Substrate processing apparatus

Abstract

The invention provides a substrate processing apparatus capable of efficiently processing a substrate. The substrate processing apparatus includes: a first mechanism including a holding portion that holds substrates arranged at equal intervals in a vertical posture; a second mechanism that combines the second substrate group held by the first mechanism and the first substrate group delivered in advance from the first mechanism, and holds a plurality of substrates arranged at unequal intervals in which a first interval and a second interval wider than the first interval are alternately repeated; a pitch conversion unit that receives the plurality of substrates arranged at unequal pitches from the second mechanism and arranges the plurality of substrates arranged at unequal pitches at a narrow pitch repeating the first interval; a substrate processing unit that processes the plurality of substrates arranged at the narrow pitch together; and a main transport mechanism that transports a plurality of substrates arranged at a narrow pitch to the substrate processing unit, the holding unit having a holding groove, and the holding groove being provided at a position offset from a center in a width direction along an arrangement direction of the substrates to a side where the first pitch is disposed.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for processing substrates. Examples of such substrates include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disc substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of FPDs include liquid crystal displays and organic EL (electroluminescence) displays. Background Art

[0002] Currently, there are known substrate processing devices that process multiple substrates simultaneously while immersed in a processing liquid. These substrate processing devices include a posture conversion mechanism and a pusher (see, for example, Japanese Patent Application Laid-Open No. 2010-93230). The posture conversion mechanism converts the substrate's posture between a horizontal and vertical posture. The pusher transfers multiple vertically positioned substrates to and from the posture conversion mechanism by vertically moving a lifting and holding portion.

[0003] After 25 substrates are delivered from the posture conversion mechanism to the lifting and holding part, the lifting and holding part rotates 180 degrees around the vertical axis. Through the 180-degree rotation, the 25 held substrates move half the pitch. In this state, another 25 substrates are delivered from the posture conversion mechanism to the lifting and holding part. The 25 substrates delivered later are combined with the 25 substrates delivered previously to form a substrate group consisting of a total of 50 substrates on the lifting and holding part. At this time, the two adjacent substrates are in a face-to-face state with their front surfaces (or back surfaces) facing each other. By processing the substrates together in a face-to-face state, the device surface of the substrate can be prevented from being contaminated. In addition, the 50 substrates held by the lifting and holding part are arranged at a half pitch, which is half of the substrate holding pitch in the carrier. By processing the substrates arranged at half pitch together, the amount of processing liquid used can be reduced. Summary of the Invention

[0004] Problems to be solved by the invention

[0005] In order to further reduce the amount of processing liquid (chemical liquid and cleaning liquid) used in a substrate processing apparatus, it is desirable to arrange multiple substrates at a narrow pitch narrower than a half pitch and process the multiple substrates arranged at the narrow pitch at once.

[0006] In this case, the substrate group held by the posture conversion mechanism must be positioned between the substrates of the substrate group previously held by the spacing conversion mechanism at a distance corresponding to the narrow spacing. Consequently, the clearance between the substrate-holding guides of the posture conversion mechanism and the substrates held by the spacing conversion mechanism becomes narrower than before. Consequently, there is a risk that the substrate-holding guides of the posture conversion mechanism may interfere with the substrates previously held by the spacing conversion mechanism. If this interference occurs, efficient substrate processing cannot be achieved.

[0007] We have considered making the guide thinner. However, the guide is already sufficiently thin. Therefore, if the guide is made thinner, it will be difficult to ensure the dimensional accuracy of the guide. The possibility of the aforementioned interference still exists.

[0008] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of efficiently processing a substrate.

[0009] Solutions to Problems

[0010] The present invention adopts the following structure to achieve such an object.

[0011] That is, a substrate processing apparatus of the present invention processes substrates and includes: a first mechanism having a holding portion for holding substrates arranged in a vertical position at equal intervals; a second mechanism for combining a second substrate group held by the first mechanism with a first substrate group previously delivered from the first mechanism and holding a plurality of substrates arranged at unequal intervals, wherein a first interval and a second interval wider than the first interval are alternately repeated; a pitch conversion portion for receiving the plurality of substrates arranged at the unequal intervals from the second mechanism and arranging the plurality of substrates arranged at the unequal intervals at a narrow interval, wherein the first interval is repeated; a substrate processing portion for collectively processing the plurality of substrates arranged at the narrow intervals; and a main transport mechanism for transporting the plurality of substrates arranged at the narrow intervals to the substrate processing portion, wherein the holding portion has a holding groove formed along a peripheral edge of the substrates, the holding groove being provided at a position offset from a center in a width direction along the arrangement direction of the substrates toward a side where the first interval is arranged when the first and second substrate groups are combined.

[0012] According to the substrate processing apparatus of the present invention, substrates arranged in a vertical position at equal intervals are arranged at a narrower pitch by passing through a first mechanism, a second mechanism, and a pitch conversion unit. Multiple substrates arranged at a narrower pitch are processed collectively by the substrate processing unit. This reduces the amount of processing fluids (chemical and cleaning fluids) used in the substrate processing apparatus. The second mechanism combines the second substrate group held by the holding unit of the first mechanism with the first substrate group previously delivered from the first mechanism, holding multiple substrates arranged at unequal intervals, alternating between a first interval and a second interval wider than the first interval. During this combination, there is a concern that the holding unit of the first mechanism or substrates of the second substrate group held by the holding unit may interfere with substrates of the first substrate group held by the second mechanism at the location where the substrates are combined at the first interval. Therefore, the holding unit is provided with a holding groove offset from the center of the width along the substrate arrangement direction toward the side where the first interval is configured when the first and second substrate groups are combined. This reduces interference between the holding unit of the first mechanism or substrates of the first substrate group held by the holding unit and substrates of the second substrate group held by the second mechanism, even at the location where the substrates are combined at the first interval. Consequently, a substrate processing apparatus capable of efficiently processing substrates can be provided.

[0013] In addition, in the substrate processing device of the present invention, it is preferred that the above-mentioned first mechanism is a posture conversion mechanism, which comprises: a pair of horizontal holding parts, which have shelves on the ends of the substrates placed in the horizontal posture arranged at the above-mentioned equal intervals; and a pair of vertical holding parts as the above-mentioned holding parts, which have holding parts for holding the substrates in the vertical posture arranged at the above-mentioned equal intervals, and by rotating and displacing the above-mentioned pair of horizontal holding parts and the above-mentioned pair of vertical holding parts, the postures of the multiple substrates are converted into the vertical posture and the horizontal posture, and the above-mentioned second mechanism is a pusher mechanism having a pusher part, which The component combines the above-mentioned second substrate group in the above-mentioned vertical posture held by the above-mentioned pair of vertical holding parts and the above-mentioned first substrate group in the above-mentioned vertical posture delivered in advance from the above-mentioned pair of vertical holding parts, and holds the above-mentioned multiple substrates arranged at the above-mentioned unequal intervals. The above-mentioned holding component has the above-mentioned holding groove formed in a manner along the peripheral edge portion of the substrate in the above-mentioned vertical posture, and the above-mentioned holding groove is provided at a position offset from the center of the above-mentioned width direction along the arrangement direction of the above-mentioned substrates held in the above-mentioned vertical posture to the side where the above-mentioned first interval is arranged when the above-mentioned first substrate group and the above-mentioned second substrate group are combined.

[0014] Thus, when the substrates of the second substrate group held by the pair of vertical holding members are combined at a first interval with the substrates of the first substrate group that were previously delivered from the pair of vertical holding members to the pusher member, interference between the holding members of the pair of vertical holding members or the substrates of the second substrate group held by the holding members and the substrates of the first substrate group held by the pusher member can be minimized. Therefore, a substrate processing apparatus capable of efficiently processing substrates can be provided.

[0015] In addition, in the substrate processing apparatus of the present invention, it is preferred that, with respect to the holding member, the deepest portion of the holding groove is located at a position offset from the center in the width direction toward a side where the first gap is arranged when the first substrate group and the second substrate group are combined.

[0016] As a result, within the deepest portion of the holding groove, the substrate can be held in a position offset toward the side where the first gap is located when the first and second substrate groups are combined. Consequently, even in the area where the first gap is formed, interference between the holding components of the first mechanism holding the substrate and the substrate held by the second mechanism is unlikely to occur. Consequently, a substrate processing apparatus capable of efficiently processing substrates can be provided.

[0017] In addition, in the substrate processing device of the present invention, it is preferred that the above-mentioned holding component comprises: a first holding wall portion, which holds one end of the peripheral portion of the above-mentioned substrate inserted in the above-mentioned holding groove; and a second holding wall portion, which holds the other end of the peripheral portion of the above-mentioned substrate inserted in the above-mentioned holding groove, and the thickness in the above-mentioned width direction at the same groove depth position of the above-mentioned first holding wall portion and the above-mentioned second holding wall portion is different.

[0018] In order to prevent interference between the holding members of a pair of vertical holding portions or the substrate of the second substrate group held by the holding member and the substrate of the first substrate group held by the pusher member, it is considered to thin the thickness of both the first holding wall portion and the second holding wall portion by the same size in the width direction. However, if the thickness of both holding walls is thinned by the same size in the width direction, the rigidity of the holding member decreases on both sides of the first holding wall portion and the second holding wall portion. Therefore, the holding member is easily deformed, and therefore, it is difficult to maintain the dimensional accuracy of the holding member. In the present invention, the thickness of the first holding wall portion and the second holding wall portion constituting the holding member in the width direction at the same groove depth position is different. Thus, it is possible to prevent the rigidity of the holding member from decreasing on both sides of the first holding wall portion and the second holding wall portion. As a result, the holding member is difficult to deform, and it is easy to maintain the dimensional accuracy of the holding member.

[0019] In addition, in the substrate processing device of the present invention, it is preferred that the thickness of the above-mentioned first retaining wall portion in the above-mentioned width direction is thinner than the thickness of the above-mentioned second retaining wall portion at the same groove depth in the above-mentioned width direction, the above-mentioned first retaining wall portion is provided on the side where the above-mentioned first spacer is configured when the above-mentioned first substrate group and the above-mentioned second substrate group are combined, and the above-mentioned second retaining wall portion is provided on the side where the above-mentioned second spacer is configured when the above-mentioned first substrate group and the above-mentioned second substrate group are combined.

[0020] In the present invention, the thickness of the first retaining wall portion on the side provided with the first interval is thinner than the thickness of the second retaining wall portion, and the thickness of the second retaining wall portion on the side provided with the second interval is thicker than the thickness of the first retaining wall portion. This prevents the rigidity of the retaining component from decreasing at both the first retaining wall portion and the second retaining wall portion. As a result, the retaining component is less likely to deform, and the dimensional accuracy of the retaining component is easily maintained. In addition, even in the portion combined with the first interval, since the thickness of the first retaining wall portion is thin, interference between the retaining portion of the first mechanism or the substrate of the first substrate group retained by the retaining portion and the substrate of the second substrate group retained by the second mechanism is less likely to occur.

[0021] In addition, in the substrate processing device of the present invention, it is preferred that, with respect to the above-mentioned retaining component, the thickness in the width direction from the deepest part of the above-mentioned retaining groove to the outer side surface of the above-mentioned first retaining wall portion is thinner than the thickness in the width direction from the deepest part of the above-mentioned retaining groove to the outer side surface of the above-mentioned second retaining wall portion.

[0022] This ensures the rigidity of the retaining member from the deepest portion of the retaining groove to the upper surface of the retaining groove. Furthermore, the thickness of the first retaining wall portion from the deepest portion of the retaining groove to the upper surface of the retaining groove is reduced, thereby minimizing interference between the retaining portion of the first mechanism or the substrate of the first substrate group retained by the retaining portion and the substrate of the second substrate group retained by the second mechanism.

[0023] In addition, in the substrate processing device of the present invention, it is preferred that, with respect to the above-mentioned retaining component, the thickness in the width direction from the deepest part of the above-mentioned retaining groove to the outer side surface of the above-mentioned first retaining wall portion is the same as the thickness in the width direction from the deepest part of the above-mentioned retaining groove to the outer side surface of the above-mentioned second retaining wall portion, and the thickness in the width direction from a depth position shallower than the above-mentioned deepest part to the outer side surface of the above-mentioned first retaining wall portion is different from the thickness in the width direction from the same depth position to the outer side surface of the above-mentioned second retaining wall portion.

[0024] Thus, the thickness of the first retaining wall portion at a depth shallower than the deepest portion of the retaining groove becomes thinner, thereby making it difficult for the retaining portion of the first mechanism or the substrate of the first substrate group retained by the retaining portion to interfere with the substrate of the second substrate group retained by the second mechanism.

[0025] In addition, in the substrate processing device of the present invention, it is preferred that, with respect to the above-mentioned retaining component, the thickness in the width direction from the deepest part of the above-mentioned retaining groove to the outer side surface of the above-mentioned first retaining wall portion is the same as the thickness in the width direction from the deepest part of the above-mentioned retaining groove to the outer side surface of the above-mentioned second retaining wall portion, and the thickness in the width direction from a depth position shallower than the above-mentioned deepest part to the outer side surface of the above-mentioned first retaining wall portion is thinner than the thickness in the width direction from the same depth position to the outer side surface of the above-mentioned second retaining wall portion.

[0026] Thus, the rigidity of the holding member at a depth shallower than the deepest portion of the holding groove can be ensured. In addition, since the thickness of the first holding wall portion is reduced at a depth shallower than the deepest portion of the holding groove, interference between the holding portion of the first mechanism or the substrate of the first substrate group held by the holding portion and the substrate of the second substrate group held by the second mechanism can be reduced.

