Display mother board, preparation method thereof and display mother board prefabricated part

Abstract

The invention provides a display mother board and a preparation method thereof, and a display mother board prefabricated member, and the preparation method of the display mother board comprises the steps: forming a shielding structure in a frame region before a light-emitting functional material layer is formed, and forming a first packaging layer after the first packaging layer is formed; the shielding structure and the first packaging layer, the light-emitting function material layer and the second electrode layer on the side, away from the substrate, of the shielding structure are removed, the film layer evaporated in the frame area is prevented from cracking or stripping under the pressure of subsequent cleaning equipment, the situation that a light-emitting layer is corroded due to corrosion of subsequent etching liquid medicine, and then large-area film layer stripping is caused is avoided, and the yield of the light-emitting device is improved. The evaporation equipment pollution and the etching abnormity are avoided, the yield loss is avoided, and the performance of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display motherboard and a preparation method thereof, and a display motherboard prefabricated part. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, power saving, thin body, and wide application range, becoming the mainstream display device.

[0003] Traditional display panel manufacturing typically uses a fine metal mask (FMM) to pattern luminescent pixels. FMM technology is mature and boasts extensive mass production experience. However, it also suffers from limitations such as limited precision, high development costs, and long development cycles. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-area scalability, and agile delivery. Patent applications CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe FMM-free technology for reference.

[0004] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0005] In view of this, the purpose of this application is to provide a method for preparing a display motherboard, which is beneficial to improving the performance of the display panel.

[0006] Based on the above objectives, the present application provides a method for preparing a display motherboard, which comprises: A substrate is provided; the substrate has a first side and a second side opposite to each other, the substrate has a functional area and a frame area surrounding the functional area, the functional area includes a plurality of panel areas; forming an array functional layer on the first side of the substrate, wherein the array functional layer is located in the functional area; forming a shielding structure on the first side of the substrate, wherein the shielding structure is located in the frame area; A light-emitting functional material layer is formed in the functional area and the frame area; wherein the light-emitting functional material layer at least covers a side of the shielding structure away from the substrate and a side of the array functional layer away from the substrate; forming a second electrode layer on a side of the light-emitting functional material layer away from the substrate; wherein the second electrode layer is located in the functional area and the frame area; forming a first encapsulation layer on a side of the second electrode layer away from the substrate; wherein the first encapsulation layer is located in the functional area and the frame area; The blocking structure and the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer on a side of the blocking structure away from the substrate are removed.

[0007] In one embodiment, after removing the blocking structure and the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer on a side of the blocking structure away from the substrate, the method further includes: The first encapsulation layer, the light-emitting functional material layer, and the second electrode layer remaining on the substrate are patterned.

[0008] In one embodiment, after removing the blocking structure and the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer on a side of the blocking structure away from the substrate, and before patterning the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer remaining on the substrate, the method further includes: The first encapsulation layer remaining on the substrate is cleaned using a cleaning device; wherein, during cleaning, a roller of the cleaning device rolls in an area of the frame region where the shielding structure is removed and contacts the substrate.

[0009] In one embodiment, patterning the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer remaining on the substrate includes: Patterning the first encapsulation layer by dry etching to form a first encapsulation unit with a plurality of first light-emitting units; The light-emitting functional material layer and the second electrode layer are patterned by wet etching to form a plurality of light-emitting functional layers of the first light-emitting units and a plurality of second electrodes.

[0010] In one embodiment, after patterning the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer remaining on the substrate, the method further includes: A second encapsulation layer and a third encapsulation layer are sequentially formed on a side of the first encapsulation layer away from the substrate.

[0011] In one embodiment, after sequentially forming the second encapsulation layer and the third encapsulation layer on a side of the first encapsulation layer away from the substrate, the method further includes: removing the substrate; Cutting is performed to obtain a plurality of panel units.

[0012] Based on the same inventive concept, the present application also discloses a display motherboard, which is prepared by any of the above-mentioned methods for preparing a display motherboard.

[0013] Based on the same inventive concept, the present application also discloses a display motherboard prefabricated component, which includes: A substrate having a first side and a second side opposite to each other, the substrate having a functional area and a frame area surrounding the functional area, the functional area including a plurality of panel areas; an array functional layer, disposed on the first side of the substrate and located in the functional area; a shielding structure, disposed on the first side of the substrate and located in the frame area; a light-emitting functional material layer, disposed in the functional area and the frame area, the light-emitting functional material layer at least covering a side of the shielding structure away from the substrate and a side of the array functional layer away from the substrate; a second electrode layer, disposed on a side of the light-emitting functional material layer in the functional area and the frame area away from the substrate; The first packaging layer is arranged on a side of the second electrode layer in the functional area and the frame area away from the substrate.

[0014] In one embodiment, after the first encapsulation layer is formed, the shielding structure and the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer on a side of the shielding structure away from the substrate are removed.

[0015] In one embodiment, the array functional layer comprises: An isolation structure is provided on the first side of the substrate, and the isolation structure encloses a plurality of isolation openings; a first electrode layer, the first electrode layer comprising a plurality of first electrodes, wherein orthographic projections of the first electrodes on the substrate are at least partially located within orthographic projections of corresponding isolation openings on the substrate; The light-emitting functional material layer is separated by the isolation structure, the light-emitting functional material layer partially covers the isolation structure, and partially is located in the isolation opening and covers the first electrode; The second electrode layer is separated by the isolation structure, the second electrode layer is partially located on a side of the light-emitting functional material layer away from the isolation structure, and partially located in the isolation opening to cover the light-emitting functional material layer, and the second electrode layer located in the isolation opening is electrically connected to the isolation structure; The first packaging layer is partially located on a side of the second electrode layer away from the isolation structure, and partially located in the isolation opening and covering the second electrode layer.

[0016] In one embodiment, the isolation structure includes a support portion and a crown portion, the crown portion is located on a side of the support portion away from the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate.

[0017] In one embodiment, the supporting portion includes a first supporting portion and a second supporting portion, the first supporting portion is located between the second supporting portion and the substrate, the orthographic projection of the second supporting portion on the substrate is located within the orthographic projection of the first supporting portion on the substrate, and the second electrode layer located in the isolation opening is arranged in contact with the first supporting portion.

[0018] In one embodiment, the array functional layer further comprises: The pixel defining layer is arranged on the first side of the substrate. The isolation structure is arranged on the side of the pixel defining layer away from the substrate. The pixel defining layer defines a pixel opening connected to the isolation opening, and the pixel opening exposes the corresponding first electrode.

[0019] In one embodiment, the shielding structure includes an adhesive tape, and the adhesive tape is bonded to the substrate.

[0020] In one embodiment, the display motherboard preform further includes: a second packaging layer, disposed on a side of the first packaging layer away from the substrate; The third packaging layer is arranged on a side of the second packaging layer away from the substrate.

