Light emitting device and LED package

Abstract

The LED package includes: a light source including a light-emitting element and having a light-emitting surface on an upper surface; a translucent member disposed on the light source; and a light reflecting layer disposed on the translucent member, the light source having a resin package and a light emitting element, the resin package having: a lead portion including a first lead portion and a second lead portion; a resin portion that holds the lead portion; the first lead part, the second lead part and a part of the resin part are used as a bottom surface, a part of the resin part is used as a concave part of a side wall, and the light-emitting element is placed on the bottom surface of the concave part.

Description

[0001] This application is a divisional application of the invention patent application with the application date of November 27, 2020, application number 202011353601.2, and invention name "Light-emitting device and LED packaging". Technical Field

[0002] The invention relates to a light emitting device and an LED package. Background Art

[0003] A light-emitting device has been developed in which a reflective or diffusing component is provided on the upper surface of a transparent resin that seals a light-emitting element, thereby irradiating light from the light-emitting element to the outside through the side of the transparent resin. Because light easily diffuses laterally, this light-emitting device can be used as a backlight source, for example (e.g., Patent Document 1).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: International Publication No. 2012-099145

[0007] Patent Document 2: Japanese Patent Application Laid-Open No. 2016-171227 Summary of the Invention

[0008] Technical problem to be solved by the invention

[0009] However, in backlight applications, it is necessary to efficiently diffuse light laterally.

[0010] An object of the present invention is to provide a light emitting device that can be reduced in thickness and effectively diffuse light laterally.

[0011] Technical solutions to technical problems

[0012] The embodiments of the present invention include the following structures.

[0013] (1) A light-emitting device comprises: a substrate; a light source including a light-emitting element having a light-emitting surface on an upper surface arranged on the substrate; a covering member covering a side of the light source and made of a resin material containing a light-reflecting substance; a light-transmitting member arranged above the light source; a light-reflecting layer arranged above the light-transmitting member; a light-transmitting covering member covering at least a side surface of the light-transmitting member, the light-reflecting layer being thicker at an outer edge than at a portion above an optical axis of the light-emitting element, and comprising an annular lens portion.

[0014] (2) An LED package comprises: a light source including a light-emitting element having a light-emitting surface on an upper surface; a translucent component arranged on the light source; and a light-reflecting layer arranged on the translucent component. The light source comprises a resin package and a light-emitting element. The resin package comprises: a lead portion including a first lead portion and a second lead portion; a resin portion for retaining the lead portion; a recess having the first lead portion, the second lead portion, and a portion of the resin portion as a bottom surface and a portion of the resin portion as a side wall, wherein the light-emitting element is placed on the bottom surface of the recess.

[0015] Effects of the Invention

[0016] According to the present invention, a light emitting device capable of more efficiently diffusing light laterally can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1A This is a schematic perspective view showing a light emitting device according to one embodiment of the present invention.

[0018] Figure 1B yes Figure 1A Schematic cross-sectional view of the II' section.

[0019] Figure 1C This is a schematic cross-sectional view of a light emitting device according to another embodiment of the present invention.

[0020] Figure 2 This is a schematic cross-sectional view showing a light emitting device according to another embodiment of the present invention.

[0021] Figure 3A It will Figure 1B An enlarged schematic cross-sectional view of a portion of a light emitting device.

[0022] Figure 3B Observed from the bottom surface Figure 3A Schematic diagram of a portion of a light-emitting device.

[0023] Figure 4 This is a schematic cross-sectional view showing an enlarged portion of a light emitting device according to another embodiment.

[0024] Figure 5A This is a schematic cross-sectional view showing an enlarged portion of a light emitting device according to another embodiment.

[0025] Figure 5B It will Figure 1B An enlarged schematic cross-sectional view of a portion of the light emitting device is shown.

[0026] Figure 5C This is a schematic cross-sectional view showing an enlarged portion of a light emitting device according to another embodiment.

[0027] Figure 6A This is a schematic plan view showing a light emitting device according to another embodiment.

[0028] Figure 6B This is a schematic plan view showing a light emitting device according to another embodiment.

[0029] Figure 7 Yes means having Figure 1C A schematic cross-sectional view of an integrated light-emitting device showing a two-dimensional arrangement of light-emitting devices is shown.

[0030] Figure 8 It will Figure 7 An enlarged schematic cross-sectional view of a portion of the integrated light-emitting device is shown.

[0031] Figure 9 It will be Figure 8 An enlarged schematic top view of a portion of one of the optical laminates used in the integrated light emitting device is shown.

[0032] Figure 10A This is a schematic plan view showing a light source used in a light emitting device according to another embodiment of the present invention.

[0033] Figure 10B yes Figure 10A A schematic cross-sectional view of section II-II'.

[0034] Figure 11 Is to use Figure 10A A schematic cross-sectional view of an LED package according to another embodiment of the light source.

[0035] Figure 12 This is a schematic cross-sectional view showing a light emitting device according to another embodiment of the present invention. DETAILED DESCRIPTION

[0036] Below, with reference to the accompanying drawings, a method for implementing the present invention is described. However, the method shown below is an example for concretizing the technical idea of the present invention, and does not limit the present invention to the following method. In addition, in order to make the description accurate, the size and positional relationship of the components shown in the drawings are exaggerated, and terms indicating specified directions or positions (such as "upper", "lower" and other terms including the above terms) are used as needed, but the above terms are used to facilitate the understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of the above terms. For example, a top view refers to a view from above. Figure 1A When viewed from the Z-axis, "up" refers to a direction based on the Z-axis. In principle, the same names and symbols represent the same or homogeneous components, and repeated descriptions are omitted as appropriate.

[0037] like Figure 1A 、 1BAs shown in FIG1C , a light emitting device 10 according to an embodiment of the present invention includes: a substrate 20, a light source 30, a covering member 40, a translucent member 50, a light reflecting layer 60, and a translucent covering member 70. The translucent covering member 70 includes a lens portion 71 that covers at least the side surface 51 of the translucent member 50. In addition, the thickness of the translucent covering member 70 on the outer edge of the light reflecting layer 60 is thicker than the thickness of the light reflecting layer 60 above the optical axis of the light emitting element 31 described later. This means that the translucent covering member 70 covers at least a portion of the upper surface of the light reflecting layer 60, that is, the optical axis ( Figure 6B In FIG. 5 , the upper surface of the light reflecting layer 60 above A) is exposed.

[0038] Thus, by forming the translucent cover member 70 with the above-described unique shape, the light from the light source is prevented from being emitted from above (directly above) the light reflecting layer 60. Meanwhile, the translucent member 50 allows the light from the light source to propagate internally, allowing it to be emitted to the outside primarily from the side surfaces of the translucent member 50. This allows the light to be efficiently introduced into the translucent cover member 70. Consequently, lateral diffusion of light can be achieved.

[0039] In addition, by configuring the translucent covering component 70 with a thickness of 0 or a thin film above the central portion of the light reflecting layer, the height of the lens portion 71 can be reduced as a whole. Therefore, the light-emitting device having the highest lens portion above the central portion of the light reflecting layer can be thinned.

