A support pin arrangement system and arrangement method

Abstract

The present invention discloses a support pin arrangement system and arrangement method, which are applied to the field of surface mounting technology, wherein the support pin arrangement system includes: a simulation planning system for determining the target support point of the support pin on the base plate; a positioning and identification component for obtaining the position of the base plate and the support pin; a picking component for taking the support pin and installing it on the target support point to obtain a finished support pin; and a control system for controlling the movement of the picking component according to the position of the target support point and the position of the base plate and the support pin. The system disclosed in the present invention can improve the rationality of the arrangement position of the support pin, reduce the interference of human factors, and improve efficiency; moreover, it operates independently of the equipment in the SMT production line, does not occupy the equipment in the SMT production line, reduces the impact on the SMT production line, improves the line change efficiency, and ensures the working efficiency of the SMT production line.

Description

Technical Field

[0001] The present invention relates to the field of surface mount technology, and in particular to a support pin arrangement system and arrangement method. Background Art

[0002] Currently, in the field of SMT (Surface Mount Technology), the rational arrangement of support pins (Support Pins) during solder paste printing / patch processes is particularly important for printing quality. The main function of support pins is to support the bottom of the PCB (Printed Circuit Board) to prevent deformation (such as bending and warping) caused by uneven force on the bottom of the PCB during solder paste printing / patch, resulting in printing offset, component placement deviation and other problems.

[0003] In the related art, when arranging support pins, the operator needs to manually adjust the support point position of the support pin according to the PCB size and the layout of the electrical components, and then manually install the support pin on the base plate, or use the equipment in the SMT production line to install the support pin on the base plate; the manual arrangement of support pins in the related art is inefficient, lacks precision, and the support point distribution is unreasonable, which can easily cause PCB deformation / damage to electrical components; poor reliability, high production cost, production requires the production of corresponding auxiliary jigs of different varieties to arrange support pins, and the jig compatibility is poor; using the equipment in the SMT production line affects the production of the SMT production line and is inefficient.

[0004] Therefore, how to effectively improve the placement accuracy and efficiency of support pins is a technical problem that those skilled in the art currently need to solve. Summary of the Invention

[0005] The purpose of the present invention is to provide a support pin layout system and layout method, which are used to improve the layout accuracy and efficiency of the support pins and reduce the impact on the SMT production line.

[0006] To achieve the above objectives, the present invention provides the following technical solutions.

[0007] A support pin arrangement system includes: a simulation planning system for determining a target support point of a support pin on a base plate based on parameter information of a circuit board; a positioning and identification component for obtaining the positions of the base plate and the support pin; a picking component for picking up the support pin and installing it on the target support point based on the positions of the base plate and the support pin to obtain a finished support pin; and a control system. The simulation planning system, the positioning and identification component, and the picking component are all connected to the control system. The control system is used to control the picking component action based on the position of the target support point and the positions of the base plate and the support pin.

[0008] On the other hand, the simulation planning system includes a reading unit, a mechanical simulation unit and a layout unit. The reading unit is used to obtain the parameter information of the circuit board; the mechanical simulation unit is used to simulate the deformation distribution of the circuit board during the processing process through the finite element analysis algorithm and determine the high-risk deformation area; the layout unit is used to determine the position and number of target support points based on the position and area of ​​the high-risk deformation area.

[0009] On the other hand, it also includes a supporting body, on which the picking component and the base plate are both installed, and the picking component can move along a first direction and a second direction relative to the supporting body, and the base plate can move along a third direction relative to the supporting body, and the first direction, the second direction and the third direction are perpendicular to each other.

[0010] On the other hand, the supporting body includes a platform component and a frame component, the frame component is installed on the platform component, the platform component is used to support the base plate, the frame component is used to support the picking component, and the positioning identification component is installed on the picking component; the frame component is provided with a frame slide rail extending along a first direction, the picking component is slidably connected to the frame slide rail, the picking component can be extended and retracted relative to the second direction, the platform component is provided with a first platform slide rail extending along a third direction, and the base plate is slidably connected to the first platform slide rail.

[0011] On the other hand, it also includes a base plate driving member for driving the base plate to move along the third direction and a picking driving member for driving the picking component to move along the first direction; the base plate driving member and the picking driving member are both connected to the control system, and the control system is used to control the base plate driving member, the picking driving member and the picking component according to the position of the target support point and the position of the base plate and the support pin; or, the platform component is equipped with a frame driving member and a frame slide rail for driving the frame component to move along the third direction, the frame component is slidably connected to the frame slide rail, and the frame driving member is connected to the control system, and the control system is used to control the frame driving member, the picking driving member and the picking component according to the position of the target support point and the position of the base plate and the support pin.

