A stainless steel embossed plate embossing process

Abstract

The present application relates to the technical field of plate surface treatment, more specifically, it relates to a stainless steel pattern plate embossing process, comprising the following steps: S1, material preparation; S2, mold design and manufacturing; S3, embossing equipment preparation; S4, embossing; S5, post-processing; S6, machine vision detection; S7, packaging and transportation; in the machine vision detection of S6, if the matching degree still cannot reach the threshold value after adjusting the pressure or temperature, the machine vision detection enters the abnormal judgment step, the abnormal judgment step comprises the following steps: S61, extracting mold pre-check record judgment; S62, spatial distribution analysis judgment; S63, time sequence trend monitoring judgment; the stainless steel pattern plate embossing process of the present application can judge the reason why the pattern matching degree cannot reach the threshold value only by logical algorithm and multi-link cross verification.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of plate surface treatment, and in particular to a stainless steel pattern plate embossing process. BACKGROUND

[0002] Currently, considering the improvement of slip resistance, aesthetics, and the increase of heat dissipation, some stainless steel pattern plates will be embossed by embossing equipment to form stainless steel pattern plates. The embossing process of the stainless steel pattern plate usually includes the following steps: designing a pattern according to customer requirements, manufacturing an embossing die and installing it on the embossing equipment, cleaning the surface of the stainless steel plate, starting the embossing equipment to emboss the pattern on the stainless steel plate under the action of pressure and heating, and detecting the appearance of the pattern of the stainless steel pattern plate. The detection step is an important quality control step in the processing technology, and has an important influence on the quality of the final processing.

[0003] When detecting the appearance of the pattern of the stainless steel pattern plate during the embossing process, in order to avoid the problems of low efficiency and easy errors caused by manual detection, the existing means may introduce machine vision detection for real-time detection. For example, the camera collects the pattern image of the current stainless steel pattern plate and compares it with the reference pattern template, calculates the matching degree of the actual pattern and the reference template, and if it is lower than the threshold (such as 90%), an alarm is triggered and the pressure or temperature is adjusted.

[0004] In the above-mentioned means, if the matching degree still cannot reach the threshold after adjusting the pressure or temperature, it may be that the embossing die is damaged, which requires maintenance of the die or replacement of a new die, or it may be that the current batch of stainless steel plates has defects, causing uneven hardness of the plate surface, thereby affecting the formation of the pattern. Therefore, it is usually necessary to increase a variety of sensors and complex models based on a variety of sensors to analyze the reasons why the pattern matching degree cannot reach the threshold, resulting in a high cost of the original embossing equipment, and ultimately leading to a high cost of stainless steel pattern plate embossing processing. SUMMARY

[0005] In order to determine the reason why the pattern matching degree cannot reach the threshold without increasing a variety of sensors and complex models, the present application provides a stainless steel pattern plate embossing process.

[0006] The stainless steel pattern plate embossing process provided by the present application adopts the following technical solution:

[0007] A stainless steel pattern plate embossing process, comprising the following steps: S1, material preparation; S2, mold design and manufacturing; S3, embossing equipment preparation; S4, embossing; S5, post-processing; S6, machine vision detection; S7, packaging and transportation; In the machine vision detection of S6, if the matching degree still cannot reach the threshold value after adjusting the pressure or temperature, the machine vision detection enters the abnormal judgment step, which includes the following steps: S61, extracting mold pre-check record judgment; S62, spatial distribution analysis judgment; S63, time sequence trend monitoring judgment.

[0008] Preferably, in S6, the abnormal judgment step of machine vision detection also includes: S64, increasing pressure or temperature for improvement judgment.

[0009] Preferably, the S61 extraction mold pre-check record judgment includes the following steps: before starting up or changing the mold every day, the camera shoots the blank mold surface image, and compares it with the initial reference template to form a pre-check record, if the pre-check record is abnormal, it is directly determined as a mold problem; if the pre-check record is normal, it enters the next abnormal judgment step.

[0010] Preferably, the S62 spatial distribution analysis judgment includes the following steps: the plate is divided into grid areas, the pattern matching degree of each small area is calculated respectively, if the low matching degree area appears repeatedly in a fixed position, such as always in the same position in the center area or the edge, it is determined as a mold problem, there may be local wear; if the low matching degree area is randomly distributed, it enters the next abnormal judgment step.

