Anti-sputtering device, cleaning device and substrate processing equipment

Abstract

The invention relates to the field of semiconductor device manufacturing, in particular to an anti-sputtering device, a cleaning device and substrate processing equipment. The anti-sputtering device is used for preventing liquid medicine sprayed to the substrate by the nozzle from sputtering into the cavity, and specifically comprises a first protective cover, and the nozzle is arranged in the first protective cover; the second protection cover is arranged on the periphery of the base plate and the first protection cover in a surrounding mode when the nozzle sprays the liquid medicine to the base plate; the relation between the first protective cover and the second protective cover is shown as h / r < H / R, and h is the height from the lower end face of the first protective cover to the substrate; r is the farthest horizontal distance between the nozzle and the edge of the lower end face of the first protective cover; h is the height from the top end of the second protective cover to the substrate; r is the horizontal distance between the top end of the second protective cover and the nozzle. By limiting the positions of the first protective cover and the second protective cover, the anti-splashing device can more effectively prevent the liquid medicine from splashing.

Description

Technical Field

[0001] The present application relates to the field of semiconductor device manufacturing, and specifically to a sputtering prevention device, a cleaning device, and a substrate processing equipment. Background Art

[0002] During semiconductor device manufacturing, the pattern on the photoresist is transferred to the chip surface through a series of steps, including exposure and development. Subsequently, processing steps such as etching or ion implantation are performed to ultimately form the circuit. After etching or ion implantation, the photoresist must be removed from the substrate surface. Because photoresist has a certain degree of adhesion to the underlying film layer, conventional photoresist removal methods can easily result in residual photoresist, which can affect the substrate's yield.

[0003] The current solution to the problem of photoresist residue is to use an SPM (Sulfuric Acid Hydrogen Peroxide Mixture) wet cleaning process to treat the substrate. The specific steps are as follows: hydrogen peroxide is injected into a sulfuric acid solution, where an exothermic reaction occurs to form a high-temperature SPM solution. This SPM solution is then sprayed onto the substrate surface, where it reacts with the photoresist on the substrate, removing it. The substrate surface is then rinsed with deionized water and finally dried.

[0004] Recent research indicates that heating sulfuric acid to a high temperature (e.g., above 180°C) facilitates the removal of photoresist after high-dose ion implantation. The higher the SPM temperature, the more uniform the mixing and the higher the stripping efficiency. However, higher sulfuric acid temperatures increase the severity of liquid splashing, which can impact substrate processing. Summary of the Invention

[0005] In response to the above-mentioned problems, the purpose of the present application is to provide a sputtering prevention device, a cleaning device and a substrate processing equipment.

[0006] To achieve the above objectives, this application provides the following technical solutions:

[0007] An anti-sputtering device for preventing a liquid sprayed onto a substrate from being splashed into a chamber, comprising:

[0008] a first protective cover, configured to allow the nozzle to be disposed within the first protective cover;

[0009] a second protective cover, arranged around the substrate and the first protective cover when the nozzle sprays the liquid medicine onto the substrate;

[0010] The relationship between the first protective cover and the second protective cover is expressed as: h / r<H / R, where h is the height of the lower end surface of the first protective cover from the substrate; r is the farthest horizontal distance between the nozzle and the edge of the lower end surface of the first protective cover; H is the height of the top of the second protective cover from the substrate; R is the horizontal distance between the top of the second protective cover and the nozzle.

[0011] The present application also provides an anti-sputtering device for preventing the liquid sprayed onto the substrate by the nozzle from splashing into the chamber, comprising: a first protective cover for setting the nozzle inside the first protective cover, the first protective cover being provided with a through hole; an exhaust pipe, one end of the exhaust pipe being set on the first protective cover and connected to the through hole; and an exhaust device, the other end of the exhaust pipe being connected to the exhaust device.

[0012] The present application also provides a cleaning device, comprising a spray body, a gas supply pipe, and a liquid supply pipe;

[0013] The spray body includes a first chamber and a second chamber, and is provided with a plurality of liquid outlet holes and a plurality of air outlet holes. The liquid outlet holes are communicated with the first chamber, and the air outlet holes are communicated with the second chamber.

[0014] The liquid supply pipe is connected to the first chamber and is used to supply cleaning liquid to the first chamber;

[0015] The gas supply pipe is connected to the second chamber and is used to supply dry gas to the second chamber.

[0016] The present application also provides a substrate processing device, comprising a nozzle device, a driving device, a rotating lifting device, the above-mentioned anti-sputtering device and / or the above-mentioned cleaning device;

[0017] The driving device is used to drive the rotary lifting device to lift and rotate, the rotary lifting device includes a swing arm, the nozzle device is arranged at the free end of the swing arm, the nozzle device includes a nozzle, and the nozzle is arranged in the anti-splashing device. The cleaning device is used to clean the anti-splashing device.