[0021] Compared with the prior art, the method for preparing a display motherboard provided in the present application forms a shielding structure in the border area before the light-emitting functional material layer is formed, and after the first packaging layer is formed, removes the shielding structure and the first packaging layer, the light-emitting functional material layer and the second electrode layer on the side of the shielding structure away from the substrate, thereby preventing the film layer evaporated in the border area from cracking or peeling under the pressure of subsequent cleaning equipment, thereby preventing the subsequent etching solution from corroding the light-emitting layer, and causing large-area film peeling, avoiding contamination of the vapor deposition equipment and etching abnormalities, avoiding yield loss, and being beneficial to improving the performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in this application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are merely embodiments of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] Figure 1 is a schematic diagram of a related display panel; Figure 2 is a schematic diagram of a layer structure of a related display panel; Figure 3 A schematic diagram of a related display motherboard preparation process; Figure 4 A schematic diagram of a display motherboard prefabricated member provided in one embodiment of the present application; Figure 5 A schematic diagram of the film structure of a display motherboard preform provided in another embodiment of the present application; Figure 6 A schematic diagram of an isolation structure of a display motherboard preform provided in another embodiment of the present application; Figure 7 A schematic diagram of the film structure of a display motherboard preform provided in another embodiment of the present application; Figure 8 A schematic diagram of a film layer of a display motherboard preform provided in another embodiment of the present application; Figure 9 A schematic diagram of a film layer of a display motherboard preform provided in another embodiment of the present application; Figure 10 A schematic diagram of a partial film structure of a display motherboard preform provided in another embodiment of the present application; Figure 11 A schematic diagram of a pixel circuit in a display motherboard preform provided by another embodiment of the present application; Figure 12 A schematic flow chart of a method for preparing a display motherboard according to another embodiment of the present application; Figure 13 A schematic diagram of a panel unit provided in another embodiment of the present application.

[0024] Marking Description: 100, display panel; 210, functional area; 211, panel area; 220, frame area; 300, scroll wheel; 400, display motherboard preform; 410, first electrode layer; 420, light-emitting functional material layer; 430, second electrode layer; 440, first encapsulation layer; 441, first encapsulation unit; 450, second encapsulation layer; 460, third encapsulation layer; 500, shielding structure; 1. Substrate; 11. Planarization layer; 12. Transistor; 2. Isolation structure; 21. Isolation opening; 22. Support portion; 221. First support portion; 222. Second support portion; 23. Crown portion; 3. Light-emitting unit; 31. First electrode; 32. Light-emitting functional layer; 321. Hole injection layer; 33. Second electrode; 4. Pixel definition layer. DETAILED DESCRIPTION

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0027] It should be noted that similar reference numerals and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures. It should be noted that different features in the embodiments of the present application can be combined with each other without conflict.

[0028] For ease of understanding, the drawings show mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is referred to as the X-direction, the direction along the Y-axis is referred to as the Y-direction, and the direction along the Z-axis is referred to as the Z-direction. The Z-direction is the normal direction relative to the plane containing the X-direction and the Y-direction. In addition, the situation where various elements are viewed parallel to the plane containing the X-direction and the Y-direction is referred to as a top view. Alternatively, the planes in the X-direction and the Y-direction are parallel to the display surface of the display panel, and the Z-direction is parallel to the thickness direction of the display panel.

[0029] For certain elements, terms such as "upper" or "above" are sometimes used to describe the position of the element in the Z direction, while "lower" or "below" is used to describe the position of the element in the opposite direction. In addition, when terms such as "upper," "above," "lower," "below," and "relatively" are used to define the relative position of two elements, they include not only a state in which the two elements are directly connected, but also a state in which the two elements are separated by a gap or other elements. In addition, terms such as "first," "second," and "third" are used only to distinguish and describe, and should not be understood to indicate or imply relative importance.

[0030] Reference Figure 1-2 As shown, it is a structural schematic diagram of a related display panel, which includes a substrate 1 and an isolation structure 2 arranged on one side of the substrate 1. The isolation structure 2 encloses an isolation opening 21 for accommodating the light-emitting unit 3, and adjacent light-emitting units 3 are separated by the isolation structure 2.

[0031] Among them, an isolation structure 2 is provided to separate the functional film layers of adjacent light-emitting units 3. In this way, in the evaporation process of multiple functional film layers of the light-emitting unit, the entire surface of the substrate 1 is evaporated without the help of metal fineness. Therefore, the process of evaporation using the isolation structure 2 does not need to consider the positioning accuracy during evaporation, so that the gap between the light-emitting units 3 can be designed to be smaller to increase the pixel density.

[0032] Reference Figure 3 As shown, during preparation, it is necessary to first form a display motherboard, and then cut the display motherboard to obtain a display panel. The display motherboard has a functional area 210 and a border area 220 surrounding the functional area 210. The film layer in the functional area 210 forms a display panel after cutting, and the border area 220 is usually discarded as waste. Among them, multiple functional film layers are all evaporated on the substrate 1 on the entire surface, and exist in both the functional area 210 and the border area 220. After evaporating the first encapsulation layer 440, it is necessary to use a cleaning device to clean the display motherboard to facilitate the subsequent graphic process. After long-term research, the inventor found that the roller 300 of the cleaning equipment will press on the first encapsulation layer 440 in the border area 220, causing the first encapsulation layer 440 in the border area 220 to crack or peel off, which in turn causes the etching solution to erode the light-emitting layer, thereby causing large-area film peeling, causing contamination of the evaporation equipment and etching abnormalities, as well as yield loss.

[0033] Based on this, the present application provides a display motherboard solution, as detailed in the following embodiments.

[0034] Reference Figure 4 and 5As shown, an embodiment of the present application discloses a display motherboard preform 400, including a substrate 1, an array functional layer, a shielding structure 500, a light-emitting functional material layer 420, a second electrode layer 430 and a first packaging layer 440; the substrate 1 has a first side and a second side opposite to each other, the substrate 1 has a functional area 210 and a border area 220 surrounding the functional area 210, and the functional area 210 includes multiple panel areas 211.

[0035] The array functional layer is arranged on the first side of the substrate 1 and is located in the functional area 210; the shielding structure 500 is arranged on the first side of the substrate 1 and is located in the border area 220; the light-emitting functional material layer 420 is arranged in the functional area 210 and the border area 220, and the light-emitting functional material layer 420 at least covers the side of the shielding structure 500 away from the substrate 1 and covers the side of the array functional layer away from the substrate 1; the second electrode layer 430 is arranged on the side of the light-emitting functional material layer 420 in the functional area 210 and the border area 220 away from the substrate 1; the first encapsulation layer 440 is arranged on the side of the second electrode layer 430 in the functional area 210 and the border area 220 away from the substrate 1.

[0036] The display motherboard preform 400 provided in this embodiment forms a shielding structure 500 in the border area 220 before the light-emitting functional material layer 420 is formed, and removes the shielding structure 500 and the first packaging layer 440, the light-emitting functional material layer 420 and the second electrode layer 430 on the side of the shielding structure 500 away from the substrate 1 after the first packaging layer 440 is formed, so as to prevent the film layer evaporated in the border area 220 from cracking or peeling under the pressure of subsequent cleaning equipment, thereby preventing the subsequent etching solution from corroding the light-emitting layer, thereby preventing large-area film peeling, avoiding contamination of the evaporation equipment and etching abnormalities, avoiding yield loss, and being beneficial to improving the performance of the display panel.

