Substrate processing apparatus

Abstract

The invention provides a substrate processing apparatus capable of efficiently processing a substrate. A substrate processing apparatus for processing a substrate includes: a posture conversion mechanism that converts a posture of the substrate into a horizontal holding posture and a vertical holding posture; a pusher mechanism having a pusher member that combines the second substrate group in the vertical holding posture held by the posture conversion mechanism and the first substrate group in the vertical holding posture delivered in advance from the posture conversion mechanism, and holds a plurality of substrates arranged at a narrow interval narrower than the equal pitch; a pitch conversion unit that receives the plurality of substrates arranged at the narrow intervals and arranges the plurality of substrates arranged at the narrow intervals at a narrow pitch narrower than the equal pitch; a substrate processing unit that processes the plurality of substrates arranged at the narrow pitch together; and a main transport mechanism that transports the plurality of substrates arranged at the narrow pitch to the substrate processing unit, and the pitch conversion unit is disposed on the main transport mechanism side of the pusher mechanism.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for processing substrates. Examples of such substrates include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disc substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of FPDs include liquid crystal displays and organic EL (electroluminescence) displays. Background Art

[0002] Currently, there are known substrate processing devices that process multiple substrates simultaneously while immersed in a processing liquid. These substrate processing devices include a posture conversion mechanism and a pusher (see, for example, Japanese Patent Application Laid-Open No. 2010-93230). The posture conversion mechanism converts the substrate's posture between a horizontal and vertical posture. The pusher transfers multiple vertically positioned substrates to and from the posture conversion mechanism by vertically moving a lifting and holding portion.

[0003] The pusher combines the substrate group held by the posture conversion mechanism with the substrate group previously delivered from the posture conversion mechanism, and then uses the lifting and holding unit to hold multiple substrates. The combination of substrate groups by the lifting and holding unit is a form of pitch conversion. The multiple substrates held by the lifting and holding unit are arranged at a half-pitch, for example, half the substrate holding pitch within the carrier. By processing substrates arranged at half-pitch together, the amount of processing fluid used can be reduced. Summary of the Invention

[0004] Problems to be solved by the invention

[0005] In order to further reduce the amount of processing liquid (chemical liquid and cleaning liquid) used in a substrate processing apparatus, it is desirable to arrange multiple substrates at a narrow pitch narrower than a half pitch and process the multiple substrates arranged at the narrow pitch at once.

[0006] In this case, the substrate group held by the posture conversion mechanism must be combined with the substrate group previously delivered from the posture conversion mechanism, and the multiple substrates must be held by the lifting and holding unit before the pitch conversion is performed. This further increases the time required for the pitch conversion. Consequently, conventional devices suffer from the problem of inefficient substrate processing.

[0007] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of efficiently processing a substrate.

[0008] Solutions to Problems

[0009] The present invention adopts the following structure to achieve such an object.

[0010] That is, the substrate processing apparatus of the present invention processes substrates and comprises: a posture conversion mechanism for converting the posture of the substrates into a horizontal holding posture for holding a group of substrates in a horizontal position arranged at equal intervals in a vertical direction, and a vertical holding posture for holding a group of substrates in a vertical position arranged at the equal intervals in a horizontal direction; a pusher mechanism having a pusher member for combining a second group of substrates in the vertical holding posture held by the posture conversion mechanism with a first group of substrates in the vertical holding posture delivered in advance from the posture conversion mechanism, and holding a plurality of substrates arranged at narrow intervals narrower than the equal intervals; a pitch conversion section for receiving the plurality of substrates arranged at the narrow intervals and arranging the plurality of substrates arranged at the narrow intervals at a narrow interval narrower than the equal intervals; a substrate processing section for collectively processing the plurality of substrates arranged at the narrow intervals; and a main transport mechanism for collectively transporting the plurality of substrates arranged at the narrow intervals to the substrate processing section, the pitch conversion section being disposed on the main transport mechanism side of the pusher mechanism.

[0011] According to the substrate processing device of the present invention, the pusher mechanism combines the second substrate group in the vertical holding posture maintained by the posture conversion mechanism and the first substrate group in the vertical holding posture delivered in advance from the posture conversion mechanism, and maintains multiple substrates arranged at narrow intervals narrower than the equal interval. The process of forming multiple substrates arranged at narrow intervals from the equal-interval substrate group is called the first stage of pitch conversion. The pitch conversion unit receives the multiple substrates arranged at narrow intervals and arranges the multiple substrates arranged at narrow intervals at narrow intervals narrower than the equal interval. The process of forming multiple substrates arranged at narrow intervals from the multiple substrates arranged at narrow intervals is called the second stage of pitch conversion. In the present invention, the second stage of pitch conversion is not performed by the pusher mechanism, but by the pitch conversion unit arranged on the main conveying mechanism side of the pusher mechanism. That is, the second stage of pitch conversion is performed at a position that does not reduce productivity. Therefore, the substrate can be processed efficiently.

[0012] In addition, in the substrate processing device of the present invention, it is preferred that the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals are multiple substrates arranged at unequal intervals that alternately repeat a first interval narrower than the above-mentioned equal interval and a second interval narrower than the above-mentioned equal interval and wider than the above-mentioned first interval, the above-mentioned equal interval is equal to the sum of the above-mentioned first interval and the above-mentioned second interval, and the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals are multiple substrates arranged by repeating the above-mentioned first interval.

[0013] Therefore, the second intervals of uneven pitch formed by the first stage of pitch conversion narrow until they become the first intervals, so the second stage of pitch conversion can be carried out in an orderly manner. Therefore, the second stage of pitch conversion can be carried out in an orderly manner at a position that does not reduce the productivity of the first stage of pitch conversion.

[0014] In addition, in the substrate processing device of the present invention, it is preferred that the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals are the above-mentioned multiple substrates arranged at a first narrow interval narrower than the above-mentioned equal interval, and the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals are the above-mentioned multiple substrates arranged at a second narrow interval narrower than the above-mentioned first narrow interval.

[0015] Therefore, the first narrow pitch formed by the first stage of pitch conversion narrows until it becomes the second narrow pitch, allowing for smooth and orderly pitch conversion in the second stage. However, the second stage of pitch conversion is performed at a location that does not reduce productivity, thus enabling efficient substrate processing.

[0016] In addition, in the substrate processing device of the present invention, it is preferred that the above-mentioned substrate processing device has a lateral movement mechanism, which causes the lateral movement holding part that holds the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals received from the above-mentioned pusher part to move laterally along the lateral movement path between the substrate transfer position and the substrate handover position. The above-mentioned substrate transfer position is a position where the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals are handed over together between the above-mentioned pusher part and the above-mentioned lateral movement holding part, and the above-mentioned substrate handover position is a position where the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals are handed over together between the above-mentioned spacing conversion part and the above-mentioned main conveying device. The above-mentioned spacing conversion part performs the handover of the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals with the above-mentioned lateral movement holding part by rising and falling at the above-mentioned substrate handover position, and the above-mentioned spacing conversion part is arranged at the above-mentioned substrate handover position.

[0017] This allows the pitch converter, which performs the second-stage pitch conversion, to be positioned away from the pusher mechanism, which performs the first-stage pitch conversion. In other words, the second-stage pitch conversion is performed at a location that does not reduce the productivity of the first-stage pitch conversion. Consequently, substrates can be processed efficiently.

[0018] Furthermore, in the substrate processing apparatus of the present invention, it is preferable that the pitch converter is arranged below the lateral movement path.

[0019] Thus, the work at the lateral movement holding portion and the work at the pitch conversion portion can be performed simultaneously, partially simultaneously, or at close timings.

[0020] In addition, in the substrate processing device of the present invention, it is preferred that the substrate processing device comprises: a lateral movement mechanism, which causes the lateral movement holding portion that holds the plurality of substrates arranged at the narrow intervals received from the pusher component to move laterally along a lateral movement path between a substrate transfer position and a substrate handover position; and an intermediary mechanism, which causes the intermediary holding portion that holds the plurality of substrates arranged at the narrow intervals to rise and fall at the substrate handover position, wherein the substrate transfer position is a position where the plurality of substrates are handed over at the narrow intervals between the pusher component and the lateral movement holding portion. The position of the above-mentioned multiple substrates arranged at intervals, the above-mentioned substrate handover position is the position where the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals are handed over between the above-mentioned intermediate holding part and the above-mentioned main conveying device, the above-mentioned spacing conversion part is lifted and lowered at the above-mentioned substrate handover position to transfer the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals between the above-mentioned horizontal movement holding part, the above-mentioned intermediate holding part is lifted and lowered at the above-mentioned substrate handover position to transfer the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals between the above-mentioned spacing conversion part, and the above-mentioned spacing conversion part is configured at the above-mentioned substrate handover position.

[0021] This allows the pitch converter, which performs the second-stage pitch conversion, to be positioned away from the pusher mechanism, which performs the first-stage pitch conversion. In other words, the second-stage pitch conversion is performed at a location that does not reduce the productivity of the first-stage pitch conversion. Consequently, substrates can be processed efficiently.

[0022] Furthermore, in the substrate processing apparatus of the present invention, it is preferable that the pitch converter is disposed below the intermediate holding portion.

[0023] Thus, the work at the pitch conversion portion and the work at the intermediate holding portion can be performed simultaneously, partially simultaneously, or at close timings.

[0024] Furthermore, in the substrate processing apparatus of the present invention, it is preferable that the pitch converter is arranged below the lateral movement path.

[0025] Thus, the work at the lateral movement holding portion, the work at the pitch conversion portion, and the work at the intermediate holding portion can be performed simultaneously, partially simultaneously, or at close timings.

[0026] In addition, in the substrate processing device of the present invention, it is preferred that the above-mentioned substrate processing device includes: a first lateral movement mechanism, which causes the first lateral movement holding portion that holds the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals and received from the above-mentioned pusher component to move laterally along the first lateral movement path; and a second lateral movement mechanism, which causes the second lateral movement holding portion that holds the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals and delivered to the above-mentioned pusher component to move laterally along the second lateral movement path, and the above-mentioned spacing conversion portion includes: a first spacing conversion portion that receives the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals and arranges the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals at the above-mentioned narrow intervals; and a second spacing conversion portion that receives the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals and arranges the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals at the above-mentioned narrow intervals.

[0027] The two-stage pitch conversion is split between the pusher mechanism and the pitch conversion unit. Furthermore, pitch conversion is split between the first and second pitch conversion units, depending on the substrate processing stage. This eliminates any loss in productivity, enabling efficient substrate processing.

[0028] In addition, in the substrate processing device of the present invention, it is preferred that the above-mentioned first lateral movement path is a path between the substrate transfer position and the substrate carry-in position, the above-mentioned second lateral movement path is a path between the substrate carry-out position and the substrate transfer position, the above-mentioned first lateral movement path and the above-mentioned second lateral movement path are arranged at positions separated along the lateral direction, the above-mentioned first spacing conversion part is arranged at the above-mentioned substrate carry-in position, and the above-mentioned second spacing conversion part is arranged at the above-mentioned substrate carry-out position.

[0029] The first and second lateral travel paths are located at laterally separated positions. This reduces the height of the substrate processing apparatus. The first and second pitch converters perform pitch conversion at laterally separated positions. Therefore, the first and second pitch converters do not interfere with each other, allowing them to perform pitch conversion simultaneously, partially simultaneously, or at close intervals. This improves productivity and, as a result, enables efficient substrate processing.

[0030] In addition, in the substrate processing apparatus of the present invention, it is preferred that the first pitch conversion portion receives the plurality of substrates arranged at the narrow intervals from the first lateral movement holding portion and carries the plurality of substrates arranged at the narrow intervals into the main transport mechanism.

[0031] Thus, the substrate can be efficiently carried in between the first lateral movement holding portion, the first pitch converting portion, and the main transport mechanism.

[0032] In addition, in the substrate processing device of the present invention, it is preferred that an intermediary mechanism is provided, which causes the intermediary holding part that holds the above-mentioned multiple substrates arranged at the above-mentioned narrow pitch to rise at the above-mentioned substrate carry-in position, the above-mentioned substrate transfer position is a position where the above-mentioned multiple substrates arranged at the above-mentioned narrow pitch are moved from the above-mentioned pusher part to the above-mentioned first lateral movement holding part, the above-mentioned substrate carry-in position is a position where the above-mentioned multiple substrates arranged at the above-mentioned narrow pitch are moved from the above-mentioned intermediary holding part to the above-mentioned main conveying mechanism, the above-mentioned first pitch conversion part moves the above-mentioned multiple substrates arranged at the above-mentioned narrow pitch from the above-mentioned first lateral movement holding part by rising at the above-mentioned substrate carry-in position, the above-mentioned intermediary holding part moves the above-mentioned multiple substrates arranged at the above-mentioned narrow pitch from the above-mentioned pitch conversion part by rising at the above-mentioned substrate carry-in position, and the above-mentioned first pitch conversion part is arranged at the above-mentioned substrate carry-in position.

[0033] Thus, in the process of carrying in the substrate between the first transverse movement holding section, the first pitch converter, the intermediate holding section, and the main transport mechanism, the pitch conversion by the first pitch converter can be efficiently performed.

[0034] Furthermore, in the substrate processing apparatus of the present invention, it is preferable that the first pitch converter is disposed below the intermediate holding portion.

[0035] Thus, the work on the first pitch conversion portion and the work on the intermediate holding portion can be performed simultaneously, partially simultaneously, or at close timings.

[0036] Furthermore, in the substrate processing apparatus of the present invention, it is preferable that the first pitch converter is disposed below the first lateral movement path.