[0018] Compared with the prior art, this application has the following beneficial effects:

[0019] The anti-sputtering device provided in the present application can more effectively prevent the splashing of the chemical solution by limiting the positions among the first protective cover, the second protective cover and the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0021] Figure 1 A cross-sectional view of the anti-sputtering device provided in this application.

[0022] Figure 2a This is a schematic diagram of the first protective cover structure of Example 1 of the present application.

[0023] Figure 2b This is a cross-sectional view of the first protective cover structure of Example 1 of the present application.

[0024] Figure 2c This is a cross-sectional view of the first protective cover structure of Example 1 of the present application.

[0025] Figure 3a This is another schematic diagram of the first protective cover structure provided in this application.

[0026] Figure 3b This is another cross-sectional view of the first protective cover structure provided in this application.

[0027] Figure 3c This is another cross-sectional view of the first protective cover structure provided in this application.

[0028] Figure 4a This is a schematic diagram of another first protective cover structure provided in this application.

[0029] Figure 4b This is another cross-sectional view of the first protective cover structure provided in this application.

[0030] Figure 4c This is another cross-sectional view of the first protective cover structure provided in this application.

[0031] Figure 4d This is a top view of another first protective cover structure provided in this application.

[0032] Figure 5a This is a schematic structural diagram of the cleaning device of Example 2 of the present application.

[0033] Figure 5b This is a schematic top view of the cleaning device according to the second embodiment of the present application.

[0034] Figure 5c for Figure 5b A partial enlarged schematic diagram.

[0035] Figure 6aThis is a schematic structural diagram of the cleaning device of Example 3 of the present application.

[0036] Figure 6b This is a cross-sectional view of the cleaning device of Example 3 of the present application.

[0037] Figure 6c for Figure 6b A partial enlarged schematic diagram.

[0038] Figure 7a This is a structural schematic diagram of the substrate processing equipment of Example 4 of the present application.

[0039] Figure 7b This is a partial cross-sectional view of the substrate processing equipment structure of the fourth embodiment of the present application.

[0040] Figures 7c to 7e Schematic diagram of different stages in the process flow of the substrate processing equipment provided in this application.

[0041] Figure 8 This is a process flow chart of a substrate processing equipment according to one embodiment of the present application.

[0042] Figure 9a This is a partial schematic diagram of a substrate processing device according to another embodiment of the present application.

[0043] Figure 9b A partial cross-sectional view of a substrate processing apparatus according to another embodiment of the present application.

[0044] Figure 10a This is a structural diagram of another anti-sputtering device provided in this application.

[0045] Figure 10b This is a cross-sectional view of the water vapor separation device provided in this application. DETAILED DESCRIPTION

[0046] The following specific embodiments illustrate the implementation of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this application are limited to this implementation. On the contrary, the purpose of introducing the application in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide an in-depth understanding of the present application, the following description will contain many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other unless there is a conflict.

[0047] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0048] The following will clearly and completely describe the technical solution of this application in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0049] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0050] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0051] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0052] Example 1

[0053] See Figure 1 An embodiment of the present application provides an anti-sputtering device 1 , which includes a first protective cover 11 and a second protective cover 12 .

[0054] In the figure, the nozzle assembly 3 includes a nozzle 31, which is directed toward the inner wall of the first protective cover 11. The second protective cover 12 is disposed within a chamber (not shown). When processing a substrate 4, the substrate 4 is placed within the chamber, and the second protective cover 12 is disposed around the substrate 4 and the first protective cover 11. In other embodiments, the nozzle 31 may be directed toward the substrate 4.

[0055] The nozzle 31 is disposed within the first protective cover 11. The first protective cover 11 is a roughly frustoconical structure, with the maximum diameter of its upper end surface smaller than the maximum diameter of its lower end surface. After the chemical solution is sprayed from the nozzle 31 onto the substrate 4, it splashes back onto the first protective cover 11. The first protective cover 11 acts as a primary protective barrier, preventing the chemical solution sprayed onto the substrate 4 from splashing into the chamber.

[0056] When the nozzle 31 is to spray the liquid medicine onto the substrate 4, the second protective cover 12 is arranged around the outer periphery of the substrate 4 and the first protective cover 11. The second protective cover 12 includes a truncated cone structure 121 and a cylindrical structure 122, and the truncated cone structure 121 is arranged on the cylindrical structure 122. The second protective cover 12 prevents the liquid medicine escaping from the protection area outside the first protective cover 11 from splashing into the chamber. As a second protective barrier, the second protective cover 12 can further prevent the liquid medicine sprayed on the substrate 4 from splashing into the chamber. The first protective cover 11 and the second protective cover 12 form a double protective barrier, which can effectively prevent the liquid medicine from splashing.

