Connector

Abstract

The invention belongs to the technical field of connectors, and discloses a connector which comprises a back plate, a circuit board, a fixing support and a cooling fan, a convex hull is arranged on the back plate in a protruding mode in the third direction, the circuit board is arranged on the back plate in the third direction, the convex hull is attached to the circuit board, the fixing support is arranged on the circuit board in the third direction, and the cooling fan is arranged on the fixing support. The chip is placed in the fixing support, and the heat dissipation fan is arranged on the fixing support in the third direction and used for being connected with the chip in a pressing mode and conducting ventilation and heat dissipation on the chip. The circuit board is pre-pressed and jacked up through the convex hulls, when the cooling fan is finally locked on the fixing support, the convex hulls on the back plate and the circuit board are in contact preferentially to be stressed, the jacked back plate and the circuit board deform along with increase of locking force, the circuit board can be flatly placed, and the service life of the cooling fan is prolonged. Stable contact connection of terminals in the connector is ensured, and the signal transmission performance is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of connectors, and in particular to a connector. Background Art

[0002] With the increasing number of CPU sockets (central processing unit sockets, used to connect the CPU to the motherboard) and the majority of servers using over 5,000 CPU sockets, the corresponding CPUs are also getting larger, requiring greater downward force during installation. Traditional CPU socket connector structures often require a cooling fan and hardware fasteners to provide downward force, ensuring that the internal terminals are compressed, maintaining a stable connection between the circuit board and the CPU and achieving continuity.

[0003] When the number of CPU sockets is small, the required downward force is lower, and the corresponding hardware fastener is subjected to less force and deformation, which also ensures the flatness of the CPU socket and the circuit board, improving the contact between the CPU and the wire terminals and enhancing signal transmission performance. When the number of CPU sockets is large, the required downward force is greater, and the fastener will deform and warp in a smiley face shape due to the force. This will create a gap in the central connection area, resulting in poor contact between the chip module and the conductive terminals in the electrical connector, and preventing the connection function.

[0004] There are two existing methods for compensating for warpage. One is to increase the overall thickness of the backplate to improve the rigidity of the overall structure, enhance its resistance to bending and torsion, and reduce deformation under stress. However, this thickening of the backplate takes up more space and increases its weight, which is contrary to the current trend of lightweight and thin equipment. The other method is to process the backplate into an arched shape to compensate for the warpage through reverse warping. However, this method is difficult to control and detect the effect of the arched structure, and is prone to insufficient or excessive warpage compensation, which can lead to abnormal connections. Therefore, how to provide accurate compensation for buckle deformation and solve the problem of unstable terminal contact due to large deformation of hardware buckles under stress is a problem that researchers in this field need to solve. Summary of the Invention

[0005] The object of the present invention is to provide a connector to provide accurate compensation for the deformation of the fastener, thereby solving the problem of unstable terminal contact connection caused by large deformation of the hardware fastener under force.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] Connectors, including:

[0008] a back plate, the back plate being provided with a convex bump along a third direction;

[0009] a circuit board, the circuit board being arranged on the back plate along the third direction, and the convex bump being in contact with the circuit board;

[0010] a fixing bracket, the fixing bracket being arranged on the circuit board along the third direction, and the chip being placed in the fixing bracket;

[0011] A heat dissipation fan is arranged on the fixing bracket along the third direction and is used for pressing the chip and ventilating and dissipating the heat of the chip.

[0012] Optionally, the back plate has at least a pre-stressed state and a locked state. In the pre-stressed state, the bulge abuts against and pushes the circuit board upward along the third direction, and the circuit board is curved and concave upward toward one side of the bulge; in the locked state, the circuit board abuts against and presses the bulge downward along the third direction, and the circuit board is horizontal, and the back plate is curved and concave downward toward one side of the circuit board.

[0013] Optionally, the device further includes a first fastening assembly and a second fastening assembly, both of which are sequentially arranged along the third direction through the back plate, the circuit board, the fixing bracket, and the cooling fan, and the first fastening assembly is located in the middle of the connector along the first direction, and the second fastening assembly is arranged on both sides of the first fastening assembly along the first direction;

[0014] After the second fastening assembly is locked in the pre-compression state, the first fastening assembly is locked in the locked state.

