Chip packaging mechanical arm for semiconductor lighting device manufacturing

Abstract

The invention relates to the technical field of lighting device manufacturing, and discloses a chip packaging mechanical arm for semiconductor lighting device manufacturing, and the chip packaging mechanical arm comprises a supporting assembly which comprises a base, a guide rod fixedly connected to the side wall of the base, a fixed plate fixedly connected to the top of the guide rod, and a supporting plate slidably installed on the side wall of the guide rod; the beneficial effects of the invention are that the supporting assembly is added to realize accurate lifting adjustment of the mechanical arm in the vertical direction, the adjusting assembly realizes multi-angle and multi-position adjustment of the mechanical arm in the horizontal direction, the clamping assembly can carry out overturning operation of a chip, and different chip packaging requirements can be flexibly adapted; the packaging efficiency and precision are improved, the position, the angle and the action of the mechanical arm can be accurately controlled, the labor intensity of operators is reduced, the working efficiency is improved, the chip packaging requirements of different types of semiconductor lighting devices can be met, and high universality and applicability are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of lighting device manufacturing, and in particular to a chip packaging robot arm for manufacturing semiconductor lighting devices. Background Art

[0002] In today's era of rapid technological advancement, semiconductor lighting devices, with their significant advantages such as energy saving, long life, and fast response time, are playing an increasingly important role in the lighting field. As market demand for semiconductor lighting devices continues to grow, so too are the requirements for their performance and quality. As the core component of semiconductor lighting devices, the quality of the chip packaging directly affects the luminous efficiency, reliability, and stability of the entire device.

[0003] Traditional chip packaging methods often rely on manual labor or simple mechanical equipment, resulting in numerous issues such as low packaging precision, low efficiency, and poor consistency, making them difficult to meet the demands of large-scale production and high-quality products. Manual operations are not only susceptible to operator skill and fatigue, resulting in inconsistent packaging quality, but also suffer from low production efficiency, making them unable to adapt to rapidly growing market demands. Simple mechanical equipment, with its limited functionality and lack of flexibility, often proves inadequate for the complex and diverse chip packaging tasks. Summary of the Invention

[0004] In view of the above-mentioned problems existing in the chip packaging robot arm for manufacturing the existing semiconductor lighting devices, the present invention is proposed.

[0005] Therefore, the present invention aims to provide a chip packaging robot for manufacturing semiconductor lighting devices, the purpose of which is to:

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: including, wherein

[0007] A support assembly comprising a base, a guide rod fixedly connected to a side wall of the base, a fixing plate fixedly connected to the top of the guide rod, and a support plate slidably mounted on the side wall of the guide rod;

[0008] An adjustment assembly includes an adapter plate hinged at the end of the support plate, an extension plate hinged at the end of the adapter plate, a drive shaft rotatably mounted at the end of the extension plate, and a drive motor fixedly connected to the middle position of the extension plate, wherein the output end of the drive motor is connected to the drive shaft through a synchronous belt;

[0009] The clamping assembly includes a sleeve fixedly connected to the end of the drive shaft, a connecting plate fixedly connected to the end of the sleeve, a connecting piece connected to the side wall of the connecting plate by bolts, a frame hinged on the side wall of the connecting piece, and a vacuum suction cup fixedly connected to the side wall of the frame.

[0010] As a preferred solution of the chip packaging robot arm for manufacturing the semiconductor lighting device described in the present invention, the clamping assembly also includes a flip motor fixedly mounted on the side wall of the connecting plate, and the output end of the flip motor is fixedly connected to the end of the central axis of the frame.

[0011] As a preferred solution of the chip packaging robot arm for manufacturing the semiconductor lighting device described in the present invention, the side wall at the end of the frame is provided with a mounting groove for use with the vacuum suction cup, and the inner side wall of the connecting part is provided with a step edge for use with the frame.

[0012] As a preferred solution of the chip packaging robot arm for manufacturing the semiconductor lighting device described in the present invention, the clamping assembly further includes a spring column installed on the side wall of the connecting plate, and a limit rod fixedly connected to the side wall of the flip motor output shaft, the end of the limit rod extends to the end of the spring column, and the spring columns are symmetrically installed on both sides of the flip motor output shaft.

[0013] As a preferred solution of the chip packaging robot arm for manufacturing the semiconductor lighting device described in the present invention, the adjustment component also includes a main adjustment motor fixedly connected to the side wall of the support plate, and the output end of the main adjustment motor is connected to the main shaft at the end of the adapter plate through a belt.

