Display module and display device

Abstract

The invention provides a display module and a display device, belongs to the technical field of display, and can solve the problem that the use experience of a user is affected due to the risks of too fast local life attenuation, screen burning and the like of an existing OLED (Organic Light Emitting Diode) display module under the condition that the heat dissipation performance is reduced. The display module comprises a supporting back plate, a display panel and a driving circuit board, the supporting back plate is located on the non-display side of the display panel. The driving circuit board is electrically connected with the display panel and is bent to one side, deviating from the display panel, of the supporting back plate; the display module further comprises a directional heat conduction structure layer. The directional heat conduction structure layer comprises a heat conduction layer and a heat insulation layer; the heat-conducting layer is positioned on one side of the driving circuit board close to the supporting backboard; the heat-insulating layer is positioned on one side of the heat-conducting layer close to the

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a display module and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) is a light-emitting device that uses organic solid-state semiconductors as light-emitting materials. Due to its advantages such as simple preparation process, low cost, low power consumption, high luminous brightness, wide operating temperature range, and flexibility, it has been widely used in consumer display fields such as mobile phones and tablets. It has also gradually begun to be used in the field of in-vehicle displays, especially curved in-vehicle display products that can meet personalized requirements, which have gradually occupied part of the market.

[0003] Unlike consumer display products, automotive display products have higher reliability requirements for OLED display modules. Taking temperature rise as an example, users require that the temperature rise of OLED display modules during operation is no more than 15°C. For flat display products, a support backplane with a thickness of 0.8mm to 1.0mm is usually installed on the back of the OLED display panel (i.e., the non-display side). However, for curved display products, in order to ensure its bendability, a support backplane with a lower thickness is usually selected, such as a support backplane with a thickness of 0.2mm. The thinning of the support backplane can easily lead to a decrease in its heat dissipation performance. When the heat dissipation performance of the OLED display module is reduced, it is easy for the local life to decay too quickly and the risk of screen burn-in will occur, affecting the user experience. Summary of the Invention

[0004] The present disclosure aims to solve at least one of the technical problems existing in the prior art, and provides a display module and a display device.

[0005] In a first aspect, an embodiment of the present disclosure provides a display module, wherein the display module comprises: a supporting backplane, a display panel, and a driving circuit board; the supporting backplane is located on a non-display side of the display panel; the driving circuit board is electrically connected to the display panel and bent to a side of the supporting backplane facing away from the display panel; the display module further comprises: a directional heat conduction structural layer; the directional heat conduction structural layer comprises: a heat conducting layer and a heat insulating layer;

[0006] The heat-conducting layer is located on a side of the driving circuit board close to the supporting back plate; the heat-insulating layer is located on a side of the heat-conducting layer close to the supporting back plate.

[0007] In some embodiments, the directional heat conduction structural layer further includes: a first bonding layer and a second bonding layer;

[0008] The heat conductive layer is bonded to the driving circuit board via the first adhesive layer;

[0009] The heat insulation layer is bonded to the supporting backboard through the second adhesive layer.

[0010] In some embodiments, the driver circuit board includes: a first driver chip and a second driver chip; the heat generated by the first driver chip is greater than the heat generated by the second driver chip; the non-display side of the display panel is a concave curved surface; the concave curved surface is divided into a central area and an edge area surrounding the central area;

[0011] The first driving chip is disposed corresponding to the central area; the second driving chip is disposed corresponding to the edge area.

[0012] In some embodiments, W2≤W1+W3, (W1+W3)*F≥10G; W2 is the width of the central area, W1 and W3 are the widths of the edge areas on both sides of the central area, F is the viscosity of the second adhesive layer, and G is the external force applied to the driving circuit board.

[0013] In some embodiments, in the central area, the gap between the second adhesive layer and the supporting backplane is less than or equal to 3 mm.

[0014] In some embodiments, the driver circuit board includes: a first driver chip and a second driver chip; the heat generated by the first driver chip is greater than the heat generated by the second driver chip; the non-display side of the display panel is a convex curved surface; the convex curved surface is divided into a central area and an edge area surrounding the central area;

[0015] The first driving chip is disposed corresponding to the edge area; the second driving chip is disposed corresponding to the center area.

[0016] In some embodiments, W1+W3≤W2, W2*F≥10G; W2 is the width of the central area, W1 and W3 are the widths of the edge areas on both sides of the central area, F is the viscosity of the second adhesive layer, and G is the external force applied to the driving circuit board.

[0017] In some embodiments, in the edge region, the distance between the second adhesive layer and the supporting backplane is less than or equal to 3 mm.

[0018] In some embodiments, the first driver chip includes: a timing controller and / or a power management chip; the second driver chip includes: a source driver chip and / or a touch driver chip.

[0019] In some embodiments, the second adhesive layer is provided with a first groove corresponding to the central area, and the supporting back plate is provided with a first protrusion corresponding to the central area;

[0020] The first protrusion is embedded in the first groove, and the two are in contact with each other.

[0021] In some embodiments, 1 / 2(A1+A3)≥A2≥1 / 3(A1+A3); A2 is the width of the first groove, and A1 and A3 are the widths of two sides of the first groove respectively.

[0022] In some embodiments, a ratio of the depth of the first groove to the height of the first protrusion is less than or equal to 0.8.

[0023] In some embodiments, the second adhesive layer is provided with a second protrusion corresponding to the central area, and the supporting back plate is provided with a second groove corresponding to the central area;

[0024] The second protrusion is embedded in the second groove, and the two are in contact with each other.

[0025] In some embodiments, 1 / 2(B1+B3)≥B2≥1 / 3(B1+B3); B2 is the width of the second protrusion, and B1 and B3 are the widths of two sides of the second protrusion respectively.

[0026] In some embodiments, a ratio of a depth of the second groove to a height of the second protrusion is less than or equal to 0.8.

[0027] In some embodiments, the edges of the first adhesive layer and the second adhesive layer adhere to each other to form a closed space;

[0028] The heat-conducting layer and the heat-insulating layer are both located in the enclosed space.

