Stereoscopic molded body derived from transparent conductive film

Abstract

Provided is a three-dimensionally molded body derived from a transparent conductive film, which has excellent conductivity and appearance. A three-dimensionally molded article derived from a transparent conductive film according to the present invention is provided with a substrate containing a resin A having a softening point of 200 DEG C or less, and a transparent conductive layer disposed on at least one side of the substrate, the transparent conductive layer containing metal nanowires. In one embodiment, the metal nanowire has a melt bonded mesh structure.

Description

Technical Field

[0001] The present invention relates to a three-dimensional formed body derived from a transparent conductive film. Background Art

[0002] Traditionally, touch sensor electrodes and other components have often used transparent conductive films. In recent years, the form factors of touch sensor devices have diversified, with research exploring the use of transparent conductive films with concave and convex shapes, in addition to the traditional flat sheets. However, three-dimensional forming (e.g., press forming) to create these concave and convex shapes can lead to problems such as damage to the transparent conductive layer, a significant increase in resistance, and a reduction in appearance.

[0003] Prior art literature

[0004] Patent Document 1

[0005] Patent Document 1: Japanese Patent Application No. 2009-505358 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] The present invention has been made to solve the above-mentioned problems, and a main object thereof is to provide a three-dimensional formed article derived from a film, which is a three-dimensional formed article derived from a transparent conductive film and has excellent conductivity and appearance.

[0008] Means used to solve problems

[0009] The three-dimensional molded body derived from a transparent conductive film of the present invention comprises a substrate and a transparent conductive layer disposed on at least one side of the substrate. The substrate comprises a resin A having a softening point of 200° C. or lower, and the transparent conductive layer comprises metal nanowires.

[0010] In one embodiment, the metal nanowires have a fusion-bonded mesh structure.

[0011] In one embodiment, the total light transmittance of the three-dimensional molded body derived from the transparent conductive film is 80% or more.

[0012] In one embodiment, the surface resistivity of the three-dimensional formed body derived from the transparent conductive film is 3000Ω / □ or less.

[0013] In another aspect of the present invention, a transparent conductive film is provided. The transparent conductive film can be used to form a three-dimensional formed body derived from the transparent conductive film.

[0014] Effects of the Invention

[0015] According to the embodiment of the present invention, a three-dimensional film-derived formed body can be provided, which is a three-dimensional film-derived formed body excellent in conductivity and appearance and derived from a transparent conductive film. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic cross-sectional view of a three-dimensional formed body derived from a transparent conductive film according to one embodiment of the present invention.

[0017] Figure 2 This is a schematic perspective view of a three-dimensional formed body derived from a transparent conductive film according to one embodiment of the present invention.

[0018] Figure 3 This is a schematic perspective view of a three-dimensional formed body derived from a transparent conductive film according to one embodiment of the present invention. DETAILED DESCRIPTION

[0019] Hereinafter, embodiments of the present invention will be described, but the present invention is not limited to these embodiments.

[0020] A. Overall structure of a three-dimensional molded body derived from a transparent conductive film

[0021] Figure 1 This is a schematic cross-sectional view of a three-dimensional molded article derived from a transparent conductive film according to one embodiment of the present invention. The three-dimensional molded article 100 derived from a transparent conductive film comprises a substrate 10 and a transparent conductive layer 20 disposed on at least one side of the substrate 10. The substrate 10 comprises a resin A having a softening point of 200°C or less. Furthermore, the transparent conductive layer 20 comprises metal nanowires (not shown). Although not shown, the transparent conductive film may further comprise any appropriate other layers.

[0022] Figure 2 This is a schematic perspective view of a three-dimensional formed body derived from a transparent conductive film according to an embodiment of the present invention. In this specification, a "three-dimensional formed body derived from a film" refers to a formed body 100 obtained by subjecting the film to a forming process (typically, press forming) in order to provide a concave-convex portion 110 in the thickness direction. In one embodiment, as Figure 3 As shown, a 1 cm square grid pattern is set on the entire surface of the film before three-dimensional forming (the area of one square is 1 cm 2 ), a grid with a changed shape is formed by forming, and the area of the grid with the largest area among the grids with a changed shape is set to 1.1 cm 2 ~10cm 2 (Preferably 1.8 cm 2 ~5cm 2 ) is defined as a "three-dimensional formed body derived from a film" in this specification.

