Radiator

Abstract

The radiator comprises a body made of phonon heat conduction materials, the body is provided with a first end and a second end which are opposite, the second end of the body is used for making contact with a heat release device, the cross section area of the first end is larger than that of the second end, and the cross section area of the body is gradually decreased from the first end to the second end. According to test detection, the cross sectional area of the first end of the body is set to be larger than that of the second end, the cross sectional area of the body is gradually reduced from the first end to the second end, heat is mainly transferred from the second end to the first end, heat transfer is limited in the reverse direction, and one-way heat conduction can be basically achieved; therefore, the temperature difference can be maintained, the heat dissipation efficiency and the performance stability of the equipment can be improved, and the energy waste can be reduced.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a unidirectional heat dissipation radiator. Background Art

[0002] As electronic products improve in performance and become more complex, heat dissipation becomes a key factor limiting their performance. Existing heat dissipation products are mostly bidirectional. During the use of electronic products, when the ambient temperature is too high, the heat dissipation products often transfer heat into the product, causing damage to components and inconvenience. Summary of the Invention

[0003] Based on this, the present application provides a radiator that can achieve one-way heat transfer and avoid heat transfer to the inside of the electronic product when the external ambient temperature is too high.

[0004] A heat sink includes a body made of phononic heat conductive material, the body having a first end and a second end opposite to each other, the second end of the body being used to contact a heat dissipation device, the cross-sectional area of the first end being larger than the cross-sectional area of the second end, and the cross-sectional area of the body decreasing from the first end to the second end.

[0005] In one embodiment, the interior of the body has a cavity, and the cross-sectional area of the cavity decreases from the first end to the second end; or, the interior of the body has a cavity, and the cross-sectional area of the cavity decreases from the first end to the second end, and the cavity is filled with a filler with a thermal conductivity lower than that of the body.

[0006] In one embodiment, an adhesive layer is provided on the outer surface of the body from the first end to the second end, and the thermal conductivity of the adhesive layer is lower than the thermal conductivity of the body.

[0007] In one embodiment, the adhesive layer is potting glue or thermal insulation paint.

[0008] In one embodiment, the body is in the shape of a cone, a truncated cone, a pyramid or a truncated pyramid; or the body is formed by connecting a plurality of cylinders with successively decreasing diameters.

[0009] In one embodiment, the end surface of the first end of the body is parallel to the end surface of the second end; and / or the heat sink further includes a pad, and the second end of the body contacts the heat dissipation device through the pad.

[0010] In one embodiment, the heat sink further comprises a first base plate having a thermal conductivity no greater than that of the body, the body comprising a plurality of bodies, a first end of the body being connected to the first base plate, and the plurality of bodies and the first base plate being integrally formed to form a first heat dissipation assembly;

[0011] Alternatively, the heat sink also includes a first base plate with a thermal conductivity not greater than that of the main body and a mounting plate with a thermal conductivity not less than that of the main body. The main body includes multiple, the first end of the main body is connected to the first base plate, the second end of the main body is connected to the mounting plate, and the multiple first base plates, the main body and the mounting plate are integrally formed to form a first heat dissipation component.

[0012] In one embodiment, the first heat dissipation component includes a plurality of components, the plurality of first heat dissipation components are stacked in the same direction, and the second end of the outermost first heat dissipation component is used to contact the heat dissipation device.

[0013] In one embodiment, the heat sink further includes a second base plate, the thermal conductivity of the second base plate is lower than the thermal conductivity of the main body, the main body includes a plurality of second base plates having a plurality of pits matching the outer shape of the main body and the orientations of the pits are the same, and the main bodies are arranged one-to-one in the pits to form a second heat dissipation component.

[0014] In one embodiment, the second heat dissipation component includes a plurality of second heat dissipation components, which are stacked in the same direction, and the second end of the outermost second heat dissipation component is used to contact the heat dissipation device.

