Laser marking method, device and equipment and storage medium

Abstract

The invention discloses a laser marking method, device and equipment and a storage medium, and relates to the technical field of product machining, and is applied to a laser marking system.The method comprises the steps that an image of a to-be-machined workpiece is shot through a charge-coupled device camera, and the position and direction of the to-be-machined workpiece are obtained through recognition based on the image of the to-be-machined workpiece; displaying the image of the to-be-processed workpiece in a display screen; the click position of the user in the display screen is received, the laser head is controlled to move to the corresponding position of the to-be-machined workpiece for laser marking based on the position and direction of the to-be-machined workpiece, and flexible marking operation can be conducted at any position of a product according to actual requirements.

Description

Technical Field

[0001] The present application relates to the field of product processing technology, and in particular to a laser marking method, device, equipment and storage medium. Background Art

[0002] In the field of product processing technology, laser marking is often used.

[0003] At present, some laser marking methods require the prior collection of product marking information to control the laser marking process, making it difficult to perform flexible marking operations at any position on the product according to actual needs.

[0004] The above content is only used to assist in understanding the technical solution of this application and does not constitute an admission that the above content is prior art. Summary of the Invention

[0005] The main purpose of this application is to provide a laser marking method, device, equipment and storage medium, aiming to solve the technical problem that the current laser marking method is difficult to perform flexible marking operations at any position of the product according to actual needs.

[0006] To achieve the above objectives, the present application proposes a laser marking method, which is applied to a laser marking system. The method comprises the following steps:

[0007] capturing an image of a workpiece to be processed by a charge coupled device camera, and obtaining a position and orientation of the workpiece to be processed based on image recognition of the workpiece to be processed;

[0008] Displaying an image of the workpiece to be processed on a display screen;

[0009] A click position of the user on the display screen is received, and based on the position and direction of the workpiece to be processed, a laser head is controlled to move to a corresponding position of the workpiece to be processed for laser marking.

[0010] In one embodiment, before the step of receiving a click position of a user on the display screen and controlling the laser head to move to a corresponding position of the workpiece to be processed for laser marking based on the position and direction of the workpiece to be processed, the step further includes:

[0011] In response to the light source adjustment instruction, the intensities of several light sources providing illumination for the workpiece to be processed are adjusted.

[0012] In one embodiment, controlling the laser head to move to a corresponding position of the workpiece to be processed for laser marking includes:

[0013] Controlling the laser head to move to a corresponding position of the workpiece to be processed, and adjusting the laser power and / or frequency according to the material properties of the workpiece to be processed;

[0014] The workpiece to be processed is laser marked based on the adjusted laser power and / or frequency.

[0015] In one embodiment, the laser marking system includes a laser focusing vision module, a pseudo-coaxial cavity, and a cavity lifting platform. Before the step of capturing an image of the workpiece to be processed by the charge coupled device camera and identifying the position and orientation of the workpiece to be processed, the system further includes:

[0016] Confirm that the metal calibration card is placed on the processing platform;

[0017] Controlling the X-axis motor and the Y-axis motor to move the laser head to a preset focus calibration area;

[0018] Controlling the laser head to emit laser light at a plurality of Z-axis heights through the laser focusing vision module to form a marking line on the surface of the metal calibration card;

[0019] Controlling the laser head to move to the position of the charge coupled device camera through the laser focusing vision module;

[0020] Controlling the charge coupled device camera to photograph the marking line through the pseudo coaxial cavity;

[0021] Analyzing the marking lines by an image processing algorithm to find the thinnest marking line;

[0022] Controlling the cavity lifting platform to move along the Z axis to the height of the thinnest marking line;

[0023] The actual height of the metal calibration card is verified twice by the laser rangefinder of the pseudo-coaxial cavity.

[0024] In one embodiment, the step of controlling the laser head to emit laser light at a plurality of Z-axis heights by the laser focusing vision module to form a marking line on the surface of the metal calibration card includes:

[0025] When the laser head is controlled by the laser focusing vision module to emit laser at the Z-axis height to form a marking line on the surface of the metal calibration card, the Z-axis is moved to the height corresponding to the marking line by the cavity lifting platform to ensure that the marking line is distributed in a gradient.

[0026] In one embodiment, controlling the laser head to move to a corresponding position of the workpiece to be processed for laser marking includes:

[0027] The laser head is controlled to move to the corresponding position of the workpiece to be processed for laser marking. If the surface of the workpiece to be processed is uneven, the Z-axis height is adjusted by the cavity lifting platform to achieve real-time focus compensation.

[0028] In one embodiment, controlling the laser head to move to a corresponding position of the workpiece to be processed for laser marking includes:

[0029] Controlling the laser head to move to a corresponding position of the workpiece to be processed for laser marking, and monitoring the marking quality in real time through the charge coupled device camera;

[0030] If the marking quality is found to be abnormal, the focus operation will be triggered again.

