Method and equipment for optimizing dynamic balance of rotating base and medium
Through three-dimensional modeling and dynamic simulation methods, the dynamic response value of the rotating parts is accurately calculated, which solves the problem of difficult to identify small imbalances in the prior art, and realizes high-precision dynamic balance optimization of rotating bases, reducing physical testing and correction costs.
Patent Information
- Application Number
- CN202510635449.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-16
- Publication Date
- 2025-08-08
AI Technical Summary
The existing rotary base dynamic balance correction methods rely on physical testing and mechanical adjustment, making it difficult to identify tiny vibrations or imbalances, and are susceptible to environmental interference, resulting in measurement errors and adjustment difficulties.
By creating a three-dimensional model of the rotation device, setting multiple boundary conditions for dynamic simulation, calculating the dynamic response value of the rotating component, determining the imbalance point, and optimizing the design parameters based on the response value to achieve the optimization of dynamic simulation.
It improves the detection accuracy of the rotating device, can quickly adjust design parameters, shorten optimization cycles, reduce physical testing and calibration costs, and achieve dynamic balance optimization without disassembly.
Smart Images
Figure CN120449599A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a method, device and medium for optimizing the dynamic balance of a rotating base. Background Art
[0002] A wafer is a thin, circular piece of silicon made from high-purity single crystal silicon through a complex process. It is used in the semiconductor industry to manufacture integrated circuits and other micro-devices. Among the various wafer manufacturing processes, the core component of the coating process is the rotating device. Existing rotating devices are typically rotating bases, which serve as the base or platform for the wafer spin coating process. They serve as a support base for uniformly coating photoresist or other thin film materials.
[0003] When rotating at high speeds, any slight mass unevenness in the rotating device will cause vibration, affecting the uniformity of thin film production. To ensure that the thickness and uniformity of the film meet the high-precision requirements of semiconductor manufacturing, the rotation speed and acceleration of the rotating base must be precisely controlled. Therefore, dynamic balancing is extremely important in the production of rotating devices.
[0004] During the manufacturing process of rotating devices, traditional dynamic balancing methods eliminate imbalances in rotating components through physical testing and mechanical adjustments. This method requires correction of the manufactured rotating device and is suitable for low- to medium-precision applications. However, it has difficulty identifying very small vibrations or minor imbalances. During the measurement process, the sensor may be affected by environmental interference such as external vibrations or electromagnetic interference, which can affect the measurement results. Furthermore, manual adjustment of the sensor position or calibration is required, which can easily introduce errors. Summary of the Invention
[0005] In order to solve the above problems, this application proposes a method for optimizing the dynamic balance of a rotating base, including:
[0006] Creating an initial three-dimensional model of the rotating device based on design parameters corresponding to each rotating component in the rotating device;
[0007] Based on predefined working environment parameters, a plurality of boundary conditions are set, and a rotational dynamic simulation is performed based on the plurality of boundary conditions respectively through the initial three-dimensional model;
[0008] respectively calculating the dynamic response values of the rotating components corresponding to the boundary conditions, and determining the unbalance points of the rotating components;
[0009] Optimizing the design parameters corresponding to the unbalanced points according to the dynamic response values to obtain an optimized three-dimensional model;
[0010] By using the optimized three-dimensional model, dynamic simulation is performed again based on multiple boundary conditions to verify whether the optimization result meets the optimization requirements.
[0011] On the other hand, the present application also proposes an optimization device for the dynamic balance of a wafer rotating device, comprising:
[0012] at least one processor; and,
[0013] a memory communicatively connected to the at least one processor; wherein,
[0014] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform a method for optimizing the dynamic balancing of a rotating base as described in the above example.
[0015] On the other hand, the present application also proposes a non-volatile computer storage medium storing computer executable instructions, wherein the computer executable instructions are configured as: a method for optimizing the dynamic balance of a rotating base as described in the above example.
