Wafer laser processing device and use method thereof

Abstract

The invention discloses a wafer laser processing device and a using method thereof, and relates to the field of wafer processing. The wafer laser processing device comprises a front open type wafer conveying box, a mechanical arm, a pre-alignment mechanism, a cutting assembly and a cleaning assembly. According to the wafer laser processing device and the using method thereof, an edge finder in the pre-alignment mechanism is used for calibration, so that a wafer packaging sheet is located at the center position of a fixed suction cup, then a workpiece is grabbed and moved to a material carrying table through a mechanical arm, and it is ensured that a sample is located at the circle center position of a laser lens; then the cutting galvanometer guides the laser to emit laser to penetrate through the laser lens to carry out V-groove cutting on the glass packaging sheet outside the wafer, and meanwhile, burr cutting is carried out on the outer edge of the glass packaging sheet, so that concentric packaging is formed by the packaging sheet and the wafer, V-groove cutting, concentric cutting and burr cutting are completed at a time, the overall machining procedure is reduced, and the production efficiency is improved. The cost is lower, and the processing efficiency is higher.

Description

Technical Field

[0001] The present invention relates to the field of wafer processing technology, and in particular to a wafer laser processing device and a method for using the same. Background Art

[0002] Wafers are silicon wafers used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single crystals. Silicon ingots are then ground, polished, and sliced to form silicon wafers, also known as wafers. Domestic wafer production lines primarily focus on 8-inch and 12-inch wafers.

[0003] During conventional wafer processing, the V-shaped edge of the encapsulated wafer plastic body must be trimmed using a laser. The desired dimensions are cut and inspected, and the outer perimeter of the plastic body is then corrected. After this correction, the wafer and the outer perimeter of the plastic body are made concentric, and the outer perimeter needs to be deburred. However, existing equipment performs deburring and outer perimeter correction in two separate steps, resulting in complex processing steps and high processing costs. Therefore, a wafer laser processing device and method for its use are provided. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the present invention provides a wafer laser processing device and method for use, which solves the problem of requiring correction of the outer periphery of the plastic package during wafer processing. This correction aligns the wafer with the outer periphery of the plastic package and requires deburring the outer periphery. However, existing equipment performs deburring and outer periphery correction in two separate steps, resulting in cumbersome processing steps and high processing costs.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: A wafer laser processing device, comprising a wafer loading center and a wafer processing center, wherein the wafer loading center and the wafer processing center are assembled to form a wafer processing machine;

[0006] Two sets of front-opening wafer transfer boxes for loading and unloading are installed on the front side of the wafer loading center, and a robot and a pre-alignment mechanism are installed inside the wafer loading center;

[0007] The wafer processing center is provided with a cutting assembly and a cleaning assembly. The robot grabs the wafers from a group of front-opening wafer pods, calibrates the center of the wafers through a pre-alignment mechanism, and then places the wafers into the cutting assembly and the cleaning assembly for laser cutting and cleaning, and finally places the wafers into another group of front-opening wafer pods to complete unloading.

[0008] The cutting assembly includes a loading platform and a laser lens arranged on the top of the loading platform. A cutting galvanometer is installed on one side of the laser lens. A dust cover is arranged between the loading platform and the laser lens. The loading platform, the dust cover and the laser lens form a closed cutting area. A suction head is installed on one side of the dust cover for directionally collecting dust generated during the laser cutting process.

[0009] Preferably, an industrial computer for controlling a front-opening wafer transfer box, a robot and a pre-alignment mechanism is installed on the outside of the wafer loading center, and an integrated control panel for controlling a cutting component and a cleaning component is installed on the side of the wafer processing center.

[0010] Preferably, the robot includes a linear motor fixedly arranged at the bottom of the wafer loading center, a first lifting cylinder is installed on the linear motor, two groups of robot arms are installed on the top of the first lifting cylinder, and suction cup hands are installed on both groups of robot arms. A positioning frame is installed inside the wafer loading center, the first lifting cylinder slides inside the positioning frame, and the pre-alignment mechanism is installed at one end of the positioning frame.

[0011] Preferably, the pre-alignment mechanism includes a calibration seat and a fixed suction cup fixedly embedded on the calibration seat, an edge finder is installed on one side of the top of the calibration seat, and a dust removal fan is fixedly provided on one side of the edge finder.