[0014] As a preferred solution of the chip packaging robot arm for manufacturing the semiconductor lighting device described in the present invention, the adjustment component also includes an auxiliary adjustment motor fixedly connected to the middle position of the upper end of the adapter plate, and the output end of the auxiliary adjustment motor is connected to the main shaft at the end of the extension plate through a belt.

[0015] As a preferred solution of the chip packaging robot arm for manufacturing semiconductor lighting devices of the present invention, a partition is installed in the middle of the extension plate, and the end of the partition is inserted in the middle of the belt inside the extension plate.

[0016] As a preferred solution of the chip packaging robot arm for manufacturing the semiconductor lighting device of the present invention, the end of the support plate is fixedly connected to a bearing, and the bearing is fixedly connected to the bottom of the main shaft at the end of the adapter plate.

[0017] As a preferred solution of the chip packaging robot arm for manufacturing the semiconductor lighting device described in the present invention, the support assembly also includes a lifting motor fixedly connected to the end of the fixed plate, a screw rod adapted to be installed at the output end of the lifting motor, and a ball nut threadedly connected to the middle of the screw rod, and the ball nut is fixedly connected to the center position of the support plate.

[0018] As a preferred solution of the chip packaging robot arm for manufacturing the semiconductor lighting device described in the present invention, the side wall of the support plate is installed with a shaft sleeve, the shaft sleeve is slidably sleeved on the side wall of the guide rod, and the guide rod is installed on the outside of the screw rod.

[0019] The beneficial effects of the present invention are as follows: the support component realizes the precise lifting and lowering adjustment of the robotic arm in the vertical direction, the adjustment component realizes the multi-angle and multi-position adjustment of the robotic arm in the horizontal direction, the clamping component can perform the chip flipping operation, can flexibly adapt to different chip packaging requirements, improves the efficiency and accuracy of packaging, can accurately control the position, angle and movement of the robotic arm, reduces the labor intensity of the operator, improves work efficiency, can meet the chip packaging requirements of different types of semiconductor lighting devices, and has strong versatility and applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort. Among them:

[0021] Figure 1 This is one of the overall structural diagrams of the present invention.

[0022] Figure 2 This is the second schematic diagram of the overall structure of the present invention.

[0023] Figure 3 It is a side structural schematic diagram of the present invention.

[0024] Figure 4 It is a schematic diagram of the front structure of the present invention.

[0025] Figure 5 It is a schematic diagram of the back structure of the present invention.

[0026] Figure 6 It is a schematic diagram of the bottom structure of the present invention.

[0027] In the figure: 100, support assembly; 101, base; 102, guide rod; 103, fixing plate; 104, support plate; 105, lifting motor; 106, screw rod; 107, ball nut; 108, bushing; 200, adjustment assembly; 201, adapter plate; 202, extension plate; 203, drive shaft; 204, drive motor; 205, main adjustment motor; 206, auxiliary adjustment motor; 207, partition; 208, bearing; 300, clamping assembly; 301, sleeve; 302, connecting plate; 303, connector; 304, frame; 305, vacuum suction cup; 306, flip motor; 307, spring column; 308, limit rod. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0029] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0030] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0031] Furthermore, the present invention is described in detail with reference to schematic diagrams. For ease of illustration, when describing the embodiments of the present invention, cross-sectional views illustrating device structures may be partially enlarged and not to scale. Furthermore, the schematic diagrams are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, the three-dimensional dimensions of length, width, and depth should be included.

[0032] Example 1

[0033] Reference Figure 1-6 , which is the first embodiment of the present invention, provides a support assembly 100 for a chip packaging robot arm for manufacturing semiconductor lighting devices, comprising:

[0034] The support assembly 100 includes a base 101 , a guide rod 102 fixedly connected to the side wall of the base 101 , a fixing plate 103 fixedly connected to the top of the guide rod 102 , and a support plate 104 slidably mounted on the side wall of the guide rod 102 .

[0035] Specifically, the support assembly 100 also includes a lifting motor 105 fixedly connected to the end of the fixed plate 103, a screw rod 106 adapted to be installed at the output end of the lifting motor 105, and a ball nut 107 threadedly connected to the middle of the screw rod 106. The ball nut 107 is fixedly connected to the center position of the support plate 104.