[0015] Optionally, two groups of the first fastening components are provided along the second direction, and four groups of the second fastening components are provided and are respectively located at the four top corners of the fixing bracket.

[0016] Optionally, the convex portion is located in the middle of the back plate and is arranged corresponding to the middle of the circuit board.

[0017] Optionally, the convex bulge is formed by stamping along the third direction.

[0018] Optionally, the fixed bracket includes a bracket bottom plate and a bracket top plate, one end of the bracket top plate is rotatably connected to the bracket bottom plate, the bracket bottom plate is arranged on the circuit board along the third direction, and the chip is clamped between the bracket top plate and the bracket bottom plate.

[0019] Optionally, a clamping plate is further included, in which the chip is confined, and the clamping plate is clamped between the bottom plate of the bracket and the top plate of the bracket.

[0020] Optionally, the bracket bottom plate, the bracket top plate and the clamping plate are respectively penetrated by a first accommodating hole, a second accommodating hole and a third accommodating hole along the third direction, and the first accommodating hole, the second accommodating hole and the third accommodating hole are interconnected and surrounded by the top surface of the circuit board to form an accommodating space for placing the chip.

[0021] Optionally, the heat dissipation fan includes a base and a fan, the base is pressed onto the fixing bracket along the third direction, and the fan is fixed on the base.

[0022] Beneficial effects of the present invention:

[0023] In the present invention, a convex hump is provided on the back plate, and the convex hump is arranged against the circuit board, so that when the back plate and the circuit board, the fixing bracket and the cooling fan are installed, the circuit board can be pre-pressed and lifted up by the convex hump, and when the cooling fan is finally locked on the fixing bracket, the convex hump on the back plate and the circuit board are preferentially contacted and subjected to force. As the locking force increases, the lifted back plate and the circuit board are deformed, and the circuit board can be placed flat. The four sides of the back plate are consistent in height with the convex hump, and are deformed into a smiley face-shaped bending state under force to achieve warping compensation. At the same time, the position, size, shape and number of layers of the convex hump can be set, thereby ensuring stable contact connection of the internal terminals of the connector and improving the performance of signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a first isometric view of the connector according to an embodiment of the present invention;

[0025] Figure 2 is a second isometric view of the connector according to an embodiment of the present invention;

[0026] Figure 3 is an exploded schematic diagram of a connector according to an embodiment of the present invention;

[0027] Figure 4 1 is a schematic structural diagram of a backplane in a connector according to an embodiment of the present invention;

[0028] Figure 5 is a front view schematic diagram of a back plate in a connector according to an embodiment of the present invention;

[0029] Figure 6 yes Figure 5 A partial enlarged schematic diagram in the middle;

[0030] Figure 7 This is a schematic structural diagram of the connector after the back plate, circuit board, fixing bracket and clamping plate are connected according to an embodiment of the present invention;

[0031] Figure 8This is a schematic structural diagram of the connector according to an embodiment of the present invention, wherein the back plate, circuit board, fixing bracket and clamping plate are placed on the chip;

[0032] Figure 9 1 is a schematic structural diagram of a bracket base plate of a fixed bracket in a connector according to an embodiment of the present invention;

[0033] Figure 10 1 is a schematic structural diagram of a bracket top plate of a fixed bracket in a connector according to an embodiment of the present invention;

[0034] Figure 11 1 is a schematic structural diagram of a clamping plate in a connector according to an embodiment of the present invention;

[0035] Figure 12 This is a schematic structural diagram of a connector according to an embodiment of the present invention after a chip is placed in the clamping plate;

[0036] Figure 13 is a schematic structural diagram of the connector according to an embodiment of the present invention excluding the heat dissipation fan;

[0037] Figure 14 This is a schematic structural diagram of the connector according to an embodiment of the present invention, excluding the cooling fan and having a transparent base;

[0038] Figure 15 is a schematic diagram of a back plate in a pre-pressed state in a connector according to an embodiment of the present invention;

[0039] Figure 16 2 is a schematic diagram of a connector according to an embodiment of the present invention, wherein the back plate is in a locked state.

