Open type loading equipment suitable for feeding semiconductor equipment

Abstract

The invention discloses open type loading equipment suitable for feeding of semiconductor equipment, and belongs to the technical field of semiconductor manufacturing equipment, the open type loading equipment comprises a frame body and a shell fixed on the frame body, and a loading platform is arranged in the frame body. A sensor module and a communication interface are integrated on the loading platform, an openable and closable cover shell is arranged outside the loading platform, the cover shell is made of PC anti-static materials in a splicing and adhering mode and is provided with a magnetic attraction structure and a torque hinge, and stable opening and slow descending closing of a turning cover can be achieved. The loading platform is provided with a sensor, an RFID module and a limiting mechanism, the specifications of the material boxes can be automatically recognized, adjustment and positioning can be achieved, and the feeding precision is improved. An air supply module is arranged in the equipment, airflow is dynamically adjusted through an infrared sensor and a differential pressure sensor, and an anti-pollution barrier is formed. Modular design is adopted, compatibility and function extension of various material boxes are supported, and the automatic feeding device has the advantages of being low in cost, high in flexibility and easy to maintain and meets the feeding requirement of semiconductor manufacturing equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing equipment, in particular to an open loading device suitable for loading semiconductor equipment. Background Art

[0002] Currently, semiconductor equipment loading primarily utilizes SMIF (Standard Mechanical Interface) and LoadPort technologies. These technologies can meet high cleanliness requirements, but they are costly. For operations that do not require a high cleanliness environment, such as loading and unloading PFA cassettes, purchasing SMIF or LoadPort equipment is uneconomical. While existing solutions such as adapter plates exist, they still present issues such as poor compatibility, high costs, and inconvenient maintenance. Patent US20240047253A1 discloses a substrate loading device for semiconductor manufacturing equipment. The device includes a pickup device for moving the cassette in multiple directions, an elevator defining multiple waiting spaces, a stage for supporting the cassette, and an insertion device for transferring substrates within the cassette. This improves production efficiency by allowing for simultaneous loading and replacement of cassettes. The patent's substrate loading device has a complex mechanical structure, leaving room for improvement in semiconductor equipment loading. There is an urgent need for a low-cost loading device for semiconductor equipment that is compatible with multiple cassettes. Summary of the Invention

[0003] The present invention provides a modular, low-cost open loading device, aiming to solve the problems of high cost and poor compatibility in the prior art.

[0004] In order to solve the above technical problems, the present invention specifically provides the following technical solutions: An open loading device suitable for loading semiconductor equipment comprises a frame and a housing fixed to the frame. A backplate is mounted on the back of the frame, a loading platform is provided within the frame, the loading platform is equipped with a sensor module and a communication interface, and a retractable cover is provided outside the loading platform. The present invention provides an open loading device structure that, through a modular design, achieves flexibility and scalability, suitable for loading semiconductor equipment. The retractable cover design enhances operational flexibility, and the frame is equipped with an indicator light to display the operating status of the device. Preferably, the cover is equipped with a magnetic structure and a torque hinge to ensure stable opening and closing of the cover.

[0005] The loading platform is equipped with a magazine in-position sensor, a tab sensor, a limit block, and an RFID module. These ensure precise positioning and securement of the magazine. The integration of the RFID module enables automatic identification of magazine specifications and adaptive adjustment of the limit mechanism, improving the equipment's compatibility and automation, reducing manual intervention, and enhancing loading accuracy and efficiency.

[0006] The loading platform communicates with the entire machine through the wiring port and the protective coil.

[0007] The cover is made of PC anti-static material and is processed by gluing, including the top panel, side panels, and flap. The cover is made of PC anti-static material, which is lightweight and has excellent anti-static properties. The gluing method greatly reduces weight and assembly work compared to the use of additional machined parts for connection.

