Chip backboard cooling pipeline and control method

Abstract

The invention provides a chip backboard cooling pipeline and a control method, and relates to the technical field of air conditioning equipment, the chip backboard cooling pipeline comprises a first heat exchanger, a first pipeline, a second heat exchanger and a second pipeline which are sequentially communicated to form a first circulation pipeline; the first heat exchanger is used for condensing the gaseous carbon dioxide cold-carrying medium input by the second pipeline to obtain a liquid carbon dioxide cold-carrying medium and outputting the liquid carbon dioxide cold-carrying medium to the first pipeline; the second heat exchanger is used for vaporizing the liquid carbon dioxide cold-carrying medium input by the first pipeline to obtain a gaseous carbon dioxide cold-carrying medium and outputting the gaseous carbon dioxide cold-carrying medium to the second pipeline. The liquid CO2 working medium flows in from the bottom of the micro-channel and vaporizes after absorbing heat of the server backboard, and the gaseous working medium naturally floats upwards and flows out from the top due to density difference, so that the problem of gas-liquid retention or flowing dead zone possibly caused by a traditional horizontal or reverse flow channel is avoided, and it is ensured that the working medium phase change process is more uniform and more efficient.

Description

Technical Field

[0001] The present application relates to the field of heat exchange technology, and in particular to a chip backplane cooling pipeline and a control method. Background Art

[0002] Data center servers generate a significant amount of heat when running. Without proper cooling measures for components like chips, this can easily lead to localized overheating, impacting equipment reliability. Chips, in particular, require simultaneous cooling of both the chip cold plate and the chip backplane to ensure stable performance.

[0003] Freon-based refrigerants are commonly used to cool chip backplanes. While these refrigerants offer higher cooling efficiency than traditional air or water cooling systems, their high global warming potential (GWP) and ozone depletion potential (ODP) have limited their applicability. Furthermore, at temperatures below -20°C, the viscosity of fluorinated liquids increases significantly, increasing recirculation resistance and reducing heat transfer efficiency by over 50%. These refrigerants are unable to meet the cooling needs of data centers in high-altitude and cold regions.

[0004] Therefore, a new cooling system for the chip backplane is urgently needed to solve the above problems. Summary of the Invention

[0005] The embodiments of the present application provide a chip backplane cooling pipeline and control method to solve the problems of insufficient heat exchange capacity and insufficient environmental protection of the cooling structure in the prior art in specific scenarios.

[0006] In a first aspect, an embodiment of the present application provides a chip backplane cooling pipeline, comprising:

[0007] A first heat exchanger, a first pipeline, a second heat exchanger, and a second pipeline are sequentially connected to form a first circulation pipeline; a carbon dioxide cooling medium flows in the first circulation pipeline;

[0008] The first heat exchanger is used to condense the gaseous carbon dioxide cooling medium input from the second pipeline to obtain liquid carbon dioxide cooling medium, and output the liquid carbon dioxide cooling medium to the first pipeline;

[0009] The second heat exchanger is used to vaporize the liquid carbon dioxide cooling medium input from the first pipeline to obtain gaseous carbon dioxide cooling medium, and output the gaseous carbon dioxide cooling medium to the second pipeline;

[0010] The second heat exchanger is bonded to the chip backplane and is used to absorb heat from the surface of the chip backplane.

[0011] In some possible embodiments, the following further comprises:

[0012] The second circulation pipeline includes the first heat exchanger; a first cooling medium flows in the second circulation pipeline; the second circulation pipeline is used to exchange heat with the first circulation pipeline in the first heat exchanger to condense the gaseous carbon dioxide cooling medium in the first circulation pipeline to obtain liquid carbon dioxide cooling medium.

[0013] In some feasible embodiments, a first electric throttle valve is provided on the first pipeline; and a first temperature sensor and a first pressure gauge are provided on the second pipeline.

[0014] In some feasible embodiments, in the second circulation pipeline, the input section of the first heat exchanger is provided with a second electric throttle valve; the output section of the first heat exchanger is provided with a second temperature sensor and a second pressure gauge.

