A chip feeding device and a die bonding machine

Abstract

This invention relates to the field of chip mounting equipment technology, and discloses a chip picking device and a die bonder. The chip picking device includes a mounting frame, a first corrugated tube, a second corrugated tube, a floating frame, a displacement sensor, and a picking assembly. The first and second corrugated tubes are spaced apart in the horizontal direction. One end of each of the first and second corrugated tubes in the vertical direction is fixedly connected to the mounting frame, and the other end is fixedly connected to the floating frame. The floating frame is slidably connected to the mounting frame. The displacement sensor is connected to the mounting frame and is used to monitor the sliding distance of the floating frame in the vertical direction. The picking assembly is connected to the floating frame. Based on the first and second corrugated tubes, the chip picking device can provide a wide range of picking forces, which is suitable for picking various types of chips.

Description

Technical Field

[0001] This invention belongs to the field of chip mounting equipment, and more specifically, relates to a chip feeding device and a die bonder. Background Technology

[0002] Chips are highly precise and fragile electronic components. Therefore, in the chip mounting process, appropriate picking force needs to be applied to ensure that the chip is not damaged during the picking process and to maintain its stable and reliable performance. With the continuous development of semiconductor technology, the types and specifications of chips have become more diversified. Different types of chips require different picking forces due to differences in size, material and internal structure. Existing chip picking devices have a relatively narrow force control range, making them difficult to apply to the picking of various types of chips. Summary of the Invention

[0003] The main objective of this invention is to provide a chip picking device with a relatively wide force control range, which can be applied to picking up various types of chips.

[0004] According to a first aspect of the present invention, a chip picking device is provided, comprising a mounting frame, a first corrugated tube, a second corrugated tube, a floating frame, a displacement sensor, and a picking assembly. The first corrugated tube and the second corrugated tube are spaced apart in a horizontal direction, and the length direction of the first corrugated tube and the second corrugated tube extends in a vertical direction. One end of each of the first corrugated tube and the second corrugated tube in the vertical direction is fixedly connected to the mounting frame, and the other end is fixedly connected to the floating frame. The floating frame is connected to the mounting frame and is capable of sliding in the vertical direction. The displacement sensor is fixedly connected to the mounting frame and is used to monitor the sliding distance of the floating frame in the vertical direction. The picking assembly is fixedly connected to the floating frame.

[0005] In a specific embodiment of the present invention, the floating frame includes a frame body and a connecting plate. The frame body is connected to the mounting frame, and the connecting plate is horizontally fixedly connected to the top of the frame body. The top side of the connecting plate is fixedly connected to the first corrugated pipe and the second corrugated pipe.

[0006] The chip picking device further includes a first limiting member, which is fixedly connected to the mounting bracket and located below the connecting plate. The first limiting member has a limiting surface that is horizontally arranged and faces the connecting plate.

[0007] When the first corrugated pipe, the second corrugated pipe, the floating frame, and the material handling assembly are in a natural hanging state, the bottom side of the connecting plate contacts the limiting surface of the first limiting component.

[0008] In a specific embodiment of the present invention, the frame has a clearance hole located below the connecting plate, and the first limiting member passes through the clearance hole.

[0009] In a specific embodiment of the present invention, the chip picking device further includes a second limiting member, which is fixedly connected to the mounting bracket and is spaced apart above the connecting plate. The second limiting member is used to contact the connecting plate to limit the displacement of the connecting plate.

[0010] In a specific embodiment of the present invention, the first bellows and the second bellows have the same structure, size and mechanical properties.

[0011] In a specific embodiment of the present invention, the chip picking device further includes a first mounting base and a second mounting base, both of which are connected to the mounting frame, and the positions of the first mounting base and the second mounting base in the vertical direction are adjustable.

[0012] The first corrugated pipe is fixedly connected to the first mounting base to be connected to the mounting frame, and the second corrugated pipe is fixedly connected to the second mounting base to be connected to the mounting frame.

[0013] In a specific embodiment of the present invention, the chip picking device further includes a first guide rail and a second guide rail, the first guide rail and the second guide rail being fixedly connected to the mounting bracket, and the first guide rail and the second guide rail being spaced apart along the horizontal direction, and the length direction of the first guide rail and the second guide rail extending along the vertical direction;

[0014] The floating frame is connected to the first guide rail and the second guide rail at both ends along the horizontal direction, respectively.