[0040] In the picture:

[0041] 10-backplane; 20-circuit board; 30-fixing bracket; 40-clamping plate; 50-chip; 60-base; 70-fan; 11-convex bump; 101-first fastening component; 102-second fastening component; 501-accommodation space;

[0042] 31- bracket bottom plate; 311- first accommodating hole; 312- rotating assembly; 313- first hole; 314- enclosure;

[0043] 32 - bracket top plate; 321 - second accommodating hole; 322 - rotating portion; 323 - first avoidance opening; 324 - second avoidance opening; 325 - groove; 326 - avoidance groove; 327 - fixing member;

[0044] 401-third accommodating hole; 402-third avoidance opening; 403-third hole; 404-fourth hole; 41-limiting block; 601-fifth hole; 602-sixth hole; 602-heat dissipation hole. DETAILED DESCRIPTION

[0045] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar components or components having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, but are not to be construed as limiting the present invention.

[0046] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed or detachable connections, mechanical or electrical connections, direct or indirect connections through an intermediate medium, and internal communication between two elements or interaction between two elements. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0047] In the description of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first feature being in direct contact with the second feature, or may include the first feature being in contact with the second feature through another feature between them instead of being in direct contact. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0048] The technical solution of this embodiment will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0049] like Figures 1-16 As shown, this embodiment provides a connector including a backplane 10, a circuit board 20, a fixing bracket 30 and a cooling fan. The backplane 10 is provided with a bulge 11 along the third direction. The circuit board 20 is arranged on the backplane 10 along the third direction, and the bulge 11 is abutted against the circuit board 20. The fixing bracket 30 is arranged on the circuit board 20 along the third direction. The chip 50 is placed in the fixing bracket 30. The cooling fan is arranged on the fixing bracket 30 along the third direction for crimping the chip 50 and ventilating and cooling the chip 50.

[0050] Specifically, in this embodiment, a convex 11 is provided on the back plate 10, and the convex 11 is provided against the circuit board 20, so that when the back plate 10 and the circuit board 20, the fixing bracket 30 and the cooling fan are installed, the circuit board 20 can be pre-pressed and lifted by the convex 11, and when the cooling fan is finally locked on the fixing bracket 30, the convex 11 on the back plate 10 and the circuit board 20 are preferentially contacted and subjected to force. As the locking force increases, the lifted back plate 10 and the circuit board 20 are deformed, and the circuit board 20 can be placed flat. The four sides of the back plate 10 are consistent in height with the convex 11, and are deformed into a smiley face-shaped bending state under force to achieve warping compensation. At the same time, the position, size, shape and number of layers of the convex 11 can be set, thereby ensuring stable contact connection of the internal terminals of the connector and improving the performance of signal transmission.

[0051] The specific structure of the connector in this embodiment is described below.

[0052] like Figure 1-Figure 3 As shown, in this embodiment, the connector includes a back plate 10, a circuit board 20, a fixed bracket 30, a clamping plate 40 and a cooling fan, and the cooling fan includes a base 60 and a fan 70. Optionally, the length direction of the connector is set to a first direction, the width direction is set to a second direction, and the height direction is set to a third direction, and the first direction, the second direction and the third direction are perpendicular to each other. Specifically, along the third direction, the connector is sequentially provided with a back plate 10, a circuit board 20, a fixed bracket 30, a base 60 and a fan 70 from bottom to top, and the chip 50 is limited in the clamping plate 40, and the clamping plate 40 is limited and placed in the fixed bracket 30, so as to ensure the stable placement of the chip 50. Furthermore, the cooling fan is fixed on the fixed bracket 30, and is used for crimping the chip 50 and ventilating and cooling the chip 50 to ensure the stability of the circuit.

