Multi-chip series crimping module

Abstract

The invention belongs to the technical field of chip series connection, and particularly discloses a multi-chip series connection crimping module, which comprises a crimping sub-module and a packaging sub-module, and is characterized in that the crimping sub-module comprises a chip unit, an adjusting unit, two elastic buffer units and two pressing plates, the chip unit is located between the two elastic buffer units, and the adjusting unit is located between the two elastic buffer units; the chip unit, the adjusting unit and the chip unit are arranged between the two pressing plates in a stacked mode, the adjusting unit is used for adjusting the distance between the two pressing plates, and the chip unit comprises a plurality of bare chips which are arranged in a stacked mode and connected in series and two busbars connected to the two ends of a whole formed by the bare chips; each packaging sub-module comprises an inner cylinder with a port and an outer cylinder with a port, the inner cylinder and the outer cylinder are mutually sleeved and connected along the port to form a packaging cylinder which wraps the crimping sub-module and allows the busbar to extend out, and an inner cavity of the packaging cylinder is filled with an insulating medium for packaging the chip unit. The multi-chip series connection crimping module has the advantages of being small in inductance, high in integration level and not prone to breakdown.

Description

Technical Field

[0001] The present application belongs to the field of chip series connection technology, and more specifically, relates to a multi-chip series connection compression module. Background Art

[0002] A tandem chip module is a packaging technology that stacks multiple electronic chips vertically. This packaging technology can effectively save space and improve module performance.

[0003] In related technologies, such as Figure 1 As shown, a conventional chip-in-series module encapsulates a bare chip within a tube package (a) to form a chip package structure. Multiple chip packages are then connected in series to form the module. When using this multi-chip-in-series module, current flows through the tube package, generating additional inductance. This significantly increases the inductance of the entire module, leading to excessively long pulse rise times and high losses in systems equipped with this module. This makes it difficult to meet the high-standard application requirements of the system and urgently requires improvement. Summary of the Invention

[0004] In response to the defects or improvement needs of the existing technology, the present application provides a multi-chip series compression module, which aims to improve the problem of large inductance of traditional multi-chip series modules.

[0005] The present application provides a multi-chip serial compression module, which specifically includes a compression submodule and a packaging submodule, wherein: The crimping submodule includes a chip unit, an adjustment unit, two elastic buffer units, and two pressure plates. The chip unit is located between the two elastic buffer units. The chip unit includes a plurality of bare chips stacked and connected in series, and two bus bars connected at the upper and lower ends of the whole body formed by the plurality of bare chips. The two pressure plates are crimped at the upper and lower ends of the whole body formed by the chip unit and the two elastic buffer units with adjustable spacing through the adjustment unit. The packaging submodule includes an inner cylinder and an outer cylinder with ports, the inner cylinder and the outer cylinder are connected to each other along the ports to form a packaging cylinder that covers the crimping submodule and allows the busbar to extend. The inner cavity of the packaging cylinder is filled with an insulating medium for the packaging chip unit. The above technical solution conceived by the present application, compared with the prior art, this solution uses multiple naked chips to be directly crimped in series and packaged as a whole. Compared with the traditional method of crimping the chips in series after packaging, the module under the overall series crimping packaging design of this design has smaller parasitic inductance, which can increase the opening speed of the module and has less loss, which is conducive to improving the system response speed with the participation of this module. Moreover, the module designed by this application is highly integrated and can be directly connected to the external circuit, which is easy to use. At the same time, the module obtained by this design scheme has an extremely small volume and is easier to miniaturize, which is conducive to saving space.

[0006] As a further preferred embodiment, the bare chip has a concave connecting portion, an interconnection member is embedded in the connecting portion, and two adjacent bare chips are connected in series via the interconnection member.

[0007] As a further preferred embodiment, the busbars extend through the peripheral side of the packaging cylinder, and the ends of the two busbars extending through the peripheral side are staggered.

[0008] As a further preferred embodiment, the elastic buffer unit includes a connecting seat, an elastic member and a supporting seat, the connecting seat is connected to the supporting seat through the elastic member, the end of the connecting seat away from the supporting seat is in contact with the pressure plate, and the end of the supporting seat away from the connecting seat is in contact with the bus.

