Detector module, detector, and medical imaging apparatus

Abstract

The invention discloses a detector module, a detector and a medical imaging device, the detector module comprises a module support and a sub-module assembly, the module support defines a first heat dissipation channel extending in the Z direction; a plurality of sub-module assemblies arranged in the Z direction form at least one sub-module row, each sub-module assembly comprises a sub-module and a sub-module support which are in heat conduction fit, and the sub-module is connected with the module support through the sub-module support; wherein at least one sub-module support defines a second heat dissipation channel, the second heat dissipation channel is communicated with the first heat dissipation channel, and the second heat dissipation channel and the first heat dissipation channel are used for forming a heat dissipation medium flowing channel. The heat dissipation medium not only can dissipate heat of the module support, but also can directly flow into the sub-module support to directly dissipate heat, so that the sub-module can directly transfer heat to the heat dissipation medium through the sub-module support in a thermal contact mode, the heat transfer path is shortened, and the heat dissipation efficiency of the sub-module can be improved; the detector module is good in heat dissipation performance and high in working reliability.

Description

Technical Field

[0001] The present invention relates to the technical field of medical equipment, and in particular to a detector module, a detector and a medical imaging device. Background Art

[0002] With the advancements in CT (Computed Tomography) scanners, the number of slices and channels in CT detector systems has increased. The image quality required for low dose and high signal-to-noise ratio requires detectors with denser pixel density. Consequently, the detector's heat generation has increased significantly. This increased temperature gradient leads to increased local heat load, which has a significant impact on the detector's physical and imaging performance. Sustained high heat generation increases electronic noise and susceptibility to aging of internal components. Therefore, maintaining a stable, low detector temperature has become increasingly important, leading to increased attention to heat dissipation in detector system design.

[0003] In the related art, a fan is usually installed on the detector housing. Through the high-speed rotation of the fan, the cold air inside the CT machine cavity is forced to flow through the module bracket with heat dissipation fins and the circuit board itself of the detector system to achieve the purpose of cooling. However, this method has low heat dissipation efficiency and there is room for improvement. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a detector module having high heat dissipation efficiency and strong working reliability.

[0005] The present invention also provides a detector having the above detector module.

[0006] The present invention also provides a medical imaging device having the detector.

[0007] According to an embodiment of the first aspect of the present invention, the detector module includes: a module bracket, which extends along the Z direction; at least one row of sub-modules, the sub-module row including a plurality of sub-module assemblies sequentially installed on the module bracket along the Z direction, the sub-module assembly including a sub-module and a sub-module bracket, the sub-module being connected to the module bracket via the sub-module bracket, and the sub-module being thermally coordinated with the sub-module bracket; wherein the module bracket defines a first heat dissipation channel, and at least one of the sub-module brackets defines a second heat dissipation channel, the second heat dissipation channel is connected to the first heat dissipation channel, and the two are used to form a heat dissipation medium flow path.

[0008] According to the detector module of an embodiment of the present invention, a second heat dissipation channel is provided on the sub-module bracket, so that the heat dissipation medium can not only dissipate heat to the module bracket, but also flow directly into the sub-module bracket to directly dissipate heat to the sub-module bracket. As a result, the sub-module can directly transfer heat to the heat dissipation medium through the sub-module bracket by thermal contact, shortening the heat transfer path, thereby improving the heat dissipation efficiency of the sub-module; the detector module has good heat dissipation performance and strong working reliability.

[0009] In some embodiments, the first heat dissipation channel includes a first sub-channel and a second sub-channel, and the second sub-channel is connected to the first sub-channel through any second heat dissipation channel; or, the second sub-channel is connected to the first sub-channel through multiple second heat dissipation channels connected in sequence, and one of the first sub-channel and the second sub-channel is formed with a medium inlet, and the other is formed with a medium outlet.

[0010] In some embodiments, both ends of the second heat dissipation channel pass through a side surface of the sub-module bracket facing the module bracket in the Y direction to form a first through hole and a second through hole, respectively. The first through hole is connected to the first sub-channel, and the second through hole is connected to the second sub-channel. The sub-module bracket is fixedly connected to the module bracket along the Y direction.

[0011] In some embodiments, the second heat dissipation channel includes an inflow section, an outflow section and at least one heat dissipation section, the inflow section and the outflow section respectively extend along the Y direction and are spaced apart along the Z direction, the inflow section is connected to the first through hole, the outflow section is connected to the second through hole, the heat dissipation section is connected between the inflow section and the outflow section, and at least one side surface of the submodule bracket in the X direction is thermally conductively matched with the submodule.

[0012] In some embodiments, there are multiple heat dissipation segments and they are spaced apart along the Y direction; wherein, the flow area of the heat dissipation segment close to the module bracket among two adjacent heat dissipation segments is smaller than the flow area of the heat dissipation segment far from the module bracket.

[0013] In some embodiments, the sub-module bracket that defines the second heat dissipation channel is an integrally formed part, and the sub-module bracket that defines the second heat dissipation channel also defines at least one connecting channel, and each of the heat dissipation segments is connected to one connecting channel at one end in the Z direction, and the connecting channel is connected to the connecting position corresponding to the heat dissipation segment and the inflow segment / the outflow segment, and the connecting channel extends along the Z direction and passes through the outer surface of the sub-module bracket away from the end corresponding to the heat dissipation segment; the detector module also includes: a sealing member, which blocks the connecting channel.

[0014] In some embodiments, at least two of the sub-module brackets adjacent to each other along the Z direction are integrally connected; and / or, the sub-module rows are multiple rows and are arranged in sequence along the X direction, and the sub-module brackets corresponding to the sub-module components of at least two adjacent rows of the sub-module rows are opposite to each other along the X direction and integrally connected.

[0015] In some embodiments, the sub-modules are arranged in multiple rows and are arranged in sequence along the X direction, and the corresponding sub-module components of two adjacent rows of the sub-modules are facing each other along the X direction; each of the sub-module brackets defines the second heat dissipation channel, and the first through hole and the second through hole of the sub-module bracket are arranged at intervals along the Z direction. The first sub-channel forms the medium inlet, and the second sub-channel forms the medium outlet, and the second sub-channels are respectively arranged at intervals on both sides of the first sub-channel in the X direction.