[0023] In the present invention, by providing a transparent conductive layer containing metal nanowires on a substrate containing resin A having a softening point of 200°C or less, a three-dimensional formed body derived from a transparent conductive film having high conductivity, excellent appearance, and excellent transparency can be obtained even after three-dimensional forming.

[0024] The surface resistivity of the three-dimensional molded body derived from the transparent conductive film is preferably 3000Ω / □ or less, more preferably 1000Ω / □ or less, and further preferably 500Ω / □ or less. The smaller the surface resistance value of the three-dimensional molded body derived from the transparent conductive film, the better, but its lower limit is, for example, 200Ω / □ (preferably 100Ω / □, more preferably 50Ω / □). It should be noted that in this specification, "the surface resistivity of the three-dimensional molded body derived from the transparent conductive film" means that after adding a 1 cm□ checkerboard grid to the entire surface of the transparent conductive film (i.e., the film before three-dimensional molding), three-dimensional molding is performed, and the maximum value of the surface resistivity for each checkerboard grid is obtained as the surface resistivity of the three-dimensional molded body derived from the transparent conductive film. In the above-mentioned three-dimensional molding, the transparent conductive film is formed into a hemispherical shape, for example.

[0025] The haze value of the three-dimensional molded article derived from the transparent conductive film is preferably 1% or less, more preferably 0.7% or less, and even more preferably 0.5% or less. The lower the haze value, the better, and its lower limit is, for example, 0.05%. Within this range, a three-dimensional molded article derived from a transparent conductive film that is suitable for use as a transparent electrode, for example, can be obtained.

[0026] The total light transmittance of the three-dimensional molded article derived from the transparent conductive film is preferably 80% or more, more preferably 85% or more, and particularly preferably 90% or more. Within this range, a three-dimensional molded article derived from the transparent conductive film can be obtained that is suitable for use as a transparent electrode, for example.

[0027] The thickness of the transparent conductive film is preferably 10 μm to 500 μm, more preferably 15 μm to 300 μm, and even more preferably 20 μm to 200 μm.

[0028] B. Transparent conductive layer

[0029] In one embodiment, the transparent conductive layer comprises metal nanowires and a polymer matrix. Forming a transparent conductive layer comprising metal nanowires can produce a three-dimensional shaped article derived from a transparent conductive film that exhibits excellent flexibility and light transmittance. The metal nanowires are protected by the polymer matrix. As a result, corrosion of the metal nanowires can be prevented, resulting in a three-dimensional shaped article derived from a transparent conductive film with enhanced durability.

[0030] The thickness of the transparent conductive layer is preferably 10 nm to 1000 nm, more preferably 20 nm to 500 nm.

[0031] The total light transmittance of the transparent conductive layer is preferably 85% or higher, more preferably 90% or higher, and even more preferably 95% or higher.

[0032] The surface resistance of the transparent conductive layer is preferably 3000 Ω / □ or less, more preferably 1000 Ω / □ or less, and even more preferably 500 Ω / □ or less. The lower the surface resistance of the transparent conductive layer, the better. For example, the lower limit is 200 Ω / □ (preferably 100 Ω / □, more preferably 50 Ω / □).

[0033] (Metal Nanowires)

[0034] Metal nanowires are conductive materials made of metal, shaped like needles or wires, and with nanometer-sized diameters. Metal nanowires can be straight or curved. When using a transparent conductive layer composed of metal nanowires, by forming the metal nanowires into a mesh, even a small amount of metal nanowires can form a good conductive path, resulting in a three-dimensional shaped article derived from a transparent conductive film with low resistance. Furthermore, by forming the metal nanowires into a mesh and openings between the meshes, a three-dimensional shaped article derived from a transparent conductive film with high light transmittance can be obtained.

