Seed wafer gluing assembly, gluing equipment and gluing method

Abstract

The invention relates to the technical field of crystal growth, and discloses a seed wafer gluing assembly, gluing equipment and a gluing method.The seed wafer gluing assembly comprises a circular base used for adsorbing a seed wafer; and the positioning device is detachably arranged on the outer periphery of the base and is used for enabling the circle center of the seed wafer to be positioned on the central axis of the circular base. The seed wafer gluing assembly can improve the gluing uniformity of seed wafers and promote the growth of high-quality crystals.

Description

Technical Field

[0001] The present application relates to the field of crystal growth technology, and in particular to a seed wafer gluing assembly, equipment, and gluing method. Background Art

[0002] At present, physical vapor transport (PVT) has become the mainstream method technology for growing silicon carbide crystals. The characteristic of this technology is that the surface of the silicon carbide seed wafer is coated with adhesive, so that it is bonded to the crucible cover and installed on the upper part of the graphite crucible. Through heating, the gas generated by the thermal decomposition of the powder at the bottom of the crucible reaches the silicon carbide seed wafer with a lower temperature driven by the temperature gradient, thereby growing a single crystal on the silicon carbide seed wafer. Among them, coating the surface of the silicon carbide seed wafer with adhesive is the first step in crystal growth, and the uniformity of the adhesive coating has a very important influence on the growth quality of the silicon carbide single crystal.

[0003] In the prior art, the adhesive coating method for seed wafers is mainly to apply adhesive to the seed wafer manually with a scraper, or to place the adhesive at the center of the seed wafer and use a glue spinner to spread the adhesive on the seed wafer. Manual scraping makes it difficult to ensure uniform coating, and glue spinners require relatively high energy consumption and can cause uneven coating, thus affecting the normal growth of silicon carbide single crystals. Therefore, designing a new seed wafer glue coating assembly is crucial to improving the uniformity of seed wafer glue coating and promoting high-quality crystal growth.

[0004] Application Contents

[0005] The present application aims to solve, at least to a certain extent, one of the technical problems in the related art. To this end, one purpose of the present application is to provide a seed wafer gluing assembly, a gluing device, and a gluing method, wherein the seed wafer surface adhesive obtained by using the seed wafer gluing assembly, the gluing device, and the gluing method of the present application is uniform, and the crystals grown are of high quality.

[0006] In a first aspect of the present application, a seed wafer glue coating assembly is provided, comprising:

[0007] Round base for adsorbing seed crystals;

[0008] A positioning device is detachably arranged on the outer periphery of the circular base, and is used to make the center of the seed chip be located on the central axis of the circular base.

[0009] When using the seed chip gluing assembly to gluing the seed chip, the center of the seed chip can be placed on the central axis of the circular base by relying on a positioning device, that is, the seed chip is placed in the center of the circular base. During the rotating gluing process, the adhesive can accurately diffuse evenly from the center of the seed chip to the edge, so that the thickness of the adhesive on the seed chip is consistent, thereby improving the uniformity of the gluing and growing high-quality crystals.

[0010] In addition, the preparation method according to the above embodiment of the present application may also have the following additional technical features:

[0011] In some embodiments, the side of the positioning device closest to the center of the circular base is defined as the inner side; the seed chip is disposed on the inner side of the positioning device, and the outer edge of the seed chip abuts the inner edge of the positioning device. The distance between the inner edge of the positioning device in contact with the seed chip and the center of the circular base is equal to the radius of the seed chip. In this way, the positioning device can form an integrated structure that fits the circular base and the seed chip, helping to accurately locate the position of the seed chip so that it is centered above the circular base.

[0012] In some embodiments, the seed wafer gluing assembly includes two positioning devices, which are symmetrically arranged about the center of the circular base. Positioning and constraining the seed wafer from both sides simultaneously facilitates further centering the seed wafer on the circular base.