[0009] As a further preferred embodiment, the crimping submodule further includes a positioning piece, and positioning holes are provided at the centers of the end faces of the support seat and the bus bar, and the positioning piece is embedded in the positioning holes of the support seat and the bus bar.

[0010] As a further preference, the adjusting unit includes a screw and a nut, one end of the screw is threadedly connected to a certain pressing plate, and the other end passes through another pressing plate and is threadedly connected to the nut.

[0011] As a further preference, the end surface of the packaging cylinder is provided with a through hole for the screw to pass through.

[0012] As a further preferred embodiment, the outer peripheral wall of the inner cylinder is slidably fitted with the inner peripheral wall of the outer cylinder, and the inner peripheral wall of the inner cylinder is slidably fitted with the outer peripheral surface of the pressure plate.

[0013] As a further preferred embodiment, a protruding flange is provided on the outer periphery of one end of the inner cylinder facing away from the outer cylinder, and the flange can be in contact with the end surface of the outer cylinder.

[0014] As a further preference, the inner cylinder is detachably connected to the outer cylinder.

[0015] In general, the above technical solutions conceived by this application have the following technical advantages compared with the existing technologies: 1. This application utilizes multiple bare chips crimped in series and packaged as a whole. This eliminates the risk of current flowing through the package and generating additional inductance. This results in a module with low inductance and a very high turn-on speed, which helps improve the response speed of the system incorporating this module.

[0016] 2. This application utilizes an integrated multi-chip package and staggered placement of the busbars at both ends, resulting in excellent insulation and strong resistance to high-voltage breakdown.

[0017] 3. The module designed in this application has an extremely small size, achieving miniaturization optimization of the module. Moreover, when a single chip fails, the module can be removed and replaced with a new one, thus ensuring that the module can be replaced at low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the traditional chip series module mentioned in the background technology of this application; Figure 2 This is a schematic structural diagram of a multi-chip serial compression module provided in an embodiment of the present application; Figure 3 This is an exploded view of a multi-chip serial compression module provided in an embodiment of the present application; Figure 4 is a schematic diagram of a crimping submodule provided in an embodiment of the present application; Figure 5 is an exploded view of a chip unit provided in an embodiment of the present application; Figure 6 is an exploded view of the elastic buffer unit provided in an embodiment of the present application; Figure 7 This is a schematic structural diagram of the inner cylinder provided in an embodiment of the present application; Figure 8 This is a schematic structural diagram of the outer cylinder provided in an embodiment of the present application; Figure 9 This is an electrical sensing diagram of the module provided in the embodiment of the present application; Figure 10 This is an electrical sensing diagram of a traditional module provided in an embodiment of the present application; Figure 11 is a test circuit diagram provided in an embodiment of the present application; Figure 12 This is a comparison diagram of the discharge current waveforms of the module provided in the embodiment of the present application and the traditional module.

[0019] Throughout the drawings, the same reference numerals are used to denote the same elements or structures, wherein: 1. Chip unit; 1-1. Bare chip; 1-1a. Connecting part; 1-2. Bus; 1-3. Interconnecting member; 2. Adjusting unit; 2-1. Screw; 2-2. Nut; 3. Elastic buffer unit; 3-1. Connecting seat; 3-1a. Mounting hole; 3-2. Elastic member; 3-3. Support seat; 3-3a. Plate body; 3-3b. Column body; 4. Press plate; 5. Inner cylinder; 5-1. Flanging; 5-2. Perforation; 5-3. Through hole; 6. Outer cylinder; 6-1. Accommodating groove; 6-2. Threaded hole; 7. Positioning member; 8. Square groove. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0021] The following is combined with Figure 2-Figure 12 This application is described in further detail.

