Electronic device

Abstract

The invention provides an electronic device. The electronic device includes a carrier, an electronic component, a first antenna and a conductive element. The carrier has a first surface and a second surface opposite to the first surface. The electronic component adjoins the second surface. The first antenna is connected with the carrier. The conductive element abuts the first surface of the carrier and is configured to test the first antenna.

Description

Technical Field

[0001] The present invention relates generally to an electronic device, and in particular, to an electronic device including an antenna and a test pad configured to test electrical properties of the electronic device. Background Art

[0002] To reduce the size of electronic devices and achieve higher integration, several packaging solutions, such as antenna in package (AiP) and antenna on package (AoP), have been developed and implemented. However, to support industry demand for increased electronic functionality, the size and / or form factor of electronic devices will inevitably increase. Summary of the Invention

[0003] In some arrangements, an electronic device includes a carrier, an electronic component, a first antenna, and a conductive element. The carrier has a first surface and a second surface opposite the first surface. The electronic component is adjacent to the second surface. The first antenna is connected to the carrier. The conductive element is adjacent to the first surface of the carrier and is configured to test the first antenna.

[0004] In some arrangements, an electronic device includes a carrier, a flexible circuit structure, a connector, and a first antenna. The flexible circuit structure is disposed above the carrier. The first antenna is connected to the flexible circuit structure. The connector is disposed above the carrier and electrically connected to the first antenna by the flexible circuit structure. The connector is configured to connect an external device to the carrier.

[0005] In some arrangements, an electronic device includes a carrier, an electronic component, a connector, and a flexible circuit layer. The electronic component is disposed below the carrier. The connector is disposed above the carrier and is configured to connect the carrier to an external device. The flexible circuit layer connects an antenna to the carrier and is spaced apart from the connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Aspects of some arrangements of the present invention are best understood from the following detailed description when read in conjunction with the accompanying drawings.It should be noted that the various structures may not be drawn to scale and that the dimensions of the various structures may be arbitrarily increased or reduced for clarity of discussion.

[0007] Figure 1A and Figure 1B Perspective views illustrating electronic devices according to some arrangements of the present invention.

[0008] Figure 1C Some arrangements according to the present invention are described as follows Figure 1A and Figure 1B A side view of the electronic device shown in FIG.

[0009] Figure 2 A side view illustrating an electronic device according to some arrangements of the present invention.

[0010] Figure 3 Perspective views illustrating electronic devices according to some arrangements of the present invention.

[0011] Figure 4 Perspective views illustrating electronic devices according to some arrangements of the present invention.

[0012] Figure 5 Perspective views illustrating electronic devices according to some arrangements of the present invention.

[0013] Figure 6 A side view illustrating an electronic device according to some arrangements of the present invention.

[0014] Figure 7A The layout of an electronic device according to some arrangements of the present invention is illustrated.

[0015] Figure 7B Some arrangements according to the present invention are described as follows Figure 7A A side view of the electronic device shown in FIG.

[0016] Figure 8A One or more stages of an example of a method for fabricating a semiconductor package structure according to some arrangements of the present invention are described.

[0017] Figure 8B One or more stages of an example of a method for fabricating a semiconductor package structure according to some arrangements of the present invention are described.

[0018] Figure 8C One or more stages of an example of a method for fabricating a semiconductor package structure according to some arrangements of the present invention are described.

[0019] Figure 8D One or more stages of an example of a method for fabricating a semiconductor package structure according to some arrangements of the present invention are described.

[0020] Figure 9A Perspective views illustrating comparative arrangements of electronic devices during testing.

[0021] Figure 9B A perspective view illustrating an electronic device according to some arrangements of the present invention during testing. DETAILED DESCRIPTION

[0022] Common reference numerals are used throughout the drawings and embodiments to indicate the same or similar components.The arrangement of the present invention will be readily understood from the following detailed description taken in conjunction with the accompanying drawings.

[0023] The following disclosure provides many different arrangements or examples for implementing the different features of the provided themes. Specific examples of components and arrangements are described below to explain certain aspects of the present invention. Of course, these components and arrangements are merely examples and are not intended to be restrictive. For example, in the following description, the formation of a first feature above or on a second feature may include an arrangement in which the first feature is formed or arranged in direct contact with the second feature, and may also include an arrangement in which an additional feature may be formed or arranged between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the present invention may repeat reference numbers and / or letters in various examples. This repetition is for simplicity and clarity, and does not itself specify the relationship between the various arrangements and / or configurations discussed.

[0024] Figure 1A and Figure 1B Perspective views of an electronic device 1a according to some arrangements of the present invention are illustrated from different perspectives. In some arrangements, the electronic device 1a may be configured to operate using electromagnetic waves or electromagnetic signals at appropriate radio wavelengths, such as microwaves, millimeter waves, or submillimeter waves. In some arrangements, the electronic device 1a may include a circuit structure 10, a carrier 20, an electronic component 30 (shown in FIG. Figure 1B ), the encapsulation body 40 and the antenna component 50.

[0025] Circuit structure 10 may include a circuit board including a redistribution structure for electrical connections between components. For example, circuit structure 10 may include a conductive layer, conductive traces, conductive pads, and / or vias for electrical connections. In some arrangements, circuit structure 10 may include a flexible circuit structure, a bendable circuit structure, or other suitable circuit structure. Circuit structure 10 may include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide, liquid crystal polymer (LCP), thermoplastic polyurethane (TPU), or other suitable materials. Circuit structure 10 may include a multilayer structure including a dielectric layer and electrical interconnects (e.g., a conductive layer, conductive traces, conductive pads, and vias) disposed on and / or within the dielectric layer.