[0016] In some embodiments, the module bracket includes a bracket body, a first blocking cover and a second blocking cover, the first sub-channel and the second sub-channel both pass through both ends of the bracket body along the Z direction, the first blocking cover blocks one end of the first sub-channel and the second sub-channel in the Z direction and separates the first sub-channel and the second sub-channel, the second blocking cover blocks the other end of the first sub-channel and the second sub-channel in the Z direction and separates the first sub-channel and the second sub-channel, the medium inlet is formed on the first blocking cover, and the medium outlet is formed on the bracket body.

[0017] In some embodiments, the sub-module bracket is detachably connected to the module bracket.

[0018] The detector according to the second aspect of the present invention comprises a plurality of housings and a plurality of detector modules according to the first aspect of the present invention, wherein the plurality of detector modules are arranged side by side along the X direction.

[0019] According to the detector of the present invention, by providing the detector module of the first aspect, the detector has good heat dissipation effect and strong working stability.

[0020] According to a third aspect of the present invention, a medical imaging device includes a scanning frame, a radiation source, and a detector according to the second aspect of the present invention; the radiation source and the detector are respectively arranged on the scanning frame, the radiation source is used to emit rays to the scanned object, and the detector is used to receive rays attenuated by the scanned object.

[0021] According to the medical imaging device of the present invention, by providing the detector according to the second aspect, the medical imaging device has good heat dissipation performance and strong working stability.

[0022] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic structural diagram of a detector module according to one embodiment of the present invention;

[0024] Figure 2 is a schematic structural diagram of a bracket body according to an embodiment of the present invention;

[0025] Figure 3 is a cross-sectional view of a submodule bracket according to one embodiment of the present invention;

[0026] Figure 4 is a schematic structural diagram of a submodule bracket according to an embodiment of the present invention;

[0027] Figure 5 is a bottom view of a submodule bracket according to one embodiment of the present invention;

[0028] Figure 6 is based on Figure 5 AA section of the example shown;

[0029] Figure 7 is a side view of a submodule assembly according to one embodiment of the present invention;

[0030] Figure 8 is a partial structural diagram of a submodule according to an embodiment of the present invention;

[0031] Figure 9 is a partial structural side view of a submodule according to one embodiment of the present invention;

[0032] Figure 10 2 is a schematic structural diagram of a bracket body according to an embodiment of the present invention.

[0033] Reference numerals:

[0034] Detector module 100;

[0035] Module bracket 1; first heat dissipation channel 1a; first sub-channel 11; second sub-channel 12; bracket body 13; medium outlet 131; first blocking cover 14; medium inlet 141; second blocking cover 15; first connecting branch inlet 16; first connecting branch outlet 17; second connecting branch inlet 18; second connecting branch outlet 19;

[0036] Submodule row 20; submodule assembly 2;

[0037] Submodule 21; detection unit 211; digital-to-analog conversion unit 212; signal transmission unit 213;

[0038] Submodule bracket 22; second heat dissipation channel 221; inflow section 2211; outflow section 2212; heat dissipation section 2213; first through hole 222; second through hole 223; sealing rubber ring 224; communication channel 225; boss 226; base 22a; support base 22b;

[0039] Blocking piece 3;

[0040] First drip-free quick connector 4;

[0041] Second drip-free quick connector 5. DETAILED DESCRIPTION

[0042] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0043] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art will appreciate the applicability of other processes and / or the use of other materials.

[0044] The detector module 100 according to the first embodiment of the present invention will be described below with reference to the accompanying drawings.

[0045] Detector modules 100 are components of a detector. The detector is used to detect radiation emitted by a radiation source after being attenuated by the scanned object. Therefore, each detector module 100 is also used to detect radiation emitted by a radiation source after being attenuated by the scanned object. The detector can be used in any device and can be used in medical imaging equipment or other equipment requiring scanning and imaging, such as security inspection equipment.

[0046] In CT scanners, XYZ coordinates are usually used, where X is the arrangement direction of the module bracket 1, Y is the vertical direction, and Z is perpendicular to the plane formed by the XY directions. The Z direction is usually the rotation axis of the scanner.

[0047] The X-direction, Y-direction, and Z-direction mentioned below are coordinate directions commonly used in CT scanners when the detector module 100 is applied to a CT scanner. The X-direction, Y-direction, and Z-direction mentioned below can be expressed as three mutually perpendicular directions when the detector is applied to other devices, i.e., the X-direction is a first direction, the Y-direction is a second direction, and the Z-direction is a third direction, and the first direction, the second direction, and the third direction are mutually perpendicular in pairs.

[0048] According to the detector module 100 of the embodiment of the present invention, Figure 1-Figure 3 As shown, the detector module 100 includes: a module bracket 1 and at least one row of sub-module rows 20, the module bracket 1 is extended along the Z direction; the sub-module row 20 includes a plurality of sub-module assemblies 2 installed in sequence on the module bracket 1 along the Z direction, the sub-module assembly 2 includes a sub-module 21 and a sub-module bracket 22, the sub-module 21 is connected to the module bracket 1 through the sub-module bracket 22, and the sub-module 21 and the sub-module bracket 22 are thermally matched; wherein, the module bracket 1 defines a first heat dissipation channel 1a extending along the Z direction, and at least one sub-module bracket 22 defines a second heat dissipation channel 221, the second heat dissipation channel 221 is connected to the first sub-channel 11, and the two are used to form a heat dissipation medium flow path.

[0049] The module bracket 1 is the main load-bearing component and installation component of the detector module 100, and multiple sub-module assemblies 2 are installed on the sub-module bracket 22; the sub-module assembly 2 is the main functional component of the detector module 100. The sub-module assembly 2 detects the rays emitted by the radiation source after attenuation by the scanned object and completes the conversion of X-rays into electrical signals.

