Polycrystalline silicon crushing equipment

Abstract

The invention discloses polycrystalline silicon crushing equipment which comprises a feeding device, a heating device, a cooling device and a crushing device, and the feeding device is used for continuously supplying silicon columns; the heating device comprises a machine table, a conveying mechanism and a heating mechanism, the conveying mechanism is arranged on the machine table and used for receiving the silicon columns supplied by the feeding device, the conveying mechanism is used for conveying the silicon columns and enabling the silicon columns to rotate, and the heating mechanism is arranged on the machine table and used for conducting high-temperature heating on the silicon columns conveyed by the conveying mechanism; the cooling device is used for cooling the heated silicon column; and the crushing device is used for receiving the silicon columns conveyed out by the cooling device and crushing the silicon columns. In the process that the silicon column is conveyed by the conveying mechanism, the silicon column rotates, and the heating mechanism can uniformly heat the periphery of the silicon column at high temperature, so that after the silicon column passes through the cooling device, the crushing device can fully crush the silicon column.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment, and in particular to a polysilicon crushing device. Background Art

[0002] In related technologies, polysilicon needs to be crushed before use. It needs to be subjected to high-temperature and cooling treatment to facilitate subsequent crushing operations. During the heating process, a conveyor mechanism is typically used to transport the polysilicon to a heated area, thereby heating the polysilicon being transported by the conveyor mechanism.

[0003] However, common transmission mechanisms easily lead to poor heating effects of polysilicon, such as when polysilicon is transmitted by a conveyor belt, thereby affecting the subsequent crushing effect of the polysilicon. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a polysilicon crushing device that can uniformly heat the polysilicon to improve the subsequent crushing effect of the polysilicon.

[0005] In a first aspect, an embodiment of the present application provides a polysilicon crushing device, comprising:

[0006] A feeding device for continuously supplying silicon columns;

[0007] The heating device includes a machine, a conveying mechanism, and a heating mechanism, wherein the conveying mechanism is provided on the machine and is used to receive the silicon pillars supplied by the loading device, the conveying mechanism is used to convey the silicon pillars and rotate the silicon pillars, and the heating mechanism is provided on the machine and is used to heat the silicon pillars conveyed by the conveying mechanism at a high temperature;

[0008] A cooling device, used for cooling the heated silicon column;

[0009] The crushing device is used to receive the silicon pillars transmitted from the cooling device and crush the silicon pillars.

[0010] According to some embodiments of the present invention, the conveying mechanism includes:

[0011] A first carrier is disposed on the machine, wherein the first carrier is provided with a plurality of first placement slots in sequence along its length;

[0012] A second carrier is provided on the machine, wherein the first carrier and the second carrier are arranged side by side, and the second carrier is provided with a plurality of second placement slots in sequence along its length;

[0013] A first driving module is provided on the machine platform, and is used to drive the second carrier to move along its length direction and up and down direction, so that the silicon column is switched between the first carrier and the second carrier to realize transportation;

[0014] When the second carrier places the silicon column on the first carrier, the first placement groove and the second placement groove are partially staggered; and / or when the second carrier lifts the silicon column from the first carrier, the first placement groove and the second placement groove are partially staggered.

[0015] According to some embodiments of the present invention, the first placement groove is provided with a relatively expanded first guiding inclined surface; the second placement groove is provided with a relatively expanded second guiding inclined surface.

[0016] According to some embodiments of the present invention, the sidewall of the first placement groove is provided with a first support pad for allowing the silicon column to roll along the first support pad; and / or, the sidewall of the second placement groove is provided with a second support pad for allowing the silicon column to roll along the second support pad.

[0017] According to some embodiments of the present invention, the second carrier is provided with a material receiving section, and the material receiving section can be in an extended state relative to the first carrier;

[0018] The loading device includes a third carrier and a second driving module. The second driving module is arranged on the machine and is used to drive the third carrier to slide along its length direction so that it can overlap with the material receiving section in the extended state. The third carrier is provided with multiple third placement slots in sequence along its length direction.

