Cabinet-type wafer storage device and storage control method

Abstract

This invention relates to the field of semiconductor technology, and more particularly to a cabinet-type wafer storage device and its storage control method. The cabinet-type wafer storage device comprises a cabinet, a movable frame, a wafer cassette conveyor area, a wafer cassette storage area, a wafer conveying and positioning device, and an electrical control module. This application not only enables automated flow, transfer, and storage of wafer cassettes and their internal wafers without the need for additional equipment or manual intervention, effectively reducing operational complexity and potential contamination risks, but also achieves highly efficient automated material storage and transfer, thereby significantly improving production efficiency and safety. Furthermore, it can store wafer cassettes of various sizes and their internal wafers to simultaneously meet diverse production needs. In addition, it enables integrated control and traceability management of wafer cassettes of various sizes and their internal wafers, improving product quality and manufacturing process traceability, and achieving automated material management.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a cabinet-type wafer memory device and a memory control method. Background Technology

[0002] With the continuous development of semiconductor manufacturing technology, the requirements for wafer transfer equipment are also constantly increasing. As an important substrate that carries semiconductor circuits, wafers need to be positioned and transferred efficiently and accurately throughout the entire manufacturing process.

[0003] In existing semiconductor production lines, wafers are typically loaded into wafer cassettes for transport and storage. Existing wafer storage systems are generally used for transporting wafer cassettes rather than directly transporting wafers. This necessitates additional equipment or manual intervention to remove the wafers from the cassettes and place them into the furnace boat for heat treatment, increasing operational complexity and potential contamination risks. Furthermore, existing wafer storage systems typically rely on robotics and automated control systems, integrating linear drivers, servo motors, precision sensors, and robotic arms to achieve high-precision wafer transport. However, these systems usually only handle a single type of wafer or wafer cassette, failing to meet diverse production needs simultaneously. Therefore, this invention proposes a cabinet-type wafer storage device and its storage control method. Summary of the Invention

[0004] Therefore, it is necessary to provide a cabinet-type wafer storage device and storage control method to address the aforementioned technical problems.

[0005] According to a first aspect of the present invention, a cabinet-type wafer storage device is provided, comprising: a cabinet; a window formed on the back of the cabinet for conveying wafers to a furnace boat; a wafer cassette conveyor area disposed inside the cabinet for receiving and buffering wafer cassettes of various sizes; a wafer cassette storage area disposed inside the cabinet for storing wafer cassettes of various sizes; a wafer conveying and positioning device fixedly installed inside the cabinet and having wafer protrusion detection and positioning functions; a second wafer protrusion detection device fixedly connected inside the cabinet for cooperating with the wafer conveying and positioning device in performing wafer protrusion detection; and an electrical control module fixedly installed inside the cabinet. The wafer cassette conveyor area, the wafer cassette storage area, the wafer conveying and positioning device, and the second wafer protrusion detection device are respectively electrically connected to the electrical control module for integrated control and traceability management of wafer cassettes of various sizes and the wafers within the wafer cassettes during conveying and storage. When a trolley conveys a wafer cassette of a certain size to the furnace boat... After the wafer cassette conveyor area, wafer cassettes of the corresponding size are received and buffered through the wafer cassette conveyor area. The buffer position information and wafer cassette size information of the wafer cassettes are collected and sent to the electrical control module. After receiving the buffer position information and wafer cassette size information, the electrical control module controls the wafer transfer positioning device at the origin position to clamp two wafer cassettes in the wafer cassette conveyor area. During the vertical upward movement of the wafer transfer positioning device, detection and positioning commands are executed to perform wafer protrusion detection and wafer positioning processing on the wafer in one of the wafer cassettes. When the wafer transfer positioning device moves to the second wafer protrusion detection device, the second wafer protrusion detection device performs collaborative wafer protrusion detection on the wafer in the other wafer cassette. After the wafer protrusion detection and wafer positioning processing are completed, the wafer transfer positioning device transfers the wafer cassette to the wafer cassette storage area or transfers the wafer in the wafer cassette to the furnace body crystal boat.

[0006] Optionally, the front of the cabinet is connected to an inspection door via a hinge. The inspection door has an input port for conveying wafer cassettes from the overhead crane to the wafer cassette conveyor area. The input port is equipped with an external electric gate for isolating the wafer cassette conveyor area from the external working environment of the cabinet. The rear end of the wafer cassette conveyor area is equipped with an internal electric gate for isolating the wafer cassette conveyor area from the internal working environment of the cabinet.

[0007] Optionally, the cabinet is equipped with a movable frame inside, and the movable frames of the wafer cassette conveyor area and the wafer cassette storage area are both fixed to the movable frame. The upper and lower ends of the inner sidewall of the cabinet are equipped with push-pull cable protection modules. The push-pull cable protection modules are used to store and protect the cables during maintenance work as the movable frame is pulled out, and to facilitate the pulling out and pushing in of the movable frame.

[0008] Optionally, the wafer cassette conveyor area includes a main body, a split section rotatably connected to both sides of the main body, and a first driving device for controlling the horizontal rotation of the split section. One end of the first driving device is rotatably connected to the split section, and the other end is rotatably connected to the main body. Driven by the first driving device, the split section is rotated to facilitate control of the orientation of the wafer cassette. Both the main body and the split section are provided with a first size recognition unit for detecting and identifying wafer cassette size information.

[0009] Optionally, the wafer cassette storage area is positioned corresponding to the window position to improve the convenience of transferring wafers to the furnace boat. The wafer cassette storage area includes multiple wafer cassette storage platforms, each of which has multiple wafer cassette storage stations. Each wafer cassette storage station is equipped with a second size recognition unit for detecting and identifying wafer cassette size information.

[0010] Optionally, the wafer transfer and positioning device includes an assembly section, a second drive unit, an integration section, a multi-functional wafer transfer robot, a first wafer protrusion detection device, and a wafer positioning device. The assembly section is fixedly installed on the inner wall of the cabinet and is arranged between the wafer cassette conveyor area and the window for movement between the wafer cassette conveyor area and the window. The second drive unit is fixedly installed at the lower end of the assembly section, and its output end is connected to the integration section. The integration section is slidably connected to the assembly section. Driven by the second drive unit, the integration section drives the multi-functional wafer transfer robot, the first wafer protrusion detection device, and the wafer positioning device to move vertically up and down together. The multi-functional wafer transfer robot, the first wafer protrusion detection device, and the wafer positioning device are all fixedly installed on the integration section. During the vertical ascent of the device and the wafer positioning device, the multi-functional wafer transfer robot simultaneously transfers two wafer cassettes and the wafers within them. After transferring one wafer cassette to the first wafer protrusion detection device for wafer protrusion detection, it quickly transfers the wafers within the wafer cassette to the wafer positioning device for wafer positioning adjustment. After the first wafer protrusion detection device completes its wafer protrusion detection, the multi-functional wafer transfer robot corrects and adjusts wafers with edge protrusion issues. The multi-functional wafer transfer robot is also equipped with position and quantity detection elements to detect the position and quantity of wafers within the wafer cassettes during the transfer process. The first wafer protrusion detection device is also equipped with a third size recognition unit for detecting and identifying wafer cassette size information.