[0050] Multiple submodule assemblies 2 sequentially mounted on the module support 1 along the Z direction form a submodule row 20, and the detector module 100 includes at least one row of submodule rows 20. The detector module 100 may include one row of submodule rows 20, and the submodule assemblies 2 located on the module support 1 are sequentially arranged along the Z direction; or the detector module 100 may also include multiple rows of submodule rows 20, and the multiple submodule assemblies 2 located on the module support 1 are not only sequentially arranged along the Z direction, but also sequentially arranged along the X direction. For example, Figure 1 As shown, the detector module 100 includes two rows of submodules 20, with the submodule assemblies 2 of the two rows 20 arranged opposite each other in the X-direction. The multiple submodule assemblies 2 are sequentially installed on the module support 1 along the Z-direction. This merely illustrates the arrangement of the submodule assemblies 2 and does not indicate or imply the order in which the multiple submodule assemblies 2 should be installed.

[0051] It is worth noting that the module bracket 1 can extend in the Z direction in a linear direction or in a nonlinear direction, for example, it can be arranged along a curved direction extending approximately along the Z direction; similarly, multiple sub-module components 2 are installed on the module bracket 1 in sequence along the Z direction, and can be extended in the Z direction in a linear direction or in a nonlinear direction, for example, they can be arranged along a curved direction extending approximately along the Z direction.

[0052] The submodule assembly 2 includes a submodule 21 and a submodule bracket 22. The submodule 21 is used to convert X-rays into electrical signals. The submodule 21 is usually composed of a scintillator array, a photodiode, a substrate and an AD conversion circuit, wherein the scintillator array is usually a matrix structure such as 32×16 or 16×16.

[0053] Submodule 21 generates heat during operation. On the one hand, submodule 21 can transfer heat to module bracket 1 through submodule bracket 22 via thermal contact. Submodule 21 is connected to module bracket 1 via submodule bracket 22. Submodule 21 generates heat during operation, and submodule 21 and submodule bracket 22 cooperate in thermal conductivity to transfer heat to submodule bracket 22. Submodule bracket 22 is mounted on module bracket 1, and heat is transferred to module bracket 1 through thermal contact. Module bracket 1 has a large area and heats up quickly. Furthermore, module bracket 1 defines a first heat dissipation channel 1a. The flow of heat dissipation medium within first heat dissipation channel 1a accelerates heat dissipation from module bracket 1, thereby improving the heat dissipation rate of detector module 100.

[0054] Furthermore, the present invention defines a second heat dissipation channel 221 on the submodule bracket 22, allowing heat dissipation medium to flow between the first heat dissipation channel 1a and the second heat dissipation channel 221. Thus, the submodule 21 can directly transfer heat to the heat dissipation medium through the submodule bracket 22 via thermal contact, shortening the heat transfer path and thereby improving the heat dissipation efficiency of the submodule 21.

[0055] It is worth noting that the second heat dissipation channel 221 can be connected to an external circulation system, as described below, to conduct heat-exchanged heat dissipation medium out of the system and continue to direct cooler heat dissipation medium into the detector module 100. The heat dissipation medium quickly removes heat from the submodule 21, thereby further accelerating heat dissipation from the detector module 100. Alternatively, the second heat dissipation channel 221 can be independent of the external environment, with the heat dissipation medium flowing only between the first heat dissipation channel 1a and the second heat dissipation channel 221. The heat dissipation medium can accelerate heat transfer to the module bracket 1, improve the heat dissipation efficiency of the submodule 21, and accelerate heat dissipation from the detector module 100.

[0056] It is also worth noting that the heat dissipation medium may be a coolant or a cooling airflow, which can be selected according to actual needs and is within the scope of protection of the present invention.

[0057] In the related art, a common approach is to install a fan on the detector housing. The fan's high-speed rotation forces cool air from the CT machine cavity through the detector, achieving cooling. However, when high-power submodules operate intensively, the heat generated cannot be promptly dissipated. The detector module 100 of the present embodiment employs a second heat dissipation channel 221 provided on the submodule bracket 22. This utilizes a heat dissipation medium to dissipate heat from the multiple submodule assemblies 2, thereby improving heat dissipation.

[0058] According to the detector module 100 of an embodiment of the present invention, by providing a second heat dissipation channel 221 on the sub-module bracket 22, the heat dissipation medium can not only dissipate heat to the module bracket 1, but can also directly flow into the sub-module bracket 22 to directly dissipate heat to the sub-module bracket 22. As a result, the sub-module 21 can directly transfer heat to the heat dissipation medium through the sub-module bracket 22 by thermal contact, shortening the heat transfer path, thereby improving the heat dissipation efficiency of the sub-module 21; the detector module 100 has good heat dissipation performance and strong working reliability.

[0059] In some embodiments of the present invention, Figure 2 As shown, the first heat dissipation channel 1a includes a first sub-channel 11 and a second sub-channel 12. The second sub-channel 12 is connected to the first sub-channel 11 through any second heat dissipation channel 221. One of the first sub-channel 11 and the second sub-channel 12 is formed with a medium inlet 141, and the other is formed with a medium outlet 131.

[0060] The first sub-channel 11 forms a medium inlet 141, and the second sub-channel 12 forms a medium outlet 131. The heat dissipation medium flows into the detector module 100 through the first sub-channel 11 and then flows out of the detector module 100 through the second sub-channel 12. The heat dissipation medium forms a circulation from the first sub-channel 11 to the second heat dissipation channel 221 to the second sub-channel 12 in the module bracket 1.

[0061] The detector module 100 is connected to an external circulation system, which directs the heat dissipation medium through the medium outlet 131 and directs the cooler heat dissipation medium through the medium inlet 141. The heat dissipation medium rapidly removes heat from the submodule 21 and removes it from the detector module 100, further accelerating heat dissipation from the detector module 100 compared to heat dissipation solely through heat exchange with the external environment via the module bracket 1.

[0062] The second sub-channel 12 is connected to the first sub-channel 11 through any second heat dissipation channel 221. This means that the second sub-channel 12 is connected to all of the second heat dissipation channels 221, and the first sub-channel 11 is also connected to all of the second heat dissipation channels 221. The multiple second heat dissipation channels 221 are connected in parallel. Consequently, after the heat dissipation medium flows from the first sub-channel 11 into the second heat dissipation channel 221, it undergoes heat exchange and flows directly out of the second sub-channel 12 through the second heat dissipation channel 221. After heat exchange in the second heat dissipation channel 221, the heat dissipation medium rarely flows back into other second heat dissipation channels 221. This results in balanced heat dissipation across the multiple sub-module assemblies 2, which helps improve the operational stability of the detector module 100.