[0016] The present application proposes a method for optimizing the dynamic balance of a rotating base, which can bring the following beneficial effects:
[0017] Through three-dimensional modeling and dynamic simulation of the rotating device, the dynamic response value of each rotating component under different boundary conditions can be accurately calculated. Even for very small vibrations or slight imbalances, difficult-to-identify details can be captured, thereby improving the detection accuracy of the rotating device.
[0018] Furthermore, through simulation of the rotating device, the design parameters of each rotating component can be quickly adjusted and the dynamic simulation can be rerun to optimize the dynamic balance of the rotating device without the need to physically disassemble and reinstall the rotating components. This significantly shortens the design and optimization cycle and reduces the equipment usage costs required for physical testing and calibration. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0020] Figure 1 Schematic diagram of a flow chart of a method for optimizing the dynamic balance of a rotating base in an embodiment of the present application;
[0021] Figure 2 This is a schematic diagram of an optimization device for dynamic balancing of a wafer rotating device in an embodiment of the present application. DETAILED DESCRIPTION
[0022] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0023] The following describes in detail the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings.
[0024] like Figure 1 As shown, the embodiment of the present application provides a method for optimizing the dynamic balance of a rotating base, comprising:
[0025] S101: Creating an initial three-dimensional model of the rotating device based on design parameters corresponding to each rotating component in the rotating device.
[0026] Specifically, based on the design parameters of each rotating component in the rotating device, including size parameters, shape parameters, material parameters, etc., an initial three-dimensional model of the rotating device is constructed, and the physical structure and geometric characteristics of the rotating device are accurately presented through the initial three-dimensional model.
[0027] It should be noted that wafer rotation devices are key equipment in the semiconductor manufacturing process, primarily used to rotate wafers at precise speeds and stability during processes such as photolithography, cleaning, and coating, ensuring process uniformity and consistency. Wafer rotation devices typically include components such as a motor, a rotating shaft, a wafer support platform, counterweights, a support structure, sensors, and a controller.
[0028] S102: Based on predefined working environment parameters, multiple boundary conditions are set, and rotational dynamic simulation is performed based on the multiple boundary conditions through the initial three-dimensional model.
[0029] Specifically, the initial 3D model includes predefined operating environment parameters, including temperature, speed, load, and vibration, covering the various conditions encountered by the rotating device during actual operation. Based on these operating environment parameters, multiple boundary conditions are set. Using the initial 3D model and tools such as finite element analysis software, dynamic rotational simulations are performed based on these boundary conditions. This allows the initial 3D model to simulate the operating conditions of the rotating device under different operating scenarios and capture its dynamic response under various operating conditions.
[0030] Among them, in the process of setting multiple boundary conditions based on the working environment parameters, the working environment parameters and the corresponding parameter value variation range are determined according to the historical working environment of the rotating device, and the working environment parameters are defined; within the parameter value variation range, several working environment parameter values corresponding to the working environment parameters are selected respectively; and several working environment parameter values are combined to generate multiple different boundary conditions.
[0031] Specifically, historical operating environment data from the rotating device's actual operation under different conditions is collected. Based on this historical operating environment data, key operating environment parameters that affect the rotating device's dynamic balance and performance, such as temperature, speed, load, and vibration, are identified. The value range of each operating environment parameter in the historical data is analyzed, its maximum and minimum values are determined, and the parameter value variation range is determined. Based on this parameter value variation range, the operating environment parameter is defined.
[0032] Furthermore, within the parameter value variation range, multiple specific values are selected for each working environment parameter. Based on the historical working environment of the rotating device, the working environment change rate corresponding to each working environment parameter is calculated; a first parameter whose working environment change rate is lower than a preset threshold is obtained, an average value of the first parameter is calculated, and the average value is set as the ideal working environment parameter value of the rotating device; a second parameter whose working environment change rate is not lower than the preset threshold is obtained, and the number of parameter values corresponding to the working environment parameter is determined through a random discretization method; the ideal working environment parameter value is set to a fixed value, and based on the number of parameter values corresponding to the non-ideal working environment parameter, a corresponding non-ideal working environment parameter value is randomly selected from the second parameter through a random sampling method.
