LED lamp bead and electronic equipment

Abstract

The invention provides an LED lamp bead and electronic equipment. The LED lamp bead comprises a substrate; the first cup body is arranged on the base plate, the second cup body is arranged at the central position in the first cup body, a central cavity is formed in the second cup body, and a peripheral cavity is formed between the first cup body and the second cup body; at least two RGB chip sets are arranged in the center cavity, a white light chip set is arranged in the peripheral cavity, white light chips in the white light chip set are connected in series, the white light chip set is arranged on the periphery of the RGB chip set in a surrounding mode, the RGB chip sets can conduct good color mixing with white light emitted by the surrounding white light chip set, and the excellent color effect is achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of lamp beads, and particularly relates to an LED lamp bead and an electronic device. Background Art

[0002] LED technology presents a promising future, with development trends focused on achieving higher brightness, improved weather resistance, higher luminous density and uniformity, and lower costs. As the market matures, stricter requirements are being placed on the power, color, luminous efficiency, and integration of LED lamps. Consequently, lamp design demands continuous optimization of form factors, enhanced circuit compatibility, richer color options, and longer lifespans.

[0003] To meet these requirements, LED lamps must also achieve improved optoelectronic performance, color diversity, stability, and reliability. Regarding optoelectronic characteristics, the voltage, power, and luminous efficiency of the lamps must be continuously improved to meet the design requirements of diverse customers. Color diversity has expanded from single-color and RGB lamp combinations to RGBW, RGBWW, and more. Regarding reliability, the focus is on improving heat dissipation and increasing bracket strength.

[0004] For the existing lamp beads, take the 5054RGBWW full-color dual-color temperature lamp bead as an example. It consists of three bowls separated by a partition wall. The middle bowl contains the RGB chip, and the upper and lower bowls contain white light chips. They are sealed with transparent glue or transparent glue with a diffusing agent to form full-color RGB. The upper and lower bowls are sealed with corresponding fluorescent glue to form white light of different color temperatures. However, it has the following problems:

[0005] 1. Uneven light distribution: The distance between the lamp beads and the cup wall can easily cause uneven light distribution, resulting in light spots, shadows, and overlapping images on the edge of the cup. Since the LED chips are already spaced apart in the lamp beads, the distance between the lamp beads in the lamp is greater, resulting in a larger spacing between the light points. This will cause the overall brightness to decrease, the color light distribution to be scattered, and affect the lighting effect.

[0006] 2. The color mixing effect is not ideal: In LED lamps, such as 5054RGBWW full-color dual-color temperature lamp beads, the spacing design of the cup shape and the partition wall will affect the mixing effect of the overall color light of the lamp beads. The three bowl cups are separated by a plastic partition wall and are distributed in a strip shape. At this time, the light of the LED chip in the corresponding bowl cup can only be emitted by the upper surface of the corresponding bowl cup. The upper and lower bowl cups are on both sides, and the two white lights are located in different cups. The light emitted by the LED in each cup will be separated by the cup wall, resulting in obvious light spots and shadows. The cup mouth area is small and the spacing distance is large, resulting in a smaller light-emitting surface of the LED light and unsatisfactory light mixing effect between cups. Summary of the Invention

[0007] In order to solve the above technical problems, the present invention provides an LED lamp bead and an electronic device to solve the problems in the above background technology.

[0008] The invention provides the following technical solution: an LED lamp bead, comprising:

[0009] substrate;

[0010] a first cup body disposed on the substrate and a second cup body disposed at a central position within the first cup body, wherein a central cavity is formed within the second cup body, a peripheral cavity is formed between the first cup body and the second cup body, and an encapsulation layer is disposed on both the first cup body and the second cup body;

[0011] At least two RGB chip sets are provided in the central cavity;

[0012] A white light chipset is provided in the peripheral cavity. The white light chips in the white light chipset are connected in series. The white light chipset is arranged around the periphery of the RGB chipset.

