.
[0200] The first crossing traces 221t electrically connected to the first group 221G1 and the third group 221G2 may be referred to as 1-1th crossing traces 221t1 and 1-2nd crossing traces 221t2, respectively, and the second crossing traces 222t electrically connected to the second group 222G1 and the fourth group 222G2 may be referred to as 2-1st crossing traces 222t1 and 2-2nd crossing traces 222t2, respectively.
[0201] In an embodiment, a coupling capacitor Cc may be defined between one 2-1st electrode group 221G and one 2-2nd electrode group 222G adjacent thereto (e.g., in the second direction DR2). In this embodiment, the induced current generated at the time of pen sensing can be transmitted from the 2-1st electrode group 221G to the 2-2nd electrode group 222G, or from the 2-2nd electrode group 222G to the 2-1st electrode group 221G, via the coupling capacitor Cc. For example, the 2-1st electrode group 221G can be used to supplement the signal transmitted from the 2-2nd electrode group 222G to the sensor driver 200C, and the 2-2nd electrode group 222G can be used to supplement the signal transmitted from the 2-1st electrode group 221G to the sensor driver 200C.
[0202] The second mode MD2-d or the second mode MD2 may include a pen sensing drive mode. In an embodiment, in the pen sensing drive mode, the sensor layer 200 and the sensor driver 200C may sense an induced current generated by a magnetic field emitted from the pen PN. In an embodiment, in the pen sensing drive mode, the sensor driver 200C may be configured to receive a first signal SG1 from the 2-1 electrode group 221G and to receive a second signal SG2 from the 2-2 electrode group 222G. For example, the first signal SG1 may include a 1-1 signal Sn-1 and a 1-2 signal Sn+1 received from the first group 221G1 and the third group 221G2, respectively. The second signal SG2 may include a 2-1 signal Sn and a 2-2 signal Sn+2 received from the second group 222G1 and the fourth group 222G2, respectively.
[0203] Figure 11 is an equivalent circuit diagram illustrating a relationship between one second electrode group and a pen according to an embodiment of the inventive concept. Figure 12 is a graph showing the magnitude of the current versus the position of the pen relative to one channel. Figure 13 is a graph showing the magnitude of the output signal versus the position of the pen relative to one channel.
[0204] refer to Figure 10 and Figure 11 , the 2-1st electrode group 221G (e.g., the first group 221G1) may be electrically connected to the sensor driver 200C through the first node ND1, and the 2-2nd electrode group 222G (e.g., the second group 222G1) may be electrically connected to the sensor driver 200C through the fourth node ND4. In an embodiment, the first node ND1 may be the right node of the 2-1st electrode group 221G (e.g., the first group 221G1), and the fourth node ND4 may be the left node of the 2-2nd electrode group 222G (e.g., the second group 222G1).
[0205] A plurality of coupling capacitors Cc may be defined between the 2-1st electrode group 221G and the 2-2nd electrode group 222G adjacent to each other (eg, in the second direction DR2). Figure 10 and Figure 11 , five coupling capacitors Cc are shown defined between adjacent 2-1st electrode group 221G and 2-2nd electrode group 222G, such as between the first group 221G1 and the second group 222G1. However, embodiments of the present inventive concept are not necessarily limited thereto, and the number of capacitors may vary.
[0206] In an embodiment, five first basic capacitors Cb11 and Cb12 may be defined in the 2-1st electrode group 221G (e.g., the first group 221G1), and five second basic capacitors Cb21 and Cb22 may also be defined in the 2-2nd electrode group 222G (e.g., the second group 222G1). The number of the first basic capacitors Cb11 and Cb12 may be the same as the number of the first sensing patterns 221sp (see FIG. 221 ) to be described later. Figure 18 ), and the number of the second basic capacitors Cb21 and Cb22 may correspond to the number of the second sensing patterns 222sp (see Figure 18 ) corresponds to the number of ).
[0207] If the pen PN approaches the 2-1st electrode group 221G and the 2-2nd electrode group 222G adjacent to each other, a first induced electromotive force v may be generated in the 2-1st electrode group 221G due to the magnetic field generated from the pen PN. n-1 (t), and a second induced electromotive force v can be generated in the 2-2 electrode group 222G n (t).
[0208] Due to the induced electromotive force v n-1 (t) and v n (t), a first induced current Ia, a second induced current Ib, and a third induced current Ic may be generated in the 2-1st electrode group 221G and the 2-2nd electrode group 222G. The first signal SG1 may correspond to the sum of the first induced current Ia and the second induced current Ib, and the second signal SG2 may correspond to the negative value of the sum of the second induced current Ib and the third induced current Ic. Figure 11 and Figure 12 shows a situation in which the pen PN approaches the first group 221G1 and the second group 222G1, and Figure 13 The 1-1th signal Sn-1 of the first signal SG1 received from the first group 221G1 and the 2-1th signal Sn of the second signal SG2 received from the second group 222G1 are shown.
[0209] For example, the capacitance of each of the first base capacitors Cb11 and Cb12 and the capacitance of each of the second base capacitors Cb21 and Cb22 are Cb, and the capacitance of the coupling capacitor Cc is Cc.
[0210] In an embodiment, the first node ND1 and the fourth node ND4 connected to the sensor driver 200C may be grounded. In addition, the voltage of the second node ND2 corresponding to the left end of the 2-1st electrode group 221G (eg, the first group 221G1) may be v n-1(t), and the voltage of the third node ND3 corresponding to the right end of the 2-2 electrode group 222G (for example, the second group 222G1) may be -v n (t) Therefore, since the voltage across both ends of the first basic capacitor Cb11 and the second basic capacitor Cb21 may be grounded, current may not flow.
[0211] The first induced current Ia according to time can be expressed as the following formula.
[0212]
[0213] The second induced current Ib according to time can be expressed as the following formula.
[0214]
[0215] The third induced current Ic according to time can be expressed as the following formula.
[0216]
[0217] The first signal SG1 (eg, 1-1th signal Sn-1) may correspond to -Ia(t)-Ic(t), and the second signal SG2 (eg, 2-1th signal Sn) may correspond to Ib(t)+Ic(t).
[0218] refer to Figure 11 、 Figure 12 and Figure 13 As the position of the pen PN moves from the first node ND1 toward the second node ND2, the first induced current Ia can gradually decrease, and the third induced current Ic can be substantially the same. According to this embodiment, due to the coupling capacitor Cc, the third induced current Ic can be additionally generated. Therefore, compared to the induced current in the comparative embodiment in which the coupling capacitor Cc is not generated, the total induced current can be increased, and the magnitude of the total induced current can be sufficient for sensing input performed by the pen PN. For example, even if the position of the pen PN is close to the second node ND2, which is located away from the connection position with the 1-1 cross trace 221t1, the magnitude of the total induced current can be ensured to be greater than or equal to a predetermined value, thereby sufficiently sensing input performed by the pen PN.
[0219] As the position of the pen PN moves from the fourth node ND4 toward the third node ND3, the second induced current Ib can gradually decrease, and the third induced current Ic can be substantially the same. According to this embodiment, the third induced current Ic can be additionally generated due to the coupling capacitor Cc. Therefore, compared to the induced current in the comparative embodiment in which the coupling capacitor Cc is not generated, the total induced current can be increased, and the magnitude of the total induced current can be sufficient for sensing input performed by the pen PN. For example, even if the position of the pen PN is close to the third node ND3, which is located away from the connection position with the 2-1st intersection trace 222t1, the magnitude of the total induced current can be ensured to be greater than or equal to a predetermined value, and input performed by the pen PN can be sufficiently sensed.
[0220] Therefore, the sensor driver 200C can stably receive a signal from the electrode regardless of the distance between the input terminal and the area in which the input by the pen PN is input. As a result, the electronic device 1000 with increased sensing sensitivity can be provided (see Figure 1A ).
[0221] Furthermore, according to an embodiment of the present inventive concept, coupling capacitors may be defined (e.g., provided or formed) between adjacent electrode groups in at least one electrode group in the sensor layer 200, thereby sensing both touch input and pen input. This increases the degree of freedom in designing the electrodes in the sensor layer 200 and facilitates securing bandwidth.
[0222] Figure 14 is a diagram illustrating four second electrode groups and a portion of a sensor driver according to an embodiment of the inventive concept.
[0223] refer to Figure 7 and Figure 14 In an embodiment, the sensor driver 200C may include a first differential amplifier DAP1 and a second differential amplifier DAP2.
[0224] In an embodiment, in the pen sensing driving mode, the first differential amplifier DAP1 may receive a signal from the 2-2 th electrode group 222G, and the second differential amplifier DAP2 may receive a signal from the 2-1 th electrode group 221G.
[0225] In an embodiment, in the pen sensing driving mode, the inverting terminal of the first differential amplifier DAP1 may be electrically connected to the fourth group 222G2 via the 2-2nd crossing trace 222t2, and the non-inverting terminal of the first differential amplifier DAP1 may be electrically connected to the second group 222G1 via the 2-1st crossing trace 222t1. For example, the inverting terminal and the non-inverting terminal of the first differential amplifier DAP1 may be electrically connected to two different 2-2nd electrode groups 222G, such as the first 2-2nd electrode group and the second 2-2nd electrode group.