[0037] Thus, the work at the first lateral movement holding portion, the work at the first pitch conversion portion, and the work at the intermediate holding portion can be performed simultaneously, partially simultaneously, or at close timings.

[0038] In addition, in the substrate processing device of the present invention, it is preferred that the above-mentioned second spacing conversion part receives the above-mentioned multiple substrates arranged at the above-mentioned narrow spacing from the above-mentioned main conveying mechanism, and carries out the above-mentioned multiple substrates arranged at the above-mentioned narrow spacing to the above-mentioned second lateral movement holding part, and the above-mentioned second spacing conversion part is arranged at the above-mentioned substrate carrying-out position.

[0039] Thus, during the unloading process of the substrate, the pitch conversion by the second pitch converting portion can be performed efficiently.

[0040] Furthermore, in the substrate processing apparatus of the present invention, it is preferable that the second pitch converter is disposed below the second lateral movement path.

[0041] Thus, the work at the second pitch conversion portion and the work at the second lateral movement maintaining portion can be performed simultaneously, partially simultaneously, or at close timings.

[0042] Furthermore, in the substrate processing apparatus of the present invention, it is preferable that the second pitch converter is arranged above the first pitch converter.

[0043] Thus, the work at the first pitch conversion portion and the work at the second pitch conversion portion can be performed simultaneously, partially simultaneously, or at close timings.

[0044] Furthermore, in the substrate processing apparatus of the present invention, it is preferable that the second pitch converter is disposed above the intermediate holding portion.

[0045] Thus, the work at the first pitch conversion portion, the work at the intermediate holding portion, and the work at the second pitch conversion portion can be performed simultaneously, partially simultaneously, or at close timings.

[0046] In addition, in the substrate processing device of the present invention, it is preferred that the above-mentioned first lateral movement path and the above-mentioned second lateral movement path intersect at a predetermined angle, the above-mentioned pusher mechanism is arranged at the position intersecting at the above-mentioned predetermined angle, and the above-mentioned first spacing conversion part and the above-mentioned second spacing conversion part are separated and arranged at the above-mentioned predetermined angle.

[0047] Thus, the first pitch conversion portion and the second pitch conversion portion can be separated to positions where interference is less likely to occur.

[0048] In addition, in the substrate processing device of the present invention, it is preferred that the above-mentioned substrate processing device has a lateral movement mechanism, which enables the lateral movement holding part that holds the above-mentioned multiple substrates arranged at the above-mentioned narrow intervals received from the above-mentioned pusher part to move laterally along the lateral movement path between the substrate transfer position and the substrate handover position, and the above-mentioned spacing conversion part is equipped with the above-mentioned lateral movement mechanism.

[0049] Thus, the height of the substrate processing apparatus can be suppressed by an amount corresponding to the integration of the pitch converter and the lateral movement mechanism.

[0050] Furthermore, in the substrate processing apparatus of the present invention, it is preferable that the first pitch conversion portion is provided in the first lateral movement mechanism, and the second pitch conversion portion is provided in the second lateral movement mechanism.

[0051] Thus, the height of the substrate processing apparatus can be suppressed by an amount corresponding to the integration of the first pitch converter and the first lateral movement mechanism, and the integration of the second pitch converter and the second lateral movement mechanism.

[0052] Effects of the Invention

[0053] According to the substrate processing apparatus of the present invention, it is possible to perform other processing corresponding to pre-processing or post-processing at the substrate processing section while performing pitch conversion, thereby enabling efficient substrate processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] For the purpose of illustrating the invention, several embodiments presently considered to be preferred are shown in the drawings; however, it should be understood that the invention is not limited to the illustrated structures and measures.

[0055] Figure 1 This is a plan view showing a schematic structure of a substrate processing apparatus according to Example 1.

[0056] Figure 2 It is a plan view showing the structure of the transfer block and its surroundings.

[0057] Figure 3 It is a side view showing the substrate operating mechanism.

[0058] Figure 4 It is a side view showing the posture conversion unit.

[0059] Figure 5 It is a side view showing the pusher mechanism.

[0060] Figure 6 It is a side view showing the pusher component in longitudinal section.

[0061] Figure 7 Is to say Figure 2 A side view of the handover mechanism and two pitch conversion parts when viewed as shown by arrow AA.

[0062] Figure 8 This is a plan view that mainly shows the moving-in and moving-out mechanisms.

[0063] Figure 9 It is a floor plan that primarily represents an intermediary agency.

[0064] Figure 10 This is a side view schematically showing the structure of a pitch converter that holds a plurality of substrates arranged at unequal pitches.

[0065] Figure 11 This is a side view schematically showing the structure of a pitch converter that holds a plurality of substrates arranged at a narrow pitch.

[0066] Figure 12 This is a bottom view mainly showing the telescopic mechanism of the pitch conversion portion that holds a plurality of substrates arranged at unequal pitches.

[0067] Figure 13 This is a bottom view mainly showing the telescopic mechanism of the pitch conversion portion that holds a plurality of substrates arranged at a narrow pitch.

[0068] Figure 14 This is a flowchart for explaining the first half of the operation of the substrate processing apparatus.

[0069] Figure 15A 、 Figure 15B 、 Figure 15C It is a side view for explaining the operation of the substrate processing apparatus.

[0070] Figure 16A 、 Figure 16B 、 Figure 16C It is a side view for explaining the operation of the substrate processing apparatus.

[0071] Figure 17A 、 Figure 17B 、 Figure 17C It is a side view for explaining the operation of the substrate processing apparatus.

[0072] Figure 18A 、 Figure 18B It is a side view for explaining the operation of the substrate processing apparatus.

[0073] Figure 19A 、 Figure 19B It is a side view for explaining the operation of the substrate processing apparatus.

[0074] Figure 20A 、 Figure 20B It is a side view for explaining the operation of the substrate processing apparatus.

[0075] Figure 21 This is a flowchart for explaining the second half of the operation of the substrate processing apparatus.

[0076] Figure 22A 、 Figure 22B It is a side view for explaining the operation of the substrate processing apparatus.

[0077] Figure 23A 、 Figure 23B It is a side view for explaining the operation of the substrate processing apparatus.

[0078] Figure 24A 、 Figure 24B It is a side view for explaining the operation of the substrate processing apparatus.

[0079] Figure 25A 、 Figure 25B 、 Figure 25C It is a side view for explaining the operation of the substrate processing apparatus.

[0080] Figure 26A 、 Figure 26B 、 Figure 26C It is a side view for explaining the operation of the substrate processing apparatus.

[0081] Figure 27This is a plan view showing the structure of the transfer block and its surroundings in Example 2.

[0082] Figure 28 Is to say Figure 27 A side view of the handover mechanism and two pitch conversion parts when viewed as shown by arrow AA.

[0083] Figure 29 This is a plan view showing the structure of the transfer block and its surroundings in Example 3.

[0084] Figure 30 Is to say Figure 29 A side view of the handover mechanism and two pitch conversion parts when viewed as shown by arrow AA.

[0085] Figure 31 It is a plan view showing the structure of the transfer block and its surroundings in Example 4.

[0086] Figure 32 Is to say Figure 31 A side view of the handover mechanism and two pitch conversion parts when viewed as shown by arrow AA.

[0087] Figure 33 It is a plan view showing the structure of the transfer block and its surroundings in Example 5.

[0088] Figure 34 It is a side view showing the telescopic mechanism of the pitch conversion portion provided on the pair of chuck members of the carry-in mechanism and the pair of chuck members of the carry-out mechanism.

[0089] Figure 35 It is a side view showing the telescopic mechanism of the pitch conversion portion provided on the pair of chuck members of the carry-in mechanism and the pair of chuck members of the carry-out mechanism.

[0090] In the picture:

[0091] 1—substrate processing device, 7—processing block, 19—posture conversion unit, 21—pusher mechanism, 25—first pitch conversion unit, 26—second pitch conversion unit, WTR—main transport mechanism. DETAILED DESCRIPTION

[0092] [Example 1]

[0093] Hereinafter, Example 1 of the present invention will be described with reference to the accompanying drawings. Figure 1 It is a plan view showing a schematic structure of the substrate processing apparatus 1 according to the first embodiment. Figure 2 It is a plan view showing the transfer block 5 and the surrounding structure.

[0094] In this specification, for the sake of convenience, the direction in which the transfer block 5 and the processing block 7 are arranged is referred to as the "front-back direction X". The front-back direction X is a horizontal direction. The direction in the front-back direction X, for example, from the processing block 7 toward the transfer block 5, is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction perpendicular to the front-back direction X is referred to as the "width direction Y". One direction of the "width direction" is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". The vertical direction Z is expressed as "above" and "below". In each figure, the front, back, right, left, top and bottom are appropriately shown for reference.

[0095] <1. Structure of Substrate Processing Apparatus>

[0096] Reference Figure 1 The substrate processing apparatus 1 processes substrates W. The substrate processing apparatus 1 is a batch-type substrate processing apparatus that processes multiple substrates W (e.g., 50, 75, or 100 substrates) at once. The substrate processing apparatus 1 performs, for example, chemical treatment, cleaning, and drying on the substrates W. The substrate processing apparatus 1 includes a stocker 2, a carrier 3, a transfer block 5, a processing block 7, and a batch substrate transfer area 8.

[0097] <1-1. Storage>

[0098] The storage 2 accommodates at least one carrier C. The storage 2 is adjacent to the front of the transfer block 5. The carrier C stores multiple (for example, 25) substrates W in a horizontal posture at predetermined intervals (for example, 10 mm). In other words, the carrier C stores N (for example, 25) substrates W arranged at a reference pitch in a horizontal posture. In addition, "N" of the N substrates W is a natural number greater than 2. In addition, the reference pitch repeats the reference pitch TN9 (for example, 10 mm). That is, when the reference pitch TN9 is 10 mm, the reference pitch is a 10 mm pitch. The N substrates W in the carrier C are arranged in the vertical direction Z or the thickness direction of each substrate W. As the carrier C, for example, a FOUP (Front Opening Unify Pod) is used, but it is not limited to this.

[0099] The stocker 2 has multiple (e.g., two) loading ports 9. The two loading ports 9 are arranged along the width direction Y. In this embodiment, the two loading ports 9 are used to load and unload carriers C. Furthermore, the stocker 2 has at least one storage rack 11 and a carrier transport robot 13. Carriers C are loaded on the storage rack 11.

[0100] The carrier transport robot 13 transports carriers C between the two loading ports 9, the storage rack 11, and the loading rack 3. The carrier transport robot 13 includes a gripping portion 15 for gripping, for example, a protrusion provided on the upper surface of the carrier C. The carrier transport robot 13 can move the gripping portion 15 in the horizontal direction (front-back direction X and width direction Y) and in the vertical direction Z. The carrier transport robot 13 is driven by one or more electric motors.

[0101] The carrier rack 3 is disposed in the area of the stocker 2. The carrier rack 3 is adjacent to the front of the transfer block 5. The carrier C is placed on the carrier rack 3.

[0102] <1-2. Transfer Block>

[0103] Reference Figure 1 、 Figure 2 The transfer block 5 includes a substrate handling mechanism (robot) HTR, a posture conversion unit 19 , a pusher mechanism 21 , a transfer mechanism 23 , and two pitch conversion units 25 and 26 .

[0104] The substrate handling mechanism HTR is arranged behind the carrier 3. The substrate handling mechanism HTR transports a plurality of (for example, 25) substrates W in a horizontal posture between the carrier C placed on the carrier 3 and the posture conversion unit 19. Figure 3 As shown, the substrate handling mechanism HTR includes a plurality (e.g., 25 or 13) of robots 27. Each robot 27 holds a substrate W. The plurality of robots 27 are arranged at a reference pitch along the vertical direction Z. Thus, for example, 25 substrates W held by the 25 robots 27 are arranged at a reference pitch. Furthermore, the reference pitch repeats a reference interval TN9 (e.g., 10 mm).

[0105] In addition, Figure 3 For ease of illustration, the substrate handling mechanism HTR is assumed to include five robots 27. Furthermore, a pair of horizontal holding portions 37 and a pair of vertical holding portions 39, described later, are assumed to hold five substrates W. Furthermore, a pusher member 55, described later, is assumed to support ten substrates W.

[0106] The substrate handling mechanism HTR also includes a robot support portion 29, an advance and retreat portion 31, and a lifting and rotating portion 33. The robot support portion 29 supports a plurality of robots 27. The advance and retreat portion 31 moves the plurality of robots 27 forward and backward via the robot support portion 29. In order to change the orientation of the robots 27, the lifting and rotating portion 33 rotates the advance and retreat portion 31 around the vertical axis AX1. The lifting and rotating portion 33 is fixed to the floor surface. In addition, the advance and retreat portion 31 and the lifting and rotating portion 33 each include an electric motor. In addition, the substrate handling mechanism HTR may also include a movable robot (not shown) other than the robot 27 for carrying only one substrate W.

[0107] The posture conversion unit 19 converts a plurality of (for example, 25) substrates W between a horizontal posture and a vertical posture. The posture conversion unit 19 is arranged on the left side of the substrate manipulation mechanism HTR. Figure 4 As shown, the posture conversion unit 19 includes a support base 35 , a pair of horizontal holding units 37 , a pair of vertical holding units 39 , and a rotation drive unit 41 .

[0108] The support table 35 is supported so as to be rotatable about a horizontal axis AX2 extending in the front-to-back direction X. A pair of horizontal holding portions 37 and a pair of vertical holding portions 39 are provided to extend at right angles from the support surface 35A. When the multiple substrates W are in a horizontal position, the pair of horizontal holding portions 37 hold the multiple substrates W. In other words, when the multiple substrates W are in a horizontal position, the multiple substrates W are placed on the pair of horizontal holding portions 37. Furthermore, when the multiple substrates W are in a vertical position, the pair of vertical holding portions 39 hold the multiple substrates W.