[0015] In some possible embodiments, the following further comprises:

[0016] a controller electrically connected to the first electric throttle valve, the first temperature sensor, the first pressure gauge, the second electric throttle valve, the second temperature sensor, and the second pressure gauge, respectively;

[0017] The controller is used to generate a control instruction for controlling the first electric throttle valve based on the first data fed back by the first temperature sensor and the first pressure gauge, and to generate a control instruction for controlling the second electric throttle valve based on the second data fed back by the second temperature sensor and the second pressure gauge.

[0018] In a second aspect, the present application provides a method for controlling a chip backplane cooling pipeline, which is applied to the controller in the chip backplane cooling pipeline described in the first aspect, the method comprising:

[0019] Obtaining return gas superheat data of the gaseous carbon dioxide cooling medium in the second pipeline;

[0020] A first control instruction is generated based on a comparison result between the return air superheat data and a preset threshold value; the first control instruction is used to adjust the opening of a first electric throttle valve on a first pipeline.

[0021] In some feasible embodiments, the step of generating a first control instruction according to a comparison result of the return air superheat data and a preset threshold value includes:

[0022] If the return air superheat data is lower than a preset threshold, the first control instruction is used to reduce the opening of the first electric throttle valve;

[0023] If the return air superheat data is higher than a preset threshold, the first control instruction is used to increase the opening of the first electric throttle valve.

[0024] In some possible embodiments, the method further includes:

[0025] When the return air superheat data is lower than a preset threshold, a second control instruction is generated; the second control instruction is used to reduce the opening of the second electric throttle valve in the second circulation pipeline;

[0026] When the return air superheat data is higher than a preset threshold, a third control instruction is generated; the third control instruction is used to increase the opening of the second electric throttle valve in the second circulation pipeline.

[0027] In some possible embodiments, the method further includes:

[0028] Acquire real-time data of the cabinet where the chip backplane is located; the real-time data includes at least one of cabinet power, ambient temperature, and working fluid overheat;

[0029] If the real-time data satisfies the first preset rule, a fourth control instruction is generated; the fourth control instruction is used to adjust the opening of the first electric throttle valve on the first pipeline, and / or adjust the opening of the second electric throttle valve in the second circulation pipeline.

[0030] In some possible embodiments, the method further includes:

[0031] If the real-time data satisfies a first preset rule, a fifth control instruction is generated; the fifth control instruction is used to adjust the opening of the first electric throttle valve on the first pipeline and / or adjust the opening of the second electric throttle valve in the second circulation pipeline within a preset time period;

[0032] Real-time data within the preset time period is acquired, and if the real-time data satisfies a second preset rule, a sixth control instruction is generated, where the sixth control instruction is used to cancel the fifth control instruction.

[0033] The solution provided by this application has the following beneficial effects:

[0034] 1. This application greatly increases the contact area between the working fluid and the server backplane through the precisely designed microchannel structure inside the evaporation section, enhances the rapid absorption of heat and the efficiency of phase change startup, and makes the liquid CO2 quickly vaporize after being heated. The latent heat absorption can reach 5-8 times that of sensible heat exchange, significantly improving the heat dissipation capacity per unit area and meeting the heat dissipation needs of high heat density cabinets (single cabinet power ≥ 20kW).

[0035] 2. This application is based on a gravity-driven closed-loop architecture. After the liquid CO2 absorbs heat and vaporizes in the evaporation section, it rises to the condensation section by relying on the natural driving force formed by the gas-liquid density difference. The condensed liquid working fluid automatically flows back under the action of gravity. No external power devices such as mechanical pumps are required, which greatly reduces the power consumption of the data center.

[0036] 3. The pipeline constructed in this application integrates an electric regulating valve control strategy based on the return gas superheat of the microchannel heat exchanger. By real-time monitoring of the return gas superheat and dynamically adjusting the valve opening, the CO2 working fluid flow rate is precisely controlled, achieving high-precision control of the return gas superheat at a stable 1K. This mechanism effectively avoids the risk of evaporation section drying out or condensation section liquid hammer caused by uneven working fluid flow in traditional gravity heat pipe systems, ensuring that the gas-liquid two-phase circulation is always in the efficient phase change range.

[0037] 4. The CO2 gravity heat pipe backplane heat exchanger in this application is directly bonded to the server cabinet and adopts an integrated design, which greatly reduces the pipe redundancy and space occupation of the traditional cooling system, improves the flexibility of the data center cabinet layout, and adapts to the construction needs of high-density modular data centers. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A schematic diagram of the structure of a chip backplane cooling pipeline provided in some embodiments of the present application;

[0039] Figure 2 This is a schematic diagram of the chip backplane cooling circuit provided in this application.