[0033] It should be noted that when selecting multiple specific values for each operating environment parameter, the ideal operating environment parameter value was calculated as the average value for parameters with relatively stable variations. For parameters with larger variations, the parameter values were determined using random discretization and random sampling. Finally, the selected values for each parameter were combined to form different boundary conditions for subsequent rotational dynamic simulations to comprehensively evaluate the performance of the rotating device under different operating environments.
[0034] For example, for temperature parameters, the ratio of the daily or time-period temperature change to the initial temperature is calculated to measure the temperature change rate. Assume the temperature change rate is 10% / day, the speed change rate is 5% / day, the load change rate is 15% / day, and the vibration change rate is 20% / day. Then, a threshold value is preset for each environmental parameter, assuming it is all set to 8%. Parameters with a working environment change rate below this threshold are considered the first parameter with relatively stable changes. The average value is calculated as the ideal working environment parameter value. If the speed parameter change rate is 5% lower than 8%, the historical average of the speed parameter data, such as 1800 rpm, is set as the ideal working environment speed parameter value for the rotating device. Assume that the algorithm determines that three values are required for the temperature parameter, four values for the load parameter, and three values for the vibration parameter. The ideal working environment parameter value (1800 rpm) is set as a fixed value. Using a random sampling method, corresponding non-ideal working environment parameter values are randomly selected within the parameter value ranges of temperature (15°C-35°C), load (1kg-5kg), and vibration (0.1g-0.5g). For example, the randomly selected temperature values are 20℃, 25℃, and 30℃; the load values are 1.5kg, 2.5kg, 3.5kg, and 4.5kg; and the vibration values are 0.2g, 0.3g, and 0.4g.
[0035] Combine the selected parameter values to generate multiple different boundary conditions. For example, boundary condition 1 is temperature 20°C, speed 1800 rpm, load 1.5 kg, and vibration 0.2 g; boundary condition 2 is temperature 25°C, speed 1800 rpm, load 2.5 kg, and vibration 0.3 g, etc.
[0036] S103: Calculating the dynamic response values of the rotating components corresponding to the boundary conditions respectively, and determining the unbalance points of the rotating components.
[0037] Specifically, after completing the rotational dynamic simulation, the dynamic response values of each rotating component under different boundary conditions will be obtained, including displacement data, rotation speed, rotation acceleration, vibration amplitude, etc. By analyzing the dynamic response values, the positions where abnormal vibrations or uneven forces occur in each rotating component during rotation are determined to be unbalanced points.
[0038] In the process of determining the imbalance point of each rotating component, the position points of each rotating component at different time points are collected based on a preset time period, and the displacement data of each rotating component is calculated; based on the displacement data, the rotation speed and rotation acceleration of each rotating component within the preset time period are determined; the displacement data, rotation speed and rotation acceleration are converted into corresponding frequency data, and the vibration amplitude of each rotating component is determined based on the frequency data; the vibration amplitude of each rotating component is matched with the corresponding natural frequency and vibration mode of each rotating component, and the imbalance point is determined based on the matching result.
[0039] Specifically, a position sensor (such as a laser displacement sensor or encoder) mounted on the rotating device collects the position of each rotating component at different time points within a preset time period. The displacement data of each rotating component is calculated by taking the position difference between adjacent time points. Based on this displacement data, the rotational speed and acceleration of the rotating component at different time points are calculated.
[0040] It's important to note that rotational velocity refers to the rate of change of the angle or displacement of a rotating component per unit time, while rotational acceleration refers to the rate of change of rotational velocity. For discrete displacement data, velocity and acceleration can be approximated using the difference method. For example, the average velocity over a time period can be calculated by dividing the displacement within that time period by the time interval, while the acceleration can be calculated by dividing the change in velocity between adjacent time periods by the time interval. Displacement, velocity, and acceleration data describe the dynamic characteristics of a rotating component in the time domain.