[0013] Compared with the prior art, the present application has the following advantages: In terms of heat dissipation performance, the present invention significantly reduces thermal resistance by adopting a large pad heat dissipation and a direct-type thermoelectric separation heat dissipation structure, thereby significantly reducing the risk of LED damage due to overheating. This improvement in heat dissipation performance not only enhances the reliability of the LED, but also facilitates the expansion of lamp bead power and voltage. The LED chips can be evenly distributed on different pin functional area frames as needed to ensure uniform heat distribution of the lamp beads. In terms of light distribution and color mixing effects, the reduction in lamp bead thermal resistance and the optimization of functional area allow more chips to be placed in the cup, thereby improving light density, light intensity, and luminous uniformity. The present invention uses a uniform complementarity of white light chipsets to achieve overall complementarity of white light. Only a small number of lamp beads are required to meet the optoelectronic parameter requirements and achieve uniform illumination, which is beneficial to the uniform design of the lamp and saves costs. Secondly, because the chips in the lamp bead are evenly distributed, the light source can more evenly illuminate the target area, reducing the occurrence of light spots and shadows. In particular, the RGB chipset is located in the middle, which can achieve good color mixing with the surrounding white light, achieving excellent color effects.

[0014] Preferably, the inner edges of the first cup body and / or the second cup body are square or circular.

[0015] Preferably, the RGB chipset includes three monochrome chips, which are a red light chip, a green light chip and a blue light chip respectively, and the monochrome chips with the same luminous color in each RGB chipset are connected in series.

[0016] Preferably, a fluorescent glue layer with the same or different color temperatures is provided on the white light chips in the white light chipset, so that each of the white light chips emits white light with the same or different color temperatures.

[0017] Preferably, a first partition retaining wall is provided between the first cup body and the second cup body, and the first partition retaining wall is used to divide the peripheral cavity into a plurality of first sub-areas.

[0018] Preferably, there are at least two groups of white light chip groups, and a second partition retaining wall is provided between two adjacent groups of white light chip groups. The second partition retaining wall is used to divide the peripheral cavity into several second sub-areas, and at least two groups of white light chip groups are independently or jointly arranged around the periphery of the RGB chip group.

[0019] Preferably, the second cup body is higher than the first cup body, and the packaging layer includes a first packaging glue layer arranged in the central cavity, a second packaging glue layer arranged in the peripheral cavity, and a third packaging glue layer arranged in the height gap between the first cup body and the second cup body.

[0020] Preferably, a plurality of solder pads are provided on the substrate, and the number of the white light chip groups increased is equal to the number of the solder pads increased.

[0021] Preferably, a marking corner is provided at a corner point of the first cup body.

[0022] The invention provides the following technical solution: an electronic device comprising the above-mentioned LED lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A three-dimensional diagram of an LED lamp bead provided in Example 1 of the present invention;

[0025] Figure 2 A plan view of an LED lamp bead provided in Example 1 of the present invention;

[0026] Figure 3 A three-dimensional diagram of a solder pad provided in Example 1 of the present invention;

[0027] Figure 4 A three-dimensional diagram of an LED lamp bead provided in Example 2 of the present invention;

[0028] Figure 5A plan view of an LED lamp bead provided in Example 2 of the present invention;

[0029] Figure 6 A three-dimensional diagram of an LED lamp bead provided in Example 3 of the present invention;

[0030] Figure 7 A plan view of an LED lamp bead provided in Example 3 of the present invention;

[0031] Figure 8 A three-dimensional diagram of an LED lamp bead provided in the fourth embodiment of the present invention;

[0032] Figure 9 A three-dimensional diagram of a solder pad provided in the fourth embodiment of the present invention;

[0033] Figure 10 A plan view of an LED lamp bead provided in Example 5 of the present invention;

[0034] Figure 11 A three-dimensional diagram of a solder pad provided in a fifth embodiment of the present invention;

[0035] Figure 12 This is a plan view of the LED lamp bead provided in Example 6 of the present invention.

[0036] Description of reference numerals:

[0037] substrate 1 pads 2 First cup 3 Second cup 4 RGB chipset 5 White light chipset 6 Bonding wire 7 Fluorescent adhesive layer 8 First partition retaining wall 9 Second partition retaining wall 10 First encapsulation layer 11 Second encapsulation layer 12 The third encapsulation layer 13 Logo corner 14

[0038] The present invention will be further described below with reference to the accompanying drawings and their descriptions. DETAILED DESCRIPTION

[0039] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0040] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0042] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0043] Example 1

[0044] like Figure 1-3 As shown, in the first embodiment of the present invention, it specifically discloses an LED lamp bead, including:

[0045] substrate1;

