PCB structure optimization design method and device, storage medium and program product

Abstract

The invention discloses a PCB structure optimization design method and device, a storage medium and a program product, and relates to the technical field of PCB structure design, the method comprises the steps that a parameterized geometric model of a PCB is acquired, and screw layout parameters in the parameterized geometric model are defined as adjustable parameters; the test values of the screw layout parameters are substituted into the parameterized geometric model, then vibration fatigue analysis is carried out to obtain an analysis result, and the analysis result comprises the solving result of the inherent frequency and the maximum stress of the PCB; and according to the test value and the corresponding solution result, performing parameter optimization by taking the screw layout parameter as an optimization variable and taking the inherent frequency and the maximum stress as optimization targets to obtain a target value of the screw layout parameter. The reliability of the PCB under the influence of the vibration load can be improved, so that the reliability of an electronic product can be improved, and the service life of the electronic product is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit board (PCB) structure design, and in particular to a PCB structure optimization design method, device, computer-readable storage medium, and computer program product. Background Art

[0002] Electronic products are constantly exposed to unavoidable vibrations during normal operation and transportation. These vibrations can cause vibration fatigue damage to some of the electronic components within these products, shortening the product's lifespan. The PCB is the most critical component affecting the functionality of electronic products. Vibration fatigue damage to the PCB under the influence of vibration can cause malfunctions or even inoperability. Therefore, improving the reliability of PCBs under vibration loads, thereby enhancing the reliability and extending the lifespan of electronic products, is a pressing issue. Summary of the Invention

[0003] The main purpose of this application is to provide a PCB structure optimization design method, equipment, computer-readable storage medium and computer program product, aiming to solve the problem of improving the reliability of PCB boards under the influence of vibration loads to improve the reliability of electronic products and extend the service life of electronic products.

[0004] To achieve the above objectives, the present application proposes a PCB structure optimization design method, which includes:

[0005] Obtaining a parameterized geometric model of the PCB board, wherein screw layout parameters in the parameterized geometric model are defined as adjustable parameters;

[0006] Substituting the experimental values of the screw layout parameters into the parameterized geometric model, and performing vibration fatigue analysis to obtain analysis results, wherein the analysis results include the solution results of the natural frequency and maximum stress of the PCB board;

[0007] According to the test values and the corresponding solution results, parameter optimization is performed with the screw layout parameters as optimization variables and the natural frequency and the maximum stress as optimization targets to obtain the target values of the screw layout parameters.

[0008] Optionally, the step of performing parameter optimization based on the test values and the corresponding solution results, taking the screw layout parameters as optimization variables and the natural frequency and the maximum stress as optimization targets, to obtain target values of the screw layout parameters includes:

[0009] Taking the screw layout parameters as optimization variables and the natural frequency and the maximum stress as optimization targets, and according to the plurality of test values and the solution results corresponding to the plurality of test values, establishing an approximate model between the optimization variables and the optimization targets;

[0010] Performing parameter optimization on the approximate model to obtain candidate values of the screw layout parameters;

[0011] Verify whether the candidate value meets the preset optimization stop condition;

[0012] If the candidate value meets the optimization stop condition, the candidate value is used as the target value of the screw layout parameter;

[0013] If the candidate value does not meet the optimization stopping condition, after obtaining multiple new experimental values of the screw layout parameters and the solution results corresponding to the multiple new experimental values, return to execute the step of establishing an approximate model between the optimization variable and the optimization target based on the multiple experimental values and the solution results corresponding to the multiple experimental values.

[0014] Optionally, the optimization stopping condition includes: the optimization error is less than a preset error threshold, wherein the optimization error is the error between the model value and the candidate solution result, the candidate solution result is the solution result corresponding to the candidate value, and the model value is the value of the optimization target corresponding to the candidate value in the approximate model.

[0015] Optionally, before the step of substituting the experimental values of the screw layout parameters into the parameterized geometric model and performing vibration fatigue analysis to obtain analysis results, the method further includes:

[0016] Obtaining the value range of the screw layout parameter;

[0017] A plurality of test values of the screw layout parameters are sampled within the value range to obtain.

[0018] Optionally, the analysis results further include stress calculation results and strain calculation results of various parts of the PCB board. After the step of obtaining the target value of the screw layout parameter, the step further includes:

[0019] Calculating the damage value of each component in the PCB board according to the stress calculation result and the strain calculation result corresponding to the target value;

[0020] Calculating the failure time and failure probability of each component according to the damage value of each component;

[0021] A failure probability curve of the PCB board is generated according to the failure time and failure probability of each component.

[0022] Optionally, the step of substituting the experimental values of the screw layout parameters into the parameterized geometric model and then performing vibration fatigue analysis to obtain analysis results includes:

[0023] After substituting the experimental values of the screw layout parameters into the parameterized geometric model, the parameterized geometric model is meshed;

[0024] Setting constraint conditions on the parameterized geometric model after meshing according to actual installation conditions corresponding to the test values;

[0025] Modal analysis and random vibration analysis are performed on the parameterized geometric model after setting the constraint conditions to obtain analysis results.

[0026] Optionally, the step of obtaining a parameterized geometric model of the PCB board includes:

[0027] Obtaining the initial design engineering file of the PCB board;

[0028] Generating a three-dimensional geometric model of the PCB board according to the initial design engineering file;

[0029] The screw layout parameters in the three-dimensional geometric model are defined as adjustable parameters to convert the three-dimensional geometric model into a parameterized geometric model.

[0030] Optionally, the step of generating the three-dimensional geometric model of the PCB board according to the initial design engineering file includes:

[0031] Obtaining attribute information of an actual sample of the PCB board;

[0032] The initial design engineering file is updated according to the attribute information, and a three-dimensional geometric model of the PCB board is generated according to the updated initial design engineering file.

