Laser module and manufacturing method thereof

Abstract

The invention relates to a laser module and a manufacturing method thereof.The manufacturing method of the laser module comprises the steps that a light source layer is prepared, the light source layer comprises a plurality of light-emitting areas, the light-emitting areas are arranged at intervals, and a to-be-cut area is arranged between every two adjacent light-emitting areas; a supporting layer is prepared on the light source layer, an optical element layer is arranged on the side, away from the light source layer, of the supporting layer, and the supporting layer is arranged to penetrate through at least part of light emitted by the light-emitting area; the optical element layer comprises a plurality of optical element areas, the optical element areas are in one-to-one correspondence with the light-emitting areas, and at least parts of the supporting layer and the optical element layer are opposite to the area to be cut. And the optical element layer, the supporting layer and the light source layer are cut in the thickness direction of the light source layer and along the to-be-cut area so as to separate the adjacent light-emitting areas, and the part where each light-emitting area is located correspondingly forms a laser module. A plurality of laser modules can be manufactured at the same time, the manufacturing process is simplified, the production efficiency is greatly improved, and the productivity is improved.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and in particular to a laser module and a manufacturing method thereof. Background Art

[0002] Vertical-cavity surface-emitting lasers (VCSELs) are semiconductor lasers that emit laser light perpendicular to the chip surface. They offer advantages such as low cost, wafer-level testability, and excellent thermal stability. VCSELs are playing an increasingly important role in 3D ranging, positioning, and display.

[0003] The manufacturing process of the laser module using VCSEL in the related art is usually complicated and has low production efficiency. Summary of the Invention

[0004] Based on this, a laser module and a manufacturing method thereof are provided, which are used to manufacture the laser module, and the manufacturing process is simple and has high production efficiency.

[0005] According to one aspect of the present application, a method for manufacturing a laser module is provided, the method comprising:

[0006] Prepare a light source layer, wherein the light source layer includes a plurality of light-emitting areas, the plurality of light-emitting areas are arranged at intervals, and an area to be cut is provided between two adjacent light-emitting areas;

[0007] A support layer is prepared on the light source layer, and an optical element layer is disposed on a side of the support layer facing away from the light source layer; the support layer is configured to transmit at least a portion of the light emitted by the light-emitting area; the optical element layer includes a plurality of optical element areas, each of the optical element areas corresponds to each of the light-emitting areas, and at least a portion of the support layer and the optical element layer is opposite to the area to be cut;

[0008] The optical element layer, the support layer and the light source layer are cut along the thickness direction of the light source layer and along the area to be cut to separate the adjacent light emitting areas, and each portion where the light emitting area is located forms a corresponding laser module.

[0009] In one embodiment, the step of preparing the light source layer includes:

[0010] Provide a base layer;

[0011] Arranging a plurality of light-emitting units on the base layer to form a light-emitting layer, wherein the light-emitting layer has a plurality of light-emitting areas, the light-emitting units are located in the light-emitting areas, and the light-emitting units in the same light-emitting area are spaced apart from each other;

[0012] Disposing a first electrode layer on a side of the base layer away from the light-emitting layer;

[0013] A second electrode layer is arranged on the side of the light-emitting layer away from the base layer to form the light source layer. A plurality of light-emitting holes are provided on the second electrode layer. The plurality of light-emitting holes correspond one-to-one to the plurality of light-emitting units. The first electrode layer and the second electrode layer are arranged to provide the light-emitting units with an electric field along the thickness direction of the base layer. The light-emitting units are arranged to emit light toward the light-emitting holes under the drive of the electric field.

[0014] In one embodiment, the step of preparing a support layer on the light source layer and disposing an optical element layer on a side of the support layer facing away from the light source layer comprises:

[0015] providing a structural layer;

[0016] A plurality of light openings are provided on the structural layer along the thickness direction of the structural layer to form the supporting layer;

[0017] A first adhesive layer is provided on one of the light source layer and the support layer, the support layer is provided on the light source layer, and the support layer is adhered to the light source layer through the first adhesive layer, the plurality of light openings correspond one-to-one to the plurality of light-emitting areas, and the light-emitting area has at least one light-emitting hole;

[0018] preparing the optical element layer;

[0019] A second adhesive layer is provided on one of the support layer and the optical element layer, and the optical element layer is bonded to the support layer through the second adhesive layer.

[0020] In one embodiment, the step of preparing a support layer on the light source layer and disposing an optical element layer on a side of the support layer facing away from the light source layer comprises:

[0021] A formable adhesive layer is provided on the light source layer, wherein the formable adhesive layer is made of a transparent material;

[0022] preparing the optical element layer on the formable adhesive layer;

[0023] The formable adhesive layer is cured to form the support layer.

[0024] In one embodiment, the step of preparing the optical element layer includes:

[0025] providing an optical substrate;

[0026] A plurality of optical element areas are provided on the optical bottom layer, the plurality of optical element areas correspond one to one with the plurality of light emitting areas, and the light emitting area has at least one light exit hole;

[0027] An optical element is arranged in the optical element area, and the optical element is arranged to transmit the light emitted from the light exit hole. The optical element includes at least one of a lens array, a diffractive optical element and a metal lens.