[0015] The heat sink of the present application, when in use, contacts the heat dissipating device at the second end of the body with a smaller cross-sectional area. The heat generated by the heat dissipating device is transferred to the body. Since solid heat conduction is mainly caused by phonon propagation, the higher the temperature, the more intense the lattice vibration. The transmission of lattice vibration leads to heat transfer. The lattice vibration in the crystal generates mechanical waves. When the wavelength is close to the lattice period, the mechanical wave is called a phonon. The transmission characteristics of phonons follow the propagation law of waves. In an independent object, the wave generally moves and concentrates toward the tip (the end of the geometric shape). Phonon heat conduction exhibits different heat conduction efficiencies in specific directions. Experiments have found that by setting the cross-sectional area of the first end of the body to be larger than the second end, and the cross-sectional area of the body decreasing from the first end to the second end, heat is mainly transferred from the second end to the first end, and heat transfer in the opposite direction is restricted. This can basically achieve unidirectional heat conduction, avoid heat transfer to the interior of the electronic product when the external ambient temperature is too high, thereby maintaining the temperature difference and ensuring that heat can only be transferred from the high temperature area to the low temperature area, improving the heat dissipation efficiency and performance stability of the device, and reducing energy waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an illustrative and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0017] Figure 1 is a perspective schematic diagram of a heat sink according to a first embodiment;

[0018] Figure 2 is a perspective schematic diagram of a heat sink according to a second embodiment;

[0019] Figure 3 is a perspective schematic diagram of a heat sink according to a third embodiment;

[0020] Figure 4 is a perspective schematic diagram of a heat sink according to a fourth embodiment;

[0021] Figure 5 is a perspective schematic diagram of a radiator according to a fifth embodiment;

[0022] Figure 6 is a perspective schematic diagram of a heat sink according to a sixth embodiment;

[0023] Figure 7 is a cross-sectional schematic diagram of a radiator according to an embodiment of the present application;

[0024] Figure 8 is a cross-sectional schematic diagram of a radiator according to another embodiment of the present application;

[0025] Figure 9 It is a cross-sectional schematic diagram of a radiator according to another embodiment of the present application.

[0026] The reference numerals are as follows:

[0027] 10. Main body; 110. First end; 120. Second end; 20. First base plate; 30. Second base plate; 40. Mounting plate; 50. Filling body. DETAILED DESCRIPTION

[0028] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are part of the embodiments of the present disclosure, not all of them. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0029] The specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0030] Reference Figure 1-6One embodiment of the present application provides a heat sink, comprising a body 10 made of a phonon heat conduction material such as hexagonal boron nitride (h-BN), diamond, silicon (Si), germanium (Ge) or boron nitride nanosheets (BNNS) with high thermal conductivity, and the body 10 has a first end 110 and a second end 120 opposite to each other. The second end 120 of the body 10 is used to contact a heat release device. The cross-sectional area of the first end 110 is larger than the cross-sectional area of the second end 120, and the cross-sectional area of the body 10 decreases from the first end 110 to the second end 120. The second end 120 can be point-shaped or plane-shaped, and the longitudinal cross-section of the body 10 can be conical, trapezoidal, etc., as long as the first end 110 with a larger cross-sectional area of the body 10 is connected to the second end 120 with a smaller cross-sectional area in a manner of decreasing cross-sectional area. For example, the main body 10 is in the shape of a cone, a truncated cone, a pyramid or a truncated pyramid, or the main body 10 is formed by connecting a plurality of cylinders with successively decreasing diameters, and the adjacent cylinders are bonded with a high thermal conductive material to ensure good surface contact between each section.

[0031] Traditional heat conduction follows the basic law of heat conduction, which states that the amount of heat passing through a given cross-section per unit time is proportional to the rate of temperature change perpendicular to that interface and the cross-sectional area. Unidirectional heat conduction, on the other hand, further limits the direction of heat conduction, achieving unidirectional heat flow. Compared to heat sinks that primarily use convection as a heat sink, the heat sink of this embodiment primarily transfers heat through phonon heat conduction, and its performance is determined by its internal structure and is unaffected by the external environment. Tests have shown that the structure of the heat sink of this embodiment allows it to better transfer heat from the second end 120 to the first end 110, while limiting heat transfer in the opposite direction, essentially achieving unidirectional heat conduction.