[0027] In addition, in the substrate processing device of the present invention, it is preferred that, with respect to the above-mentioned holding component, when the above-mentioned holding component is cut along the width direction, the cross-sectional shapes of the above-mentioned first holding wall portion and the above-mentioned second holding wall portion are asymmetric relative to the center line passing through the deepest part of the above-mentioned holding groove, wherein the width direction is a direction along the arrangement direction of the above-mentioned substrate.

[0028] This ensures the rigidity of the holding member.

[0029] In addition, in the substrate processing device of the present invention, it is preferred that, with respect to the above-mentioned holding component, the above-mentioned cross-sectional shape of the above-mentioned first holding wall portion is a shape in which the length in the above-mentioned width direction from a depth position shallower than the above-mentioned deepest portion to the outer side surface of the above-mentioned first holding wall portion is shorter than the length in the above-mentioned width direction from the same depth position to the outer side surface of the above-mentioned second holding wall portion.

[0030] Thus, the thickness of the first retaining wall portion at a depth shallower than the deepest portion of the retaining groove becomes thinner, thereby making it difficult for the retaining portion of the first mechanism or the substrate of the first substrate group retained by the retaining portion to interfere with the substrate of the second substrate group retained by the second mechanism.

[0031] Furthermore, in the substrate processing apparatus of the present invention, it is preferable that the shelf is provided on a side where the second partition is arranged when the first substrate group and the second substrate group are combined.

[0032] Thus, the shelf is provided on the side where the second space is arranged when the first and second substrate groups are combined. Therefore, when the first and second substrate groups are combined, it is less likely to interfere with the substrates held by the pusher mechanism.

[0033] Effects of the Invention

[0034] According to the substrate processing apparatus of the present invention, the holding member is provided with a holding groove at a position offset from the center in the width direction along the arrangement direction of the substrates toward a side where the first spacing is arranged when the first substrate group and the second substrate group are combined. This can reduce interference between the holding portion of the first mechanism or a substrate of the second substrate group held by the holding portion and a substrate of the first substrate group held by the second mechanism. Therefore, a substrate processing apparatus capable of efficiently processing substrates can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] For the purpose of illustrating the invention, several embodiments presently considered to be preferred are shown in the drawings; however, it should be understood that the invention is not limited to the illustrated structures and measures.

[0036] Figure 1 This is a plan view showing a schematic structure of a substrate processing apparatus according to Example 1.

[0037] Figure 2 It is a plan view showing the structure of the transfer block and its surroundings.

[0038] Figure 3 It is a side view showing the substrate operating mechanism.

[0039] Figure 4 It is a side view showing the posture conversion unit.

[0040] Figure 5 It will Figure 4 The posture conversion mechanism shown is a cross-sectional view taken along line yy.

[0041] Figure 6A It is a side view of a pair of horizontal holding parts and a pair of vertical holding parts in a horizontal posture.

[0042] Figure 6B It will Figure 5 The holding member shown is a cross-sectional view taken along line y1-y1.

[0043] Figure 7 It is a plan view of a pair of horizontal holding parts and a pair of vertical holding parts in a vertical posture.

[0044] Figure 8 It is a side view showing the pusher mechanism.

[0045] Figure 9 It is a side view showing the pusher component in longitudinal section.

[0046] Figure 10 Is to say Figure 2 A side view of the handover mechanism and two pitch conversion parts when viewed as shown by arrow AA.

[0047] Figure 11 This is a plan view that mainly shows the moving-in and moving-out mechanisms.

[0048] Figure 12 It is a floor plan that primarily represents an intermediary agency.

[0049] Figure 13 This is a side view schematically showing the structure of a pitch converter that holds a plurality of substrates arranged at unequal pitches.

[0050] Figure 14This is a side view schematically showing the structure of a pitch converter that holds a plurality of substrates arranged at a narrow pitch.

[0051] Figure 15 This is a bottom view mainly showing the telescopic mechanism of the pitch conversion portion that holds a plurality of substrates arranged at unequal pitches.

[0052] Figure 16 This is a bottom view mainly showing the telescopic mechanism of the pitch conversion portion that holds a plurality of substrates arranged at a narrow pitch.

[0053] Figure 17 This is a flowchart for explaining the first half of the operation of the substrate processing apparatus.

[0054] Figure 18A 、 Figure 18B 、 Figure 18C It is a side view for explaining the operation of the substrate processing apparatus.

[0055] Figure 19A 、 Figure 19B 、 Figure 19C It is a side view for explaining the operation of the substrate processing apparatus.

[0056] Figure 20A 、 Figure 20B 、 Figure 20C It is a side view for explaining the operation of the substrate processing apparatus.

[0057] Figure 21A 、 Figure 21B It is a side view for explaining the operation of the substrate processing apparatus.

[0058] Figure 22A 、 Figure 22B It is a side view for explaining the operation of the substrate processing apparatus.

[0059] Figure 23A 、 Figure 23B It is a side view for explaining the operation of the substrate processing apparatus.

[0060] Figure 24A 、 Figure 24B It is a side view of a characteristic portion for explaining the operation of the substrate processing apparatus.

[0061] Figure 25 is to proceed Figure 24A A top view of the posture converter and pusher mechanism in action is shown.

[0062] Figure 26 is to proceed Figure 24B A top view of a conventional posture converter and pusher mechanism showing the operation shown.

[0063] Figure 27A It will Figure 25 The vertical holding portion shown is a cross-sectional view taken along line y2-y2.

[0064] Figure 27B It will Figure 26 The shown figure is a cross-sectional view of a conventional vertical holding portion taken along line y3 - y3 .

[0065] Figure 28 yes Figure 27A An enlarged view of the retaining component surrounded by a two-dot chain line.

[0066] Figure 29 This is a flowchart for explaining the second half of the operation of the substrate processing apparatus.

[0067] Figure 30A 、 Figure 30B It is a side view for explaining the operation of the substrate processing apparatus.

[0068] Figure 31A 、 Figure 31B It is a side view for explaining the operation of the substrate processing apparatus.

[0069] Figure 32A 、 Figure 32B It is a side view for explaining the operation of the substrate processing apparatus.

[0070] Figure 33A 、 Figure 33B 、 Figure 33C It is a side view for explaining the operation of the substrate processing apparatus.

[0071] Figure 34A 、 Figure 34B 、 Figure 34C It is a side view for explaining the operation of the substrate processing apparatus.

[0072] Figure 35A 、 Figure 35B 、 Figure 35C 、 Figure 35D It is a cross-sectional view showing a holding member according to a modified example.

[0073] Figure 36A 、 Figure 36B It is a cross-sectional view showing a holding member according to a modified example.

[0074] In the picture:

[0075] c1—clearance, t1~t4—thickness, TN1—first gap, TN2—second gap, W—substrate, W1—first substrate group, W2—second substrate group, 1—substrate processing device, 19—posture conversion mechanism, 21—pusher mechanism, 25, 26—pitch conversion part, 37—horizontal holding part, 37A—shelf, 39—vertical holding part, 39Ba—center in width direction, 39C—holding groove, 39Ca—deepest part, 39C1—first holding wall, 39C1a—outer end edge, 39C1s—outer side surface, 39C2—second holding wall, 39C2a—outer end edge, 39C2s—outer side surface, 55—pusher component, BT1~BT4—chemical liquid processing tank, WTR—main transport mechanism. DETAILED DESCRIPTION

[0076] Hereinafter, the present invention will be described with reference to various embodiments.

[0077] [Example 1]

[0078] Hereinafter, Example 1 of the present invention will be described with reference to the accompanying drawings. Figure 1 It is a plan view showing a schematic structure of the substrate processing apparatus 1 according to the first embodiment. Figure 2 It is a plan view showing the transfer block 5 and the surrounding structure.

[0079] In this specification, for the sake of convenience, the direction in which the transfer block 5 and the processing block 7 are arranged is referred to as the "front-back direction X". The front-back direction X is a horizontal direction. The direction in the front-back direction X, for example, from the processing block 7 toward the transfer block 5, is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction perpendicular to the front-back direction X is referred to as the "width direction Y". One direction of the "width direction" is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". The vertical direction Z is expressed as "above" and "below". In each figure, the front, back, right, left, top and bottom are appropriately shown for reference.

[0080] <1. Structure of Substrate Processing Apparatus>

[0081] Reference Figure 1 The substrate processing apparatus 1 processes substrates W. The substrate processing apparatus 1 is a batch-type substrate processing apparatus that processes multiple substrates W (e.g., 50, 75, or 100 substrates) at once. The substrate processing apparatus 1 performs, for example, chemical treatment, cleaning, and drying on the substrates W. The substrate processing apparatus 1 includes a stocker 2, a carrier 3, a transfer block 5, a processing block 7, and a batch substrate transfer area 8.

[0082] <1-1. Storage>

[0083] The storage 2 accommodates at least one carrier C. The storage 2 is adjacent to the front of the transfer block 5. The carrier C stores multiple (for example, 25) substrates W in a horizontal posture at predetermined intervals (for example, 10 mm). In other words, the carrier C stores N (for example, 25) substrates W arranged at a reference pitch in a horizontal posture. In addition, "N" of the N substrates W is a natural number greater than 2. In addition, the reference pitch repeats the reference pitch TN9 (for example, 10 mm). That is, when the reference pitch TN9 is 10 mm, the reference pitch is a 10 mm pitch. The N substrates W in the carrier C are arranged in the vertical direction Z or the thickness direction of each substrate W. As the carrier C, for example, a FOUP (Front Opening Unify Pod) is used, but it is not limited to this.

[0084] The stocker 2 has multiple (e.g., two) loading ports 9. The two loading ports 9 are arranged along the width direction Y. In this embodiment, the two loading ports 9 are used to load and unload carriers C. Furthermore, the stocker 2 has at least one storage rack 11 and a carrier transport robot 13. Carriers C are loaded on the storage rack 11.

[0085] The carrier transport robot 13 transports carriers C between the two loading ports 9, the storage rack 11, and the loading rack 3. The carrier transport robot 13 includes a gripping portion 15 for gripping, for example, a protrusion provided on the upper surface of the carrier C. The carrier transport robot 13 can move the gripping portion 15 in the horizontal direction (front-back direction X and width direction Y) and in the vertical direction Z. The carrier transport robot 13 is driven by one or more electric motors.

[0086] The loading rack 3 is arranged in the area of the stocker 2. The loading rack 3 is adjacent to the front of the transfer block 5. The loading rack 3 places the carrier C thereon.

[0087] <1-2. Transfer Block>

[0088] Reference Figure 1 、 Figure 2 The transfer block 5 includes a substrate handling mechanism (robot) HTR, a posture conversion mechanism 19 , a pusher mechanism 21 , a transfer mechanism 23 , and two pitch conversion units 25 and 26 .

[0089] The substrate handling mechanism HTR is arranged behind the carrier 3. The substrate handling mechanism HTR transports a plurality of (for example, 25) substrates W in a horizontal posture between the carrier C placed on the carrier 3 and the posture conversion mechanism 19. Figure 3As shown, the substrate handling mechanism HTR includes a plurality (e.g., 25 or 13) of robots 27. Each robot 27 holds a substrate W. The plurality of robots 27 are arranged at a reference pitch along the vertical direction Z. Thus, for example, 25 substrates W held by the 25 robots 27 are arranged at a reference pitch. Furthermore, the reference pitch repeats a reference interval TN9 (e.g., 10 mm).

[0090] In addition, Figure 3 For ease of illustration, the substrate handling mechanism HTR is assumed to include five robots 27. Furthermore, a pair of horizontal holding portions 37 and a pair of vertical holding portions 39, described later, are assumed to hold five substrates W. Furthermore, a pusher member 55, described later, is assumed to support ten substrates W.

[0091] The substrate handling mechanism HTR also includes a robot support portion 29, an advance and retreat portion 31, and a lifting and rotating portion 33. The robot support portion 29 supports a plurality of robots 27. The advance and retreat portion 31 moves the plurality of robots 27 forward and backward via the robot support portion 29. In order to change the orientation of the robots 27, the lifting and rotating portion 33 rotates the advance and retreat portion 31 around the vertical axis AX1. The lifting and rotating portion 33 is fixed to the floor surface. In addition, the advance and retreat portion 31 and the lifting and rotating portion 33 each include an electric motor. In addition, the substrate handling mechanism HTR may also include a movable robot (not shown) other than the robot 27 for carrying only one substrate W.

[0092] The posture conversion mechanism 19 converts a plurality of (for example, 25) substrates W between a horizontal posture and a vertical posture. The posture conversion mechanism 19 is arranged on the left side of the substrate manipulation mechanism HTR. Figure 4 As shown, the posture conversion mechanism 19 includes a support base 35 , a pair of horizontal holding portions 37 , a pair of vertical holding portions 39 , and a rotation drive portion 41 .

[0093] The support table 35 is supported so as to be rotatable about a horizontal axis AX2 extending in the front-to-back direction X. A pair of horizontal holding portions 37 and a pair of vertical holding portions 39 are provided to extend at right angles from the support surface 35A. When the multiple substrates W are in a horizontal position, the pair of horizontal holding portions 37 hold the multiple substrates W. In other words, when the multiple substrates W are in a horizontal position, the multiple substrates W are placed on the pair of horizontal holding portions 37. Furthermore, when the multiple substrates W are in a vertical position, the pair of vertical holding portions 39 hold the multiple substrates W.

[0094] The pair of horizontal holding portions 37 and the pair of vertical holding portions 39 are both arranged along the front-back direction X (see Figure 2). In addition, when the pair of horizontal holding parts 37 hold a plurality of substrates W in a horizontal posture, the pair of vertical holding parts 39 are arranged on the side of the pusher mechanism 21 relative to the pair of horizontal holding parts 37. The pair of horizontal holding parts 37 have a plurality of pairs (for example, 25 pairs, 38 pairs, 50 pairs) of shelves 37A arranged at a reference pitch along the direction DR1 in which the pair of horizontal holding parts 37 extend. The pair of vertical holding parts 39 have a plurality of pairs (for example, 25 pairs, 38 pairs, 50 pairs) of holding parts 39A arranged at a reference pitch along the direction DR1 in which the pair of vertical holding parts 39 extend. The holding parts 39A have holding grooves 39C described later. The direction DR1 in which the pair of horizontal holding parts 37 and the pair of vertical holding parts 39 extend is the same direction as the arrangement direction of the substrates W.