[0022] The embodiment of the present application discloses a multi-chip serial compression module. Figure 2-Figure 4 The multi-chip serial crimping module includes a crimping submodule and a packaging submodule, wherein: the crimping submodule includes a chip unit 1, an adjustment unit 2, two elastic buffer units 3 and two pressure plates 4, the chip unit 1 is located between the two elastic buffer units 3, the chip unit 1 and the two elastic buffer units 3 are stacked together between the two pressure plates 4, the chip unit 1 includes a plurality of stacked and serially connected bare chips 1-1, the chip unit 1 also includes two bus bars 1-2 connected at both ends of the whole formed by the plurality of bare chips 1-1; the two pressure plates 4 are crimped at the upper and lower ends of the whole formed by the chip unit 1 and the two elastic buffer units 3 with adjustable spacing through the adjustment unit 2; and the packaging submodule includes an inner cylinder 5 and an outer cylinder 6 with a port, the inner cylinder 5 and the outer cylinder 6 are connected to each other along the port to form a packaging cylinder covering the crimping submodule, and the bus bars 1-2 in the crimping submodule extend out of the packaging cylinder for connection to an external circuit, and the inner cavity of the packaging cylinder is filled with an insulating medium for packaging the chip unit 1 (not shown in the figure).

[0023] In this design, multiple bare chips 1-1 are directly crimped in series and packaged as a whole. Compared to the traditional method of crimping chips in series after tube and shell packaging, the module with this overall series crimping packaging design has a smaller parasitic inductance, which can increase the module's activation speed and improve the system response speed when the module is involved. Moreover, the module of this design is highly integrated, with integrated clamps and busbars. This design allows the module to be directly connected to the external circuit, making it extremely convenient to use. At the same time, the module obtained by this design has an extremely small size, which is easier to miniaturize, which helps save space.

[0024] Furthermore, in some embodiments, two adjacent bare chips 1-1 are connected in series via an interconnection member 1-3. Figure 5 As shown, the bare chip 1-1 has a concave connecting portion 1-1a, and the interconnection member 1-3 can be embedded in the connecting portion 1-1a. After the interconnection member 1-3 is embedded in the connecting portion 1-1a, the top of the interconnection member 1-3 protrudes or is flush with the upper surface of the bare chip 1-1 where the connecting portion 1-1a is located, so as to contact and connect with the adjacent upper bare chip 1-1.

[0025] Preferably, the interconnection member 1-3 is made of copper, and the bare chip 1-1 is preferably a disc-shaped RSD chip, with a large-sized groove-shaped connecting portion 1-1a in the middle of its top surface, and a glue strip adhered to its outer edge.

[0026] Further, such as Figure 2 As shown, in some embodiments, the busbars 1-2 extend through the periphery of the package cylinder, and the ends of the two busbars 1-2 extending through the package cylinder are staggered in space. In addition, two through holes are formed at the ends of the busbars 1-2 extending through the package cylinder for connecting to an external circuit.

[0027] In this design, by staggering the two busbars 1-2, the insulation distance can be increased, the insulation performance of the module can be improved, and the module is less likely to break down in high-voltage applications.

[0028] Further, such as Figure 4 、 Figure 6 As shown, in some embodiments, the elastic buffer unit 3 includes a connecting seat 3-1, an elastic member 3-2 and a supporting seat 3-3, wherein the connecting seat 3-1 is connected to the supporting seat 3-3 through the elastic member 3-2, the end of the connecting seat 3-1 away from the supporting seat 3-3 is in contact with the pressure plate 4, and the end of the supporting seat 3-3 away from the connecting seat 3-1 is in contact with the bus 1-2.

[0029] Further preferably, the support seat 3-3 includes a plate portion 3-3a and a column portion 3-3b, and the elastic member 3-2 includes, but is not limited to, a disc spring. When a disc spring is used, the disc spring is sleeved on the column portion 3-3b. Generally speaking, multiple disc springs can be provided, but it should be ensured that the multiple disc springs are stacked and sleeved together on the column portion 3-3b, and that one end of the whole formed by the multiple disc springs is in contact with the plate portion 3-3a, and the other end protrudes from the column portion 3-3b and is in contact with the connecting seat 3-1. Of course, in some other embodiments, the connecting seat 3-1 can also be discarded, and the pressure plate 4 can be used to directly apply pressure to the elastic member 3-2.