[0011] Optionally, the second wafer detection device is located at the rear end of the wafer cassette storage area. The second wafer detection device is equipped with a fourth size recognition unit for detecting and identifying wafer cassette size information. After the multi-functional wafer transfer robot transfers one wafer cassette from the wafer cassette transfer area to the first wafer detection device for wafer detection, the multi-functional wafer transfer robot picks up another wafer cassette from the wafer cassette transfer area and, driven by the second drive device, transfers the other wafer cassette to the second wafer detection device for collaborative wafer detection, thereby improving the efficiency of wafer detection in a limited space.

[0012] Optionally, the first size identification unit, the second size identification unit, the third size identification unit, and the fourth size identification unit each include a limiting block, a common pressure sensing identification element arranged on the side of the limiting block, and multiple pressure sensing identification elements. The common pressure sensing identification element is used to perform common pressure sensing detection on wafer cassettes of all sizes. Each pressure sensing identification element is used to identify the size information of a wafer cassette of a certain size under the cooperative action of the common pressure sensing identification element, and send the identified wafer cassette size information to the electrical control module to realize traceability management of wafer cassettes of different sizes and wafers in the wafer cassettes.

[0013] Optionally, a filter is provided on the top of the cabinet.

[0014] According to a second aspect of the present invention, a storage control method for a cabinet-type wafer storage device is provided, comprising the following steps: Step 1: First, the cabinet-type wafer storage device is securely installed at the front end of the input port of the furnace body crystal boat, and the cabinet-type wafer storage device is powered on; Step 2: The external electric gate is opened, and the wafer cassette is transported to the wafer cassette conveyor area by an overhead crane. The main body or a separate part of the wafer cassette conveyor area receives and buffers the wafer cassette, and the buffer position information and wafer cassette size information of the wafer cassette are collected and sent to the electrical control module through a first size identification unit. At this time, the internal electric gate is in a closed state; Step 3: After the wafer cassette conveyor area has finished receiving and buffering the wafer cassette, the gate is closed. The external electric gate opens the internal electric gate. After receiving the buffer position information and wafer box size information of the wafer box, the electrical control module controls the multi-functional wafer transfer robot at the origin position to grip two wafer boxes in the wafer box conveyor area. During the gripping of each wafer box, the position and quantity of the wafers in the wafer box are detected by the position and quantity detection elements, and the position and quantity detection information is sent to the electrical control module. Then, the two wafer boxes are respectively transferred to the first wafer detection device and the second wafer detection device for wafer detection. Step 4: When the multi-functional wafer transfer robot transfers one wafer box on the wafer box conveyor area to the first wafer detection device for detection... After wafer probing, the multi-functional wafer transfer robot grips another wafer cassette from the wafer cassette conveyor area. A second drive unit propels the integration unit, the multi-functional wafer transfer robot, the first wafer probing detection device, and the wafer positioning device vertically upwards, transferring the other wafer cassette to the second wafer probing detection device for collaborative wafer probing detection. This improves the efficiency of wafer probing detection within a limited space. If edge probing issues are observed on the wafers within the cassette during wafer probing detection by either the first or second wafer probing detection device, the multi-functional wafer transfer robot then removes the wafers exhibiting edge probing problems. After correction and adjustment, if the wafers in the wafer cassette do not exhibit edge protrusion issues, proceed to step five; Step five: Use a multi-functional wafer transfer robot to transfer the wafers in the wafer cassettes on the first or second wafer protrusion detection device to the wafer positioning device; Step six: Use the wafer positioning device to position and adjust the wafers, and then use the multi-functional wafer transfer robot to place the positioned and adjusted wafers back into their corresponding wafer cassettes; Step seven: Repeat steps five and six until all wafers have been positioned and adjusted and returned to their corresponding wafer cassettes, then use the multi-functional wafer transfer robot to transfer the wafer cassettes to the wafer cassette storage area or to transfer the wafers in the wafer cassettes to the furnace boat.

[0015] The advantages and beneficial effects of this invention are as follows: This invention provides a cabinet-type wafer storage device and storage control method. This cabinet-type wafer storage device integrates a wafer cassette conveyor area, a wafer cassette storage area, a wafer conveying and positioning device, a second wafer detection device, and an electrical control module. Its high degree of integration enables automated flow, transfer, and storage of wafer cassettes and their internal wafers without the need for additional equipment or manual intervention. It automates the warehousing and retrieval operations of wafer cassettes and their internal wafers, effectively reducing operational complexity and potential contamination risks, thus achieving highly efficient automated material handling. The purpose of storage and transmission is to effectively improve production efficiency and security. It can also store wafer cassettes of various sizes and the wafers inside them to meet multiple production needs simultaneously and thus meet the needs of capacity expansion. In addition, it can realize integrated control and traceability management of wafer cassettes of various sizes and the wafers inside them, improve product quality and traceability of the manufacturing process, and realize automated material management. Through the collaborative processing of the first wafer detection device and the second wafer detection device, wafer detection can be performed on two wafer cassettes respectively to improve the efficiency of wafer detection in a limited space. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the cabinet-type wafer storage device of the present invention.

[0017] Figure 2 This is a schematic diagram of the cabinet-type wafer storage device of the present invention from another angle.

[0018] Figure 3 This is a schematic diagram of the internal structure of the cabinet of the present invention.

[0019] Figure 4 This is a schematic diagram of the structure of the movable frame of the present invention.

[0020] Figure 5 This is a partial enlarged view of the wafer cassette conveyor area of ​​the present invention.

[0021] Figure 6 This is a schematic diagram of the push-pull cable protection module of the present invention.

[0022] Figure 7 This is a schematic diagram showing the installation positions of the external electric gate and the internal electric gate of the present invention.

[0023] Figure 8 This is a schematic diagram of the wafer transfer and positioning device of the present invention.

[0024] Figure 9 This is a partial enlarged view of the wafer transfer and positioning device of the present invention.

[0025] Figure 10This is a schematic diagram showing the mounting position of the slider according to the present invention.

[0026] Figure 11 This is a schematic diagram of the cable protection structure of the present invention.

[0027] Figure 12 This is a schematic diagram of the structure of the multifunctional wafer transfer robot of the present invention.

[0028] Figure 13 This is a schematic diagram of the internal structure of the housing of the present invention.

[0029] Figure 14 This is a schematic diagram showing the installation position of the position and quantity identification element of the present invention.

[0030] Reference numerals: Cabinet 1, Input Port 2, Signal Light 3, Embedded Door Handle 4, Display 5, Emergency Stop Button 6, Filter 7, Inspection Door 8, Window 9, Wafer Cage Storage Area 10, Wafer Transfer Positioning Device 11, Second Wafer Protrusion Detection Device 12, Wafer Cage Storage Platform 13, Wafer Cage Conveyor Area 14, Electrical Control Module 15, Movable Frame 16, Wafer Cage Storage Station 17, Main Body 18, Sub-body 19, Limiting Block 20, First Drive Device 21, Common Pressure Sensing Identification Element 22, First Pressure Sensing Identification Element 23, Second Pressure Sensing Identification Element 24, First Linear Guide Rail 25, Second Linear Guide Rail 26, Anti-collision Block 27, Connecting Block 28, Connecting Plate 29, First Cable Carrier 30, First Cable Carrier Plate 31, External Electric Gate 32, Internal Electric Gate 33, Machine Body 34, Wafer Protrusion Detection Platform 35, Wafer Positioner 36. First protruding detection element; 37. Bracket; 38. Limiting block base plate; 39. Second protruding detection element; 40. Slide back plate; 41. Second drag chain; 42. Vertical slide; 43. Mounting frame; 44. Robotic arm; 45. Multifunctional wafer transfer robot; 46. Positioner placement platform; 47. Slider; 48. Slide top cover; 49. Vertical assembly gap; 50. Second drag chain plate; 51. Ceramic chuck; 52. Base; 53. Housing; 54. Wafer gripper housing; 55. Frame; 56. Second clamping block; 57. First clamping block; 58. Second support block; 59. First support block; 60. Baffle; 61. Solenoid valve seat; 62. Solenoid valve; 63. Air duct; 64. Speed ​​control valve; 65. Third drive device; 66. Moving block; 67. Vertical slide; 68. Horizontal slide; 69. Active transmission rod; 70. Passive transmission rod; 71. Position and quantity identification element; 72. Wafer positioning stage; 73. Support column; 74. Detailed Implementation