[0040] Therefore, when the light-emitting device is placed directly below a light guide plate as a backlight source, for example, it can achieve a thinner design and lateral diffusion of light. This improves the in-plane uniformity of brightness across the light-emitting surface. Furthermore, the number of light sources can be reduced, contributing to the provision of a lighter and more affordable surface-emitting device for backlighting and other applications.

[0041] (Substrate 20)

[0042] The substrate 20 is a component for mounting the light source 30. Figure 1B 、 1C As shown, the light source 30 includes a wiring 21 for supplying power to the light source 30 and a base 22 on which the wiring 21 is disposed. In addition, a cover layer 23 covering a portion of the wiring 21 may be arbitrarily disposed.

[0043] The substrate 22 can be formed of, for example, a resin such as phenolic resin, epoxy resin, polyimide resin, BT resin, polyphthalamide (PPA), polyethylene terephthalate (PET), or ceramics. Among them, resins can be used from the perspective of low cost and ease of molding. Furthermore, in order to provide a light-emitting device with good heat resistance and light resistance, ceramics can be used as the material of the substrate 22. Examples of ceramics include alumina, mullite, forsterite, glass ceramics, nitrides (e.g., AlN), and carbides (e.g., SiC). Among them, ceramics formed of alumina or having alumina as a main component are preferred.

[0044] When resin is used as the material constituting the base 22, inorganic fillers such as glass fiber, SiO2, TiO2, and Al2O3 may be mixed into the resin to improve mechanical strength, reduce thermal expansion coefficient, and increase light reflectivity. In addition, the substrate 20 may be a metal component with an insulating portion formed thereon.

[0045] The wiring 21 is a member for electrically connecting to the electrodes of the light source 30 and supplying current (electric power) from the outside, and has at least two patterns separated into positive and negative.

[0046] The wiring 21 is formed on at least the upper surface of the substrate 20, which serves as the mounting surface for the light source 30. The material of the wiring 21 can be appropriately selected based on the material of the base 22, etc. For example, when ceramic is used as the material of the base 22, the material of the wiring 21 can be, for example, a material having a high melting point that can withstand the firing temperature of the ceramic sheet. For example, a high melting point metal such as tungsten or molybdenum is preferably used. Alternatively, a metal material such as nickel, gold, or silver may be coated thereon by electroplating, sputtering, vapor deposition, or the like.

[0047] When a resin is used as the material of the base 22, the material of the wiring 21 can be, for example, a material that is easy to process. In addition, when the base 22 is formed by injection-molded resin, the material of the wiring 21 can be, for example, a material that is easy to process by stamping, etching, bending, etc., and has a large mechanical strength. For example, metal plates, lead frames, etc. such as copper, aluminum, gold, silver, tungsten, iron, nickel, iron-nickel alloy, phosphor bronze, iron-containing copper, and molybdenum can be cited. The surface can also be covered with a metal material. As the metal material, for example, a single layer or multilayer structure of silver or an alloy of silver and copper, gold, aluminum, rhodium, etc. can be cited. Covering can be performed using electroplating, sputtering, vapor deposition, etc.

[0048] The covering layer 23 is usually formed of an insulating material. The covering layer 23 preferably covers the other parts of the wiring 21 except the parts electrically connected to the light source 30 and other materials. The covering layer 23 can be formed of a material that absorbs less light from the light-emitting element. For example, epoxy resin, silicone resin, modified silicone resin, polyurethane resin, oxetane resin, acrylic resin, polycarbonate resin, polyimide resin, etc. can be cited. The covering layer 23 is not only used to insulate the wiring 21, but also contains white fillers to prevent light leakage and absorption, and can also improve light output efficiency through reflection. In addition, as described later, when connected to the translucent covering component 70 (for example Figure 1B As shown), it is possible to improve the close contact with the translucent cover member 70, etc.

[0049] (Light source 30)

[0050] The light source 30 includes a light emitting element 31. The light source 30 is disposed on the substrate 20. When the light source 30 is composed only of the light emitting element 31, the upper surface 31c of the light emitting element 31 is the light emitting surface of the light source 30. Figure 3A As shown, the surface of the light-emitting element 31 facing the substrate 20 is referred to as the lower surface 31b, the surface opposite to or facing the lower surface is referred to as the upper surface 31c, and the surface adjacent to the upper surface 31c is referred to as the side surface 31a. Other components may also be referred to as the side surface, lower surface, and upper surface based on this.

[0051] like Figure 3A 、 Figure 3B and Figure 4 As shown in FIG. 1 and FIG. 2 , the light source 30 preferably includes a wavelength conversion component 34, 84 on the light emitting element 31. In addition, the light source 30 preferably has a side surface ( Figure 3A The fourth light-transmitting component 35 is 31a).

[0052] (Light-emitting element 31)

[0053] The light emitting element 31 includes a semiconductor laminate 32 and a pair of electrodes 33p and 33n located on one side of the semiconductor laminate 32. When the light emitting element 31 is viewed from the upper surface 31c side (the light emitting surface side of the light source when the light source is composed only of light emitting elements), the top view shape can be a polygon such as a quadrilateral or hexagon, a circle, or an ellipse. Figure 3B As shown, the light emitting element 31 preferably has a quadrilateral shape, particularly a square shape, or a shape close thereto in plan view.

[0054] The semiconductor laminate 32 includes a semiconductor layer having a light-emitting layer. In addition, it may also have a light-transmitting substrate such as sapphire. As a semiconductor laminate, a semiconductor layer including a first conductive type semiconductor layer (e.g., an n-type semiconductor layer), a light-emitting layer (active layer), and a second conductive type semiconductor layer (e.g., a p-type semiconductor layer) may be used. As a semiconductor layer that can emit ultraviolet light and visible light from blue light to green light, for example, a III-V compound semiconductor can be used, specifically, Indium ions can be used. X Al Y Ga 1-X-Y Nitride-based semiconductors such as N (0≦X, 0≦Y, X+Y≦1). Semiconductors such as GaAs, GaAlAs, GaP, InGaAs, and InGaAsP can be used as the semiconductor layer capable of emitting red light. The thickness of the semiconductor laminate 32 can be, for example, 3 μm to 500 μm.

[0055] The electrodes 33p and 33n can be formed of materials and structures known in the art and with any thickness. For example, the electrodes 33p and 33n can be formed of a single layer or a laminated film of a metal such as Au, Pt, Pd, Rh, Ni, W, Mo, Cr, Ti, Al, Cu, Sn, Fe, Ag, or an alloy of the above metals. Specifically, the electrodes can be formed from the semiconductor layer side by a laminated film of Ti / Rh / Au, Ti / Pt / Au, W / Pt / Au, Rh / Pt / Au, Ni / Pt / Au, Al-Cu alloy / Ti / Pt / Au, Al-Si-Cu alloy / Ti / Pt / Au, Ti / Rh, etc. In addition, solders such as AuSn, SnAgCu, and SnPb can also be used. The electrodes 33p and 33n can be formed to a thickness in the range of 1 μm to 300 μm, preferably in the range of 5 μm to 100 μm. The planar shape of the electrodes 33p and 33n can be set arbitrarily.