[0226] Figure 14 The diagram shows that two adjacent 2-2 electrode groups 222G (e.g., the second group 222G1 and the fourth group 222G2) among the 2-2 electrode groups 222G are configured as two 2-2 electrode groups 222G, respectively, electrically connected to the inverting terminal and the non-inverting terminal of a first differential amplifier DAP1. However, embodiments of the present inventive concept are not necessarily limited thereto. For example, in some embodiments, two 2-2 electrode groups 222G that are spaced apart from each other (e.g., in the second direction DR2) with at least one 2-2 electrode group 222G therebetween can be configured as two 2-2 electrode groups 222G, respectively, electrically connected to the inverting terminal and the non-inverting terminal of a first differential amplifier DAP1.
[0227] In an embodiment, in the pen sensing driving mode, the inverting terminal of the second differential amplifier DAP2 may be electrically connected to the first group 221G1 via the 1-1th crossing trace 221t1, and the non-inverting terminal of the second differential amplifier DAP2 may be electrically connected to the third group 221G2 via the 1-2th crossing trace 221t2. For example, the inverting terminal and the non-inverting terminal of the second differential amplifier DAP2 may be electrically connected to two different 2-1th electrode groups 221G, such as the first 2-1th electrode group and the second 2-1th electrode group.
[0228] Figure 14 The diagram shows two adjacent 2-1 electrode groups 221G (e.g., the first group 221G1 and the third group 221G2) among the 2-1 electrode groups 221G, each of which is electrically connected to the inverting terminal and the non-inverting terminal of a second differential amplifier DAP2. However, embodiments of the present inventive concept are not necessarily limited thereto. For example, in some embodiments, two 2-1 electrode groups 221G that are spaced apart from each other (e.g., in the second direction DR2) with at least one 2-1 electrode group 221G therebetween can be configured as two 2-1 electrode groups 221G that are electrically connected to the inverting terminal and the non-inverting terminal of a second differential amplifier DAP2, respectively.
[0229] Figure 15Ais a graph illustrating currents sensed in a plurality of channels according to an embodiment of the inventive concept. Figure 15B is a graph illustrating currents obtained from differential pairs of multiple channels according to an embodiment of the inventive concept.
[0230] refer to Figure 7 and Figure 15A , the directions of the currents sensed from the channels that are spaced apart from each other and between which the position of the pen PN is positioned may be different. In an embodiment, the channels may correspond to the second electrode groups 220G, respectively. Therefore, the direction of the current flowing to the channel on the left side relative to the position of the pen PN and the direction of the current flowing to the channel on the right side relative to the position of the pen PN may be different. Therefore, the sensor driver 200C can sense currents flowing in directions different from each other relative to the position of the pen PN. If the pen PN is positioned exactly above one second electrode group 220G, the signal sensed from the one second electrode group 220G may be "0". For example, as referenced Figure 10 As described, if coordinates are calculated using the output signal SG1 or SG2 obtained from one second electrode group 220G, the size of a signal received from one second electrode group 220G directly corresponding to the position of the pen PN may be “0”.
[0231] refer to Figure 10 、 Figure 14 and Figure 15B , the output signal Soutl or Soutr is a signal obtained from two or more electrode groups 221G and 222G. For example, current can be sensed by differential sensing of channels adjacent to each other (for example, in the second direction DR2) or channels spaced apart from each other. In an embodiment, the coordinates of the pen PN can be relatively easily calculated based on the centroid method or the maximum point of the trend line. Figure 14 The output signal Sout1 (or second output signal) output from the first differential amplifier DAP1 may be a signal obtained from the 2-2nd electrode group 222G, and the output signal Soutr (or first output signal) output from the second differential amplifier DAP2 may be a signal obtained from the 2-1st electrode group 221G. Therefore, current can be sensed by differential sensing of the channel corresponding to the 2-2nd electrode group 222G, and current can be sensed by differential sensing of the channel corresponding to the 2-1st electrode group 221G.
[0232] Figure 14The differential operation is shown as being implemented via differential amplifiers DAP1 and DAP2. However, embodiments of the present inventive concept are not necessarily limited thereto. For example, in an embodiment, data can be obtained by converting an analog signal received from the 2-1st electrode group 221G into a first digital signal and performing a differential operation on the first digital signal. Data can also be obtained by converting an analog signal received from the 2-2nd electrode group 222G into a second digital signal and performing a differential operation on the second digital signal.
[0233] Figure 16A and Figure 16B is a graph illustrating currents obtained from a differential pair of a 2-1th electrode group and currents obtained from a differential pair of a 2-2th electrode group according to an embodiment of the inventive concept.
[0234] refer to Figure 14 、 Figure 16A and Figure 16B In an embodiment of the present inventive concept, the sensor driver 200C may further include a charge voltage amplifier, and the sensor driver 200C may be configured to change a gain applied to each of the 2-1st electrode group 221G and the 2-2nd electrode group 222G according to a position of an active area.
[0235] For example, if the position of the pen PN is set relatively to the left (for example, in the direction opposite to the first direction DR1), then Figure 16A As shown in FIG, the magnitude of the second output signal Sout1 obtained from the 2-2 electrode group 222G may be greater than the magnitude of the first output signal Soutr obtained from the 2-1 electrode group 221G. In this embodiment, the sensor driver 200C may amplify the first output signal Soutr obtained from the 2-1 electrode group 221G with a predetermined gain value. In an embodiment, the sensor driver 200C may adjust the gain value, and for example, the gain value may be adjusted to a value that amplifies the magnitude of the first output signal Soutr obtained from the 2-1 electrode group 221G so as to be substantially the same as the magnitude of the second output signal Sout1 obtained from the 2-2 electrode group 222G. Figure 16B The current of the output signal Soutr_g obtained by amplifying the first output signal Soutr obtained from the 2-1th electrode group 221G with a predetermined gain value is shown.
[0236] In an embodiment, if the position of the pen PN is set to the right (for example, in the first direction DR1), the magnitude of the first output signal Soutr obtained from the 2-1st electrode group 221G may be greater than the magnitude of the second output signal Soutl obtained from the 2-2nd electrode group 222G. In this case, the sensor driver 200C may amplify the second output signal Soutl obtained from the 2-2nd electrode group 222G with a predetermined gain value. In an embodiment, the sensor driver 200C may adjust the gain value, and for example, the gain value may be adjusted to a value that amplifies the magnitude of the second output signal Soutl obtained from the 2-2nd electrode group 222G so that it is substantially the same as the magnitude of the first output signal Soutr obtained from the 2-1st electrode group 221G.
[0237] Figure 17 is a plan view illustrating a portion of a sensor layer according to an embodiment of the present inventive concept.
[0238] refer to Figure 7 、 Figure 9 and Figure 17 In an embodiment, the sensor layer 200 may include a first electrode group 210Ga and a second electrode group 220Ga.
[0239] The second electrode group 220Ga may include at least one 2-1st electrode group 221Ga and at least one 2-2nd electrode group 222Ga. For example, in an embodiment of the present inventive concept, the second electrode group 220Ga may include a plurality of 2-1st electrode groups 221Ga and a plurality of 2-2nd electrode groups 222Ga, and the 2-1st electrode groups 221Ga and the 2-2nd electrode groups 222Ga may be arranged alternately (e.g., in the second direction DR2). In an embodiment, the 2-1st electrode group 221Ga may correspond to the second electrode group 220Ga disposed in an even-numbered position within the second electrode group 220Ga, and the 2-2nd electrode group 222Ga may correspond to the second electrode group 220Ga disposed in an odd-numbered position within the second electrode group 220Ga.
[0240] The first electrode group 210Ga may include at least one 1-1 electrode group 211G and at least one 1-2 electrode group 212G. For example, in an embodiment of the present inventive concept, the first electrode group 210Ga may include a plurality of 1-1 electrode groups 211G and a plurality of 1-2 electrode groups 212G, and the 1-1 electrode groups 211G and the 1-2 electrode groups 212G may be arranged alternately (for example, in the first direction DR1). In an embodiment, the 1-1 electrode group 211G may correspond to the first electrode group 210Ga disposed in an odd-numbered position within the first electrode group 210Ga, and the 1-2 electrode group 212G may correspond to the first electrode group 210Ga disposed in an even-numbered position within the first electrode group 210Ga.
[0241] In an embodiment, the 2-1st electrode group 221Ga may be electrically connected to the first intersecting trace 221t disposed on the right side (e.g., in the first direction DR1) of the 2-1st electrode group 221Ga, and the 2-2nd electrode group 222Ga may be electrically connected to the second intersecting trace 222t disposed on the left side (e.g., in a direction opposite to the first direction DR1) of the 2-2nd electrode group 222Ga. The 1-1st electrode group 211G may be electrically connected to the third intersecting trace 211t disposed on the upper side (e.g., in the second direction DR2) of the 1-1st electrode group 211G, and the 1-2nd electrode group 212G may be electrically connected to the fourth intersecting trace 212t disposed on the lower side (e.g., in a direction opposite to the second direction DR2) of the 1-2nd electrode group 212G.