[0031] The embodiments of this application will now be described in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. Furthermore, the following embodiments and features can be combined with each other unless otherwise specified. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] Reference Appendix Figure 1-13 A cabinet-type wafer storage device includes: a cabinet 1, a movable frame 16, a wafer cassette conveyor area 14, a wafer cassette storage area 10, a wafer conveyor positioning device 11, a second wafer protrusion detection device 12, and an electrical control module 15.

[0034] In this embodiment, refer to the appendix Figure 2 A window 9 is provided on the back of the cabinet 1 for transferring the wafer to the furnace boat. The position of the window 9 corresponds to the position of the wafer box storage area 10, so as to transfer the wafer in the wafer box to the furnace boat for heat treatment, thereby reducing the complexity of operation and the potential risk of contamination.

[0035] In this embodiment, refer to the appendix Figure 4 The movable frame 16 is located inside the cabinet 1 and is connected to the inner wall of the cabinet 1 via a push-pull cable protection module. The lower end of the movable frame 16 is fixedly installed with a wafer cassette conveyor area 14 for receiving and buffering wafer cassettes of various sizes, and the upper end of the movable frame 16 is fixedly installed with a wafer cassette storage area 10 for storing wafer cassettes of various sizes.

[0036] In this embodiment, refer to the appendix Figure 6During maintenance, to protect the cables that move with the movable frame 16 and to facilitate the movement of the movable frame 16, this application designs a push-pull cable protection module. This module includes a first linear guide rail 25, a second linear guide rail 26, anti-collision blocks 27, connecting blocks 28, connecting plates 29, a first drag chain 30, and a first drag chain plate 31. During assembly, the first linear guide rail 25 and the second linear guide rail 26 are fixed to the inner wall of the cabinet 1 from top to bottom, and the length extension direction of the first linear guide rail 25 and the second linear guide rail 26 is the same as the push-pull movement direction of the movable frame 16. Anti-collision blocks 27 are fixed to the ends of the first linear guide rail 25 and the second linear guide rail 26 near the maintenance door 8 to prevent the first linear guide rail 25 and the second linear guide rail 26 from falling off due to external impacts. Connecting blocks 28 are slidably connected to both the first linear guide 25 and the second linear guide 26. The two connecting blocks 28 are fixedly connected to the connecting plate 29, which is used to enable the connecting plate 29 to reciprocate on the first linear guide 25 and the second linear guide 26 through the connecting blocks 28. The connecting plate 29 is fixedly connected to the movable frame 16, which is used to enable the movable frame 16 to push and pull. One end of the first drag chain 30 is fixedly connected to the first drag chain plate 31, and the other end is fixedly connected to the connecting plate 29. The first drag chain plate 31 is fixedly connected to the movable frame 16, and the cables of the electrical components that need to be protected (mainly the cables of the electrical components in the wafer cassette conveyor area 14 and the wafer cassette storage area 10 installed on the movable frame 16) are concentratedly installed in the first drag chain 30, so as to make the wiring neat and protect the cables, thereby protecting the cables from wear, pulling and damage caused by the pushing and pulling movement of the movable frame 16.

[0037] In this embodiment, for ease of maintenance, an inspection door 8 is connected to the front of the cabinet 1 via a hinge. To increase the sealing between the inspection door 8 and the cabinet 1, a sealing element is provided between the inspection door 8 and the cabinet 1. This sealing element can be made of rubber gasket and is located at the connection between the inspection door 8 and the cabinet 1, thereby ensuring the cleanliness of the internal environment of the cabinet 1 and ensuring the safety of the wafers when they are transferred or stored inside the cabinet 1.

[0038] In this embodiment, refer to the appendix Figure 1 In order to meet production needs and facilitate operation, the maintenance door 8 of this application is also equipped with an embedded door handle 4 for easy opening and closing, an emergency stop button 6 for emergency shutdown, a display 5 for displaying content when interacting with an external computer, an indicator light 3 for displaying the operating status of the cabinet-type wafer storage device, and an interface for connecting to external devices (such as USB 3.0, CAT 6, etc.).

[0039] In this embodiment, refer to the appendix Figure 1 and attached Figure 7The inspection door 8 is equipped with an input port 2 for conveying wafer cassettes from the overhead crane to the wafer cassette conveyor area 14. An external electric gate 32 is located at the input port 2 to isolate the wafer cassette conveyor area 14 from the external working environment of the cabinet 1. An internal electric gate 33 is located at the rear end of the wafer cassette conveyor area 14 to isolate the wafer cassette conveyor area 14 from the internal working environment of the cabinet 1. External electric gates 32 and internal electric gates 33 are respectively located at the front and rear ends of the wafer cassette conveyor area 14. During operation, the external electric gate 32 is first opened, allowing the overhead crane to transport the wafer cassettes to the wafer cassette conveyor area 14. At this time, the internal electric gate 33 is closed to facilitate the loading process of the wafer cassettes. Subsequently, the external electric gate 32 is closed and the internal electric gate 33 is opened, allowing the wafer cassettes to be transferred, transported, and stored within the sealed cabinet 1. This not only ensures the cleanliness of the internal environment of the cabinet 1 but also guarantees the safety of the wafers.

[0040] In this embodiment, refer to the appendix Figure 5 The wafer cassette conveyor area 14 includes a main body 18, a split part 19 rotatably connected to both sides of the main body 18, and a first drive device 21 for controlling the horizontal rotation of the split part 19. One end of the first drive device 21 is rotatably connected to the split part 19, and the other end is rotatably connected to the main body 18. Driven by the first drive device 21, the split part 19 is rotated to facilitate control of the orientation of the wafer cassette. Both the main body 18 and the split part 19 are provided with a first size recognition unit for detecting and identifying wafer cassette size information.

[0041] In this embodiment, refer to the appendix Figure 5 The wafer cassette conveyor area 14 involved in this application can be used to buffer three wafer cassettes, that is, one wafer cassette is buffered on the main body 18 and one on each of the two separate parts 19. At the same time, in order to facilitate the multi-functional wafer conveyor robot 46 to grip the wafer cassettes, the first drive device 21 drives the separate parts 19 to rotate, so as to facilitate the control of the orientation of the wafer cassettes and thus facilitate the gripping of the wafer cassettes. The first drive device 21 can be a slow-speed cylinder to realize the rotation control of the separate parts 19.