[0033] Optionally, the screw layout parameters include one or more of an installation position of the screw in the PCB board, a diameter of a fixing hole of the screw, and a material property of the screw.

[0034] In addition, to achieve the above-mentioned purpose, the present application also proposes a PCB structure optimization design device, which includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the steps of the PCB structure optimization design method as described above.

[0035] In addition, to achieve the above-mentioned purpose, the present application also proposes a storage medium, which is a computer-readable storage medium. A computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the PCB structure optimization design method described above are implemented.

[0036] In addition, to achieve the above-mentioned purpose, the present application also provides a computer program product, which includes a computer program, and when the computer program is executed by a processor, it implements the steps of the PCB structure optimization design method as described above.

[0037] In this application, a parametric geometric model of a PCB board with adjustable screw layout parameters is obtained, and the experimental values of the screw layout parameters are substituted into the parametric geometric model to perform a vibration fatigue analysis to obtain the solution results of the natural frequency and maximum stress of the PCB board, providing data support for parameter optimization; based on the experimental values and the corresponding solution results, parameter optimization is performed with the screw layout parameters as optimization variables and the natural frequency and maximum stress as optimization targets to obtain the target values of the screw layout parameters. Since the target values are the values of the screw layout parameters that make the natural frequency of the PCB board higher and the maximum stress smaller, they can be used as a reference for designers to design a physical PCB board with a higher natural frequency and smaller maximum stress, thereby improving the reliability of the PCB board under the influence of vibration loads, and further improving the reliability of electronic products and extending the service life of electronic products. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0039] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0040] Figure 1 A schematic diagram of a flow chart provided for the first embodiment of the PCB structure optimization design method of this application;

[0041] Figure 2 A schematic diagram of a PCB structure optimization design process according to an embodiment of the present application;

[0042] Figure 3 This is a simplified example diagram of a PCB board involved in one embodiment of the present application;

[0043] Figure 4A comparison chart of failure probability curves corresponding to initial design parameters and optimized design parameters involved in one embodiment of the present application;

[0044] Figure 5 A deformation cloud diagram of a PCB board under initial design parameters according to an embodiment of the present application;

[0045] Figure 6 A deformation cloud diagram of a PCB board under optimized design parameters according to an embodiment of the present application;

[0046] Figure 7 This is a stress cloud diagram of a PCB board under the initial design parameters involved in one embodiment of the present application;

[0047] Figure 8 This is a stress cloud diagram of a PCB board under optimized design parameters according to one embodiment of the present application;

[0048] Figure 9 This is a schematic diagram of the device structure of the hardware operating environment involved in the PCB structure optimization design method in the embodiment of the present application.

[0049] The purpose, features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0050] It should be understood that the specific embodiments described herein are merely used to explain the technical solutions of the present application and are not intended to limit the present application.

[0051] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0052] Electronic products are constantly exposed to unavoidable vibrations during normal operation and transportation. These vibrations can cause vibration fatigue damage to some of the electronic components within these products, shortening the product's lifespan. The PCB (Printed Circuit Board) is the most critical component affecting the functionality of electronic products. Vibration fatigue damage to the PCB under the influence of vibration can cause malfunctions or even inoperability. Therefore, improving the reliability of PCBs under vibration loads, thereby enhancing the reliability and extending the lifespan of electronic products, is a pressing issue.

[0053] In order to solve the above-mentioned technical problems, the embodiment of the present application proposes to improve the reliability of the PCB board from the perspective of optimizing the design of the screw layout parameters of the PCB board. Specifically, compared with the current electrical hardware engineers who focus on whether the functions of the designed PCB board meet the requirements while ignoring the structural strength design, the embodiment of the present application optimizes the design of the screw layout parameters of the PCB board to guide the research and development to perform forward design, thereby improving the reliability of the PCB board, increasing the service life of the product, and reducing the maintenance cost of the product in the later stage. In the solution proposed in the embodiment of the present application, a parametric geometric model of the PCB board with adjustable screw layout parameters is obtained, and the experimental values of the screw layout parameters are substituted into the parametric geometric model to perform vibration fatigue analysis to obtain the solution results of the natural frequency and maximum stress of the PCB board, providing data support for parameter optimization; based on the experimental values and the corresponding solution results, parameter optimization is performed with the screw layout parameters as the optimization variables and the natural frequency and maximum stress as the optimization targets to obtain the target values of the screw layout parameters. Since the target values are obtained through parameter optimization to determine the screw layout parameters that result in a higher natural frequency and lower maximum stress for the PCB board, designers can use this as a reference to design physical PCB boards with higher natural frequencies and lower maximum stresses, thereby improving the reliability of the PCB board under vibration loads, and in turn, increasing the reliability and extending the service life of electronic products.

[0054] The following is a first embodiment of the PCB structure optimization design method of the present application. Figure 1 , Figure 1 This is a flow chart of the first embodiment of the PCB structure optimization design method of this application. The execution subject of the PCB structure optimization design method in this embodiment can be a computing service device with data processing, network communication and program running functions, such as a tablet computer, personal computer, mobile phone, etc., or an electronic device that can realize the above functions. The execution subject is omitted below, and this embodiment and the following embodiments are described. In this embodiment, the PCB structure optimization design method includes steps S10 to S30:

[0055] Step S10: obtaining a parameterized geometric model of the PCB board, wherein screw layout parameters in the parameterized geometric model are defined as adjustable parameters.