[0095] In addition, the posture conversion mechanism 19 also includes an axial moving portion 51 and a accommodating moving portion 53. The axial moving portion 51 moves the pair of horizontal holding portions 37 by a predetermined small distance in the direction DR1 in which the pair of horizontal holding portions 37 extend. The accommodating moving portion 53 moves the pair of vertical holding portions 39 closer to or farther away from the pair of horizontal holding portions 37. For example, when the pair of horizontal holding portions 37 hold multiple substrates W in a horizontal posture, the accommodating moving portion 53 can move the pair of vertical holding portions 39 along the width direction Y. The rotational drive portion 41 converts the posture of the support table 35 between a vertical supporting posture and a horizontal supporting posture. In other words, the posture conversion mechanism 19 converts the posture of the pair of horizontal holding portions 37 and the pair of vertical holding portions 39 between a vertical supporting posture and a horizontal supporting posture. Thus, the posture conversion mechanism 19 converts the multiple substrates W held by the pair of horizontal holding portions 37 and the pair of vertical holding portions 39 between a horizontal posture and a vertical posture.

[0096] The rotation drive unit 41 includes, for example, an electric motor. The axial movement unit 51 and the accommodation movement unit 53 each include an air cylinder or an electric actuator. The electric actuator includes an electric motor.

[0097] Reference Figure 5 、 Figure 6A 、 Figure 6B 、 Figure 7 . Figure 5 It will Figure 4 The illustrated posture conversion mechanism 19 is a cross-sectional view taken along line yy. Figure 6A It is a side view of the pair of horizontal holding parts 37 and the pair of vertical holding parts 39 in a horizontal posture. Figure 6B It will Figure 5 The holding member 39A shown is a cross-sectional view taken along line y1-y1. Figure 7 It is a diagram showing the shelf 37A and the holding member 39A in a vertical posture.

[0098] like Figure 5As shown, the shelf 37A is formed from the portion indicated by the dotted line to the boundary with the hatched line indicated by the right downward slanting line. The holding component 39A includes a holding groove forming portion 39D that forms the holding groove 39C in the area overlapping with the substrate W from the portion indicated by the dotted line. The portion indicated by the dotted line is the deepest portion 39Ca of the holding groove 39C. The holding component 39A includes a holding groove support portion 39E that supports the holding groove forming portion 39D from the deepest portion 39Ca to the boundary with the hatched line indicated by the left downward slanting line. The holding component 39A includes a vertical holding body 39F that supports the holding groove support portion 39E in the area indicated by the hatched line indicated by the left downward slanting line. In other words, the holding component 39A extends from the vertical holding body 39F in the front-to-back direction X.

[0099] like Figure 6A As shown, the substrate W is placed on the placement surface 37B of the shelf 37A. The holding member 39A is formed with a holding groove 39C. The substrate W placed on the placement surface 37B is inserted into the holding groove 39C.

[0100] like Figure 6B As shown, an example of the retaining groove 39C is a groove having a V-shaped cross section. Hereinafter, the retaining groove 39C is also referred to as a V-shaped groove. The retaining groove 39C has two inclined inclined surfaces 39C3. The upper side of the two inclined surfaces 39C3 is referred to as the first inclined surface 39C3a, and the lower side is referred to as the second inclined surface 39C3b. The retaining component 39A is the area marked with hatching. In the retaining component 39A, the substrate W side is referred to as the retaining groove forming portion 39D, and the opposite side is referred to as the retaining groove supporting portion 39E, with the double-dashed line z1 as the boundary.

[0101] Specifically, the holding groove 39C is formed along the peripheral edge Wa of the substrate W in the horizontal posture. Specifically, the holding groove 39C contacts two locations above and below the peripheral edge Wa of the substrate W in the vertical posture.

[0102] The holding groove 39C is positioned upwardly offset from the center 39Ba in the direction DR1 extending from the pair of horizontal holding portions 37 and the pair of vertical holding portions 39, i.e., along the width direction of the arrangement direction of the substrates W. The direction DR1 extending from the pair of horizontal holding portions 37 and the pair of vertical holding portions 39, the direction along the arrangement direction of the substrates W held in a vertical position by the pair of vertical holding portions 39, and the width direction of the holding member 39A are all the same. The arrangement direction of the substrates W in a vertical position is also represented by the symbol DR1. For example, the holding groove 39C is positioned entirely above the center 39Ba. The placement surface 37B is located within the vertical width of the holding groove 39C.

[0103] The deepest portion 39Ca of the holding groove 49C is located on the deep side (the deep side in the drawing) when viewed from the substrate handling mechanism HTR. The deepest portion 39Ca is located upwardly offset from the center 39Ba. The deepest portion 39Ca is located above the placement surface 37B.

[0104] The width of the holding groove 39C in the vertical direction is greater than the width of the substrate W in the vertical direction (the thickness of the substrate W). When viewed from the substrate handling mechanism HTR, the holding groove 39C overlaps with the shelf 37A. For example, a portion of both end sides of the holding groove 39C in the front-to-back direction x overlaps with the horizontal holding portion 37. Specifically, the end of the second inclined surface 39C3b of the holding groove 39C, which is below the deepest portion 39Ca, overlaps with the end of the shelf 37A. The first inclined surface 39C3a of the holding groove 39C, which is above the deepest portion 39Ca, does not overlap with the shelf 37A.

[0105] Furthermore, the holding groove 39C and the shelf 37A may be separated in the horizontal direction so that the holding groove 39C and the shelf 37A do not overlap when viewed from the substrate handling mechanism HTR side.

[0106] like Figure 7 As shown, when the shelf 37A and holding member 39A are in the vertical position, the shelf 37A is located to the right of the substrate W (on the side of the posture conversion mechanism 19). This substrate W is the substrate W originally placed on the shelf 37A when it was in the horizontal position. As will be described later, after the shelf 37A is in the vertical position, it separates to the right from the substrate W. In other words, the shelf 37A in the vertical position does not directly hold the substrate W. Furthermore, the shelf 37A can also support a substrate W that has fallen from the vertical position.

[0107] Return to Figure 1 、 Figure 2 The pusher mechanism 21 is arranged on the left side of the posture conversion mechanism 19. Figure 8 As shown, the pusher mechanism 21 includes a pusher member 55 , a rotating shaft 57 , a pusher rotating portion 59 , a pusher horizontal moving portion 61 , an elevating platform 63 , and a pusher elevating portion 65 .

[0108] like Figure 9 As shown, the pusher member 55 holds a plurality of substrates W (e.g., 50, 75, or 100) arranged at unequal intervals, alternating between first intervals TN1 (e.g., 3.333 mm) and second intervals TN2 (e.g., 6.666 mm), in a vertical position. The second interval TN2 is wider than the first interval TN1 (second interval TN2 > first interval TN1). The first interval TN1 is also referred to as a narrow interval, and the second interval TN2 is also referred to as a wide interval.

[0109] like Figure 9As shown, the pusher member 55 includes a plurality (e.g., 50, 75, or 100) of vertical holding grooves 67 to hold multiple substrates W in a vertical position. The plurality of vertical holding grooves 67 are arranged at unequal intervals, for example, alternating first intervals TN1 and second intervals TN2. The sum of the first interval TN1 (e.g., 3.333 mm) and the second interval TN2 (e.g., 6.666 mm) is a reference interval TN9 (e.g., 10 mm).

[0110] Reference Figure 8 . The lower surface of the pusher component 55 is connected to the upper end of the rotating shaft body 57. The pusher rotating part 59 rotates the pusher component 55 and the rotating shaft body 57 around the vertical axis AX3 passing through the rotating shaft body 57. As a result, the plurality of substrates W supported in a vertical posture by the pusher component 55 rotate around the vertical axis AX3. The pusher rotating part 59 includes, for example, an electric motor. The pusher rotating part 59 is provided below the pusher component 55. In addition, the pusher rotating part 59 is mounted on the upper surface of the lifting platform 63 via the pusher horizontal moving part 61.

[0111] The pusher horizontal moving unit 61 includes two guide rails 61A extending in the width direction Y, a slider 61B, and an electric motor (not shown). The two guide rails 61A are provided on the upper surface of the lifting platform 63. The slider 61B moves along the two guide rails 61A in the width direction Y. The slider 61B is driven by the electric motor. The pusher lifting unit 65 raises and lowers the lifting platform 63 in the vertical direction Z. This causes the pusher member 55 to rise and fall. The pusher lifting unit 65 includes, for example, an electric actuator.

[0112] Reference Figure 2 . The two spacing conversion parts 25 and 26 are arranged on the left side of the pusher mechanism 21. In addition, if the two spacing conversion parts 25 and 26 are arranged along the vertical direction Z, the substrate processing device 1 will become unnecessarily high. From this point of view, the two spacing conversion parts 25 and 26 are arranged along the front-to-back direction X. That is, the first spacing conversion part 25 is arranged behind the second spacing conversion part 26 when viewed in a planar manner. Therefore, it is possible to prevent the substrate processing device 1 from becoming unnecessarily high. The handover mechanism 23 transports a plurality of substrates W arranged at unequal intervals between the pusher component 55 and the two spacing conversion parts 25 and 26, for example.

[0113] Reference Figure 2 、 Figure 10 . Figure 10 Is to say Figure 21 is a side view of the transfer mechanism 23 and the two pitch conversion parts 25 and 26 when viewed as shown by arrows A-A. The transfer mechanism 23 includes a carry-in mechanism 71, an intermediary mechanism 73, and a carry-out mechanism 75. The carry-in mechanism 71 transports a plurality of substrates W arranged at unequal pitches from the pusher component 55 to the first pitch conversion part 25. The intermediary mechanism 73 transports a plurality of substrates W arranged at narrow pitches from the first pitch conversion part 25 to the first transfer position P1. The carry-out mechanism 75 transports a plurality of substrates W arranged at unequal pitches from the second pitch conversion part 26 to the pusher component 55. The carry-in mechanism 71, the intermediary mechanism 73, and the carry-out mechanism 75 include a chuck 77, a chuck 78, and a chuck 79, respectively.

[0114] like Figure 10 As shown, the carry-in mechanism 71 is arranged at the carry-in height position H1. The carry-in mechanism 71 is arranged, for example, on the side of the lifting portion 141 of the second pitch conversion portion 26. The chuck 78 of the intermediary mechanism 73 is provided at an upper position of the first pitch conversion portion 25. In addition, the chuck 78 of the intermediary mechanism 73 is arranged between the carry-in height position H1 and the first handover position P1. The first handover position P1 is a position higher than the carry-in height position H1 and the carry-out height position H2. The carry-out mechanism 75 is arranged at the carry-out height position H2 which is higher than the carry-in height position H1. The carry-in mechanism 71 and the carry-out mechanism 75 are respectively configured so that the carry-out mechanism 75 and the plurality of substrates W held by the carry-out mechanism 75 do not interfere with the carry-in mechanism 71 and the plurality of other substrates W held by the carry-in mechanism 71.

[0115] Figure 11 This is a plan view primarily showing the load-in mechanism 71 and the load-out mechanism 75. The load-in mechanism 71 is located behind the load-out mechanism 75. Specifically, the load-in mechanism 71 is located on the processing block 7 side, and the load-out mechanism 75 is located on the stocker 2 side. The load-in mechanism 71 includes a chuck 77, an opening and closing portion 81, a front-to-back moving portion 83, and a widthwise moving portion 85.

[0116] The chuck 77 holds multiple substrates W arranged at unequal intervals in a vertical position. The chuck 77 includes a pair of chuck components 77A and 77B extending in the width direction Y, respectively. The pair of chuck components 77A and 77B includes multiple pairs (e.g., 50 pairs, 75 pairs, 100 pairs) of retaining grooves 87 and 88 arranged at unequal intervals. In addition, the unequal intervals are the alternating repetitions of the first interval TN1 (e.g., 3.333 mm) and the second interval TN2 (e.g., 6.666 mm). The first chuck component 77A is provided with multiple retaining grooves 87 arranged at unequal intervals. In addition, the second chuck component 77B is provided with multiple retaining grooves 88 arranged at unequal intervals.

[0117] The opening and closing portion 81 supports the two chuck components 77A and 77B so as to be movable along the front-back direction X. In addition, the opening and closing portion 81 opens and closes the two chuck components 77A and 77B in the front-back direction X. Specifically, the opening and closing portion 81 moves the two chuck components 77A and 77B closer to or farther away from each other. When the opening and closing portion 81 closes the chuck 77, the chuck 77 can hold multiple substrates W in a vertical posture. In contrast, when the opening and closing portion 81 opens the chuck 77, the chuck 77 can pass multiple substrates W in a vertical posture between the two chucks 77A and 77B along the vertical direction Z. The opening and closing portion 81 includes an air cylinder or an electric actuator that drives the two chuck components 77A and 77B.

[0118] The front-to-back moving portion 83 is positioned closer to the two pitch conversion portions 25 and 26 than the width-direction moving portion 85. The front-to-back moving portion 83 moves the chuck 77 and the opening and closing portion 81 horizontally in the front-to-back direction X. The width-direction moving portion 85 moves the chuck 77, the opening and closing portion 81, and the front-to-back moving portion 83 horizontally in the width-direction Y. In other words, the front-to-back moving portion 83 and the width-direction moving portion 85 can move the chuck 77 in the front-to-back direction X and the width-direction Y (two-dimensional directions). The front-to-back moving portion 83 includes, for example, an air cylinder or an electric actuator. The width-direction moving portion 85 includes an electric actuator.