[0012] On the other hand, it also includes a storage component and a storage drive component for driving the storage component to move along a third direction. The storage component is used to place a support pin. The storage drive component is installed on the support body, and a second platform slide rail is also provided on the support body. The storage component is slidingly connected to the second platform slide rail; the storage drive component is connected to the control system, and the control system is used to control the action of the storage drive component according to the position of the target support point and the position of the base plate and the support pin.

[0013] On the other hand, it also includes a pressure sensor arranged on the picking component, and the pressure sensor is used to obtain the pressure of the picking component; the pressure sensor is connected to the control system, and the control system is also used to control the picking component to stop moving when the pressure of the picking component exceeds the warning pressure; and / or, it also includes an image acquisition component, which is used to obtain an image of the supporting Pin finished product, and the image acquisition component is installed on the picking component; the control system is connected to the image acquisition component, and the control system is also used to compare the position of the supporting Pin on the supporting Pin finished product with the position of the target supporting point, and when the position of the supporting Pin on the supporting Pin finished product deviates from the position of the target supporting point by exceeding a preset offset value, the control system outputs the position of the offset supporting Pin on the supporting Pin finished product.

[0014] A method for arranging support pins includes the following steps: obtaining parameter information of a circuit board; simulating the deformation distribution of the circuit board during processing using a finite element analysis algorithm to determine high-risk deformation areas of the circuit board; determining the position of a target support point on a base plate based on the position and area of ​​the high-risk deformation area; obtaining a support pin and installing it on the target support point to obtain a finished support pin.

[0015] On the other hand, determining the position of the target support point on the base plate according to the position and area of ​​the high-risk deformation area includes: determining the position of the initial support point on the base plate according to the position and area of ​​the high-risk deformation area; and optimizing the initial support point using a genetic algorithm or a particle swarm algorithm to determine the position of the target support point.

[0016] On the other hand, determining the position of the initial support point on the base plate based on the position and area of ​​the high-risk deformation area includes: determining the position of the initial support point on the base plate based on the position and area of ​​the high-risk deformation area and the support point setting rules; the support point setting rules include: the distance between adjacent support points is less than or equal to a first preset distance; the distance between the support point and the edge of the circuit board is greater than or equal to a second preset distance.

[0017] The support pin arrangement system provided by the present invention has the following beneficial effects: with the help of the setting of the simulation planning system, the target support point of the support pin on the base plate can be determined according to the parameter information of the circuit board, so as to more accurately give the most reasonable setting position of the support pin on the base plate, that is, the position of the target support point, reduce human judgment, improve the rationality of the support pin arrangement position, while meeting the support effect, reduce waste, thereby maximizing the saving of support pin arrangement time and improving efficiency; then, through the setting of the positioning and recognition component, the position of the base plate and the support pin is identified, which facilitates the picking of the component to take the support pin and install it on the target support point to obtain the support pin finished product; at the same time, through the setting of the control system, the target support point determined by the simulation planning system can be automatically obtained. The position of the base plate and the support pin is obtained by the positioning and identification component, and the picking component action is controlled according to the position of the target support point and the position of the base plate and the support pin, so that the automatic arrangement process of the support pin can be realized; the arrangement system of the support pin can improve the rationality of the arrangement position of the support pin, reduce the interference of human factors, reduce the number of support pins used, save costs, and improve the installation efficiency of the support pin; moreover, through the automatic installation of the support pin, it is independent of the equipment operation in the SMT production line. When the equipment in the SMT production line needs to support the finished product of the pin, the finished product of the support pin can be directly obtained without occupying the equipment in the SMT production line, reducing the impact on the SMT production line, improving the line change efficiency, and ensuring the working efficiency of the SMT production line.

[0018] In one embodiment, a storage component and a storage driving component for driving the storage component to move along a third direction are provided, and the movement direction of the storage component is consistent with that of the base plate. Support pins can be placed on the storage component. The same type of support pins or different types of support pins can be placed on the same storage component. The storage driving component is installed on the support body, and the support body is also provided with a second platform slide rail. The storage component is slidably connected to the second platform slide rail. When it is necessary to obtain the support pin on the storage component, the storage driving component can be controlled to drive the storage component to move, thereby driving the support pin to move, making it convenient for the picking component to obtain the support pin, thereby improving the installation efficiency of the support pin.

[0019] The support pin arrangement method provided by the present invention obtains parameter information of the circuit board and performs a finite element analysis algorithm on the circuit board to simulate the deformation distribution of the circuit board during the processing, thereby determining the high-risk deformation area of ​​the circuit board. The high-risk deformation area of ​​the circuit board is the position that needs to be supported by the support pin. According to the positional relationship between the base plate and the circuit board during actual processing, the position of the target support point of the support pin on the base plate is determined, and then the support pin is installed on the target support point to obtain the support pin finished product; this support pin arrangement method can improve the rationality of the layout of the target support point, reduce the interference of human factors, reduce the number of support pins used, save costs, and improve the installation efficiency of the support pin.

