Vertical continuous electroplating device capable of adjusting electroplating deviation according to thickness difference of electroplated object

Abstract

The present invention relates to a vertical continuous plating apparatus capable of adjusting plating deviation according to the difference in the thickness of an object to be plated, including a plating bath filled with a plating solution and provided with mixed-flow nozzles on both left and right side walls, the mixed-flow nozzles being used for circulating the plating solution, removing air adhering to the object to be plated, and maximizing plating in a hole, and the plating deviation being adjusted according to the difference in the thickness of the object to be plated. The electroplating device further comprises a holding and transferring part which can move up and down and horizontally on the upper portion of the electroplating bath, vertically holds the electroplated object on the upper portion of the electroplating bath in a lifting or angle changing mode and enables the electroplated object to be electrified, and the holding and transferring part is used for transferring the electroplated object in the electroplating bath back and forth and left and right in a reciprocating mode. The electroplating deviation of the electroplated object is adjusted by adjusting the displacement and the moving distance of the electroplated object in the electroplating bath according to the thickness of the electroplated object, so that the lead-out effect can be adjusted according to the thickness of the electroplated object, the lead-out effect is maximized by horizontally moving front, back, left and right, and the electroplating deviation of the electroplated object with different thicknesses is reduced.

Description

Technical Field

[0001] The present invention relates to a vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object. More specifically, it relates to the following vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object, that is, the lead-out effect of the electroplated object in the electroplating tank can be maximized by adjusting the arrangement angle (arrangement angle) and the front, back, left and right displacement of the electroplated object in the electroplating tank, and uniform electroplating quality can be obtained even in electroplated objects with different thicknesses, thereby expected to increase manufacturing capacity and improve quality. Since the size of the electroplating tank is reduced, the space utilization rate is improved compared with the same space, and multiple electroplating production lines can be set up, so it can be advantageously used in small-scale production and large-scale production of multiple varieties. Background Art

[0002] Generally, a vertical continuous electroplating device, which is one of the existing electroplating production line types, is different from an ordinary electroplating tank electroplating device. It is a device that vertically hangs a substrate on a conveyor belt through which current flows to achieve electroplating. This vertical continuous electroplating device is provided with a mixed flow nozzle (e-ductor) for circulating the plating solution, removing air attached to the substrate, and maximizing electroplating in the hole.

[0003] In particular, compared to a conventional electroplating tank plating apparatus that affects only a portion of the substrate area when the e-duct is sprayed, in this vertical continuous electroplating apparatus, the entire area of the substrate is affected, thereby playing an advantageous role in glossy, uniform hole plating.

[0004] Figure 1 Part (a) and Figure 1 Part (b) is a schematic diagram showing an existing ordinary electroplating tank electroplating device and an existing vertical continuous electroplating device, as well as an affected area (glossy area) after electroplating in each device. Figure 1 Part (a) shows the state of holding the substrate 1 in the plating tank 10 in a common plating device and the glossy area in the substrate 1 after plating. Figure 1 Part (b) shows the state of holding the substrate 1 in the plating tank 10 in the vertical continuous electroplating device and the glossy area in the substrate 1 after electroplating. As shown in these figures, compared with the ordinary electroplating tank electroplating device, the entire area of the substrate 1 is affected in the vertical continuous electroplating device, which plays a favorable role in the gloss of the electroplating and uniform hole plating.

[0005] However, if Figure 2As shown, this conventional vertical continuous plating apparatus has a longer production line than conventional plating apparatuses because the substrates 1 within the plating tanks 10 are arranged in a row. Consequently, not only is the space utilization very low due to the required installation space, but the number of substrates that can be manufactured is also very small, resulting in poor manufacturing yields. Furthermore, for companies producing a large variety of products in small quantities, the plating conditions for each product vary, making it impossible to perform the plating process simultaneously using this vertical continuous plating apparatus, potentially leading to delivery issues.

[0006] Furthermore, this type of vertical continuous electroplating system requires a large amount of bath chemicals, which presents a significant commercial disadvantage. Although bath chemicals are sometimes only replenished to replace those consumed by electroplating, these chemicals themselves have an expiration date, requiring regular replenishment of all of the above bath chemicals.

[0007] In this regard, in Korean Patent No. 10-2539090 (hereinafter referred to as "Patent Document 1") developed by the present applicant, as Figure 3 As shown, the substrate 1 serving as the object to be plated in the plating tank 10 can be configured in a diagonal direction in a manner that allows for adjustment of the angle, thereby increasing the workload on the object to be plated in the plating tank and maximizing the lead-out effect, thereby potentially increasing manufacturing output and improving quality. Furthermore, the object to be plated moves back and forth and gradually advances to extend the total moving distance, thereby reducing the size of the plating tank. By reducing the size of the plating tank, multiple plating production lines can be set up, and thus the method can be advantageously applied to the production of multiple varieties and small quantities.