[0041] Furthermore, a Fourier transform (such as a fast Fourier transform (FFT)) is used to convert the displacement data, rotational velocity, and rotational acceleration into frequency domain data. In this frequency data, each frequency component corresponds to an amplitude, reflecting the vibration intensity of the rotating part at that frequency. By analyzing the frequency spectrum, the amplitude corresponding to each major frequency component is determined as the vibration amplitude of the rotating part. Vibration amplitude is an important indicator for measuring the degree of vibration of a rotating part. The larger the amplitude, the more severe the vibration of the rotating part at that frequency.
[0042] The natural frequencies and mode shapes of each rotating component are pre-determined through experiments or finite element analysis, and the vibration amplitudes of the rotating components are matched to the natural frequencies and mode shapes. If the vibration of a rotating component does not conform to its natural characteristics, the rotating component to be optimized is identified. A vibration spatial distribution is constructed based on the vibration amplitudes of the rotating component to be optimized. Within this constructed vibration spatial distribution, areas with large vibration amplitudes indicate imbalances, which are the imbalance points in the rotating component to be optimized. Once the imbalance points are identified, targeted dynamic balancing measures are taken, such as adding or removing counterweights.
[0043] For example, using finite element analysis software to perform modal analysis on a rotating disk reveals its natural frequencies, f01 and f02, along with their corresponding mode shapes. Comparing the previously calculated vibration amplitudes with these natural frequencies reveals a significant increase at frequency f01. Examining the mode shape diagram corresponding to f01 reveals that the vibration amplitude is greatest in a specific region of the disk, indicating that this region is the disk's imbalance point.
[0044] S104: Optimizing design parameters corresponding to the unbalanced points according to the dynamic response values to obtain an optimized three-dimensional model.
[0045] Specifically, the cause of the imbalance is determined based on the dynamic response value of each rotating component, the design parameters are adjusted and optimized based on the cause of the imbalance, and the three-dimensional model is reconstructed to obtain an optimized three-dimensional model.
[0046] Among them, in the process of optimizing the design parameters of the rotating device, dynamic response analysis is performed according to the vibration amplitude to determine the imbalance type corresponding to the imbalance point; according to the imbalance type, the corresponding optimization method is determined, and the design parameters corresponding to the imbalance point are optimized through the optimization method.
[0047] Specifically, vibration amplitude is an important indicator of the dynamic response of rotating parts. Different types of imbalance will lead to different characteristics of vibration amplitude changes. By conducting a detailed analysis of the changes in vibration amplitude with time, frequency and other factors, the type of imbalance corresponding to the imbalance point can be inferred. Common types of imbalance include static imbalance, dynamic imbalance and mixed imbalance. Static imbalance means that the center of gravity of the rotating part is not on the axis of rotation, resulting in an unbalanced torque in the static state; dynamic imbalance means that the rotating part not only has a center of gravity offset, but also generates a couple imbalance during rotation; mixed imbalance is a combination of static imbalance and dynamic imbalance.
[0048] Different types of imbalance require different optimization approaches. For static imbalance, the center of gravity of the rotating component can be restored to the axis of rotation by adding or removing counterweights in the opposite direction of the center of gravity offset. For dynamic imbalance, counterweight adjustments are usually made on two different planes of the rotating component to balance the couple. For mixed imbalance, the effects of static and dynamic imbalance must be comprehensively considered and appropriate counterweight adjustments must be made.
[0049] Once the optimization method is determined, the design parameters corresponding to the imbalance point need to be specifically adjusted and optimized. Design parameters may include the mass distribution, shape, and size of the rotating component. By changing these parameters, the imbalance can be corrected. For example, adding or removing counterweights will change the mass distribution of the rotating component; modifying the shape of the rotating component can affect its center of gravity and the distribution of couples.
[0050] S105: Using the optimized three-dimensional model, dynamic simulation is performed again based on multiple boundary conditions to verify whether the optimization result meets the optimization requirements.