[0035] The ratio of the thickness d to the length L of the above-mentioned metal nanowires (aspect ratio: L / d) is preferably 10 to 100,000, more preferably 50 to 100,000, and particularly preferably 100 to 10,000. If metal nanowires with a large aspect ratio are used in this way, the metal nanowires are well crossed, and high conductivity can be exhibited by a small amount of metal nanowires. As a result, a three-dimensional formed body derived from a transparent conductive film with high light transmittance can be obtained. Furthermore, in this specification, the so-called "thickness of the metal nanowire" refers to its diameter when the cross-section of the metal nanowire is circular, refers to its short diameter when it is elliptical, and refers to the longest diagonal line when it is polygonal. The thickness and length of the metal nanowire can be confirmed by a scanning electron microscope or a transmission electron microscope.

[0036] The thickness of the metal nanowires is preferably less than 500 nm, more preferably less than 200 nm, particularly preferably 10 nm to 100 nm, and most preferably 10 nm to 50 nm. Within this range, a transparent conductive layer with high light transmittance can be formed.

[0037] The length of the metal nanowires is preferably 1 μm to 1000 μm, more preferably 10 μm to 500 μm, and particularly preferably 10 μm to 100 μm. Within this range, a three-dimensional molded body derived from the transparent conductive film having high conductivity can be obtained.

[0038] As the metal constituting the metal nanowires, any suitable metal can be used as long as it is a conductive metal. Examples of the metal constituting the metal nanowires include silver, gold, copper, and nickel. Furthermore, materials that have been plated (e.g., gold-plated) with these metals can also be used. Among these, silver, copper, or gold are preferred from the perspective of conductivity, with silver being more preferred.

[0039] Any appropriate method can be used to produce the metal nanowires. For example, methods include reducing silver nitrate in a solution, applying a voltage or current to the surface of a precursor from the tip of a probe, and continuously forming the metal nanowires by drawing the metal nanowires from the tip of the probe. In the method of reducing silver nitrate in a solution, silver nanowires can be synthesized by liquid-phase reduction of a silver salt such as silver nitrate in the presence of a polyol such as ethylene glycol and polyvinyl pyrrolidone. Silver nanowires of uniform size can be mass-produced according to the methods described in, for example, Xia, Y. et al., Chem. Mater. (2002), 14, 4736-4745 and Xia, Y. et al., Nano Letters (2003) 3(7), 955-960.

[0040] The transparent conductive layer including the metal nanowires can be formed by applying a dispersion in which the metal nanowires are dispersed in a solvent onto the transparent substrate and then drying the coating layer.

[0041] Examples of the solvent include water, alcoholic solvents, ketone solvents, ether solvents, hydrocarbon solvents, and aromatic solvents. From the viewpoint of reducing environmental load, water is preferably used.

[0042] The dispersion concentration of the metal nanowires in the metal nanowire dispersion is preferably 0.1% by weight to 1% by weight. Within this range, a transparent conductive layer having excellent conductivity and light transmittance can be formed.

[0043] The metal nanowire dispersion may further contain any appropriate additives depending on the intended purpose. Examples of such additives include anticorrosion materials for preventing corrosion of the metal nanowires and surfactants for preventing aggregation of the metal nanowires. The type, amount, and quantity of the additives used can be appropriately determined depending on the intended purpose.

[0044] As a coating method for the above-mentioned metal nanowire dispersion, any appropriate method can be adopted. As coating methods, for example, spray coating, rod coating, roller coating, die coating, inkjet coating, screen coating, dip coating, letterpress printing, gravure printing, photogravure printing, etc. can be mentioned. As a drying method for the coating layer, any appropriate drying method (such as natural drying, air drying, heat drying) can be adopted. For example, in the case of heat drying, the drying temperature is typically 50°C to 200°C, and the drying time is typically 1 to 10 minutes.

[0045] The content of the metal nanowires in the transparent conductive layer is preferably 30% to 90% by weight, and more preferably 45% to 80% by weight, relative to the total weight of the transparent conductive layer. Within this range, a three-dimensional molded article derived from the transparent conductive film having excellent electrical conductivity and light transmittance can be obtained.

[0046] When the metal nanowires are silver nanowires, the density of the transparent conductive layer is preferably 1.3 g / cm 3 ~10.5g / cm 3 , more preferably 1.5 g / cm 3 ~3.0g / cm 3 When the content is within this range, a three-dimensional molded body derived from a transparent conductive film having excellent electrical conductivity and light transmittance can be obtained.

