Control device of heating and ventilation system and heating and ventilation system

Abstract

The embodiment of the invention provides a control device of a heating and ventilation system and the heating and ventilation system. The control device comprises a shell, a control module and a control module, a containing cavity is formed in the shell, and the shell is provided with an operation opening communicating with the containing cavity; the middle partition plate is located in the containing cavity and divides the containing cavity into at least a first chamber and a second chamber, and the first chamber is communicated with the operation opening; the electric control assembly is located in the first cavity, the electric control assembly comprises a circuit substrate, at least one plugging port and at least one first-class electrical component, the plugging port and the first-class electrical component are arranged on the first side surface of the circuit substrate, the electric control assembly further comprises a heat dissipation module, the heat dissipation module makes contact with the heat dissipation surface of the first-class electrical component, and the electric control assembly is installed on the middle partition plate; the at least one plug port is close to the operation port relative to the heat dissipation module. According to the technical scheme, identification and installation of the plugging port are facilitated, and maintenance is facilitated.

Description

Technical Field

[0001] The present disclosure relates to the technical field of HVAC control, and in particular to a control device for a HVAC system and a HVAC system. Background Art

[0002] Refrigerant heat dissipation technology and air cooling technology are widely used in air-conditioning outdoor unit systems. Compared with air cooling, refrigerant heat dissipation has more efficient heat transfer efficiency and better heat dissipation effect. It can ensure that high-power devices can operate reliably and stably under high temperature and high load conditions, greatly improving the high-temperature cooling effect of the air-conditioning system.

[0003] In existing refrigerant cooling technologies, electronic control components are primarily installed in two orientations: inverted mounting and front-facing vertical mounting. In the inverted mounting method, the connectors in the electronic control components, such as the temperature sensor port and the electronic expansion valve port, are placed upside down, making it difficult to identify each port during installation and maintenance, which is inconvenient. Front-facing vertical mounting, on the other hand, increases costs. Summary of the Invention

[0004] The embodiments of the present disclosure provide a control device for a HVAC system and a HVAC system to solve or alleviate one or more technical problems in the prior art.

[0005] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a control device for a heating and ventilation system, comprising:

[0006] The housing has an accommodating cavity formed therein and is provided with an operating port communicating with the accommodating cavity;

[0007] a middle partition, located in the accommodating cavity and dividing the accommodating cavity into at least a first chamber and a second chamber, wherein the first chamber is communicated with the operation port;

[0008] The electronic control component is located in the first cavity. The electronic control component includes a circuit substrate, at least one plug-in port arranged on the first side surface of the circuit substrate and at least one first-class electrical component. It also includes a heat dissipation module. The heat dissipation module is in contact with the heat dissipation surface of the first-class electrical component. The electronic control component is installed on the middle partition, and at least one plug-in port is close to the operation port relative to the heat dissipation module.

[0009] In some embodiments, the shell includes a support wall arranged opposite to the operating port, and the control device also includes a condenser located in the second chamber. The first part of the condenser is arranged along the support wall, and the first connection port on the first part faces the second chamber. The first connection port is away from the operating port relative to the heat dissipation module. The heat dissipation module includes a refrigerant heat dissipation pipe, and one end of the refrigerant heat dissipation pipe is connected to the first connection port through a first pipeline.

[0010] In some embodiments, it also includes a first expansion valve located in the first chamber, the first expansion valve is far away from the operation port relative to the heat dissipation module, and the other end of the refrigerant heat dissipation pipe is connected to the first port of the first expansion valve through a second pipeline.

[0011] In some embodiments, the first expansion valve and the first connection port are both located on the second side of the electronic control component, and the two ports of the refrigerant heat dissipation pipe are both arranged toward the second side of the electronic control component.

[0012] In some embodiments, the middle partition includes a first partition, a second partition, and a third partition connected in sequence from the support wall toward the operating port. The first partition and the third partition are both perpendicular to the support wall. The second partition is inclined relative to the support wall so that the part of the first chamber separated by the second partition is open toward the operating port. The electronic control component is installed on the third partition, and the heat dissipation module is arranged along the edge of the circuit substrate facing the second partition.

[0013] In some embodiments, the circuit substrate includes a first edge and a second edge arranged opposite to each other, the first edge is closer to the operating port relative to the second edge, and at least one plug-in port includes at least two first-type control ports, and the at least two first-type control ports are arranged along the first edge.

[0014] In some embodiments, the at least two first-type control ports include at least two of a valve port, a sensor port, and a fan control port.

[0015] In some embodiments, the at least one plug port further comprises a power port, the circuit substrate further comprises a third edge and a fourth edge connecting the first edge and the second edge, and the power port is closer to the third edge relative to the heat dissipation module;

[0016] The at least one plug port further includes a compressor control port, which is closer to the fourth edge than the first type of control port and closer to the heat dissipation module than the first type of control port.

[0017] In some embodiments, the electronic control component also includes a common-mode inductor and / or a safety capacitor arranged on the first side surface of the circuit substrate, the common-mode inductor and / or the safety capacitor are close to the third edge relative to the heat dissipation module, and the common-mode inductor and / or the safety capacitor are close to the second edge relative to the power port.

[0018] In some embodiments, the electronic control component also includes a first inverter module arranged on the first side surface of the circuit substrate, the first inverter module is close to the fourth edge relative to the first type of control port, the first inverter module is close to the first edge relative to the heat dissipation module, and the compressor control port is located between the first inverter module and the heat dissipation module.

[0019] In some embodiments, the electronic control component further includes a power factor correction (PFC) inductor and an electrolytic capacitor disposed on the first side surface of the circuit substrate, and the PFC inductor and the electrolytic capacitor are both located between the first type control port and the heat dissipation component.

[0020] In some embodiments, the electrolytic capacitor is closer to the fourth edge of the circuit substrate than the PFC inductor.

[0021] In some embodiments, the electronic control component includes a rectifier module, a power factor correction module, and a second inverter module. The output side of the rectifier module is electrically connected to the power factor correction module, the input side of the second inverter module is electrically connected to the power factor correction module, and the output side of the second inverter module is electrically connected to the compressor control port in the electronic control component.