[0040] Description of reference numerals:

[0041] 1-output section; 2-input section; 3-second temperature sensor; 4-second pressure gauge; 5-second electric throttle valve; 6-first heat exchanger; 7-second pipeline; 8-first pipeline; 9-first temperature sensor; 10-first pressure gauge; 11-first electric throttle valve; 12-CO2 gravity heat pipe; 13-back plate heat exchanger. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0043] It should be noted that in this application, carbon dioxide (CO2) is used as a new working fluid with a critical temperature of 31.1°C and a triple point of -56.6°C. It can achieve efficient heat transfer through a liquid-to-gas phase transition within the temperature range of -55°C to 0°C. Furthermore, CO2 has GWP = 1, ODP = 0, is non-corrosive, and is non-flammable and explosive, making it significantly safer and more environmentally friendly than traditional fluorinated liquid working fluids.

[0044] See also Figure 1, which is a schematic diagram of the structure of the chip backplane cooling pipeline provided in some embodiments of the present application; see Figure 2 , which is a schematic diagram of the chip backplane cooling pipeline provided by this application;

[0045] See also Figure 1 , the present application provides a chip backplane cooling pipeline, comprising:

[0046] The first heat exchanger 6, the first pipeline 8, the second heat exchanger and the second pipeline 7 are sequentially connected to form a first circulation pipeline; carbon dioxide cooling medium flows in the first circulation pipeline; wherein the second heat exchanger includes a connected CO2 gravity heat pipe 12 and a backplate heat exchanger 13.

[0047] In the embodiment of the present application, carbon dioxide is used as the cooling medium, and its natural phase change cycle is the core. The heat absorption and heat release effect of vaporization / condensation is utilized to achieve the purpose of removing the heat from the chip backplane through the first circulation pipeline. Specifically, the first heat exchanger 6 and the second heat exchanger respectively perform different heat exchange processes in the embodiment of the present application:

[0048] The first heat exchanger 6 is used to condense the gaseous carbon dioxide cooling medium input from the second pipeline 7 to obtain liquid carbon dioxide cooling medium, and output the liquid carbon dioxide cooling medium to the first pipeline 8;

[0049] The second heat exchanger is used to vaporize the liquid carbon dioxide cooling medium input from the first pipeline 8 to obtain gaseous carbon dioxide cooling medium, and output the gaseous carbon dioxide cooling medium to the second pipeline 7;

[0050] The second heat exchanger is bonded to the chip backplane to absorb heat from the chip backplane surface. In practical applications, the CO2 gravity heat pipe 12 and the backplane heat exchanger 13 can be integrated into a highly efficient heat transfer unit and directly bonded to the server cabinet to transfer heat from the chip backplane.

[0051] In an embodiment of the present application, the horizontal height of the first heat exchanger 6 is higher than the horizontal height of the second heat exchanger, so that the gaseous carbon dioxide cooling medium generated in the second heat exchanger can automatically flow along the second pipeline 7 toward the direction of the first heat exchanger 6 based on the density difference, and can also automatically flow along the first pipeline 8 toward the direction of the second heat exchanger based on the height difference, thereby realizing the flow of the medium without the need for a driving device.

[0052] See also Figure 2In the embodiment of the present application, the second heat exchanger composed of the CO2 gravity heat pipe 12 and the backplane heat exchanger 13 serves as the evaporation section, which can be tightly fitted with the server cabinet (chip) backplane through a high thermal conductivity interface material, and the liquid CO2 cooling medium flows evenly into the microchannel array at the bottom of the evaporation section, which adopts a "bottom-in and top-out" flow channel design. The precise layout of the microchannel (channel width is 0.5-1.2mm, depth is 2-3mm) greatly increases the contact area between the working fluid and the heat source, so that when the liquid CO2 absorbs the heat generated by the operation of the server, it can quickly break through the phase change threshold and complete the transformation from liquid to gas. Because the density of the gaseous CO2 is significantly reduced, it rises along the second pipeline 7 to the first heat exchanger 6 under the action of the natural driving force formed by the density difference between the gas and liquid phases. The whole process follows the spontaneous heat transfer law of the second law of thermodynamics.