[0037] Each panel area 211 corresponds to a display panel. After the display motherboard is prepared, it is cut along the edge of each panel area 211 to form individual display panels.

[0038] Optionally, the cleaning equipment is a wet cleaning equipment, a high-pressure air cleaning equipment or a brush cleaning equipment.

[0039] Further, refer to Figure 7 As shown, after forming the first encapsulation layer 440, the shielding structure 500 and the first encapsulation layer 440, the light-emitting functional material layer 420, and the second electrode layer 430 on the side of the shielding structure 500 away from the substrate 1 are removed. This prevents the film layer deposited in the frame area 220 from cracking or peeling under the pressure of the subsequent cleaning equipment, thereby preventing the subsequent etching solution from corroding the light-emitting layer.

[0040] Optionally, the shielding structure 500 comprises adhesive tape, which is bonded to the substrate 1. Before cleaning, the tape is removed, and the deposited film layer on the tape is removed along with the tape. During cleaning, the roller 300 of the cleaning equipment can directly contact the substrate 1, thereby preventing cracks or peeling of the film layer in the border area 220. Selecting adhesive tape as the shielding structure 500 facilitates subsequent removal and reduces material costs. Optionally, the shielding structure 500 can be made of polyimide (PI) tape, Teflon (PTFE) tape, fiberglass cloth tape, silicone cloth tape, or the like.

[0041] The light-emitting functional material layer 420, the second electrode layer 430, and the first encapsulation layer 440 are all formed by full-surface evaporation. Therefore, the light-emitting functional material layer 420, the second electrode layer 430, and the first encapsulation layer 440 are present in both the functional area 210 and the border area 220. When the shielding structure 500 is removed, the light-emitting functional material layer 420, the second electrode layer 430, and the first encapsulation layer 440 on the shielding structure 500 are also removed simultaneously.

[0042] Reference Figure 8 As shown, in one embodiment, the array functional layer includes an isolation structure 2 and a first electrode layer 410. The isolation structure 2 is disposed on one side of the substrate 1 and encloses a plurality of isolation openings 21. The first electrode layer 410 includes a plurality of first electrodes 31, the orthographic projections of the first electrodes 31 on the substrate 1 being at least partially located within the orthographic projections of the corresponding isolation openings 21 on the substrate 1. The light-emitting functional material layer 420 is separated by the isolation structure 2, partially covering the isolation structure 2, and partially located within the isolation openings 21 and covering the first electrodes 31. The second electrode layer 430 is separated by the isolation structure 2, partially located on the side of the light-emitting functional material layer 420 away from the isolation structure 2, and partially located within the isolation openings 21 and covering the light-emitting functional material layer 420. The second electrode layer 430 located within the isolation openings 21 is electrically connected to the isolation structure 2. The first encapsulation layer 440 is partially located on the side of the second electrode layer 430 away from the isolation structure 2, and partially located within the isolation openings 21 and covering the second electrode layer 430.

[0043] Due to the presence of the isolation structure 2, during evaporation, the light-emitting functional material layer 420 is isolated by the isolation structure 2, forming the light-emitting functional layer 32 within the isolation opening 21. The second electrode layer 430 is isolated by the isolation structure 2, forming the second electrode 33 within the isolation opening 21. The first electrode 31, the light-emitting functional layer 32, and the second electrode 33 constitute a light-emitting unit. The second electrode 33 overlaps the isolation structure 2, so that the isolation structure 2 connects the second electrode 33, thereby making the isolation structure 2 a common electrode for easy driving.

[0044] Preferably, the first electrode 31 includes an anode, and the second electrode 33 includes a cathode. Different voltages are applied to the first electrode 31 and the second electrode 33 to form a voltage difference between the first electrode 31 and the second electrode 33, thereby driving the light-emitting functional layer 32 to emit light.

[0045] Optionally, the first electrode 31 may include a multilayer structure, for example, comprising a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer. The reflective layer can be formed, for example, from a metal material such as silver, which has excellent light reflectivity. Each conductive oxide layer can be formed from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 33 can be formed from a metal material such as, for example, a magnesium and silver alloy (MgAg).

[0046] Furthermore, the light-emitting functional layer 32 includes the following film layers: The hole injection layer helps holes to be smoothly injected from the anode into the organic material, thereby reducing the hole injection barrier and improving the hole injection efficiency.

[0047] Hole transport layer: responsible for transporting holes from the hole injection layer to the light-emitting layer, and is required to have good hole transport performance and high carrier mobility.

[0048] The light-emitting layer is the most important functional layer in an OLED device. When electrons and holes recombine in this layer, excitons are generated. Excitons de-excite and emit photons, thus generating light. The material and structure of the light-emitting layer determine the color and efficiency of the OLED's light.

[0049] Electron transport layer: transports electrons from the cathode to the light-emitting layer, allowing the electrons to smoothly reach the light-emitting layer and recombine with holes to emit light. It needs to have good electron transport ability and stability.

[0050] Electron injection layer: Modify the cathode to promote the injection of electrons from the cathode into the organic material, improve the electron injection efficiency, and improve the performance and efficiency of the device.

[0051] Optionally, the light-emitting units of different colors include a first color light-emitting unit, a second color light-emitting unit and a third color light-emitting unit. During preparation, a first color light-emitting unit is first prepared. Specifically, a shielding structure 500 is first formed on the first side of the substrate 1, and the shielding structure 500 is located in the frame area 220. Then, a light-emitting functional material layer 420 corresponding to the first color light-emitting unit is formed in the functional area 210 and the frame area 220. Then, a second electrode layer 430 corresponding to the first color light-emitting unit is formed on the side of the light-emitting functional material layer 420 corresponding to the first color light-emitting unit away from the substrate 1. Then, a first encapsulation layer 440 corresponding to the first color light-emitting unit is formed on the side of the second electrode layer 430 corresponding to the first color light-emitting unit away from the substrate 1. Then, the shielding structure 500 and the first encapsulation layer 440 corresponding to the first color light-emitting unit, the light-emitting functional material layer 420 corresponding to the first color light-emitting unit, and the second electrode layer 430 corresponding to the first color light-emitting unit on the side of the shielding structure 500 away from the substrate 1 are removed. Then, the remaining first encapsulation layer 440 corresponding to the first color light-emitting unit, the light-emitting functional material layer 420 corresponding to the first color light-emitting unit, and the second electrode layer 430 corresponding to the first color light-emitting unit on the substrate 1 are patterned to obtain the first color light-emitting unit.

[0052] Next, a second color light-emitting unit is prepared. Specifically, a shielding structure 500 is formed again on the first side of the substrate 1, the shielding structure 500 being located in the frame area 220. A light-emitting functional material layer 420 corresponding to the second color light-emitting unit is then formed in the functional area 210 and the frame area 220. A second electrode layer 430 corresponding to the second color light-emitting unit is then formed on the side of the light-emitting functional material layer 420 corresponding to the second color light-emitting unit away from the substrate 1. A first encapsulation layer 440 corresponding to the second color light-emitting unit is then formed on the side of the second electrode layer 430 corresponding to the second color light-emitting unit away from the substrate 1. The shielding structure 500 and the second encapsulation layer 450 corresponding to the second color light-emitting unit, the light-emitting functional material layer 420 corresponding to the second color light-emitting unit, and the second electrode layer 430 corresponding to the second color light-emitting unit on the side of the shielding structure 500 away from the substrate 1 are then removed. The remaining first encapsulation layer 440 corresponding to the second color light-emitting unit, the light-emitting functional material layer 420 corresponding to the second color light-emitting unit, and the second electrode layer 430 corresponding to the second color light-emitting unit on the substrate 1 are then patterned. This yields a second color light-emitting unit.