[0028] In one embodiment, the step of preparing the optical element layer includes:

[0029] providing an optical substrate;

[0030] The optical bottom layer is processed by nanoimprinting or etching, and a plurality of optical elements spaced apart from each other are arranged on one side of the optical bottom layer. When the optical bottom layer is arranged on the supporting layer, the optical elements are arranged toward or back to the light source layer. The plurality of optical elements correspond one-to-one to the plurality of light-emitting areas, and the light-emitting areas have at least one light-emitting hole. The optical element includes at least one of a lens array, a diffraction optical element, and a metal lens.

[0031] According to another aspect of the present application, a laser module is provided, comprising:

[0032] At least one light-emitting unit, the light-emitting unit being configured to emit light, wherein at least one of the light-emitting units is combined to form a light-emitting area; and

[0033] A support member and an optical component are sequentially arranged along a propagation direction of the emergent light, wherein the optical component comprises an optical element area corresponding to the light emitting area.

[0034] In one embodiment, the laser module further includes a first electrode and a second electrode. Along the light emitting direction of the light emitting unit, the first electrode and the second electrode are respectively arranged on both sides of the light emitting unit, and a light emitting hole is provided on the second electrode. At least part of the light emitting unit is exposed from the light emitting hole. The first electrode and the second electrode are configured to provide the light emitting unit with an electric field along the light emitting direction of the light emitting unit, and the light emitting unit is configured to emit light toward the light emitting hole under the drive of the electric field.

[0035] In one embodiment, the optical assembly further comprises a body, wherein a plurality of optical element areas are provided on the body, the plurality of optical element areas correspond to the plurality of light-emitting areas one by one, and the optical element areas are provided with optical elements; or

[0036] The optical assembly includes a body, and a plurality of optical elements are formed on the body, and the optical elements are located on a side of the body facing the light-emitting unit or away from the light-emitting unit.

[0037] In one embodiment, the support member includes a light opening extending along the light emitting direction of the light emitting unit, and the light opening corresponds to the light emitting area.

[0038] The above-mentioned laser module manufacturing method first prepares the light source layer, then sequentially prepares the support layer and optical element layer on the light source layer. The multiple optical element areas of the optical element layer are arranged to correspond one-to-one with the multiple light-emitting areas. Finally, the optical element layer, support layer, and light source layer are cut along the to-be-cut area to form an independent laser module. Compared to the related art of independently processing a single laser module, this application can simultaneously produce multiple laser modules, simplifying the production process, significantly improving production efficiency, and increasing production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 Schematic diagram of the structure of the light source layer in one embodiment of the present application.

[0040] Figure 2 It is a side view of the light source layer in one embodiment of the present application.

[0041] Figure 3 This is a schematic diagram of the structure after the light source layer, support layer and optical element layer are separated in one embodiment of the present application.

[0042] Figure 4 This is a structural diagram of an embodiment of the present application in which a light-through opening is provided on the support layer and an optical element is located on a side of the optical bottom layer facing the light source layer.

[0043] Figure 5 In one embodiment of the present application, a formable adhesive layer is provided, and the optical element is located on the side of the optical bottom layer away from the light source layer, and is a structural diagram of a lens array.

[0044] Figure 6 In one embodiment of the present application, a formable adhesive layer is provided, and the optical element is located on the side of the optical bottom layer facing the light source layer, and is a structural schematic diagram of a diffractive optical element.

[0045] Figure 7 This is a structural diagram of a laser module in an embodiment of the present application, in which the optical element is located on the side of the body facing the light source layer and is a protruding structure.

[0046] Figure 8 This is a structural diagram of a laser module in an embodiment of the present application, in which the optical element is located on a side of the body facing the light source layer and is a recessed structure.

[0047] Figure 9 FIG1 is a schematic diagram of light emission of a portion of a laser module in which the optical element adopts a lens array in one embodiment of the present application.

[0048] Figure 10 for Figure 9A schematic structural diagram of the radiation intensity distribution of the emergent light in the illustrated embodiment.

[0049] Figure 11 for Figure 9 Schematic diagram of the structure of the incoherent irradiance distribution of the emergent light in the embodiment shown.

[0050] Figure 12 Schematic diagram of a laser module emitting light forming a clear square spot in one embodiment of the present application.

[0051] Figure 13 Schematic diagram of a laser module emitting light forming a more uniform square spot in one embodiment of the present application.

[0052] Figure 14 FIG. 1 is a schematic diagram of scattered spots formed by light emitted from a laser module in one embodiment of the present application.

[0053] Figure 15 Schematic diagram of a linear spot formed by light emitted from a laser module in one embodiment of the present application.