[0013] In some embodiments, the positioning device satisfies at least one of the following conditions:

[0014] The positioning device is arc-shaped, and the center of the arc is located on the central axis of the circular base;

[0015] The surface of the positioning device facing the circular base has at least one step structure, and the thickness of the outer side of the positioning device is greater than the thickness of the inner side, and the direction of the thickness is the direction of the central axis of the circular base;

[0016] The width of the positioning device is 5 mm to 10 mm, and the width direction is the radius direction of the circular base.

[0017] This helps to make the above-mentioned seed chip gluing assembly suitable for gluing seed chips of different sizes, and at the same time can ensure the adaptability between the positioning device and the seed chip and the circular base, thereby ensuring accurate positioning of the seed chip.

[0018] In some embodiments, the surface of the circular base that contacts the seed wafer has a raised portion and a recessed portion, thereby increasing the friction between the seed wafer and the circular base and reducing the energy consumption required for adsorbing the seed wafer.

[0019] In some embodiments, the raised portion on the circular base surface includes at least one arc-shaped raised portion concentric with the circular base; and / or the recessed portion includes at least one arc-shaped recessed portion concentric with the circular base. During the spin coating process, the arc-shaped notches concentric with the circular base align the direction of friction with the direction of rotation, thereby contributing to stable and uniform friction between the circular base and the seed wafer.

[0020] In some embodiments, the raised portion includes a plurality of annular raised portions that are concentric with the circular base and spaced apart along the radial direction of the circular base; and / or

[0021] The recessed portion includes a plurality of annular recessed portions that are concentric with the circular base and spaced apart along the radius of the circular base, thereby further increasing the friction between the seed chip and the circular base, reducing the energy consumption required to attract the seed chip, and ensuring that the generated friction is stable and uniform.

[0022] In a second aspect of the present application, a seed wafer vacuum gluing device is provided, comprising the above-mentioned seed wafer gluing assembly. Thus, the vacuum gluing device has all the features and advantages of the above-mentioned seed wafer gluing assembly, which will not be described in detail here.

[0023] In a third aspect of the present application, a seed wafer gluing method is proposed, comprising:

[0024] Apply film to one side of the seed chip, adsorb the film-applied side onto the circular base, and make the center of the seed chip and the center of the circular base on the same straight line;

[0025] The adhesive is placed at the center of the seed wafer, and the circular base rotates to drive the seed wafer to rotate, using centrifugal force to apply the adhesive to the surface of the seed wafer. This seed wafer adhesive coating method helps reduce damage to the seed wafer caused by the circular base during the adhesive coating process and helps improve the uniformity of adhesive coating.

[0026] In some embodiments, the center of the seed chip and the center of the circular base are aligned in a straight line by the following steps: a positioning device is placed on the outer periphery of the circular base, and the outer edge of the seed chip is brought into contact with the inner edge of the positioning device; wherein the side of the positioning device closer to the center of the circular base is the inner side; and the distance between the inner edge of the positioning device in contact with the seed chip and the center of the circular base is equal to the radius of the seed chip. This facilitates accurate positioning of the seed chip.

[0027] In some embodiments, the circular base rotates at a first speed and a second speed in sequence, wherein the first speed is less than the second speed. This effectively avoids uneven distribution of the adhesive on the surface of the seed wafer and effectively improves adhesive coating uniformity.

[0028] In some embodiments, the first rotation speed is 800 rpm / min to 1000 rpm / min, and the second rotation speed is 1800 rpm / min to 2000 rpm / min, thereby further improving the uniformity of glue coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of a seed chip gluing assembly according to an embodiment of the present application.

[0030] Figure 2 This is a schematic diagram of a seed chip gluing assembly according to an embodiment of the present application.

[0031] Figure 3 This is a cross-sectional view of a positioning device according to an embodiment of the present application along the central axis of the circular base.

[0032] Figure 4 It is a structural schematic diagram of a circular base according to an embodiment of the present application.

[0033] Figure 5 This is a cross-sectional view of a positioning device according to an embodiment of the present application when performing positioning along the radius direction of the circular base.