[0008] The top plate features a magnetic structure that provides a fixed hold when the flap is open. This ensures the flap's stability and facilitates wafer placement. The magnetic force utilizes a gradient design, controlling the spatial distribution of the magnetic field to achieve a nonlinear variation in magnetic force with distance. This ensures that: when the flap is open (e.g., from 0° to 30°), a weak magnetic force guides the flap into the attraction range, preventing sudden closure. When the flap is hovering, a strong magnetic force maintains its stable hovering position, resisting external disturbances. A slight manual force can overcome the magnetic force, allowing the flap to close or open further.

[0009] The flip cover is connected to the top plate via a torque hinge, which provides resistance when the flip cover is closed. The torque hinge prevents shock or damage caused by rapid closing of the flip cover, thus extending the life of the device.

[0010] The cover is equipped with a safety door lock to prevent the cover from being opened by mistake.

[0011] A material box pressing mechanism is provided above the loading platform. The material box pressing mechanism includes a pressing end head. The pressing end head is connected to a clamp above, and the clamp is provided with a clamp shield.

[0012] The magazine clamping mechanism also includes a support plate and a dust shield, with the clamp extending through both. The support plate is connected to the side panels, further enhancing the stability of the magazine clamping mechanism. The dust shield ensures efficient operation of the device in a clean environment.

[0013] The frame houses an air supply module, which includes a filter and fan, generating vertical upward airflow and creating negative pressure. A rectifier plate is located between the loading platform and the air supply module below. The plate features an adjustable aperture structure that dynamically adjusts the aperture opening, creating a vertical barrier that surrounds or partially surrounds the loading platform. The air supply module delivers a laminar flow of 0.6-1.2 m / s vertically upward, creating a vertical barrier that prevents external particles from entering. The negative pressure environment simultaneously directs the removal of chemical vapor contaminants generated internally.

[0014] The beneficial effects of the present invention are as follows: the present invention provides a modular, low-cost open loading device, which aims to solve the problems of high cost and poor compatibility in the prior art. The device adopts a standardized interface design, which can flexibly replace SMIF / LoadPort and support multiple functional expansions. The device includes a frame and a shell fixed to the frame, and a loading platform is provided inside the frame. The loading platform integrates a sensor module and a communication interface, and is provided with an openable and closable cover on the outside. The cover is made of PC anti-static material and is made by splicing and gluing. It has a magnetic structure and a torque hinge, which can realize the stable opening and slow closing of the flip cover. The loading platform is equipped with sensors, RFID modules and limit mechanisms, which can automatically identify the specifications of the material box and adjust the positioning to improve the loading accuracy. The equipment has a built-in air supply module, which dynamically adjusts the airflow through infrared sensors and pressure difference sensors to form an anti-pollution barrier. The present invention adopts a modular design, supports compatibility with multiple material boxes and functional expansion, has the characteristics of low cost, high flexibility and easy maintenance, and is suitable for the loading needs of semiconductor manufacturing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are merely exemplary, and those skilled in the art can, without inventive effort, derive other implementation drawings based on the provided drawings.

[0016] Figure 1 It is a structural schematic diagram of the open loading equipment of the present invention.

[0017] Figure 2 Schematic diagram of the workbench of the open loading equipment of the present invention.

[0018] Figure 3 It is a rear view of the open loading device of the present invention.

[0019] Figure 4 Schematic diagram of the material box pressing mechanism described in Example 1.

[0020] Figure 5 This is an exploded view of the material box pressing mechanism described in Example 1.

[0021] Figure 6 This is a schematic diagram of the modified loading equipment described in Example 3.

[0022] Figure 7 This is a schematic diagram of the special-shaped loading equipment described in Example 3.

[0023] Figure 8 This is a schematic diagram of the wafer flipping mechanism loading device described in Example 3.

[0024] Figure 9 This is a loading platform compatible with the 6 / 8 inch magazine described in Example 3.

[0025] Figure 10 This is a loading platform compatible with the 2 / 4-inch magazine described in Example 3.