[0057] In order to more effectively prevent the liquid medicine from splashing into the chamber, the relationship between the first protective cover 11 and the second protective cover 12 is expressed as follows:

[0058] h / r<H / R, where h is the height between the lower end surface of the first protective cover 11 and the substrate 4; r is the maximum horizontal distance between the nozzle 31 and the edge of the lower end surface of the first protective cover 11; H is the height between the top end of the second protective cover 12 and the substrate 4; R is the horizontal distance between the top end of the second protective cover 12 and the nozzle 31. The top end of the second protective cover 12 refers to its highest position.

[0059] See Figure 2a The first protective cover 11 includes a first structure 111 and a second structure 112 connected in sequence from top to bottom. The first structure 111 is a roughly truncated cone structure, and the second structure 112 is a roughly cylindrical structure. The bottom surfaces of the first structure 111 and the second structure 112 are both annular.

[0060] In actual process, part of the liquid medicine slides down and remains on the annular bottom surface of the first protective cover 11. Specifically, the liquid medicine tends to remain on the bottom surface of the second structure 112. In order to reduce the amount of liquid medicine remaining on the bottom surface of the second structure 112, the thickness of the second structure 112 close to the first structure 111 is greater than the thickness away from the first structure 111. Figure 2b and Figure 2cThe thickness of the second structure 112 gradually decreases toward the substrate 4. A cross-sectional view of the second structure 112, taken perpendicular to the thickness of the second structure 112, shows a triangular cross-section. The angle θ between the inner wall 1121 and the outer wall 1122 of the second structure 112 is such that 0°<θ<180°, and the angle γ between the outer wall 1122 and the horizontal plane is such that 0°<γ<180°. Reducing the thickness of the annular bottom surface of the second structure 112 reduces the amount of residual liquid on the annular bottom surface of the second structure 112.

[0061] Continue reading Figure 2c A reference line AA' is drawn vertically downward through the center point A of the upper end surface of the first protective cover 11, and the first protective cover 11 is divided into a first unit and a second unit by this reference line AA'. In an optional embodiment, the first unit and the second unit are arranged symmetrically. The cross-section of the first protective cover 11 is circular. When the nozzle 31 is positioned directly opposite the substrate 4 during the process, it is preferable that the first unit and the second unit are arranged symmetrically.

[0062] After being splashed, part of the liquid medicine tends to remain at the connection between the outer wall surface of the first structure 111 and the outer wall surface of the second structure 112. In an optional embodiment, refer to Figures 3a-3c , this implementation is similar to Figures 2a-2c The difference between the illustrated embodiments is that the first protective cover 11 also includes a transition structure 113, which is a curved structure. The upper end of the transition structure 113 is connected to the outer wall of the first structure 111, and the lower end of the transition structure 113 is connected to the outer wall of the second structure 112. After the liquid medicine falls back onto the transition structure 113, the liquid medicine flows down more easily through the transition structure 113, thereby further reducing the residual amount of the liquid medicine on the outer wall of the first protective cover 11.

[0063] In an optional embodiment, the transition structure 113 may be a planar structure. The planar structure plays a transition role. After the liquid medicine falls back onto the planar structure, the liquid medicine can flow down more easily through the planar structure.

[0064] During the process, when the nozzle 31 is positioned toward the inner wall of the first protective cover 11, the side of the first protective cover 11 opposite the nozzle 31 is more susceptible to splashing of the chemical solution. Based on the relationship h / r < H / R, increasing r and decreasing h / r improve the effectiveness of blocking chemical solution splashing. In an optional embodiment, the slope of the side of the first structure 111 opposite the nozzle 31 is gentler than that of the other side.

[0065] For details, see Figures 4a-4d , this implementation is similar to Figures 2a-2cThe difference between the illustrated embodiments is that the first unit and the second unit are asymmetrically arranged, the nozzle 31 is arranged toward the first unit, and the overall slope of the first unit is gentler. In the cross-sectional view, the first unit is a semi-ellipse and the second unit is a semi-circle. For the first unit, the horizontal distance r1 between the nozzle 31 and the edge of the lower end face of the first unit is greater than the horizontal distance r2 between the nozzle 31 and the edge of the lower end face of the second unit. According to the above relationship h / r<H / R, in this embodiment, h / r1<H / R, and the first protective cover 11 can effectively block the splashing of the liquid medicine. In a preferred embodiment, h / r1<H / R, and h / r2<H / R, the effect of blocking the splashing of the liquid medicine is better.

[0066] In other embodiments, the first unit may be of other special-shaped structures. This application does not impose any specific restrictions on the structure of the first unit. The anti-sputtering effect can be improved if the horizontal distance r1 between the nozzle 31 and the edge of the lower end surface of the first unit is greater than the horizontal distance r2 between the nozzle 31 and the edge of the lower end surface of the second unit.

[0067] The anti-sputtering device of this embodiment is not limited to being used in a desmearing device, but can also be used in other devices to play an anti-sputtering role, such as being used to remove other organic matter.

[0068] The first protective cover 11 and the second protective cover 12 can be made of PTFE material, quartz material, etc., and the material is selected based on the characteristics of high temperature resistance and corrosion resistance.