[0019] According to some embodiments of the present invention, the loading device further includes a fourth carrier and a third driving module, wherein the third driving module is used to drive the fourth carrier to move up and down, and the fourth carrier is sequentially provided with a plurality of fourth placement slots along its length direction;

[0020] Among them, the third carrier includes a feeding section and a discharging section, and the feeding section and the discharging section are arranged at an equal distance. When the feeding section extends relative to the fourth carrier, it receives the incoming silicon column, and the discharging section is aligned with the fourth carrier to support the silicon column on the fourth carrier; when the discharging section extends relative to the fourth carrier, the discharging section coincides with the receiving section to be able to transfer the silicon column from the discharging section to the receiving section, and the feeding section is aligned with the fourth carrier to transfer the silicon column to the fourth carrier.

[0021] According to some embodiments of the present invention, the second carrier is provided with an intermediate section and an outgoing section, the intermediate section is connected between the material receiving section and the outgoing section, and when the outgoing section extends relative to the first carrier, the material receiving section is aligned with the first carrier.

[0022] According to some embodiments of the present invention, the length of the middle section is X1, and the lengths of the feeding section and the discharging section are X2, X1=nX2, and n is greater than or equal to 1.

[0023] According to some embodiments of the present invention, the first driving module includes:

[0024] A first driving member, provided on the machine platform, for providing a force in a conveying direction;

[0025] The second driving member is disposed on the first driving member and is used for providing an acting force in an up-down direction. The second carrier is disposed on the second driving member.

[0026] According to some embodiments of the present invention, the second driving member includes:

[0027] Four elevators, each having a lifting portion and two transmission portions, wherein the lifting portion is connected to the second carrier;

[0028] Four transmission shafts, respectively connected to the transmission parts of adjacent elevators;

[0029] The motor is used to drive the transmission shaft to rotate.

[0030] It can be seen from the above technical solution that the embodiment of the present application has the following advantages: the loading device continuously transfers the silicon column to be heated into the conveying mechanism of the heating device, and the conveying mechanism conveys the silicon column from left to right. Under the conveyance of the conveying mechanism, the silicon column rotates and rolls by itself, so that the downward peripheral area of the silicon column rotates to an upward state. As a result, the heating device located above the silicon column can evenly heat the four sides of the silicon column. The heated silicon column is transferred to the cooling device, which cools the silicon column. The cooled silicon column is transferred to the crushing device, which cools the silicon column. It can be understood that when the conveying mechanism is conveying the silicon column, the silicon column rotates by itself, and the heating mechanism can evenly heat the four sides of the silicon column with high temperature. In this way, after the silicon column passes through the cooling device, the crushing device can fully crush the silicon column. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic structural diagram of a polysilicon crushing device according to an embodiment of the present invention;

[0032] Figure 2 A schematic structural diagram of a working state of a heating device according to an embodiment of the present invention;

[0033] Figure 3 Schematic diagram of the structure of the first carrier and the second carrier according to an embodiment of the present invention;

[0034] Figure 4 Schematic diagram of the structure of the second carrier and the first driving module according to an embodiment of the present invention;

[0035] Figure 5 This is a schematic structural diagram of another working state of the heating device according to an embodiment of the present invention;

[0036] Figure 6 This is a schematic structural diagram of a loading device according to an embodiment of the present invention;

[0037] Figure 7 This is a schematic diagram of the exploded structure of a feeding device according to an embodiment of the present invention;

[0038] Figure 8 Schematic diagram of the cooperative working structure of the second carrier and the third carrier according to an embodiment of the present invention.

[0039] The meanings of the reference numerals are as follows:

[0040] 10. Silicon pillar; 100. Loading device; 110. Third carrier; 111. Third placement trough; 112. Feed section; 113. Discharge section; 120. Second drive module; 130. Fourth carrier; 131. Fourth placement trough; 140. Third drive module; 200. Heating device; 210. Machine; 220. Conveying mechanism; 221. First carrier; 2211. First placement trough; 2212. First guide slope; 2213. First support pad; 222. Second carrier; 2221, second placement groove; 2222, second guide slope; 2223, second support pad; 2224, material receiving section; 2225, middle section; 2226, transmission section; 223, first drive module; 2231, first drive member; 2232, second drive member; 2233, transmission shaft; 2234, elevator; 2235, motor; 230, heating mechanism; 300, crushing device; 400, cooling device; 500, stepping transmission device. DETAILED DESCRIPTION

[0041] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0042] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, upper, lower, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0043] In the description of the present invention, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0044] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0045] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0046] The present invention will be further described in detail below with reference to the accompanying drawings.