[0026] Explanation of the reference numerals: 1-indicator light; 2-frame; 3-blocking cover; 4-magnetic structure; 5-torque hinge; 6-cover; 7-handle; 8-top plate; 9-side plate; 10-safety door lock; 11-back plate; 12-loading platform; 13-wiring port; 14-protective coil; 15-material box clamping mechanism; 1501-clamp; 1502-clamp guard; 1503-support plate; 1504-dustproof plate; 1505-clamping end; 16-second frame; 17-third frame; 18-second cover; 19-visualization window; 20-second handle; 21-buckle; 22-second loading platform; 23-third loading platform. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] The following first describes the concepts involved in this application with reference to the accompanying drawings. It should be noted that the following description of each concept is intended only to make the content of this application easier to understand and does not limit the scope of protection of this application. At the same time, the embodiments and features in the embodiments of this application can be combined with each other unless there is a conflict. The following detailed description of this application will be made with reference to the accompanying drawings and in conjunction with the embodiments.

[0029] Example 1 See also Figures 1 to 3, an open loading device suitable for loading semiconductor equipment, comprising a frame 2 and a shell fixed to the frame 2, a back plate 11 being installed on the back of the frame 2, a loading platform 12 being provided inside the frame 2, the loading platform 12 being provided with a sensor module and a communication interface, and an openable and closable cover 6 being provided outside the loading platform 12. The present invention provides an open loading device structure, which realizes the flexibility and scalability of the equipment through modular design, and is suitable for loading semiconductor equipment. The openable and closable cover 6 design enhances the operational flexibility, and the frame 2 is provided with an indicator light 1 for displaying the operating status of the equipment. Preferably, the cover 6 is provided with a magnetic structure 4 and a torque hinge 5 to achieve stable opening and closing of the cover 6. The device adopts the SMIF / LoadPort standardized installation interface, and the SMIF / LoadPort can be flexibly replaced. The shell is fixed to the frame 2 by bolts, and the blocking cover 3 cooperates with the hole of the shell. Each shell is installed independently without interfering with each other. When the equipment is maintained, it can be partially disassembled, which is convenient and quick.

[0030] The loading platform 12 is equipped with a magazine in-position sensor, a tab sensor, a stopper, and an RFID module. These ensure precise positioning and securement of the magazine. The integration of the RFID module enables automatic identification of magazine specifications and adaptive adjustment of the stopper mechanism, improving the compatibility and automation of the equipment, reducing manual intervention, and enhancing loading accuracy and efficiency.

[0031] The loading platform 12 communicates with the entire machine through the connection port 13 and the protective coil 14 .

[0032] The cover 6 is made of PC anti-static material and is fabricated by gluing together components, including a top panel 8, side panels 9, and a flip cover. The PC anti-static material is lightweight and offers excellent anti-static properties. This gluing process significantly reduces weight and assembly effort compared to methods that use additional machined parts for connection.

[0033] The top plate 8 is provided with a magnetic structure 4, which forms a positioning and holding force when the flip cover is open. The magnetic structure 4 is used to ensure the stability of the flip cover and facilitate the operator to pick up and place wafers. The magnetic attraction force adopts a gradient design. By controlling the spatial distribution of the magnetic field, the magnetic attraction force varies nonlinearly with distance to achieve the following: when the flip cover is open (such as 0°~30°), a weak magnetic force guides the flip cover into the adsorption range to avoid sudden attraction; when the flip cover is hovering, a strong magnetic force is used to maintain the flip cover in a stable hovering state to resist external force disturbances. The magnetic attraction force can be overcome by manually applying a slight external force to achieve the closing or further opening of the flip cover.

[0034] The flip cover is connected to the top plate 8 via a torque hinge 5, which provides resistance to the descent of the flip cover when it is closed. The torque hinge 5 can prevent the flip cover from being impacted or damaged by rapid closure, thereby extending the service life of the device.

[0035] A safety door lock 10 is provided on the cover 6. The safety door lock 10 is provided to prevent the flip cover from being opened due to misoperation.

[0036] like Figure 4 and Figure 5 As shown, a cartridge clamping mechanism 15 is positioned above the loading platform 12. This mechanism includes a clamping head 1505 connected to a clamp 1501 positioned above. The clamp 1501 is equipped with a clamp shield 1502. The mechanism also includes a support plate 1503 and a dust shield 1504. The clamp 1501 extends through these two components. The support plate 1503 is connected to the side panel 9, further enhancing the stability of the cartridge clamping mechanism. The dust shield 1504 ensures efficient operation of the device in a clean environment.