[0109] The pair of horizontal holding portions 37 and the pair of vertical holding portions 39 are both arranged along the front-back direction X (see Figure 2 ). Furthermore, when the pair of horizontal holding members 37 hold a plurality of substrates W in a horizontal position, the pair of vertical holding members 39 are arranged closer to the pusher mechanism 21 than the pair of horizontal holding members 37. The pair of horizontal holding members 37 include multiple pairs (e.g., 25 pairs, 38 pairs, or 50 pairs) of shelves 37A arranged at a reference pitch along the direction DR1 in which the pair of horizontal holding members 37 extend. The pair of vertical holding members 39 include multiple pairs (e.g., 25 pairs, 38 pairs, or 50 pairs) of holding grooves 39A arranged at a reference pitch along the direction DR1 in which the pair of vertical holding members 39 extend.

[0110] The posture conversion unit 19 also includes an axially movable portion 51 and an accommodating movable portion 53. The axially movable portion 51 moves the pair of horizontal holding portions 37 by a predetermined small distance in the direction DR1 in which the pair of horizontal holding portions 37 extend. The accommodating movable portion 53 moves the pair of vertical holding portions 39 toward or away from the pair of horizontal holding portions 37. For example, when the pair of horizontal holding portions 37 are holding multiple substrates W in a horizontal posture, the accommodating movable portion 53 can move the pair of vertical holding portions 39 in the width direction Y. The rotational drive unit 41 converts the multiple substrates W held by the pair of horizontal holding portions 37 and the pair of vertical holding portions 39 between a horizontal posture and a vertical posture.

[0111] The rotation drive unit 41 includes, for example, an electric motor. The axial movement unit 51 and the accommodation movement unit 53 each include an air cylinder or an electric actuator. The electric actuator includes an electric motor.

[0112] The pusher mechanism 21 is arranged on the left side of the posture conversion unit 19. Figure 5As shown, the pusher mechanism 21 includes a pusher member 55 , a rotating shaft 57 , a pusher rotating portion 59 , a pusher horizontal moving portion 61 , an elevating platform 63 , and a pusher elevating portion 65 .

[0113] The pusher member 55 holds the plurality of substrates W arranged at narrow intervals narrower than the reference pitch of the repetitive reference interval TN9. Figure 6 As shown, the pusher member 55 holds a plurality of substrates W (e.g., 50, 75, or 100) arranged at unequal intervals, alternating between first intervals TN1 (e.g., 3.333 mm) and second intervals TN2 (e.g., 6.666 mm), in a vertical position. The second interval TN2 is wider than the first interval TN1 (second interval TN2 > first interval TN1). The first interval TN1 is also referred to as a narrow interval, and the second interval TN2 is also referred to as a wide interval.

[0114] like Figure 6 As shown, the pusher member 55 includes a plurality (e.g., 50, 75, or 100) of vertical holding grooves 67 to hold multiple substrates W in a vertical position. The plurality of vertical holding grooves 67 are arranged at unequal intervals, for example, alternating first intervals TN1 and second intervals TN2. The sum of the first interval TN1 (e.g., 3.333 mm) and the second interval TN2 (e.g., 6.666 mm) is a reference interval TN9 (e.g., 10 mm).

[0115] Reference Figure 5 . The lower surface of the pusher component 55 is connected to the upper end of the rotating shaft body 57. The pusher rotating part 59 rotates the pusher component 55 and the rotating shaft body 57 around the vertical axis AX3 passing through the rotating shaft body 57. As a result, the plurality of substrates W supported in a vertical posture by the pusher component 55 rotate around the vertical axis AX3. The pusher rotating part 59 includes, for example, an electric motor. The pusher rotating part 59 is provided below the pusher component 55. In addition, the pusher rotating part 59 is mounted on the upper surface of the lifting platform 63 via the pusher horizontal moving part 61.

[0116] The pusher horizontal moving unit 61 includes two guide rails 61A extending in the width direction Y, a slider 61B, and an electric motor (not shown). The two guide rails 61A are provided on the upper surface of the lifting platform 63. The slider 61B moves along the two guide rails 61A in the width direction Y. The slider 61B is driven by the electric motor. The pusher lifting unit 65 raises and lowers the lifting platform 63 in the vertical direction Z. This causes the pusher member 55 to rise and fall. The pusher lifting unit 65 includes, for example, an electric actuator.

[0117] Reference Figure 2. The two spacing conversion parts 25 and 26 are arranged on the main transport mechanism WTR side of the pusher mechanism 21, that is, on the left side of the pusher mechanism 21. In addition, if the two spacing conversion parts 25 and 26 are arranged along the vertical direction Z, the substrate processing device 1 will become unnecessarily high. From this point of view, the two spacing conversion parts 25 and 26 are arranged along the front-to-back direction X. That is, the first spacing conversion part 25 is arranged behind the second spacing conversion part 26 when viewed in a planar manner. Therefore, it is possible to prevent the substrate processing device 1 from becoming unnecessarily high. The handover mechanism 23, for example, transports a plurality of substrates W arranged at unequal intervals between the pusher component 55 and the two spacing conversion parts 25 and 26.

[0118] The first spacing conversion part 25 and the second spacing conversion part 26 are arranged to be separated by a predetermined angle α with the substrate transfer position Po of the pusher mechanism 21 as the center. That is, the first spacing conversion part 25 is located at the substrate carry-in position Pin separated from the second spacing conversion part 26 by a predetermined angle α. The second spacing conversion part 26 is located at the substrate carry-out position Pout separated from the first spacing conversion part 25 by a predetermined angle α. In addition, the first lateral movement path Rin of the lateral movement of the first spacing conversion part 25 and the second lateral movement path Rout of the lateral movement of the second spacing conversion part 26 described later intersect at a predetermined angle α. The pusher mechanism 21 is arranged at a position where they intersect at a predetermined angle α. In this way, the first spacing conversion part 25 and the second spacing conversion part 26 are separated to a position where interference is difficult. In addition, the substrate transfer position Po, the substrate carry-in position Pin, and the second lateral movement path Rout are as follows Figure 2 The position of the transfer block 5 is observed in a plan view.

[0119] Reference Figure 2 、 Figure 7 . Figure 7 Is to say Figure 2 1 is a side view of the transfer mechanism 23 and the two pitch conversion parts 25 and 26 when viewed as shown by arrows A-A. The transfer mechanism 23 includes a carry-in mechanism 71, an intermediary mechanism 73, and a carry-out mechanism 75. The carry-in mechanism 71 transports a plurality of substrates W arranged at unequal pitches from the pusher component 55 to the first pitch conversion part 25. The intermediary mechanism 73 transports a plurality of substrates W arranged at narrow pitches from the first pitch conversion part 25 to the first transfer position P1. The carry-out mechanism 75 transports a plurality of substrates W arranged at unequal pitches from the second pitch conversion part 26 to the pusher component 55. The carry-in mechanism 71, the intermediary mechanism 73, and the carry-out mechanism 75 include a chuck 77, a chuck 78, and a chuck 79, respectively.

[0120] like Figure 7As shown, the carry-in mechanism 71 is arranged at the carry-in height position H1 at the substrate carry-in position Pin. The carry-in mechanism 71 is arranged, for example, on the side of the lifting portion 141 of the second pitch conversion unit 26 at the substrate carry-in position Pin. The chuck 78 of the intermediary mechanism 73 is provided above the first pitch conversion unit 25 at the substrate carry-in position Pin. In addition, the chuck 78 of the intermediary mechanism 73 is arranged between the carry-in height position H1 and the first handover position P1 at the substrate carry-in position Pin. The first handover position P1 is a position higher than the carry-in height position H1 and the carry-out height position H2 at the substrate carry-in position Pin. The carry-out mechanism 75 is arranged at the carry-out height position H2 higher than the carry-in height position H1 at the substrate carry-in position Pout. The carry-in mechanism 71 and the carry-out mechanism 75 are respectively configured so that the carry-out mechanism 75 and the plurality of substrates W held by the carry-out mechanism 75 do not interfere with the carry-in mechanism 71 and the plurality of other substrates W held by the carry-in mechanism 71. The substrate carrying-in position Pin and the substrate carrying-out position Pout are set at positions sufficiently separated in the front-back direction X. Figure 7 As shown in FIG. 1 , the substrate carry-in position Pin is sometimes indicated by a two-dot chain line extending in the vertical direction Z. The substrate carry-out position Pout is sometimes indicated by a one-dot chain line extending in the vertical direction Z.

[0121] Figure 8 This is a plan view primarily showing the load-in mechanism 71 and the carry-out mechanism 75. The load-in mechanism 71 is located at the substrate load-in position Pin, which is located behind the carry-out mechanism 75. The carry-out mechanism 75 is located at the substrate carry-out position Pout, which is located in front of the load-in mechanism 71. Specifically, the load-in mechanism 71 is located at the substrate load-in position Pin, which is located closer to the processing block 7, and the carry-out mechanism 75 is located at the substrate carry-out position Pout, which is located closer to the stocker 2. The load-in mechanism 71 includes a chuck 77, an opening and closing portion 81, a front-to-back moving portion 83, and a widthwise moving portion 85.

[0122] The chuck 77 holds multiple substrates W arranged at unequal intervals in a vertical position. The chuck 77 includes a pair of chuck components 77A and 77B extending in the width direction Y, respectively. A pair of chuck components 77A and 77B includes multiple pairs (e.g., 50 pairs, 75 pairs, 100 pairs) of retaining grooves 87 and 88 arranged at unequal intervals. In addition, the unequal intervals are alternately arranged with a first interval TN1 (e.g., 3.333 mm) and a second interval TN2 (e.g., 6.666 mm). The first chuck component 77A is provided with multiple retaining grooves 87 arranged at unequal intervals. In addition, the second chuck component 77B is provided with multiple retaining grooves 88 arranged at unequal intervals.

[0123] The opening and closing portion 81 supports the two chuck components 77A and 77B so as to be movable along the front-back direction X. In addition, the opening and closing portion 81 opens and closes the two chuck components 77A and 77B in the front-back direction X. Specifically, the opening and closing portion 81 moves the two chuck components 77A and 77B closer to or farther away from each other. When the opening and closing portion 81 closes the chuck 77, the chuck 77 can hold multiple substrates W in a vertical posture. In contrast, when the opening and closing portion 81 opens the chuck 77, the chuck 77 can pass multiple substrates W in a vertical posture between the two chucks 77A and 77B along the vertical direction Z. The opening and closing portion 81 includes an air cylinder or an electric actuator that drives the two chuck components 77A and 77B.

[0124] The front-to-back direction moving portion 83 is arranged on the side of the two spacing conversion portions 25 and 26 relative to the width direction moving portion 85. The front-to-back direction moving portion 83 moves the chuck 77 and the opening and closing portion 81 horizontally along the front-to-back direction X. The width direction moving portion 85 moves the chuck 77, the opening and closing portion 81, and the front-to-back direction moving portion 83 horizontally along the width direction Y. That is, the front-to-back direction moving portion 83 and the width direction moving portion 85 can move the chuck 77 along the front-to-back direction X and the width direction Y (two-dimensional directions). Thus, the loading mechanism 71 can move the chuck 77 between the substrate transfer position Po and the substrate handover position (substrate loading position Pin and substrate unloading position Pout) described later. By simultaneously performing movement in the front-to-back direction X and movement in the width direction Y, the above-mentioned oblique movement such as the first lateral movement path Rin and the second lateral movement path Rout is achieved. The front-to-back direction moving portion 83 includes, for example, an air cylinder or an electric actuator. The width direction moving portion 85 includes an electric actuator.

[0125] The carrying-out mechanism 75 includes a chuck 79, an opening and closing portion 89, a front-to-back direction moving portion 91, and a width direction moving portion 93. The chuck 79 is constructed in the same manner as the chuck 77. Specifically, the chuck 79 includes a pair of chuck components 79A and 79B respectively extending in the width direction Y. The pair of chuck components 79A and 79B includes a plurality of pairs (for example, 50 pairs, 75 pairs, 100 pairs) of retaining grooves 95 and 96 arranged at unequal intervals. The front-to-back direction moving portion 91 is arranged on the side of the two spacing conversion portions 25 and 26 relative to the width direction moving portion 93. In addition, the opening and closing portion 89, the front-to-back direction moving portion 91, and the width direction moving portion 93 are constructed in the same manner as the opening and closing portion 81, the front-to-back direction moving portion 83, and the width direction moving portion 85, respectively.

[0126] Figure 9It is a plan view mainly showing the intermediary mechanism 73. The intermediary mechanism 73 is arranged at the same substrate carrying-in position Pin as the carrying-in mechanism 71. The intermediary mechanism 73 includes a chuck 78, an opening and closing part 101, an arm part 103 and a lifting part 105. The chuck 78 includes a pair of chuck parts 78A and 78B respectively extending in the width direction Y. A pair of chuck parts 78A and 78B includes multiple pairs (for example, 50 pairs, 75 pairs, 100 pairs) of retaining grooves 107 and 108 arranged at a narrow pitch (for example, a 3.333 mm pitch (1 / 3 pitch)). Specifically, a plurality of retaining grooves 107 arranged at a narrow pitch are provided in the first chuck part 78A along the width direction Y. In addition, a plurality of retaining grooves 108 arranged at a narrow pitch are provided in the second chuck part 78B.