[0012] Preferably, a sealing partition is installed in the wafer processing center, and the cutting assembly and the cleaning assembly are sealed by the sealing partition respectively. The outer wall of the sealing partition is installed with an electric door, and the robot enters and exits the cutting assembly and the cleaning assembly by passing through two sets of electric doors.

[0013] Preferably, the cutting assembly also includes a mounting bracket fixedly arranged in the wafer processing center, the loading platform is arranged at the bottom of the mounting bracket, a lifting cylinder is installed on the top of the mounting bracket, the laser lens is fixedly installed on the output end of the lifting cylinder, and a laser optical path and a laser are installed on the top of the mounting bracket. The laser optical path and the laser are connected to the laser lens, and ion air guns are installed on both sides of the laser lens. A positioning camera and a detection camera are installed on the outer wall of the laser lens.

[0014] Preferably, the loading platform includes a Y-axis slide rail fixedly arranged on the mounting bracket, an X-axis slide rail is slidably arranged on the Y-axis slide rail, a base is slidably arranged on the top of the X-axis slide rail, a large suction cup is fixedly arranged on the base, a lifting cylinder is fixedly arranged in the middle of the large suction cup, and a small suction cup is fixedly arranged on the output end of the lifting cylinder.

[0015] Preferably, the cleaning component includes a cleaning table and a cleaning chamber fixedly arranged in the cleaning table, a second lifting cylinder is fixedly arranged on the inner bottom of the cleaning table, an electric rotating table is fixedly arranged on the output end of the second lifting cylinder, a suction cup rack is fixedly arranged on the electric rotating table, a lower spray gun is arranged in a circular array inside the cleaning chamber and below the suction cup rack, spray arms are installed on both sides of the interior of the cleaning table, and a drain outlet is installed on the inner bottom of the cleaning chamber.

[0016] Preferably, a waterproof cover is fixedly installed above the washing table, and an inlet and outlet adapted for an electric door is opened on the waterproof cover. Rotating cylinders are installed on both sides of the washing table, and a third lifting cylinder is fixedly installed at the output end of the rotating cylinder. The spray arm is fixedly installed on the third lifting cylinder, and nozzles are installed at the ends of the two groups of spray arms, and the nozzles of the two groups of nozzles are fan-shaped and circular respectively.

[0017] Preferably, a method for using a wafer laser processing device comprises the following steps:

[0018] S1, loading, the front-opening wafer pod is opened, and the robot grabs a group of workpieces from a group of front-opening wafer pods;

[0019] S2, pre-alignment: the robot places the workpiece into the fixed suction cup for pre-alignment, so that the packaged wafer and the glass are pre-aligned so that the centers of the two circles coincide;

[0020] S3, cutting, the robot grabs the pre-aligned wafer and places it on the loading platform, and uses the cutting galvanometer to guide the laser to perform V-groove cutting and burr cutting;

[0021] S4, cleaning, the robot grabs the cut wafer and places it on the suction cup rack, and uses the lower spray gun and spray arm to perform upper and lower spray cleaning;

[0022] S5, unloading, the robot places the cleaned wafers into the front-opening wafer transfer box.

[0023] The present invention discloses a wafer laser processing device and a method for using the same, which have the following beneficial effects:

[0024] 1. The wafer laser processing device sets a pre-alignment mechanism and uses the edge finder in the calibration seat for calibration, so that the wafer packaging sheet is located at the center of the fixed suction cup. The workpiece is then grabbed and moved to the loading platform by a robot to ensure that the sample is located at the center of the laser lens. The laser is then guided by a cutting galvanometer to emit laser light through the laser lens to perform V-groove cutting on the glass packaging sheet outside the wafer. At the same time, the outer edge of the glass packaging sheet is burred, so that the packaging sheet and the wafer form a concentric package. V-groove cutting, concentric cutting and burr removal cutting are completed at one time, reducing the overall processing steps, lowering costs and increasing processing efficiency.

[0025] 2. When cutting a workpiece, the wafer laser processing device moves the workpiece horizontally through the X-axis slide and the Y-axis slide, so that the workpiece is under the laser lens. At this time, the laser lens is driven downward by the lifting cylinder, so that the laser lens, the large suction cup and the dust cover form a closed cutting space for the workpiece, and the dust cover is blown with ions by starting the ion air gun to prevent the cut dust from adhering to the laser lens, the large suction cup and the dust cover. Then, the cutting dust is sucked outward by the suction head to avoid contaminating the cutting processing area.