[0037] An air supply module is provided in the frame 2, and the air supply module includes a filter and a fan, which is used to generate a vertical upward airflow and form a negative pressure. A rectifier plate is provided between the loading platform 12 and the air supply module below. The rectifier plate has an adjustable pore structure and can dynamically adjust the opening and closing of the pores so that the airflow forms a vertical barrier that surrounds or semi-surrounds the loading platform 12. The rectifier plate is a multi-layer composite structure with evenly distributed pores. It uses multiple layers of plates with different pore sizes to gradually stabilize the airflow and prevent the vibration of the plate body caused by the impact of the airflow. The air supply module outputs 0.6-1.2m / s laminar flow vertically upward, forming a vertical barrier that makes it difficult for external particles to invade. At the same time, the negative pressure environment can directionally extract the chemical vapor pollutants generated inside.

[0038] Embodiment 2: The air supply module is further optimized based on embodiment 1.

[0039] Preferably, the air supply module is provided with an infrared sensor and a pressure difference sensor. The infrared sensor is used to detect the opening state of the cover 6. Specifically, when the flap is opened to a preset angle (such as 30°) manually or by a robotic arm, the infrared sensor detects the displacement of the flap by transmitting and receiving changes in infrared signals, transmits the detected signal to the control system, and triggers the air supply module to start. The control system adjusts the speed of the variable frequency fan and the aperture opening degree of each position of the rectifier plate in real time according to the data of the infrared sensor, forming an air barrier with a vertical gradient that changes according to the opening angle of the cover 6 to prevent the invasion of external particles. Among them, the adjustable pore structure controls the aperture opening degree of the rectifier plate as a partition control, and the infrared sensor detects the cover. When the cover 6 is opened to a certain angle, the horizontal projection coordinates of the cover 6 are calculated based on its shape. The adjustable aperture structure controls the rectifier plate apertures within the projection area to close, while the rectifier plate apertures outside the projection area to open. This creates a semi-circular airflow barrier outside the projection area, allowing airflow to escape to the open space above and preventing turbulence that causes vibration of the operating platform. Preferably, the aperture opening and closing degrees of each rectifier plate block are adjusted according to the opening of the cover 6, forming a wind-blocking interface with a vertical gradient that conforms to the motion boundary. When the infrared sensor detects that the flap is closed, the air supply module switches to standby mode to save energy. A differential pressure sensor monitors the pressure difference between the interior of the cover 6 and the external environment and feeds the data back to the control system to ensure a stable micro-negative pressure (-5Pa to -10Pa). Specifically, if the pressure difference is below the set value, the control system increases the fan speed, increasing the airflow velocity and enhancing the negative pressure effect. If the pressure difference is too high, the system reduces the fan speed to avoid excessive wind speed and airflow turbulence. When wafer pick-up and placement operations are performed manually or by a robotic arm, the infrared sensor and the pressure differential sensor work together to appropriately reduce the micro-negative pressure in the inner cavity of the cover 6 (e.g., -5Pa~-7Pa), thereby reducing the flow rate of the laminar flow output vertically upward by the air supply module, making the pick-up and placement operations more convenient.

[0040] Embodiment 3: Based on embodiment 1, the device structure is improved.

[0041] The loading platform 12 can be expanded to be compatible with various specifications of boxes. Figure 9 It is a loading platform compatible with 6 / 8 inch magazines. Figure 10 It is a loading platform compatible with 2 / 4 inch magazines.

[0042] The device can be adapted to various forms by changing the corresponding structure. For example, a magazine pressing mechanism 15 is added to the 2 / 4-inch wafer loading device to prevent the small-sized magazine from tipping over. The cover can be customized to meet the process buffer requirements of the 6 / 8-inch loading device, such as Figure 6 and Figure 7As shown in the figure, the side panels are shaped to reserve space for handle operation to improve ease of use. The device can also be transformed into a wafer flip mechanism loading device that can be quickly disassembled, such as Figure 8 As shown, the specific modification is: the cover shell 6 is replaced by a second cover shell 18, and the second cover shell 18 is provided with a visualization window 19, a second handle 20 and a buckle 21 for connecting the second cover shell 18 and the outer shell.