[0022] In some embodiments, the power factor correction module includes a PFC inductor, a first transistor, a first diode, and an electrolytic capacitor, the first output terminal of the rectifier module is connected to the collector of the first transistor, the second output terminal of the rectifier module is connected to the emitter of the first transistor, and the PFC inductor is connected between the first output terminal of the rectifier module and the collector of the first transistor;

[0023] The first plate and the second plate of the electrolytic capacitor are respectively connected to the two input ends of the second inverter module, the positive electrode and the negative electrode of the first diode are respectively connected to the collector of the first transistor and the first plate of the electrolytic capacitor, and the emitter of the first transistor is also connected to the second plate of the electrolytic capacitor.

[0024] In some embodiments, the first type of electrical components includes at least one of a rectifier module, a first transistor, a first diode, and a second inverter module.

[0025] In some embodiments, the rectifier module, the first transistor, the first diode, and the second inverter module are arranged along an extension direction of the heat dissipation module.

[0026] In some embodiments, the electronic control assembly includes a packaged device, the packaged device includes at least two of a rectifier module, a second inverter module, a first transistor, and a first diode, and the first type of electrical component includes the packaged device.

[0027] In some embodiments, the heat dissipation module includes a radiator, a refrigerant heat dissipation pipe and a cover plate, the cover plate is covered on the radiator, an accommodating channel is provided between the radiator and the cover plate, and the refrigerant heat dissipation pipe is passed through the accommodating channel.

[0028] In some embodiments, the refrigerant heat dissipation pipe is arranged in a circuitous shape between the radiator and the cover plate.

[0029] In some embodiments, the refrigerant heat dissipation pipe is U-shaped.

[0030] In some embodiments, the first type of electrical component includes a main body and a pin portion, the pin portion is connected to the circuit substrate, and the control device also includes an insulating support plate, which is arranged between the main body and the circuit substrate so that there is a preset distance between the main body and the circuit substrate.

[0031] In some embodiments, the main body of the first type of electrical component is fixed to the first surface of the heat sink by a first screw.

[0032] In some embodiments, the insulating support plate is provided with a first positioning piece, and at least one first-category electrical component is provided with a second positioning piece, and the second positioning piece matches and corresponds to the first positioning piece.

[0033] In some embodiments, the method further includes a second screw that securely connects the circuit substrate, the insulating support plate, the main body of the first type electrical component, and the heat sink from the second side surface of the circuit substrate.

[0034] In some embodiments, the system further includes a compressor and a four-way valve located in the first chamber, wherein the second connection port on the first portion faces the second chamber, the second connection port is located away from the operation port relative to the compressor, the exhaust port of the compressor is connected to the first port of the four-way valve via a third pipeline, and the second port of the four-way valve is connected to the second connection port via a fourth pipeline;

[0035] The third port of the four-way valve is connected to the air inlet of the compressor, the fourth port of the four-way valve is used to connect to one end of the indoor heat exchange module, and the second port of the first expansion valve is used to connect to the other end of the indoor heat exchange module.

[0036] In some embodiments, the condenser further comprises a second portion connected to the first portion, the housing further comprises a first side wall opposite to the middle partition, the second chamber is located between the first side wall and the middle partition, the second portion is disposed along the first side wall, and the control device further comprises a fan located in the second chamber, the fan being closer to the operating port relative to the first portion of the condenser;

[0037] The shell also includes a second side wall opposite to the middle partition, the first chamber is located between the second side wall and the middle partition, and a first connecting member and a second connecting member are provided on the second side wall. The inner end of the first connecting member is connected to the second port of the first expansion valve, the inner end of the second connecting member is connected to the fourth port of the four-way valve, and the outer end of the first connecting member and the outer end of the second connecting member are used to connect to the indoor heat exchange module.

[0038] As a second aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a HVAC system, including the control device in any embodiment of the present disclosure.

[0039] According to the technical solution of the embodiment of the present disclosure, in the control device, the plug-in port is close to the operating port relative to the heat dissipation module. The heat dissipation module is used to dissipate heat. Therefore, the surface temperature of the heat dissipation module is relatively high. The plug-in port is arranged to face outward relative to the heat dissipation module. This not only facilitates the identification of the position of each plug-in port and facilitates plugging, but also prevents the operator from touching the surface of the heat dissipation module when operating the plug-in port, thereby avoiding burns and ensuring safe operation.

[0040] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0042] Figure 1 Schematic diagram of a control device for a HVAC system in one embodiment of the present disclosure;

[0043] Figure 2 for Figure 1 A schematic cross-sectional view of the control device shown;

[0044] Figure 3 is a plan view of an electric control component in one embodiment of the present disclosure;

[0045] Figure 4 This is a schematic diagram of the connection of refrigerant circuit pipes in a control device according to an embodiment of the present disclosure;

[0046] Figure 5 for Figure 3 The structural block diagram of the electronic control component shown;

[0047] Figure 6 This is a schematic diagram of a compressor control circuit in an electronic control assembly according to an embodiment of the present disclosure;

[0048] Figure 7 is a cross-sectional schematic diagram of a heat dissipation module in one embodiment of the present disclosure;

[0049] Figure 8 The figure is a schematic diagram of the shape and structure of the refrigerant heat dissipation pipe in the control device according to one embodiment of the present disclosure.

[0050] Description of reference numerals:

[0051] 10. Housing; 11. Support wall; 12. First side wall; 13. Second side wall; 14. Fourth side wall; 21. Condenser; 211. First portion; 212. Second portion; 22. Middle partition; 221. First partition; 222. Second partition; 223. Third partition; 23. Fan; 24. Compressor; 26. First connector; 27. Second connector.

[0052] 40. Electronic control assembly; 41. Circuit board; 42. Connector port; 421. First-class control port; 422. Power port; 423. Compressor control port; 43. Heat dissipation module; 431. Refrigerant heat pipe; 432. Radiator; 433. Cover; 44. Common-mode inductor; 46. First inverter module; 47. Safety capacitor; 48. PFC inductor; 49. Electrolytic capacitor; 51. First pipeline; 52. Second pipeline; 53. Third pipeline; 54. Fourth pipeline;

[0053] 60. Indoor heat exchange module; 70. Class I electrical components; 80. Insulation support plate

[0054] 100. First chamber; 200. Second chamber; 300. Operation port. DETAILED DESCRIPTION

[0055] In the following, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure, and different embodiments may be combined in any manner without conflict. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0056] In order to facilitate the installation and maintenance of an air-conditioning outdoor unit, an embodiment of the present disclosure provides a control device for a HVAC system.