[0031] In addition, to achieve the above-mentioned purpose, the present application also proposes a laser marking device, which is provided in a laser marking system, and the laser marking device includes:

[0032] a shooting module, configured to capture an image of a workpiece to be processed by using a charge coupled device camera, and obtain a position and orientation of the workpiece to be processed based on image recognition of the workpiece to be processed;

[0033] A display module, configured to display an image of the workpiece to be processed on a display screen;

[0034] The laser marking module is used to receive the click position of the user on the display screen, and based on the position and direction of the workpiece to be processed, control the laser head to move to the corresponding position of the workpiece to be processed for laser marking.

[0035] In addition, to achieve the above objectives, the present application also proposes a laser marking device, which includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the steps of the laser marking method described above.

[0036] In addition, to achieve the above objectives, the present application also proposes a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the steps of the laser marking method described above are implemented.

[0037] One or more technical solutions proposed in this application have at least the following technical effects:

[0038] This application controls the movement of the laser head by displaying the image of the workpiece to be processed on the display screen and receiving the user's click position. The user can freely select any position on the image for laser marking, thereby improving the flexibility of operation and meeting the processing needs of various complex workpieces. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0040] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] Figure 1 A schematic diagram of the process flow provided for Example 1 of the laser marking method of this application;

[0042] Figure 2 This is a front view schematic diagram of the external structure of the laser marking system of this application;

[0043] Figure 3 This is a schematic diagram of the back side of the external structure of the laser marking system of this application;

[0044] Figure 4 This is a schematic diagram of the internal structure of the laser marking system of this application;

[0045] Figure 5 Schematic diagram of the XY axis in the laser marking system of this application;

[0046] Figure 6 Schematic diagram of the pseudo-coaxial cavity in the laser marking system of this application;

[0047] Figure 7 Schematic diagram of the internal structure of the pseudo-coaxial cavity in the laser marking system of this application;

[0048] Figure 8 This is a schematic diagram of a laser focusing vision module in the laser marking system of this application;

[0049] Figure 9 This is a schematic diagram of the internal structure of the laser focusing vision module in the laser marking system of this application;

[0050] Figure 10 A schematic diagram of a cavity lifting platform in the laser marking system of this application;

[0051] Figure 11 A schematic diagram of a metal calibration card in the laser marking system of this application;

[0052] Figure 12 This is a schematic diagram of the laser autofocus workflow of the laser marking system of this application;

[0053] Figure 13 This is a schematic diagram of the laser marking workflow of the laser marking system of this application;

[0054] Figure 14 A breakdown of the cycle times for the laser marking system for this application;

[0055] Figure 15 This is a schematic diagram of the module structure of the laser marking device according to an embodiment of the present application;

[0056] Figure 16 Schematic diagram of the device structure of the hardware operating environment involved in the laser marking method in the embodiment of the present application.

[0057] Description of Figure Numbers:

[0058] Label name Label name 1 FFU fan filter 2 Display 3 Pneumatic door 4 Start button 5 Base cabinet 6 Safety light curtain 7 keyboard 8 signal light 9 Upper cover 10 Power cabinet 11 Dust extraction hole 100 Pseudo-coaxial cavity 200 Laser focus vision module 300 XY axis 400 Cavity lifting platform 101 rangefinder 102 Camera 1 103 lens 104 Light 1 105 Light 2 106 Light 3 107 Product 1 201 Camera 2 202 lens 203 Ring light 204 rangefinder 205 Product 2 301 X-axis motor 302 Y-axis 303 Y-axis motor 304 Power meter location 305 X-axis 401 Motor with brake 402 Lifting module 403 lifting plate

[0059] The purpose, features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0060] It should be understood that the specific embodiments described herein are merely used to explain the technical solutions of the present application and are not intended to limit the present application.

[0061] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0062] The main solution of the embodiment of the present application is: to capture an image of the workpiece to be processed by a charge-coupled device camera, and to obtain the position and direction of the workpiece to be processed based on the image recognition of the workpiece to be processed; to display the image of the workpiece to be processed on a display screen; to receive the user's click position on the display screen, and based on the position and direction of the workpiece to be processed, to control the laser head to move to the corresponding position of the workpiece to be processed for laser marking.

[0063] In this embodiment, for ease of description, the laser marking system is used as the execution subject for explanation.

[0064] Since the existing technology requires the collection of product marking information in advance to realize the control of the laser marking process, it is difficult to perform flexible marking operations at any position of the product according to actual needs.

[0065] This application provides a solution, which controls the movement of the laser head by displaying the image of the workpiece to be processed on the display screen and receiving the user's click position. The user can freely select any position on the image for laser marking, thereby improving the flexibility of operation and meeting the processing needs of various complex workpieces.