[0119] The carrying-out mechanism 75 includes a chuck 79, an opening and closing portion 89, a front-to-back direction moving portion 91, and a width direction moving portion 93. The chuck 79 is constructed in the same manner as the chuck 77. Specifically, the chuck 79 includes a pair of chuck components 79A and 79B respectively extending in the width direction Y. The pair of chuck components 79A and 79B includes a plurality of pairs (for example, 50 pairs, 75 pairs, 100 pairs) of retaining grooves 95 and 96 arranged at unequal intervals. The front-to-back direction moving portion 91 is arranged on the side of the two spacing conversion portions 25 and 26 relative to the width direction moving portion 93. In addition, the opening and closing portion 89, the front-to-back direction moving portion 91, and the width direction moving portion 93 are constructed in the same manner as the opening and closing portion 81, the front-to-back direction moving portion 83, and the width direction moving portion 85, respectively.

[0120] Figure 12 1 is a plan view mainly showing the intermediary mechanism 73. The intermediary mechanism 73 includes a chuck 78, an opening and closing portion 101, an arm portion 103, and a lifting portion 105. The chuck 78 includes a pair of chuck components 78A and 78B, each extending in the width direction Y. The pair of chuck components 78A and 78B includes multiple pairs (e.g., 50 pairs, 75 pairs, 100 pairs) of retaining grooves 107 and 108 arranged at a narrow pitch (e.g., a 3.333 mm pitch (1 / 3 pitch)). Specifically, the first chuck component 78A is provided with multiple retaining grooves 107 arranged at a narrow pitch along the width direction Y. In addition, the second chuck component 78B is provided with multiple retaining grooves 108 arranged at a narrow pitch.

[0121] The opening and closing portion 101 is arranged on the right side of the chuck 78 (on the side of the pusher mechanism 21). Apart from this, the opening and closing portion 101 is constructed in the same manner as the opening and closing portion 81. If described in a more specific manner, the opening and closing portion 101 supports a pair of chuck components 78A and 78B so as to be movable along the front-to-back direction X. In addition, the opening and closing portion 101 opens and closes a pair of chuck components 78A and 78B in the front-to-back direction X. When the opening and closing portion 101 closes the chuck 78, the chuck 78 can hold multiple substrates W arranged at a narrow interval in a vertical posture. In contrast, when the opening and closing portion 101 opens the chuck 78, the chuck 78 can pass multiple substrates W in a vertical posture between the two chuck components 78A and 78B along the vertical direction Z.

[0122] The opening and closing section 101 is mounted on the lifting section 105 via the arm section 103 so as to be able to be raised and lowered. The lifting section 105 raises and lowers the chuck 78 and the opening and closing section 101 in the vertical direction Z. The lifting section 105 includes, for example, an electric actuator. Thus, the intermediary mechanism 73 can receive the plurality of substrates W arranged in a vertical position with a narrow pitch from the first pitch conversion section 25, and move the plurality of substrates W to the first transfer position P1 (see FIG. 1 ) in order to transfer the plurality of substrates W to the main transport mechanism WTR. Figure 10 ).

[0123] Furthermore, the transfer block 5 has two transport paths for transporting multiple substrates W between the pusher member 55 (pusher mechanism 21) and the main transport mechanism WTR. Specifically, the first transport path passes through the carry-in mechanism 71, the first pitch converter 25, and the intermediate mechanism 73. Furthermore, the second transport path passes through the second pitch converter 26 and the carry-out mechanism 75. For example, while 50 substrates W are held by the intermediate mechanism 73, the carry-out mechanism 75 can transport the 50 substrates W, which have been processed in the chemical liquid treatment tank BT1, etc., to the pusher member 55. This allows for smooth transport of 50 substrates W (a processed substrate set).

[0124] Reference Figure 10 、 Figures 13 to 16 The two pitch conversion sections 25 and 26 respectively convert the pitch of the multiple substrates W between unequal pitch and narrow pitch. The unequal pitch is a first pitch TN1 (e.g., 3.333 mm) and a second pitch TN2 (e.g., 6.666 mm) that is wider than the first pitch TN1, which is repeated alternately. The narrow pitch is a repeating first pitch TN1.

[0125] The first pitch conversion unit 25 arranges the plurality of substrates W, which were arranged at unequal pitches, at a narrow pitch. Specifically, the first pitch conversion unit 25 converts the pitch of the plurality of substrates W before processing in the processing block 7 into a narrow pitch. Conversely, the second pitch conversion unit 26 arranges the plurality of substrates W, which were arranged at a narrow pitch, at unequal pitches. Specifically, the second pitch conversion unit 26 converts the pitch of the plurality of substrates W after processing in the processing block 7 into an unequal pitch.

[0126] Each of the two pitch converters 25 and 26 includes a pitch converter body 111 . The pitch converter body 111 includes a plurality of (eg, 25, 38, or 50) holding members 113 ( 113A to 113E) and a moving portion 115 .

[0127] A plurality of holding components 113 hold a plurality of substrates W arranged at unequal intervals in a vertical position. The plurality of holding components 113 each have two holding grooves 117 for holding two substrates W in the plurality of substrates W at a first interval TN1 (e.g., 3.333 mm). The two holding grooves 117 are separated by a first interval TN1. The two holding grooves 117 of each holding component 113 are arranged along the width direction Y. For example, when the spacing conversion portion 25 has 25 holding components 113, the 25 holding components 113 can hold 50 substrates W. In addition, in Figures 13 to 16 In the figure, for the convenience of illustration, it is assumed that the two pitch conversion parts 25 and 26 each have five holding members 113.

[0128] The moving unit 115 moves the plurality of holding members 113 along the arrangement direction (width direction Y) of the plurality of substrates W to switch between an unequal pitch state in which the plurality of substrates W are arranged at unequal pitches and a narrow pitch state in which the plurality of substrates W are arranged at narrow pitches. The moving unit 115 includes a base member 119, two guide rails 121, an extension mechanism 123, a drive unit 125, and a coupling unit 127.

[0129] The two guide rails 121 support the multiple holding components 113 so that they can move along the arrangement direction (width direction Y). The two guide rails 121 extend respectively along the width direction Y. The two guide rails 121 are mounted on the upper surface of the base component 119. In addition, the central holding component 113C among the multiple holding components 113 is fixed to the base component 119 by, for example, a screw SW. That is, the central holding component 113C does not move in the width direction Y. In addition, the guide rails 121 are not limited to two, and can also be one, or three or more. That is, the moving part 115 only needs to have one or more guide rails 121.

[0130] The telescopic mechanism 123 allows the plurality of holding members 113 to be telescopic in the arrangement direction (width direction Y). The telescopic mechanism 123 is connected to each holding member 113. The telescopic mechanism 123 is composed of, for example, a link mechanism. Specifically, the telescopic mechanism 123 is composed of, for example, a lazy tongs type, a sawtooth type, or a type similar thereto. The telescopic mechanism 123 is, for example, provided with a plurality of ( Figure 13 etc.) connecting rod components 129, multiple ( Figure 13 etc.) pins 131 and multiple ( Figure 13 etc.) connectors 133. Figure 15 、 Figure 16 For example, five pins 131 are provided on the bottom surfaces of the five holding members 113. The five link members 129 are each rotatably mounted on the five pins 131 about a vertical axis. The five pins 131 are located at the five center portions of the five link members 129. Four joints 133 connect the ends of two adjacent link members 129.

[0131] For example, the first end of the link member 129B is connected to the second end of the link member 129A via a joint 133A. In addition, the second end of the link member 129B is connected to the first end of the link member 129C via a joint 133B.

[0132] The drive unit 125 drives the telescopic mechanism 123. The drive unit 125 is attached to the bottom surface of the base member 119. The drive unit 125 extends and retracts a rod 125A extending in the width direction Y. The drive unit 125 comprises an air cylinder or an electric actuator. The connecting portion 127 connects the end holding members 113E of the plurality of holding members 113 to the distal end of the rod 125A of the drive unit 125. Furthermore, the connecting portion 127 extends through the opening 119A of the base member 119.

[0133] exist Figure 13 、 Figure 15 For example, when the rod 125A of the driving unit 125 is extended, the end holding member 113E is separated from the central holding member 113C, and the other three holding members 113A, 113B, and 113D are separated from the central holding member 113C by the telescopic mechanism 123. As a result, the multiple substrates W are arranged at unequal intervals. Figure 14 、 Figure 16 For example, when the rod 125A of the driving unit 125 contracts, the end holding member 113E approaches the central holding member 113C, and the other three holding members 113A, 113B, and 113D approach the central holding member 113C through the telescopic mechanism 123. As a result, the plurality of substrates W are arranged at a narrow pitch (first interval TN1).

[0134] like Figure 10As shown, each of the pitch converters 25 and 26 includes a lifting unit 141. The lifting unit 141 raises and lowers the pitch converter body 111 (the plurality of holding members 113 and the moving unit 115). The lifting unit 141 includes an air cylinder or an electric actuator.

[0135] The lifting unit 141 of the first pitch converter 25 raises and lowers the plurality of holding members 113 between an upper position higher than (the upper surface of) the chuck 77 of the carry-in mechanism 71 and a lower position lower than the chuck 77. Furthermore, the lifting unit 141 of the second pitch converter 26 raises and lowers the plurality of holding members 113 between an upper position higher than (the upper surface of) the chuck 79 of the carry-out mechanism 75 and a lower position lower than the chuck 79.

[0136] <1-3. Processing Block>

[0137] Reference Figure 1 The processing block 7 includes a plurality (e.g., four) batch processing tanks BT1 to BT4 and a drying unit 143. The four batch processing tanks BT1 to BT4 and the drying unit 143 are arranged along the front-to-back direction X extending from the substrate processing apparatus 1. The four batch processing tanks BT1 to BT4 each perform immersion processing on a plurality (e.g., 50, 75, or 100) of substrates W at a time. The four batch processing tanks BT1 to BT4 each store a processing liquid (e.g., a chemical solution or pure water) used to immerse the plurality of substrates W.

[0138] The four batch processing tanks BT1 to BT4 are composed, for example, of two chemical processing tanks BT1 and BT3 and two cleaning tanks BT2 and BT4. The chemical processing tank BT1 and the cleaning tank BT2 are grouped together, while the chemical processing tank BT3 and the cleaning tank BT4 are grouped together. The combination of chemical processing tanks and cleaning tanks is not limited to this example. Furthermore, the number of batch processing tanks is not limited to four; it can be one or more.

[0139] The two chemical treatment tanks BT1 and BT3 each perform a chemical etching process. The chemical solution used is, for example, but not limited to, a phosphoric acid solution. The chemical solution is heated to a predetermined temperature. A chemical dispensing pipe (not shown) is provided at the bottom of each of the chemical treatment tanks BT1 and BT3. Each chemical treatment tank BT1 and BT3 stores the chemical solution supplied from the chemical dispensing pipe.

[0140] The two cleaning tanks BT2 and BT4 each perform a cleaning process to rinse chemical liquid adhered to the plurality of substrates W using a cleaning liquid (rinsing liquid). Pure water, such as deionized water (DIW), is used as the cleaning liquid. Each of the cleaning tanks BT2 and BT4 stores pure water supplied from a pure water discharge pipe (not shown).

[0141] The processing block 7 includes a dedicated transport mechanism, lift LF1, for transferring substrates W after chemical treatment in chemical treatment tank BT1 to cleaning tank BT2, and lift LF2, for transferring substrates W after chemical treatment in chemical treatment tank BT3 to cleaning tank BT4. Each lift LF1 and LF2 includes a substrate holder for vertically holding multiple substrates W arranged at narrow intervals along the width direction Y; a lifting unit for raising and lowering the substrate holder; and a horizontal moving unit for moving the substrate holder in the front-to-back direction X.

[0142] The drying section 143 includes a substrate holding mechanism that holds a plurality of substrates W (e.g., 50, 75, or 100 substrates W) arranged at narrow intervals along the width direction Y in a vertical position, and a processing chamber that accommodates the plurality of substrates W held by the substrate holding mechanism. The drying section 143 dries the substrates by supplying an organic solvent (e.g., isopropyl alcohol) to the substrates W in a reduced-pressure atmosphere or by using centrifugal force to spin off liquid components on the surfaces of the substrates W.

[0143] <1-4. Batch substrate transfer area>

[0144] The batch substrate transfer area 8 is located behind the stocker 2 and adjacent to the left of the transfer block 5 and the processing block 7. The batch substrate transfer area 8 extends along the front-to-back direction X. The batch substrate transfer area 8 includes a main transfer mechanism WTR (main transfer robot). The main transfer mechanism WTR transfers a plurality of substrates W (e.g., 50, 75, or 100 substrates) arranged in a vertical position with narrow spacing along the width direction Y along the front-to-back direction X. The main transfer mechanism WTR also transfers the plurality of substrates W between the first transfer position P1, the second transfer position P2, a plurality of (e.g., four) batch processing tanks BT1 to BT4, and the drying section 143.

[0145] The main transport mechanism WTR includes a chuck 145, a chuck lifting unit (not shown), a chuck horizontal moving unit (not shown), and a guide rail 147. The chuck 145 holds multiple substrates W arranged at narrow intervals along the width direction Y in a vertical position. The chuck 145 includes a pair of chuck components 145A and 145B, each extending along the width direction Y. The pair of chuck components 145A and 145B includes multiple pairs (e.g., 50 pairs, 75 pairs, or 100 pairs) of holding grooves arranged at narrow intervals along the width direction Y. The pair of chuck components 145A and 145B are opened and closed by a chuck opening and closing unit (not shown).