[0020] In one embodiment, before determining the target support point, it is first necessary to determine the position of the initial support point on the base plate based on the location and area of ​​the high-risk deformation area. That is, multiple initial support points can be given first, and then optimized through the data information stored in the simulation planning system, removing the initial support points where no support pins are required, thereby determining the final target support point. This method can further optimize the number of support pins, save costs, and improve efficiency. For example, for the optimization of the initial support points, the initial support points in certain locations can be removed, or multiple initial support points can be merged into one target support point, and the judgment can be made based on the data information stored in the simulation planning system. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 This is a structural diagram of a specific implementation of the support Pin arrangement system provided by the present invention.

[0023] Figure 2 for Figure 1 The front view of the arrangement system of the support pin is shown.

[0024] Figure 3-1 for Figure 1 Schematic diagram of the control system in the support pin arrangement system shown.

[0025] Figure 3-2 for Figure 1 Schematic diagram of the simulation planning system in the support pin layout system shown.

[0026] Figure 4 The figure is a flow chart of a specific implementation of the support pin arrangement method provided by the present invention.

[0027] Figure 5 The figure is a flow chart of a specific implementation of the support pin arrangement method provided by the present invention.

[0028] Figure markings: simulation planning system 100; reading unit 101; mechanical simulation unit 102; layout unit 103; positioning and identification component 200; picking component 300; suction nozzle 301; control system 400; bottom plate drive 401; picking drive 402; frame drive 403; storage drive 404; pressure sensor 405; image acquisition component 406; support body 500; platform component 510; first platform slide rail 511; second platform slide rail 512; frame slide rail 513; frame component 520; bottom plate 600; bottom plate support seat 601; support Pin 700; storage component 800; storage support seat 801; support Pin finished product 900. DETAILED DESCRIPTION

[0029] The core of the present invention is to provide a support pin layout system and layout method, which can significantly improve the layout efficiency and position accuracy of the support pins and improve the production line change efficiency.

[0030] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0031] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0032] In order to enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0033] Please refer to Figure 1 and Figure 2In this embodiment, the support pin arrangement system includes: a simulation planning system 100, which is used to determine the target support point of the support pin 700 on the base plate 600 according to the parameter information of the circuit board; a positioning and identification component 200, which is used to obtain the positions of the base plate 600 and the support pin 700; a picking component 300, which is used to pick up the support pin 700 and install it on the target support point according to the positions of the base plate 600 and the support pin 700 to obtain the support pin finished product 900; a control system 400, the simulation planning system 100, the positioning and identification component 200 and the picking component 300 are all connected to the control system 400, and the control system 400 is used to control the movement of the picking component 300 according to the position of the target support point and the positions of the base plate 600 and the support pin 700.

[0034] Specifically, the circuit board can be a PCB (Printed Circuit Board), and the positioning and identification component 200 can be a visual component, which can determine the positions of the base plate 600 and the support Pin 700 by obtaining pictures of the base plate 600 and the support Pin 700. By setting the positioning and identification component 200, it can be ensured that the support Pin 700 is correctly grasped and placed on the coordinates of the target support point; after the support Pin 700 is fixed to the base plate 600, the support Pin finished product 900 can be obtained; the end of the picking component 300 can be provided with a suction nozzle 301, and the suction nozzle 301 can be a vacuum suction nozzle 301, which can be sucked by the suction nozzle 301. The nozzle 301 picks up the support Pin 700, which is easy to operate and has a good adsorption effect. The installation position of the support Pin 700 is highly accurate. The arrangement system of the support Pin supplies the support Pin finished product 900 to the SMT production line. The SMT production line has multiple devices, such as a printer or a placement machine. The printer is used to accurately print solder paste onto the circuit board, and the placement machine is used to accurately place surface mount electrical components on the pads of the circuit board. The positioning and identification component 200, the picking component 300 and the control system 400 constitute the automatic installation equipment of the support Pin 700.

[0035] Furthermore, the parameter information of the circuit board can be obtained by reading the Gerber file. The Gerber file refers to the technical data file of the circuit board. Automatically reading the Gerber file can further improve the accuracy and efficiency. Of course, the parameter information of the circuit board can also be manually input into the simulation planning system 100.

