High-temperature liquid cooling heat conduction device and manufacturing method thereof

Abstract

The invention discloses a high-temperature liquid cooling heat conduction device and a manufacturing method thereof, and belongs to the technical field of high-temperature liquid cooling heat conduction, the high-temperature liquid cooling heat conduction device is provided with a heat conduction substrate formed by a plurality of square and strip-shaped bulges and grooves formed among the bulges; the heat dissipation fiber layer covers the heat conduction substrate; the square protrusions are located in the center of the heat conduction substrate to form an array structure, and the side length of each square protrusion is 1 mm. The strip-shaped protrusions are located on the periphery of the heat conduction substrate and distributed in a scattering mode, the length of each strip-shaped protrusion is 4.5 mm, and the width of each strip-shaped protrusion is 1 mm. By adopting the high-temperature liquid cooling heat conduction device and the manufacturing method thereof, the device can quickly absorb cooling liquid, break a high-temperature interface steam layer and inhibit a Leidenfrost effect through a strong capillary effect in a wide temperature range of 100-1300 DEG C, so that liquid drops are quickly wicked and severely vaporized.

Description

Technical Field

[0001] The present invention relates to the technical field of high-temperature liquid cooling heat conduction technology, and in particular to a high-temperature liquid cooling heat conduction device and a manufacturing method thereof. Background Art

[0002] With the development of electronic equipment, aerospace, nuclear energy, and other fields, the demand for efficient heat dissipation in high-temperature environments is increasing. For example, a 100°C increase in the turbine inlet temperature of a gas turbine engine can improve the engine's thrust-to-weight ratio by approximately 10%. Therefore, efficient, stable, and reliable thermal conductivity components are crucial to solving the heat dissipation problem in high-temperature environments. Many researchers have proposed methods to improve heat dissipation efficiency in high-temperature environments.

[0003] However, the difficulty of liquid cooling in high-temperature environments lies in the existence of an inhibitory Leidenfrost effect between liquid and solid: when the liquid contacts a high-temperature wall with a temperature above 200°C, the vapor layer generated by the rapid evaporation of the liquid completely suspends the liquid, resulting in separation of the liquid from the wall and cooling failure.

[0004] Currently, many research methods have been developed to break the vapor layer at the liquid-solid interface in high-temperature environments and suppress the Leidenfrost effect. However, less research has been conducted on how to suppress the Leidenfrost effect and improve heat dissipation efficiency in extremely high-temperature environments (1300°C). To address this heat dissipation issue in extremely high-temperature environments (1300°C), this paper proposes a high-temperature liquid-cooled heat conduction device and its preparation method. Summary of the Invention

[0005] The purpose of the present invention is to provide a high-temperature liquid-cooled heat conduction device and a manufacturing method thereof, which can break the steam layer and suppress the Leidenfrost effect in an extremely high temperature (1300°C) environment to solve the heat dissipation problem in an extremely high temperature (1300°C) environment.

[0006] To achieve the above objectives, the present invention provides a high-temperature liquid-cooled heat-conducting device, comprising: a heat-conducting base having a plurality of square and strip-shaped protrusions and grooves formed between the protrusions; and a heat-dissipating fiber layer covering the heat-conducting base; the square protrusions are located at the center of the heat-conducting base to form an array structure, and the side length of the square protrusions is 1 mm; the strip-shaped protrusions are located around the heat-conducting base and are distributed in a scattered manner, and the strip-shaped protrusions are 4.5 mm long and 1 mm wide.

[0007] Preferably, in the above-mentioned high-temperature liquid-cooled heat-conducting device, the grooves formed between the protrusions are 2 mm deep, and the strip-shaped protrusions form a channel for gas escape, which is 1 mm wide, 4.5 mm long and 2 mm deep.

[0008] Preferably, in the above-mentioned high-temperature liquid cooling heat conduction device, the heat conduction base material is stainless steel, and the thermal conductivity is 20W·m -1 ·K -1 The heat dissipation fiber layer is made of nickel fiber felt with a thickness of about 200 μm and a porosity of 60%.

[0009] Preferably, in the above-mentioned high-temperature liquid-cooled heat-conducting device, the heat dissipation fiber layer covers and is embedded on the heat-conducting base, and the shape of the removed heat dissipation fiber layer is consistent with the shape of the protrusion on the heat-conducting base. Wire cutting is used for processing, and the accuracy is controlled within ±0.01mm, and the protrusion area accounts for 25% of the total heat dissipation area; the heat dissipation fiber layer is made of nickel fiber with a wire diameter of 20±5μm, and is sintered at a high temperature of 1000°C in a protective atmosphere of argon, and the sintering time is 2 hours.