[0069] Example 2

[0070] An embodiment of the present application provides a cleaning device 2, which can be used to clean the anti-splash device 1 of the first embodiment.

[0071] See Figures 5a to 5c The cleaning device 2 includes a spray body 21 , a base 22 , a gas supply pipe 23 and a liquid supply pipe 24 .

[0072] The spray body 21 includes a central component 212, a peripheral component 211 and an auxiliary structure 213. The auxiliary structure 213 is fixedly mounted on the base 22, the peripheral component 211 is fixedly mounted on the auxiliary structure 213, and the central component 212 is fixedly mounted on the peripheral component 211. Optionally, the aforementioned "fixed arrangement" can be achieved by welding.

[0073] The base 22 includes a base wall 221 and a recovery chamber 222 formed by the base wall 221. The recovery chamber 222 is used to collect waste liquid after cleaning. The central component 212 includes a central body 2121 and a flow chamber 2122 formed by the central body 2121. The recovery chamber 222 is connected to the flow chamber 2122.

[0074] The peripheral component 211 includes a first portion 2111 and a second portion 2112 connected sequentially from bottom to top. The first portion 2111 and the second portion 2112 may be integrally formed.

[0075] The auxiliary structure 213 surrounds the outer periphery of the first portion 2111. A first groove is formed on the inner wall of the auxiliary structure 213, and the cross-section of the auxiliary structure 213 is roughly L-shaped. The inner wall of the auxiliary structure 213, the outer wall of the first portion 2111, and the bottom surface of the second portion 2112 form a second chamber 214, which is an annular structure. The second portion 2112 is provided with a plurality of annularly arranged air outlet holes 2113, which extend to the bottom surface of the second portion 2112 and communicate with the second chamber 214. A gas supply line 23 communicates with the second chamber 214 to supply dry gas to the second chamber 214.

[0076] The first portion 2111 surrounds the outer periphery of the central component 212. A second groove is formed on the outer wall of the central body 2121. The inner wall of the first portion 2111, the outer wall of the central body 2121, and the bottom of the central body 2121 form a first chamber 215, which is an annular structure. The top surface of the central component 212 is provided with a plurality of liquid outlet holes 2123 arranged in a circular pattern, which communicate with the first chamber 215. A liquid supply line 24 communicates with the first chamber 215 to supply cleaning liquid to the first chamber 215.

[0077] The liquid outlet holes 2123 and the air outlet holes 2113 are arranged in a ring shape, and the first protective cover 11 and the nozzle 31 can be cleaned and dried from all directions.

[0078] The second chamber 214 is arranged around the outer periphery of the first chamber 215, that is, the first chamber 215 is located in the inner ring and the second chamber 214 is located in the outer ring. Cleaning liquid is sprayed from the inner ring, and drying gas is sprayed from the outer ring. The cleaning liquid after rinsing the device to be cleaned is hereinafter referred to as waste liquid. The device to be cleaned, which can be the first protective cover 11 and the nozzle 31 disposed within the first protective cover 11, is first cleaned during the cleaning and drying process. The inner ring liquid outlet 2123 sprays cleaning liquid upward onto the device to be cleaned, and the recovery chamber 222 recovers the waste liquid. After the cleaning step is completed, the drying step is performed. The outer ring gas outlet 2113 sprays drying gas upward to dry the device to be cleaned. The drying gas is typically nitrogen.

[0079] The present application does not impose any limitation on the shape, size, depth, etc. of the first groove structure and the second groove structure.

[0080] It should be noted that the cleaning device 2 of this embodiment can not only be used to clean the anti-sputtering device 1, but can also be used in other application scenarios to clean contaminated devices.

[0081] Example 3

[0082] See Figures 6a to 6c The difference between the cleaning device of this embodiment and the second embodiment lies in the structure of the spraying body.

[0083] The injection body 21 of this embodiment includes a central component 212 and a peripheral component 211. The peripheral component 211 includes a third portion 2111 and a fourth portion 2112. The central component 212 includes a central body 2121 and a flow chamber 2122 enclosed by the central body 2121. The central body 2121 includes a partition 21213, which is inserted between the third portion 2111 and the fourth portion 2112 and fixedly connected to the third portion 2111 and the fourth portion 2112, respectively. A third groove structure 21211 is formed on the outer wall of the central body 2121, corresponding to the fourth portion 2112. A fourth groove structure 21212 is formed on the outer wall of the central body 2121, corresponding to the third portion 2111. The third groove structure 21211 and the fourth groove structure 21212 are separated by the partition 21213. Both the third groove structure 21211 and the fourth groove structure 21212 are annular structures.

[0084] By forming the third groove structure 21211 and the fourth groove structure 21212, the third portion 2111 and the fourth groove structure 21212 enclose a second chamber 214, and the fourth portion 2112 and the third groove structure 21211 enclose a first chamber 215. In this embodiment, the first chamber 215 and the second chamber 214 are both annular structures.