[0032] When the heat sink of this embodiment is in use, the second end 120 of the body 10, which has a smaller cross-sectional area, contacts the heat dissipating device, and the heat generated by the heat dissipating device is transferred to the body 10. Since solid heat conduction is mainly caused by phonon propagation, the higher the temperature, the more intense the lattice vibration. The transmission of lattice vibration leads to heat transfer. Lattice vibration in the crystal generates mechanical waves. When the wavelength is close to the lattice period, this mechanical wave is called a phonon. The transmission characteristics of phonons follow the propagation law of waves. In an independent object, the wave will move and concentrate toward the tip (the end of the geometric shape). Phonon heat conduction exhibits different heat conduction efficiencies in specific directions. Experimental testing found that by setting the cross-sectional area of the first end 110 of the body 10 to be larger than the second end 120, and the cross-sectional area of the body 10 decreasing from the first end 110 to the second end 120, heat is mainly transferred from the second end 120 to the first end 110, and heat transfer in the opposite direction is restricted, which can basically achieve unidirectional heat conduction, thereby maintaining the temperature difference and ensuring that heat can only be transferred from the high temperature area to the low temperature area, improving the heat dissipation efficiency and performance stability of the device, and reducing energy waste.

[0033] In one embodiment, the interior of the body 10 is hollow. Experimental tests have shown that the hollow interior of the body 10 has a better unidirectional heat conduction effect.

[0034] In one embodiment, the body 10 is provided with an adhesive layer on its surface extending from the first end 110 to the second end 120. The adhesive layer has a lower thermal conductivity than the body 10. By wrapping the outer surface of the body 10 with the adhesive layer, external heat is prevented from being transferred to the body 10, thereby ensuring unidirectional heat transfer. The adhesive layer can be made of a thermally insulating material. Optionally, the adhesive layer can be potting glue or thermal insulation paint; the wrapping method can be to use potting glue with lower thermal conductivity or to apply thermal insulation paint.

[0035] In one embodiment, the end surface of the first end 110 of the body 10 is parallel to the end surface of the second end 120. By arranging the upper and lower end surfaces in parallel, it is more convenient to install the heat sink.

[0036] First embodiment

[0037] Reference Figure 1 In this embodiment, the heat sink includes a first base plate 20 and multiple bodies 10. The first ends 110 of the bodies 10 are connected to the first base plate 20. The multiple bodies 10 and the first base plate 20 are integrally formed to form a first heat dissipation assembly. In this embodiment, the first base plate 20 can be made of the same heat dissipation material as the bodies 10, or a material with thermal conductivity no less than that of the bodies 10, to better conduct heat from the second ends 120 to the first ends 110 and the first base plate 20.

[0038] Second embodiment

[0039] Reference Figure 2 The heat sink described in this embodiment includes a plurality of first heat dissipation components as in the first embodiment, and the plurality of first heat dissipation components are stacked in the same direction. It can be understood that, among two adjacent first heat dissipation components, the second end 120 of one first heat dissipation component is adjacent to or in contact with the first end 110 of the other first heat dissipation component. The second end 120 of the outermost first heat dissipation component is used to contact the heat release device. Through experimental inspection, it was found that there are multiple layers of special structures superimposed in the heat sink. For example, the heat sink described in this embodiment is composed of two layers of special structures superimposed. The thermal conductivity of the internal structure in the direction from the tip to the bottom is enhanced, which will aggravate the phenomenon of unidirectional heat conduction.