[0056] The geometric model of the PCB board refers to a three-dimensional geometric model of the PCB board, including data on the PCB board's three-dimensional geometry and structure that affect the PCB board's vibration characteristics, as well as data that can support vibration fatigue simulation analysis. For example, it can include information such as the geometric features (geometry, laminate structure, key slots, cutouts, etc.) and material properties of the PCB substrate, as well as information such as the geometric features (component height, package type, etc.) and material properties of key components. In this step, the parametric geometric model of the PCB board refers to a three-dimensional geometric model of the PCB board in which some or all parameters are defined as adjustable parameters, and the adjustable parameters include screw layout parameters. That is, the adjustable parameters in the parametric geometric model at least include screw layout parameters. The screw installation position, the diameter of the screw fixing hole, the screw material properties, and other factors may all affect the vibration characteristics of the PCB, thereby affecting the reliability of the PCB. In this embodiment, the screw layout parameters refer to screw-related parameters that affect the vibration characteristics of the PCB. However, these parameters are not limited to a specific set and can be set according to specific design requirements. For example, in one feasible embodiment, the screw layout parameters may include one or more of the screw installation position on the PCB, the screw fixing hole diameter, and the screw material properties. In other embodiments, the screw layout parameters may also include other screw-related parameters.

[0057] There are many ways to obtain a parametric geometric model of a PCB, which are not limited in this embodiment. For example, in a specific embodiment, a designer can import a design file containing a parametric geometric model of a PCB to obtain the parametric geometric model. Alternatively, a designer can import an initial design engineering file of the PCB and then generate the parametric geometric model of the PCB based on the initial design engineering file.

[0058] Step S20: Substituting the experimental values of the screw layout parameters into the parameterized geometric model, and performing vibration fatigue analysis to obtain analysis results, wherein the analysis results include the solution results of the natural frequency and maximum stress of the PCB board.

[0059] The experimental value of a screw layout parameter refers to a value within the parameter range of the screw layout parameter. During the trial phase, when the final value has not yet been determined, this value is referred to as the experimental value to distinguish it. It should be noted that the screw installation position and the diameter of the screw fixing hole are two different parameters. The installation positions of multiple screws are multiple parameters. If the screw layout parameter includes multiple parameters, the experimental value refers to the experimental value corresponding to each of the multiple parameters.

[0060] The screw layout parameters in the parametric geometric model are adjustable. After substituting the experimental values of the screw layout parameters into the parametric geometric model, the values of the screw layout parameters in the parametric geometric model are fixed. Vibration fatigue analysis is then performed on the parametric geometric model after the fixed parameters to obtain analysis results. Vibration fatigue analysis is a simulation analysis that simulates the vibration process to determine the natural frequency and maximum stress of the PCB board when the screw layout parameters are fixed. In this embodiment, there is no limitation on the implementation method of the vibration fatigue analysis. For example, finite element simulation analysis can be used.

[0061] By substituting different test values into the parameterized geometric model for vibration fatigue analysis, different analysis results can be obtained. The test values and the analysis results correspond one-to-one, that is, the test values correspond one-to-one to the solution results of the natural frequency and maximum stress of the PCB board.

[0062] Step S30, based on the test values and the corresponding solution results, parameter optimization is performed with the screw layout parameters as optimization variables and the natural frequency and the maximum stress as optimization targets to obtain target values of the screw layout parameters.

[0063] The natural frequency of a PCB refers to the frequency characteristics of its free vibration without external interference. The higher the natural frequency, the lower the risk of resonance and the higher the reliability. The maximum stress of a PCB refers to the maximum stress generated internally when the PCB is subjected to loads (such as vibration and thermal expansion). The lower the maximum stress, the less likely the PCB will be affected by vibration and the higher the reliability.

[0064] Parameter optimization with screw layout parameters as optimization variables and natural frequency and maximum stress as optimization targets means: finding under which test value, the corresponding solution result is better or optimal, that is, finding under which test value, the corresponding natural frequency is higher or highest, and the corresponding maximum stress is smaller or smallest. The test value determined by parameter optimization that makes the solution result better or optimal is used as the target value. The target value obtained can be used as a reference for designers to design the screw layout parameters of the physical PCB board. Since the target value is a value obtained by parameter optimization that makes the natural frequency of the PCB board higher and the maximum stress smaller, it can be used as a reference for designers to design a physical PCB board with a higher natural frequency and smaller maximum stress, thereby improving the reliability of the PCB board under the influence of vibration loads, and further improving the reliability of electronic products and extending the service life of electronic products.

[0065] There are many specific implementation methods for parameter optimization, which are not limited in this embodiment. For example, in one feasible implementation, multiple test values can be obtained by sampling within the parameter value range of the screw layout parameter, and vibration fatigue analysis can be performed based on each of the multiple test values to obtain a solution. The solution results are then compared, and the test value corresponding to the optimal solution result is used as the target value.

[0066] In one feasible implementation, the functions corresponding to the PCB board structure optimization design method provided in this embodiment can be deployed in an application or service provided by a computer, server, mobile phone, or other device. The designer can import a design file containing a parametric geometric model of the PCB board or an initial design engineering file of the PCB board into the corresponding application or service. The application or service will then optimize the screw layout parameters of the PCB board and output the target value or the design file containing the target value. The designer can then view the target value on the device and then design the screw layout parameters of the physical PCB board with reference to the target value. In some implementations, the analysis results corresponding to the target value can also be output for the designer to view, and then the screw layout parameters of the physical PCB board can be designed with reference to the analysis results corresponding to the target value.

[0067] In a feasible embodiment, the analysis results also include stress calculation results and strain calculation results of various parts of the PCB board. The stress calculation results reflect the stress conditions of various parts of the PCB board when the values of the screw layout parameters are fixed, for example, they may include the stress values of various parts of the PCB board. The strain calculation results reflect the strain conditions of various parts of the PCB board when the values of the screw layout parameters are fixed, for example, they may include the strain values of various parts of the PCB board. By performing vibration fatigue analysis on the parameterized geometric model after substituting the target values of the screw layout parameters, the stress calculation results and strain calculation results of the PCB board are obtained, which can be used for designers to understand the stress and strain conditions of various parts of the PCB board when the screw layout parameters of the PCB board are designed according to the target values, thereby better understanding the reliability of the PCB board, which is conducive to designing a design entity PCB board with higher reliability.