[0063] In other embodiments of the present invention, the first heat dissipation channel 1a includes a first sub-channel 11 and a second sub-channel 12, the second sub-channel 12 is connected to the first sub-channel 11 through a plurality of second heat dissipation channels 221 connected in sequence, and one of the first sub-channel 11 and the second sub-channel 12 is formed with a medium inlet 141, and the other is formed with a medium outlet 131.

[0064] The first sub-channel 11 forms a medium inlet 141, and the second sub-channel 12 forms a medium outlet 131. The heat dissipation medium flows into the detector module 100 through the first sub-channel 11 and then flows out of the detector module 100 through the second sub-channel 12. The heat dissipation medium forms an internal circulation from the first sub-channel 11 to the second heat dissipation channel 221 to the second sub-channel 12 in the module bracket 1.

[0065] The second sub-channel 12 is connected to the first sub-channel 11 through a plurality of second heat dissipation channels 221 connected in sequence. The plurality of second heat dissipation channels 221 are connected in series, so that the heat dissipation medium can fully exchange heat in the plurality of sub-module brackets 22 before flowing out.

[0066] In some embodiments of the present invention, Figure 2 As shown, the first sub-channel 11 and the second sub-channel 12 both extend along the Z direction, and the lengths of the first sub-channel 11 and the second sub-channel 12 are equal to or slightly shorter than the length of the module bracket 1 .

[0067] The second sub-channel 12 is connected to multiple second heat dissipation channels 221, and the first sub-channel 11 is also connected to multiple second heat dissipation channels 221. Therefore, the lengths of the first sub-channel 11 and the second sub-channel 12 are both longer to meet the requirements of connecting with the second heat dissipation channels 221 in multiple sub-module brackets 22.

[0068] Therefore, the second sub-channel 12 can also play a heat dissipation role. The heat dissipation medium flowing in the second sub-channel 12 undergoes heat exchange, but the temperature of the heat dissipation medium is still lower than the module bracket 1. The heat dissipation speed of the module bracket 1 can still be accelerated during the process of flowing out through the second sub-channel 12, thereby further improving the heat dissipation efficiency of the detector module 100.

[0069] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, both ends of the second heat dissipation channel 221 pass through the side surface of the sub-module bracket 22 facing the module bracket 1 in the Y direction to form a first through hole 222 and a second through hole 223 respectively. The first through hole 222 is connected to the first sub-channel 11, and the second through hole 223 is connected to the second sub-channel 12. The sub-module bracket 22 is fixedly connected to the module bracket 1 along the Y direction.

[0070] The submodule bracket 22 is fixedly connected to the module bracket 1 along the Y direction on one side thereof. Therefore, the second heat dissipation channel 221 is formed with a first through-hole 222 and a second through-hole 223 on the surface of the submodule bracket 22 for the inflow and outflow of heat dissipation medium. The first through-hole 222 communicates with the first sub-channel 11, and the second through-hole 223 communicates with the second sub-channel 12. The heat dissipation medium flows into the second heat dissipation channel 221 through the first through-hole 222, exchanges heat within the second heat dissipation channel 221, and then flows out of the second through-hole 223 to the second sub-channel 12.

[0071] Similarly, a first connecting branch and a second connecting branch are provided on the module support 1, such as Figure 2 and Figure 10 As shown, the inlet 16 of the first connecting branch communicates with the first sub-channel 11, the outlet 17 of the first connecting branch communicates with the second heat dissipation channel 221, the inlet 18 of the second connecting branch communicates with the second heat dissipation channel 221, and the outlet 19 of the second connecting branch communicates with the second sub-channel 12. The first connecting branch forms the outlet 17 of the first connecting branch on the surface of the module bracket 1 facing the sub-module assembly 2, and the second connecting branch forms the inlet 18 of the second connecting branch on the surface of the module bracket 1 facing the sub-module assembly 2. The outlet 17 of the first connecting branch communicates with the first through-hole 222 in the Y direction, and the inlet 18 of the second connecting branch communicates with the second through-hole 223 in the Y direction.

[0072] Furthermore, the surface of the submodule 21 facing the module bracket 1 in the Y direction is in close contact with the surface of the module bracket 1 , which can accelerate the transfer of heat from the submodule bracket 22 to the module bracket 1 and is beneficial to heat dissipation.

[0073] In some embodiments of the present invention, Figure 5 and Figure 6As shown, the submodule bracket 22 is provided with a sealing rubber ring 224 on the periphery of the first through hole 222 and the second through hole 223, which can improve the connection sealing between the submodule bracket 22 and the module bracket 1 and improve the leakage of the heat dissipation medium from the connection point.

[0074] In some embodiments of the present invention, Figure 3 As shown, the second heat dissipation channel 221 includes an inflow section 2211, an outflow section 2212 and at least one heat dissipation section 2213. The inflow section 2211 and the outflow section 2212 extend along the Y direction respectively and are spaced apart along the Z direction. The inflow section 2211 is connected to the first through hole 222, and the outflow section 2212 is connected to the second through hole 223. The heat dissipation section 2213 is connected between the inflow section 2211 and the outflow section 2212. At least one side surface of the submodule bracket 22 in the X direction is thermally coordinated with the submodule 21.

[0075] The heat dissipation medium flows into the inlet section 2211, passes through the heat dissipation section 2213, and then flows to the outlet section 2212, and finally flows from the outlet section 2212 to the second sub-channel 12. At least one surface of the sub-module bracket 22 in the X-direction is thermally conductively coupled with the sub-module 21. Therefore, by spacing the inlet section 2211 and the outlet section 2212 in the Z-direction, connecting the heat dissipation section 2213 between the inlet section 2211 and the outlet section 2212, and extending the heat dissipation section 2213 in the Z-direction, the length of the second heat dissipation channel 221 can be increased, thereby increasing the heat exchange area between the heat dissipation medium and the sub-module bracket 22, thereby improving the heat dissipation efficiency of the sub-module assembly 2.

