Method and device for realizing burning of security chip firmware and testing of intelligent mainboard at single station
By implementing secure chip firmware burning and motherboard testing in a single work station, the problems of low production efficiency and high cost are solved, and cost compression and efficiency improvement are achieved.
Patent Information
- Application Number
- CN202510545142.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-28
- Publication Date
- 2025-08-12
AI Technical Summary
In the prior art, security chip firmware burning and Android motherboard functional testing are independent workstations, resulting in low production efficiency, high cost and long cycles, and increasing labor and equipment investment.
Implement security chip firmware recording and motherboard testing at the same station. By determining the identity information of the motherboard and security chip, selecting the appropriate burning method and hardware, adjusting the interface position and firmware burning, combining the burning process with PCBA functional testing or RF calibration process.
It compresses production costs, improves production efficiency, avoids process switching and repeated hardware investment, and improves production capacity.
Smart Images
Figure CN120469699A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of automated production technology, and in particular to a method and device for implementing security chip firmware burning and intelligent motherboard testing at a single station. Background Art
[0002] A hardware security module is a hardware device used to enhance the security of Android devices. It provides security functions such as encryption, decryption, and digital signatures for the Android system through a built-in security chip. It can also protect sensitive data such as user passwords, payment information, and biometric data to prevent them from being stolen by malware.
[0003] Chips usually have flash memory or reprogrammable read-only memory (EEPROM) integrated into them. These memories can transfer code to the chip through specific communication protocols such as SPI, I2C, and UART.
[0004] During the production process, security chips require firmware burning. Currently, in the production process of smart device production lines, security chip firmware burning and Android motherboard functional testing are usually independent workstations. Setting up independent workstations not only requires manpower, but also requires the addition of fixtures, power supplies, PCs and other equipment. Therefore, problems such as low production efficiency, high costs and long cycles lead to reduced production capacity. Summary of the Invention
[0005] The present application provides a method and device for implementing security chip firmware burning and intelligent motherboard testing at a single workstation, which can realize security chip firmware burning and motherboard testing at the same workstation, which helps to reduce production costs and improve production efficiency.
[0006] The above-mentioned purpose of this application is achieved through the following technical solutions:
[0007] In a first aspect, the present application provides a method for implementing security chip firmware burning and intelligent motherboard testing in a single station, comprising:
[0008] Determine the identity information of the mainboard object and select a burning method according to the identity information of the mainboard object;
[0009] Determine the identity information of the security chip and determine the location of the burning process according to the identity information of the security chip;
[0010] Select the burning hardware according to the burning method and burning process location;
[0011] Use burning hardware to burn firmware to the security chip;
[0012] Among them, the burning methods include USB burning and serial port burning;
[0013] When the security chip firmware is successfully burned and can work normally, the burning process is merged into the PCBA functional test;
[0014] After the security chip firmware is successfully burned, if the mainboard needs to restart the security chip or the mainboard needs to be restarted, the burning process is merged into the RF calibration process.
[0015] In a possible implementation of the first aspect, using the burning hardware to burn firmware to the security chip further includes:
[0016] Determine the burning interface and burning method on the mainboard according to the identity information of the mainboard object;
[0017] Drive the burning module to move to the burning interface;
[0018] Drive the burning module to move toward the burning interface and adjust the relative position between the burning module and the burning interface;
[0019] When the programming module and the programming interface are correctly connected, physically connect the programming module and the programming interface.
[0020] In a possible implementation of the first aspect, adjusting the relative position of the burning module and the burning interface includes:
[0021] Acquire first distance detection data belonging to a detection surface of a data transmission interface on the burning module;
[0022] Acquire second distance detection data of the detection surface of the burning interface on the mainboard;
[0023] Comparing the corresponding first distance detection data and second distance detection data to obtain a comparison result;
[0024] Adjust the relative position of the programming module and the programming interface according to the comparison results;
[0025] The number of the detection surfaces of the data transmission interface on the burning module and the detection surfaces of the burning interface on the mainboard are the same and correspond one to one.