[0046] Specifically, in this embodiment, a plurality of solder pads 2 are further provided on the substrate 1. The substrate 1 is made of plastic material, which may be a non-conductive material such as PPA, PCT, or EMC. The solder pads 2 are directly provided on the substrate 1. The solder pads 2 are made of metal material, which may be copper, iron, aluminum, or an alloy. The solder pads 2 are distributed in a plane on the substrate 1. White stripes are provided between the solder pads 2, and the number of solder pads 2 is determined according to the number of chips in the RGB chipset 5 and the white light chipset 6. The solder pads 2 and the RGB chipset 5 and the white light chipset 6 in this application adopt a direct-down thermoelectric separation heat dissipation structure, which greatly reduces the thermal resistance and significantly reduces the risk of damage to the LED due to overheating. This improvement in heat dissipation performance not only enhances the reliability of the LED, but also facilitates the expansion of the power and voltage of the lamp beads. The LED chips can be evenly distributed on the pin functional area frame of different solder pads 2 as needed to ensure uniform heat distribution of the lamp beads.

[0047] A first cup body 3 is provided on the substrate 1, and a second cup body 4 is provided at the center of the first cup body 3. A central cavity is formed in the second cup body 4, and a peripheral cavity is formed between the first cup body 3 and the second cup body 4. An encapsulation layer is provided on both the first cup body 3 and the second cup body 4.

[0048] Specifically, the first cup body 3 is fixed on the substrate 1, and the first cup body 3 has a bowl-cup structure, so a cavity is formed in the first cup body 3, and the second cup body 4 is provided at the center of the cavity. The colors and materials of the second cup body 4 and the first cup body 3 can be designed in various ways according to the purpose: such as white PCT, white PPA, black PPA, transparent PC, white EMC, white ceramic, etc., so the first cup body 3 and the second cup body 4 form a cup-in-cup structure, and the second cup body 4 is also a cup-shaped structure, so a central cavity is formed in the second cup body 4, and an outer cavity is formed between the inner wall of the first cup body 3 and the outer wall of the second cup body 4. The outer cavity is arranged on the periphery of the central cavity, and the two are separated by the second cup body 4.

[0049] Several groups of RGB chipsets 5 are provided in the central cavity;

[0050] Specifically, in this embodiment, a single RGB chip set 5 includes three monochrome chips, namely a red chip, a green chip, and a blue chip, and the monochrome chips emitting the same color are connected in series, such as the red chips connected in series, the green chips connected in series, and the blue chips connected in series. The voltage of the monochrome chips is 3V. In practice, the number of RGB chip sets 5, the number of monochrome chips, and the voltage of the monochrome chips can be adjusted according to actual needs. In this embodiment, the number of RGB chip sets is three.

[0051] The white light chips in the white light chipset 6 are connected in series, and the white light chipset 6 is arranged around the periphery of the RGB chipset 5;

[0052] For a single group of white light chipset 6, it includes several white light chips connected in series, several white light chips are evenly distributed in the peripheral cavity, and several white light chips are arranged around the periphery of the RGB chipset 5. Through the coordinated mixed light emission between the middle RGB chipset 5 and the peripheral white light chipset 6, good color mixing can be achieved, achieving excellent color effects, and also achieving overall complementarity of white light.

[0053] It should be noted that, in the embodiment, the white light chip group 6 is provided with a group, which includes 9 3V white light chips, and in this embodiment, there are eight pads 2, and the RGB chip group 5 is provided with three groups, so there are 9 monochrome chips in the central cavity. The monochrome chips in this application are all dual-electrode chips. From top to bottom and from left to right, the pads 2 are respectively recorded as pads a to h, and the pads 2 located on the upper side are pads a, c, e, and g, respectively, and the pads 2 located on the lower side are pads b, d, f, and h, respectively. The three red light chips are connected to On pads e and f, three green light chips are connected to pads c, d, and f respectively, three blue light chips are connected to pads f, g, and h respectively, and nine white light chips are evenly distributed on pads a to h. The present invention adopts a solution that combines dual-electrode red light with insulating glue (about 99% silicone resin) to successfully remove the silver glue, thereby completely solving the dead light problem caused by the peeling of red light silver glue. It should also be noted that in the drawings of this application, the "+" and "-" at the upper and lower positions of the pads in the drawings represent the positive and negative poles, respectively.

[0054] Meanwhile, it should be noted that the number of white light chip groups 6 increased is equal to the number of solder pads 2 increased.