[0068] In one embodiment, a stress distribution diagram of the PCB can be generated based on the stress calculation results. Different colors are used to represent different stress levels at different locations on the PCB. This output allows designers to more intuitively understand the stress conditions at various locations on the PCB when the screw layout parameters are designed according to target values. Similarly, in one embodiment, a strain distribution diagram can be generated based on the strain calculation results, using different colors to represent different strain levels.

[0069] In a feasible implementation manner, after step S30, the following steps are further included: S40 to S60:

[0070] Step S40: Calculate the damage value of each component in the PCB board according to the stress calculation result and the strain calculation result corresponding to the target value.

[0071] Step S50 , calculating the failure time and failure probability of each component according to the damage value of each component.

[0072] Step S60: generating a failure probability curve of the PCB board according to the failure time and failure probability of each component.

[0073] PCBs typically contain multiple components, and the damage value of each component can be calculated based on the stress and strain calculation results. The failure time and failure probability of a component are multiple sets of data, each consisting of a time and a failure probability, representing the failure probability of the component at that future time point. For example, the failure probability of each component can be calculated for each year within the next 1 to 20 years. Multiplying the failure probabilities of each component at the same time point yields the overall failure probability of the PCB. Based on the overall time to failure (TTF) and probability of failure (PoF) of the PCB, a failure probability curve can be generated. This curve can have time as the horizontal axis and failure probability as the vertical axis. This curve can intuitively demonstrate the reliability of the PCB, thereby helping designers design more reliable physical PCBs. There are many ways to calculate damage values and calculate failure time and failure probability based on damage values, and these are not limited in this embodiment. For example, in one feasible implementation, calculations can be performed by calling Sherlock (an electronic hardware reliability analysis tool). Specifically, after obtaining the stress calculation results and strain calculation results corresponding to the target values, a file containing data such as the stress calculation results, the strain calculation results, and a parameterized geometric model of the PCB board can be imported into the Sherlock tool. The Sherlock tool calculates the damage value of each component based on the stress calculation results and strain calculation results in the imported file. The failure time and failure probability of each component are calculated based on the damage value. Finally, the failure probability of each component is multiplied to calculate the failure probability of the entire PCB board, and the failure probability curve is obtained by combining it with the Weibull distribution.

[0074] In this embodiment, a parametric geometric model of a PCB with adjustable screw layout parameters is obtained. Experimental values of the screw layout parameters are substituted into the parametric geometric model, and a vibration fatigue analysis is performed to obtain the natural frequency and maximum stress of the PCB, providing data support for parameter optimization. Based on the experimental values and the corresponding solution, a parameter optimization is performed using the screw layout parameters as optimization variables and the natural frequency and maximum stress as optimization targets to obtain target values for the screw layout parameters. Because the target values are obtained through parameter optimization, the screw layout parameters that result in a higher natural frequency and lower maximum stress for the PCB, allowing designers to design physical PCBs with higher natural frequencies and lower maximum stresses, thereby improving the reliability of the PCB under vibration loads and, in turn, enhancing the reliability and service life of electronic products. Furthermore, the optimized design scheme in this embodiment does not require experimental design of the screw layout parameters for the physical PCB, thus reducing product failure rates while maintaining the original design and production costs, resulting in a highly practical design.

[0075] Based on the above first embodiment, a second embodiment of the PCB structure optimization design method of the present application is proposed. In this embodiment, the same or similar contents as those of the above first embodiment can be referred to the above introduction and will not be repeated hereafter. In this embodiment, step S30 includes steps S301 to S304:

[0076] Step S301, taking the screw layout parameters as optimization variables, taking the natural frequency and the maximum stress as optimization targets, and establishing an approximate model between the optimization variables and the optimization targets based on the multiple test values and the solution results corresponding to the multiple test values.

[0077] A variety of experimental values of the screw layout parameters can be set. For example, assuming that the screw layout parameters include the diameter of the screw fixing hole, a variety of diameter values can be set. Using the set multiple experimental values, each of them is substituted into the parameterized geometric model and then subjected to vibration fatigue analysis to obtain analysis results. Then, the corresponding solution results of the multiple experimental values can be obtained. It can be understood that the solution results mentioned here refer to the solution results of the maximum stress and the natural frequency. After obtaining the multiple experimental values and the corresponding solution results, the screw layout parameters can be used as optimization variables, and the natural frequency and maximum stress can be used as optimization targets to establish an approximate model between the optimization variables and the optimization targets. An approximate model is a model that fits the relationship between the optimization variables and the optimization targets. Since it is a fitting rather than a true model, it is called an approximate model. There are many ways to establish an approximate model, which is not limited in this embodiment. For example, in one embodiment, the Box-Behnken (effect surface method) design method can be used. The Box-Behnken design method can take the least design points (experimental values) to establish an approximate model, that is, it can achieve the most comprehensive reflection of the model characteristics with the least design points.

[0078] The number of experimental values and solution results used to establish the approximate model, that is, the number of design points, can be set as needed. In this embodiment, there is no restriction. For example, 10 design points can be selected, that is, 10 experimental values and solution results can be selected to establish the approximate model.

[0079] The sources of the various experimental values of the screw layout parameters are not limited in this embodiment. For example, in one feasible implementation, a designer can set various experimental values. For example, in another feasible implementation, before step S20, steps S70 to S80 are further included:

[0080] Step S70: Obtain the value range of the screw layout parameter.