[0056] The light-emitting element 31 is electrically connected to the wiring 21 of the substrate 20 by aligning the electrodes 33p and 33n. To facilitate this connection, the light-emitting element 31 may also have a metal layer 36 connected to the surface of the electrodes 33p and 33n, serving as an external connection terminal. The metal layer 36 preferably has better corrosion and oxidation resistance than the electrodes 33p and 33n. The metal layer 36 can be formed, for example, from a high-melting-point metal such as Ru, Mo, or Ta. The thickness of the metal layer 36 can be, for example, 10 nm to 50 μm. The metal layer 36 can be large enough to reach the side surfaces of the light-emitting device 10 from the bottom surface, but preferably is spaced apart from the side surfaces. For example, the metal layer can be configured to cover a portion of the bottom surface of the cover member 40, described later. This allows the bottom surface of the light-emitting device to expose externally the external connection terminals that have a larger area ratio than the electrodes. This allows the light-emitting element 31 or the light source 30 to be mounted on the substrate 20 with good positional accuracy using a bonding member 24 such as solder. In addition, the bonding strength between the wiring 21 and the light emitting element 31 or the light source 30 can be improved.

[0057] (Wavelength conversion components 34, 84)

[0058] The wavelength conversion components 34 and 84 absorb light from the light-emitting element 31 and convert it into light of a different wavelength, and contain a phosphor. The wavelength conversion components 34 and 84 are arranged above the light-emitting surface (upper surface 31c) of the light-emitting element 31. Furthermore, they are arranged below the translucent component 50, which will be described later. The arrangement of the wavelength conversion component 34 allows light from the light-emitting element 31 and light from the wavelength conversion component 34 to enter the translucent component 50. When the light source 30 is composed of the light-emitting element 31 and the wavelength conversion components 43 and 84, the upper surface of the wavelength conversion components 43 and 84 serves as the light-emitting surface 31L of the light source 30.

[0059] The wavelength conversion member 34, 84 preferably covers the entire light emitting surface (upper surface 31c) of the light emitting element 31. Figure 3AAs shown, the wavelength conversion member 34 is preferably positioned with its outer edge 34a outside the outer edge 31g of the light-emitting element 31 in a plan view. The wavelength conversion member may have a polygonal shape such as a quadrilateral or hexagon, a circle, an ellipse, or other shapes when viewed from above. The planar area of the wavelength conversion member 34 is, for example, greater than 100% of the planar area of the light-emitting surface (upper surface 31c) of the light-emitting element 31, preferably less than 200%, and more preferably within the range of 110% to 160%. The wavelength conversion member 34 is preferably positioned so that its center (or center of gravity) coincides with the center (or center of gravity) of the light-emitting surface (upper surface 31c) of the light-emitting element 31. This ensures that the width of the outer periphery of the wavelength conversion member 34 outside the light-emitting surface (upper surface 31c) of the light-emitting element 31 is substantially constant, thereby suppressing color unevenness. The wavelength conversion member 34 preferably has a plate-like shape with parallel upper and lower surfaces. Its side surfaces may be any of a variety of surfaces, such as vertical, inclined, or curved.

[0060] The thickness of the wavelength conversion members 34 and 84 can be appropriately selected according to the type and amount of phosphors used, the desired chromaticity, etc. For example, the thickness of the wavelength conversion member 34 can be in the range of 20 μm to 200 μm, preferably in the range of 100 μm to 180 μm.

[0061] Wavelength conversion components 34 and 84 can contain a base material such as a translucent resin material or glass, and a phosphor as the wavelength conversion material. Alternatively, they can be formed from a ceramic containing the phosphor or a single crystal of the phosphor. Examples of the base material include thermosetting resins such as silicone resin, silicone-modified resin, epoxy resin, and phenolic resin, and thermoplastic resins such as polycarbonate resin, acrylic resin, polymethylpentene resin, and polynorbornene resin. Silicone resin, which exhibits excellent light and heat resistance, is particularly suitable. Examples of ceramics include those obtained by firing a translucent material such as alumina.

[0062] Any phosphor known in the art can be used as the phosphor. Examples of phosphors that can be excited by a blue light-emitting element or an ultraviolet light-emitting element include cerium-activated yttrium / aluminum / garnet phosphors (YAG:Ce); cerium-activated lutetium / aluminum / garnet phosphors (LAG:Ce); europium and / or chromium-activated nitrogen-containing calcium aluminosilicate phosphors (CaO-Al2O3-SiO2); europium-activated silicate phosphors ((Sr, Ba)2SiO4); nitride phosphors such as β-sialon phosphors, CASN phosphors, and SCASN phosphors; KSF phosphors (K2SiF6:Mn); sulfide phosphors, and quantum dot phosphors. By combining these phosphors with a blue light-emitting element or an ultraviolet light-emitting element, light-emitting devices of various colors (e.g., white light-emitting devices) can be produced. One or more of these phosphors can be used. When using multiple types of phosphors, they may be mixed and formed into a single layer, or layers containing each phosphor may be laminated. In addition, the wavelength conversion member may contain various fillers for the purpose of adjusting viscosity, etc.

[0063] For example, Figure 4 As shown, when the wavelength conversion component 84 is a multi-layered structure, it is preferred that the layer containing the filler as the diffusion layer 83 is arranged as the uppermost layer. In this case, the layers containing phosphors may be the first layer 81 and the second layer 82 containing different phosphors. For example, the second layer 82 may contain a KSF-type phosphor, and the first layer 81 may contain a β-sialon phosphor. By making multiple layers contain different types of phosphors, it is possible to suppress the mutual absorption of phosphors, improve the wavelength conversion efficiency, and form a light-emitting device with higher light output. In the wavelength conversion component 84, the diffusion layer 83 may be, for example, 50μm to 200μm, preferably 50μm to 100μm. The layer containing phosphors can be appropriately adjusted according to the type and content of the phosphors. For example, the second layer 82 containing KSF-type phosphors may be 50μm to 500μm, preferably 75μm to 200μm. The first layer 81 containing the β-sialon phosphor may have a thickness of 10 μm to 100 μm, and preferably 20 μm to 80 μm.

[0064] The wavelength conversion member 34, 84 can be disposed directly or via a component on the light-emitting surface (upper surface 31c) of the light-emitting element 31. When the wavelength conversion member 34 is disposed directly, that is, when the wavelength conversion member 34 is in contact with the light-emitting surface (upper surface 31c) of the light-emitting element 31, for example, the wavelength conversion member 34 can be disposed using a direct bonding method at room temperature.

[0065] When the arrangement is performed via a certain component, a translucent adhesive can be used. For example, in addition to being located between the wavelength conversion component 34 and the light-emitting element 31, the translucent adhesive can also be used as a fourth translucent component 35 to cover the entire lower surface opposite to the upper surface of the wavelength conversion component 34, as well as part or all of the side surface 31a of the light-emitting element 31. In this way, by covering the side surface 31a of the light-emitting element 31 with the fourth translucent component 35, light emitted from the side surface 31a of the light-emitting element 31 can be effectively guided to the wavelength conversion component 34 and then to the translucent component 50. In addition, the wavelength conversion component 34 can also be located on the side surface of the light-emitting element 31. In this case, the side surface of the light source is the side surface of the wavelength conversion component.

