Cooling method and system for electrical engineering relay protector

Abstract

The invention relates to relay cooling protection, in particular to a cooling method and system for an electrical engineering relay protector, and the method comprises the steps: presetting a temperature protection step of the relay protector; temperature information of the relay protector is obtained in real time; comparing the temperature information with the temperature protection stepped temperature monitoring result; and executing different cooling procedures according to the temperature monitoring result. According to the technical scheme of the invention, the method achieves the precise control of the temperature of the relay protector through a step-by-step temperature protection strategy, and has the technical effects: building a dynamic gradient response mechanism; progressive control of passive heat dissipation, active heat dissipation and passive heat dissipation, active refrigeration and passive heat dissipation, active refrigeration, active heat dissipation and passive heat dissipation, and power failure alarm and continuous heat dissipation is triggered through five levels of temperature threshold values, and the equipment failure rate and maintenance cost are effectively reduced.

Description

Technical Field

[0001] The present invention relates to relay temperature reduction protection, and in particular to a temperature reduction method and system for an electrical engineering relay protector. Background Art

[0002] Relay protectors, as core equipment in power systems, perform critical tasks such as overload protection, short-circuit protection, and temperature monitoring. Their internal electromagnetic coils, contacts, and electronic components generate Joule heat during operation. If this heat accumulates beyond a critical threshold, it can cause insulation degradation, contact welding, and even fire. According to IEEE statistics, temperature anomalies account for 37% of relay failures, and repair costs increase exponentially with the duration of temperature excursions.

[0003] Traditional temperature protection systems usually use a single threshold control, which immediately triggers power-off protection when the temperature exceeds a preset value. However, this method has the following defects: a single threshold cannot adapt to the temperature change characteristics of the equipment under different loads, which may lead to frequent false operations or delayed protection; relying only on a single heat dissipation method (such as passive heat dissipation or forced air cooling), it is impossible to dynamically adjust the heat dissipation intensity according to the temperature gradient, resulting in energy waste or insufficient heat dissipation; direct power outages in the event of a high-temperature fault may cause secondary damage (such as residual heat accumulation), and there is a lack of a continuous cooling mechanism after power outages. Therefore, the present invention proposes a cooling method for electrical engineering relay protectors. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is that the existing heat dissipation method is not intelligent enough.

[0005] The above technical problem is solved by the following technical solution: The present invention proposes a cooling method for an electrical engineering relay protector, comprising:

[0006] Preset temperature protection steps for relay protectors;

[0007] Get temperature information of relay protection device in real time;

[0008] Compare temperature information and temperature protection step temperature monitoring results;

[0009] Execute different cooling processes according to the temperature monitoring results.

[0010] In a preferred embodiment of the temperature reduction method of the electrical engineering relay protector of the present invention: the temperature protection ladder is divided into 5 ladders; including:

[0011] The first step: the temperature is less than or equal to 5°C;

[0012] The second step: the temperature is greater than 5℃ and less than or equal to 20℃;

[0013] The third stage: the temperature is greater than 20℃ and less than or equal to 40℃;

[0014] The fourth stage: the temperature is greater than 40℃ and less than or equal to 60℃;

[0015] The fifth step is a temperature greater than 60°C.

[0016] In a preferred embodiment of the method for cooling a relay protection device in an electrical engineering according to the present invention, the step of obtaining the temperature information of the relay protection device comprises performing a temperature detection on the relay protection device every 30 to 60 seconds.

[0017] In a preferred embodiment of the method for cooling a relay protection device in an electrical engineering according to the present invention, the method of performing different cooling operations according to the temperature monitoring results is as follows:

[0018] When the temperature information is at the first level, passive cooling is performed;

[0019] When the temperature information is in the second stage, active heat dissipation and passive heat dissipation are performed;

[0020] When the temperature information is in the third stage, active cooling and passive heat dissipation are performed;

[0021] When the temperature information is in the fourth stage, active cooling, active heat dissipation, and passive heat dissipation are performed.

[0022] In a preferred embodiment of the temperature reduction method for an electrical engineering relay protector of the present invention: when the temperature information is in the fifth stage, a power-off operation and an alarm operation are performed simultaneously.

[0023] In a preferred embodiment of the temperature reduction method for an electrical engineering relay protection device of the present invention: after the power-off operation is performed, active cooling, active heat dissipation, and passive heat dissipation are performed simultaneously.