[0085] The top surface of the central component 212 is provided with a plurality of annularly arranged liquid outlet holes 2123 and a plurality of annularly arranged air outlet holes 2113. The liquid outlet holes 2123 communicate with the first chamber 215, and the air outlet holes 2113 communicate with the second chamber 214. In this embodiment, the liquid outlet holes 2123 are located in the inner circle, and the air outlet holes 2113 are located in the outer circle.

[0086] It can be understood that the second chamber 214 in the above-mentioned embodiment 2 and embodiment 3 can also be connected to the liquid supply pipe 24, and the first chamber 215 is connected to the gas supply pipe 23. Accordingly, the liquid outlet 2123 is set in the outer circle and the gas outlet 2113 is set in the inner circle.

[0087] Example 4

[0088] This embodiment provides a substrate processing device, see Figure 7aThe substrate processing apparatus includes the sputtering prevention device 1 of the first embodiment, the cleaning device 2 of the second or third embodiment, a nozzle device 3, a driving device 5, and a rotary lifting device 6. The rotary lifting device 6 includes a swing arm 61. The nozzle device 3 is disposed at the free end of the swing arm 61. The driving device 5 includes a motor 51, a cylinder 52, and a support base 53. The motor 51 and the rotary lifting device 6 are both connected to the support base 53, and the support base 53 is slidably disposed on the cylinder 52. The sputtering prevention device 1 includes a first protective cover 11 and a second protective cover 12.

[0089] See details Figure 7b In one embodiment, the nozzle device 3 includes a nozzle 31, a first fluid tube 32, a second fluid tube 33 and a mixing fluid tube 34. The first fluid tube 32 and the second fluid tube 33 are arranged side by side. The nozzle 31 is arranged in the anti-sputtering device 1, and the nozzle 31 is arranged toward the inner wall of the first protective cover 11. The first fluid tube 32 transmits sulfuric acid, and the second fluid tube 33 transmits hydrogen peroxide. After sulfuric acid and hydrogen peroxide are mixed in the mixing fluid tube 34, they flow through the nozzle 31 and are sprayed onto the substrate 4. It should be noted that the first fluid tube 32 is not limited to transmitting sulfuric acid, and the second fluid tube 33 is not limited to transmitting hydrogen peroxide. In different processes, the first fluid tube 32 is used to transmit the first solution, and the second fluid tube 33 is used to transmit the second solution. The first solution and the second solution are mixed in the mixing fluid tube 34.

[0090] The spray body 21 includes a first chamber 215 and a liquid outlet 2123 communicating with the first chamber 215 for spraying cleaning liquid, and a second chamber 214 and a gas outlet 2113 communicating with the second chamber 214 for spraying drying gas.

[0091] See Figures 7c to 7e , below, taking the degumming process as an example, the process flow of the substrate processing equipment is introduced in detail.

[0092] The motor 51 drives the rotary lifting device 6 to rotate, and the first protective cover 11 and the nozzle device 3 rotate from the initial position to the upper side of the process position along with the swing arm 61. Figure 7c The cylinder 52 drives the swing arm 61 down to the process position, and the nozzle device 3 sprays liquid onto the substrate 4 to remove the photoresist thereon. During the photoresist removal process, the liquid sprayed onto the substrate 4 splashes, and the anti-sputtering device 1 prevents the liquid from splashing into the chamber. The substrate processing equipment of the present application further enhances the blocking effect of the anti-sputtering device 1 by defining the positional relationship between the first protective cover 11, the second protective cover 12, and the substrate 4.

[0093] See Figure 7d After the degumming process is completed, the cylinder 52 drives the rotary lifting device 6 to rise, and the motor 51 drives the rotary lifting device 6 to rotate to the initial position, that is, above the cleaning device 2.

[0094] See Figure 7e The cylinder 52 drives the rotary lifting device 6 to descend again, so that the anti-splashing device 1 enters the cleaning device 2. The cleaning device 2 first cleans the anti-splashing device 1 and then dries the anti-splashing device 1.

[0095] For details, see Figure 7b The second chamber 214 is disposed around the periphery of the first chamber 215, with the inner ring spraying cleaning fluid and the outer ring spraying drying gas. The inner ring's liquid outlet holes 2123 spray cleaning fluid upward. After the cleaning fluid is sprayed onto the first protective cover 11, some of the cleaning fluid continues upward along the surface of the first protective cover 11 due to its inertia. Meanwhile, some of the cleaning fluid splashes back onto the nozzle 31, cleaning it. This ensures that the cleaning fluid sprayed from the liquid outlet holes 2123 covers the largest cleaning area, effectively cleaning the first protective cover 11 and the nozzle 31.

[0096] After the cleaning step is completed, the outer ring outlet 2113 sprays dry gas upward to dry the first protective cover 11 and the nozzle 31, so that the sputtering protection device 1 meets the cleanliness requirements of the process. The dry gas is usually nitrogen.