[0026] In a possible implementation of the first aspect, before physically connecting the burning module to the burning interface, the method further includes determining the parallelism between the burning interface and the data transmission interface;
[0027] Determining parallelism includes:
[0028] Get two distance detection data of a detection surface on the burning interface;
[0029] Obtain two distance detection data corresponding to a detection surface on the data transmission interface;
[0030] The parallelism of the programming interface and the data transmission interface is calculated based on the four distance detection data obtained.
[0031] In a second aspect, the present application provides a single-station device for implementing security chip firmware burning and motherboard testing, comprising:
[0032] Turntable;
[0033] A data transmission interface is vertically arranged on the rotating table, and the axis of the data transmission interface is parallel to the rotating axis of the rotating table;
[0034] The test frame is placed on the rotating table, and the data transmission interface is located inside the test frame;
[0035] Multiple sets of distance measuring sensors are arranged on the inner detection surface of the test frame, and each inner detection surface of the test frame is provided with a set of distance measuring sensors;
[0036] Two groups of inclination distance measuring sensors are arranged on the same inner detection surface of the test frame.
[0037] In a possible implementation manner of the second aspect, a line connecting the distance measuring sensors in the same group of distance measuring sensors is parallel to a rotation axis of the rotating platform.
[0038] In a possible implementation of the second aspect, a line connecting the inclination ranging sensors in the same group of inclination ranging sensors is not parallel to the rotation axis of the rotating platform;
[0039] The connecting lines of the inclination distance measuring sensors in the two groups of inclination distance measuring sensors are arranged in parallel.
[0040] In a possible implementation manner of the second aspect, a line connecting the inclination ranging sensors in the same group of inclination ranging sensors is perpendicular to a rotation axis of the rotating platform.
[0041] In a possible implementation of the second aspect, the device further includes a linear moving platform;
[0042] There are two rotating tables on the linear moving platform. The first rotating table is equipped with a USB burning interface, and the second rotating table is equipped with a serial port burning interface.
[0043] The beneficial effects of this application are:
[0044] This application avoids switching between different processes and related hardware investment by implementing firmware burning and motherboard testing at the same workstation. This method merges the two processes, which can reduce production costs while improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0045] Figure 1This is a flowchart of the steps of a method for implementing security chip firmware burning and intelligent motherboard testing at a single station provided by this application.
[0046] Figure 2 is based on Figure 1 A schematic diagram of the process is given.
[0047] Figure 3 This is a schematic diagram of the corresponding measurement points in a USB burning method provided by this application.
[0048] Figure 4 This is a schematic diagram of the corresponding measurement points in a serial port programming method provided in this application.
[0049] Figure 5 This is a schematic diagram of the principle of adjusting the relative position of the burning module and the burning interface provided by this application.
[0050] Figure 6 This is a schematic diagram of the principle of adjusting the parallelism between the burning module and the burning interface provided by this application.
[0051] Figure 7 This is a structural diagram of a single-station device for implementing security chip firmware burning and motherboard testing provided by this application.
[0052] Figure 8 This is a structural schematic diagram of a linear moving platform provided by this application.
[0053] In the figure, 1. Rotation table, 2. Data transmission interface, 3. Test frame, 4. Distance measurement sensor, 5. Inclination distance measurement sensor, 6. Linear moving platform. DETAILED DESCRIPTION
[0054] The technical solution in this application is further described in detail below with reference to the accompanying drawings.
[0055] This application discloses a method for implementing security chip firmware burning and intelligent motherboard testing in a single station. Figure 1 and Figure 2 In some examples, the single-station method disclosed in this application for implementing security chip firmware burning and intelligent motherboard testing includes the following steps:
[0056] S101, determining the identity information of the motherboard object and selecting a burning method according to the identity information of the motherboard object;
[0057] S102, determining the identity information of the security chip and determining the location of the burning process according to the identity information of the security chip;
[0058] S103, selecting the burning hardware according to the burning method and the burning process position;
[0059] S104, using burning hardware to burn firmware to the security chip;
[0060] Among them, the burning methods include USB burning and serial port burning;
[0061] When the security chip firmware is successfully burned and can work normally, the burning process is merged into the PCBA functional test;
[0062] After the security chip firmware is successfully burned, if the mainboard needs to restart the security chip or the mainboard needs to be restarted, the burning process is merged into the RF calibration process.