[0010] Preferably, in the above-mentioned high-temperature liquid-cooled heat-conducting device, it also includes a layer of high-temperature resistant adhesive, which is arranged between the heat-conducting base and the heat-dissipating fiber layer to fixedly connect the two; the adhesive is a high-temperature resistant ceramic glue, the main component of which is inorganic aluminosilicate, the bonding thickness is 100μm, and it can withstand a high temperature of 1500°C.

[0011] A method for manufacturing a high-temperature liquid-cooled heat-conducting device as described above comprises: providing a heat-conducting base material and forming the heat-conducting base on the material by processing, wherein the heat-conducting base has an upper surface including a plurality of protrusions and grooves; providing a fiber material, forming a plurality of through holes corresponding to the protrusions on the fiber material by processing, and processing the fiber material with through holes to obtain a porous heat-dissipating fiber layer; and fixing the heat-dissipating fiber layer to the upper surface of the heat-conducting base by a high-temperature resistant adhesive so that the protrusions correspond to the through holes.

[0012] Preferably, in the above-mentioned method for manufacturing a high-temperature liquid-cooled heat-conducting device, an array of square heat-conducting columns is cut on the surface of the heat-conducting base material using electric spark wire cutting, and square boss areas for fixing nickel fiber felt are left at the four corners to form the heat-conducting base.

[0013] Preferably, in the above-mentioned manufacturing method of a high-temperature liquid-cooled heat-conducting device, the fiber material is nickel fiber felt with a thickness of 200 μm and a fiber diameter of 20±5 μm. Laser cutting is performed on the nickel fiber felt to form a through-hole pattern corresponding to the protrusion, and the felt is heated at a high temperature of 1000°C for 2 hours to oxidize the surface to form granular nickel oxide to obtain the heat dissipation fiber layer.

[0014] Preferably, in the above-mentioned manufacturing method of a high-temperature liquid-cooled heat-conducting device, the high-temperature resistant adhesive is a high-temperature resistant ceramic glue, the high-temperature resistant ceramic glue is coated on the heat-conducting base, and the heat dissipation fiber layer is stacked on the square heat-conducting column of the heat-conducting base and bonded and fixed.

[0015] Therefore, the present invention adopts the above-mentioned high-temperature liquid-cooled heat-conducting device and its manufacturing method. The high-temperature liquid-cooled heat-conducting device achieves multi-dimensional technical effects through innovative structural design and material optimization. The heat-conducting base is made of stainless steel, and the central square protrusion and the scattered strip protrusions around it form a groove network with a depth of 2mm, which not only constructs a gas escape channel to quickly discharge steam and reduce thermal resistance, but also enhances heat conduction through the layout in which the protrusions account for 25% of the total heat dissipation area; the nickel fiber felt heat dissipation layer covering it is precisely machined by wire cutting to accurately match the shape of the protrusions of the heat-conducting base, and through sintering, the surface roughness and capillary effect are significantly improved, and it is fixed with thick high-temperature resistant ceramic glue to achieve a tight liquid-solid interface. Close contact and structural stability; the device can quickly absorb coolant through a strong capillary effect in a wide temperature range of 100-1300℃, break the high-temperature interface vapor layer, inhibit the Leidenfrost effect, and make the droplets quickly wick and violently vaporize. At the same time, the gas escape channel between the strip-shaped protrusions effectively discharges steam; experiments show that at an initial temperature of 1300℃, it can reduce the surface temperature to below 100℃ within 40 seconds and maintain it stably. The thermal conductive base and the heat dissipation fiber layer work together to achieve efficient heat transfer, and the material is resistant to high temperatures of 1500℃, the structure is detachable and easy to maintain, and it is suitable for thermal control in extreme high-temperature scenarios such as aerospace, nuclear energy equipment, etc., providing an efficient and reliable solution for extremely high-temperature heat dissipation.

