Inductance element structure and multilayer circuit board structure

Abstract

The utility model belongs to the technical field of electromagnetism, and provides an inductance element structure and a multilayer circuit board structure, the inductance element structure comprises a magnetic core and a winding which is arranged in the magnetic core and penetrates out of the magnetic core, and the winding is provided with a terminal at an opening of the magnetic core; meanwhile, a conductor sheet is additionally arranged on the magnetic core of the inductance element structure, and the conductor sheet and the terminal are simultaneously used for forming external electric connection; when the inductance element structure is connected with a PCB (Printed Circuit Board), a novel multilayer circuit board structure can be formed, the space is saved, the packaging volume of a PCB multilayer product can be further reduced, and the energy storage filtering inductance function of the inductance element structure can be exerted while the through-flow is realized; meanwhile, due to the fact that the conductor piece is attached to the magnetic core, heat dissipation of the magnetic core can be accelerated, working loss of the inductance element structure is reduced, and overall power consumption of the multi-layer circuit board structure is reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of circuit manufacturing and the field of electromagnetic technology, and relates to an inductance element structure, a multilayer circuit board structure and a multilayer circuit board structure. BACKGROUND

[0002] In recent years, with the rapid popularization of portable electronic products such as smart phones, tablet computers and wearable devices, users have higher requirements for the miniaturization, lightweight and high performance of devices. Electronic device manufacturers are constantly pursuing more compact designs to achieve thinner and lighter product forms. This miniaturization trend not only reflects in the external structure, but also goes deep into the internal circuit design. Traditional single-layer circuit boards have been difficult to meet the requirements of complex functions, and the demand for miniaturized and micro-sized multilayer board structures is increasing.

[0003] In existing multilayer board connection technologies, the most commonly used method is to connect different layers of circuit boards through a wire harness or flat cable. For example, CN215187923U discloses a mounting structure of a multilayer PCB, which includes two or more PCBs, each PCB is provided with a mounting hole, and all PCBs are positioned and stacked by a stacking positioning assembly. CN103517578B discloses a multilayer PCB manufacturing method and a multilayer PCB, which realizes the connection between the circuit layer of the first back-drilling layer and the metal layer of the second back-drilling layer, as well as the connection between the circuit layers of the inner layers, reduces the area of the PCB occupied by the inner conductive holes and the conductive vias, and is beneficial to the production of high-density PCBs.

[0004] It can be seen that the existing technology currently only solves the connection problem between multilayer boards, and the method used is to stack the multilayer boards, and the layers are connected by metal wire harnesses. Although this method is simple and easy to implement, it has obvious disadvantages in actual application. First of all, this connection method will significantly increase the connection resistance between two or more boards, leading to an increase in overall circuit impedance, heat generation and energy consumption. Moreover, the complex arrangement of the wire harnesses not only makes the assembly and manufacturing process complex, but also affects the internal aesthetics of the product, affecting maintenance and replacement.

[0005] Moreover, the main focus of current research and development in the application market and field still remains on reducing the size of electronic components in the circuit and the individual loss, and there is little involvement in reducing the connection circuit loss between boards and the heat dissipation of components. Therefore, in order to realize a miniaturized multilayer circuit board structure that can not only reduce the packaging size but also improve the heat dissipation capacity of components, a new solution needs to be found. Utility model content

[0006] In view of the problems in the prior art, the utility model discloses a kind of inductance element structure and a kind of multilayer circuit board structure, the inductance element structure includes magnetic core and the winding being arranged in magnetic core and passing through magnetic core, winding has terminal at the opening of magnetic core;At the same time, the magnetic core of the inductance element structure is additionally provided with conductor sheet, the conductor sheet is simultaneously used to form external electrical connection with the terminal;PCB board can be formed by using the inductance element structure connection new multilayer circuit board structure, save space, it is favorable to further reduce the packaging volume of PCB multilayer product, and energy storage filter inductance effect of inductance element structure itself can be played while realizing through flow;At the same time, since conductor sheet and magnetic core are attached, the heat dissipation of magnetic core can also be accelerated, reduce inductance element structure operating loss, and the overall power consumption of multilayer circuit board structure.