[0011] Preferably, the S63 time sequence trend monitoring judgment includes the following steps: record the pattern matching degree data of 10-20 times of continuous embossing, generate a trend curve, if the matching degree continues to decrease, it indicates that the mold has a continuous wear condition, then it is determined as a mold problem; if the matching degree jumps irregularly, it is determined as a plate problem.

[0012] Preferably, the S64 increasing pressure or temperature for improvement judgment includes the following steps: if the matching degree is significantly improved after increasing the pressure or temperature, it indicates that the plate indeed has the problem of uneven thickness or abnormal hardness; if the matching degree is not significantly improved after increasing the pressure or temperature, it indicates that the surface plate has other problems or the mold still has other problems, at this time, manual intervention is needed to form a man-machine coordination mechanism.

[0013] Preferably, the increased pressure or temperature in the link of the abnormal judgment step is greater than the increased pressure or temperature in the normal processing link.

[0014] Preferably, in S64, a standard thickness value is set, if the thickness of the plate exceeds the standard thickness value, the improvement judgment is made by increasing the pressure, if the thickness of the plate exceeds the standard thickness value, the improvement judgment is made by increasing the temperature.

[0015] Preferably, a thickness detection member is arranged on the embossing machine, and the thickness detection step is arranged before the embossing step.

[0016] Preferably, in the machine vision detection of S6, the camera is connected to the embossing machine through a lifting assembly, and the height of the camera changes in direct proportion to the change of the thickness of the plate.

[0017] The beneficial effects of the present application are:

[0018] 1. Through the above-mentioned three-step abnormality judgment steps in the machine vision detection of the present application, it can be determined whether the problem of the matching degree always being lower than the threshold value is caused by the mold or the plate, and further, whether the mold problem is caused by static defects or dynamic defects, and further, whether the dynamic defect problem is caused by temporary wear or continuous wear. Ultimately, without the need to add high-end sensors or complex models, the reason why the pattern matching degree cannot reach the threshold value can be determined through logical algorithms and multi-link cross verification, avoiding high cost of embossing equipment, thereby avoiding high cost of stainless steel pattern plate embossing processing;

[0019] 2. The improvement judgment step of increasing the pressure or the temperature can further verify whether the plate has thickness unevenness or hardness abnormality;

[0020] 3. The height of the camera changes in direct proportion to the change of the thickness of the plate, ensuring that the area size of the plate of different thicknesses captured by the camera is closer, thereby improving the consistency of the detection effect. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is the flow chart of the embossing processing technology of the stainless steel pattern plate in the embodiment of the present application;

[0022] Figure 2 is the flow chart of the abnormality judgment step of the machine vision detection in the embodiment of the present application. DETAILED DESCRIPTION

[0023] The present application will be further described below in combination with Figures 1-2 and examples.

[0024] The present embodiment discloses an embossing processing technology of a stainless steel pattern plate.

[0025] Referring to Figure 1 , the embossing processing technology of the stainless steel pattern plate comprises the following steps:

[0026] S1, Material Preparation:

[0027] Selecting Stainless Steel Plate: Choose appropriate material and thickness of stainless steel plate according to requirements;

[0028] Surface Treatment: Ensure surface cleanliness, no oil stains or oxidation layer.

[0029] S2, Mold Design and Manufacturing:

[0030] Designing Patterns: Design pattern according to customer requirements;

[0031] Manufacturing Molds: Use engraving or CNC machining to make molds, ensuring precision and durability.

[0032] S3, Embossing Equipment Preparation:

[0033] Selecting Embossing Machine: Select appropriate embossing machine according to plate thickness and pattern complexity;

[0034] Installing Molds: Correctly install molds on the embossing machine.

[0035] S4, Embossing:

[0036] Preheating: Preheat the stainless steel plate to reduce stress;

[0037] Positioning: Place the plate on the embossing machine workbench, ensuring accurate positioning.

[0038] S5, Post-processing:

[0039] Cooling: Let the plate cool naturally after embossing;

[0040] Trimming: Remove burrs and excess parts, ensuring smooth edges;

[0041] Surface Treatment: Perform polishing, wire drawing, etc., to improve appearance and corrosion resistance.

[0042] S6, Machine Vision Inspection:

[0043] Hardware Composition: Use CCD camera installed on the outlet side of the embossing machine, equipped with ring LED light source. CCD camera is linked with the embossing machine PLC controller through industrial computer, used to adjust embossing machine pressure parameters and temperature parameters;

[0044] Software Function: Collect the current stainless steel pattern plate pattern image and compare with the reference pattern template, calculate the matching degree of actual pattern and reference template, if below threshold (such as 90%), trigger alarm and suggest to increase pressure or temperature.