[0042] In this embodiment, refer to the appendix Figure 5In order to detect and identify the size information of the wafer cassette, a first size identification unit is provided on both the main body 18 and the split part 19. The first size identification unit includes a limiting block 20, a common pressure sensing identification element 22 arranged on the side of the limiting block 20, and multiple pressure sensing identification elements. The common pressure sensing identification element 22 is used to perform common pressure sensing detection on wafer cassettes of all sizes. Each pressure sensing identification element is used to identify the size information of a wafer cassette of a certain size under the synergistic effect of the common pressure sensing identification element, and send the identified wafer cassette size information to the electrical control module 15 to realize traceability management of wafer cassettes of different sizes and the wafers in the wafer cassettes.

[0043] In this embodiment, refer to the appendix Figure 5 Taking 6-inch and 8-inch wafer cassettes as examples, there is one common pressure sensing element 22 and two pressure sensing elements (both pressure sensors). The two pressure sensing elements can be distinguished by the first pressure sensing element 23 and the second pressure sensing element 24. When a 6-inch wafer cassette is placed on the main body 18 or the split part 19, the common pressure sensing element 22 and the first pressure sensing element 23 together sense the pressure and can determine that the size information of the wafer cassette is 6 inches. When an 8-inch wafer cassette is placed on the main body 18 or the split part 19, the common pressure sensing element 22 and the second pressure sensing element 24 together sense the pressure and can determine that the size information of the wafer cassette is 8 inches. This allows the wafer cassette size information to be collected and fed back to the electrical control module 15, thereby realizing the traceability management of the corresponding wafer cassette and its internal wafers.

[0044] In this embodiment, the wafer cell storage area 10 includes a multi-layer wafer cell storage stage 13, each wafer cell storage stage 13 is provided with a plurality of wafer cell storage stations 17, and each wafer cell storage station 17 is provided with a second size recognition unit for detecting and identifying wafer cell size information.

[0045] In this embodiment, refer to the appendix Figure 4 This application designs a three-layer wafer cassette storage stage 13, each layer of which includes three wafer cassette storage stations 17, meaning the three-layer wafer cassette storage stage 13 can store nine wafer cassettes. Furthermore, the second size identification unit involved in this application has the same structural composition and working principle as the first size identification unit, and will not be described again here.

[0046] In this embodiment, refer to the appendix Figure 8-9The wafer transfer and positioning device 11 includes an assembly section, a second drive unit, an integration section, a multi-functional wafer transfer robot 46, a first wafer protrusion detection device, and a wafer positioning device. The assembly section is fixedly installed on the inner wall of the cabinet 1 and is located between the wafer cassette conveyor area 14 and the window 9, for transferring wafers between the wafer cassette conveyor area 14 and the window 9. The second drive unit is fixedly installed at the lower end of the assembly section, and its output end is connected to the integration section. The integration section is slidably connected to the assembly section. Driven by the second drive unit, the integration section drives the multi-functional wafer transfer robot 46, the first wafer protrusion detection device, and the wafer positioning device to move vertically up and down together. The multi-functional wafer transfer robot 46, the first wafer protrusion detection device, and the wafer positioning device are all fixedly installed on the integration section, and the first wafer protrusion detection device and the wafer positioning device are symmetrically arranged on both sides of the multi-functional wafer transfer robot 46. During the vertical upward movement of the wafer transfer robot 46, the first wafer probing detection device, and the wafer positioning device, the multi-functional wafer transfer robot 46 simultaneously transfers two wafer cassettes and the wafers within them. After transferring one wafer cassette to the first wafer probing detection device for wafer probing detection, it quickly transfers the wafers within the wafer cassette to the wafer positioning device for wafer positioning adjustment. Furthermore, after the first wafer probing detection device completes wafer probing detection, the multi-functional wafer transfer robot 46 corrects and adjusts wafers with edge probing issues. The multi-functional wafer transfer robot 46 is also equipped with position and quantity detection elements to detect the position and quantity of wafers within the wafer cassettes during the transfer process. The first wafer probing detection device is also equipped with a third size recognition unit for detecting and identifying wafer cassette size information.

[0047] In this embodiment, refer to the appendix Figure 8 and attached Figure 10 The assembly part includes a slide back plate 41, a vertical slide 43, and a slide top cover 49. The slide back plate 41 is fixed to the inner wall of the cabinet 1, the vertical slide 43 is fixed to the front end of the slide back plate 41, and the slide top cover 49 is fixed to the front end of the vertical slide 43. A vertical assembly gap 50 is formed between the vertical slide 43 and the slide top cover 49. The integrated part is slidably connected to the vertical assembly gap 50 and can be driven by the second drive device to move vertically up and down along the length extension direction of the vertical assembly gap 50.

[0048] In this embodiment, refer to the appendix Figure 8 and attached Figure 10The integrated unit includes a slider 48 and a mounting bracket 44. The slider 48 is slidably connected at the vertical assembly gap 50, and the mounting bracket 44 is fixedly connected to the slider 48. The multi-functional wafer transfer robot 46, the first wafer detection device, and the wafer positioning device are fixedly connected to the mounting bracket 44. The first wafer detection device and the wafer positioning device are arranged on both sides of the multi-functional wafer transfer robot 46 so that, under the driving action of the second drive device, the slider 48 drives the mounting bracket 44 and the multi-functional wafer transfer robot 46, the first wafer detection device, and the wafer positioning device to move vertically up and down together. In addition, the second drive device involved in this application can be a cylinder or a motor to realize the vertical lifting and lowering movement control of the multi-functional wafer transfer robot 46, the first wafer detection device, and the wafer positioning device.

[0049] In this embodiment, refer to the appendix Figure 11 To protect the cables that move vertically with the multi-functional wafer transfer robot 46, the first wafer probing detection device, and the wafer positioning device, this application designs a cable protection structure. The cable protection structure includes a second drag chain plate 51 and a second drag chain 42. The second drag chain plate 51 is fixed to the slider 48. One end of the second drag chain 42 is fixed to the drag chain plate, and the other end is fixed to the vertical slide 43. The cables of the electrical components that need to be protected (mainly the cables of the multi-functional wafer transfer robot 46, the first wafer probing detection device, and the wafer positioning device) are centrally installed in the second drag chain 42. On the one hand, the wiring is neater, and on the other hand, the cables are well protected from wear and tear.

[0050] In this embodiment, refer to the appendix Figure 8 The multi-functional wafer transfer robot 46 includes a body 34 with its own vertical transmission, a robotic arm 45, a base 53, wafer grippers, and wafer box grippers.

[0051] Further, see attached document. Figure 8 The robot body 34 is a commercially available product, and its model includes, but is not limited to, UTX-FS6000ASYST wafer semiconductor robot body, etc. It can be flexibly selected according to actual production needs, as long as it can achieve its own lifting and moving, and there are no further restrictions here.

[0052] Further, see attached document. Figure 8 The robotic arm 45 includes two sub-robotic arms that are controlled by three joint axes on a horizontal plane to achieve horizontal handling of wafers.

[0053] Furthermore, the base 53 is fixedly mounted on the joint axis at the uppermost end of the robotic arm 45, and the wafer gripper and wafer cassette gripper are respectively set on both sides of the base 53 to synchronously transfer the wafer cassette and the wafer, and to effectively reduce the space occupancy rate.