[0242] In an embodiment, the second mode MD2-d or the second mode MD2 may include a pen sensing drive mode. In the pen sensing drive mode, the sensor layer 200 and the sensor driver 200C may sense an induced current generated due to a magnetic field emitted from the pen PN. In an embodiment, in the pen sensing drive mode, the sensor driver 200C may be configured to receive a first signal SG1 from the 2-1 electrode group 221Ga, configured to receive a second signal SG2 from the 2-2 electrode group 222Ga, configured to receive a third signal SG3 from the 1-1 electrode group 211G and configured to receive a fourth signal SG4 from the 1-2 electrode group 212G. In the pen sensing drive mode, the sensor driver 200C may process the signal as described in reference Figure 10 、 Figure 14 or Figure 16B Described are the first signal SG1, the second signal SG2, the third signal SG3 and the fourth signal SG4.
[0243] Figure 18 is a plan view illustrating four sensing units according to an embodiment of the inventive concept. Figure 19Ais a plan view illustrating a second conductive layer of four sensing units according to an embodiment of the inventive concept. Figure 19B is a plan view illustrating a first conductive layer of four sensing units according to an embodiment of the inventive concept.
[0244] refer to Figure 17 、 Figure 18 、 Figure 19A and Figure 19B In an embodiment of the present inventive concept, the 2-1st electrode group 221Ga may include the first sensing electrode 221cea, and the 2-2nd electrode group 222Ga may include the second sensing electrode 222cea. The 1-1st electrode group 211G may include the third sensing electrode 211ce, and the 1-2nd electrode group 212G may include the fourth sensing electrode 212ce.
[0245] In an embodiment, the first sensing electrode 221cea may include a first sensing pattern 221sp, a first bridge pattern 221bp, a first cross pattern 221cp, and a first extension pattern 221ep. The second sensing electrode 222cea may include a second sensing pattern 222sp, a second bridge pattern 222bp, a second cross pattern 222cp, and a second extension pattern 222ep. In an embodiment, the third sensing electrode 211ce may include a third sensing pattern 211sp, a third bridge pattern 211bp, a third cross pattern 211cp, and a third extension pattern 211ep. The fourth sensing electrode 212ce may include a fourth sensing pattern 212sp, a fourth bridge pattern 212bp, a fourth cross pattern 212cp, and a fourth extension pattern 212ep.
[0246] In an embodiment, the first sensing pattern 221sp, the first bridge pattern 221bp, the second sensing pattern 222sp, the second bridge pattern 222bp, the third sensing pattern 211sp, the third extension pattern 211ep, the fourth sensing pattern 212sp, and the fourth extension pattern 212ep may be disposed on the same layer as each other and, for example, may be included in the second conductive layer 204 (see Figure 6 The first intersection pattern 221cp, the first extension pattern 221ep, the second intersection pattern 222cp, the second extension pattern 222ep, the third bridge pattern 211bp, the third intersection pattern 211cp, the fourth bridge pattern 212bp, and the fourth intersection pattern 212cp may be provided on the same layer as each other, and, for example, may be included in the first conductive layer 202 (see Figure 6 )middle.
[0247] The first sensing patterns 221sp may be spaced apart from each other in the first direction DR1. The first sensing patterns 221sp adjacent to each other in the first direction DR1 may be electrically connected to each other via a first bridge pattern 221bp. In an embodiment of the present inventive concept, the first sensing patterns 221sp spaced apart from each other in the first direction DR1 and the first bridge pattern 221bp connecting the first sensing patterns 221sp may have an integral shape, and the first bridge pattern 221bp may be referred to as a first connection pattern or a first intermediate pattern.
[0248] In an embodiment, the second sensing patterns 222sp may be spaced apart from each other in the first direction DR1. The second sensing patterns 222sp adjacent to each other in the first direction DR1 may be electrically connected to each other via a second bridge pattern 222bp. In an embodiment of the present inventive concept, the second sensing patterns 222sp spaced apart from each other in the first direction DR1 and the second bridge pattern 222bp connecting the second sensing patterns 222sp may have an integral shape, and the second bridge pattern 222bp may be referred to as a second connection pattern or a second intermediate pattern.
[0249] In an embodiment, the third sensing patterns 211sp may be spaced apart from each other in the second direction DR2. The third sensing patterns 211sp adjacent to each other in the second direction DR2 may be electrically connected to each other through a third bridge pattern 211bp. In an embodiment of the present inventive concept, the third sensing patterns 211sp adjacent to each other in the second direction DR2 and the third bridge pattern 211bp connecting the third sensing patterns 211sp may be disposed on different layers from each other, and may be electrically connected to each other by being defined in the intermediate insulating layer 203 (see FIG. Figure 6 ) in the via connection.
[0250] In an embodiment, the fourth sensing patterns 212sp may be spaced apart from each other in the second direction DR2. The fourth sensing patterns 212sp adjacent to each other in the second direction DR2 may be electrically connected to each other through a fourth bridge pattern 212bp. In an embodiment of the present inventive concept, the fourth sensing patterns 212sp adjacent to each other in the second direction DR2 and the fourth bridge pattern 212bp connecting the fourth sensing patterns 212sp may be disposed on different layers from each other, and may be electrically connected to each other by being defined in the intermediate insulating layer 203 (see FIG. 2 ). Figure 6 ) in the via connection.
[0251] The first cross pattern 221cp may be electrically connected to the first sensing pattern 221sp. The first sensing patterns 221sp may be electrically connected to each other through the first extension pattern 221ep. In an embodiment of the present invention, each of the first extension patterns 221ep may extend from the corresponding first cross pattern 221cp. For example, in an embodiment, each of the first extension patterns 221ep may have a shape that is integral with the corresponding first cross pattern 221cp. Each of the first extension patterns 221ep and the corresponding first sensing pattern 221sp may be provided on different layers from each other, and by being defined in the intermediate insulating layer 203 (see Figure 6 ) in the via connection.
[0252] In an embodiment, two first intersection patterns 221cp may be electrically connected to one first sensing pattern 221sp. The one first sensing pattern 221sp may be connected to two first extension patterns 221ep extending from the two first intersection patterns 221cp, respectively. One of the two first intersection patterns 221cp may overlap (for example, in a plan view) with a second sensing pattern 222sp spaced apart from the one first sensing pattern 221sp in the second direction DR2. The other of the two first intersection patterns 221cp may overlap (for example, in a plan view) with a second sensing pattern 222sp spaced apart from the one first sensing pattern 221sp in a direction opposite to the second direction DR2.
[0253] The second cross pattern 222cp may be electrically connected to the second sensing pattern 222sp. The second sensing patterns 222sp may be electrically connected to each other through the second extension pattern 222ep. In an embodiment of the present invention, each of the second extension patterns 222ep may extend from the corresponding second cross pattern 222cp. For example, in an embodiment, each of the second extension patterns 222ep may have a shape that is integral with the corresponding second cross pattern 222cp. In an embodiment, each of the second extension patterns 222ep and the corresponding second sensing pattern 222sp may be provided on different layers from each other, and by being defined in the intermediate insulating layer 203 (see Figure 6 ) in the via connection.
[0254] In an embodiment, two second intersection patterns 222cp may be electrically connected to one second sensing pattern 222sp. The one second sensing pattern 222sp may be connected to two second extension patterns 222ep extending from the two second intersection patterns 222cp, respectively. One of the two second intersection patterns 222cp may overlap (for example, in a plan view) with a first sensing pattern 221sp spaced apart from the one second sensing pattern 222sp in the second direction DR2. The other of the two second intersection patterns 222cp may overlap (for example, in a plan view) with a first sensing pattern 221sp spaced apart from the one second sensing pattern 222sp in a direction opposite to the second direction DR2.
[0255] The third cross pattern 211cp may be electrically connected to the third sensing pattern 211sp. The third sensing patterns 211sp may be electrically connected to each other through the third extension pattern 211ep. In an embodiment of the present invention, each of the third extension patterns 211ep may extend from the corresponding third sensing pattern 211sp. For example, in an embodiment, each of the third extension patterns 211ep may have a shape that is integral with the corresponding third sensing pattern 211sp. In an embodiment, each of the third extension patterns 211ep and the corresponding third cross pattern 211cp may be provided on different layers from each other and may be formed by being defined on the intermediate insulating layer 203 (see Figure 6 ) in the via connection.
[0256] In an embodiment, two third intersection patterns 211cp may be electrically connected to one third sensing pattern 211sp. The one third sensing pattern 211sp may be connected to the two third intersection patterns 211cp via two third extension patterns 211ep extending from the one third sensing pattern 211sp. One of the two third intersection patterns 211cp may (for example, in a plan view) overlap with a fourth sensing pattern 212sp spaced apart from the one third sensing pattern 211sp in the first direction DR1. The other of the two third intersection patterns 211cp may (for example, in a plan view) overlap with a fourth sensing pattern 212sp spaced apart from the one third sensing pattern 211sp in a direction opposite to the first direction DR1.