[0053] Next, a third-color light-emitting unit is prepared. Specifically, a shielding structure 500 is again formed on the first side of the substrate 1, the shielding structure 500 being located in the border area 220. A light-emitting functional material layer 420 corresponding to the third-color light-emitting unit is then formed in the functional area 210 and the border area 220. A second electrode layer 430 corresponding to the third-color light-emitting unit is then formed on the side of the light-emitting functional material layer 420 corresponding to the third-color light-emitting unit away from the substrate 1. A first encapsulation layer 440 corresponding to the third-color light-emitting unit is then formed on the side of the second electrode layer 430 corresponding to the third-color light-emitting unit away from the substrate 1. The shielding structure 500 and the second encapsulation layer 450 corresponding to the third-color light-emitting unit, the light-emitting functional material layer 420 corresponding to the third-color light-emitting unit, and the second electrode layer 430 corresponding to the third-color light-emitting unit on the side of the shielding structure 500 away from the substrate 1 are then removed. The remaining first encapsulation layer 440 corresponding to the three-color light-emitting units, the light-emitting functional material layer 420 corresponding to the third-color light-emitting unit, and the second electrode layer 430 corresponding to the third-color light-emitting unit on the substrate 1 are then patterned. This yields a third-color light-emitting unit.

[0054] When preparing each color light emitting unit, it is necessary to set up the shielding structure 500 in sequence, and remove the shielding structure 500 during the preparation process.

[0055] Reference Figure 8 As shown, in one embodiment, the isolation structure 2 includes a support portion 22 and a crown portion 23. The crown portion 23 is located on the side of the support portion 22 away from the substrate 1, and the orthographic projection of the support portion 22 on the substrate 1 is located within the orthographic projection of the crown portion 23 on the substrate 1. The isolation structure 2 is formed into a T-shaped structure, so that the isolation structure 2 can effectively block the light-emitting functional layers of adjacent light-emitting units, thereby reducing the current crosstalk problem of adjacent light-emitting units.

[0056] Reference Figure 6 As shown, in one embodiment, the support portion 22 includes a first support portion 221 and a second support portion 222, the first support portion 221 is located between the second support portion 222 and the substrate 1, the orthographic projection of the second support portion 222 on the substrate 1 is located within the orthographic projection of the first support portion 221 on the substrate 1, the first support portion 221 extends a certain length compared to the second support portion 222, and the second electrode layer 430 located in the isolation opening 21 is arranged in contact with the area of the first support portion 221 that extends compared to the second support portion 222, which is beneficial to improving the overlapping effect of the second electrode 33 and the support portion 22.

[0057] Specifically, the width of the crown 23 is greater than the width of the second support portion 222. As a result, the ends of the crown 23 protrude beyond the side surfaces of the second support portion 222, a shape also known as an overhang. The second support portion 222 and the crown 23 are made of different materials, and the etching rate of the crown 23 is lower than that of the second support portion 222. The material of the second support portion 222 includes a conductive material, specifically at least one of aluminum (Al) and an aluminum alloy. The aluminum alloy may include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The crown 23 may have a single-layer structure or a multi-layer structure. If the crown 23 has a single-layer structure, the material of the crown 23 may include at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy. If the crown portion 23 has a multi-layer structure, one layer of the crown portion 23 may be made of at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy. Another layer of the crown portion 23 may be made of a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO). The first support portion 221 may be made of at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), a molybdenum-tungsten alloy (MoW), or a molybdenum-niobium alloy (MoNb).

[0058] In one embodiment, the isolation openings 21 include a first isolation opening, a second isolation opening, and a third isolation opening. The first isolation opening, the second isolation opening, and the third isolation opening respectively define light-emitting units emitting light of different colors, thereby enhancing the richness of the display panel. For example, the light-emitting units of different colors include light-emitting unit R, light-emitting unit B, and light-emitting unit G. Furthermore, the first isolation opening, the second isolation opening, and the third isolation opening can be configured as needed, and their shapes and sizes may vary, without specific limitation.

[0059] Reference Figure 8 As shown, in one embodiment, the array function layer further includes a pixel defining layer 4, which is disposed on a first side of the substrate 1. The isolation structure 2 is disposed on a side of the pixel defining layer 4 away from the substrate 1. The pixel defining layer 4 defines a pixel opening that communicates with the isolation opening 21, and the pixel opening exposes the corresponding first electrode 31. This allows the first electrode 31 to have a larger design area without contacting the isolation structure 2, thereby allowing the light-emitting unit to have a larger effective light-emitting area.

[0060] Furthermore, the pixel defining layer 4 is provided with a first pixel opening connected to the first isolation opening, a second pixel opening connected to the second isolation opening, and a third pixel opening connected to the third isolation opening. The areas of the orthographic projections of the first, second, and third pixel openings on the substrate 1 are the same or different. The shapes of the pixel openings and the orthographic projections of the corresponding isolation openings 21 on the substrate 1 may be the same or different. Generally speaking, the orthographic projection area of the isolation opening 21 on the substrate 1 is larger than the orthographic projection area of the pixel opening connected to the isolation opening 21 on the substrate 1. The orthographic projections of the pixel openings on the substrate 1 overlap with the orthographic projections of the isolation openings 21 on the substrate 1. The pixel defining layer 4 is made of an inorganic material, for example, the pixel defining layer 4 is formed using at least one inorganic insulating material selected from silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON). The pixel defining layer 4 may have a multi-layer or single-layer structure, and the multiple film layers of the pixel defining layer 4 may be made of different materials or formed under different film forming conditions.

[0061] Reference Figure 9 As shown, in one embodiment, the display motherboard preform 400 further includes a second encapsulation layer 450 and a third encapsulation layer 460. The second encapsulation layer 450 is disposed on the side of the first encapsulation layer 440 away from the substrate 1; the third encapsulation layer 460 is disposed on the side of the second encapsulation layer 450 away from the substrate 1. The first encapsulation layer 440 is an inorganic layer, which has a high density to isolate water and oxygen. The second encapsulation layer 450 is an organic layer, thus having a large thickness to flatten the surface of the display panel. The third encapsulation layer 460 is an inorganic layer, achieving an inorganic-organic-inorganic triple-layer encapsulation.

[0062] Optionally, the first encapsulation layer 440 includes multiple independent encapsulation units, each corresponding to at least one light-emitting unit. The materials of the first encapsulation layer 440 and the third encapsulation layer 460 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The material of the second encapsulation layer 450 is a resin material such as epoxy resin or acrylic resin. Furthermore, the display motherboard preform 400 also includes pixel circuits, which are electrically connected to the light-emitting units to drive the light-emitting units to emit light of corresponding colors. Each pixel circuit drives at least one light-emitting device to emit light. For example, the display area includes a normal display area and a translucent display area. The translucent display area is the display area corresponding to the sensor and has light-transmitting properties. The normal display area is the display area not corresponding to the sensor. In the normal display area, one pixel circuit drives one light-emitting unit to emit light, while in the translucent display area, one pixel circuit drives one or more light-emitting units to emit light.