[0054] Further, see attached document. Figure 12 The wafer gripper includes a wafer gripper control unit disposed inside the base 53 and a wafer gripper part disposed on the side of the base 53. The wafer gripper control unit includes an electromagnetic valve seat 62 fixed inside the base 53, an electromagnetic valve 63 fixed to the electromagnetic valve seat 62, an air guide pipe 64, and a speed regulating valve 65 disposed on the air guide pipe 64. The electromagnetic valve 63 is connected to the wafer gripper part through the air guide pipe 64 to control the wafer gripper part to grip or release the wafer. At the same time, under the action of the speed regulating valve 65, the airflow rate is regulated. The wafer gripper can control the adsorption force of the wafer to avoid the wafer falling off or being damaged due to too small or too large adsorption force. The wafer gripper includes a wafer gripper housing 55 and a ceramic chuck 52 disposed on the wafer gripper housing 55. Both the wafer gripper housing 55 and the ceramic chuck 52 have interconnected air channels. The air channels inside the wafer gripper housing 55 are connected to the air guide tube 64. The surface of the ceramic chuck 52 has multiple adsorption ports that are connected to its internal air channels to realize the adsorption gripping or release of the wafer.

[0055] Further, see attached document. Figure 12-14The wafer cassette gripper includes a wafer cassette gripper control unit on the side of the base 53 and a wafer cassette gripper portion slidably connected to the wafer cassette gripper control unit. The wafer cassette gripper control unit includes a housing 54, a third drive device 66 fixed inside the housing 54 (the third drive device 66 can be a cylinder or a motor to realize the vertical lifting and lowering movement control of the moving block 67), a moving block 67 disposed at the output shaft end of the third drive device 66, a vertical slide rail 68 fixed inside the housing 54 and slidably connected to the moving block 67, a horizontal slide rail 69 fixed inside the housing 54 and slidably connected to the wafer cassette gripper portion, and a rotatably connected to the moving block 67. The above-mentioned conveying device is used to drive the wafer cassette gripper to move horizontally and reciprocally. The housing 54 has a rectangular structure. The third drive device 66, the moving block 67, and the vertical slide rail 68 are all located at the vertical centerline of the housing 54. The conveying device includes a pair of conveying elements, which are correspondingly arranged on both sides of the third drive device 66. Each conveying element includes a driving rod 70 and a driven rod 71. One end of the driving rod 70 is rotatably connected to the moving block 67, and the other end is rotatably connected to the middle of the driven rod 71. The two ends of the driven rod 71 are respectively connected to the wafer cassette gripper and move horizontally and reciprocally with the third drive device 66. The device 66 drives the moving block 67 to move vertically upward, which in turn drives the active transmission rod 70 to rotate inward, thereby driving the passive transmission rod 71 and the wafer cassette gripper to move inward along the horizontal slide rail 69, thus realizing the gripping process of the wafer cassette. Similarly, as the third drive device 66 drives the moving block 67 to move vertically downward, it drives the active transmission rod 70 to rotate outward, thereby driving the passive transmission rod 71 and the wafer cassette gripper to move outward along the horizontal slide rail 69, thus realizing the release process of the wafer cassette. The wafer cassette gripper includes a frame 56, a first gripping block 58, a second gripping block 57, and a third gripping block 58. The frame 56 has a concave structure, with two protruding ends that pass through the housing 54 and are slidably connected to it. At the same time, these two protruding ends are fixedly connected to the two ends of the passive transmission rod 71. Compared with a rectangular frame 56 or a frame 56 with one end (similar to a convex structure), the concave structure of the frame 56 can not only improve the stability of the overall structure of the wafer cassette clamping part in reciprocating translational motion, but also reduce weight and save material costs.Meanwhile, the "protruding" end of the frame 56 is slidably connected to the horizontal slide rail 69. To further improve the stability of the frame 56's movement, the number of horizontal slide rails 69 can be set to two, that is, the two ends of the frame 56 are respectively slidably engaged with the horizontal slide rails 69. With the transmission action of the transmission device and the guiding action of the horizontal slide rails 69, the frame 56 reciprocates along the length extension direction of the horizontal slide rails 69. The first clamping block 58 and the second clamping block 57 are fixed to the frame 56 from the inside to the outside. The first support block 60 and the second support block 59 are both fixed to the frame 56, and the first support block 60 and the second support block 59 are respectively arranged at the lower ends of the first clamping block 58 and the second clamping block 57. When the drive device drives the frame 56 to reciprocate, the first clamping block 58 and the second clamping block 57 respectively clamp the wafers of the corresponding size, and under the action of the first support block 60 and the second support block 59, the wafers can be prevented from falling. To improve transport safety, wafer cassettes of various sizes are detached during handling. A baffle 61 is positioned on the side of the frame 56 facing the wafer cassette to protect the wafers inside. A position and quantity identification element 72 is fixed to the baffle 61 to detect the position and quantity of wafers within the cassette. The position and quantity identification element 72 can be an FU18M fiber optic sensor. Additionally, 25 FU18M fiber optic sensors can be installed in a stepped configuration on both sides of the vertical centerline of the baffle 61. It should be noted that the number of FU18M fiber optic sensors corresponds to the maximum wafer capacity within the wafer cassette; that is, the maximum wafer capacity is 25 wafers for all wafer cassette sizes, and the spacing between adjacent wafers within the cassette is the same. Therefore, after deploying 25 FU18M fiber optic sensors at the corresponding positions within the wafer cassette, the system can detect the position and quantity of wafers in wafer cassettes of different sizes, providing a wide detection range.

[0056] In this embodiment, refer to the appendix Figure 8-9 The first wafer detection device includes a wafer detection platform 35, a support column 74, a bracket 38, a limiting block base plate 39, a first detection element 37, and a second detection element 40. The wafer detection platform 35 is fixed to the mounting frame 44, the support column 74 is fixed to the wafer detection platform 35, the limiting block base plate 39 is fixed to the top of the support column 74, one end of the bracket 38 is fixed to the side of the support column 74, and the other end is fixed to the first detection element 37. The second detection element 40 is fixed to the wafer detection platform 35 and is arranged at the lower end of the first detection element 37. During the wafer detection process, the first detection element 37 and the second detection element 40 are used to perform wafer detection detection on the wafer.

[0057] Furthermore, the first detection element 37 and the second detection element 40 can be EX-13A photoelectric sensors. The EX-13A photoelectric sensor uses NPN output, with both open-collector and bright-light output modes. It uses a red LED as the light source and has an IP67 protection rating, effectively preventing dust and water intrusion. Its working principle is based on the photoelectric effect. The EX-13A photoelectric sensor specifically consists of three parts: a transmitter, a receiver, and a detection circuit. The transmitter emits a light beam, the receiver receives the reflected or transmitted light signal, and the detection circuit converts the change in light intensity into an electrical signal. During the wafer probing inspection process, the multi-functional wafer transfer robot 46 removes the wafer from the wafer cassette and transfers it to the wafer positioning device. During this process, the edge of the removed wafer enters the detection range formed by the EX-13A photoelectric sensor, enabling edge probing inspection and detection of the wafer. It can also detect defects or features on the wafer. Defects can be detected by comparing the image of the chip under inspection with the image of adjacent chips. If there are no defects on the wafer, they can be determined by digital signals, thereby improving the performance and reliability of the final product.

[0058] In this embodiment, the third size identification unit is disposed on the bottom plate 39 of the limiting block to detect and identify the size information of the wafer box on the first wafer protrusion detection device; in addition, the third size identification unit involved in this application has the same structure and working principle as the first size identification unit, and will not be described again here.