[0063] In step S101, the identity information of the mainboard object needs to be determined first. The processing method generally used here is the image comparison processing method. Specifically, the graphic information of the mainboard object is obtained by shooting, and then compared with the image stored in the database. The identity information of the mainboard object is determined based on the comparison results.
[0064] Alternatively, the text information carried on the mainboard object can be obtained by photographing, and then the identity information of the mainboard object can be obtained through the text information.
[0065] After obtaining the identity information of the motherboard object, the burning method will be selected according to the identity information of the motherboard object. The burning method needs to be determined according to the type of burning interface on the motherboard. There are two types of burning interfaces: USB interface and serial port interface, so there are two burning methods: USB burning and serial port burning.
[0066] In step S102, the identity information of the security chip is determined and the programming process location is determined based on the identity information of the security chip. Specifically, it is divided into the following situations:
[0067] When the security chip firmware is successfully burned and can work normally, the burning process is merged into the PCBA functional test;
[0068] After the security chip firmware is successfully burned, if the mainboard needs to restart the security chip or the mainboard needs to be restarted, the burning process is merged into the RF calibration process.
[0069] The specific method of determining the identity information of the security chip is to obtain the identity information of the motherboard object by querying the associated content of the identity information of the motherboard object after obtaining the identity information of the motherboard object. This method is a prior art and will not be described in detail here.
[0070] Then in step S103, the burning hardware is selected according to the burning mode and the burning process position. There are two types of burning hardware, one with a USB interface and the other with a serial port.
[0071] Finally, in step S104 , the firmware of the security chip is burned using the burning hardware.
[0072] See also Figure 3 , Figure 3 The content shown in the figure is the corresponding measurement point schematic diagram in the USB burning method. The USB burning method requires reserving the DM, DP, VBUS, and GND measurement points of the security chip and connecting them to the USB DM, DP, VBUS, and GND lines respectively.
[0073] See also Figure 4 , Figure 4 The content shown in the figure is the corresponding measurement point schematic diagram in the serial port burning method. The serial port burning method requires reserving the TX, RX, 3V3, and GND measurement points of the security chip, which are connected to the TX, RX, 3V3, and GND lines of the serial port board respectively.
[0074] In some possible implementations, when using the flashing hardware to flash the firmware to the security chip, the following content is added:
[0075] Determine the burning interface and burning method on the mainboard according to the identity information of the mainboard object;
[0076] Drive the burning module to move to the burning interface;
[0077] Drive the burning module to move toward the burning interface and adjust the relative position between the burning module and the burning interface;
[0078] When the programming module and the programming interface are correctly connected, physically connect the programming module and the programming interface.
[0079] The purpose of this section is to adjust the relative position of the programming module and the programming interface. It should be understood that the Android motherboard is generally placed on a jig for transportation. When the Android motherboard is placed on the jig, its relative position with the jig cannot be guaranteed to be completely consistent. Here, it is also necessary to consider the possible position errors during installation and transportation.
[0080] This means that if the position adjustment is not performed, the burning module will experience mechanical wear beyond the allowable range, which will reduce the service life of the burning module. Therefore, position adjustment is required before each physical connection process.
[0081] See also Figure 5 and Figure 6 The specific method to adjust the relative position of the burning module and the burning interface is as follows:
[0082] Obtain the first distance detection data of the detection surface of the data transmission interface on the burning module ( Figure 5 S1 in
[0083] Get the second distance detection data of the detection surface belonging to the burning interface on the mainboard ( Figure 5 S2 in
[0084] Comparing the corresponding first distance detection data and second distance detection data to obtain a comparison result;
[0085] Adjust the relative position of the programming module and the programming interface according to the comparison results;
[0086] The number of the detection surfaces of the data transmission interface on the burning module and the detection surfaces of the burning interface on the mainboard are the same and correspond one to one.