[0051] Specifically, using the optimized 3D model, a rotational dynamic simulation was performed again according to the previously set boundary conditions. The dynamic response values obtained from the simulation were compared with those before optimization to evaluate whether the optimization effect met the expected optimization requirements, such as whether the vibration amplitude was reduced to within the allowable range.
[0052] Among them, the optimization requirements include vibration level, load level, and thermal performance level. The optimized vibration value, load value, and temperature change value are obtained respectively to determine whether the vibration value meets the vibration level, whether the load value meets the load level, and whether the temperature change value meets the thermal performance level.
[0053] Through three-dimensional modeling and dynamic simulation of the rotating device, the dynamic response value of each rotating component under different boundary conditions can be accurately calculated. Even for very small vibrations or slight imbalances, difficult-to-identify details can be captured, thereby improving the detection accuracy of the rotating device.
[0054] Furthermore, through simulation of the rotating device, the design parameters of each rotating component can be quickly adjusted and the dynamic simulation can be rerun to optimize the dynamic balance of the rotating device without the need to physically disassemble and reinstall the rotating components. This significantly shortens the design and optimization cycle and reduces the equipment usage costs required for physical testing and calibration.
[0055] like Figure 2 As shown, the embodiment of the present application also proposes an optimization device for the dynamic balance of a wafer rotating device, comprising:
[0056] at least one processor; and,
[0057] a memory communicatively connected to the at least one processor; wherein,
[0058] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute a method for optimizing the dynamic balance of a rotating base as described in any of the above embodiments.
[0059] An embodiment of the present application further provides a non-volatile computer storage medium storing computer executable instructions, wherein the computer executable instructions are configured to be: a method for optimizing the dynamic balance of a rotating base as described in any of the above embodiments.
[0060] The various embodiments in this application are described in a progressive manner. Similar portions between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences between the other embodiments. In particular, the device and medium embodiments are generally similar to the method embodiments, so their descriptions are relatively simple. For relevant portions, refer to the descriptions of the method embodiments.
[0061] The devices and media provided in the embodiments of the present application correspond one-to-one to the methods. Therefore, the devices and media also have similar beneficial technical effects to their corresponding methods. Since the beneficial technical effects of the methods have been described in detail above, the beneficial technical effects of the devices and media will not be repeated here.
[0062] It will be understood by those skilled in the art that embodiments of the present invention may be provided as methods, systems, or computer program products. Thus, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.
[0063] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.
[0064] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.
[0065] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.
[0066] In a typical configuration, a computing device includes one or more processors (CPUs), input / output interfaces, network interfaces, and memory.
[0067] Memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. Memory is an example of a computer-readable medium.
[0068] Computer-readable media includes permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. The information can be computer-readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer-readable media does not include transitory computer-readable media (transitory media), such as modulated data signals and carrier waves.
[0069] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent to such process, method, commodity, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, commodity, or apparatus that includes the element.
[0070] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.
Claims
1. A method for optimizing the dynamic balance of a rotating base, characterized in that: include: Creating an initial three-dimensional model of the rotating device based on design parameters corresponding to each rotating component in the rotating device; Based on predefined working environment parameters, a plurality of boundary conditions are set, and a rotational dynamic simulation is performed based on the plurality of boundary conditions respectively through the initial three-dimensional model; respectively calculating the dynamic response values of the rotating components corresponding to the boundary conditions, and determining the unbalance points of the rotating components; Optimizing the design parameters corresponding to the unbalanced points according to the dynamic response values to obtain an optimized three-dimensional model; By using the optimized three-dimensional model, dynamic simulation is performed again based on multiple boundary conditions to verify whether the optimization result meets the optimization requirements.
2. The method for optimizing the dynamic balance of a rotating base according to claim 1, characterized in that: The method of setting multiple boundary conditions based on predefined working environment parameters specifically includes: Determining working environment parameters and corresponding parameter value variation ranges based on the historical working environment of the rotating device, and defining the working environment parameters; Within the parameter value variation range, selecting a plurality of working environment parameter values corresponding to the working environment parameter; The plurality of working environment parameter values are combined to generate a plurality of different boundary conditions.