[0047] See also Figures 1 to 3 , is a polysilicon crushing equipment provided by an embodiment of the present invention, wherein the feeding device 100 is used to continuously supply silicon pillars 10; the heating device 200 includes a machine 210, a conveying mechanism 220, a cooling device 400 and a heating mechanism 230, wherein the conveying mechanism 220 is arranged on the machine 210, and is used to receive the silicon pillars 10 supplied by the feeding device 100, the conveying mechanism 220 is used to convey the silicon pillars 10 and rotate the silicon pillars 10, the heating mechanism 230 is arranged on the machine 210, and is used to heat the silicon pillars 10 conveyed by the conveying mechanism 220 at high temperature; the cooling device 400 is used to cool the heated silicon pillars 10; the crushing device 300 is used to receive the silicon pillars 10 transmitted by the cooling device 400 and crush the silicon pillars 10.

[0048] In specific applications, the loading device 100 continuously transfers the silicon column 10 to be heated into the conveying mechanism 220 of the heating device 200. The conveying mechanism 220 conveys the silicon column 10 from left to right. Under the conveyance of the conveying mechanism 220, the silicon column 10 rotates and rolls by itself, so that the downward circumferential area of the silicon column 10 rotates to an upward state. Thus, the heating device 200 located above the silicon column 10 can evenly heat the four sides of the silicon column 10. The heated silicon column 10 is transferred to the cooling device 400, which cools the silicon column 10. The cooled silicon column 10 is transferred to the crushing device 300, which fully crushes the silicon column 10.

[0049] It can be understood that when the conveying mechanism 220 conveys the silicon column 10, the silicon column 10 rotates itself, and the heating mechanism 230 can evenly heat the four sides of the silicon column 10 at high temperature. In this way, after the silicon column 10 passes through the cooling device 400, the crushing device 300 can fully crush the silicon column 10.

[0050] In some embodiments, see Figures 2 to 3 The conveying mechanism 220 includes a first carrier 221, a second carrier 222, and a first drive module 223. The first carrier 221 is disposed on the platform 210 along its length, i.e., extending in the left-right direction. The first carrier 221 is sequentially provided with a plurality of first placement slots 2211 along its length. The second carrier 222 is slidably disposed on the platform 210 along its length, i.e., slidably disposed in the left-right direction. The first carrier 221 and the second carrier 222 are disposed side by side, and the second carrier 222 is sequentially provided with a plurality of second placement slots 2221 along its length. The first drive module 223 is disposed on the platform 210 and is used to drive the second carrier 222 to move along its length and in the vertical direction, so that the silicon pillars 10 can be switched between the first carrier 221 and the second carrier 222 to achieve conveyance.

[0051] In practical applications, the second carrier 222 operates in four main phases. In the first phase, the first drive module 223 drives the second carrier 222 upward, lifting the silicon pillar 10 upward through the second placement groove 2221, separating the silicon pillar 10 from the first placement groove 2211. In the second phase, the first drive module 223 drives the second carrier 222 rightward by a distance X, thereby moving the lifted silicon pillar 10 rightward by a distance X. In the third phase, the first drive module 223 drives the second carrier 222 downward, placing the lifted silicon pillar 10 downward into the first placement groove 2211 until the second placement groove 2221 separates from the silicon pillar 10. In the fourth working phase, the first drive module 223 drives the second carrier 222 to move to the left by a distance X, returning to the position in the first phase, and repeating the steps from the first working phase to the fourth working phase. Thus, the second carrier 222 sequentially transports the silicon pillars 10 from left to right. This configuration allows the second carrier 222 to reciprocate left and right, as well as up and down, to optimally transport the silicon pillars 10, thereby ensuring that the heating device 200 can optimally heat the silicon pillars 10, facilitating subsequent crushing of the silicon pillars 10.

[0052] Furthermore, relatively expanded first guide slopes 2212 are provided on both sides of the first placement groove 2211, or in other words, the first placement groove 2211 is roughly V-shaped; similarly, relatively expanded first guide slopes 2212 are provided on both sides of the second placement groove 2221, or in other words, the first placement groove 2211 is roughly V-shaped.

