Substrate transfer apparatus and substrate processing apparatus

Abstract

The present invention provides a substrate conveying apparatus and a substrate processing apparatus, the substrate processing apparatus comprising: a substrate holding mechanism which combines a first substrate group in a vertical posture held by a posture changing mechanism by a clamping rod and a second substrate group in a vertical posture transferred from the posture changing mechanism in advance, the substrate holding mechanism is provided with a first substrate group and a second substrate group which are arranged in a horizontal direction at an arrangement pitch narrower than the predetermined pitch, and the posture changing mechanism is provided with a moving mechanism which moves the first substrate group and the second substrate group when the substrate holding mechanism combines the first substrate group and the second substrate group. The moving mechanism moves the flat plate at a first position where the substrate in the horizontal posture can abut to a second position where the flat plate is retracted from the gap of the first substrate group.

Description

Technical Field

[0001] The present invention relates to a substrate transporting device and a substrate processing device for transporting substrates such as semiconductor substrates, FPD (Flat Panel Display) substrates such as liquid crystal display or organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks. Background Art

[0002] Patent document 1 describes the following substrate processing device: the same number of substrates are taken out from two carriers respectively to form a first substrate group and a second substrate group, and the second substrate group is inserted into the gaps between the substrates of the first substrate group, thereby converting the spacing to 1 / 2, forming a substrate group with twice the number of sheets, and processing them together.

[0003] In recent years, there has been a demand for further efficiency improvement of substrate processing devices. In order to increase the number of substrates processed at one time in batch processing, it is necessary to make the arrangement pitch (pitch) of the substrates narrower. What becomes a problem at this time is the orientation of the substrate. That is, in batch processing, from the viewpoint of preventing contamination of the device surface, it is preferred to arrange the substrates face to face to generate a batch (batch lot). In existing devices, in order to arrange substrates face to face, a method is adopted in which a substrate arrangement obtained from a first carrier is combined with a substrate arrangement obtained by rotating a substrate arrangement obtained from a second carrier half a circle. Therefore, in existing devices, setting the arrangement pitch of the substrates on the carrier to 1 / 2 is the limit. If you want to arrange the substrates face to face and further reduce the pitch, you need a new device that has not been available before. In addition, if you want to reduce the pitch, there is a possibility of damage to the substrate when combining the two substrate arrangements.

[0004] List of prior art documents: Japanese Patent Application Laid-Open No. 5-175179 Summary of the Invention

[0005] The present invention has been made in view of the above circumstances, and an object thereof is to provide a substrate transport apparatus and a substrate processing apparatus capable of narrowing the arrangement pitch of substrates without damaging the substrates and efficiently processing the substrates.

[0006] The present invention adopts the following configuration in order to solve the above-mentioned problems.

[0007] That is, the present invention has:

[0008] An operating mechanism that obtains a substrate group from a carrier that arranges and accommodates substrates in a horizontal position in a vertical direction;

[0009] The posture changing mechanism comprises: a pair of placing rods having flat plates arranged at predetermined intervals in the vertical direction, the flat plates placing the ends of the substrates to which the operating mechanism is attached; a pair of clamping rods having grooves arranged at predetermined intervals in the vertical direction for clamping the substrates in the vertical posture; a supporting member having the placing rods and the clamping rods provided upright; and a base supporting the supporting member so as to be inverted; and

[0010] A substrate holding mechanism combines a first substrate group held in a vertical position by the posture changing mechanism using the clamping rods with a second substrate group in a vertical position previously received from the posture changing mechanism, so that the substrates are arranged in the horizontal direction at an arrangement pitch narrower than the predetermined pitch.

[0011] The posture changing mechanism includes a moving mechanism that moves the plate from a first position where horizontal substrates can abut against the plate to a second position away from a gap between the first substrate groups when the substrate holding mechanism combines the first and second substrate groups.

[0012] [Function and Effect] According to the above structure, the posture conversion mechanism includes a moving mechanism that moves the flat plate at a first position where the substrates in a horizontal position can abut against each other to a second position away from the gap of the first substrate group when the substrate holding mechanism combines the first substrate group and the second substrate group. The substrate conveying device of the present invention is configured to insert the substrates of the first substrate group into the gap of the substrates of the second substrate group. The first substrate group is clamped by the clamping rod of the posture conversion mechanism when combined with the second substrate group, so the loading rod does not contribute to the support of the substrate. On the contrary, the flat plate of the loading rod is located in the space where the substrates of the second substrate group are inserted. Therefore, when the first substrate group and the second substrate group are combined, there is a possibility that the flat plate and the second substrate group will collide. According to the present invention, when the first substrate group and the second substrate group are combined, the flat plate retreats from the gap of the first substrate group. Therefore, when the substrate groups are combined, the flat plate of the loading rod does not come into contact with the substrate and damage the substrate.

[0013] In the above configuration, preferably, the placement rod has a surface where the flat plates are arranged and a surface where the flat plates are not arranged, and the moving mechanism is a rotating mechanism that rotates the placement rod about a central axis parallel to the arrangement direction of the flat plates.

[0014] [Function and Effect] According to the above structure, the loading rod has a surface for arranging the flat plates and a surface for not arranging the flat plates, and the moving mechanism is a rotating mechanism that rotates the loading rod about a central axis parallel to the arrangement direction of the flat plates. With this structure, the flat plates can be reliably retracted.

[0015] In addition, in the above-mentioned structure, it is preferred that the loading rod has a surface for arranging the outward path of the first flat plate and a surface for arranging the return path of the second flat plate as the surface for arranging the flat plates, and when the substrate is transported from the operating mechanism to the substrate holding mechanism, the rotating mechanism rotates the loading rod so that the outward path surface faces the substrate, and when the substrate is transported from the substrate holding mechanism to the operating mechanism, the rotating mechanism rotates the loading rod so that the return path surface faces the substrate.

[0016] [Function and Effect] According to the above configuration, the loading rod has a surface for arranging the first flat plate in the forward direction and a surface for arranging the second flat plate in the return direction. When transferring a substrate from the operating mechanism to the substrate holding mechanism, the rotation mechanism rotates the loading rod so that the forward surface faces the substrate. Conversely, when transferring a substrate from the substrate holding mechanism to the operating mechanism, the rotation mechanism rotates the loading rod so that the return surface faces the substrate. Thus, by distinguishing between the flat plates of the loading rod used in the forward direction and the flat plates of the loading rod used in the return direction, the present invention can prevent contamination of substrates passing through the flat plates of the loading rod.

[0017] In addition, in the above structure, it is preferred that the flat plates are arranged on the loading rod at a pitch that is twice the pitch of the substrates on the carrier, the grooves are arranged on the clamping rod at a pitch that is twice the pitch of the substrates on the carrier, and the arrangement pitch of the substrates in the substrate holding mechanism is 1 / 3 times the arrangement pitch of the substrates on the carrier.

[0018] [Function and Effect] According to the above structure, the flat plates are arranged on the loading rods at a pitch twice the spacing of the substrates on the carrier, and the grooves are arranged on the clamping rods at a pitch twice the spacing of the substrates on the carrier. As a result, the spacing of the substrates in the substrate holding mechanism is 1 / 3 of the spacing of the substrates on the carrier. With this structure, the substrate holding mechanism can reliably maintain the spacing of the substrates at 1 / 3 of the spacing of the substrates on the carrier by repeatedly transferring the substrates six times.

[0019] Furthermore, in the above-mentioned configuration, it is preferable that the substrate holding mechanism can rotate the arrangement of the held substrates by half a turn around the vertical axis.

[0020] [Function and Effect] According to the above structure, the substrate holding mechanism can rotate the arrangement of the held substrates half a turn around the vertical axis. As a result, the substrate holding mechanism can change the orientation of the substrates while assembling the batch, so that the substrates can be arranged face to face in the final batch.

[0021] In addition, in the above structure, it is preferred that the flat plates are arranged on the loading rod at the arrangement pitch of the substrates on the carrier, and the grooves are arranged on the clamping rod at the arrangement pitch of the substrates on the carrier, and the substrate holding mechanism can divide the substrates into a first group and a second group in such a manner that two opposite substrates in the arrangement of the held substrates become different groups, and rotate the substrates of the second group half a circle around the vertical axis.

[0022] [Function and Effect] In the above-described structure, flat plates are arranged on the loading rods at the same pitch as the substrates on the carrier, and grooves are arranged on the clamping rods at the same pitch as the substrates on the carrier. The substrate holding mechanism can divide the substrates into a first group and a second group, so that two opposing substrates in the held arrangement form different groups. The second group of substrates is rotated half a turn about the vertical axis. This configuration enables the substrates to be arranged face-to-face in the final batch.

[0023] Furthermore, in the above structure, preferably, the arrangement pitch of the substrates in the substrate holding mechanism is 1 / 3 times the arrangement pitch of the substrates on the carrier.

[0024] [Action and Effect] According to the above structure, the arrangement pitch of the substrates in the substrate holding mechanism is 1 / 3 of the arrangement pitch of the substrates on the carrier. If it is constructed in this way, the arrangement pitch of the final batch can be set to 1 / 3 of the arrangement pitch of the substrates on the carrier.

[0025] Furthermore, according to the present invention, it is possible to provide a substrate processing apparatus including an immersion tank for immersing a substrate held by a substrate holding mechanism in a processing liquid.

[0026] According to the present invention, it is possible to provide a substrate transport apparatus and a substrate processing apparatus that can narrow the arrangement pitch of substrates without damaging the substrates and efficiently process the substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a top view illustrating the overall structure of the substrate processing apparatus according to the first embodiment.

[0028] Figure 2 This is a schematic diagram illustrating the structure of the carrier of Example 1.

[0029] Figure 3 It is a perspective view for explaining each part constituting the transfer block of Example 1.

[0030] Figure 4 This is a comparison diagram between the structure of the carrier of Example 1 and the structure of the transfer robot.

[0031] Figure 5 This is a perspective view illustrating the structure of the HVC posture changing unit of the first embodiment.

[0032] Figure 6 It is a plan view illustrating the structure of each rod in Example 1.

[0033] Figure 7 It is a plan view illustrating the structure of each rod in Example 1.

[0034] Figure 8 This is a cross-sectional view illustrating the groove included in the clamping rod of Example 1.

[0035] Figure 9 Schematic diagram illustrating the pusher of Example 1.

[0036] Figure 10 Schematic diagram illustrating the pusher of Example 1.

[0037] Figure 11A This is a schematic diagram illustrating the batch combination of Example 1.

[0038] Figure 11B This is a schematic diagram illustrating the batch combination of Example 1.

[0039] Figure 11C This is a schematic diagram illustrating the batch combination of Example 1.

[0040] Figure 11D This is a schematic diagram illustrating the batch combination of Example 1.

[0041] Figure 11E This is a schematic diagram illustrating the batch combination of Example 1.

[0042] Figure 12A This is a perspective view for explaining the operation of the tablet of Example 1.

[0043] Figure 12B This is a perspective view for explaining the operation of the tablet of Example 1.

[0044] Figure 12C This is a perspective view for explaining the operation of the tablet of Example 1.

[0045] Figure 13 This is a schematic diagram illustrating the batch combination of Example 1.

[0046] Figure 14 This is a schematic diagram for explaining the operation of the tablet in Example 1.

[0047] Figure 15A This is a schematic diagram illustrating the batch combination of Example 1.

[0048] Figure 15B This is a schematic diagram illustrating the batch combination of Example 1.

[0049] Figure 15C This is a schematic diagram illustrating the batch combination of Example 1.

[0050] Figure 15D This is a schematic diagram illustrating the batch combination of Example 1.

[0051] Figure 15E This is a schematic diagram illustrating the batch combination of Example 1.

[0052] Figure 15F This is a schematic diagram illustrating the batch combination of Example 1.

[0053] Figure 15G This is a schematic diagram illustrating the batch combination of Example 1.

[0054] Figure 15H This is a schematic diagram illustrating the batch combination of Example 1.

[0055] Figure 15I This is a schematic diagram illustrating the batch combination of Example 1.

[0056] Figure 15J This is a schematic diagram illustrating the batch combination of Example 1.

[0057] Figure 16 This is a schematic diagram illustrating the orientation of the substrate in Example 1.

[0058] Figure 17 This is a flowchart illustrating the process of the substrate of Example 1.

[0059] Figure 18 This is a flowchart illustrating the process of the substrate of Example 1.

[0060] Figure 19 This is a comparison diagram between the structure of the carrier of Example 1 and the structure of the transfer robot.

[0061] Figure 20 This is a perspective view illustrating the structure of the HVC posture changing unit of the first embodiment.

[0062] Figure 21 It is a plan view illustrating the structure of the placement rod of Example 1.

[0063] Figure 22A This is a schematic diagram illustrating the batch combination of Example 2.

[0064] Figure 22B This is a schematic diagram illustrating the batch combination of Example 2.

[0065] Figure 22CThis is a schematic diagram illustrating the batch combination of Example 2.

[0066] Figure 22D This is a schematic diagram illustrating the batch combination of Example 2.

[0067] Figure 22E This is a schematic diagram illustrating the batch combination of Example 2.

[0068] Figure 22F This is a schematic diagram illustrating the batch combination of Example 2.

[0069] Figure 22G This is a schematic diagram illustrating the batch combination of Example 2.

[0070] Figure 22H This is a schematic diagram illustrating the batch combination of Example 2.

[0071] Figure 22I This is a schematic diagram illustrating the batch combination of Example 2.

[0072] Figure 22J This is a schematic diagram illustrating the batch combination of Example 2.

[0073] Figure 23 This is a schematic diagram illustrating the batch combination of Example 2.

[0074] Figure 24 This is a schematic diagram illustrating the batch combination of Example 2.

[0075] Figure 25 This is a schematic diagram illustrating the batch combination of Example 2.

[0076] Figure 26A This is a schematic diagram illustrating the batch combination of Example 2.

[0077] Figure 26B This is a schematic diagram illustrating the batch combination of Example 2.

[0078] Figure 26C This is a schematic diagram illustrating the batch combination of Example 2.

[0079] Figure 26D This is a schematic diagram illustrating the batch combination of Example 2.

[0080] Figure 26E This is a schematic diagram illustrating the batch combination of Example 2.

[0081] Figure 26F This is a schematic diagram illustrating the batch combination of Example 2.

[0082] Figure 26GThis is a schematic diagram illustrating the batch combination of Example 2.

[0083] Figure 26H This is a schematic diagram illustrating the batch combination of Example 2.