[0030] like Figure 6 As shown, in some specific embodiments, the connector 3-1 is provided with a mounting hole 3-1a for the column portion 3-3b to extend into. After the elastic member 3-2 is mounted on the column portion 3-3b, the main body protrudes from the elastic member 3-2 and extends into the mounting hole 3-1a. The mounting hole 3-1a has a space margin for the axial movement of the column portion 3-3b, so that the column portion 3-3b does not form an end-face contact with the connector 3-1. When a force is applied to the connector 3-1, the force can be transmitted to the support base 3-3 through the elastic deformation process of the elastic member 3-2, and then transmitted to the bus 1-2 through the support base 3-3, applying pressure to the series-connected chips.

[0031] Further, such as Figure 6 As shown, in some embodiments, the crimping submodule also includes a positioning member 7, and positioning holes adapted for the positioning member 7 are provided at the centers of the end faces of the support seat 3-3 and the bus 1-2. The positioning member 7 is assembled at the positioning holes of the support seat 3-3 and the bus 1-2 to enable the support seat 3-3 and the bus 1-2 to be precisely docked, wherein the positioning member 7 includes but is not limited to the use of a positioning pin.

[0032] Furthermore, in some embodiments, the end surfaces of the pressure plates 4 are provided with positioning grooves (not shown) for positioning the connecting seat 3-1. That is, the facing sides of the two pressure plates 4 are each provided with positioning grooves for positioning the supporting seat 3-3. The inner diameter of the positioning grooves is preferably the same as the outer diameter of the connecting seat 3-1, so that the elastic buffer structure 3 can be inserted into the pressure plates 4 to form a fixed position for the elastic buffer structure 3.

[0033] Further, such as Figure 4 As shown, in some embodiments, the adjustment unit 2 includes a screw 2-1 and a nut 2-2. One end of the screw 2-1 is threadedly connected to one pressure plate 4, and the other end extends through the other pressure plate 4 and is threadedly connected to the nut 2-2. Preferably, multiple adjustment units 2 are evenly distributed around the circumference of the pressure plate 4, and multiple adjustment units 2 are evenly distributed around the chip unit 1. Further preferably, in some embodiments, both ends of the screw 2-1 are threadedly assembled with nuts 2-2.

[0034] Generally speaking, a through hole is provided on the pressure plate 4 for the screw 2-1 to pass axially (i.e., not threadedly connected). The diameter of the through hole is preferably slightly larger than the diameter of the screw 2-1, so that the screw 2-1 can just pass through without contacting the side wall of the through hole, and an internal threaded hole matching the screw 2-1 is provided on the pressure plate 4 at the bottom.

[0035] When actually assembling this module, the pressure plate 4 with the internal threaded hole can be placed flat, and then the screw 2-1 can be screwed into the internal threaded hole of the pressure plate 4 from top to bottom, and protrude a length the same as the height of the nut 2-2. Then, the nut 2-2 is screwed onto this protruding section of the screw 2-1 to fix the screw 2-1 so that there is no vertical relative displacement between the screw 2-1 and the through hole at the bottom.

[0036] Then, install the chip unit 1 and two elastic buffer units 3, and then align another pressure plate 4 with a through hole with the screw 2-1 from top to bottom. When the positioning groove on the pressure plate 4 is put together with the elastic buffer structure 3 at the top, the position of the top pressure plate 4 is determined, and then screw another nut 2-2 on the part of the pressure plate 4 protruding from the top of the screw 2-1 to achieve fixation between the two pressure plates 4.

[0037] Furthermore, in some embodiments, the outer circumferential wall of the inner cylinder 5 is slidably fitted with the inner circumferential wall of the outer cylinder 6, and the inner circumferential wall of the inner cylinder 5 is slidably fitted with the outer circumferential surface of the pressure plate 4, ensuring that the inner cylinder 5 and the outer cylinder 6 are tightly assembled.