[0045] S7, Packaging and Transportation:

[0046] Packaging: Packaged with scratch-resistant materials to prevent damage during transportation.

[0047] Transportation: Ensure that collisions and extrusions are avoided during transportation.

[0048] In the machine vision detection of S6, if the matching degree still cannot reach the threshold after adjusting the pressure or temperature, it is possible that the embossing die is damaged, which requires maintenance or replacement of the die, or it is possible that the current batch of stainless steel plates has defects, causing uneven hardness of the plate surface, thereby affecting the pattern formation. To realize abnormality judgment, the following improvements are made.

[0049] In the machine vision detection of S6, if the matching degree still cannot reach the threshold after adjusting the pressure or temperature, the machine vision detection enters the abnormality judgment step, including:

[0050] S61, extract die pre-detection record judgment:

[0051] Before daily startup or die replacement, use the camera to capture the image of the blank die surface and compare it with the initial reference template to form a pre-detection record. If the pre-detection record is abnormal, it is directly determined as a die problem. If the pre-detection record is normal, the next abnormality judgment step is entered to determine whether the die has appeared abnormality in the running process.

[0052] It should be noted that the pre-detection of the die has limitations, because the die pre-detection is completed in a static environment, but in the actual embossing process, the die is in a dynamic working environment (high temperature, high pressure, continuous friction). Therefore, the die may cause temporary deformation or wear due to continuous production after pre-detection, or oil stains and debris may be attached to the die surface during production, causing the pattern to be blurred during embossing.

[0053] S62, spatial distribution analysis judgment:

[0054] The plate is divided into grid areas, and the pattern matching degree of each small area is calculated. If the low matching degree area appears repeatedly in a fixed position, such as always in the same position in the center area or edge, it is determined as a die problem, which may have local wear. If the low matching degree area is randomly distributed, the next abnormality judgment step is entered for secondary verification to determine whether the die has sustained wear.

[0055] It should be noted that if the die has sustained rapid wear, it will cause differences in the pattern of each embossing, thereby presenting a "pseudo-random" defect in the plate. Therefore, even if the result in the spatial distribution analysis points to a plate problem, secondary verification is still needed.

[0056] S63, time series trend monitoring judgment:

[0057] Record the 10-20 times of pattern matching degree data of continuous embossing, generate a trend curve, if the matching degree continues to decrease, indicating that the mold has a continuous wear condition, then determine that the mold problem; if the matching degree jumps irregularly, then determine that the plate problem.

[0058] In summary, through the above three steps of abnormality judgment in machine vision detection, it can be determined whether the problem of matching degree always below the threshold is a mold problem or a plate problem, and for mold problems, it can further investigate whether the mold has static defects or dynamic defects, and for dynamic defect problems, it can further investigate whether it is temporary wear or continuous wear. Ultimately, without the need to add high-end sensors or complex models, only through logical algorithms and multi-link cross-validation, the reason why the pattern matching degree cannot reach the threshold can be determined, avoiding the high cost of embossing equipment, thereby avoiding the high cost required for stainless steel pattern plate embossing processing.

[0059] In the embossing process of stainless steel plates, plate problems are usually uneven thickness or abnormal hardness of the batch of plates, which cannot emboss patterns with high matching degree under normal pressure or temperature. In some embodiments, to further verify whether the plate has uneven thickness or abnormal hardness problems, the following steps are included in the abnormality judgment step of machine vision detection:

[0060] S64, increase pressure or temperature for improvement judgment:

[0061] The increased pressure or temperature in this abnormality judgment step should be greater than the increased pressure or temperature in the normal processing step to amplify the improvement effect. If the pattern matching degree of the plate is significantly improved (matching degree > 3% improvement) after increasing the pressure or temperature of the embossing machine, it indicates that the plate indeed has uneven thickness or abnormal hardness problems. If the matching degree is not significantly improved after increasing the pressure or temperature, it indicates that the plate has other problems or the mold has other problems. At this time, manual intervention is required to form a man-machine coordination mechanism. Through the above steps, the effect of further verifying whether the plate has uneven thickness or abnormal hardness problems is achieved.

[0062] In S64, a standard thickness value is set. If the thickness of the plate exceeds the standard thickness value, the improvement judgment is performed by increasing the pressure. If the thickness of the plate exceeds the standard thickness value, the improvement judgment is performed by increasing the temperature, to deal with the case where the thin plate is difficult to improve by increasing the pressure.