[0257] The fourth cross pattern 212cp may be electrically connected to the fourth sensing pattern 212sp. The fourth sensing patterns 212sp may be electrically connected to each other through the fourth extension pattern 212ep. In an embodiment of the present invention, each of the fourth extension patterns 212ep may extend from the corresponding fourth sensing pattern 212sp. For example, in an embodiment, each of the fourth extension patterns 212ep may have a shape that is integral with the corresponding fourth sensing pattern 212sp. In an embodiment, each of the fourth extension patterns 212ep and the corresponding fourth cross pattern 212cp may be provided on different layers from each other and may be formed by being defined on the intermediate insulating layer 203 (see Figure 6 ) in the via connection.
[0258] In an embodiment, two fourth intersection patterns 212cp may be electrically connected to one fourth sensing pattern 212sp. The one fourth sensing pattern 212sp may be connected to the two fourth intersection patterns 212cp via two fourth extension patterns 212ep extending from the one fourth sensing pattern 212sp. One of the two fourth intersection patterns 212cp may (for example, in a plan view) overlap with a third sensing pattern 211sp spaced apart from the one fourth sensing pattern 212sp in the first direction DR1. The other of the two fourth intersection patterns 212cp may (for example, in a plan view) overlap with a third sensing pattern 211sp spaced apart from the one fourth sensing pattern 212sp in a direction opposite to the first direction DR1.
[0259] Since the first intersection pattern 221cp can be arranged to overlap with a portion of the second sensing pattern 222sp (for example, in a plan view), and the second intersection pattern 222cp can be arranged to overlap with a portion of the first sensing pattern 221sp (for example, in a plan view), a coupling capacitor can be defined between the adjacent 2-1 electrode group 221Ga and the 2-2 electrode group 222Ga. Since the third intersection pattern 211cp can be arranged to overlap with a portion of the fourth sensing pattern 212sp (for example, in a plan view), and the fourth intersection pattern 212cp can be arranged to overlap with a portion of the third sensing pattern 211sp (for example, in a plan view), a coupling capacitor can be defined between the adjacent 1-1 electrode group 211G and the 1-2 electrode group 212G.
[0260] Figure 18 The four sensing units shown in FIG. 5 may be repeatedly arranged along the first direction DR1 and the second direction DR2 .
[0261] Figure 19A and Figure 19BThe patterns shown in the figure may each have a grid structure. The grid structures may each include a plurality of grid lines. In an embodiment, the plurality of grid lines may each have a straight line shape extending in a predetermined direction and may be connected to each other. However, embodiments of the present inventive concept are not necessarily limited thereto. For example, in an embodiment, at least a portion of each of the plurality of grid lines may have a curved shape.
[0262] Figure 20 is a plan view illustrating four sensing units according to an embodiment of the inventive concept. Figure 21A is a plan view illustrating a second conductive layer of four sensing units according to an embodiment of the inventive concept. Figure 21B is a plan view illustrating a first conductive layer of four sensing units according to an embodiment of the inventive concept.
[0263] refer to Figure 17 、 Figure 20 、 Figure 21A and Figure 21B In an embodiment, the first sensing electrode 221cea may include a first sensing pattern 221sp, a first bridge pattern 221bp, a first cross pattern 221cp, and a first extension pattern 221ep. The second sensing electrode 222cea may include a second sensing pattern 222sp, a second bridge pattern 222bp, a second cross pattern 222cp, and a second extension pattern 222ep. In an embodiment, the third sensing electrode 211ce may include a third sensing pattern 211sp, a third bridge pattern 211bp, a third cross pattern 211cp, and a third extension pattern 211ep. The fourth sensing electrode 212ce may include a fourth sensing pattern 212sp, a fourth bridge pattern 212bp, a fourth cross pattern 212cp, and a fourth extension pattern 212ep.
[0264] In an embodiment, the first sensing pattern 221sp, the first crossing pattern 221cp, the second sensing pattern 222sp, the second crossing pattern 222cp, the third sensing pattern 211sp, the third bridge pattern 211bp, the third crossing pattern 211cp, the third extension pattern 211ep, the fourth sensing pattern 212sp, the fourth bridge pattern 212bp, the fourth crossing pattern 212cp, and the fourth extension pattern 212ep may be provided on the same layer as each other, and, for example, may be included in the second conductive layer 204 (see Figure 4 The first bridge pattern 221bp, the first extension pattern 221ep, the second bridge pattern 222bp, and the second extension pattern 222ep may be provided on the same layer as each other, and, for example, may be included in the first conductive layer 202 (see Figure 4 )middle.
[0265] In an embodiment, the first bridge pattern 221bp and the second bridge pattern 222bp and the third bridge pattern 211bp and the fourth bridge pattern 212bp may be insulated from each other (e.g., electrically insulated) and may cross each other. The first bridge pattern 221bp and the second bridge pattern 222bp and the third bridge pattern 211bp and the fourth bridge pattern 212bp may be provided on different layers. In an embodiment, the first bridge pattern 221bp and the second bridge pattern 222bp may be included in the second conductive layer 204 (see Figure 4 ), and the third bridge pattern 211bp and the fourth bridge pattern 212bp may be included in the first conductive layer 202 (see Figure 4 ). In this embodiment, the first bridge pattern 221bp may have a shape integral with the first sensing pattern 221sp, and the second bridge pattern 222bp may have a shape integral with the second sensing pattern 222sp. However, embodiments of the present inventive concept are not necessarily limited thereto. For example, in an embodiment, the first bridge pattern 221bp and the second bridge pattern 222bp may be included in the first conductive layer 202 (see Figure 4 ), and the third bridge pattern 211bp and the fourth bridge pattern 212bp may be included in the second conductive layer 204 (see Figure 4 In this embodiment, the third bridging pattern 211bp may have a shape integral with the third sensing pattern 211sp, and the fourth bridging pattern 212bp may have a shape integral with the fourth sensing pattern 212sp.
[0266] In an embodiment of the present inventive concept, at least one opening 221-op and 222-op may be defined in each of the first and second sensing patterns 221sp and 222sp, and at least one recess portion 211-rp and 212-rp may be defined in each of the third and fourth sensing patterns 211sp and 212sp. Figure 21A It is shown that two openings 221 -op and 222 -op are defined in each of the first and second sensing patterns 221 sp and 222 sp, and two recessed portions 211 -rp and 212 -rp are defined in each of the third and fourth sensing patterns 211 sp and 212 sp.
[0267] In an embodiment of the present invention, the first sensing pattern 221sp, the second sensing pattern 222sp, the third sensing pattern 211sp, and the fourth sensing pattern 212sp, as well as the first cross pattern 221cp, the second cross pattern 222cp, the third cross pattern 211cp, and the fourth cross pattern 212cp may be arranged on the same layer as each other. For example, in an embodiment, the second cross pattern 222cp may be arranged in each of the openings 221-op of the first sensing pattern 221sp. The outer edge of the second cross pattern 222cp may be surrounded by the first sensing pattern 221sp (for example, in a plan view). The first cross pattern 221cp may be arranged in each of the openings 222-op of the second sensing pattern 222sp. The outer edge of the first cross pattern 221cp may be surrounded by the second sensing pattern 222sp (for example, in a plan view). Therefore, a coupling capacitor may be defined between the 2-1 electrode group 221Ga and the 2-2 electrode group 222Ga adjacent to each other.
[0268] In an embodiment, a fourth cross pattern 212cp may be provided in each of the recessed portions 211-rp of the third sensing pattern 211sp. The outer edge of the fourth cross pattern 212cp may be surrounded by the third sensing pattern 211sp (e.g., in a plan view). The third cross pattern 211cp may be provided in each of the recessed portions 212-rp of the fourth sensing pattern 212sp. The outer edge of the third cross pattern 211cp may be surrounded by the fourth sensing pattern 212sp (e.g., in a plan view). Thus, a coupling capacitor may be defined between the adjacent 1-1 electrode group 211G and the 1-2 electrode group 212G.
[0269] Figure 21A and Figure 21B The patterns shown in the figure may each have a grid structure. The grid structures may each include a plurality of grid lines. In an embodiment, the plurality of grid lines may each have a straight line shape extending in a predetermined direction and may be connected to each other. However, embodiments of the present inventive concept are not necessarily limited thereto. In an embodiment, at least a portion of each of the plurality of grid lines may have a curved shape.
[0270] Figure 22 is a plan view illustrating a portion of a sensor layer according to an embodiment of the present inventive concept.
[0271] refer to Figure 7 and Figure 22 The sensor layer 200 may further include a plurality of auxiliary electrodes 230s (eg, in plan view) respectively overlapping the first electrode groups 210Gb. Furthermore, the sensor layer 200 may further include connection traces 230ct that connect (eg, electrically connect) the auxiliary electrodes 230s of the sensor layer 200 to each other.