[0007] To achieve this purpose, the utility model adopts the following technical solutions:

[0008] The utility model provides a kind of inductance element structure, the inductance element structure includes:

[0009] Magnetic core, the magnetic core is provided with at least one containing space inside, and the two ends of the containing space are respectively formed opening in the top surface and bottom surface of the magnetic core;

[0010] Winding, including coil;The winding is arranged in the containing space, and the winding has terminal at the opening, and the terminal is electrically connected with the coil;The terminal is used to form external electrical connection;

[0011] Conductor sheet, set on the side surface of the magnetic core, and the two ends of the conductor sheet respectively extend towards the top surface and bottom surface of the magnetic core, until end face and the terminal are in the same plane;The conductor sheet is used to form external electrical connection.

[0012] The utility model provides a novel integrated inductance element structure, the winding of this inductance element structure is arranged in the magnetic core and the winding that goes out the magnetic core forms the terminal for external electric connection, simultaneously, the magnetic core of inductance element structure still additionally is provided with the conductor sheet, the conductor sheet is used for forming external electric connection with the terminal simultaneously, therefore, the inductance element structure can be used to make the electric connection between two circuit boards, forms the novel multilayer circuit board structure, is advantageous in saving space, is also advantageous in further reducing the packaging volume of PCB multilayer product, and can realize through -flow simultaneously, also can play the energy storage filter inductance function of inductance element structure itself, simultaneously, because the conductor sheet is attached to the magnetic core in the inductance element structure, the heat dissipation of the magnetic core can also be accelerated, the working loss of inductance element structure and the overall power consumption of multilayer circuit board structure are reduced.

[0013] The following is the preferred technical scheme of the utility model, but not as the restriction of the technical scheme provided by the utility model, through the following technical scheme, the technical purpose and beneficial effect of the utility model can be better achieved and realized.

[0014] As the preferred technical scheme of the utility model, the conductor sheet comprises a metal copper sheet or other material with excellent heat conduction and conductivity.

[0015] As the preferred technical scheme of the utility model, the shape of the winding comprises any one of straight line type, curve type, U-shaped type or Z-shaped type, and the accommodating space is arranged in the shape of the winding.

[0016] As the preferred technical scheme of the utility model, the number of the conductor sheet should be designed and selected according to the specific needs of the upper and lower PCBs.

[0017] As the preferred technical scheme of the utility model, the two ends of the conductor sheet extend to the top surface and the bottom surface of the magnetic core respectively.

[0018] As the preferred technical scheme of the utility model, the outer surface of the magnetic core is provided with a coating material in the area other than the position of the terminal and the position of the conductor sheet to protect the magnetic core (i.e. as a protective layer).

[0019] As the preferred technical scheme of the present application, the coating comprises a paint layer and / or a resin layer, and the thickness of the coating is 0.02-0.2 mm.

[0020] As the preferred technical scheme of the present application, a tin solder layer is arranged between the conductor sheet and the surface of the magnetic core, and the tin solder layer comprises a copper-nickel-tin layer or a nickel-silver layer, for fixing the conductor sheet.

[0021] Exemplarily, the present application provides a manufacturing method of the inductance element structure of the first aspect, and the manufacturing method comprises:

[0022] (1) pre-preparing the winding; the magnetic core is divided into a first part and a second part, the first part is pre-prepared, and the first part has an internal structure of the magnetic core in the accommodating space, and the internal structure is used for receiving the winding;

[0023] (2) assembling the winding and the first part to obtain a semi-assembly;

[0024] (3) pre-preparing the second part, assembling the second part on the semi-assembly to form the magnetic core, or preparing the second part on the semi-assembly to form the magnetic core to obtain a semi-finished product;

[0025] (4) after the obtained semi-finished product is sequentially subjected to heating and curing, surface coating to form a coating, and removing the coating at the position of the terminal and the setting position of the conductor sheet, the conductor sheet is assembled to obtain the inductance element structure.

[0026] As the preferred technical scheme of the present application, the internal structure comprises a receiving boss.

[0027] As the preferred technical scheme of the present application, in step (3), the method for preparing the second part on the semi-assembly comprises placing the semi-assembly in a mold cavity, filling the mold cavity with a magnetic material, and pressing to form the second part, thereby constituting a complete magnetic core to obtain the semi-finished product.