[0063] In order to realize the thickness detection of the plate, the thickness detection piece is arranged on the embossing machine, the thickness detection piece can be selected from a distance sensor, and the thickness detection step is arranged before the embossing step. Further, in the machine vision detection of S6, the camera is connected to the embossing machine through the lifting assembly, the height of the camera changes in direct proportion to the change of the thickness of the plate, that is, when the thickness of the plate increases, the height of the camera also increases, and when the thickness of the plate decreases, the height of the camera also decreases, so that the area size of the plate of different thicknesses photographed by the camera is closer, thereby improving the consistency of the detection effect.

[0064] The above are preferred embodiments of the present application, and are not intended to limit the protection scope of the present application, therefore: any equivalent changes made on the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A process for embossing stainless steel patterned sheets, comprising the following steps: S1, Material Preparation; S2, mold design and manufacturing; S3, embossing equipment preparation; S4, embossing; S5, post-processing; S6, machine vision inspection; S7, packaging and transportation; characterized in that, in the machine vision inspection of S6, if the pattern matching degree still cannot reach the threshold after adjusting the pressure or temperature, the machine vision inspection enters the anomaly judgment step, which includes the following steps: S61, extracting mold pre-inspection record judgment: before starting the machine or changing the mold each day, take a picture of the surface of the blank mold with a camera and compare it with the initial reference template to form a pre-inspection record; S62, spatial distribution analysis judgment: divide the board into gridded areas and calculate the pattern matching degree of each small area; S63, time-series trend monitoring judgment: record the pattern matching degree data of 10-20 consecutive embossings and generate a trend curve.

2. The embossing process for stainless steel patterned plates according to claim 1, characterized in that: In S6, the anomaly detection step of machine vision inspection also includes: S64, increasing pressure or temperature to make an improvement judgment.

3. The embossing process for stainless steel patterned plates according to claim 1, characterized in that: The S61 extraction of mold pre-inspection records includes the following steps: Before starting the machine or changing the mold each day, take a picture of the surface of the blank mold with a camera and compare it with the initial reference template to form a pre-inspection record. If the pre-inspection record is abnormal, it is directly determined to be a mold problem; if the pre-inspection record is normal, proceed to the next abnormal judgment step.

4. The embossing process for stainless steel patterned plates according to claim 3, characterized in that: The spatial distribution analysis and judgment of S62 includes the following steps: Divide the board into gridded areas, calculate the pattern matching degree of each small area, if the low matching degree area appears repeatedly in a fixed position, it is determined to be a mold problem; if the low matching degree area is randomly distributed, proceed to the next anomaly judgment step.

5. The embossing process for stainless steel patterned plates according to claim 4, characterized in that: The timing trend monitoring and judgment of S63 includes the following steps: record the pattern matching degree data of 10-20 consecutive embossings, generate a trend curve. If the matching degree continues to decline, it indicates that the mold is in continuous wear, and it is determined to be a mold problem; if the matching degree jumps irregularly, it is determined to be a board problem.

6. The embossing process for stainless steel patterned plates according to claim 2, characterized in that: The S64 method of improving the matching degree by increasing pressure or temperature includes the following steps: If the matching degree is significantly improved after increasing pressure or temperature, it indicates that the board does have problems with uneven thickness or abnormal hardness; if the matching degree is not significantly improved after increasing pressure or temperature, there are other problems with the surface board or the mold. At this time, manual intervention is required to make a judgment and form a human-machine coordination mechanism.

7. The embossing process for stainless steel patterned plates according to claim 6, characterized in that: The pressure or temperature increase in this abnormality judgment step must be greater than the pressure or temperature increase in the normal processing step.

8. The embossing process for stainless steel patterned plates according to claim 7, characterized in that: In S64, a standard thickness value is set. If the thickness of the board exceeds the standard thickness value, an improvement judgment is made by increasing the pressure. If the thickness of the board exceeds the standard thickness value, an improvement judgment is made by increasing the temperature.

9. The embossing process for stainless steel patterned plates according to claim 8, characterized in that: The embossing machine is equipped with a thickness detection device, and the thickness detection step is set before the embossing step.

10. The embossing process for stainless steel patterned plates according to claim 9, characterized in that: In the machine vision inspection of S6, the camera is connected to the embossing machine via a lifting assembly, and the height of the camera changes proportionally with the thickness of the board.

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