[0057] Figure 1 Schematic diagram of a control device for a HVAC system in one embodiment of the present disclosure. Figure 2 for Figure 1 A cross-sectional diagram of the control device is shown in FIG. Figure 1 and Figure 2 As shown, an embodiment of the present disclosure provides a control device for a heating and ventilation system. The control device may include a housing 10, and a housing cavity is formed inside the housing 10. The housing 10 may include a support wall 11, and the shape of the support wall 11 may be quadrilateral. The housing 10 may also include a first side wall 12, a second side wall 13, a third side wall (not shown in the figure), and a fourth side wall 14 arranged along the circumferential edge of the support wall 11. The first side wall 12 and the second side wall 13 are opposite to each other, and the third side wall and the fourth side wall 14 are opposite to each other.

[0058] The shape of the support wall 11 is not limited to a quadrilateral. In another embodiment, the shape of the support wall 11 can be other polygonal or regular or irregular shapes such as a circle or an ellipse. The side wall is provided along the circumferential edge of the support wall 11. The support wall 11 and the side wall are arranged to form a receiving cavity. It should be noted that, in order to show more clearly, Figure 1 The second side wall 13 and the third side wall are not shown.

[0059] The control device may further include a middle partition 22 and an electronic control assembly 40. The middle partition 22 is located within the accommodating chamber and divides the accommodating chamber into at least a first chamber 100 and a second chamber 200. For example, the middle partition 22 is located between the first sidewall 12 and the second sidewall 13. Thus, the first sidewall 12 and the middle partition 22 are disposed opposite each other, and the second chamber 200 is located between the first sidewall 12 and the middle partition 22; and the second sidewall 13 and the middle partition 22 are disposed opposite each other, and the first chamber 100 is located between the second sidewall 13 and the middle partition 22.

[0060] like Figure 1 and Figure 2 As shown, according to the placement direction of the housing 10, the second chamber 200 and the first chamber 100 can be distributed left and right. Figure 1 In the embodiment, the first chamber 100 is located on the right side of the second chamber 200. When the placement direction of the housing 10 is changed, the first chamber 100 and the second chamber 200 can be distributed up and down. The electronic control component 40 is located in the first chamber 100.

[0061] In order to facilitate the installation and maintenance of the electronic control component 40, the shell 10 is provided with an operation port 300, and the operation port 300 is connected to the accommodating cavity, so that the installation or maintenance personnel can operate or repair the components in the accommodating cavity through the operation port 300. The operation port 300 can be arranged opposite to the support wall 11. For example, the edge of the side wall of the shell 10 opposite to the support wall 11 is enclosed to form the operation port 300, or the shell 10 also includes an encapsulation wall arranged opposite to the support wall 11, and the operation port 300 can be opened on the encapsulation wall. Alternatively, the shell 10 includes a door body arranged opposite to the support wall 11 and capable of opening and closing. After the door body is opened, the door frame forms the operation port 300.

[0062] In order to facilitate installation and maintenance of the electronic control component 40 , the first chamber 100 may be in communication with the operation port 300 .

[0063] Figure 3: This is a planar schematic diagram of an electric control component in one embodiment of the present disclosure. The electric control component 40 includes a circuit substrate 41, at least one plug port 42 and at least one first-class electrical component 70. The at least one plug port 42 and the at least one first-class electrical component 70 are both arranged on the first side surface of the circuit substrate 41. The electric control component 40 also includes a heat dissipation module 43, which contacts the heat dissipation surface of the first-class electrical component 70. The plug port 42 is used to connect to the second-class electrical component, such as sensors, valves and other electrical components. The first-class electrical component 70 can be an electrical component with relatively high power. During operation, the first-class electrical component 70 needs to be cooled to ensure that it can operate normally. The surface of the heat dissipation module 43 can be in direct contact with the heat dissipation surface of the first-class electrical component 70, or can be in contact through a heat-conducting medium, so that the heat dissipation module 43 can dissipate heat from the first-class electrical component 70.

[0064] like Figure 1 and Figure 2 As shown, the electronic control assembly 40 is mounted on the middle partition 22, with the surface of the circuit substrate 41 opposite the first side surface facing the middle partition 22. Consequently, when the electronic control assembly 40 is mounted on the middle partition 22, the plug-in ports 42 and the first type of electrical components 70 face outward, making it easier to identify the plug-in ports 42 and facilitating heat dissipation. To further facilitate installation and maintenance, the electronic control assembly 40 is mounted on the middle partition 22, with at least one plug-in port 42 positioned closer to the operating port 300 than the heat dissipation module 43. The operating port 300 can be considered the outside, so the plug-in port 42 is closer to the outside than the heat dissipation module 43, while the heat dissipation module 43 is located inward of the plug-in port 42.

[0065] When the control device is working, the heat dissipation module 43 is used to dissipate heat. Therefore, the surface temperature of the heat dissipation module 43 is relatively high. The plug-in ports 42 are arranged to face outward relative to the heat dissipation module 43. This not only facilitates the identification of the positions of the plug-in ports 42 and facilitates plugging, but also prevents the operator from touching the surface of the heat dissipation module 43 when operating the plug-in ports 42, thereby avoiding burns and ensuring safe operation.

[0066] like Figure 1 and Figure 2 As shown, the control device further includes a condenser 21, which is located in the second chamber 200. A first portion 211 of the condenser 21 is arranged along the support wall 11. A first connection port is provided on the first portion 211, and the first connection port faces the second chamber 200. The first connection port is away from the operation port 300 relative to the heat dissipation module 43, that is, the first connection port is located on the inner side of the heat dissipation module 43. For example, Figure 2As shown, the first connection port can be set on the end face of the first part 211 opposite to the middle partition 22. The middle partition 22 is provided with a first through hole corresponding to the first connection port, and the first connection port can enter the first chamber 100 through the first through hole.

[0067] The heat dissipation module 43 includes a refrigerant heat dissipation pipe 431, one end of which is connected to the first connection port via a first pipe 51. Figure 4 The refrigerant flows through the condenser 21 and can flow into the refrigerant heat dissipation pipe 431 through the first pipe 51 , so that the refrigerant in the refrigerant heat dissipation pipe 431 can dissipate heat to the heat dissipation module 43 , thereby achieving refrigerant heat dissipation and improving heat dissipation efficiency.