[0016] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional diagram of a high-temperature liquid-cooled heat conduction device;

[0018] Figure 2 This is an exploded schematic perspective diagram of a high-temperature liquid-cooled heat conduction device;

[0019] Figure 3 is a structural diagram of the thermal conductive substrate;

[0020] Figure 4 This is a top view of the high-temperature liquid-cooling heat-conducting device of Example 1;

[0021] Figure 5 This is a side view of the high-temperature liquid-cooling heat-conducting device of Example 1;

[0022] Figure 6 This is a scanning electron microscope image of the nickel fiber felt of Example 1;

[0023] Figure 7 This is a temperature drop diagram of the high-temperature liquid-cooled heat conduction device of Example 1 at an extremely high temperature of 1300°C;

[0024] Figure 8 This is a three-dimensional diagram of the high-temperature thermally conductive substrate of Example 2;

[0025] Figure 9 This is a three-dimensional diagram of the high-temperature thermal conductive substrate of Example 3. DETAILED DESCRIPTION

[0026] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] The terms used in the embodiments of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The singular forms "a," "an," "the," and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, and unless the context clearly indicates otherwise, "a plurality" generally includes at least two.

[0028] It should also be noted that the terms "include," "comprises," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a product or device comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such product or device. In the absence of further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the product or device comprising the element.

[0029] The present invention provides a high temperature liquid cooling heat conduction device, such as Figure 1 As shown, the high temperature liquid cooling heat conduction device mainly comprises: a heat conduction base 1 at the bottom, and a heat dissipation fiber layer 2 arranged and fixed on the upper surface of the heat conduction base 1. Figure 2 As shown, the heat-conducting substrate 1 and the heat-dissipating fiber layer 2 are fixedly connected via a high-temperature resistant adhesive 3 .

[0030] like Figure 3As shown, the top surface of the thermally conductive substrate 1 features specific structural features: a central region of the thermally conductive substrate 1 is provided with a plurality of raised structures, typically square protrusions 11, arranged in a linear array. Grooves are formed between adjacent square protrusions 11. Specifically, longitudinal grooves 111 are formed between laterally adjacent protrusions 11, while transverse grooves 112 are formed between longitudinally adjacent protrusions 11. Preferably, grooves in the same direction, such as all transverse grooves 112, are parallel to each other, while grooves in different directions, such as longitudinal grooves 111 and transverse grooves 112, are perpendicular to each other or intersect at a predetermined angle, forming a grid-like or channel-like groove structure surrounding the square protrusions.

[0031] A plurality of strip-shaped protrusions 12 are provided at the edge of the thermally conductive substrate 1, distributed in a generally radial or scattered pattern. Similarly, strip-shaped grooves are formed between adjacent strip-shaped protrusions 12. Specifically, transverse strip-shaped grooves 121 are formed between laterally adjacent strip-shaped protrusions 12, while longitudinal strip-shaped grooves 122 are formed between longitudinally adjacent strip-shaped protrusions 12.

[0032] The grooves in the central area of the heat-conducting base 1 and the strip grooves in the edge area together constitute a fluid channel network. On the one hand, it helps to further guide the coolant after being absorbed by the heat dissipation fiber layer 2 and exchange heat with the protrusions; on the other hand, more importantly, it can serve as an exhaust channel for the steam generated after the coolant evaporates, facilitating the rapid diffusion and escape of the steam to the outside of the heat dissipation device.

[0033] The structure of the bottom surface of the heat-conducting base 1 (i.e., the side in contact with the heat source) can be tailored to the shape of the heat source system to ensure good thermal contact and efficient heat transfer. During operation, heat generated by the heat source is transferred through the bottom surface of the heat-conducting base 1 to the entire base 1, particularly to the raised structures on the surface. The high-temperature liquid-cooled heat-conducting device of the present invention can be used in applications requiring efficient high-temperature heat dissipation, such as rocket engine fuel chambers, nuclear reactor cores, metal smelting furnaces, and electromagnetic weapon rails, but is not limited thereto.

[0034] The heat dissipation fiber layer 2 can be made of materials such as metal fiber felt or ceramic fiber felt. The preparation process may include: first, using laser cutting or other precision processing methods, forming through-holes in the fiber felt raw material that correspond to the shape, size, and position of the protrusions (square protrusions and strip-shaped protrusions) on the thermally conductive substrate 1; then, the cut fiber felt can be subjected to a high-temperature sintering treatment to enhance its structural stability and high-temperature resistance, and to ensure the formation of a stable, interconnected porous network structure.

[0035] In order to more clearly and in detail introduce a high-temperature liquid-cooled heat-conducting device and a manufacturing method thereof provided by an embodiment of the present invention, a description will be given below in conjunction with specific embodiments.

