Semiconductor plug-in component dispensing system and method

Abstract

A semiconductor plug arrangement system and arrangement method, the system comprises: a vibrating disc, the inner wall is provided with a spiral material plate, the end of the spiral material plate is connected with a main material groove extending to the outside of the vibrating disc. A spiral groove is formed on the inner wall of the vibrating disc corresponding to the connecting part of the spiral material plate; a notch is formed on one side of the middle section of the main material groove, the width of the notch is greater than or equal to half of the width of the bottom plate of the main material groove, the notch is connected with a branch material groove, the branch material groove is communicated with the main material groove, a stop rod is arranged on the inner wall of the side plate opposite to the notch of the main material groove in parallel, the stop rod has a gap between the bottom plates of the main material groove, a notch is formed on the middle section of the stop rod, the width of the notch is greater than the width of the pin; the end of the branch material groove and the end of the main material groove are respectively connected to two ends of an arc track, and a material taking point is arranged on the middle section of the arc track. The scheme can multiply the number of triodes arranged and output by the vibrating disc, and effectively reduces the influence on the plug-in equipment lifting efficiency.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor component routing technology, and particularly relates to a semiconductor component routing system and routing method. Background Technology

[0002] During circuit board assembly manufacturing, various electronic components need to be installed on the circuit board. This process is called "insertion." With the improvement of production efficiency, the insertion work has gradually shifted from traditional manual insertion to automated insertion. To facilitate the automatic picking of various electronic components, an automatic feeding device is usually set up at the front end of the automatic insertion equipment to feed the electronic components and transport the arranged electrical components to the picking position of the insertion equipment. The insertion equipment uses chucks or nozzles to pick up the electronic components from the picking position and install them.

[0003] A transistor is a commonly used electronic component. A typical package structure includes a cuboid plastic casing and leads extending to both sides of the casing. A transistor has three leads, one on one side of the casing and the other two on the opposite side. During installation, the leads are aligned with pads on the circuit board, and the transistor is fixed to the board by soldering.

[0004] Most existing material feeding processes use vibratory feeders. These feeders utilize a spiral track inside the feeder to transport transistors, achieving a screening process during transport. Only transistors with aligned pin orientations are output from the end of the spiral track, while those with incorrect orientations fall back into the vibratory feeder. However, existing feeding equipment can only output transistors in one orientation. While this ensures consistency in transistor orientation when picked up by the insertion equipment, it also results in more transistors falling back into the vibratory feeder and repeatedly participating in the feeding process, reducing feeding efficiency and hindering the improvement of insertion equipment efficiency. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a semiconductor insertion and sorting system and method, which significantly increases the number of transistors output by the vibratory feeder and effectively reduces the impact on improving the efficiency of insertion equipment.

[0006] In order to achieve the objective of this invention, the following solution is proposed:

[0007] A semiconductor component feeding system includes: a vibratory feeder with a spiral feeder on its inner wall, and a main feeder extending to the outside of the vibratory feeder at the end of the spiral feeder.

[0008] The inner wall of the vibratory feeder has a spiral groove corresponding to the connection part with the spiral plate, which is used to accommodate the pins of the transistor. The trajectory of the spiral groove is consistent with the trajectory of the spiral plate.

[0009] The width of the spiral plate is less than the width of the transistor's encapsulation body, but greater than half of its width.

[0010] The main material trough has a U-shaped cross-section, including a bottom plate and side plates on both sides of the bottom plate. A notch is provided on one side of the middle section of the main material trough. The width of the notch is greater than or equal to half the width of the bottom plate of the main material trough. A branch material trough is connected to the notch. The branch material trough is connected to the main material trough. The bottom surface of the branch material trough is inclined downward relative to the bottom surface of the main material trough. A stop bar is provided parallel to the inner wall of the side plate opposite to the notch of the main material trough. There is a gap between the stop bars and the bottom plate of the main material trough. A slot is provided in the middle section of the stop bar. The width of the slot is greater than the width of the pin.

[0011] The ends of the branch trough and the main trough are respectively connected to the two ends of an arc-shaped track, and a material collection point is provided in the middle section of the arc-shaped track.

[0012] The beneficial effects of this invention are as follows: the vibratory feeder coupling of this solution is simpler, it can simultaneously output transistors with pins facing different directions, and it can shunt the current to transistors with different pin orientations. Then, an arc-shaped track is used to converge the shunt pins to the same picking station, ultimately ensuring that the transistors at the picking station have consistent orientations. This solution significantly increases the number of transistors that the vibratory feeder can output, improves material discharge efficiency, and effectively reduces the impact on improving the efficiency of the insertion equipment. Attached Figure Description

[0013] The accompanying drawings described herein are merely illustrative of selected embodiments, not all possible implementations, and are not intended to limit the scope of the invention.