[0068] The first connection port is located on the inner side of the heat dissipation module 43. Figure 1 and Figure 2 The end surface DB where the first connection port is located is shown in FIG. This allows both the first connection port and the heat dissipation module 43 to be located inside the plug port 42, significantly reducing the distance between the heat dissipation module 43 and the first connection port. This reduces the length of the first conduit 51 and lowers costs. Furthermore, the first conduit 51 is located inside the plug port 42, preventing operators from touching the first conduit 51 when operating the plug port 42.

[0069] The control device may further include a first expansion valve EVX, which is located in the first chamber 100. The first expansion valve EVX is located away from the operation port 300 relative to the heat dissipation module 43, so that the first expansion valve EVX is located inside the heat dissipation module 43. The other end of the refrigerant heat dissipation pipe 431 can be connected to the first port of the first expansion valve EVX through the second pipe 52, as shown in FIG. Figure 4 The first expansion valve EVX and the heat dissipation module 43 are both located inside the plug port 42, so that the distance between the heat dissipation module 43 and the first expansion valve EVX is greatly reduced, thereby reducing the length of the second pipeline 52 and reducing costs.

[0070] To further facilitate the connection between the first pipeline 51 and the second pipeline 52, the first expansion valve EVX and the first connection port are both located on the second side of the electronic control assembly 40, and both ports of the refrigerant heat dissipation pipe 431 are both oriented toward the second side of the electronic control assembly 40. In other words, the two ports of the refrigerant heat dissipation pipe 431, the first expansion valve EVX, and the first connection port are all located on the same side of the electronic control assembly 40, further facilitating the connection between the first pipeline 51 and the second pipeline 52 and reducing their lengths.

[0071] The second side direction of the electric control component 40 may be a direction located on one side of the electric control component 40 in the first direction. The first direction is the extending direction of the middle partition 22 perpendicular to the depth direction of the accommodating cavity. The depth direction of the accommodating cavity is the direction in which the operation port 300 points to the support wall 11, i.e. Figure 1 The direction of the Y axis; the first direction is Figure 1 The direction of the Z axis in . Figure 2 In the embodiment, the second side direction of the electric control component 40 is the lower side direction of the electric control component 40. The second side direction of the electric control component 40 may be the direction of the electric control component 40 toward the fourth side wall 14.

[0072] Figure 4 This is a schematic diagram of the refrigerant circuit pipeline connection in the control device of an embodiment of the present disclosure. The control device may also include a compressor 24 and a four-way valve 25, both of which are located in the first chamber 100. A second connection port is also provided on the first part 211 of the condenser 21. The second connection port faces the first chamber 100. For example, the second connection port can be provided on the end surface DB of the first part 211 opposite to the middle partition 22, and the middle partition 22 is provided with a second through hole corresponding to the second connection port, and the second connection port can enter the first chamber 100 through the second through hole. The second connection port is away from the operating port 300 relative to the compressor, so that the second connection port is located on the inner side of the compressor. The exhaust port of the compressor 24 is connected to the first port A of the four-way valve 25 through the third pipeline 53, and the second port B of the four-way valve 25 is connected to the second connection port through the fourth pipeline 54.

[0073] The third port C of the four-way valve 25 is connected to the air inlet of the compressor 24, the fourth port D of the four-way valve 25 is used to connect to one end of the indoor heat exchange module 60, and the second port of the first expansion valve EVX is used to connect to the other end of the indoor heat exchange module 60. Figure 4 The connection state of the four-way valve 25 is the cooling state. In the heating state, the first port of the four-way valve 25 is connected to the fourth port, and the second port of the four-way valve 25 is connected to the third port.

[0074] It can be seen that the refrigerant heat dissipation pipe 431 is connected between the condenser 21 and the first expansion valve EVX. Whether in cooling or heating state, the refrigerant temperature at this position is lower. Using the refrigerant at this position for heat dissipation can achieve better heat dissipation effect.

[0075] In the embodiment of the present disclosure, the first connection port and the second connection port are both facing the first chamber 100, and the compressor and the four-way valve 25 are also located in the first chamber 100. Therefore, the connecting pipelines in the control device are all located in the first chamber 100, which facilitates the connection and maintenance of each pipeline.

[0076] like Figure 1 and Figure 2 As shown, the condenser 21 also includes a second part 212 connected to the first part 211, and the second part 212 can be arranged along the first side wall 12. The control device also includes a fan 23, and the fan 23 is located in the second chamber 200. The fan 23 is close to the operation port 300 relative to the first part 211 of the condenser 21. The condenser 21 exchanges heat with the environment in the second chamber 200 through the high-speed operation of the fan 23, so that the temperature of the refrigerant flowing out of the first connection port is relatively low in the cooling mode. The refrigerant with a lower temperature flows into the refrigerant heat dissipation pipe 431 through the first connection port and the first pipeline 51, and dissipates heat to the first type of electrical components 70 through the heat dissipation module 43.

[0077] In order to achieve the connection with the indoor heat exchange module 60, a first connecting member 26 and a second connecting member 27 may be provided on the second side wall 13. Figure 4 The inner end of the first connector 26 is connected to the second port of the first expansion valve EVX, and the inner section of the second connector 27 is connected to the fourth port of the four-way valve 25. The outer ends of the first connector 26 and the second connector 27 are used to connect to the indoor heat exchange module 60. The first connector 26 can include a first valve assembly, and the second connector 27 can include a second valve assembly.

[0078] The control device may further include multiple temperature sensors for detecting temperatures at corresponding locations on the condenser 21. For example, a first temperature sensor T3A may be located at the first connection port to detect the refrigerant temperature at the first connection port, and a second temperature sensor may be located at the second connection port to detect the refrigerant temperature at the second connection port. A third temperature sensor T4 may be located on the side of the fan facing the operating port 300 to detect the ambient temperature.