[0015] In a specific embodiment of the present invention, the chip picking device further includes a sensing element, which is fixedly connected to the floating frame. The sensing element is used to cooperate with the displacement sensor so that the displacement sensor can monitor the sliding distance of the floating frame.

[0016] In a specific embodiment of the present invention, the material handling assembly includes a direct drive motor, a first magnetic base, a second magnetic base, and a suction nozzle. The direct drive motor is fixedly connected to the floating frame, the first magnetic base is fixedly connected to the power output end of the direct drive motor, the second magnetic base is detachably connected to the first magnetic base, and the suction nozzle is fixedly connected to the second magnetic base. The suction nozzle, the second magnetic base, the first magnetic base, and the direct drive motor are arranged along the vertical direction.

[0017] The present invention also proposes a die bonder, including the chip pick-up device as described above.

[0018] One of the above-described technical solutions of the present invention has at least one of the following advantages or beneficial effects:

[0019] The chip picking device of the present invention includes a first bellows and a second bellows. In practical applications, the first and second bellows balance the gravity of the floating frame and the picking assembly. Therefore, the chip picking device can eliminate the picking force deviation caused by gravity during picking, achieving precise picking force control. When the chip picking device is handling chips requiring relatively low picking force, a first preset amount of gas is input into the first or second bellows to adjust its stiffness. Subsequently, as the picking assembly moves downwards to adhere to the chip and applies slight overpressure, the floating frame slides upwards, and the first or second bellows is compressed. At this time, a displacement sensor monitors the sliding distance of the floating frame. The moving distance is the deformation length of the first or second bellows. Based on this deformation length and Hooke's Law, the elastic force of the first or second bellows can be obtained, which is the picking force of the picking component. When the chip picking device is handling chips that require a relatively large picking force, a second preset amount of gas is input into the first and second bellows. At this time, the stiffness of the first and second bellows is relatively large. Under the same sliding distance, the elastic force generated by the first and second bellows is greater. Therefore, the chip picking device can provide a greater picking force. That is, based on the first and second bellows, the chip picking device can provide a wide range of picking forces, which is suitable for picking various types of chips. Attached Figure Description

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0021] Figure 1 This is a perspective view of the chip picking device according to an embodiment of the present invention;

[0022] Figure 2 This is a front view of the chip picking device according to an embodiment of the present invention;

[0023] Figure 3 This is a cross-sectional view of the chip picking device according to an embodiment of the present invention.

[0024] In the diagram, 1. Mounting bracket; 2. First corrugated pipe; 3. Second corrugated pipe; 4. Floating frame; 41. Frame body; 4101. Clearance hole; 42. Connecting plate; 5. Displacement sensor; 6. Material handling assembly; 61. Direct drive motor; 62. First magnetic base; 63. Second magnetic base; 64. Suction nozzle; 7. First limiting component; 8. Second limiting component; 9. First mounting base; 10. Second mounting base; 11. First guide rail; 12. Second guide rail; 13. Sensing component. Detailed Implementation

[0025] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0026] Reference Figures 1 to 3 As shown, a chip picking device includes a mounting frame 1, a first corrugated pipe 2, a second corrugated pipe 3, a floating frame 4, a displacement sensor 5, and a picking assembly 6. The first corrugated pipe 2 and the second corrugated pipe 3 are spaced apart in the horizontal direction, and their length direction extends in the vertical direction. One end of each of the first corrugated pipe 2 and the second corrugated pipe 3 in the vertical direction is fixedly connected to the mounting frame 1, and the other end is fixedly connected to the floating frame 4. The floating frame 4 is connected to the mounting frame 1 and can slide in the vertical direction. The displacement sensor 5 is fixedly connected to the mounting frame 1 and is used to monitor the sliding distance of the floating frame 4 in the vertical direction. The picking assembly 6 is fixedly connected to the floating frame 4. When the picking assembly 6 picks up a chip, the first corrugated pipe 2 and / or the second corrugated pipe 3 are filled with a preset amount of gas, and the picking force of the picking assembly 6 is controlled based on the sliding distance monitored by the displacement sensor 5.