[0084] Figure 27 This is a schematic diagram illustrating the orientation of the substrate in Example 2.

[0085] Figure 28 This is a flowchart illustrating the process of the substrate of Example 2.

[0086] Figure 29 It is a perspective view illustrating a modified example of the present invention.

[0087] Figure 30 It is a perspective view illustrating a modified example of the present invention. DETAILED DESCRIPTION

[0088] An embodiment of the present invention is described below with reference to the accompanying drawings. The substrate processing apparatus of this embodiment converts substrates arranged at a 10mm pitch into a 1 / 3 pitch (10 / 3mm) to form batches. Various substrate treatments, such as chemical immersion treatment, are performed on these batches simultaneously, thus implementing so-called batch processing. By performing substrate processing with a narrowed substrate pitch in this manner, the required chemical solution is reduced, enabling substrate processing that reduces operating costs and is environmentally friendly.

[0089] The substrates processed by the substrate processing apparatus of this embodiment have an orientation defined by their front and back surfaces. The front surface of the substrate is the device side where film formation and exposure processing are performed. The back surface is the side opposite the device surface. When the substrate is held horizontally, the front surface of the substrate faces upward.

[0090] Example 1

[0091] 1. Overall structure

[0092] The substrate processing apparatus 1 of the present invention is configured for batch processing. It includes a housing 1A that houses the various blocks. Housing 1A is generally rectangular in plan view. Housing 1A houses a storage block 3, a transfer block 5, and a processing block 6 arranged horizontally from one end. A loading port 9 is protruding from a wall surface at one end of housing 1A.

[0093] In this specification, for convenience, the direction in which the storage block 3, the transfer block 5 and the processing block 6 in the substrate processing device 1 are arranged is referred to as the "front-back direction X". The front-back direction X extends horizontally. The direction in the front-back direction X from the transfer block 5 in the substrate processing device 1 toward the storage block 3 is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontally extending direction perpendicular to the front-back direction X is referred to as the "width direction Y". For convenience, one direction of the "width direction Y" is referred to as the "right", and for convenience, the other direction is referred to as the "left". For convenience, the direction (height direction) perpendicular to the front-back direction X and the width direction Y is referred to as the "vertical direction Z". In each figure, for reference, front, back, right, left, top and bottom are appropriately shown.

[0094] 2. Storage block

[0095] like Figure 1 As shown, the storage block 3 has a loading port 9, which serves as an entrance for loading a carrier C containing a plurality of substrates W in a horizontal position at predetermined intervals in a vertical direction into the block. The loading port 9 is a structure that protrudes from the outer wall of the storage block 3 extending in the width direction (Y direction).

[0096] A plurality of (eg, 25) substrates W are stacked in a horizontal position at predetermined intervals within one carrier C. The carrier C containing the unprocessed substrates W to be carried into the substrate processing apparatus 1 is first placed on the load port 9 .

[0097] Figure 2 The structure of the carrier C is described below. The carrier C is formed with a plurality of slots S extending in the horizontal direction while maintaining the surfaces of the substrates W separated from each other. The slots S are arranged in the vertical direction at a specific pitch (for example, 10 mm), and each slot S accommodates a substrate W. 25 slots S are provided on one carrier C. Therefore, on the carrier C, 25 substrates W are arranged in the vertical direction at a specific pitch. The loading plate 7 is located at a position dividing each slot S, and supports both ends of the substrate W together with the paired loading plates 7. Therefore, the loading plates 7 are arranged one on each side of the carrier C and on a surface parallel to the side. As a carrier C, for example, there is a closed FOUP (Front Opening Unify Pod). In the present invention, an open container can also be used as a carrier C.

[0098] The internal structure of the storage block 3 will be described. The storage block 3 includes a transport and storage unit ACB for storing and managing carriers C. The transport and storage unit ACB includes a carrier transport mechanism 11 for transporting carriers C and a shelf 13 for placing carriers C. The storage block 3 can store at least one carrier C.

[0099] The storage block 3 has a plurality of shelves 13 for mounting carriers C. The shelves 13 are provided on a partition wall separating the storage block 3 from the transfer block 5. The shelves 13 include a storage shelf 13b for temporarily mounting carriers C and a carrier mounting shelf 13a for removing substrates, which is accessed by the first transfer robot HTR of the transfer block 5.

[0100] The carrier loading shelf 13a is a structure capable of loading a carrier C. The carrier loading shelf 13a is a structure for loading a target carrier C from which a substrate W is to be removed. In this embodiment, one carrier loading shelf 13a is provided, but a plurality of carrier loading shelves 13a may be provided. The carrier transport mechanism 11 takes in a carrier C containing an unprocessed substrate W from the loading port 9 and loads it onto the carrier loading shelf 13a for substrate removal. At this time, the carrier transport mechanism 11 can also temporarily load the carrier C onto the storage shelf 13b before loading it onto the carrier loading shelf 13a. The number of carrier loading shelves 13a provided in the storage block 3 is one or more.

[0101] The carrier loading shelf 13a also houses empty carriers C for storing processed substrates W. Processed substrates W are stored on the carriers C waiting on the carrier loading shelf 13a. The carrier transport mechanism 11 retrieves a carrier C containing processed substrates W from the carrier loading shelf 13a and transports it to the load port 9. When transporting a carrier C to the load port 9, the carrier transport mechanism 11 may temporarily place the carrier C on the storage shelf 13b.

[0102] 3. Transfer block

[0103] The transfer block 5 is adjacent to the carrier loading shelf 13a. The transfer block 5 is arranged adjacent to the rear of the storage block 3. The transfer block 5 includes: a transport robot HTR that can access the carrier C placed on the carrier loading shelf 13a for substrate removal; an HVC posture changer 23 that changes a plurality of substrates W from a horizontal posture to a vertical posture at a time; and a pushing mechanism 25. The HVC posture changer 23 changes a plurality of substrates W from a horizontal posture to a vertical posture at a time. In addition, a substrate transfer position PP for transferring a plurality of substrates W to the forward and backward transport mechanism WTR provided in the collective transport area R2 is set in the transfer block 5. The transport robot HTR is equivalent to the operating mechanism of the present invention. The transport robot HTR is a structure that obtains a substrate group from a carrier C that stores substrates in a horizontal posture arranged in a vertical direction.

[0104] like Figure 3As shown, the transport robot HTR, the HVC posture change unit 23, and the pushing mechanism 25 are arranged in sequence along the Y direction. The transport robot HTR has a hand 211 that can hold a substrate W in a horizontal position. The hand 211 can hold one substrate W. The hand 211 of the transport robot HTR is arranged in the vertical direction. The transport robot HTR can transport multiple substrates W at a time by holding a substrate with each hand 211. The moving support mechanism 213 is a mechanism that constitutes the transport robot HTR. It is a structure that rotates the hand 211 around the vertical axis, raises and lowers the hand 211, and moves the hand 211 forward and backward in the front-to-back direction X or horizontally in the left-to-right direction Y.

[0105] Figure 4 FIG. 2 shows a situation in which the transport robot HTR receives the substrate W in the carrier C using the hand 211. Figure 4 As shown, the hands 211 are arranged in the vertical direction at a pitch that is twice the pitch of the slots S provided on the carrier C. That is, the hands 211 are arranged at a pitch of 20 mm. The transport robot HTR cannot transport all substrates W arranged at 10 mm intervals on the carrier C at one time. The transport robot HTR is a structure that generates a group of substrates arranged at intervals of 20 mm by pulling out every other substrate W arranged at 10 mm intervals. The surfaces of the substrates W stored in the carrier C are all facing upward, so the substrates W pulled out by the transport robot HTR are all facing upward. In addition, each hand 211 is provided with a guide 214 for abutting the peripheral edge of the substrate. The guide 214 is provided at the front end and base end of a pair of blades constituting the hand 211. Therefore, four guides 214 are provided on the hand 211.

[0106] The transport robot HTR has 13 hands 211. The transport robot HTR uses these hands to transport 25 substrates stored on the carrier C in two steps. The transport robot HTR can first transport 12 substrates W and then transport 13 substrates W. Similarly, the transport robot HTR can first transport 13 substrates W and then transport 12 substrates W.

[0107] Figure 3 The HVC posture changer 23 shown is a structure that changes the horizontal posture of a substrate W removed from a carrier C by a transport robot HTR to a vertical posture. The HVC posture changer 23 includes a pair of loading rods 231 with flat plates 233 arranged at 20 mm intervals in the vertical direction for supporting the ends of the substrate W transferred by the transport robot HTR. Furthermore, the HVC posture changer 233 includes a pair of clamping rods 232 with V-grooves 234b (described later) arranged at 20 mm intervals in the vertical direction for clamping the substrate W in the vertical posture. The HVC posture changer 23 corresponds to the posture change mechanism of the present invention.

[0108] The HVC posture changing unit 23 includes a pair of loading rods 231 and a pair of clamping rods 232 extending in the longitudinal direction (Z direction). The support platform 237 has a support surface extending in the XY plane for supporting the loading rods 231 and the clamping rods 232. The support platform 237 is a structure in which the loading rods 231 and the clamping rods 232 are arranged upright. The support platform 237 is equivalent to the supporting component of the present invention. The rotation drive mechanism 239 is a structure that rotates the loading rods 231 and the clamping rods 232 together with the support platform 237 by 90°. Through this rotation, the loading rods 231 and the clamping rods 232 become structures extending in the left-right direction (Y direction). The base 2310 is a structure that supports the support platform 237 so that it can be inverted.

[0109] The loading rods 231 are equipped with rod drive mechanisms 235 that rotate about rotation axes extending along their extension directions. The pair of rod drive mechanisms 235 allow the pair of loading rods 231 to rotate synchronously. Furthermore, the rod drive mechanisms 235 can extend and retract the loading rods 231. A specific example of how the loading rods 231 are driven by the rod drive mechanisms 235 will be described later.

[0110] The clamping rod 232 includes a rod rotating mechanism 236 that rotates around a rotation axis along the extending direction of the clamping rod 232. The pair of rod rotating mechanisms 236 allow the pair of clamping rods 232 to rotate synchronously.

[0111] Figure 5 The flat plate 233 of the loading rod 231 is described. The flat plates 233 are arranged on the loading rod 231 at intervals of 20 mm along the extension direction of the loading rod 231. Each flat plate 233 is a plate extending in a plane perpendicular to the arrangement direction of the flat plates 233, and the substrate W is supported by the loading rod 231 by placing the end of the substrate W on the upper surface of the flat plate 233. In addition, it is not possible to hold the entire substrate W by holding only one end of the substrate W, so two loading rods 231 are provided in the HVC posture changing section 23. One end of the substrate W is held by the flat plate 233 of one loading rod 231, and the other end of the substrate W is held by the flat plate 233 of the other loading rod 231. One end and the other end are separated by a distance equal to the diameter of the substrate W. Therefore, as Figure 6 As shown, the pair of loading rods 231 are separated by a distance equal to the diameter of the substrate W. This prevents the substrate W held by the plate 233 from floating off the plate 233. Because the weight of the substrate W is applied symmetrically to the plate 233, the weight of the substrate W on the plate 233 is balanced. Furthermore, the pair of loading rods 231 are parallel to each other.

[0112] Figure 5The clamping plate 234 of the clamping rod 232 is described. The clamping plate 234 has an arc edge 234a along the curve of the substrate W, and a V-groove 234b for clamping the substrate W is provided on the arc edge 234a. The substrate W is in a shape along the curve of the arc edge 234a, so the substrate W is clamped by the V-groove 234b of the arc edge 234a. The clamping plates 234 are arranged on the clamping rod 232 at a pitch of 20 mm along the extension direction of the clamping rod 232. Each clamping plate 234 is a plate extending on a plane orthogonal to the arrangement direction of the clamping plates 234, and a portion of the substrate W is clamped in the V-groove 234b of the arc edge 234a, thereby clamping the substrate W by the clamping rod 232.

[0113] In addition, since clamping only a part of the substrate W cannot achieve clamping of the entire substrate W, two clamping rods 232 are provided in the HVC posture changing section 23. It is a structure in which a part of the substrate W is clamped by the clamping plate 234 of one clamping rod 232, and a part of the substrate W is clamped by the clamping plate 234 of the other clamping rod 232. The pair of clamping rods 232 are separated by a distance shorter than the diameter of the substrate W. The pair of clamping rods 232 is a structure for clamping the substrate W in a vertical posture, so it is sufficient as long as it is a structure for clamping the lower side of the substrate W, and there is no need to separate the diameter of the substrate W like the loading rod 231. However, as Figure 7 As shown, the clamping rods 232 are arranged at positions offset from the bottom of the vertically positioned substrate W, so two rods are required: one for clamping the right side of the substrate W when viewed from the bottom, and one for clamping the left side of the substrate W when viewed from the bottom. Figure 8 As shown, the two clamping bars 232 clamp the substrate W from both sides via the V-grooves 234b of the clamping plate 234. The pair of clamping bars 232 are parallel to each other.

[0114] Figure 3 The pushing mechanism 25 includes a pusher 251 that can align substrates W in a vertical position horizontally. The pusher 251 is a half-tube shape that follows the curve of the bottom of the substrate W. In the initial state, the U-groove 251a forming the half-tube of the pusher 251 extends in the left-right direction Y. In this state, the pusher 251 can receive the substrate W from the HVC position changing unit 23.

[0115] Figure 9 2 is a cross-sectional view illustrating the structure of the pusher 251. The pusher 251 has a plurality of V-shaped clamping grooves 252. The clamping grooves 252 are arranged in a V-shaped manner. Figure 7 The arrangement pitch of the clamping groove 252 is 10 / 3 mm. Figure 9 As shown, the substrates W are clamped one by one in each clamping groove 252 .

[0116] Figure 10 The relationship between the pair of clamping rods 232 and the pushing member 251 will be described. Figure 10 A pair of clamping rods 232 and Figure 3 The state is different, and the support platform 237 is tilted 90 degrees together with the rotation drive mechanism 239. Therefore, Figure 10 The clamping rod 232 extends in the horizontal direction. Figure 10 As can be seen, the pusher 251 is located at a position clamped by the pair of clamping bars 232 in the front-rear direction X. Therefore, the pair of clamping bars 232 and the pusher 251 can cooperate to clamp the substrate W in a vertical posture without interfering with each other.