[0066] It should be noted that the execution subject of this embodiment may be a computing service device with data processing, network communication, and program execution functions, such as a tablet computer, personal computer, mobile phone, etc., or an electronic device or laser marking device capable of implementing the above functions, or an electronic system or laser marking system capable of implementing the above functions. The laser marking system is used as an example to illustrate this embodiment and the following embodiments.

[0067] Based on this, the embodiment of the present application provides a laser marking method, which is applied to a laser marking system, referring to Figure 1 , Figure 1 This is a flow chart of the first embodiment of the laser marking method of this application.

[0068] In this embodiment, the laser marking method includes steps S90, S100, and S120:

[0069] Step S90, capturing an image of the workpiece to be processed by a charge coupled device camera, and obtaining a position and orientation of the workpiece to be processed based on image recognition of the workpiece to be processed;

[0070] Image processing algorithms can be used to analyze the captured workpiece images. Common image processing techniques include edge detection and feature extraction.

[0071] Edge detection algorithms can identify the outline of objects in workpiece images, thereby determining the approximate location of the workpiece in the image. Feature extraction can extract representative features from the workpiece image, such as shape and texture. These features can be used to further determine the orientation of the workpiece.

[0072] Optionally, the workpiece position and orientation information in the image can be converted into actual spatial coordinates and angles. Through coordinate conversion, the system can accurately determine the actual position and orientation of the workpiece on the processing platform, providing precise positioning for subsequent laser marking operations.

[0073] Furthermore, if there are multiple charge coupled device cameras, images of the workpiece to be processed are captured by the multiple charge coupled device cameras, the captured images are spliced, and the spliced product image is displayed on a display screen.

[0074] For example, product images acquired by the upper and lower charge-coupled device cameras may be spliced together, and the spliced product image may be displayed on a display screen.

[0075] Step S100, displaying an image of the workpiece to be processed on a display screen;

[0076] Step S120 , receiving a click position of the user on the display screen, and controlling the laser head to move to a corresponding position of the workpiece to be processed for laser marking based on the position and direction of the workpiece to be processed.

[0077] Among them, you can refer to Figure 2 、 Figure 3 , Figure 2 This is a front view of the external structure of the laser marking system of this application. Figure 3This is a schematic diagram of the back side of the external structure of the laser marking system of this application.

[0078] From the front and back schematic diagrams of the external structure of the laser marking system, it can be seen that the laser marking system includes an FFU fan filter 1, a display screen 2, a pneumatic door 3, a start button 4, a base cabinet 5, a safety grating 6, a keyboard 7, a signal light 8, an upper cover 9, a power input cabinet 10, and a dust extraction hole 11.

[0079] The laser marking system receives user clicks on the display screen via interactive devices such as a mouse and touch screen. When the user clicks a location on the display screen, the interactive device transmits the click coordinate information to the laser marking system. The laser marking system then maps the click coordinates on the display screen to the actual workpiece coordinate system, controls the laser head to move to the corresponding position on the workpiece to be processed, and then laser marks the corresponding position.

[0080] This embodiment provides a laser marking method, which controls the movement of the laser head by displaying the image of the workpiece to be processed on a display screen and receiving the user's click position. The user can freely select any position on the image for laser marking, thereby improving the flexibility of the operation and meeting the processing needs of various complex workpieces.

[0081] Based on the first embodiment of the present application, in the second embodiment of the present application, the same or similar contents as those in the first embodiment can be referred to the above introduction, and no further details will be given later. On this basis, before step S120, the laser marking method further includes step S110:

[0082] Step S110 , in response to a light source adjustment instruction, adjusting the intensities of a plurality of light sources providing illumination for the workpiece to be processed.

[0083] It should be noted that appropriate light source intensity can make the image features of the workpiece to be processed clearer and enhance the contrast between the workpiece and the background, so the intensities of the multiple light sources providing illumination for the workpiece to be processed can be adjusted.

[0084] The embodiment of the present application can make the outline of the workpiece clearer and improve the accuracy of image recognition by adjusting the intensity of the light source.

[0085] Based on the above embodiment, in the embodiment of the present application, the same or similar contents as the above embodiment can be referred to the above introduction, and no further description will be given later. On this basis, step S120, controlling the laser head to move to the corresponding position of the workpiece to be processed for laser marking includes steps S121 to S122:

[0086] Step S121, controlling the laser head to move to a corresponding position of the workpiece to be processed, and adjusting the laser power and / or frequency according to the material properties of the workpiece to be processed;

[0087] Step S122: laser marking the workpiece to be processed based on the adjusted laser power and / or frequency.

[0088] It's important to note that different workpiece materials have varying characteristics in terms of laser absorption, reflection, and heat conduction. For example, metals typically have a high reflectivity to lasers and require higher laser power for effective marking. Plastics, on the other hand, absorb lasers better and may not require high power, but may require a specific laser frequency for optimal marking.