[0027] In practical applications, the first bellows 2 and the second bellows 3 balance the gravity of the floating frame 4 and the picking assembly 6. Therefore, the chip picking device can eliminate the picking force deviation caused by gravity during picking, ensuring precise picking force control. When the chip picking device is handling chips requiring relatively small picking forces, a first preset amount of gas is input into the first bellows 2 or the second bellows 3 to adjust their stiffness. Subsequently, as the picking assembly 6 moves downwards to adhere to the chip and applies slight overpressure, the floating frame 4 slides upwards, and the first bellows 2 or the second bellows 3 is compressed. At this time, the displacement sensor 5 monitors the sliding distance of the floating frame 4, which is the deformation length of the first bellows 2 or the second bellows 3. The deformation length and Hooke's law can be used to obtain the elastic force of the first bellows 2 or the second bellows 3, which is the picking force of the picking component 6. When the picking force is at a preset value, the chip picking device stops moving downward. When the chip picking device is facing the picking work of chips that require a larger picking force, a second preset amount of gas is input into the first bellows 2 and the second bellows 3. At this time, the stiffness of the first bellows 2 and the second bellows 3 is relatively large. Under the same sliding distance, the elastic force generated by the first bellows 2 and the second bellows 3 is greater. Therefore, the chip picking device can provide a larger picking force. That is, based on the first bellows 2 and the second bellows 3, the chip picking device can provide a wide range of picking forces, which is suitable for picking various types of chips.

[0028] The horizontal direction referred to in this embodiment is... Figure 2 The image shows the left-right direction from the perspective of the chip picking device, while the vertical direction is... Figure 2 The vertical direction as seen from the perspective of the chip picking device shown.

[0029] It should be noted that after the first bellows 2 and / or the second bellows 3 are filled with gas, their stiffness can be obtained through calibration. For example, the calibration method is described by filling the first bellows 2 with a preset amount of gas. The calibration method is as follows: First, fill the first bellows 2 with a preset amount of gas, then drive the chip picking device to move downwards, and make the picking component 6 attach to the pressure surface of the force sensor so that the two are just in contact. Then, continue to press the picking component 6 down a small stroke. At this time, the floating frame 4 will have a small upward displacement in the vertical direction. At this time, the displacement sensor 5 will receive the displacement change signal. At the same time, combined with the force value signal of the force sensor, a linear change relationship of "displacement-force" is established, thereby calibrating the stiffness of the first bellows 2. In practical applications, this linear change relationship of "displacement-force" is also the main control basis for the force control of the chip picking device. Similarly, the stiffness of the second bellows 3 and the stiffness of the first bellows 2 and the second bellows 3 are also calibrated in the above way, which will not be elaborated on in this application.

[0030] Furthermore, the chip picking device of the present invention can also be used in the chip mounting and handling process. When the chip is mounted, its mounting force is also controlled by the above-mentioned linear change relationship of "displacement-force".

[0031] In this embodiment, the floating frame 4 includes a frame body 41 and a connecting plate 42. The frame body 41 is connected to the mounting frame 1, and the connecting plate 42 is horizontally fixedly connected to the top of the frame body 41. The top side of the connecting plate 42 is fixedly connected to the first corrugated pipe 2 and the second corrugated pipe 3. The chip picking device also includes a first limiting member 7, which is fixedly connected to the mounting frame 1 and is located below the connecting plate 42. The first limiting member 7 has a horizontally arranged limiting surface facing the connecting plate 42. When the first corrugated pipe 2, the second corrugated pipe 3, the floating frame 4, and the picking assembly 6 are in a naturally drooping state... When the bottom side of the connecting plate 42 is in contact with the limiting surface of the first limiting member 7, the advantage of this structure is that when the first corrugated tube 2 or the second corrugated tube 3 is used to control the picking force, after the first corrugated tube 2 or the second corrugated tube 3 is filled with gas, the connecting plate 42 will press against the first limiting member 7. At this time, the force applied by the first corrugated tube 2 or the second corrugated tube 3 will smoothly transition into the force applied by the first corrugated tube 2 and the second corrugated tube 3 together, which can make the force act evenly on the floating frame 4, so that the picking component 6 can provide a uniform picking force and avoid physical damage to the chip.