[0026] In some arrangements, the circuit structure 10 may include an extension portion 11, an extension portion 12, and a curved portion 13 to define a curved circuit structure. The extension portion 11 may extend along the X-direction and the Z-direction, with the X-direction and the Z-direction spanning a plane generally parallel to the XZ plane. For example, the long edge (or long side) of the extension portion 11 may extend generally along the Z-direction, while the short edge (or short side) of the extension portion 11 may extend generally along the X-direction. The extension portion 11 may have a surface 11s1 and a surface 11s2 opposite to the surface 11s1. In some arrangements, the surface 11s2 of the extension portion 11 may be configured to support the carrier 20. In some arrangements, the surface 11s2 of the extension portion 11 may be configured to support the electronic component 30.

[0027] In some arrangements, the extension portion 12 may be connected to the extension portion 11 via a bent portion 13. The extension portion 12 may extend along the Y direction and the Z direction, the Y direction and the Z direction spanning a plane generally parallel to the YZ plane. For example, the long edge (or long side) of the extension portion 12 extends generally along the Z direction, while the short edge (or short side) of the extension portion 12 extends generally along the Y direction. The extension portion 12 may have a surface 12s1 and a surface 12s2 opposite to the surface 12s1. In some arrangements, the surface 12s2 of the extension portion 12 may be configured to support the antenna assembly 50. In some arrangements, the surface area of the extension portion 12 (e.g., the surface area of the surface 12s1) is smaller than the surface area of the extension portion 11 (e.g., the surface area of the surface 11s1).

[0028] Bend 13 may extend between extension 11 and extension 12. In some arrangements, bend 13 may include two or more curved fingers 13f. In some arrangements, fingers 13f define a curved surface connecting extension 11 and extension 12. In some arrangements, extension 11, extension 12, and bend 13 may be formed as a single, integral piece. That is, extension 11, extension 12, and bend 13 may include or be made of the same material, with no distinct boundaries. Bend 13 allows extension 12 to extend further away from carrier 20.

[0029] In some arrangements, the carrier 20 may be disposed on or under the surface 11s2 of the extension portion 11. The carrier 20 may be attached to the surface 11s2 of the extension portion 11. The carrier 20 may extend along an X-direction and a Z-direction, the X-direction and the Z-direction spanning a plane generally parallel to the XZ plane. For example, the long edge (or long side) of the carrier 20 may extend generally along the Z-direction, while the short edge (or short side) of the carrier 20 may extend generally along the X-direction. The carrier 20 may be formed, for example, from a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated fiberglass-based copper foil laminate. The carrier 20 may include a redistribution structure comprising conductive layers, conductive traces, conductive pads, and / or vias disposed on or within one or more dielectric layers. The carrier 20 may be electrically connected to the circuit structure 10. The carrier 20 may have a surface 20s1 and a surface 20s2 opposite the surface 20s1. The surface 20 s 1 may face or abut the surface 11 s 2 of the extension portion 11 .

[0030] In some arrangements, the surface area of the surface 20s1 of the carrier 20 may be greater than the surface area of the surface 11s1 of the extension portion 11. The extension portion 11 may have a length L1 along the Z direction. The carrier 20 may have a length L2 along the Z direction. In some arrangements, the length L2 of the carrier 20 may be greater than the length L1 of the extension portion 11. The extension portion 11 may have a length L3 along the X direction. The carrier 20 may have a length L4 along the X direction. In some arrangements, the length L4 of the carrier 20 may be greater than the length L3 of the extension portion 11. In some arrangements, a portion of the surface 20s1 may be exposed by the extension portion 11. In some arrangements, a portion of the surface 11s2 of the extension portion 11 may be exposed by the carrier 20 or the electronic component 30, such as Figure 1B . In some arrangements, a portion of the short edge of extension portion 11 may extend beyond the short edge of carrier 20. The long edge of extension portion 12 may have a length L5 along the Z direction. In some arrangements, length L5 of extension portion 12 may be less than length L2 of carrier 20. In some arrangements, length L5 of extension portion 12 may be substantially equal to length L1 of extension portion 11.

[0031] In some arrangements, the electronic component 30 may be disposed on or below the surface 20s2 of the carrier 20. The electronic component 30 may be disposed on or below the surface 11s2 of the extension portion 11. The electronic component 30 may include a semiconductor die or chip, such as a logic die (e.g., an application processor (AP), a system-on-a-chip (SoC), a central processing unit (CPU), a graphics processing unit (GPU), a microcontroller, etc.), a memory die (e.g., a dynamic random access memory (DRAM) die, a static random access memory (SRAM) die, etc.), a power management die (e.g., a power management integrated circuit (PMIC) die), a radio frequency (RF) die, a sensor die, a micro-electro-mechanical-system (MEMS) die, a signal processing die (e.g., a digital signal processing (DSP) die), a front-end die (e.g., an analog front-end (AFE) die), or other active components. In some arrangements, the electronic component 30 may include an analog-to-digital (A / D) converter, a digital-to-analog (D / A) converter, a filter, a low noise amplifier (LNA), a power amplifier, a multiplexer, a demultiplexer, a modulator, a demodulator, etc. In some arrangements, the electronic component 30 may be configured to transmit a signal (e.g., a feed signal, an input signal, an output signal, or an electromagnetic wave) to the antenna component 50 and / or receive a signal from the antenna component 50 and / or process the signal.

[0032] In some arrangements, the encapsulation body 40 may be disposed on or below the surface 20s2 of the carrier 20. The encapsulation body 40 may be disposed on or below the surface 11s2 of the extension portion 11. In some arrangements, the encapsulation body 40 may encapsulate or cover the electronic component 30. In some arrangements, the encapsulation body 40 may include or be made of a molding material, such as a novolac-type resin, an epoxy-type resin, a silicone-type resin, or another suitable encapsulating material. A suitable filler, such as powdered SiO2, may also be included.