[0081] The value range of the screw layout parameter can be imported by the designer, or the value range can be generated according to the parameterized geometric model according to a set rule, and the rule can be pre-set by the designer.

[0082] Step S80: sampling and obtaining a plurality of test values of the screw layout parameters within the value range.

[0083] There are many sampling methods, which are not limited here. For example, random sampling can be used. In one feasible embodiment, the Box-Behnken design method can be used for sampling to take a minimum of design points (experimental values) to establish an approximate model. This allows the established approximate model to more accurately fit the relationship between the optimization variables and the optimization target, thereby enabling a more optimal or optimal target value to be found more quickly.

[0084] Step S302: Optimizing parameters of the approximate model to obtain candidate values of the screw layout parameters.

[0085] An approximate model is a model that fits the relationship between the optimization variables and the optimization objective. Therefore, mathematical calculations can be used to optimize this model and find its local or global optimal solution. There are many ways to optimize the parameters of an approximate model, which are not limited in this embodiment. For example, in one feasible implementation, a genetic algorithm can be used for parameter optimization.

[0086] Step S303: Verify whether the candidate value meets the preset optimization stop condition.

[0087] The optimization stopping condition can be pre-set as needed and is not limited in this embodiment. For example, in one feasible embodiment, the optimization stopping condition includes: the optimization error is less than a preset error threshold, where the optimization error is the error between the model value and the candidate solution result, the candidate solution result is the solution result corresponding to the candidate value, and the model value is the value of the optimization objective corresponding to the candidate value in the approximate model. The solution result corresponding to the candidate value is the maximum stress and natural frequency solution obtained by substituting the candidate value into the parameterized geometric model and performing vibration fatigue analysis. It is understood that since the approximate model is a model that fits the relationship between the optimization variables and the optimization objective, the value of the optimization objective can be calculated by substituting the candidate value into the approximate model. This value is referred to as the candidate value for distinction. The preset error threshold can be set as needed and is not limited in this embodiment. If the error between the model value and the candidate solution result is less than the preset error threshold, it indicates that the approximate model has a good fit for the relationship between the optimization variables and the optimization objective, and the candidate value obtained by parameter optimization using the approximate model is not significantly different from the ideal optimization result. In this case, the optimization can be stopped. If the error between the model value and the candidate solution result is greater than or equal to the preset error threshold, it means that the approximate model does not fit the relationship between the optimization variable and the optimization target well. The candidate value obtained by parameter optimization through the approximate model is significantly different from the ideal optimization result. In this case, the optimization can continue.

[0088] If the candidate value meets the optimization stop condition, step S304 is executed: the candidate value is used as the target value of the screw layout parameter.

[0089] If the candidate value does not meet the optimization stop condition, after obtaining multiple new test values of the screw layout parameters and the solution results corresponding to the multiple new test values, the process returns to step S301.

[0090] If the candidate values do not meet the optimization stopping conditions, new parameter values can be reset. Based on the new parameter values and the corresponding solution results, the approximate model is re-established to optimize and obtain candidate values. The candidate values are then verified to see if they meet the optimization stopping conditions. The process is repeated until the optimization stopping conditions are met, and the target values of the screw layout parameters are obtained. It is understood that the obtained new test values may overlap with previously used test values, but cannot be identical.

[0091] In this embodiment, by taking the screw layout parameters as optimization variables and the natural frequency and maximum stress as optimization targets, an approximate model between the optimization variables and the optimization targets is established based on multiple test values and the solution results corresponding to the multiple test values, and the approximate model is optimized to obtain candidate values of the screw layout parameters. When the candidate values do not meet the preset optimization stop conditions, the approximate model is re-established based on multiple new test values and the corresponding solution results to perform parameter optimization, and the process is iterated until the preset optimization stop conditions are met, and the candidate values are used as target values. This provides a more efficient screw layout parameter optimization method, which can more quickly find better screw layout parameter values, thereby improving the efficiency of PCB board reliability structure optimization design, improving the reliability of the PCB board, and extending the life of the electronic equipment.

[0092] Based on the above-mentioned first and / or second embodiments, a third embodiment of the PCB structure optimization design method of the present application is proposed. In this embodiment, the same or similar contents as those of the above-mentioned first and second embodiments can be referred to above and will not be described in detail. In this embodiment, step S10 includes S101 to S102:

[0093] Step S101: obtaining the initial design engineering file of the PCB board.

[0094] The initial design engineering file is a design engineering file of the initial version of the PCB board designed by the designer, for example, it can be an ECAD (Electronic Computer Aided Design) file of the initial version of the PCB board. The initial design engineering file can be imported by the designer.

[0095] Step S102: generating a three-dimensional geometric model of the PCB board according to the initial design engineering file.

[0096] There are many ways to generate a three-dimensional geometric model, which are not limited in this embodiment. For example, in one possible implementation, the Sherlock tool can be called to generate a finite element analysis (FEA) file based on the initial design engineering file. The FEA file includes a three-dimensional geometric model of the PCB board.

[0097] Step S103 : defining the screw layout parameters in the three-dimensional geometric model as adjustable parameters, so as to convert the three-dimensional geometric model into a parameterized geometric model.

[0098] The screw layout parameters in the 3D geometric model are fixed. By defining the screw layout parameters in the 3D geometric model as adjustable parameters, the 3D geometric model can be converted into a parametric geometric model, so that a variety of test values can be used for subsequent vibration fatigue analysis.

[0099] In one feasible embodiment, the screw layout parameters in the 3D geometric model can be defined as adjustable parameters by calling 3D modeling software to convert the 3D geometric model into a parametric geometric model. The 3D modeling software can be, for example, a 3D CAD (Computer Aided Design) system such as SolidWorks or ProE.

[0100] In one feasible implementation, step S102 includes S1021 to S1022:

[0101] Step S1021: Acquire attribute information of an actual sample of the PCB board.