[0117] Figure 3 The pusher rotation mechanism 253 can rotate the pusher 251 at least 180°. The pusher rotation mechanism 253 can rotate the pusher 251 in its initial state to face the opposite direction, or it can rotate the pusher 251 in the opposite direction to return it to its initial state. A half-turn rotation of the pusher 251 can rotate the arrangement of the substrates W held by the pusher 251 by half a turn about the vertical axis.

[0118] The pusher shifting mechanism 254 can reciprocate the pusher 251 in the initial state in the left-right direction Y. The pusher shifting mechanism 254 can move the pusher 251 closer to the HVC posture changing unit 23 or closer to the forward and backward transport mechanism WTR.

[0119] The pusher lifting mechanism 255 can make the pusher 251 of the initial position rise to the upper empty position. In addition, the pusher lifting mechanism 255 can also make the pusher 251 of the upper empty position return to the initial position.

[0120] 4. Change of spacing in transfer blocks

[0121] The substrate processing apparatus of this embodiment can change the arrangement pitch of substrates W in the transfer block 5, so this feature will be described below. Substrates W arranged at a 10 mm pitch on the carrier C are first arranged at a 20 mm pitch in the transfer block 5, and then rearranged at a 10 / 3 mm pitch. This configuration will be described in detail below.

[0122] Figure 11A The arrangement pitch of the substrates in each configuration is compared. The mounting plates 7 forming the slots S are arranged on the carrier C at intervals of 10 mm. The mounting plates 7 are arranged vertically on one side of the carrier C and also on the other side. The substrate W is held in the carrier C by placing both ends of the substrate W on a pair of facing mounting plates 7.

[0123] On the other hand, flat plates 233 are arranged at 20 mm intervals on the placement bars 231 in the HVC posture changing unit 23. Therefore, if the arrangement pitch of the placement plates 7 of the carrier C is set to A, the arrangement pitch of the flat plates 233 is 2A. In other words, the pair of placement bars 231 can only hold 13 substrates W, approximately half of the 25 substrates stored in the carrier C, at a time.

[0124] Similarly, the clamping plates 234 are arranged at 20 mm intervals on the clamping bars 232 in the HVC posture changing unit 23. Therefore, if the arrangement pitch of the placement plates 7 of the carrier C is set to A, the arrangement pitch of the clamping plates 234 is 2A. In other words, the pair of clamping bars 232 can only hold 13 substrates W, approximately half of the 25 substrates stored in the carrier C, at a time.

[0125] Figure 11B The diagram briefly shows a situation where 25 substrates W are arranged on a carrier C. In the following description, three different carriers C appear, so Figure 11B The carrier C in FIG. 1 is referred to as a first carrier C1 . 25 substrates W are arranged at a pitch of 10 mm on the first carrier C1 .

[0126] Figure 11C The figure shows the situation when a part of the substrates W stored in the first carrier C1 is handed over to the HVC posture change unit 23 by the transport robot HTR. The transport robot HTR has hands 211 arranged in the vertical direction at a pitch of 20 mm. Therefore, the transport robot HTR can only hold about half of the substrates W in the first carrier C1 at a time. The transport robot HTR extracts every other substrate W in the first carrier C1 and hands it over to the HVC posture change unit 23. Thus, as shown in FIG. Figure 6 As shown, both ends of the substrate W are supported by a pair of mounting rods 231 .

[0127] At this point, the periphery of the substrate W contacts the clamping plates 234 of the pair of clamping bars 232. Specifically, the periphery of the substrate W is clamped in the V-grooves of the clamping plates 234. Therefore, even if the support table 237 is rotated 90° in this state, the substrate W is clamped by the V-grooves 234b of the clamping plates 234, preventing it from slipping off the HVC posture changing unit 23.

[0128] In addition, Figure 11C FIG also shows a case where the loading rod 231 supports the substrate W via the flat plate 233. Figure 11C FIG. 2 shows a state where the clamping rods 232 clamp the substrate W via the clamping plates 234 .

[0129] Figure 11DThe figure shows the state of the rotation drive mechanism 239 in the HVC posture changing unit 23 during operation. This operation rotates the support table 237 90 degrees, and the placement rods 231 and clamping rods 232 are horizontally extended. As a result, the load of the substrate W is transferred from the placement rods 231 to the clamping rods 232, and the flat plate 233 of the placement rods 231 is in contact only with the substrate W. Figure 11D The figure shows the situation when the loading rod 231 is retracted by the rod driving mechanism 235. When the loading rod 231 is retracted (moved slightly by sinking into the support table 237), the plate 233 separates from the substrate W. Even with such an action, the substrate W does not move with the movement of the plate 233 because it is supported by the clamping rod 232. Figure 12A 、 Figure 12B It can be understood that the plate 233 moves due to the contraction of the placement rod 231 .

[0130] If the flat plate 233 is separated from the substrate W, the flat plate 233 will not damage the back surface of the substrate W even if the substrate W clamped by the clamping bars 232 is lifted by the pusher 251 .

[0131] Figure 11E The following figure shows the situation when the loading rod 231 is rotated 90 degrees by the rod driving mechanism 235. The flat plate 233 in the loading rod 231 is directed upward by the rotation of the loading rod 231. The movement of the flat plate 233 is performed above the pusher 251. The loading rod 231 and the substrate W clamped by the clamping rod 232 approach the pusher 251, but at this time, the flat plate 233 does not collide with the substrate W held by the pusher 251. Figure 12B 、 Figure 12C It can be understood that the plate 233 is retracted relative to the substrate W by the rotation of the placement rod 231. The placement rod 231 has an arrangement surface SF1 on which the plate 233 is arranged and a flat surface SF2 on which the plate 233 is not arranged. The rod driving mechanism 235 rotates the placement rod 231 about a central axis parallel to the arrangement direction of the plate 233 (the extending direction of the placement rod 231).

[0132] Thus, the HVC posture changing unit 23 moves the plate 233 at the contact position POS1 to the retreat position POS2 (see FIG. 1 ) where the plate 233 is retreated from the gap between the substrates W. Figure 12A 、 Figure 12C ), the contact position POS1 is a position where the substrate W in a horizontal posture can contact when the pushing mechanism 25 performs batch assembly. Figure 11E The pusher 251 does not clamp the substrate W, so the rotation of the plate 233 can be omitted.

[0133] Figure 13The following figure shows the situation when the pusher 251 is subsequently raised. As a result, the bottom of the substrate W, clamped by the clamping rods 232, fits into the clamping grooves 252 of the pusher 251. If the pusher 251 is further raised in this state, the substrate W is removed from the clamping plates 234 of the clamping rods 232. In this manner, the substrate W is transferred from the HVC posture changing unit 23 to the pushing mechanism 25.

[0134] Thereafter, the pusher 251 rises to an upper position UR set above the placement rod 231. The pusher 251 at the upper position UR does not collide with the placement rod 231 that has returned to its upright state. Figure 13 The case where the loading rod 231 and the clamping rod 232 are moved to the imaginary position IR shown by the dotted line by the rotation drive mechanism 239 is also described. At this time, the loading rod 231 rotates in the reverse direction and returns to the position IR. Figure 12B In addition, the retracted loading rod 231 returns to Figure 12A When understanding the reverse action and extension action of the loading rod 231, reference can be made to Figure 14 .

[0135] Figure 14 (a) shows that the loading rod 231 is Figure 13 In this state, the plate 233 is located at the retreat position POS2. In this state, the substrate W cannot be placed on the placement rod 231. Figure 14 As shown in (b), the loading rod 231 is rotated. As a result, the loading rod 231 faces the direction of the space where the substrate W is located. However, in this state, the position of the loading rod 231 is too low, and the substrate W cannot be loaded on the loading rod 231. Therefore, as shown in FIG. Figure 14 As shown in (c), the loading rod 231 is extended. As a result, the flat plate 233 of the loading rod 231 rises to the height of the clamping plate 234 of the clamping rod 232. In this state, the flat plate 233 is at the contact position POS1. If a substrate W is placed on the flat plate 233 in this state, the end of the substrate W is clamped by the clamping plate 234, which is located at the same height as the flat plate 233, allowing the HVC posture changer 23 to receive the desired substrate W. The above actions complete the HVC posture changer 23's preparation for receiving the substrate W.

[0136] In this way, the substrates W arranged at a pitch of 20 mm are handed over from the HVC posture changing unit 23 to the pushing mechanism 25. At this time, the clamping grooves 252 in the pushing member 251 have grooves for clamping the substrates W and empty grooves that do not clamp the substrates W. The grooves for clamping the substrates W are separated from each other by 6 times the arrangement pitch of the clamping grooves 252. This is because the arrangement pitch of the clamping grooves 252 is 10 / 3 mm. The arrangement pitch of the substrates W of 20 mm is equivalent to exactly 6 times the arrangement pitch of the clamping grooves 252. For the sake of convenience, the substrates W arranged on the pushing member 251 at this time are referred to as the initial substrate group, or simply referred to as the initial substrate W0.

[0137] Figure 15A The pusher 251 that has been lowered and returned to its initial position is rotated half a circle by the pusher rotating mechanism 253. The pusher 251 facing the left is called the L state. Figure 13 The push member 251 is in the R state facing right. Figure 15A The half-rotation in is called the first half-rotation r1. Figure 15A The dotted line also illustrates how the substrates W remaining on the first carrier C1 and arranged at a 20 mm pitch are transported to the HVC posture changing unit 23. This transport is achieved by the transfer robot HTR having hands 211 arranged at a 20 mm pitch.

[0138] Figure 15B It shows the situation when the substrate W held by the HVC posture changing unit 23 is handed over to the pusher 251. Figure 11D The tilting of the loading rod 231 and the clamping rod 232 and the contraction of the loading rod 231 are described in detail. Figure 15B Also omitted Figure 11E The rotation of the loading rod 231 described in Figure 13 The insertion of the substrate W into the pusher 251, the ascent and descent of the pusher 251, the rising action of the placement rod 231 and the clamping rod 232, the extension action of the placement rod 231, and the reverse action of the placement rod 231 are described in detail.

[0139] Reference Figure 15B It can be seen that in this case, the substrates W arranged at a pitch of 20 mm are not changed in their pitch and are delivered to the pusher 251. When the substrate W is delivered from the HVC posture changer 23 to the push mechanism 25, the substrate W is delivered to any one of the clamping grooves 252 of the pusher 251. The clamping groove 252 in which the initial substrate group is already embedded cannot further clamp the substrate W. Therefore, the substrate W held by the HVC posture changer 23 is transported to a position that deviates from the initial substrate group in the arrangement of the clamping grooves 252 by one pitch and is embedded in the clamping groove 252 at this time. Such alignment of the substrate W and the pusher 251 is achieved by the pusher shifting mechanism 254.

[0140] In this way, the substrates W arranged at a pitch of 20 mm are delivered from the HVC posture changing unit 23 to the pushing mechanism 25. At this time, the pushing member 251 is alternately provided with a region having two consecutive clamping grooves 252 for clamping the substrate W and a region having four consecutive empty grooves without clamping the substrate W. Figure 15B In the figure, for the convenience of description, the substrates W newly arranged on the pusher 251 are referred to as the first arrangement or simply as the first substrates W1 .

[0141] In this way, the pushing mechanism 25 combines the first substrate W1 in the vertical posture maintained by the HVC posture changing unit 23 using the clamping rod 232 with the initial substrate W0 in the vertical posture previously handed over from the HVC posture changing unit 23, so that the substrates W are arranged in the left-right direction Y with an arrangement pitch narrower than 10 mm.

[0142] Figure 15C The pusher 251 is rotated half a circle by the pusher rotating mechanism 253. At this time, the pusher 251 is in the R state. Figure 15C The half rotation in is called the second half rotation r2. Figure 15A The dotted line also illustrates the transfer of substrates W from the second carrier C2 to the HVC posture changer 23. The second carrier C2 is a new carrier that is transferred to the carrier placement shelf 13a by the carrier transfer mechanism 11, replacing the empty first carrier C1. The second carrier C2 accommodates 25 substrates W arranged at 10 mm pitch. Substrates W arranged at 20 mm pitch are removed from the second carrier C2 and transferred to the HVC posture changer 23. This transfer is performed by a transfer robot HTR having hands 211 arranged at 20 mm pitch.

[0143] Figure 15D This shows the situation when the substrate W held by the HVC posture changing unit 23 is transferred to the pusher 251. Figure 11D The specific actions of the tilting of the loading rod 231 and the clamping rod 232 are described in Figure 15B The same is omitted.

[0144] Reference Figure 15D As can be seen, even in this case, the substrates W arranged at a 20 mm pitch are delivered to the pusher 251 without changing their pitch. The gripping grooves 252 of the pusher 251, where the substrates W of the first arrangement of the substrate group are already inserted, are unable to grip any further substrates W. Therefore, the substrate W held by the HVC posture changer 23 is transported to a position offset by one pitch from the arrangement of the gripping grooves 252 of the first arrangement of substrates W, and is inserted into the gripping grooves 252 at that location. This alignment of the substrate W and the pusher 251 is achieved by the pusher shifting mechanism 254.

[0145] In this way, the substrates W arranged at a pitch of 20 mm are delivered from the HVC posture changing unit 23 to the pushing mechanism 25. At this time, the pushing member 251 is alternately provided with three consecutive areas of clamping grooves 252 for clamping substrates W and three consecutive areas of empty grooves without clamping substrates W. Figure 15D For the sake of convenience, the substrates W newly arranged on the pusher 251 are referred to as the second arrangement or simply as the second substrates W2 .

[0146] In this way, the pushing mechanism 25 combines the second substrate W2 in a vertical posture maintained by the HVC posture changing unit 23 using the clamping rod 232, the initial substrate W0 in a vertical posture previously transferred from the HVC posture changing unit 23, and the first substrate W1, so that the substrates W are arranged in the left-right direction Y with an arrangement pitch narrower than 10 mm.

[0147] Figure 15E The pusher 251 is shown as a half-turn through the pusher rotating mechanism 253. At this time, the pusher 251 is in the L state. Figure 15E The half rotation in is called the third half rotation r3. Figure 15E The dotted lines also illustrate the transfer of substrates W remaining on the second carrier C2 to the HVC posture changer 23. The substrates W remaining on the second carrier C2 are arranged at a 20 mm pitch. This transfer is achieved by the transport robot HTR having hands 211 arranged at a 20 mm pitch.

[0148] Figure 15F This shows the situation when the substrate W held by the HVC posture changing unit 23 is transferred to the pusher 251. Figure 11D The specific actions of the tilting of the loading rod 231 and the clamping rod 232 are described in Figure 15B The same is omitted.