[0033] In some arrangements, the antenna assembly 50 may be disposed on the surface 12s2 of the extension portion 12. The antenna assembly 50 may be attached to the surface 12s2 of the extension portion 12. The antenna assembly 50 may be electrically connected to the electronic assembly 30 via the circuit structure 10 and the carrier 20. In some arrangements, the antenna assembly 50 may be configured to radiate and / or receive electromagnetic signals, such as radio frequency (RF) signals. For example, the antenna assembly 50 may be configured to operate at a frequency between approximately 10 GHz and approximately 10 THz, such as 10 GHz, 50 GHz, 100 GHz, 500 GHz, 1000 GHz, 5000 GHz, or 10 THz. In some arrangements, the antenna assembly 50 may support fifth-generation (5G) communications, such as sub-6 GHz bands and / or millimeter (mm) wave bands. For example, the antenna assembly 50 may incorporate both a sub-6 GHz antenna and an mm-wave antenna. In some arrangements, the antenna assembly 50 may support beyond-5G or 6G communications, such as in the terahertz (THz) band. In some arrangements, the antenna assembly 50 may include a loop antenna, an inverted-F antenna, a strip antenna, a planar inverted-F antenna, a patch antenna, a slot antenna, a hybrid antenna including more than one type of antenna structure, or other suitable antenna. In some arrangements, the antenna assembly 50 may include a dielectric resonator antenna (DRA). In some arrangements, the antenna assembly 50 may be detachable. For example, the antenna assembly 50 may be separate from the circuit structure 10. In some arrangements, the antenna patch, radiator, director, and / or other components of the antenna assembly 50, which may include metal materials, are not formed on or within the circuit structure 10. Under such conditions, signal radiation can be easily controlled. In some arrangements, the antenna assembly 50 may include multiple antennas operating at different frequencies. The antennas may be stacked. For example, an antenna operating at a lower frequency may be closer to the circuit structure 10 than an antenna operating at a higher frequency.

[0034] In some arrangements, the electronic device 1a may further include a connector 62. The connector 62 may be disposed on or over the surface 20s1 of the carrier 20. The connector 62 may be supported by or attached to the carrier 20. In some arrangements, the antenna component 50 and the connector 62 may be disposed on adjacent sides or surfaces of the circuit structure 10. For example, the connector 62 may be adjacent to the surface 11s3 of the extension 11 extending between the surfaces 11s1 and 11s2 and facing the Y direction, while the antenna component 50 is disposed on the surface 12s2 of the extension 12 and facing the X direction. The connector 62 may be configured to electrically connect the electronic device 1a to an external device (not shown), such as a circuit board or other suitable component. In some arrangements, the connector 62 may be adjacent to the extension 11. For example, the connector 62 may be disposed adjacent to a lateral surface (not illustrated) of the extension 11. The connector 62 may be electrically connected to the carrier 20. The connector 62 may be electrically connected to the electronic component 30. In some arrangements, connector 62 may be exposed by extension portion 11. In some arrangements, connector 62 may not overlap extension portion 11 along the Y direction. In some arrangements, connector 62 may not overlap extension portion 12 along the Y direction. Connector 62 may cover the portion of carrier 20 exposed by circuit structure 10.

[0035] In some arrangements, the electronic device 1a may further include a conductive element 64. A portion of the conductive element 64 may be embedded within the carrier 20. The conductive element 64 may be disposed on or above the surface 20s1 of the carrier 20. In some arrangements, the antenna component 50 and the conductive element 64 may be disposed on adjacent sides or surfaces of the circuit structure 10. For example, the conductive element 64 may be adjacent to the surface 11s3 and face the Y direction, while the antenna component 50 is disposed on the surface 12s2 of the extension 12 and faces the X direction. In some arrangements, the conductive element 64 does not overlap with the circuit structure 10. In some arrangements, the conductive element 64 does not overlap with the extension 11 of the circuit structure 10. In some arrangements, the conductive element 64 does not overlap with the extension 12 of the circuit structure 10. The conductive element 64 may be configured to electrically connect to the electronic component 30 and / or the antenna component 50 for testing. For example, the conductive element 64 may be configured to measure electrical properties of the electronic device 1a, such as the gain, impedance, or other properties of the antenna. In some arrangements, the conductive element 64 may be positioned adjacent to the connector 62 so that the electrical properties of the electrical signal transmitted between the connector 62 and the antenna assembly 50 may be closer to the measured electrical properties of the electrical signal transmitted between the conductive element 64 and the antenna assembly 50. Consequently, the measured electrical properties from the conductive element 64 may be relatively accurate. In some arrangements, the electrical transmission path between the conductive element 64 and the antenna assembly 50 may be substantially the same as or closer to the electrical transmission path between the connector 62 and the antenna assembly 50. The electrical transmission path may be the path of the electrical signal. In some arrangements, the conductive element 64 may be positioned between the extension portion 11 and the connector 62.

[0036] In this arrangement, the conductive element 64 (e.g., a test pad) and the electronic component 30 (or the encapsulation 40) are disposed on different sides of the carrier 20. Furthermore, the conductive element 64 and the antenna component 50 are disposed on adjacent sides. Thus, a probe can be connected to the conductive element 64 without obstructions such as the encapsulation, antenna, and / or other components. Furthermore, the conductive element 64 is disposed on the side (or lateral surface) of the carrier 20, thereby providing more space for integration of the electronic device 1a and other external devices such as a circuit board.

[0037] Figure 1C Some arrangements according to the present invention are described as follows Figure 1A and Figure 1B 1a is a side view of the electronic device 1a shown in FIG.

[0038] The electronic device 1a may further include an electrical connector 22. The electrical connector 22 may be disposed between the carrier 20 and the extension 11 of the circuit structure 10. The electrical connector 22 may electrically connect the circuit structure 10 and the carrier 20. In some arrangements, the electrical connector 22 may overlap the circuit structure 10 along the X-direction. In some arrangements, the electrical connector 22 may overlap the extension 12 of the circuit structure 10 along the X-direction. The electrical connector 22 may include solder balls, such as controlled collapse chip connection (C4) bumps, ball grid arrays (BGAs), land grid arrays (LGAs), and the like. In some arrangements, the electrical connector 22 may include one or more solder materials, which may include a gold-solder alloy or a silver-solder alloy, or other suitable materials.