[0008] However, according to Patent Document 1, it can improve the extraction effect compared with the existing electroplating device, but the plated object can only be moved forward and backward (refer to Figure 3 ) and gradually move forward or backward, so Figure 4 The thickness of the plated article shown in part (b) is thicker than that in Figure 4 In the case of the thinner plated object shown in part (a), the distance between the plated object and the mixing nozzle becomes larger, so the effect (2) becomes relatively low. For example, since the thickness of the printed circuit board varies from product to product and ranges from 0.4 to 8.5 mm, the plating quality may vary depending on the thickness of the printed circuit board. That is, when the printed circuit board is located in the center of the plating tank, the printed circuit board can only be moved forward and backward (refer to Figure 3 As the lead-out effect is minimized by the movement of the lead-out plate (in the direction of the arrow), the hole surface at the center of the PCB thickness is minimized. To achieve glossy and uniform hole plating through electroplating, the lead-out effect should be maximized in the center of the PCB thickness, which is the most fragile part. However, current equipment cannot achieve this.

[0009] Prior art literature

[0010] Patent Literature

[0011] Patent Document 0001: KR10-2539090B1 Announced on June 2, 2023 Summary of the Invention

[0012] Therefore, the present invention is derived in order to solve the above problems. The technical problem to be solved by the present invention is to provide the following vertical continuous electroplating device that can adjust the electroplating deviation according to the thickness difference of the electroplated object, that is, by adjusting the configuration angle of the electroplated object in the electroplating tank and the left and right horizontal movement, the lead-out effect is adjusted according to the thickness of the electroplated object, and the front and back left and right horizontal movement can be performed and the total moving distance can be extended gradually. Therefore, not only can the lead-out effect of the electroplated object in the electroplating tank be maximized, but also the electroplating deviation of the electroplated object with different thicknesses can be reduced, thereby expected to improve manufacturing output and quality, and the space utilization rate is improved compared with the same space due to the reduction in the size of the electroplating tank, and multiple electroplating production lines can be set up, so it can be advantageously used in small-scale production and large-scale production of multiple varieties.

[0013] In order to achieve the above-mentioned purpose, one embodiment of the present invention is the following vertical continuous electroplating device that can adjust the electroplating deviation according to the thickness difference of the electroplated object. The present invention includes an electroplating tank filled with electroplating liquid and provided with mixed flow nozzles on the left and right side walls. The mixed flow nozzles are used for circulating the electroplating liquid, removing air attached to the electroplated object and maximizing the electroplating in the hole, and the device includes a holding and transferring part. The holding and transferring part can be lifted and moved horizontally in the upper part of the electroplating tank and vertically hold the electroplated object in the upper part of the electroplating tank in a manner that can be lifted and lowered or angled and energized, and is used to reciprocate and gradually advance the electroplated object in the electroplating tank. The displacement and movement distance of the electroplated object in the electroplating tank are adjusted according to the thickness of the electroplated object to adjust the electroplating deviation of the electroplated object. The extraction effect of the electroplated object in the electroplating tank based on the thickness of the electroplated object can be adjusted by adjusting the configuration angle of the electroplated object in the electroplating tank and the front, back, left and right movement, so that uniform electroplating quality can also be obtained for electroplated objects of different thicknesses.

[0014] According to the present invention, the advantage of the present invention is that the lead-out effect on the electroplated objects with different thicknesses can be adjusted by adjusting the configuration angle and the front, back, left and right displacement of the electroplated objects in the electroplating tank. Therefore, not only the lead-out effect on the electroplated objects in the electroplating tank is maximized, but also the plating deviation according to the thickness difference of the electroplated objects can be reduced, thereby contributing to increasing manufacturing output and improving quality. Moreover, since the size of the electroplating tank is reduced, the space utilization rate can be improved compared with the same space, and multiple electroplating production lines can be set up, so it can be advantageously used in small-scale production of multiple varieties. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Part (a) and Figure 1 Part (b) is a schematic diagram showing a conventional ordinary electroplating tank electroplating apparatus and a conventional vertical continuous electroplating apparatus, and the degree of influence (glossy area) caused by electroplating in each apparatus.

[0016] Figure 2 A simplified plan view showing the configuration of a substrate of an existing common vertical continuous electroplating device.

[0017] Figure 3 A simplified plan view showing the configuration of a substrate of a conventional vertical continuous electroplating apparatus related to the present invention.

[0018] Figure 4 Part (a) and Figure 4 Part (b) is a reference diagram for explaining the difference in the lead-out effect based on the substrate thickness in the conventional vertical continuous electroplating apparatus related to the present invention.