[0038] Further, such as Figure 3 、 Figure 7 As shown, in some embodiments, a flange 5-1 is provided on the outer periphery of one end of the inner cylinder 5 facing away from the outer cylinder 6. The flange 5-1 can contact the end surface of the outer cylinder 6 to limit the assembly of the inner cylinder 5 and the outer cylinder 6.

[0039] Furthermore, in some embodiments, the inner cylinder 5 and the outer cylinder 6 are detachably connected to form a single body via fasteners. The fasteners include, but are not limited to, bolts. When bolts are used, threaded holes 6-2 are provided at the open end surface of the inner cylinder 5, and corresponding through holes 5-3 for the bolt's shank to pass through are provided at the flange 5-1 of the outer cylinder 6.

[0040] Furthermore, the end surface of the packaging cylinder is provided with a through hole 5-2 for the screw 2-1 to pass through, and a receiving groove 6-1 for accommodating the nut 2-2.

[0041] Specifically, if Figure 8 As shown, in some embodiments, the inner wall surface of the outer cylinder 6 is provided with a plurality of accommodating grooves 6-1, which are used to accommodate the nut 2-2 at the end of the screw 2-1. The depth of the accommodating groove 6-1 is the same as the thickness of the nut 2-2. When the crimping sub-module is installed into the packaging sub-module, the horizontal displacement and rotation of the crimping sub-module are limited by the contact fit between the accommodating groove 6-1 and the nut 2-2.

[0042] like Figure 7 As shown, the inner wall of the inner cylinder 5 is provided with perforations 5-2, preferably stepped holes (i.e., holes 5-2 with stepped surfaces). These perforations 5-2 are used to mount the top nut 2-2 of the screw 2-1 and to allow the screw 2-1 to pass through. When a small number of bare chips 1-1 are connected in series, the length of the screw 2-1 protruding from the upper pressure plate 4 is longer. In this case, the protruding portion of the screw 2-1 passes through these three perforations 5-2. This design allows the module to accommodate a wide variety of bare chips 1-1 connected in series without having to modify the length of the screw 2-1, thereby increasing the module's application flexibility.

[0043] Furthermore, in some embodiments, a notch is provided at the port wall of the inner cylinder 5 and the outer cylinder 6. When the inner cylinder 5 and the outer cylinder 6 are fitted together, the inner cylinder 5 and the outer cylinder 6 form a through hole 5-2 at the notch for the bus 1-2 to pass through, and the bus 1-2 does not contact the inner wall of the through hole 5-2.

[0044] Specifically, in some embodiments, two square grooves 8, one deep and one shallow, are provided axially spaced apart on the port wall of the outer cylinder 6. The height of the remaining wall of the deep square groove 8 after cutting is lower than the sum of the heights of the lower pressure plate 4 and the elastic buffer unit 3, so that the bus 1-2 can be located in the slotted position. The height of the shallower square groove 8 is equal to the height of the deeper square groove 8 minus the total height of the chips to be connected in series. For flexible application, a certain margin can be left, that is, the height of a few chips can be reduced according to actual needs. This can make the groove deeper, so that when there are fewer chips, the bus 1-2 will not contact the packaging cylinder. In addition, the height of the cylindrical portion of the inner cylinder 5 (excluding the flange 5-1) is less than the depth of the deeper square groove 8 of the outer cylinder 6, so that the bus 1-2 can pass through without contact.

[0045] During installation, the part with a larger radius in the inner cylinder 5 contacts the outer cylinder 6, so that the inner cylinder 5 cannot move further downward; in addition, a square groove 8 is also opened on the upper inner cylinder 5, and the height of this groove is greater than the height of the uncut part of the shallower groove of the outer cylinder 6. Therefore, after the inner cylinder 5 and the outer cylinder 6 are installed together, a through hole is left together to allow the bus 1-2 to pass through.

[0046] Furthermore, in some embodiments, the inner cylinder 5 and the outer cylinder 6 are made of epoxy material, which has low hardness and good toughness.

[0047] Compared to traditional ceramic tubes and tubes for multi-chip serial connection, if more chips are connected in series, the overall module height increases, meaning the ceramic used on the sides also becomes taller. This tall ceramic structure is prone to breakage in the event of impact or pressure. In this design, the structural shell formed by the inner and outer tubes 5 and 6 is made of epoxy material, which has a low hardness and good toughness, making it difficult to break in the event of impact, thereby providing higher reliability.