[0039] Electronic device 1a may further include an electrical connector 52. Electrical connector 52 may be disposed between antenna assembly 50 and extension portion 12 of circuit structure 10. Electrical connector 52 may electrically connect circuit structure 10 and antenna assembly 50. Electrical connector 52 may include solder balls, such as controlled chip connection (C4) bumps, ball grid arrays (BGAs), land grid arrays (LGAs), and the like. In some arrangements, electrical connector 52 may include one or more solder materials, such as a gold-solder alloy or a silver-solder alloy, or other suitable materials.

[0040] Surfaces 11s1, 12s1, and curved portion 13 may define a generally L-shaped surface 10s1. Surfaces 11s2, 12s2, and curved portion 13 may define a generally L-shaped surface 10s2 opposite generally L-shaped surface 10s1. In some arrangements, both the electronic component 30 and the antenna component 50 are disposed on the generally L-shaped surface 10s2 of the circuit structure 10. In some arrangements, both the encapsulation body 40 and the antenna component 50 are disposed on the generally L-shaped surface 10s2 of the circuit structure 10. In some arrangements, no antenna component 50 is disposed on or attached to the generally L-shaped surface 10s1. In some arrangements, the probe approaches the conductive element 64 from the side of the generally L-shaped surface 10s1. Because there is more space adjacent to the generally L-shaped surface 10s1, the probe can connect to the conductive element 64 with fewer obstructions.

[0041] The carrier 20 may have a surface 20s3 extending between the surface 20s1 and the surface 20s2. In some arrangements, the encapsulation body 40 may have a surface 40s1 (or lateral surface) that is generally aligned with the surface 20s3.

[0042] In some arrangements, the electronics assembly 30 may not overlap with the antenna assembly 50 along the X direction. In some arrangements, the electronics assembly 30 may not overlap with the antenna assembly 50 along the Y direction. In some arrangements, the electronics assembly 30 may not overlap with the antenna assembly 50 along the Z direction.

[0043] In some arrangements, the encapsulation body 40 does not overlap with the antenna assembly 50 along the Y direction. In some arrangements, the encapsulation body 40 does not overlap with the antenna assembly 50 along the X direction. In some arrangements, the encapsulation body 40 does not overlap with the extension portion 12 of the circuit structure 10 along the Y direction. In some arrangements, the encapsulation body 40 does not overlap with the extension portion 12 of the circuit structure 10 along the X direction. In some arrangements, the surface 40s1 of the encapsulation body 40 may extend beyond the extension portion 11 of the circuit structure 10. For example, the surface 40s1 of the encapsulation body 40 may extend beyond the lateral surface of the extension portion 11 of the circuit structure 10.

[0044] In some arrangements, connector 62 may overlap circuit structure 10 along the X direction. In some arrangements, connector 62 may overlap extension portion 12 of circuit structure 10 along the X direction. In some arrangements, connector 62 may overlap antenna assembly 50 along the X direction.

[0045] Figure 2 A side view illustrating an electronic device 1b according to some arrangements of the present invention. The electronic device 1b is similar to Figure 1C , and the differences therebetween are described below.

[0046] In some arrangements, the electronic device 1b may further include a circuit structure 10'. The circuit structure 10' may include a circuit board including a redistribution structure for electrical connections between components. For example, the circuit structure 10' may include a conductive layer, conductive traces, conductive pads, and / or vias for electrical connections. The circuit structure 10' may include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide, liquid crystal polymer (LCP), thermoplastic polyurethane (TPU), or other suitable materials. The circuit structure 10' may include a multilayer structure including a dielectric layer and electrical interconnects (e.g., conductive layers, conductive traces, conductive pads, and vias) disposed on and / or within the dielectric layer. The circuit structure 10' may have a surface 10's1 and a surface 10's2 opposite to the surface 10's1. In some arrangements, the surface 10's1 may be a substantially flat surface. In some arrangements, surface 10's2 may be a substantially flat surface. In some arrangements, encapsulation body 40 may be disposed on or above surface 10's2 of circuit structure 10'. In some arrangements, a portion of carrier 20 does not overlap circuit structure 10' along the Y direction. In some arrangements, antenna assembly 50 may be disposed on or above surface 10's2 of circuit structure 10'. In some arrangements, carrier 20 may overlap antenna assembly 50 along the X direction. In some arrangements, encapsulation body 40 may overlap antenna assembly 50 along the X direction. In some arrangements, a probe is connected to conductive element 64 from the side of surface 10's1. Because there is more space adjacent to surface 10's1, the probe can connect to conductive element 64 with fewer obstructions. In some arrangements, when conductive element 64 and electronic component 30 encapsulated by encapsulation body 40 are disposed on two opposing sides of carrier 20, a common probe can be utilized without requiring any additional design modifications to the electronic device. As a result, the cost of the probe can be reduced.

[0047] Figure 3 A perspective view illustrating an electronic device 1c according to some arrangements of the present invention. The electronic device 1c is similar to Figure 1A , and the differences therebetween are described below.

[0048] In some arrangements, the long edge (or side) of the extension portion 12 may have a length L6 along the Z direction. In some arrangements, the length L6 of the extension portion 12 may be substantially equal to the length L2 of the carrier 20. In some arrangements, the length L6 of the extension portion 12 may be greater than the length L1 of the extension portion 11. The length of the extension portion 12 may be controlled. In some arrangements, the extension portion 12 may extend beyond the surface 11s3 of the extension portion 11. The size (e.g., surface area) of the antenna component 50 may be increased. For example, the number of antenna patterns (e.g., antenna arrays) of the antenna component 50 may be increased, thereby improving the gain of the antenna. The electrical properties of the antenna component 50 may also be controlled based on the requirements of the electronic device 1c.