[0053] like Figure 4-Figure 6 As shown, in this embodiment, a convex bump 11 is provided on the back plate 10 along the third direction. Optionally, the convex bump 11 is arranged close to the circuit board 20 to compensate for the warping of the circuit board 20 during the subsequent installation process and ensure the stable connection of the chip 50. Figure 15 and Figure 16As shown, specifically, in this embodiment, the back plate 10 has at least a pre-stressed state and a locked state. In the pre-stressed state, the protrusion 11 abuts against and lifts the circuit board 20 upward along the third direction. At this time, the circuit board 20 is bent under the restraint of the fixing bracket 30 and is recessed upward toward one side of the protrusion 11. This creates a "crying face" shape before the cooling fan is installed. Furthermore, in the locked state, the circuit board 20 abuts against and presses the protrusion 11 downward along the third direction. At this time, the circuit board 20 is horizontal, and the back plate 10 is curved and recessed downward toward one side of the circuit board 20. Therefore, after the cooling fan is installed, the circuit board 20 changes from a "crying face" shape to a horizontal position under the pressure of the cooling fan, ensuring a stable connection between the circuit board 20 and the chip 50. Furthermore, under the pressing effect of the cooling fan, the circuit board 20 presses the bump 11 downward along the third direction, causing the back panel 10 to bend in a "smiley face shape". At the same time, an upward reaction force is applied to the circuit board 20 to compensate for its reverse warping, thereby avoiding deformation of the circuit board 20, thereby improving the tightness of the fit between the circuit board 20 and the chip 50 and avoiding abnormal connections.

[0054] like Figure 5 and Figure 6 As shown, in this embodiment, the convex hump 11 is located in the middle of the back plate 10 and is arranged corresponding to the middle of the circuit board 20 to ensure optimal interaction between the circuit board 20 and the convex hump 11, and the convex hump 11 has the best warping compensation effect on the circuit board 20. Furthermore, the convex hump 11 is formed by stamping along a third direction, so that the size, shape, and number of layers of the convex hump 11 can be precisely controlled to ensure its mechanical strength. Furthermore, the height between the upper top surface of the convex hump 11 and the upper plane of the back plate 10 along the third direction is set to h. By controlling the stamping parameters and force, the value of h can be adjusted, thereby changing the height of the convex hump 11 to adjust the warping compensation of the circuit board 20 to different degrees. The specific setting method and the specific value of h can be formulated according to actual needs and will not be described in detail here.

[0055] Combine 4 and Figure 15 、 Figure 16As shown, the connector in this embodiment is equipped with a first fastening assembly 101 and a second fastening assembly 102, both of which penetrate the backplane 10, circuit board 20, fixing bracket 30, and cooling fan base 60 in sequence along the third direction to ensure the overall stability of the connector. Specifically, in this embodiment, the first fastening assembly 101 is located in the middle of the connector along the first direction, and the second fastening assemblies 102 are arranged on both sides of the first fastening assembly 101 along the first direction to improve connection stability. Illustratively, in this embodiment, when the back plate 10 is in a pre-stressed state, only the second fastening component 102 is locked, and at this time the back plate 10 is pre-connected with the circuit board 20 and the fixing bracket 30, and then in the locked state, the first fastening component 101 is locked, thereby ensuring that the base 60 can be fixed on the circuit board 20, and in the locked state, the locking force of the second fastening component 102 is greater than the locking force of the first fastening component 101, and by gradually tightening the first fastening component 101, the downward loading force in the middle of the circuit board 20 along the third direction becomes larger and larger, until the circuit board 20 is adjusted from a "crying face shape" to a horizontal shape, and the locking of the first fastening component 101 is stopped, thereby achieving stable contact between the circuit board 20 and the chip 50.

[0056] Combine Figure 7 and Figure 8 As shown, illustratively, in this embodiment, two groups of first fastening components 101 are provided along the second direction, and four groups of second fastening components 102 are provided, and are respectively located at the four top corners of the fixing bracket 30, so that the two groups of first fastening components 101 are located in the middle position of the four groups of second fastening components 102 along the first direction, thereby ensuring a stable connection between the various components of the connector. Optionally, both the first fastening components 101 and the second fastening groups 102 are configured as a combination structure of nuts and studs. Specifically, two first connection holes are provided on the back plate 10 at a middle position along the second direction, and second connection holes are provided at its four top corners. Specifically, the first fastening component 101 is passed through the first connection hole, and the second fastening component 102 is passed through the second connection hole, thereby ensuring the stable installation of the two on the back plate 10.