[0029] In some embodiments, the display module further comprises: a housing and an insulating structure layer;

[0030] The housing is located between the supporting back plate and the driving circuit board;

[0031] The insulating structure layer is located on a side of the housing away from the supporting back plate;

[0032] The driving circuit board is located on a side of the insulating structure layer away from the housing, and is electrically connected to the display panel through a via hole penetrating the housing.

[0033] In some embodiments, the display module further comprises: a back cover and thermal grease;

[0034] The back cover is located on a side of the driving circuit board away from the insulating structure layer;

[0035] The thermal conductive silicone grease is located between the rear cover and the driving circuit board, and between the supporting back plate and the housing.

[0036] In some embodiments, the display module further includes: a housing;

[0037] The housing is located on a side of the driving circuit board away from the supporting back plate;

[0038] A slot is provided on one side of the housing close to the driving circuit;

[0039] The driving circuit board is embedded in the slot, and an air gap is formed between the driving circuit board and the supporting back plate.

[0040] In some embodiments, the display module further comprises: a back cover and thermal grease;

[0041] The back cover is located on a side of the housing away from the driving circuit board;

[0042] The thermal conductive silicone grease is located between the rear cover and the outer shell, and between the supporting back plate and the outer shell.

[0043] In a second aspect, an embodiment of the present disclosure provides a display device, wherein the display device includes the display module provided in the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A schematic diagram of the structure of an exemplary display module.

[0045] Figure 2 A schematic structural diagram of a display module provided in an embodiment of the present disclosure.

[0046] Figure 3 A schematic diagram of a directional heat-conducting structural layer provided in an embodiment of the present disclosure.

[0047] Figure 4 A schematic structural diagram of a convex display module provided in an embodiment of the present disclosure.

[0048] Figure 5 A schematic structural diagram of a concave display module provided in an embodiment of the present disclosure.

[0049] Figure 6 A schematic structural diagram of another convex display module provided in an embodiment of the present disclosure.

[0050] Figure 7 A schematic structural diagram of another concave display module provided in an embodiment of the present disclosure.

[0051] Figure 8 A schematic diagram of another directional heat-conducting structural layer provided in an embodiment of the present disclosure.

[0052] Figure 9A schematic structural diagram of another display module provided in an embodiment of the present disclosure.

[0053] Figure 10 A schematic structural diagram of another display module provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0054] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. The components of the embodiments of the present disclosure generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the drawings is not intended to limit the scope of the disclosure for protection, but merely represents the selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present disclosure. In the absence of conflict, the various embodiments of the present disclosure and the various features in the embodiments can be combined with each other.

[0055] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "an" or "the" do not indicate a quantitative limitation, but rather indicate the presence of at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0056] In this disclosure, "multiple or several" refers to two or more. "And / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0057] Figure 1 is a schematic diagram of the structure of an exemplary display module, such as Figure 1As shown, the display module includes: a supporting backplane 101, a display panel 102 and a driving circuit board 103; the supporting backplane 101 is located on the non-display side of the display panel 102; the driving circuit board 103 is electrically connected to the display panel 102 and is bent to the side of the supporting backplane 101 away from the display panel 101. Among them, the supporting backplane 101 can rigidly support structures such as the display panel 102 to ensure that the display panel 102 remains stable and flat when pressed or written by fingers. The display panel 102 can specifically be an OLED display panel, which can display according to the driving signal provided by the driving circuit board 103 to realize the display function. The driving circuit board 103 can be connected to the display panel 102 and bent to the back side of the display panel 102 (i.e., the non-display side). It is understandable that the display module can also include: other structures such as a polarizer 104, an optical adhesive layer 105, a cover plate 106, etc., which can be stacked in sequence on the light-emitting side of the display panel 102. Polarizer 104 converts natural light into polarized light, preventing ambient light from reflecting off display panel 102 and affecting the display quality. Cover plate 106 protects display panel 102 and other structures, preventing damage to them from external forces. Optical adhesive layer 105 can be used to bond cover plate 106 to polarizer 104.

[0058] For flat display products, a support backplane 101 with a thickness of 0.8mm to 1.0mm is typically installed on the back side (i.e., the non-display side) of the display panel 102. However, for curved display products, to ensure flexibility, a thinner support backplane 101, such as 0.2mm, is typically selected. Thinning the support backplane 101 can easily lead to a decrease in its heat dissipation performance. When heat dissipation performance is reduced, OLED display modules are prone to rapid localized lifespan degradation and risks such as screen burn-in, impacting the user experience.

[0059] In order to solve at least one of the above-mentioned technical problems, the embodiments of the present disclosure provide a display module and a display device. The display module and the display device provided by the embodiments of the present disclosure will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0060] In a first aspect, an embodiment of the present disclosure provides a display module. Figure 2 A schematic diagram of the structure of a display module provided in an embodiment of the present disclosure is shown in FIG. Figure 2As shown, the display module includes: a supporting backplane 101, a display panel 102 and a driving circuit board 103; the supporting backplane 101 is located on the non-display side of the display panel 102; the driving circuit board 103 is electrically connected to the display panel 102 and is bent to the side of the supporting backplane 101 away from the display panel 102; the display module also includes: a directional heat conduction structure layer 107; the directional heat conduction structure layer 107 includes: a heat conducting layer 1071 and a heat insulating layer 1072; the heat conducting layer 1071 is located on the side of the driving circuit board 103 close to the supporting backplane 101; the heat insulating layer 1072 is located on the side of the heat conducting layer 1071 close to the supporting backplane 101.

[0061] The support backplate 101 provides rigid support for other structures in the display module, ensuring that the foldable display module remains stable and flat when pressed or written on. The support backplate 101 can be made of materials such as stainless steel, carbon fiber, or titanium alloy, which offer strong rigidity. To ensure a stable bending effect, its thickness is generally small, for example, less than or equal to 0.2 mm.

[0062] The display panel 102 can specifically be an OLED display panel, which has a certain degree of flexibility and can be bent to a certain extent to achieve a curved display to meet the display requirements of vehicle-mounted display products in different scenarios. In actual applications, the display panel 102 is also covered with other structures such as a polarizer 104, an optical adhesive layer 105, and a cover plate 106, which can be stacked in sequence on the light-emitting side of the display panel 102. The polarizer 104 can convert natural light into polarized light to prevent ambient light from being reflected on the display panel 102 and affecting the display effect. The cover plate 106 can protect structures such as the display panel 102 to prevent external forces from damaging the display panel 102 and other structures. An optical adhesive layer 105 can be used to bond the cover plate 106 to the polarizer 104.