[0272] In an embodiment, the connection trace 230ct and the first trace 210t may be spaced apart from each other (e.g., in the second direction DR2) with the first electrode group 210Gb and the auxiliary electrode 230s therebetween. For example, the routing direction of the first electrode group 210Gb and the routing direction of the auxiliary electrode 230s may be different.
[0273] According to an embodiment of the inventive concept, one first electrode group 210Gb may cross each of the 2-1st electrode group 221Ga and the 2-2nd electrode group 222Ga, and one auxiliary electrode 230s may cross each of the 2-1st electrode group 221Ga and the 2-2nd electrode group 222Ga.
[0274] The auxiliary electrodes 230s can be used to supplement the signals transmitted from the first electrode group 210Gb to the sensor driver 200C. Therefore, the maximum effect can be achieved when the signals sensed by the auxiliary electrodes 230s and the signals sensed by the first electrode group 210Gb are in phase. Therefore, the center of each of the first electrode groups 210Gb in the second direction DR2 can overlap with the center of each of the auxiliary electrodes 230s in the second direction DR2. Furthermore, the center of each of the first electrode groups 210Gb in the first direction DR1 and the center of each of the auxiliary electrodes 230s in the first direction DR1 can overlap with each other.
[0275] In an embodiment of the present inventive concept, the first electrode group 210Gb, the second electrode group 220Ga, and the auxiliary electrode 230s may be individually disposed on the two conductive layers 202 and 204 (see FIG. Figure 6 ). Figures 26 to 29B Describe it.
[0276] In an embodiment of the present inventive concept, the first electrode group 210Gb and the second electrode group 220Ga may be individually disposed in the two conductive layers 202 and 204, and the auxiliary electrode 230s may be included in a third conductive layer disposed below the two conductive layers 202 and 204 (e.g., in the third direction DR3). The third conductive layer may be disposed in the base layer 201 (see FIG. Figure 6 ). For example, the third conductive layer may be provided below the base layer 201 and the display layer 100 (see Figure 6 ), arranged below the display layer 100, or included in the display layer 100.
[0277] Figure 23 is a schematic diagram illustrating one channel according to an embodiment of the present inventive concept. Figure 24 is an equivalent circuit diagram illustrating a relationship between one channel and a pen according to an embodiment of the inventive concept.
[0278] refer to Figure 22 、 Figure 23 and Figure 24 , one first electrode group 210Gb and one auxiliary electrode 230s are shown. When viewed in the third direction DR3 (eg, in a plan view), the first electrode group 210Gb and the auxiliary electrode 230s may overlap each other.
[0279] In an embodiment, one end (e.g., the first end) of the auxiliary electrode 230s may be floating (e.g., electrically insulated), and the other end (e.g., the second end) of the auxiliary electrode 230s may be grounded. For example, the other end (e.g., the second end) of the auxiliary electrode 230s may be electrically connected to a connection trace 230ct, and the connection trace 230ct may be grounded. However, embodiments of the present inventive concept are not necessarily limited thereto. For example, in an embodiment, the connection trace 230ct may be grounded via a bias capacitor.
[0280] Capacitors Cbc1, Cbc2, Cbc3, and Cbc4 may be defined in the first electrode group 210Gb. Capacitors Cbc1, Cbc2, Cbc3, and Cbc4 may be referred to as parasitic capacitors or basic capacitors. According to an embodiment of the inventive concept, capacitors Cbc1, Cbc2, Cbc3, and Cbc4 may also be used to increase the magnitude of a signal.
[0281] If the pen PN approaches the first electrode group 210Gb, a first induced electromotive force Vs(t) may be generated in the first electrode group 210Gb due to the magnetic field generated by the pen PN, and a second induced electromotive force Va(t) may be generated in the auxiliary electrode 230s. In an embodiment, a first induced current IN-M and a third induced current IN-B may be generated due to the first induced electromotive force Vs(t), and a second induced current IN-A may be generated due to the second induced electromotive force Va(t). Therefore, the total induced current IN input to the input terminal IT may correspond to the sum of the first induced current IN-M, the second induced current IN-A, and the third induced current IN-B.
[0282] For example, the capacitance of each of the capacitors Cbc1 , Cbc2 , Cbc3 , and Cbc4 is Cb, and the capacitance of each of the first coupling capacitors Ccp11 , Ccp12 , Ccp13 , and Ccp14 is Cc.
[0283] The first induction current IN-M according to time can be expressed as the following formula.
[0284]
[0285] The second induction current IN-A according to time can be expressed as the following formula.
[0286]
[0287] The third induction current IN-B according to time can be expressed as the following formula.
[0288]
[0289] Figure 25A is a graph showing the magnitude of the current versus the position of the pen relative to one channel. Figure 25B is a graph showing the magnitude of the total induced current versus the position of the pen relative to one channel.
[0290] refer to Figure 23 、 Figure 24 and Figure 25A Since the voltage across capacitors Cbc1, Cbc2, Cbc3, and Cbc4 between input terminal IT and the position of pen PN is grounded, current may not flow. Therefore, if the position of pen PN moves from first point PP1 to second point PP2, first induced current IN-M may gradually decrease. Furthermore, second induced current IN-A may gradually increase, and third induced current IN-B may gradually decrease.
[0291] refer to Figure 23 、 Figure 24 and Figure 25B If the position of the pen PN moves from the first point PP1 to the second point PP2, the total induced current IN may gradually decrease. However, as described above, the total induced current IN may correspond to the sum of the first induced current IN-M, the second induced current IN-A, and the third induced current IN-B, and the magnitude of the total induced current IN at the second point PP2 may be ensured to be greater than or equal to a predetermined value.
[0292] Figure 26 is a plan view illustrating four sensing units according to an embodiment of the inventive concept. Figure 27A is a plan view illustrating a second conductive layer of four sensing units according to an embodiment of the inventive concept. Figure 27B is a plan view illustrating a first conductive layer of four sensing units according to an embodiment of the inventive concept.
[0293] refer to Figure 22 、 Figure 26 、 Figure 27A and Figure 27B In an embodiment of the present inventive concept, the 2-1st electrode group 221Ga may include the first sensing electrode 221cea, and the 2-2nd electrode group 222Ga may include the second sensing electrode 222cea. The first electrode group 210Gb may include the third sensing electrode 210ceb.
[0294] In an embodiment, the first sensing electrode 221cea may include a first sensing pattern 221sp, a first bridge pattern 221bp, a first cross pattern 221cp, and a first extension pattern 221ep. The second sensing electrode 222cea may include a second sensing pattern 222sp, a second bridge pattern 222bp, a second cross pattern 222cp, and a second extension pattern 222ep. The third sensing electrode 210ceb may include only the third sensing pattern 210sp and the third bridge pattern 210bp. In an embodiment, the third sensing electrode 210ceb may not include a cross pattern or a connection pattern.
[0295] In an embodiment, the first sensing pattern 221sp, the first bridge pattern 221bp, the first extension pattern 221ep, the second sensing pattern 222sp, the second bridge pattern 222bp, the second extension pattern 222ep, and the third sensing pattern 210sp may be disposed on the same layer as each other, and, for example, may be included in the second conductive layer 204 (see Figure 4 The first cross pattern 221cp, the second cross pattern 222cp, the third bridge pattern 210bp, and the auxiliary electrode 230s may be provided on the same layer as each other, and, for example, may be included in the first conductive layer 202 (see Figure 4 )middle.
[0296] In an embodiment of the present inventive concept, two first extension patterns 221ep may extend from one first sensing pattern 221sp. In an embodiment, each of the first extension patterns 221ep may extend from a corresponding first sensing pattern 221sp and have a shape integral with the corresponding first sensing pattern 221sp. In an embodiment, each of the first extension patterns 221ep and the corresponding first intersection pattern 221cp may be disposed on different layers from each other and formed by defining a first insulating layer 203 (see FIG. 2 ). Figure 6 However, embodiments of the present inventive concept are not necessarily limited thereto, and each of the first extension patterns 221ep may extend from the corresponding first intersection pattern 221cp and have a shape integral with the corresponding first intersection pattern 221cp.
[0297] In an embodiment, two second extension patterns 222ep may extend from one second sensing pattern 222sp. In an embodiment, each of the second extension patterns 222ep may extend from a corresponding second sensing pattern 222sp and have a shape integral with the corresponding second sensing pattern 222sp. In an embodiment, each of the second extension patterns 222ep and the corresponding second crossing pattern 222cp may be provided on different layers from each other and formed by defining a plurality of second extension patterns 222ep on the intermediate insulating layer 203 (see FIG. 2 ). Figure 6 However, embodiments of the present inventive concept are not necessarily limited thereto, and each of the second extension patterns 222ep may extend from the corresponding second intersection pattern 222cp and have a shape integral with the corresponding second intersection pattern 222cp.