[0036] Example 1

[0037] The bottom surface of the heat-conducting substrate 1 is designed as a planar structure. Figure 4 As shown, the shape and position of the through-holes in the heat-dissipating fiber layer 2 precisely match the cross-sectional shape and position of all the raised structures on the thermally conductive base 1. The raised areas account for 25% of the total heat dissipation area, facilitating heat transfer. To ensure a reliable connection between the thermally conductive base 1 and the heat-dissipating fiber layer 2, a high-temperature-resistant adhesive 3 is applied to specific areas on the upper surface of the thermally conductive base 1. The heat-dissipating fiber layer 2 with through-holes is then placed over the thermally conductive base 1, with the raised structures on the thermally conductive base 1 passing through the corresponding through-holes in the heat-dissipating fiber layer 2. The adhesive 3 securely bonds the two together.

[0038] The heat-conducting base 1 is made of a material with good high-temperature resistance and high thermal conductivity to ensure that heat can be efficiently transferred from the heat source to the raised structure on the surface, and then to the heat dissipation fiber layer and the coolant. In this embodiment, the heat-conducting base 1 is made of steel, and its thermal conductivity is about k = 25W·m -1 ·K -1 The material of the thermally conductive substrate 1 can also be an iron-based alloy, a cobalt-based alloy, a nickel-based alloy, a titanium-based alloy, a copper-based alloy or other suitable high-temperature resistant and high-thermal-conductivity metal, alloy or ceramic composite material. The specific selection can be adjusted according to factors such as the actual working environment temperature, heat flux density and cost.

[0039] The material of the heat dissipation fiber layer 2 also needs to have excellent high-temperature resistance and a certain degree of thermal conductivity. Its key characteristic is its highly developed porous structure (preferably composed of micron- or nanometer-scale fibers), which can produce a strong capillary effect for rapid absorption and dispersion of the coolant. In this embodiment, the heat dissipation fiber layer 2 is made of nickel fiber felt, and its (equivalent) thermal conductivity after high-temperature treatment is approximately k = 0.8147 W·m -1 ·K -1 The heat dissipation fiber layer 2 can also be made of other metal fibers (such as stainless steel fibers, high-temperature alloy fibers, etc.) or non-metallic high-temperature resistant fibers (such as silicon carbide fibers, alumina fibers, quartz fibers, etc.), or materials with similar porous structures such as porous ceramics, graphene foam, etc.

[0040] The high temperature resistant adhesive 3 is a high temperature resistant adhesive that can maintain bonding strength and structural integrity at the target working temperature. In this embodiment, the adhesive is a high temperature resistant ceramic glue, the main component of which is inorganic aluminosilicate, which can survive at a high temperature of 1500°C.

[0041] In this embodiment, the height of the heat dissipation fiber layer 2 is higher than the highest height of the protrusions on the heat conductive base 1, such as Figure 5When the heat dissipation fiber layer 2 is installed on the thermally conductive base 1, its top surface (upper surface) is slightly higher than the top surfaces of all raised structures on the thermally conductive base 1. This height difference (the distance the top surface of the heat dissipation fiber layer exceeds the top surface of the raised structures) is the sum of the thickness of the heat dissipation fiber layer and the thickness of the high-temperature resistant adhesive coating, which is approximately 300 μm.

[0042] Because the top surface of the heat dissipation fiber layer 2 is the highest point on the entire device's working surface and possesses excellent porous hydrophilic properties, such as a strong affinity for water, when coolant drips or sprays onto the device's surface, it preferentially contacts and is rapidly absorbed and soaked by the porous structure of the heat dissipation fiber layer 2 through capillary action, spreading over a large area within the fiber network. This design effectively avoids the violent splashing that can occur when droplets directly impact hot solid surfaces.

[0043] like Figure 6 The following is a scanning electron microscope (SEM) image of the nickel fiber felt used in this example, clearly showing its interconnected porous network structure. This microstructure is the physical basis for achieving rapid capillary absorption of coolant, large-area spreading, and effective vapor discharge.

[0044] Experimental testing was conducted on the thermally conductive device, heating it using a high-frequency induction heater. When the working surface temperature of the thermally conductive device is within a high range, for example, 100°C to 1300°C, the dripping or supplied coolant rapidly spreads through the porous structure using the powerful capillary action of the heat-dissipating fiber layer 2, effectively and efficiently exchanging heat with the internal fiber skeleton and the protrusions of the thermally conductive base 1 interspersed therein. During this process, the coolant continuously absorbs large amounts of heat until it boils and evaporates.