[0028] Preferably, after assembling the second part on the semi-assembly in step (3), pressing is performed to form the magnetic core.

[0029] As the preferred technical scheme of the present application, in step (4), after heating and curing, first shaping processing is performed, and the shaping processing chamfers the edges of the magnetic core to remove the right angles and edges around the magnetic core.

[0030] Preferably, in step (4), the surface coating method comprises spraying, the coating comprises paint and / or resin, and the thickness of the coating is 0.02-0.2 mm.

[0031] Preferably, in step (4), the method for removing the covering at the position of the terminal and the conductor sheet setting position comprises laser stripping and / or grinding until the fresh conductor section is exposed.

[0032] As the preferred technical scheme of the present application, in step (4), the method for assembling the conductor sheet comprises setting a tin solder layer on the surface of the magnetic core, fixing the conductor sheet on the tin solder layer to realize fixation, and completing the assembly.

[0033] Preferably, the method for setting the tin solder layer comprises electroplating to prepare a copper-nickel-tin layer or dipping tin to prepare a nickel-silver layer.

[0034] In the second aspect, the present application provides a multilayer circuit board structure comprising at least two PCBs, and the inductor element structure of the first aspect is arranged between adjacent two PCBs.

[0035] Compared with the prior art, the present application has at least the following beneficial effects:

[0036] The present application provides a novel integrated inductor. The winding of the inductor element structure is arranged inside the magnetic core and penetrates the winding of the magnetic core to form a terminal for external electrical connection. Meanwhile, the magnetic core of the inductor element structure is additionally provided with a conductor sheet, and the conductor sheet is used together with the terminal to form external electrical connection. Therefore, the inductor element structure can be used to form electrical connection between two circuit boards, form a novel multilayer circuit board structure, save space, further reduce the packaging volume of the multilayer PCB product, realize through flow, and play the energy storage and filtering inductance role of the inductor element structure itself. Meanwhile, since the conductor sheet is attached to the magnetic core in the inductor element structure, the heat dissipation of the magnetic core can be accelerated, the working loss of the inductor element structure and the overall power consumption of the multilayer circuit board structure can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 is a schematic view of the inductor element structure of embodiment 1.

[0038] Figure 2 is a schematic view of the multilayer circuit board structure of application example 1.

[0039] Figure 3 is a schematic view of the winding in the inductor element structure of embodiment 1.

[0040] Figure 4 is a schematic view of the first part of the magnetic core in the inductor element structure of embodiment 1.

[0041] Figure 5 is a schematic view of the assembly of the first part of the magnetic core and the winding of embodiment 1.

[0042] Figure 6 is a schematic view of the second part of the magnetic core in the inductance element structure of Example 1.

[0043] Figure 7 is a schematic view of the assembly of the second part of the magnetic core and the half-assembly of Example 1.

[0044] Figure 8 is a schematic view of the obtained half-finished product of Example 1.

[0045] Figure 9 is a schematic view of the conductor sheet of Example 1.

[0046] Figures 1 to 9 M: 1-magnetic core, 11-first part, 12-second part, 2-winding, 3-conductor sheet, 4-PCB board.

[0047] Figure 10 is a comparison chart of the surface temperature of the inductance element structures obtained in Example 1 and Comparative Example 1 when passing through the same current.

[0048] Figure 11 is a comparison chart of the efficiency difference of the multi-layer circuit boards obtained in Application Example 1 and Application Comparative Example 1 under different currents. DETAILED DESCRIPTION

[0049] The technical solutions of the present application will be further illustrated by the specific embodiments.

[0050] Those skilled in the art should understand that the embodiments are only to help understand the present application and should not be regarded as specific limitations of the present application.

[0051] In some specific embodiments, the present application provides an inductance element structure, as shown in Figure 1 and Figures 3 to 9 The inductance element structure comprises:

[0052] A magnetic core 1, which is internally provided with at least one accommodating space, and the two ends of the accommodating space form openings on the top surface and the bottom surface of the magnetic core 1, respectively;

[0053] A winding 2, which comprises a coil; the winding 2 is arranged in the accommodating space, and the winding 2 has a terminal electrically connected with the coil at the opening; the terminal is used to form an external electrical connection;

[0054] A conductor sheet 3, which is arranged on the side surface of the magnetic core 1, and the two ends of the conductor sheet 3 extend towards the top surface and the bottom surface of the magnetic core 1, respectively, until the end surface is in the same plane as the terminal; the conductor sheet 3 is used to form an external electrical connection.