[0047] In one embodiment, the transparent conductive layer is patterned. Any appropriate method may be used for patterning, depending on the morphology of the transparent conductive layer. The shape of the pattern of the transparent conductive layer may be any appropriate shape depending on the intended use. Examples include the patterns described in JP-A-2011-511357, JP-A-2010-164938, JP-A-2008-310550, JP-A-2003-511799, and JP-A-2010-541109. After the transparent conductive layer is formed on the transparent substrate, it may be patterned using any appropriate method, depending on the morphology of the transparent conductive layer.

[0048] In one embodiment, the metal nanowires in the transparent conductive layer have a fusion-bonded network structure. The metal nanowires having the fusion-bonded network structure are fusion-bonded at their contact points. Forming a transparent conductive layer comprising metal nanowires having the fusion-bonded network structure allows for a three-dimensional formed article derived from a transparent conductive film with higher conductivity without compromising transparency.

[0049] The transparent conductive layer containing the metal nanowires having the above-mentioned melt-bonded network structure can be formed, for example, by adding an additive for promoting melt bonding to the metal nanowire dispersion. Examples of such additives include metal halides (e.g., LiCl, CsCl, NaF, NaCl, NaBr, NaI, KCl, MgCl2, CaCl2, AlCl3, AgF, etc.), inorganic acids (e.g., nitric acid, nitrous acid, sulfuric acid, etc.), organic acids (e.g., oxalic acid, citric acid, formic acid, acetic acid, lactic acid, propionic acid, butyric acid, acrylic acid, pyruvic acid, trichloroacetic acid, trifluoroacetic acid, hexanoic acid, octanoic acid, decanoic acid, dodecanoic acid (lauric acid), tetradecanoic acid (myristic acid), hexadecanoic acid (palmitic acid), octadecanoic acid (stearic acid), Examples of the present invention include silver salts (e.g., 2-ethylbutyric acid, 2-methylhexanoic acid, 2-ethylhexanoic acid, 2-propylpentanoic acid, trimethylacetic acid, neoheptanoic acid, neononanoic acid, and neodecanoic acid), silver salts (e.g., silver nitrate, silver nitrite, silver lactate, silver chloride, silver sulfate, silver oxide, silver acetate, silver chlorate, silver sulfide, silver formate, silver hexanoate, silver octanoate, silver decanoate, silver dodecanoate, silver tetradecanoate, silver hexadecanoate, silver octadecanoate, silver pentanoate, silver trimethylacetate, silver neoheptanoate, silver neononanoate, and silver neodecanoate), and compounds (e.g., hydrogen chloride and sodium chloride) containing an element capable of forming a silver salt (e.g., chlorine and sulfur). Among these, metal halides are preferred, and NaCl, AgF, LiF, NaBr, or NaF are more preferred. In one embodiment, the transparent conductive layer containing the metal nanowires having the fusion-bonded network structure can be formed by applying a metal nanowire dispersion containing the above-mentioned additives and then performing a heat treatment and / or a pressure treatment. The temperature of the heat treatment is, for example, 50°C to 200°C.

[0050] The transparent conductive layer containing the metal nanowires having the fusion-bonded network structure can be formed by exposing a coating layer of the metal nanowire dispersion to acyl halide vapor, such as HCl, HBr, HI, or a mixture thereof.

[0051] Metal nanowires having a fusion-bonded network structure and a method for producing the same are described, for example, in Japanese Patent Application Publication No. 2015-530693, the contents of which are incorporated herein by reference.

[0052] (Polymer Matrix)

[0053] As the polymer constituting the polymer matrix, any appropriate polymer can be used. Examples of such polymers include acrylic polymers; polyester polymers such as polyethylene terephthalate; aromatic polymers such as polystyrene, polyvinyl toluene, polyvinyl xylene, polyimide, polyamide, and polyamide-imide; polyurethane polymers; epoxy polymers; polyolefin polymers; acrylonitrile-butadiene-styrene copolymer (ABS); cellulose; silicone polymers; polyvinyl chloride; polyacetate; polynorbornene; synthetic rubber; and fluorine-based polymers. Preferably, a curable resin (preferably a UV-curable resin) composed of a multifunctional acrylate such as pentaerythritol triacrylate (PETA), neopentyl glycol diacrylate (NPGDA), dipentaerythritol hexaacrylate (DPHA), dipentaerythritol pentaacrylate (DPPA), or trimethylolpropane triacrylate (TMPTA) is used.