[0076] In some embodiments of the present invention, Figure 3 As shown, there are multiple heat dissipation sections 2213 and they are spaced apart along the Y direction; wherein, the flow area of the heat dissipation section 2213 close to the module bracket 1 of two adjacent heat dissipation sections 2213 is smaller than the flow area of the heat dissipation section 2213 far from the module bracket 1.

[0077] By connecting multiple heat dissipation sections 2213 between the inflow section 2211 and the outflow section 2212, the multiple heat dissipation sections 2213 are arranged at intervals along the extension direction of the inflow section 2211 and the outflow section 2212, thereby increasing the length of the second heat dissipation channel 221 and increasing the heat exchange area of the heat dissipation medium and the submodule bracket 22.

[0078] The heat dissipation medium flows from the module bracket 1 to the sub-module bracket 22. Therefore, under the premise that the flow area of the heat dissipation section 2213 is the same, the flow rate of the heat dissipation medium in the heat dissipation section 2213 close to the module bracket 1 will be greater than the flow rate of the heat dissipation medium in the heat dissipation section 2213 far away from the module bracket 1.

[0079] In the embodiment of the present invention, the flow area of the heat dissipation section 2213 close to the module bracket 1 in the two adjacent heat dissipation sections 2213 is designed to be smaller than the flow area of the heat dissipation section 2213 far away from the module bracket 1, thereby increasing the flow rate of the heat dissipation medium in the heat dissipation section 2213 far away from the module bracket 1 in the two adjacent heat dissipation sections 2213, making the flow rate of the heat dissipation medium in multiple heat dissipation sections 2213 balanced and improving the heat exchange effect.

[0080] In some specific embodiments of the present invention, Figure 3 As shown, there are two heat dissipation sections 2213 and they are spaced apart along the Y direction. The inner diameter L2 of the heat dissipation section 2213 close to the module bracket 1 among the two adjacent heat dissipation sections 2213 is smaller than the inner diameter L1 of the heat dissipation section 2213 far from the module bracket 1 among the two adjacent heat dissipation sections 2213, so that the flow area of the heat dissipation section 2213 close to the module bracket 1 among the two adjacent heat dissipation sections 2213 is smaller than the flow area of the heat dissipation section 2213 far from the module bracket 1.

[0081] In some specific embodiments of the present invention, Figure 7 As shown, the submodule 21 includes: a detection unit 211, a digital-to-analog conversion unit 212 and a signal transmission unit 213. The detection unit 211 is used to convert the optical signal into an analog signal, the analog-to-digital conversion unit is used to convert the analog signal into a digital signal, and the signal transmission unit 213 is used for signal transmission. The signal transmission unit 213 is connected between the detection unit 211 and the digital-to-analog conversion unit 212. The signal transmission unit 213 is also connected to other components to transmit the signal out of the submodule component 2.

[0082] like Figure 8 and Figure 9 As shown, the submodule 21 is provided with signal transmission units 213 on both sides of the submodule bracket 22 in the X direction, and a digital-to-analog conversion unit 212 is provided on the side of the two signal transmission units 213 facing the submodule bracket 22. The digital-to-analog conversion units 212 are arranged in two rows in the Y direction, wherein the digital-to-analog conversion units 212 generate more heat when working.

[0083] Therefore, in some embodiments of the present invention, the location of the heat dissipation section 2213 on the submodule bracket 22 corresponds to the location of the module conversion unit, thereby shortening the distance between the heat dissipation medium and the module conversion unit and improving the heat dissipation effect of the module conversion unit. Figure 4 and Figure 7 As shown, a boss 226 is provided on the submodule bracket 22, and the digital-to-analog conversion unit 212 of the submodule 21 is disposed on both sides of the boss 226 on the same side in the Y direction, and the heat dissipation section 2213 is also disposed on both sides of the boss 226 in the Y direction in the Y direction, and the heat dissipation section 2213 is disposed corresponding to the module conversion unit.

[0084] In some embodiments of the present invention, Figure 3 As shown, the submodule bracket 22 defining the second heat dissipation channel 221 is an integrally formed component. The submodule bracket 22 defining the second heat dissipation channel 221 also defines at least one communication channel 225. Each heat dissipation segment 2213 is connected to a communication channel 225 at one end in the Z direction. The communication channel 225 connects to the corresponding heat dissipation segment 2213 at the connection point between the inflow segment 2211 and the outflow segment 2212. The communication channel 225 extends along the Z direction and extends through the outer surface of the submodule bracket 22 at the end away from the corresponding heat dissipation segment 2213. The detector module 100 also includes a blocking member 3 that blocks the communication channel 225.

[0085] The submodule bracket 22 is an integrally formed part, which enhances the integrity of the submodule bracket 22. The second heat dissipation channel 221 is formed by secondary processing after the submodule bracket 22 is manufactured. For example, an inflow section 2211 and an outflow section 2212 can be drilled through the submodule bracket 22 along the Y direction, and a heat dissipation section 2213 can be drilled through the submodule bracket 22 along the Z direction. After forming an intersecting line, the hole is blocked by welding, realizing the single-piece processing of the preparation chamber of the submodule 21.

[0086] The inflow section 2211 and outflow section 2212 can be formed directly by opening the submodule support 22 in the Y direction on a side surface facing the module support 1. The holes can be machined directly into the side surface of the submodule support 22 facing the module support 1 in the Y direction to form the first through hole 222 and the second through hole 223. The heat dissipation section 2213 forms a connecting channel 225 on the outer surface of the submodule support 22. Therefore, the sealing member 3 is provided to block the connecting channel 225, thereby sealing the second heat dissipation channel 221.

[0087] Optionally, the blocking member 3 may seal and block the communication channel 225 by welding as described above; or, further optionally, the blocking member 3 may seal and block the communication channel 225 by sealing in a threaded connection.

[0088] In some embodiments of the present application, the submodule brackets 22 can be designed independently of each other, or adjacent submodule brackets 22 can be integrally formed. In other words, there can be a clear physical boundary between adjacent submodule brackets 22, or when adjacent submodule brackets 22 are integrally connected, adjacent submodule brackets 22 can be divided according to the combination relationship between the submodules 21 and the submodule brackets 22.