[0089] As an implementation method, the laser marking system may pre-store characteristic parameters of different materials, or detect material information of the workpiece in real time through a sensor (such as a spectrum analyzer, etc.).

[0090] Based on the analyzed material properties, the laser marking system can automatically adjust the power and / or frequency of the laser generator.

[0091] Among them, adjusting the laser power can change the energy density of the laser beam, thereby affecting the depth and clarity of the mark; adjusting the laser frequency can change the mechanism of interaction between the laser and the material, such as affecting the thermal decomposition, melting or vaporization process of the material to achieve the best marking effect.

[0092] In the embodiment of the present application, the laser power and / or frequency is adjusted according to the material characteristics of the workpiece to be processed, and the workpiece to be processed is laser marked based on the adjusted laser power and / or frequency, thereby achieving the best marking effect.

[0093] Based on the above embodiment, in the embodiment of the present application, the same or similar contents as the above embodiment can be referred to the above introduction, and no further description will be given later. On this basis, the laser marking system includes a laser focusing vision module, a pseudo coaxial cavity and a cavity lifting platform, referring to Figure 4 , Figure 4 This is a schematic diagram of the internal structure of the laser marking system of the present application. The internal structure of the laser marking system includes a pseudo-coaxial cavity 100, a laser focusing vision module 200, an XY axis 300, and a cavity lifting platform 400.

[0094] Reference Figure 5 , Figure 5 Schematic diagram of the XY axis in the laser marking system of the present application, wherein the XY axis includes an X-axis motor 301 , a Y-axis 302 , a Y-axis motor 303 , a power meter position 304 , and an X-axis 305 .

[0095] Reference Figure 6 , Figure 6 Schematic diagram of the pseudo-coaxial cavity in the laser marking system of this application, Figure 6It can be seen that the pseudo coaxial cavity includes a rangefinder 101. Figure 7 , Figure 7 This is a schematic diagram of the internal structure of the pseudo-coaxial cavity in the laser marking system of the present application, wherein the pseudo-coaxial cavity includes camera 1 (102), lens 103, lamp 1 (104), lamp 2 (105), lamp 3 (106), and product 1 (107).

[0096] Reference Figure 8 、 Figure 9 , Figure 8 This is a schematic diagram of the laser focusing vision module in the laser marking system of this application. Figure 9 This is a schematic diagram of the internal structure of the laser focusing vision module in the laser marking system of this application. Figure 8 、 Figure 9 It can be seen that the laser focusing vision module includes a camera 2 (201), a lens 202, a ring light source 203, a rangefinder 204, and a product 2 (205). The ring light source 203 provides uniform shadowless lighting, and its light is focused by the lens 202 and irradiated onto the surface of the product 205. The reflected light is captured by the camera 201 as a high-definition image for target recognition. At the same time, the rangefinder 204 emits a laser that is focused onto the product surface through the same lens 202, and measures the working distance in real time through the reflected signal.

[0097] Reference Figure 10 , Figure 10 This is a schematic diagram of the cavity lifting platform in the laser marking system of this application, Figure 10 As can be seen, the cavity lift platform comprises a motor 401 with a brake, a lifting module 402, and a lifting plate 403. Upon receiving a command, the motor 401 with a brake drives the lifting module 402 (e.g., a lead screw or hydraulic mechanism), causing the lifting plate 403 to move smoothly in the vertical direction. A built-in brake mechanism instantly locks upon reaching the target height, ensuring that the lifting plate does not drift. This platform provides a stable Z-axis reference plane for laser processing.

[0098] The step S90, capturing an image of the workpiece to be processed by a charge coupled device camera and obtaining the position and direction of the workpiece to be processed based on the image recognition of the workpiece to be processed, includes steps S10 to S80:

[0099] Step S10, confirming that the metal calibration card is placed on the processing platform;

[0100] Step S20, controlling the X-axis motor and the Y-axis motor to move the laser head to a preset focus calibration area;

[0101] Step S30, controlling the laser head to emit laser light at several Z-axis heights through the laser focusing vision module to form a marking line on the surface of the metal calibration card;

[0102] Alternatively, the laser is controlled to emit laser lines at 10 different Z-axis heights (e.g., from low to high, with intervals of 0.1 mm) in sequence, forming a series of marking lines of varying widths on the surface of the metal calibration card. The greater the defocus, the wider the laser line.

[0103] Furthermore, after each laser line is emitted, the Z-axis platform will move to the corresponding height to ensure the gradient distribution of the marking line.

[0104] Reference Figure 11 , Figure 11 Schematic diagram of a metal calibration card in the laser marking system of the present application, wherein a plurality of laser marking lines (marking lines) are formed on the metal calibration card.