[0034] Figure 6 It is a structural schematic diagram of a circular base according to an embodiment of the present application.

[0035] Figure 7 This is a view of a positioning device according to an embodiment of the present application when performing positioning along the radius direction of the circular base.

[0036] Figure 8 This is a schematic diagram of a seed chip gluing assembly according to an embodiment of the present application.

[0037] Figure 9 This is a back view of the crystal after growth according to an embodiment of the present application.

[0038] Figure 10 This is a back view of the crystal after growth in a comparative example of the present application.

[0039] Reference numerals: 1, circular base 2, positioning device 3, seed chip 4, base body 5, rotating suction cup A, thickness of outer side of positioning device B, thickness of inner side of positioning device C, step structure C1, step structure C2, step structure D, width of positioning device E, raised portion F, recessed portion DETAILED DESCRIPTION

[0040] The embodiments of the present application are described in detail below. The embodiments described below are exemplary and intended to be used to explain the present application, but should not be understood as limiting the present application.

[0041] This application is based on the following findings and knowledge of the applicant:

[0042] In the related art, the coating of seed wafers is mostly completed with the help of a glue-spinning machine. However, during the process of the glue-spinning machine rotating and spinning, on the one hand, since the surface of the seed wafer and the surface of the glue-spinning machine suction cup are both smooth surfaces, the energy consumption required to vacuum adsorb the seed wafer on the surface of the glue-spinning machine suction cup is relatively large; on the other hand, after the seed wafer is coated with glue by the glue-spinning machine, the glue on the surface of the seed wafer is not uniform, resulting in the subsequent crystal growth being affected. The inventor found that the reason for the uneven coating is that the seed wafer is not placed in the center of the suction cup during the rotation coating. A slight deviation in the position of the seed wafer will lead to uneven coating. It can be seen that the method of coating seed wafers with the help of a glue-spinning machine in the related art will affect the uniformity of the coating to a certain extent, resulting in uneven bubbles generated after the subsequent seed wafer bonding, sintering and curing. The uneven bubbles are in the process of crystal growth when the temperature is high, which will cause the crystal to reverse sublime, and seriously cause crystal ablation, thereby affecting the quality of the crystal.

[0043] Based on the above findings, the inventors of this application have developed a new seed chip gluing assembly, which can ensure that the center position of the seed chip is the center position of the centrifugal force, and then use the action of centrifugal force to throw away the adhesive on the seed chip, thereby avoiding the problem of uneven gluing caused by the deviation of the seed chip position.

[0044] In the first aspect of the present application, a seed wafer glue coating assembly is proposed, referring to Figure 1 The device comprises a circular base 1 for adsorbing the seed wafer; and a positioning device 2, detachably mounted on the outer periphery of the circular base and configured to position the center of the seed wafer on the central axis of the circular base. The positioning device ensures that the seed wafer is positioned at the center of the circular base during glue application, ensuring uniform force is applied to the seed wafer and improving the uniformity of glue application.

[0045] The central axis of the circular base is a straight line passing through the center of the circular base and perpendicular to the surface of the circular base.

[0046] In some embodiments, the side of the positioning device closer to the center of the circular base is defined as the inner side; the distance between the inner edge of the positioning device in contact with the seed chip and the center of the circular base is equal to the radius of the seed chip, the seed chip is arranged on the inner side of the positioning device, and the outer edge of the seed chip abuts against the inner edge of the positioning device. In this way, the positioning device can form an adaptive overall structure with the circular base and the seed chip, which helps to accurately locate the position of the seed chip so that it is placed in the center above the circular base (that is, the center of the seed chip is located on the central axis of the circular base).