[0036] The support pin arrangement system, with the help of the setting of the simulation planning system 100, can determine the target support point of the support pin 700 on the base plate 600 according to the parameter information of the circuit board, so as to more accurately give the most reasonable setting position of the support pin 700 on the base plate 600, that is, the position of the target support point, reduce human judgment, improve the rationality of the arrangement position of the support pin 700, while meeting the support effect, reduce waste, thereby maximizing the saving of the arrangement time of the support pin 700 and improving efficiency; then, through the setting of the positioning and identification component 200, the positions of the base plate 600 and the support pin 700 are identified, which facilitates the picking component 300 to take the support pin 700 and install it on the target support point to obtain the support pin finished product 900; at the same time, through the setting of the control system 400, the position of the target support point determined by the simulation planning system 100 can be automatically obtained, and the positions of the base plate 600 and the support pin 700 obtained by the positioning and identification component 200 are obtained according to the target The position of the support point and the position of the base plate 600 and the support Pin 700 control the action of the picking component 300, and can realize the automatic arrangement process of the support Pin 700; the arrangement system of the support Pin can improve the rationality of the arrangement position of the support Pin 700, reduce the interference of human factors, reduce the number of support Pin 700 used, save costs, and improve the installation efficiency of the support Pin 700; moreover, through the automatic installation of the support Pin 700, it is independent of the equipment operation in the SMT production line. When the equipment in the SMT production line needs to support the finished Pin 900, it can directly obtain the processed support Pin finished product 900 without occupying the equipment in the SMT production line, reducing the impact on the SMT production line, improving the line change efficiency, and ensuring the working efficiency of the SMT production line; SMT production line change refers to the configuration replacement and adjustment process of the SMT production line equipment, such as placement machines, printing machines, etc., in order to adapt to the production needs of new products. At this time, it is often necessary to replace the new support Pin finished product 900.

[0037] In some embodiments, see Figure 3-2 The simulation planning system 100 includes a reading unit 101, a mechanical simulation unit 102 and a layout unit 103. The reading unit 101 is used to obtain parameter information of the circuit board; the mechanical simulation unit 102 is used to simulate the deformation distribution of the circuit board during the processing process through a finite element analysis algorithm and determine the high-risk deformation area; the layout unit 103 is used to determine the position and number of target support points according to the position and area of ​​the high-risk deformation area; specifically, for a high-risk deformation area with a larger area, multiple target support points can be set.

[0038] In some embodiments, the apparatus further includes a support body 500, with the pickup component 300 and the base plate 600 both mounted on the support body 500. The pickup component 300 is movable relative to the support body 500 in a first direction and a second direction, and the base plate 600 is movable relative to the support body 500 in a third direction, with the first direction, the second direction, and the third direction being perpendicular to each other. Specifically, by enabling movement in three directions, a three-axis precision motion module can be utilized to drive the pickup component 300 in different directions, or by controlling the movement of the base plate 600, the pickup component 300 can be driven relative to the base plate 600 in different directions.

[0039] In some embodiments, the support body 500 includes a platform component 510 and a frame component 520, the frame component 520 is installed on the platform component 510, the platform component 510 is used to support the base plate 600, the frame component 520 is used to support the picking component 300, and the positioning identification component 200 is installed on the picking component 300; the frame component 520 is provided with a frame slide rail 513 extending along the first direction, the picking component 300 is slidably connected to the frame slide rail 513, and the picking component 300 can be extended and retracted relative to the second direction, and the platform component 510 is provided with a first platform slide rail 511 extending along the third direction, and the base plate 600 is slidably connected to the first platform slide rail 511; specifically, the frame component 520 can be a U-shaped structure, that is, a gantry structure, the frame slide rail 513 is located at the horizontal extension position of the frame component 520, and the picking component 300 slides on the frame slide rail 513 to change the position of the picking component 300 in the first direction.

[0040] In some embodiments, see Figure 3-1 , further comprising a base plate driving member 401 for driving the base plate 600 to move along the third direction and a pickup driving member 402 for driving the pickup component 300 to move along the first direction; the base plate driving member 401 and the pickup driving member 402 are both connected to a control system 400, and the control system 400 is used to control the base plate driving member 401, the pickup driving member 402 and the pickup component 300 according to the position of the target support point and the position of the base plate 600 and the support Pin 700; specifically, the base plate is controlled by the control system 400 By controlling the driving member 401, the position of the base plate 600 in the third direction is changed, that is, the relative position of the picking component 300 and the base plate 600 in the third direction is changed. By controlling the picking driving member 402, the relative position of the picking component 300 and the base plate 600 in the first direction can be changed. By controlling the extension and retraction of the picking component 300, the relative position of the picking component 300 and the base plate 600 in the second direction can be changed, thereby realizing the adjustment of the picking component 300 and the base plate 600 at any position in three different directions.

[0041] Of course, the adjustment of the relative position of the picking component 300 and the base plate 600 in the third direction can also be achieved by adjusting the position of the frame component 520 in the third direction, that is, the position of the base plate 600 is different, and the relative position of the picking component 300 and the base plate 600 in the third direction is changed by moving the frame component 520; specifically, the platform component 510 is provided with a frame driving component 403 and a frame slide rail 513 for driving the frame component 520 to move along the third direction, the platform component 510 is slidably connected to the frame slide rail 513, the frame driving component 403 is connected to the control system 400, and the control system 400 is used to adjust the position of the target support point and the base plate 600 and the support Pi n700's position controls the movement of the frame drive member 403, the pickup drive member 402 and the pickup member 300. This method does not require adjustment of the position of the base plate 600, which can help improve the installation accuracy of the support Pin700. It should be noted here that when the frame member 520 is fixed on the platform member 510 and the position of the base plate 600 can be moved, the frame member 520 should be set at the middle position of the platform member 510 along the third direction, and the first platform slide rail 511 is also set at the middle position of the platform member 510 along the third direction. With this arrangement, when it is necessary to drive the base plate 600 to move, it is only necessary to move it slightly in the front and back directions along the third direction.