[0040] Third embodiment

[0041] Reference Figure 3The difference between this embodiment and the first embodiment or the second embodiment is that the body 10 of this embodiment is hollow. The body 10 has a cavity inside, and the cross-sectional area of the cavity decreases from the first end 110 to the second end 120. After testing, the body 10 with a hollow interior has a better one-way heat conduction effect. Optionally, refer to Figure 8 In other embodiments, the cavity is filled with a filler 50 having a lower thermal conductivity than the body 10. The body 10 can be filled with fillers 50 having the same pointed shape, or even formed into a cavity. When the thermal conductivity of the body 10 is greater than that of the first base plate 20 and the filler 50, the heat sink as a whole still has the characteristic of unidirectional heat conduction.

[0042] Fourth embodiment

[0043] Reference Figure 4 This embodiment differs from the above-described embodiment in that the heat sink of this embodiment further includes a mounting plate 40, to which the second end 120 of the body 10 is connected, and the thermal conductivity of the mounting plate 40 is no less than that of the body 10. This arrangement facilitates contact with the heat-dissipating device through the mounting plate 40, ensuring unidirectional heat transfer from the second end 120 to the first end 110 of the body 10.

[0044] Fifth embodiment

[0045] Reference Figure 5 、 Figure 7 The heat sink of this embodiment includes a second base plate 30 and multiple bodies 10. The thermal conductivity of the second base plate 30 is lower than that of the bodies 10. The second base plate 30 has multiple recesses that match the outer shape of the bodies 10 and are oriented in the same direction. This means that the recesses are all arranged with their tips facing downward. The bodies 10 are positioned one-to-one within these recesses to form a second heat dissipation assembly.

[0046] Based on the transmission characteristics of waves, reasoning and attempts were made, and through experimental verification, it was found that when the internal structure of a solid presents a shape similar to a funnel that is narrow at the top and wide at the bottom, such as the tip shape of the main body 10 of the present embodiment, and the second base plate 30 is other fillers, when the thermal conductivity of the main body 10 is better than that of the second base plate 30, the heat sink exhibits different heat conduction efficiencies in specific directions. The internal structure of the main body 10 enables the heat sink of the present embodiment to have better thermal conductivity from the tip (the second end 120 of the main body 10) to the bottom (the first end 110 of the main body 10), and the opposite is true in the opposite direction.

[0047] Optionally, refer to Figure 8 , the body 10 can be configured to be hollow as in the third embodiment.

[0048] Sixth embodiment

[0049] Reference Figure 6 、 Figure 9 The heat sink described in this embodiment includes a plurality of second heat dissipation components as in the fifth embodiment, and the plurality of second heat dissipation components are stacked in the same direction. It can be understood that, among two adjacent second heat dissipation components, the second end 120 of one second heat dissipation component is adjacent to or in contact with the first end 110 of the other second heat dissipation component. The second end 120 of the outermost second heat dissipation component is used to contact the heat release device. Through experimental inspection, it was found that there are multiple layers of special structures superimposed in the heat sink. For example, the heat sink described in this embodiment is composed of two layers of special structures superimposed. The thermal conductivity of the internal structure from the bottom to the tip is enhanced, which will aggravate the phenomenon of unidirectional heat conduction.

[0050] Optionally, refer to Figure 8 In this embodiment, the main body 10 can be configured to be hollow as in the third embodiment.

[0051] Furthermore, the heat sink of any of the above embodiments further includes a backing plate, through which the second end 120 of the body 10 contacts the heat dissipating device. The second end 120 of the heat sink, which has a smaller cross-section, is mounted in contact with the backing plate, which is in contact with the heat dissipating device. Heat generated by the heat dissipating device is conducted through the backing plate to the second end 120 of the body 10, and then from the second end 120 to the first end 110, dissipating heat in a unidirectional manner.

[0052] In the above description of this specification, unless otherwise expressly specified or limited, terms such as "fixed," "mounted," "connected," or "connected" should be understood broadly. For example, the term "connected" can refer to a fixed connection, a removable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal connection between two elements or the interaction between two elements. Therefore, unless otherwise expressly defined in this specification, those skilled in the art can understand the specific meanings of the above terms in this application based on the specific circumstances.