[0055] In one embodiment, the conductor sheet 3 comprises a metal copper sheet.

[0056] In one embodiment, the winding 2 has a metal conducting effect, and the number thereof can be one or more.

[0057] In one embodiment, the shapes of the different windings 2 can be the same or different.

[0058] In one embodiment, the shape of the winding 2 comprises any one of a straight line type, a curved line type, a U-shaped type or a Z-shaped type; the accommodating space is arranged in the shape of the winding 2.

[0059] In one embodiment, the two ends of the accommodating space form openings on different magnetic surfaces (i.e. top surface and bottom surface), which means that the two ends of the winding 2 can pass out from the different magnetic surfaces, and the part passing out and exposed forms the terminal, which enables the winding 2 to form an electrical connection with the outside.

[0060] In one embodiment, the number of the conductor sheet 3 can be one or more, and the conductor sheet 3 can be arranged in a symmetrical manner or an asymmetrical manner around the magnetic core 1.

[0061] Further, the number of the conductor sheet 3 is an even number, and the conductor sheet 3 is arranged symmetrically on two opposite sides of the magnetic core 1.

[0062] In one embodiment, the two ends of the conductor sheet extend to the top surface and the bottom surface of the magnetic core, respectively.

[0063] It should be noted that, in order to realize external electrical connection, the shape of the winding 2, the position of the terminal (the position of the opening), the size of the winding 2, the number of the winding 2, the position of the terminal (the position of the opening), the size of the terminal (the size of the opening), the shape of the conductor sheet 3, the size of the conductor sheet 3, the arrangement position of the conductor sheet 3, etc. should be adjusted reasonably according to the needs to adapt to the position and size of the current flow.

[0064] In one embodiment, the area of the outer surface of the magnetic core, except the position of the terminal and the arrangement position of the conductor sheet, is provided with a coating for protection.

[0065] In one embodiment, the coating comprises a paint layer and / or a resin layer, and the thickness of the coating is 0.02-0.2 mm, for example, it can be 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.10 mm, 0.12 mm, 0.14 mm, 0.16 mm or 0.2 mm, etc., but it is not limited to the listed values, and the values not listed in the above range are also applicable.

[0066] In one embodiment, a solder layer is arranged between the conductor sheet and the surface of the magnetic core, the solder layer comprising a copper-nickel-tin layer or a nickel-silver layer, for fixing the conductor sheet; further, the solder layer can also be used for soldering and fixing the conductor sheet to the PCB.

[0067] In some specific embodiments, the utility model provides a manufacturing method of the inductance element structure, the manufacturing method comprising:

[0068] (1) preform the winding 2; divide the magnetic core 1 into a first part 11 and a second part 12, preform the first part 11, the first part 11 has the internal structure of the magnetic core 1 in the accommodating space, and the internal structure is used for receiving the winding 2;

[0069] (2) assemble the winding 2 with the first part 11 to obtain a half assembly;

[0070] (3) preform the second part 12, assemble the second part 12 on the half assembly to form the magnetic core 1; or, prepare the second part 12 on the half assembly to form the magnetic core 1 to obtain a semi-finished product;

[0071] (4) after the obtained semi-finished product is sequentially subjected to heating and curing, surface coating to form a coating, removing the coating at the position of the terminal and the setting position of the conductor sheet 3, assembling the conductor sheet 3 to obtain the inductance element structure.

[0072] It should be noted that, considering the structure that the winding 2 is arranged in the interior of the magnetic core 1 and is led out, in order to facilitate manufacturing, the manufacturing method first manufactures a half of the magnetic core 1, can make the winding 2 be pre-placed at the position (the internal structure) where it should be arranged, obtain a half assembly, and then assemble the other half of the magnetic core 1 to the plate assembly or directly prepare the second part 12 on the plate assembly to form a complete magnetic core 1.

[0073] In one embodiment, in step (1), the internal structure comprises a receiving boss.

[0074] In one embodiment, in step (3), the method for preparing the second part 12 on the half assembly comprises placing the half assembly in a mold cavity, filling the mold cavity with a magnetic material, and pressing to form the second part 12, constitute a complete magnetic core 1, and obtain the semi-finished product.