[0127] The opening and closing portion 101 is arranged on the right side of the chuck 78 (on the side of the pusher mechanism 21). Apart from this, the opening and closing portion 101 is constructed in the same manner as the opening and closing portion 81. If described in a more specific manner, the opening and closing portion 101 supports a pair of chuck components 78A and 78B so as to be movable along the front-to-back direction X. In addition, the opening and closing portion 101 opens and closes a pair of chuck components 78A and 78B in the front-to-back direction X. When the opening and closing portion 101 closes the chuck 78, the chuck 78 can hold multiple substrates W arranged at a narrow interval in a vertical posture. In contrast, when the opening and closing portion 101 opens the chuck 78, the chuck 78 can pass multiple substrates W in a vertical posture between the two chuck components 78A and 78B along the vertical direction Z.

[0128] The opening and closing section 101 is mounted on the lifting section 105 via the arm section 103 so as to be able to be raised and lowered. The lifting section 105 raises and lowers the chuck 78 and the opening and closing section 101 in the vertical direction Z. The lifting section 105 includes, for example, an electric actuator. Thus, the intermediary mechanism 73 can receive the plurality of substrates W arranged in a vertical position with a narrow pitch from the first pitch conversion section 25, and move the plurality of substrates W to the first transfer position P1 (see FIG. 1 ) in order to transfer the plurality of substrates W to the main transport mechanism WTR. Figure 7 ).

[0129] Furthermore, the transfer block 5 has two transport paths for transporting multiple substrates W between the pusher member 55 (pusher mechanism 21) and the main transport mechanism WTR. Specifically, the first transport path passes through the carry-in mechanism 71, the first pitch converter 25, and the intermediate mechanism 73. Furthermore, the second transport path passes through the second pitch converter 26 and the carry-out mechanism 75. For example, while 50 substrates W are held by the intermediate mechanism 73, the carry-out mechanism 75 can transport the 50 substrates W, which have been processed in the chemical liquid treatment tank BT1, etc., to the pusher member 55. This allows for smooth transport of 50 substrates W (a processed substrate set).

[0130] <1-2-1. Pitch conversion section>

[0131] Reference Figure 7 、 Figures 10-13 The two pitch conversion sections 25 and 26 respectively convert the pitch of the multiple substrates W between unequal pitch and narrow pitch. The unequal pitch is a first pitch TN1 (e.g., 3.333 mm) and a second pitch TN2 (e.g., 6.666 mm) that is wider than the first pitch TN1, which is repeated alternately. The narrow pitch is a repeating first pitch TN1.

[0132] The first pitch conversion unit 25 arranges the plurality of substrates W, which were arranged at unequal pitches, at a narrow pitch. Specifically, the first pitch conversion unit 25 converts the pitch of the plurality of substrates W before processing in the processing block 7 into a narrow pitch. Conversely, the second pitch conversion unit 26 arranges the plurality of substrates W, which were arranged at a narrow pitch, at unequal pitches. Specifically, the second pitch conversion unit 26 converts the pitch of the plurality of substrates W after processing in the processing block 7 into an unequal pitch.

[0133] Each of the two pitch converters 25 and 26 includes a pitch converter body 111 . The pitch converter body 111 includes a plurality of (eg, 25, 38, or 50) holding members 113 ( 113A to 113E) and a moving portion 115 .

[0134] A plurality of holding components 113 hold a plurality of substrates W arranged at unequal intervals in a vertical position. The plurality of holding components 113 each have two holding grooves 117 for holding two substrates W in the plurality of substrates W at a first interval TN1 (e.g., 3.333 mm). The two holding grooves 117 are separated by a first interval TN1. The two holding grooves 117 of each holding component 113 are arranged along the width direction Y. For example, when the spacing conversion portion 25 has 25 holding components 113, the 25 holding components 113 can hold 50 substrates W. In addition, in Figures 10 to 13 In the figure, for the convenience of illustration, it is assumed that the two pitch conversion parts 25 and 26 each have five holding members 113.

[0135] The moving unit 115 moves the plurality of holding members 113 along the arrangement direction (width direction Y) of the plurality of substrates W to switch between an unequal pitch state in which the plurality of substrates W are arranged at unequal pitches and a narrow pitch state in which the plurality of substrates W are arranged at narrow pitches. The moving unit 115 includes a base member 119, two guide rails 121, an extension mechanism 123, a drive unit 125, and a coupling unit 127.

[0136] The two guide rails 121 support the multiple holding components 113 so that they can move along the arrangement direction (width direction Y). The two guide rails 121 extend respectively along the width direction Y. The two guide rails 121 are mounted on the upper surface of the base component 119. In addition, the central holding component 113C among the multiple holding components 113 is fixed to the base component 119 by, for example, a screw SW. That is, the central holding component 113C does not move in the width direction Y. In addition, the guide rails 121 are not limited to two, and can also be one, or three or more. That is, the moving part 115 only needs to have one or more guide rails 121.

[0137] The telescopic mechanism 123 allows the plurality of holding members 113 to be telescopic in the arrangement direction (width direction Y). The telescopic mechanism 123 is connected to each holding member 113. The telescopic mechanism 123 is composed of, for example, a link mechanism. Specifically, the telescopic mechanism 123 is composed of, for example, a lazy tongs type, a sawtooth type, or a type similar thereto. The telescopic mechanism 123 is, for example, provided with a plurality of ( Figure 10 etc.) connecting rod components 129, multiple ( Figure 10 etc.) pins 131 and multiple ( Figure 10 etc.) connectors 133. Figure 12 、 13 For example, five pins 131 are provided on the bottom surfaces of the five holding members 113. The five link members 129 are each rotatably mounted on the five pins 131 about a vertical axis. The five pins 131 are located at the five center portions of the five link members 129. Four joints 133 connect the ends of two adjacent link members 129.

[0138] For example, the first end of the link member 129B is connected to the second end of the link member 129A via a joint 133A. In addition, the second end of the link member 129B is connected to the first end of the link member 129C via a joint 133B.

[0139] The drive unit 125 drives the telescopic mechanism 123. The drive unit 125 is attached to the bottom surface of the base member 119. The drive unit 125 extends and retracts a rod 125A extending in the width direction Y. The drive unit 125 comprises an air cylinder or an electric actuator. The connecting portion 127 connects the end holding members 113E of the plurality of holding members 113 to the distal end of the rod 125A of the drive unit 125. Furthermore, the connecting portion 127 extends through the opening 119A of the base member 119.

[0140] exist Figure 10 、 Figure 12For example, when the rod 125A of the driving unit 125 is extended, the end holding member 113E is separated from the central holding member 113C, and the other three holding members 113A, 113B, and 113D are separated from the central holding member 113C by the telescopic mechanism 123. As a result, the multiple substrates W are arranged at unequal intervals. Figure 11 、 Figure 13 For example, when the rod 125A of the driving unit 125 contracts, the end holding member 113E approaches the central holding member 113C, and the other three holding members 113A, 113B, and 113D approach the central holding member 113C through the telescopic mechanism 123. As a result, the plurality of substrates W are arranged at a narrow pitch (first interval TN1).

[0141] like Figure 7 As shown, each of the pitch converters 25 and 26 includes a lifting unit 141. The lifting unit 141 raises and lowers the pitch converter body 111 (the plurality of holding members 113 and the moving unit 115). The lifting unit 141 includes an air cylinder or an electric actuator.

[0142] The lifting unit 141 of the first pitch converter 25 raises and lowers the plurality of holding members 113 between an upper position higher than (the upper surface of) the chuck 77 of the carry-in mechanism 71 and a lower position lower than the chuck 77. Furthermore, the lifting unit 141 of the second pitch converter 26 raises and lowers the plurality of holding members 113 between an upper position higher than (the upper surface of) the chuck 79 of the carry-out mechanism 75 and a lower position lower than the chuck 79.

[0143] <1-3. Processing Block>

[0144] Reference Figure 1 . The processing block 7 includes a plurality of (for example, four) batch processing tanks BT1 to BT4 and a drying section 143. The four batch processing tanks BT1 to BT4 and the drying section 143 are arranged along the front-to-back direction X extending from the substrate processing apparatus 1. The four batch processing tanks BT1 to BT4 respectively perform immersion processing on a plurality of (for example, 50, 75 or 100) substrates W at a time. The four batch processing tanks BT1 to BT4 respectively store processing liquids (for example, chemical solutions or pure water) for immersing the plurality of substrates W. In addition, the processing block 7 is equivalent to the "substrate processing section" of the present invention.

[0145] The four batch processing tanks BT1 to BT4 are composed, for example, of two chemical processing tanks BT1 and BT3 and two cleaning tanks BT2 and BT4. The chemical processing tank BT1 and the cleaning tank BT2 are grouped together, while the chemical processing tank BT3 and the cleaning tank BT4 are grouped together. The combination of chemical processing tanks and cleaning tanks is not limited to this example. Furthermore, the number of batch processing tanks is not limited to four; it can be one or more.

[0146] The two chemical treatment tanks BT1 and BT3 each perform a chemical etching process. The chemical solution used is, for example, but not limited to, a phosphoric acid solution. The chemical solution is heated to a predetermined temperature. A chemical dispensing pipe (not shown) is provided at the bottom of each of the chemical treatment tanks BT1 and BT3. Each chemical treatment tank BT1 and BT3 stores the chemical solution supplied from the chemical dispensing pipe.

[0147] The two cleaning tanks BT2 and BT4 each perform a cleaning process to rinse chemical liquid adhered to the plurality of substrates W using a cleaning liquid (rinsing liquid). Pure water, such as deionized water (DIW), is used as the cleaning liquid. Each of the cleaning tanks BT2 and BT4 stores pure water supplied from a pure water discharge pipe (not shown).

[0148] The processing block 7 includes a dedicated transport mechanism, lift LF1, for transferring substrates W after chemical treatment in chemical treatment tank BT1 to cleaning tank BT2, and lift LF2, for transferring substrates W after chemical treatment in chemical treatment tank BT3 to cleaning tank BT4. Each lift LF1 and LF2 includes a substrate holder for vertically holding multiple substrates W arranged at narrow intervals along the width direction Y; a lifting unit for raising and lowering the substrate holder; and a horizontal moving unit for moving the substrate holder in the front-to-back direction X.

[0149] The drying section 143 includes a substrate holding mechanism that holds a plurality of substrates W (e.g., 50, 75, or 100 substrates W) arranged at narrow intervals along the width direction Y in a vertical position, and a processing chamber that accommodates the plurality of substrates W held by the substrate holding mechanism. The drying section 143 dries the substrates by supplying an organic solvent (e.g., isopropyl alcohol) to the substrates W in a reduced-pressure atmosphere or by using centrifugal force to spin off liquid components on the surfaces of the substrates W.

[0150] <1-4. Batch substrate transfer area>

[0151] The batch substrate transfer area 8 is located behind the stocker 2 and adjacent to the left of the transfer block 5 and the processing block 7. The batch substrate transfer area 8 extends along the front-to-back direction X. The batch substrate transfer area 8 includes a main transfer mechanism WTR (main transfer robot). The main transfer mechanism WTR transfers a plurality of substrates W (e.g., 50, 75, or 100 substrates) arranged in a vertical position with narrow spacing along the width direction Y along the front-to-back direction X. The main transfer mechanism WTR also transfers the plurality of substrates W between the first transfer position P1, the second transfer position P2, a plurality of (e.g., four) batch processing tanks BT1 to BT4, and the drying section 143.

[0152] The main transport mechanism WTR includes a chuck 145, a chuck lifting unit (not shown), a chuck horizontal moving unit (not shown), and a guide rail 147. The chuck 145 holds multiple substrates W arranged at narrow intervals along the width direction Y in a vertical position. The chuck 145 includes a pair of chuck components 145A and 145B, each extending along the width direction Y. The pair of chuck components 145A and 145B includes multiple pairs (e.g., 50 pairs, 75 pairs, or 100 pairs) of holding grooves arranged at narrow intervals along the width direction Y. The pair of chuck components 145A and 145B are opened and closed by a chuck opening and closing unit (not shown).

[0153] The chuck 145 is movable along the guide rail 147 in the front-to-back direction X. The chuck 145 is moved in the front-to-back direction X by a chuck horizontal moving unit. The chuck 145 is raised and lowered in the vertical direction Z by a chuck lifting unit. The chuck horizontal moving unit and the chuck lifting unit are each equipped with, for example, an electric actuator. The chuck opening and closing unit is equipped with, for example, an air cylinder or an electric actuator.

[0154] <1-5. Control Unit>

[0155] The substrate processing apparatus 1 includes a control unit 151 (see Figure 1 ) and a storage unit (not shown). The control unit 151 controls the various components of the substrate processing apparatus 1. The control unit 151 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The storage unit stores computer programs required to control the various components of the substrate processing apparatus 1.

[0156] <2. Operation of Substrate Processing Apparatus>

[0157] Next, refer to Figure 14 、 Figure 21 The operation of the substrate processing apparatus 1 will be described with reference to the flowchart of Figure 14 , the operation from the transfer of the carrier C to the load port 9 to the first half of the drying process will be described. In this embodiment, the substrate processing apparatus 1 processes 50 substrates W taken out from two carriers C at a time.

[0158] In addition, Figure 15A In the above, symbol TA represents the surface (device surface or main surface) of substrate W (W1, W2). In addition, the back side of substrate W is the surface on the opposite side of the surface of substrate W. The device surface is the surface on which the device is formed or the surface in the middle of forming the device. In addition, Figure 15A In the figures, for convenience of illustration, 5 substrates W1 represent 25 substrates W1, and 5 substrates W2 represent 25 substrates W2.