[0024] The present invention also discloses a cooling system for an electrical engineering relay protector, which includes a temperature information acquisition module for monitoring the temperature of the relay protector in real time; a cooling module with passive heat dissipation function, active heat dissipation function, and active cooling function for reducing the temperature of the relay protector; and a control module electrically connected to the temperature information acquisition module and the cooling module, for receiving temperature information from the temperature information acquisition module and capable of controlling the cooling module.

[0025] In a preferred embodiment of the cooling system for the electrical engineering relay protection device of the present invention: the temperature information acquisition module is a temperature sensor.

[0026] In a preferred embodiment of the cooling system of the electrical engineering relay protector described in the present invention: the cooling module includes heat dissipation fins, a heat dissipation fan, and a cooling plate; the heat dissipation fins are used for passive heat dissipation; the heat dissipation fan is used for active heat dissipation; and the cooling plate is used for active cooling.

[0027] In a preferred embodiment of the cooling system of the electrical engineering relay protection device of the present invention: the cooling system of the electrical engineering relay protection device adopts an independent power supply.

[0028] The beneficial effects of the present invention are: refined control of the temperature of the relay protector is achieved through a stepped temperature protection strategy, and the technical effect is reflected in: establishing a dynamic gradient response mechanism, triggering progressive control of passive heat dissipation, active heat dissipation + passive heat dissipation, active cooling + passive heat dissipation, active cooling + active heat dissipation + passive heat dissipation, power-off alarm + continuous heat dissipation through 5-level temperature thresholds, effectively reducing equipment failure rate and maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings of the embodiments of the present invention. Obviously, the drawings described below only relate to some embodiments of the present invention and are not intended to limit the present invention. Among them:

[0030] Figure 1 Shows a wiring diagram of the cooling system of the electrical engineering relay protector in the present invention; DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below with reference to specific embodiments and the accompanying drawings.

[0032] The terms used in the present invention are those commonly used in the art in view of the functions of the present invention, but these terms may vary according to the intentions of those skilled in the art, precedents, or new technologies in the art. In addition, specific terms may be selected by the applicant, and in such cases, their detailed meanings will be described in the detailed description of the present invention. Therefore, the terms used in the specification should not be understood as simple names, but rather as the meanings of the terms and the overall description of the present invention.

[0033] Reference Figure 1 This embodiment provides a method for cooling a relay protector in an electrical engineering, comprising:

[0034] S1: Preset temperature protection step of relay protector;

[0035] In this embodiment, a single chip microcomputer or a programmable logic controller (PLC) may be used to implement the preset temperature protection steps.

[0036] The temperature protection ladder is divided into 5 steps; including:

[0037] The first step is a normal low-temperature operating environment. In this case, the relay protection device is in a risk-free state. The first step is when the temperature is less than or equal to 5°C.

[0038] The second stage is the normal temperature operating environment. In this case, the relay protection device needs to stabilize the temperature as much as possible to prevent the temperature from continuing to rise. The second stage temperature is greater than 5°C and less than or equal to 20°C.

[0039] The third stage is a medium temperature operating environment. In this case, the relay protection device needs to lower the temperature to avoid damage. The third stage temperature is greater than 20℃ and less than or equal to 40℃.

[0040] The fourth stage is a high temperature operating environment. In this case, the relay protection device is at risk of damage. The fourth stage is a temperature greater than 40°C and less than or equal to 60°C.

[0041] The fifth stage is a high-temperature operating environment. In this case, the relay protection device has a greater risk of damage. The fifth stage is a temperature greater than 60°C.

[0042] By presetting the temperature protection steps, the operating status of the relay protector can be basically judged. Of course, different relay protectors can adopt temperature protection steps with different values, which can be adjusted according to actual protection needs.

[0043] S2: Get the temperature information of the relay protection device in real time;

[0044] The real-time acquisition of the temperature information of the relay protection device is specifically to perform a temperature detection on the relay protection device every 30 to 60 seconds.

[0045] The temperature information of the relay protection device can be obtained through some temperature monitoring equipment, where the distance between the temperature monitoring equipment and the relay protection device is L. The optimal value is 10cm≥L≥0cm, so that there is a smaller distance between the temperature monitoring equipment and the relay protection device, which facilitates obtaining a more accurate temperature of the relay protection device. The temperature monitoring equipment can use a temperature sensor.