[0014] Figure 1 A schematic diagram of the overall structure of this application is shown.

[0015] Figure 2 It shows Figure 1 A magnified view of a portion of point A in the middle.

[0016] Figure 3 A partial cross-sectional view of the vibratory feeder is shown.

[0017] Figure 4 A partial schematic diagram of the connection between the main feed trough and the branch feed trough is shown.

[0018] Figure 5 The end view of the main feed trough and the branch feed trough is shown.

[0019] Figure 6 A schematic diagram of a preferred structure for an arc track is shown.

[0020] Figure 7 It shows Figure 6 A magnified view of a section at point B.

[0021] The markings in the diagram are: vibratory feeder-1, spiral plate-11, spiral groove-12, main trough-2, notch-21, stop bar-22, groove opening-221, branch trough-3, arc track-4, baffle-41, sliding plate-5, left groove opening-51, right groove opening-52, sensor-6, telescopic cylinder-7. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the implementation methods of the present invention will be described in detail below with reference to the accompanying drawings. However, the embodiments described in this invention are only some embodiments of the present invention, and not all embodiments.

[0023] Example 1, as Figure 1 As shown, a semiconductor component feeding system includes: a vibratory feeder 1, the inner wall of which is provided with a spiral feeder 11, and the end of the spiral feeder 11 is connected to a main feed trough 2 extending to the outside of the vibratory feeder 1.

[0024] Specifically, such as Figure 1 , Figure 3 As shown, a spiral groove 12 is provided on the inner wall of the vibratory plate 1 at the connection point with the spiral plate 11 to accommodate the pins of the transistor. The trajectory of the spiral groove 12 is consistent with the trajectory of the spiral plate 11.

[0025] Specifically, such as Figure 3 As shown, the width of the spiral plate 11 is less than the width of the transistor's encapsulation body, but greater than half of its width. Here, the width refers to the distance between the two sides of the encapsulation body where the pins are located. During the transistor's ascent along the spiral plate 11, only transistors with pins inserted into the spiral groove 12 are prevented from falling off the spiral plate 11 because their pins are limited by the top surface of the spiral groove 12. Transistors with pins facing the spiral groove 12 exist in two orientations: one where the pin on the side with a single pin is inserted into the spiral groove 12, and the other where both pins on the other side are inserted. Both orientations of transistors ultimately enter the main material tank 2 from the end of the spiral plate 11. The vibratory feeder 1, designed using the above structure, can simultaneously output transistors with both pin orientations, improving the transistor arrangement efficiency. Compared to the existing arrangement with only one pin orientation, this significantly increases the output efficiency of the transistors. Transistors with pins not inserted into the spiral groove 12 will fall from the edge of the spiral plate 11 into the vibratory feeder 1.

[0026] Specifically, such as Figure 4 , Figure 5As shown, the main material tank 2 has a U-shaped cross-section, including a bottom plate and side plates on both sides of the bottom plate. A notch 21 is provided on one side of the middle section of the main material tank 2. The width of the notch 21 is greater than or equal to half the width of the bottom plate of the main material tank 2. The notch 21 is connected to a branch material tank 3, which is connected to the main material tank 2. The bottom surface of the branch material tank 3 is inclined downward relative to the bottom surface of the main material tank 2. A stop bar 22 is provided parallel to the inner wall of the side plate opposite to the notch 21 of the main material tank 2. The stop bar 22 has a gap for the pin to pass through between the bottom plate of the main material tank 2. A slot 221 is provided in the middle section of the stop bar 22. The width of the slot 221 is greater than the width of the pin. The slot 221 is located in the middle of the length direction of the notch 21. The lengths of both the notch 21 and the stop bar 22 are greater than the length of the transistor. The length of the stop bar 22 is greater than the length of the notch 21.

[0027] Specifically, such as Figure 1 As shown, the ends of the branch material trough 3 and the main material trough 2 are respectively connected to the two ends of an arc-shaped track 4. Specifically, the arc-shaped track 4 is U-shaped, semi-circular, or similar. Figure 1 , Figure 6 The elliptical structure shown has an opening, with the two ends of the opening used to connect the branch material trough 3 and the main material trough 2, respectively. The middle section of the arc track 4 is provided with a material pick-up point. The cross-sections of the branch material trough 3 and the arc track 4 are the same as the cross-sectional shape of the main material trough 2.