[0102] An actual sample can be a PCB with pre-designed screw layout parameters, an electronic device with a PCB installed, or a semi-finished product. Attribute information can include information such as the PCB component packaging and solder joint locations. This attribute information can be uploaded by the designer.

[0103] Step S1022: updating the initial design engineering file according to the attribute information, and generating a three-dimensional geometric model of the PCB board according to the updated initial design engineering file.

[0104] The initial design engineering file may not contain the attribute information of the actual sample. By obtaining the attribute information and updating the initial design engineering file based on the attribute information, and then generating a 3D geometric model of the PCB board, a more complete and accurate 3D geometric model can be obtained, thereby making the results of subsequent vibration fatigue analysis more accurate, and thus more conducive to designing highly reliable PCB board screw layout parameter values.

[0105] In one feasible implementation, step S20 includes S201 to S203:

[0106] Step S201 : Substituting the experimental values of the screw layout parameters into the parameterized geometric model, the parameterized geometric model is meshed.

[0107] The purpose of meshing the parametric geometric model of a PCB is to convert the continuous geometric structure into discrete finite elements so that its physical behavior can be simulated by numerical methods (such as finite element analysis). Specifically, this can be done by dividing the complex three-dimensional structure of the PCB (such as substrate, solder joints, components, etc.) into simple-shaped units (such as tetrahedrons and hexahedrons).

[0108] Step S202 : setting constraint conditions for the parameterized geometric model after meshing according to the actual installation conditions corresponding to the test values.

[0109] The actual installation conditions corresponding to the test values refer to the actual installation conditions of the PCB board according to the test values. This is a hypothetical situation, not a real installation. The purpose of setting constraints according to the actual installation conditions is to simulate the actual installation conditions. For example, during actual installation, screws need to be fixed in the mounting holes. The screws will be constrained and will not move arbitrarily during vibration. Setting constraints is to simulate this installation condition.

[0110] Step S203 , performing modal analysis and random vibration analysis on the parameterized geometric model after setting the constraint conditions to obtain analysis results.

[0111] By performing modal analysis on the parameterized geometric model and solving the characteristic equation, the natural frequency and vibration mode of the PCB can be calculated. Based on the results of the modal analysis, random vibration analysis can be performed to determine the maximum stress of the PCB.

[0112] In order to help understand the implementation process of the PCB structure optimization design method in the above embodiments, an implementation example is given. Figure 2 As shown, in this example, the structural optimization design of the PCB board can be achieved according to the following process.

[0113] S1. Generate FEA files that can be used for finite element simulation based on the initial ECAD files of the PCB board.

[0114] The Sherlock tool can be called to update the initial ECAD file of the PCB board according to the attribute information of the actual PCB board sample, and then the Sherlock tool can be called to generate an FEA file that can be used for finite element simulation based on the initial ECAD file of the PCB board, which includes a three-dimensional geometric model of the PCB board.

[0115] S2. Obtain a parametric geometric model with adjustable screw layout parameters based on the FEA file.

[0116] The FEA file is imported into the ANSYS tool (a finite element analysis software), and the built-in 3D modeling tool in the ANSYS tool is called to define the screw layout parameters as adjustable parameters to convert the 3D geometric model into a parametric geometric model.

[0117] Exemplarily, the screw layout parameters include the installation positions of the four screws and the diameters of the fixing holes, where the diameter is represented by D, and the four installation positions are represented as (X1, Y1), (X2, Y2), (X3, Y3), and (X4, Y4), respectively. Figure 3 This is a simplified example diagram of a PCB board. Four screws are represented by solid black circles, and the range of values for their installation positions is shown. Table 1 below provides an example of parameter value ranges.

[0118] Table 1

[0119] Screw layout parameters Minimum Median Maximum Diameter D, mm 3 4 5 Horizontal axis Xi, mm 89.27 90.27 91.27 Vertical coordinate Yi, mm 51.17 52.17 53.17

[0120] S3. Sample the design points and establish an approximate model between the screw layout parameters and the natural frequency and maximum stress of the PCB board based on the results of the vibration fatigue analysis.

[0121] Using screw layout parameters as optimization variables and the PCB's natural frequency (expressed as W) and maximum stress (expressed as Stress) as optimization targets, the experimental design was conducted using the Box-Behnken design method. Through rational sampling, the model characteristics were reflected as comprehensively as possible with a minimum number of design points, establishing an approximate model between the optimization variables and the optimization target. The experimental values required to establish the approximate model (the solution results for the natural frequency and maximum stress) were obtained by using the ANSYS tool to mesh the parameterized geometric model into which the experimental values were substituted. Constraints were then set according to the actual installation conditions corresponding to the experimental values. Modal analysis and random vibration analysis were then performed to obtain analysis results corresponding to the experimental values, including the solution results for the natural frequency and maximum stress.

[0122] S4. Perform global optimization on the approximate model using a genetic algorithm to obtain candidate values.

[0123] S5: Verify whether the optimization error of the candidate value is less than the preset error threshold. If the optimization error of the candidate value is less than the preset error threshold, execute step S6; if the optimization error of the candidate value is greater than or equal to the preset error threshold, return to step S3.

[0124] S6. Taking the candidate value as the target value.

[0125] Table 2 below compares the optimized design parameters (optimized values) with the designer's initial design parameters (initial values). These optimized design parameters are the target values obtained by optimizing the screw layout parameters of the PCB board using the optimization design process in this example. Table 2 shows that the natural frequency corresponding to the optimized values is 6.47% higher than that corresponding to the initial values, and the maximum stress corresponding to the optimized values is -17% lower than that corresponding to the initial values. This achieves the effect of increasing the natural frequency and reducing the maximum stress, thereby reducing the degree of vibration fatigue damage to the PCB board caused by vibration loads and improving the reliability of the PCB board.