[0054] As described above, the polymer matrix can be formed by forming a layer composed of metal nanowires on a transparent substrate, coating the layer with a polymer solution, and then drying or curing the coated layer. This operation forms a transparent conductive layer containing metal nanowires in the polymer matrix.

[0055] The polymer solution contains the polymer constituting the polymer matrix or a precursor of the polymer (a monomer constituting the polymer).

[0056] The polymer solution may contain a solvent. Examples of the solvent in the polymer solution include alcoholic solvents, ketone solvents, tetrahydrofuran, hydrocarbon solvents, and aromatic solvents. The solvent is preferably volatile. The boiling point of the solvent is preferably 200°C or lower, more preferably 150°C or lower, and even more preferably 100°C or lower.

[0057] C. Transparent substrate

[0058] The thickness of the transparent substrate is preferably 8 μm to 500 μm, more preferably 10 μm to 250 μm, further preferably 10 μm to 150 μm, and particularly preferably 15 μm to 100 μm.

[0059] The total light transmittance of the transparent substrate is preferably 80% or higher, more preferably 85% or higher, and particularly preferably 90% or higher. Within this range, a three-dimensional molded article derived from a transparent conductive film suitable as a transparent conductive film for use in touch panels, etc. can be obtained.

[0060] Typically, the resin constituting the transparent substrate is a thermoplastic resin. Examples of the resin constituting the transparent substrate include polycarbonate resins; ethylene copolymers such as ethylene-vinyl acetate and ethylene-ethyl acrylate; polyamide resins such as nylon and dimer acid; polystyrene resins such as styrene-butadiene, styrene-isoprene, and styrene-ethylene-butylene; polyester resins; polyolefin resins; polyvinyl ether resins; polymethyl methacrylate resins; ionomer resins; cellulose resins; polyurethane resins; acrylic resins; epoxy resins; melamine resins; and vinyl chloride resins.

[0061] As described above, the transparent substrate contains a resin A having a softening point of 200°C or less. The softening point of the resin A is preferably 50°C to 400°C, more preferably 80°C to 300°C. Within this range, the effects of the present invention described above become significant. In addition, by containing a resin A having a softening point of 80°C or more, degradation of the transparent substrate during formation of the transparent conductive layer can be prevented, and a three-dimensional molded body derived from a transparent conductive film having excellent heat resistance can be obtained. In this specification, the softening point can be measured by the softening point test (ring and ball) method according to JIS-2817.

[0062] In the transparent substrate, the content of the resin A is preferably 80 parts by weight or more, more preferably 90 parts by weight or more, further preferably 95 parts by weight or more, and particularly preferably 100 parts by weight, based on 100 parts by weight of the resin in the transparent substrate.

[0063] The glass transition temperature of the resin constituting the transparent substrate is preferably 50° C. to 400° C., more preferably 80° C. to 300° C. A transparent substrate having a glass transition temperature within this range can prevent degradation during formation of a transparent conductive layer.

[0064] The transparent substrate may further contain any appropriate additives as needed. Specific examples of additives include plasticizers, heat stabilizers, light stabilizers, lubricants, antioxidants, ultraviolet absorbers, flame retardants, colorants, antistatic agents, compatibilizers, crosslinking agents, and thickeners. The type and amount of the additives used may be appropriately set according to the intended purpose.

[0065] As a method for obtaining the above-mentioned transparent substrate, any appropriate molding method can be used, for example, a suitable method can be suitably selected from compression molding, transfer molding, injection molding, extrusion molding, blow molding, powder molding, FRP molding and solvent casting. Among these preparation methods, extrusion molding or solvent casting is preferably used. This is because the smoothness of the transparent substrate obtained can be improved, and good optical uniformity can be obtained. The molding conditions can be appropriately set according to the composition, type, etc. of the resin used.

[0066] As required, various surface treatments can be performed on the above-mentioned transparent substrate. Surface treatment can be performed by any appropriate method according to the purpose. For example, low-pressure plasma treatment, ultraviolet irradiation treatment, corona treatment, flame treatment, acid or alkali treatment can be enumerated. In one embodiment, the transparent substrate is surface treated to make the transparent substrate surface hydrophilic.