[0105] Step S40, controlling the laser head to move to the position of the charge coupled device camera through the laser focusing vision module;

[0106] After all the marking lines are completed, the laser head is controlled by the laser focusing vision module to move to the position of the charge coupled device camera to prepare for image acquisition.

[0107] Step S50, controlling the charge coupled device camera to photograph the marking line through the pseudo coaxial cavity;

[0108] Step S60, analyzing the marking lines using an image processing algorithm to find the thinnest marking line;

[0109] Image processing algorithms (such as edge detection) analyze the width of each line to find the thinnest laser line, which corresponds to the optimal focal plane position.

[0110] Step S70, controlling the cavity lifting platform to move along the Z axis to the height of the thinnest marking line;

[0111] Among them, the Z axis can be controlled to move to the optimal focal plane height according to the analysis results to ensure the accuracy of the laser focus.

[0112] Step S80 , performing a secondary verification on the actual height of the metal calibration card by using the laser rangefinder of the pseudo-coaxial cavity.

[0113] Among them, the laser rangefinder performs secondary verification on the actual height of the metal calibration card to ensure that the system error is controlled within an extremely low range (such as <3 microns).

[0114] The embodiment of the present application achieves micron-level precise focusing through multi-height gradient calibration combined with real-time image analysis; the embodiment of the present application also adopts multi-data point dynamic acquisition and fusion technology to effectively suppress environmental interference and can stably adapt to flat and slightly curved surfaces; the laser marking system in the embodiment of the present application can operate automatically throughout the entire process without human intervention, meeting the needs of batch continuous production in industrial scenarios.

[0115] Based on the above embodiment, in the embodiments of the present application, the same or similar contents as those in the above embodiment can be referred to the above description and will not be repeated hereafter. On this basis, the step S30, controlling the laser head to emit laser light at several Z-axis heights through the laser focusing vision module to form a marking line on the surface of the metal calibration card, includes the following steps:

[0116] In step S31, when the laser head is controlled by the laser focusing vision module to emit laser at the Z-axis height to form a marking line on the surface of the metal calibration card, the Z-axis is moved to the height corresponding to the marking line by the cavity lifting platform to ensure that the marking line is distributed in a gradient.

[0117] The laser focus vision module controls the laser head to emit laser light in the Z-axis direction, forming a marking line on the surface of the metal calibration card. The depth of the marking line (or energy deposition) is determined by the Z-axis height of the laser head (for example, the higher the height, the greater the laser focus offset and the shallower the mark).

[0118] The cavity lift platform gradually adjusts the Z-axis position according to preset gradient heights (e.g., 0.1mm, 0.2mm, 0.3mm, etc.), allowing the laser head to emit laser light at different heights. After each adjustment, the laser head marks again, forming a series of marking lines with varying depths and intensities. A vision module (e.g., a camera) verifies the laser focus at different Z-axis heights by inspecting the clarity, width, or contrast of the marking lines.

[0119] The embodiment of the present application achieves micron-level precise focusing through multi-height gradient calibration combined with real-time image analysis; the embodiment of the present application also adopts multi-data point dynamic acquisition and fusion technology to effectively suppress environmental interference and can stably adapt to flat surfaces and slightly curved surfaces.

[0120] Based on the above embodiment, in the embodiment of the present application, the same or similar contents as the above embodiment can be referred to the above introduction, and no further description will be given later. On this basis, step S120, controlling the laser head to move to the corresponding position of the workpiece to be processed for laser marking includes step S123:

[0121] Step S123 , controlling the laser head to move to the corresponding position of the workpiece to be processed for laser marking. If the surface of the workpiece to be processed is uneven, adjusting the Z-axis height through the cavity lifting platform to achieve real-time focus compensation.

[0122] Among them, the laser head moves to the target position of the workpiece to be processed (such as metal parts or plastic parts) according to the preset path, and then the laser focusing vision module (including rangefinder and camera) scans the surface of the workpiece to obtain the Z-axis height data of the current position. If a surface height difference (such as bumps, tilts or curves) is detected, the system calculates the offset between the current laser focus and the workpiece surface (such as +0.2mm).

[0123] The cavity lift platform dynamically adjusts the Z-axis height based on the offset (e.g., by 0.2mm), ensuring the laser focus always falls precisely on the workpiece surface. The laser head then fires at the compensated Z-axis height, creating a clear, uniform mark (e.g., text, barcode).

[0124] Optionally, the compensation process and laser marking can be performed synchronously without pause (delay < 10ms).

[0125] The embodiments of the present application solve the problem of unstable marking quality caused by surface unevenness in traditional laser processing, and improve the accuracy of laser marking.