[0087] Here, distance detection data is obtained at the data transmission interface of the burning module. Specifically, the first distance detection data is obtained from the detection surface of the data transmission interface on the burning module, and the number of detection surfaces is generally four. Then, the second distance detection data is obtained from the detection surface of the burning interface on the motherboard, and the number of second distance detection data is also four.
[0088] The difference between S1 and S2 is generally controlled within a range of 0.05-0.1 mm. This is only an example and does not constitute a limitation to the present application.
[0089] Then, the corresponding first distance detection data and second distance detection data are compared.
[0090] Specifically, for the interface, the distance data of the four sides of the interface will be obtained. At this time, four sets of data will be obtained. Each set of data includes a first distance detection data and a second distance detection data. This set of data is generated based on the same base surface. Through these four sets of data, the position of the burning module on the horizontal plane can be fine-tuned. The fine-tuning here includes horizontal adjustment and vertical adjustment or left and right adjustment and height adjustment.
[0091] In some cases, before physically connecting the programming module to the programming interface, the parallelism of the programming interface and the data transmission interface is determined. This method is to obtain two straight lines by determining a straight line from two points, and then determine the parallelism of the two straight lines. Please refer to Figure 6 , as follows:
[0092] Get two distance detection data of a detection surface on the burning interface;
[0093] Obtain two distance detection data corresponding to a detection surface on the data transmission interface;
[0094] The parallelism of the programming interface and the data transmission interface is calculated based on the four distance detection data obtained.
[0095] Here, it is generally required that the angle between the two straight lines is less than 0.2 degrees. This is only for illustration and does not constitute a limitation to this application.
[0096] This application also discloses a single-station device for implementing security chip firmware burning and motherboard testing, see Figure 7 , including a rotating table 1, a data transmission interface 2, a test frame 3, a ranging sensor 4 and an inclination ranging sensor 5. The data transmission interface 2 is vertically arranged on the rotating table 1, and the axis of the data transmission interface 2 is required to be parallel to the rotation axis of the rotating table 1.
[0097] The test frame 3 is also fixedly mounted on the rotating table 1, and the data transmission interface 2 is located inside the test frame 3. The test frame 3 is generally rectangular in shape and has four internal detection surfaces. Each internal detection surface of the test frame 3 is provided with a set of distance measuring sensors 4, and one of the internal detection surfaces is also provided with two sets of tilt distance measuring sensors 5.
[0098] In some possible implementations, a line connecting the distance measuring sensors 4 in the same group of distance measuring sensors 4 is parallel to the rotation axis of the rotating stage 1 .
[0099] In some possible implementations, the connecting line of the tilt ranging sensors 5 in the same group of tilt ranging sensors 5 is not parallel to the rotation axis of the turntable 1 , and the connecting lines of the tilt ranging sensors 5 in two groups of tilt ranging sensors 5 are required to be arranged in parallel.
[0100] Of course, the connecting line of the inclination distance measuring sensors 5 in the same group of inclination distance measuring sensors 5 is perpendicular to the rotation axis of the rotating platform 1 .
[0101] See also Figure 8 In some examples, a linear moving platform 6 is added, and two rotating platforms 1 are provided on the linear moving platform 6. The first rotating platform 1 is provided with a USB burning interface, and the second rotating platform 1 is provided with a serial port burning interface.
[0102] After adding the linear moving platform 6, both USB burning and serial port burning can be satisfied at the same position.
[0103] The embodiments of this specific implementation method are all preferred embodiments of the present application and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.