[0054] Description of Figure Numbers:

[0055] 100, light source layer; 110, light-emitting area; 120, area to be cut; 130, base layer; 140, light-emitting unit; 150, first electrode layer; 160, second electrode layer; 170, light-emitting hole; 180, light-emitting structure;

[0056] 200, support layer; 210, structural layer; 220, light opening; 230, formable adhesive layer; 240, first adhesive layer; 250, second adhesive layer;

[0057] 300, optical element layer; 310, optical bottom layer; 320, optical element area; 330, optical element;

[0058] 10. Laser module;

[0059] 411. First electrode; 412. Second electrode; 420. Support member; 430. Main body. DETAILED DESCRIPTION

[0060] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0061] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0062] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0063] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0064] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0065] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0066] The beam spot of a vertical-cavity surface-emitting laser (VCSEL) is circularly symmetrical with a small divergence angle. This spot needs to be modulated by optical components to achieve a point, line, or surface pattern with appropriate energy distribution and field of view for practical application. Most VCSEL modules in use consist of a chip, substrate, supporting components, and optical elements. Furthermore, the manufacturing process for VCSEL modules in related technologies is lengthy and labor-intensive.

[0067] Based on this, the present application provides a laser module and a manufacturing method thereof, so as to simplify the manufacturing process, greatly improve production efficiency and increase production capacity.

[0068] See Figure 1 、 Figure 2 and Figure 3 As shown, Figure 1 Schematic diagram of the structure of the light source layer 100 in one embodiment of the present application. Figure 2 It is a side view of the light source layer 100 in one embodiment of the present application. Figure 3 Schematic diagram of the structure of the light source layer 100, the support layer 200 and the optical element layer 300 after being disassembled in one embodiment of the present application.

[0069] The manufacturing method of the laser module 10 provided in this application includes:

[0070] S1. Prepare a light source layer 100, which includes a plurality of light emitting regions 110. The plurality of light emitting regions 110 are arranged at intervals, and a to-be-cut region 120 is provided between two adjacent light emitting regions 110. The light emitting regions 110 are used to emit light.

[0071] S2. Prepare a support layer 200 on the light source layer 100, and dispose an optical element layer 300 on the side of the support layer 200 facing away from the light source layer 100. The support layer 200 is configured to transmit at least a portion of the light emitted by the light-emitting area 110. The optical element layer 300 includes multiple optical element regions, each corresponding to a plurality of light-emitting areas 110. At least portions of the support layer 200 and the optical element layer 300 face the area to be cut 120. Light emitted from the light-emitting area 110 passes through the support layer 200 and the optical element layer 300 in sequence and propagates outward.

[0072] S3. Cut the optical element layer 300, support layer 200, and light source layer 100 along the thickness direction of the light source layer 100 and along the to-be-cut area 120 to separate adjacent light-emitting areas 110. Each portion of the light-emitting area 110 forms a corresponding laser module 10. In this way, multiple laser modules 10 can be manufactured simultaneously in batches, and finally cut to form the corresponding multiple laser modules 10.

[0073] In some embodiments, the stacked optical element layer 300 , support layer 200 and light source layer 100 need to be tested before the cutting operation, and the separated multiple laser modules 10 need to be cleaned after the cutting operation to obtain the final product.

[0074] The manufacturing method of the laser module 10 of the present application first prepares the light source layer 100, and then sequentially prepares the support layer 200 and the optical element layer 300 on the light source layer 100, and sets a plurality of optical element areas of the optical element layer 300 corresponding to a plurality of light-emitting areas 110, and finally cuts the optical element layer 300, the support layer 200 and the light source layer 100 along the area to be cut 120 to form an independent laser module 10. The substrate of the single packaged VCSEL in the related art is pre-cut from the wafer, and is obtained by single chip bonding, wire bonding and baking, and then mounting the optical element. The process is long, time-consuming and labor-intensive. In addition, for some components that require processes such as alignment, a single device is required to make the oxidation aperture (AA), which places higher requirements on the process and working time. In conjunction with reference Figure 3 The light source layer 100, support layer 200, and optical element layer 300 of this application can all be fabricated in a wafer structure. After the light source layer 100, support layer 200, and optical element layer 300 are arranged, they can be cut simultaneously, simplifying the manufacturing process. This eliminates the need to pre-cut the substrate of a single packaged VCSEL from the wafer before packaging. Compared to the related art, which involves independently processing a single laser module 10, this application allows for the simultaneous production of multiple laser modules 10, simplifying the manufacturing process and significantly improving production efficiency and capacity.

[0075] In some embodiments, the light source layer 100, support layer 200, and optical element layer 300 are all wafer structures, and 6-inch wafers or wafers of other sizes may be used, without further limitation. Directly using a wafer structure facilitates fabrication using semiconductor processing techniques and improves process precision.

[0076] In some embodiments, in conjunction with Figure 2 As shown, S1, the step of preparing the light source layer 100 includes:

[0077] S11 , providing a base layer 130 , which may be a wafer structure.

[0078] S12. Arrange a plurality of light-emitting units 140 on the base layer 130 to form a light-emitting layer. The light-emitting layer has a plurality of light-emitting regions 110. The light-emitting units 140 are located within the light-emitting regions 110. The plurality of light-emitting units 140 within the same light-emitting region 110 are spaced apart from each other. The light-emitting units 140 may be a wafer structure.

[0079] like Figure 1 and Figure 2 As shown, the portion where each light-emitting area 110 is located corresponds to forming a laser module 10. It can be understood that each laser module 10 has multiple light-emitting units 140, and the light-emitting units 140 are stimulated to emit light, so that the laser module 10 emits light through the multiple light-emitting units 140, wherein the multiple light-emitting units 140 can be arranged in an array, or the arrangement of the multiple light-emitting units 140 can be set according to needs.