[0063] The driver circuit board 103 may specifically include components such as a printed circuit board, a flexible circuit board, and a driver chip. The driver chip may provide a driving signal for the display panel 102 and is disposed on the printed circuit board. Metal traces of different specifications are also provided on the printed circuit board to transmit the driving signal. The driver chip may be electrically connected to the display panel 102 through the flexible circuit board. Since the flexible circuit board has good flexibility, the printed circuit board and the driver chip may be bent to the side of the support backplane 101 away from the display panel 102, thereby preventing structures such as the printed circuit board and the driver chip from occupying space on the display side of the display panel 102, thereby reducing the frame of the display module, increasing the screen-to-body ratio, and improving the display effect.

[0064] The heat-conducting layer 1071 in the directional heat-conducting structural layer 107 is located on the side of the driver circuit board 103 close to the supporting backplate 101. The heat-conducting layer 1071 can actively and efficiently conduct the heat generated during the operation of the driver circuit board 103 along its predetermined heat conduction path (e.g., vertically downward) to a connected heat dissipation system (not shown in the figure) for effective heat dissipation, thereby significantly reducing the temperature rise of the driver circuit board 103 itself. In practical applications, the heat-conducting layer 1071 can be made of a metal material with good thermal conductivity, such as copper foil.

[0065] The thermal insulation layer 1072 in the directional heat-conducting structural layer 107 is located on the side of the heat-conducting layer 1071 close to the supporting backplate 101. The thermal insulation layer 1072 can form a strong heat barrier in directions other than the heat conduction path (particularly toward the top of the display panel 102). This can greatly suppress and block the heat conduction path from the driver circuit board 103 directly upward to the display panel 102. In practical applications, the thermal insulation layer 1072 can be made of a material with excellent thermal insulation properties, such as aerogel or foam material.

[0066] It should be noted that the display module provided in the embodiment of the present disclosure also includes a polarizer, an optical adhesive, a cover plate and other structures. The above structures are not shown, and they can be referred to in detail. Figure 1 The structure of the module is shown in FIG, which will not be described in detail here.

[0067] In the display module provided by the embodiment of the present disclosure, the support backplate 101 can provide stable physical support and basic bearing for the display panel 102, and the driver circuit board 103 located thereon can generate and transmit the driving signal required by the display panel 102. However, when the driver circuit board 103 is working at high frequency or high load, its internal driver chip and other structures will inevitably generate a large amount of heat accumulation. In order to efficiently manage this part of heat and isolate its potential thermal shock to the display panel 102, a directional heat conduction structural layer 107 is provided between the driver circuit board 103 and the support backplate 101.

[0068] In the embodiment of the present disclosure, the heat-conducting layer 1071 and the heat-insulating layer 1072 in the directional heat-conducting structural layer 107 are utilized to actively conduct away the heat generated by the driver circuit board 103 and passively isolate the heat generated by the driver circuit board 103 from diffusing toward the display panel 102, thereby greatly optimizing the overall thermal management efficiency and heat dissipation performance of the display module. This fundamentally avoids the risk of direct thermal damage to the upper display panel 102 caused by the heat generated by the driver circuit board 103, allowing the display panel 102 to operate in a relatively mild and stable temperature environment, thereby effectively preventing the accelerated aging and performance degradation of key materials of the display panel 102 due to overheating, and significantly reducing the probability of reliability problems caused thereby, such as rapid decay of local pixel life, uneven brightness, color drift, and even severe "burn-in" (image retention), thereby significantly improving the overall reliability of the display module and the user experience.

[0069] Figure 3 A schematic diagram of a directional heat conduction structure layer provided in an embodiment of the present disclosure is shown in FIG. Figure 3 As shown, the directional heat conduction structure layer 107 also includes: a first adhesive layer 1073 and a second adhesive layer 1074; the heat conduction layer 1071 is bonded to the driving circuit board 103 through the first adhesive layer 1073; and the heat insulation layer 1072 is bonded to the supporting back plate 101 through the second adhesive layer 1074.

[0070] The first adhesive layer 1073 is arranged on the side of the thermal conductive layer 1071 close to the driving circuit board 103. The thermal conductive layer 1071 is adhered to the driving circuit board 103 through the first adhesive layer 1073 to fix the directional thermal conductive structure layer 107 as a whole to the driving circuit board 103. It can be made of materials with good bonding properties and stability, such as black double-sided tape and foam glue.

[0071] The second adhesive layer 1074 is arranged on the side of the thermal insulation layer 1072 close to the supporting backboard 101. The thermal insulation layer 1072 is adhered to the supporting backboard 101 through the second adhesive layer 1074 to fix the directional heat conduction structure layer 107 as a whole to the supporting backboard 101. It can be made of materials with good adhesive properties and stability such as black double-sided tape and foam glue.

[0072] Figure 4 A schematic structural diagram of a convex display module provided in an embodiment of the present disclosure is shown in FIG. Figure 4 As shown, the driver circuit board 103 includes: a first driver chip 1031 and a second driver chip 1032; the heat generated by the first driver chip 1031 is greater than the heat generated by the second driver chip 1032; the non-display side of the display panel 102 is a concave curved surface; the concave curved surface is divided into a central area and an edge area surrounding the central area; the first driver chip 1031 is arranged corresponding to the central area; the second driver chip 1032 is arranged corresponding to the edge area.

[0073] The first driver chip 1031 may specifically include: a timing controller Tcon and / or a power management chip PMIC; the second driver chip 1032 may specifically include: a source driver chip D-IC and / or a touch driver chip Touch-IC. The power of the timing controller Tcon is generally greater than 1.1W, the power of the power management chip PMIC is generally greater than 3W, the power of the source driver chip D-IC is generally 0.4W to 0.5W, and the power of the touch driver chip Touch-IC is generally 0.5W to 0.7W. Therefore, the power of the timing controller Tcon and the power management chip PMIC is significantly greater than the power of the source driver chip D-IC and / or the touch driver chip Touch-IC. During operation, the timing controller Tcon and the power management chip PMIC may generate a greater amount of heat, while the source driver chip D-IC and the touch driver chip Touch-IC may generate less heat.