[0126] Based on the above embodiment, in the embodiment of the present application, the same or similar contents as the above embodiment can be referred to the above introduction, and no further description will be given later. On this basis, step S120, controlling the laser head to move to the corresponding position of the workpiece to be processed for laser marking includes steps S124 to S125:

[0127] Step S124, controlling the laser head to move to a corresponding position of the workpiece to be processed for laser marking, and monitoring the marking quality in real time through the charge coupled device camera;

[0128] The laser head moves to the target position of the workpiece according to a preset path and performs laser marking (such as engraving and marking).

[0129] A charge-coupled device (CCD) camera synchronously captures images of the marked area, and uses algorithms to analyze the mark clarity (edge sharpness), contrast (grayscale difference between the mark and the background), and integrity (whether there are missing or broken lines).

[0130] Step S125: If the mark quality is found to be abnormal, the focus operation is retriggered.

[0131] If the charge-coupled device camera detects abnormal marking quality (such as blur or incompleteness), the system will pause the current marking process, re-call the laser focus vision module, perform focus calibration (Z-axis height adjustment), confirm the focus optimization, and continue to complete the marking.

[0132] The embodiment of the present application controls the laser head to move to the corresponding position of the workpiece to be processed for laser marking, and monitors the marking quality in real time through the charge-coupled device camera. If the marking quality is found to be abnormal, the focusing operation is re-triggered, and remedial operations can be performed in time to ensure the quality and efficiency of the laser meeting the standards.

[0133] For example, to help understand the implementation process of the laser marking method in the above embodiment, please refer to Figure 12 , Figure 12 This is a schematic diagram of the laser autofocus workflow of the laser marking system in this application. Figure 12 It includes steps A1 to A11:

[0134] A1. Place the metal calibration card. Place a high-precision metal calibration card on the processing platform as the reference plane for focusing. The metal calibration card must be extremely flat (error < 1 micron) to ensure focusing accuracy.

[0135] A2, enable auto focus function. Start the system's auto focus program and prepare for precise calibration of the laser focus.

[0136] A3, Close the pneumatic door. Close the pneumatic protective door of the equipment to ensure safe isolation during laser operation and prevent external interference.

[0137] A4, controls the X and Y axes to move to the autofocus position. Controls the X and Y axis motors to move the laser head to the preset focus calibration area.

[0138] A5, emits laser marking lines 1 to 10. The laser sequentially emits laser lines at 10 different Z-axis heights (for example, from low to high, with intervals of 0.1 mm), forming a series of marking lines of varying widths on the surface of the metal calibration card. The greater the defocus, the wider the laser line.

[0139] A6, controls the Z-axis to move to heights 1 to 10. After each laser line is emitted, the Z-axis platform moves to the corresponding height to ensure the gradient distribution of the marking line.

[0140] A7 controls the XY axis to move to the CCD camera. After all marking lines are completed, the XY axis moves the laser head to the CCD camera position to prepare for image acquisition.

[0141] A8, a charge-coupled device camera captures and finds the thinnest line. A charge-coupled device camera captures all marked lines, and image processing algorithms (such as edge detection) analyze the width of each line to identify the thinnest laser line. The thinnest line corresponds to the optimal focal plane position.

[0142] A9 controls the Z axis to move to the height of the thinnest marking line. Based on the analysis results, the system controls the Z axis to move to the optimal focal plane height to ensure accurate laser focus.

[0143] A10 uses a distance meter to measure the height of the metal calibration card. Finally, a laser distance meter verifies the actual height of the metal calibration card to ensure that the system error is controlled within an extremely low range (e.g., <3 microns).

[0144] After the laser autofocus workflow is completed, enter the laser marking workflow, refer to Figure 13 , Figure 13 This is a schematic diagram of the laser marking workflow of the laser marking system of this application. The laser marking workflow includes steps D1 to D8:

[0145] D1, manual unloading. The operator places the workpiece to be processed on the processing platform.

[0146] D2, press the start button to start the device, and the system begins to execute the preset marking program.

[0147] D3, the pneumatic door is closed and the protective door is closed to ensure the safe isolation of the processing process.

[0148] D4, control the XY axis to move to the charge coupled device camera, control the XY axis to move the laser head to the position of the charge coupled device camera, and prepare for workpiece positioning.

[0149] D5 uses a charge-coupled device camera for positioning, captures workpiece images through a charge-coupled device camera, and accurately identifies the position and orientation of the workpiece through feature matching or template comparison to ensure the accuracy of the marking position.

[0150] Optionally, in a preset software interface, a product image captured by a charge-coupled device camera is displayed, and the user can click anywhere on the product in the interface. At this time, the laser head can be controlled to move to the user-selected position for lighting.

[0151] Optionally, the product images acquired by the upper and lower charge coupled device cameras may be spliced together, and the spliced product image may be displayed on a display screen.

[0152] Optionally, the user can adjust the intensity of multiple light sources.