3. The method for optimizing the dynamic balance of a rotating base according to claim 2, characterized in that: The working environment parameters include temperature parameters, speed parameters, load parameters and vibration parameters; Within the parameter value variation range, selecting a plurality of working environment parameter values corresponding to the working environment parameter specifically includes: Calculating the working environment change rates corresponding to the working environment parameters according to the historical working environment of the rotating device; Obtaining a first parameter whose working environment change rate is lower than a preset threshold, calculating an average value of the first parameter, and setting the average value as an ideal working environment parameter value of the rotating device; Obtaining a second parameter whose rate of change of the working environment is not less than a preset threshold, and determining the number of parameter values corresponding to the working environment parameter by a random discretization method; The ideal working environment parameter value is set to a fixed value, and the corresponding non-ideal working environment parameter value is randomly selected from the second parameter based on the number of parameter values corresponding to the non-ideal working environment parameter through a random sampling method.
4. The method for optimizing the dynamic balance of a rotating base according to claim 1, characterized in that: The step of respectively calculating the dynamic response values of the rotating components corresponding to the boundary conditions to determine the unbalance points of the rotating components specifically includes: Collecting the position points of each rotating component at different time points based on a preset time period, and calculating the displacement data of each rotating component; determining a rotational speed and a rotational acceleration of each rotating component within the preset time period based on the displacement data; converting the displacement data, the rotational speed, and the rotational acceleration into corresponding frequency data, and determining the vibration amplitude of each rotating component according to the frequency data; The vibration amplitude of each rotating component is matched with the natural frequency and vibration mode corresponding to each rotating component, and the unbalance point is determined according to the matching result.
5. The method for optimizing the dynamic balance of a rotating base according to claim 4, characterized in that: Determining the imbalance point according to the matching result specifically includes: Determining the presence of mismatched rotating parts to be optimized; Constructing a vibration spatial distribution based on the vibration amplitude corresponding to the rotating component to be optimized; An unbalance point in the rotating component to be optimized is determined according to the spatial distribution of vibration.
6. The method for optimizing the dynamic balance of a rotating base according to claim 5, characterized in that: Optimizing the design parameters corresponding to the unbalanced point according to the dynamic response value specifically includes: Performing a dynamic response analysis based on the vibration amplitude to determine the imbalance type corresponding to the imbalance point; According to the imbalance type, a corresponding optimization method is determined, and the design parameters corresponding to the imbalance point are optimized by the optimization method.
7. The method for optimizing the dynamic balance of a rotating base according to claim 6, characterized in that: The types of imbalance include uneven mass distribution, irregular shape, and eccentricity of rotating parts; Determining a corresponding optimization method according to the imbalance type specifically includes: When the imbalance type is uneven mass distribution, adjusting the mass parameter corresponding to the imbalance point; When the imbalance type is irregular shape, adjusting the shape parameters corresponding to the imbalance point, the shape parameters including thickness, radius and length; When the imbalance type is eccentricity of the rotating component, the center of gravity position of the rotating component corresponding to the imbalance point is adjusted.
8. The method for optimizing the dynamic balance of a rotating base according to claim 1, characterized in that: Verifying whether the optimization result meets the optimization requirements specifically includes: The optimization requirements include vibration level, load level, and thermal performance level; The optimized vibration value, load value, and temperature change value are respectively obtained to determine whether the vibration value meets the vibration level, whether the load value meets the load level, and whether the temperature change value meets the thermal performance level.
9. An optimization device for the dynamic balance of a wafer rotating device, characterized in that: include: at least one processor; as well as, a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute a method for optimizing the dynamic balancing of a rotating base as described in any one of claims 1 to 8.
10. A non-volatile computer storage medium storing computer executable instructions, characterized in that: The computer executable instructions are configured as: a method for optimizing the dynamic balance of a rotating base as described in any one of claims 1 to 8.