[0063] refer to Figure 10The substrate 1 includes a pixel circuit layer and a planarization layer 11. The pixel circuit layer includes a pixel circuit for driving the light-emitting unit to emit light. Figure 11 The transistor 12 in the pixel circuit is shown. A via is provided in the planarization layer 11, and the first electrode 31 is electrically connected to the transistor 12 in the pixel circuit layer through the via. Furthermore, the pixel circuit layer includes at least one insulating layer, which may include at least one of an inorganic layer and an organic layer. Furthermore, the substrate 111 also includes scan lines that provide scan signals Scan and data lines that provide data signals Data to the pixel circuit.

[0064] refer to Figure 11 The pixel circuit includes a driving transistor T1 and a data transistor T2, the source of the data transistor T2 is connected to a data line providing a data signal Data, the gate of the data transistor T2 is connected to a scan line providing a scan signal Scan, the drain of the data transistor T2 is connected to the gate of the driving transistor T1, the two ends of the storage capacitor C1 are respectively connected to the gate and source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting unit. Figure 10 This is an embodiment of the pixel circuit. The pixel circuit of this application is not limited to Figure 11 The 2T1C pixel circuit shown may also be other pixel circuits, such as a 7T1C, 8T1C pixel circuit, etc.

[0065] Based on the same inventive concept, Figure 12 As shown, another embodiment of the present application discloses a method for preparing a display motherboard, wherein the display motherboard prepared by the method is as follows: Figure 4 and Figure 7 The preparation method comprises the following steps: Step S10, providing a substrate 1; the substrate 1 has a first side and a second side opposite to each other, the substrate 1 has a functional area 210 and a frame area 220 surrounding the functional area 210, and the functional area 210 includes a plurality of panel areas 211; Step S20: forming an array functional layer on the first side of the substrate 1, wherein the array functional layer is located in the functional area 210; Step S30: forming a shielding structure 500 on the first side of the substrate 1, wherein the shielding structure 500 is located in the border area 220; Step S40: forming a light-emitting functional material layer 420 in the functional area 210 and the frame area 220; wherein the light-emitting functional material layer 420 at least covers the side of the shielding structure 500 away from the substrate 1 and the side of the array functional layer away from the substrate 1; Step S50: forming a second electrode layer 430 on a side of the light-emitting functional material layer 420 away from the substrate 1; wherein the second electrode layer 430 is located in the functional area 210 and the frame area 220; Step S60: forming a first encapsulation layer 440 on the side of the second electrode layer 430 away from the substrate 1; wherein the first encapsulation layer 440 is located in the functional area 210 and the frame area 220; Figure 5 shown.

[0066] Step S70: remove the shielding structure 500 and the first encapsulation layer 440, the light-emitting functional material layer 420 and the second electrode layer 430 on the side of the shielding structure 500 away from the substrate 1. Figure 7 shown.

[0067] The preparation method of the display motherboard provided in this embodiment is to set the shielding structure 500 in the frame area 220, evaporate the first packaging layer 440, the light-emitting functional material layer 420 and the second electrode layer 430 on the shielding structure 500, and then remove the shielding structure 500. At the same time, the first packaging layer 440, the light-emitting functional material layer 420 and the second electrode layer 430 are removed, thereby preventing the first packaging layer 440 in the frame area 220 from cracking or peeling under the pressure of subsequent cleaning equipment, thereby preventing the subsequent etching solution from corroding the light-emitting layer, thereby preventing large-area film peeling, avoiding contamination of the evaporation equipment and etching abnormalities, avoiding yield loss, and being beneficial to improving the performance of the display panel.

[0068] The light-emitting functional material layer 420, the second electrode layer 430, and the first encapsulation layer 440 are all formed by full-surface evaporation. Therefore, the light-emitting functional material layer 420, the second electrode layer 430, and the first encapsulation layer 440 are present in both the functional area 210 and the border area 220. When the shielding structure 500 is removed, the light-emitting functional material layer 420, the second electrode layer 430, and the first encapsulation layer 440 on the shielding structure 500 are also removed simultaneously.

[0069] In one embodiment, after step S70, in which the shielding structure 500 and the first encapsulation layer 440, the light-emitting functional material layer 420 and the second electrode layer 430 on the side of the shielding structure 500 away from the substrate 1 are removed, the following steps are further included: Step S80: Patterning the remaining first encapsulation layer 440, light-emitting functional material layer 420 and second electrode layer 430 on the substrate 1. Figure 8 As shown, the patterned first encapsulation layer 440 forms a plurality of first encapsulation units 441, the patterned light-emitting functional material layer 420 forms a plurality of light-emitting functional layers 32, and the patterned second electrode layer 430 forms a plurality of second electrodes 33. The first electrodes 31, light-emitting functional layers 32, and second electrode layer 430 are stacked to form a light-emitting unit. Preferably, the first electrode 31 comprises an anode, and the second electrode 33 comprises a cathode. By applying different voltages to the first and second electrodes 31, 33, a voltage difference is formed between the first and second electrodes 31, 33, driving the light-emitting functional layers 32 to emit light.

[0070] In one embodiment, step S80, patterning the first encapsulation layer 440, the light-emitting functional material layer 420, and the second electrode layer 430 remaining on the substrate 1, includes: Step S81: Pattern the first packaging layer 440 by dry etching to form a plurality of first packaging units 441. Dry etching is a process that uses physical sputtering or chemical reaction of plasma (ions, atoms, etc. generated by ionized gas) to remove materials layer by layer. Its principle includes high energy ions (such as Ar + ) bombards the material surface; chemical etching, where reactive gases (such as CF4 and O2) react with the material to form volatile products; and a combination of the two. This process, implemented using equipment such as reactive ion etching (RIE) and inductively coupled plasma etching (ICP), offers the advantages of high etching precision (down to the nanometer to micrometer scale) and strong directionality (vertical etching to form steep sidewalls). It is commonly used for patterning precision structures such as pixel electrodes (such as anodes in ITO-Ag-ITO stacks) and thin-film encapsulation layers (such as Al2O3), as well as processing micro-optical structures to optimize light extraction efficiency.

[0071] In step S82, the light-emitting functional material layer 420 and the second electrode layer 430 are patterned using wet etching to form multiple light-emitting functional layers 32 and multiple second electrodes 33. The first electrode 31, the light-emitting functional layer 32, and the second electrode layer 430 are stacked to form a light-emitting unit. Wet etching involves removing material from a target area through a dissolution reaction between a chemical solution and the material. This process utilizes the selective corrosion properties of acids (such as hydrochloric acid and hydrofluoric acid), bases (such as sodium hydroxide), or organic solvents (such as acetone) to selectively remove specific materials, dissolving and stripping away the areas not protected by the photoresist layer by layer. This process is simple to operate, low-cost, and can achieve uniform etching over a large area. It is suitable for cleaning impurities from substrate surfaces, low-precision patterning of anodes (such as layers of ITO-Ag-ITO stacked structures) or cathodes (such as layers of Mg or Ag alloys), and in-process repair and pretreatment (such as removing excess material at the edges).