[0153] D6, laser marking. The laser etches the workpiece surface according to a preset pattern or text path. The system automatically adjusts the laser power and frequency based on the material characteristics to ensure clear marking without damaging the workpiece.

[0154] D7, control XY axis movement / pneumatic door opening. After marking is completed, control the XY axis to move away from the laser head and the pneumatic door will open automatically.

[0155] D8, manual unloading. The operator takes out the finished workpiece and prepares for the next operation.

[0156] Through experiments, we can know the time required for laser marking process. Figure 14 , Figure 14 The cycle time schedule for the laser marking system for this application is as follows: Figure 14 It can be seen that the time required for the laser marking workflow is 18+t, where t is the time required for laser marking.

[0157] It should be noted that the above examples are only used to understand the present application and do not constitute a limitation on the laser marking method of the present application. More simple transformations based on this technical concept are all within the scope of protection of the present application.

[0158] This application also provides a laser marking device, which is set in the laser marking system, please refer to Figure 15 , the laser marking device comprises:

[0159] The shooting module 10 is used to capture an image of the workpiece to be processed by a charge coupled device camera, and obtain a position and direction of the workpiece to be processed based on image recognition of the workpiece to be processed;

[0160] A display module 20 is used to display the image of the workpiece to be processed on a display screen;

[0161] The laser marking module 30 is used to receive a click position of the user on the display screen, and based on the position and direction of the workpiece to be processed, control the laser head to move to the corresponding position of the workpiece to be processed for laser marking.

[0162] The laser marking device provided in this application, utilizing the laser marking method described in the aforementioned embodiments, can address the technical issue of current laser marking methods, which make it difficult to flexibly mark arbitrary product locations based on actual needs. Compared to the prior art, the laser marking device provided in this application achieves the same beneficial effects as the laser marking method described in the aforementioned embodiments. Other technical features of the laser marking device are the same as those disclosed in the aforementioned embodiments and are not further elaborated here.

[0163] The present application provides a laser marking device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the laser marking method of the above-mentioned embodiment 1.

[0164] Reference below Figure 16, which shows a schematic structural diagram of a laser marking device suitable for implementing an embodiment of the present application. The laser marking device in the embodiment of the present application may include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), and in-vehicle terminals (e.g., in-vehicle navigation terminals), as well as fixed terminals such as digital TVs and desktop computers. Figure 16 The laser marking device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0165] like Figure 16 As shown, the laser marking device may include a processing device 1001 (e.g., a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory 1002 or a program loaded from a storage device 1003 into a random access memory 1004. The random access memory 1004 also stores various programs and data required for the operation of the laser marking device. The processing device 1001, the read-only memory 1002, and the random access memory 1004 are connected to each other via a bus 1005. An input / output interface 1006 is also connected to the bus. Typically, the following systems can be connected to the input / output interface 1006: an input device 1007 including, for example, a touch screen, a touchpad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD), a speaker, a vibrator, etc.; a storage device 1003 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1009. The communication device 1009 can allow the laser marking device to communicate with other devices wirelessly or by wire to exchange data. Although the figure shows a laser marking device with various systems, it should be understood that it is not required to implement or have all the systems shown. More or fewer systems can be implemented or have instead.

[0166] In particular, according to the embodiments disclosed in the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, the embodiments disclosed in the present application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program comprising program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via a communication device, or installed from a storage device 1003, or installed from a read-only memory 1002. When the computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiment disclosed in the present application are performed.

[0167] The laser marking device provided in this application, utilizing the laser marking method described in the aforementioned embodiment, can address the technical issue of current laser marking methods, which make it difficult to flexibly mark arbitrary product locations based on actual needs. Compared to the prior art, the beneficial effects of the laser marking device provided in this application are the same as those of the laser marking method described in the aforementioned embodiment. Other technical features of this laser marking device are the same as those disclosed in the aforementioned embodiment and are not further elaborated here.

[0168] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0169] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

[0170] The present application provides a computer-readable storage medium having computer-readable program instructions (ie, computer program) stored thereon, and the computer-readable program instructions are used to execute the laser marking method in the above embodiment.

[0171] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems or devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system or device. The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0172] The computer-readable storage medium may be included in the laser marking device, or may exist independently without being assembled into the laser marking device.

[0173] The above-mentioned computer-readable storage medium carries one or more programs. When the above-mentioned one or more programs are executed by the laser marking device, the laser marking device: captures an image of the workpiece to be processed through a charge-coupled device camera, and obtains the position and direction of the workpiece to be processed based on the image recognition of the workpiece to be processed; displays the image of the workpiece to be processed on a display screen; receives a click position of the user on the display screen, and controls the laser head to move to the corresponding position of the workpiece to be processed for laser marking based on the position and direction of the workpiece to be processed.