[0055] In this embodiment, the white light chip group 6 is a group, so the corresponding initial number of pads 2 is 8, that is, four groups. When the white light chip group 6 is increased to two groups, the number of corresponding pads 2 needs to be increased by one group, that is, 5 groups, 10 pads.

[0056] In this embodiment, the RGB chipset 5 and the white light chipset 6 are evenly connected to the corresponding pads 2 through bonding wires 7 .

[0057] The inner edge of the first cup body 3 is circular, and the inner edge of the second cup body 4 is circular.

[0058] Specifically, the cup-in-cup structure presents an inner circle and outer circle structure. By setting the first cup body 3 and the second cup body 4 in a circular arrangement, the light source can illuminate the target area more evenly, reducing the appearance of light spots and shadows. At the same time, all the solder pads 2 can be tightly connected together, further improving the overall strength of the lamp bead.

[0059] In this embodiment, the white light chips of each group of the white light chip group 6 are provided with a fluorescent glue layer 8 with the same or different color temperatures, so that each of the white light chips emits white light with the same or different color temperatures;

[0060] Specifically, the fluorescent glue layer 8 can be prepared by spraying fluorescent glue with fluorescent powder or spot-coating fluorescent glue with fluorescent powder. For the entire lamp bead structure, different fluorescent powder layers 8 are selected and attached to the white light chip group 6 according to actual conditions. The color temperature of the light emitted by the white light chip can be set to be all the same, partially the same or all different, so as to further enhance the complementary and mixed light effects.

[0061] The second cup body 4 is higher than the first cup body 3, and the encapsulation layer includes a first encapsulation adhesive layer 11 provided in the central cavity, a second encapsulation adhesive layer 12 provided in the peripheral cavity, and a third encapsulation adhesive layer 13 provided in the height gap between the first cup body and the second cup body;

[0062] Specifically, the encapsulation glue can be transparent glue or transparent glue filled with a diffusing agent. The preparation order of the encapsulation layer is to first prepare a first encapsulation glue layer 11 in the central cavity, and then prepare a second encapsulation glue layer 12 in the peripheral cavity. The height of the first encapsulation glue layer 11 and the second encapsulation glue layer 12 are the same. Then, a third encapsulation glue layer 13 is prepared on the first encapsulation glue layer 11 and the second encapsulation glue layer 12 to further enhance the light mixing effect.

[0063] In this embodiment, a marking corner 14 is provided at a corner point of the first cup body 3 .

[0064] Specifically, the identification angle 14 is used to identify the direction of the lamp beads to facilitate processing.

[0065] Example 2

[0066] like Figure 4-5 As shown, in the second embodiment of the present invention, it specifically discloses an LED lamp bead. The difference between the LED lamp bead provided in the second embodiment and the LED lamp bead provided in the first embodiment is that: the inner edge of the first cup body 3 is set in a square shape;

[0067] Specifically, the cup-in-cup structure in the second embodiment has an inner circle and outer square structure, which can also achieve uniform light output and mixed light output of the RGB chipset 5 and the white light chipset 6. Correspondingly, due to the change in the shape of the first cup body 3, the second encapsulation adhesive layer 12 and the third encapsulation adhesive layer 13 will change with the shape of the first cup body 3.

[0068] Example 3

[0069] like Figure 6-7 As shown, in the third embodiment of the present invention, it specifically discloses an LED lamp bead. The difference between the LED lamp bead provided in the third embodiment and the LED lamp bead provided in the first embodiment is that: the inner edge of the first cup body 3 is set in a square shape, and the inner edge of the second cup body 4 is set in a square shape;

[0070] Specifically, the cup-in-cup structure in the second embodiment has an inner square and outer square structure, which can also achieve uniform light output and mixed light output of the RGB chipset 5 and the white light chipset 6. Correspondingly, due to the change in the shape of the first cup body 3 and the second cup body 4, the first encapsulation adhesive layer 11, the second encapsulation adhesive layer 12, and the third encapsulation adhesive layer 13 will change with the shape of the first cup body 3 and the second cup body 4.

[0071] It should be noted that, in another embodiment of the present invention, the cup-in-cup structure has an inner square and outer circle structure, which will not be described in detail here for the sake of simplicity.