[0072] Optionally, the light-emitting units of different colors include a first color light-emitting unit, a second color light-emitting unit and a third color light-emitting unit. During preparation, a first color light-emitting unit is first prepared. Specifically, a shielding structure 500 is first formed on the first side of the substrate 1, and the shielding structure 500 is located in the frame area 220. Then, a light-emitting functional material layer 420 corresponding to the first color light-emitting unit is formed in the functional area 210 and the frame area 220. Then, a second electrode layer 430 corresponding to the first color light-emitting unit is formed on the side of the light-emitting functional material layer 420 corresponding to the first color light-emitting unit away from the substrate 1. Then, a first encapsulation layer 440 corresponding to the first color light-emitting unit is formed on the side of the second electrode layer 430 corresponding to the first color light-emitting unit away from the substrate 1. Then, the shielding structure 500 and the first encapsulation layer 440 corresponding to the first color light-emitting unit, the light-emitting functional material layer 420 corresponding to the first color light-emitting unit, and the second electrode layer 430 corresponding to the first color light-emitting unit on the side of the shielding structure 500 away from the substrate 1 are removed. Then, the remaining first encapsulation layer 440 corresponding to the first color light-emitting unit, the light-emitting functional material layer 420 corresponding to the first color light-emitting unit, and the second electrode layer 430 corresponding to the first color light-emitting unit on the substrate 1 are patterned to obtain the first color light-emitting unit.

[0073] Next, a second color light-emitting unit is prepared. Specifically, a shielding structure 500 is formed again on the first side of the substrate 1, the shielding structure 500 being located in the frame area 220. A light-emitting functional material layer 420 corresponding to the second color light-emitting unit is then formed in the functional area 210 and the frame area 220. A second electrode layer 430 corresponding to the second color light-emitting unit is then formed on the side of the light-emitting functional material layer 420 corresponding to the second color light-emitting unit away from the substrate 1. A first encapsulation layer 440 corresponding to the second color light-emitting unit is then formed on the side of the second electrode layer 430 corresponding to the second color light-emitting unit away from the substrate 1. The shielding structure 500 and the second encapsulation layer 450 corresponding to the second color light-emitting unit, the light-emitting functional material layer 420 corresponding to the second color light-emitting unit, and the second electrode layer 430 corresponding to the second color light-emitting unit on the side of the shielding structure 500 away from the substrate 1 are then removed. The remaining first encapsulation layer 440 corresponding to the second color light-emitting unit, the light-emitting functional material layer 420 corresponding to the second color light-emitting unit, and the second electrode layer 430 corresponding to the second color light-emitting unit on the substrate 1 are then patterned. This yields a second color light-emitting unit.

[0074] Next, a third-color light-emitting unit is prepared. Specifically, a shielding structure 500 is again formed on the first side of the substrate 1, the shielding structure 500 being located in the border area 220. A light-emitting functional material layer 420 corresponding to the third-color light-emitting unit is then formed in the functional area 210 and the border area 220. A second electrode layer 430 corresponding to the third-color light-emitting unit is then formed on the side of the light-emitting functional material layer 420 corresponding to the third-color light-emitting unit away from the substrate 1. A first encapsulation layer 440 corresponding to the third-color light-emitting unit is then formed on the side of the second electrode layer 430 corresponding to the third-color light-emitting unit away from the substrate 1. The shielding structure 500 and the second encapsulation layer 450 corresponding to the third-color light-emitting unit, the light-emitting functional material layer 420 corresponding to the third-color light-emitting unit, and the second electrode layer 430 corresponding to the third-color light-emitting unit on the side of the shielding structure 500 away from the substrate 1 are then removed. The remaining first encapsulation layer 440 corresponding to the three-color light-emitting units, the light-emitting functional material layer 420 corresponding to the third-color light-emitting unit, and the second electrode layer 430 corresponding to the third-color light-emitting unit on the substrate 1 are then patterned. This yields a third-color light-emitting unit.

[0075] When preparing each color light emitting unit, it is necessary to set up the shielding structure 500 in sequence, and remove the shielding structure 500 during the preparation process.

[0076] In one embodiment, after step S70, removing the shielding structure 500 and the first encapsulation layer 440, the light-emitting functional material layer 420, and the second electrode layer 430 on the side of the shielding structure 500 away from the substrate 1, and before step S80, patterning the remaining first encapsulation layer 440, the light-emitting functional material layer 420, and the second electrode layer 430 on the substrate 1, the following steps are further included: Step S71: Use a cleaning device to clean the remaining first encapsulation layer 440 on the substrate 1. During cleaning, the roller 300 of the cleaning device rolls in the area of the frame region 220 where the shielding structure 500 is removed and contacts the substrate 1, thereby preventing cracks or peeling of the film layer in the frame region 220.

[0077] Specifically, a cleaning device with a roller 300 is used to clean the first packaging layer 440. The roller 300 is in direct contact with the substrate 1. While rolling, the cleaning liquid is sprayed on the surface of the first packaging layer 440 to achieve the purpose of cleaning the first packaging layer 440 and ensure the cleanliness of the surface of the first packaging layer 440.

[0078] Step S80, after patterning the first encapsulation layer 440, the light-emitting functional material layer 420 and the second electrode layer 430 remaining on the substrate 1, further includes the following steps: Step S90: sequentially forming a second encapsulation layer 450 and a third encapsulation layer 460 on the side of the first encapsulation layer 440 away from the substrate 1. Figure 9 As shown, the first encapsulation layer 440 is an inorganic layer with high density to isolate water and oxygen. The second encapsulation layer 450 is an organic layer with a large thickness to flatten the surface of the display panel. The third encapsulation layer 460 is an inorganic layer, achieving an inorganic-organic-inorganic triple-layer encapsulation.

[0079] Optionally, the material of the first encapsulation layer 440 and the third encapsulation layer 460 includes at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The material of the second encapsulation layer 450 is a resin material such as epoxy resin and acrylic resin.

[0080] In one embodiment, after step S90 of sequentially forming the second encapsulation layer 450 and the third encapsulation layer 460 on the side of the first encapsulation layer 440 away from the substrate 1 , the following steps are further included: Step S91, removing the substrate 1; Step S92: cutting to obtain a plurality of panel units.

[0081] The panel unit may be an organic light emitting diode display panel (Organic Light Emitting Diode, referred to as OLED) or a quantum dot electroluminescent display panel (Quantum Dot Light Emitting Diodes, referred to as QLED).

[0082] Reference Figure 13 As shown, the panel unit includes a display area AA with a display function and a non-display area NA, wherein the non-display area NA at least partially surrounds the display area AA. The display area AA of the panel unit can be rectangular, square, circular, elliptical or other shapes.