[0059] In this embodiment, refer to the appendix Figure 8-9 The wafer positioning device includes a locator placement platform 47 fixed to the mounting frame 44 and a wafer locator 36 fixed to the locator placement platform 47. In order to effectively reduce the time for the multi-functional wafer transfer robot 46 to transfer wafers between the first wafer detection device and the wafer positioning device, the wafer positioning stage 73 of the wafer locator 36 and the placement area of ​​the limiting block base plate 39 are located at the same height.

[0060] In this embodiment, the wafer locator 36 involved in this application is a commercially available product, and its model includes, but is not limited to, the HAL200V-0408S_Aligner calibrator. It can be flexibly selected according to actual production needs, as long as it can achieve wafer positioning; no further limitation is made here. It should be noted that each wafer has a notch, which is used to position the wafer. During wafer positioning, the multi-functional wafer transfer robot 46 first places the wafer at the wafer positioning stage 73 of the wafer locator 36. Then, the wafer locator 36 rotates the wafer, and by detecting the position of the notch, the wafer is adjusted to a preset position. Specifically, the notch position corresponds to the preset position, thereby ensuring the accuracy and consistency of the wafer in subsequent processing steps.

[0061] In this embodiment, a second wafer detection device 12 is also fixedly installed inside the cabinet 1. The second wafer detection device 12 is located at the rear end of the wafer box storage area 10. After the multi-functional wafer transfer robot transfers one wafer box from the wafer box transfer machine area to the first wafer detection device for wafer detection, the multi-functional wafer transfer robot picks up another wafer box from the wafer box transfer machine area again. Driven by the second drive device, the multi-functional wafer transfer robot transfers the other wafer box to the second wafer detection device for collaborative wafer detection, thereby improving the wafer detection efficiency in a limited space.

[0062] In this embodiment, the second wafer detection device 12 has the same structure and working principle as the first wafer detection device, and will not be described again here. The second wafer detection device 12 and the first wafer detection device together perform wafer detection to improve the efficiency of wafer detection within a limited space. Additionally, a fourth size identification unit is disposed on the limiting block base plate of the second wafer detection device 12 to detect and identify the size information of the wafer cassette on the second wafer detection device 12. Furthermore, the fourth size identification unit involved in this application has the same structure and working principle as the first size identification unit, and will not be described again here.

[0063] In this embodiment, the collaborative processing of the second wafer detection device 12 and the first wafer detection device includes: firstly, the multi-functional wafer transfer robot transports one wafer cassette from the wafer cassette transport area to the first wafer detection device for wafer detection; then, the multi-functional wafer transfer robot picks up another wafer cassette from the wafer cassette transport area, and through the second drive device, drives the integration unit, the multi-functional wafer transfer robot, the first wafer detection device, and the wafer positioning device to move vertically upwards together, transporting the other wafer cassette to the second wafer detection device for collaborative wafer detection, thereby improving the efficiency of wafer detection in areas with... The efficiency of wafer detection within a limited space; when performing wafer detection on wafers in a wafer cassette using either the first or second wafer detection device, if edge protrusion issues occur, a multi-functional wafer transfer robot corrects and adjusts the wafers with edge protrusion problems; then, the second and first wafer detection devices transmit their respective detection data to an external upper-level control system (such as a host computer). The upper-level control system comprehensively analyzes the two detection data, identifies and eliminates abnormal data, obtains analysis results, and, based on the analysis results, can... A comprehensive inspection report is generated, and based on this report, the inspection parameters (such as inspection distance) of the second wafer detection device 12 and the first wafer detection device can be dynamically adjusted. Applying these optimized inspection parameters to subsequent inspection tasks effectively improves inspection accuracy and efficiency. Simultaneously, machine learning algorithms can automatically optimize the collaborative processing flow between the second and first wafer detection devices. This involves predicting and adjusting the motion trajectories of the vertical slide and the multi-functional wafer transfer robot based on historical detection data and the current inspection task, thereby reducing inspection time and errors. During the inspection process, further optimization can be achieved through… The system monitors the operating status and detection data of the second wafer detection device 12 and the first wafer detection device in real time. If any abnormality is detected (such as a deviation in the operating status of the second or first wafer detection device 12, or abnormal detection data), the detection must be stopped immediately, and the anomaly handling procedure must be initiated. Depending on the type of anomaly, appropriate measures can be taken, such as recalibration or wafer replacement. The anomaly handling results and improvement measures are fed back and stored in the upper-level control system for subsequent optimization and improvement. Regular maintenance and upgrades of the cabinet-type wafer storage device ensure its long-term stable operation. Furthermore, it should be noted that the first wafer detection device, the second wafer detection device 12, the multi-functional wafer transfer robot 46, and the wafer cassette storage area 10 are positioned at the same height. During collaborative wafer detection, the multi-functional wafer transfer robot 46 only needs to move vertically, radially, and articulately within a very small space to improve the efficiency of wafer detection.

[0064] In this embodiment, refer to the appendix Figure 1 and attached Figure 6 The top of the cabinet 1 is equipped with a filter 7. By setting the filter 7, contaminants that may affect the wafer surface and process equipment, including particles, organic matter, and metal impurities, can be removed, thereby ensuring the cleanliness of the internal environment of the cabinet 1.

[0065] In this embodiment, in order to facilitate the movement of the cabinet 1, casters can be installed at the bottom of the cabinet 1. At the same time, in order to improve the stability of the cabinet 1 during use, lifting anti-vibration feet can also be installed at the four corners of the bottom of the cabinet 1 to improve the convenience of using the cabinet 1.

[0066] In this embodiment, refer to the appendix Figure 3 This application also includes an electrical control module 15 fixedly installed inside the cabinet 1. The wafer cassette conveyor area 14, the wafer cassette storage area 10, and the wafer conveying and positioning device 11 are electrically connected to the electrical control module 15, respectively, for integrated control and traceability management of wafer cassettes of various sizes and the wafers within them during the conveying and storage process. When the trolley conveys a wafer cassette of a certain size to the wafer cassette conveyor area 14, the wafer cassette conveyor area 14 receives and buffers the corresponding size wafer cassette, collects and sends the buffer position information and wafer cassette size information of the wafer cassette to the electrical control module 15, and the electrical control module 15 receives the buffer position information and wafer cassette size information of the wafer cassette. Subsequently, the wafer transfer and positioning device 11, positioned at the origin, grips two wafer cassettes in the wafer cassette conveyor area 14. During the vertical upward movement of the wafer transfer and positioning device, detection and positioning commands are executed to perform wafer probing detection and wafer positioning processing on the wafer in one of the wafer cassettes. When the wafer transfer and positioning device moves to the second wafer probing detection device, the second wafer probing detection device performs collaborative wafer probing detection on the wafer in the other wafer cassette. After the wafer probing detection and wafer positioning processing are completed, the wafer transfer and positioning device 11 transfers the wafer cassette to the wafer cassette storage area 10 or transfers the wafer in the wafer cassette to the furnace body's wafer boat. The electrical control module 15 involved in this application is the main control panel, which is a core component for constructing the cabinet-type wafer storage device and is responsible for managing and controlling the storage, transfer, and transmission processes of the wafers. By setting up a master control panel, it is possible to track inventory and material flow in real time, improve product quality and traceability of the manufacturing process, and realize automated material management. At the same time, the master control panel usually needs to be connected to an external host computer to realize the warehousing and outbound operations of wafer boxes.

[0067] In this embodiment, the present application also provides a storage control method for a cabinet-type wafer memory device, including the following steps.