[0019] Figure 5 This is a schematic perspective view showing the structure of the main parts of a vertical continuous electroplating apparatus of the present invention that can adjust the plating deviation according to the thickness difference of the electroplated object.

[0020] Figure 6a and Figure 6b To illustrate Figure 5 Conceptual diagram of the displacement action of the multi-limb clamp realized in the variable angle gripping part. Figure 6c and Figure 6d It is a schematic diagram showing the assembly and separation states between the bracket and the multi-limb clamp.

[0021] Figure 7 Reference diagrams are shown for explaining the back-and-forth and left-and-right reciprocating horizontal movement of the object to be plated implemented in the vertical continuous electroplating apparatus of the present invention that can adjust the plating deviation according to the thickness difference of the object to be plated.

[0022] Figure 8a and Figure 8b These are enlarged cross-sectional photographs of the upper end, middle end, and lower end of each of the sample substrates 1 and 2 related to the comparative example and the embodiment of the present invention. DETAILED DESCRIPTION

[0023] Hereinafter, with reference to the accompanying drawings, the structure, operation and effects of a vertical continuous electroplating apparatus capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to a preferred embodiment of the present invention will be described in detail.

[0024] The terms and words used in this specification and the scope of protection of the invention should not be interpreted as limited to their common or dictionary meanings. Based on the principle that the inventor can appropriately define the concept of terms to best illustrate their own invention, they should be interpreted in accordance with the meaning and concept of the technical concept of the present invention. Therefore, the embodiments described in this specification and the structures shown in the drawings are merely the most preferred embodiments of the present invention. It should be understood that various equivalent technical solutions and modifications may exist at the time of filing this application.

[0025] Figure 5 This is a simplified perspective view showing the structure of the main parts of a vertical continuous electroplating apparatus capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to the present invention. Figures 6a to 6d To show that Figure 5 Schematic diagram of the 0° to 90° displacement state of the multi-limb clamp in the variable angle gripping part and its main parts, Figure 7 A reference diagram is provided for illustrating the front-to-back and left-to-right reciprocating horizontal movement of the object to be plated in a vertical continuous electroplating apparatus capable of adjusting the plating deviation according to the thickness difference of the object to be plated of the present invention. As shown in the figure, the vertical continuous electroplating apparatus capable of adjusting the plating deviation according to the thickness difference of the object to be plated of the present invention includes a plating tank 100 and a holding and transfer unit 200. The extraction effect is maximized by adjusting the configuration angle and the front-to-back and left-to-right reciprocating movement of the object to be plated in the plating tank, thereby reducing the plating deviation according to the thickness difference of the object to be plated. This vertical continuous electroplating apparatus capable of adjusting the plating deviation according to the thickness difference of the object to be plated of the present invention can be applied to a conveyor-type panel electroplating apparatus that hangs and supports the object to be plated by vertically grasping at least two positions in the plating tank from the top.

[0026] like Figure 5 As shown, the electroplating tank 100 is a tank filled with electroplating solution, and a mixed flow nozzle 110 (e-ductor) is provided on the left and right side walls. The mixed flow nozzle 110 is used to circulate the electroplating solution, remove air attached to the electroplated object 101, and maximize the electroplating in the hole. A phosphorus-containing copper bag (120) is provided as a copper plating source to achieve electroplating of the electroplated object. The electroplating tank can be filled with electroplating solution containing, for example, sulfuric acid, copper sulfate, chloride ions, brightener, and wetting agent. The electrode used for energization can use an anode made of phosphorus-containing copper or an insoluble anode made of iridium.

[0027] The holding and transfer part 200 can be lifted and moved horizontally in the upper part of the electroplating tank 100 and can vertically hold the object to be electroplated in a manner that can be lifted and lowered or angled and energize it in the upper part of the electroplating tank 100. It is used to transfer the object to be electroplated back and forth and left and right in the electroplating tank 100 and gradually push (advance) the object to be electroplated. The plating deviation of the object to be electroplated is adjusted by adjusting the displacement and moving distance of the object to be electroplated in the electroplating tank according to the thickness of the object to be electroplated.

[0028] The holding and transferring unit 200 may include a variable angle holding unit 210 , a transferring unit 220 , a moving distance adjusting unit 230 , and a plating deviation adjusting unit 240 .