[0080] S13 , disposing a first electrode layer 150 on a side of the base layer 130 away from the light-emitting layer.

[0081] S14: Dispose a second electrode layer 160 on the side of the light emitting layer facing away from the base layer 130 to form the light source layer 100. The first electrode layer 150 and the second electrode layer 160 can use back electrodes, eliminating the need for wire bonding and other processes, simplifying the process steps and improving production efficiency.

[0082] The second electrode layer 160 is provided with a plurality of light exit holes 170, each corresponding to the plurality of light emitting units 140. This allows light emitted by the light emitting units 140 when stimulated to emit light to propagate out through the light exit holes 170. It will be appreciated that the first electrode layer 150 and the second electrode layer 160 are respectively provided on either side of the light emitting layer and are configured to provide an electric field along the thickness direction of the base layer 130 for the light emitting units 140. The light emitting units 140 are configured to emit light toward the light exit holes 170 under the drive of the electric field, thereby achieving stimulated emission of light by the light emitting units 140.

[0083] In this way, the present application can simultaneously prepare multiple light-emitting units 140 ( Figure 7 and Figure 8 As shown), it is convenient to prepare the laser module 10 in batches, which is beneficial to simplify the production process and improve the production efficiency.

[0084] In some embodiments, see Figure 3 Part of Figure 4 The embodiment shown, Figure 4This is a schematic diagram of a structure in which a support layer 200 is provided with a light opening 220 and an optical element 330 is located on the side of the optical base layer 310 facing the light source layer 100 in one embodiment of the present application. Step S2, preparing the support layer 200 on the light source layer 100 and disposing the optical element layer 300 on the side of the support layer 200 facing away from the light source layer 100, includes:

[0085] S21 . Provide a structural layer 210 . The structural layer 210 may be a wafer made of silicon or glass.

[0086] S22. Dispose a plurality of light openings 220 on the structural layer 210 along the thickness direction of the structural layer 210 to form the support layer 200. The size of the light openings 220 needs to be larger than the luminous cone of the light emitted by the luminous area so that the light emitted through the luminous hole can pass through the light openings 220 smoothly.

[0087] The light opening 220 can be formed by punching through silicon via (TSV) or through glass via (TGV). If the light opening 220 needs to be larger, liquid etching and other technologies can also be used. No further restrictions are imposed here.

[0088] S23. A first adhesive layer 240 is provided on one of the light source layer 100 and the support layer 200. The support layer 200 is provided on the light source layer 100. The support layer 200 is bonded to the light source layer 100 through the first adhesive layer 240. A plurality of light openings 220 correspond one to one with a plurality of light emitting areas 110. The light emitting area 110 has at least one light exit hole 170. The light opening 220 is opposite to the light emitting area 110, so that the light emitted by the light emitting unit 140 can be emitted from the at least one light exit hole 170 and the light opening 220 in sequence. Thus, the support layer 200, while serving as a partition and support between the optical element layers 300, does not affect the propagation of light in the light emitting area 110 of the light source layer 100. The light source layer 100 and the support layer 200 can also be welded using a eutectic welding process.

[0089] S24 , preparing the optical element layer 300 .

[0090] S25. A second adhesive layer 250 is disposed on one of the support layer 200 and the optical element layer 300, and the optical element layer 300 is bonded to the support layer 200 via the second adhesive layer 250. The plurality of optical element regions are aligned with the plurality of light-emitting regions 110, so that light emitted from the light-emitting regions 110 is transmitted through the light openings 220 to the corresponding optical element regions, and is modulated by the optical element regions before being emitted.

[0091] In this embodiment, the multiple light openings 220 of the support layer 200 are arranged so that there is an air gap between the light-emitting area 110 and the optical element area. When the light emitted from the light-emitting area 110 passes through the light opening 220 and enters the optical element layer 300, the light enters the optically dense medium from the optically sparse medium, which can avoid total reflection of the light, thereby facilitating the light to have a larger output angle.

[0092] In this embodiment, the optical element faces the light source layer. The optical element may be, for example, a microlens array, a diffractive optical element DOE, or a metalens. The specific structure and form of the optical element are not limited here.

[0093] In some embodiments, see Figure 5 and Figure 6 The embodiment shown, Figure 5 In one embodiment of the present application, a moldable adhesive layer 230 is provided. The optical element 330 is located on a side of the optical bottom layer 310 away from the light source layer 100 and is a schematic structural diagram of a lens array. Figure 6 In one embodiment of the present application, a moldable adhesive layer 230 is provided. The optical element 330 is located on a side of the optical bottom layer 310 facing the light source layer 100 and is a structural diagram of a diffractive optical element.

[0094] Step S2, preparing a support layer 200 on the light source layer 100, and disposing an optical element layer 300 on a side of the support layer 200 facing away from the light source layer 100, comprises:

[0095] S26 , disposing a formable adhesive layer 230 on the light source layer 100 . The formable adhesive layer 230 is made of a transparent material.

[0096] S27 , preparing an optical element layer 300 on the formable adhesive layer 230 .

[0097] S28 , curing the formable adhesive layer 230 to form the support layer 200 .