[0074] Figure 4 The display module shown is a convex display module, meaning the display side of the display panel 102 is a convex curved surface, while the non-display side is a concave curved surface. Accordingly, the back side of the support backplane 101 (i.e., the side facing away from the display panel 102) also exhibits the same concave curved surface. The directional heat-conducting structural layer 107 and the driver circuit board 103 are both fixed to the concave curved surface of the support backplane 101. Due to the characteristics of the concave curved surface, the directional heat-conducting structural layer 107 inevitably has a step difference, resulting in a phenomenon in which the edge areas are pressed tightly together and the center area is raised. As a result, the directional heat-conducting structural layer 107 in the center area is relatively far away from the support backplane 101, and it does not directly contact the support backplane 101.

[0075] In actual applications, the first driver chip 1031 (timing controller Tcon and / or power management chip PMIC) has a large power consumption and generates a lot of heat. The first driver chip 1031 can be set corresponding to the central area. Here, not only a directional heat conduction structure layer 107 is provided between the first driver chip 1031 and the supporting backplane 101, but also an air gap is formed. The heat dissipation conditions are good, and the heat generated by the first driver chip 1031 during operation can be actively and efficiently conducted along its preset heat conduction path (such as vertically downward) to the heat dissipation system connected to it (not shown in the figure) for effective heat dissipation, thereby significantly reducing the temperature rise of the first driver chip 1031 itself.

[0076] The second driver chip 1032 (source driver chip D-IC and touch driver chip Touch-IC) has low power consumption and generates less heat. The second driver chip 1032 can be set corresponding to the edge area. Here, a directional heat conduction structure layer 107 is set between the second driver chip 1032 and the supporting backplane 101. It can also actively and efficiently conduct the heat generated during the operation of the second driver chip 1032 along its preset heat conduction path (such as vertically downward) to the heat dissipation system connected to it (not shown in the figure) for effective heat dissipation, thereby significantly reducing the temperature rise of the second driver chip 1032 itself.

[0077] Specifically, if Figure 4 As shown, W2≤W1+W3, (W1+W3)*F≥10G; W2 is the width of the central area, W1 and W3 are the widths of the edge areas on both sides of the central area, F is the viscosity of the second adhesive layer 1074, and G is the external force applied to the driving circuit board 103.

[0078] Figure 4 In the display module shown, the width W2 of the central area is less than or equal to the sum of the widths W1+W3 of the edge areas on both sides. At the same time, the adhesion force of the edge areas on both sides is greater than or equal to 10 times the external force exerted on the driving circuit board 103. This ensures that the directional heat conduction structure layer 107 not only has a larger bonding area, but also has a larger bonding force, thereby avoiding peeling between the directional heat conduction structure layer 107 and the supporting back plate 101, which affects the stability of the display module.

[0079] In some implementations, such as Figure 4 As shown, in the center area, the gap between the second adhesive layer 1074 and the supporting back plate 101 is less than or equal to 3 mm.

[0080] The directional heat-conducting structure layer 107 and the driving circuit board 103 are both fixed on the concave surface of the support back plate 101. Due to the characteristics of the concave surface, the directional heat-conducting structure layer 107 will inevitably have a step difference, resulting in the edge area being pressed tightly and the center area being raised, resulting in the directional heat-conducting structure layer 107 in the center area being far away from the support back plate 101, and it is not in direct contact with the support back plate 101.

[0081] In actual applications, in the center region, the gap between the second adhesive layer 1074 and the supporting backplate 101 is less than or equal to 3 mm, ensuring good heat dissipation for the driver circuit board 103. Heat generated during operation by the first driver chip 1031 in the driver circuit board 103 can be actively and efficiently conducted along a predetermined heat conduction path (e.g., vertically downward) to a connected heat dissipation system (not shown) for effective heat dissipation, thereby significantly reducing the temperature rise of the first driver chip 1031. In actual applications, the gap between the second adhesive layer 1074 and the supporting backplate 101 in the center region can be appropriately set based on the curvature of the display panel 102.

[0082] Figure 5 A structural diagram of a concave display module provided in an embodiment of the present disclosure is shown in FIG. Figure 5 As shown, the driver circuit board 103 includes: a first driver chip 1031 and a second driver chip 1032; the heat generated by the first driver chip 1031 is greater than the heat generated by the second driver chip 1032; the non-display side of the display panel 102 is a convex curved surface; the convex curved surface is divided into a central area and an edge area surrounding the central area; the first driver chip 1031 is arranged corresponding to the edge area; the second driver chip 1032 is arranged corresponding to the central area.

[0083] The first driver chip 1031 may specifically include: a timing controller Tcon and / or a power management chip PMIC; the second driver chip 1032 may specifically include: a source driver chip D-IC and / or a touch driver chip Touch-IC. The power of the timing controller Tcon is generally greater than 1.1W, the power of the power management chip PMIC is generally greater than 3W, the power of the source driver chip D-IC is generally 0.4W to 0.5W, and the power of the touch driver chip Touch-IC is generally 0.5W to 0.7W. Therefore, the power of the timing controller Tcon and the power management chip PMIC is significantly greater than the power of the source driver chip D-IC and / or the touch driver chip Touch-IC. During operation, the timing controller Tcon and the power management chip PMIC may generate a greater amount of heat, while the source driver chip D-IC and the touch driver chip Touch-IC may generate less heat.

[0084] Figure 5The display module shown is a concave display module, meaning the display side of the display panel 102 is concavely curved, while the non-display side is convexly curved. Correspondingly, the backside of the support backplane 101 (i.e., the side facing away from the display panel 102) also exhibits the same convex curve. The directional heat-conducting structural layer 107 and the driver circuit board 103 are both fixed to the convex surface of the support backplane 101. Due to the characteristics of the convex surface, the directional heat-conducting structural layer 107 inevitably has a step difference, resulting in a tightly pressed center area and raised edge areas. This results in the directional heat-conducting structural layer 107 in the edge areas being farther away from the support backplane 101 and not in direct contact with it.