[0029] The angle-variable holding portion 210 holds each object to be plated vertically at a variable angle on the upper portion of the electroplating tank 100 and energizes the object. The two ends of the angle-variable holding portion 210 are respectively hung on the conveyor belt 221 of the transfer portion 220, and the upper end of the object to be plated in the electroplating tank is held in a manner that allows the angle to be adjusted within the range of 0° to 90° relative to the length direction of the electroplating tank 100. Together with the conveyor belt 221, the object moves forward / backward along the length direction of the electroplating tank 100 or left / right along the width direction and performs electroplating during the entire electroplating process. The current density during energization can be between 0.1 and 5 A / dm 2 The conveyor belt 221 can move forward and backward at a speed of 0 to 500 mm / min, and left and right at a speed of 0 to 250 mm / sec, and the entire electroplating time can be within a range of 30 to 500 minutes. To this end, the angle-variable gripping unit 210 may include: a bracket 211, with both ends respectively attached to the conveyor belt 221 of the transfer unit 220; a multi-limbed clamp 212 for gripping each object to be electroplated; and fixing screws 213 for assembling or detaching the bracket and the multi-limbed clamp.

[0030] like Figure 5 As shown, fastening hooks 211a are provided at both ends of the bracket 211, so that the bracket 211 is hung and fixed on the transfer unit 220 along the width direction (transverse direction) of the plating tank 100, and is reciprocated forward and backward along the length direction (longitudinal direction) of the plating tank 100 by the conveyor belt 221 of the transfer unit 220 and is used as a whole to support the load of the multi-limbed clamp and the object to be plated. In addition, in this bracket 211, as shown in FIG. Figures 6a to 6d As shown, the bracket 211 is provided with a vertical link 211b of a predetermined length extending vertically from the center of gravity to the lower portion thereof. In the center portion of the body at the lower end portion of the vertical link 211b, as shown in FIG. Figure 6c and Figure 6dAs shown, a set screw assembly groove 211c is formed inward from the lower end of the body to a predetermined depth to allow assembly with a set screw 213. On the body side of the lower end of the vertical link 211b where the set screw assembly groove 211c is formed, a portion of the body cross-section is removed by semicircular machining to form a clamp rotation guide groove 211d that guides the horizontal rotation of the multi-limb clamp. A screw groove of a predetermined size for the assembly screw is formed on the inner circumference of the set screw assembly groove 211c.

[0031] In the multi-limbed clamp 212, two or more clamps 212a that can hold the object to be plated are spaced at equal intervals and suspended downwardly at both ends of a horizontal connecting rod 212b, thereby simultaneously grasping and fixing the upper end of an object to be plated in the plating tank at multiple positions. In addition, in this multi-limbed clamp 212, a plurality of clamps 212a are formed at the center of gravity of the horizontal connecting rod 212b. Figure 6c and Figure 6d The fixing screw through-hole 212c shown runs through the inner side of the main body from top to bottom, allowing for assembly with the fixing screw 213. A portion of the main body cross-section on the upper end of the horizontal connecting rod 212b, where the fixing screw through-hole 212c is formed, is machined to protrude upward. The rotating support protrusion 212d, which is guided by the fixture rotation guide groove 211d of the bracket 211 and can rotate horizontally, is fan-shaped so that its center angle forms a specified angle (90°). A screw groove is formed on the inner circumference of the fixing screw through-hole 212c. The screw groove is formed to a specified depth at the lower end of the main body of the vertical connecting rod 211b of the bracket 211 and has the same inner diameter and dimensions as the fixing screw assembly groove 211c.

[0032] In the fixing screw 213, the screw body is formed with a length that can be assembled to the uppermost end of the fixing screw assembly groove 211c of the bracket 211 through the fixing screw through hole 212c of the multi-limbed clamp 212 and the height of the rotation support protrusion 212d or the clamp rotation guide groove 211d, and the outer diameter is formed to be screw-assembled with the fixing screw assembly groove 211c of the bracket 211 and the fixing screw through hole 212c of the multi-limbed clamp 212, and a thread of a size that can be assembled along their screw grooves is formed on the outer peripheral surface, and is assembled or separated together with the fixing screw assembly groove 211c at the lower end of the vertical connecting rod 211b through the fixing screw through hole 212c of the horizontal connecting rod 212b.

[0033] Thus, the rotation support protrusion 212d formed on the upper portion of the horizontal link 212b of the multi-limbed clamp 212 is guided and engaged by the clamp rotation guide groove 211d formed on the lower end portion of the vertical link 211b of the bracket 211, and is assembled accordingly, or separated in a horizontally rotatable manner. When the fixing screw 213 is loosened, the displacement angle of the electroplated object in the electroplating tank can be adjusted by horizontally rotating the multi-limbed clamp 212 relative to the bracket 211 within a range of 0° to 90°. The fixing screw 213 can be reassembled and fixed in a state where it is rotated and adjusted to a desired angle, thereby fixing the configuration angle of the electroplated object in the electroplating tank. For example, this multi-limbed clamp 212 can be used as follows: Figure 6a The angle of arrangement (0°: the angle in which the plated object faces the same direction as the bracket) that does not cause displacement of the plated object in the plating tank is as shown. Figure 6b As shown, the direction can be adjusted as needed by deriving a configuration angle (as an angle of displacement of +θ or -θ in the range of 0° to 90°, the electroplated object is tilted by +θ or -θ relative to the bracket) to increase the affected area and improve the electroplating quality.