[0047] Specifically, when using a positioning tool to position the seed chip, the size of the positioning tool is designed so that the distance between the inner edge of the positioning tool in contact with the seed chip and the center of the circular base is equal to the radius of the seed chip. In other words, when the positioning tool is placed on the outer periphery of the circular base and the inner edge abuts the outer edge of the seed chip, the center of the seed chip is exactly located on the central axis of the circular base, thus achieving the centering of the seed chip. At the same time, different sizes of positioning tools can be used to position seed chips of different sizes. Therefore, the glue coating component can achieve precise positioning of seed chips of different sizes.

[0048] In some embodiments, the seed wafer gluing assembly includes two positioning devices, which are symmetrically arranged about the center of the circular base. When gluing the seed wafer, the seed wafer is first placed on the circular base, and then the positioning devices are used to simultaneously apply positioning constraints to the seed wafer from both sides. The symmetrical arrangement of the positioning devices on both sides of the circular base can make the constraint force on the seed wafer more uniform, avoid the problem of seed wafer tilting or offsetting due to uneven force, and help to further center the seed wafer on the circular base.

[0049] In some embodiments, the positioning device is arc-shaped, and the center of the arc is located on the central axis of the circular base. Figure 2 The positioning device 2 can fit tightly against the edge of the seed crystal 3, achieving multi-point contact between different components, which helps to further improve the accuracy of positioning. At the same time, the shape and structure of the positioning device also match the outer periphery of the circular base. The positioning device can be precisely adapted to be set on the outer periphery of the circular base, and the two can be tightly abutted together.

[0050] In some embodiments, the surface of the positioning tool facing the circular base has at least one step structure, and the thickness of the outer side of the positioning tool is greater than the thickness of the inner side, and the direction of the thickness is the direction of the central axis of the circular base. Figure 3 When the positioning tool positions the seed chip, the seed chip and the edge of the circular base form an undulating step structure. Therefore, in order to meet the adaptability between the positioning tool, the circular base and the seed chip, a step structure needs to be designed on the surface of the positioning tool facing the circular base.

[0051] In some embodiments, reference Figure 4 The edge of the circular base 1 in contact with the seed wafer is a smooth plane. The circular base 1 directly absorbs the seed wafer. When the positioning device positions the seed wafer, the cross-sectional view of the seed wafer glue coating component along the radial direction of the circular base is shown in FIG. Figure 5 The surface of the positioning device 2 facing the circular base 1 has a step structure C.

[0052] In some embodiments, the edge of the circular base can also be provided with a plurality of undulating step structures according to the process and functional requirements. Specifically, it can be a step structure (the structural diagram can be referred to Figure 6 ), two step structures, three step structures, etc., and the corresponding positioning device has two step structures, three step structures, four step structures, etc. facing the circular base surface. As a result, the step structure on the edge of the circular base can be precisely matched with the step structure of the positioning device facing the circular base surface, which helps to further improve the positioning effect of the positioning device.

[0053] In some embodiments, the circular base can be configured as an assembled structure, referring to Figure 6 The circular base includes a base body 4 and a rotating suction cup 5. The rotating suction cup and the base body are fixed by at least one screw, and the seed chip is adsorbed on the surface of the rotating suction cup. When positioning the seed chip, the cross-sectional view of the seed chip glue coating assembly along the radial direction of the circular base is shown in FIG. Figure 7 The positioning device has two step structures facing the circular base surface, namely C1 and C2.

[0054] In some embodiments, the circular base is connected to a vacuum device, and the air inside the circular base is extracted by the vacuum device, so that the seed wafer is adsorbed and fixed on the circular base.

[0055] In some embodiments, the circular base has at least one suction hole on its surface close to the seed chip, and the suction hole is connected to the suction channel inside the circular base, thereby allowing the seed chip to be adsorbed on the circular base.

[0056] In some embodiments, reference Figure 8 The width D of the positioning device is 5mm to 10mm, and the width direction is the radius direction of the circular base. Specifically, it can be 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, etc., which helps to improve the adaptability of the seed chip glue coating assembly and expand the application range of the seed chip.

[0057] In some embodiments, the width of the positioning device can be adjusted according to the size of the circular base, thereby further improving the adaptability of the seed chip glue coating assembly.