[0057] like Figure 7-10As shown, in this embodiment, the fixed bracket 30 includes a bracket bottom plate 31 and a bracket top plate 32, and the bracket bottom plate 31 is provided with a first accommodating hole 311, a rotating assembly 312, a first hole 313, a second hole and a barrier 314, and the bracket top plate 32 is provided with a second accommodating hole 321, a rotating portion 322, a first avoidance opening 323, a second avoidance opening 324, a groove 325, an avoidance groove 326 and a fixing member 327. Optionally, a rotating portion 322 is provided at one end of the bracket top plate 32, and the rotating portion 322 is rotatably connected to the rotating assembly 312 of the bracket bottom plate 31, thereby being able to rotate the bracket top plate 32 to facilitate the removal and placement of the chip 50. Exemplarily, the rotating component 312 is provided with at least a fixed seat and a torsion spring rotatably arranged on the fixed seat. A rotating hole is opened on the rotating part 322, and the protruding end of the torsion spring is passed through the rotating hole, thereby realizing relative rotation between the bracket bottom plate 31 and the bracket top plate 32, and ensuring that the bracket top plate 32 is fixed when rotated to a certain position, and restores its original state of covering the bracket bottom plate 31 by rotation, so that the operator can install the chip 50.

[0058] like Figure 8 and Figure 9 As shown, specifically, the bracket base plate 31 is arranged on the circuit board 20 along the third direction, and the chip 50 is sandwiched between the bracket top plate 32 and the bracket base plate 31 to ensure stable installation of the chip 50. Specifically, the bracket base plate 31 is provided with a first accommodating hole 311 along the third direction to facilitate the placement of the chip 50. Furthermore, the bracket base plate 31 is provided with two first holes 313 spaced apart along the second direction in the middle position, and second holes are provided at its four corners. Specifically, the first fastening component 101 is provided through the first hole 313, and the second fastening component 102 is provided through the second hole to ensure stable installation of the fixed bracket 30. Exemplarily, a fence 314 extends upward along the third direction around the bracket base plate 31, and the fence 314 is provided around the outside of the bracket top plate 32. The fence 314 protects the bracket top plate 32 circumferentially and limits its position, ensuring that the chip 50 does not escape between the two and is not easily affected by the external environment.

[0059] like Figure 10As shown, the bracket top plate 32 is provided with a second accommodating hole 321 along the third direction to facilitate the placement of the chip 50. Meanwhile, a rotating portion 322 and a fixing member 327 are respectively provided on both sides of the bracket top plate 32 along the first direction. The rotating portion 322 can rotate the bracket top plate 32 relative to the bracket bottom plate 31, and the fixing member 327 can fix the bracket top plate 32 to the bracket bottom plate 31 to ensure the stability of the fixed bracket 30. Furthermore, a first avoidance opening 323 is provided along the second direction on the outer side of the middle position of the bracket top plate 32 to avoid the first fastening assembly 101. This allows the first fastening assembly 101 to pass through the bracket bottom plate 31 and connect to the base 60 without interfering with the bracket top plate 32. Similarly, second avoidance openings 324 are provided at the four top corners of the bracket top plate 32 to avoid the second fastening component 102, so that the second fastening component 102 can be connected to the base 60 after passing through the bracket bottom plate 31 without interfering with the bracket top plate 32.

[0060] Furthermore, the bracket top plate 32 is provided with grooves 325 on opposite sides of the second receiving hole 321 along the first direction, and with escape grooves 326 on opposite sides along the second direction. Exemplarily, two groups of grooves 325 are provided, each group having two grooves 325, and the two groups of grooves 325 are respectively disposed on either side of the second receiving hole 321 in the bracket top plate 32. Furthermore, the notches of the grooves 325 are disposed upward, and the first escape opening 323 is located between the two grooves 325 in each group. Accordingly, the escape groove 326 is provided through the second receiving hole 321 and is recessed inwardly. Specifically, when the chip 50 is placed in the second receiving hole 321, the top surface of the chip 50 is higher than the bottom of the grooves 325, and there is a gap between the side surfaces of the chip 50 and the bottom of the escape grooves 326. This facilitates operator adjustment and placement of the chip 50 through the four grooves 325 and two escape grooves 326.