[0049] Figure 4 A perspective view illustrating an electronic device 1d according to some arrangements of the present invention. The electronic device 1d is similar to Figure 1A , and the differences therebetween are described below.

[0050] In some arrangements, the circuit structure 10 may further include an extension portion 14 and a curved portion 15. In some arrangements, the extension portion 14 may be connected to the extension portion 11 via the curved portion 15. The extension portion 14 may extend along the X-direction and the Z-direction, with the X-direction and the Z-direction spanning a plane generally parallel to the XZ plane. For example, the long edge (or long side) of the extension portion 14 may extend generally along the X-direction, while the short edge (or short side) of the extension portion 14 may extend generally along the Z-direction.

[0051] Bend 15 may extend between extension 11 and extension 14. In some arrangements, bend 15 may include two or more curved fingers 15f. In some arrangements, fingers 15f define a curved surface connecting extension 11 and extension 14. Bend 15 allows extension 14 to extend further away from carrier 20.

[0052] The electronic device 1d may further include an antenna assembly 54. In some arrangements, the antenna assembly 54 may be disposed on the extension portion 14. In some arrangements, the antenna assembly 54 may be configured to radiate and / or receive electromagnetic signals, such as RF signals. In some arrangements, the antenna assembly 54 may support fifth-generation (5G) communications, such as sub-6 GHz bands and / or millimeter (mm) wave bands. For example, the antenna assembly 50 may include both a sub-6 GHz antenna and an mm wave antenna. In some arrangements, the antenna assembly 54 may support super-5G or 6G communications, such as the terahertz (THz) band. In some arrangements, the antenna assembly 54 may be detachable. For example, the antenna assembly 54 may be detachable from the extension portion 14. In some arrangements, the antenna assembly 50 and the antenna assembly 54 may operate in different frequency bands. In some arrangements, the antenna assembly 50 and the antenna assembly 54 may operate in different bandwidths. In some arrangements, the signal from the antenna assembly 50 may be incident along a direction different from the incident direction of the signal from the antenna assembly 54. For example, the signal (or electromagnetic wave) from antenna component 50 may be incident generally along the X direction that is generally parallel to the surface 20s1 of carrier 20, while the signal (or electromagnetic wave) from antenna component 54 may be incident generally along the Z direction. Antenna component 50 may face the X direction, while antenna component 54 may face the Z direction.

[0053] Figure 5 A perspective view illustrating an electronic device 1e according to some arrangements of the present invention. The electronic device 1e is similar to Figure 1A , and the differences therebetween are described below.

[0054] In some arrangements, the long edge (or side) of carrier 20 may have a length L7 along the Z direction. In some arrangements, length L7 of carrier 20 may be substantially equal to length L1 of extension 11. In some arrangements, connector 62 may be disposed on surface 11s1 of extension 11. Connector 62 may overlap extension 11 along the Y direction. In some arrangements, connector 62 may overlap extension 12 along the X direction. In some arrangements, connector 62 may be spaced apart from carrier 20 by extension 11 of circuit structure 10.

[0055] In some arrangements, the conductive element 64 may be disposed on the surface 11s1 of the extension portion 11. In some arrangements, the conductive element 64 may be at least partially embedded within the extension portion 11 of the circuit structure 10. The conductive element 64 may overlap the extension portion 11 along the Y direction. In some arrangements, the conductive element 64 may overlap the extension portion 12 along the X direction. In some arrangements, the conductive element 64 may be separated from the carrier 20 by the extension portion 11 of the circuit structure 10. In this arrangement, the dimension along the Z direction can be reduced. Consequently, the size of the electronic device 1e can be reduced. In this arrangement, the connector 62 can be electrically connected to the electronic component 30 via the extension portion 11 and the carrier 20. The conductive element 64 can be electrically connected to the electronic component 30 via the extension portion 11 and the carrier 20.

[0056] Figure 6 A side view illustrating an electronic device 1f according to some arrangements of the present invention. The electronic device 1f is similar to Figure 1C , and the differences therebetween are described below.

[0057] In some arrangements, the electronic device 1f may further include an electromagnetic interference (EMI) shielding layer 70. In some arrangements, the EMI shielding layer 70 may be electrically connected to ground. In some arrangements, the EMI shielding layer 70 may be electrically connected to a ground trace (not shown) within the carrier 20. In some arrangements, the EMI shielding layer 70 may be configured to receive and / or transmit a ground signal. In some arrangements, the EMI shielding layer 70 may be configured to protect the electronic component 30 from EMI. The EMI shielding layer 70 may encapsulate the encapsulation body 40. The EMI shielding layer 70 may cover an outer surface of the encapsulation body 40. For example, the EMI shielding layer 70 may cover a surface 40s1 of the encapsulation body 40. The EMI shielding layer 70 may encapsulate the carrier 20. The EMI shielding layer 70 may cover an outer surface of the carrier 20. For example, the EMI shielding layer 70 may cover a surface 20s3 of the carrier 20. The surface 20s1 of the carrier 20 may be exposed by the EMI shielding layer 70.

[0058] In some arrangements, the EMI shielding layer 70 may comprise a multilayer structure. For example, the EMI shielding layer 70 may comprise an adhesive metal layer, one or more intervening metal layers, and a protective metal layer. The intervening metal layer may be sandwiched between the adhesive metal layer and the protective metal layer. The adhesive metal layer may have relatively good adhesion to the encapsulation body 40 (or carrier 20) to prevent the EMI shielding layer 70 from peeling off from the encapsulation body 40 (or carrier 20). The adhesive metal layer may comprise, for example, stainless steel or other suitable materials. The intervening metal layer may have relatively good ductility and shielding capabilities to block interfering signals (such as light or other optical signals) from electronic components (such as electronic components 30) in the surrounding environment. The intervening metal layer may comprise, for example, copper or other suitable materials. The protective metal layer may be configured to protect the intervening metal layer from oxidation. The protective metal layer may comprise, for example, stainless steel or other suitable materials.