[0089] In some embodiments of the present invention, at least two adjacent sub-module brackets 22 along the Z direction are integrally connected, at least two adjacent sub-module brackets 22 in a row of sub-modules 20 are integrally connected, and a plurality of sub-modules 21 arranged in sequence along the Z direction are arranged on the plurality of integrally connected sub-module brackets 22.

[0090] At least two adjacent submodule brackets 22 along the Z direction are integrally connected, which can improve the structural stability of the submodule assembly 2, and the integrally connected submodule brackets 22 can be disassembled relative to the module bracket 1 as a whole, which is convenient for disassembly and assembly.

[0091] In other embodiments of the present invention, multiple submodule rows 20 are arranged sequentially along the X-direction, and the submodule brackets 22 of the corresponding submodule assemblies 2 of at least two adjacent submodule rows 20 are aligned and integrally connected along the X-direction. This improves the structural stability of the submodule assembly 2 and allows the submodule brackets 22 to be completely disassembled relative to the module bracket 1, facilitating assembly and disassembly.

[0092] For example, Figure 4 and Figure 7 As shown, there are two rows of submodules 20 and they are arranged in sequence along the X direction. The two submodule supports 22 of the two rows of submodules 20 in the X direction are opposite to each other and are integrally connected.

[0093] It is worth noting that the multiple second heat dissipation channels 221 defined by the multiple sub-module brackets 22 connected as a whole can be independent of each other (for example, multiple second heat dissipation channels 221 are connected in parallel between the first sub-channel 11 and the second sub-channel 12), and the multiple second heat dissipation channels 221 can also be connected to each other (for example, multiple second heat dissipation channels 221 are arranged in series between the first sub-channel 11 and the second sub-channel 12).

[0094] In some other embodiments, the sub-module rows 20 are multiple rows and the multiple rows of sub-module rows 20 are arranged in sequence along the X-direction, the sub-module brackets 22 of the corresponding sub-module assemblies 2 of at least two adjacent rows of sub-module rows 20 are opposite and integrally connected along the X-direction, and at least two adjacent sub-module brackets 22 along the Z-direction are integrally connected.

[0095] In some embodiments of the present invention, Figure 4 、 Figure 5 and Figure 7 As shown, the submodule rows 20 are multiple rows and are arranged in sequence along the X direction. The corresponding submodule components 2 of two adjacent rows of submodule rows 20 are directly opposite to each other along the X direction; each submodule bracket 22 defines a second heat dissipation channel 221, and the first through hole 222 and the second through hole 223 of the submodule bracket 22 are spaced apart along the Z direction, as shown in FIG. Figure 2 As shown, the first sub-channel 11 forms a medium inlet, the second sub-channel 12 forms a medium outlet, and the second sub-channels 12 are spaced apart on both sides of the first sub-channel 11 in the X direction.

[0096] There are multiple rows of sub-modules 20, and multiple sub-module brackets 22 are arranged opposite each other along the X direction. The first through holes 222 and the second through holes 223 of the sub-module brackets 22 are arranged at intervals along the Z direction. Therefore, the multiple first through holes 222 and the multiple second through holes 223 are arranged in the Z direction according to the arrangement of one row of first through holes 222, one row of second through holes 223, and one row of first through holes 222, so that the multiple first through holes 222 and the second through holes 223 are neatly arranged on the side surface of the component facing the module bracket 1 to reduce mutual interference.

[0097] There is one first sub-channel 11, located in the center. Two second sub-channels 12 are spaced apart on either side of the first sub-channel 11 along the X-axis. The first sub-channel 11 extends along the Z-axis, connecting with multiple rows of first through-holes 222. The second heat dissipation channel 221 extends along the Z-axis, connecting with multiple rows of second through-holes 223 located in the same Z-axis column or columns. The neat arrangement of the first and second sub-channels 11 and 12 reduces interference and improves the flow reliability of the heat dissipation medium. The second sub-channels 12 are used to discharge the heat dissipation medium. The heat dissipation medium in the second sub-channels 12 is relatively high in temperature. Placing the second sub-channels 12 on both sides improves heat dissipation.

[0098] In some specific embodiments of the present invention, Figure 3 and Figure 4 As shown, the submodule rows 20 are two rows, and the two submodule brackets 22 are arranged in sequence along the X direction and fixedly connected. The two first through holes 222 formed by the two submodule brackets 22 are spaced apart along the X direction, and the two second through holes 223 formed by the two submodule brackets 22 are spaced apart along the X direction. The two first through holes 222 are in a row, and the two second through holes 223 are in a row. A row of first through holes 222 and a row of second through holes 223 are spaced apart along the Z direction. Figure 2 and Figure 10 As shown, there is one first sub-channel 11 and two second heat dissipation channels 221, one located on either side of the first sub-channel 11 in the X-direction. The first sub-channel 11 communicates with both first through-holes 222 in the same row, while the second heat dissipation channels 221 communicate with corresponding second through-holes 223. The second heat dissipation channels 221 defined by the sub-module brackets 22 form relatively independent circulation channels, reducing mutual interference and improving the flow stability of the heat dissipation medium.

[0099] like Figure 10As shown, a first connecting branch and a second connecting branch are provided on the module bracket 1. The first connecting branch connects the first sub-channel 11 and the second heat dissipation channel 221, while the second connecting branch connects the second heat dissipation channel 221 and the second sub-channel 12. There are two first connecting branches, with the inlets 16 of the two first connecting branches connecting to the first sub-channel 11 and the outlets 17 of the two first connecting branches connecting to the first through-holes 222, respectively. There are two second connecting branches, with the inlets 18 of the two second connecting branches connecting to the two second through-holes 223, respectively, and the outlets 19 of the two second connecting branches connecting to the two second sub-channels 12, respectively.

[0100] In some embodiments of the present invention, Figure 7 As shown, the submodule bracket 22 includes a base 22a and a support base 22b. The base 22a is used to connect to the module bracket 1. The support base 22b is arranged on a side of the base 22a away from the module bracket 1 and extends in a direction away from the module bracket 1. The support base 22b is used to support the submodule 21. The support bases 22b of the submodule bracket 22 are spaced apart from each other, and the bases 22a of the submodule bracket 22 are integrally connected to each other.