[0034] The transfer unit 220 is composed of a conveyor belt 221 that can be moved up and down, and horizontally moved forward and backward (in the longitudinal direction of the plating tank) and left and right (in the width direction of the plating tank) in the upper part of the plating tank 100. It is arranged along the longitudinal direction of the plating tank (for example, a pair of conveyor belts are arranged in parallel), and the variable angle gripping unit 210 is suspended and supported in a horizontal manner. The variable angle gripping unit 210 can be moved up and down or horizontally moved forward and backward and left and right in the upper part of the plating tank by a power source such as a reducer, and gradually advanced (advanced). The forward and backward movement speed of the transfer unit can be within the range of 0 to 500 mm / min, and the left and right movement speed can be within the range of 0 to 250 mm / sec.

[0035] The movement distance adjustment unit 230 is provided on one side of the transfer unit 220 and adjusts the movement distance of the plated object in the plating tank by controlling the forward and backward (longitudinal direction of the plating tank) reciprocating horizontal movement of the transfer unit 220. This movement distance adjustment unit 230 can be formed by a conventional motor M and a plurality of conventional rollers R. The conventional motor M can rotate in a forward / reverse direction. The conventional rollers R rotate through the motor and cause the transfer unit 220 to move forward in a single direction or backward in the opposite direction. In each action cycle of the entire electroplating process, the power of the motor causes the transfer unit 220 to repeatedly move forward / backward along the longitudinal direction of the plating tank 100 and gradually move forward as a whole to extend the total movement distance of the plated object held and arranged by the variable angle gripping unit 210 in the plating tank. The entire electroplating time is within the range of 30 to 500 minutes, and the moving distance adjusting unit 230 can extend the moving distance of the electroplated object held and arranged by the variable angle gripping unit 210 in the electroplating tank during the entire electroplating process by repeating the following actions in each action cycle, i.e., rotating the motor forward in the first 1 / 2 of each action cycle of the entire electroplating time set for driving the transfer unit to move the transfer unit 220 forward to the first position and rotating the motor backward in the next 1 / 2 of each action cycle to move the transfer unit 220 backward to a second position shorter than the first position. For example, in the case of an action cycle in which the transfer unit moves 10 cm every 20 seconds, the following actions can be repeated, i.e., moving the transfer unit forward 30 cm in the first 10 seconds and moving the transfer unit backward 20 cm in the next 10 seconds, so that the electroplated object moves back and forth and gradually moves forward during the entire electroplating process, thereby extending the moving distance in the entire electroplating tank.

[0036] In the case where the present invention is constructed as described above, for example, when electroplating substrates with a width of 30.5 cm are arranged in an electroplating tank with a total length of 1800 cm at an interval of 10 cm, the number of electroplating substrates that can enter a conventional vertical continuous electroplating device may be about 44 pieces, but the number of electroplating substrates that can enter the vertical continuous electroplating device of the present invention that can adjust the arrangement angle and moving distance of the electroplated object can reach about 177 pieces, thereby increasing the manufacturing output while keeping the same space.

[0037] Furthermore, the total length of the plating tank required for plating 44 plating substrates can be reduced to approximately 500 cm, so multiple additional plating production lines can be set up, thereby increasing space utilization.

[0038] The electroplating deviation adjustment unit 240 is provided on the upper side of the transfer unit 220, and controls the mixing nozzle drive of the electroplating tank 100 and the reciprocating horizontal movement of the transfer unit 220 (in the width direction of the electroplating tank) according to the thickness of the electroplated object. Figure 7The position of the plated object within the plating tank is uniformly changed in sequence, thereby adjusting the distance between the mixing nozzles on the left and right side walls of the plating tank and the plated object in the plating tank to adjust the extraction effect 102, thereby adjusting the plating deviation according to the thickness difference of the plated object. To this end, the plating deviation adjustment unit 240 may include a drive motor 241, a speed reducer 242, a rotating shaft 243, a pair of cams 244, a bracket 245, and a transfer unit connecting rod 246.

[0039] The driving motor 241 and the speed reducer 242 are used as a power source for the electroplating deviation adjustment unit and to reduce the rotation speed of the motor.