[0042] In some embodiments, a storage component 800 and a storage drive component 404 for driving the storage component 800 to move along a third direction are also included. The storage component 800 is used to place the support Pin 700. The storage drive component 404 is installed on the support body 500, and the support body 500 is also provided with a second platform slide rail 512. The storage component 800 is slidingly connected to the second platform slide rail 512; the storage drive component 404 is connected to the control system 400, and the control system 400 is used to control the movement of the storage drive component 404 according to the position of the target support point and the position of the base plate 600 and the support Pin 700. Specifically, the second platform rail 512 is set on the platform component 510, and the second platform rail 512 extends along the third direction; by setting the storage component 800 and the storage driving component 404 for driving the storage component 800 to move along the third direction, the storage component 800 is consistent with the moving direction of the base plate 600, and the support pin 700 can be placed on the storage component 800. The same type of support pin 700 can be placed on the same storage component 800, and different types of support pins 700 can be placed. The storage driving component 404 is installed on the support body 500, and the support body 500 is also provided with a second platform rail 512. The storage component 800 is slidably connected to the second platform rail 512. When it is necessary to obtain the support pin 700 on the storage component 800, the storage driving component 404 can be controlled to drive the storage component 800 to move, thereby driving the support pin 700 to move, making it convenient for the picking component 300 to obtain the support pin 700, thereby improving the installation efficiency of the support pin 700.

[0043] In some embodiments, a pressure sensor 405 is further included on the picking component 300, and the pressure sensor 405 is used to obtain the pressure of the picking component 300; the pressure sensor 405 is connected to the control system 400, and the control system 400 is also used to control the picking component 300 to stop moving when the pressure of the picking component 300 exceeds the warning pressure; while controlling the picking component 300 to stop moving, an alarm signal can also be issued; the setting of the pressure sensor 405 can timely determine whether the picking component 300 is installed in place on the support Pin 700, so as to avoid damage to the support Pin 700 and the base plate 600.

[0044] In some embodiments, the control system 400 also includes a human-computer interaction component, which can facilitate two-way information transmission between the user and the control system 400. Through the human-computer interaction component, the parameter information of the circuit board can be input into the control system 400, and the parameter information of the circuit board can also be automatically obtained through the simulation planning system 100.

[0045] In some embodiments, an image acquisition component 406 is further included for acquiring an image of the support Pin finished product 900, and the image acquisition component 406 is installed on the picking component 300; the control system 400 is connected to the image acquisition component 406, and the control system 400 is also used to compare the position of the support Pin 700 on the support Pin finished product 900 with the position of the target support point, and when the position of the support Pin 700 on the support Pin finished product 900 and the position of the target support point deviate beyond a preset offset value, the position of the support Pin 700 that is offset on the support Pin finished product 900 is output; the image acquisition component 406 can be an industrial camera with high precision, convenient material acquisition, and low cost; the support Pin finished product 900 is inspected by the image acquisition component 406 to avoid the phenomenon of support Pin 700 installation position offset caused by factors such as position deviation of the base plate 600, thereby ensuring that the final support Pin finished product 900 meets the requirements and ensures the production accuracy of the SMT production line.

[0046] In some embodiments, it also includes a base plate support seat 601 for placing the base plate 600 and / or a storage support seat 801 for placing the storage component 800. The base plate support seat 601 and the storage support seat 801 are both multi-layer support seats, and the multi-layer support seat can move the base plate 600 or storage component 800 of the target layer to the top of the multi-layer support seat; specifically, by setting a multi-layer structure of the base plate support seat 601 and / or storage support seat 801, after completing the production of one type of support pin finished product 900, the required base plate 600 and support pin 700 can be directly pushed to the top of the multi-layer support seat through the multi-layer support seat, so as to facilitate continuous processing of the support pin finished product 900; of course, the selection of the required base plate 600 and support pin 700 can be determined according to the processing type of the next type of circuit board stored in the control system 400, and then the multi-layer support seat is automatically controlled by the control system 400 to further improve the degree of automation. Of course, the bottom plate support seat 601 and the storage support seat 801 can also be a stacked multi-layer structure, and each layer of the structure is marked. After completing the processing of the same type of support pin finished product 900, the required bottom plate 600 and support pin 700 can be moved to the top layer of the bottom plate support seat 601 or the storage support seat 801 by manually replacing the arrangement of each layer of the bottom plate support seat 601 and the storage support seat 801.