[0036] Furthermore, a shaft sleeve 108 is installed on the side wall of the support plate 104 , and the shaft sleeve 108 is slidably sleeved on the side wall of the guide rod 102 , and the guide rod 102 is installed on the outside of the screw rod 106 .

[0037] The base 101 serves as the foundation of the entire robotic arm, ensuring its stability during operation. The guide rod 102 maintains the smooth up and down movement of the support plate 104 and is used to coordinate with the installation of the adjustment assembly 200. When the lift motor 105 rotates, the screw rod 106 rotates accordingly. The threads of the screw rod 106 cooperate with the ball nut 107 to convert the motor's rotational motion into linear motion, thereby driving the support plate 104 up and down.

[0038] During use, the lifting motor 105 is started according to the position of the chip and the packaging requirements. The lifting motor 105 drives the screw rod 106 to rotate. Due to the threaded fit between the screw rod 106 and the ball nut 107, the ball nut 107 moves linearly along the screw rod 106, thereby driving the support plate 104 to move up and down along the guide rod 102.

[0039] In summary, the support assembly 100 realizes the precise lifting and lowering adjustment of the robotic arm in the vertical direction, the base 101 provides stable support for other components, the cooperation of the guide rod 102 and the shaft sleeve 108 ensures the sliding stability of the support plate 104, and the moving support plate 104 facilitates the adjustment of the robotic arm to the appropriate vertical height.

[0040] Example 2

[0041] Reference Figure 1-6 , which is a second embodiment of the present invention, and which differs from the first embodiment in that: an adjustment component 200 for a chip packaging robot arm for manufacturing semiconductor lighting devices is provided;

[0042] The adjustment assembly 200 includes an adapter plate 201 hinged at the end of the support plate 104, an extension plate 202 hinged at the end of the adapter plate 201, a drive shaft 203 rotatably mounted at the end of the extension plate 202, and a drive motor 204 fixedly connected to the middle position of the extension plate 202. The output end of the drive motor 204 is connected to the drive shaft 203 through a synchronous belt.

[0043] Among them, the adapter plate 201 is hinged at the end of the support plate 104 and can rotate relative to the support plate 104. The extension plate 202 is hinged at the end of the adapter plate 201, which further increases the extension length and adjustment range of the robot arm and improves the flexibility of the robot arm. The drive shaft 203 is rotatably mounted on the end of the extension plate 202 to provide rotational power for the clamping assembly 300. The drive shaft 203 can accurately control the rotation angle of the clamping assembly 300 to ensure the accurate position of the chip during the packaging process. The power provided by the drive motor 204 is transmitted to the drive shaft 203 through the synchronous belt to realize the rotation of the drive shaft 203, thereby driving the clamping assembly 300 to rotate.

[0044] Specifically, the adjustment assembly 200 further includes a main adjustment motor 205 fixedly connected to the side wall of the support plate 104 , and the output end of the main adjustment motor 205 is connected to the main shaft at the end of the adapter plate 201 through a belt.

[0045] The operation of the main adjustment motor 205 can drive the adapter plate 201 to rotate relative to the support plate 104, thereby achieving a wide range of angle adjustment of the robotic arm in the horizontal direction.

[0046] Furthermore, the adjustment assembly 200 also includes an auxiliary adjustment motor 206 fixedly connected to the middle position of the upper end of the adapter plate 201, and the output end of the auxiliary adjustment motor 206 is connected to the main shaft at the end of the extension plate 202 through a belt.

[0047] The operation of the auxiliary adjustment motor 206 can drive the extension plate 202 to rotate relative to the adapter plate 201, further refining the angle adjustment of the robotic arm and improving the positioning accuracy of the robotic arm.

[0048] Preferably, a partition plate 207 is installed in the middle of the extension plate 202 , and the end of the partition plate 207 is inserted into the middle of the belt inside the extension plate 202 .

[0049] The partition 207 serves to isolate and protect the belts, thereby preventing the belts from interfering with each other during operation and ensuring the stability and reliability of the transmission.

[0050] Preferably, a bearing 208 is fixedly connected to the end of the support plate 104 , and the bearing 208 is fixedly connected to the bottom of the main shaft at the end of the adapter plate 201 .

[0051] The bearing 208 can reduce the friction during the rotation of the adapter plate 201, thereby improving the flexibility and stability of the rotation, and can also withstand certain axial and radial loads.