[0066] In the case where the fourth translucent component 35 covers the side surface 31a of the light-emitting element 31, it is preferred that the fourth translucent component 35 is thickest on the light-emitting surface side and is configured to be thinner as it approaches the electrode side. Such a thickness inclination can be linear or a curve that is concave inward. For example, the thickness of the light-emitting surface side of the fourth translucent component 35 can be equivalent to the length from the outer edge of the lower surface of the wavelength conversion component 34 to the outer edge 31g of the light-emitting surface (upper surface 31c) of the light-emitting element 31. Thus, after the light emitted from the side surface 31a of the light-emitting element 31 is incident on the fourth translucent component 35, it is reflected upward (in the direction of the light-emitting surface of the light-emitting element 31) by the outer surface of the fourth translucent component 35 and is incident on the translucent component 50. By having the above-mentioned fourth translucent component 35, the light from the light-emitting element 31 can be effectively incident on the translucent component 50.

[0067] The fourth light-transmitting member 35 can be made of a light-transmitting resin material. For example, a resin material primarily composed of a thermosetting resin such as silicone resin, silicone-modified resin, epoxy resin, or phenolic resin is preferred. The fourth light-transmitting member 35 can have a transmittance of 70% or greater, preferably 80% or greater, and more preferably 90% or greater, with respect to light from the light-emitting element.

[0068] It is particularly preferred that the fourth light-transmitting member 35 covers 50% or more of the side surface 31 a of the light-emitting element 31 .

[0069] like Figure 3B As shown, the fourth translucent member 35 preferably has a substantially circular outer shape on the light-emitting surface side. This shape allows light emitted from the side surface 31a of the light-emitting element 31 to be efficiently guided toward the wavelength conversion member 34. The fourth translucent member 35 having the above-described shape can be formed by, for example, casting a liquid material for the fourth translucent member 35 onto a flat plate-shaped translucent member 50, described later.

[0070] (Covering member 40)

[0071] The cover member 40 is a member that covers the sides of the light source 30. The cover member 40 is made of a resin material containing a light-reflecting substance.

[0072] When the light source 30 is composed only of the light-emitting element 31, the covering member 40 preferably covers the side surface 31a of the light-emitting element 31 and covers a portion of the lower surface 31b of the light-emitting element 31. In addition, the covering member 40 preferably covers the lower surface 31b of the light-emitting element 31, leaving at least a portion (the lower surface, the surface opposite to the semiconductor laminate) of each of the pair of electrodes 33p and 33n of the light-emitting element 31 exposed.

[0073] When the light source 30 includes a light-emitting element 31, a wavelength conversion member 34, and a fourth translucent member 35, the covering member 40 preferably covers the side surfaces of the light-emitting element 31 directly or through a certain member. Furthermore, the covering member 40 preferably covers the fourth translucent member 35 as needed. Furthermore, when a portion of the side surfaces of the light-emitting element 31 are not covered by the fourth translucent member 35, the covering member 40 preferably covers the uncovered side surfaces of the light-emitting element 31. Furthermore, the covering member 40 preferably covers a portion or all of the side surfaces and a portion of the lower surface of the wavelength conversion member 34, and more preferably covers all of the side surfaces and a portion of the lower surface of the wavelength conversion member 34. In particular, the covering member 40 preferably contacts and covers the side surfaces 31a of the light-emitting element 31, the fourth translucent member 35, and all of the side surfaces and a portion of the lower surface of the wavelength conversion member 34.

[0074] When the light source 30 consists solely of the light-emitting element 31, the upper surface of the cover member 40 is preferably flush with the upper surface 31c of the light-emitting element 31. Alternatively, when the light source 30 includes the light-emitting element 31 and the wavelength conversion member 34, the upper surface of the cover member 40 is preferably flush with the upper surface (light-emitting surface 31L) of the wavelength conversion member 34. However, even in these cases, a slight height difference may be present, for example, approximately 1% to 20% of the thickness of the wavelength conversion member 34.

[0075] As described above, when the metal layer 36 is connected to the electrodes 33 p and 33 n , it is preferable that the covering member 40 is arranged so as not to cover the metal layer 36 , in other words, so as to place the metal layer 36 between the metal layer 36 and the substrate.

[0076] The maximum thickness of the covering member 40 is preferably the same as the total thickness of the light emitting element 31 and the wavelength conversion member 34. The thickness is, for example, in the range of 200 μm to 10,000 μm, and preferably in the range of 300 μm to 600 μm.

[0077] For example, the reflectivity of the cover member 40 with respect to the light from the light emitting element 31 can be set to 70% or more, preferably 80% or more, and more preferably 90% or more.

[0078] Examples of the resin material comprising the cover member 40 include those primarily composed of thermosetting resins such as silicone resins, silicone-modified resins, epoxy resins, and phenolic resins. Examples of the light-reflecting material include white substances, specifically titanium dioxide, silicon dioxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, and mullite. The amount of light-reflecting material contained in the resin material can be adjusted appropriately based on the thickness of the cover member 40 and the size of the light-emitting element.

[0079] (Translucent member 50)

[0080] The translucent member 50 is disposed on the light source 30 and is used together with the light reflecting layer 60 described later to control the light distribution characteristics of the light emitting device 10. The translucent member 50 can particularly propagate light emitted from the light emitting surface 31L of the light source laterally.

[0081] When the light source 30 consists solely of the light-emitting element 31, the translucent member 50 can be placed directly on the upper surface of the light-emitting element or via a component. When the light source 30 includes the wavelength conversion member 34, the translucent member 50 can be placed directly on the upper surface of the wavelength conversion member 34 or via a component. When the translucent member 50 is directly placed, that is, when the translucent member 50 is in contact with the upper surface of the wavelength conversion member 34 or the light-emitting element 31, placement can be achieved, for example, using a direct bonding method at room temperature.

[0082] In the case of indirect placement, a translucent adhesive can be used. For example, the translucent adhesive may be the same material as exemplified for the fourth translucent member.

[0083] The translucent component 50 is preferably a plate-shaped component with parallel upper and lower surfaces, but may also have partially or completely non-parallel surfaces. For example, a slight height difference may exist on its upper or lower surface. A height difference of approximately 1% to 10% of the thickness of the translucent component 50 is acceptable. In addition, the upper or lower surface of the translucent component 50 may be inclined at an angle of less than 10 degrees relative to the other. The thickness of the translucent component 50 can be appropriately adjusted, for example, based on the size of the light-emitting element, the size and thickness of the wavelength conversion component, the size of the light-emitting device, etc. For example, the translucent component 50 may have a thickness of 10% to 80% of the maximum width of the light-emitting surface of the light source (the maximum width of the wavelength conversion component 34 in the case of a wavelength conversion component 34), preferably 20% to 60%. Specifically, the thickness of the translucent component 50 can be, for example, 200 μm to 2000 μm, preferably 300 μm to 1000 μm, and more preferably 350 μm to 600 μm. From another perspective, the thickness of the light-transmitting member 50 may be approximately 20% to 80% of the thickness of the light-emitting device 10 .