[0053] According to the above description of this specification, those skilled in the art may also understand that the terms used below, such as "up", "down", "front", "back", "left", "right", "length", "width", "thickness", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential", "center", "longitudinal", "lateral", "clockwise" or "counterclockwise", etc., which indicate orientation or positional relationships, are based on the orientation or positional relationships shown in the drawings of this specification, and are only for the purpose of facilitating the explanation of the scheme of this application and simplifying the description, rather than explicitly or implicitly indicating that the device or element involved must have the specific orientation, be constructed and operate in a specific orientation. Therefore, the above-mentioned orientation or positional relationship terms cannot be understood or interpreted as limitations on the scheme of this application.

[0054] In addition, the terms "first" or "second" used in this specification to refer to numbers or ordinal numbers are used for descriptive purposes only and should not be understood as explicitly or implicitly indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this specification, "plurality" means at least two, such as two, three or more, etc., unless otherwise clearly specified.

[0055] Although this specification has shown and described a plurality of embodiments of the present application, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Those skilled in the art will think of many changes, modifications and alternatives without departing from the thought and spirit of the present application. It should be understood that in the process of practicing the present application, various alternatives to the embodiments of the present application described herein may be adopted. The appended claims are intended to define the scope of protection of the present application and therefore cover modular compositions, equivalents or alternatives within the scope of these claims.

Claims

1. A radiator, characterized in that: It includes a body made of phonon heat conductive material, the body having a first end and a second end opposite to each other, the second end of the body is used to contact the heat dissipation device, the cross-sectional area of the first end is larger than the cross-sectional area of the second end, and the cross-sectional area of the body decreases from the first end to the second end.

2. The radiator according to claim 1, characterized in that The interior of the body has a cavity, and the cross-sectional area of the cavity decreases from the first end to the second end; or, the interior of the body has a cavity, and the cross-sectional area of the cavity decreases from the first end to the second end, and the cavity is filled with a filler with a thermal conductivity lower than that of the body.

3. The radiator according to claim 1 or 2, characterized in that: An adhesion layer is provided on the outer surface of the body from the first end to the second end, and the thermal conductivity of the adhesion layer is lower than the thermal conductivity of the body.

4. The radiator according to claim 3, characterized in that The adhesion layer is potting glue or thermal insulation paint.

5. The radiator according to claim 3, characterized in that The main body is in the shape of a cone, a truncated cone, a pyramid or a truncated pyramid; or the main body is formed by connecting a plurality of cylinders with successively decreasing diameters.

6. The radiator according to claim 1 or 2, characterized in that: The end surface of the first end of the body is parallel to the end surface of the second end; and / or, the heat sink further includes a pad, and the second end of the body contacts the heat dissipation device through the pad.

7. The radiator according to claim 1 or 2, characterized in that: It also includes a first base plate having a thermal conductivity not greater than that of the body, the body including a plurality of bodies, a first end of the body connected to the first base plate, and the plurality of bodies and the first base plate are integrally formed to form a first heat dissipation assembly; Alternatively, the heat sink also includes a first base plate with a thermal conductivity not greater than that of the main body and a mounting plate with a thermal conductivity not less than that of the main body. The main body includes multiple, the first end of the main body is connected to the first base plate, the second end of the main body is connected to the mounting plate, and the multiple first base plates, the main body and the mounting plate are integrally formed to form a first heat dissipation component.

8. The radiator according to claim 7, characterized in that The first heat dissipation components include a plurality of components, which are stacked in the same direction, and the second end of the outermost first heat dissipation component is used to contact the heat dissipation device.

9. The radiator according to claim 1 or 2, characterized in that: It also includes a second base plate, the thermal conductivity of the second base plate is lower than the thermal conductivity of the main body, the main body includes multiple, the second base plate has multiple pits matching the shape of the main body and the orientation of the pits is the same, the main body is arranged one by one in the pits to form a second heat dissipation component.

10. The radiator according to claim 9, characterized in that The second heat dissipation components include a plurality of second heat dissipation components, which are stacked in the same direction, and the second end of the outermost second heat dissipation component is used to contact the heat dissipation device.

Images