[0047] In a specific embodiment, the support pin layout system, the staff imports the Gerber file through the human-computer interaction system or manually inputs the parameter information of the circuit board, the simulation planning system 100 analyzes the coordinates of the electrical components, the pad distribution coordinates and the outline coordinates of the circuit board, generates a three-dimensional model of the circuit board, and simulates the deformation distribution of the circuit board under printing pressure or patch pressure through the FEA algorithm, and identifies high-risk deformation areas; the simulation planning system 100 combines the set rules to generate the layout of the initial support points, and optimizes the algorithm through the genetic algorithm or the particle swarm algorithm to ensure that the number of support points is minimized and the support effect is maximized; according to the coordinate program generated by the simulation planning system 100, the components 300 are picked up. The suction nozzle 301 is combined with the positioning and identification component 200 to accurately suck the support Pin 700 from the storage component and release it to the base plate 600. The pressure sensor 405 feedbacks that the support Pin 700 is correctly and effectively arranged at the specified position. After completing the arrangement of all support Pins 700, the image acquisition component 406 takes an image of the completed arrangement of the support Pin 700, and the correctness of the position of the support Pin 700 is verified by the image template matching algorithm. After adjustment, the finished support Pin 900 is finally output, which can meet the support Pin 700 requirements of the printing machine and the placement machine equipment; the simulation planning system 100 finally generates a layout report and stores it in the control system 400 for subsequent production traceability.

[0048] This support Pin layout system integrates the target support points determined by the simulation algorithm with the automatic installation equipment, and achieves fully automatic planning and precise layout of support Pin700 through Gerber file analysis, mechanical simulation, precision motion control and visual positioning. The automatic installation equipment can operate independently offline without the need for real-time communication with the printer or placement machine, and can complete the layout of support Pin700 in advance outside the production line, avoiding occupying the production time of SMT production line equipment.

[0049] In addition to the above-mentioned support pin arrangement system, the present invention also provides a support pin arrangement method.

[0050] Please refer to Figure 4 The support pin arrangement method includes the following steps.

[0051] Step S1: Obtain parameter information of the circuit board; the parameter information includes the outline information of the circuit board, the thickness and material of the circuit board, the preset position of the electrical components, and the position of the pads and vias on the circuit board; by obtaining the parameter information of the circuit board, a force analysis can be given according to the thickness and material of the circuit board, and structures such as electrical components, pads and vias can also be effectively avoided.

[0052] Step S2: Using a finite element analysis algorithm, simulate the deformation distribution of the circuit board during processing to identify high-risk deformation areas of the circuit board. Specifically, based on a finite element analysis algorithm, such as the FEA (finite element analysis) algorithm, simulate the deformation distribution of the circuit board under the pressure of the scraper of a printer or the placement pressure of a placement machine to identify high-risk deformation areas. The FEA algorithm is a numerical calculation technology based on the finite element method, which is used to simulate and predict the behavior of physical systems, such as in fields such as structural mechanics, heat conduction, and fluid dynamics.

[0053] Step S3: Determine the position of the target support point on the base plate 600 according to the position and area of ​​the high-risk deformation area.

[0054] Step S4: Obtain the support pin 700 and install it on the target support point to obtain the support pin finished product 900.

[0055] Specifically, the support pin arrangement method, by obtaining parameter information of the circuit board and performing a finite element analysis algorithm on the circuit board, can simulate the deformation distribution of the circuit board during the processing process, and determine the high-risk deformation area of ​​the circuit board. The high-risk deformation area of ​​the circuit board is the position that needs to be supported by the support Pin 700. According to the positional relationship between the base plate 600 and the circuit board during actual processing, the position of the target support point of the support Pin 700 on the base plate 600 is determined, and then the support Pin 700 is installed on the target support point to obtain the support Pin finished product 900; the support pin arrangement method can improve the rationality of the layout of the target support point, reduce the interference of human factors, reduce the number of support Pin 700 used, save costs, and improve the installation efficiency of the support Pin 700.

[0056] In some embodiments, see Figure 5 , step S3: determining the position of the target support point on the base plate 600 according to the position and area of ​​the high-risk deformation area, including the following steps.

[0057] Step S31: determining the position of the initial support point on the bottom plate 600 according to the position and area of ​​the high-risk deformation area.

[0058] Step S32: Optimize the initial support point using a genetic algorithm or a particle swarm optimization algorithm to determine the position of the target support point. Specifically, the genetic algorithm (GA) and the particle swarm optimization (PSO) are two optimization algorithms inspired by biological behavior in nature and are often used to solve complex optimization problems. The genetic algorithm is an optimization algorithm based on the principle of evolution; the particle swarm optimization algorithm is an optimization algorithm based on swarm intelligence.