[0126] Table 2

[0127] parameter D,mm X1,mm X2,mm X3,mm X4,mm Initial value 4 90.27 90.27 90.27 90.27 Optimization value 5 89.271 89.277 89.28 89.277 Relative difference — — — — — parameter Y1,mm Y2,mm Y3,mm Y4,mm Initial value 52.17 52.17 52.17 52.17 Optimization value 51.171 51.18 51.172 51.179 Relative difference — — — — parameter W,Hz Stress, MPa Initial value 150.73 7.8255 Optimization value 160.48 6.495 Relative difference +6.47％ -17％

[0128] S7. Generate a failure probability curve corresponding to the target value.

[0129] The analysis results corresponding to the target value (including stress calculation results and strain calculation results) are then imported into the Sherlock tool, and the Sherlock tool is called to generate a failure probability curve based on the stress calculation results and strain calculation results.

[0130] like Figure 4 The failure probability curve corresponding to the initial design parameters and the failure probability curve corresponding to the optimized design parameters are given. Figure 4 It can be clearly seen that the failure rate of the PCB board under the initial design parameters exceeds 20% after about 1.5 years under random vibration conditions, but the failure rate of the PCB board under the optimized design parameters only exceeds 20% after about 3.5 years under random vibration conditions. The service life and reliability of the PCB board are greatly improved. Figure 5 This is the deformation cloud diagram of the PCB board at the natural frequency (150.73Hz) under the initial design parameters output by the ANSYS tool. Figure 6 This is a deformation cloud map of the PCB board at the natural frequency (160.48Hz) under the optimized design parameters output by the ANSYS tool. The deformation cloud map uses colors to distinguish different degrees of deformation. Red indicates a larger degree of deformation, and blue indicates a smaller degree of deformation. The unit of the deformation scale is millimeter (mm). The type, frequency, unit and other information marked in the figure are the relevant marking information of the stress cloud map output by the ANSYS tool. Figure 7 This is the stress cloud diagram of the PCB board under random vibration under the initial design parameters output by the ANSYS tool. Figure 8This is the stress cloud diagram of the PCB board under random vibration under the optimized design parameters output by the ANSYS tool. The stress cloud diagram uses colors to distinguish different stress sizes. Red indicates a larger stress value, and blue indicates a smaller stress value. The stress unit is MPa. The type, scale factor value, probability, unit, time and other information marked in the figure are the relevant marking information of the stress cloud diagram output by the ANSYS tool. Figure 8 Compared to Figure 7 , the stress distribution changes significantly.

[0131] An embodiment of the present application provides a PCB structure optimization design device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the PCB structure optimization design method in the above-mentioned embodiment 1.

[0132] Reference below Figure 9 , which shows a schematic diagram of the structure of a PCB structure optimization design device suitable for implementing the embodiment of the present application. The PCB structure optimization design device in the embodiment of the present application can be a control unit in an RNC system. Figure 9 The PCB structure optimization design device shown is merely an example and should not impose any limitations on the functions and scope of use of the embodiments of the present application.

[0133] like Figure 9 As shown, the PCB structure optimization and design device may include a processing device 1001 (e.g., a DSP processor, etc.), which can perform various appropriate actions and processes based on programs stored in a read-only memory 1002 or programs loaded from a storage device 1003 into a random access memory 1004. Random access memory 1004 also stores various programs and data required for the operation of the PCB structure optimization and design device. Processing device 1001, read-only memory 1002, and random access memory 1004 are interconnected via a bus 1005. An input / output interface 1006 is also connected to the bus. Typically, the following systems may be connected to the input / output interface 1006: an input device 1007 including, for example, a microphone or accelerometer; an output device 1008 including, for example, a speaker or vibrator; a storage device 1003 including, for example, a magnetic tape or hard disk; and a communication device 1009. The communication device 1009 can allow the PCB structure optimization and design device to communicate with other devices wirelessly or wired to exchange data. Although the drawings show a PCB structure optimization design device with various systems, it should be understood that it is not required to implement or possess all the systems shown, and more or fewer systems may be implemented or possessed instead.

[0134] In particular, according to the embodiments disclosed in the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, the embodiments disclosed in the present application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program comprising program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via a communication device, or installed from a storage device 1003, or installed from a read-only memory 1002. When the computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiment disclosed in the present application are performed.

[0135] Compared with the prior art, the beneficial effects of the PCB structure optimization design device provided in the embodiment of the present application are the same as the beneficial effects of the PCB structure optimization design method provided in the above embodiment, and the other technical features in the PCB structure optimization design device are the same as the features disclosed in the method of the previous embodiment, which will not be repeated here.

[0136] It should be understood that the various parts disclosed in the embodiments of the present application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any appropriate manner in any one or more embodiments or examples.

[0137] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

[0138] An embodiment of the present application provides a computer-readable storage medium having computer-readable program instructions (i.e., a computer program) stored thereon, and the computer-readable program instructions are used to execute the PCB structure optimization design method in the above embodiment.

[0139] The computer-readable storage medium provided in the embodiments of the present application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems or devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system or device. The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0140] The computer-readable storage medium may be included in the PCB structure optimization design device; or it may exist independently without being assembled into the PCB structure optimization design device.

[0141] The above-mentioned computer-readable storage medium carries one or more programs. When the above-mentioned one or more programs are executed by the PCB structure optimization design device, the PCB structure optimization design device performs the above-mentioned functions defined in the method of the embodiment disclosed in this application.

[0142] Computer program code for performing the operations of the present application may be written in one or more programming languages, or a combination thereof, including object-oriented programming languages such as Java, Smalltalk, C++, and conventional procedural programming languages such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on the remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., through the Internet using an Internet service provider).