[0026] 3. The wafer laser processing device uses a robot to grab the workpiece and move it to the suction cup rack in the cleaning chamber. At this time, the bottom of the workpiece is sprayed and cleaned through the lower nozzle, and two sets of spray arms drive two different nozzles to spray and clean the surface of the workpiece. After the spraying is completed, the workpiece is rotated and dried by the electric rotary table, thereby realizing fully automatic double-sided cleaning of the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 This is a schematic diagram of the overall front structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the overall rear structure of the present invention;

[0030] Figure 3 This is a schematic diagram of the overall top structure of the present invention;

[0031] Figure 4 This is a schematic diagram of the outer surface structure of the positioning frame of the present invention;

[0032] Figure 5 This is a schematic diagram of the structure of the manipulator of the present invention;

[0033] Figure 6 This is a schematic diagram of the structure of the pre-alignment mechanism of the present invention;

[0034] Figure 7 This is a schematic structural diagram of the wafer processing center of the present invention;

[0035] Figure 8 This is a schematic diagram of the cutting assembly structure of the present invention;

[0036] Figure 9 This is a schematic diagram of the front outer wall structure of the laser lens of the present invention;

[0037] Figure 10 This is a schematic diagram of the outer wall structure of the laser lens side of the present invention;

[0038] Figure 11 This is a schematic diagram of the outer surface structure of the loading platform of the present invention;

[0039] Figure 12 This is a cross-sectional view of the internal structure of the large suction cup of the present invention;

[0040] Figure 13 This is a schematic diagram of the top structure of the cleaning component of the present invention;

[0041] Figure 14 This is a cross-sectional view of the internal structure of the cleaning chamber of the present invention;

[0042] Figure 15 This is a schematic diagram of the bottom structure of the cleaning table of the present invention.

[0043] In the figure: 1. Wafer processing machine; 11. Wafer loading center; 12. Wafer processing center; 13. Positioning frame; 14. Sealing partition; 15. Waterproof cover; 16. Electric door; 2. Industrial computer; 3. Front-opening wafer transfer box; 4. Integrated control panel; 5. Robot; 51. Linear motor; 52. First lifting cylinder; 53. Suction cup hand; 54. Robot arm; 6. Pre-alignment mechanism; 61. Calibration seat; 62. Fixed suction cup; 63. Edge finder; 64. Dust removal fan; 7. Cutting assembly; 71. Loading platform; 711. Y-axis slide rail; 712. X-axis slide rail; 713. Base; 71 4. Large suction cup; 715. Small suction cup; 716. Lifting cylinder; 72. Laser lens; 722. Laser; 73. Laser optical path; 74. Mounting bracket; 75. Detection camera; 76. Positioning camera; 77. Cutting galvanometer; 78. Dust hood; 782. Suction head; 79. Lifting cylinder; 710. Ion air gun; 8. Cleaning assembly; 81. Cleaning table; 82. Cleaning chamber; 83. Electric rotating table; 84. Suction cup holder; 85. Lower nozzle; 86. Spray arm; 87. Drain outlet; 88. Second lifting cylinder; 89. Spray head; 810. Third lifting cylinder; 811. Rotating cylinder. DETAILED DESCRIPTION

[0044] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0045] The present invention provides a wafer laser processing device and its use method, which solves the problem of needing to correct the outer circle of the plastic package during wafer processing. After correction, the wafer and the outer circle of the plastic package are made concentric, and the outer edge needs to be deburred. However, existing equipment performs deburring and outer circle correction in two separate steps, resulting in cumbersome processing procedures and high processing costs.

[0046] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0047] The embodiment of the present invention discloses a wafer laser processing device and a method of using the same.

[0048] According to the attached Figure 1-15 As shown, it includes a wafer loading center 11 and a wafer processing center 12, which are assembled into a wafer processing machine 1;

[0049] Two sets of front-opening wafer transfer boxes 3 for loading and unloading are installed on the front side of the wafer loading center 11. A robot 5 and a pre-alignment mechanism 6 are installed inside the wafer loading center 11.

[0050] The wafer processing center 12 is equipped with a cutting assembly 7 and a cleaning assembly 8. The robot 5 grabs the wafers from a group of front-opening wafer pods 3, calibrates the center of the wafers through the pre-alignment mechanism 6, and then places them in the cutting assembly 7 and the cleaning assembly 8 for laser cutting and cleaning, and finally places them into another group of front-opening wafer pods 3 to complete the unloading.