[0085] In actual applications, the first driver chip 1031 (timing controller Tcon and / or power management chip PMIC) has a large power consumption and generates a lot of heat. The first driver chip 1031 can be set corresponding to the edge area. Here, not only a directional heat conduction structure layer 107 is provided between the first driver chip 1031 and the supporting backplane 101, but also an air gap is formed. The heat dissipation conditions are good, and the heat generated by the first driver chip 1031 during operation can be actively and efficiently conducted along its preset heat conduction path (such as vertically downward) to the heat dissipation system connected to it (not shown in the figure) for effective heat dissipation, thereby significantly reducing the temperature rise of the first driver chip 1031 itself.

[0086] The second driver chip 1032 (source driver chip D-IC and touch driver chip Touch-IC) has low power consumption and generates less heat. The second driver chip 1032 can be set corresponding to the central area. Here, a directional heat conduction structure layer 107 is set between the second driver chip 1032 and the supporting backplane 101. It can also actively and efficiently conduct the heat generated during the operation of the second driver chip 1032 along its preset heat conduction path (such as vertically downward) to the heat dissipation system connected to it (not shown in the figure) for effective heat dissipation, thereby significantly reducing the temperature rise of the second driver chip 1032 itself.

[0087] Specifically, if Figure 5 As shown, W1+W3≤W2, W2*F≥10G; W2 is the width of the central area, W1 and W3 are the widths of the edge areas on both sides of the central area, F is the viscosity of the second adhesive layer 1074, and G is the external force applied to the driving circuit board 103.

[0088] Figure 5In the display module shown, the width W2 of the central area is greater than or equal to the sum of the widths W1+W3 of the edge areas on both sides. At the same time, the adhesion force of the central area is greater than or equal to 10 times the external force exerted on the driving circuit board 103. This ensures that the directional heat conduction structure layer 107 not only has a larger bonding area, but also has a larger bonding force, thereby avoiding peeling between the directional heat conduction structure layer 107 and the supporting back plate 101, which affects the stability of the display module.

[0089] In some implementations, such as Figure 5 As shown, in the edge area, the gap between the second adhesive layer 1074 and the supporting back plate 101 is less than or equal to 3 mm.

[0090] The directional heat-conducting structural layer 107 and the driver circuit board 103 are both fixed to the convex curved surface of the support backplate 101. Due to the characteristics of the convex curved surface, the directional heat-conducting structural layer 107 inevitably has a step difference, resulting in a phenomenon of being pressed and fitted in the center area and raised in the edge area. As a result, the directional heat-conducting structural layer 107 in the edge area is farther away from the support backplate 101 and does not directly contact the support backplate 101. In actual applications, in the edge area, the gap between the second adhesive layer 1074 and the support backplate 101 is less than or equal to 3 mm, which can ensure that the driver circuit board 103 has good heat dissipation conditions. The heat generated during operation of the first driver chip 1031 in the driver circuit board 103 can be actively and efficiently conducted along its preset heat conduction path (e.g., vertically downward) to the connected heat dissipation system (not shown in the figure) for effective heat dissipation, thereby significantly reducing the temperature rise of the first driver chip 1031 itself. In actual applications, the gap between the second adhesive layer 1074 and the support backplate 101 in the edge area can be reasonably set according to the curvature of the display panel 102.

[0091] Figure 6 A structural diagram of another convex display module provided in an embodiment of the present disclosure is shown in FIG. Figure 6 As shown, a first groove is provided in the center area corresponding to the second adhesive layer 1074, and a first protrusion is provided in the center area corresponding to the supporting back plate 101; the first protrusion is embedded in the first groove, and the two are in contact with each other.

[0092] Figure 6The display module shown is a convex display module, that is, the display side of the display panel 102 is a convex curved surface, and the non-display side is a concave curved surface. Correspondingly, the back side of the support backplane 101 (i.e., the side facing away from the display panel 102) also presents the same concave curved surface. The directional heat-conducting structural layer 107 and the driver circuit board 103 are both fixed to the concave curved surface of the support backplane 101. Due to the characteristics of the concave curved surface, the directional heat-conducting structural layer 107 will inevitably have a step difference, resulting in the edge area being pressed tightly and the center area being raised. As a result, the directional heat-conducting structural layer 107 in the center area is far away from the support backplane 101 and is not in direct contact with the support backplane 101, affecting the stability of the connection between the directional heat-conducting structural layer 107 and the support backplane 101.

[0093] In the embodiment of the present disclosure, a first groove is provided in the central region corresponding to the second adhesive layer 1074, and a first protrusion is provided in the central region corresponding to the support back plate 101. The first protrusion can compensate for the gap between the second adhesive layer 1074 and the support back plate 101 in the central region caused by the concave curved surface. At the same time, the first protrusion is embedded in the first groove, and the two are in contact with each other. In this way, in the central region, the second adhesive layer 1074 and the support back plate 101 can be completely in contact with each other, ensuring the connection stability between the overall directional heat conduction structure layer 107 and the support back plate 101, while also ensuring the heat conduction and heat insulation effects of the overall directional heat conduction structure layer 107.

[0094] In some embodiments, as Figure 6 As shown, 1 / 2(A1+A3)≥A2≥1 / 3(A1+A3); A2 is the width of the first groove, and A1 and A3 are the widths of both sides of the first groove respectively.

[0095] Figure 6 In the display module shown, the width of the first groove is less than or equal to half the width of the two side edges, and greater than or equal to one-third of the width of the two side edges, ensuring that the first groove has sufficient width. At the same time, the first protrusion is the same width as the first groove, allowing the first protrusion to fit into the first groove and the two to fit completely. This can compensate for the gap between the second adhesive layer 1074 and the supporting backplate 101 in the central area caused by the concave curved surface, ensuring the connection stability between the overall directional heat conduction structure layer 107 and the supporting backplate 101, while also maintaining the thermal conductivity and thermal insulation effects of the overall directional heat conduction structure layer 107.