[0052] When in use, start the main adjustment motor 205 and the auxiliary adjustment motor 206. The main adjustment motor 205 drives the adapter plate 201 to rotate relative to the support plate 104 through a belt, and the auxiliary adjustment motor 206 drives the extension plate 202 to rotate relative to the adapter plate 201 through a belt, so that the clamping assembly 300 can accurately reach above the chip.

[0053] In summary, the adjustment component 200 realizes multi-angle and multi-position adjustment of the robot arm in the horizontal direction, can accurately adjust the angle and extension length of the robot arm in the horizontal direction, adapt to material picking operations in different positions, and facilitate different chip packaging.

[0054] Example 3

[0055] Reference Figure 1-6 , which is the third embodiment of the present invention, which is different from the second embodiment in that: a clamping assembly 300 of a chip packaging robot arm for manufacturing semiconductor lighting devices is proposed;

[0056] The clamping assembly 300 includes a sleeve 301 fixedly connected to the end of the drive shaft 203, a connecting plate 302 fixedly connected to the end of the sleeve 301, a connecting piece 303 connected to the side wall of the connecting plate 302 by bolts, a frame 304 hinged to the side wall of the connecting piece 303, and a vacuum suction cup 305 fixedly connected to the side wall of the frame 304.

[0057] The sleeve 301 is fixedly connected to the end of the drive shaft 203, connecting the drive shaft 203 and the connecting plate 302. The sleeve 301 can transmit the rotation of the drive shaft 203 to the connecting plate 302, causing the connecting plate 302 to rotate accordingly. The frame 304 provides a mounting position for the vacuum suction cup 305 and can rotate around the central axis under the drive of the flip motor 306 to achieve the chip flipping operation.

[0058] Specifically, the clamping assembly 300 also includes a flip motor 306 fixedly mounted on the side wall of the connecting plate 302, the output end of the flip motor 306 is fixedly connected to the end of the central axis of the frame 304, the side wall of the end of the frame 304 is provided with a mounting groove for use with the vacuum suction cup 305, and the inner wall of the connecting member 303 is provided with a step edge for use with the frame 304.

[0059] The flip motor 306 can precisely control the flip angle of the frame 304 to meet the requirements for chip posture in different chip packaging processes.

[0060] Preferably, the clamping assembly 300 also includes a spring column 307 installed on the side wall of the connecting plate 302, and a limiting rod 308 fixedly connected to the side wall of the output shaft of the flip motor 306, the end of the limiting rod 308 extends to the end of the spring column 307, and the spring column 307 is symmetrically installed on both sides of the output shaft of the flip motor 306.

[0061] The spring column 307 has a certain degree of elasticity, which can act as a buffer and limit the rotation of the frame 304, preventing damage to the frame 304 due to excessive rotation. When the frame 304 is tilted to a certain angle, the limit rod 308 will contact the spring column 307, which will absorb some of the impact force and limit further rotation of the frame 304, ensuring a safe and accurate tilting operation.

[0062] During use, after the clamping assembly 300 reaches above the chip, the vacuum suction cup 305 starts working, and by generating negative pressure, the chip is adsorbed on the suction cup to achieve the chip grabbing operation. Chip flipping If the chip needs to be flipped during the packaging process, start the flipping motor 306. The flipping motor 306 drives the frame 304 to rotate around the central axis, thereby achieving the flipping of the chip. During the flipping process, when the limit rod 308 touches the spring column 307, the spring column 307 will absorb part of the impact force to prevent the frame 304 from being damaged due to excessive rotation, while accurately controlling the flipping angle of the frame 304. Chip packaging After grasping and adjusting the posture of the chip, the robotic arm again accurately moves the chip to the packaging position through the cooperation of the support assembly 100 and the adjustment assembly 200 to complete the chip packaging operation.

[0063] In summary, the clamping assembly 300 realizes the clamping, transfer and flipping operations of the chip, can flexibly adapt to different chip packaging requirements, and improves the efficiency and accuracy of packaging. The spring column 307 and the limit rod 308 in the clamping assembly 300 play a buffering and limiting role, avoiding damage to mechanical components and ensuring the stable operation of the robotic arm.