[0101] In some embodiments of the present invention, Figure 1 As shown, the medium inlet 141 and the medium outlet 131 are both arranged on one side of the module bracket 1 behind the ion module assembly 2, a first drip-free quick connector 4 is provided at the medium inlet 141, and a second drip-free quick connector 5 is provided at the medium outlet 131. The first drip-free quick connector 4 is provided at one end of the module bracket 1 in the Z direction, and the second drip-free quick connector 5 is spaced between the two ends of the module bracket 1 in the Z direction and is arranged adjacent to the first drip-free quick connector 4.

[0102] By providing a drip-free quick connector at the medium inlet 141 and the medium outlet 131 , it is possible to reduce the risk of heat dissipation medium flowing out of the pollution detector module 100 when plugging or unplugging the drip-free quick connector.

[0103] The medium inlet 141 is arranged at one end of the module bracket 1 in the Z direction, and the medium outlet 131 is arranged close to the medium inlet 141 and between the two ends of the module bracket 1 in the Z direction. By adjusting the spacing and position relationship between the medium outlet 131 and the medium inlet 141, cross-matching can be achieved to achieve balanced cooling of each sub-module component 2.

[0104] like Figure 1As shown, the module bracket 1 includes a bracket body 13, a first blocking cover 14 and a second blocking cover 15. The first sub-channel 11 and the second sub-channel 12 both pass through the two ends of the bracket body 13 along the Z direction. The first blocking cover 14 blocks one end of the first sub-channel 11 and the second sub-channel 12 in the Z direction and separates the first sub-channel 11 and the second sub-channel 12. The second blocking cover 15 blocks the other end of the first sub-channel 11 and the second sub-channel 12 in the Z direction and separates the first sub-channel 11 and the second sub-channel 12. The medium inlet 141 is formed on the first blocking cover 14. Figure 10 As shown, the medium outlet 131 is formed on the bracket body 13 .

[0105] The first sub-channel 11 and the second sub-channel 12 pass through both ends of the bracket body 13 along the Z direction. The first blocking cover 14 and the second blocking cover 15 are arranged at both ends of the bracket body 13. The bracket body 13, the first blocking cover 14 and the second blocking cover 15 jointly define the first sub-channel 11 and the second sub-channel 12.

[0106] In some embodiments of the present invention, an external circulation pump is connected to the first drip-free quick connector 4 and the second drip-free quick connector 5, and the low-temperature coolant is pumped into the medium inlet 141 under the action of the external circulation pump. The coolant is quickly distributed in the first sub-channel 11 and is injected into multiple second heat dissipation channels 221 under pressure. The heat generated by the sub-module 21 absorbed by each sub-module bracket 22 is merged into the second sub-channel 12 of the module bracket 1 through the coolant flowing in the sub-module bracket 22, and then returns to the external radiator through the second drip-free quick connector 5 at the medium outlet 131 for heat dissipation. The circulation cooling of the coolant realizes the stable operation of the detector module 100.

[0107] In some embodiments of the present invention, the detector module 100 also includes: a detection component, which is arranged on the module bracket 1 and located on the outside of the module bracket 1 and the sub-module bracket 22, and the detection component is used to detect the concentration of a preset medium in the heat dissipation medium leaked from the module bracket 1 and the sub-module bracket 22.

[0108] It is understood that submodule 21 integrates high-precision electronic components. External contamination of these components can cause electrical shorts or disconnections, and leakage of the heat dissipation medium can potentially damage these components. Therefore, by adding a pre-set medium that is non-corrosive to the module components to the heat dissipation medium, the detection component can detect the concentration of the pre-set medium to detect leaks in detector module 100.

[0109] For example, the heat dissipation medium is a coolant. As a liquid medium, the coolant flows in a closed manner between the module bracket 1 and the submodule bracket 22. Any leakage of the coolant would undoubtedly damage the electronic components. Alcohol is added to the coolant and the test component measures the alcohol concentration to determine if there is a leak.

[0110] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, the submodule bracket 22 is detachably connected to the module bracket 1 .

[0111] By setting up the sub-module bracket 22, the sub-module 21 can be detachably connected to the module bracket 1 together with the sub-module bracket 22. Therefore, the sub-module assembly 2 and the module bracket 1 can be removed as a whole without the need to disassemble and assemble the sub-module 21 and the module bracket 22, which can simplify the disassembly and assembly process and facilitate the later maintenance of the detector module.

[0112] The detector according to the second embodiment of the present invention includes a housing and a plurality of detector modules 100 , wherein the plurality of detector modules 100 are arranged side by side along the X direction.

[0113] By providing the above-mentioned detector module 100 , the detector has a good heat dissipation effect and strong working stability.

[0114] In some embodiments of the present invention, the detector is a CT detector, and all detector modules 100 are arranged on an arc with a radius R in the Z direction. After the CT detector is assembled as a whole, the intersection of the center lines of all sub-modules 21 should coincide with the focus of the CT tube or be located near the focus of the CT tube.

[0115] According to a third aspect of an embodiment of the present invention, the medical imaging device comprises a scanning frame, a radiation source, and the detector of the above embodiment.

[0116] A radiation source and detector are mounted on the gantry. The source emits radiation toward the object being scanned, while the detector receives radiation attenuated by the object. As the gantry rotates about the Z axis, the source and detector rotate synchronously with the gantry, maintaining radially opposed positions. This allows the detector to receive radiation, such as X-rays, emitted by the source and passing through the object.

[0117] The structure of the scanning frame is not limited. For example, the scanning frame forms a scanning cavity for receiving the scanning object, and the radiation source and the detector are respectively arranged on both radial sides of the scanning cavity.

[0118] Illustratively, in addition to the above components, the medical imaging device may further include a scanning bed for carrying a scanned object.

[0119] According to the medical imaging device of the present invention, by providing the detector according to the second aspect, the medical imaging device has good heat dissipation performance and strong working stability.

[0120] In some embodiments of the present invention, the medical imaging device is a CT device.

[0121] The following describes the working process of the detector module 100 of the CT detector according to a specific embodiment of the present invention with reference to the accompanying drawings.