[0051] The cutting assembly 7 includes a loading platform 71 and a laser lens 72 arranged on the top of the loading platform 71. A cutting galvanometer 77 is installed on one side of the laser lens 72. A dust cover 78 is arranged between the loading platform 71 and the laser lens 72. The loading platform 71, the dust cover 78 and the laser lens 72 form a closed cutting area. A suction head 782 is installed on one side of the dust cover 78 for directionally collecting dust generated during the laser cutting process.

[0052] An industrial computer 2 for controlling the front-opening wafer transfer box 3, the robot 5 and the pre-alignment mechanism 6 is installed on the outside of the wafer loading center 11, and an integrated control panel 4 for controlling the cutting component 7 and the cleaning component 8 is installed on the side of the wafer processing center 12.

[0053] The robot 5 includes a linear motor 51 fixedly arranged at the bottom of the wafer loading center 11, a first lifting cylinder 52 is installed on the linear motor 51, two groups of robot arms 54 are installed on the top of the first lifting cylinder 52, and suction cup hands 53 are installed on both groups of robot arms 54. A positioning frame 13 is installed inside the wafer loading center 11, the first lifting cylinder 52 slides along the inside of the positioning frame 13, and the pre-alignment mechanism 6 is installed at one end of the positioning frame 13.

[0054] The pre-alignment mechanism 6 includes a calibration seat 61 and a fixed suction cup 62 fixedly embedded in the calibration seat 61 . An edge finder 63 is installed on one side of the top of the calibration seat 61 . A dust removal fan 64 is fixedly provided on one side of the edge finder 63 .

[0055] A sealing partition 14 is installed in the wafer processing center 12, and the cutting assembly 7 and the cleaning assembly 8 are sealed by the sealing partition 14 respectively. An electric door 16 is installed on the outer wall of the sealing partition 14, and the robot 5 enters and exits the cutting assembly 7 and the cleaning assembly 8 by passing through the two sets of electric doors 16.

[0056] The cutting assembly 7 also includes a mounting bracket 74 fixedly set in the wafer processing center 12, a loading platform 71 is set at the bottom of the mounting bracket 74, a lifting cylinder 79 is installed on the top of the mounting bracket 74, and the laser lens 72 is fixedly installed at the output end of the lifting cylinder 79. The laser light path 73 and the laser 722 are installed on the top of the mounting bracket 74. The laser light path 73 and the laser 722 are connected to the laser lens 72. Ion air guns 710 are installed on both sides of the laser lens 72, and a positioning camera 76 and a detection camera 75 are installed on the outer wall of the laser lens 72.

[0057] The loading platform 71 includes a Y-axis slide rail 711 fixedly set on the mounting bracket 74, an X-axis slide rail 712 is slidably set on the Y-axis slide rail 711, a base 713 is slidably set on the top of the X-axis slide rail 712, a large suction cup 714 is fixedly set on the base 713, a lifting cylinder 716 is fixedly set in the middle of the large suction cup 714, and a small suction cup 715 is fixedly installed on the output end of the lifting cylinder 716.

[0058] The cleaning assembly 8 includes a cleaning table 81 and a cleaning chamber 82 fixedly arranged in the cleaning table 81. A second lifting cylinder 88 is fixedly arranged at the inner bottom of the cleaning table 81, and an electric rotating table 83 is fixedly arranged at the output end of the second lifting cylinder 88. A suction cup rack 84 is fixedly arranged on the electric rotating table 83. A lower spray gun 85 is arranged in a circular array inside the cleaning chamber 82 and below the suction cup rack 84. Spray arms 86 are installed on both sides of the interior of the cleaning table 81, and a drain outlet 87 is installed at the inner bottom of the cleaning chamber 82.

[0059] A waterproof cover 15 is fixedly installed above the cleaning table 81, and an inlet and outlet adapted for the electric door 16 is opened on the waterproof cover 15. Rotating cylinders 811 are installed on both sides of the cleaning table 81, and a third lifting cylinder 810 is fixedly installed at the output end of the rotating cylinder 811. The spray arm 86 is fixedly set on the third lifting cylinder 810. The ends of the two groups of spray arms 86 are both equipped with nozzles 89, and the nozzles of the two groups of nozzles 89 are fan-shaped and circular, respectively.