[0032] Furthermore, since the first limiting member 7 has a horizontal limiting surface, its setting provides a reference for the gravity balance adjustment of the first corrugated pipe 2, the second corrugated pipe 3, the floating frame 4, and the material picking assembly 6. Specifically, after the first corrugated pipe 2 and the second corrugated pipe 3 are assembled on the mounting frame 1, when the first corrugated pipe 2, the second corrugated pipe 3, the floating frame 4, and the material picking assembly 6 are in a naturally drooping state, by adjusting the vertical position of the first corrugated pipe 2 and / or the second corrugated pipe 3, the bottom side of the connecting plate 42 is made to contact the limiting surface of the first limiting member 7, thus preventing the connecting plate 42 from tilting slightly due to the installation position of the first corrugated pipe 2 and / or the second corrugated pipe 3. At this time, the first corrugated pipe 2 and the second corrugated pipe 3 balance the gravity of the floating frame 4 and the material picking assembly 6. That is, based on the setting of the first limiting member 7, the gravity balance adjustment of the first corrugated pipe 2, the second corrugated pipe 3, the floating frame 4, and the material picking assembly 6 can be made more convenient.

[0033] It should be noted that the first corrugated pipe 2, the second corrugated pipe 3, the floating frame 4 and the picking component 6 being in a naturally drooping state means that when the chip picking device is stationary, the first corrugated pipe 2, the second corrugated pipe 3, the floating frame 4 and the picking component 6 are simply drooping or hanging downwards due to their own gravity.

[0034] Furthermore, the frame 41 has a clearance hole 4101 located below the connecting plate 42. The first limiting member 7 passes through the clearance hole 4101. The advantage of this structure is that the first limiting member 7 does not need to be connected to a position other than the floating frame 4 in the mounting frame 1, and the chip picking device has a compact structure.

[0035] In this embodiment, the chip picking device further includes a second limiting member 8, which is fixedly connected to the mounting frame 1 and is spaced above the connecting plate 42. The second limiting member 8 is used to contact the connecting plate 42 to limit the displacement of the connecting plate 42. Thus, during the movement of the floating frame 4 in the picking operation, it can prevent the actual upward displacement of the floating frame 4 from exceeding the expected or set target displacement. The chip picking device has the characteristics of structural safety and reliability.

[0036] In this embodiment, the first corrugated pipe 2 and the second corrugated pipe 3 have the same structure, size and mechanical properties. Specifically, the corrugated pipe itself has relatively stable elastic characteristics. Within a certain deformation range, its elastic force and deformation amount are basically linearly related. This allows for more precise control of the material taking force during the material taking process. When the material taking force is controlled through the first corrugated pipe 2 and the second corrugated pipe 3, since the structure, size and mechanical properties of the first corrugated pipe 2 and the second corrugated pipe 3 are the same, the differences can be reduced, thereby reducing errors and making the control of the material taking force more precise.

[0037] In this embodiment, the chip feeding device further includes a first mounting base 9 and a second mounting base 10. Both the first mounting base 9 and the second mounting base 10 are connected to the mounting frame 1, and their vertical positions are adjustable. The first corrugated pipe 2 is fixedly connected to the first mounting base 9 to the mounting frame 1, and the second corrugated pipe 3 is fixedly connected to the second mounting base 10 to the mounting frame 1. Specifically, the first mounting base 9 can adjust the vertical position of the first corrugated pipe 2, and the second mounting base 10 can adjust the vertical position of the second corrugated pipe 3. Based on this, the first corrugated pipe 2 and the second corrugated pipe 3 can be aligned horizontally, further reducing differences and thus reducing errors.

[0038] As a specific implementation of this embodiment, both the first mounting base 9 and the second mounting base 10 are provided with waist-shaped holes extending in the vertical direction, and the mounting frame 1 is provided with through holes directly opposite the waist-shaped holes. Both the first mounting base 9 and the second mounting base 10 are fixed to the mounting frame 1 by means of bolts passing through the waist-shaped holes and through holes and being connected to nuts. By loosening the bolts and nuts, the first mounting base 9 and the second mounting base 10 can be adjusted in the vertical direction.