[0043] It should be noted that the terms used in this application are only for describing specific embodiments and are not intended to limit the scope of this application. As shown in the specification of this application, unless the context clearly indicates an exception, the words "one", "a", "a kind of" and / or "the" do not specifically refer to the singular and may also include the plural. The terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method or device comprising a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also includes elements inherent to such process, method or device. In the absence of further restrictions, the elements defined by the sentence "comprise a..." do not exclude the presence of other identical elements in the process, method or device comprising the elements.

[0044] It should also be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a communication between the internal parts of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] The embodiments and / or implementation methods described above are only used to illustrate the preferred embodiments and / or implementation methods for realizing the technology of the present invention, and do not impose any form of limitation on the implementation methods of the technology of the present invention. Any person skilled in the art may make slight changes to other equivalent embodiments without departing from the scope of the technical means disclosed in the content of the present invention, but they should still be regarded as technologies or embodiments that are essentially the same as the present invention. This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and core ideas of this application. The above is only the preferred implementation method of this application. It should be pointed out that due to the limitations of textual expression, there are objectively infinite specific structures. For ordinary technicians in this technical field, without departing from the principles of this application, they can also make several improvements, modifications or changes, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes or combinations, or the direct application of the inventive concept and technical solution to other occasions without improvement, should be regarded as the scope of protection of this application.

Claims

1. An open loading device suitable for loading semiconductor equipment, comprising a frame (2) and a housing fixed to the frame (2), characterized in that: A back plate (11) is installed on the back of the frame (2), a loading platform (12) is provided inside the frame (2), the loading platform (12) is provided with a sensor module and a communication interface, an openable and closable cover (6) is provided outside the loading platform (12), the cover (6) is provided with a magnetic attraction structure (4), and the magnetic attraction structure (4) forms a positioning and holding force when the cover (6) is in an open working condition.

2. An open loading device suitable for loading semiconductor equipment according to claim 1, characterized in that: The loading platform (12) is provided with a material box in-position sensor, a convex piece sensor, a limit block and an RFID module.

3. The open loading device for semiconductor equipment according to claim 1, characterized in that: The loading platform (12) communicates with the entire machine via a connection port (13) and a protective coil (14).

4. The open loading device for semiconductor equipment according to claim 1, characterized in that: The cover (6) is made of PC antistatic material and is processed by splicing and gluing, and comprises a top plate (8), side plates (9) and a flip cover.

5. The open loading device for semiconductor equipment according to claim 4, characterized in that: The flip cover is connected to the top plate (8) via a torque hinge (5), and the torque hinge (5) provides a slow-down resistance when the flip cover is closed.

6. The open loading device for semiconductor equipment according to claim 1, characterized in that: The cover (6) is provided with a safety door lock (10).

7. The open loading device for semiconductor equipment according to claim 1, characterized in that: A material box pressing mechanism (15) is provided above the loading platform (12). The material box pressing mechanism (15) comprises a pressing end (1505). The pressing end (1505) is connected to a clamp (1501) above. The clamp (1501) is provided with a clamp shield (1502).

8. The open loading device for semiconductor equipment according to claim 7, characterized in that: The material box pressing mechanism (15) further comprises a support plate (1503) and a dustproof plate (1504), and the clamp (1501) is arranged through the support plate (1503) and the dustproof plate (1504).

9. The open loading device for semiconductor equipment according to claim 1, characterized in that: An air supply module is provided in the frame (2), and the air supply module comprises a filter and a fan, and is used to generate an upward airflow and form a negative pressure.

10. The open loading device for semiconductor equipment according to claim 9, characterized in that: A rectifier plate is provided between the loading platform (12) and the air supply module below. The rectifier plate has an adjustable pore structure and can dynamically adjust the pore opening and closing degree so that the airflow forms a barrier surrounding or semi-surrounding the loading platform (12).

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