[0060] Working principle: When the device is in use, the industrial computer 2 controls the wafer loading center 11, and the integrated control panel 4 controls the wafer processing center 12, so that the front-opening wafer cassette 3 is opened. At this time, the robot 5 grabs a group of wafer packaging sheets from a group of front-opening wafer cassettes 3 and then places them on the calibration seat 61. The edge finder 63 in the calibration seat 61 is used to calibrate the wafer packaging sheets so that the wafer packaging sheets are in the center position of the fixed suction cup 62;

[0061] At this time, the robot 5 grabs the calibrated and positioned wafer package and places it on the small suction cup 715. The small suction cup 715 absorbs the workpiece and then descends. At this time, the large suction cup 714 contacts the workpiece and absorbs it. Then the small suction cup 715 is released. At this time, the X-axis slide rail 712 and the Y-axis slide rail 711 are used to move the workpiece horizontally, so that the workpiece is under the laser lens 72. At this time, the laser lens 72 is driven downward by the lifting cylinder 79, so that the laser lens 72, the large suction cup 714 and the dust cover 78 form a closed cutting space for the workpiece. At this time, the cutting galvanometer 77 guides the laser beam, so that the laser 722 emits laser light through the laser lens 72 to cut the glass packaging sheet outside the wafer into a V-groove, and at the same time cuts the burrs on the outer edge of the glass packaging sheet, so that the packaging sheet and the wafer form a concentric package, and the ion air gun 710 is started to blow ions on the dust cover 78 to prevent the cut dust from adhering to the laser lens 72, the large suction cup 714 and the dust cover 78, and then the cutting dust is sucked outward by the suction head 782;

[0062] After the cutting is completed, the lifting cylinder 79 drives the laser lens 72 to move upward, and then the large suction cup 714 is released, the small suction cup 715 lifts the workpiece, and the workpiece is transferred to the designated unloading position through the X-axis slide 712 and the Y-axis slide 711, and then the workpiece is grabbed and moved to the suction cup rack 84 in the cleaning chamber 82 by the robot 5. At this time, the bottom of the workpiece is sprayed and cleaned by the lower nozzle 85, and the two sets of spray arms 86 drive two different nozzles 89 to spray and clean the surface of the workpiece. After the spraying is completed, the electric rotary table 83 drives the workpiece to rotate and dry, and then the cleaned and dried workpiece is picked up by the robot 5 and placed in another set of front-opening wafer transfer boxes 3 to complete the unloading.

[0063] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer laser processing device, comprising a wafer loading center (11) and a wafer processing center (12), characterized in that: The wafer loading center (11) and the wafer processing center (12) are assembled to form a wafer processing machine (1); Two sets of front-opening wafer transfer boxes (3) for loading and unloading are installed on the front side of the wafer loading center (11), and a robot (5) and a pre-alignment mechanism (6) are installed inside the wafer loading center (11); The wafer processing center (12) is provided with a cutting assembly (7) and a cleaning assembly (8), and the robot (5) grabs the wafers from a group of front-opening wafer transfer boxes (3), calibrates the center of the wafers through a pre-alignment mechanism (6), and then successively places the wafers into the cutting assembly (7) and the cleaning assembly (8) for laser cutting and cleaning, and finally places the wafers into another group of front-opening wafer transfer boxes (3) to complete unloading; The cutting assembly (7) includes a loading platform (71) and a laser lens (72) arranged on the top of the loading platform (71), a cutting galvanometer (77) is installed on one side of the laser lens (72), a dust cover (78) is provided between the loading platform (71) and the laser lens (72), and the loading platform (71), the dust cover (78) and the laser lens (72) form a closed cutting area, and a suction head (782) is installed on one side of the dust cover (78) for directionally collecting dust generated during the laser cutting process.

2. The wafer laser processing device according to claim 1, characterized in that: An industrial computer (2) for controlling a front-opening wafer transfer box (3), a robot (5) and a pre-alignment mechanism (6) is installed on the outside of the wafer loading center (11), and an integrated control panel (4) for controlling a cutting component (7) and a cleaning component (8) is installed on the side of the wafer processing center (12).

3. The wafer laser processing device according to claim 2, wherein: The robot (5) includes a linear motor (51) fixedly arranged at the bottom of the wafer loading center (11), a first lifting cylinder (52) is installed on the linear motor (51), two groups of robot arms (54) are installed on the top of the first lifting cylinder (52), and suction cup hands (53) are installed on the two groups of robot arms (54). A positioning frame (13) is installed inside the wafer loading center (11), the first lifting cylinder (52) slides along the inside of the positioning frame (13), and the pre-alignment mechanism (6) is installed at one end of the positioning frame (13).