[0084] By setting the thickness of the translucent component 50 to the aforementioned thickness, light emitted to the sides of the light-emitting device 10 can be emitted further. The light emitted from the sides of the translucent component 50 is primarily divided into: direct light that travels directly from the light-emitting surface 31L of the light source toward the sides of the translucent component 50; light that contacts and is reflected and scattered by the light-reflecting layer 60, described later; and indirect light that is reflected and scattered by the upper surface of the cover component located to the side of the light source and contacts the sides of the translucent component 50 and is emitted. The direct light component can further be emitted to the sides (laterally) of the light-emitting device, or it can be emitted upward. In other words, it can be emitted diagonally upward when the light-emitting device is viewed in cross-section. This makes it easy to achieve batwing-shaped light distribution characteristics. Furthermore, by adjusting the thickness of the translucent component relative to the maximum width of the light-emitting surface 31L (wavelength conversion component), the ratio of direct light to indirect light changes, making it easy to achieve various batwing-shaped light distribution characteristics. It should be noted that the lateral direction mentioned in this embodiment mainly refers to the true lateral (horizontal) direction, but of course it is not limited to the true lateral (horizontal) direction, and also includes obliquely downward and obliquely upward directions.

[0085] The light-transmitting member 50 preferably has a constant thickness over the entire surface.

[0086] The side surface of the light-transmitting member 50 is preferably perpendicular to the upper surface or the lower surface. However, it may be inclined at an angle of 10 degrees or less to the upper surface or the lower surface, or may be a curved surface, or a combination of both.

[0087] The planar area of the translucent component 50 is preferably, for example, 100% to 1000% of the planar area of the light-emitting surface of the light-emitting element 31, and more preferably is in the range of 300% to 700%. In addition, the planar area of the translucent component 50 is preferably, for example, 100% to 500% of the planar area of the wavelength conversion component 34, and more preferably is in the range of 150% to 450%. The translucent component 50 is preferably arranged so that its center (or center of gravity) coincides with the center (or center of gravity) of the upper surface of the light-emitting element 31 and / or the center (or center of gravity) of the upper surface of the wavelength conversion component 34, that is, the center (or center of gravity) of the light-emitting surface of the light source. It should be noted that the larger the planar area of the translucent component 50 is compared to the planar area of the light-emitting surface of the light-emitting element 31 and / or the wavelength conversion component 34 when viewed from the light-emitting surface, the more color unevenness can be reduced.

[0088] In addition to being in direct contact with the upper surface of the light-emitting element 31 or the wavelength conversion component 34 or in direct contact with the upper surface of the cover component 40 or in direct contact with the upper surface of the cover component 40 or in direct contact with the upper surface of the cover component 40. In addition, the light-transmitting component is preferably arranged from the upper surface of the light-emitting element 31 or the wavelength conversion component to the upper surface of the cover component 40. From another perspective, the light-transmitting component is preferably arranged on the upper surface by integrating the light-emitting element 31 or the wavelength conversion component with the cover component to form a single upper surface. In addition, the side surface 51 of the light-transmitting component 50 is preferably flush with the side surface of the cover component 40. The flushness mentioned here means, for example, that a concavity or convexity of about 1% to 10% of the thickness of the light-transmitting component 50 is allowed. In this way, light from the light source 30 can be effectively introduced into the light-transmitting component 50 and effectively reflected by the light-reflecting layer 60 described later, so that light can be easily output to the outside from the side surface 51.

[0089] The light-transmitting member 50 may have a transmittance of 70% or more, preferably 80% or more, and more preferably 90% or more, with respect to the light from the light source 30 .

[0090] The translucent component 50 can be made of a translucent resin material, glass, or the like. For example, thermosetting resins such as silicone resin, silicone-modified resin, epoxy resin, and phenolic resin, and thermoplastic resins such as polycarbonate resin, acrylic resin, polymethylpentene resin, and polynorbornene resin can be cited. Among them, silicone resins with good light resistance and heat resistance are preferred. The translucent component 50 preferably does not actually contain the phosphor described later. It preferably does not contain diffusing materials, etc. However, it may also contain them. In the case where the translucent component 50 is formed only of a resin material or glass, it is possible to suppress the scattering of light inside the translucent component 50, and to effectively emit light reflected by the lower surface of the light reflecting layer 60 described later and the upper surface of the covering component 40 to the outside from the side surface 51 of the translucent component 50.

[0091] (Light Reflecting Layer 60)

[0092] The light-reflecting layer 60 is disposed on the translucent member 50. The light-reflecting layer 60 preferably covers the entire upper surface of the translucent member 50. The light-reflecting layer 60 is preferably disposed in contact with the upper surface of the translucent member 50, either directly or through some other member. The light-reflecting layer 60 reflects light from the light source 30 toward the light-emitting surface, i.e., the side surface 51 of the translucent member 50.

[0093] For example, the reflectivity of the light-reflecting layer 60 with respect to light from the light source 30 is 50% or greater, preferably 70% or greater, and more preferably 90% or greater. The thickness of the light-reflecting layer 60 is preferably such that the transmittance of light from the light source 30 is 50% or less, 40% or less, or 30% or less. Furthermore, the transmittance of light from the light source 30 is preferably greater than 0%, more preferably 10% or greater, or 15% or greater. Thus, by mixing light emitted from the translucent member with a portion of light transmitted through the light-reflecting layer, the brightness uniformity of the entire surface can be improved when viewed from above the light source.

[0094] The light reflecting layer 60 can be formed of, for example, a resin material containing a light reflecting substance, a metal material, an inorganic material using a dielectric multilayer film, etc. The light reflecting layer 60 is preferably white, and more preferably formed of a resin material containing a light reflecting substance.

[0095] The light-reflective substance and resin material can be selected from the materials exemplified for the cover member 40. Metal materials with high light reflectivity are preferably used, and examples thereof include silver, aluminum, rhodium, gold, copper, and alloys of one or more of these metals. Dielectric multilayer films include materials such as titanium dioxide, silicon dioxide, zirconium oxide, potassium titanate, aluminum oxide, and aluminum nitride.

[0096] The light-reflecting layer 60 preferably has upper and lower surfaces parallel to the light-emitting surface of the light source 30, that is, has a uniform thickness. However, the upper or lower surface may have irregularities or be convex relative to the light-emitting surface. This facilitates reflection of light from the light source 30 laterally toward the light-emitting device 10. The irregularities on the upper or lower surface of the light-reflecting layer 60 may be, for example, approximately 1% to 20% of the thickness (maximum thickness) of the light-reflecting layer 60.

[0097] When the light reflecting layer 60 is a layer having different thicknesses, it is preferable that the thickness of the thinnest portion be such that the transmittance of the light from the light source 30 is 50% or less.

[0098] When a resin material containing a light-reflecting substance is used as the light-reflecting layer 60, the light transmittance varies depending on the composition and content of the light-reflecting substance. Therefore, it is preferable to appropriately adjust the thickness, etc., depending on the material used. For example, when the light-reflecting layer 60 is composed of a resin material containing a light-reflecting substance and has a uniform thickness, the thickness can be within the range of 100 μm to 500 μm, preferably within the range of 100 μm to 300 μm.

[0099] (Translucent Covering Member 70)

[0100] The translucent cover member 70 includes a lens portion 71. The lens portion, as used herein, refers to the surface opposite the surface facing the light source and substrate, and is refracted to diffuse or focus light. The lens portion 71 is typically a spherical or curved surface, surrounding the light source 30 in an annular shape or a similar annular shape with a recessed center. This allows the light-emitting device 10 to have a 360-degree light-emitting surface centered on the light-emitting device 10 when viewed from above.