[0059] Figure 7A and Figure 7B An electronic device 2 according to some arrangements of the present invention is described, wherein Figure 7A Describe the layout, and Figure 7B for Figure 7A is a side view. In some arrangements, electronic device 2 may include a mobile phone, smartphone, laptop computer, digital broadcast terminal, personal digital assistant (PDA), portable multimedia player (PMP), navigation system, tablet personal computer, tablet computer, ultrabook, digital TV, desktop computer, or the like. However, it should be noted that the configuration according to the arrangements described herein is applicable even to new products to be developed later. In some arrangements, electronic device 2 may include antenna module 1, motherboard 81, energy storage component 83, and housing 84.

[0060] The antenna module 1 may be configured to transmit, receive and / or process electromagnetic signals, such as RF signals. Figure 6 For example, the antenna module 1 may include the following: Figure 6 , circuit structure 10, carrier 20, electronic component 30, encapsulation body 40, antenna assembly 50, and EMI shielding layer 70 are shown. In some arrangements, antenna module 1 may be positioned adjacent to an edge (or lateral surface) of housing 84. Antenna module 1 (or antenna assembly 50) may be configured to radiate electromagnetic waves (or signals) into the surrounding environment. Antenna module 1 (or antenna assembly 50) protrudes from a lateral surface of motherboard 81. Antenna module 1 (or antenna assembly 50) may be configured to transmit signals (or electromagnetic waves) in a direction generally perpendicular to the lateral surface of motherboard 81.

[0061] A host board 81 (or printed circuit board) can be attached to or electrically connected to the antenna module 1. In some arrangements, the host board 81 may include one or more active components (not shown) and passive components (not shown). Active components may include semiconductor dies or chips, such as logic dies (e.g., application processors (APs), system-on-chips (SoCs), central processing units (CPUs), graphics processing units (GPUs), microcontrollers, etc.), memory dies (e.g., dynamic random access memory (DRAM) dies, static random access memory (SRAM) dies, etc.), power management dies (e.g., power management integrated circuit (PMIC) dies), radio frequency (RF) dies, sensor dies, microelectromechanical systems (MEMS) dies, signal processing dies (e.g., digital signal processing (DSP) dies), front-end dies (e.g., analog front-end (AFE) dies), or other active components. Passive components may include resistors, capacitors, inductors, or a combination thereof. Additionally, the host board 81 may include electrical interconnects, such as conductive traces or vias, for electrical connection.

[0062] In some arrangements, the motherboard 81 may include a heat dissipation element 82. The heat dissipation element 82 may be attached to or connected to the EMI shielding layer 70 of the antenna module 1. In some arrangements, a thermally conductive material (not shown) may be disposed between the encapsulation body 40 and the heat dissipation element 82. The heat dissipation element 82 may be configured to receive and / or transmit heat emitted from the antenna module 1. A heat dissipation path may be provided between the antenna module 1 and the motherboard 81. The heat dissipation element 82 may include copper, silver, gold, or other suitable thermally conductive materials.

[0063] Energy storage component 83 may be disposed on or attached to surface 11s2 of circuit structure 10. Energy storage component 83 may include a battery configured to provide power to antenna module 1 or other devices. In some arrangements, antenna module 1 may be disposed between motherboard 81 and energy storage component 83.

[0064] Housing 84 can house antenna module 1, motherboard 81, and energy storage assembly 83. Energy storage assembly 83 can be formed from plastic, glass, ceramic, fiber composite, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or a combination of any two or more of these materials. Housing 84 can be machined or molded as a single structure or can be formed using multiple structures (e.g., an internal frame structure, one or more structures forming an external housing surface, or the like).

[0065] Figures 8A to 8D Various stages of an example of a method for manufacturing an electronic device according to some arrangements of the present invention are described.

[0066] See Figure 8A, providing a circuit structure 10'. In some arrangements, the circuit structure 10' can be flexible. The circuit structure 10' can have a surface 10's1 and a surface 10's2 opposite the surface 10's1. The electrical connector 22 can be formed on or above the surface 10's2 of the circuit structure 10'. The electrical connector 52 can be formed on or above the surface 10's2 of the circuit structure 10'.

[0067] See Figure 8B The structure including the carrier 20, the electronic component 30, and the encapsulation body 40 encapsulating the electronic component 30 can be attached to the surface 10's2 via the electrical connector 22. The carrier 20 can have a surface 20s1 and a surface 20s2 opposite to the surface 20s1. In some arrangements, the electronic component 30 and the encapsulation body 40 can be formed on the surface 20s2 of the carrier 20. In some arrangements, the connector 62 can be formed on the surface 20s1 of the carrier 20.

[0068] See Figure 8C , antenna assembly 50 can be attached to surface 10's2 via electrical connector 52. In some arrangements, a reflow process can be performed. The reflow process can be configured to activate a fluxing solvent so that the fluxing solvent can assist in attaching electrical connector 52 and electrical connector 22 to the terminals of antenna assembly 50 and carrier 20, respectively.

[0069] See Figure 8D , the circuit structure 10' can be bent to define a circuit structure 10 that can include generally L-shaped surfaces 10s1 and 10s2. The electronic component 30 and the antenna component 50 can face different sides. As a result, an electronic device (e.g., Figure 1C The electronic device 1a shown in FIG.

[0070] Figure 9A A perspective view of an electronic device 1g illustrating a comparative arrangement during testing. Carrier 20 may be disposed on surface 11s1 of extension portion 11 of circuit structure 10. Encapsulation 40, connector 62, and conductive element 64 may be disposed on surface 20s1 of carrier 20. In this scenario, the presence of the relatively thick encapsulation 40 may hinder probe 90 from approaching conductive element 64 during testing.