[0149] Reference Figure 15F As can be seen, even in this case, the substrates W arranged at a 20 mm pitch are delivered to the pusher 251 without changing their pitch. The gripping grooves 252 of the pusher 251, where the substrates W of the initial substrate group, the first array, and the second array are already embedded, are unable to grip any further substrates W. Therefore, the substrate W held by the HVC posture changer 23 is transported to a position offset by one pitch from the second array of substrates W in the gripping grooves 252 and is then embedded in the existing gripping grooves 252. This alignment of the substrate W and the pusher 251 is achieved by the pusher shifting mechanism 254.

[0150] In this way, the substrates W arranged at a pitch of 20 mm are delivered from the HVC posture changing unit 23 to the pushing mechanism 25. At this time, the pushing member 251 is alternately provided with a region having four consecutive clamping grooves 252 for clamping the substrates W and a region having two consecutive empty grooves without clamping the substrates W. Figure 15F In the figure, for the convenience of description, the substrate W newly arranged on the pusher 251 is referred to as a third arrangement or simply as a third substrate W3.

[0151] In this way, the pushing mechanism 25 combines the third substrate W3 in the vertical posture maintained by the HVC posture changing part 23 using the clamping rod 232, and the initial substrate W0 in the vertical posture previously handed over from the HVC posture changing part 23, the first substrate W1, and the second substrate W2, so that the substrates W are arranged in the left-right direction Y with an arrangement spacing narrower than 10 mm.

[0152] Figure 15G The pusher 251 is rotated half a circle by the pusher rotating mechanism 253. At this time, the pusher 251 is in the R state. Figure 15G The half rotation in is called the fourth half rotation r4. Figure 15G The dotted lines also illustrate the transfer of substrates W from the third carrier C3 to the HVC posture changer 23. The third carrier C3 is a new carrier that is transferred to the carrier placement shelf 13a by the carrier transfer mechanism 11, replacing the empty second carrier C2. The third carrier C3 accommodates 25 substrates W arranged at 10 mm pitch. Substrates W arranged at 20 mm pitch are removed from the third carrier C3 and transferred to the HVC posture changer 23. This transfer is performed by a transfer robot HTR having hands 211 arranged at 20 mm pitch.

[0153] Figure 15H This shows the situation when the substrate W held by the HVC posture changing unit 23 is transferred to the pusher 251. Figure 11D The specific actions of the tilting of the loading rod 231 and the clamping rod 232 are described in Figure 15B The same is omitted.

[0154] Reference Figure 15H As can be seen, even in this case, the substrates W arranged at a 20 mm pitch are delivered to the pusher 251 without changing their pitch. The gripping grooves 252 of the pusher 251, where the substrates W of the initial substrate group, the first row, the second row, and the third row are already inserted, are unable to grip any further substrates W. Therefore, the substrate W held by the HVC posture changer 23 is transported to a position offset by one pitch from the arrangement of the gripping grooves 252 of the substrates W in the third row, and is inserted into the existing gripping grooves 252. This alignment of the substrate W and the pusher 251 is achieved by the pusher shifting mechanism 254.

[0155] In this way, the substrates W arranged at a pitch of 20 mm are delivered from the HVC posture changing unit 23 to the pushing mechanism 25. At this time, the clamping grooves 252 in the pushing member 251 have grooves for clamping substrates W and empty grooves for not clamping substrates W. The empty grooves are separated by 6 times the arrangement pitch of the clamping grooves 252. Figure 15H For the sake of convenience, the substrate W newly arranged on the pusher 251 is referred to as a fourth arrangement or simply as a fourth substrate W4.

[0156] In this way, the pushing mechanism 25 combines the fourth substrate W4 in the vertical posture maintained by the HVC posture changing part 23 using the clamping rod 232, and the initial substrate W0, the first substrate W1, the second substrate W2, and the third substrate W3 in the vertical posture previously handed over from the HVC posture changing part 23, so that the substrates W are arranged in the left-right direction Y with an arrangement spacing narrower than 10 mm.

[0157] Figure 15I The pusher 251 is shown as a half-turn through the pusher rotating mechanism 253. At this time, the pusher 251 is in the L state. Figure 15I The half rotation in is called the fifth half rotation r5. Figure 15I The dotted lines also illustrate the transfer of substrates W remaining on the third carrier C3 to the HVC posture changer 23. The substrates W remaining on the third carrier C3 are arranged at a 20 mm pitch. This transfer is achieved by a transport robot HTR having hands 211 arranged at a 20 mm pitch.

[0158] Figure 15J This shows the situation when the substrate W held by the HVC posture changing unit 23 is transferred to the pusher 251. Figure 11D The specific actions of the tilting of the loading rod 231 and the clamping rod 232 are described in Figure 15B The same is omitted.

[0159] Reference Figure 15J It can be seen that even in this case, the substrates W arranged at a 20 mm pitch are delivered to the pusher 251 without changing their pitch. The clamping grooves 252 of the pusher 251, where the substrates W of the initial substrate group, the first row, the second row, the third row, and the fourth row are already embedded, are unable to clamp any further substrates W. Therefore, the substrate W held by the HVC posture changer 23 is transported to a position offset by one pitch from the arrangement of the clamping grooves 252 of the substrate W in the fourth row, and is embedded in the clamping groove 252 at that location. This alignment of the substrate W and the pusher 251 is achieved by the pusher shifting mechanism 254.

[0160] In this way, the substrates W arranged at a pitch of 20 mm are delivered from the HVC posture changing unit 23 to the pushing mechanism 25. At this time, the clamping grooves 252 of the pushing member 251 all clamp the substrates W. Figure 15J For the sake of convenience, the substrate W newly arranged on the pusher 251 is referred to as the fifth arrangement or simply the fifth substrate W5 .

[0161] In this way, the pushing mechanism 25 combines the fifth substrate W5 in the vertical posture maintained by the HVC posture changing part 23 using the clamping rod 232, and the initial substrate W0 in the vertical posture previously transferred from the HVC posture changing part 23, the first substrate W1, the second substrate W2, the third substrate W3, and the fourth substrate W4, so that the substrates W are arranged in the left-right direction Y with an arrangement spacing narrower than 10 mm.

[0162] In this way, 75 substrates W are arranged at a pitch of 10 / 3 mm on the pusher 251. The substrate line thus generated is referred to as a batch BL.

[0163] 5. Batches consisting of transfer blocks

[0164] Figure 16 The orientation of the substrates W in batch BL is described below. In batch BL, the initial substrate W0 from the first carrier C1, the first substrate W1 from the first carrier C1, the second substrate W2 from the second carrier C2, the third substrate W3 from the second carrier C2, the fourth substrate W4 from the third carrier C3, and the fifth substrate W5 from the third carrier C3 are arranged repeatedly in this order with a pitch of 10 / 3 mm. The initial substrate W0, the second substrate W2, and the fourth substrate W4 are received from the HVC posture changer 23 by the pusher 251 in the rightward-facing R state, so the orientations of these substrates W are unified in one direction. On the other hand, the first substrate W1, the third substrate W3, and the fifth substrate W5 are received from the HVC posture changer 23 by the pusher 251 in the leftward-facing L state, so the orientations of these substrates are unified in the opposite direction.

[0165] That is, the device surface of the first substrate W1 faces the front surface of the initial substrate W0, the back surface of the second substrate W2 faces the back surface of the first substrate W1, the device surface of the third substrate W3 faces the device surface of the second substrate W2, the back surface of the fourth substrate W4 faces the back surface of the third substrate W3, the device surface of the fifth substrate W5 faces the device surface of the fourth substrate W4, and the back surface of the fifth substrate W5 faces the back surface of the initial substrate W0. In this way, the batch BL completed by the pusher 251 is formed by arranging the substrates W in a face-to-face manner.

[0166] If the substrates W are transferred while the pusher 251 is rotated as in this example, the initial substrate W0, the first substrate W1, the second substrate W2, the third substrate W3, the fourth substrate W4, and the fifth substrate W5, whose orientations are all unified in one direction, can be arranged face to face to generate a batch BL.

[0167] Next, the relationship between the clamping groove 252 of the pusher 251 and the substrates W will be described. The positions where the clamping groove 252 is located include six positions: the reference position P for the initial substrate W0; the first position P1 for the first substrate W1; the second position P2 for the second substrate W2; the third position P3 for the third substrate W3; the fourth position P4 for the fourth substrate W4; and the fifth position P5 for the fifth substrate W5. The reference positions P are arranged at 20 mm intervals within the pusher 251. The first position P1, second position P2, third position P3, fourth position P4, and fifth position P5 divide the 20 mm between the reference positions P into six equal parts. Specifically, the 20 mm between the reference positions P is divided into six equal parts by the first position P1, second position P2, third position P3, fourth position P4, and fifth position P5. Therefore, the distance from the reference position P to the first position P1 is 1 / 3 of the 10 mm arrangement pitch of the substrates W in the carrier C, or 10 / 3 mm. Similarly, the distance from the first position P1 to the second position P2, the distance from the second position P2 to the third position P3, the distance from the third position P3 to the fourth position P4, the distance from the fourth position P4 to the fifth position P5, and the distance from the fifth position P5 to the reference position P are all 10 / 3 mm.

[0168] Moreover, the substrate W facing in one direction is located at the reference position P, the substrate W facing in the opposite direction is located at the first position P1, the substrate W facing in one direction is located at the second position P2, the substrate W facing in the opposite direction is located at the third position P3, the substrate W facing in one direction is located at the fourth position P4, and the substrate W facing in the opposite direction is located at the fifth position P5.

[0169] 6. Maintaining batches in transfer blocks

[0170] The transfer block 5 has two locations capable of holding a batch BL. One of these locations is a pusher 251. The pusher 251 is capable of reciprocating between an initial position, where it can transfer substrates W to the HVC posture changer 23, and a transfer position PP, where it can transfer the batch BL to the forward / retractable transport mechanism WTR. This reciprocating movement is achieved by a pusher shifting mechanism 254.

[0171] The transfer block 5 includes a batch support portion 33 as a portion capable of holding the batch BL separately from the pusher 251. The batch support portion 33 serves as a batch holding portion for temporarily evacuating the batch BL when congestion of the batch BL occurs between the transfer block 5 and the processing block 6.

[0172] 7. Processing Blocks

[0173] The following, Figure 1 The structure of the processing block 6 described in [ 1 ] will now be described. The processing block 6 is adjacent to the transfer block 5. The processing block 6 performs batch processing on the aforementioned batch BL. The processing block 6 is divided into a batch processing area R1 and a collective transfer area R2, which are arranged along the width direction (Y direction). Each area extends along the front-to-back direction (X direction). Specifically, the batch processing area R1 is located within the processing block 6. The collective transfer area R2 is adjacent to the batch processing area R1 and is located at the leftmost side of the processing block 6.

[0174] The batch processing area R1 in the processing block 6 is a rectangular area extending in the front-to-back direction (X direction). One end (front side) of the batch processing area R1 is adjacent to the transfer block 5. The other end (rear side) of the batch processing area R1 extends away from the transfer block 5. When the batch BL is transferred from the transfer block 5 to the processing block 6, the forward and backward transfer mechanism WTR of the processing block 6 is used.

[0175] The forward and backward transport mechanism WTR collectively transports a plurality of substrates W in a vertical position between the transfer block 5, the batch processing units BPU1 to BPU6, and the batch drying chamber DC. The forward and backward transport mechanism WTR can hold a batch BL consisting of substrates W arranged at a 10 / 3 mm pitch.

[0176] Batch processing region R1 includes a batch processing section for performing batch processing. Specifically, batch processing region R1 includes a batch drying chamber DC for drying multiple substrates W collectively, and a plurality of batch processing units BPU1 to BPU6 for performing immersion processing on multiple substrates W collectively, arranged in the direction in which batch processing region R1 extends. Batch processing units BPU1 to BPU6 collectively perform immersion processing on multiple substrates in a vertical position. The configuration of batch drying chamber DC and batch processing units BPU1 to BPU6 will be described in detail. Batch drying chamber DC is adjacent to transfer block 5 from the rear. First batch processing unit BPU1 is adjacent to batch drying chamber DC from the rear. Second batch processing unit BPU2 is adjacent to first batch processing unit BPU1 from the rear. Third batch processing unit BPU3 is adjacent to second batch processing unit BPU2 from the rear. Fourth batch processing unit BPU4 is adjacent to third batch processing unit BPU3 from the rear. Fifth batch processing unit BPU5 is adjacent to fourth batch processing unit BPU4 from the rear. The sixth batch processing unit BPU6 is adjacent to the rear of the fifth batch processing unit BPU5. Therefore, the batch drying chamber DC, the first batch processing unit BPU1, the second batch processing unit BPU2, the third batch processing unit BPU3, the fourth batch processing unit BPU4, the fifth batch processing unit BPU5, and the sixth batch processing unit BPU6 are arranged in a manner that they are sequentially away from the transfer block 5.

[0177] Batch processing units BPU1-BPU6 have batch processing tanks capable of holding liquids. These batch processing tanks hold chemical solutions or pure water. Chemical solutions are acidic aqueous solutions, such as phosphoric acid solutions. In this manual, chemical solutions and pure water are collectively referred to as processing liquids. Batch processing tanks holding chemical solutions are referred to as batch chemical processing tanks CHB2-CHB6, and batch processing tanks holding pure water are referred to as batch rinse processing tanks ONB.

[0178] Specifically, the second batch processing unit BPU2 includes: a batch chemical liquid processing tank CHB2, which performs chemical liquid processing on the batch BL at a time; and a lifter LF2, which lifts the batch BL between the substrate transfer position and the chemical liquid processing position (see Figure 2 The substrate transfer position is set above the batch chemical liquid treatment tank CHB2 accessible to the forward and backward transport mechanism WTR, and the chemical liquid treatment position is set within the tank of the batch chemical liquid treatment tank CHB2 capable of immersing the batch BL in the chemical liquid. The batch chemical liquid treatment tank CHB2 performs an acid treatment on the batch BL. The acid treatment may be a phosphoric acid treatment or a treatment using another acid. The phosphoric acid treatment performs an etching treatment on the plurality of substrates W constituting the batch BL. The etching treatment, for example, chemically etches the nitride film on the surface of the substrate W.

[0179] The lifter LF2 can hold a batch BL consisting of substrates W arranged at a 10 / 3 mm pitch. Like the lifter LF2, lifters installed in other processing tanks can also hold the batch BL. The batch drying chamber DC can accommodate the batch BL.