[0072] Example 4

[0073] like Figure 8-9 As shown, in the fourth embodiment of the present invention, a LED lamp bead is specifically disclosed. The difference between the LED lamp bead provided in the fourth embodiment and the LED lamp bead provided in the first embodiment is that: the white light chip group 6 is two groups;

[0074] In this embodiment, two groups of white light chip groups 6 are provided in the peripheral cavity, and the two groups of white light chip groups 6 are surrounded by the periphery of the RGB chip 5, and the two groups of white light chip groups 6 are arranged in sequence, that is, they are diffused outward with the central cavity as the center, and the two groups of white light chip groups 6 can emit white light with the same color temperature or white light with different color temperatures to enhance the mixed light effect, and the two groups of white light chip groups 6 include a total of 18 3V white light chips, and these white light chips are distributed in a similar manner to the white light chips in Example 1, and are evenly distributed on the pads. At the same time, in this embodiment, in order to ensure that the two groups of white light chip groups 6 can be smoothly connected, the number of pads 2 in this embodiment is increased to 10, such as the pads aj in the figure, so that the 18 white light chips can be evenly connected to the corresponding pads 2 through bonding wires, that is, the increased number of white light chip groups 6 in the above embodiment is equal to the increased number of pads 2.

[0075] Example 5

[0076] like Figure 10-11 As shown, in the fifth embodiment of the present invention, it specifically discloses an LED lamp bead. The difference between the LED lamp bead provided in the fifth embodiment and the LED lamp bead provided in the first embodiment is that: the inner edge of the first cup body 3 is set in a square shape, and a first partition retaining wall 9 is provided between the first cup body 3 and the second cup body 4. The first partition retaining wall 9 is used to divide the peripheral cavity into a plurality of first sub-areas;

[0077] Specifically, one end of the first partition retaining wall 9 is connected to the first cup body 3, and the other end is connected to the second cup body 4. Therefore, by setting at least two first partition retaining walls 9, the peripheral cavity can be divided into several first sub-areas. The shape of the first sub-area can be determined according to the shape of the first cup body 3, the shape of the second cup body 4 and the number of first partition retaining walls 9. In this embodiment, each first sub-area is provided with a group of white light chip groups 6, each group includes 9 white light chips, and since the number of white light chip groups 6 increases, the number of pads 2 in this embodiment is increased to 10, so that 18 white light chips can be evenly connected to the corresponding pads 2 through bonding wires, and the color temperature of the fluorescent glue layer 8 of each white light chip can be the same or different.

[0078] Meanwhile, in other embodiments of the present invention, the first partition retaining wall 9 can cooperate with the first cup body 3 and the second cup body 4 of different shapes, and each first sub-area can also have two groups of white light chip groups 6, or even more.

[0079] Example 6

[0080] like Figure 12 As shown, in the sixth embodiment of the present invention, it specifically discloses an LED lamp bead. The difference between the LED lamp bead provided in the sixth embodiment and the LED lamp bead provided in the first embodiment is that: the inner edges of the first cup body 3 and the second cup body 4 are both square, and a second partition retaining wall 10 is provided between two adjacent groups of the white light chip groups 6. The second partition retaining wall 10 is used to divide the peripheral cavity into a plurality of second sub-areas;

[0081] Specifically, the second partition retaining wall 10 is arranged between two adjacent groups of white light chip groups 6. Therefore, by setting at least one second partition retaining wall 10, the peripheral cavity can be divided into a plurality of second sub-areas. The second sub-areas are arranged in a ring shape. The number of the second sub-areas can be determined according to the number of the second partition retaining walls 10. In this embodiment, each second sub-area is provided with a group of white light chip groups 6, each group includes 9 white light chips, and since the number of groups of white light chip groups 6 increases, the number of pads 2 in this embodiment is increased to 10, so that 18 white light chips can be formed. The optical chips can be evenly connected to the corresponding pads 2 through bonding wires, and the color temperature of the fluorescent glue layer 8 of each white light chip can be the same or different. The second partition retaining wall 10 can only be set when the number of white light chip groups 6 extending outward is greater than 2 groups, and the number of groups of white light chip groups 6 extending outward is 1 to 5 groups. When the second partition retaining wall 10 is not set, the two groups of white light chip groups 6 are jointly surrounded by the periphery of the RGB chip group 5. When the second partition retaining wall 10 is set, the two groups of white light chip groups 6 are independently surrounded by the periphery of the RGB chip group 5.