[0079] In order to further facilitate operation and increase the space of the first chamber 100, the middle partition 22 may include a first partition 221, a second partition 222, and a third partition 223 connected in sequence, and the first partition 221, the second partition 222, and the third partition 223 are connected in sequence from the support wall 11 toward the operation port 300. The first partition 221 and the third partition 223 are both perpendicular to the support wall 11, and the second partition 222 is inclined relative to the support wall 11, so that the portion QB of the first chamber 100 separated by the second partition 222 is open toward the operation port 300. In other words, the portion QB of the first chamber 100 located between the second partition 222 and the second side wall 13 is open toward the operation port 300, as shown in FIG. Figure 2 As shown, Figure 2The dashed box in the figure illustrates the QB portion of the first chamber. In this manner, the first portion 211 of the condenser 21 is installed between the first sidewall 12 and the first partition 221. The distance between the first sidewall 12 and the first partition 221 is relatively large, meeting the size requirements of the first portion 211 of the condenser 21. By arranging the second partition 222 to be inclined, the volume of the first chamber 100 is increased, allowing the first chamber 100 to accommodate components such as the compressor and the four-way valve 25, thereby facilitating operation.

[0080] The third partition 223 is closer to the operation port 300 than the first partition 221 and the second partition 222. The electronic control assembly 40 can be mounted on the third partition 223, making it easier for operators to access the electronic control assembly 40 through the operation port 300, facilitating installation and maintenance. The heat dissipation module 43 can be positioned along the edge of the circuit substrate 41 facing the second partition 222, minimizing the distance from the operation port 300 and facilitating proximity to the first connection port.

[0081] Figure 5 for Figure 3 The structural block diagram of the electronic control components is shown in FIG. Figure 1 、 Figure 3 and Figure 5 As shown, the circuit substrate 41 may include a first edge 41a and a second edge 41b that are arranged opposite to each other. The electronic control component 40 is mounted on the middle partition 22, and the first edge 41a is closer to the operation port 300 than the second edge 41b. The plug-in port 42 includes at least two first-class control ports 421, and the at least two first-class control ports 421 are arranged along the first edge 41a. The first-class control ports 421 may include at least two of the following: a valve port, a sensor port, and a fan control port. The valve port is used to connect valves such as an electronic expansion valve, a solenoid valve, and a four-way valve. The sensor port is used to connect various sensors such as a temperature sensor. The fan control port is used to connect to a fan to control its operation.

[0082] The frequency of failure of components such as the electronic expansion valve, solenoid valve, four-way valve, sensor, and fan is relatively high, so the operation frequency of the first-class control port 421 is relatively high. The first-class control port 421 is set along the first edge 41a, so that the first-class control port 421 is closer to the operation port 300, which further facilitates the operation of the first-class control port 421 and facilitates the maintenance and replacement of components such as the electronic expansion valve, solenoid valve, four-way valve, sensor, and fan.

[0083] The plug port 42 may also include a power port 422, which is used to connect to a power supply. The power supply provides operating power to the electronic control component 40 through the power port 422. The circuit substrate 41 may also include a third edge 41c and a fourth edge 41d. The first edge 41a, the third edge 41c, the second edge 41b, and the fourth edge 41d are sequentially connected. The electronic control component 40 is mounted on the middle partition 22, with the third edge 41c farther from the fourth side wall 14 than the fourth edge 41d. The power port 422 is closer to the third edge 41c than the heat dissipation module 43, and the distance between the power port 422 and the third edge 41c is less than the distance between the heat dissipation module 43 and the third edge 41c.

[0084] The plug port 42 may further include a compressor control port 423, which is closer to the fourth edge 41d than the first type control port 421 and closer to the heat dissipation module 43 than the first type control port 421. This places the compressor control port 423 closer to the compressor, facilitating connection between the compressor and the compressor control port 423.

[0085] The electronic control assembly 40 may further include a common-mode inductor 44 and / or a safety capacitor 47. The common-mode inductor 44 and / or the safety capacitor 47 are disposed on the first side surface of the circuit substrate 41. The common-mode inductor 44 and / or the safety capacitor 47 are positioned closer to the third edge 41c relative to the heat dissipation module 43, and closer to the second edge 41b relative to the power port 422. This arrangement places the common-mode inductor 44 and / or the safety capacitor 47 relatively close to the power port 422, facilitating wiring between the common-mode inductor 44 and / or the safety capacitor 47 and the power port 422.

[0086] The electronic control assembly 40 also includes a first inverter module 46, which is used to provide a drive signal to the fan. The first inverter module 46 is disposed on the first side surface of the circuit substrate 41. The first inverter module 46 is located closer to the fourth edge 41d relative to the first-type control ports 421 and closer to the first edge 41a relative to the heat dissipation module 43. This allows the first inverter module 46 to be closer to the fan control ports in the first-type control ports 421, thereby reducing the wiring length between the first inverter module 46 and the fan control ports.

[0087] like Figure 3 As shown, the compressor control port 423 may be located between the first inverter module 46 and the heat dissipation module 43 .

[0088] The electronic control assembly 40 also includes a power factor correction (PFC) inductor 48 and an electrolytic capacitor 49, which are disposed on the first side surface of the circuit substrate 41. The PFC inductor 48 and electrolytic capacitor 49 are located between the first-type control port 421 and the heat sink assembly, and may also be located between the power port 422 and the compressor port. The electrolytic capacitor 49 is located closer to the fourth edge 41d of the circuit substrate 41 than the PFC inductor 48.

[0089] Figure 6 FIG. 1 is a schematic diagram of a compressor control circuit in an electronic control assembly according to an embodiment of the present disclosure. Figure 3 and Figure 6 As shown, the electronic control assembly 40 may include a compressor control circuit, which includes a rectifier module 71, a PFC module, and a second inverter module 72. The output side of the rectifier module 71 is electrically connected to the PFC module, and the input side of the second inverter module 72 is electrically connected to the PFC module. The output side of the second inverter module 72 is electrically connected to the compressor control port 423 in the electronic control assembly 40, and a drive signal is provided to the compressor through the compressor control port 423. The input side of the rectifier module 71 can be connected to an AC power source.

[0090] The rectifier module 71 includes a high-power rectifier bridge and a high-voltage and large-capacity electrolytic capacitor 49, which is used to rectify the industrial frequency alternating current into direct current for powering subsequent circuits.

[0091] The PFC module includes a PFC inductor 48, a high-power first transistor Q1, and a control and protection circuit, and is used to improve the power factor of the HVAC system, reduce harmonic interference of the power grid, and increase the voltage.

[0092] The second inverter module 72 includes an IPM (Intelligent Power Module) module and its control, protection, and detection circuits. Under the control of the main driver chip, the IPM module is used to convert the rectified and boosted DC power into controllable three-phase AC power and transmit it to the permanent magnet synchronous motor of the compressor, thereby achieving the purpose of regulating the compressor speed.