[0053] Continue to see Figure 2 In the first heat exchanger 6, high-temperature gaseous CO2 and the external cooling medium undergo forced convection heat exchange through the corrugated, enhanced heat transfer tube bundle. Under supercritical pressure (approximately 7.4 MPa), the gaseous CO2 releases latent heat and cools to 30-35°C, completing a gas-liquid phase transition and condensing into a liquid state. The condensed, high-density liquid CO2 returns to the bottom of the microchannels of the backplate heat exchanger 13 under the influence of gravity along the return line (first line 8), thus forming a closed cycle of "evaporation-ascent-condensation-reflux."

[0054] As can be seen from the above technical solution, the evaporator of the backplane heat exchanger in the embodiment of this application adopts a bottom-in, top-out microchannel flow layout. Liquid CO2 flows into the bottom of the microchannel, vaporizes after absorbing heat from the server backplane, and the gaseous working medium naturally floats up due to the density difference and flows out of the top, fully aligning with the driving principle of the "thermosiphon effect" of gravity heat pipes. This design reduces the flow resistance of CO2 within the microchannel by more than 30%, avoiding the gas-liquid stagnation or flow dead zones that can occur with traditional horizontal or reverse flow channels, and ensuring a more uniform and efficient working medium phase change process.

[0055] At the same time, this application uses CO2 as the working fluid, which has a global warming potential (GWP) of only 1 and an ozone depletion potential (ODP) of 0, fundamentally solving the high environmental load problem caused by traditional fluorinated liquid working fluids (GWP>1000), conforming to the global trend of low-carbon data center construction, and meeting stringent environmental regulations. Utilizing the unique phase change characteristics of CO2 (triple point -56.6°C, critical temperature 31.1°C), it can still efficiently transfer heat through liquid-gas phase change in the low temperature range of -55°C to 0°C, completely solving the problem of fluorinated liquid's heat transfer efficiency dropping by more than 50% due to a surge in viscosity below -20°C. It can not only meet the heat dissipation needs of plateaus, cold regions, green data centers, high-density data centers, but also greatly expand the application scenarios of gravity heat pipe backplanes.

[0056] For further information, see Figure 1 In some feasible embodiments, the chip cooling circuit provided by the present application further includes:

[0057] The second circulation pipeline includes the first heat exchanger 6; a first cooling medium flows in the second circulation pipeline; the second circulation pipeline is used to exchange heat with the first circulation pipeline in the first heat exchanger 6, so that the gaseous carbon dioxide cooling medium in the first circulation pipeline is condensed to obtain liquid carbon dioxide cooling medium.

[0058] In the embodiment of the present application, the second circulation pipeline can be connected to any external refrigeration pipeline, and the first cooling medium can be cooling water or other cooling media.

[0059] In some possible embodiments, see Figure 1 The first pipeline 8 is provided with a first electric throttle valve 11; the second pipeline 7 is provided with a first temperature sensor 9 and a first pressure gauge 10. The first temperature sensor 9 is used to monitor the temperature of the gaseous carbon dioxide cooling medium in the second pipeline 7 in real time, and uses the monitored temperature data as real-time data; the first pressure gauge 10 is used to monitor the pressure of the gaseous carbon dioxide cooling medium in the second pipeline 7 in real time, and uses the monitored pressure data as real-time data. In actual application, the opening of the first electric throttle valve 11 can be dynamically adjusted based on the real-time data from the first temperature sensor 9 and the first pressure gauge 10 to precisely control the flow rate and pressure of the gaseous carbon dioxide cooling medium in the second pipeline 7, thereby achieving precise adjustment of the cooling effect.

[0060] In some possible embodiments, see Figure 1 In the second circulation pipeline, the input section 2 of the first heat exchanger 6 is equipped with a second electric throttle valve 5; the output section 1 of the first heat exchanger 6 is equipped with a second temperature sensor 3 and a second pressure gauge 4. The second temperature sensor 3 is used to monitor the temperature of the first cooling medium in the output section 1 of the first heat exchanger 6 in real time, and uses the monitored temperature data as real-time data; the second pressure gauge 4 is used to monitor the pressure of the first cooling medium in the output section 1 of the first heat exchanger 6 in real time, and uses the monitored pressure data as real-time data. In actual application, the opening of the second electric throttle valve 5 can be dynamically adjusted based on the real-time data from the second temperature sensor 3 and the second pressure gauge 4 to accurately control the flow rate and pressure of the first cooling medium in the first heat exchanger 6, thereby further ensuring the stability and efficiency of the cooling effect.