[0159] [Step S01] Vertical posture conversion of the first substrate group

[0160] Reference Figure 1 . An external transport robot not shown in the figure transports two carriers C to the loading port 9 in sequence. The carrier transport robot 13 of the storage 2 transports the first carrier C from the loading port 9 to the loading rack 3. It is set that the first carrier C contains, for example, 25 substrates W1 (first substrate group) arranged at a reference pitch (for example, 10 mm pitch) with a repeated reference interval TN9. The substrate operation mechanism HTR of the transfer block 5 takes out 25 substrates W1 in a horizontal posture from the first carrier C placed on the loading rack 3 through, for example, 25 manipulators 27. Then, the substrate operation mechanism HTR transports the 25 substrates W1 taken out to the posture conversion unit 19. In addition, the carrier transport robot 13 moves the empty first carrier C after the 25 substrates W1 are taken out from the loading rack 3 to the storage rack 11.

[0161] Reference Figure 15A The posture conversion unit 19 receives 25 substrates W1 arranged at a reference pitch from the substrate handling mechanism HTR. In the posture conversion unit 19, the 25 substrates W1 are held (placed) on 25 pairs of shelves 37A of a pair of horizontal holding units 37. Figure 15B After that, the accommodation moving part 53 of the posture conversion part 19 (see Figure 4 ) The pair of vertical holding portions 39 are brought close to the pair of horizontal holding portions 37. Thus, the peripheral edges of the 25 substrates W1 are accommodated and held in the 25 pairs of holding grooves 39A of the pair of vertical holding portions 39.

[0162] Reference Figure 15C . Then, the posture conversion unit 19 converts the 25 substrates W1 (first substrate group) held at the reference spacing from the horizontal posture to the vertical posture. Specifically, the rotation drive unit 41 of the posture conversion unit 19 converts the 25 substrates W1 held by a pair of horizontal holding units 37 and a pair of vertical holding units 39 from the horizontal posture to the vertical posture. Then, the axial moving unit 51 (refer to Figure 4 ) Move the pair of horizontal holding parts 37 in a direction toward the support surface 35A so that the 25 pairs of shelves 37A of the pair of horizontal holding parts 37 are away from the 25 substrates W1 in the vertical posture.

[0163] [Step S02] The pusher component receives the first substrate assembly

[0164] Reference Figure 16A After that, the pusher lifting part 65 of the pusher mechanism 21 (refer to Figure 5) causes the pusher member 55 to rise to a position higher than the pair of horizontal holding portions 37 and the pair of vertical holding portions 39. Thus, the pusher member 55 receives the 25 substrates W1 (first substrate group) in a vertical position. Furthermore, the pusher member 55 holds the 25 substrates W1 arranged at a reference pitch in a vertical position. Furthermore, the 50 vertical holding grooves 67 are arranged at unequal intervals.

[0165] [Step S03] The first substrate group moves a first distance

[0166] Reference Figure 16B The pusher mechanism 21 moves the 25 substrates W1 held by the pusher member 55 along the arrangement direction of the 25 substrates W1 by a first interval TN1 (3.333 mm). Specifically, the pusher rotating portion 59 (see Figure 5 ) rotates the pusher member 55 180 degrees around the vertical axis AX3. As a result, the 25 substrates W1 held by the pusher member 55 are moved to the left by the first interval TN1. In addition, the movement of the first interval TN1 can also be achieved by the pusher rotating unit 59 rotating the pusher member 55 180 degrees and the pusher horizontal moving unit 61 (see Figure 5 ) is performed by moving the pusher component 55 along the width direction Y.

[0167] In addition, the posture conversion unit 19 rotates the pair of horizontal holding units 37 and the like by 90 degrees around the horizontal axis AX2. As a result, the pair of horizontal holding units 37 and the like are lifted up. The axial moving unit 51 (see FIG. 1 ) of the posture conversion unit 19 Figure 4 ) moves the pair of horizontal holding portions 37 in a direction away from the support surface 35A. Figure 4 ) moves the pair of vertical holding portions 39 away from the pair of horizontal holding portions 37.

[0168] [Step S04] Vertical posture conversion of the second substrate group

[0169] Figure 1 The carrier transport robot 13 shown transports the second carrier C from the loading port 9 to the carrier rack 3. As with the first carrier C, the second carrier C is configured to contain, for example, 25 substrates W2 arranged at a reference pitch (10 mm pitch). The substrate handling mechanism HTR uses 25 manipulators 27 to remove the 25 substrates W2 in a horizontal position from the second carrier C placed on the carrier rack 3. The substrate handling mechanism HTR then transports the 25 removed substrates W2 to the posture conversion unit 19. Furthermore, the carrier transport robot 13 moves the empty second carrier C, from which the 25 substrates W2 have been removed, from the carrier rack 3 to the storage rack 11.

[0170] Reference Figure 16CThe posture conversion unit 19 receives 25 substrates W2 arranged at a reference pitch from the substrate handling mechanism HTR. In the posture conversion unit 19, the 25 substrates W2 are held by 25 pairs of shelves 37A of a pair of horizontal holding units 37. Figure 17A After that, the accommodation moving part 53 of the posture conversion part 19 (see Figure 4 ) brings a pair of vertical holding portions 39 close to a pair of horizontal holding portions 37.

[0171] Reference Figure 17B Then, the posture conversion unit 19 converts the 25 substrates W2 (second substrate group) held at the reference pitch from the horizontal posture to the vertical posture. Then, the axial moving unit 51 (refer to Figure 4 ) Move the pair of horizontal holding parts 37 in a direction toward the support surface 35A so that the 25 pairs of shelves 37A of the pair of horizontal holding parts 37 are away from the 25 substrates W1 in the vertical posture.

[0172] [Step S05] The pusher component receives the second substrate assembly

[0173] Reference Figure 17C After that, the pusher lifting part 65 of the pusher mechanism 21 (refer to Figure 8 ) raises the pusher member 55 to a position higher than the pair of horizontal holding members 37 and the pair of vertical holding members 39. The pusher member 55 thus receives the 25 substrates W2 (second substrate group) that have been turned into a vertical position. Furthermore, the pusher member 55 holds 50 substrates W (W1, W2) arranged at unequal intervals. The 50 substrates W are formed by alternating 25 substrates W1 and 25 substrates W2.

[0174] In addition, if Figure 17B 、 Figure 17C As shown, the surfaces (device surfaces or main surfaces) of the 25 substrates W1 face the predetermined direction (rightward). Conversely, the surfaces of the 25 substrates W2 face the opposite direction (leftward). In other words, the 50 substrates W are arranged in a so-called face-to-face arrangement.

[0175] [Step S06] The loading mechanism transports the processed substrate group to the pitch conversion unit.

[0176] After that, the carrying mechanism 71 carries 50 substrates W (processing substrate group) arranged at unequal pitches from the pusher member 55 to the first pitch conversion unit 25. This operation will be described in detail. Figure 18A First, the posture conversion unit 19 rotates the pair of horizontal holding units 37 and the like by 90 degrees around the horizontal axis AX2. As a result, the pair of horizontal holding units 37 and the like are lifted up.

[0177] Reference Figure 18B. Thereafter, the carry-in mechanism 71 moves the chuck 77 horizontally from the upper position of the first spacing conversion section 25 to the lower position of the pusher component 55. That is, the carry-in mechanism 71 moves the chuck 77, which does not hold the substrate W, laterally along the first lateral movement path Rin from the substrate carry-in position Pin to the substrate transfer position Po. Before the lateral movement, the first spacing conversion section 25 is located below the first lateral movement path Rin. The first spacing conversion section 25 is located at the substrate carry-in position Pin. The first spacing conversion section 25 is located below the chuck 77. In addition, the pusher component 55 is located at the substrate transfer position Po. The chuck 77 is in a closed state capable of holding 50 substrates W. Thereafter, the pusher mechanism 21 lowers the pusher component 55 that holds the 50 substrates W in a vertical position. When the pusher component 55 passes between the pair of chuck components 77A and 77B of the chuck 77, the 50 substrates W are delivered from the pusher component 55 to the chuck 77. The chuck 77 holds 50 substrates W arranged at unequal intervals in a vertical position.

[0178] Reference Figure 19A . Thereafter, the carry-in mechanism 71 moves the chuck 77 from the upper position of the pusher component 55 to the upper position of the first spacing conversion unit 25. That is, the carry-in mechanism 71 causes the chuck 77 holding 50 substrates W to move laterally along the first lateral movement path Rin from the substrate transfer position Po to the substrate carry-in position Pin. After the lateral movement, the first spacing conversion unit 25 is located below the first lateral movement path Rin. The first spacing conversion unit 25 is located at the substrate carry-in position Pin. The first spacing conversion unit 25 is located below the chuck 77. In addition, the pusher component 55 is located at the substrate transfer position Po. The substrate carry-in position is the upper position of the first spacing conversion unit 25. Refer to Figure 19B Afterwards, the lifting portion 141 of the first pitch conversion portion 25 (see Figure 7 ) The pitch conversion body 111 including 25 holding members 113 is raised. Thus, the first pitch conversion unit 25 receives 50 substrates W from the carry-in mechanism 71.

[0179] [Step S07] Converting the pitch of the processed substrate group from uneven pitch to narrow pitch

[0180] Reference Figure 20A After that, the first pitch conversion unit 25 converts the pitch of the 50 substrates W from the uneven pitch to the narrow pitch (3.333 mm). In other words, the first pitch conversion unit 25 causes the 50 substrates W that were arranged at uneven pitches to be arranged at a narrow pitch. This operation will be described in detail.

[0181] Each of the 25 holding members 113 of the first pitch converter 25 has two holding grooves 117 separated by a first interval (3.333 mm). The first pitch converter 25 uses the two holding grooves 117 of each of the 25 holding members 113 to hold two substrates W1 and W2 among the 50 substrates W, while also using the 25 holding members 113 to hold the 50 substrates W arranged at unequal intervals.

[0182] In addition, the moving portion 115 of the first pitch conversion portion 25 (see Figure 10 ) moves the 25 holding members 113 in the arrangement direction (Y direction) of the 50 substrates W, thereby changing the arrangement from an unevenly spaced arrangement of the 50 substrates W to a narrowly spaced arrangement of the 50 substrates W. Furthermore, the intermediary mechanism 73 opens the chuck 78.

[0183] [Step S08] The intermediary mechanism transports the processed substrate group to the first transfer position

[0184] Reference Figure 20B Next, the intermediary mechanism 73 lowers the chuck 78 as shown by the dotted line to receive the 50 substrates W arranged at a narrow pitch and held by the first pitch converter 25. The intermediary mechanism 73 then closes the chuck 78. This allows the intermediary mechanism 73 to hold the 50 substrates W via the chuck 78.

[0185] The intermediary mechanism 73 then raises the chuck 78 to the first transfer position P1. This allows the intermediary mechanism 73 to receive 50 substrates W from the first pitch converter 25 and transfer them to the main transport mechanism WTR. Furthermore, the chuck 78 holds the 50 substrates W, arranged at a narrow pitch, in a vertical position.

[0186] [Step S09] Substrate processing and drying

[0187] The main transport mechanism WTR then receives 50 substrates W from the intermediary mechanism 73 using the chuck 145 and transports the 50 substrates W to one of the two chemical processing tanks BT1 and BT3. For example, while the main transport mechanism WTR is transporting the 50 substrates W to the chemical processing tank BT1, the lifter LF1 receives the 50 substrates W arranged at a narrow pitch from the main transport mechanism WTR above the chemical processing tank BT1. The lifter LF1 then lowers the 50 substrates W, immersing them in the chemical solution stored in the chemical processing tank BT1. Thus, all 50 substrates W are collectively chemically processed.

[0188] After the preset chemical treatment time has elapsed, lifter LF1 raises the 50 substrates W, thereby removing them from the chemical solution in chemical treatment tank BT1. Lifter LF1 then horizontally moves the 50 substrates W from the upper position of chemical treatment tank BT1 to the upper position of cleaning tank BT2. Lifter LF1 then lowers the 50 substrates W, immersing them in the pure water stored in cleaning tank BT2. This cleans all 50 substrates W collectively. After the preset cleaning time has elapsed, lifter LF1 removes the 50 substrates W from the pure water in cleaning tank BT2.

[0189] When the main transport mechanism WTR transports 50 substrates W to the chemical processing tank BT3, the lifter LF2 receives the 50 substrates W from the main transport mechanism WTR. The lifter LF2 then transports the 50 substrates W to the chemical processing tank BT3 and the cleaning tank BT4 in that order.

[0190] The main transport mechanism WTR receives 50 substrates W from one of the two lifts LF1 and LF2 using a chuck 145 and transports the 50 substrates W to the drying section 143. The drying section 143 dries the 50 substrates W. Then, the main transport mechanism WTR receives the 50 dried substrates W from the drying section 143.

[0191] Next, refer to Figure 21 , while explaining the latter half of the operation from the drying process to the conveyance of the carrier C from the loading port 9.

[0192] [Step S11] The main transport mechanism transports the processed substrate group to the second transfer position.

[0193] Reference Figure 2 、 Figure 22A The main transport mechanism WTR transports 50 substrates W that have been processed together in the chemical liquid processing tank BT1 and arranged in a vertical position with a narrow pitch to a position above the second pitch converter 26. In other words, the main transport mechanism WTR transports 50 substrates W that have been dried in the drying section 143 to a position above the second pitch converter 26.

[0194] The main transport mechanism WTR then lowers the 50 substrates W held by the chucks 145 to the transfer position P2. The main transport mechanism WTR then transports the 50 substrates W, arranged in a vertical position at a narrow pitch, to the second pitch converter 26. Furthermore, the second pitch converter 26 receives the 50 substrates W, arranged in a vertical position at a narrow pitch, from the main transport mechanism WTR. Upon receiving the 50 substrates W, the second pitch converter 26 moves the 25 holding members 113 so that the 50 holding slots 117 are arranged at a narrow pitch.