[0101] In addition to the lens portion 71, the translucent cover member 70 may also have a flat or nearly flat surface as a portion thereof, located above the optical axis of the light-emitting element 31. The nearly flat surface mentioned herein may, for example, be a surface having irregularities on a flat surface. The size of the irregularities may be, for example, approximately 1% to 20% of the maximum thickness of the translucent cover member 70 disposed on the light-reflecting layer 60 above the optical axis of the light-emitting element 31.

[0102] The light-transmitting cover member 70 preferably covers at least a portion or all of the side surface 51 of the light-transmitting member 50. In addition, the light-transmitting cover member 70 may cover a portion or all of the side surface of the light-reflecting layer 60, a portion or all of the upper surface of the light-reflecting layer 60, or a portion or all of the cover member 40. Figure 1B As shown, the translucent cover member 70 preferably covers the entire side surface 51 of the translucent member 50, the entire side surface of the light reflecting layer 60, and a portion of the side surface of the cover member 40. In this case, the translucent cover member 70 may be formed as a ring structure as shown in FIG1 and FIG2. Figure 5A As shown, the inner edge, that is, the inner edge 76, is consistent with the outer edge 61 of the light reflecting layer 60, or as shown in FIG. Figure 1B and Figure 5B As shown, the inner edge, that is, the inner edge 75, covers the outer peripheral region 62 of the upper surface of the light-reflecting layer 60. In other words, the translucent cover member 70 covers at least the outer edge 61 of the light-reflecting layer 60, leaving a portion of the upper surface of the light-reflecting layer 60 exposed. Here, the portion of the upper surface of the light-reflecting layer 60 preferably includes the upper surface of the light-reflecting layer 60 above the optical axis of the light-emitting element 31.

[0103] Here, the light-reflecting layer 60 is formed from a resin containing a white reflective material and provided with the aforementioned translucent cover member. This further improves brightness uniformity when the light source is viewed from above. For example, in backlight applications, if a diffuser is placed above the light-emitting device, the diffuser can scatter the reflected light from the light-reflecting layer 60, resulting in uniform light with a uniform color. Specifically, within the translucent cover member, in this embodiment, where light is emitted from the side of the translucent member, the proportion of light that partially transmits through the light-reflecting layer and is output upward is reduced. Therefore, when the entire surface is viewed from above, the light-emitting element may appear darker along the optical axis than at other locations. In particular, in the case of a surface-emitting device with a diffuser placed above the light source, the light-emitting element may appear darker along the optical axis when the light-emitting surface of the diffuser is viewed from above, potentially resulting in a dark spot. In contrast, according to this embodiment, dark spots can be reduced, and the brightness uniformity of the light-emitting device or surface-emitting device can be improved when viewed from the top. This is because the brightness uniformity can be particularly improved when the translucent cover member 70 exposes a portion of the upper surface of the light reflecting layer 60 or the entire upper surface (when the thickness is 0).

[0104] When the light-transmitting cover member 70 covers the upper surface of the light-reflecting layer 60 and exposes a portion thereof, the exposed area may be 100% of the upper surface area of the light-reflecting layer 60, and may be 50% or more, preferably 60% or more, and more preferably 70% or more. In other words, the width of the peripheral region 62 (i.e., the width of the outer peripheral region 62) is 100% of the upper surface area of the light-reflecting layer 60. Figure 5B The distance from the outer edge 61 of the light reflecting layer 60 to the inner edge 75 of the light-transmitting cover member 70 can be exemplified as 5% to 90% of the maximum width of the light reflecting layer 60. Figure 5C Alternatively, as shown in the case where the translucent cover member 70 exposes at least a portion of the upper surface of the light reflecting layer 60 , that is, the upper surface of the light reflecting layer 60 above the optical axis of the light emitting element 31 , Figure 5B As shown, when the translucent covering part 70 covers the upper surface of the light reflecting layer 60, the thickness T1 of the translucent covering part 70 on the outer edge 61 of the light reflecting layer 60 is preferably thicker than the thicknesses T2 and T3 on the upper surface of the light reflecting layer 60, and is particularly more preferably thicker than the thickness T3 of the light reflecting layer 60 above the optical axis A of the light emitting element.

[0105] It should be noted that if Figure 5A As shown, even when the inner edge 76 of the translucent covering part 70 is consistent with the outer edge 61 of the light reflecting layer 60, the thickness T4 of the translucent covering part 70 on the outer edge 61 of the light reflecting layer 60 is thicker than the thickness (0) on the upper surface of the light reflecting layer 60.

[0106] For example, the maximum thickness of the light-transmitting cover member 70 in the Z direction ( Figure 1B The Tx in the figure is in the range of 300 μm to 5000 μm, preferably in the range of 800 μm to 2500 μm.

[0107] The maximum width of the light-transmitting cover member 70 on the substrate 20 ( Figure 1B WX in the figure can be appropriately adjusted according to the size and brightness of the light source 30, but for example it can be in the range of 1 mm to 10 mm, preferably in the range of 2 mm to 8 mm.

[0108] For example, Figure 1B As shown, the translucent cover member 70 may also include: a second translucent member 72 covering the side surface of the translucent member 50, and a third translucent member 73 covering the second translucent member 72 and constituting the lens portion 71. Figure 2 As shown, the translucent cover member 70 may be composed of a fifth translucent member 74 formed by integrating the second translucent member and the third translucent member with the same material.

[0109] For example, the second translucent component 72, the third translucent component 73, and the fifth translucent component 74 constituting the translucent cover component 70 may have a transmittance of 70% or more, preferably 80% or more, and more preferably 90% or more, relative to light from the light-emitting element.

[0110] The second light-transmitting component 72, the third light-transmitting component 73, and the fifth light-transmitting component 74 can be formed using the same material as the material exemplified by the light-transmitting component 50. In particular, as the second light-transmitting component 72, it is preferable to select a material having a refractive index lower than that of the material constituting the third light-transmitting component 73 from among the materials exemplified by the light-transmitting component 50. By selecting the above-mentioned material, light can be refracted upward, and the light from the light source can be used more efficiently. In addition, by using the second light-transmitting component 72, it is possible to prevent bubbles from being generated in the lens portion 71 of the light-transmitting cover component 70. In particular, in the case of casting, it is possible to prevent voids from entering (voids). It should be noted that, in order to adjust the shape of the light-transmitting cover component 70, it is preferable that the material contains a filler to adjust the viscosity. Among them, the viscosity and thixotropy of the third light-transmitting component 73 are preferably higher than the viscosity and thixotropy of the second light-transmitting component 72.

[0111] The second translucent member 72 preferably has varying thicknesses. However, it may also have a uniform thickness throughout. For example, the second translucent member 72 may be thickest on the translucent member 50 side, then linearly tapering, with the thinnest portion being the farthest from the translucent member 50. This inclination allows light emitted from the translucent member 50 to diffuse upward and laterally.

[0112] The translucent cover member 70 can be formed, for example, using methods known in the art. Casting is preferred. For the light source 30 comprising the cover member 40, the translucent member 50, and the light-reflecting layer 60, two methods are possible, for example: Method 1 involves moving the nozzle that discharges the material constituting the translucent cover member so that the material is discharged in a circular pattern centered on the light source; Method 2 involves arranging multiple nozzles, such as four, six, or eight, that discharge the material around the light source, discharging an appropriate amount of material from each nozzle, and connecting the material discharged from adjacent nozzles. These methods make it easy to form the translucent cover member 70 into the desired shape.