4. The wafer laser processing device according to claim 3, wherein: The pre-alignment mechanism (6) comprises a calibration seat (61) and a fixed suction cup (62) fixedly embedded in the calibration seat (61); an edge finder (63) is installed on one side of the top of the calibration seat (61); and a dust removal fan (64) is fixedly provided on one side of the edge finder (63).

5. The wafer laser processing device according to claim 2, wherein: A sealing partition (14) is installed in the wafer processing center (12), and the cutting component (7) and the cleaning component (8) are sealed by the sealing partition (14). The outer wall of the sealing partition (14) is installed with an electric door (16), and the robot (5) enters and exits the cutting component (7) and the cleaning component (8) by passing through the two sets of electric doors (16).

6. The wafer laser processing device according to claim 5, characterized in that: The cutting assembly (7) also includes a mounting bracket (74) fixedly arranged in the wafer processing center (12), the loading platform (71) is arranged at the bottom of the mounting bracket (74), a lifting cylinder (79) is installed on the top of the mounting bracket (74), the laser lens (72) is fixedly installed on the output end of the lifting cylinder (79), a laser light path (73) and a laser (722) are installed on the top of the mounting bracket (74), the laser light path (73) and the laser (722) are connected to the laser lens (72), ion air guns (710) are installed on both sides of the laser lens (72), and a positioning camera (76) and a detection camera (75) are installed on the outer wall of the laser lens (72).

7. The wafer laser processing device according to claim 6, characterized in that: The loading platform (71) includes a Y-axis slide rail (711) fixedly arranged on a mounting bracket (74), an X-axis slide rail (712) is slidably arranged on the Y-axis slide rail (711), a base (713) is slidably arranged on the top of the X-axis slide rail (712), a large suction cup (714) is fixedly arranged on the base (713), a lifting cylinder (716) is fixedly arranged in the middle of the large suction cup (714), and a small suction cup (715) is fixedly installed at the output end of the lifting cylinder (716).

8. The wafer laser processing device according to claim 5, characterized in that: The cleaning assembly (8) includes a cleaning table (81) and a cleaning chamber (82) fixedly arranged in the cleaning table (81), a second lifting cylinder (88) is fixedly arranged on the inner bottom of the cleaning table (81), an electric rotating table (83) is fixedly arranged on the output end of the second lifting cylinder (88), a suction cup frame (84) is fixedly arranged on the electric rotating table (83), a lower spray gun (85) is arranged in a circular array inside the cleaning chamber (82) and below the suction cup frame (84), spray arms (86) are installed on both sides of the interior of the cleaning table (81), and a drain outlet (87) is installed on the inner bottom of the cleaning chamber (82).

9. The wafer laser processing device according to claim 8, characterized in that: A waterproof cover (15) is fixedly provided above the cleaning table (81), and an inlet and outlet adapted for an electric door (16) is provided on the waterproof cover (15). Rotating cylinders (811) are installed on both sides of the cleaning table (81), and a third lifting cylinder (810) is fixedly provided at the output end of the rotating cylinder (811). The spray arms (86) are fixedly provided on the third lifting cylinder (810), and nozzles (89) are installed at the ends of the two groups of spray arms (86), and the nozzles of the two groups of nozzles (89) are fan-shaped and circular, respectively.

10. The method for using a wafer laser processing device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, loading, the front-opening wafer transfer box (3) is opened, and the robot (5) grabs a group of workpieces from a group of front-opening wafer transfer boxes (3); S2, pre-alignment, the robot (5) places the workpiece into the fixed suction cup for pre-alignment, so that the packaged wafer and the glass are pre-aligned so that the centers of the two circles coincide; S3, cutting, the robot (5) grabs the pre-aligned wafer and places it on the loading platform (71), and guides the laser to perform V-groove cutting and burr cutting through the cutting galvanometer (77); S4, cleaning, the robot (5) grabs the cut wafer and places it on the suction cup rack (84), and uses the lower spray gun (85) and the spray arm (86) to spray and clean it from top to bottom; S5, unloading, the robot (5) places the cleaned wafer into the front-opening wafer transfer box (3).

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