[0053] It can be understood that the first placement groove 2211 and the second placement groove 2221 adopt the above-mentioned structural form. The first placement groove 2211 and the second placement groove 2221 can be flexibly used to place silicon pillars 10 of various diameters. Therefore, the heating device 200 can more conveniently heat silicon pillars 10 of various diameters; moreover, the placement openings of the first placement groove 2211 and the second placement groove 2221 are set larger, so that the silicon pillar 10 can be more conveniently placed in the first placement groove 2211 and the second placement groove 2221, or the silicon pillar 10 can be more conveniently taken out from the first placement groove 2211 and the second placement groove 2221.

[0054] In order to achieve the rolling of the silicon pillar 10, in one possible embodiment, when the second carrier 222 places the silicon pillar 10 on the first carrier 221, the first placement groove 2211 and the second placement groove 2221 are partially staggered. Specifically, the bottom of the second placement groove 2221 is located directly above the first guide slope 2212. The second placement groove 2221 places the silicon pillar 10 on the first guide slope 2212, and the silicon pillar 10 rolls downward along the first guide slope 2212, thereby causing the silicon pillar 10 to rotate itself. As a result, the heating device 200 located above the silicon pillar 10 can fully and evenly heat the four sides of the silicon pillar 10, thereby heating the four sides of the silicon pillar 10 at high temperature, and then the silicon pillar 10 can be easily and fully crushed.

[0055] Furthermore, the sidewall of the first guide bevel 2212 is provided with a first support pad 2213 for guiding the silicon pillar 10 to roll along the sidewall of the first support pad 2213, wherein the first support pad 2213 can be made of a high-temperature resistant material such as silicon oxide or silicon carbide, and the surface of the first support pad 2213 can be provided with anti-slip grooves to increase friction. Specifically, through the provision of the first support pad 2213, when the silicon pillar 10 is placed on the first support pad 2213, there is a sufficiently large friction between the silicon pillar 10 and the first support pad 2213, so that the silicon pillar 10 rotates itself during the sliding process along the first guide bevel 2212, thereby the heating device 200 located above the silicon pillar 10 can fully and evenly heat the four sides of the silicon pillar 10, thereby sufficiently heating the four sides of the silicon pillar 10 at a high temperature, and then the silicon pillar 10 can be fully crushed.

[0056] In addition, by disposing the first support pad 2213 , the first support pad 2213 can effectively prevent the first carrier 221 from contaminating the silicon column 10 , thereby ensuring the subsequent use of the silicon column 10 .

[0057] In order to achieve the rolling of the silicon pillar 10, in another possible embodiment, when the second carrier 222 lifts the silicon pillar 10 from the first carrier 221, the first placement groove 2211 and the second placement groove 2221 are partially staggered. Specifically, the bottom of the second placement groove 2221 is located directly below the first guide slope 2212. When the second placement groove 2221 lifts the silicon pillar 10 from the first placement groove 2211, the silicon pillar 10 rolls downward along the second guide slope 2222, thereby causing the silicon pillar 10 to rotate itself. As a result, the heating device 200 located above the silicon pillar 10 can fully and evenly heat the four sides of the silicon pillar 10, thereby sufficiently high-temperature heating the four sides of the silicon pillar 10, and then the silicon pillar 10 can be fully crushed.

[0058] Furthermore, a second support pad 2223 is provided on the second guide bevel 2222 to guide the silicon column 10 to roll along the side wall of the second support pad 2223, wherein the second support pad 2213 can be made of high-temperature resistant materials such as silicon oxide and silicon carbide, and the surface of the first support pad 2213 can be provided with anti-slip grooves to increase friction. Specifically, through the provision of the second support pad 2223, there is a sufficiently large friction between the silicon column 10 and the second support pad 2223, so that the silicon column 10 can rotate itself during the sliding process along the second guide bevel 2222, thereby allowing the heating device 200 located above the silicon column 10 to fully and evenly heat the four sides of the silicon column 10, thereby heating the four sides of the silicon column 10 at high temperature, and then conveniently crushing the silicon column 10.

[0059] In addition, by disposing the second support pad 2223 , the second support pad 2223 can effectively prevent the first carrier 221 from contaminating the silicon column 10 , thereby ensuring the subsequent use of the silicon column 10 .