[0028] After the transistors with both pin orientations enter the main material tank 2, they automatically move towards the rear end of the main material tank 2. When a transistor with a single pin facing the side of the baffle 22 moves backward, the single pin enters the gap between the baffle 22 and the bottom plate of the main material tank 2. When the transistor moves into the gap range, because the width of the gap 21 is greater than or equal to half the width of the bottom plate of the main material tank 2, the transistor will tilt towards the side with both pins. Because the single pin is restricted by the bottom surface of the baffle 22, the transistor can still move along the main material tank 2. However, when the single pin moves to the position of the slot opening 221, because the width of the slot opening 221 is greater than the width of the pin, the single pin will enter upward. Since the single pin is no longer restricted by the stop bar 22, the transistor will slide to the side with two pins and enter the front end of the branch material tank 3. This allows the transistor with one pin facing the stop bar 22 to enter the branch material tank 3, achieving the purpose of diversion. The transistor in the branch material tank 3 will enter the left track of the arc track 4. When the transistor with two pins facing the stop bar 22 passes through the notch 21, since one pin is always inserted in the gap between the stop bar 22 and the bottom plate of the main material tank 2, it can be ensured that the transistor in this state can pass smoothly through the notch 21 and the notch 221, and enter the right track of the arc track 4 through the rear end of the main material tank 2.

[0029] Ultimately, the two transistors in different orientations move to the middle section of the arc track 4 via the left and right sides of the arc track 4, respectively. Guided by the arc track 4, the transistor pins of the transistors entering the middle section of the arc track 4 are aligned. By setting the pick-up point in the middle section of the arc track 4, the insertion device can obtain transistors with the same orientation at the pick-up point in the middle section of the arc track 4.

[0030] Preferred, such as Figure 1 As shown, the rear ends of both the main material trough 2 and the branch material trough 3 are inclined downwards. The horizontal height of the rear ends of both the main material trough 2 and the branch material trough 3 is higher than the horizontal height of the middle section of the arc track 4. The middle section of the arc track 4 is the lowest position of the arc track 4. With the above design, the transistors in the main material trough 2 and the branch material trough 3 can automatically enter the arc track 4, and the transistors that enter the arc track 4 can automatically move to the middle section of the arc track 4, so that the transistors can automatically enter the material picking point.

[0031] Preferred, such as Figure 5 As shown, the cross-sections of both the main material trough 2 and the branch material trough 3 are inclined outwards. Here, "outer side" refers to the side of the main material trough 2 that is furthest from the branch material trough 3. This design increases the angle between the top surfaces of the bottom plates of the main material trough 2 and the branch material trough 3, facilitating the smooth fall of transistors with a single lead facing the stop bar 22 into the branch material trough 3. Simultaneously, it enhances the limiting effect of the stop bar 22 on the leads. The outward inclination of the main material trough 2 ensures that the side of the transistor's encapsulation is tightly against the inner wall of the side plate opposite the notch 21, preventing transistors with a single lead facing the stop bar 22 from falling into the branch material trough 3 before the lead has moved to the slot opening 221. It also prevents transistors with two leads facing the stop bar 22 from falling into the branch material trough 3 when passing the notch 21.

[0032] Preferred, such as Figure 7 As shown, a baffle 41 is provided in the middle section of the arc track 4. The baffle 41 divides the arc track 4 into a left track and a right track. The positions of the transistors that are directly in contact with the baffle 41 on both sides of the arc track 4 are the pick-up points. By setting the baffle 41, two pick-up points can be set in the middle section of the arc track 4, and the transistors obtained by the two pick-up points have the same posture, that is, the transistor pins are facing the same direction.

[0033] Preferred, such as Figure 2As shown, the arc-shaped track 4 is broken at the middle, forming a left track and a right track. The material collection point is located between the left and right tracks. A sliding plate 5 is radially provided between the left and right tracks along the arc-shaped track 4. The sliding plate 5 is movable along the through-path direction and has a left slot 51 and a right slot 52 along the moving direction, facing the left and right tracks respectively. During material collection, the sliding plate 5 is moved so that the left slot 51 or right slot 52 moves between the left and right tracks. At this time, the transistor inside the left or right track will automatically enter the left slot 51 or right slot 52 aligned with the left or right track. The insertion device can then obtain the transistor from the sampling point. This structural design can use the left slot 51 and right slot 52 to limit the transistors on both sides respectively, and ensure that the transistors in the left and right tracks enter the same sampling point, thus facilitating sampling by the insertion device. Furthermore, this design can determine the transistors based on the left or right track. The position of the sliding plate 5 is adjusted to control the number of transistors, thereby preventing transistors from accumulating inside the left or right track. For example, if there are more transistors inside the left track, the left slot 51 can be moved between the left and right tracks. After the insertion equipment picks up the material, only transistors inside the left track can enter the left slot 51, that is, only transistors inside the left track can enter the sampling point. Similarly, if there are more transistors on the right track, the sliding plate 5 can be moved so that the right slot 51 is moved between the left and right tracks, so that the insertion equipment can pick up the transistors on the right track.

[0034] Preferred, such as Figure 6 As shown, multiple sensors 6 are installed along the conveying trajectory on both the left and right tracks to sense the transistors inside the left and right tracks.