[0075] In one embodiment, in step (3), after assembling the second part 12 on the half assembly, pressing is performed to form the magnetic core 1.

[0076] In one embodiment, in step (4), the heating and curing is performed in a protective atmosphere.

[0077] In one embodiment, in step (4), after the heating and curing, a shaping process is first performed, in which the edges of the magnetic core 1 are chamfered to remove the right angles and edges around the magnetic core.

[0078] In one embodiment, in step (4), the surface coating method includes spraying, the coating material includes paint and / or resin, and the thickness of the coating material is controlled to be 0.02 to 0.2 mm.

[0079] In one embodiment, the method for removing the covering at the location of the terminal and the location of the conductor sheet 3 in step (4) includes laser peeling and / or grinding until a fresh conductor cross-section is exposed.

[0080] In one embodiment, step (4) of assembling the conductor sheet 3 includes setting a solder layer on the surface of the magnetic core 1, fixing the conductor sheet 3 to the solder layer to achieve fixation, and completing the assembly.

[0081] In one embodiment, the method for setting the solder layer includes electroplating to prepare a copper-nickel-tin layer or tinning to prepare a nickel-silver layer.

[0082] Example 1

[0083] This embodiment provides an inductor component structure, such as Figure 1 as well as Figures 3 to 9 As shown, the inductor element structure includes:

[0084] The magnetic core 1 has two Z-shaped receiving spaces inside, and each receiving space has an opening at both ends on the opposite top and bottom surfaces of the magnetic core 1.

[0085] Two windings 2, each including a coil, wherein the coil is Z-shaped; the two windings 2 are respectively disposed in the two receiving spaces, and each end of the winding 2 has a terminal at the opening that is electrically connected to the coil; the terminal is used to form an external electrical connection;

[0086] The conductor sheet 3 is in the shape of C, having a main part and a bending part arranged at both ends of the main part respectively; the main part of all the conductor sheets 3 is arranged on the side surface, and both ends extend towards the top surface of the magnetic core 1 and the bottom surface of the magnetic core 1 respectively until the end surface is in the same plane as the terminal to form a bending part parallel to the top surface and the bottom surface of the magnetic core 1 respectively, so that the conductor sheet 3 is clamped on the top surface and the bottom surface of the magnetic core 1 through the bending part, and the bending part is away from the outer surface of the magnetic core 1 to form an external electrical connection.

[0087] The inductance element structure described in the embodiment is obtained by a manufacturing method, and the manufacturing method comprises:

[0088] (1) Preparing the winding 2; dividing the magnetic core 1 into a first part 11 and a second part 12, pre-preparing the first part 11, the first part 11 having an internal structure of the magnetic core 1 in the accommodating space, the internal structure being a receiving boss, the internal structure being used for receiving the winding 2;

[0089] (2) Assembling the winding 2 and the first part 11 to obtain a semi-assembly;

[0090] (3) Placing the semi-assembly in a mold cavity, filling the mold cavity with a magnetic material raw material, and pressing to form the second part 12, thereby constituting a complete magnetic core 1 to obtain the semi-finished product;

[0091] (4) Heating and curing the obtained semi-finished product, and then performing shaping processing on the heating and curing product, the shaping processing chamfering the edges of the magnetic core 1, and the chamfering R is 0.18 mm;

[0092] Then, surface coating is performed, a protective layer is formed by spraying resin, and then the protective layer at the positions of the terminals and the conductor sheet 3 is removed by laser stripping until the fresh conductor cross section is exposed;

[0093] On the fresh conductor cross section exposed on the four conductor sheets 3, a copper-nickel-tin layer is prepared by electroplating, and then the conductor sheet 3 is placed on the copper-nickel-tin layer for assembly and fixation to obtain the inductance element structure.

[0094] Comparative Example 1

[0095] The comparative example provides an inductance element structure which does not contain a conductor sheet 3, and other conditions are the same as those in Example 1.