[0060] In other possible embodiments, the conveying mechanism 220 may adopt other structural forms, such as a circulating motion carrier, and the circulating motion carrier is correspondingly provided with a pressing jig. When the silicon column 10 passes through the pressing jig along with the circulating motion carrier, the friction between the pressing jig and the silicon column 10 is used to achieve rotational adjustment of the silicon column 10, so that the heating device uniformly heats the silicon column 10 at high temperature.

[0061] In some embodiments, see Figures 3 and 4 The first driving module 223 includes a first driving member 2231 and a second driving member 2232. The first driving member 2231 is provided on the machine 210 and is used to provide a force in the conveying direction, i.e., a conveying force in the left-right direction. The second driving member 2232 is provided on the first driving member 2231 and is used to provide a force in the up-down direction. The second carrier 222 is provided on the second driving member 2232. The first driving member 2231 can be a motor screw structure, or a transmission structure such as a sprocket or chain, without limitation.

[0062] Among them, the second driving member 2232 includes four elevators 2234, four transmission shafts 2233 and a motor 2235, wherein the four elevators 2234 are provided with a lifting part and two transmission parts, and the lifting part is connected to the second carrier 222; the four transmission shafts 2233 are respectively connected to the transmission parts of adjacent elevators 2234; the motor 2235 is used to drive the transmission shaft 2233 to rotate.

[0063] In a specific application, when the second carrier 222 needs to support or place the silicon pillar 10, the motor 2235 drives the transmission shaft 2233 to rotate, and the transmission shaft 2233 drives the lifting part to move up and down, thereby supporting or placing the silicon pillar 10. When the second carrier 222 needs to receive or transfer a material pillar, the first driving member 2231 drives the second driving member 2232 to move left and right, thereby driving the second carrier 222 to move left and right, thereby receiving or transferring the silicon pillar 10.

[0064] In some embodiments, see Figure 3 and Figure 6 The second carrier 222 is provided with a material receiving section 2224, and the material receiving section 2224 can be in an extended state relative to the first carrier 221; at the same time, the loading device 100 includes a third carrier 110 and a second driving module 120. The second driving module 120 is arranged on the machine 210, and is used to drive the third carrier 110 to slide along its length direction, that is, to slide in the left and right directions, so that it can overlap with the material receiving section 2224 in the extended state. The third carrier 110 is provided with a plurality of third placement slots 111 in sequence along its length direction.

[0065] In a specific application, when the conveying mechanism 220 needs to be supplied with silicon pillars 10, the first drive module 223 drives the second carrier 222 to slide to the left, and the receiving section 2224 is extended to the left relative to the first carrier 221. At the same time, the second drive module 120 drives the third carrier 110 to move to the right, and the third carrier 110 coincides with the receiving section 2224 of the second carrier 222. At this time, the silicon pillars 10 on the third carrier 110 are located directly above the receiving section 2224. Then, the first drive module 223 drives the second carrier 222 to move upward, and the second carrier 222 lifts the third carrier 110 and the silicon pillars 10 on the first carrier 221 upward. The first drive module 223 drives the second carrier 222 to move to the right, and the receiving section 2224 of the second carrier 222 coincides with the first carrier 221. The receiving section 2224 transports the silicon pillars 10 to the top of the first carrier 221. The first driving module 223 drives the second carrier 222 to move downward, and the receiving section 2224 places the carried silicon column 10 on the first carrier 221 , thereby transferring the silicon column 10 from the third carrier 110 to the first carrier 221 for subsequent transportation along the first carrier 221 .

[0066] Furthermore, the loading device 100 further includes a fourth carrier 130 and a third driving module 140. The third driving module 140 is used to drive the fourth carrier 130 to move up and down. The fourth carrier 130 is sequentially provided with a plurality of fourth placement slots 131 along its length direction.

[0067] Also see Figures 7 and 8The third carrier 110 includes a feeding section 112 and a discharging section 113, and the feeding section 112 and the discharging section 113 are arranged at equal distances. When the feeding section 112 extends relative to the fourth carrier 130, it receives the incoming silicon column 10, and the discharging section 113 is aligned with the fourth carrier 130 to be able to support the silicon column 10 on the fourth carrier 130; when the discharging section 113 extends relative to the fourth carrier 130, the discharging section 113 coincides with the receiving section 2224 to be able to transfer the silicon column 10 from the discharging section 113 to the receiving section 2224, and the feeding section 112 is aligned with the fourth carrier 130 to transfer the silicon column 10 to the fourth carrier 130.