[0146] The chuck 145 is movable along the guide rail 147 in the front-to-back direction X. The chuck 145 is moved in the front-to-back direction X by a chuck horizontal moving unit. The chuck 145 is raised and lowered in the vertical direction Z by a chuck lifting unit. The chuck horizontal moving unit and the chuck lifting unit are each equipped with, for example, an electric actuator. The chuck opening and closing unit is equipped with, for example, an air cylinder or an electric actuator.

[0147] The processing block 7 includes a vc for transporting a plurality of substrates arranged at a narrow pitch to the processing block 7 .

[0148] <1-5. Control Unit>

[0149] The substrate processing apparatus 1 includes a control unit 151 (see Figure 1 ) and a storage unit (not shown). The control unit 151 controls the various components of the substrate processing apparatus 1. The control unit 151 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The storage unit stores computer programs required to control the various components of the substrate processing apparatus 1.

[0150] <2. Operation of Substrate Processing Apparatus>

[0151] Next, refer to Figure 17 The operation of the substrate processing apparatus 1 will be described with reference to the flowchart of Figure 17 , the operation from the transfer of the carrier C to the load port 9 to the first half of the drying process will be described. In this embodiment, the substrate processing apparatus 1 processes 50 substrates W taken out from two carriers C at a time.

[0152] In addition, Figure 18A In the above, symbol TA represents the surface (device surface or main surface) of substrate W (W1, W2). In addition, the back side of substrate W is the surface on the opposite side of the surface of substrate W. The device surface is the surface on which the device is formed or the surface in the middle of forming the device. In addition, Figure 18A In the figures, for convenience of illustration, 5 substrates W1 represent 25 substrates W1, and 5 substrates W2 represent 25 substrates W2.

[0153] [Step S01] Vertical posture conversion of the first substrate group

[0154] Reference Figure 1. An external transport robot not shown in the figure transports two carriers C to the loading port 9 in sequence. The carrier transport robot 13 of the storage 2 transports the first carrier C from the loading port 9 to the loading rack 3. It is set that the first carrier C contains, for example, 25 substrates W1 (first substrate group) arranged at a reference spacing (for example, 10 mm spacing) with a repeated reference spacing TN9. The substrate operation mechanism HTR of the transfer block 5 takes out 25 substrates W1 in a horizontal posture from the first carrier C placed on the loading rack 3 through, for example, 25 manipulators 27. Then, the substrate operation mechanism HTR transports the 25 substrates W1 taken out to the posture conversion mechanism 19. In addition, the carrier transport robot 13 moves the empty first carrier C after the 25 substrates W1 are taken out from the loading rack 3 to the storage rack 11.

[0155] Reference Figure 18A The posture conversion mechanism 19 receives 25 substrates W1 arranged at a reference pitch from the substrate handling mechanism HTR. In the posture conversion mechanism 19, the 25 substrates W1 are held (mounted) on 25 pairs of shelves 37A of a pair of horizontal holding portions 37. Figure 18B After that, the accommodation moving part 53 (refer to Figure 4 ) The pair of vertical holding portions 39 are brought close to the pair of horizontal holding portions 37. Thus, the peripheral edges of the 25 substrates W1 are accommodated and held in the 25 pairs of holding grooves 39C of the pair of vertical holding portions 39.

[0156] Reference Figure 18C . Then, the posture conversion mechanism 19 converts the 25 substrates W1 (first substrate group) held at the reference spacing from the horizontal posture to the vertical posture. Specifically, the rotation drive unit 41 of the posture conversion mechanism 19 converts the 25 substrates W1 held by a pair of horizontal holding parts 37 and a pair of vertical holding parts 39 from the horizontal posture to the vertical posture. Then, the axial moving part 51 (refer to Figure 4 ) Move the pair of horizontal holding parts 37 in a direction toward the support surface 35A so that the 25 pairs of shelves 37A of the pair of horizontal holding parts 37 are away from the 25 substrates W1 in the vertical posture.

[0157] [Step S02] The pusher component receives the first substrate assembly

[0158] Reference Figure 19A After that, the pusher lifting part 65 of the pusher mechanism 21 (refer to Figure 8) causes the pusher member 55 to rise to a position higher than the pair of horizontal holding portions 37 and the pair of vertical holding portions 39. Thus, the pusher member 55 receives the 25 substrates W1 (first substrate group) in a vertical position. Furthermore, the pusher member 55 holds the 25 substrates W1 arranged at a reference pitch in a vertical position. Furthermore, the 50 vertical holding grooves 67 are arranged at unequal intervals.

[0159] [Step S03] The first substrate group moves a first distance

[0160] Reference Figure 19B The pusher mechanism 21 moves the 25 substrates W1 held by the pusher member 55 along the arrangement direction of the 25 substrates W1 by a first interval TN1 (3.333 mm). Specifically, the pusher rotating portion 59 (see Figure 8 ) rotates the pusher member 55 180 degrees around the vertical axis AX3. As a result, the 25 substrates W1 held by the pusher member 55 are moved to the left by the first interval TN1. In addition, the movement of the first interval TN1 can also be achieved by the pusher rotating unit 59 rotating the pusher member 55 180 degrees and the pusher horizontal moving unit 61 (see Figure 8 ) is performed by moving the pusher component 55 along the width direction Y.

[0161] In addition, the posture conversion mechanism 19 rotates the pair of horizontal holding parts 37 and the like by 90 degrees around the horizontal axis AX2. As a result, the pair of horizontal holding parts 37 and the like are lifted up. The axial moving part 51 (see Figure 4 ) moves the pair of horizontal holding portions 37 in a direction away from the support surface 35A. Figure 4 ) moves the pair of vertical holding portions 39 away from the pair of horizontal holding portions 37.

[0162] [Step S04] Vertical posture conversion of the second substrate group

[0163] Figure 1 The carrier transport robot 13 shown transports the second carrier C from the loading port 9 to the carrier rack 3. As with the first carrier C, the second carrier C is configured to contain, for example, 25 substrates W2 arranged at a reference pitch (10 mm pitch). The substrate handling mechanism HTR uses 25 manipulators 27 to remove the 25 substrates W2 in a horizontal position from the second carrier C placed on the carrier rack 3. The substrate handling mechanism HTR then transports the 25 removed substrates W2 to the posture conversion mechanism 19. Furthermore, the carrier transport robot 13 moves the empty second carrier C, from which the 25 substrates W2 have been removed, from the carrier rack 3 to the storage rack 11.

[0164] Reference Figure 19CThe posture conversion mechanism 19 receives 25 substrates W2 arranged at a reference pitch from the substrate handling mechanism HTR. In the posture conversion mechanism 19, the 25 substrates W2 are held by 25 pairs of shelves 37A of a pair of horizontal holding portions 37. Figure 20A After that, the accommodation moving part 53 (refer to Figure 4 ) brings a pair of vertical holding portions 39 close to a pair of horizontal holding portions 37.

[0165] Reference Figure 20B Then, the posture conversion mechanism 19 converts the 25 substrates W2 (second substrate group) held at the reference pitch from the horizontal posture to the vertical posture. Then, the axial moving portion 51 (refer to Figure 4 ) Move the pair of horizontal holding parts 37 in a direction toward the support surface 35A so that the 25 pairs of shelves 37A of the pair of horizontal holding parts 37 are away from the 25 substrates W1 in the vertical posture.

[0166] [Step S05] The pusher component receives the second substrate assembly

[0167] Reference Figure 20C After that, the pusher lifting part 65 of the pusher mechanism 21 (refer to Figure 8 ) raises the pusher member 55 to a position higher than the pair of horizontal holding members 37 and the pair of vertical holding members 39. The pusher member 55 thus receives the 25 substrates W2 (second substrate group) that have been turned into a vertical position. Furthermore, the pusher member 55 holds 50 substrates W (W1, W2) arranged at unequal intervals. The 50 substrates W are formed by alternating 25 substrates W1 and 25 substrates W2.

[0168] Regarding the above Figures 20B to 20C The process of raising the pusher member 55 is shown later in FIG. 24 to FIG. Figure 28 This will be described in more detail.

[0169] [Step S06] The loading mechanism transports the processed substrate group to the pitch conversion unit.

[0170] After that, the carrying mechanism 71 carries 50 substrates W (processing substrate group) arranged at unequal pitches from the pusher member 55 to the first pitch conversion unit 25. This operation will be described in detail. Figure 21A First, the posture conversion mechanism 19 rotates the pair of horizontal holding parts 37 and the like by 90 degrees around the horizontal axis AX2.

[0171] Reference Figure 21B. Thereafter, the carry-in mechanism 71 moves the chuck 77 horizontally from the upper position of the first pitch conversion portion 25 to the lower position of the pusher member 55. The chuck 77 is in a closed state capable of holding 50 substrates W. Thereafter, the pusher mechanism 21 lowers the pusher member 55 that holds the 50 substrates W in a vertical posture. When the pusher member 55 passes between a pair of chuck members 77A and 77B of the chuck 77, the 50 substrates W are delivered from the pusher member 55 to the chuck 77. The chuck 77 holds the 50 substrates W arranged at unequal pitches in a vertical posture.

[0172] Reference Figure 22A After that, the carrying mechanism 71 moves the chuck 77 from the upper position of the pusher member 55 to the upper position of the first pitch conversion portion 25. Figure 22B Afterwards, the lifting portion 141 of the first pitch conversion portion 25 (see Figure 10 ) The pitch conversion body 111 including 25 holding members 113 is raised. Thus, the first pitch conversion unit 25 receives 50 substrates W from the carry-in mechanism 71.

[0173] [Step S07] Converting the pitch of the processed substrate group from uneven pitch to narrow pitch

[0174] Reference Figure 23A After that, the first pitch conversion unit 25 converts the pitch of the 50 substrates W from the uneven pitch to the narrow pitch (3.333 mm). In other words, the first pitch conversion unit 25 causes the 50 substrates W that were arranged at uneven pitches to be arranged at a narrow pitch. This operation will be described in detail.

[0175] Each of the 25 holding members 113 of the first pitch converter 25 has two holding grooves 117 separated by a first interval (3.333 mm). The first pitch converter 25 uses the two holding grooves 117 of each of the 25 holding members 113 to hold two substrates W1 and W2 among the 50 substrates W, while also using the 25 holding members 113 to hold the 50 substrates W arranged at unequal intervals.

[0176] In addition, the moving portion 115 of the first pitch conversion portion 25 (see Figure 13 ) moves the 25 holding members 113 in the arrangement direction (Y direction) of the 50 substrates W, thereby changing the arrangement from an unevenly spaced arrangement of the 50 substrates W to a narrowly spaced arrangement of the 50 substrates W. Furthermore, the intermediary mechanism 73 opens the chuck 78.

[0177] [Step S08] The intermediary mechanism transports the processed substrate group to the first transfer position

[0178] Reference Figure 23BNext, the intermediary mechanism 73 lowers the chuck 78 as shown by the dotted line to receive the 50 substrates W arranged at a narrow pitch and held by the first pitch converter 25. The intermediary mechanism 73 then closes the chuck 78. This allows the intermediary mechanism 73 to hold the 50 substrates W via the chuck 78.

[0179] The intermediary mechanism 73 then raises the chuck 78 to the first transfer position P1. This allows the intermediary mechanism 73 to receive 50 substrates W from the first pitch converter 25 and transfer them to the main transport mechanism WTR. Furthermore, the chuck 78 holds the 50 substrates W, arranged at a narrow pitch, in a vertical position.

[0180] [Step S09] Substrate processing and drying

[0181] The main transport mechanism WTR then receives 50 substrates W from the intermediary mechanism 73 using the chuck 145 and transports the 50 substrates W to one of the two chemical processing tanks BT1 and BT3. For example, while the main transport mechanism WTR is transporting the 50 substrates W to the chemical processing tank BT1, the lifter LF1 receives the 50 substrates W arranged at a narrow pitch from the main transport mechanism WTR above the chemical processing tank BT1. The lifter LF1 then lowers the 50 substrates W, immersing them in the chemical solution stored in the chemical processing tank BT1. Thus, all 50 substrates W are collectively chemically processed.

[0182] After the preset chemical treatment time has elapsed, lifter LF1 raises the 50 substrates W, thereby removing them from the chemical solution in chemical treatment tank BT1. Lifter LF1 then horizontally moves the 50 substrates W from the upper position of chemical treatment tank BT1 to the upper position of cleaning tank BT2. Lifter LF1 then lowers the 50 substrates W, immersing them in the pure water stored in cleaning tank BT2. This cleans all 50 substrates W collectively. After the preset cleaning time has elapsed, lifter LF1 removes the 50 substrates W from the pure water in cleaning tank BT2.

[0183] When the main transport mechanism WTR transports 50 substrates W to the chemical processing tank BT3, the lifter LF2 receives the 50 substrates W from the main transport mechanism WTR. The lifter LF2 then transports the 50 substrates W to the chemical processing tank BT3 and the cleaning tank BT4 in that order.

[0184] The main transport mechanism WTR receives 50 substrates W from one of the two lifts LF1 and LF2 using a chuck 145 and transports the 50 substrates W to the drying section 143. The drying section 143 dries the 50 substrates W. Then, the main transport mechanism WTR receives the 50 dried substrates W from the drying section 143.

[0185] Reference Figures 24A to 28 , described in more detail in the above Figures 20B to 20C The pusher component 55 is raised relative to a pair of horizontal holding parts 37 and a pair of vertical holding parts 39, and the substrate W of the second substrate group W2 held by the pair of vertical holding parts 39 and the substrate W of the first substrate group W1 held by the pusher component 55 are combined at a first interval TN1.