[0195] [Step S12] Converting the pitch of the processed substrate group from a narrow pitch to an uneven pitch

[0196] Reference Figure 22B . Afterwards, the second pitch conversion unit 26 converts the pitch of the 50 substrates W from a narrow pitch to an unequal pitch. This action is described in detail. The second pitch conversion unit 26 uses the two holding grooves 117 separated by the first interval TN1 of each of the 25 holding components 113 to hold the two substrates W at the first interval TN1, while using the 25 holding components 113 to hold the 50 substrates W arranged at a narrow pitch. The moving unit 115 (refer to Figure 10 ) moves the 25 holding components 113 along the arrangement direction (width direction Y) of the 50 substrates W to change from a narrow pitch state to an uneven pitch state.

[0197] [Step S13] The unloading mechanism transports the processed substrate group to the pusher member.

[0198] Reference Figure 23A Then, the carrying-out mechanism 75 of the transfer mechanism 23 carries the 50 substrates W arranged at unequal intervals from the second interval conversion section 26 to the pusher member 55 in a vertical position. This action is described in detail. The chuck 79 of the carrying-out mechanism 75 is in a closed state. First, the lifting part 141 (refer to Figure 7 ) The pitch conversion main body 111 including 25 holding members 113 is lowered. During the lowering, the unloading mechanism 75 receives and holds 50 substrates W arranged in a vertical position at unequal pitches using the chucks 79.

[0199] Reference Figure 23B . Thereafter, the carry-out mechanism 75 carries the 50 substrates W held by the chuck 79 from the upper position of the second pitch conversion section 26 to the upper position of the pusher component 55. That is, the carry-out mechanism 75 causes the chuck 79 holding the 50 substrates W to move laterally along the second lateral movement path Rout from the substrate carry-out position Pout to the substrate transfer position Po. Before the chuck 79 moves laterally, the second pitch conversion section 26 is located below the second lateral movement path Rout. The second pitch conversion section 26 is located at the substrate carry-out position Pout. The second pitch conversion section 26 is located below the chuck 79. In addition, the pusher component 55 is located at the substrate transfer position Po. Thereafter, the pusher mechanism 21 raises the pusher component 55 to a position higher than the chuck 79. During this rise, the pusher mechanism 21 receives and holds the 50 substrates W from the chuck 79 of the carry-out mechanism 75 using the pusher component 55. The pusher component 55 holds the 50 substrates W arranged at unequal intervals in a vertical position.

[0200] [Step S14] The posture conversion unit receives the second substrate set

[0201] Reference Figure 24A . Afterwards, the carry-out mechanism 75 moves the chuck 79 to a position above the second spacing conversion part 26. That is, the carry-out mechanism 75 causes the chuck 79 that does not hold the substrate W to move laterally along the second lateral movement path Rout from the substrate carry-out position Pout to the substrate transfer position Po. After the lateral movement of the chuck 79, the second spacing conversion part 26 is located below the second lateral movement path Rout. The second spacing conversion part 26 is located at the substrate carry-out position Pout. The second spacing conversion part 26 is located below the chuck 79. In addition, the pusher part 55 is located at the substrate transfer position Po. Then, in order to make the pair of vertical holding parts 39 receive 25 pieces of substrates W2 (second substrate group), the rotation drive part 41 of the posture conversion part 19 rotates the pair of horizontal holding parts 37 and the like 90 degrees around the horizontal axis AX2. As a result, the pair of horizontal holding parts 37 and the pair of vertical holding parts 39 are in a tilted state. Furthermore, the axial movement portion 51 brings the pair of horizontal holding portions 37 closer to the support surface 35A, and the accommodating movement portion 53 brings the pair of vertical holding portions 39 closer to the pair of horizontal holding portions 37 .

[0202] Reference Figure 24B . Thereafter, the pusher mechanism 21 causes the pusher component 55 to descend from the upper position of the pair of vertical holding portions 39 to the lower position thereof. During this descent, the posture conversion portion 19 receives 25 substrates W2 (second substrate group) out of 50 substrates W (processing substrate group) from the pusher component 55 using a pair of horizontal holding portions 37 and a pair of vertical holding portions 39. The pair of vertical holding portions 39 hold the 25 substrates W2 arranged at a reference pitch (10 mm pitch). Then, the axial moving portion 51 moves the pair of horizontal holding portions 37 away from the supporting surface 35A. As a result, the 25 pairs of shelves 37A of the pair of horizontal holding portions 37 come into contact with the back surfaces of the 25 substrates W2, respectively.

[0203] In addition, if Figure 24A As shown, the moving portion 115 of the second pitch conversion portion 26 moves 25 (24) holding members 113 so that 50 holding grooves 117 are arranged at a narrow pitch. Figure 24B As shown, the lifting portion 141 of the second pitch converter 26 raises the pitch converter body 111 including the 25 holding members 113 so that the 50 holding grooves 117 are arranged at a position higher than the chuck 79 .

[0204] [Step S15] Vertical posture conversion of the second substrate group

[0205] Reference Figure 25A The posture conversion unit 19 rotates the pair of horizontal holding units 37 and the like by 90 degrees around the horizontal axis AX2. Thus, the posture conversion unit 19 converts the 25 substrates W2 from the vertical posture to the horizontal posture.

[0206] Thereafter, the accommodating moving portion 53 moves the pair of vertical holding portions 39 away from the pair of horizontal holding portions 37 . As a result, the peripheral edge portions of the 25 substrates W2 are taken out from the 25 pairs of holding grooves 39A of the pair of vertical holding portions 39 .

[0207] Figure 1 The carrier transport robot 13 shown in FIG. 1 transports the empty second carrier C from the storage rack 11 to the loading rack 3 in advance. The substrate handling mechanism HTR takes out 25 substrates W2 that have been converted to a horizontal posture by the posture conversion unit 19 and arranged at a reference pitch from the posture conversion unit 19 (see FIG. 1 ). Figure 25B Then, the substrate handling mechanism HTR transfers the 25 substrates W2 to the second carrier C mounted on the mounting rack 3. Then, the carrier transport robot 13 transfers the second carrier C containing the 25 processed substrates W2 from the mounting rack 3 to the load port 9.

[0208] [Step S16] The first substrate group moves a first distance

[0209] Reference Figure 25B After the posture conversion unit 19 converts the 25 substrates W2 into the horizontal posture, the pusher mechanism 21 raises the pusher member 55 holding the 25 substrates W1 (first substrate group).

[0210] In addition, the pusher mechanism 21 moves the 25 substrates W1 held by the pusher member 55 by a first interval TN1 (3.333 mm) in the arrangement direction of the 25 substrates W1. Specifically, the pusher rotating portion 59 (see Figure 5 ) rotates the pusher member 55 180 degrees around the vertical axis AX3. As a result, the 25 substrates W1 held by the pusher member 55 are moved rightward by the first interval TN1. In addition, the movement of the first interval TN1 can also be achieved by the pusher rotating unit 59 rotating the pusher member 55 180 degrees and the pusher horizontal moving unit 61 (see Figure 5 ) is performed by moving the pusher component 55 along the width direction Y.

[0211] [Step S17] The posture conversion unit receives the first substrate set

[0212] Reference Figure 25C The posture conversion unit 19 tilts the pair of horizontal holding units 37 and the pair of vertical holding units 39 . Furthermore, the axial movement unit 51 moves the pair of horizontal holding units 37 closer to the support surface 35A, and the accommodating movement unit 53 moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37 .

[0213] Reference Figure 26A. Thereafter, the pusher mechanism 21 lowers the pusher component 55 from the upper position of the pair of vertical holding portions 39 to the lower position thereof. During this lowering, the posture conversion portion 19 receives the remaining 25 substrates W1 from the pusher component 55 using the pair of horizontal holding portions 37 and the pair of vertical holding portions 39. The pair of vertical holding portions 39 hold the 25 substrates W1 arranged at a reference pitch (e.g., a 10 mm pitch). Thereafter, the axial moving portion 51 brings the 25 pairs of shelves 37A of the pair of horizontal holding portions 37 into contact with the back surfaces of the 25 substrates W1, respectively.

[0214] [Step S18] Vertical posture conversion of the first substrate group

[0215] Reference Figure 26B The posture conversion unit 19 rotates the pair of horizontal holding units 37 and the like by 90 degrees around the horizontal axis AX2. Thus, the posture conversion unit 19 converts the 25 substrates W1 from the vertical posture to the horizontal posture. Figure 26C Thereafter, the accommodating moving portion 53 moves the pair of vertical holding portions 39 away from the pair of horizontal holding portions 37 .

[0216] Figure 1 The carrier transport robot 13 shown in the figure transports an empty first carrier C from the storage rack 11 to the loading rack 3. The substrate handling mechanism HTR takes out 25 substrates W1 (see FIG. 1 ) which have been converted to a horizontal posture by the posture conversion unit 19 and arranged at a reference pitch (10 mm pitch) from the posture conversion unit 19. Figure 26C ). The substrate handling mechanism HTR then transfers the 25 substrates W1 to the first carrier C mounted on the carrier rack 3. The carrier transport robot 13 then transfers the first carrier C containing the 25 processed substrates W1 from the carrier rack 3 to the load port 9. An external transport robot (not shown) then sequentially transfers the two carriers C from the load port 9 to their next destination.

[0217] The chuck 77 described above corresponds to the "first lateral movement holding portion" of the present invention. The carry-in mechanism 71 described above corresponds to the "first lateral movement mechanism" of the present invention. The chuck 79 described above corresponds to the "second lateral movement holding portion" of the present invention. The carry-out mechanism 75 described above corresponds to the "second lateral movement mechanism" of the present invention. The chuck 78 described above corresponds to the "intermediary holding portion" of the present invention.

[0218] According to Example 1, the posture conversion unit 19 converts the posture of the substrate into a horizontal holding posture of a substrate group that maintains substrates in a horizontal posture arranged at a reference pitch in a vertical direction and a vertical holding posture of a substrate group that maintains substrates in a vertical posture arranged at a reference pitch in a horizontal direction. The pusher mechanism 21 has a pusher component 55, which combines the substrates W2 (second substrate group) in the vertical holding posture maintained by the posture conversion unit 19 and the substrates W1 (first substrate group) in the vertical holding posture delivered in advance from the posture conversion unit 19 to maintain multiple substrates arranged at unequal pitches narrower than the reference pitch. The first pitch conversion unit 25 receives multiple substrates arranged at unequal pitches and arranges the multiple substrates arranged at unequal pitches at a narrow pitch narrower than the reference pitch. The processing block 7 processes the multiple substrates arranged at a narrow pitch together. The main conveying mechanism WTR conveys the multiple substrates arranged at a narrow pitch to the processing block 7 together. The first pitch converting portion 25 and the second pitch converting portion 26 are arranged on the main transport mechanism WTR side (left side in the left-right direction Y) of the pusher mechanism 21 .

[0219] Therefore, the pusher mechanism 21 combines the substrates W2 (second substrate group) held in a vertically held position by the posture conversion unit 19 and the substrates W1 (first substrate group) held in a vertically held position previously delivered from the posture conversion unit 19, and holds multiple substrates arranged at unequal pitches narrower than the reference pitch. The process of forming multiple substrates arranged at unequal pitches from a substrate group with a reference pitch is called the first stage of pitch conversion. The first pitch conversion unit 25 receives multiple substrates arranged at unequal pitches and arranges the multiple substrates arranged at a narrow pitch narrower than the reference pitch. The process of forming multiple substrates arranged at narrow pitches from multiple substrates arranged at unequal pitches is called the second stage of pitch conversion. In the present invention, the second stage of pitch conversion is not performed by the pusher mechanism 21, but by the first pitch conversion unit 25 arranged on the main transport mechanism WTR side of the pusher mechanism 21. In other words, the second stage of pitch conversion is performed at a position that does not reduce the productivity of the second stage of pitch conversion. Therefore, the substrates W can be processed efficiently.

[0220] Furthermore, multiple substrates W arranged at unequal pitches are arranged with alternating first pitches TN1, which are narrower than the reference pitch, and second pitches TN2, which are narrower than the reference pitch and wider than the first pitch TN1. The equal pitch is equal to the sum of the first pitch TN1 and the second pitch TN2. Multiple substrates W arranged at narrow pitches are arranged with the first pitch TN1 repeated. In this way, the unequal second pitches TN2 formed by the first-stage pitch conversion narrow until they reach the first pitch TN1, allowing the second-stage pitch conversion to proceed smoothly. Consequently, the second-stage pitch conversion can be performed smoothly at a location that does not reduce the productivity of the first-stage pitch conversion.

[0221] Furthermore, the carry-in mechanism 71 causes the chuck 77, which holds the multiple substrates W arranged at unequal pitches and received from the pusher member 55, to move laterally along a first lateral movement path. The carry-out mechanism 75 causes the chuck 79, which holds the multiple substrates W arranged at unequal pitches and delivered to the pusher member 55, to move laterally along a second lateral movement path. The first pitch conversion unit 25 receives the multiple substrates W arranged at unequal pitches and arranges them at a narrow pitch. The second pitch conversion unit 26 receives the multiple substrates W arranged at a narrow pitch and arranges them at unequal pitches. In this way, the two-stage pitch conversion is performed by the pusher mechanism 21 and the first and second pitch conversion units 25 and 26. Furthermore, the pitch conversion is performed by the first and second pitch conversion units 25 and 26, respectively, depending on the time before or after processing in the processing block 7. Therefore, the productivity of the second-stage pitch conversion is not reduced. As a result, substrates can be processed efficiently.