[0048] Furthermore, compared to traditional modules, their overall height makes stacking modules in series inconvenient. Instead, they must be placed side by side. This necessitates a bend in the busbars connecting the modules, making the design more complex and lengthy, leading to higher inductance. Furthermore, this side-by-side arrangement requires the modules to occupy a larger space, hindering system miniaturization.

[0049] The modules designed in this application are relatively small, making them easy to stack and place, fully utilizing the vertical space to achieve a 3D distribution, thereby reducing the system size. Furthermore, when connected in series, the modules only need to be placed in a straight line, one facing up and one facing down. This arrangement requires only one busbar section, making it easy to implement and reducing inductance.

[0050] Furthermore, in some embodiments, the insulating medium includes, but is not limited to, materials such as epoxy resin. The insulating medium is preferably cast and formed after the inner cylinder 5 and outer cylinder 6 are assembled. The use of the insulating medium improves the breakdown electric field strength within the module, ensuring good insulation properties. It also prevents components from being directly exposed to air, providing dust and moisture protection, thereby enhancing module reliability.

[0051] Compared with traditional designs, the tube shell a in traditional design modules is exposed to the air. When the current is too large, the tube shell a will be subjected to a large lateral electric stress. The actual contact area between the tube shell a and the tube shell a is actually not large. Therefore, the lateral electric stress can easily exceed the friction between the tube shell a, which may cause the tube shell a to fly out, causing the module to disintegrate, posing a certain safety hazard. The structure proposed in this application adopts a direct series connection solution for chips. There is a large contact area between the chips, and the friction is large, which is not easy to cause the chip to fly out under the action of electric stress. Moreover, the module of this design has a packaging shell. If the chip flies out under extreme conditions, it will not endanger the operator, but will be scattered inside the module, which has a higher safety. ↔ Under this design, the module is detachable as a whole. When an individual chip fails, the module can be disassembled and the faulty chip can be replaced, thereby ensuring that the module can be replaced at a low cost, with excellent economy and high reliability.

[0052] In particular, this design module is specifically designed and optimized for pulsed power devices (RSDs), a specific type of power semiconductor device. These devices lack a gate, only a cathode and an anode (i.e., two busbars 1-2). This eliminates the need to consider gate connection and lead generation, resulting in an extremely simple and reliable structure.

[0053] For ease of understanding, Figure 9 The inductive sensing diagram of a chip series crimping module made based on this design is shown. Seven bare chips 1-1 are crimped in series in the module. The resistance measurement value of the module is 0.00005Ω, and the inductance measurement value is 80.35205nH.

[0054] In contrast, Figure 10The paper shows an inductive sensing diagram of a traditional chip series module. The traditional module is a solution that uses a tube shell to package the chip and then connects the tube shells in series (connecting seven tube shells with the same specification chips in series). Figure 1 As shown in the scheme. Figure 10 As shown in the figure, the resistance measurement value of the traditional module is 0.00006Ω, and the inductance measurement value is 172.06942nH, indicating that this design can significantly reduce the inductance compared with the traditional design.

[0055] Generally speaking, in Figure 9 and Figure 10 In the table, “Inductance” means “Inductance”; “Units” means “Units”; “Original” means “Original”; “All Freqs” means “All Freqs”; “Self Terms” means “Self Terms”; “View” means “View”; “Format” means “Format”; “Passivity” means “Passivity”; “Export” means “Export”; “Freq” means “Freq”; and “Source” means “Source”.

[0056] For ease of understanding, Figure 11 The test circuit diagram shows that the extracted module inductance is connected to the RLC discharge circuit in the simulation to test the current waveform. Here, the capacitor C is selected as 2nF, the resistor R is selected as 20Ω, and the DC power supply charges the capacitor C to 100V. Simulation tests are performed on a traditional press-fit module (inductance is 172nH) and the module proposed in this application (inductance is 80nH) respectively (the RSD stack is a multi-chip series module).