[0186] Figure 24A 1 is a side view of a characteristic portion for explaining the operation of the substrate processing apparatus 1. Figure 24B It is a side view explaining the operation of a conventional substrate processing apparatus. Figure 25 is to proceed Figure 24A A top view of the posture converter and pusher mechanism in action is shown. Figure 26 is to proceed Figure 24B A top view of the posture converter and pusher mechanism in action is shown. Figure 27A It will Figure 25 The vertical holding portion 39 shown is a cross-sectional view taken along line y2 - y2. Figure 27B It will Figure 26 The illustrated conventional vertical holding portion 390 is a cross-sectional view taken along line y3 - y3 . Figure 28 yes Figure 27A An enlarged view of the retaining member 39A surrounded by a two-dot chain line.

[0187] like Figure 24A As shown above, Figure 20B As the pusher member 55 shown rises, the front end side of the 25 substrates W (W1) held by the pusher member 55 is inserted into a pair of vertical holding parts 39 holding the 25 substrates W (W2). Specifically, the substrate W (W1) is inserted between the holding parts 39A, 39A. In addition, at both ends of the pair of vertical holding parts 39 in the Y direction, the substrate W (W1) is inserted between the inner wall of the pair of vertical holding parts 39 and the holding parts 39A. It is necessary to hold the first substrate group W1 and the second substrate group W2 at unequal intervals on the pusher member. Therefore, the 25 substrates W (W1) held by the pusher member 55 are inserted into a position close to the pair of vertical holding parts 39 holding the 25 substrates W (W2).

[0188] like Figure 25As shown, in the holding member 39A, the holding groove 39C is located at a position offset from the center 39Ba in the width direction along the arrangement direction of the substrates W to the side where the first gap TN1 is configured when the first substrate group W1 and the second substrate group W2 are combined. Specifically, the deepest portion 39Ca of the holding groove 39C is located at a position offset from the center 39Ba in the width direction of the holding member 39A to the side of the first gap TN1. As described later Figure 27A 、 Figure 27B As shown, the holding member 39A has an outer side surface 39C1s extending downward from the outer end edge 390C1a. At a location where the substrate W (W1) held by the pusher member 55 and the substrate W (W2) held by the holding member 39A are arranged at a first interval TN1, the clearance c1 between the outer side surface 39C1s of the holding member 39A and the substrate W1 held by the pusher member 55 is sufficiently larger than that of the existing structure described later. The clearance c1 is the width of the gap between the outer side surface 39C1s of the holding member 39A and the substrate W1 held by the pusher member 55. Therefore, when the substrate W1 held by the pusher member 55 wants to pass by the side of the holding member 39A with the substrate W2 held by the holding member 39A at the first interval TN1, it is difficult for the substrate W1 to collide with the outer side surface 39C1s of the holding member 39A.

[0189] In contrast, Figure 24B 、 Figure 26 As shown, in the conventional holding member 390A, the holding groove 370C is provided at the center 390Ba of the holding member 390A in the width direction. Specifically, the deepest portion 390Ca of the holding groove 370C is provided at the center 390Ba of the holding member 39A in the width direction. In the portion where the substrate W (W1) held by the pusher member 55 and the substrate W (W2) held by the holding member 390A are arranged at a first interval TN1, the clearance c10 between the outer side surface 390C1s of the holding member 390A holding the substrate W2 and the substrate W1 held by the pusher member 55 becomes very narrow. Therefore, when the substrate W1 held by the pusher member 55 wants to pass the side of the holding member 390A with the substrate W2 held by the holding member 390A at the first interval TN1, there is a concern that the substrate W2 will collide with the outer side surface 390C1s of the holding member 390A.

[0190] The holding member 39A will be described in more detail.

[0191] like Figure 27A 、 Figure 28As shown, the holding groove forming portion 39D includes a first holding wall portion 39C1, which contacts one end Wa1 of the peripheral portion Wa of the substrate W inserted into the holding groove 39C, and a second holding wall portion 39C2, which contacts the other end Wa2 of the peripheral portion Wa of the substrate W inserted into the holding groove 39C, above the two-dot chain line z1. The first holding wall portion 39C1 is located on the first interval TN1 side of the holding groove forming portion 39D. The second holding wall portion 39C2 is located on the second interval TN2 side of the holding groove forming portion 39D. The first holding wall portion 39C1 and the second holding wall portion 39C2 are equal to the number of holding grooves 39C.

[0192] The widthwise thickness of the first retaining wall 39C1 refers to the thickness in the widthwise direction (left-right direction y in the figure) along the arrangement direction DR1 of the substrates W. The widthwise thickness t1 of the first retaining wall 39C1 is thinner than the widthwise thickness t2 of the second retaining wall 39C2 located at the same groove depth. The retaining groove 39C is formed by the inner side surfaces of the first retaining wall 39C1 and the second retaining wall 39C2. The deepest portion 39Ca of the retaining groove 39C is the deepest portion 39Ca of the first retaining wall 39C1 and the second retaining wall 39C2. The widthwise thickness t3 from the deepest portion 39Ca of the first retaining wall 39C1 to the outer side surface 39C1s of the first retaining wall 39C1 is thinner than the widthwise thickness t4 from the deepest portion 39Ca of the second retaining wall 39C2 to the outer side surface 39C2s of the second retaining wall 39C2. As a result, the substrate W2 held in the holding groove 39C (center line z2 of the substrate W2) is significantly offset from the widthwise center 39Ba of the holding member 39A toward the side where the first gap TN1 is provided. In other words, the substrate W1, which is spaced apart from the substrate W2 held in the holding groove 39C by the gap TN1, is significantly separated from the outer side surface 39C1s of the first holding wall 39C1. Consequently, the clearance C1 is wider than the conventional clearance C10.

[0193] In contrast, in the existing retaining member 390A, as shown in FIG. Figure 27BAs shown, the widthwise thickness t10 of the first retaining wall 390C1 is identical to the widthwise thickness t20 of the second retaining wall 390C2 located at the same groove depth. Furthermore, the widthwise thickness t30 from the deepest portion 390Ca of the first retaining wall 390C1 to the outer side surface 390C1s of the first retaining wall 390C1 is identical to the widthwise thickness t40 from the deepest portion 390Ca of the second retaining wall 390C2 to the outer side surface 390C2s of the second retaining wall 390C2. Therefore, the substrate W2 retained in the retaining groove 390C (centerline z2 of the substrate W2) is located at the widthwise center 390Ba of the retaining member 390A. In other words, the substrate W1, spaced apart by a distance TN1 from the substrate W2 retained in the retaining groove 390C, is closer to the outer side surface 390C1s of the first retaining wall 390C1. Therefore, the conventional clearance C10 is narrower than the clearance C1 of the present invention.

[0194] The cross-sectional shapes of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are asymmetrical with respect to a centerline z3 passing through the deepest portion 39Ca of the retaining groove 39C. The centerline z3 is located closer to the side of the widthwise center 39Ba of the retaining member 39A, where the first gap TN1 is provided. In contrast, in the conventional retaining member 390A, the cross-sectional shapes of the first retaining wall portion 390C1 and the second retaining wall portion 390C2 are symmetrical with respect to a centerline z30 passing through the deepest portion 390Ca located at the center of the retaining groove 390C. The centerline z30 passes through the center of the retaining groove 390C and through the widthwise center 390Ba of the retaining member 390A. In the present invention, when narrowing the clearance C1, the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are not made uniformly thinner, thereby ensuring the rigidity of the retaining member 39A.

[0195] The thickness of the retaining groove forming portion 39D in the width direction is substantially constant from the base end to the tip end. While the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are formed to have a substantially constant width, the first retaining wall portion 39C1 is thinner and the second retaining wall portion 39C2 is thicker. Because the retaining groove forming portion 39D comprises the thinner first retaining wall portion 39C1 on one side and the thicker second retaining wall portion 39C2 on the other, the necessary rigidity is ensured overall.

[0196] The widthwise thickness of the retaining groove support portion 39E is greater than the thickness t3 of the first retaining wall portion 39C1. The widthwise thickness of the retaining groove support portion 39E is greater than the thickness t4 of the second retaining wall portion 39C2. The widthwise thickness of the retaining groove support portion 39E is equal to the thickness from the outer side surface 39C1s of the first retaining wall portion 39C1 to the outer side surface 39C2s of the second retaining wall portion 39C2. The rigidity of the retaining member 39A increases as it approaches the retaining groove support portion 39E.

[0197] The holding member 39A is formed from a fluororesin, such as PTFE (polytetrafluoroethylene). Fluororesins have excellent heat and chemical resistance and are softer than metal. Therefore, the holding member 39A formed from fluororesin is less likely to scratch the substrate W when placing it horizontally or holding it vertically. However, fluororesins are relatively soft even among synthetic resins, and therefore, are more susceptible to deformation than harder synthetic resins.

[0198] The retaining groove forming portion 39D (i.e., the first retaining wall portion 39C1 and the second retaining wall portion 39C2) and the retaining groove support portion 39E are integrally formed. The retaining groove support portion 39E is integrally formed on the vertical retaining body 39F. Fluororesin is easily deformed, so when the first retaining wall portion 39C1 is thinned, the retaining component 39A is easily deformed. By arranging the thicker second retaining wall portion 39C2 on the opposite side of the thinner first retaining wall portion 39C1 as in the present invention, the rigidity of the retaining component 39A can be increased, making the retaining component 39A difficult to deform. In addition, it can also be configured so that the retaining groove support portion 39E is connected to the vertical retaining body 39F by a connecting mechanism such as an adhesive or a screw.

[0199] Next, refer to Figure 29 , while explaining the latter half of the operation from the drying process to the conveyance of the carrier C from the loading port 9.

[0200] [Step S11] The main transport mechanism transports the processed substrate group to the second transfer position.

[0201] Reference Figure 2 、 Figure 30A The main transport mechanism WTR transports 50 substrates W that have been processed together in the chemical liquid processing tank BT1 and arranged in a vertical position with a narrow pitch to a position above the second pitch converter 26. In other words, the main transport mechanism WTR transports 50 substrates W that have been dried in the drying section 143 to a position above the second pitch converter 26.

[0202] The main transport mechanism WTR then lowers the 50 substrates W held by the chucks 145 to the transfer position P2. The main transport mechanism WTR then transports the 50 substrates W, arranged in a vertical position at a narrow pitch, to the second pitch converter 26. Furthermore, the second pitch converter 26 receives the 50 substrates W, arranged in a vertical position at a narrow pitch, from the main transport mechanism WTR. Upon receiving the 50 substrates W, the second pitch converter 26 moves the 25 holding members 113 so that the 50 holding slots 117 are arranged at a narrow pitch.

[0203] [Step S12] Converting the pitch of the processed substrate group from a narrow pitch to an uneven pitch

[0204] Reference Figure 30B . Afterwards, the second pitch conversion unit 26 converts the pitch of the 50 substrates W from a narrow pitch to an unequal pitch. This action is described in detail. The second pitch conversion unit 26 uses the two holding grooves 117 separated by the first interval TN1 of each of the 25 holding components 113 to hold the two substrates W at the first interval TN1, while using the 25 holding components 113 to hold the 50 substrates W arranged at a narrow pitch. The moving unit 115 (refer to Figure 13 ) moves the 25 holding components 113 along the arrangement direction (width direction Y) of the 50 substrates W to change from a narrow pitch state to an uneven pitch state.

[0205] [Step S13] The unloading mechanism transports the processed substrate group to the pusher member.

[0206] Reference Figure 31A Then, the carrying-out mechanism 75 of the transfer mechanism 23 carries the 50 substrates W arranged at unequal intervals from the second interval conversion section 26 to the pusher member 55 in a vertical position. This action is described in detail. The chuck 79 of the carrying-out mechanism 75 is in a closed state. First, the lifting part 141 (refer to Figure 10 ) The pitch conversion main body 111 including 25 holding members 113 is lowered. During the lowering, the unloading mechanism 75 receives and holds 50 substrates W arranged in a vertical position at unequal pitches using the chucks 79.

[0207] Reference Figure 31B Afterwards, the carry-out mechanism 75 carries the 50 substrates W held by the chuck 79 from a position above the second pitch converter 26 to a position above the pusher member 55. The pusher mechanism 21 then raises the pusher member 55 to a position higher than the chuck 79. During this ascent, the pusher mechanism 21 uses the pusher member 55 to receive and hold the 50 substrates W from the chuck 79 of the carry-out mechanism 75. The pusher member 55 holds the 50 substrates W arranged at unequal pitches in a vertical position.

[0208] [Step S14] The posture conversion unit receives the second substrate set

[0209] Reference Figure 32A. Afterwards, the carrying-out mechanism 75 moves the chuck 79 to a position above the second pitch conversion portion 26. Then, in order to allow the pair of vertical holding portions 39 to receive 25 substrates W2 (second substrate group), the rotation drive portion 41 of the posture conversion mechanism 19 rotates the pair of horizontal holding portions 37 and the like 90 degrees around the horizontal axis AX2. As a result, the pair of horizontal holding portions 37 and the pair of vertical holding portions 39 are in a tilted state. In addition, the axial moving portion 51 brings the pair of horizontal holding portions 37 close to the support surface 35A, and the accommodating moving portion 53 brings the pair of vertical holding portions 39 close to the pair of horizontal holding portions 37.

[0210] Reference Figure 32B . Thereafter, the pusher mechanism 21 lowers the pusher component 55 from the upper position of the pair of vertical holding parts 39 to the lower position thereof. During the descent, the posture conversion mechanism 19 receives 25 substrates W2 (second substrate group) out of 50 substrates W (processing substrate group) from the pusher component 55 using a pair of horizontal holding parts 37 and a pair of vertical holding parts 39. The pair of vertical holding parts 39 hold the 25 substrates W2 arranged at a reference pitch (10 mm pitch). Then, the axial moving part 51 moves the pair of horizontal holding parts 37 away from the supporting surface 35A. As a result, the 25 pairs of shelves 37A of the pair of horizontal holding parts 37 are in contact with the back surfaces of the 25 substrates W2, respectively.