[0096] The temperature of the surface of the inductance product when the inductance element structures described in Example 1 and Comparative Example 1 pass through the same current is compared as follows: Figure 10 and shown in Table 1:

[0097] Table 1

[0098]

[0099] It can be seen from the data that, in the inductance element structure with external copper sheet, because of the rapid heat dissipation effect of the copper sheet, the surface temperature of the inductance is obviously lower than that of the inductance element structure in the embodiment when the inductance passes through the same current. And with the increase of the current, the temperature rise of the product surface is less than that of the comparative example.

[0100] Application Example 1

[0101] The application example provides a multilayer circuit board structure, as shown in Figure 2 The multilayer circuit board structure includes at least two PCB boards 4, and the inductance element structure provided by the embodiment 1 is arranged between the adjacent two PCB boards 4, and the conductor sheet 3 and the terminal of the inductance element structure are respectively electrically connected, to obtain the multilayer circuit board structure.

[0102] Application Comparative Example 1

[0103] The application comparative example provides a multilayer circuit board structure, the multilayer circuit board structure includes at least two PCB boards 4, and the inductance element structure provided by the comparative example 1 is arranged between the adjacent two PCB boards 4, and the conductor sheet 3 and the terminal of the inductance element structure are respectively electrically connected, to obtain the multilayer circuit board structure.

[0104] The multilayer circuit board structure obtained by the application example 1 and the application comparative example 1 is tested, and the efficiency difference of the application example 1 and the application comparative example 1 under different currents is as shown in Figure 11 and table 2:

[0105] Table 2

[0106]

[0107] It can be seen from the data that, in the inductance element structure with external copper sheet, because of the rapid heat dissipation effect of the copper sheet, the surface temperature of the inductance is obviously lower than that of the inductance element structure in the embodiment when the inductance passes through the same current. And with the increase of the current, the temperature rise of the product surface is less than that of the comparative example.

[0108] The above describes the preferred embodiments of the present application, but the present application is not limited to the specific details in the above embodiments, and various simple modifications can be made to the technical scheme of the present application within the technical concept of the present application, and these simple modifications all belong to the protection scope of the present application.

[0109] In addition, it should be noted that the various specific technical features described in the foregoing detailed description can be combined in any suitable manner, and that the application contemplates all possible combinations of features, unless otherwise indicated herein.

[0110] Furthermore, the various embodiments of the application can also be combined with each other, as long as they do not contradict the idea of the application, they should also be considered as disclosed by the application.

Claims

1. An inductive element structure, characterized by The application relates to an inductor element structure. The inductor element structure comprises: a magnetic core, which is internally provided with at least one accommodating space, and the two ends of the accommodating space form openings on the top surface and the bottom surface of the magnetic core respectively; a winding, which comprises a coil; the winding is arranged in the accommodating space, and the winding has terminals electrically connected with the coil at the openings; the terminals are used for forming external electrical connection; 2. The inductive element structure of claim 1, wherein, a conductor sheet, which is arranged on the side surface of the magnetic core, and the two ends of the conductor sheet respectively extend towards the top surface and the bottom surface of the magnetic core until the end surfaces are in the same plane with the terminals; the conductor sheet is used for forming external electrical connection.

3. The inductive element structure of claim 1, wherein, The conductor sheet comprises a metal copper sheet.

4. The inductive element structure of claim 1, wherein, The shape of the winding comprises any one of straight line type, curve type, U type or Z type; the accommodating space is arranged along the shape of the winding.

5. The inductive element structure of claim 1, wherein, The two ends of the conductor sheet respectively extend to the top surface and the bottom surface of the magnetic core.

6. The inductive element structure of claim 5, wherein, The outer surface of the magnetic core is provided with a coating for protecting the magnetic core.

7. The inductive element structure of claim 1, wherein, The coating comprises a paint layer and / or a resin layer, and the thickness of the coating is 0.02-0.2 mm.

8. The inductive element structure of claim 7, wherein, A tin solder layer is arranged between the conductor sheet and the magnetic core, and is used for fixing the conductor sheet.

9. The inductive element structure of claim 1, wherein, The tin solder layer comprises a copper-nickel-tin layer or a nickel-silver layer.

10. A multilayer circuit board structure, characterized by, The right angles and edges of the four peripheral edges of the magnetic core are chamfered. The application further relates to an inductor element structure, which comprises at least two PCB boards, and the two adjacent PCB boards are provided with the inductor element structure according to any one of claims 1-9.

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