[0222] In addition, the intermediary mechanism 73 causes the chuck 78 that holds multiple substrates W arranged at a narrow pitch to rise at the substrate carry-in position. The substrate transfer position is a position where multiple substrates W arranged at unequal pitches are carried together from the pusher component 55 to the chuck 78. The substrate carry-in position is a position where multiple substrates W arranged at a narrow pitch are carried together from the chuck 78 to the main transport mechanism WTR. The first pitch conversion unit 25 is moved in multiple substrates W arranged at unequal pitches from the chuck 77 by rising at the substrate carry-in position. The chuck 78 is moved in multiple substrates W arranged at a narrow pitch from the first pitch conversion unit 25 by rising at the substrate carry-in position Pin. The first pitch conversion unit 25 is arranged at the substrate carry-in position Pin. Thus, in the substrate carry-in process performed between the chuck 77, the first pitch conversion unit 25, the chuck 78 and the main transport mechanism WTR, the pitch conversion can be efficiently performed by the first pitch conversion unit 25.

[0223] Furthermore, the first pitch converter 25 is disposed below the chuck 78. Thus, the work on the first pitch converter 25 and the work on the chuck 78 can be performed simultaneously, partially simultaneously, or at close timings.

[0224] Furthermore, the first pitch converter 25 is disposed below the first lateral travel path Pin. This allows operations on the chuck 77, the first pitch converter 25, and the chuck 78 to be performed simultaneously, partially simultaneously, or at close timings.

[0225] Furthermore, the second pitch converter 26 receives a plurality of substrates W arranged at a narrow pitch from the main transport mechanism WTR and unloads the plurality of substrates W arranged at unequal pitches onto the chuck 79. The second pitch converter 26 is positioned at the substrate unloading position Pout. Thus, during the unloading process of the substrates, the second pitch converter 26 can efficiently perform pitch conversion.

[0226] Furthermore, the second pitch converter 26 is disposed below the second lateral travel path Pout, thereby enabling operations on the second pitch converter 26 and the chuck 79 to be performed simultaneously, partially simultaneously, or at close timings.

[0227] Furthermore, the second pitch converter 26 is disposed above the first pitch converter 25. Thus, the work on the first pitch converter 25 and the work on the second pitch converter 26 can be performed simultaneously, partially simultaneously, or at close timings.

[0228] The second pitch converter 26 is disposed above the chuck 78. This allows operations on the first pitch converter 25, the chuck 79, and the second pitch converter to be performed simultaneously, partially simultaneously, or at close timings.

[0229] Furthermore, the first lateral travel path Pin and the second lateral travel path Pout intersect at a predetermined angle α, and the pusher mechanism 21 is positioned at the intersection point (Po) at the predetermined angle α. The first pitch converter 25 and the second pitch converter 26 are positioned at a predetermined angle apart. This allows the first pitch converter 25 and the second pitch converter 26 to be separated to positions where they are less likely to interfere with each other (the substrate loading position Pin and the substrate unloading position Pout).

[0230] [Example 2]

[0231] Next, a second embodiment of the present invention will be described with reference to the accompanying drawings. Explanations overlapping with those of the first embodiment will be omitted.

[0232] Figure 27 It is a plan view showing the structure of the transfer block 5 and its surroundings in Example 2. Figure 28 Is to say Figure 27 1 is a side view of the delivery mechanism 23 and the two pitch conversion parts 25 and 26 when viewed along the arrow AA.

[0233] The substrate processing apparatus 1 of the second embodiment differs from the substrate processing apparatus 1 of the first embodiment in that the substrate processing apparatus 1 does not include the intermediary mechanism 73 .

[0234] That is, the main transport mechanism WTR receives the 50 substrates W arranged at a narrow pitch held by the first pitch converter 25 without passing through the intermediary mechanism 73. For example, the main transport mechanism WTR descends to the height at which the first pitch converter 25 performs pitch conversion (the first transfer position P1A in this example). The first pitch converter 25 at the pitch conversion height can transfer the 50 substrates arranged at a narrow pitch to the main transport mechanism WTR. Alternatively, if the first pitch converter 25 can be raised to a position higher than the pitch conversion height, the first transfer position P1A can also be higher than the position shown in this example.

[0235] According to the second embodiment, the first pitch converter 25 receives a plurality of substrates W arranged at unequal pitches from the chuck 77 and loads a plurality of substrates W arranged at narrow pitches into the main transport mechanism WTR. This allows efficient transfer of substrates W between the chuck 77, the first pitch converter 25, and the main transport mechanism WTR.

[0236] [Example 3]

[0237] Next, a third embodiment of the present invention will be described with reference to the drawings. Explanations overlapping with those of the first and second embodiments will be omitted.

[0238] Figure 29 This is a plan view showing the structure of the transfer block 5 and its surroundings in Example 3. Figure 28 Is to say Figure 30 1 is a side view of the delivery mechanism 23A and one pitch conversion portion 25A, etc., when viewed along the arrow AA.

[0239] The substrate processing apparatus 1 of the first embodiment includes the delivery mechanism 23 having two pitch converters 25 and 26. In contrast, the substrate processing apparatus 1 of the third embodiment includes the delivery mechanism 23A having one pitch converter 25A.

[0240] Specifically, the delivery mechanism 23A includes a loading / unloading mechanism 71A and an intermediary mechanism 73A. The loading / unloading mechanism 71A loads a plurality of substrates W arranged at unequal pitches from the pusher member 55 into the pitch conversion section 25A, and unloads a plurality of substrates W arranged at unequal pitches from the pitch conversion section 25A into the pusher member 55. The intermediary mechanism 73A loads a plurality of substrates W arranged at narrow pitches from the pitch conversion section 25A into the delivery position P1B, and unloads a plurality of substrates W arranged at narrow pitches from the delivery position P1B into the pitch conversion section 25A.

[0241] The loading and unloading mechanism 71A is arranged at a loading height position H1 and a loading height position H3. The loading height position H1 and the loading height position H3 are at the same height.

[0242] The loading and unloading mechanism 71A includes a chuck 77, an opening and closing unit 81, a front-rear moving unit 83, and a widthwise moving unit 85. The chuck 77, the opening and closing unit 81, the front-rear moving unit 83, and the widthwise moving unit 85 are used for loading and unloading a plurality of substrates W arranged at unequal pitches.

[0243] The intermediary mechanism 73A includes a chuck 78, an opening and closing unit 101, an arm 103, and a lifting unit 105. The chuck 78, the opening and closing unit 101, the arm 103, and the lifting unit 105 are used for both loading and unloading a plurality of substrates W arranged at a narrow pitch. Alternatively, the intermediary mechanism 73A may be used only for loading substrates W.

[0244] The pitch conversion portion 25A is used for both conversion from a plurality of substrates W arranged at unequal pitches to a plurality of substrates W arranged at narrow pitches and conversion from a plurality of substrates W arranged at narrow pitches to a plurality of substrates W arranged at unequal pitches.

[0245] The chuck 77 described above corresponds to the "lateral movement holding portion" of the present invention. The lateral movement mechanism 71A described above corresponds to the "lateral movement mechanism" of the present invention. The chuck 78 described above corresponds to the "intermediary holding portion" of the present invention.

[0246] According to the substrate processing apparatus 1 of Example 3, the lateral movement and unloading mechanism 71A causes the chuck 77, which holds a plurality of substrates W arranged at unequal intervals and received from the pusher component 55, to move laterally along the lateral movement paths Rin and Rout between the substrate transfer position Po and the substrate transfer positions Pin and Pout. The intermediary mechanism 73A causes the chuck 78, which holds a plurality of substrates W arranged at narrow intervals, to rise and fall at the substrate transfer positions Pin and Pout. The substrate transfer position Po is the position at which a plurality of substrates W arranged at unequal intervals are transferred together between the pusher component 55 and the chuck 77. The substrate transfer positions Pin and Pout are the positions at which a plurality of substrates W arranged at narrow intervals are transferred together between the chuck 78 and the main transport unit WTR. The pitch conversion unit 25A transfers a plurality of substrates W arranged at unequal intervals to and from the chuck 77 by rising and falling at the substrate transfer positions Pin and Pout. The chuck 77 transfers multiple substrates W arranged at narrow pitches between the substrate transfer positions Pin and Pout, thereby transferring them to the pitch converter 25A. The pitch converter 25A is positioned at the substrate transfer positions Pin and Pout. This allows the position of the pitch converter 25, which performs the second-stage pitch conversion, to be separated from the pusher mechanism 21, which performs the first-stage pitch conversion. This allows the second-stage pitch conversion to be performed at a position that does not reduce the productivity of the first-stage pitch conversion. Consequently, substrates W can be processed efficiently.

[0247] Furthermore, the pitch converter 25A is disposed below the chuck 78. This allows the operation at the pitch converter 25A and the operation at the chuck 78 to be performed simultaneously, partially simultaneously, or at close timings.

[0248] Furthermore, the pitch converter 25A is disposed below the lateral travel path, so that the work on the chuck 77 , the work on the pitch converter 25A, and the work on the chuck 78 can be performed simultaneously, partially simultaneously, or at close timings.

[0249] [Example 4]

[0250] Next, a fourth embodiment of the present invention will be described with reference to the drawings. Explanations overlapping with those of the first to third embodiments will be omitted.

[0251] Figure 31 This is a plan view showing the structure of the transfer block and its surroundings in Example 4. Figure 32 Is to say Figure 31 A side view of the handover mechanism and two pitch conversion parts when viewed as shown by arrow AA.

[0252] The substrate processing apparatus 1 of the fourth embodiment includes a delivery mechanism 23A having one pitch converter 25A, similarly to the third embodiment. The substrate processing apparatus 1 of the fourth embodiment differs from the third embodiment in that the substrate processing apparatus 1 does not include an intermediary mechanism 73A.

[0253] That is, the main transport mechanism WTR receives the 50 substrates W arranged at a narrow pitch held by the pitch converter 25A without passing through the intermediate mechanism 73A. For example, the main transport mechanism WTR descends to the height at which the pitch converter 25A performs pitch conversion (the first transfer position P1A in this example). The pitch converter 25A, at the height at which the pitch converter 25A performs pitch conversion, transfers the 50 substrates arranged at a narrow pitch to the main transport mechanism WTR.

[0254] According to the substrate processing apparatus 1 of Example 4, the loading and unloading mechanism 71A causes the chuck 77 that holds the multiple substrates W arranged at unequal intervals and received from the pusher component 55 to move laterally along the lateral movement paths Rin and Rout between the substrate transfer position Po and the substrate transfer positions Pin and Pout. The substrate transfer position Po is the position where the multiple substrates W arranged at unequal intervals are transferred together between the pusher component 55 and the chuck 77. The substrate transfer positions Pin and Pout are the positions where the multiple substrates arranged at narrow intervals are transferred together between the pitch conversion unit 25A and the main transport unit WTR. The pitch conversion unit 25A transfers the multiple substrates W arranged at unequal intervals with the chuck 77 by rising and falling at the substrate transfer positions Pin and Pout. The pitch conversion unit 25A is arranged at the substrate transfer positions Pin and Pout. As a result, the position of the pitch conversion unit 25A that performs the second stage of pitch conversion can be separated from the pusher mechanism 21 that performs the first stage of pitch conversion. That is, the second-stage pitch conversion is performed at a position that does not reduce the productivity of the first-stage pitch conversion. Therefore, the substrate can be processed efficiently.

[0255] Furthermore, the pitch conversion section 25A is disposed below the lateral travel paths Rin and Rout, thereby enabling operations on the chuck 77 and the pitch conversion section 25A to be performed simultaneously, partially simultaneously, or at close timings.

[0256] [Example 5]

[0257] Next, a fifth embodiment of the present invention will be described with reference to the drawings. Explanations overlapping with those of the first to fourth embodiments will be omitted.

[0258] Figure 33 It is a plan view showing the structure of the transfer block 5 and its surroundings in Example 5. Figure 34 It is a side view showing the telescopic mechanism of the pitch converters 25 and 26 provided on the pair of chuck members 77C and 77D of the carry-in mechanism 71 and the pair of chucks 79C and 79D of the carry-out mechanism 75 . Figure 34 It is a side view showing the telescopic mechanism of the pitch converters 25 and 26 provided on the pair of chuck members 77C and 77D of the carry-in mechanism 71 and the pair of chucks 79C and 79D of the carry-out mechanism 75 .

[0259] In Example 5, the first pitch converter 25 is integrally mounted on the pair of chuck members 77C and 77D of the carry-in mechanism 71. The second pitch converter 26 is mounted on the pair of chucks 79C and 79D of the carry-out mechanism 75. Specifically, the first pitch converter 25 is integrally mounted on the side surfaces of the pair of chuck members 77C and 77D of the carry-in mechanism 71. The second pitch converter 26 is mounted on the side surfaces of the pair of chucks 79C and 79D of the carry-out mechanism 75.

[0260] The telescopic structure of the first pitch conversion part 25 and the second pitch conversion part 26 is the same as that of embodiment 1. In embodiment 1, the pitch conversion parts 25 and 26 are placed in a horizontally long manner, while in embodiment 5, the pitch conversion parts 25 and 26 are placed in a vertically long manner.

[0261] The holding grooves 113 of the carry-in mechanism 71 are mounted above the pair of chuck members 77C and 77D. The holding grooves 113 of the carry-out mechanism 75 are mounted above the pair of chucks 79C and 79D. Thus, in the carry-in mechanism 71, the substrate W is held above the pair of chuck members 77C and 77D. In the carry-out mechanism 75, the substrate W is held above the pair of chuck members 79C and 79D.