[0082] At the same time, in other embodiments of the present invention, the second partition retaining wall 10 can be coordinated with the first cup body 3 and the second cup body 4 of different shapes. At the same time, there can also be two groups of white light chip groups 6 in each second sub-area. The number of second partition retaining walls 10 can be two or even more, and the first partition retaining wall 9 can also be coordinated with the second partition retaining wall 10, that is, the second sub-area is partitioned by the first partition retaining wall 9.

[0083] Meanwhile, in another embodiment of the present invention, an electronic device is provided, which includes the LED lamp beads provided in the above embodiment.

[0084] In summary, the LED lamp beads in the above embodiments of the present invention have the following beneficial effects compared with the prior art: in terms of heat dissipation performance, the present invention achieves a significant reduction in thermal resistance by adopting a large pad heat dissipation and a direct-down thermoelectric separation heat dissipation structure, thereby significantly reducing the risk of damage to the LED due to overheating. This improvement in heat dissipation performance not only enhances the reliability of the LED, but also facilitates the expansion of the power and voltage of the lamp beads. The LED chips can be evenly distributed on different pin functional area frames according to needs to ensure uniform heat distribution of the lamp beads; in terms of light distribution and color mixing effects, the thermal resistance of the lamp beads is The reduction of and optimization of the functional area allow more chips to be placed in the cup, thereby improving the light density, light intensity and luminous uniformity. The present invention adopts the uniform complementation of the white light chip group 6 to achieve overall complementarity of white light. Only a small number of lamp beads are needed to meet the photoelectric parameter requirements and achieve uniform lighting, which is beneficial to the uniformity design of the lamp and saves costs. Secondly, since the chips in the lamp beads are evenly distributed, the light source can illuminate the target area more evenly, reducing the appearance of light spots and shadows. In particular, the RGB chipset 5 is located in the middle, which can perform good color mixing with the surrounding white light to achieve excellent color effects.

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An LED lamp bead, characterized in that: include: base(1); A first cup body (3) is provided on the substrate (1), and a second cup body (4) is provided at a central position in the first cup body (3), a central cavity is formed in the second cup body (4), a peripheral cavity is formed between the first cup body (3) and the second cup body (4), and an encapsulation layer is provided on both the first cup body (3) and the second cup body (4); At least two RGB chip groups (5) are provided in the central cavity; A white light chip group (6) is provided in the peripheral cavity, the white light chips in the white light chip group (6) are connected in series, and the white light chip group (6) is arranged around the periphery of the RGB chip group (5).

2. The LED lamp bead according to claim 1, characterized in that: The inner edges of the first cup body (3) and / or the second cup body (4) are arranged in a square or circular shape.

3. The LED lamp bead according to claim 1, characterized in that: The RGB chip group (5) comprises three monochrome chips, which are respectively a red light chip, a green light chip and a blue light chip. The monochrome chips with the same luminous color in each group of the RGB chip group (5) are connected in series.

4. The LED lamp bead according to claim 1, characterized in that: The white light chips in the white light chip group (6) are provided with a fluorescent glue layer (8) with the same or different color temperatures, so that each of the white light chips emits white light with the same or different color temperatures.

5. The LED lamp bead according to claim 1, characterized in that: A first partition retaining wall (9) is provided between the first cup body (3) and the second cup body (4), and the first partition retaining wall (9) is used to separate the peripheral cavity into a plurality of first sub-areas.

6. The LED lamp bead according to claim 1, characterized in that: There are at least two groups of white light chip groups (6), and a second partition retaining wall (10) is provided between two adjacent groups of white light chip groups (6). The second partition retaining wall (10) is used to separate the peripheral cavity into a plurality of second sub-areas. At least two groups of white light chip groups (6) are independently or jointly arranged around the periphery of the RGB chip group (5).

7. The LED lamp bead according to claim 1, characterized in that: The second cup body (4) is higher than the first cup body (3), and the encapsulation layer includes a first encapsulation glue layer (11) arranged in the central cavity, a second encapsulation glue layer (12) arranged in the peripheral cavity, and a third encapsulation glue layer (13) arranged in the height gap between the first cup body (3) and the second cup body (4).

8. The LED lamp bead according to claim 1, characterized in that: A plurality of solder pads (2) are provided on the substrate (1), and the number of white light chip groups (6) increased is equal to the number of solder pads (2) increased.

9. The LED lamp bead according to any one of claims 1 to 8, characterized in that: A marking corner (14) is provided at a corner point of the first cup body (3).

10. An electronic device, characterized in that: The electronic device comprises the LED lamp bead according to any one of claims 1 to 9.

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