[0096] In some embodiments, as Figure 6 As shown, the ratio of the depth of the first groove to the height of the first protrusion is less than or equal to 0.8.

[0097] In actual applications, the depth of the first groove is slightly smaller than the height of the first protrusion. For example, the ratio between the depth of the first groove and the height of the first protrusion is less than or equal to 0.8. In this way, the gap between the second adhesive layer 1074 and the supporting back plate 101 in the central area caused by the concave surface can be compensated to ensure the connection stability between the overall directional heat conduction structure layer 107 and the supporting back plate 101, while ensuring the thermal conductivity and thermal insulation effects of the overall directional heat conduction structure layer 107.

[0098] It should be noted that the depth of the first groove should be less than or equal to half the thickness of the second adhesive layer 1074 to prevent the groove from being too deep and penetrating the second adhesive layer 1074, thereby affecting the bonding performance of the second adhesive layer 1074. Furthermore, the groove should be too deep to affect the thermal conductivity of the thermally conductive layer 1071 and the thermal insulation performance of the thermal insulation layer 1072 thereon.

[0099] Figure 7 A structural diagram of another concave display module provided in an embodiment of the present disclosure is shown in FIG. Figure 7 As shown, a second protrusion is provided in the center area corresponding to the second adhesive layer 1074, and a second groove is provided in the center area corresponding to the supporting back plate 101; the second protrusion is embedded in the second groove, and the two are in contact with each other.

[0100] Figure 7 The display module shown is a concave display module, that is, the display side of the display panel 102 is a concave curved surface, and the non-display side is a convex curved surface. Correspondingly, the back side of the support backplane 101 (i.e., the side facing away from the display panel 102) also presents the same convex curved surface. The directional heat-conducting structural layer 107 and the driver circuit board 103 are both fixed to the convex curved surface of the support backplane 101. Due to the characteristics of the convex curved surface, the directional heat-conducting structural layer 107 will inevitably have a step difference, resulting in a phenomenon of pressing and fitting in the center area and raising the edge area. As a result, the directional heat-conducting structural layer 107 in the edge area is far away from the support backplane 101, and it is not in direct contact with the support backplane 101, affecting the stability of the connection between the directional heat-conducting structural layer 107 and the support backplane 101.

[0101] In the embodiment of the present disclosure, a second protrusion is provided in the center region corresponding to the second adhesive layer 1074, and a second groove is provided in the center region corresponding to the support back plate 101. The second protrusion can compensate for the gap between the second adhesive layer 1074 and the support back plate 101 in the edge region caused by the convex curved surface. At the same time, the second protrusion is embedded in the second groove, and the two are in contact with each other. In this way, in the edge region, the second adhesive layer 1074 and the support back plate 101 can be completely in contact with each other, ensuring the connection stability between the overall directional heat conduction structure layer 107 and the support back plate 101, while also ensuring the heat conduction and heat insulation effects of the overall directional heat conduction structure layer 107.

[0102] In some embodiments, as Figure 7 As shown, 1 / 2(B1+B3)≥B2≥1 / 3(B1+B3); B2 is the width of the second protrusion, and B1 and B3 are the widths on both sides of the second protrusion respectively.

[0103] Figure 7 In the display module shown, the width of the second protrusion is less than or equal to half the width of the two side edges, and greater than or equal to one-third of the width of the two side edges, ensuring that the second protrusion has sufficient width. At the same time, the second protrusion and the second groove have the same width, allowing the second protrusion to fit into the second groove and the two to fit completely. This can compensate for the gap between the second adhesive layer 1074 and the supporting backplate 101 in the central area caused by the convex curved surface, ensuring the connection stability between the overall directional heat conduction structure layer 107 and the supporting backplate 101, while also maintaining the thermal conductivity and thermal insulation effects of the overall directional heat conduction structure layer 107.

[0104] In some embodiments, a ratio between the depth of the second groove and the height of the second protrusion is less than or equal to 0.8.

[0105] In actual applications, the depth of the second groove is slightly smaller than the height of the second protrusion. For example, the ratio between the depth of the second groove and the height of the second protrusion is less than or equal to 0.8. In this way, the gap between the second adhesive layer 1074 and the supporting back plate 101 in the central area caused by the convex curved surface can be compensated to ensure the connection stability between the overall directional heat conduction structure layer 107 and the supporting back plate 101, while ensuring the thermal conductivity and thermal insulation effects of the overall directional heat conduction structure layer 107.

[0106] Figure 8 A schematic diagram of another directional heat conduction structure layer provided in an embodiment of the present disclosure, such as Figure 8 As shown, the edges of the first adhesive layer 1073 and the second adhesive layer 1074 are attached to each other to form a closed space; the heat conducting layer 1071 and the heat insulating layer 1072 are both located in the closed space.

[0107] Figure 8 The directional heat conducting structural layer 107 is Figure 3 The difference of the directional heat conducting structural layer 107 is that Figure 3 The widths of the various film layers in the directional heat conducting structural layer 107 are substantially the same, and the film layers are stacked. Figure 8 The width of the first adhesive layer 1073 and the second adhesive layer 1074 in the directional heat-conducting structural layer shown is significantly larger than the width of the heat-conducting layer 1071 and the heat-insulating layer 1072. The first adhesive layer 1073 and the second adhesive layer 1074 expand outward, and the edges of the first adhesive layer 1073 and the second adhesive layer 1074 fit together to form a closed space; the heat-conducting layer 1071 and the heat-insulating layer 1072 are both located in the closed space.

[0108] Since the thermal insulation material in the thermal insulation layer 1072 is usually aerogel or foam, to which corrosive elements such as potassium K, sodium Na, and sulfur S are added, the edges of the first adhesive layer 1073 and the second adhesive layer 1074 are bonded to form a closed space that can seal the thermal insulation layer 1072, thereby preventing the corrosive elements in the thermal insulation layer 1072 from overflowing onto the driver circuit board 103 under reliable conditions and causing electrochemical corrosion to the driver circuit board 103, thereby avoiding failure of the display module and improving the stability of the display module.