[0180] The batch chemical liquid treatment tank CHB2 contains an acid solution such as a phosphoric acid solution. The batch chemical liquid treatment tank CHB2 is provided with a lifter LF2 for moving the batch BL up and down. The lifter LF2 is raised and lowered in the vertical direction (Z direction). Specifically, the lifter LF2 is raised and lowered between a processing position corresponding to the interior of the batch chemical liquid treatment tank CHB2 and a transfer position corresponding to the top of the batch chemical liquid treatment tank CHB2. The lifter LF2 holds the batch BL consisting of substrates W in a vertical posture. The lifter LF2 transfers the batch BL between the transfer position and the forward and backward transport mechanism WTR. When the lifter LF2 descends from the transfer position to the processing position while holding the batch BL, the entire area of the substrate W is located below the liquid surface of the chemical liquid. When the lifter LF2 ascends from the processing position to the transfer position while holding the batch BL, the entire area of the substrate W is located above the liquid surface of the chemical liquid. The lifter LF2 can immerse the batch BL in the batch treatment tank at once. At this time, the lifter LF2 descends from the transfer position to the processing position.

[0181] Specifically, the third batch processing unit BPU3 includes a batch chemical liquid treatment tank CHB3 and a lifter LF3 that lifts the batch BL between the substrate handover position and the chemical liquid treatment position. The batch chemical liquid treatment tank CHB3 has the same structure as the above-mentioned batch chemical liquid treatment tank CHB2. That is, the batch chemical liquid treatment tank CHB3 contains the above-mentioned chemical liquid and is provided with a lifter LF3. The batch chemical liquid treatment tank CHB3 performs the same treatment on the batch BL as the batch chemical liquid treatment tank CHB2. The substrate processing device 1 of this example includes a plurality of treatment tanks that can perform the same chemical liquid treatment. This is because phosphoric acid treatment takes time compared to other treatments. Phosphoric acid treatment takes a long time (for example, 60 minutes). Therefore, the device of this example can perform acid treatment in parallel through a plurality of batch chemical liquid treatment tanks.

[0182] The structures of the fourth through sixth batch processing units BPU4 to BPU6 are identical to those of the second and third batch processing units BPU2 and BPU3. Specifically, the fourth batch processing unit BPU4 includes a batch chemical liquid treatment tank CHB4 and a lifter LF4 for raising and lowering the batch BL between the substrate transfer position and the chemical liquid treatment position. Similarly, the fifth batch processing unit BPU5 includes a batch chemical liquid treatment tank CHB5 and a lifter LF5 for raising and lowering the batch BL between the substrate transfer position and the chemical liquid treatment position. Furthermore, the sixth batch processing unit BPU6 includes a batch chemical liquid treatment tank CHB6 and a lifter LF6 for raising and lowering the batch BL between the substrate transfer position and the chemical liquid treatment position. Therefore, the batch BL undergoes acid treatment in any of the batch chemical liquid treatment tanks CHB2 to CHB6. By performing chemical liquid treatment in parallel across five processing units in this manner, the productivity of the apparatus is improved.

[0183] Specifically, the first batch processing unit BPU1 includes a batch rinse processing tank ONB that contains rinse liquid and a lifter LF1 for raising and lowering the batch BL between a substrate transfer position and a rinse position. The substrate transfer position is set above the batch rinse processing tank ONB, which is accessible by the forward and backward transport mechanism WTR, and the rinse position is set within the tank of the batch rinse processing tank ONB, which allows the batch BL to be immersed in the rinse liquid. The batch rinse processing tank ONB has the same structure as the batch chemical liquid processing tank CHB2 described above. That is, the batch rinse processing tank ONB contains rinse liquid and is equipped with a lifter LF1. Unlike other processing tanks, the batch rinse processing tank ONB contains pure water and is provided for the purpose of cleaning chemical liquid attached to multiple substrates W. In the batch rinse processing tank ONB, the cleaning process is completed when the resistivity of the pure water in the tank rises to a predetermined value.

[0184] Thus, the batch rinsing tank ONB in this embodiment is located closer to the transfer block 5 than the batch chemical liquid treatment tanks CHB2 through CHB6. This configuration minimizes the separation of the various mechanisms comprising the transfer block 5 from the batch chemical liquid treatment tanks CHB2 through CHB6, preventing the pusher mechanism 25 and other components from being adversely affected by acids such as phosphoric acid. Furthermore, the proximity of the transfer block 5 to the batch drying chamber DC allows the batch BL, after completing the rinsing process, to be transported a short distance and promptly returned to the transfer block 5.

[0185] 8. Collective transport area in the processing block

[0186] The batch transfer area R2 in the processing block 6 is a rectangular area extending in the front-to-back direction (X direction). The batch transfer area R2 is provided along the outer edge of the batch processing area R1, with one end extending to the transfer block 5 and the other end extending away from the transfer block 5.

[0187] The collective transfer area R2 is equipped with a forward / backward transfer mechanism WTR for collectively transporting multiple substrates W. The forward / backward transfer mechanism WTR collectively transports multiple substrates W (specifically, batches BL) between the substrate transfer position PP, the batch support 33, the batch drying chamber DC, and each batch processing unit BPU1 to BPU6, defined within the transfer block 5. The forward / backward transfer mechanism WTR is configured to move back and forth in the front-to-back direction (X direction) across the transfer block 5 and the processing block 6. In addition to being able to enter the collective transfer area R2 within the processing block 6, the forward / backward transfer mechanism WTR can also enter the substrate transfer position PP and the batch support 33 within the transfer block 5.

[0188] The forward and backward transport mechanism WTR is equipped with a pair of chucks 29 for transporting the batch BL. The pair of chucks 29 can be changed into a closed state approaching each other and an open state moving away from each other. The chuck 29 is a component extending in the Y direction with grooves for holding the substrate W arranged at a pitch of 10 / 3 mm. The pair of chucks 29 is in a closed state to receive the multiple substrates W constituting the batch BL. Then, the pair of chucks 29 is in an open state to hand over the multiple substrates W constituting the batch BL to other components (elevator LF1, etc.). The forward and backward transport mechanism WTR hands over the batch BL between the substrate handover position PP in the transfer block 5 and the batch support part 33. In addition, the forward and backward transport mechanism WTR hands over the batch BL between the lifters LF1 to LF6 of the batch processing units BPU1 to BPU6 in the processing block 6 and the batch drying chamber DC.

[0189] The collective transport region R2 is equipped with a guide rail 31 extending in the X direction to guide the forward / retractable transport mechanism WTR. The forward / retractable transport mechanism WTR can move forward and backward in the X direction along this guide rail 31. Therefore, the guide rail 31 extends from the processing block 6 to the transfer block 5. More specifically, the guide rail 31 faces the substrate transfer position PP in the transfer block 5 from the Y direction and the sixth batch processing unit BPU6 in the processing block 6 from the Y direction. Furthermore, the guide rail 31 faces the batch support 33 in the transfer block 5, the batch drying chamber DC in the processing block 6, and the first to sixth batch processing units BPU1 to BPU6 from the Y direction.

[0190] 9. Other structures in the processing block

[0191] The batch drying chamber DC is arranged at a position sandwiched between the first batch processing unit BPU1 and the transfer block 5. The batch drying chamber DC has a drying chamber for accommodating a batch BL in which substrates W are arranged in a vertical posture. The drying chamber has an inert gas supply nozzle for supplying an inert gas into the chamber and a vapor supply nozzle for supplying vapor of an organic solvent into the tank. The batch drying chamber DC first supplies an inert gas to the batch BL supported in the chamber, replacing the atmosphere in the chamber with the inert gas. Then, the decompression in the chamber is started. In the state where the chamber is decompressed, vapor of an organic solvent is supplied into the chamber. The organic solvent is discharged to the outside of the chamber along with the moisture attached to the substrate W. In this way, the batch drying chamber DC performs drying of the batch BL. At this time, the inert gas may be, for example, nitrogen, and the organic solvent may be, for example, IPA (isopropyl alcohol).

[0192] The carrier loading shelf 13a, batch drying chamber DC, and batch processing units BPU1-BPU6 in the substrate processing apparatus 1 are arranged in a front-to-back direction. Specifically, the carrier loading shelf 13a is located in the front, with the batch drying chamber DC located behind it. Batch processing units BPU1-BPU6 are located further behind it. The substrate processing apparatus 1 of this embodiment optimizes the internal layout of the apparatus to minimize the travel distance of the forward / reverse transport mechanism WTR.

[0193] 10. Control Department

[0194] The control unit 131 of the substrate processing apparatus 1 can be referred to Figure 1 In addition, although Figure 1 Although not shown in the figure, a corresponding storage unit is provided in the control unit 131. The control unit 131 is composed of, for example, a CPU (Central Processing Unit). The specific structure of the control unit is not limited. For example, each control unit can be composed of a single processor or each control unit can be composed of separate processors.

[0195] Examples of controls performed by the control unit 131 include controls related to the carrier transport mechanism 11 , the transport robot HTR, the HVC posture changing unit 23 , the pushing mechanism 25 , the forward and backward transport mechanism WTR, the batch processing units BPU1 to BPU6 , and the batch drying chamber DC.

[0196] The storage unit stores control-related programs, parameters, etc. The storage unit can be composed of a single device or a separate device corresponding to each control unit. In addition, the substrate processing system of this embodiment does not specifically limit the structure of the device that realizes the storage unit.

[0197] 11. Substrate processing process

[0198] Below, refer to Figure 17 、 Figure 18The flowchart of the substrate processing in this example is described.

[0199] Step S10: The transport robot HTR extracts every other initial substrate W0 from the first carrier C1. The extracted initial substrates W0 are arranged at a pitch of 20 mm.

[0200] Initially, the substrate W0 is changed from the horizontal posture to the vertical posture. The substrate W0 in the vertical posture is first received by the pusher 251 .

[0201] Step S11 : The transport robot HTR extracts the remaining first substrates W1 from the first carrier C1 . The first substrates W1 are also arranged at a pitch of 20 mm. The first substrates W1 are received by the HVC posture changing unit 23 .

[0202] Step S12: The pusher 251 of the initial substrate group is rotated half a circle while maintaining the vertical posture, thereby orienting the initial substrate group in one direction.

[0203] Step S13: The initial substrate W0 and the first substrate W1 are batched together on the pusher 251. A first arrangement of the first substrates W1, facing in opposite directions and spaced 20 mm apart, is combined with the initial substrate group, positioning the first substrates W1 at the first position P1 of the pusher 251. This arrangement positions the initial substrate W0 and the first substrate W1 at a 10 / 3 mm interval, with their device surfaces facing each other. Step S13 corresponds to the first assembly process of the present invention.

[0204] Step S14 : The transport robot HTR extracts every other second substrate W2 from the second carrier C2 . The extracted second substrates W2 are arranged at a pitch of 20 mm. The second substrates W2 are taken in by the HVC posture changing unit 23 .

[0205] Step S15 : performing a half-turn rotation of the pusher 251 holding the initial substrate W0 and the first substrate W1 .

[0206] Step S16: The pusher 251 performs a batch assembly of the substrate row consisting of the initial substrate W0, the first substrate W1, and the second substrate W2. A second row of second substrates W2, arranged in a direction with 20 mm intervals, is assembled with the substrate row in the pusher 251. The second substrates W2 are positioned at the second position P2 of the pusher 251. As a result, the first and second substrates W1 and W2 are arranged with their back surfaces facing each other at a 10 / 3 mm interval.

[0207] Step S17 : The transport robot HTR extracts the remaining third substrates W3 from the second carrier C2 . The third substrates W3 are arranged at a pitch of 20 mm. The third substrates W3 are taken in by the HVC posture changing unit 23 .

[0208] Step S18 : performing a half-turn rotation of the pusher 251 holding the initial substrate W0 , the first substrate W1 , and the second substrate W2 .

[0209] Step S19: The pusher 251 batches the substrate row consisting of the initial substrate W0, the first substrate W1, and the second substrate W2, with the third substrate W3. The third row, with the third substrates W3 facing in opposite directions and spaced 20 mm apart, is then combined with the substrate row in the pusher 251. The third substrates W3 are positioned at a third position P3 on the pusher 251. This results in the second and third substrates W2 and W3 being arranged with their device surfaces facing each other, spaced 10 / 3 mm apart.

[0210] Step S20 : The transport robot HTR extracts every other fourth substrate W4 from the third carrier C3 . The extracted fourth substrates W4 are arranged at a pitch of 20 mm. The fourth substrates W4 are received by the HVC posture changing unit 23 .

[0211] Step S21 : performing a half-turn rotation of the pusher 251 holding the initial substrate W0 , the first substrate W1 , the second substrate W2 , and the third substrate W3 .

[0212] Step S22: The pusher 251 batches the substrate row consisting of the initial substrate W0, the first substrate W1, the second substrate W2, and the third substrate W3, with the fourth substrate W4. The fourth row, in which the fourth substrates W4 are arranged in a direction with 20 mm intervals, is combined with the substrate row in the pusher 251. The fourth substrates W4 are positioned at a fourth position P4 on the pusher 251. As a result, the third and fourth substrates W3 and W4 are arranged with their back surfaces facing each other, at a 10 / 3 mm interval.

[0213] Step S23 : The transport robot HTR extracts the remaining fifth substrates W5 from the third carrier C3 . The fifth substrates W5 are arranged at a pitch of 20 mm. The fifth substrates W5 are received by the HVC posture changing unit 23 .

[0214] Step S24 : performing a half-turn rotation of the pusher 251 holding the initial substrate W0 , the first substrate W1 , the second substrate W2 , the third substrate W3 , and the fourth substrate W4 .

[0215] Step S25: The pusher 251 batches the substrate row consisting of the initial substrate W0, the first substrate W1, the second substrate W2, the third substrate W3, and the fourth substrate W4, with the fifth substrate W5. The fifth row, consisting of the fifth substrates W5 facing in opposite directions and spaced 20 mm apart, is then combined with the substrate row in the pusher 251. The fifth substrate W5 is positioned at the fifth position P5 of the pusher 251. As a result, the fourth and fifth substrates W4 and W5 are arranged with their device surfaces facing each other, spaced 10 / 3 mm apart.

[0216] Step S31 : The generated lot BL is transported from the transfer block 5 to the processing block 6 by the forward and backward transport mechanism WTR.

[0217] Step S32: Perform chemical liquid treatment on the batch BL.

[0218] Step S33: Perform a flushing process on the batch BL.