[0071] Figure 9B Illustrate a perspective view of an electronic device 1a during testing according to some arrangements of the present invention.Since the encapsulation body 40 and the conductive element 64 are disposed at opposite sides of the carrier 20, the probe 90 can connect to the conductive element 64 with fewer obstacles.

[0072] In some arrangements, an electronic device includes a carrier, an electronic component, a conductive element, and a flexible circuit structure. The carrier has a first surface and a second surface opposite the first surface. The electronic component is disposed above the second surface. The conductive element is disposed below the first surface of the carrier and electrically connected to the electronic component for testing. The flexible circuit structure is supported by the first surface of the carrier and connected to a first antenna.

[0073] In some arrangements, the conductive element is exposed from the first surface of the carrier.

[0074] In some arrangements, the conductive element is spaced apart from the carrier by the flexible circuit structure.

[0075] In some arrangements, the conductive element is electrically connected to the carrier via the flexible circuit structure.

[0076] In some arrangements, the conductive element does not overlap the flexible circuit structure along a first direction defined from the first surface toward the second surface of the carrier.

[0077] In some arrangements, a connector is disposed below the first surface, wherein the conductive element is disposed between the flexible circuit structure and the connector.

[0078] In some arrangements, the conductive element overlaps the flexible circuit structure along a second direction that is substantially orthogonal to the first direction.

[0079] In some arrangements, an encapsulation body is disposed over the second surface and encapsulates the electronic component, wherein the encapsulation body does not overlap the first antenna along the first direction.

[0080] In some arrangements, the encapsulation does not overlap the first antenna along a second direction that is substantially orthogonal to the first direction.

[0081] In some arrangements, the flexible circuit structure includes a first extension portion that extends generally along a first direction defined from the first surface toward the second surface of the carrier, and the first antenna is supported by the first extension portion.

[0082] In some arrangements, the flexible circuit structure includes a second extending portion extending generally along the first direction and supporting a second antenna.

[0083] In some arrangements, the first antenna is configured to operate in a first frequency band that is different from a second frequency band of the second antenna.

[0084] In some arrangements, the first extension portion is separated from the second extension portion by a curved portion.

[0085] In some arrangements, the carrier has a first length along a first direction and a second length along the first direction, the first direction being substantially orthogonal to a second direction defined by the first surface toward the second surface of the carrier and the flexible circuit structure, and the second length being less than the first length.

[0086] In some arrangements, an electronic device includes a carrier, a flexible circuit structure, and a connector. The carrier has a first surface and a second surface opposite the first surface. The flexible circuit structure is disposed below the first surface of the carrier and supports an antenna. The connector is disposed below the first surface of the carrier. The connector faces a first direction, and the flexible circuit structure faces a second direction different from the first direction.

[0087] In some arrangements, an electronic component is disposed over the second surface of the carrier, wherein the electronic component does not overlap with the antenna along a direction defined from the first surface toward the second surface.

[0088] In some arrangements, the flexible circuit structure includes a first extending portion supporting the carrier and a second extending portion supporting the antenna, and the first extending portion is substantially orthogonal to the second extending portion.

[0089] In some arrangements, the flexible circuit structure further includes a bent portion connecting the first extension portion and the second extension portion, and the first extension portion, the second extension portion, and the bent portion are formed as a unitary piece.

[0090] In some arrangements, the first extension has a first surface area that is smaller than a second surface area of the carrier.

[0091] In some arrangements, a portion of the first extension is exposed by the carrier.

[0092] In some arrangements, an encapsulation body is disposed over the second surface of the carrier, wherein a lateral surface of the encapsulation body exceeds a lateral surface of the first extension portion of the carrier.

[0093] In some arrangements, the first extension portion and the second extension portion collectively define a first generally L-shaped surface, and the encapsulation and the antenna are disposed on the first generally L-shaped surface.

[0094] In some arrangements, the first and second extension portions collectively define a second generally L-shaped surface opposite the first generally L-shaped surface, and no antenna is disposed on the second generally L-shaped surface.

[0095] In some arrangements, a test pad is disposed below the first surface of the carrier and adjacent the connector.

[0096] In some arrangements, an electromagnetic interference (EMI) shielding layer encapsulates the carrier.

[0097] In some arrangements, the EMI shielding layer further encapsulates the encapsulated body.

[0098] In some arrangements, an electronic device includes a flexible circuit structure, an electronic component, and an antenna. The flexible circuit structure has a first surface and a second surface adjacent to the first surface. The electronic component is disposed on the first surface. The antenna is disposed on the second surface.

[0099] In some arrangements, the flexible circuit structure further includes a third surface opposite the first surface.The electronic device includes a connector, wherein the connector is closer to the third surface than the electronic component.

[0100] In some arrangements, the encapsulation body encapsulates the electronic component and overlaps the connector along a direction substantially normal to the first surface of the flexible circuit structure.

[0101] In some arrangements, a carrier is disposed between the electronic component and the flexible circuit structure, and the connector is attached to the carrier.

[0102] Unless otherwise specified, spatial descriptions such as "above," "below," "up," "left," "right," "lower," "top," "bottom," "vertical," "horizontal," "side," "above," "below," "upper," "above," "below," etc., are indicated relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and that embodiments of the structures described herein may be spatially arranged in any orientation or manner, provided that the advantages of the embodiments of the present disclosure are not deviated by such arrangements.