[0113] (Light Reflective Member 41)

[0114] The light-emitting device 10 preferably further includes a light-reflecting member 41 between the substrate 20, the cover member 40, and the translucent cover member 70. Even if a light-absorbing material is disposed around the light-emitting element 31 in the substrate 20, the light-reflecting member 41 can cover the light-absorbing material, effectively preventing absorption of light from the light source.

[0115] The light-reflective component 41 can be arranged on any component such as the base 22, the wiring 21, the covering layer 23, the bonding component 24, etc., and is preferably arranged on all components. In addition, it is preferably also arranged on the substrate 20 directly below the light-emitting element 31. The light-reflective component 41 on the substrate 20 can be of uniform thickness or of varying thickness. For example, the light-reflective component 41 can be in a shape in which the thickest film is near the light source, and then linearly decreases and is the thinnest film at the part farthest from the light source. By utilizing the above-mentioned inclination, the light emitted from the light-transmitting component 50 can be reflected further upward and laterally. Thus, a light-emitting device that emits laterally diffuse and bright light can be provided.

[0116] When the light reflective member 41 is arranged in this manner, a portion of the light-transmitting cover member 70 is arranged on the light reflective member 41, and the other portion is arranged on the cover layer 23 of the substrate 20 (for example, Figure 1B ). However, if Figure 1CAs shown, the light-transmitting cover member 70 can also be arranged entirely on the light-reflecting member 41. In this case, the light-reflecting member 41 is arranged to the upper surface of the cover layer 23 of the substrate 20. As a result, it is easy to arrange the light-transmitting cover member 70 in an appropriate shape and at an appropriate position. It should be noted that Figure 1C and Figure 1B The same is observed in other embodiments Figure 1A This is a schematic cross-sectional view of the perspective view of such a light emitting device taken along the line II'.

[0117] Furthermore, the viscosity and thixotropy of the light reflective member 41 are preferably lower than those of the second light transmissive member 72. This makes it possible to easily achieve the above-mentioned inclination.

[0118] The light emitting device 10 may be a light emitting device having a plurality of light emitting devices arranged on a substrate. Figure 6A As shown, multiple light emitting devices 10 are arranged in a row on the substrate 20, or as shown in FIG. Figure 6B As shown, a plurality of light emitting devices 10 are arranged in a matrix on a substrate 20. The spacing between the plurality of light emitting devices 10 is preferably the same. However, it can also be different. The spacing between the light emitting devices 10 can be appropriately adjusted according to the size, brightness, etc. of the light emitting devices. For example, the spacing between the light emitting devices 10 ( Figure 6A The thickness (P) is in the range of 5 mm to 100 mm, preferably in the range of 15 mm to 50 mm.

[0119] Figure 7 Indicates that Figure 1B or Figure 1C The light emitting devices 10 shown are examples of two-dimensionally arranged integrated light emitting devices. Figure 7 The integrated light emitting device 200 shown includes Figure 1C The arrangement of sixteen units of the same structure as shown is arranged in four rows and four columns in the XY plane of the figure. As shown in the figure, a second reflective member 170 includes a plurality of inclined surfaces 174s. The plurality of inclined surfaces 174s extend in the X direction or Y direction of the figure, and each light-emitting device 10 is surrounded by four of the plurality of inclined surfaces 174s.

[0120] The integrated light emitting device 200 is a surface emitting light source including a plurality of light emitting regions arranged in four rows and four columns, and is useful as a backlight for a liquid crystal display device, for example. Figure 7 As shown, according to the structure in which each light emitting device 10 is surrounded by a plurality of inclined surfaces 174s, it is possible to suppress uneven brightness in each light emitting region and to suppress uneven brightness in units of light emitting region groups.

[0121] Figure 81 is a cross-sectional view showing one light emitting device 10 in an integrated light emitting device 200. The integrated light emitting device 200 includes a plurality of light emitting devices 10 arranged two-dimensionally. The light emitting device 10 includes an optical laminate 180. The optical laminate 180 includes, for example, a semi-transparent mirror 181, a diffuser plate 182, and at least one prism sheet 183. Figure 8 In the example shown, the optical laminate 180 further includes a prism sheet 184 and a polarizer 185. The optical laminate 180 is preferably located on the substrate 20 supporting the light emitting device 10, and the prism sheet 183 is preferably located on the emission side. The diffuser 182 is preferably located between the semi-transparent mirror 181 and the prism sheet 183.

[0122] The semi-transparent mirror 181 transmits a portion of light incident from the substrate 20 side and reflects a portion toward the substrate 20 side. Figure 9 A schematic top view of the semi-transparent mirror 181 is shown. The semi-transparent mirror 181 includes a plurality of holes 181h and 181g provided on the main surface. In this embodiment, the holes 181h and 181g are physical through-holes extending from one main surface to the other main surface. In the region of the holes 181h and 181g, the semi-transparent mirror 181 does not actually reflect light but allows it to pass through. Therefore, the size, number, and position of the holes 181h and 181g can be used to create a two-dimensional distribution of the light transmission and reflection characteristics of the semi-transparent mirror 181, thereby suppressing brightness and color unevenness and allowing light incident from the substrate side to be emitted toward the diffuser 182. In the case where the semi-transparent mirror 181 is composed of a translucent substrate and a dielectric multilayer film supported by the substrate, the same optical characteristics can be achieved by not providing holes in the substrate and not providing the dielectric multilayer film in the region of the holes 181h and 181g.

[0123] exist Figure 9 In the example shown, hole 181h is larger than hole 181g and is located above the four walls 174 (the portion of second light-reflecting member 170 that includes inclined surface 174s) surrounding light-emitting device 10. Holes 181g are arranged concentrically with respect to the center of light-emitting device 10. Furthermore, holes 181g are also located at the corners of the quadrilateral area surrounded by wall 174. By arranging holes 181h of larger diameter above wall 174, light leaks into the adjacent light-emitting element area at the boundary of wall 174, blurring the boundary line at the boundary defined by wall 174.

[0124] The diffuser 182 diffuses the light that has passed through the semi-transparent mirror 181 in the direction of travel, reducing uneven brightness and color. The prisms 183 and 184 change the direction of travel of the incident light by refracting it, causing it to be emitted forward. By arranging the prisms in an orthogonal manner, the prisms 183 and 184 further direct the light forward, thereby increasing the brightness in the forward direction. The polarizer 185, for example, reflects the S wave of the incident light and transmits the P wave, thereby aligning the polarization direction of the emitted light and increasing the brightness of the light emitted from the light-emitting device 10 on a specific polarization plane. This is particularly effective when the integrated light-emitting device 200 is used as a backlight for a liquid crystal panel.

[0125] like Figure 10A and Figure 10B As shown, a light source 90 used in a light emitting device according to another embodiment of the present invention may include a light emitting element 31 and a resin package 95 including a lead portion 93 and a resin portion 94. The light source 90 may include a wire 96a connecting the lead portion 93 and the light emitting element 31.