[0068] For example, the feed section 112 and the discharge section 113 are configured to have the same length, which is half the length of the fourth carrier 130. It is understood that the length of the fourth carrier 130 is twice the length of the feed section 112, the middle section 2225, and the discharge section 113. The third carrier 110 and the fourth carrier 130 can cooperate to transport the silicon pillars 10.

[0069] Specifically, in the first stage, the third drive module 140 drives the fourth carrier 130 upward, and the fourth carrier 130 lifts the silicon pillar 10 on the third placement slot 111 of the third carrier 110 upward through the fourth placement slot 131. In the second stage, the second drive module 120 is used to drive the third carrier 110 to move leftward by the distance of the feed section 112. At this time, the feed section 112 of the third carrier 110 is extended to the left relative to the fourth carrier 130, and an external device can add silicon pillars 10 to the feed section 112. In the third stage, the third drive module 140 drives the fourth carrier 130 downward, and the fourth carrier 130 places the silicon pillar 10 in the third placement slot 111 of the third carrier 110 through the fourth placement slot 131. In the fourth stage, the second drive module 120 is used to drive the third carrier 110 to move rightward by the distance of the discharge section 113. At this time, the discharge section 113 is in an extended state to the right relative to the fourth carrier 130, that is, the silicon pillars 10 in the discharge section 113 can be transferred to the receiving section 2224. For details, please refer to the above description. At the same time, the feed section 112 is aligned with the fourth carrier 130, and the third drive module 140 drives the fourth carrier 130 to move upward, thereby supporting the silicon pillars 10 in the feed section 112 and the silicon pillars 10 at other positions on the third carrier 110. This cycle continues, and the third carrier 110 can continuously supply silicon pillars 10 to be heated to the heating device 200 through the fourth carrier 130.

[0070] In some embodiments, see Figure 3 and Figure 5The second carrier 222 includes an intermediate section 2225 and an outgoing section 2226. The intermediate section 2225 is connected between the receiving section 2224 and the outgoing section 2226. When the outgoing section 2226 extends relative to the first carrier 221, the receiving section 2224 is aligned with the first carrier 221. The length of the intermediate section 2225 is X1, and the lengths of the feeding section 112 and the outgoing section 113 are X2, where X1 = nX2, and n is greater than or equal to 1.

[0071] Specifically, during the feeding phase, the first driving module 223 drives the second carrier 222 to move a set distance to the left. At this time, the receiving section 2224 is in an extended state relative to the first carrier 221, and the loading device 100 can add silicon pillars 10 to the receiving section 2224. At the same time, the discharging section 113 is in a relatively aligned state with the first carrier 221, and the second carrier 222 simultaneously carries each silicon pillar 10 on the first carrier 221. During the discharging phase, the driving module drives the second carrier 222 to move a set distance to the right. At this time, the outgoing section 2226 is in an extended state relative to the first carrier 221, and an external device can grab the silicon pillar 10 from the outgoing section 2226. At the same time, the receiving section 2224 is in an aligned state with the first carrier 221, thereby placing the received silicon pillar 10 on the first carrier 221.

[0072] During the feeding phase, the middle section 2225 carries the silicon pillars 10 on the first carrier 221. During the discharging phase, the middle section 2225 shifts the silicon pillars 10 to the right by a set distance and replaces them in the first placement slot 2211 of the first carrier 221. Thus, during the feeding and discharging phases, the middle section 2225 continuously transfers the silicon pillars 10 on the first carrier 221 toward the cooling device 400.

[0073] In some embodiments, see Figure 1 The cooling device 400 includes a water tank and a transport mechanism. Specifically, the transport mechanism receives the silicon pillars 10 from the heating device 200 and places the silicon pillars 10 into the liquid cooling water in the water tank to cool the silicon pillars 10. The cooled silicon pillars 10 are then transferred to the stepping conveyor 500 for transport toward the crushing device 300. Then, a robot 600 grabs the cooled silicon pillars 10 from the stepping conveyor 500 and places them into the crushing device 300 to crush the silicon pillars.