[0174] Computer program code for performing the operations of the present application may be written in one or more programming languages, or a combination thereof, including object-oriented programming languages such as Java, Smalltalk, C++, and conventional procedural programming languages such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0175] The flow charts and block diagrams in the accompanying drawings illustrate the possible architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, program segment or a part of code, and the module, program segment or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order than that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0176] The modules described in the embodiments of the present application may be implemented in software or hardware, wherein the name of a module does not necessarily limit the unit itself.

[0177] The computer-readable storage medium provided in this application stores computer-readable program instructions (i.e., a computer program) for executing the aforementioned laser marking method. This computer-readable storage medium can address the technical issue of current laser marking methods, which make it difficult to flexibly mark any position on a product based on actual needs. Compared to the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the laser marking method provided in the aforementioned embodiments, and are not further elaborated here.

[0178] The above description is only part of the embodiments of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made by using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A laser marking method, characterized in that: Applied to a laser marking system, the method comprises the following steps: capturing an image of a workpiece to be processed by a charge coupled device camera, and obtaining a position and orientation of the workpiece to be processed based on image recognition of the workpiece to be processed; Displaying an image of the workpiece to be processed on a display screen; A click position of the user on the display screen is received, and based on the position and direction of the workpiece to be processed, a laser head is controlled to move to a corresponding position of the workpiece to be processed for laser marking.

2. The method according to claim 1, wherein Before the step of receiving a click position of a user on the display screen and controlling the laser head to move to a corresponding position of the workpiece to be processed for laser marking based on the position and direction of the workpiece to be processed, the step further includes: In response to the light source adjustment instruction, the intensities of several light sources providing illumination for the workpiece to be processed are adjusted.

3. The method according to claim 1, wherein The step of controlling the laser head to move to a corresponding position of the workpiece to be processed for laser marking includes: Controlling the laser head to move to a corresponding position of the workpiece to be processed, and adjusting the laser power and / or frequency according to the material properties of the workpiece to be processed; The workpiece to be processed is laser marked based on the adjusted laser power and / or frequency.

4. The method according to claim 1, wherein The laser marking system includes a laser focusing vision module, a pseudo coaxial cavity and a cavity lifting platform. Before the step of capturing an image of the workpiece to be processed by the charge coupled device camera and identifying the position and direction of the workpiece to be processed, the system further includes: Confirm that the metal calibration card is placed on the processing platform; Controlling the X-axis motor and the Y-axis motor to move the laser head to a preset focus calibration area; Controlling the laser head to emit laser light at a plurality of Z-axis heights through the laser focusing vision module to form a marking line on the surface of the metal calibration card; Controlling the laser head to move to the position of the charge coupled device camera through the laser focusing vision module; Controlling the charge coupled device camera to photograph the marking line through the pseudo coaxial cavity; Analyzing the marking lines by an image processing algorithm to find the thinnest marking line; Controlling the cavity lifting platform to move along the Z axis to the height of the thinnest marking line; The actual height of the metal calibration card is verified twice by the laser rangefinder of the pseudo-coaxial cavity.

5. The method according to claim 4, wherein The step of controlling the laser head to emit laser light at a plurality of Z-axis heights through the laser focusing vision module to form a marking line on the surface of the metal calibration card includes: When the laser head is controlled by the laser focusing vision module to emit laser at the Z-axis height to form a marking line on the surface of the metal calibration card, the Z-axis is moved to the height corresponding to the marking line by the cavity lifting platform to ensure that the marking line is distributed in a gradient.

6. The method according to claim 1, wherein The step of controlling the laser head to move to a corresponding position of the workpiece to be processed for laser marking includes: The laser head is controlled to move to the corresponding position of the workpiece to be processed for laser marking. If the surface of the workpiece to be processed is uneven, the Z-axis height is adjusted by the cavity lifting platform to achieve real-time focus compensation.

7. The method according to claim 1, wherein The step of controlling the laser head to move to a corresponding position of the workpiece to be processed for laser marking includes: Controlling the laser head to move to a corresponding position of the workpiece to be processed for laser marking, and monitoring the marking quality in real time through the charge coupled device camera; If the marking quality is found to be abnormal, the focus operation will be triggered again.

8. A laser marking device, characterized in that: Provided in a laser marking system, the device comprises: a shooting module, configured to capture an image of a workpiece to be processed by using a charge coupled device camera, and obtain a position and orientation of the workpiece to be processed based on image recognition of the workpiece to be processed; A display module, configured to display an image of the workpiece to be processed on a display screen; The laser marking module is used to receive the click position of the user on the display screen, and based on the position and direction of the workpiece to be processed, control the laser head to move to the corresponding position of the workpiece to be processed for laser marking.

9. A laser marking device, characterized in that: The device comprises: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the steps of the laser marking method according to any one of claims 1 to 7.

10. A storage medium, characterized in that: The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the laser marking method according to any one of claims 1 to 7 are implemented.

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