[0058] In some embodiments, the diameter of the circular base can be 160mm to 220mm, specifically, 160mm, 165mm, 170mm, 175mm, 180mm, 185mm, 190mm, 195mm, 200mm, 205mm, 210mm, 215mm, 220mm, etc., thus, it can be suitable for seed chips of different sizes.

[0059] In some embodiments, the diameter of the seed chip can be 140mm to 240mm, specifically, 140mm, 150mm, 160mm, 170mm, 180mm, 190mm, 200mm, 210mm, 220mm, etc., which helps to improve the utilization rate of the seed chip coating assembly.

[0060] In some embodiments, the surface of the circular base that contacts the seed wafer has a protrusion and a depression, thereby increasing the friction between the seed wafer and the surface of the circular base, thereby reducing the energy consumption required for adsorbing the seed wafer.

[0061] Specifically, the raised portion on the surface of the circular base includes at least one arc-shaped raised portion concentric with the circular base; and / or the recessed portion includes at least one arc-shaped recessed portion concentric with the circular base. Figure 8 The surface of the circular base can be a plurality of circular raised portions E and recessed portions F. During the rotary glue coating process, the circular notches concentric with the circular base make the direction of the friction force adapt to the direction of rotation, which helps to generate a stable and uniform friction force between the circular base and the seed chip, thereby improving the uniformity of the glue coating.

[0062] Further, refer to Figure 8 The annular raised portion E and recessed portion F on the surface of the circular base can be arranged at intervals.

[0063] In a second aspect of the present application, a seed wafer vacuum gluing device is proposed, comprising: the seed wafer gluing assembly and a vacuum pump device as described above.

[0064] The vacuum gluing equipment has at least the following beneficial effects:

[0065] 1. The vacuum gluing equipment is equipped with a positioning device to realize the centering of the seed wafer, thus avoiding the uneven gluing caused by the position deviation of the seed wafer.

[0066] 2. Multiple rings are arranged on the circular surface to increase the friction between the seed wafer and the rotating suction cup and reduce the energy consumption of the vacuum pump.

[0067] 3. The vacuum glue coating equipment can be applied to seed wafers of different sizes, which improves the utilization rate of the equipment and reduces the equipment cost to a certain extent.

[0068] In a third aspect of the present application, a seed wafer gluing method is proposed, comprising:

[0069] S10: applying a film to one side of the seed wafer, and adsorbing the film-applied side onto the circular base, with the film-applied side facing the circular base, and making the center of the seed wafer and the center of the circular base on the same straight line;

[0070] In this step, a PE film is applied to one side of the seed wafer, and the film-applied side is adsorbed onto the circular base. During the adhesive application process, the seed wafer and the circular base rotate simultaneously due to centrifugal force, thereby preventing damage to the seed wafer during rotation.

[0071] S20: placing adhesive glue at the center of the seed chip, rotating the circular base to drive the seed chip to rotate, and using centrifugal force to apply the adhesive glue on the surface of the seed chip.

[0072] In some embodiments, the center of the seed chip and the center of the circular base are aligned in a straight line by the following steps: a positioning device is placed on the outer periphery of the circular base, and the outer edge of the seed chip is brought into contact with the inner edge of the positioning device; wherein the side of the positioning device closer to the center of the circular base is the inner side; and the distance between the inner edge of the positioning device in contact with the seed chip and the center of the circular base is equal to the radius of the seed chip. This facilitates accurate positioning of the seed chip.

[0073] When using the above-mentioned seed chip gluing method, first place the seed chip on the circular base, then select a positioning device of appropriate size to fix it on both sides of the seed chip, and make the step structure of the positioning device correspond to the step structure on the circular base to ensure that the center of the seed chip is located on the central axis of the circular base. At the same time, turn on the vacuum adsorption, adsorb the seed chip on the surface of the circular base, apply the adhesive drop to the center position of the seed chip, and rotate the circular base to make the adhesive evenly coated on the surface of the seed chip.