[0262] According to the fifth embodiment, the first pitch converter 25 is provided in the carry-in mechanism 71, and the second pitch converter 26 is provided in the carry-out mechanism 75. Thus, the height of the substrate processing apparatus 1 can be reduced by an amount corresponding to the fact that the first pitch converter 25 is integrated with the carry-in mechanism 71, and the second pitch converter 26 is integrated with the carry-out mechanism 75.

[0263] Furthermore, the present invention is also applicable to a substrate processing apparatus 1 in which a carry-in mechanism 71 and a carry-out mechanism 75 are arranged vertically. This is because the height of the substrate processing apparatus 1 can be reduced by an amount corresponding to the integration of the first pitch converter 25 and the carry-in mechanism 71, and the integration of the second pitch converter 26 and the carry-out mechanism 75.

[0264] Furthermore, this example can also be applied to the substrate processing apparatus 1 in which the carry-in mechanism 71 and the carry-out mechanism 75 are realized by one mechanism (the carry-in / carry-out mechanism 71A).

[0265] The present invention is not limited to the above-described embodiment, and can be implemented in the following modified forms.

[0266] (1) In the above embodiment, when the reference interval TN9 is, for example, 10 mm, the first interval TN1 is, for example, 3.333 mm, and the second interval TN2 is, for example, 6.666 mm. In this case, the first interval TN1 is equal to half the interval of the second interval TN2. In this regard, the first interval TN1 may be smaller than half the interval of the second interval TN2. For example, when the reference interval TN9 is, for example, 10 mm, the first interval TN1 may be 3 mm, and the second interval TN2 may be 7 mm. Alternatively, the first interval TN1 may be 2.5 mm, and the second interval TN2 may be 7.5 mm. Furthermore, the second interval TN2 is preferably 2 to 3 times the first interval TN1.

[0267] For example, the two retaining grooves 117 of each retaining member 113 may be separated by a first spacing TN1 (e.g., 3 mm) that is smaller than half the second spacing TN2 (e.g., 7 mm) and larger than 0 (zero) mm. Alternatively, the two retaining grooves 117 of each retaining member 113 may be separated by a first spacing TN1 (e.g., 3 mm) that is greater than one-third and less than one-half the second spacing TN2 (e.g., 7 mm). Alternatively, the two retaining grooves 117 of each retaining member 113 may be separated by a first spacing TN1 (e.g., 3.333 mm) that is half the second spacing TN2 (e.g., 6.666 mm).

[0268] (2) In each of the above-described embodiments and modification (1), when the reference interval TN9 is, for example, 10 mm, the first interval TN1 is, for example, 3.333 mm, and the second interval TN2 is, for example, 6.666 mm. In this regard, the first interval TN1 may be larger than a distance that is 1 / 3 times the reference interval TN9 (for example, 3.333 mm) and smaller than a distance that is 1 / 2 times the reference interval TN9 (for example, 5 mm).

[0269] (3) In the above-described embodiment, the pitch conversion units 25 and 26 are provided with two holding grooves 117 in one holding member 113. However, one holding groove 117 may be provided in each holding member 113. In such a structure, a two-stage pitch conversion different from that in the above-described embodiment can be adopted. That is, the pusher mechanism 21 combines the substrates W1 of the first substrate group and the substrates W2 of the second substrate group to form a plurality of substrates W arranged at a first narrow pitch narrower than the reference pitch. The first pitch conversion unit 25 converts the plurality of substrates W arranged at the first narrow pitch into a plurality of substrates W arranged at a second narrow pitch narrower than the first narrow pitch. The first pitch conversion unit 25 provides one holding groove 117 for each holding member 113, thereby being able to convert the first narrow pitch into the second narrow pitch.

[0270] According to this example, the plurality of substrates W arranged at narrow intervals are arranged at a first narrow pitch narrower than the reference pitch. The plurality of substrates W arranged at a narrow pitch are arranged at a second narrow pitch narrower than the first narrow pitch. In this manner, the first narrow pitch formed by the first-stage pitch conversion gradually narrows until it becomes the second narrow pitch, allowing the second-stage pitch conversion to proceed smoothly. The second-stage pitch conversion is performed at a location that does not reduce productivity. Consequently, substrates can be processed efficiently.

[0271] (4) In the above-described embodiments and modifications, the carry-in mechanism 71 is disposed behind the carry-out mechanism 75. However, the carry-in mechanism 71 may be disposed in front of the carry-out mechanism 75. In other words, the arrangement of the carry-in mechanism 71 and the carry-out mechanism 75 may be reversed. In this case, the carry-in mechanism 71 transports the plurality of substrates W from the pusher member 55 to the second pitch converter 26, and the carry-out mechanism 75 transports the plurality of substrates W from the first pitch converter 25 to the pusher member 55.

[0272] (5) In the above-described embodiments and modifications, the intermediary mechanism 73 transports a plurality of substrates W arranged at a narrow pitch from the first pitch converter 25 to the main transport mechanism WTR. In this regard, the intermediary mechanism 73 may transport a plurality of substrates W arranged at a narrow pitch from the main transport mechanism WTR to the second pitch converter 26.

[0273] (6) In the above-described embodiments and modifications, the chuck 77 (a pair of chuck members 77A, 77B) of the carry-in mechanism 71 is opened and closed by the opening and closing portion 81. In this regard, the chuck 77 does not need to be configured to be opened and closed.

[0274] (7) In the above-described embodiments and modifications, the chuck 79 (a pair of chuck members 79A, 79B) of the carry-out mechanism 75 is opened and closed by the opening and closing portion 89. In this regard, the chuck 79 may not be configured to be opened and closed.

[0275] The present invention can be embodied in other specific forms without departing from the spirit or essence thereof, and therefore, reference should be made to the appended claims rather than to the foregoing description as to the scope of the invention.

Claims

1. A substrate processing device for processing a substrate, characterized in that: have: a posture conversion mechanism for converting the posture of the substrates into a horizontal holding posture for maintaining a substrate group in which the substrates in the horizontal posture are arranged at equal intervals in the vertical direction, and a vertical holding posture for maintaining a substrate group in which the substrates in the vertical posture are arranged at the equal intervals in the horizontal direction; a pusher mechanism having a pusher member that combines the second substrate group held in the vertically held posture by the posture conversion mechanism and the first substrate group held in the vertically held posture delivered in advance from the posture conversion mechanism, and holds the plurality of substrates arranged at intervals narrower than the equal intervals; a pitch conversion portion for receiving the plurality of substrates arranged at the narrow intervals and arranging the plurality of substrates arranged at the narrow intervals at a narrower interval than the equal interval; a substrate processing section for processing the plurality of substrates arranged at the narrow pitch at a time; as well as The main transport mechanism transports the plurality of substrates arranged at the narrow pitch to the substrate processing section. The pitch conversion portion is disposed on the main transport mechanism side of the pusher mechanism.

2. The substrate processing apparatus according to claim 1, wherein: The plurality of substrates arranged at the narrow intervals are arranged at unequal intervals, with a first interval narrower than the equal interval and a second interval narrower than the equal interval and wider than the first interval being alternately repeated. The equal spacing is equal to the sum of the first spacing and the second spacing. The plurality of substrates arranged at the narrow pitch are substrates arranged so as to repeat the first interval.

3. The substrate processing apparatus according to claim 1, wherein: The plurality of substrates arranged at the narrow intervals are the plurality of substrates arranged at a first narrow interval narrower than the equal interval. The plurality of substrates arranged at the narrow pitch are arranged at a second narrow pitch that is narrower than the first narrow pitch.

4. The substrate processing apparatus according to claim 1, wherein: The substrate processing apparatus includes a lateral movement mechanism that causes a lateral movement holding portion that collectively holds the plurality of substrates received from the pusher member and arranged at the narrow intervals to move laterally along a lateral movement path between a substrate transfer position and a substrate delivery position. The substrate transfer position is a position where the plurality of substrates arranged at the narrow intervals are transferred between the pusher member and the lateral movement holding portion. The substrate transfer position is a position where the plurality of substrates arranged at the narrow pitch are transferred between the pitch conversion unit and the main transport device. The pitch conversion portion transfers the plurality of substrates arranged at the narrow intervals between the pitch conversion portion and the lateral movement holding portion by ascending and descending at the substrate transfer position. The pitch conversion portion is disposed at the substrate handover position.

5. The substrate processing apparatus according to claim 4, wherein: The pitch conversion portion is disposed below the lateral travel path.

6. The substrate processing apparatus according to claim 1, wherein: The substrate processing apparatus includes: a lateral movement mechanism that causes a lateral movement holding portion that collectively holds the plurality of substrates received from the pusher member and arranged at the narrow intervals to move laterally along a lateral movement path between a substrate transfer position and a substrate delivery position; and An intermediary mechanism that raises and lowers an intermediary holding portion that holds the plurality of substrates arranged at the narrow pitch at the substrate transfer position. The substrate transfer position is a position where the plurality of substrates arranged at the narrow intervals are transferred between the pusher member and the lateral movement holding portion. The substrate transfer position is a position where the plurality of substrates arranged at the narrow pitch are transferred between the intermediate holding portion and the main transport device. The pitch conversion portion transfers the plurality of substrates arranged at the narrow intervals between the pitch conversion portion and the lateral movement holding portion by ascending and descending at the substrate transfer position. The intermediate holding portion transfers the plurality of substrates arranged at the narrow pitch between the intermediate holding portion and the pitch conversion portion by moving up and down at the substrate transfer position. The pitch conversion portion is disposed at the substrate handover position.

7. The substrate processing apparatus according to claim 6, wherein: The pitch conversion portion is disposed below the intermediate holding portion.

8. The substrate processing apparatus according to claim 6, wherein: The pitch conversion portion is disposed below the lateral travel path.

9. The substrate processing apparatus according to claim 1, wherein: The substrate processing apparatus includes: a first lateral movement mechanism that causes a first lateral movement holding portion that holds the plurality of substrates received from the pusher member and arranged at the narrow intervals to move laterally along a first lateral movement path; as well as The second lateral movement mechanism causes the second lateral movement holding portion that holds the plurality of substrates arranged at the narrow intervals and delivered to the pusher member to move laterally along a second lateral movement path. The pitch conversion unit includes: a first pitch conversion portion receiving the plurality of substrates arranged at the narrow intervals and arranging the plurality of substrates arranged at the narrow intervals at the narrow intervals; as well as The second pitch conversion portion receives the plurality of substrates arranged at the narrow pitch and arranges the plurality of substrates arranged at the narrow pitch at the narrow interval.

10. The substrate processing apparatus according to claim 9, wherein: The first lateral movement path is a path between the substrate transfer position and the substrate loading position. The second lateral movement path is a path between the substrate unloading position and the substrate loading position. The first lateral movement path and the second lateral movement path are provided at positions separated in the lateral direction. The first pitch conversion portion is disposed at the substrate loading position. The second pitch conversion portion is disposed at the substrate carrying-out position.

11. The substrate processing apparatus according to claim 10, wherein: The first pitch conversion portion receives the plurality of substrates arranged at the narrow intervals from the first lateral movement holding portion, and carries the plurality of substrates arranged at the narrow intervals into the main transport mechanism.

12. The substrate processing apparatus according to claim 10, wherein: The intermediate mechanism is provided to raise the intermediate holding portion for collectively holding the plurality of substrates arranged at the narrow pitch to the substrate carrying-in position. The substrate transfer position is a position where the plurality of substrates arranged at the narrow intervals are collectively transferred from the pusher member to the first transverse transfer holding portion. The substrate loading position is a position where the plurality of substrates arranged at the narrow pitch are loaded from the intermediate holding portion to the main transport mechanism. The first pitch conversion unit moves up to the substrate loading position to load the plurality of substrates arranged at the narrow intervals from the first lateral movement holding unit. The intermediate holding portion moves up to the substrate carrying position to carry in the plurality of substrates arranged at the narrow pitch from the pitch conversion portion. The first pitch conversion portion is disposed at the substrate carrying-in position.

13. The substrate processing apparatus according to claim 12, wherein: The first pitch conversion portion is disposed below the intermediate holding portion.

14. The substrate processing apparatus according to claim 13, wherein: The first pitch conversion portion is disposed below the first lateral travel path.

15. The substrate processing apparatus according to claim 10, wherein: The second pitch conversion unit receives the plurality of substrates arranged at the narrow pitch from the main conveying mechanism and carries out the plurality of substrates arranged at the narrow pitch to the second lateral movement holding unit. The second pitch conversion portion is disposed at the substrate carrying-out position.

16. The substrate processing apparatus according to claim 15, wherein: The second pitch conversion portion is disposed below the second lateral travel path.

17. The substrate processing apparatus according to claim 9, wherein: The second pitch conversion portion is disposed above the first pitch conversion portion.

18. The substrate processing apparatus according to claim 10, wherein: The second pitch conversion portion is disposed above the intermediate holding portion.

19. The substrate processing apparatus according to claim 9, wherein: The first lateral movement path and the second lateral movement path intersect at a predetermined angle, The pusher mechanism is arranged at a position intersecting at the predetermined angle. The first pitch converter and the second pitch converter are arranged to be spaced apart from each other by the predetermined angle.

20. The substrate processing apparatus according to claim 1, wherein The substrate processing apparatus includes a lateral movement mechanism that causes a lateral movement holding portion that collectively holds the plurality of substrates received from the pusher member and arranged at the narrow intervals to move laterally along a lateral movement path between a substrate transfer position and a substrate delivery position. The pitch conversion portion is provided on the lateral movement mechanism.

21. The substrate processing apparatus according to claim 9, wherein The first spacing conversion portion is provided on the first lateral movement mechanism. The second pitch conversion portion is provided on the second lateral movement mechanism.

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