[0211] In addition, if Figure 32A As shown, the moving portion 115 of the second pitch conversion portion 26 moves 25 (24) holding members 113 so that 50 holding grooves 117 are arranged at a narrow pitch. Figure 32B As shown, the lifting portion 141 of the second pitch converter 26 raises the pitch converter body 111 including the 25 holding members 113 so that the 50 holding grooves 117 are arranged at a position higher than the chuck 79 .

[0212] [Step S15] Vertical posture conversion of the second substrate group

[0213] Reference Figure 33A The posture conversion mechanism 19 rotates the pair of horizontal holding portions 37 and the like by 90 degrees around the horizontal axis AX2. Thus, the posture conversion mechanism 19 converts the 25 substrates W2 from the vertical posture to the horizontal posture.

[0214] Thereafter, the accommodating moving portion 53 moves the pair of vertical holding portions 39 away from the pair of horizontal holding portions 37 . As a result, the peripheral edge portions of the 25 substrates W2 are taken out from the 25 pairs of holding grooves 39C of the pair of vertical holding portions 39 .

[0215] Figure 1The carrier transport robot 13 shown in FIG. 1 transports an empty second carrier C from the storage rack 11 to the loading rack 3. The substrate handling mechanism HTR takes out 25 substrates W2 that have been converted to a horizontal posture by the posture conversion mechanism 19 and arranged at a reference pitch from the posture conversion mechanism 19 (see FIG. 1 ). Figure 33B Then, the substrate handling mechanism HTR transfers the 25 substrates W2 to the second carrier C mounted on the mounting rack 3. Then, the carrier transport robot 13 transfers the second carrier C containing the 25 processed substrates W2 from the mounting rack 3 to the load port 9.

[0216] [Step S16] The first substrate group moves a first distance

[0217] Reference Figure 33B After the posture conversion mechanism 19 converts the 25 substrates W2 into the horizontal posture, the pusher mechanism 21 raises the pusher member 55 holding the 25 substrates W1 (first substrate group).

[0218] In addition, the pusher mechanism 21 moves the 25 substrates W1 held by the pusher member 55 by a first interval TN1 (3.333 mm) in the arrangement direction of the 25 substrates W1. Specifically, the pusher rotating portion 59 (see Figure 8 ) rotates the pusher member 55 180 degrees around the vertical axis AX3. As a result, the 25 substrates W1 held by the pusher member 55 are moved rightward by the first interval TN1. In addition, the movement of the first interval TN1 can also be achieved by the pusher rotating unit 59 rotating the pusher member 55 180 degrees and the pusher horizontal moving unit 61 (see Figure 8 ) is performed by moving the pusher component 55 along the width direction Y.

[0219] [Step S17] The posture conversion unit receives the first substrate set

[0220] Reference Figure 33C The posture conversion mechanism 19 tilts the pair of horizontal holding portions 37 and the pair of vertical holding portions 39. Furthermore, the axial movement portion 51 moves the pair of horizontal holding portions 37 closer to the support surface 35A, and the accommodating movement portion 53 moves the pair of vertical holding portions 39 closer to the pair of horizontal holding portions 37.

[0221] Reference Figure 34A. Thereafter, the pusher mechanism 21 lowers the pusher component 55 from the upper position of the pair of vertical holding portions 39 to the lower position thereof. During this lowering, the posture conversion mechanism 19 receives the remaining 25 substrates W1 from the pusher component 55 using the pair of horizontal holding portions 37 and the pair of vertical holding portions 39. The pair of vertical holding portions 39 hold the 25 substrates W1 arranged at a reference pitch (e.g., a 10 mm pitch). Thereafter, the axial moving portion 51 brings the 25 pairs of shelves 37A of the pair of horizontal holding portions 37 into contact with the back surfaces of the 25 substrates W1, respectively.

[0222] [Step S18] Vertical posture conversion of the first substrate group

[0223] Reference Figure 34B The posture conversion mechanism 19 rotates the pair of horizontal holding parts 37 and the like by 90 degrees around the horizontal axis AX2. Thus, the posture conversion mechanism 19 converts the 25 substrates W1 from the vertical posture to the horizontal posture. Figure 34C Thereafter, the accommodating moving portion 53 moves the pair of vertical holding portions 39 away from the pair of horizontal holding portions 37 .

[0224] Figure 1 The carrier transport robot 13 shown in the figure transports the empty first carrier C from the storage rack 11 to the loading rack 3 in advance. The substrate handling mechanism HTR takes out 25 substrates W1 (see FIG. 1 ) which have been converted to a horizontal posture by the posture conversion mechanism 19 and arranged at a reference pitch (10 mm pitch) from the posture conversion mechanism 19. Figure 34C ). The substrate handling mechanism HTR then transfers the 25 substrates W1 to the first carrier C mounted on the carrier rack 3. The carrier transport robot 13 then transfers the first carrier C containing the 25 processed substrates W1 from the carrier rack 3 to the load port 9. An external transport robot (not shown) then sequentially transfers the two carriers C from the load port 9 to their next destination.

[0225] The aforementioned "reference spacing" corresponds to the "equal spacing" of the present invention. The aforementioned "holding member 39A" corresponds to the "holding member" of the present invention. The aforementioned "posture conversion mechanism 19" corresponds to the "first mechanism" of the present invention. The aforementioned "pusher mechanism 21" corresponds to the "second mechanism" of the present invention.

[0226] According to this embodiment, the posture conversion mechanism 19 includes a pair of vertical holding sections 39 for holding substrates W arranged in a vertical posture at a reference pitch. The pusher mechanism 21 combines the second substrate group W2 held by the posture conversion mechanism 19 with the first substrate group W1 previously delivered from the posture conversion mechanism 19, thereby holding a plurality of substrates W arranged at unequal pitches, with a first pitch TN1 and a second pitch TN2, which is wider than the first pitch TN1, alternating between them. The pitch conversion section 25 receives the plurality of substrates W arranged at unequal pitches from the pusher mechanism 21 and arranges them at a narrow pitch, repeating the first pitch TN1. The processing block 7 processes the plurality of substrates arranged at a narrow pitch collectively. The main transport mechanism WTR transports the plurality of substrates arranged at a narrow pitch to the processing block 7. The pair of vertical holding sections 39 include a holding groove 39C formed along the peripheral edge Wa of the substrates W in each holding member 39A. The pair of vertical holding portions 39 are provided with holding grooves 39C at positions offset from the width center of each holding member 39A along the arrangement direction of the substrates W toward one side where the first substrate group W1 and the second substrate group W2 are arranged at the first interval TN when the first substrate group W1 and the second substrate group W2 are combined.

[0227] As described above, the substrates W arranged in a vertical posture at a reference pitch are arranged at a narrow pitch through the posture conversion mechanism 19, the pusher mechanism 21, and the pitch conversion unit 25. The substrates arranged at a narrow pitch are processed together by the processing block 7. As a result, the amount of processing liquid (chemical liquid and cleaning liquid) used in the processing block 7 can be reduced. The pusher mechanism 21 combines the second substrate group W2 held by the posture conversion mechanism 19 and the first substrate group W1 delivered in advance from the posture conversion mechanism 19 to hold a plurality of substrates W arranged at unequal pitches that alternately repeat the first interval TN1 and the second interval TN2 that is wider than the first interval TN1. When performing this combination, there is a concern that interference may occur between the holding component 39A or the substrates W of the second substrate group W2 held by the holding component 39A and the substrates W of the first substrate group W1 held by the pusher component 55 at the portion combined at the first interval TN1. Therefore, the pair of vertical holding portions 39 are provided with holding grooves 39C at positions offset from the center of the holding member 39A in the width direction along the arrangement direction of the substrates W, toward a side where the first and second substrate groups W1, W2 are arranged at the first interval TN1 when the first and second substrate groups W1, W2 are combined. Consequently, even at the position where the first interval TN1 is provided, interference between the holding member 39A or the substrates W of the second substrate group W2 held by the holding member 39A and the substrates W of the first substrate group W1 held by the pusher member 55 is less likely to occur. Consequently, a substrate processing apparatus 1 capable of efficiently processing substrates W can be provided.

[0228] The posture conversion mechanism 19 includes a pair of horizontal holding sections 37, each having shelves 37A arranged at a reference pitch for holding the ends of substrates W in a horizontal position, and a pair of vertical holding sections 39, each having holding members 39A arranged at a reference pitch for holding substrates W in a vertical position. The posture conversion mechanism 19 converts the posture of multiple substrates W between a vertical position and a horizontal position by rotating the pair of horizontal holding sections 37 and the pair of vertical holding sections 39. The pusher mechanism 21 includes a pusher member 55, which combines the second substrate group W2 held in a vertical position by the pair of vertical holding sections 39 with the first substrate group W1 in a vertical position, previously delivered from the pair of vertical holding sections 30, to hold multiple substrates W arranged at unequal intervals. The holding member 39A includes a holding groove 39C formed along the peripheral edge Wa of the substrates W in a vertical position. The holding member 39A is provided with a holding groove 39C at a position offset from the center in the width direction along the arrangement direction DR1 of the substrates W held in the vertical position, toward a side where a first gap TN1 is provided when the first substrate group W1 and the second substrate group W2 are combined. Consequently, when the substrates W of the second substrate group W2 held by the pair of vertical holding portions 39 are combined with the substrates W of the first substrate group W1 that have been previously delivered from the pair of vertical holding portions 39 to the pusher member 55 at the first gap TN1, interference between the holding member 39A or the substrates W of the second substrate group W2 held by the holding member 39A and the substrates W of the first substrate group W1 held by the pusher member 55 is minimized. Consequently, a substrate processing apparatus 1 capable of efficiently processing substrates W can be provided.

[0229] Furthermore, the deepest portion 39Ca of the holding groove 39C of the holding member 39A is located at a position offset from the center in the width direction toward the side where the first gap TN1 is formed when the first and second substrate groups W1 and W2 are combined. Consequently, the substrate W can be held in the deepest portion 39Ca of the holding groove 39C at a position offset toward the side where the first gap TN1 is formed when the first and second substrate groups W1 and W2 are combined. Therefore, even at the position where the first gap TN1 is formed, interference between the holding member 39A of the posture conversion mechanism 19 holding the substrate W2 and the substrate held by the second mechanism is minimized. Consequently, a substrate processing apparatus 1 capable of efficiently processing substrates W can be provided.

[0230] The holding member 39A also includes a first holding wall 39C1 that holds one end of the peripheral edge Wa of the substrate W inserted into the holding groove 39C, and a second holding wall 39C2 that holds the other end of the peripheral edge Wa of the substrate W inserted into the holding groove 39C. The first holding wall 39C1 and the second holding wall 39C2 have different widthwise thicknesses at the same groove depth. To minimize interference between the holding members 39A of the pair of vertical holding members 39 or the substrates W of the second substrate group W2 held by the holding member 39A and the substrates W of the first substrate group W1 held by the pusher member 55, it is considered possible to reduce the widthwise thickness of both the first holding wall 39C1 and the second holding wall 39C2 by the same amount. However, if both holding walls are reduced in width by the same amount, the rigidity of the holding member 39A decreases on both sides. This makes the holding member 39A susceptible to deformation, making it difficult to maintain the dimensional accuracy of the holding member 39A. In the present invention, the first retaining wall 39C1 and the second retaining wall 39C2 that constitute the retaining member 39A have different thicknesses in the width direction at the same groove depth. This prevents a decrease in the rigidity of the retaining member 39A at both the first retaining wall 39C1 and the second retaining wall 39C2. As a result, the retaining member is less likely to deform, and the dimensional accuracy of the retaining member W is easily maintained.

[0231] Furthermore, the widthwise thickness t1 of the first retaining wall 39C1 is thinner than the widthwise thickness t2 of the second retaining wall 39C2 located at the same groove depth. The first retaining wall 39C1 is provided on the side where the first gap TN1 is located when the first substrate group W1 and the second substrate group W2 are combined. The second retaining wall 39C2 is provided on the side where the second gap TN2 is located when the first substrate group W1 and the second substrate group W2 are combined. This prevents the rigidity of the retaining member 39A from being reduced at both the first retaining wall 39C1 and the second retaining wall 39C2. As a result, the retaining member is less likely to deform, making it easier to maintain the dimensional accuracy of the retaining member W. Furthermore, even in the area where the first gap TN1 is located, the thin thickness t1 of the first retaining wall 39C1 prevents interference between the retaining member 39A or the substrates W of the second substrate group W2 retained by the retaining member 39A and the substrates W of the first substrate group W1 retained by the pusher member 55.

[0232] Furthermore, the thickness t3 in the width direction from the deepest portion 39Ca of the retaining groove 39C to the outer side surface 39C1s of the first retaining wall 39C1 is thinner than the thickness t4 in the width direction from the deepest portion 39Ca of the retaining groove 39C to the outer side surface 39C2 of the second retaining wall 39C2. This ensures the rigidity of the retaining member 39A from the deepest portion 39Ca of the retaining groove 39C to the upper surface of the retaining groove 39C. Furthermore, since the thicknesses t1 and t3 of the first retaining wall 39C1 from the deepest portion 39Ca of the retaining groove 39C to the upper surface of the retaining groove 39C are thinner, interference between the retaining member 39A or the substrates W of the second substrate group W2 retained by the retaining member 39A and the substrates W of the first substrate group W1 retained by the pusher member 55 is minimized.

[0233] Furthermore, in the retaining member 39A, when the retaining member 39A is cut along its width, the cross-sectional shapes of the first retaining wall 39C1 and the second retaining wall 39C2 are asymmetrical relative to the centerline z3 passing through the deepest portion 39Ca of the retaining groove 39C. The width direction is along the arrangement direction DR1 of the substrates W. The cross-sectional shape of the first retaining wall 39C1 is approximately a right triangle. The cross-sectional shape of the second retaining wall 39C2 is approximately a trapezoid. This ensures the rigidity of the retaining member 39A, compared to a structure in which the first and second retaining walls 39C1, 39C2 have the same cross-sectional shape but are thinner.