[0061] In some feasible embodiments, the following further comprises:

[0062] a controller (not shown in the figure), electrically connected to the first electric throttle valve 11, the first temperature sensor 9, the first pressure gauge 10, the second electric throttle valve 5, the second temperature sensor 3, and the second pressure gauge 4;

[0063] The controller is used to generate a control instruction for controlling the first electric throttle valve 11 based on the first data fed back by the first temperature sensor 9 and the first pressure gauge 10, and to generate a control instruction for controlling the second electric throttle valve 5 based on the second data fed back by the second temperature sensor 3 and the second pressure gauge 4.

[0064] In an embodiment of the present application, the controller can process and analyze data fed back by the first temperature sensor 9, the first pressure gauge 10, the second temperature sensor 3, and the second pressure gauge 4 using a preset algorithm or model, thereby determining the optimal opening of the first electric throttle valve 11 and the second electric throttle valve 5. By adjusting the opening of these two throttle valves in real time, precise control of the cooling system can be achieved, ensuring that it maintains the optimal cooling effect under different operating conditions. In addition, the controller can also have fault diagnosis and early warning functions. When the system experiences an anomaly, it can promptly detect and take appropriate measures to prevent the fault from further expanding and ensure the stable operation of the system.

[0065] As can be seen from the above technical solution, the pipeline provided by this application can integrate an electric regulating valve control strategy based on the return gas superheat of the microchannel heat exchanger through a controller. By real-time monitoring of the return gas superheat and dynamically adjusting the valve opening, the CO2 working fluid flow rate is precisely controlled, achieving high-precision control of the return gas superheat at a stable 1K. This mechanism effectively avoids the risks of evaporation section drying out or condensation section liquid hammer caused by uneven working fluid flow in traditional gravity heat pipe systems, ensuring that the gas-liquid two-phase circulation is always in the efficient phase change range.

[0066] In order to explain in detail the working principle of the controller, the present application further provides a control method for a chip backplane cooling pipeline, which is applied to the controller in the chip backplane cooling pipeline in any of the aforementioned embodiments. The method includes:

[0067] S100: Acquire return gas superheat data for the gaseous carbon dioxide refrigerant in the second pipeline. Specifically, the temperature and pressure of the gaseous carbon dioxide in the second pipeline are monitored and recorded during circulation to calculate its superheat value. Superheat, defined as the degree to which the gas temperature exceeds its saturation temperature, is a key parameter for measuring the efficiency and stable operation of a refrigeration system. Accurately acquiring this data ensures efficient operation of the refrigeration system according to design requirements while preventing system failures caused by abnormal superheat.

[0068] S200: Generate a first control instruction based on a comparison result between the return air superheat data and a preset threshold value. The first control instruction is used to adjust the opening of a first electric throttle valve on a first pipeline. Specifically, the opening adjustment method is differentiated into increasing the opening or decreasing the opening. By setting a preset threshold value and comparing it with the real-time data, a corresponding control rule can be derived.

[0069] Furthermore, in some feasible embodiments, the step of generating a first control instruction according to a comparison result of the return air superheat data and a preset threshold value includes:

[0070] S210: If the return gas superheat data is lower than a preset threshold, the first control instruction is used to reduce the opening of the first electric throttle valve; for example, when the superheat is lower than 0.8K, the valve opening is reduced to limit the working fluid flow rate to avoid liquid accumulation in the evaporation section due to incomplete vaporization of liquid CO2.

[0071] S220: If the return air superheat data is higher than a preset threshold, the first control instruction is used to increase the opening of the first electric throttle valve; for example, when the superheat is higher than 1.2K, the valve opening is increased to accelerate the working medium circulation and prevent the evaporation section from drying up.

[0072] When the return gas superheat data is abnormal, in addition to adjusting the medium flow in the first circulation pipeline, the medium flow in the second circulation pipeline may also be adjusted accordingly. Therefore, in some feasible embodiments, the method further includes:

[0073] S230: When the return air superheat data is lower than a preset threshold, generating a second control instruction; the second control instruction is used to reduce the opening of the second electric throttle valve in the second circulation pipeline;

[0074] S240: When the return air superheat data is higher than a preset threshold, a third control instruction is generated; the third control instruction is used to increase the opening of the second electric throttle valve in the second circulation pipeline.