[0109] In actual applications, when the concentration of corrosive elements such as potassium K, sodium Na, and sulfur S exceeds 50 ppm, the first bonding layer 1073 and the second bonding layer 1074 need to be bonded at the edge to prevent the corrosive elements in the insulation layer 1072 from overflowing under reliable conditions.

[0110] Figure 9 A schematic diagram of the structure of another display module provided in an embodiment of the present disclosure is shown in FIG. Figure 9 As shown, the display module also includes: a shell 108 and an insulating structure layer 109; the shell 108 is located between the supporting back plate 101 and the driving circuit board 103; the insulating structure layer 109 is located on the side of the shell 108 away from the supporting back plate 101; the driving circuit board 103 is located on the side of the insulating structure layer 109 away from the shell 108, and is electrically connected to the display panel 102 through a via V passing through the shell.

[0111] The housing 108 can be made of a rigid material, such as metal, to protect the display panel 102 and other components from damage caused by external forces. Multiple vias V are provided in the housing 108. Some of these vias V can reduce the mass of the housing 108, thereby improving heat dissipation, while others can serve as connection channels. For example, the driver circuit board 103 and the display panel 102 can be located on opposite sides of the housing 108, and the driver circuit board 103 and the display panel 102 can be electrically connected via vias V extending through the housing 108.

[0112] The insulating structure layer 109 can be made of a material with good thermal insulation performance, such as a plastic plate. The insulating structure layer 109 can be located on the side of the housing 108 away from the supporting back plate 101. At the same time, the driver circuit board 103 is located on the side of the insulating structure layer 109 away from the housing 108. Due to the presence of the insulating structure layer 109, the distance between the driver circuit board 103 and the display panel 102 can be increased, and the heat conduction path between the driver circuit board 103 and the display panel 102 can be cut off, fundamentally avoiding the risk of direct thermal damage to the upper display panel 102 caused by the heat generated by the driver circuit board 103, allowing the display panel 102 to operate in a relatively mild and stable temperature environment, thereby effectively preventing the accelerated aging and performance degradation of the key materials of the display panel 102 due to overheating, significantly reducing the probability of reliability problems such as excessive decay of local pixel life, uneven brightness, color drift, and even serious "burn-in" (image retention), thereby significantly improving the overall reliability of the display module and the user experience.

[0113] In some embodiments, as Figure 9 As shown, the display module also includes: a back cover 110 and thermal grease (not shown in the figure); the back cover 110 is located on the side of the driving circuit board 103 away from the insulating structure 109 layer; the thermal grease is located between the back cover 110 and the driving circuit board 103, and between the supporting back plate 101 and the outer shell 108.

[0114] The back cover 110 can protect the drive circuit board 103 and other structures to prevent them from being damaged by external forces. The back cover 110 can be made of a rigid material with good heat dissipation performance. It can be in direct contact with the air to facilitate heat dissipation. Thermal conductive silicone is filled between the back cover 110 and the drive circuit board 103, and between the support back plate 101 and the shell 108. It can further facilitate the transmission of heat generated by the display panel 102 and the drive circuit board 103 toward the back cover 110, further facilitating the heat dissipation, allowing the display panel 102 to operate in a relatively mild and stable temperature environment, thereby effectively preventing the accelerated aging and performance degradation of the key materials of the display panel 102 due to overheating, and significantly reducing the probability of reliability problems such as excessive decay of local pixel life, uneven brightness, color drift, and even serious "burn-in" (image retention), thereby significantly improving the overall reliability of the display module and the user experience.

[0115] Figure 10 A structural diagram of another display module provided in an embodiment of the present disclosure is shown in FIG. Figure 10As shown, the display module also includes: a housing 108; the housing 108 is located on the side of the driving circuit board 103 away from the supporting back plate 101; a slot M is provided on the side of the housing 108 close to the driving circuit 103; the driving circuit board 103 is embedded in the slot M, and an air gap is formed between the driving circuit board 103 and the supporting back plate 101.

[0116] The housing 108 can be made of a rigid material, such as metal, to protect the display panel 102 and other components from damage caused by external forces. A slot M is provided on the side of the housing 108 near the driver circuit board 103. The depth of the slot M is greater than the thickness of the driver circuit board 103. The driver circuit board 103 is embedded in the slot M, and an air gap is formed between the driver circuit board 103 and the support backplane 101. On the one hand, the existence of the air gap can increase the distance between the driver circuit board 103 and the supporting back plate 101 and the display panel 102, increase the distance between the driver circuit board 103 and the display panel 102, and cut off the heat conduction path between the driver circuit board 103 and the display panel 102, which is beneficial to the heat dissipation of the driver circuit board 103, fundamentally avoiding the risk of direct thermal damage to the upper display panel 102 caused by the heat generated by the driver circuit board 103, allowing the display panel 102 to operate in a relatively mild and stable temperature environment, thereby effectively preventing the accelerated aging and performance degradation of key materials of the display panel 102 due to overheating, and significantly reducing the probability of reliability problems such as rapid decay of local pixel life, uneven brightness, color drift, and even serious "burn-in" (image retention), thereby significantly improving the overall reliability of the display module and the user experience.

[0117] In some embodiments, the display module also includes: a back cover 110 and thermal grease (not shown in the figure); the back cover 110 is located on the side of the outer shell 108 away from the driving circuit board 103; the thermal grease is located between the back cover 110 and the outer shell 108, and between the supporting back plate 101 and the outer shell 108.

[0118] The back cover 110 can protect the drive circuit board 103 and other structures to prevent them from being damaged by external forces. The back cover 110 can be made of a rigid material with good heat dissipation performance. It can be in direct contact with the air to facilitate heat dissipation. Thermal conductive silicone is filled between the back cover 110 and the outer shell 108, as well as between the supporting back plate 101 and the outer shell 108. It can further facilitate the transmission of heat generated by the display panel 102 and the drive circuit board 103 toward the back cover 110, further facilitating the heat dissipation, allowing the display panel 102 to operate in a relatively mild and stable temperature environment, thereby effectively preventing the accelerated aging and performance degradation of the key materials of the display panel 102 due to overheating, and significantly reducing the probability of reliability problems such as excessive decay of local pixel life, uneven brightness, color drift, and even severe "burn-in" (image retention), thereby significantly improving the overall reliability of the display module and the user experience.