[0039] It should be noted that the first mounting base 9 is also connected to a first air inlet connector that communicates with the first bellows 2, and the second mounting base 10 is also connected to a second air inlet connector that communicates with the second bellows 3. In practical applications, both the first and second air inlet connectors are connected to the air source system through air pipes. The air source system is used to charge or de-charge the first bellows 2 and / or the second bellows 3. To further explain the air source system, it includes air source processing components (air compressor, air pump), air source pressure regulating components (pressure reducing valve), high-precision electro-proportional valve, air tank, directional control valve, flow meter, and pressure switch, etc. Air source processing components (air compressors, air pumps) and air source pressure regulating components (pressure reducing valves) are the basic components for positive pressure input in the air circuit; high-precision electro-proportional valves are used to achieve high-precision air pressure control and ensure air pressure accuracy; air tanks are used to provide a stable flow rate; directional control valves are used to control the bellows to be filled or de-filled; flow meters and pressure switches are used to monitor the airflow stability and air pressure input to the bellows, and will issue an alarm when they deviate from the normal value. Finally, based on the composition of the control air circuit, the bellows can achieve a wide range of thrust.

[0040] In this embodiment, the chip picking device further includes a first guide rail 11 and a second guide rail 12. The first guide rail 11 and the second guide rail 12 are fixedly connected to the mounting frame 1, and the first guide rail 11 and the second guide rail 12 are spaced apart in the horizontal direction. The length direction of the first guide rail 11 and the second guide rail 12 extends in the vertical direction. The two ends of the frame 41 of the floating frame 4 in the horizontal direction are respectively connected to the first guide rail 11 and the second guide rail 12. The configuration of the first guide rail 11 and the second guide rail 12 provides the floating frame 4 with a precise movement direction, ensuring that it moves in the vertical direction. The chip picking device has the characteristics of reliable structure.

[0041] In this embodiment, the chip picking device also includes a sensing element 13, which is fixedly connected to the floating frame 4. The sensing element 13 is used to cooperate with the displacement sensor 5 so that the displacement sensor 5 can monitor the sliding distance of the floating frame 4. The structure is simple and facilitates the displacement sensor 5 to monitor the sliding distance of the floating frame 4.

[0042] In this embodiment, the pick-up assembly 6 includes a direct drive motor 61, a first magnetic base 62, a second magnetic base 63, and a nozzle 64. The direct drive motor 61 is fixedly connected to the floating frame 4. The first magnetic base 62 is fixedly connected to the power output end of the direct drive motor 61. The second magnetic base 63 is detachably connected to the first magnetic base 62. The nozzle 64 is fixedly connected to the second magnetic base 63. The nozzle 64, the second magnetic base 63, the first magnetic base 62, and the direct drive motor 61 are arranged vertically. Specifically, based on the arrangement of the first magnetic base 62 and the second magnetic base 63, the nozzle 64 is detachably connected to the direct drive motor 61. In practical applications, the chip pick-up device can quickly replace the nozzle 64 according to actual needs, and the chip pick-up device has higher applicability to different types of chips.

[0043] Furthermore, the direct drive motor 61 has a negative pressure channel that runs through its central axis. The negative pressure channel passes through the output shaft of the direct drive motor 61. The upper end of the negative pressure channel is connected to an air pipe connector, and the lower end is connected to the suction nozzle 64. The suction nozzle 64 is connected to the negative pressure system through the negative pressure channel and the air pipe connector. Thus, the replacement suction nozzle 64 can be directly connected to the negative pressure channel, making the replacement of the suction nozzle 64 convenient and ensuring that the replaced suction nozzle 64 can perform chip gripping work normally.

[0044] Based on the above-mentioned chip picking device, the present invention also proposes a die bonder, wherein the die bonder includes the chip picking device as described above. Since the die bonder includes the above-mentioned chip picking device, the die bonder also has the advantages of the above-mentioned chip picking device, which will not be elaborated further in this application.