[0298] In an embodiment, the third sensing patterns 210sp may be spaced apart from each other in the second direction DR2. The third sensing patterns 210sp spaced apart from each other in the second direction DR2 may be electrically connected to each other through a third bridge pattern 210bp. In an embodiment of the present inventive concept, the third sensing patterns 210sp spaced apart from each other in the second direction DR2 and the third bridge pattern 210bp connecting the third sensing patterns 210sp may be disposed on different layers from each other and may be electrically connected to each other by being defined in the intermediate insulating layer 203 (see FIG. Figure 6 ) in the via connection.
[0299] Each of the auxiliary electrodes 230s may extend along the second direction DR2. The third sensing pattern 210sp included in one of the first electrode groups 210Gb may overlap with a corresponding auxiliary electrode 230s among the auxiliary electrodes 230s (e.g., in a plan view). A hole 230s-h may be defined in each of the auxiliary electrodes 230s. Each of the third bridging patterns 210bp may be surrounded by a corresponding hole 230s-h and insulated from the auxiliary electrode 230s (e.g., in a plan view).
[0300] Figure 27A and Figure 27B The patterns shown in the figure may each have a grid structure. The grid structures may each include a plurality of grid lines. In an embodiment, the plurality of grid lines may each have a straight line shape extending in a predetermined direction and may be connected to each other. However, embodiments of the present inventive concept are not necessarily limited thereto, and at least a portion of each of the plurality of grid lines may have a curved shape.
[0301] Figure 28 is a plan view illustrating four sensing units according to an embodiment of the inventive concept. Figure 29A is a plan view illustrating a second conductive layer of four sensing units according to an embodiment of the inventive concept. Figure 29Bis a plan view illustrating a first conductive layer of four sensing units according to an embodiment of the inventive concept.
[0302] refer to Figure 22 、 Figure 28 、 Figure 29A and Figure 29B In an embodiment, the first sensing electrode 221cea may include a first sensing pattern 221sp, a first bridge pattern 221bp, a first cross pattern 221cp, and a first extension pattern 221ep. The second sensing electrode 222cea may include a second sensing pattern 222sp, a second bridge pattern 222bp, a second cross pattern 222cp, and a second extension pattern 222ep. The third sensing electrode 210ceb may include only the third sensing pattern 210sp and the third bridge pattern 210bp. In an embodiment, the third sensing electrode 210ceb may not include additional cross patterns and connecting patterns.
[0303] In an embodiment, the first sensing pattern 221sp, the first bridge pattern 221bp, the first crossing pattern 221cp, the first extension pattern 221ep, the second sensing pattern 222sp, the second bridge pattern 222bp, the second crossing pattern 222cp, the second extension pattern 222ep, and the third sensing pattern 210sp may be disposed on the same layer as one another and, for example, may be included in the second conductive layer 204 (see Figure 4 ). For example, in an embodiment, the first sensing pattern 221sp, the first bridge pattern 221bp, the first cross pattern 221cp, and the first extension pattern 221ep of one first sensing electrode 221cea may be provided on the same layer as each other and have an integral shape. In an embodiment, the second sensing pattern 222sp, the second bridge pattern 222bp, the second cross pattern 222cp, and the second extension pattern 222ep of one second sensing electrode 222cea may be provided on the same layer as each other and have an integral shape. The third bridge pattern 210bp and the auxiliary electrode 230s may be provided on the same layer as each other and, for example, may be included in the first conductive layer 202 (see Figure 4 )middle.
[0304] In an embodiment of the present inventive concept, at least one recess portion 221 - rp and 222 - rp may be defined in each of the first sensing pattern 221 sp and the second sensing pattern 222 sp. Figure 29A It is shown that two recessed portions 221 -rp and 222 -rp are defined in each of the first sensing pattern 221sp and the second sensing pattern 222sp However, embodiments of the inventive concept are not necessarily limited thereto.
[0305] The second cross pattern 222cp can be provided in each of the recessed portions 221-rp of the first sensing pattern 221sp. The outer edge of the second cross pattern 222cp can be surrounded by the first sensing pattern 221sp (for example, in a plan view). The first cross pattern 221cp can be provided in each of the recessed portions 222-rp of the second sensing pattern 222sp. The outer edge of the first cross pattern 221cp can be surrounded by the second sensing pattern 222sp (for example, in a plan view). Therefore, a coupling capacitor can be defined between the adjacent 2-1 electrode group 221Ga and the 2-2 electrode group 222Ga.
[0306] Figure 29A and Figure 29B The patterns shown in the figure may each have a grid structure. The grid structures may each include a plurality of grid lines. In an embodiment, the plurality of grid lines may each have a straight line shape extending in a predetermined direction and may be connected to each other. However, embodiments of the present inventive concept are not necessarily limited thereto, and at least a portion of each of the plurality of grid lines may have a curved shape.
[0307] Figure 30 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver according to an embodiment of the inventive concept.
[0308] refer to Figure 7 and Figure 30 In an embodiment, the sensor layer 200 may further include a plurality of loop traces 230rt electrically connected to the plurality of auxiliary electrodes 230s. Figure 30 The auxiliary electrodes 230s and the loop traces 230rt are shown to be electrically connected in a one-to-one correspondence. However, embodiments of the present inventive concept are not necessarily limited thereto. For example, in some embodiments, two or more auxiliary electrodes 230s may be electrically connected to one loop trace 230rt.
[0309] The second mode MD2 (see Figure 9 ) can include a charging driving mode and a pen sensing driving mode. Figure 30 2 is a diagram illustrating a charging driving mode. In an embodiment, the sensor driver 200C may include a first switch SSW1 and a second switch SSW2. The first signal CSG1 may be transmitted to the sensor layer 200 through the first switch SSW1, and the second signal CSG2 may be transmitted to the sensor layer 200 through the second switch SSW2.
[0310] In an embodiment, each of the first signal CSG1 and the second signal CSG2 may be a sine wave or square wave signal. In an embodiment, the first signal CSG1 and the second signal CSG2 may be in anti-phase relationship. Therefore, in the charge drive mode, the direction of the current may change periodically. However, embodiments of the present invention are not necessarily limited thereto. For example, in an embodiment of the present invention, one of the first signal CSG1 and the second signal CSG2 may be a sine wave or square wave signal, and the other may have a predetermined constant voltage.
[0311] In the charging driving mode, the first switch SSW1 and the second switch SSW2 can be electrically connected to at least one of the connection trace 230ct and the loop trace 230rt and at least the other of the connection trace 230ct and the loop trace 230rt. One end of the connection trace 230ct can be connected to the first terminal SND1, and the other end of the connection trace 230ct can be connected to the second terminal SND2. Figure 30 The first signal CSG1 is shown as being provided to a connection trace 230ct, and the second signal CSG2 is shown as being provided to a loop trace 230rt. However, embodiments of the present inventive concept are not necessarily limited thereto. For example, in some embodiments, the first signal CSG1 may be provided to two or more lines, and the second signal CSG2 may also be provided to two or more different lines.
[0312] In an embodiment, in the pen sensing drive mode, all loop traces 230rt may be electrically floating, and the connection traces 230ct may be grounded.
[0313] Figure 31 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver according to an embodiment of the inventive concept.
[0314] refer to Figure 7 and Figure 31 , schematically shows the sensor layer 200 in the first mode MD1 (see Figure 9 In an embodiment, the first mode MD1 may include a mutual capacitance detection mode.
[0315] In an embodiment, the sensor driver 200C may include a differential amplifier DAP. In the first mode MD1, an inverting terminal of the differential amplifier DAP may be electrically connected to the second electrode group 220Ga. A non-inverting terminal of the differential amplifier DAP may be grounded or applied with a reference voltage.
[0316] In the first mode MD1, the sensor driver 200C may sequentially provide the transmission signal SG-md1 to the first electrode group 210Gb. The sensor driver 200C may detect the first input 2000 (see FIG. 200B ) by using the reception signal detected by the second electrode group 220Ga. Figure 4 For example, the sensor driver 200C may be configured to sense a change in mutual capacitance between the first electrode group 210Gb and the second electrode group 220Ga and calculate the input coordinates.
[0317] In the first mode MD1, the connection trace 230ct may be grounded, so that noise may not be introduced through the auxiliary electrode 230s.
[0318] Figure 32 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver according to an embodiment of the inventive concept.
[0319] refer to Figure 7 and Figure 32 , schematically shows the sensor layer 200 in the first mode MD1 (see Figure 9 In an embodiment, the first mode MD1 may include a mutual capacitance detection mode.
[0320] In an embodiment, the sensor driver 200C may include a differential amplifier DAP. In the first mode MD1, an inverting terminal of the differential amplifier DAP may be electrically connected to the first electrode group 210Gb. A non-inverting terminal of the differential amplifier DAP may be grounded or applied with a reference voltage.
[0321] In the first mode MD1, the sensor driver 200C may sequentially provide the transmission signal SG-md1 to the second electrode group 220Ga. The sensor driver 200C may detect the first input 2000 (see FIG. 2 ) by using the reception signal detected by the first electrode group 210Gb. Figure 4 For example, the sensor driver 200C may be configured to sense a change in mutual capacitance between the first electrode group 210Gb and the second electrode group 220Ga and calculate the input coordinates.