[0098] In this embodiment, the support layer 200 can be made of a moldable adhesive. Specifically, a layer of moldable adhesive is disposed on the light source layer 100 to form a moldable adhesive layer 230. The optical element layer 300 is then formed on the moldable adhesive layer 230 so that the moldable adhesive layer 230 can be bonded between the light source layer 100 and the optical element layer 300. The moldable adhesive layer 230 is then cured to form the support layer 200.

[0099] The moldable adhesive can be a resin-based molding adhesive, etc. Molding adhesive has a high light transmittance, so there is no need to provide a light opening 220 for light to pass through, which helps to simplify the steps of setting the support layer 200, further simplify the manufacturing process, and greatly improve production efficiency and capacity. In this embodiment, the moldable adhesive can be made of silicone or other materials.

[0100] It is understood that step S2 may adopt steps S21-S25 to prepare the support layer 200 having the light opening 220, or may adopt steps S26-S28 to prepare the support layer 200 using a moldable adhesive, without further limitation.

[0101] In this embodiment, the optical element is away from the light source layer. The optical element may be, for example, a diffractive optical element DOE or a metalens. The specific structure and form of the optical element are not limited and will not be restricted herein.

[0102] In some embodiments, see Figure 3 The steps of preparing the optical element layer 300 include:

[0103] S41, providing an optical bottom layer 310.

[0104] The optical base layer 310 only needs to be large enough to cover the entire light source layer 100. If the optical element layer 300 is significantly larger than the light source layer 100, the light source layer 100 can be attached to an auxiliary silicon wafer before further fabrication. Using the auxiliary silicon wafer as a carrier improves operational convenience.

[0105] The optical base layer 310 may be made of glass, SiO2 (silicon dioxide), Si (silicon), GaP (gallium phosphide), SiC (silicon carbide), or various resin materials.

[0106] S42 , a plurality of optical element areas 320 are provided on the optical bottom layer 310 , and the plurality of optical element areas 320 correspond one-to-one to the plurality of light-emitting areas 110 , and the light-emitting area 110 has at least one light-emitting hole 170 .

[0107] S43. An optical element 330 is arranged in the optical element area 320. The optical element 330 is arranged to transmit the light emitted from the light exit hole 170. The optical element 330 includes at least one of a lens array, a diffractive optical element, and a metal lens.

[0108] It will be appreciated that in this embodiment, an optical element area 320 is provided on the optical base layer 310 to accommodate the optical element 330, so that the light-emitting area 110 and the corresponding optical element 330 are opposite each other. Light emitted from at least one light exit hole 170 in the light-emitting area 110 is emitted from the optical element 330 in the corresponding optical element area 320. Furthermore, different optical elements 330 can be provided in different optical element areas 320, enabling the simultaneous production of different laser modules 10. This allows for batch production of laser modules 10 while also enabling different light-emitting areas 110 to correspond to different optical elements 330 as needed. This simplifies the production process, improves production efficiency, and enhances the precision and quality of the finished product.

[0109] In some embodiments, see Figure 4 、 Figure 5 and Figure 6 As shown, the steps of preparing the optical element layer 300 include:

[0110] S44, providing an optical bottom layer 310.

[0111] The size of the optical base layer 310 only needs to cover the entire light source layer 100. The optical base layer 310 can be made of glass, SiO2 (silicon dioxide), Si (silicon), GaP (gallium phosphide), SiC (silicon carbide) or various resin materials.

[0112] S45. Nanoimprinting or etching is used to process the optical base layer 310. A plurality of optical elements 330 are disposed on one side of the optical base layer 310, spaced apart from each other. When the optical base layer 310 is disposed on the support layer 200, the optical elements 330 are disposed toward or away from the light source layer 100. The plurality of optical elements 330 correspond one-to-one to the plurality of light-emitting regions 110, and the light-emitting regions 110 have at least one light exit hole 170. The optical element 330 includes at least one of a lens array, a diffractive optical element, and a metal lens. The optical element 330 can also be bonded to the side of the optical base layer 310 facing toward or away from the light source layer 100, without further limitation.

[0113] In this embodiment, a nanoimprint lithography or etching process is directly applied to the optical base layer 310 to form a plurality of optical elements 330 on one side of the optical base layer 310. The optical elements 330 can be formed on the side facing the light source layer 100 or on the side facing away from the optical elements 330. When the optical element layer 300 is formed using a nanoimprint lithography or etching process, there is no need to provide the optical element region 320 on the optical base layer 310, which simplifies the manufacturing process and improves manufacturing efficiency.

[0114] In some embodiments, when preparing the support layer 200 having the light opening 220 in steps S21-S25, it is preferred that the optical element 330 be formed on the side facing the light source layer 100. This allows light emitted from the light-emitting hole to enter the optical element layer 300 through the light opening 220, passing from the air to the microstructured surface of the optical element 330, and then from the optically less dense medium to the optically dense medium. This prevents total internal reflection of the light and facilitates achieving a larger output angle for the module. Furthermore, the provision of the light opening 220 helps protect the microstructured surface of the optical element 330, preventing scratches and damage to the microstructured surface of the optical element 330.