[0122] As CT machine performance improves, the number of slices and channels in CT detector systems increases. The image quality required for low dose and high signal-to-noise ratio requires detectors with denser pixel units. Consequently, the detector's heat generation increases significantly. This increased temperature gradient leads to increased local heat load, which has a growing impact on the detector's physical and imaging performance. Sustained high heat generation increases electronic noise and susceptibility to aging of internal components. Therefore, maintaining a stable, low detector temperature is crucial, and addressing heat dissipation in detector system design is receiving increasing attention.

[0123] The present invention proposes a heat dissipation structure for a CT machine detector module 100 component, in which special independent liquid inlet and return flow channels, namely a first sub-channel 11 and a second sub-channel 12, are designed inside the module bracket 1. In addition, the total liquid inlet and return ports of the module bracket 1 are respectively connected to the external circulation pump and radiator of the detector using special drip-free quick connectors. The liquid inlet and return ports of the module bracket 1 are connected to multiple "A"-shaped sub-module brackets 22 with different diameters of flow channels, namely sub-module brackets 22 with double-layer flow channel structures. The circulation of the coolant can be in closer contact with the heat generated by the sub-module 21. The heat absorbed by each sub-module bracket 22 is merged into the module bracket 1 flow channel through the coolant flowing in the sub-module bracket 22, and then returned to the radiator through the drip-free quick connector pre-installed on the total liquid return port of the module bracket 1 for heat dissipation, so that the detector is maintained at a relatively low operating temperature.

[0124] Other components of the detector module according to the embodiment of the present invention, such as the detection unit, the digital-to-analog conversion unit, the signal transmission unit, and the like, as well as operations are well known to those skilled in the art and will not be described in detail here.

[0125] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0126] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0127] In the present invention, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0128] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0129] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0130] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A detector module, characterized in that: include: A module bracket, wherein the module bracket is extended along the Z direction; At least one row of submodules, the submodule row comprising a plurality of submodule assemblies sequentially mounted on the module support along the Z direction, the submodule assemblies comprising submodules and submodule supports, the submodules being connected to the module support via the submodule supports, and the submodules being thermally coupled to the submodule supports; The module bracket defines a first heat dissipation channel, and at least one of the sub-module brackets defines a second heat dissipation channel. The second heat dissipation channel is connected to the first heat dissipation channel, and the two are used to form a heat dissipation medium flow path.

2. The detector module according to claim 1, characterized in that The first heat dissipation channel includes a first sub-channel and a second sub-channel, and the second sub-channel is connected to the first sub-channel through any second heat dissipation channel; or, the second sub-channel is connected to the first sub-channel through multiple second heat dissipation channels connected in sequence, and one of the first sub-channel and the second sub-channel is formed with a medium inlet, and the other is formed with a medium outlet.

3. The detector module according to claim 2, characterized in that The two ends of the second heat dissipation channel pass through the side surface of the sub-module bracket facing the module bracket in the Y direction to form a first through hole and a second through hole respectively. The first through hole is connected to the first sub-channel, and the second through hole is connected to the second sub-channel. The sub-module bracket is fixedly connected to the module bracket along the Y direction.

4. The detector module according to claim 3, characterized in that The second heat dissipation channel includes an inflow section, an outflow section and at least one heat dissipation section, the inflow section and the outflow section respectively extend along the Y direction and are spaced apart along the Z direction, the inflow section is connected to the first through hole, the outflow section is connected to the second through hole, the heat dissipation section is connected between the inflow section and the outflow section, and at least one side surface of the submodule bracket in the X direction is thermally coordinated with the submodule.

5. The detector module according to claim 4, characterized in that There are multiple heat dissipation sections and they are spaced apart along the Y direction; Among the two adjacent heat dissipation sections, the flow area of the heat dissipation section close to the module bracket is smaller than the flow area of the heat dissipation section far from the module bracket.

6. The detector module according to claim 4, characterized in that The submodule bracket defining the second heat dissipation channel is an integrally formed part. The submodule bracket defining the second heat dissipation channel further defines at least one communication channel. Each heat dissipation segment is connected to one of the communication channels at one end in the Z direction. The communication channel is connected at a connection position between the corresponding heat dissipation segment and the inflow segment / the outflow segment. The communication channel extends along the Z direction and penetrates the outer surface of the submodule bracket at an end away from the corresponding heat dissipation segment. The detector module further includes a blocking member configured to block the communication channel.

7. The detector module according to claim 3, characterized in that At least two of the submodule brackets adjacent to each other along the Z direction are integrally connected; And / or, the submodule rows are multiple and are arranged sequentially along the X direction, and the submodule brackets corresponding to the submodule assemblies of at least two adjacent rows of the submodule rows are opposite to each other along the X direction and are integrally connected.

8. The detector module according to claim 3, characterized in that The submodules are arranged in multiple rows in sequence along the X direction, and the corresponding submodule components of two adjacent rows of the submodules are directly opposite to each other along the X direction; Each of the sub-module brackets defines the second heat dissipation channel respectively, the first through hole and the second through hole of the sub-module bracket are arranged at intervals along the Z direction, the first sub-channel forms the medium inlet, the second sub-channel forms the medium outlet, and the second sub-channels are respectively spaced apart on both sides of the first sub-channel in the X direction.

9. The detector module according to claim 2, characterized in that The module bracket includes a bracket body, a first blocking cover and a second blocking cover. The first sub-channel and the second sub-channel both pass through both ends of the bracket body along the Z direction. The first blocking cover blocks one end of the first sub-channel and the second sub-channel in the Z direction and separates the first sub-channel and the second sub-channel. The second blocking cover blocks the other end of the first sub-channel and the second sub-channel in the Z direction and separates the first sub-channel and the second sub-channel. The medium inlet is formed on the first blocking cover, and the medium outlet is formed on the bracket body.

10. The detector module according to any one of claims 1 to 9, characterized in that The submodule bracket is detachably connected to the module bracket.

11. A detector, characterized in that: The device comprises a housing and a plurality of detector modules according to any one of claims 1 to 10, wherein the plurality of detector modules are arranged side by side along the X direction.

12. A medical imaging device, characterized in that: comprising a scanning frame, a radiation source and a detector according to claim 11; The radiation source and the detector are respectively arranged on the scanning frame. The radiation source is used to emit radiation toward the scanned object, and the detector is used to receive the radiation attenuated by the scanned object.

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