[0035] Example 2: A material feeding method using the semiconductor plug-in feeding system of claim 6. When all sensors 6 on the left track detect transistors, the sliding plate 5 is moved to move the left slot 51 between the left and right tracks; when all sensors 6 on the right track detect transistors, the sliding plate 5 is moved to move the right slot 52 between the left and right tracks. The logic of the above execution method is that when all sensors 6 on the left or right track detect transistors, it means that the transistors inside the left or right track have been filled to the set position. If they are not removed, there is a risk of accumulation.

[0036] Preferably, to ensure the accuracy of the detection results of sensor 6, sensor 6 is evenly and intermittently distributed on the front section of the left and right tracks. The front section here refers to the section where the arc track 4 connects to the main material trough 2 and the branch material trough 3.

[0037] Preferred, such as Figure 1 , Figure 2 As shown, the sliding plate 5 is mounted on the movable rod of a telescopic cylinder 7, and the telescopic cylinder 7 automatically adjusts the position of the sliding plate 5 according to the signal sent by the sensor 6.

[0038] The above description is merely a preferred embodiment of the present invention and is not intended to be the only or limiting of the invention. Those skilled in the art should understand that various changes or equivalent substitutions made to the present invention without departing from its scope are all within the protection scope of the present invention.

Claims

1. A semiconductor component routing system, comprising: A vibratory feeder (1) has a spiral material plate (11) on its inner wall, and the end of the spiral material plate (11) is connected to a main material trough (2) extending to the outside of the vibratory feeder (1). Its characteristic is that: A spiral groove (12) is provided on the inner wall of the vibratory plate (1) corresponding to the connection part with the spiral plate (11) to accommodate the pins of the transistor. The trajectory of the spiral groove (12) is consistent with the trajectory of the spiral plate (11). The width of the spiral plate (11) is less than the width of the transistor encapsulation body, but greater than half of the width. The main material trough (2) has a U-shaped cross section, including a bottom plate and side plates on both sides of the bottom plate. A notch (21) is provided on one side of the middle section of the main material trough (2). The width of the notch (21) is greater than or equal to half the width of the bottom plate of the main material trough (2). The notch (21) is connected to a branch material trough (3). The branch material trough (3) is connected to the main material trough (2). The bottom surface of the branch material trough (3) is inclined downward relative to the bottom surface of the main material trough (2). A stop bar (22) is provided parallel to the inner wall of the side plate opposite to the notch (21) of the main material trough (2). The stop bar (22) has a gap between the bottom plates of the main material trough (2). A slot (221) is provided in the middle section of the stop bar (22). The width of the slot (221) is greater than the width of the pin. The ends of the branch trough (3) and the main trough (2) are respectively connected to the two ends of an arc track (4), and the middle section of the arc track (4) is provided with a material collection point.

2. The semiconductor component routing system according to claim 1, characterized in that, The rear ends of the main material trough (2) and the branch material trough (3) are both inclined downwards. The horizontal height of the rear ends of the main material trough (2) and the branch material trough (3) is higher than the horizontal height of the middle section of the arc track (4). The middle section of the arc track (4) is the lowest position of the arc track (4).

3. The semiconductor component routing system according to claim 1, characterized in that, The cross sections of the main material trough (2) and the branch material trough (3) are both inclined outward.

4. The semiconductor component routing system according to claim 1, characterized in that, A baffle (41) is provided in the middle section of the arc track (4). The locations of the transistors that are directly in contact with the baffle (41) on both sides of the arc track (4) are the material pick-up points.

5. A semiconductor component routing system according to claim 1, characterized in that, The arc track (4) is broken from the middle to form a left track and a right track. The material pick-up point is between the left track and the right track. A sliding plate (5) is provided between the left track and the right track along the radial direction of the arc track (4). The sliding plate (5) is moved along the direction of the sliding plate. The sliding plate (5) has a left slot (51) and a right slot (52) along the direction of movement. The left slot (51) and the right slot (52) face the left track and the right track respectively.

6. A semiconductor component routing system according to claim 5, characterized in that, Multiple sensors (6) are installed along the conveying trajectory on both the left and right tracks to sense the transistors in the left and right tracks.

7. A method for routing semiconductor components using the semiconductor component routing system of claim 6, characterized in that, When all sensors (6) on the left track detect the transistor, move the sliding plate (5) to move the left slot (51) between the left and right tracks; when all sensors (6) on the right track detect the transistor, move the sliding plate (5) to move the right slot (52) between the left and right tracks.

8. The semiconductor component routing method according to claim 7, characterized in that, Sensors (6) are evenly and intermittently distributed on the front sections of the left and right tracks.

9. The semiconductor component routing method according to claim 7, characterized in that, The sliding plate (5) is mounted on the movable rod of a telescopic cylinder (7).

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