[0045] Crucially, because the coolant is effectively "locked" in close contact with the hot surface by the porous structure and continuously replenished, the structure significantly suppresses or even completely avoids the Leidenfrost effect. This thermal conductivity device overcomes this high-temperature heat dissipation bottleneck by maintaining direct liquid-solid contact and efficient phase change heat transfer.

[0046] The generated steam can flow quickly and smoothly through the groove network pre-set on the heat-conducting base 1 as a priority channel and be discharged to the outside of the device. This not only prevents steam from accumulating on the heat dissipation interface and hindering heat transfer, but also creates conditions for the subsequent timely replenishment of coolant and continuous and efficient heat dissipation.

[0047] Figure 7 This is a comparative curve of the liquid cooling performance of the heat conduction device of Example 1 of the present invention and the common structural material (as a control group) under the conditions of an initial surface temperature of 1300°C and continuous heating.

[0048] At 20 seconds after the start of the experiment (t=20s), cooling water was dripped toward the center of the sample surface at a constant flow rate of 10 ml / min.

[0049] For the heat-conducting device of Example 1 (marked as "Implementation Case 1" in the curve), due to the synergistic effect of the heat-conducting substrate 1 and the heat-dissipating fiber layer 2, the Leidenfrost effect is effectively suppressed and heat is quickly conducted. After the drip cooling begins, its surface temperature drops rapidly from 1300°C to below 100°C in a relatively short period of time (40s).

[0050] During the continuous drip cooling process, the surface temperature of the heat conduction device can be stably maintained at a relatively low level (100°C). According to the figure, it shows that it has achieved stable and efficient high-temperature liquid cooling.

[0051] In contrast, for a standard control sample (e.g., a plate made of the same material but without the heat dissipation fiber layer, but with only the raised and grooved structure, designated as the "control" sample in the curve), the Leidenfrost effect significantly affected the surface, forming a stable vapor insulation layer between the water droplets and the solid surface. This made it difficult for the added water droplets to effectively wet the hot surface, severely hindering heat transfer. Consequently, the surface temperature remained above 1000°C even after the water was added, resulting in very limited cooling and failure to achieve effective liquid cooling.

[0052] The comparative experimental results strongly demonstrate the significant advantages of the high-temperature liquid-cooled heat conduction device structure proposed in the present invention in suppressing the Leidenfrost effect under ultra-high temperature conditions and achieving efficient and stable liquid cooling and heat dissipation.

[0053] Example 2

[0054] like Figure 8 As shown, the main difference between this embodiment and Example 1 lies in the shape of the raised structures on the thermally conductive base 1. In this embodiment, the raised structures provided in the center and edge regions of the thermally conductive base 1 are conical in shape. Accordingly, the through-holes in the corresponding heat dissipation fiber layer are also rounded to allow for proper fit over the conical raised structures. The remaining structure and operating principles are similar to those of Example 1.

[0055] Example 3

[0056] like Figure 9 As shown, the main difference between this embodiment and Examples 1 and 2 lies in the shape of the raised structures. In this embodiment, the raised structures provided in the central region and / or edge regions of the thermally conductive substrate 1 are cylindrical in shape. Similarly, the through-holes provided in the corresponding heat dissipation fiber layer are also rounded to allow for proper fit over the cylindrical raised structures. The remaining structure and operating principles are similar to those of Example 1.