[0219] Step S34: Drying the batch BL.

[0220] In this way, substrate processing is achieved in batch units.

[0221] Figure 18 The flowchart is shown when the lot BL after substrate processing is returned to the carrier C. The returning operation of the substrate W is basically a time-reversal of the above-mentioned method.

[0222] Step S41 : The lot BL on which the substrates have been processed is transported from the processing block 6 to the transfer block 5 by the forward and backward transport mechanism WTR.

[0223] Step S42: After the pusher 251 obtains the batch BL, it rotates half a circle. Through this action, the fifth substrate W5 facing the opposite direction is directed to one direction.

[0224] Step S43 : The HVC posture changing unit 23 receives the fifth substrate W5 from the batch BL in the pusher 251 and breaks the batch BL.

[0225] Step S44 : After the posture of the fifth substrate W5 is changed by the HVC posture changing unit 23 , the fifth substrate W5 is returned to the third carrier C3 by the transport robot HTR.

[0226] Step S45: The pusher 251 rotates half a circle. Through this action, the fourth substrate W4 facing the opposite direction is directed in one direction.

[0227] Step S46 : The HVC posture changing unit 23 receives the fourth substrate W4 from the batch BL in the pusher 251 and breaks the batch BL.

[0228] Step S47 : After the fourth substrate W4 undergoes posture change by the HVC posture changer 23 , it is returned to the third carrier C3 by the transport robot HTR.

[0229] Step S48: The pusher 251 rotates half a circle. Through this action, the third substrate W3 facing the opposite direction is directed to one direction.

[0230] Step S49 : The HVC posture changing unit 23 receives the third substrate W3 from the batch BL in the pusher 251 and breaks the batch BL.

[0231] Step S50 : After the third substrate W3 undergoes posture change by the HVC posture changer 23 , it is returned to the second carrier C2 by the transport robot HTR.

[0232] Step S51: The pusher 251 rotates half a circle. Through this action, the second substrate W2 facing the opposite direction is moved toward one direction.

[0233] Step S52 : The HVC posture changing unit 23 receives the second substrate W2 from the batch BL in the pusher 251 and breaks the batch BL.

[0234] Step S53 : After the posture of the second substrate W2 is changed by the HVC posture changing unit 23 , the second substrate W2 is returned to the second carrier C2 by the transport robot HTR.

[0235] Step S54: The pusher 251 rotates half a circle. Through this action, the first substrate W1 facing the opposite direction is directed to one direction.

[0236] Step S55 : The HVC posture changing unit 23 receives the first substrate W1 from the batch BL in the pusher 251 and breaks the batch BL.

[0237] Step S56 : After the first substrate W1 undergoes posture change by the HVC posture changer 23 , it is returned to the first carrier C1 by the transport robot HTR.

[0238] Step S57: The pusher 251 rotates half a circle. By this action, the substrate W0 that was originally facing the opposite direction is directed in one direction.

[0239] Step S58: The HVC posture changing unit 23 receives the first substrate W0 from the lot BL in the pusher 251. After the first substrate W0 undergoes posture change by the HVC posture changing unit 23, it is returned to the first carrier C1 by the transport robot HTR.

[0240] 12. Effect of this example

[0241] According to the above configuration, the HVC posture changer 23 includes a rod drive mechanism 235. When the push mechanism 25 is used to combine the first and second substrate sets, the flat plate 233, which is in a first position where a horizontal substrate W can abut, moves to a second position retracted from the gap between the first and second substrate sets. The transfer block 5 of the present invention is configured to insert substrates W from the first substrate set into the gap between substrates W from the second substrate set. When combining the first and second substrate sets, the first substrate set is clamped by the clamping rods 232 of the HVC posture changer 23. Therefore, the loading rods 231 do not contribute to supporting the substrates W. Instead, the flat plates 233 of the loading rods 231 are located in the space where the substrates W from the second substrate set are inserted. This creates the risk of collision between the flat plates 233 and the second substrate sets when combining the first and second substrate sets. According to the present invention, the flat plates 233 retract from the gap between the first and second substrate sets when combining the first and second substrate sets. Therefore, the flat plates 233 of the loading rods 231 do not interfere when combining the substrate sets.

[0242] According to the above configuration, the placement rod 231 has a surface where the flat plates 233 are arranged and a surface where the flat plates 233 are not arranged, and the rod drive mechanism 235 is a rotation mechanism that rotates the placement rod 231 about a central axis parallel to the arrangement direction of the flat plates 233. With this configuration, the flat plates 233 can be reliably retracted.

[0243] According to the above configuration, the flat plates 233 are arranged on the placement rods 231 at a pitch twice the arrangement pitch of the substrates W in the carrier C, and the grooves are arranged on the clamping rods 232 at a pitch twice the arrangement pitch of the substrates W in the carrier C. The arrangement pitch of the substrates W in the pushing mechanism 25 is 1 / 3 of the arrangement pitch of the substrates W in the carrier C. With this configuration, the pushing mechanism 25 can reliably maintain the arrangement pitch of the substrates W at 1 / 3 of the arrangement pitch of the substrates W in the carrier C by repeatedly transferring the substrates W six times.

[0244] According to the above configuration, the pushing mechanism 25 can rotate the array of held substrates W by half a turn about the vertical axis. Thus, the pushing mechanism 25 can combine batches while changing the orientation of the substrates W, thereby arranging the substrates W face to face in the final batch.

[0245] Example 2

[0246] Next, the substrate transport device (transfer block 5) of Example 2 will be described. The overall structure of the transfer block 5 of Example 2 is the same as that of Example 1, but its main feature lies in the structure of the placement rod 231 and the clamping rod 233 in the HVC posture changing unit 23.

[0247] 13. Storage block actions

[0248] Figure 19FIG. 2 shows a situation in which the transport robot HTR receives the substrate W in the carrier C using the hand 211. Figure 19 As shown, the hands 211 are arranged in the vertical direction at an arrangement pitch of the slots S provided on the carrier C. That is, the hands 211 are arranged at a pitch of 10 mm. 10 mm corresponds to the predetermined interval of the present invention, and is represented by the arrangement pitch Da in the respective drawings. The transport robot HTR transports all substrates W arranged at intervals of 10 mm on the carrier C at one time. The surfaces of the substrates W stored in the carrier C are all facing upward, so the substrates W pulled out by the transport robot HTR are all facing upward. In addition, a guide 214 is provided on each hand 211 for abutting the peripheral edge of the substrate. The guide is provided on the front end and the base end of a pair of blades constituting the hand 211. Therefore, four guides 214 are provided on the hand 211.

[0249] The transport robot HTR has 25 hands 211. The transport robot HTR transports 25 substrates stored in the carrier C collectively using these hands.

[0250] Figure 20 The flat plates 233 and 241 included in the loading rod 231 will now be described. The flat plates 233 are arranged on the loading rod 231 at 10 mm intervals along the extending direction of the loading rod 231. Each flat plate 233 extends in a plane perpendicular to the direction in which the flat plates 233 are arranged. The substrate W is supported by the loading rod 231 by placing the end of the substrate W on the upper surface of the flat plate 233.

[0251] The flat plates 241 are arranged on the supporting rods 231 at a pitch of 20 / 3 mm along the extending direction of the supporting rods 231. The 20 / 3 mm pitch is referred to as the arrangement pitch Db. The flat plates 241 are plates extending on a plane perpendicular to the arrangement direction of the flat plates 233. Like the flat plates 233, the flat plates 241 are supported by the supporting rods 231 by placing the end of the substrate W on the upper surface of the flat plates 233. Two supporting rods 231 are provided in the HVC posture changing section 23. One end of the substrate W is held by the flat plate 241 of one supporting rod 231, and the other end of the substrate W is held by the flat plate 241 of the other supporting rod 231.

[0252] Thus, the loading rod 231 has one side on which the flat plate 233 is arranged and the other side on which the flat plate 241 is arranged. The loading rod 231 can rotate about a rotation axis along the extension direction, and can switch the side facing the substrate W between the one side of the flat plate 233 and the other side of the flat plate 241. In the initial state of the loading rod 231, as shown in FIG. Figure 20 As shown, one surface of the flat plate 233 faces the substrate W. Therefore, in the initial state, the HVC posture changing unit 23 holds the substrate W using the flat plate 233 .

[0253] Figure 20The clamping plate 234 and the clamping plate 230 of the clamping rod 232 are described. The clamping plate 234 has an arc edge 234a along the curve of the substrate W, and a V-groove 234b for clamping the substrate W is provided on the arc edge 234a. The substrate W is in a shape along the curve of the arc edge 234a, so the substrate W is clamped by the V-groove 234b of the arc edge 234a. The clamping plates 234 are arranged on the clamping rod 232 at a pitch of 10 mm along the extension direction of the clamping rod 232. Each clamping plate 234 is a plate extending on a plane orthogonal to the arrangement direction of the clamping plates 234, and a portion of the substrate W is clamped in the V-groove 234b of the arc edge 234a, whereby the substrate W is clamped by the clamping rod 232.

[0254] The clamping plates 230 are arranged on the clamping rods 232 at 20 / 3 mm intervals along the extending direction of the clamping rods 232. The clamping plates 230 extend in a plane perpendicular to the arrangement direction of the clamping plates 230. Like the clamping plates 234, the clamping plates 230 have arcuate edges 230 a that follow the curve of the substrate W. V-grooves 230 b for clamping the substrate W are provided on the arcuate edges 230 a.

[0255] Thus, the clamping rod 232 has one side on which the clamping plates 234 are arranged and the other side on which the clamping plates 230 are arranged. The clamping plates 234 can rotate about a rotation axis along the extension direction, and the side facing the substrate W can be switched between one side of the clamping plates 234 and the other side of the clamping plates 230. In the initial state of the clamping rod 232, as shown in FIG. Figure 20 As shown, one surface of the clamping plate 234 faces the substrate W. Therefore, in the initial state, the HVC posture changing unit 23 holds the substrate W using the clamping plate 234 .

[0256] Figure 21 The arrangement pitch of the flat plates 233 and 241 on the support rod 231 is described below. The arrangement pitch Da of the flat plates 233 is 10 mm, and the arrangement pitch Db of the flat plates 241 is 20 / 3 mm. Therefore, one flat plate 233 is located between a pair of flat plates 233 separated by a width of 20 mm in the direction in which the support rod 231 extends. On the other hand, two flat plates 241 are located between a pair of flat plates 241 separated by a width of 20 mm in the direction in which the support rod 231 extends.

[0257] Figure 21 The arrangement pitch of the clamping plates 234 and 230 of the clamping rod 232 is also described. The arrangement pitch Da of the clamping plates 234 is 10 mm, and the arrangement pitch Db of the clamping plates 230 is 20 / 3 mm. Therefore, one clamping plate 234 is located between a pair of clamping plates 234 separated by a width of 20 mm in the direction in which the clamping rod 232 extends. On the other hand, two clamping plates 230 are located between a pair of clamping plates 230 separated by a width of 20 mm in the direction in which the clamping rod 232 extends.

[0258] Figure 22A The arrangement pitch of the substrates in each configuration is compared. The carrier C is provided with mounting plates 7, forming each slot S, arranged at 10 mm intervals. These mounting plates 7 have the same structure as the flat plate 233 in the mounting rod 231. Therefore, the mounting plates 7 are arranged vertically not only on one side of the carrier C but also on the other side. By placing both ends of the substrate W on a pair of facing mounting plates 7, the substrate W is retained within the carrier C.

[0259] Flat plates 233 are arranged at 10 mm pitch on the placement bars 231 of the HVC posture changing unit 23. Therefore, the 25 substrates W held by the carrier C are collectively transported to the HVC posture changing unit 23. This transport is achieved by the transport robot HTR.

[0260] Figure 22B The diagram briefly shows a situation where 25 substrates W are arranged on a carrier C. In the following description, three different carriers C appear, so Figure 22B The carrier C in FIG. 1 is referred to as a first carrier C1 . 25 substrates W are arranged at a pitch of 10 mm on the first carrier C1 .

[0261] Figure 22C 1 and 2. The state in which the substrate W accommodated in the first carrier C1 is delivered to the HVC posture changing unit 23 by the transport robot HTR is shown.

[0262] At this point, the periphery of the substrate W contacts the clamping plates 234 of the pair of clamping bars 232. Specifically, the periphery of the substrate W is clamped in the V-grooves of the clamping plates 234. Therefore, even if the support table 237 is rotated 90° in this state, the substrate W is clamped by the V-grooves 234b of the clamping plates 234, preventing it from slipping off the HVC posture changing unit 23.

[0263] In addition, Figure 22C FIG also shows a case where the loading rod 231 supports the substrate W via the flat plate 233. Figure 22C FIG. 2 shows a state where the clamping rods 232 clamp the substrate W via the clamping plates 234 .

[0264] Figure 22D The figure shows the state of the rotation drive mechanism 239 in the HVC posture changing unit 23 during operation. This operation rotates the support table 237 90 degrees, and the placement rods 231 and clamping rods 232 are horizontally extended. As a result, the load of the substrate W is transferred from the placement rods 231 to the clamping rods 232, and the flat plate 233 of the placement rods 231 is in contact only with the substrate W. Figure 22DThe figure shows the situation when the placement rod 231 is retracted by the rod driving mechanism 235. When the placement rod 231 is retracted, the plate 233 moves away from the substrate W. Even with this movement, the substrate W does not move with the movement of the plate 233 because it is supported by the clamping rods 232.

[0265] If the flat plate 233 is kept away from the substrate W, the flat plate 233 will not damage the back surface of the substrate W even if the substrate W clamped by the clamping rods 232 is lifted by the pusher 251 .

[0266] Figure 22E The following figure shows the situation when the loading rod 231 is rotated 90 degrees by the rod driving mechanism 235. The flat plate 233 in the loading rod 231 is directed upward by the rotation of the loading rod 231. The operation of the loading rod 231 at this time is the same as that of the embodiment 1. Figure 12B 、 Figure 12C The movement of the flat plate 233 is performed above the pusher 251. The loading rod 231 and the substrate W clamped by the clamping rod 232 approach the pusher 251, but at this time, the flat plate 233 does not collide with the substrate W held by the pusher 251. In addition, Figure 22E The pusher 251 does not clamp the substrate W, so the rotation of the plate 233 can be omitted.