[0322] In the first mode MD1, the connection trace 230ct may be grounded, so that noise may not be introduced through the auxiliary electrode 230s.
[0323] Figure 33 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver according to an embodiment of the inventive concept.
[0324] refer to Figure 7 and Figure 33, schematically shows the sensor layer 200 in the first mode MD1 (see Figure 9 In an embodiment, the first mode MD1 may include a mutual capacitance detection mode.
[0325] The sensor layer 200 may further include additional traces 220ta. The additional traces 220ta may include a first additional trace 221t2-md1 and a second additional trace 222t2-md1. The 2-1st electrode group 221Ga may each be connected to the first cross trace 221t1-md1 and the first additional trace 221t2-md1. In an embodiment, the first cross trace 221t1-md1 may be connected to one side (e.g., the right end) of the corresponding 2-1st electrode group 221Ga, and the first additional trace 221t2-md1 may be connected to the other end (e.g., the left end) of the corresponding 2-1st electrode group 221Ga. The 2-2nd electrode group 222Ga may each be connected to the second cross trace 222t1-md1 and the second additional trace 222t2-md1. In the first mode MD1, the second crossing trace 222t1-md1 can be connected to one side (e.g., the left end) of the corresponding 2-2 electrode group 222Ga, and the second additional trace 222t2-md1 can be connected to the other end (e.g., the right end) of the corresponding 2-2 electrode group 222Ga.
[0326] In the first mode MD1, the first additional trace 221t2-md1 may be electrically connected to the first crossing trace 221t1-md1. In an embodiment, in the first mode MD1, the second additional trace 222t2-md1 may also be electrically connected to the second crossing trace 222t1-md1.
[0327] In the first mode MD1, the sensor driver 200C may sequentially provide the transmission signal SG-md1 to the second electrode group 220Ga. The sensor driver 200C may detect the first input 2000 (see FIG. 2 ) by using the reception signal detected by the first electrode group 210Gb. Figure 4 For example, the sensor driver 200C may be configured to sense a change in mutual capacitance between the first electrode group 210Gb and the second electrode group 220Ga and calculate the input coordinates.
[0328] In an embodiment, in the second mode MD2 (see Figure 9 ), the first additional trace 221t2-md1 may be electrically disconnected from the first crossing trace 221t1-md1, and the second additional trace 222t2-md1 may be electrically disconnected from the second crossing trace 222t1-md1. In the second mode MD2, the first additional trace 221t2-md1 and the second additional trace 222t2-md1 may each be floating.
[0329] However, embodiments of the present invention are not necessarily limited thereto. For example, in embodiments of the present invention, the first mode MD1 may include a self-capacitance detection mode. The sensor driver 200C may be configured to output a drive signal to the first electrode group 210Gb and the second electrode group 220Ga, sense a change in capacitance of each of the first electrode group 210Gb and the second electrode group 220Ga, and calculate input coordinates in the self-capacitance detection mode.
[0330] According to the above description, touch input and input by pen can be sensed by using a sensor layer. Therefore, since it is not necessary to add an additional component for pen sensing (e.g., a digitizer) to the electronic device, the increase in thickness, the increase in weight, and the degradation of flexibility of the electronic device caused by the addition of a digitizer may not occur. In addition, at least one electrode group arranged parallel to each other in the sensor layer may include two electrode groups with different routing directions. The size of the signal received from the electrode can be increased by a coupling capacitor between the two electrode groups. As a result, the sensor driver can stably receive a signal from the electrode regardless of the distance between the input terminal and the area where the input by pen is input.
[0331] Although non-limiting embodiments of the present invention have been described, it should be understood that the present invention should not be limited to the described embodiments, but rather that various changes and modifications can be made by those skilled in the art within the spirit and scope of the present invention. Therefore, the technical scope of the present invention is not limited to the contents described in the detailed description of the specification.
Claims
1. Electronic equipment, including: sensor layer; as well as a sensor driver that drives the sensor layer and selectively operates in a first mode for sensing a touch input and in a second mode for sensing a pen input, Wherein, the sensor layer comprises: A plurality of first electrode groups are arranged along a first direction; a plurality of second electrode groups arranged along a second direction intersecting the first direction, the plurality of second electrode groups intersecting the plurality of first electrode groups and comprising at least one 2-1 electrode group and at least one 2-2 electrode group spaced apart from each other in the second direction; a first crossing trace connected to one side of the at least one 2-1 electrode group; and A second crossing trace is connected to one side of the at least one 2-2 electrode group, the one side of the at least one 2-1 electrode group and the one side of the at least one 2-2 electrode group being opposite to each other with respect to the first direction.
2. The electronic device according to claim 1, wherein: The at least one 2-1 electrode group includes a plurality of 2-1 electrode groups, and the at least one 2-2 electrode group includes a plurality of 2-2 electrode groups; and The plurality of 2-1 electrode groups and the plurality of 2-2 electrode groups are alternately arranged.
3. The electronic device according to claim 2, wherein A plurality of coupling capacitors are defined between adjacent 2-1 electrode groups and 2-2 electrode groups among the plurality of 2-1 electrode groups and the plurality of 2-2 electrode groups.
4. The electronic device according to claim 2, wherein: the sensor driver outputting a first output signal by performing a differential operation on first signals received from the plurality of 2-1 th electrode groups; as well as The sensor driver outputs a second output signal by performing a differential operation on second signals received from the plurality of 2-2 electrode groups.
5. The electronic device according to claim 4, wherein: The sensor driver includes a first differential amplifier having an inverting terminal and a non-inverting terminal and a second differential amplifier having an inverting terminal and a non-inverting terminal; and The second mode includes a pen sensing drive mode, wherein, in the pen sensing driving mode, the inverting terminal of the first differential amplifier is electrically connected to a first 2-1 electrode group among the plurality of 2-1 electrode groups, and the non-inverting terminal of the first differential amplifier is electrically connected to a second 2-1 electrode group among the plurality of 2-1 electrode groups, and In the pen sensing driving mode, the inverting terminal of the second differential amplifier is electrically connected to a first 2-2 electrode group among the multiple 2-2 electrode groups, and the non-inverting terminal of the second differential amplifier is electrically connected to a second 2-2 electrode group among the multiple 2-2 electrode groups.
6. The electronic device according to claim 4, wherein: The sensor driver converts the first signals received from the plurality of 2-1 th electrode groups into first digital signals and performs a differential operation on the first digital signals; as well as The sensor driver converts the second signals received from the plurality of 2-2 electrode groups into second digital signals and performs a differential operation on the second digital signals.
7. The electronic device according to claim 2, wherein: The sensor driver obtains a first output signal by performing a differential operation on first signals received from the plurality of 2-1 electrode groups, and obtains a second output signal by performing a differential operation on second signals received from the plurality of 2-2 electrode groups; as well as When the magnitude of the first output signal is smaller than the magnitude of the second output signal, the sensor driver amplifies the first output signal by applying a gain value to the first output signal.
8. The electronic device according to claim 1, wherein: The plurality of first electrode groups include at least one 1-1 electrode group and at least one 1-2 electrode group spaced apart from each other in the first direction, The sensor layer further comprises: a third crossing trace connected to one side of the at least one 1-1 electrode group; and A fourth crossing trace is connected to one side of the at least one 1-2 electrode group, the one side of the at least one 1-1 electrode group and the one side of the at least one 1-2 electrode group being opposite to each other with respect to the second direction.
9. The electronic device according to claim 8, wherein: The at least one 1-1 electrode group includes a plurality of 1-1 electrode groups, and the at least one 1-2 electrode group includes a plurality of 1-2 electrode groups; and The plurality of 1-1 electrode groups and the plurality of 1-2 electrode groups are alternately arranged.
10. The electronic device according to claim 9, wherein A plurality of coupling capacitors are defined between adjacent 1-1 electrode groups and 1-2 electrode groups among the plurality of 1-1 electrode groups and the plurality of 1-2 electrode groups.
11. The electronic device according to claim 8, wherein: Each of the at least one 2-1 electrode group includes a first sensing electrode, and each of the at least one 2-2 electrode group includes a second sensing electrode; The first sensing electrode includes a first sensing pattern, a first bridge pattern connecting adjacent first sensing patterns among the first sensing patterns, and a first cross pattern electrically connected to each of the first sensing patterns; The second sensing electrode includes a second sensing pattern, a second bridge pattern connecting adjacent second sensing patterns among the second sensing patterns, and a second cross pattern electrically connected to each of the second sensing patterns; The first sensing pattern and the second sensing pattern are disposed on different layers from the first crossing pattern and the second crossing pattern; as well as At least a portion of the first intersection pattern overlaps with a second sensing pattern adjacent to the first intersection pattern among the second sensing patterns, and at least a portion of the second intersection pattern overlaps with a first sensing pattern adjacent to the second intersection pattern among the first sensing patterns.