[0040] In the rotating shaft 243, its length corresponds to the front-to-back length of the electroplating tank 100, and is arranged on the upper side of the transfer part 220. It is supported and fixed in a rotatable manner by a separate rotating shaft fixing part 243a arranged at a specified interval by a separate bracket set on the ceiling or the ground, and is rotated by the driving motor 241 and the reducer 242.

[0041] A pair of cams 244 are respectively provided at both ends of the rotating shaft 243 and rotate integrally with the rotating shaft.

[0042] The bracket 245 is connected to the rear side of each cam 244 to support the cam and convert the rotational motion of the cam into linear motion.

[0043] The transfer link 246 has a length corresponding to the front-to-back length of the plating tank 100. Its ends are directly connected to the brackets 245, synchronizing the linear motion of the two brackets 245 generated by the cams 244. On one side of the upper portion of the transfer unit 220, parallel to the rotation axis 243, it is directly connected to the transfer unit 220 via at least one flat plate 246a. The linear motion of the brackets 245 allows for reciprocating horizontal movement of the transfer unit 220 in the left-right direction of the plating tank, thereby causing the transfer unit 220 to reciprocate horizontally in the left-right direction of the plating tank. The horizontal movement speed of this transfer link can be within a range of 0 to 250 mm / sec.

[0044] The plating deviation adjustment unit 240 constructed as above can adjust the driving speed of the driving motor 241 according to the thickness of the electroplated object gripped by the variable angle gripping unit 210, thereby controlling the left and right reciprocating horizontal movement of the transfer unit 220 and adjusting the plating deviation of the electroplated object in the plating tank.

[0045] Furthermore, the plating deviation adjustment unit 240 constructed as described above can also adjust the plating deviation of the object to be plated in the plating tank by controlling the driving of the mixing flow nozzle of the plating tank 100 and the left-right reciprocating horizontal movement of the transfer unit 220 according to the aspect ratio of the object to be plated held by the variable angle holding unit 210. In this case, for example, when the aspect ratio of the object to be plated held by the variable angle holding unit 210 is 10:1 or less, the driving of the mixing flow nozzle of the plating tank 100 is stopped and only the left-right reciprocating horizontal movement of the transfer unit 220 is controlled to adjust the plating deviation of the object to be plated in the plating tank.

[0046] The following describes comparative examples and examples of the present invention. These comparative examples and examples are merely illustrative of the present invention, and it is obvious to those skilled in the art that the scope of the present invention should not be construed as being limited to these comparative examples and examples.

[0047] Comparative example and embodiment: According to the presence or absence of left / right movement of the electroplated object, an electroplating layer (a1) is manufactured. A plating tank A and a plating tank B are prepared. 120 g / L of sulfuric acid, 60 g / L of copper sulfate, 45 ppm of chloride ions, 2 ml / L of brightener and 20 ml / L of wetting agent are added to each plating tank A and each plating tank B respectively, thereby forming a plating solution with the same component content and conditions. In each plating tank A and each plating tank B, a bath temperature of 22°C and a current density of 0.7 A / dm 2 , electroplating conditions of anodes made of phosphorus-containing copper.

[0048] (a2) Substrates 1 and 2 having a thickness of 6.3T and formed with plating holes of 150 μm (aspect ratio: 42:1) were prepared by a drilling process.

[0049] (a3) Substrate 1 and substrate 2 are respectively placed in electroplating tank A and electroplating tank B. After driving the mixed flow nozzle in each electroplating tank under the same conditions (the vibration frequency of the mixed flow nozzle is 60 Hz), electroplating tank A causes substrate 1 to move back and forth at a speed of 50 mm / min along the length direction of the electroplating tank, and electroplating tank B causes substrate 2 to move back and forth at a speed of 50 mm / min and left and right at a speed of 20 mm / sec along the length direction of the electroplating tank. Electroplating is performed in the same manner for 120 minutes to manufacture sample substrates 1 (moving back and forth along the length direction of the electroplating tank) and sample substrate 2 (moving back and forth along the length direction of the electroplating tank and left and right along the width direction of the electroplating tank) with electroplated layers. A microscope is used to magnify and photograph the cross-sections of the electroplated layers of each sample substrate 1 and sample substrate 2.

[0050] Figure 8a and Figure 8bThe enlarged cross-sectional photos of the upper, middle and lower ends of each sample substrate 1 and sample substrate 2 are shown. Figure 8a Compared with the comparative example shown (where the substrate is moved back and forth along the length of the plating tank to form a plating layer), it can be seen that Figure 8b The embodiment shown (applying the vertical continuous electroplating device of the present invention to move the substrate back and forth along the length direction of the electroplating tank while moving it left and right along the width direction of the electroplating tank to form an electroplating layer) is more effective in adjusting the influence of the mixed flow nozzle, so that not only the thickness of the electroplating layer at the upper and lower ends of the hole can be made uniform, but also the thickness of the electroplating layer in the middle part can be made uniform.