[0143] The flow charts and block diagrams in the accompanying drawings illustrate the possible architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, program segment or a part of code, and the module, program segment or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order than that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0144] The modules described in the embodiments of the present application may be implemented in software or hardware, wherein the name of a module does not necessarily limit the unit itself.

[0145] The readable storage medium provided in the embodiment of the present application is a computer-readable storage medium, which stores computer-readable program instructions (i.e., a computer program) for executing the above-mentioned PCB structure optimization design method. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in the embodiment of the present application are the same as the beneficial effects of the PCB structure optimization design method provided in the above-mentioned embodiment, and are not further elaborated here.

[0146] An embodiment of the present application also provides a computer program product, including a computer program, which, when executed by a processor, implements the steps of the above-mentioned PCB structure optimization design method.

[0147] Compared with the prior art, the beneficial effects of the computer program product provided in the embodiment of the present application are the same as the beneficial effects of the PCB structure optimization design method provided in the above embodiment, and will not be repeated here.

[0148] The above description is only part of the embodiments of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made by using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A PCB structure optimization design method, characterized in that: The PCB structure optimization design method includes: Obtaining a parameterized geometric model of the PCB board, wherein screw layout parameters in the parameterized geometric model are defined as adjustable parameters; Substituting the experimental values of the screw layout parameters into the parameterized geometric model, and performing a vibration fatigue analysis to obtain an analysis result, wherein the analysis result includes a solution result of the natural frequency and maximum stress of the PCB board; According to the test values and the corresponding solution results, parameter optimization is performed with the screw layout parameters as optimization variables and the natural frequency and the maximum stress as optimization targets to obtain the target values of the screw layout parameters.

2. The PCB structure optimization design method according to claim 1, characterized in that: The step of performing parameter optimization based on the test values and the corresponding solution results, taking the screw layout parameters as optimization variables and the natural frequency and the maximum stress as optimization targets, to obtain target values of the screw layout parameters includes: Taking the screw layout parameters as optimization variables and the natural frequency and the maximum stress as optimization targets, and according to the plurality of test values and the solution results corresponding to the plurality of test values, establishing an approximate model between the optimization variables and the optimization targets; Performing parameter optimization on the approximate model to obtain candidate values of the screw layout parameters; Verify whether the candidate value meets the preset optimization stop condition; If the candidate value meets the optimization stop condition, the candidate value is used as the target value of the screw layout parameter; If the candidate value does not meet the optimization stopping condition, after obtaining multiple new experimental values of the screw layout parameters and the solution results corresponding to the multiple new experimental values, return to execute the step of establishing an approximate model between the optimization variable and the optimization target based on the multiple experimental values and the solution results corresponding to the multiple experimental values.

3. The PCB structure optimization design method according to claim 2, characterized in that: The optimization stopping condition includes: the optimization error is less than a preset error threshold, wherein the optimization error is the error between the model value and the candidate solution result, the candidate solution result is the solution result corresponding to the candidate value, and the model value is the value of the optimization target corresponding to the candidate value in the approximate model.

4. The PCB structure optimization design method according to claim 2, wherein: Before the step of substituting the experimental values of the screw layout parameters into the parameterized geometric model and performing vibration fatigue analysis to obtain analysis results, the method further includes: Obtaining the value range of the screw layout parameter; A plurality of test values of the screw layout parameters are sampled within the value range to obtain.

5. The PCB structure optimization design method according to claim 1, wherein: The step of substituting the experimental values of the screw layout parameters into the parameterized geometric model and then performing vibration fatigue analysis to obtain analysis results includes: After substituting the experimental values of the screw layout parameters into the parameterized geometric model, the parameterized geometric model is meshed; Setting constraint conditions on the parameterized geometric model after meshing according to actual installation conditions corresponding to the test values; Modal analysis and random vibration analysis are performed on the parameterized geometric model after setting the constraint conditions to obtain analysis results.

6. The PCB structure optimization design method according to claim 1, wherein: The analysis results also include stress calculation results and strain calculation results of various parts of the PCB board. After the step of obtaining the target value of the screw layout parameter, the method further includes: Calculating the damage value of each component in the PCB board according to the stress calculation result and the strain calculation result corresponding to the target value; Calculating the failure time and failure probability of each component according to the damage value of each component; A failure probability curve of the PCB board is generated according to the failure time and failure probability of each component.

7. The PCB structure optimization design method according to claim 1, wherein: The step of obtaining the parameterized geometric model of the PCB board includes: Obtaining the initial design engineering file of the PCB board; Generating a three-dimensional geometric model of the PCB board according to the initial design engineering file; The screw layout parameters in the three-dimensional geometric model are defined as adjustable parameters to convert the three-dimensional geometric model into a parameterized geometric model.

8. The PCB structure optimization design method according to claim 7, wherein: The step of generating the three-dimensional geometric model of the PCB board according to the initial design engineering file includes: Obtaining attribute information of an actual sample of the PCB board; The initial design engineering file is updated according to the attribute information, and a three-dimensional geometric model of the PCB board is generated according to the updated initial design engineering file.

9. The PCB structure optimization design method according to any one of claims 1 to 8, characterized in that: The screw layout parameters include one or more of the installation position of the screw in the PCB board, the diameter of the fixing hole of the screw, and the material properties of the screw.

10. A PCB structure optimization design device, characterized in that: The device includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the steps of the PCB structure optimization design method according to any one of claims 1 to 9.

11. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the PCB structure optimization design method according to any one of claims 1 to 9 are implemented.

12. A computer program product, characterized in that The computer program product includes a computer program, and when the computer program is executed by a processor, the steps of the PCB structure optimization design method according to any one of claims 1 to 9 are implemented.

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