[0074] Specifically, the circular base rotates at a first speed and a second speed in sequence, and the first speed is less than the second speed. This helps to improve the uniformity of glue coating and does not cause the adhesive to be thin in the middle of the circular base and thick at the edges.

[0075] In some embodiments, the first rotation speed is 800rpm / min to 1000rpm / min, specifically 800rpm / min, 850rpm / min, 900rpm / min, 950rpm / min, 1000rpm / min, etc., and the second rotation speed is 1800rpm / min to 2000rpm / min, specifically 1800rpm / min, 1850rpm / min, 1900rpm / min, 1950rpm / min, 2000rpm / min, etc. When rotating at low speed, the circular base drives the seed wafer to rotate, the centrifugal force is relatively small, and the adhesive slowly diffuses from the center of the seed wafer to the edge. At the same time, the low-speed rotation can also prevent the adhesive from splashing out of the surface of the seed wafer, ensuring the effective use of the adhesive. After the adhesive is initially spread, it switches to high-speed rotation, the centrifugal force increases, and the adhesive moves further to the edge and is evenly distributed. The centrifugal force generated by the high-speed rotation can further adjust the thickness of the adhesive layer, allowing the adhesive in the thicker area to flow to the thinner area, further improving the uniformity of the adhesive coating.

[0076] It can be understood that the seed chip gluing method of the present application can be implemented through the seed chip gluing component and seed chip vacuum gluing equipment described above. The specific operations involved in each step involved in the seed chip gluing method can be consistent with the description in the seed chip gluing component in the previous text, and will not be repeated here one by one.

[0077] The present application is described below with reference to specific examples. It should be noted that these examples are merely illustrative and do not limit the present application in any way. Where specific techniques or conditions are not specified in the examples, the techniques or conditions described in the literature in the art or in the product instructions shall be followed.

[0078] Example 1

[0079] The seed wafer vacuum coating equipment of the present application is used to coat, bond and grow 4H-silicon carbide seed wafers, as follows:

[0080] 1. Use the seed wafer vacuum coating equipment of the present application to apply adhesive to the Si surface of the seed wafer 157 (thickness 0.5 mm), first rotating it at a speed of 900 rpm / min for 5 seconds, and then rotating it at a speed of 2000 rpm / min for 13 seconds; use the same method to apply adhesive to one side of the graphite paper;

[0081] 2. Lay the glue-coated side of the seed wafer on the glue-coated side of the graphite paper, place them in a hot pressing sintering furnace, heat up to 220°C at a rate of 3°C / min and keep the temperature constant for 60 minutes for sintering;

[0082] 3. Manually scrape epoxy resin glue on the uncoated side of the graphite paper and the surface of the crucible cover, and then fit the manually scraped side of the graphite paper to the glued surface of the crucible cover. Then put it into a hot pressing sintering furnace, heat it to 500℃ at a rate of 10℃ / min and keep it at a constant temperature for 60min for sintering.

[0083] 4. Grow the bonded seed crystals using the physical vapor transport method for 160 hours. After growth, take a photo of the back of the crystals with a camera for recording. Figure 9 .

[0084] Comparative Example 1

[0085] 1. Manually apply adhesive to the Si surface of the seed wafer 157 (thickness 0.5 mm), and use the same method to apply adhesive to one side of the graphite paper;

[0086] 2. Lay the glue-coated side of the seed wafer on the glue-coated side of the graphite paper, place them in a hot pressing sintering furnace, heat up to 220°C at a rate of 3°C / min and keep the temperature constant for 60 minutes for sintering;

[0087] 3. Manually scrape epoxy resin glue on the uncoated side of the graphite paper and the surface of the crucible cover, and then fit the manually scraped side of the graphite paper to the glued surface of the crucible cover. Then put it into a hot pressing sintering furnace, heat it to 500℃ at a rate of 10℃ / min and keep it at a constant temperature for 60min for sintering.