[0045] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A chip picking device, characterized in that, The system includes a mounting frame (1), a first corrugated pipe (2), a second corrugated pipe (3), a floating frame (4), a displacement sensor (5), and a material handling assembly (6). The first corrugated pipe (2) and the second corrugated pipe (3) are spaced apart in the horizontal direction. The length direction of the first corrugated pipe (2) and the second corrugated pipe (3) extends in the vertical direction. One end of the first corrugated pipe (2) and the second corrugated pipe (3) in the vertical direction are fixedly connected to the mounting frame (1), and the other end is fixedly connected to the floating frame (4). The floating frame (4) is fixedly connected to the mounting frame (1), and the floating frame (4) can slide along the vertical direction. The displacement sensor (5) is fixedly connected to the mounting frame (1) and is used to monitor the sliding distance of the floating frame (4) along the vertical direction. The material picking assembly (6) is fixedly connected to the floating frame (4). When the material picking assembly (6) picks up the chip, the first corrugated pipe (2) and / or the second corrugated pipe (3) are filled with a preset amount of gas. The floating frame (4) includes a frame body (41) and a connecting plate (42). The frame body (41) is connected to the mounting frame (1). The connecting plate (42) is horizontally fixed to the top of the frame body (41). The top side of the connecting plate (42) is fixedly connected to the first corrugated pipe (2) and the second corrugated pipe (3). The chip picking device further includes a first limiting member (7), which is fixedly connected to the mounting bracket (1) and located below the connecting plate (42). The first limiting member (7) has a limiting surface that is horizontally set and faces the connecting plate (42). When the first corrugated pipe (2), the second corrugated pipe (3), the floating frame (4) and the material picking assembly (6) are in a natural hanging state, the bottom side of the connecting plate (42) is in contact with the limiting surface of the first limiting member (7).

2. The chip feeding device according to claim 1, characterized in that, The frame (41) has a clearance hole (4101) located below the connecting plate (42), and the first limiting member (7) passes through the clearance hole (4101).

3. The chip feeding device according to claim 1, characterized in that, The chip picking device further includes a second limiting member (8), which is fixedly connected to the mounting bracket (1) and is spaced above the connecting plate (42). The second limiting member (8) is used to contact the connecting plate (42) to limit the displacement of the connecting plate (42).

4. The chip picking device according to any one of claims 1-3, characterized in that, The first corrugated pipe (2) and the second corrugated pipe (3) have the same structure, size and mechanical properties.

5. The chip feeding device according to claim 4, characterized in that, The chip feeding device further includes a first mounting base (9) and a second mounting base (10), both of which are connected to the mounting frame (1), and the positions of the first mounting base (9) and the second mounting base (10) in the vertical direction can be adjusted. The first corrugated pipe (2) is fixedly connected to the first mounting base (9) to be connected to the mounting frame (1), and the second corrugated pipe (3) is fixedly connected to the second mounting base (10) to be connected to the mounting frame (1).

6. The chip picking device according to claim 4, characterized in that, The chip feeding device further includes a first guide rail (11) and a second guide rail (12). The first guide rail (11) and the second guide rail (12) are fixedly connected to the mounting bracket (1), and the first guide rail (11) and the second guide rail (12) are spaced apart along the horizontal direction. The length direction of the first guide rail (11) and the second guide rail (12) extends along the vertical direction. The floating frame (4) is connected to the first guide rail (11) and the second guide rail (12) at both ends along the horizontal direction, respectively.

7. The chip feeding device according to claim 1, characterized in that, The chip picking device also includes a sensor (13), which is fixedly connected to the floating frame (4). The sensor (13) is used to cooperate with the displacement sensor (5) so that the displacement sensor (5) can monitor the sliding distance of the floating frame (4).

8. The chip feeding device according to claim 1, characterized in that, The material handling assembly (6) includes a direct drive motor (61), a first magnetic base (62), a second magnetic base (63), and a suction nozzle (64). The direct drive motor (61) is fixedly connected to the floating frame (4). The first magnetic base (62) is fixedly connected to the power output end of the direct drive motor (61). The second magnetic base (63) is detachably connected to the first magnetic base (62). The suction nozzle (64) is fixedly connected to the second magnetic base (63). The suction nozzle (64), the second magnetic base (63), the first magnetic base (62), and the direct drive motor (61) are arranged along the vertical direction.

9. A die bonder, characterized in that, Includes the chip picking device as described in any one of claims 1-8.

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