[0093] The electronic control assembly 40 may also include a switching power supply circuit, a temperature detection circuit, a communication circuit, a valve and fan control circuit, and temperature, voltage, and current protection circuits, which are not listed here one by one.

[0094] Exemplarily, the PFC module includes a PFC inductor 48, a first transistor Q1, a first diode D5, and an electrolytic capacitor 49. A first output terminal of the rectifier module 71 is connected to the collector of the first transistor Q1, and a second output terminal of the rectifier module 71 is connected to the emitter of the first transistor Q1. The PFC inductor 48 is connected between the first output terminal of the rectifier module 71 and the collector of the first transistor Q1.

[0095] The first and second plates of the electrolytic capacitor 49 are respectively connected to the two input terminals of the second inverter module 72. The anode and cathode of the first diode D5 are respectively connected to the collector of the first transistor Q1 and the first plate of the electrolytic capacitor 49. The emitter of the first transistor Q1 is also connected to the second plate of the electrolytic capacitor 49.

[0096] As can be seen from the above, each device in the rectifier module 71, the PFC module, and the second inverter module 72 is a high-power device and needs to be cooled by the heat dissipation module 43. Therefore, the first type of electrical components 70 includes the rectifier module 71, the first transistor Q1, the first diode D5, and at least one of the second transistors in the second inverter module 72. Therefore, the rectifier module 71, the first transistor Q1, the first diode D5, and the second transistor in the second inverter module 72 are located in the area where the heat dissipation module 43 is located, and are located between the circuit substrate 41 and the heat dissipation module 43. The heat dissipation module 43 is in contact with the heat dissipation surfaces of these high-power devices, and the heat dissipation module 43 can dissipate heat for these high-power devices, such as Figure 5 As shown. Figure 3 and Figure 5 In that way, the PFC inductor 48 and the electrolytic capacitor 49 are arranged between the first type control port 421 and the heat dissipation component, so that the PFC inductor 48 and the electrolytic capacitor 49 are closer to the heat dissipation component, which can reduce the length of the connection line between the PFC inductor 48 and the electrolytic capacitor 49 and the related devices in the corresponding area.

[0097] The electrolytic capacitor 49 is connected to the second inverter module 72. Setting the electrolytic capacitor 49 close to the fourth edge 41d of the circuit substrate 41 relative to the PFC inductor 48 can further reduce the distance between the electrolytic capacitor 49 and the second inverter module 72, and further shorten the length of the connection line between the electrolytic capacitor 49 and the second inverter module 72.

[0098] like Figure 5 As shown, the heat dissipation module 43 is located in a predetermined area YA of the circuit substrate 41. The rectifier module 71, the first transistor Q1, the first diode D5, and the second inverter module 72 can be arranged in the predetermined area YA along the extension direction of the heat dissipation module 43. For example, the rectifier module 71, the first transistor Q1, the first diode D5, and the second inverter module 72 can be arranged sequentially along the second edge 41b of the circuit substrate 41, with the second inverter module 72 closer to the fourth edge 41d of the circuit substrate 41. This arrangement corresponds to the connection sequence of the compressor control circuit, facilitating the wiring of the various components in the compressor control circuit.

[0099] In one embodiment, the electronic control assembly 40 may include a packaged device, which includes at least two of the rectifier module 71, the second inverter module 72, the first transistor Q1, and the first diode D5. The first type of electrical component 70 includes the packaged device. Thus, the packaged device integrates at least two of the rectifier module 71, the second inverter module 72, the first transistor Q1, and the first diode D5, reducing the number of components and making the device layout more compact. Exemplarily, the packaged device includes the rectifier module 71, the second inverter module 72, the first transistor Q1, and the first diode D5. In other words, the packaged device is an integrated device of the rectifier module 71, the second inverter module 72, the first transistor Q1, and the first diode D5.

[0100] Figure 7 FIG. 1 is a cross-sectional diagram of a heat dissipation module according to an embodiment of the present disclosure. Figure 3 and Figure 7 As shown, the heat dissipation module 43 may include a radiator 432, a refrigerant heat dissipation pipe 431, and a cover plate 433, with the cover plate 433 covering the radiator 432. A receiving channel is provided between the radiator 432 and the cover plate 433, and the refrigerant heat dissipation pipe 431 is disposed within the receiving channel. The first surface of the radiator 432, facing away from the cover plate 433, contacts the heat dissipation surface of the first type of electrical component 70. This arrangement of the refrigerant heat dissipation pipe 431 within the radiator 432 facilitates the refrigerant to remove heat from the radiator 432, thereby improving the heat dissipation effect.

[0101] In order to improve the heat conduction efficiency between the refrigerant heat dissipation pipe 431 and the radiator 432 , a heat conducting medium may be filled between the refrigerant heat dissipation pipe 431 and the accommodating channel.

[0102] In order to further improve the heat dissipation effect of the refrigerant heat dissipation pipe 431, the refrigerant heat dissipation pipe 431 is arranged in a circuitous shape between the radiator 432 and the cover plate 433. For example, the refrigerant heat dissipation pipe 431 is U-shaped, or the refrigerant heat dissipation pipe 431 is a plurality of connected U-shaped, such as Figure 8 As shown, Figure 8 This is a schematic diagram of the shape and structure of the refrigerant heat dissipation pipe in the control device of an embodiment of the present disclosure. This increases the contact area between the refrigerant heat dissipation pipe 431 and the radiator 432, improving heat dissipation efficiency.

[0103] like Figure 3 As shown, the cover plate 433 is fixed to the radiator 432 by a third screw LD3. A heat conducting medium can also be filled between the cover plate 433 and the radiator 432, so that the heat on the contact surface of the radiator 432 and the cover plate 433 can be transferred to the cover plate 433 for heat dissipation, thereby increasing the heat dissipation area of the radiator 432.

[0104] The cover plate 433 may be a sheet-like structure. To enhance its strength, the surface of the cover plate 433 facing away from the heat sink 432 may be provided with first and second reinforcing ribs 4331, 4332. The first and second reinforcing ribs 4331 and 4332 extend in a direction that intersects. Consequently, the plurality of first and second reinforcing ribs 4331 and 4332 form a mesh structure, further enhancing the strength of the cover plate 433 and, consequently, the structural strength of the heat sink module 43. Furthermore, the first and second reinforcing ribs 4331 and 4332 increase the heat dissipation area of the cover plate 433, improving the heat dissipation efficiency of the heat sink module 43.