[0097] Figure 8 A process flow chart of the substrate processing equipment of this embodiment is shown.

[0098] Step S01: the motor 51 drives the swing arm 61 to rotate, and the first protective cover 11 and the nozzle device 3 rotate from the initial position to above the process position along with the swing arm 61;

[0099] In step S02, the cylinder 52 drives the swing arm 61 to descend to the process position, and the nozzle device 3 sprays the chemical solution onto the substrate 4 to start the organic matter removal process;

[0100] Step S03: After the organic matter removal process is completed, the cylinder 52 drives the swing arm 61 to rise, and the motor 51 drives the swing arm 61 to rotate to the initial position;

[0101] In step S04, the cylinder 52 drives the swing arm 61 downward again so that the anti-splashing device 1 enters the cleaning device 2. The cleaning device 2 first cleans the anti-splashing device 1 and then dries it.

[0102] In step S05 , the cylinder 52 drives the swing arm 61 to rise to the initial position and wait for the next process.

[0103] In some process applications, sulfuric acid at a higher temperature is required. Therefore, in order to increase the temperature of the sulfuric acid, in another embodiment of the present invention, the nozzle device 3 further includes a heating module 35 .

[0104] Specific reference Figures 9a-9bThe first fluid pipe 32 is an annular cylindrical structure, and the heating module 35 is disposed inside the first fluid pipe 32. The heating module 35 can be a lamp tube or a heating wire.

[0105] The first fluid pipe 32 includes a first fluid inlet 321 and a first fluid outlet 322. The first fluid pipe 32 is used to transport sulfuric acid, which enters through the first fluid inlet 321. The heating module 35 heats the sulfuric acid to a preset temperature before it flows out of the first fluid outlet 322. The second fluid pipe 33 is used to transport hydrogen peroxide. The heated sulfuric acid and hydrogen peroxide mix in the mixing fluid pipe 34, flow through the nozzle 31, and are sprayed onto the substrate 4.

[0106] Example 5

[0107] In the process of treating substrates using SPM liquid, hydrogen peroxide is injected into a sulfuric acid solution. The hydrogen peroxide and sulfuric acid react, releasing heat to form a high-temperature SPM liquid, resulting in mist. The temperature of the substrate surface is low, and the SPM liquid sprayed onto the substrate surface produces more mist, which forms acid mist above the substrate. Especially in equipment that uses a heating module 35 to heat sulfuric acid, the higher the temperature of the sulfuric acid, the more mist is generated. Furthermore, the acid mist condenses in the chamber and then drips onto the substrate. All of these situations can have a negative impact on substrate processing.

[0108] In order to solve the above problems, this embodiment provides an anti-sputtering device, which is specifically referred to in Figure 10a The anti-sputtering device includes a first protective cover 11, an exhaust pipe 7, and an exhaust device 8. A through hole is provided on the first protective cover 11. One end of the exhaust pipe 7 is provided on the first protective cover 11 and communicates with the through hole. The other end of the exhaust pipe 7 is connected to the exhaust device 8. Two exhaust pipes 7 are symmetrically provided on the first protective cover 11, and the two exhaust pipes 7 are connected to one exhaust device 8. Other technical features of the anti-sputtering device in the first embodiment can be applied to this embodiment.

[0109] The nozzle 31 is disposed within the first protective cover 11. When the chemical solution is sprayed from the nozzle 31 onto the substrate 4, acid mist is likely to form within the shielded area of the first protective cover 11. To reduce the acid mist from overflowing from the shielded area of the first protective cover 11 into the chamber, the exhaust device 8 operates when the nozzle 31 sprays the chemical solution onto the substrate 4, promptly exhausting the acid mist above the substrate through the exhaust pipe 7.

[0110] The anti-sputtering device also includes a water vapor separation device 9. The exhaust device 8 includes a connection port and an outlet. One end of the exhaust pipe 7 is connected to the through hole of the first protective cover 11, and the other end of the exhaust pipe 7 is connected to the connection port of the exhaust device 8. One end of the water vapor separation device 9 is connected to the outlet of the exhaust device 8. The exhaust device 8 sucks the acid mist into the water vapor separation device 9 through the exhaust pipe 7. The water vapor separation device 9 is used to separate air and sulfuric acid. The exhaust device 8 can be made of perfluorinated material, which is more corrosion-resistant.

[0111] The vacuum device 8 can be a vacuum pump or a vacuum generator. In this embodiment, the vacuum device 8 is a vacuum generator. The vacuum generator includes a connection port, an inlet, and an outlet. It is a pneumatic component that uses the flow of compressed air to create a certain vacuum level. Air is introduced through the inlet, compressed within the vacuum generator, and discharged through the outlet. During this process, a negative pressure is formed within the vacuum generator, drawing acid mist into the vacuum generator through the connection port and then discharging it through the outlet to the water vapor separation device 9.