[0051] This vertical continuous electroplating device of the present invention that can adjust the electroplating deviation according to the thickness difference of the electroplated object can be applied to the panel electroplating device of the conveyor belt type that is hung and supported by vertically grasping at least two positions of the electroplated object in the electroplating tank from the top to realize, and the increased oscillation function can improve the problems of the existing electroplating device, that is, improve the surface electroplating uniformity and the electroplating uniformity in the hole. In addition, the existing device only has the ability to move in a straight line due to the reason of the conveyor belt, and the electroplating device of the present invention can minimize the device and adjust the amount of the bathing solution by repeatedly advancing and retreating a specified distance and advancing, and can realize the environmental protection of the device and carry out uniform electroplating. In addition, when the electroplated object is electroplated, the electroplating device of the present invention can change the angle and install the electroplating panel on the conveyor belt electroplating device, thereby increasing the electroplating productivity by dense configuration.

[0052] As described above, according to the present invention, the advantage of the present invention is that the object to be electroplated in the plating tank is arranged in a manner that allows it to be displaced at an angle along the diagonal direction, the lead-out effect based on the thickness of the object to be electroplated can be adjusted by horizontally moving the object to be electroplated left and right in the plating tank, and the total moving distance can be extended by moving horizontally back and forth and gradually moving forward, thereby maximizing the lead-out effect of the object to be electroplated in the plating tank, thereby increasing manufacturing capacity and improving quality.

[0053] Furthermore, according to the present invention, the present invention has the advantage that the size of the electroplating tank can be reduced by improving the space utilization under the same space, and multiple electroplating production lines can be set up, which can be advantageously applied to the production of multiple varieties and small quantities.

[0054] As described above, the present invention is described by way of limited embodiments and accompanying drawings. However, the present invention is not limited to the embodiments described above. Those skilled in the art will be able to make various modifications and variations based on the description. Therefore, the subject matter of the present invention is to be understood solely by reference to the appended claims, and all equivalent or equivalent variations thereof fall within the scope of the subject matter of the present invention.

Claims

1. A vertical continuous electroplating apparatus capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object, comprising an electroplating tank filled with electroplating solution and provided with mixing flow nozzles on the left and right side walls, wherein the mixing flow nozzles are used to circulate the electroplating solution, remove air attached to the electroplated object, and maximize the electroplating in the hole, characterized in that: It includes a holding and transferring part, which can be lifted and moved horizontally on the upper part of the electroplating tank and can vertically hold the electroplated object in a manner that can be lifted or changed in angle on the upper part of the electroplating tank and energize it, and is used to transfer the electroplated object back and forth and left and right and gradually advance the electroplated object in the electroplating tank, and adjust the displacement and moving distance of the electroplated object in the electroplating tank according to the thickness of the electroplated object to adjust the plating deviation of the electroplated object.

2. The vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to claim 1 is characterized in that: The holding and transferring part further comprises: A variable angle holding portion, which holds the object to be plated vertically at a variable angle at the upper portion of the electroplating tank and energizes the object; The transfer part is capable of moving up and down and horizontally moving forward, backward, left and right on the upper part of the electroplating tank. A pair of transfer parts are arranged in parallel along the length direction of the electroplating tank, horizontally hanging and supporting the angle-changing gripping part, so that the angle-changing gripping part can be moved up and down or horizontally moved forward, backward, left and right; A moving distance adjustment unit is provided on one side of the transfer unit, and adjusts the moving distance of the plated object in the electroplating tank by controlling the forward and backward reciprocating horizontal movement of the transfer unit; and The electroplating deviation adjustment unit is arranged on the upper side of the above-mentioned transfer unit, and controls the mixed flow nozzle drive of the above-mentioned electroplating tank and the left and right reciprocating horizontal movement of the above-mentioned transfer unit according to the thickness of the electroplated object to adjust the electroplating deviation based on the thickness difference of the electroplated object in the electroplating tank.

3. The vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to claim 2, characterized in that: The above-mentioned variable angle gripping portion includes: The bracket is provided with fastening hooks at both ends, is hung and fixed on the transfer part along the width direction of the electroplating tank, and is moved back and forth along the length direction of the electroplating tank by the transfer part and is used to support the load of the electroplated object; A multi-limbed clamp having two or more clamps suspended downward for holding an object to be plated, which simultaneously grasps and fixes an upper end portion of an object to be plated in a plating tank at multiple locations; and The fixing screw is fixed by assembling with a multi-limbed clamp at the bottom of the bracket, or can be separated in a rotatable manner.