[0234] Furthermore, the cross-sectional shape of the first retaining wall 39C1 of the retaining member 39A is such that a widthwise length t1 from a depth position shallower than the deepest portion 39Ca to an outer side surface 39C1s of the first retaining wall 39C1 is shorter than a widthwise length t2 from the same depth position to an outer side surface 39C2s of the second retaining wall 39C2. Consequently, the thickness of the first retaining wall 39C1 is reduced at a depth position shallower than the deepest portion 39Ca of the retaining groove 39C. This reduces interference between the retaining member 39A or the substrates W of the second substrate group W2 retained by the retaining member 39A and the substrates W of the first substrate group W1 retained by the pusher member 55.

[0235] Furthermore, a shelf 37A is provided on the side where the second gap TN2 is formed when the first and second substrate groups W1 and W2 are combined. Thus, since the shelf 37A is provided on the side where the second gap TN2 is formed when the first and second substrate groups W1 and W2 are combined, it is less likely to interfere with the substrates held by the pusher mechanism 21 when the first and second substrate groups W1 and W2 are combined.

[0236] The present invention is not limited to the above-described embodiment, and can be implemented in the following modified forms.

[0237] (1) In the first embodiment described above, not only the deepest portion 39Ca of the holding groove 39C but also the entire holding groove 39C is provided closer to the side where the first gap TN1 is provided when the first substrate group W1 and the second substrate group W2 are combined, than the center 39Ba in the width direction along the arrangement direction DR1 of the substrates W. However, the arrangement of the holding groove 39C is not limited to this form. That is, as long as Figure 35A As shown, the deepest portion 39Ca of the holding groove 39C may be located closer to the first interval TN1 than the center 39Ba in the width direction along the arrangement direction DR1 of the substrates W. The holding groove 39C may also be made wider at a portion closer to the second interval TN2 than the center 39Ba in the width direction. Alternatively, the holding groove 39C may be formed over the entire width direction of the holding member 39A. For example, Figure 35B The holding groove 39C shown is formed throughout the entire width direction of the holding member 39A. The cross-sectional shapes of the first holding wall portion 39C1 and the second holding wall portion 39C2 are asymmetrical with respect to a center line z3 passing through the deepest portion 39Ca of the holding groove 39C.

[0238] (2) In the above-mentioned embodiment 1, the retaining groove 39C is a V-shaped groove, but the shape of the retaining groove 39C is not limited to this. The bottom of the retaining groove 39C, that is, the deepest part 39Ca, may also be flat. Figure 35C As shown in FIG. 3 , the deepest portion 39Ca of the retaining groove 39C may also be a curved surface. The retaining groove 39C may also not be provided with the inclined surface 39B. For example, Figure 35D As shown, the deepest portion 39Ca is flat, and the groove is formed at a right angle relative to the deepest portion 39Ca. The bottom of the retaining groove 39C can also be formed into multiple levels. The cross-sectional shapes of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are asymmetrical with respect to the centerline z3 passing through the deepest portion 39Ca of the retaining groove 39C. Figure 35D In the embodiment, the deepest portion 39Ca of the holding groove 39C is the center in the width direction along the arrangement direction of the substrates W of the flat deepest portion 39Ca.

[0239] (3) In the first embodiment described above, the holding groove 39C is offset to the side where the first gap TN1 is provided relative to the center 39Ba in the width direction along the arrangement direction DR1 of the substrates W of the holding member 39A. However, the position of the holding groove 39C in the holding member 39A is not limited to this. For example, Figure 36AThe deepest portion 39Ca of the shown retaining groove 39C is located at the center 39Ba in the width direction of the retaining part 39A. However, the retaining groove 39C as a whole is offset in the retaining part 39A toward the side where the first gap TN1 is provided. Therefore, the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are asymmetrically shaped, with the center line z3 passing through the deepest portion 39Ca of the retaining groove 39C being clamped therebetween. In addition, in Figure 36, the center line z3 passes through the center 39Ba of the retaining part 39A. The cross-sectional shape of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 is roughly trapezoidal. The second retaining wall portion 39C2 protrudes toward the center 39Ba more than the first retaining wall portion 39C1. That is, the substrate W2 protrudes toward the first retaining wall portion 39C1. At the depth position of the deepest portion 39Ca, the thicknesses (t3, t4) of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are the same. However, at a depth shallower than the deepest portion 39Ca, the thicknesses (t1, t2) of the first retaining wall 39C1 and the second retaining wall 39C2 differ. At a depth shallower than the deepest portion 39Ca, the widthwise lengths (t1, t2) of the cross-sectional shapes of the first retaining wall 39C1 and the second retaining wall 39C2 differ.

[0240] in addition, Figure 36B The deepest portion 39Ca of the shown retaining groove 39C is located at the center 39Ba in the width direction of the retaining part 39A. However, the second retaining wall portion 39C2 of the retaining groove 39C bulges slightly outward. Therefore, the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are asymmetrically shaped with respect to the center line z3 passing through the deepest portion 39Ca of the retaining groove 39C. The cross-sectional shape of the first retaining wall portion 39C1 is roughly a right triangle. The cross-sectional shape of the second retaining wall portion 39C2 is a 1 / 4 circle shape. The second retaining wall portion 39C2 protrudes toward the center 39Ba side more than the first retaining wall portion 39C1. That is, the substrate W2 protrudes toward the first retaining wall portion 39C1. At the depth position of the deepest portion 39Ca, the thicknesses (t3, t4) of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are the same. However, the first retaining wall 39C1 and the second retaining wall 39C2 have asymmetrical shapes, and therefore have different thicknesses (t1, t2) at depths shallower than the deepest portion 39Ca. At depths shallower than the deepest portion 39Ca, the first retaining wall 39C1 and the second retaining wall 39C2 have different widthwise lengths (t1, t2) at depths shallower than the deepest portion 39Ca.

[0241] Therefore, in the retaining member 39A, the widthwise thickness t3 from the deepest portion 39Ca of the retaining groove 39C to the outer side surface 39C1s of the first retaining wall 39C1 is the same as the widthwise thickness t4 from the deepest portion 39Ca of the retaining groove 39C to the outer side surface 39C2s of the second retaining wall 39C2. However, in the retaining member 39A, the widthwise thickness t1 from a depth shallower than the deepest portion 39Ca to the outer side surface 39C1s of the first retaining wall 39C1 is different from the widthwise thickness t2 from the same depth to the outer side surface 39C2s of the second retaining wall 39C2. Consequently, compared to a configuration in which the thicknesses of the first retaining wall 39C1 and the second retaining wall 39C2 are the same, the thickness of the first retaining wall 39C1 is thinner at depths shallower than the deepest portion 39Ca of the retaining groove 39C. Therefore, interference between the holding member 39A or the substrates W of the second substrate group W2 held by the holding member 39A and the substrates W of the first substrate group W1 held by the pusher member 55 can be less likely to occur.

[0242] Furthermore, in the retaining member 39A, the widthwise thickness t1 from a depth position shallower than the deepest portion 39Ca to the outer side surface 39C1s of the first retaining wall 39C1 is thinner than the widthwise thickness t2 from the same depth position to the outer side surface 39C2s of the second retaining wall 39C2. This ensures the rigidity of the retaining member 39A at a depth position shallower than the deepest portion 39Ca of the retaining groove 39C. Furthermore, the thinner thickness of the first retaining wall 39C1 at a depth position shallower than the deepest portion 39Ca of the retaining groove 39C prevents interference between the retaining member 39A or the substrates W of the second substrate group W2 retained by the retaining member 39A and the substrates W of the first substrate group W1 retained by the pusher member 55.

[0243] (4) In the above-mentioned embodiment 1, the posture conversion mechanism 19 was described as an example of the "first mechanism" of the present invention. However, as long as the mechanism has a holding portion for holding substrates arranged in a vertical position at equal intervals, the posture conversion mechanism 19 as in the embodiment 1 may not be used. In addition, in the above-mentioned embodiment 1, the pusher mechanism 21 was described as an example of the "second mechanism" of the present invention. However, as long as the mechanism combines the second substrate group held by the first mechanism and the first substrate group delivered in advance from the first mechanism and holds a plurality of substrates arranged at unequal intervals with a first interval and a second interval wider than the first interval being alternately repeated, the pusher mechanism 21 as in the embodiment 1 may not be used.

[0244] The present invention can be embodied in other specific forms without departing from the spirit or essence thereof, and therefore, reference should be made to the appended claims rather than to the foregoing description as to the scope of the invention.

Claims

1. A substrate processing device for processing a substrate, characterized in that: have: A first mechanism having a holding portion for holding substrates arranged at equal intervals in a vertical position; a second mechanism that combines the second substrate group held by the first mechanism with the first substrate group delivered in advance from the first mechanism, and holds a plurality of substrates arranged at unequal intervals that alternately repeat first intervals and second intervals wider than the first intervals; a pitch conversion unit that receives the plurality of substrates arranged at the unequal pitches from the second mechanism and arranges the plurality of substrates arranged at the unequal pitches at a narrow pitch that repeats the first interval; a substrate processing section for processing the plurality of substrates arranged at the narrow pitch at a time; as well as A main transport mechanism transports the plurality of substrates arranged at the narrow pitch to the substrate processing section. The holding portion has a holding groove formed along the peripheral edge of the substrate, and the holding groove is set at a position offset from the center in the width direction along the arrangement direction of the substrate to the side where the first gap is arranged when the first substrate group and the second substrate group are combined.

2. The substrate processing apparatus according to claim 1, wherein: The first mechanism is a posture conversion mechanism, which includes: a pair of horizontal holding parts, on which shelves for placing ends of substrates in a horizontal posture are arranged at equal intervals; and a pair of vertical holding parts as the holding parts, on which holding components for holding substrates in a vertical posture are arranged at equal intervals. By rotating and displacing the pair of horizontal holding parts and the pair of vertical holding parts, the postures of the plurality of substrates can be converted between a vertical posture and a horizontal posture. The second mechanism is a pusher mechanism having a pusher member, which combines the second substrate group in the vertical posture held by the pair of vertical holding portions and the first substrate group in the vertical posture delivered in advance from the pair of vertical holding portions, and holds the plurality of substrates arranged at the unequal intervals. The above-mentioned holding component has the above-mentioned holding groove formed in a manner along the peripheral edge portion of the substrate in the above-mentioned vertical posture, and the above-mentioned holding groove is provided at a position offset from the center of the above-mentioned width direction along the arrangement direction of the above-mentioned substrates held in the above-mentioned vertical posture toward the side where the above-mentioned first interval is arranged when the above-mentioned first substrate group and the above-mentioned second substrate group are combined.

3. The substrate processing apparatus according to claim 2, wherein: As for the above-mentioned retaining member, The deepest portion of the holding groove is located at a position offset from the center in the width direction toward a side where the first gap is arranged when the first substrate group and the second substrate group are combined.

4. The substrate processing apparatus according to claim 2 or 3, wherein: The above-mentioned holding component has: a first holding wall portion that holds one end of a peripheral edge portion of the substrate inserted into the holding groove; and a second holding wall portion that holds the other end of the peripheral edge portion of the substrate inserted into the holding groove; The first retaining wall portion and the second retaining wall portion have different thicknesses in the width direction at positions having the same groove depth.

5. The substrate processing apparatus according to claim 4, wherein: The thickness of the first retaining wall portion in the width direction is thinner than the thickness of the second retaining wall portion in the width direction at the same groove depth. The first retaining wall is provided on the side where the first spacer is arranged when the first substrate group and the second substrate group are combined. The second holding wall portion is provided on a side where the second spacer is arranged when the first substrate group and the second substrate group are combined.

6. The substrate processing apparatus according to claim 5, wherein: As for the above-mentioned retaining member, The thickness in the width direction from the deepest portion of the retaining groove to the outer side surface of the first retaining wall portion is thinner than the thickness in the width direction from the deepest portion of the retaining groove to the outer side surface of the second retaining wall portion.

7. The substrate processing apparatus according to claim 4, wherein: As for the above-mentioned retaining member, The thickness in the width direction from the deepest part of the holding groove to the outer side surface of the first holding wall portion is the same as the thickness in the width direction from the deepest part of the holding groove to the outer side surface of the second holding wall portion. The thickness in the width direction from a depth position shallower than the deepest portion to the outer side surface of the first retaining wall portion is different from the thickness in the width direction from the same depth position to the outer side surface of the second retaining wall portion.

8. The substrate processing apparatus according to claim 4, wherein: As for the above-mentioned retaining member, The thickness in the width direction from the deepest part of the holding groove to the outer side surface of the first holding wall portion is the same as the thickness in the width direction from the deepest part of the holding groove to the outer side surface of the second holding wall portion. The thickness in the width direction from a depth position shallower than the deepest portion to the outer side surface of the first retaining wall portion is thinner than the thickness in the width direction from the same depth position to the outer side surface of the second retaining wall portion.

9. The substrate processing apparatus according to claim 4, wherein: As for the above-mentioned retaining member, When the holding member is cut along a width direction along the arrangement direction of the substrates, the cross-sectional shapes of the first holding wall and the second holding wall are asymmetric relative to a center line passing through the deepest part of the holding groove.

10. The substrate processing apparatus according to claim 4, wherein: As for the above-mentioned retaining member, The cross-sectional shape of the first retaining wall portion is such that the length in the width direction from a depth position shallower than the deepest portion to the outer side surface of the first retaining wall portion is shorter than the length in the width direction from the same depth position to the outer side surface of the second retaining wall portion.

11. The substrate processing apparatus according to claim 2, wherein: The shelf is provided on a side where the second partition is arranged when the first substrate group and the second substrate group are combined.

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