[0083] The display area AA includes a plurality of pixels PX arranged in the X and Y directions. The pixels PX include a plurality of sub-pixels SPX that display different colors. In some embodiments, the pixels PX include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel SPX2, and the third sub-pixel SPX3 is a red sub-pixel SPX3. In some embodiments, in addition to the sub-pixels SPX1, SPX2, and SPX3, the pixels PX also include sub-pixels SPX that emit white light or other colors.

[0084] Subpixels SPX include pixel circuits and light-emitting devices driven by the pixel circuits to emit light of corresponding colors. The first subpixel SPX1 includes a first light-emitting device, the second subpixel SPX2 includes a second light-emitting device, and the third subpixel SPX3 includes a third light-emitting device. Each pixel circuit drives at least one light-emitting device to emit light. For example, the display area AA includes a normal display area and a light-transmitting display area. The light-transmitting display area is the display area corresponding to the sensor and has light-transmitting properties, while the normal display area is the display area not corresponding to the sensor. In the normal display area, one pixel circuit drives one light-emitting device to emit light, while in the light-transmitting display area, one pixel circuit drives one or more light-emitting devices to emit light.

[0085] In one embodiment, the array functional layer includes an isolation structure 2 and a first electrode layer 410. The isolation structure 2 is disposed on one side of a substrate 1 and encloses a plurality of isolation openings 21. The first electrode layer 410 includes a plurality of first electrodes 31, the orthographic projections of the first electrodes 31 on the substrate 1 being at least partially located within the orthographic projections of the corresponding isolation openings 21 on the substrate 1. A light-emitting functional material layer 420 is separated by the isolation structure 2, partially covering the isolation structure 2 and partially located within the isolation openings 21 and covering the first electrodes 31. A second electrode layer 430 is separated by the isolation structure 2, partially located on a side of the light-emitting functional material layer 420 away from the isolation structure 2, partially located within the isolation openings 21 and covering the light-emitting functional material layer 420. The second electrode layer 430 located within the isolation openings 21 is electrically connected to the isolation structure 2. A first encapsulation layer 440 is partially located on a side of the second electrode layer 430 away from the isolation structure 2 and partially located within the isolation openings 21 and covering the second electrode layer 430.

[0086] Due to the presence of the isolation structure 2, during evaporation, the light-emitting functional material layer 420 is isolated by the isolation structure 2, forming the light-emitting functional layer 32 within the isolation opening 21. The second electrode layer 430 is isolated by the isolation structure 2, forming the second electrode 33 within the isolation opening 21. The first electrode 31, the light-emitting functional layer 32, and the second electrode 33 constitute a light-emitting unit. The second electrode 33 overlaps the isolation structure 2, so that the isolation structure 2 connects the second electrode 33, thereby making the isolation structure 2 a common electrode for easy driving.

[0087] Preferably, the first electrode 31 includes an anode, and the second electrode 33 includes a cathode. Different voltages are applied to the first electrode 31 and the second electrode 33 to form a voltage difference between the first electrode 31 and the second electrode 33, thereby driving the light-emitting functional layer 32 to emit light.

[0088] Optionally, the first electrode 31 may include a multilayer structure, for example, comprising a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer. The reflective layer can be formed, for example, from a metal material such as silver, which has excellent light reflectivity. Each conductive oxide layer can be formed from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 33 can be formed from a metal material such as, for example, a magnesium and silver alloy (MgAg).

[0089] Furthermore, the light-emitting functional layer 32 includes the following film layers: The hole injection layer helps holes to be smoothly injected from the anode into the organic material, thereby reducing the hole injection barrier and improving the hole injection efficiency.

[0090] Hole transport layer: responsible for transporting holes from the hole injection layer to the light-emitting layer, and is required to have good hole transport performance and high carrier mobility.

[0091] The light-emitting layer is the most important functional layer in an OLED device. When electrons and holes recombine in this layer, excitons are generated. Excitons de-excite and emit photons, thus generating light. The material and structure of the light-emitting layer determine the color and efficiency of the OLED's light.

[0092] Electron transport layer: transports electrons from the cathode to the light-emitting layer, allowing the electrons to smoothly reach the light-emitting layer and recombine with holes to emit light. It needs to have good electron transport ability and stability.

[0093] Electron injection layer: Modify the cathode to promote the injection of electrons from the cathode into the organic material, improve the electron injection efficiency, and improve the performance and efficiency of the device.

[0094] Reference Figure 8 As shown, in one embodiment, the isolation structure 2 includes a support portion 22 and a crown portion 23. The crown portion 23 is located on the side of the support portion 22 away from the substrate 1, and the orthographic projection of the support portion 22 on the substrate 1 is located within the orthographic projection of the crown portion 23 on the substrate 1. The isolation structure 2 is formed into a T-shaped structure, so that the isolation structure 2 can effectively block the light-emitting functional layers of adjacent light-emitting units, thereby reducing the current crosstalk problem of adjacent light-emitting units.

[0095] Reference Figure 6As shown, in one embodiment, the support portion 22 includes a first support portion 221 and a second support portion 222, the first support portion 221 is located between the second support portion 222 and the substrate 1, the orthographic projection of the second support portion 222 on the substrate 1 is located within the orthographic projection of the first support portion 221 on the substrate 1, and the second electrode layer 430 located in the isolation opening 21 is arranged in contact with the first support portion 221, which is beneficial to improving the overlapping effect of the second electrode 33 and the support portion 22.

[0096] Specifically, the width of the crown 23 is greater than the width of the second support portion 222. As a result, the ends of the crown 23 protrude beyond the side surfaces of the second support portion 222, a shape also known as an overhang. The second support portion 222 and the crown 23 are made of different materials, and the etching rate of the crown 23 is lower than that of the second support portion 222. The material of the second support portion 222 includes a conductive material, specifically at least one of aluminum (Al) and an aluminum alloy. The aluminum alloy may include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The crown 23 may have a single-layer structure or a multi-layer structure. If the crown 23 has a single-layer structure, the material of the crown 23 may include at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy. If the crown portion 23 has a multi-layer structure, one layer of the crown portion 23 may be made of at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy. Another layer of the crown portion 23 may be made of a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO). The first support portion 221 may be made of at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), a molybdenum-tungsten alloy (MoW), or a molybdenum-niobium alloy (MoNb).

[0097] In one embodiment, the isolation openings 21 include a first isolation opening, a second isolation opening, and a third isolation opening. The first isolation opening, the second isolation opening, and the third isolation opening respectively define light-emitting units emitting light of different colors, thereby enhancing the richness of the display panel. For example, the light-emitting units of different colors include light-emitting unit R, light-emitting unit B, and light-emitting unit G. Furthermore, the first isolation opening, the second isolation opening, and the third isolation opening can be configured as needed, and their shapes and sizes may vary, without specific limitation.

[0098] Reference Figure 8As shown, in one embodiment, the array function layer further includes a pixel defining layer 4, which is disposed on a first side of the substrate 1. The isolation structure 2 is disposed on a side of the pixel defining layer 4 away from the substrate 1. The pixel defining layer 4 defines a pixel opening that communicates with the isolation opening 21, and the pixel opening exposes the corresponding first electrode 31. This allows the first electrode 31 to have a larger design area without contacting the isolation structure 2, thereby allowing the light-emitting unit to have a larger effective light-emitting area.