[0068] Step 1: First, securely install the cabinet-type wafer storage device onto the front end of the input port of the furnace body crystal boat, and then power on the cabinet-type wafer storage device.

[0069] Step 2: Open the external electric gate 32 and transport the wafer cassette to the wafer cassette conveyor area 14 by the overhead crane. The main body 18 or the split part 19 of the wafer cassette conveyor area 14 receives and buffers the wafer cassette. The buffer position information and wafer cassette size information of the wafer cassette are collected and sent to the electrical control module 15 through the first size recognition unit. At this time, the internal electric gate 33 is in the closed state.

[0070] Step 3: After the wafer cassette conveyor area 14 has received and buffered the wafer cassettes, the external electric gate 32 is closed and the internal electric gate 33 is opened. After receiving the buffer position information and wafer cassette size information of the wafer cassettes, the electrical control module 15 controls the multi-functional wafer conveying robot 46, which is at the origin position, to grip the two wafer cassettes in the wafer cassette conveyor area 14. During the gripping of each wafer cassette, the position and quantity of the wafers in the wafer cassettes are detected by the position and quantity detection elements, and the position and quantity detection information is sent to the electrical control module 15. Then, the two wafer cassettes are respectively conveyed to the first wafer protrusion detection device and the second wafer protrusion detection device 12 for wafer protrusion detection.

[0071] Furthermore, in order to improve the cleanliness of the internal environment of cabinet 1, the external electric gate 32 can be opened before the overhead crane transports the wafer box to the wafer box conveyor area 14 each time.

[0072] Furthermore, before the multi-functional wafer transfer robot 46 grips the wafer cassette in the wafer cassette conveyor area 14, the process includes: resetting the wafer transfer positioning device 11 to its origin. This involves the following steps: First, the wafer transfer positioning device 11 receives the gripping command sent by the electrical control module 15 and needs to determine whether it is at its origin. This can be done by setting a position sensor, such as an optical position sensor, at the origin to monitor whether the wafer transfer positioning device 11 is at its origin, which features high precision and fast response. If the wafer transfer positioning device 11 is not at its origin, the second drive device can drive it to move vertically downward until it returns to its origin before performing the wafer cassette gripping operation.

[0073] Step 4: After the multi-functional wafer transfer robot 46 transfers one wafer cassette from the wafer cassette transfer area 14 to the first wafer probing detection device for probing detection, the multi-functional wafer transfer robot 46 picks up another wafer cassette from the wafer cassette transfer area 14. Through the second drive device, the integration unit, the multi-functional wafer transfer robot 46, the first wafer probing detection device, and the wafer positioning device move vertically upward together, transferring the other wafer cassette to the second wafer probing detection device 12 for collaborative wafer probing detection, thereby improving the efficiency of wafer probing detection in a limited space. When probing the wafer in the wafer cassette through the first wafer probing detection device or the second wafer probing detection device 12, if the wafer in the wafer cassette has an edge probing problem, the multi-functional wafer transfer robot 46 corrects and adjusts the wafer with the edge probing problem. If the wafer in the wafer cassette does not have an edge probing problem, proceed to Step 5.

[0074] Step 5: The multi-functional wafer transfer robot 46 transfers the wafers in the wafer cassette on the first wafer detection device or the second wafer detection device 12 to the wafer positioning device.

[0075] Step 6: The wafer is positioned and adjusted using a wafer positioning device, and then the multi-functional wafer transfer robot 46 places the positioned and adjusted wafer back into the corresponding wafer box.

[0076] Step 7: Repeat steps 5 and 6 until all wafers have been positioned and adjusted and placed back into their corresponding wafer cassettes. Then, use the multi-functional wafer transfer robot 46 to transfer the wafer cassettes to the wafer cassette storage area 10 or to transfer the wafers in the wafer cassettes to the furnace body crystal boat.

[0077] Furthermore, the wafer cassette conveyor area 14 involved in this application can buffer up to 3 wafer cassettes. In order to improve the detection efficiency, one wafer cassette can be placed on the first wafer detection device for wafer detection, and another wafer cassette can be placed on the second wafer detection device 12 for wafer detection. This process continues until both wafer cassettes have completed wafer detection and wafer positioning adjustment, and are then conveyed to the wafer cassette storage area 10 or the wafers inside the wafer cassettes are conveyed to the furnace body crystal boat. Then, the last wafer cassette is placed on the first wafer detection device for wafer detection and wafer positioning adjustment of its internal wafers. Finally, the wafer cassette with the positioning adjustment is conveyed to the wafer cassette storage area 10 or the wafers inside the wafer cassettes are conveyed to the furnace body crystal boat, thereby completing the conveying and storage process of the wafer cassettes and their internal wafers within the cabinet-type wafer storage device.

[0078] Furthermore, to improve the efficiency of the two wafer cassettes and their internal wafers during the wafer detection and positioning adjustment processes, the multi-functional wafer transfer robot 46, capable of simultaneously transferring wafer cassettes and wafers, is utilized. After one wafer cassette is placed on the first wafer detection device for wafer detection, the wafer cassette grippers of the multi-functional wafer transfer robot 46 grip the other wafer cassette. During the vertical upward movement of the slider 48, the integrated multi-functional wafer transfer robot 46, the first wafer detection structure, and the wafer positioning detection structure driven by the second drive device, the wafer grippers of the transfer robot grip the wafers inside the wafer cassettes on the first wafer detection device to complete the wafer positioning adjustment, thereby effectively improving the wafer detection efficiency and wafer positioning adjustment efficiency.

[0079] The above description, in conjunction with specific embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such deductions or substitutions should be considered within the scope of protection of the present invention.

Claims

1. A cabinet-type wafer storage device, characterized in that, include: The system comprises a cabinet, a window located on the back of the cabinet for transferring wafers to the furnace boat, a wafer cassette conveyor area located inside the cabinet for receiving and buffering wafer cassettes of various sizes, a wafer cassette storage area located inside the cabinet for storing wafer cassettes of various sizes, a wafer transfer positioning device fixedly installed inside the cabinet with wafer protrusion detection and positioning functions, a second wafer protrusion detection device fixedly installed inside the cabinet for assisting the wafer transfer positioning device in wafer protrusion detection, and an electrical control module fixedly installed inside the cabinet. The wafer cassette conveyor area, wafer cassette storage area, wafer transfer positioning device, and second wafer protrusion detection device are electrically connected to the electrical control module to achieve integrated control and traceability management of wafer cassettes of various sizes and the wafers within them during the transfer and storage process. After the trolley transfers a wafer cassette of a certain size to the wafer cassette conveyor area, the wafer cassette... The conveyor area receives and buffers wafer cassettes of the corresponding size, collects and sends the buffer position information and wafer cassette size information to the electrical control module. After receiving the buffer position information and wafer cassette size information, the electrical control module controls the wafer conveying positioning device at the origin position to clamp two wafer cassettes in the wafer cassette conveyor area. During the vertical upward movement with the wafer conveying positioning device, detection and positioning commands are executed to perform wafer protrusion detection and wafer positioning processing on the wafer in one of the wafer cassettes. When the wafer conveying positioning device moves to the second wafer protrusion detection device, the second wafer protrusion detection device performs collaborative wafer protrusion detection on the wafer in the other wafer cassette. After the wafer protrusion detection and wafer positioning processing are completed, the wafer conveying positioning device transfers the wafer cassette to the wafer cassette storage area or transfers the wafer in the wafer cassette to the furnace body crystal boat. The wafer cassette conveyor area includes a main body, a split section rotatably connected to both sides of the main body, and a first drive device for controlling the horizontal rotation of the split section. One end of the first drive device is rotatably connected to the split section and the other end is rotatably connected to the main body. Driven by the first drive device, the split section is rotated to facilitate control of the orientation of the wafer cassette. Both the main body and the split section are provided with a first size recognition unit for detecting and identifying wafer cassette size information. The wafer cassette storage area is positioned corresponding to the window position to improve the convenience of transferring wafers to the furnace boat. The wafer cassette storage area includes multiple wafer cassette storage platforms. Each wafer cassette storage platform is provided with multiple wafer cassette storage stations. Each wafer cassette storage station is provided with a second size recognition unit for detecting and identifying wafer cassette size information.