[0115] In some embodiments, when preparing the support layer 200 using a moldable adhesive using steps S26-S28, it is preferred to arrange the optical element 330 to be formed on the side away from the light source layer 100, so as to prevent the moldable adhesive layer 230 from scratching and damaging the microstructure surface of the optical element 330. The light in the optical element 330 is emitted from the microstructure surface of the optical element 330 into the air, and the light enters the optically sparse medium from the optically dense medium. When the optical element 330 is a lens array, large-angle light is prone to total reflection, so it is suitable for applications where light is emitted at a small angle. When the optical element 330 is a diffraction optical element or a metal lens, the optical element 330 or the microstructure surface of the optical element 330 is away from the light source layer 100, which is conducive to increasing the focal length, expanding the focal length range of the laser module 10, and facilitating the design of the laser module 10.

[0116] This application also provides a laser module 10, in conjunction with Figure 7 and Figure 8 As shown, Figure 7 1 is a schematic structural diagram of the optical element 330 of the laser module 10 in one embodiment of the present application, which is located on the side of the body 430 facing the light source layer 100 and is a protruding structure. Figure 8 1 is a schematic structural diagram of the optical element 330 of the laser module 10 in an embodiment of the present application, which is located on a side of the body 430 facing the light source layer 100 and is a recessed structure.

[0117] The laser module 10 includes a plurality of light-emitting units 140 arranged at intervals from each other, a support member 420 and an optical component, and the light-emitting unit 140 is used to emit outgoing light. A plurality of light-emitting units 140 are combined to form a plurality of light-emitting areas 110, and the light-emitting area 110 includes at least one light-emitting unit 140. The support member 420 and the optical component are arranged in sequence along the propagation direction of the outgoing light, and the optical component includes an optical element area, which corresponds to the light-emitting area 110. It can be understood that at least one light-emitting unit 140 is formed by cutting the light source layer 100 along the area to be cut 120, or in other words, a single light-emitting area 110 corresponds to at least one light-emitting unit 140 in the above-mentioned manufacturing method, a portion of the first electrode layer 150 corresponding to the light-emitting unit 140, and a portion of the second electrode layer 160 corresponding to the light-emitting unit 140. The support member 420 is formed by cutting the support layer 200 along the to-be-cut area 120, and the optical assembly is formed by cutting the optical element layer 300 along the to-be-cut area 120. In this manner, the optical element layer 300, the support layer 200, and the light source layer 100 are cut along the to-be-cut area 120 to form the laser module 10 of the present application. The above process enables batch production of multiple laser modules 10, thereby simplifying the production process and improving production efficiency.

[0118] In some embodiments, continue to refer to Figure 7 and Figure 8 , combined with reference Figure 1 As shown, the laser module 10 also includes a first electrode 411 and a second electrode 412. Along the light emitting direction of the light emitting unit 140, the first electrode 411 and the second electrode 412 are respectively arranged on both sides of the light emitting unit 140, and a light emitting hole 170 is provided on the second electrode 412. At least part of the light emitting unit 140 is exposed from the light emitting hole 170. The first electrode 411 and the second electrode 412 are configured to provide the light emitting unit 140 with an electric field along the light emitting direction of the light emitting unit 140, and the light emitting unit 140 is configured to be able to emit light toward the light emitting hole 170 under the drive of the electric field.

[0119] That is, the first electrode 411 is the portion of the first electrode layer 150 corresponding to the light-emitting unit 140, and the second electrode 412 is the portion of the second electrode layer 160 corresponding to the light-emitting unit 140. The electric field formed by the first electrode 411 and the second electrode 412 excites the light-emitting unit 140 to emit light. It can be understood that when the light source layer 100 is cut, the base layer 130 is cut along the area to be cut 120 to be divided into different sub-base layers. There are multiple light-emitting units 140 on the corresponding sub-base layers, and the corresponding first electrode layer 150 and second electrode layer 160 are also cut separately, thereby forming a sub-first electrode layer corresponding to the sub-base layer and a sub-second electrode layer corresponding to the sub-base layer. The light-emitting area 110 mentioned in the manufacturing method can also be understood as an area capable of emitting light formed by the sub-base layer, the sub-first electrode layer and the sub-second electrode layer. In this way, each laser module 10 formed after cutting can emit light normally, thereby having a certain degree of feasibility, simple preparation, and conducive to batch preparation without affecting normal light emission.

[0120] In this embodiment, a via hole can be opened on the base layer 130 so that part of the second electrode 412 passes through the base layer through the via hole and is located on the same side as the first electrode 411, so that the parts of the first electrode 411 and the second electrode 412 connected to the external circuit are both located on the side of the base layer 130 away from the light output hole 170, so as to reduce the influence of the wiring on the light output of the light output hole 170.

[0121] In some embodiments, as Figure 7 and Figure 8 As shown, the optical assembly further includes a body 430, on which are disposed a plurality of optical element regions 320. These regions 320 correspond one-to-one with the plurality of light-emitting regions 110, and the optical elements 330 are disposed within the optical element regions 320. It will be appreciated that the body 430 of the optical assembly is obtained by cutting the optical base layer 310, and in this embodiment, the body 430 is obtained by cutting the optical base layer 310 in the embodiment described in steps S41, S42, and S43. This facilitates the batch production of multiple laser modules 10 with different optical elements 330, thereby increasing the flexibility of batch production.