[0105] like Figure 7 As shown, the first type electrical component 70 may include a main body 70a and a pin portion 70b, wherein the pin portion 70b is connected to the circuit substrate 41. The control device also includes an insulating support plate 80, which is disposed between the main body 70a and the circuit substrate 41. The insulating support plate 80 ensures a predetermined distance between the main body 70a and the circuit substrate 41, ensuring that the pin portion 70b extends into the circuit substrate 41 to an appropriate extent, thereby achieving a good connection between the pin portion 70b and the circuit substrate 41.

[0106] The main body 70a of the first type electrical component 70 is fixed to the first surface of the heat sink 432 by a first screw LD1, thereby achieving a good connection between the first type electrical component 70 and the heat sink 432. For example, a heat conducting medium may be provided between the heat dissipation surface of the first type electrical component and the heat sink 432 to improve the heat conduction efficiency between the first type electrical component 70 and the heat sink 432.

[0107] The insulating support plate 80 is provided with a first positioning member, and the first type electrical component 70 is provided with a second positioning member. The second positioning member matches and corresponds to the first positioning member to achieve positioning of the insulating support plate 80 and the first type electrical component 70. For example, the first positioning member can be a first positioning hole or a first positioning post, and the second positioning member can be a second positioning hole or a second positioning post. The first positioning member and the second positioning member can both be positioning holes, or one can be a positioning hole and the other a positioning post.

[0108] It is understood that the pin portion 70b of the first type electrical component 70 is soldered to the circuit substrate 41. If only the heat dissipation module 43 is fixedly connected to the main body 70a of the first type electrical component 70, the total weight of the heat dissipation module 43 and the first type electrical component 70 will be large, and the pin portion 70b of the first type electrical component 70 may peel off from the circuit substrate 41. Figure 7As shown, the heat dissipation module 43 may further include a second screw LD2, which fixes the circuit substrate 41, the insulating support plate 80, the main body 70a of the first type of electrical component 70 and the radiator 432 from the second side surface of the circuit substrate 41, so that the circuit substrate 41, the insulating support plate 80, the main body 70a of the first type of electrical component 70 and the radiator 432 are connected as a whole, so that the heat dissipation assembly can be fixed on the circuit substrate 41, thereby improving the stability of the structure.

[0109] In actual implementation, since the sizes of different first-class electrical components 70 may be different, the thickness of the insulating support plate 80 can be set according to the needs of the first-class electrical components 70. Different first-class electrical components 70 can be set in different areas of the insulating support plate 80, and the thickness of different areas may be different.

[0110] The control device of the present invention is introduced above through specific embodiments. By setting the plug-in port 42 to be close to the operating port 300 relative to the heat dissipation module 43, production installation and maintenance are facilitated; by setting the first connection port of the condenser 21 and the first expansion valve EVX on the side of the heat dissipation module 43 away from the operating port 300, the heat dissipation module 43, the first connection port and the first expansion valve EVX are all located on the inner side, the distance between each other is shortened, the length of the first pipeline 51 between the heat dissipation module 43 and the first connection port and the length of the second pipeline 52 between the heat dissipation module 43 and the first expansion valve EVX are shortened, and the cost is reduced; by reasonably arranging the relative positions of the first type control port 421, the power port 422, the fan inverter module, the heat dissipation module 43 and the electrolytic capacitor 49, and the PFC inductor 48 on the circuit substrate 41, the wiring between the various components is facilitated and the length of the connection line is reduced.

[0111] Based on the above inventive concept, an embodiment of the present disclosure further provides a HVAC device, including the control device of the embodiment of the present disclosure.

[0112] The HVAC system may further include an indoor heat exchange module 60, wherein the outer ends of the first connector 26 and the second connector 27 on the second side wall 13 of the housing 10 are respectively connected to the two ports of the indoor heat exchange module 60. Figure 4 shown.

[0113] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0114] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

[0115] In this disclosure, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections, or communication; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on specific circumstances.

[0116] In the present disclosure, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0117] The disclosure above provides many different embodiments or examples for implementing different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, these are merely examples and are not intended to limit the present disclosure. In addition, the present disclosure may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0118] The above are only specific embodiments of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any person skilled in the art can easily conceive of various changes or substitutions within the technical scope disclosed in this disclosure. Different parts of different embodiments can be combined with each other without conflict, and all of these should be included in the scope of protection of this disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A control device for a heating and ventilation system, characterized in that: include: A housing having an accommodating cavity formed therein, and the housing is provided with an operating port communicating with the accommodating cavity; a middle partition, located in the accommodating cavity and dividing the accommodating cavity into at least a first chamber and a second chamber, wherein the first chamber is communicated with the operation port; An electronic control component is located in the first chamber, and the electronic control component includes a circuit substrate, at least one plug-in port arranged on the first side surface of the circuit substrate and at least one first-type electrical component, and also includes a heat dissipation module, which is in contact with the heat dissipation surface of the first-type electrical component. The electronic control component is installed on the middle partition, and the at least one plug-in port is close to the operating port relative to the heat dissipation module.

2. The control device according to claim 1, characterized in that The shell includes a support wall arranged opposite to the operating port, and the control device also includes a condenser located in the second chamber. The first part of the condenser is arranged along the support wall, and the first connection port on the first part faces the second chamber. The first connection port is away from the operating port relative to the heat dissipation module. The heat dissipation module includes a refrigerant heat dissipation pipe, and one end of the refrigerant heat dissipation pipe is connected to the first connection port through a first pipeline.

3. The control device according to claim 2, characterized in that It also includes a first expansion valve located in the first chamber, the first expansion valve is far away from the operation port relative to the heat dissipation module, and the other end of the refrigerant heat dissipation pipe is connected to the first port of the first expansion valve through a second pipeline.

4. The control device according to claim 3, characterized in that The first expansion valve and the first connection port are both located on the second side of the electronic control component, and the two ports of the refrigerant heat dissipation pipe are both arranged toward the second side of the electronic control component.