[0057] Therefore, the present invention adopts the above-mentioned high-temperature liquid-cooled heat-conducting device and its manufacturing method. The high-temperature liquid-cooled heat-conducting device achieves multi-dimensional technical effects through innovative structural design and material optimization. The heat-conducting base is made of stainless steel, and the central square protrusion and the scattered strip protrusions around it form a groove network with a depth of 2mm, which not only constructs a gas escape channel to quickly discharge steam and reduce thermal resistance, but also enhances heat conduction through the layout in which the protrusions account for 25% of the total heat dissipation area; the nickel fiber felt heat dissipation layer covering it is precisely machined by wire cutting to accurately match the shape of the protrusions of the heat-conducting base, and through sintering, the surface roughness and capillary effect are significantly improved, and it is fixed with thick high-temperature resistant ceramic glue to achieve a tight liquid-solid interface. Close contact and structural stability; the device can quickly absorb coolant through a strong capillary effect in a wide temperature range of 100-1300℃, break the high-temperature interface vapor layer, inhibit the Leidenfrost effect, and make the droplets quickly wick and violently vaporize. At the same time, the gas escape channel between the strip-shaped protrusions effectively discharges steam; experiments show that at an initial temperature of 1300℃, it can reduce the surface temperature to below 100℃ within 40 seconds and maintain it stably. The thermal conductive base and the heat dissipation fiber layer work together to achieve efficient heat transfer, and the material is resistant to high temperatures of 1500℃, the structure is detachable and easy to maintain, and it is suitable for thermal control in extreme high-temperature scenarios such as aerospace, nuclear energy equipment, etc., providing an efficient and reliable solution for extremely high-temperature heat dissipation.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solutions of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A high-temperature liquid-cooled heat conduction device, characterized in that: include: A heat-conducting base having a plurality of square and strip-shaped protrusions and grooves formed between the protrusions; and a heat dissipation fiber layer covering the heat conductive substrate; The square protrusions are located at the center of the thermally conductive base to form an array structure, and the side length of the square protrusions is 1 mm; the strip protrusions are located around the thermally conductive base to form a scattered distribution, and the strip protrusions are 4.5 mm long and 1 mm wide.

2. A high-temperature liquid-cooled heat conduction device according to claim 1, characterized in that The depth of the groove formed between the protrusions is 2 mm, and the strip-shaped protrusions form a channel for gas escape, which is 1 mm wide, 4.5 mm long and 2 mm deep.

3. A high-temperature liquid-cooled heat conduction device according to claim 1, characterized in that The thermal conductive base material is stainless steel with a thermal conductivity of 20W·m -1 ·K -1 The heat dissipation fiber layer is made of nickel fiber felt with a thickness of about 200 μm and a porosity of 60%.

4. A high-temperature liquid-cooled heat conduction device according to claim 3, characterized in that The heat dissipation fiber layer covers and is embedded in the thermally conductive substrate. The shape of the removed heat dissipation fiber layer is consistent with the shape of the protrusion on the thermally conductive substrate. Wire cutting is used for processing, and the accuracy is controlled within ±0.01mm, and the protrusion area accounts for 25% of the total heat dissipation area; the heat dissipation fiber layer is made of nickel fiber with a wire diameter of 20±5μm, and is sintered at a high temperature of 1000℃ in a protective atmosphere of argon for 2 hours.

5. A high-temperature liquid-cooled heat conduction device according to claim 1, characterized in that , also includes a layer of high-temperature resistant adhesive, which is arranged between the thermal conductive base and the heat dissipation fiber layer to fixedly connect the two; the adhesive is a high-temperature resistant ceramic glue, the main component of which is inorganic aluminosilicate, the bonding thickness is 100μm, and it can withstand a high temperature of 1500℃.

6. A method for manufacturing a high-temperature liquid-cooled heat-conducting device according to any one of claims 1 to 5, characterized in that: include: Providing a thermally conductive base material, and forming the thermally conductive base on the material by processing, wherein the thermally conductive base has an upper surface including a plurality of protrusions and grooves; A fiber material is provided, a plurality of through holes corresponding to the protrusions are formed on the fiber material by processing, and the fiber material with the through holes is treated to obtain a porous heat dissipation fiber layer; the heat dissipation fiber layer is fixed to the upper surface of the thermally conductive substrate by a high-temperature resistant adhesive so that the protrusions correspond to the through holes.

7. The method for manufacturing a high-temperature liquid-cooled heat-conducting device according to claim 6, characterized in that On the surface of the thermally conductive base material, an array of square thermally conductive columns is cut out by electric spark wire cutting, and square boss areas for fixing nickel fiber felt are left at the four corners to form the thermally conductive base.

8. The method for manufacturing a high-temperature liquid-cooled heat-conducting device according to claim 6, characterized in that The fiber material is nickel fiber felt with a thickness of 200 μm and a fiber diameter of 20±5 μm. Laser cutting is performed on the nickel fiber felt to form a through-hole pattern corresponding to the protrusions, and the felt is heated at a high temperature of 1000°C for 2 hours to oxidize the surface to form granular nickel oxide to obtain the heat dissipation fiber layer.

9. The method for manufacturing a high-temperature liquid-cooled heat-conducting device according to claim 6, characterized in that The high temperature resistant adhesive is a high temperature resistant ceramic glue, which is coated on the thermal conductive base, and the heat dissipation fiber layer is stacked on the square thermal conductive column of the thermal conductive base and bonded and fixed.

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