[0267] Figure 22F The following figure shows the situation when the pusher 251 is subsequently raised. As a result, the bottom of the substrate W, clamped by the clamping rods 232, fits into the clamping grooves 252 of the pusher 251. If the pusher 251 is further raised in this state, the substrate W is removed from the clamping plates 234 of the clamping rods 232. In this manner, the substrate W is transferred from the HVC posture changing unit 23 to the pushing mechanism 25.

[0268] Thereafter, the pusher 251 rises to an upper position UR set above the placement rod 231. The pusher 251 at the upper position UR does not collide with the placement rod 231 that has returned to its upright state. Figure 22F The following also describes the situation where the loading rod 231 and the clamping rod 232 are moved to the imaginary position IR shown by the dotted line by the rotation drive mechanism 239. At this time, the retracted loading rod 231 returns to its original extended state. In addition, the loading rod 231 rotates in the reverse direction and returns to its original position. Figure 22C The original state described in .

[0269] In this way, the substrates W arranged at a pitch of 10 mm are handed over from the HVC posture changing part 23 to the pushing mechanism 25. At this time, the clamping grooves 252 in the pushing member 251 have grooves for clamping the substrates W and empty grooves that do not clamp the substrates W. The grooves for clamping the substrates W are separated from each other by 3 times the arrangement pitch of the clamping grooves 252. This is because the arrangement pitch of the clamping grooves 252 is 10 / 3 mm. The arrangement pitch of the substrates W of 10 mm is equivalent to exactly 3 times the arrangement pitch of the clamping grooves 252. For the sake of convenience, the substrates W arranged on the pushing member 251 at this time are referred to as the initial substrate group. The initial substrate group is composed of substrates facing one direction arranged at intervals of 10 mm.

[0270] Figure 22G The dotted line illustrates the transfer of substrates W (first substrates) from the second carrier C2 to the HVC position changer 23. The second carrier C2 is a new carrier that is transferred to the carrier placement shelf 13a by the carrier transfer mechanism 11, replacing the empty first carrier C1. In the first process, the second carrier C2, which accommodates the first substrates W in a horizontal position and arranged at intervals of 10 mm in the vertical direction Z, removes the substrates collectively.

[0271] Figure 22H The following figure shows the situation when the substrate W held by the HVC posture changer 23 is subsequently transferred to the pusher 251. The gripping grooves 252 of the pusher 251, which already hold a substrate W from the first carrier C1, are unable to grip any further substrates W. Therefore, the substrate W held by the HVC posture changer 23 is transferred to a position offset from the substrate W on the first carrier C1 by one pitch in the arrangement of the gripping grooves 252 and is then positioned in the existing gripping grooves 252. This alignment of the substrate W and the pusher 251 is achieved by the pusher shifting mechanism 254.

[0272] At this time, execute Figure 22D The tilting of the loading rod 231 and the clamping rod 232 and the contraction of the loading rod 231 are described in detail. By tilting the clamping rod 232, the posture of each substrate W is transformed from a horizontal posture to a vertical posture. Figure 22H Also omitted Figure 22E The rotation of the loading rod 231 described in Figure 22F The insertion of the substrate W into the pusher 251, the ascent and descent of the pusher 251, the rising action of the placement rod 231 and the clamping rod 232, the extension action of the placement rod 231, and the reverse action of the placement rod 231 are described in detail.

[0273] In this way, the substrate W of the second carrier C2 is transferred from the HVC posture conversion unit 23 to the pushing mechanism 25. At this time, the pushing member 251 is alternately provided with two consecutive areas of clamping grooves 252 for clamping the substrate W and areas where empty grooves are located without clamping the substrate W. That is, by combining the first arrangement in which the first substrates facing one direction are arranged at intervals of 10 mm and the initial substrate group, the first substrate is positioned at a predetermined position (first position P1) in the pushing member 251. For the first position P1, reference can be made to Figure 23 .

[0274] In this way, the pushing mechanism 25 combines the substrate W of the second carrier C2 in a vertical posture maintained by the HVC posture conversion unit 23 using the clamping rod 232 with the substrate W of the first carrier C1 in a vertical posture previously transferred from the HVC posture conversion unit 23, so that the substrates W are arranged in the left-right direction Y with an arrangement pitch narrower than 10 mm.

[0275] Figure 22I The dotted line illustrates the transfer of substrates W (second substrates) from the third carrier C3 to the HVC position changer 23. The third carrier C3 is a new carrier that is transferred to the carrier placement shelf 13a by the carrier transfer mechanism 11, replacing the empty second carrier C2. In the first process, each substrate is removed from the third carrier C3, which stores the second substrates W in a horizontal position and arranged at intervals of 10 mm in the vertical direction Z.

[0276] Figure 22J The following figure shows the situation when the substrate W held by the HVC posture changer 23 is subsequently transferred to the pusher 251. The gripping grooves 252 of the pusher 251, which already hold substrates W from the first carrier C1 and the second carrier C2, are unable to hold any further substrates W. Therefore, the substrate W held by the HVC posture changer 23 is transferred to a position offset from the substrate W on the second carrier C2 by one pitch in the arrangement of the gripping grooves 252 and is then positioned in the existing gripping grooves 252. This alignment of the substrate W and the pusher 251 is achieved by the pusher shifting mechanism 254.

[0277] At this time, execute Figure 22D The tilting of the loading rod 231 and the clamping rod 232 and the contraction of the loading rod 231 are described in detail. By tilting the clamping rod 232, the posture of each substrate W is transformed from a horizontal posture to a vertical posture. Figure 22H In the Figure 22E The rotation of the loading rod 231 described in Figure 22F The insertion of the substrate W into the pusher 251, the ascent and descent of the pusher 251, the rising action of the placement rod 231 and the clamping rod 232, the extension action of the placement rod 231, and the reverse action of the placement rod 231 are described in detail.

[0278] Thus, the substrate W on the third carrier C3 is transferred from the HVC posture changing unit 23 to the pushing mechanism 25. At this time, the gripping grooves 252 of the pushing member 251 all grip the substrates W. Thus, 75 substrates W are arranged on the pushing member 251 at a pitch of 10 / 3 mm.

[0279] In this way, the pushing mechanism 25 combines the substrate W of the third carrier C3 in a vertical posture maintained by the HVC posture changing unit 23 using the clamping rod 232 with the substrate W of the first carrier C1 in a vertical posture and the substrate W of the second carrier C2 that were previously transferred from the HVC posture changing unit 23, so that the substrates W are arranged in the left-right direction Y with an arrangement pitch narrower than 10 mm.

[0280] The substrate array thus generated is referred to as a temporary batch TL. If the substrates W held on the carrier C are arranged at a pitch of 10 mm, the arrangement pitch of the substrates W on the carrier C is changed from 10 mm to 10 / 3 mm in the transfer block 5. That is, by combining the second arrangement in which the second substrates facing one direction are arranged at a pitch of 10 mm with the initial substrate group, the second substrate is positioned at a predetermined position (second position P2) in the pusher 251. The second position P2 can be referred to as Figure 23 .

[0281] Figure 23 Let's explain the temporary batch TL. In the temporary batch TL, substrates W from the third carrier C3, substrates W from the second carrier C2, and substrates W from the first carrier C1 are arranged in this order, with a 10 / 3 mm pitch. These substrates W are all oriented in the same direction. Therefore, the temporary batch TL is formed by arranging the substrates W in a face-to-back arrangement.

[0282] Next, the relationship between the clamping groove 252 of the pusher 251 and the substrate W will be described. The clamping groove 252 is located at three positions: the reference position P for the substrate W on the first carrier C1, the first position P1 for the substrate W on the second carrier C2, and the second position P2 for the substrate W on the third carrier C3. The reference positions P are arranged at 10 mm intervals in the pusher 251, with the first position P1 and the second position P2 dividing the 10 mm distance between the reference positions P into three equal parts. Specifically, the first position P1 and the second position P2 divide the 10 mm distance between the reference positions P into three equal parts. Therefore, the distance from the first position P1 to the second position P2 is 1 / 3 the arrangement pitch of the substrates W stored in the carrier C.

[0283] 14. Rearrangement of temporary batches

[0284] In this configuration of the temporary lot TL, the orientation of the arranged substrates W remains constant. This arrangement is not optimal for batch chemical processing. The transfer block 5 of this embodiment can change the arrangement of the substrates W from face-to-back to face-to-face by disassembling and rearranging the temporary lot TL.

[0285] Figure 24 express Figure 22J The pusher 251 in the state of being raised to the upper position UR set above the placement rod 231. In this way, when the arrangement of the substrates W held by the pusher 251 is changed, the pusher 251 is accompanied by an upward movement. This is because when the arrangement is changed, a part of the substrates W held by the pusher 251 needs to be handed over to the HVC posture changing unit 23.

[0286] Figure 24 The figure also shows the clamping rod 232 in the upright position being rotated half a turn about a rotation axis parallel to its extension direction. Before the half-turn, the clamping rod 232 was configured to clamp the substrate W via the clamping plate 234. However, after the half-turn, the clamping rod 232 is configured to clamp the substrate W via the clamping plate 230. Figure 25 This figure illustrates how the arrangement pitch of the clamping plates can be changed by rotating the clamping rod 232. Before a half-turn, the clamping rod 232, as shown in (a), can collectively clamp substrates W arranged at a 10 mm pitch. After a half-turn, the clamping rod 232, as shown in (b), can collectively clamp substrates W arranged at a 20 / 3 mm pitch.

[0287] However, the clamping rod 232 cooperates with the paired clamping rods 232 to clamp the substrate W, and thus a half-turn rotation is performed in the pair of clamping rods 232. Before the half-turn, the clamping plates 234 of the pair of clamping rods 232 are facing each other, but after the half-turn, the clamping plates 230 of the pair of clamping rods 232 are facing each other.

[0288] Figure 26A Next, the HVC posture changing unit 23 is operated, and the upright placement rod 231 and the clamping rod 232 are rotated 90 degrees.

[0289] Figure 26B (a) shows the pusher 251 in the overhead position beginning to descend to transfer the substrate W to the HVC posture changer 23. As can be seen from this figure, the arrangement pitch of the clamping plates 230 is longer than the arrangement pitch of the substrates W in the temporary lot TL. Therefore, the number of clamping plates 230 is less than the number of substrates W in the temporary lot TL.

[0290] Figure 26B(b) shows the situation when the temporary batch TL held by the pusher 251 is handed over to the clamping rod 232. The clamping rod 232 cannot clamp all the substrates W of the temporary batch TL. This is because the number of clamping plates 230 is less than the number of substrates W in the temporary batch TL. As a result, half of the substrates W constituting the temporary batch TL are clamped by the corresponding clamping plates 230, and the remaining half are not clamped by the clamping plates 230 and maintain the state of being held by the pusher 251. (c) of Figure 26 illustrates the situation where the substrates W clamped by the clamping plates 230 and the substrates W held by the pusher 251 are arranged alternately.

[0291] The pusher 251 continues to descend even after the substrate W is delivered to the clamping rods 232 .

[0292] Figure 26C The figure shows the situation after the pusher 251 passes through the clamping rod 232. Thus, the temporary batch TL is divided into a first group of substrates W1 arranged at a 20 / 3 mm pitch and a second group of substrates W2 also arranged at a 20 / 3 mm pitch. If the first group of substrates W1 is designated the first group and the second group of substrates W2 is designated the second group, the temporary batch TL is divided into the first and second groups. The first group of substrates is clamped by the clamping rod 232, while the second group of substrates is held by the pusher 251.

[0293] Figure 26C The rotation of the loading rod 231 around the left and right axis is described. When inserting the flat plate into the gap of the first group of substrates W1, the arrangement pitch of the first group of substrates W1 must be consistent with the arrangement pitch of the flat plate. The arrangement pitch of the first group of substrates W1 is 20 / 3mm. Figure 20 The arrangement pitch of the flat plates 233 described in FIG is 10 mm. Therefore, when the flat plates 233 are positioned between the first set of substrates W1 , the arrangement pitches do not match, and the first set of substrates W1 collides with the flat plates 233 .

[0294] Assume that the support rod 231 of this embodiment has flat plates 241 arranged at a 20 / 3 mm pitch. When the support rod 231 is rotated so that the flat plates 241 are positioned between the first group of substrates W1, the first group of substrates W1 and the flat plates 241 do not collide because the pitches are aligned.

[0295] Furthermore, this rotational movement is performed with the loading rod 231 in the retracted position. When the same movement is attempted with the loading rod 231 in the extended position, the flat plate 241 collides with the first group of substrates W1. This is because the position of the flat plate 241 in the left-right direction Y of the loading rod 231 in the extended position coincides with the position of the first group of substrates W1 clamped by the clamping rods 232 in the left-right direction Y. Therefore, when inserting the flat plate 241 into the gap between the first group of substrates W1, the flat plate 241 must be displaced in the left-right direction Y relative to the first group of substrates W1.

[0296] When the loading rods 231 rotate and the flat plate 241 is inserted into the gap between the first group of substrates W1, the loading rods 231 are extended. As a result, the flat plate 241 contacts the back surface of the first group of substrates W1, and the substrates W are securely held on the loading rods 231 even when the loading rods 231 are raised.

[0297] Figure 26D The following figure shows the situation when the HVC posture changing unit 23 is activated, causing the placement rods 231 to be in an upright position. At this point, the clamping rods 232 merely clamp the ends of the first group of substrates W1, and therefore cannot maintain the first group of substrates W1 in a horizontal position. In this regard, the flat plates 241 of the placement rods 231 can hold the center of the first group of substrates W1. Therefore, even when the clamping rods 232 are in the upright position, the first group of substrates W1 in a horizontal position are reliably held by the pair of placement rods 231.

[0298] Figure 26D The pusher 251 is shown rising. The placement rod 231 and the clamping rod 232 in the HVC posture changing unit 23 have already rotated 90 degrees and retracted from the pusher 251. Therefore, even if the pusher 251 rises, it will not collide with the clamping rod 232 and the placement rod 231.

[0299] Figure 26E The pusher 251 is shown rotating half a turn above the HVC posture changing unit 23. The pusher 251 rotates about the vertical axis by the operation of the pusher rotating mechanism 253. By performing this operation, all the second group of substrates W2 facing in one direction face in the opposite direction.

[0300] Figure 26F The figure shows the situation in which the pusher 251 descends after rotating half a circle. The pusher 251 passes through the arrangement of the first group of substrates W1 and stops at a lower position relative to the first group of substrates W1.