2. The cabinet-type wafer storage device according to claim 1, characterized in that, The front of the cabinet is connected to an inspection door via a hinge. The inspection door has an input port for transferring wafer cassettes from the overhead crane to the wafer cassette conveyor area. The input port is equipped with an external electric gate for isolating the wafer cassette conveyor area from the external working environment of the cabinet. The rear end of the wafer cassette conveyor area is equipped with an internal electric gate for isolating the wafer cassette conveyor area from the internal working environment of the cabinet.

3. A cabinet-type wafer storage device according to claim 2, characterized in that, The cabinet is equipped with a movable frame. The movable frames of the wafer box conveyor area and the wafer box storage area are both fixed to the movable frame. The upper and lower ends of the inner side wall of the cabinet are equipped with push-pull cable protection modules. The push-pull cable protection modules are used to store and protect the cables during maintenance work as the movable frame is pulled out, and to facilitate the pulling out and pushing in of the movable frame.

4. A cabinet-type wafer storage device according to claim 1, characterized in that, The wafer transfer and positioning device includes an assembly unit, a second drive unit, an integration unit, a multi-functional wafer transfer robot, a first wafer protrusion detection device, and a wafer positioning device. The assembly unit is fixedly installed on the inner wall of the cabinet and positioned between the wafer cassette conveyor area and the window, for movement between them. The second drive unit is fixedly installed at the lower end of the assembly unit, and its output end is connected to the integration unit. The integration unit is slidably connected to the assembly unit. Driven by the second drive unit, the integration unit drives the multi-functional wafer transfer robot, the first wafer protrusion detection device, and the wafer positioning device to move vertically up and down together. All three components are fixedly installed on the integration unit. During the vertical upward movement together with the wafer positioning device, the multi-functional wafer transfer robot is used to simultaneously transfer two wafer cassettes and the wafers inside them. After transferring one of the wafer cassettes to the first wafer protrusion detection device for wafer protrusion detection, it quickly transfers the wafers inside the wafer cassette to the wafer positioning device for wafer positioning adjustment. After the first wafer protrusion detection device completes the wafer protrusion detection, the multi-functional wafer transfer robot corrects and adjusts wafers with edge protrusion problems. The multi-functional wafer transfer robot is also equipped with position and quantity detection elements to detect the position and quantity of the wafers inside the wafer cassettes during the process of the multi-functional wafer transfer robot transferring the wafer cassettes to the first wafer protrusion detection device. The first wafer protrusion detection device is also equipped with a third size recognition unit for detecting and identifying the size information of the wafer cassettes.

5. A cabinet-type wafer storage device according to claim 4, characterized in that, The second wafer detection device is located at the rear end of the wafer cassette storage area. The second wafer detection device is equipped with a fourth size recognition unit for detecting and identifying wafer cassette size information. After the multi-functional wafer transfer robot transfers one wafer cassette from the wafer cassette transfer area to the first wafer detection device for wafer detection, the multi-functional wafer transfer robot picks up another wafer cassette from the wafer cassette transfer area. Driven by the second drive device, the multi-functional wafer transfer robot transfers the other wafer cassette to the second wafer detection device for collaborative wafer detection, thereby improving the efficiency of wafer detection in a limited space.

6. A cabinet-type wafer storage device according to claim 5, characterized in that, The first size identification unit, the second size identification unit, the third size identification unit, and the fourth size identification unit all include a limiting block, a common pressure sensing identification element arranged on the side of the limiting block, and multiple pressure sensing identification elements. The common pressure sensing identification element is used to perform common pressure sensing detection on wafer cassettes of all sizes. Each pressure sensing identification element is used to identify the size information of a wafer cassette of a certain size under the synergistic effect of the common pressure sensing identification element, and send the identified wafer cassette size information to the electrical control module to realize traceability management of wafer cassettes of different sizes and the wafers in the wafer cassettes.

7. A cabinet-type wafer storage device according to claim 1, characterized in that, A filter is installed on the top of the cabinet.

8. A storage control method for a cabinet-type wafer memory device according to any one of claims 1-7, characterized in that, Includes the following steps: Step 1: First, securely install the cabinet-type wafer storage device onto the front end of the input port of the furnace body's wafer boat, and then power on the cabinet-type wafer storage device; Step 2: Open the external electric gate and transport the wafer box to the wafer box conveyor area by the overhead crane. The main body or the split part of the wafer box conveyor area receives and buffers the wafer box. The first size recognition unit collects and sends the buffer position information and wafer box size information of the wafer box to the electrical control module. At this time, the internal electric gate is in the closed state. Step 3: After the wafer cassette conveyor area has received and buffered the wafer cassettes, the external electric gate is closed and the internal electric gate is opened. After the electrical control module receives the buffer position information and wafer cassette size information, it controls the multi-functional wafer conveying robot arm at the origin position to grip the two wafer cassettes in the wafer cassette conveyor area. During the gripping of each wafer cassette, the position and quantity of the wafers in the wafer cassette are detected by the position and quantity detection elements, and the position and quantity detection information is sent to the electrical control module. Then, the two wafer cassettes are respectively conveyed to the first wafer protrusion detection device and the second wafer protrusion detection device for wafer protrusion detection. Step 4: After the multi-functional wafer transfer robot transports one wafer cassette from the wafer cassette transport area to the first wafer probing detection device for wafer probing detection, the multi-functional wafer transfer robot picks up another wafer cassette from the wafer cassette transport area. The second drive device drives the integration unit, the multi-functional wafer transfer robot, the first wafer probing detection device, and the wafer positioning device to move vertically upwards together, transporting the other wafer cassette to the second wafer probing detection device for collaborative wafer probing detection. This improves the efficiency of wafer probing detection within a limited space. When the wafers in the wafer cassettes are probing detected by the first or second wafer probing detection device, if edge probing issues occur, the multi-functional wafer transfer robot corrects and adjusts the wafers with edge probing issues. If no edge probing issues occur, proceed to Step 5. Step 5: The wafers in the wafer cassette on the first or second wafer protrusion detection device are transferred to the wafer positioning device by a multi-functional wafer transfer robot. Step 6: The wafer is positioned and adjusted using a wafer positioning device, and then the multi-functional wafer transfer robot is used to place the positioned and adjusted wafer back into the corresponding wafer box. Step 7: Repeat steps 5 and 6 until all wafers have been positioned and adjusted and placed back into their corresponding wafer cassettes. Then, use a multi-functional wafer transfer robot to transfer the wafer cassettes to the wafer cassette storage area or to transfer the wafers in the wafer cassettes to the furnace boat.

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