[0119] In the second aspect, an embodiment of the present disclosure provides a display device, which includes a display module as provided in any of the above embodiments. The display device can specifically be a mobile phone, a handheld or portable computer, a GPS receiver / navigator, a TV monitor, a flat-panel display, a computer monitor, a car display (for example, an odometer display, etc.), a navigator, a cockpit controller and / or display, a camera view display (for example, a display of a rearview camera in a vehicle), an electronic billboard or sign, etc. Its implementation principle and beneficial effects are the same as the implementation principle and beneficial effects of the above-mentioned display module, and will not be repeated here.

[0120] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0121] In the several embodiments provided in the present disclosure, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the positions of the components shown are merely logical functional positions, and actual implementations may have different position arrangements.

[0122] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display module, wherein: The display module includes: a supporting backplane, a display panel, and a driving circuit board; the supporting backplane is located on the non-display side of the display panel; the driving circuit board is electrically connected to the display panel and bent to the side of the supporting backplane away from the display panel; the display module also includes: a directional heat conduction structure layer; the directional heat conduction structure layer includes: a heat conduction layer and a heat insulation layer; The heat-conducting layer is located on the side of the driving circuit board close to the supporting back plate; the heat-insulating layer is located on the side of the heat-conducting layer close to the supporting back plate.

2. The display module according to claim 1, wherein: The directional heat conduction structural layer further comprises: a first bonding layer and a second bonding layer; The heat conductive layer is bonded to the driving circuit board via the first adhesive layer; The heat insulation layer is bonded to the supporting backboard through the second adhesive layer.

3. The display module according to claim 2, wherein: The driver circuit board includes: a first driver chip and a second driver chip; the heat generated by the first driver chip is greater than the heat generated by the second driver chip; the non-display side of the display panel is a concave curved surface; the concave curved surface is divided into a central area and an edge area surrounding the central area; The first driving chip is disposed corresponding to the central area; the second driving chip is disposed corresponding to the edge area.

4. The display module according to claim 3, wherein: W2≤W1+W3, (W1+W3)*F≥10G; W2 is the width of the central area, W1 and W3 are the widths of the edge areas on both sides of the central area, F is the viscosity of the second adhesive layer, and G is the external force applied to the driving circuit board.

5. The display module according to claim 3, wherein: In the central area, the gap between the second adhesive layer and the supporting backboard is less than or equal to 3 mm.

6. The display module according to claim 2, wherein: The driver circuit board includes: a first driver chip and a second driver chip; the heat generated by the first driver chip is greater than the heat generated by the second driver chip; the non-display side of the display panel is a convex curved surface; the convex curved surface is divided into a central area and an edge area surrounding the central area; The first driving chip is disposed corresponding to the edge area; the second driving chip is disposed corresponding to the center area.

7. The display module according to claim 6, wherein: W1+W3≤W2, W2*F≥10G; W2 is the width of the central area, W1 and W3 are the widths of the edge areas on both sides of the central area, F is the viscosity of the second adhesive layer, and G is the external force applied to the driving circuit board.

8. The display module according to claim 6, wherein: In the edge area, the distance between the second adhesive layer and the supporting backing plate is less than or equal to 3 mm.

9. The display module according to claim 3 or 6, wherein: The first driver chip includes: a timing controller and / or a power management chip; the second driver chip includes: a source driver chip and / or a touch driver chip.

10. The display module according to claim 3, wherein: The second adhesive layer is provided with a first groove corresponding to the central area, and the supporting back plate is provided with a first protrusion corresponding to the central area; The first protrusion is embedded in the first groove, and the two are in contact with each other.

11. The display module according to claim 10, wherein: 1 / 2(A1+A3)≥A2≥1 / 3(A1+A3); A2 is the width of the first groove, and A1 and A3 are the widths of two sides of the first groove respectively.

12. The display module according to claim 10, wherein: A ratio of a depth of the first groove to a height of the first protrusion is less than or equal to 0.

8.

13. The display module according to claim 6, wherein: The second adhesive layer is provided with a second protrusion corresponding to the central area, and the supporting back plate is provided with a second groove corresponding to the central area; The second protrusion is embedded in the second groove, and the two are in contact with each other.

14. The display module according to claim 13, wherein: 1 / 2(B1+B3)≥B2≥1 / 3(B1+B3); B2 is the width of the second protrusion, and B1 and B3 are the widths of two sides of the second protrusion respectively.

15. The display module according to claim 13, wherein: A ratio of a depth of the second groove to a height of the second protrusion is less than or equal to 0.

8.

16. The display module according to claim 2, wherein: The edges of the first adhesive layer and the second adhesive layer are attached to each other to form a closed space; The heat-conducting layer and the heat-insulating layer are both located in the enclosed space.

17. The display module according to claim 1, wherein: The display module further comprises: a housing and an insulating structure layer; The housing is located between the supporting back plate and the driving circuit board; The insulating structure layer is located on a side of the housing away from the supporting back plate; The driving circuit board is located on a side of the insulating structure layer away from the housing, and is electrically connected to the display panel through a via hole penetrating the housing.

18. The display module according to claim 17, wherein: The display module further includes: a back cover and thermal conductive silicone grease; The back cover is located on a side of the driving circuit board away from the insulating structure layer; The thermal conductive silicone grease is located between the rear cover and the driving circuit board, and between the supporting back plate and the housing.

19. The display module according to claim 1, wherein: The display module further includes: a housing; The housing is located on a side of the driving circuit board away from the supporting back plate; A slot is provided on one side of the housing close to the driving circuit; The driving circuit board is embedded in the slot, and an air gap is formed between the driving circuit board and the supporting back plate.

20. The display module according to claim 19, wherein: The display module further includes: a back cover and thermal conductive silicone grease; The back cover is located on a side of the housing away from the driving circuit board; The thermal conductive silicone grease is located between the rear cover and the outer shell, and between the supporting back plate and the outer shell.

21. A display device, wherein: The display device comprises the display module according to any one of claims 1 to 20.

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