4. The vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to claim 3 is characterized in that: In the above bracket, a vertical connecting rod of a predetermined length is vertically extended from the center of gravity to the lower part thereof, and a fixing screw assembly groove is formed at the center of the body at the lower end of the vertical connecting rod and extends from the lower end to the inner side of the body so as to be assembled with the fixing screw. A clamp rotation guide groove is formed on the body side of the lower end of the vertical link with a fixing screw assembly groove, and a part of the body cross section is removed to form a semicircular shape.

5. The vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to claim 4 is characterized in that: In the above-mentioned multi-limb type clamp, a plurality of clamps are arranged at equal intervals while being supported by a horizontal connecting rod. A fixing screw through hole is formed at the center of gravity of the horizontal connecting rod, which passes through the inner side of the main body vertically so that it can be assembled with the fixing screw. On one side of the upper end body of the horizontal connecting rod having a through hole for fixing screws, a portion of the cross section of the body is processed to protrude upward to form a rotating support protrusion that is guided by the clamp rotation guide groove of the bracket and can rotate horizontally. The rotating support protrusion is fan-shaped so that its center angle forms a specified angle of 90°.

6. The vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to claim 5, characterized in that: The fixing screw is formed by a screw body, and the length of the screw body is formed to be able to pass through the fixing screw through hole of the multi-limbed clamp and the height of the rotation support protrusion or the clamp rotation guide groove and be assembled to the uppermost end of the fixing screw assembly groove of the bracket.

7. The vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to claim 6, characterized in that: In the above-mentioned fixing screw, the outer diameter is formed so as to be able to be screw-assembled with the fixing screw assembly groove of the bracket and the fixing screw through-hole of the multi-limb clamp, and a thread with a size that can be assembled along their screw grooves is formed on the outer peripheral surface, and is assembled or separated together with the fixing screw assembly groove of the lower end of the vertical connecting rod through the fixing screw through-hole of the horizontal connecting rod.

8. The vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to claim 2, characterized in that: In the above-mentioned moving distance adjustment part, when controlling the forward and backward reciprocating horizontal movement of the above-mentioned transfer part, in each action cycle, the moving distance of the electroplated object in the plating tank during the entire electroplating process is extended by repeating the action of rotating the motor forward in the first 1 / 2 time to move the transfer part forward to the first position and rotating the motor reversely in the next 1 / 2 time to move the transfer part backward to the second position shorter than the first position.

9. The vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to claim 2, characterized in that: The electroplating deviation adjustment unit includes: A drive motor and a reducer, wherein the drive motor serves as a power source and the reducer is used to reduce the rotational speed; A rotating shaft, the length of which corresponds to the front-to-back length of the electroplating tank, is provided on one side of the upper portion of the transfer portion, is rotatably supported and fixed by a separate rotating shaft fixing member disposed separately, and is rotated by a drive motor and a reducer; A pair of cams are respectively provided at the two ends of the rotating shaft and rotate integrally with the rotating shaft; a bracket connected to the rear side of each cam, used to support the cam and convert the rotational motion of the cam into linear motion; and The transfer part connecting rod has a length corresponding to the front-to-back length of the electroplating tank, and its two ends are directly connected to each bracket, so that the linear motion of the two brackets based on each cam is synchronized. On the upper side of the transfer part, it is parallel to the rotation axis and is directly connected to the transfer part through at least one flat plate. Through the linear motion of the bracket, it moves back and forth horizontally along the left and right directions of the electroplating tank, and the transfer part moves back and forth horizontally along the left and right directions of the electroplating tank.

10. The vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to claim 9, characterized in that: The plating deviation adjusting unit adjusts the plating deviation of the object to be plated in the plating tank by controlling the driving speed of the driving motor and the left-right reciprocating horizontal movement of the transfer unit according to the thickness of the object to be plated held by the angle-variable gripping unit.

11. The vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to claim 9, characterized in that: The plating deviation adjusting unit adjusts the plating deviation of the object to be plated in the plating tank by controlling the driving of the mixed flow nozzle of the plating tank and the left and right reciprocating horizontal movement of the transfer unit according to the aspect ratio of the object to be plated held by the variable angle holding unit.

12. The vertical continuous electroplating device capable of adjusting the electroplating deviation according to the thickness difference of the electroplated object according to claim 11, characterized in that: In the above-mentioned electroplating deviation adjustment part, when the aspect ratio of the object to be electroplated held by the above-mentioned variable angle holding part is less than 10:1, the mixed flow nozzle of the electroplating tank adjusts the electroplating deviation of the object to be electroplated in the electroplating tank by stopping driving and controlling the left and right reciprocating horizontal movement of the above-mentioned transfer part.

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