[0057] like Figure 12 The test comparison diagram shown shows that since the module proposed in this application has smaller inductance, the current rise speed of the module proposed in this application is faster and the current amplitude is larger than that of the traditional module, which has significant progressive significance.

[0058] It should be understood that expressions such as "include" and "may include" used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as "include" and / or "have" may be interpreted as indicating a specific characteristic, number, operation, constituent element, component, or combination thereof, but may not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0059] It should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0060] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0061] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0062] It is easy for those skilled in the art to understand that the above is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A multi-chip serial compression module, characterized in that: It includes a crimping submodule and a packaging submodule, wherein: The crimping submodule comprises a chip unit (1), an adjustment unit (2), two elastic buffer units (3) and two pressing plates (4); the chip unit (1) is located between the two elastic buffer units (3); the chip unit (1) comprises a plurality of bare chips (1-1) stacked and connected in series, and two bus bars (1-2) connected to the upper and lower ends of the whole formed by the plurality of bare chips (1-1); and the two pressing plates (4) are crimped to the upper and lower ends of the whole formed by the chip unit (1) and the two elastic buffer units (3) with adjustable spacing through the adjustment unit (2); The packaging submodule comprises an inner cylinder (5) and an outer cylinder (6) with ports, wherein the inner cylinder (5) and the outer cylinder (6) are sleeved and connected to each other along the ports to form a packaging cylinder that covers the crimping submodule and allows the busbar (1-2) to extend, and the inner cavity of the packaging cylinder is filled with an insulating medium for the packaging chip unit (1).

2. The multi-chip serial compression module according to claim 1, characterized in that: The busbars (1-2) penetrate and extend out of the peripheral side of the packaging cylinder, and the ends of the two busbars (1-2) that penetrate and extend out are distributed in a staggered manner.

3. The multi-chip serial compression module according to claim 1, wherein: The bare chip (1-1) has a concave connecting portion (1-1a), an interconnection component (1-3) is embedded in the connecting portion (1-1a), and two adjacent bare chips (1-1) are connected in series via the interconnection component (1-3).

4. The multi-chip serial compression module according to claim 1, wherein: The elastic buffer unit (3) comprises a connecting seat (3-1), an elastic member (3-2) and a supporting seat (3-3); the connecting seat (3-1) is connected to the supporting seat (3-3) via the elastic member (3-2); one end of the connecting seat (3-1) away from the supporting seat (3-3) contacts the pressure plate (4); and one end of the supporting seat (3-3) away from the connecting seat (3-1) contacts the busbar (1-2).

5. The multi-chip serial compression module according to claim 4, characterized in that: The crimping submodule further includes a positioning member (7), positioning holes are provided at the centers of the end faces of the support seat (3-3) and the busbar (1-2), and the positioning member (7) is embedded in the positioning holes of the support seat (3-3) and the busbar (1-2).

6. The multi-chip serial compression module according to claim 1, wherein: The adjusting unit (2) comprises a screw (2-1) and a nut (2-2); one end of the screw (2-1) is threadedly connected to a certain pressing plate (4), and the other end extends through another pressing plate (4) and is threadedly connected to the nut (2-2).

7. The multi-chip serial compression module according to claim 6, characterized in that: The end surface of the packaging cylinder is provided with a through hole (5-2) for the screw (2-1) to pass through.

8. The multi-chip serial compression module according to claim 1, wherein: The outer peripheral wall of the inner cylinder (5) is slidably fitted with the inner peripheral wall of the outer cylinder (6), and the inner peripheral wall of the inner cylinder (5) is slidably fitted with the outer peripheral surface of the pressing plate (4).

9. The multi-chip serial compression module according to claim 8, characterized in that: A protruding flange (5-1) is provided on the outer periphery of one end of the inner cylinder (5) facing away from the outer cylinder (6), and the flange (5-1) can contact the end surface of the outer cylinder (6).

10. The multi-chip serial compression module according to any one of claims 1 to 9, characterized in that: The inner cylinder (5) and the outer cylinder (6) are detachably connected.

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