[0301] Figure 26GAfter the description, the HVC posture changing unit 23 works, and the upright loading rod 231 and the clamping rod 232 rotate 90 degrees. Through this action, the HVC posture changing unit 23 is ready to hand over the first group of substrates W1 to the pushing member 251. Figure 26G Before the state of Figure 22D 、 Figure 22E The retracting and rotating actions described in the above are used to withdraw the clamping plate 230 from the gap between the first group of substrates W1. If such an action is performed in advance, the clamping plate 230 will not collide with the pusher 251 exposed from below and the second group of substrates W2 supported by it.

[0302] Figure 26G It also shows the situation when the pusher 251 starts to rise after the placement rod 231 and the clamping rod 232 have fallen down.

[0303] Figure 26H (a) shows the pusher 251 receiving the first group of substrates W1 from the clamping rods 232. At this time, the pusher 251 generates a batch BL in which the first group of substrates W1 facing one direction and the second group of substrates W2 facing the opposite direction are alternately arranged.

[0304] The pusher 251 continues to rise after receiving the first group of substrates W1 from the clamping rods 232 .

[0305] Figure 26H (b) shows a state after the pusher 251 pulls the first group of substrates W1 out of the clamping rods 232. In this way, the batch BL of this example is produced.

[0306] The generation of the batch BL is carried out according to the following steps. First, the substrates W constituting the temporary batch TL are divided into the first group and the second group in such a manner that two opposing substrates W become different groups. And, the temporary batch TL is disassembled by moving the first group and the second group relative to each other in a direction (vertical direction Z) orthogonal to the arrangement direction of the substrates (left-right direction Y). Then, the second group of substrates W2 rotates half a circle. As a result, the initial direction of the second group of substrates W2 faces the opposite direction. Finally, the first group of substrates W1 and the second group of substrates W2 are combined, and the first group of substrates W1 facing one direction and the second group of substrates W2 facing the opposite direction are alternately arranged. The batch BL is formed by arranging the substrates W in such a face-to-face manner.

[0307] The number of substrates W constituting the lot BL is 75, which is the same as the number of substrates W in the temporary lot TL. Therefore, the number of substrates constituting the lot BL is three times that of the initial substrate group.

[0308] Figure 27The batch BL is described below. In the batch BL, a first group of substrates W1 facing one direction and a second group of substrates W2 facing the opposite direction are repeatedly arranged at a 10 / 3 mm pitch. Therefore, the batch BL is formed by arranging the substrates W in a face-to-face manner.

[0309] 15. Substrate processing process

[0310] Below, refer to Figure 28 The flowchart of the substrate processing in this example is described.

[0311] Step T11 : The substrates W arranged at a pitch of 10 mm, which are transported from the first carrier C1 by the transport robot HTR, are taken up by the pusher 251 after their postures are changed.

[0312] Step T12 : the transport robot HTR takes the substrate W from the second carrier C2 and hands it over to the HVC posture changing unit 23 .

[0313] Step T13: Substrates W, arrayed at 10 mm intervals, are transferred from the second carrier C2 to the pusher 251 after their positions are changed. Substrates W from the first carrier C1 are already arrayed on the pusher 251. Therefore, the pusher 251 batches the substrates W from the first carrier C1 with the substrates W from the second carrier C2. Step T13 corresponds to the first assembly process of the present invention. The second process described above is performed between steps T12 and T13.

[0314] Step T14 : the transport robot HTR takes the substrate W from the third carrier C3 and hands it over to the HVC posture changing unit 23 .

[0315] Step T15: After the position change, the substrates W, arrayed at 10 mm intervals, are transferred from the third carrier C3 to the pusher 251. Substrates W from the first carrier C1 and substrates W from the second carrier C2 are already arrayed on the pusher 251. Therefore, the pusher 251 batches the array of substrates from the first and second carriers C1 and C2 with the substrates W from the third carrier C3. This creates a temporary batch TL. Step T15 corresponds to the second assembly process of the present invention. The aforementioned second process is performed between steps T14 and T15.

[0316] Step T16: The substrates W constituting the temporary lot TL are divided into a first group and a second group. The pusher 251 holding the temporary lot TL delivers the first group of substrates W1 to the clamping rods 232 and separates them from the second group of substrates W2.

[0317] Step T17: performing a half-turn rotation of the second group of substrates W2, thereby causing the second group of substrates W2 facing in one direction to face in the opposite direction.

[0318] Step T18: The pusher 251 moves up and down, removing the first group of substrates W1 from the clamping rods 232. The pusher 251 is alternately provided with clamping slots 252 for clamping the second group of substrates W2 and empty clamping slots 252. Once the first group of substrates W1 are inserted into the corresponding empty clamping slots 252, the batch BL is generated.

[0319] Step T19 : The generated lot BL is transported from the transfer block 5 to the processing block 6 by the forward and backward transport mechanism WTR.

[0320] Step T20: Perform chemical liquid treatment on batch BL.

[0321] Step T21: Perform a flushing process on the batch BL.

[0322] Step T22: Drying the batch BL.

[0323] In this way, substrate processing is achieved in batch units.

[0324] Step T23 : The lot BL on which the substrates have been processed is transported from the processing block 6 to the transfer block 5 by the forward and backward transport mechanism WTR.

[0325] Step T24 : The pusher 251 holds the second group of substrates W2 while transferring the first group of substrates W1 to the clamping rods 232 .

[0326] Step T25: performing a half-turn rotation of the second group of substrates W2, thereby causing the second group of substrates W2 facing in the opposite direction to face one direction.

[0327] Step T26: The pusher 251 retrieves the first group of substrates W1 from the clamping rods 232. The pusher 251 alternates between clamping slots 252 for clamping the second group of substrates W2 and empty clamping slots 252. Once the first group of substrates W1 are inserted into the corresponding empty clamping slots 252, the temporary batch TL is generated.

[0328] Step T27: The substrates W on the third carrier C3 are arranged on the pusher 251 at a pitch of 10 mm. The pusher 251 moves up and down, transferring the substrates W on the third carrier C3 to the clamping rods 232. In this way, the temporary batch TL is disassembled.

[0329] Step T28: After the posture of the substrate W transferred to the clamping pins 232 is changed, the substrate W is returned to the third carrier C3 by the transport robot HTR.

[0330] Step T29: The substrates W on the second carrier C2 are arranged on the pusher 251 at a pitch of 10 mm. The pusher 251 moves up and down, transferring the substrates W on the second carrier C2 to the clamping rods 232. In this way, the temporary lot TL is disassembled.

[0331] Step T30 : After the posture of the substrate W transferred to the gripping bars 232 is changed, the substrate W is returned to the second carrier C2 by the transfer robot HTR.

[0332] Step T31: The substrates W on the first carrier C1 are arranged on the pusher 251 at a pitch of 10 mm. The pusher 251 moves up and down, transferring the substrates W from the first carrier C1 to the clamping rods 232. After the transferred substrates W have changed their positions, they are returned to the first carrier C1 by the transfer robot HTR.

[0333] 16. Effect of this example

[0334] In the above-described structure, the placement rods 231 have flat plates 233 arranged at the same pitch as the substrates W in the carriers C, and the clamping rods 232 have grooves arranged at the same pitch as the substrates W in the carriers C. The pushing mechanism 25 can separate the substrates W into a first group and a second group, such that two opposing substrates W in the held array form different groups, and can rotate the substrates W in the second group half a turn about the vertical axis. This configuration enables the substrates W to be arranged face-to-face in the final batch.

[0335] According to the above configuration, the arrangement pitch of the substrates W in the pushing mechanism 25 is 1 / 3 times the arrangement pitch of the substrates W in the carrier C, and the pushing mechanism 25 holds the second group of substrates W at a pitch 2 / 3 times the arrangement pitch of the substrates W in the carrier C. With this configuration, the arrangement pitch of the finally generated batch can be set to 1 / 3 of the arrangement pitch of the substrates W in the carrier C.

[0336] 17. Modification

[0337] The present invention is not limited to the configuration of the above-described embodiment, and can be modified as follows.

[0338] <Variation 1>

[0339] The HVC posture changing unit 23 in the first embodiment includes a placing rod 231 having a row of flat plates 233 arranged at intervals of 20 mm, but the present invention is not limited to this structure. Figure 29 As shown in FIG. 2 , the HVC posture changing unit 23 may be provided with another placement rod 231 having another similar flat plate 233 . Figure 29 There are two flat plates 233 arranged on the loading rod 231, and the arrangement relationship between them is that the back side of one is the other.

[0340] According to the above configuration, the loading rod 231 has an outward surface F1 on which the first flat plate 233 is arranged, and a return surface F2 on which the second flat plate 233 is arranged. When the substrate W is transferred from the transport robot HTR to the pushing mechanism 25, the rod driving mechanism 235 rotates the loading rod 231 so that the outward surface F1 faces the substrate W. On the other hand, when the substrate W is transferred from the pushing mechanism 25 to the transport robot HTR, the rod driving mechanism 235 rotates the loading rod 231 so that the return surface F2 faces the substrate W. Thus, by distinguishing between the flat plates of the loading rod used in the outward direction and the flat plates of the loading rod used in the return direction, the present invention can prevent contamination of substrates passing through the flat plates of the loading rod.

[0341] <Variation 2>

[0342] The structure of dividing the flat plates 233 into outgoing and returning ones in the first modification can also be applied to the transfer block 5 of the second embodiment. The HVC posture changing unit 23 of the second embodiment has a loading rod 231, each of which has a row of flat plates 233 arranged at intervals of 10 mm and a row of flat plates 233 arranged at intervals of 20 / 2 mm, but the present invention is not limited to this structure. Figure 30 As shown, the HVC posture changing unit 23 may include another pair of placement rods 231 having another pair of similar flat plates 233 .

[0343] Figure 30 The loading rod 231 of this modification example will be described. Figure 30 On the surface of the support rod 231 shown in (a), the arrangement of two flat plates 233 and the arrangement of one flat plate 241 can be seen. Figure 30 A flat plate 233 can be seen on the back of the loading rod 231 shown in (b). The rod drive mechanism 235 achieves batch assembly and batch disassembly according to Example 2 by appropriately rotating the loading rod 231. The loading rod 231, which is a hexagonal prism, has a surface without flat plates 233 and 241. Therefore, when it is necessary to retract the flat plates 233 and 241 from the substrate W, this surface faces the substrate W. This modification achieves the same effects as Modification 1.

[0344] <Variation 3>

[0345] While the loading rods 231 in Example 1 rotate to move the flat plate 233 closer to and farther from the substrate W, the present invention is not limited to this configuration. The position of the flat plate 231 relative to the substrate W can also be changed by moving the pair of loading rods 231 closer to and farther from each other. When the pair of loading rods 231 are separated, the flat plate 231 moves away from the substrate W and retreats from the gap between the first substrate group. When the pair of loading rods 231 are brought closer from this position, the flat plate 233 returns to a position capable of loading the substrate W. The rod drive mechanism 235 controls the movement of the loading rods 231.

[0346] <Variation 4>

[0347] While the placement rod 231 in Example 1 rotates to move the plate 233 toward and away from the substrate W, the present invention is not limited to this configuration. Alternatively, the plate 233 can be configured to freely retract from the main body of the placement rod 231, allowing the plate 233 to move toward and away from the substrate W. When the plate 233 is inserted into the main body of the placement rod 231, it moves away from the substrate W and retracts from the gap between the first substrate group. When the plate 233 is released from the main body of the placement rod 231, it returns to a position capable of placing the substrate W. This movement of the plate 233 is achieved by the rod drive mechanism 235.

Claims

1. A substrate transport device, characterized in that: The substrate transport device comprises: An operating mechanism that obtains a substrate group from a carrier that arranges and stores substrates in a horizontal position in a vertical direction; The posture changing mechanism comprises: a pair of placing rods having flat plates arranged at predetermined intervals in the vertical direction, the flat plates carrying the ends of the substrates to be transferred by the operating mechanism; and a pair of clamping rods having grooves arranged at predetermined intervals in the vertical direction for clamping the substrates in the vertical posture; a supporting member on which the placing rod and the clamping rod are provided upright; and a base supporting the supporting member so as to be inverted; and A substrate holding mechanism combines a first substrate group held in a vertical position by the posture changing mechanism using the clamping rods with a second substrate group in a vertical position previously received from the posture changing mechanism, so that the substrates are arranged in the horizontal direction at an arrangement pitch narrower than the predetermined pitch. The posture changing mechanism includes a moving mechanism that moves the plate from a first position where horizontal substrates can abut against the plate to a second position away from a gap between the first substrate groups when the substrate holding mechanism combines the first and second substrate groups.

2. The substrate transport device according to claim 1, wherein: The placing rod has a surface on which the flat plates are arranged and a surface on which the flat plates are not arranged. The moving mechanism is a rotating mechanism that rotates the placement rod around a central axis parallel to the arrangement direction of the flat plates.

3. The substrate transport device according to claim 2, wherein: The loading rod has a surface for arranging the outward path of the first flat plate and a surface for arranging the return path of the second flat plate as surfaces for arranging the flat plates. When the substrate is transported from the operating mechanism to the substrate holding mechanism, the rotating mechanism rotates the loading rod so that the outward surface faces the substrate. When the substrate is transported from the substrate holding mechanism to the operating mechanism, the rotating mechanism rotates the loading rod so that the return surface faces the substrate.

4. The substrate transport device according to claim 1, wherein: The flat plates are arranged on the mounting rod at a pitch twice the pitch of the substrates on the carrier. The grooves are arranged on the clamping rod at a pitch twice the arrangement pitch of the substrates on the carrier. The arrangement pitch of the substrates in the substrate holding mechanism is 1 / 3 times the arrangement pitch of the substrates on the carrier.

5. The substrate transporting device according to claim 1, wherein The substrate holding mechanism can rotate the arrangement of the held substrates half a circle around the vertical axis.

6. The substrate transporting device according to claim 1, wherein: The flat plates are arranged on the mounting rod at the same spacing as the substrates on the carrier. The grooves are arranged on the clamping rod at the same spacing as the substrates on the carrier. The substrate holding mechanism can divide the substrates into a first group and a second group so that two opposing substrates in the array of held substrates form different groups, and can rotate the substrates of the second group half a turn around the vertical axis.

7. The substrate transport device according to claim 6, wherein: The arrangement pitch of the substrates in the substrate holding mechanism is 1 / 3 times the arrangement pitch of the substrates on the carrier.

8. A substrate processing apparatus comprising the substrate transporting apparatus according to claim 1, wherein: The substrate processing apparatus includes an immersion tank for immersing the substrate held by the substrate holding mechanism in a processing liquid.

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