[0112] Optionally, two exhaust pipes 7 are symmetrically provided on the first protective cover 11 , and the two exhaust pipes 7 are respectively connected to corresponding exhaust devices 8 , and the two exhaust devices 8 work synchronously to extract the acid mist above the substrate.

[0113] See Figure 10b The water vapor separation device 9 includes a separation device body 91, which is provided with a water vapor inlet 92, a liquid outlet 93, and an air outlet 94. The water vapor inlet 92 is provided at the top of the separation device body 91 and is connected to the outlet of the air extraction device 8. The liquid outlet 93 is provided at the bottom of the separation device body 91, and the air outlet 94 is provided on one side of the separation device body 91. At least one partition plate 95 is provided inside the separation device body 91, and at least one blocking portion 96 is provided horizontally on the partition plate 95.

[0114] Gas outlet 94 connects exhaust unit, and acid mist enters in the separator body 91 by water vapor inlet 92, and exhaust unit is worked, and the acid mist in separator body 91 inside flows, and the H in the part acid mist SO Component drops to liquid outlet 93 due to the effect of gravity, H SO Component and air component realize separation.The acid mist of another part continues to move upward, runs into blockage 96 rear condensation, H SO Component drops to liquid outlet 93, and air continues to move due to the suction effect of exhaust unit, and is extracted to gas outlet 94.In the above process, need control the air pumping speed of exhaust unit, avoid air pumping speed too large, acid mist is directly extracted to gas outlet 94, H SO Component and air component can't separate, in addition, if air pumping speed is too small, acid mist is suspended in the separator body 91, H SO Component and air component can't separate equally.

[0115] Furthermore, in this embodiment, two partition plates 95 are provided inside the separation device body 91 . The partition plates 95 are substantially arranged in the vertical direction, and each partition plate 95 is provided with two blocking portions 96 in the horizontal direction.

[0116] The basic concepts of this application have been described above. It will be apparent to those skilled in the art that the above disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and amendments to this application. Such modifications, improvements, and amendments are suggested in this application and remain within the spirit and scope of the exemplary embodiments of this application.

[0117] At the same time, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "one embodiment," "an embodiment," or "an alternative embodiment" mentioned twice or multiple times in different locations in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application may be appropriately combined.

Claims

1. A sputtering prevention device, characterized in that: Used to prevent the liquid sprayed onto the substrate from splashing into the chamber, including: a first protective cover, configured to allow the nozzle to be disposed within the first protective cover; a second protective cover, arranged around the substrate and the first protective cover when the nozzle sprays the liquid medicine onto the substrate; The relationship between the first protective cover and the second protective cover is expressed as: h / r<H / R, where h is the height between the lower end surface of the first protective cover and the substrate; r is the farthest horizontal distance between the nozzle and the edge of the lower end surface of the first protective cover; H is the height between the top of the second protective cover and the substrate; and R is the horizontal distance between the top of the second protective cover and the nozzle.

2. The anti-sputtering device according to claim 1, characterized in that The first protective cover includes a first structure and a second structure connected in sequence from top to bottom, and the thickness of the second structure close to the first structure is greater than the thickness of the second structure far from the first structure.

3. The anti-sputtering device according to claim 2, characterized in that The thickness of the second structure gradually becomes thinner toward the substrate.

4. The anti-sputtering device according to claim 2, characterized in that The first protective cover further includes a transition structure, the upper end of the transition structure is connected to the outer wall surface of the first structure, and the lower end of the transition structure is connected to the outer wall surface of the second structure.

5. The anti-sputtering device according to claim 4, characterized in that The transition structure is a curved structure or a planar structure.

6. The sputtering prevention device according to claim 1, wherein: A reference line AA' is drawn vertically downward through the center point A of the upper end surface of the first protective cover. The first protective cover includes a first unit and a second unit. The first unit and the second unit are on both sides of the reference line AA'. The nozzle is arranged toward the inner wall surface of the first unit. A horizontal distance r1 between the nozzle and the edge of the lower end surface of the first unit is greater than a horizontal distance r2 between the nozzle and the edge of the lower end surface of the second unit.

7. The sputtering prevention device according to claim 6, characterized in that: The relationship between the first protective cover and the second protective cover is expressed as: h / r1<H / R, or h / r1<H / R and h / r2<H / R.

8. The sputtering prevention device according to claim 1, wherein: It also includes an exhaust pipe and an exhaust device. A through hole is opened on the first protective cover. One end of the exhaust pipe is set on the first protective cover and connected to the through hole, and the other end of the exhaust pipe is connected to the exhaust device.

9. The sputtering prevention device according to claim 8, characterized in that: It also includes a water vapor separation device, one end of which is connected to the air extraction device.