[0064] It is important to note that the construction and arrangement of the present application shown in a number of different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, as well as parameter values (e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, directional changes, etc.) without departing substantially from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature or number or position of the discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "means plus function" clause is intended to cover the structure described herein that performs the function, and is not only structurally equivalent but also equivalent structures. Other replacements, modifications, changes, and omissions may be made in the design, operating conditions, and arrangement of the exemplary embodiments without departing from the scope of the present invention. Therefore, the invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0065] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0066] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A chip packaging robot arm for manufacturing semiconductor lighting devices, characterized by: include, A support assembly (100) comprises a base (101), a guide rod (102) fixedly connected to a side wall of the base (101), a fixing plate (103) fixedly connected to the top of the guide rod (102), and a support plate (104) slidably mounted on the side wall of the guide rod (102); An adjustment assembly (200) comprises an adapter plate (201) hinged to the end of the support plate (104), an extension plate (202) hinged to the end of the adapter plate (201), a drive shaft (203) rotatably mounted on the end of the extension plate (202), and a drive motor (204) fixedly connected to the middle position of the extension plate (202), wherein the output end of the drive motor (204) is transmission-connected to the drive shaft (203) via a synchronous belt; The clamping assembly (300) comprises a sleeve (301) fixedly connected to the end of the drive shaft (203), a connecting plate (302) fixedly connected to the end of the sleeve (301), a connecting piece (303) connected to the side wall of the connecting plate (302) by bolts, a frame (304) hinged to the side wall of the connecting piece (303), and a vacuum suction cup (305) fixedly connected to the side wall of the frame (304).

2. The chip packaging robot arm for manufacturing semiconductor lighting devices according to claim 1, characterized in that: The clamping assembly (300) further comprises a flip motor (306) fixedly mounted on the side wall of the connecting plate (302), and an output end of the flip motor (306) is fixedly connected to the end of the central axis of the frame (304).

3. The chip packaging robot arm for manufacturing semiconductor lighting devices according to claim 2, characterized in that: The end side wall of the frame (304) is provided with a mounting groove for use with the vacuum suction cup (305), and the inner side wall of the connecting piece (303) is provided with a step edge for use with the frame (304).

4. The chip packaging robot arm for manufacturing semiconductor lighting devices according to claim 3, characterized in that: The clamping assembly (300) further comprises a spring column (307) mounted on a side wall of the connecting plate (302), and a limiting rod (308) fixedly connected to a side wall of an output shaft of the flip motor (306), wherein an end of the limiting rod (308) extends to an end of the spring column (307), and the spring columns (307) are symmetrically mounted on both sides of the output shaft of the flip motor (306).

5. The chip packaging robot arm for manufacturing semiconductor lighting devices according to claim 4, characterized in that: The adjustment assembly (200) further comprises a main adjustment motor (205) fixedly connected to the side wall of the support plate (104), and the output end of the main adjustment motor (205) is connected to the main shaft at the end of the adapter plate (201) through a belt.

6. The chip packaging robot arm for manufacturing semiconductor lighting devices according to claim 5, characterized in that: The adjustment assembly (200) further comprises an auxiliary adjustment motor (206) fixedly connected to the middle position of the upper end of the adapter plate (201), and the output end of the auxiliary adjustment motor (206) is connected to the main shaft at the end of the extension plate (202) through a belt.

7. The chip packaging robot arm for manufacturing semiconductor lighting devices according to claim 6, characterized in that: A partition (207) is installed in the middle of the extension plate (202), and the end of the partition (207) is inserted into the middle of the belt inside the extension plate (202).

8. The chip packaging robot arm for manufacturing semiconductor lighting devices according to claim 7, characterized in that: A bearing (208) is fixedly connected to the end of the support plate (104), and the bearing (208) is fixedly connected to the bottom of the main shaft at the end of the adapter plate (201).

9. The chip packaging robot arm for manufacturing semiconductor lighting devices according to claim 8, characterized in that: The support assembly (100) further comprises a lifting motor (105) fixedly connected to the end of the fixing plate (103), a screw rod (106) adapted to be installed at the output end of the lifting motor (105), and a ball nut (107) threadedly connected to the middle of the screw rod (106), wherein the ball nut (107) is fixedly connected to the center position of the support plate (104).

10. The chip packaging robot arm for manufacturing semiconductor lighting devices according to claim 9, characterized in that: A shaft sleeve (108) is installed on the side wall of the support plate (104), and the shaft sleeve (108) is slidably sleeved on the side wall of the guide rod (102), and the guide rod (102) is installed on the outside of the screw rod (106).

Images