[0075] For example, when the superheat falls below 0.8K, the opening of the second electric throttle valve in the second circulation line decreases accordingly to reduce the flow of the working fluid in that line. When the superheat exceeds 1.2K, the opening of the second electric throttle valve increases to promote the flow of the working fluid in the second circulation line. This dual regulation mechanism allows for more precise control of the working fluid flow in the cooling line, improving cooling efficiency while ensuring system stability and reliability.

[0076] In some feasible embodiments, the method further includes:

[0077] S300: Acquire real-time data of the cabinet where the chip backplane is located; the real-time data includes at least one of cabinet power, ambient temperature, and working medium overheat;

[0078] S400: If the real-time data satisfies the first preset rule, a fourth control instruction is generated; the fourth control instruction is used to adjust the opening of the first electric throttle valve on the first pipeline and / or adjust the opening of the second electric throttle valve in the second circulation pipeline.

[0079] In this embodiment of the present application, the controller can also integrate an intelligent control module to establish communication with the service center. By collecting multi-dimensional data such as cabinet power, ambient temperature, and working fluid superheat in real time, it can dynamically adjust the cooling medium flow rate and valve opening. For example, when the cabinet load suddenly increases (such as from 15kW to 25kW), the controller can generate a control instruction to increase the cooling water flow rate by 20% and accelerate the CO2 circulation by adjusting the electric throttle valve opening to ensure that the heat dissipation capacity matches the heat load.

[0080] In addition, considering that some data anomalies may lead to invalid control, for example, when the cabinet load suddenly increases and then immediately returns to a normal value, further adjustment of the medium flow in the cooling pipeline may not be required. Therefore, a preset time limit can be added in step S400, and the adjustment can be completed with a certain delay or a certain time limit. Accordingly, in some feasible embodiments, the method further includes:

[0081] S410: If the real-time data satisfies a first preset rule, generating a fifth control instruction; the fifth control instruction is used to adjust the opening of the first electric throttle valve on the first pipeline and / or adjust the opening of the second electric throttle valve in the second circulation pipeline within a preset time period;

[0082] S420: Acquire real-time data within the preset time period, and if the real-time data satisfies a second preset rule, generate a sixth control instruction, wherein the sixth control instruction is used to cancel the fifth control instruction.

[0083] For example, the generation of the fifth control instruction is based on the need to increase the cooling water flow by 20% within 5 seconds when the cabinet load suddenly increases (such as from 15kW to 25kW); then within 5 seconds, if the cabinet load obtained again becomes 15kW, it means that the sudden increase has not continued. At this time, the operation of the fifth control instruction can be canceled by generating the sixth control instruction, without changing the flow of the medium in the first circulation pipeline or the second circulation pipeline, thereby avoiding invalid waste of resources.

[0084] As can be seen from the above technology, the solution of this application uses a CO2 gravity heat pipe backplane to construct a cooling pipeline, with the natural phase change cycle of CO2 as the working fluid as the core. Incorporating key technologies such as microchannel enhanced heat transfer, supercritical pressure optimization, and intelligent dynamic control, it provides stable heat dissipation for high-heat density cabinets (single cabinet power ≥ 20kW) without requiring additional energy consumption. Its compact, integrated design can be directly embedded in the back of the cabinet, saving 30%-40% of the data center room space. At the same time, with the environmentally friendly characteristics of GWP=1 and ODP=0, it has become an ideal cooling solution for high-altitude cold regions and modular data centers.

[0085] It is easy to understand that those skilled in the art can combine, split, reorganize, etc. the embodiments of the present application based on the several embodiments provided in the present application to obtain other embodiments, and these embodiments do not exceed the scope of protection of the present application.

[0086] The above specific implementation methods further explain in detail the purpose, technical solutions and beneficial effects of the embodiments of the present application. It should be understood that the above are only specific implementation methods of the embodiments of the present application and are not intended to limit the scope of protection of the embodiments of the present application. Any modifications, equivalent replacements, improvements, etc. made on the basis of the technical solutions of the embodiments of the present application should be included in the scope of protection of the embodiments of the present application.