[0099] Furthermore, the pixel defining layer 4 is provided with a first pixel opening connected to the first isolation opening, a second pixel opening connected to the second isolation opening, and a third pixel opening connected to the third isolation opening. The areas of the orthographic projections of the first pixel opening, the second pixel opening, and the third pixel opening on the substrate 1 are the same or different. The shape of the pixel opening and the orthographic projection of the corresponding isolation opening 21 on the substrate 1 may be the same or different. Generally speaking, the area of the orthographic projection of the isolation opening 21 on the substrate 1 is larger than the area of the orthographic projection of the pixel opening connected to the isolation opening 21 on the substrate 1. The orthographic projection of the pixel opening on the substrate 1 overlaps with the orthographic projection of the isolation opening 21 on the substrate 1. The material of the pixel defining layer 4 is an inorganic material. For example, the pixel defining layer 4 is formed using an inorganic insulating material of at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0100] Based on the same inventive concept, another embodiment of the present application discloses a display motherboard, which includes a display motherboard prepared by the method for preparing the display motherboard in any of the above embodiments.

[0101] While the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations of these embodiments will be apparent to those skilled in the art in light of the foregoing description.

[0102] It should be noted that the above description is limited to some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in an order different from that described in the above embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the specific order or sequential order shown to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0103] The embodiments of the present application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of this application.

Claims

1. A method for preparing a display motherboard, characterized in that: include: providing a substrate; The substrate has a first side and a second side opposite to each other, the substrate has a functional area and a frame area surrounding the functional area, and the functional area includes a plurality of panel areas; forming an array functional layer on the first side of the substrate, wherein the array functional layer is located in the functional area; forming a shielding structure on the first side of the substrate, wherein the shielding structure is located in the frame area; A light-emitting functional material layer is formed in the functional area and the frame area; wherein the light-emitting functional material layer at least covers a side of the shielding structure away from the substrate and a side of the array functional layer away from the substrate; forming a second electrode layer on a side of the light-emitting functional material layer away from the substrate; wherein the second electrode layer is located in the functional area and the frame area; forming a first encapsulation layer on a side of the second electrode layer away from the substrate; wherein the first encapsulation layer is located in the functional area and the frame area; The blocking structure and the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer on a side of the blocking structure away from the substrate are removed.

2. The method for preparing a display motherboard according to claim 1, wherein: After removing the shielding structure and the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer on a side of the shielding structure away from the substrate, the method further includes: The first encapsulation layer, the light-emitting functional material layer, and the second electrode layer remaining on the substrate are patterned.

3. The method for preparing a display motherboard according to claim 2, wherein: After removing the blocking structure and the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer on a side of the blocking structure away from the substrate, and before patterning the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer remaining on the substrate, the method further includes: The first encapsulation layer remaining on the substrate is cleaned using a cleaning device; wherein, during cleaning, a roller of the cleaning device rolls in an area of the frame region where the shielding structure is removed and contacts the substrate.

4. The method for preparing a display motherboard according to claim 2, wherein: The patterning of the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer remaining on the substrate includes: Patterning the first encapsulation layer by dry etching to form a first encapsulation unit with a plurality of first light-emitting units; The light-emitting functional material layer and the second electrode layer are patterned by wet etching to form a plurality of light-emitting functional layers of the first light-emitting units and a plurality of second electrodes.

5. The method for preparing a display motherboard according to claim 2, wherein: After patterning the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer remaining on the substrate, the method further includes: A second encapsulation layer and a third encapsulation layer are sequentially formed on a side of the first encapsulation layer away from the substrate.

6. The method for preparing a display motherboard according to claim 5, wherein: After sequentially forming the second encapsulation layer and the third encapsulation layer on a side of the first encapsulation layer away from the substrate, the method further includes: removing the substrate; Cutting is performed to obtain a plurality of panel units.

7. A display motherboard, characterized in that: The display motherboard is prepared by the method for preparing the display motherboard according to any one of claims 1 to 6.

8. A display motherboard prefabricated component, characterized in that: include: substrate; The substrate has a first side and a second side opposite to each other, the substrate has a functional area and a frame area surrounding the functional area, and the functional area includes a plurality of panel areas; an array functional layer, disposed on the first side of the substrate and located in the functional area; a shielding structure, disposed on the first side of the substrate and located in the frame area; a light-emitting functional material layer, disposed in the functional area and the frame area, the light-emitting functional material layer at least covering a side of the shielding structure away from the substrate and a side of the array functional layer away from the substrate; a second electrode layer, disposed on a side of the light-emitting functional material layer in the functional area and the frame area away from the substrate; The first packaging layer is arranged on a side of the second electrode layer in the functional area and the frame area away from the substrate.

9. The display motherboard preform according to claim 8, characterized in that: After forming the first encapsulation layer, the blocking structure and the first encapsulation layer, the light-emitting functional material layer, and the second electrode layer on a side of the blocking structure away from the substrate are removed.

10. The display motherboard preform according to claim 8, characterized in that: The array function layer includes: An isolation structure is provided on the first side of the substrate, and the isolation structure encloses a plurality of isolation openings; a first electrode layer, the first electrode layer comprising a plurality of first electrodes, wherein orthographic projections of the first electrodes on the substrate are at least partially located within orthographic projections of corresponding isolation openings on the substrate; The light-emitting functional material layer is separated by the isolation structure, the light-emitting functional material layer partially covers the isolation structure, and partially is located in the isolation opening and covers the first electrode; The second electrode layer is separated by the isolation structure, the second electrode layer is partially located on a side of the light-emitting functional material layer away from the isolation structure, and partially located in the isolation opening to cover the light-emitting functional material layer, and the second electrode layer located in the isolation opening is electrically connected to the isolation structure; The first packaging layer is partially located on a side of the second electrode layer away from the isolation structure, and partially located in the isolation opening and covering the second electrode layer.

11. The display motherboard preform according to claim 10, characterized in that: The isolation structure includes a support portion and a crown portion, wherein the crown portion is located on a side of the support portion away from the substrate, and an orthographic projection of the support portion on the substrate is located within an orthographic projection of the crown portion on the substrate.

12. The display motherboard preform according to claim 11, wherein: The supporting portion includes a first supporting portion and a second supporting portion, the first supporting portion is located between the second supporting portion and the substrate, the orthographic projection of the second supporting portion on the substrate is located within the orthographic projection of the first supporting portion on the substrate, and the second electrode layer located in the isolation opening is arranged in contact with the first supporting portion.

13. The display motherboard preform according to claim 10, characterized in that: The array function layer further includes: The pixel defining layer is arranged on the first side of the substrate. The isolation structure is arranged on the side of the pixel defining layer away from the substrate. The pixel defining layer defines a pixel opening connected to the isolation opening, and the pixel opening exposes the corresponding first electrode.

14. The display motherboard preform according to claim 8, characterized in that: The shielding structure includes an adhesive tape, and the adhesive tape is bonded to the substrate.

15. The display motherboard preform according to claim 8, characterized in that: The display motherboard prefabricated component further includes: a second packaging layer, disposed on a side of the first packaging layer away from the substrate; The third packaging layer is arranged on a side of the second packaging layer away from the substrate.

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