[0059] The above setting, before determining the target support point, first needs to determine the position of the initial support point on the base plate 600 based on the position and area of ​​the high-risk deformation area, that is, multiple initial support points can be given first, and then optimized through the data information stored in the simulation planning system 100, removing the initial support points that are not necessary to set the support Pin 700, so as to determine the final target support point. This method can further optimize the number of support Pins 700, save costs, and improve efficiency. For example, with respect to the optimization of the initial support points, the initial support points at certain positions can be removed, or multiple initial support points can be merged into one target support point, which can be determined based on the data information stored in the simulation planning system 100.

[0060] In some embodiments, determining the positions of initial support points on the base plate 600 based on the position and area of ​​the high-risk deformation region includes: determining the positions of the initial support points on the base plate 600 based on the position and area of ​​the high-risk deformation region and a support point setting rule; the support point setting rule includes: the distance between adjacent support points is less than or equal to a first preset distance; the distance between a support point and the edge of the circuit board is greater than or equal to a second preset distance. For example, in the setting rule, the distance between adjacent support points is ≤ 50 mm, i.e., the first preset distance may be 50 mm, and the distance between a support point and the edge of the circuit board is ≥ 10 mm, i.e., the second preset distance may be 10 mm. After generating the initial support point layout, optimization is performed using a genetic algorithm or a particle swarm algorithm to minimize the number of target support points and maximize the support effect.

[0061] Specifically, in a specific embodiment, the arrangement method of the support pin is as follows: the user imports the Gerber file in the human-computer interaction system or manually inputs the size, thickness, material type and other parameters of the circuit board; the simulation planning system 100 analyzes the coordinates of the electrical components, the pad distribution coordinates and the outline coordinates of the circuit board to generate a three-dimensional model of the circuit board; the deformation trend under the pressure of the printing or placement machine nozzle 301 is simulated by the FEA algorithm, and the high deformation risk area is marked; the initial support point is generated based on the set rules, the redundant points are merged by the optimization algorithm, and the coordinate matrix of the target support point of the final support pin 700 is output; the three-axis motion module is used to grab the target support point from the storage component 800 The support Pin700 of the corresponding specification is moved to the position of the target support point; the positioning and recognition component 200 corrects the coordinates in real time to ensure accurate Pin placement; after the picking component 300 releases the Pin, the pressure sensor 405 ensures contact reliability through pressure feedback; the actual layout image of the support Pin700 is captured by the image acquisition component 406, and the correctness of the position of the support Pin700 is verified by the image template matching algorithm; for the support Pin700 with excessive deviation, the three-axis motion module automatically performs secondary calibration or reinstallation; a layout report is generated, including the coordinates of the target support point, detection results, time consumption and other data, and stored in the database of the control system 400.

[0062] This support Pin layout system and method is applicable to all SMT fields that use equipment that supports Pin700. It can optimize production processes, improve production efficiency and improve production quality. The specific points are as follows.

[0063] 1. Optimization of labor costs: The time spent on placing and debugging the support Pin700 is reduced. The introduction of offline automatic installation equipment can save time on manual placement.

[0064] 2. Improved production line change efficiency: Multiple devices on an SMT production line need to be equipped with Pin700 support. This can save the downtime of each device for placing Pin700 support and improve production line change efficiency.

[0065] 3. Improve the rationality of the layout of support Pin 700: avoid the need to confirm the position of support Pin 700 through personnel awareness, and reduce the problems of missing / misaligned placement of support Pin 700 during the placement process.

[0066] 4. Reduction of production costs: The support Pin700 placed by the support Pin layout system can meet the needs of various SMT line equipment, and then meet the production requirements of different models, reducing the production of auxiliary support jigs and thus reducing costs.

[0067] 5. Production traceability: layout reports can be generated for subsequent traceability.

[0068] The above is a detailed introduction to the support pin arrangement system and arrangement method provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core ideas of the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A support pin arrangement system, characterized in that: include: A simulation planning system (100) is used to determine a target support point of a support pin (700) on a base plate (600) based on parameter information of a circuit board; A positioning identification component (200) for obtaining the positions of the base plate (600) and the support pin (700); A picking component (300) is used to pick up the support pin (700) and install it on the target support point according to the position of the base plate (600) and the support pin (700), thereby obtaining a finished support pin (900); A control system (400), wherein the simulation planning system (100), the positioning identification component (200), and the picking component (300) are all connected to the control system (400), and the control system (400) is used to control the movement of the picking component (300) according to the position of the target support point and the positions of the base plate (600) and the support pin (700); The simulation planning system (100) comprises a reading unit (101), a mechanical simulation unit (102) and a layout unit (103), wherein the reading unit (101) is used to obtain parameter information of the circuit board; the mechanical simulation unit (102) is used to simulate the deformation distribution of the circuit board during the processing process by a finite element analysis algorithm, and determine high-risk deformation areas; The layout unit (103) is used to determine the position and number of the target support points according to the position and area of ​​the high-risk deformation area.