5. The control device according to claim 2, characterized in that: The middle partition includes a first partition, a second partition and a third partition connected in sequence from the support wall toward the operating port. The first partition and the third partition are both perpendicular to the support wall. The second partition is inclined relative to the support wall so that the part of the first chamber separated by the second partition is open toward the operating port. The electronic control component is installed on the third partition, and the heat dissipation module is arranged along the edge of the circuit substrate facing the second partition.

6. The control device according to claim 1, characterized in that The circuit substrate includes a first edge and a second edge arranged opposite to each other, the first edge is closer to the operation port relative to the second edge, and the at least one plug-in port includes at least two first-type control ports, and the at least two first-type control ports are arranged along the first edge.

7. The control device according to claim 6, characterized in that The at least two first-type control ports include at least two of a valve port, a sensor port, and a fan control port.

8. The control device according to claim 6, characterized in that The at least one plug port further includes a power port, the circuit substrate further includes a third edge and a fourth edge connecting the first edge and the second edge, the power port is closer to the third edge relative to the heat dissipation module; The at least one plug port further includes a compressor control port, which is closer to the fourth edge than the first type of control port and closer to the heat dissipation module than the first type of control port.

9. The control device according to claim 8, characterized in that The electronic control component also includes a common-mode inductor and / or a safety capacitor arranged on the first side surface of the circuit substrate, the common-mode inductor and / or the safety capacitor are close to the third edge relative to the heat dissipation module, and the common-mode inductor and / or the safety capacitor are close to the second edge relative to the power port.

10. The control device according to claim 8, characterized in that The electronic control component also includes a first inverter module arranged on the first side surface of the circuit substrate. The first inverter module is close to the fourth edge relative to the first type control port, and the first inverter module is close to the first edge relative to the heat dissipation module. The compressor control port is located between the first inverter module and the heat dissipation module.

11. The control device according to claim 6, characterized in that The electric control component further includes a power factor correction inductor and an electrolytic capacitor arranged on the first side surface of the circuit substrate, and the power factor correction inductor and the electrolytic capacitor are both located between the first type control port and the heat dissipation component.

12. The control device according to claim 11, characterized in that The electrolytic capacitor is closer to the fourth edge of the circuit substrate than the power factor correction inductor.

13. The control device according to claim 11, characterized in that The electronic control component includes a rectifier module, a power factor correction module and a second inverter module. The output side of the rectifier module is electrically connected to the power factor correction module, the input side of the second inverter module is electrically connected to the power factor correction module, and the output side of the second inverter module is electrically connected to the compressor control port in the electronic control component.

14. The control device according to claim 13, characterized in that The power factor correction module includes the power factor correction inductor, a first transistor, a first diode and the electrolytic capacitor, the first output end of the rectifier module is connected to the collector of the first transistor, the second output end of the rectifier module is connected to the emitter of the first transistor, and the power factor correction inductor is connected between the first output end of the rectifier module and the collector of the first transistor; The first plate and the second plate of the electrolytic capacitor are respectively connected to the two input ends of the second inverter module, the positive electrode and the negative electrode of the first diode are respectively connected to the collector of the first transistor and the first plate of the electrolytic capacitor, and the emitter of the first transistor is also connected to the second plate of the electrolytic capacitor.

15. The control device according to claim 14, characterized in that: The first type of electrical components includes at least one of the rectifier module, the first transistor, the first diode and the second inverter module.

16. The control device according to claim 14, characterized in that The rectifier module, the first transistor, the first diode and the second inverter module are arranged along an extension direction of the heat dissipation module.

17. The control device according to claim 14, characterized in that The electronic control assembly includes a packaged device, which includes at least two of the rectifier module, the second inverter module, the first transistor and the first diode, and the first type of electrical components includes the packaged device.

18. The control device according to any one of claims 1 to 17, characterized in that: The heat dissipation module includes a radiator, a refrigerant heat dissipation pipe and a cover plate. The cover plate is covered on the radiator. An accommodating channel is provided between the radiator and the cover plate. The refrigerant heat dissipation pipe is passed through the accommodating channel.

19. The control device according to claim 18, characterized in that The refrigerant heat dissipation pipe is arranged in a circuitous shape between the radiator and the cover plate.

20. The control device according to claim 19, characterized in that The refrigerant heat dissipation pipe is U-shaped.

21. The control device according to claim 18, characterized in that The first type of electrical component includes a main body and a pin portion, the pin portion is connected to the circuit substrate, and the control device also includes an insulating support plate, which is arranged between the main body and the circuit substrate so that there is a preset distance between the main body and the circuit substrate.

22. The control device according to claim 21, characterized in that The main body of the first type electrical component is fixed to the first surface of the heat sink by a first screw.

23. The control device according to claim 21, characterized in that The insulating support plate is provided with a first positioning piece, and at least one of the first-type electrical components is provided with a second positioning piece, and the second positioning piece matches and corresponds to the first positioning piece.

24. The control device according to claim 21, characterized in that The device further includes a second screw, which fixes and connects the circuit substrate, the insulating support plate, the main body of the first type electrical component and the heat sink from the second side surface of the circuit substrate.

25. The control device according to claim 3, characterized in that The system further includes a compressor and a four-way valve located in the first chamber, wherein a second connection port on the first portion faces the second chamber, the second connection port is located away from the operation port relative to the compressor, an exhaust port of the compressor is connected to the first port of the four-way valve via a third pipeline, and a second port of the four-way valve is connected to the second connection port via a fourth pipeline; The third port of the four-way valve is connected to the air inlet of the compressor, the fourth port of the four-way valve is used to connect to one end of the indoor heat exchange module, and the second port of the first expansion valve is used to connect to the other end of the indoor heat exchange module.

26. The control device according to claim 25, characterized in that The condenser further includes a second portion connected to the first portion, the housing further includes a first side wall opposite to the middle partition, the second chamber is located between the first side wall and the middle partition, and the second portion is disposed along the first side wall, the control device further includes a fan, the fan is located in the second chamber, and the fan is closer to the operation port relative to the first portion of the condenser; The shell also includes a second side wall opposite to the middle partition, the first chamber is located between the second side wall and the middle partition, and a first connecting member and a second connecting member are provided on the second side wall. The inner end of the first connecting member is connected to the second port of the first expansion valve, and the inner end of the second connecting member is connected to the fourth port of the four-way valve. The outer ends of the first connecting member and the second connecting member are used to connect to the indoor heat exchange module.

27. A HVAC system, characterized in that: A control device comprising the control device according to any one of claims 1 to 26.

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