Claims

1. A chip backplane cooling pipeline, characterized in that: include: A first heat exchanger, a first pipeline, a second heat exchanger, and a second pipeline are sequentially connected to form a first circulation pipeline; a carbon dioxide cooling medium flows in the first circulation pipeline; The first heat exchanger is used to condense the gaseous carbon dioxide cooling medium input from the second pipeline to obtain liquid carbon dioxide cooling medium, and output the liquid carbon dioxide cooling medium to the first pipeline; The second heat exchanger is used to vaporize the liquid carbon dioxide cooling medium input from the first pipeline to obtain gaseous carbon dioxide cooling medium, and output the gaseous carbon dioxide cooling medium to the second pipeline; The second heat exchanger is bonded to the chip backplane and is used to absorb heat from the surface of the chip backplane.

2. The chip backplane cooling pipeline according to claim 1, characterized in that: Also includes: a second circulation pipeline, the second circulation pipeline including the first heat exchanger; a first cooling medium flowing in the second circulation pipeline; The second circulation pipeline is used to perform heat exchange with the first circulation pipeline in the first heat exchanger, so as to condense the gaseous carbon dioxide cooling medium in the first circulation pipeline to obtain liquid carbon dioxide cooling medium.

3. The chip backplane cooling pipeline according to claim 2, characterized in that: A first electric throttle valve is provided on the first pipeline; a first temperature sensor and a first pressure gauge are provided on the second pipeline.

4. The chip backplane cooling pipeline according to claim 3, characterized in that: In the second circulation pipeline, the input section of the first heat exchanger is provided with a second electric throttle valve; the output section of the first heat exchanger is provided with a second temperature sensor and a second pressure gauge.

5. The chip backplane cooling pipeline according to claim 4, characterized in that: Also includes: a controller electrically connected to the first electric throttle valve, the first temperature sensor, the first pressure gauge, the second electric throttle valve, the second temperature sensor, and the second pressure gauge, respectively; The controller is used to generate a control instruction for controlling the first electric throttle valve based on the first data fed back by the first temperature sensor and the first pressure gauge, and to generate a control instruction for controlling the second electric throttle valve based on the second data fed back by the second temperature sensor and the second pressure gauge.

6. A method for controlling a chip backplane cooling pipeline, applied to a controller in the chip backplane cooling pipeline according to any one of claims 1 to 5, characterized in that: The method comprises: Obtaining return gas superheat data of the gaseous carbon dioxide cooling medium in the second pipeline; A first control instruction is generated based on a comparison result between the return air superheat data and a preset threshold value; the first control instruction is used to adjust the opening of a first electric throttle valve on a first pipeline.

7. The method according to claim 6, characterized in that The step of generating a first control instruction according to a comparison result of the return air superheat data and a preset threshold value includes: If the return air superheat data is lower than a preset threshold, the first control instruction is used to reduce the opening of the first electric throttle valve; If the return air superheat data is higher than a preset threshold, the first control instruction is used to increase the opening of the first electric throttle valve.

8. The method according to claim 6, characterized in that The method further comprises: When the return air superheat data is lower than a preset threshold, a second control instruction is generated; the second control instruction is used to reduce the opening of the second electric throttle valve in the second circulation pipeline; When the return air superheat data is higher than a preset threshold, a third control instruction is generated; the third control instruction is used to increase the opening of the second electric throttle valve in the second circulation pipeline.

9. The method according to claim 6, characterized in that The method further comprises: Acquire real-time data of the cabinet where the chip backplane is located; the real-time data includes at least one of cabinet power, ambient temperature, and working fluid overheat; If the real-time data satisfies the first preset rule, a fourth control instruction is generated; the fourth control instruction is used to adjust the opening of the first electric throttle valve on the first pipeline, and / or adjust the opening of the second electric throttle valve in the second circulation pipeline.

10. The method according to claim 9, characterized in that The method further comprises: If the real-time data satisfies a first preset rule, a fifth control instruction is generated; the fifth control instruction is used to adjust the opening of the first electric throttle valve on the first pipeline and / or adjust the opening of the second electric throttle valve in the second circulation pipeline within a preset time period; Real-time data within the preset time period is acquired, and if the real-time data satisfies a second preset rule, a sixth control instruction is generated, where the sixth control instruction is used to cancel the fifth control instruction.

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