2. The support pin arrangement system according to claim 1, characterized in that: The invention also includes a supporting body (500), the picking component (300) and the base plate (600) are both mounted on the supporting body (500), and the picking component (300) can move relative to the supporting body (500) along a first direction and a second direction, and the base plate (600) can move relative to the supporting body (500) along a third direction, and the first direction and the second direction are perpendicular to the third direction.

3. The support pin arrangement system according to claim 2, characterized in that: The supporting body (500) includes a platform component (510) and a frame component (520), wherein the frame component (520) is mounted on the platform component (510), the platform component (510) is used to support the base plate (600), the frame component (520) is used to support the picking component (300), and the positioning identification component (200) is mounted on the picking component (300); a frame slide rail (513) extending along the first direction is provided on the frame component (520), the picking component (300) is slidably connected to the frame slide rail (513), and the picking component (300) can be extended and retracted relative to the second direction; a first platform slide rail (511) extending along the third direction is provided on the platform component (510), and the base plate (600) is slidably connected to the first platform slide rail (511).

4. The support pin arrangement system according to claim 3, characterized in that: The system further comprises a base plate driving member (401) for driving the base plate (600) to move along the third direction and a pickup driving member (402) for driving the pickup component (300) to move along the first direction; the base plate driving member (401) and the pickup driving member (402) are both connected to the control system (400), and the control system (400) is used to control the actions of the base plate driving member (401), the pickup driving member (402) and the pickup component (300) according to the position of the target support point and the positions of the base plate (600) and the support pin (700); Alternatively, a frame driving member (403) and a frame slide rail (513) for driving the frame member (520) to move along the third direction are installed on the platform member (510), the frame member (520) is slidably connected to the frame slide rail (513), the frame driving member (403) is connected to the control system (400), and the control system (400) is used to control the movement of the frame driving member (403), the picking driving member (402) and the picking member (300) according to the position of the target support point and the positions of the base plate (600) and the support pin (700).

5. The support pin arrangement system according to any one of claims 2 to 4, characterized in that: The invention also includes a storage component (800) and a storage drive component (404) for driving the storage component (800) to move along the third direction, wherein the storage component (800) is used to place the support pin (700), and the storage drive component (404) is installed on the support body (500), and the support body (500) is also provided with a second platform slide rail (512), and the storage component (800) is slidably connected to the second platform slide rail (512); the storage drive component (404) is connected to the control system (400), and the control system (400) is used to control the movement of the storage drive component (404) according to the position of the target support point and the positions of the base plate (600) and the support pin (700).

6. The support pin arrangement system according to claim 5, characterized in that: It also includes a pressure sensor (405) provided on the picking component (300), the pressure sensor (405) being used to obtain the pressure of the picking component (300); the pressure sensor (405) is connected to the control system (400), and the control system (400) is further used to control the picking component (300) to stop moving when the pressure of the picking component (300) exceeds a warning pressure; And / or, it also includes an image acquisition component (406) for acquiring an image of the supporting Pin finished product (900), and the image acquisition component (406) is installed on the picking component (300); the control system (400) is connected to the image acquisition component (406), and the control system (400) is also used to compare the position of the supporting Pin (700) on the supporting Pin finished product (900) with the position of the target supporting point, and when the position of the supporting Pin (700) on the supporting Pin finished product (900) and the position of the target supporting point deviate beyond a preset offset value, output the position of the offset supporting Pin (700) on the supporting Pin finished product (900).

7. A method for arranging support pins, using the support pin arrangement system according to any one of claims 1 to 6, characterized in that: The following steps are involved: Get the parameter information of the circuit board; Simulating the deformation distribution of the circuit board during the processing by a finite element analysis algorithm to determine high-risk deformation areas of the circuit board; Determining the position of a target support point on the base plate (600) according to the position and area of ​​the high-risk deformation area; A support pin (700) is obtained and installed on the target support point to obtain a support pin finished product (900).

8. The method for arranging support pins according to claim 7, wherein: Determining the position of the target support point on the base plate (600) according to the position and area of ​​the high-risk deformation area comprises: Determining the position of the initial support point on the bottom plate (600) according to the position and area of ​​the high-risk deformation area; The initial support point is optimized using a genetic algorithm or a particle swarm algorithm to determine the position of the target support point.

9. The method for arranging support pins according to claim 8, wherein: Determining the position of the initial support point on the base plate (600) based on the position and area of ​​the high-risk deformation area includes: determining the position of the initial support point on the base plate (600) based on the position and area of ​​the high-risk deformation area and a support point setting rule; the support point setting rule includes: the distance between adjacent support points is less than or equal to a first preset distance; the distance between the support point and the edge of the circuit board is greater than or equal to a second preset distance.

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