[0067] Example

[0068] The present invention is described in detail below by way of examples, but the present invention is not limited to these examples. The measuring methods of various properties are as follows. It should be noted that, unless otherwise specified, the "parts" and "%" in the examples and comparative examples are by weight.

[0069] (1) Initial resistance

[0070] The surface resistance value of the transparent conductive film (that is, the film before three-dimensional molding) was measured using a NAPSON product name "EC-80". The measurement temperature was set to 23°C.

[0071] (2) Formability

[0072] A block-shaped metal mold having a hemispherical depression (radius: 5 cm) in the center is aligned with the opposite side of the conductor side, and is molded using a TOM molding machine (manufactured by Fuse Vacuum Co., Ltd.) at a set temperature of 160°C, thereby obtaining a three-dimensional molded body derived from a transparent conductive film molded in a hemispherical shape.

[0073] The quality of the moldability was evaluated based on the appearance of the obtained three-dimensional molded body derived from the transparent conductive film.

[0074] (3) Resistance value after forming (surface resistance value)

[0075] After forming a 1 cm square grid on the entire surface of the transparent conductive film (ie, the film before three-dimensional forming), three-dimensional forming was performed by the method (2) described above.

[0076] After forming, the grid squares are numbered and cut out individually. In each cutout (numbered section), silver paste is applied to a width of 3 mm on the side A perpendicular to the longest side and the side opposite to side A. After the silver paste is dried, resistance is measured using a tester to calculate the surface resistance.

[0077] (4) Transmittance

[0078] After forming a 1 cm square grid on the entire surface of the transparent conductive film (ie, the film before three-dimensional forming), three-dimensional forming was performed by the method (2) described above.

[0079] The transmittance of the transparent conductive film (ie, the film before three-dimensional forming) and the transparent conductive film after three-dimensional forming (three-dimensionally formed body derived from the transparent conductive film) was measured using a spectrophotometer U-4100 manufactured by Hitachi, Ltd.

[0080] The transmittance of the three-dimensional molded article derived from the transparent conductive film was measured for samples cut out for each grid pattern.

[0081] [Production Example 1] (Synthesis of Silver Nanowires and Preparation of Silver Nanowire Dispersion)

[0082] In a reaction vessel equipped with a stirring device, 5 ml of anhydrous ethylene glycol and an anhydrous ethylene glycol solution of PtCl2 (concentration: 1.5×10 -4 mol / L) 0.5 ml. After 4 minutes, 2.5 ml of an anhydrous ethylene glycol solution of AgNO₃ (concentration: 0.12 mol / L) and 5 ml of an anhydrous ethylene glycol solution of polyvinylpyrrolidone (MW: 55000) (concentration: 0.36 mol / L) were simultaneously added dropwise to the resulting solution over 6 minutes. After this addition, the mixture was heated to 160°C and reacted for at least 1 hour until the AgNO₃ was completely reduced, forming silver nanowires. Next, acetone was added to the reaction mixture containing silver nanowires obtained above until the volume of the reaction mixture was reduced to 5 times the volume. The reaction mixture was then centrifuged (2000 rpm, 20 minutes) to obtain silver nanowires.

[0083] The obtained silver nanowires have a short diameter of 30 nm to 40 nm, a long diameter of 30 nm to 50 nm, and a length of 5 μm to 50 μm.

[0084] The silver nanowires (concentration: 0.2 wt %) and pentaethylene glycol dodecyl ether (concentration: 0.1 wt %) were dispersed in pure water to prepare a silver nanowire dispersion liquid I.

[0085] [Example 1]

[0086] A polycarbonate resin film (manufactured by Teijin Chemicals, product name "PC1151", thickness 100 μm, softening point: 130°C) was used as a substrate. Silver nanowire dispersion liquid I was applied to the substrate and dried. Next, as materials for forming the overcoat layer, resin composition A was prepared by combining 80 parts by weight of "UNIDIC ELS-888" manufactured by DIC Corporation and 20 parts by weight of "UNIDIC RS28-605" manufactured by DIC Corporation. This resin composition A was applied to the conductive layer and exposed at an exposure dose of 230 mJ / cm 2 The polymer matrix was formed by irradiation with ultraviolet light to obtain a transparent conductive film. The surface resistance of the transparent conductive film was 30Ω, and the thickness of the transparent conductive layer was 1.0 μm.