[0046] The single-chip microcomputer can use the timer or delay function to perform the timing function, so that the temperature of the relay protection device can be collected every 30 to 60 seconds. At the same time, different temperature information collection intervals can be set through the single-chip microcomputer. For example, when the temperature is between the first and second steps, the temperature information is collected every 60 seconds. When the temperature is in the third step, the temperature information is collected every 45 seconds. When the temperature is in the fourth step, the temperature information of one side is collected every 60 seconds. High steps such as the fourth step usually indicate that the equipment is under high load or abnormal state, requiring more intensive monitoring to ensure that temperature mutations are captured in time to avoid the expansion of faults. At low steps, the equipment runs stably and the temperature changes slowly. The 60-second interval can not only meet the monitoring needs, but also reduce the CPU occupancy rate of the single-chip microcomputer and the power consumption of the sensor.

[0047] S3: Compare the temperature information and the temperature protection step temperature monitoring results;

[0048] After obtaining the temperature information, the single chip microcomputer can compare the temperature information with the preset temperature protection level to determine which protection level the temperature information is in.

[0049] For example, through the getTemperatureStepIndex function, the preset temperature protection steps are traversed to determine which step the current temperature is in.

[0050] S4: Execute different cooling processes according to the temperature monitoring results.

[0051] Different cooling methods are implemented according to the temperature monitoring results:

[0052] When the temperature information is at the first level, passive heat dissipation is performed; passive heat dissipation is mainly natural heat dissipation, and heat dissipation can also be performed through heat dissipation fins.

[0053] When the temperature information is in the second stage, active heat dissipation and passive heat dissipation are performed. Active heat dissipation generally refers to a heat dissipation method that can increase the air flow rate around the relay protection device, generally referring to a heat dissipation device such as a blower or fan for increasing the air flow rate.

[0054] When the temperature information is in the third stage, active cooling and passive heat dissipation are performed;

[0055] Active cooling generally refers to cooling plates, which are used to lower the temperature of the relay protector.

[0056] When the temperature information is in the fourth stage, active cooling, active heat dissipation, and passive heat dissipation are performed.

[0057] When the temperature information is in the fifth stage, the power-off operation and the alarm operation are performed simultaneously.

[0058] Through this method, the operating mode of the equipment can be reasonably adjusted according to temperature changes to reduce energy consumption.

[0059] After a power-off operation is performed, active cooling, active heat dissipation, and passive heat dissipation are performed simultaneously.

[0060] The power-off operation refers to disconnecting the power supply of the branch where the relay protector is located. In actual use, there may be multiple branches in the entire power supply system, each branch is equipped with a relay protector, and all branches are connected to the same master control. When the relay protector on one of the branches is stably in the fifth stage, the power supply of this branch is disconnected through the master control to avoid damage to the relay protector, and the alarm operation is performed at the same time. The alarm operation can be performed through the single-chip microcomputer in conjunction with the buzzer 400. After the power is cut off, the relay protector is efficiently cooled by active cooling, active heat dissipation, and passive heat dissipation. After the heat dissipation is completed, it is necessary to detect whether the relay protector can operate normally. If it can operate normally, the power supply of this circuit is reconnected.

[0061] The present invention realizes the refined control of the temperature of the relay protector through a stepped temperature protection strategy. The technical effect is reflected in: establishing a dynamic gradient response mechanism, and triggering progressive control of passive heat dissipation, active heat dissipation + passive heat dissipation, active cooling + passive heat dissipation, active cooling + active heat dissipation + passive heat dissipation, power-off alarm + continuous heat dissipation through 5-level temperature thresholds ≤5℃, 5-20℃, 20-40℃, 40-60℃, and 60℃, respectively, thereby effectively reducing equipment failure rate and maintenance costs.

[0062] The present invention also proposes a cooling system for an electrical engineering relay protector, which is applied to the above-mentioned cooling method for the electrical engineering relay protector; it includes a temperature information acquisition module 100, which is used to monitor the temperature of the relay protector in real time; a cooling module 200, which has a passive heat dissipation function, an active heat dissipation function, and an active cooling function, and is used to reduce the temperature of the relay protector; a control module 300, which is electrically connected to the temperature information acquisition module 100 and the cooling module 200, and is used to receive temperature information from the temperature information acquisition module 100 and can control the cooling module 200.

[0063] In the first embodiment, the temperature information acquisition module 100 is a temperature sensor, which is installed on the housing of the relay protector and is used to collect the stability of the relay protector. The cooling module 200 uses heat dissipation fins, heat dissipation fans, and cooling fins. The heat dissipation fins are used for passive heat dissipation; the heat dissipation fan is used for active heat dissipation; and the cooling plate is used for active cooling.