[0103] As used herein, the terms "approximately," "substantially," "approximately," and "about" are used to describe and explain minor variations. When used in conjunction with an event or circumstance, these terms can refer to instances where the event or circumstance occurred exactly as well as instances where the event or circumstance occurred very approximately. For example, when used in conjunction with a numerical value, these terms can refer to a range of variation of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first numerical value is within a range of less than or equal to ±10% of a second numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first numerical value can be considered "substantially" the same as or equal to the second numerical value. For example, "substantially" vertical can refer to an angular variation range of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0104] Two surfaces are considered coplanar or substantially coplanar if the displacement between them is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm. A surface is considered substantially flat if the displacement between the highest point and the lowest point on the surface is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm.

[0105] As used herein, the singular forms "a," "an," and "the" may include plural or plural referents unless the context clearly dictates otherwise.

[0106] As used herein, the terms "conductive," "electrically conductive," and "conductivity" refer to the ability to carry an electric current. Conductive materials are materials that present little or no resistance to the flow of electric current. One unit of measurement for conductivity is Siemens per meter (S / m). Typically, a conductive material has a conductivity greater than about 10 4 S / m, for example at least 10 5 S / m or at least 10 6 S / m of a material. The electrical conductivity of a material sometimes varies with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.

[0107] In addition, amounts, ratios, and other numerical values are sometimes presented herein in a range format. It should be understood that such range format is used for convenience and brevity and should be construed flexibly to include not only the values explicitly specified as the limits of the range, but also all individual values or sub-ranges encompassed within the range, as if each value and sub-range were explicitly specified.

[0108] Although the present disclosure has been described and illustrated with reference to specific embodiments of the present disclosure, these descriptions and illustrations are not restrictive. Those skilled in the art will understand that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the process reproduction in the present disclosure and the actual equipment. There may be other embodiments that are not specifically described in the present disclosure. The description and drawings should be regarded as illustrative and not restrictive. Modifications may be made to make specific circumstances, materials, compositions of matter, methods or processes suitable for the objectives, spirit and scope of the present disclosure. All such modifications are deemed to be included within the scope of the appended claims. Although the disclosed methods have been described herein with reference to specific operations performed in a specific order, it should be understood that these operations may be combined, subdivided or reordered to form equivalent methods without departing from the teachings of the present disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the present disclosure.

Claims

1. An electronic device comprising: a carrier having a first surface and a second surface opposite to the first surface; an electronic component adjacent to the second surface; a first antenna connected to the carrier; and A conductive element is adjacent to the first surface of the carrier and is configured to test the first antenna. 2 . The electronic device of claim 1 , further comprising a flexible circuit structure connecting the first antenna to the carrier and electrically connected to the conductive element. The electronic device of claim 2 , wherein the conductive element is spaced apart from the flexible circuit structure. The electronic device of claim 2 , wherein the conductive element is electrically connected to the carrier via the flexible circuit structure.

5. The electronic device according to claim 1, further comprising: A connector is adjacent to the conductive element, wherein an electrical transmission path between the connector and the electronic component is substantially the same as an electrical transmission path between the conductive element and the electronic component. 6 . The electronic device according to claim 2 , wherein a portion of the carrier is exposed by the flexible circuit structure, and the conductive element covers the portion.

7. The electronic device according to claim 1, further comprising: An encapsulation body is adjacent to the second surface and encapsulates the electronic component, wherein the encapsulation body does not overlap with the first antenna along a direction substantially orthogonal to the second surface.

8. The electronic device according to claim 2, wherein the flexible circuit structure includes a first portion above the first surface and a second portion connected to the first portion and extending in a direction substantially orthogonal to the first surface, and wherein the first antenna is disposed above the second portion and is configured to transmit electromagnetic waves in a direction substantially parallel to the first surface of the carrier. 9 . The electronic device of claim 8 , wherein the second portion does not overlap with the carrier along the direction substantially parallel to the first surface of the carrier. 10 . The electronic device of claim 8 , wherein the flexible circuit structure comprises a first bent portion connecting the first portion to the second portion, and the first bent portion allows the second portion to extend further away from the carrier.

11. The electronic device according to claim 10 , wherein the flexible circuit structure comprises a third portion and a second bent portion connecting the first portion and the third portion, the second bent portion allowing the third portion to extend further away from the carrier, and the electronic device further comprises: A second antenna is disposed on the third portion and is configured to transmit electromagnetic waves along the direction substantially parallel to the first surface of the carrier.

12. An electronic device comprising: carrier; a flexible circuit structure disposed above the carrier; a first antenna connected to the flexible circuit structure; and A connector is disposed over the carrier and electrically connected to the first antenna by the flexible circuit structure, wherein the connector is configured to connect an external device to the carrier.

13. The electronic device according to claim 12, further comprising: An electronic component is disposed below the carrier, wherein the electronic component does not overlap the first antenna along a direction generally normal to a surface of the carrier supporting the connector.

14. The electronic device according to claim 12, further comprising: an electronic component disposed below the carrier; and a second antenna connected to the flexible circuit structure, wherein the first antenna and the second antenna are configured to transmit electromagnetic waves along different directions, and the electronic component does not overlap with the first antenna and the second antenna along a direction substantially parallel to a surface of the carrier supporting the connector.

15. The electronic device of claim 12, wherein the connector is disposed within a space defined by the flexible circuit structure and the carrier. The electronic device of claim 12 , wherein a width of the flexible circuit structure is smaller than a width of the carrier.

17. The electronic device of claim 12, wherein the connector is electrically connected to the first antenna by the carrier.

18. An electronic device comprising: carrier; an electronic component disposed below the carrier; a connector disposed over the carrier and configured to connect the carrier to an external device; and A flexible circuit layer connects the antenna to the carrier and is spaced apart from the connector. 19 . The electronic device according to claim 18 , wherein the electronic component is configured to face a printed circuit board, and a heat dissipation path is provided between the electronic component and the printed circuit board. 20 . The electronic device of claim 19 , wherein the antenna protrudes from a lateral surface of the printed circuit board and is configured to emit electromagnetic waves in a direction substantially perpendicular to the lateral surface of the printed circuit board.

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