[0061] Combine Figure 7-Figure 8 and Figure 11-12 As shown, in this embodiment, the clamping plate 40 is provided with a third accommodating hole 401, a third avoidance opening 402, a third hole 403, a fourth hole 404 and a limit block 41. Optionally, the clamping plate 40 is clamped between the bracket bottom plate 31 and the bracket top plate 32, and the chip 50 is limited in the clamping plate 40, so that under the action of the clamping plate 40 and the fixed bracket 30, the stable installation of the chip 50 can be ensured. Optionally, the clamping plate 40 is provided with a third accommodating hole 401 along the third direction, and the first accommodating hole 311, the second accommodating hole 321 and the third accommodating hole 401 are interconnected and enclosed with the top surface of the circuit board 20 to form an accommodating space 501 for placing the chip 50.

[0062] like Figure 11As shown, the clamping plate 40 is provided with two third holes 403 spaced apart in the middle along the second direction, and a fourth hole 404 is provided at each of its four corners. The third hole 403 is provided corresponding to the first hole 313, and the fourth hole 404 is provided corresponding to the second hole. Specifically, the first fastening component 101 is provided through the first hole 313, and then the third hole 403 is provided, and then the first avoidance opening 323 is provided. The second fastening component 102 is provided through the second hole, and then the fourth hole 404 is provided, and then the second avoidance opening 324 is provided, thereby achieving stable installation of the fixed bracket 30 and the clamping plate 40. Furthermore, the clamping plate 40 is provided with a third avoidance opening 402 to avoid the rotating component 312 and avoid interference with the rotation of the rotating part 322.

[0063] Combine Figure 11 and Figure 12 As shown, a plurality of limiting blocks 41 are provided on the inner circumference of the third receiving hole 401 for placing and limiting the chip 50. For example, the limiting blocks 41 extend along the third direction toward the bracket base plate 31, and are provided with a horizontal step surface on the limiting blocks 41. The horizontal step surface is lower than the upper top surface of the clamping plate 40, and the lower bottom surface of the chip 50 abuts against the horizontal step surface, and the side surface of the chip 50 abuts against the inner side surface of the limiting blocks 41, thereby achieving the limited fixation of the chip 50 in the clamping plate 40. Optionally, limiting blocks 41 are provided on the outside of the four side surfaces of the chip 50 to achieve effective limiting and improve installation stability.

[0064] like Figure 13 and Figure 14 As shown, in this embodiment, the cooling fan includes a base 60 and a fan 70, and the base 60 is pressed onto the fixing bracket 30 along the third direction to ensure stable pressing of the chip 50, and the fan 70 is fixed to the base 60 to ventilate and dissipate heat for the chip 50. Specifically, a fifth hole 601, a sixth hole 602, and a heat dissipation hole 602 are provided on the base 60. Optionally, two fifth holes 601 are provided at intervals along the second direction in the middle position of the base 60, and a sixth hole 602 is provided at each of its four top corners, and the fifth hole 601, the third hole 403, the first hole 313, and the first connecting hole are provided in a corresponding manner, and the sixth hole 602, the fourth hole 404, the second hole, and the second connecting hole are provided in a corresponding manner. Specifically, the first fastening assembly 101 is inserted through the first connection hole and the first hole 313, followed by the third hole 403, and then the first avoidance opening 323 is inserted to secure the assembly at the fifth hole 601. The second fastening assembly 102 is inserted through the second connection hole and the second hole, followed by the fourth hole 404, and then the second avoidance opening 324 is inserted to secure the assembly at the sixth hole 602, thereby achieving stable installation between the back plate 10, the circuit board 20, the fixing bracket 30, the clamping plate 40, and the base 60. For example, a plurality of heat dissipation holes 602 are provided along the third direction on the base 60. In this embodiment, the heat dissipation holes 602 are configured as elongated square holes to improve heat dissipation.