[0064] In the first embodiment, the control module 300 uses a single-chip microcomputer, and the single-chip microcomputer Uno is selected as the single-chip microcomputer. It is a widely used and easy-to-use development board with rich digital and analog pins to meet project requirements. The temperature sensor: uses a DS18B20 digital temperature sensor, which has the advantages of high precision of ±0.5°C, single-bus communication, and strong anti-interference ability. It is suitable for temperature measurement in industrial environments. At the same time, a relay module connected to the cooling fan and the cooling plate is also required. A 5V single-channel relay module is selected, which can withstand a certain current and voltage and can be used to control the on and off of external devices such as cooling fans and cooling plates.

[0065] The microcontroller wiring is as follows: the VCC pin is connected to the 5V pin of the microcontroller to provide power to the sensor, the GND pin is connected to the GND pin of the microcontroller for grounding, and the DQ data pin is connected to the digital pin 2 of the microcontroller for data communication with the microcontroller. To ensure communication stability, a 4.7KΩ pull-up resistor can be connected between the DQ pin and the 5V pin.

[0066] The relay module is wired as follows: the VCC pin is connected to the 5V pin of the Arduino for power, the GND pin is connected to the GND pin of the Arduino, and the IN signal pin is connected to digital pin 3 of the Arduino to receive control signals from the microcontroller.

[0067] The positive pole of the power supply of the cooling fan and the cooling fin is connected to the normally open NO or normally closed NC contact of the relay module, and the common end COM of the contact is connected to the positive pole of the power supply, and the negative pole of the cooling fan and the cooling fin is connected to the negative pole of the power supply.

[0068] The cooling system of the electrical engineering relay protection device adopts independent power supply.

[0069] Finally, it should be pointed out that the methods and devices described in detail above are merely embodiments, and those skilled in the art can modify these embodiments in different ways without departing from the scope of the present invention.

Claims

1. A method for cooling a relay protector in electrical engineering, characterized in that: include, Preset temperature protection steps for relay protectors; Get temperature information of relay protection device in real time; Compare temperature information and temperature protection step temperature monitoring results; Execute different cooling processes according to the temperature monitoring results.

2. The method for cooling a relay protector for electrical engineering according to claim 1, wherein: The temperature protection ladder is divided into 5 steps; include, The first step: the temperature is less than or equal to 5°C; The second step: the temperature is greater than 5℃ and less than or equal to 20℃; The third stage: the temperature is greater than 20℃ and less than or equal to 40℃; The fourth stage: the temperature is greater than 40℃ and less than or equal to 60℃; The fifth step is a temperature greater than 60°C.

3. The method for cooling a relay protector for electrical engineering according to claim 1, wherein: The method of obtaining the temperature information of the relay protection device specifically includes performing a temperature detection on the relay protection device every 30 to 60 seconds.

4. The method for cooling a relay protector in electrical engineering according to claim 2, wherein: The specific implementation of different cooling methods according to the temperature monitoring results is as follows: When the temperature information is at the first level, passive cooling is performed; When the temperature information is in the second stage, active heat dissipation and passive heat dissipation are performed; When the temperature information is in the third stage, active cooling and passive heat dissipation are performed; When the temperature information is in the fourth stage, active cooling, active heat dissipation, and passive heat dissipation are performed.

5. The method for cooling a relay protector for electrical engineering according to claim 2 or 4, characterized in that: When the temperature information is in the fifth stage, the power-off operation and the alarm operation are performed simultaneously.

6. The method for cooling a relay protector in electrical engineering according to claim 5, wherein: After a power-off operation is performed, active cooling, active heat dissipation, and passive heat dissipation are performed simultaneously.

7. A cooling system for an electrical engineering relay protector, characterized in that: A cooling method for an electrical engineering relay protector as claimed in any one of claims 1 to 6; These include, A temperature information acquisition module (100) is used to monitor the temperature of the relay protection device in real time; A temperature reduction module (200) having a passive heat dissipation function, an active heat dissipation function, and an active cooling function, and is used to reduce the temperature of the relay protection device; The control module (300) is electrically connected to the temperature information acquisition module (100) and the cooling module (200), and is used to receive temperature information from the temperature information acquisition module (100) and to control the cooling module (200).

8. The cooling system for the electrical engineering relay protector according to claim 7, characterized in that: The temperature information acquisition module (100) is a temperature sensor.

9. The cooling system for the electrical engineering relay protector according to claim 8, characterized in that: The cooling module (200) comprises heat dissipation fins, a heat dissipation fan, and a refrigeration plate; The heat dissipation fins are used for passive heat dissipation; The heat dissipation fan is used for active heat dissipation; The refrigeration plate is used for active refrigeration.

10. The cooling system for the electrical engineering relay protector according to claim 9, characterized in that: The cooling system of the electrical engineering relay protector adopts independent power supply.

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