[0088] 4. Grow the bonded seed crystals using the physical vapor transport method for 160 hours. After growth, take a photo of the back of the crystals with a camera for recording. Figure 10 .

[0089] The test results show that compared with Comparative Example 1, the back of the crystal obtained in Example 1 is smooth and has no obvious back corrosion area, while the back of the crystal obtained in Comparative Example 1 has obvious back corrosion area, and the position of the back corrosion area is consistent with the uneven manual bonding lines. Therefore, the use of the seed chip vacuum gluing equipment of the present application for gluing is more conducive to the uniform distribution of the adhesive on the seed chip, thereby improving the quality of the crystal.

[0090] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0091] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A seed wafer gluing assembly, characterized in that: include: Round base for adsorbing seed crystals; A positioning device is detachably arranged on the outer periphery of the circular base, and is used to make the center of the seed chip be located on the central axis of the circular base.

2. The seed wafer glue coating assembly according to claim 1, characterized in that: The side of the positioning device closer to the center of the circular base is defined as the inner side; The seed chip is arranged on the inner side of the positioning device, and the outer edge of the seed chip abuts against the inner edge of the positioning device. The distance between the inner edge of the positioning device in contact with the seed chip and the center of the circular base is equal to the radius of the seed chip.

3. The seed wafer glue coating assembly according to claim 1, characterized in that: It comprises two positioning devices, which are symmetrically arranged about the center of the circular base.

4. The seed wafer glue coating assembly according to claim 1, characterized in that: The positioning device meets at least one of the following conditions: The positioning device is arc-shaped, and the center of the arc is located on the central axis of the circular base; The surface of the positioning device facing the circular base has at least one step structure, and the thickness of the outer side of the positioning device is greater than the thickness of the inner side, and the direction of the thickness is the direction of the central axis of the circular base; The width of the positioning device is 5 mm to 10 mm, and the direction of the width is the radius direction of the circular base.

5. The seed wafer glue coating assembly according to claim 1, characterized in that: The surface of the circular base that contacts the seed wafer has a convex portion and a concave portion.

6. The seed wafer glue coating assembly according to claim 5, characterized in that: The protrusion includes at least one arc-shaped protrusion concentric with the circular base; and / or The recessed portion includes at least one arc-shaped recessed portion concentric with the circular base.

7. The seed wafer glue coating assembly according to claim 6, characterized in that: The raised portion includes a plurality of annular raised portions that are concentric with the circular base and spaced apart along the radial direction of the circular base; and / or The recessed portion includes a plurality of annular recessed portions that are concentric with the circular base and spaced apart along a radial direction of the circular base.

8. A seed wafer vacuum glue coating device, characterized in that: The invention comprises the seed wafer glue coating assembly according to any one of claims 1 to 7.

9. A method for coating a seed wafer, characterized in that: include: Apply film to one side of the seed chip, adsorb the film-applied side onto the circular base, and make the center of the seed chip and the center of the circular base on the same straight line; The adhesive is placed at the center of the seed wafer, and the circular base is rotated to drive the seed wafer to rotate, and the adhesive is coated on the surface of the seed wafer by centrifugal force.

10. The seed wafer gluing method according to claim 9, characterized in that: The center of the seed wafer and the center of the circular base are aligned on the same straight line by the following steps: Place the positioning device on the outer periphery of the circular base, and make the outer edge of the seed chip abut against the inner edge of the positioning device; The side of the positioning device closer to the center of the circular base is the inner side; the distance between the inner edge of the positioning device in contact with the seed chip and the center of the circular base is equal to the radius of the seed chip.

11. The method for coating a seed wafer according to claim 9, wherein: The circular base rotates at a first rotation speed and a second rotation speed in sequence, wherein the first rotation speed is less than the second rotation speed.

12. The method for coating a seed wafer according to claim 11, wherein: The first rotation speed is 800 rpm / min to 1000 rpm / min; The second rotation speed is 1800 rpm / min to 2000 rpm / min.

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