[0074] The technical means disclosed in the solutions of the present invention are not limited to those disclosed in the above-mentioned embodiments, but also include technical solutions composed of any combination of the above-mentioned technical features. It should be noted that those skilled in the art may make various improvements and modifications without departing from the principles of the present invention, and such improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A polysilicon crushing device, characterized in that: include: A feeding device for continuously supplying silicon columns; The heating device includes a machine, a conveying mechanism, and a heating mechanism, wherein the conveying mechanism is provided on the machine and is used to receive the silicon pillars supplied by the loading device, the conveying mechanism is used to convey the silicon pillars and rotate the silicon pillars, and the heating mechanism is provided on the machine and is used to heat the silicon pillars conveyed by the conveying mechanism at a high temperature; A cooling device, used for cooling the heated silicon column; The crushing device is used to receive the silicon pillars transmitted by the cooling device and crush the silicon pillars.

2. The polysilicon crushing equipment according to claim 1, characterized in that: The conveying mechanism comprises: A first carrier is disposed on the machine, wherein the first carrier is provided with a plurality of first placement slots in sequence along its length; A second carrier is provided on the machine, wherein the first carrier and the second carrier are arranged side by side, and the second carrier is provided with a plurality of second placement slots in sequence along its length; A first driving module is provided on the machine platform, and is used to drive the second carrier to move along its length direction and up and down direction, so that the silicon column is switched between the first carrier and the second carrier to realize transportation; When the second carrier places the silicon column on the first carrier, the first placement groove and the second placement groove are partially staggered; and / or when the second carrier lifts the silicon column from the first carrier, the first placement groove and the second placement groove are partially staggered.

3. The polysilicon crushing equipment according to claim 2, characterized in that: The first placement groove is provided with a relatively expanded first guiding inclined surface; the second placement groove is provided with a relatively expanded second guiding inclined surface.

4. The polysilicon crushing equipment according to claim 3, characterized in that: A first support pad is provided on the sidewall of the first placement groove for allowing the silicon column to roll along the first support pad; a second support pad is provided on the sidewall of the second placement groove for allowing the silicon column to roll along the second support pad.

5. The polysilicon crushing equipment according to claim 2, characterized in that: The second carrier is provided with a material receiving section, and the material receiving section can be in an extended state relative to the first carrier; The loading device includes a third carrier and a second driving module. The second driving module is arranged on the machine and is used to drive the third carrier to slide along its length direction so that it can overlap with the material receiving section in the extended state. The third carrier is provided with multiple third placement slots in sequence along its length direction.

6. The polysilicon crushing equipment according to claim 5, characterized in that: The loading device further includes a fourth carrier and a third driving module, wherein the third driving module is used to drive the fourth carrier to move up and down, and the fourth carrier is sequentially provided with a plurality of fourth placement slots along its length direction; Among them, the third carrier includes a feeding section and a discharging section, and the feeding section and the discharging section are arranged at an equal distance. When the feeding section extends relative to the fourth carrier, it receives the incoming silicon column, and the discharging section is aligned with the fourth carrier to support the silicon column on the fourth carrier; when the discharging section extends relative to the fourth carrier, the discharging section coincides with the receiving section to be able to transfer the silicon column from the discharging section to the receiving section, and the feeding section is aligned with the fourth carrier to transfer the silicon column to the fourth carrier.

7. The polysilicon crushing equipment according to claim 5, characterized in that: The second carrier is provided with a middle section and a transmission section, wherein the middle section is connected between the receiving section and the transmission section. When the transmission section is extended relative to the first carrier, the receiving section is aligned with the first carrier to place the silicon column on the first carrier.

8. The polysilicon crushing equipment according to claim 7, characterized in that: The length of the middle section is X1, and the lengths of the feeding section and the discharging section are X2, X1=nX2, and n is greater than or equal to 1.

9. The polysilicon crushing equipment according to claim 2, characterized in that: The first driving module includes: A first driving member, provided on the machine platform, for providing a force in a conveying direction; The second driving member is disposed on the first driving member and is used for providing an acting force in an up-down direction. The second carrier is disposed on the second driving member.

10. The polysilicon crushing equipment according to claim 9, characterized in that: The second driving member includes: Four elevators, each having a lifting portion and two transmission portions, wherein the lifting portion is connected to the second carrier; Four transmission shafts, respectively connected to the transmission parts of adjacent elevators; The motor is used to drive the transmission shaft to rotate.

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