[0087] The obtained transparent conductive film was subjected to the above-mentioned evaluation. The results are shown in Table 1.

[0088] [Example 2]

[0089] A transparent conductive film was obtained in the same manner as in Example 1, except that a nylon film (manufactured by Mitsubishi Chemical Corporation, product name "Supernil," thickness 40 μm, softening point: 100°C) was used instead of the polycarbonate resin film. The obtained transparent conductive film was subjected to the above-described evaluation. The results are shown in Table 1.

[0090] [Example 3]

[0091] A transparent conductive film was obtained in the same manner as in Example 1, except that an acrylic resin film (manufactured by Mitsubishi Chemical Corporation, product name "ACRYPRENE," thickness 40 μm, softening point: 100° C.) was used instead of the polycarbonate resin film. The obtained transparent conductive film was subjected to the above-described evaluation. The results are shown in Table 1.

[0092] [Comparative Example 1]

[0093] A transparent conductive film was obtained in the same manner as in Example 1, except that a PET film (manufactured by Toray Industries, Inc., product name "Lumirror," thickness 40 μm, softening point: 210° C.) was used instead of the polycarbonate resin film. The obtained transparent conductive film was subjected to the above-described evaluation. The results are shown in Table 1.

[0094] [Comparative Example 2]

[0095] A transparent conductive film was obtained in the same manner as in Example 1, except that a cycloolefin resin film (manufactured by ZEON Corporation, product name "ZF16," 40 μm thick, softening point: 250°C) was used instead of the polycarbonate resin film. The obtained transparent conductive film was subjected to the above-described evaluation. The results are shown in Table 1.

[0096] [Comparative Example 3]

[0097] A polycarbonate resin film (Teijin Chemicals, product name "PC1151," 100 μm thick, softening point: 130°C) was used as a substrate. Denatron, product name "Denatron" from Nagase ChemteX, was applied to this substrate and dried to produce a conductive film having a PEDOT conductive layer. The resulting transparent conductive film was subjected to the aforementioned evaluation. The results are shown in Table 1.

[0098] [Comparative Example 4]

[0099] A polycarbonate resin film (manufactured by Teijin Chemicals, product name "PC1151," 100 μm thick, softening point: 130°C) was used as a substrate. Using ITO as a target, a transparent conductive film was vacuum-deposited on this substrate. The resulting transparent conductive film was subjected to the aforementioned evaluation. The results are shown in Table 1.

[0100] [Table 1]

[0101]

[0102] As is clear from Table 1, the present invention provides a three-dimensional film-derived formed article having excellent electrical conductivity and appearance. On the other hand, when a substrate with a high softening point is used, forming with a good appearance is not possible (Comparative Examples 1 and 2). Furthermore, when a conductive layer not composed of metal nanowires is included, the initial resistance is high, and a significant decrease in resistivity is confirmed by forming (Comparative Examples 3 and 4). It should be noted that in Comparative Example 4, cracks were generated in the conductive layer due to forming.

[0103] Description of Reference Numerals

[0104] 10 base material

[0105] 20 transparent conductive layer

[0106] 100 transparent conductive film

Claims

1. A three-dimensional formed body derived from a transparent conductive film, comprising: Base material, and a transparent conductive layer disposed on at least one side of the substrate, The substrate comprises a resin A having a softening point of 200° C. or less, The transparent conductive layer includes metal nanowires.

2. The three-dimensional formed body derived from a transparent conductive film according to claim 1, wherein: The metal nanowires have a melt-bonded mesh structure.

3. The three-dimensional formed body derived from a transparent conductive film according to claim 1 or 2, wherein: The total light transmittance is above 80%.

4. The three-dimensional formed body derived from a transparent conductive film according to claim 1 or 2, wherein: The surface resistivity is less than 3000Ω / □.

5. The three-dimensional formed body derived from a transparent conductive film according to claim 3, wherein The surface resistivity is less than 3000Ω / □. 6 . A transparent conductive film for forming a three-dimensional formed body derived from the transparent conductive film according to claim 1 .

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