Claims
1. A method for implementing security chip firmware burning and intelligent motherboard testing in a single station, characterized in that: include: Determine the identity information of the mainboard object and select a burning method according to the identity information of the mainboard object; Determine the identity information of the security chip and determine the location of the burning process according to the identity information of the security chip; Select the burning hardware according to the burning method and burning process location; Use burning hardware to burn firmware to the security chip; Among them, the burning methods include USB burning and serial port burning; When the security chip firmware is successfully burned and can work normally, the burning process is merged into the PCBA functional test; After the security chip firmware is successfully burned, if the mainboard needs to restart the security chip or the mainboard needs to be restarted, the burning process is merged into the RF calibration process.
2. The method for implementing security chip firmware burning and intelligent motherboard testing at a single station according to claim 1, characterized in that: Using the flashing hardware to flash the security chip firmware also includes: Determine the burning interface and burning method on the mainboard according to the identity information of the mainboard object; Drive the burning module to move to the burning interface; Drive the burning module to move toward the burning interface and adjust the relative position between the burning module and the burning interface; When the programming module and the programming interface are correctly connected, physically connect the programming module and the programming interface.
3. The method for implementing security chip firmware burning and intelligent motherboard testing at a single station according to claim 2, characterized in that: Adjusting the relative position of the programming module and the programming interface includes: Acquire first distance detection data belonging to a detection surface of a data transmission interface on the burning module; Acquire second distance detection data of the detection surface of the burning interface on the mainboard; Comparing the corresponding first distance detection data and second distance detection data to obtain a comparison result; Adjust the relative position of the programming module and the programming interface according to the comparison results; The number of the detection surfaces of the data transmission interface on the burning module and the detection surfaces of the burning interface on the mainboard are the same and correspond one to one.
4. The method for implementing security chip firmware burning and intelligent motherboard testing at a single station according to claim 2, characterized in that: Before physically connecting the burning module to the burning interface, it also includes determining the parallelism of the burning interface and the data transmission interface; Determining parallelism includes: Get two distance detection data of a detection surface on the burning interface; Obtain two distance detection data corresponding to a detection surface on the data transmission interface; The parallelism of the programming interface and the data transmission interface is calculated based on the four distance detection data obtained.
5. A single-station device for implementing security chip firmware burning and motherboard testing, characterized in that: include: Rotating table (1); A data transmission interface (2) is vertically arranged on the rotating table (1), and an axis of the data transmission interface (2) is parallel to the rotation axis of the rotating table (1); A test frame (3) is arranged on the rotating table (1), and the data transmission interface (2) is located inside the test frame (3); Multiple groups of distance measuring sensors (4) are arranged on the inner detection surface of the test frame (3), and each inner detection surface of the test frame (3) is provided with a group of distance measuring sensors (4); Two groups of inclination distance measuring sensors (5) are arranged on the same inner detection surface of the test frame (3).
6. The single-station device for implementing security chip firmware burning and motherboard testing according to claim 5, characterized in that: The connecting line of the distance measuring sensors (4) in the same group of distance measuring sensors (4) is parallel to the rotation axis of the rotating platform (1).
7. The single-station device for implementing security chip firmware burning and motherboard testing according to claim 5, characterized in that: The connecting line of the tilt distance measuring sensors (5) in the same group of tilt distance measuring sensors (5) is not parallel to the rotation axis of the rotating platform (1); The connecting lines of the inclination distance measuring sensors (5) in the two groups of inclination distance measuring sensors (5) are arranged in parallel.
8. The single-station device for implementing security chip firmware burning and motherboard testing according to claim 5, characterized in that: The connecting line of the inclination distance measuring sensors (5) in the same group of inclination distance measuring sensors (5) is perpendicular to the rotation axis of the rotating platform (1).
9. The single-station device for implementing security chip firmware burning and motherboard testing according to claim 5, characterized in that: Also included is a linear motion platform (6); Two rotating platforms (1) are provided on the linear moving platform (6), the first rotating platform (1) is provided with a USB burning interface, and the second rotating platform (1) is provided with a serial port burning interface.