[0126] Resin portion 94 holds lead portion 93. Lead portion 93 includes first lead portion 91 and second lead portion 92. Resin package 95 has a recessed portion 94a with first lead portion 91, second lead portion 92, and a portion of resin portion 94 as a bottom surface 94b, and a portion of resin portion 94 as a side wall. The upper surface of the side wall of resin portion 94 has a bottomed opening that can serve as a cathode mark 94c. Note that cathode mark 94c can also serve as an anode mark.

[0127] The shape of the recessed portion 94 a of the resin portion 94 is not particularly limited. For example, the bottom surface 94 b may be a quadrilateral, particularly a square, when viewed from above.

[0128] The light emitting element 31 is arranged on the bottom surface 94b of the recess 94a. Figure 10A and Figure 10B In the embodiment, two light emitting elements are arranged on the bottom surface of the recess, but the number of light emitting elements may be one or more. The planar shape of the light emitting element 31 is not particularly limited, and may be, for example, a rectangle. Figure 10A and Figure 10BIn the embodiment, both light-emitting elements 31 are arranged across the first lead portion 91 and the second lead portion 92. The two light-emitting elements are connected in series. Specifically, the first lead portion 91 and one light-emitting element 31x are connected by a wire 96a, and one light-emitting element 31x is connected to the other light-emitting element 31y by a wire 96c. The wire can be a metal such as gold, copper, silver, platinum, aluminum, palladium, or an alloy wire containing one or more of these metals. It is particularly preferred to use a wire containing both gold and silver. When the wire contains both gold and silver, the silver content is, for example, in the range of 15% to 20%, 45% to 55%, 70% to 90%, or 95% to 99%.

[0129] A sealing member 98 is disposed within the recess 94a, with the upper surface of the sealing member 98 serving as a light emitting surface 98L of the light source. A wavelength conversion material may be included in the sealing member 98. Alternatively, a layer of wavelength conversion material may be disposed between the sealing member 98 and the light emitting element 31.

[0130] like Figure 11 As shown, the light source 90 is arranged on the substrate 20 , the light-transmitting member 50 is arranged on the light source 90 , and the light-reflecting layer 60 is arranged on the light-transmitting member 50 , thereby forming an LED package 99 .

[0131] The translucent member 50 disposed above the light source 90 contacts the light-emitting surface 98L and the upper surface of the sidewall of the resin portion 94. The translucent member 50 may be disposed within the cathode mark 94c of the resin portion 94. In this case, the cathode mark 94c can serve as an anchor for the translucent member 50 within the resin portion 94. This strengthens the close contact between the light source 90 and the translucent member 50.

[0132] The thickness of the light-transmitting member 50 can be specifically 200 μm to 2000 μm, preferably 300 μm to 1000 μm, and more preferably 350 μm to 600 μm. Furthermore, in a plan view, the ratio of the area of the upper surface of the sealing member 98 to the area of the upper surface of the sealing member 98 and the upper surface of the side wall of the resin portion 94 is preferably 0.25 to 0.5.

[0133] like Figure 12 As shown, in a light-emitting device 11 of another embodiment of the present invention, an LED package 99 containing a light source 90 is carried on a substrate 20, and the substrate 20 includes a wiring 21, a base 22 for configuring the wiring 21, and a covering layer 23, and a translucent covering component 70 including an annular lens portion 71 is arranged on the LED package 99.

[0134] The translucent cover member 70 may include a second translucent member 72 that covers the side surfaces of the translucent member 50, and a third translucent member 73 that covers the second translucent member 72 and constitutes the lens portion 71. As described above, the lens portion 71 covers at least the side surfaces of the translucent member 50, and the thickness of the light-reflecting layer 60 at the outer edge is thicker than the thickness of the light-reflecting layer 60 above the optical axis of the light-emitting element 31.

[0135] Description of Reference Numerals

[0136] 10, 11 light-emitting device; 20 substrate; 21 wiring; 22 base; 23 covering layer; 24 bonding member; 30 light source; 31, 31x, 31y light-emitting element; 31L light-emitting surface; 31a side surface; 31b lower surface; 31c upper surface; 31g outer edge; 32 semiconductor laminate; 33n electrode; 33p electrode; 34 wavelength conversion member; 34a outer edge; 35 fourth light-transmitting member; 36 metal layer; 40 covering member; 41 light-reflecting member; 50 light-transmitting member; 51 side surface; 60 light-reflecting layer; 61 outer edge; 62 peripheral area; 70 light-transmitting covering member; 71 lens portion; 72 second light-transmitting member; 73 third light-transmitting member; 74 fifth Translucent component; 75, 76 inner edge; 81 first layer; 82 second layer; 83 diffusion layer; 84 wavelength conversion component; 90 light source; 91 first lead portion; 92 second lead portion; 93 lead portion; 94 resin portion; 94a recess; 94b bottom surface; 94c cathode mark; 95 resin package; 96a wire; 96b wire; 96c wire; 98 sealing component; 98L light-emitting surface; 99 LED package; A optical axis; 174 wall portion; 174s inclined surface; 170 second reflecting component; 180 optical laminate; 181 semi-transparent mirror; 181h, 181g holes; 182 diffuser; 183, 184 prism sheet; 185 polarizer; 200 integrated light-emitting device.

Claims

1. An LED package, characterized in that: have: A light source comprising a light emitting element having a light emitting surface on an upper surface; a light-transmitting component, which is arranged above the light source; a light reflecting layer disposed on the light-transmitting member, The light source has a resin package and a light emitting element, The resin package comprises: a lead portion including a first lead portion and a second lead portion; a resin portion holding the lead portion; a recessed portion having the first lead portion, the second lead portion, and a portion of the resin portion as a bottom surface and a portion of the resin portion as a side wall, The light emitting element is placed on the bottom surface of the recess.

2. The LED package according to claim 1, wherein: The resin package and the light-transmitting member constitute at least a portion of the outer surface of the LED package.

3. The LED package according to claim 1, wherein: A wavelength conversion material is contained in the recess.

4. The LED package according to claim 1, wherein: The light reflecting layer includes a resin material containing a light reflecting substance.

5. The LED package according to claim 1, wherein: The light source includes a wire connecting the light emitting element to the first lead portion or the second lead portion.

6. The LED package according to claim 5, wherein: There are two light emitting elements, and the two light emitting elements are connected in series by the wire.

7. The LED package according to claim 1, wherein: When viewed from above, the light emitting element is rectangular.

8. The LED package according to claim 1, wherein: The resin package and the light-transmitting member constitute at least a portion of the outer surface of the LED package.

9. The LED package according to claim 1, wherein: A sealing member is provided in the recess, and the sealing member includes a wavelength conversion member.

10. The LED package according to claim 1, wherein: A sealing member is provided in the recess, and a wavelength conversion member is arranged between the sealing member and the light emitting element.

11. An integrated light emitting device, characterized in that: The invention relates to an integrated light emitting device in which the LED package according to claims 1 to 10 is arranged on a substrate.

12. The integrated light emitting device according to claim 11, wherein: There are a plurality of the LED packages, and the plurality of the LED packages are arranged on a substrate.

13. The integrated light-emitting device according to claim 11 or 12, characterized in that: In the integrated light emitting device, an optical laminate is provided on a side opposite to the substrate when viewed from the LED package.

14. The integrated light emitting device according to claim 13, wherein: The optical laminate includes at least a semi-transparent mirror, a diffusion plate, and at least one prism sheet.

Images