[0122] In some embodiments, as Figure 7 and Figure 8 As shown, the optical assembly includes a body 430, with multiple optical elements 330 formed on the body 430, with the optical elements 330 located on the side of the body 430 facing the light-emitting unit 140 or facing away from the light-emitting unit 140. The body 430 is formed by cutting the optical base layer 310, and the body 430 in this embodiment is obtained by cutting the optical base layer 310 in the embodiment of steps S44 and S45 described above. In this way, the optical element layer 300 is formed through a nanoimprint or etching process, eliminating the need to provide the optical element area 320 on the optical base layer 310, which helps simplify the manufacturing process and improves manufacturing efficiency.

[0123] In some embodiments, as Figure 7 and Figure 8 As shown, the support member 420 includes a light opening 220 extending along the thickness direction of the structural layer 210, or in other words, along the light emission direction of the light-emitting unit. The light opening 220 corresponds to the light-emitting area 110. It can be understood that the support member 420 is cut from the support layer 200, and the support member 420 in this embodiment is formed by cutting the support layer 200 in the embodiment of steps S21-S25 above. In some embodiments, when the support member 420 is formed by cutting the support layer 200 in the embodiment of steps S26-S29 above, it does not have the light opening 220, and light can be directly guided through the support member 420.

[0124] In this way, by sequentially cutting the optical element layer 300 , the support layer 200 and the light source layer 100 , a laser module 10 having a light emitting area 110 , a support member 420 and an optical component can be formed, which is beneficial to simplifying the manufacturing process and improving the manufacturing efficiency.

[0125] See Figure 9 As shown, Figure 9 FIG. 1 is a schematic diagram of light emission of a portion of a laser module 10 in which the optical element 330 adopts a lens array in an embodiment of the present application. Figure 9 is a schematic diagram of a single laser module 10 emitting light, and is a schematic diagram of light emission in an embodiment in which the support member 420 is provided with a light opening 220, and Figure 9 The light-emitting unit 140 is blanked out. Clearly, the laser module 10 manufactured using the manufacturing method of the present application emits uniform light. Furthermore, the configuration of the light opening 220 ensures that when light passes through the light opening 220 and enters the optical element, it enters the optically denser medium from the less dense medium, avoiding total internal reflection and thus enabling the light to have a larger light output angle. In other words, the laser module 10 manufactured using the manufacturing method of the present application also has a larger light output angle.

[0126] See also Figure 10 and Figure 11 As shown, Figure 10 for Figure 9 A schematic structural diagram of the radiation intensity distribution of the emergent light in the illustrated embodiment. Figure 11 for Figure 9 The schematic diagram of the structure of the incoherent irradiance distribution of the output light in the embodiment shown is shown. It can be seen that the laser module 10 manufactured by the manufacturing method of the present application has a better radiation intensity distribution and a more uniform incoherent irradiance distribution.

[0127] See Figure 12 、 Figure 13 、 Figure 14 and Figure 15 As shown, Figure 12FIG. 1 is a schematic diagram showing that the light emitted by the laser module 10 forms a clear square light spot in one embodiment of the present application. Figure 13 Schematic diagram showing that the light emitted by the laser module 10 forms a more uniform square light spot in one embodiment of the present application. Figure 14 FIG. 1 is a schematic diagram of scattered spots formed by light emitted from the laser module 10 in one embodiment of the present application. Figure 15 This is a schematic diagram of a linear light spot formed by the emitted light of the laser module 10 in one embodiment of the present application. It can be seen that the manufacturing method of the present application can be used to manufacture laser modules 10 whose emitted light forms square, scattered, and linear light spots. Furthermore, by designing the support layer 200 and the optical element layer 300, the desired laser module 10 can be manufactured to have a predetermined emitted light and, therefore, a predetermined emitted light spot.

[0128] The manufacturing method of the laser module 10 of the present application first prepares the light source layer 100, then sequentially prepares the support layer 200 and the optical element layer 300 on the light source layer 100, and sets multiple optical element areas of the optical element layer 300 to correspond one to one with multiple light-emitting areas 110, and finally cuts the optical element layer 300, the support layer 200 and the light source layer 100 along the area to be cut 120 to form an independent laser module 10. Compared with the independent processing of a single laser module in the related art, the present application can simultaneously manufacture multiple laser modules 10, simplifying the manufacturing process, greatly improving production efficiency and increasing production capacity. In the related art, the manufacture of the laser module 10 usually requires the completion of processes such as patching, wire bonding, injection molding and electroplating. Due to process limitations, it is difficult to improve both precision and production efficiency. However, the present application stacks three layers of wafers: the power layer, the support layer 200 and the optical element layer 300, and can adopt processes such as gluing or wafer welding, thereby further improving manufacturing precision and production efficiency.