10. The sputtering prevention device according to claim 8, wherein: Two exhaust pipes are symmetrically arranged on the first protective cover, one end of the two exhaust pipes is respectively connected to the first protective cover, and the other end is commonly connected to one of the exhaust devices; Alternatively, there are two exhaust devices, and two exhaust pipes are symmetrically arranged on the first protective cover, one end of the two exhaust pipes is respectively connected to the first protective cover, and the other end is connected to the corresponding exhaust device.

11. The sputtering prevention device according to claim 9, characterized in that: The water vapor separation device includes a separation device body, which is provided with a water vapor inlet, a liquid outlet and an air outlet. The water vapor inlet is arranged at the top of the separation device body and is connected to the air extraction device, the liquid outlet is arranged at the bottom of the separation device body, and the air outlet is arranged on one side of the separation device body. At least one partition plate is arranged inside the separation device body, and the partition plate is provided with at least one blocking portion in the horizontal direction.

12. A sputtering prevention device, characterized in that: Used to prevent the liquid sprayed onto the substrate from splashing into the chamber, including: a first protective cover, used to place the nozzle inside the first protective cover, wherein the first protective cover is provided with a through hole; an exhaust pipe, one end of which is disposed on the first protective cover and communicated with the through hole; An air extraction device, the other end of the air extraction pipe is connected to the air extraction device.

13. A cleaning device, characterized in that: It includes a spray body, a gas supply pipe and a liquid supply pipe; The spray body includes a first chamber and a second chamber, and is provided with a plurality of liquid outlet holes and a plurality of air outlet holes. The liquid outlet holes are communicated with the first chamber, and the air outlet holes are communicated with the second chamber. The liquid supply pipe is connected to the first chamber and is used to supply cleaning liquid to the first chamber; The gas supply pipe is connected to the second chamber and is used to supply dry gas to the second chamber.

14. The cleaning device according to claim 13, characterized in that The spray body further comprises a base, wherein the spray body comprises a central component, a peripheral component and an auxiliary structure, wherein the auxiliary structure is fixedly arranged on the base, the peripheral component is fixedly arranged on the auxiliary structure, the central component is fixedly connected to the peripheral component, and the peripheral component is arranged around the periphery of the central component; The base includes a base wall and a recovery cavity surrounded by the base wall, the central component includes a central body and a flow cavity surrounded by the central body, and the recovery cavity is communicated with the flow cavity; The top surface of the central component is provided with the liquid outlet, and the top surface of the peripheral component is provided with the air outlet.

15. The cleaning device according to claim 14, characterized in that The peripheral component has a first portion and a second portion connected sequentially from bottom to top; The outer wall of the first part, the bottom surface of the second part, and the inner wall of the auxiliary structure are arranged to form the second chamber, and the second part is provided with a plurality of the air outlet holes, which extend to the bottom surface of the second part and communicate with the second chamber; The first part is arranged around the outer periphery of the central component, and the inner wall of the first part, the outer wall of the central body and the bottom of the central body are arranged to form the first chamber. The top surface of the central component is provided with a plurality of liquid outlets, and the liquid outlets are connected to the first chamber.

16. The cleaning device according to claim 13, characterized in that The spray body includes a central component and a peripheral component connected to the central component; The central component includes a central body and a flow cavity surrounded by the central body, and the peripheral component includes a third part and a fourth part. The fourth part and the outer wall of the central body form the first cavity, and the third part and the outer wall of the central body form the second cavity.

17. The cleaning device according to claim 16, characterized in that A plurality of liquid outlet holes and a plurality of air outlet holes are opened on the top surface of the central component.

18. The cleaning device according to claim 13, characterized in that The liquid outlet and the air outlet are both arranged in a ring shape, and the first chamber and the second chamber are both ring structures.

19. A substrate processing device, characterized in that: It comprises a nozzle device, a driving device, a rotating lifting device, an anti-splashing device according to any one of claims 1 to 12 and / or a cleaning device according to any one of claims 13 to 18; The driving device is used to drive the rotary lifting device to lift and rotate, the rotary lifting device includes a swing arm, the nozzle device is arranged at the free end of the swing arm, the nozzle device includes a nozzle, and the nozzle is arranged in the anti-splashing device. The cleaning device is used to clean the anti-splashing device.

20. The substrate processing apparatus according to claim 19, wherein: The nozzle device includes a first fluid tube, a second fluid tube and a mixing fluid tube. The first fluid tube is used to transmit a first solution, and the second fluid tube is used to transmit a second solution. After the first solution and the second solution are mixed in the mixing fluid tube, they flow through the nozzle and are sprayed onto the substrate.

21. The substrate processing apparatus according to claim 20, wherein: The first solution is sulfuric acid, and the second solution is hydrogen peroxide.

22. The substrate processing apparatus according to claim 20, wherein: The spray head device includes a heating module, and the heating module is used to heat the solution in the first fluid pipe.

23. The substrate processing apparatus according to claim 22, wherein: The first fluid pipe is an annular cylindrical structure, and the heating module is arranged inside the first fluid pipe.

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