12. The electronic device according to claim 11, wherein: Each of the at least one 1-1 electrode group includes a third sensing electrode, and each of the at least one 1-2 electrode group includes a fourth sensing electrode; The third sensing electrode includes a third sensing pattern, a third bridge pattern connecting adjacent third sensing patterns among the third sensing patterns, and a third cross pattern electrically connected to each of the third sensing patterns; The fourth sensing electrode includes a fourth sensing pattern, a fourth bridge pattern connecting adjacent fourth sensing patterns among the fourth sensing patterns, and a fourth cross pattern electrically connected to each of the fourth sensing patterns; The third sensing pattern and the fourth sensing pattern are disposed on different layers from the third crossing pattern and the fourth crossing pattern; as well as At least a portion of the third intersection pattern overlaps with a fourth sensing pattern adjacent to the third intersection pattern among the fourth sensing patterns, and at least a portion of the fourth intersection pattern overlaps with a third sensing pattern adjacent to the fourth intersection pattern among the third sensing patterns.
13. The electronic device according to claim 8, wherein: Each of the at least one 2-1 electrode group includes a first sensing electrode, and each of the at least one 2-2 electrode group includes a second sensing electrode; The first sensing electrode includes a first sensing pattern, a first bridge pattern connecting adjacent first sensing patterns among the first sensing patterns, and a first cross pattern electrically connected to each of the first sensing patterns; The second sensing electrode includes a second sensing pattern, a second bridge pattern connecting adjacent second sensing patterns among the second sensing patterns, and a second cross pattern electrically connected to each of the second sensing patterns; The first sensing pattern and the second sensing pattern are disposed on the same layer as the first crossing pattern and the second crossing pattern; as well as The first intersection pattern is disposed in an opening of a second sensing pattern adjacent to the first intersection pattern among the second sensing patterns, and the second intersection pattern is disposed in an opening of a first sensing pattern adjacent to the second intersection pattern among the first sensing patterns.
14. The electronic device according to claim 13, wherein: Each of the at least one 1-1 electrode group includes a third sensing electrode, and each of the at least one 1-2 electrode group includes a fourth sensing electrode, The third sensing electrode includes a third sensing pattern, a third bridge pattern connecting adjacent third sensing patterns among the third sensing patterns, and a third cross pattern electrically connected to each of the third sensing patterns. The fourth sensing electrode includes a fourth sensing pattern, a fourth bridge pattern connecting adjacent fourth sensing patterns among the fourth sensing patterns, and a fourth cross pattern electrically connected to each of the fourth sensing patterns. The third and fourth sensing patterns and the third and fourth crossing patterns are disposed on the same layer as each other, and The third intersection pattern is disposed in a concave portion of a fourth sensing pattern adjacent to the third intersection pattern among the fourth sensing patterns, and the fourth intersection pattern is disposed in a concave portion of a third sensing pattern adjacent to the fourth intersection pattern among the third sensing patterns.
15. The electronic device according to claim 1, wherein The sensor layer further comprises: a plurality of auxiliary electrodes, respectively overlapping the plurality of first electrode groups; and The connection traces connect the plurality of auxiliary electrodes to each other.
16. The electronic device according to claim 15, wherein The sensor layer further includes a plurality of first traces electrically connected to the plurality of first electrode sets in a one-to-one correspondence; and The plurality of first traces are spaced apart from the connecting traces, and the plurality of first electrode groups are between the plurality of first traces and the connecting traces.
17. The electronic device according to claim 15, wherein: Each of the at least one 2-1 electrode group includes a first sensing electrode, each of the at least one 2-2 electrode group includes a second sensing electrode, and each of the plurality of first electrode groups includes a third sensing electrode; The first sensing electrode includes a first sensing pattern, a first bridge pattern connecting adjacent first sensing patterns among the first sensing patterns, and a first cross pattern electrically connected to each of the first sensing patterns; The second sensing electrode includes a second sensing pattern, a second bridge pattern connecting adjacent second sensing patterns among the second sensing patterns, and a second cross pattern electrically connected to each of the second sensing patterns; The third sensing electrode includes a third sensing pattern and a third bridge pattern connecting adjacent third sensing patterns among the third sensing patterns; as well as Each of the third sensing patterns overlaps with a corresponding one of the plurality of auxiliary electrodes.
18. The electronic device according to claim 17, wherein: The plurality of auxiliary electrodes are disposed on different layers from the first, second, and third sensing patterns.
19. The electronic device according to claim 17, wherein: The first and second sensing patterns and the first and second crossing patterns are disposed on different layers from each other; and At least a portion of the first intersection pattern overlaps with a second sensing pattern adjacent to the first intersection pattern among the second sensing patterns, and at least a portion of the second intersection pattern overlaps with a first sensing pattern adjacent to the second intersection pattern among the first sensing patterns.
20. The electronic device according to claim 17, wherein: The first sensing pattern and the second sensing pattern and the first crossing pattern and the second crossing pattern are disposed on the same layer as each other; and The first intersection pattern is disposed in a concave portion of a second sensing pattern adjacent to the first intersection pattern among the second sensing patterns, and the second intersection pattern is disposed in a concave portion of a first sensing pattern adjacent to the second intersection pattern among the first sensing patterns.
21. The electronic device according to claim 17, wherein A plurality of holes respectively surrounding the third bridge patterns are defined in the corresponding one auxiliary electrode.
22. The electronic device according to claim 15, wherein: The sensor layer further includes a plurality of loop traces electrically connected to the plurality of auxiliary electrodes; and The second mode includes a charging driving mode and a pen sensing driving mode, wherein, in the charge driving mode, the sensor driver applies a first signal to at least one of the connection trace and the plurality of loop traces, and applies a second signal to at least another one of the connection trace and the plurality of loop traces; and In the pen sensing drive mode, all of the plurality of loop traces are electrically floating.
23. The electronic device according to claim 1, wherein In the first mode, the sensor driver sequentially provides transmission signals to the plurality of first electrode groups and receives signals from the plurality of second electrode groups.
24. The electronic device according to claim 1, wherein In the first mode, the sensor driver sequentially provides transmission signals to the plurality of second electrode groups and receives signals from the plurality of first electrode groups.
25. The electronic device according to claim 1, wherein The sensor layer further comprises: a first additional trace connected to another side of the at least one 2-1 electrode group that is different from the one side of the at least one 2-1 electrode group; and a second additional trace connected to another side of the at least one 2-2 electrode group that is different from the one side of the at least one 2-2 electrode group, In the first mode, the first additional trace is electrically connected to the first cross trace, and the second additional trace is electrically connected to the second cross trace, and In the second mode, each of the first additional trace and the second additional trace is electrically floating.
26. The electronic device according to claim 1, wherein Each of the at least one 2-1 electrode group and the at least one 2-2 electrode group crosses all of the plurality of first electrode groups.
27. Electronic equipment, including: sensor layer; as well as a sensor driver that drives the sensor layer and selectively operates in a first mode for sensing a touch input and in a second mode for sensing a pen input, Wherein, the sensor layer comprises: a plurality of first electrode groups arranged along a first direction; and a plurality of second electrode groups arranged along a second direction intersecting the first direction, the plurality of second electrode groups intersecting the plurality of first electrode groups; and A plurality of coupling capacitors are defined between adjacent second electrode groups among the plurality of second electrode groups.
28. The electronic device according to claim 27, wherein: The plurality of second electrode groups include a 2-1 electrode group and a 2-2 electrode group spaced apart from each other in the second direction, the 2-1 electrode group includes first sensing electrodes, and the 2-2 electrode group includes second sensing electrodes; The first sensing electrode includes a first sensing pattern, a first bridge pattern connecting adjacent first sensing patterns among the first sensing patterns, and a first cross pattern electrically connected to each of the first sensing patterns; as well as The second sensing electrode includes second sensing patterns, a second bridge pattern connecting adjacent second sensing patterns among the second sensing patterns, and a second cross pattern electrically connected to each of the second sensing patterns.
29. The electronic device according to claim 28, wherein: The first sensing pattern and the second sensing pattern are disposed on different layers from the first crossing pattern and the second crossing pattern; At least a portion of the first intersection pattern overlaps with a second sensing pattern adjacent to the first intersection pattern among the second sensing patterns; as well as At least a portion of the second intersection pattern overlaps with a first sensing pattern adjacent to the second intersection pattern among the first sensing patterns.
30. The electronic device of claim 28, wherein: The first sensing pattern and the second sensing pattern and the first crossing pattern and the second crossing pattern are disposed on the same layer as each other; and The first intersection pattern is disposed in an opening of a second sensing pattern adjacent to the first intersection pattern among the second sensing patterns, and the second intersection pattern is disposed in an opening of a first sensing pattern adjacent to the second intersection pattern among the first sensing patterns.
31. The electronic device according to claim 27, wherein The sensor layer further comprises: a first crossing trace connected to one side of a first-second electrode group in the adjacent second electrode groups; and a second cross trace connected to one side of a second-second electrode group in the adjacent second electrode group, and The one side of the first-second electrode group in the adjacent second electrode groups and the one side of the second-second electrode group in the adjacent second electrode groups are opposite to each other with respect to the first direction.
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Layered substrate manufacturing method and manufacturing device
KR1020240017966A