[0129] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0130] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A method for manufacturing a laser module, characterized in that: The manufacturing method of the laser module includes: Prepare a light source layer, wherein the light source layer includes a plurality of light-emitting areas, the plurality of light-emitting areas are arranged at intervals, and an area to be cut is provided between two adjacent light-emitting areas; A support layer is prepared on the light source layer, and an optical element layer is disposed on a side of the support layer facing away from the light source layer; the support layer is configured to transmit at least a portion of the light emitted by the light-emitting area; the optical element layer includes a plurality of optical element areas, each of the optical element areas corresponds to each of the light-emitting areas, and at least a portion of the support layer and the optical element layer is opposite to the area to be cut; The optical element layer, the support layer and the light source layer are cut along the thickness direction of the light source layer and along the area to be cut to separate the adjacent light emitting areas, and each portion where the light emitting area is located forms a corresponding laser module.

2. The method for manufacturing a laser module according to claim 1, wherein: The step of preparing the light source layer comprises: Provide a base layer; Arranging a plurality of light-emitting units on the base layer to form a light-emitting layer, wherein the light-emitting layer has a plurality of light-emitting areas, the light-emitting units are located in the light-emitting areas, and the light-emitting units in the same light-emitting area are spaced apart from each other; Disposing a first electrode layer on a side of the base layer away from the light-emitting layer; A second electrode layer is arranged on the side of the light-emitting layer away from the base layer to form the light source layer. A plurality of light-emitting holes are provided on the second electrode layer. The plurality of light-emitting holes correspond one-to-one to the plurality of light-emitting units. The first electrode layer and the second electrode layer are arranged to provide the light-emitting units with an electric field along the thickness direction of the base layer. The light-emitting units are arranged to emit light toward the light-emitting holes under the drive of the electric field.

3. The method for manufacturing a laser module according to claim 2, wherein: The steps of preparing a support layer on the light source layer and arranging an optical element layer on a side of the support layer away from the light source layer include: providing a structural layer; A plurality of light openings are provided on the structural layer along the thickness direction of the structural layer to form the supporting layer; A first adhesive layer is provided on one of the light source layer and the support layer, the support layer is provided on the light source layer, and the support layer is adhered to the light source layer through the first adhesive layer, the plurality of light openings correspond one-to-one to the plurality of light-emitting areas, and the light-emitting area has at least one light-emitting hole; preparing the optical element layer; A second adhesive layer is provided on one of the support layer and the optical element layer, and the optical element layer is bonded to the support layer through the second adhesive layer.

4. The method for manufacturing a laser module according to claim 2, wherein: The steps of preparing a support layer on the light source layer and arranging an optical element layer on a side of the support layer away from the light source layer include: A formable adhesive layer is provided on the light source layer, wherein the formable adhesive layer is made of a transparent material; preparing the optical element layer on the formable adhesive layer; The formable adhesive layer is cured to form the support layer.

5. The method for manufacturing a laser module according to claim 3 or 4, characterized in that: The step of preparing the optical element layer comprises: providing an optical substrate; A plurality of optical element areas are provided on the optical bottom layer, the plurality of optical element areas correspond one to one with the plurality of light emitting areas, and the light emitting area has at least one light exit hole; An optical element is arranged in the optical element area, and the optical element is arranged to transmit the light emitted from the light exit hole. The optical element includes at least one of a lens array, a diffractive optical element and a metal lens.

6. The method for manufacturing a laser module according to claim 3 or 4, characterized in that: The step of preparing the optical element layer comprises: providing an optical substrate; The optical bottom layer is processed by nanoimprinting or etching, and a plurality of optical elements spaced apart from each other are arranged on one side of the optical bottom layer. When the optical bottom layer is arranged on the supporting layer, the optical elements are arranged toward or back to the light source layer. The plurality of optical elements correspond one-to-one to the plurality of light-emitting areas, and the light-emitting areas have at least one light-emitting hole. The optical element includes at least one of a lens array, a diffraction optical element, and a metal lens.

7. A laser module, characterized in that: The laser module includes: at least one light-emitting unit, the light-emitting unit being configured to emit light, wherein at least one of the light-emitting units is combined to form a light-emitting area; and A support member and an optical component are sequentially arranged along a propagation direction of the emergent light, wherein the optical component comprises an optical element area corresponding to the light emitting area.

8. The laser module according to claim 7, characterized in that: The laser module also includes a first electrode and a second electrode. Along the light emitting direction of the light emitting unit, the first electrode and the second electrode are respectively arranged on both sides of the light emitting unit, and a light emitting hole is provided on the second electrode. At least part of the light emitting unit is exposed from the light emitting hole. The first electrode and the second electrode are configured to provide the light emitting unit with an electric field along the light emitting direction of the light emitting unit, and the light emitting unit is configured to emit light toward the light emitting hole under the drive of the electric field.

9. The laser module according to claim 7, wherein: The optical assembly further comprises a body, wherein a plurality of optical element areas are provided on the body, the plurality of optical element areas correspond to the plurality of light-emitting areas on a one-to-one basis, and optical elements are provided in the optical element areas; or The optical assembly includes a body, and a plurality of optical elements are formed on the body, and the optical elements are located on a side of the body facing the light-emitting unit or away from the light-emitting unit.

10. The laser module according to claim 7, wherein: The support member includes a light opening extending along the light emitting direction of the light emitting unit, and the light opening corresponds to the light emitting area.

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