[0065] Therefore, in this embodiment, the connector adds an upwardly protruding bump 11 to the back plate 10, and the height and shape of the bump 11 can be set as needed, so that it is suitable for different forces to achieve different deformation state transitions. For example, in this embodiment, the edge of the bump 11 is smoothly connected to the back plate 10. Therefore, when the back plate 10 and the fixing bracket 30 are installed, the circuit board 20 can be pre-pressed and lifted into a "crying face shape". When the cooling fan is finally locked, the circuit board 20 is subjected to a large downward loading force, causing the entire component to deform into a "smiling face shape". According to specific precise calculations, the smiling face deformation and the pre-pressed crying face deformation can compensate for each other, thereby achieving stable planar contact, ensuring stable contact connection of the connector, and improving signal transmission performance.

[0066] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A connector, characterized in that include: A back plate (10), wherein the back plate (10) is provided with a convex bump (11) along a third direction; a circuit board (20), the circuit board (20) being arranged on the backboard (10) along the third direction, and the convex bump (11) being in contact with the circuit board (20); a fixing bracket (30), the fixing bracket (30) being arranged on the circuit board (20) along the third direction, and the chip (50) being placed in the fixing bracket (30); A cooling fan is provided on the fixing bracket (30) along the third direction and is used for pressing the chip (50) and ventilating and cooling the chip (50).

2. The connector according to claim 1, wherein: The back plate (10) has at least a pre-pressed state and a locked state. In the pre-pressed state, the convex bump (11) abuts against and pushes up the circuit board (20) along the third direction, and the circuit board (20) is curved and concave upward toward one side of the convex bump (11); in the locked state, the circuit board (20) abuts against and presses the convex bump (11) downward along the third direction, and the circuit board (20) is horizontal, and the back plate (10) is curved and concave downward toward one side of the circuit board (20).

3. The connector according to claim 2, wherein: The invention also includes a first fastening assembly (101) and a second fastening assembly (102), both of which are sequentially arranged along the third direction through the back plate (10), the circuit board (20), the fixing bracket (30) and the cooling fan, and the first fastening assembly (101) is located in the middle of the connector along the first direction, and the second fastening assembly (102) is arranged on both sides of the first fastening assembly (101) along the first direction; After the second fastening component (102) is locked in the pre-compression state, the first fastening component (101) is locked in the locked state.

4. The connector according to claim 3, wherein: Two groups of the first fastening components (101) are provided along the second direction, and four groups of the second fastening components (102) are provided and are respectively located at the four top corners of the fixing bracket (30).

5. The connector according to claim 1, wherein: The convex bump (11) is located in the middle of the back plate (10) and is arranged corresponding to the middle of the circuit board (20).

6. The connector according to claim 1, wherein: The convex bump (11) is formed by stamping along the third direction.

7. The connector according to claim 1, wherein: The fixed bracket (30) comprises a bracket bottom plate (31) and a bracket top plate (32), one end of the bracket top plate (32) is rotatably connected to the bracket bottom plate (31), the bracket bottom plate (31) is arranged on the circuit board (20) along the third direction, and the chip (50) is clamped between the bracket top plate (32) and the bracket bottom plate (31).

8. The connector according to claim 7, wherein: It also includes a clamping plate (40), the chip (50) is limited in the clamping plate (40), and the clamping plate (40) is clamped between the bracket bottom plate (31) and the bracket top plate (32).

9. The connector according to claim 8, wherein: The bracket bottom plate (31), the bracket top plate (32) and the clamping plate (40) are respectively provided with a first accommodating hole (311), a second accommodating hole (321) and a third accommodating hole (401) along the third direction; the first accommodating hole (311), the second accommodating hole (321) and the third accommodating hole (401) are interconnected and enclosed with the top surface of the circuit board (20) to form an accommodating space (501) for placing the chip (50).

10. The connector according to claim 1, wherein: The heat dissipation fan comprises a base (60) and a fan (70), wherein the base (60) is pressed onto the fixing bracket (30) along the third direction, and the fan (70) is fixed on the base (60).

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