Semiconductor device packaging machine

Abstract

The invention discloses a semiconductor device packaging machine which comprises a machine body. A feeding device, a first clamping device, a rotating device, a first clamping device, a position correcting mechanism, a first detecting device, a shielding device, a second detecting device, a marking device, a second clamping device, a discharging device, a drying agent conveying device and a packaging device are installed on the machine body. Dispersed functions or manual operation procedures can be processed through one packaging machine, and the effect of fast and stable packaging of the semiconductor device is achieved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor device packaging technology, and in particular relates to a semiconductor device packaging machine. Background Art

[0002] In the field of semiconductor device production and packaging, the receiving and packaging of semiconductor devices is particularly important, typically requiring processing steps such as packaging, testing, laser marking, appearance inspection, and sorting. Traditionally, semiconductor devices are transferred sequentially to different equipment using a transfer device to achieve different processing effects on the semiconductor devices. This delays processing time because multiple processes require multiple pieces of equipment to complete, and the lack of interoperability between multiple processes increases the processing time of semiconductor devices. Therefore, there is an urgent need for a semiconductor device packaging machine that can quickly and stably package semiconductor devices into bags. Summary of the Invention

[0003] In view of this, the main purpose of this application is to provide a semiconductor device packaging machine.

[0004] The technical solution adopted in this application is as follows: A semiconductor device packaging machine, comprising: a machine body; a loading device mounted on the machine body; a first clamping device mounted on the machine body and located at the output end of the loading device; a rotating device mounted on the machine body, the rotating device having a plurality of placement stations for placing semiconductor devices, the first clamping device clamping the semiconductor devices on the loading device and placing them on the placement stations; A position correction mechanism, mounted on the body in the rotation direction of the rotating device, for detecting and correcting the placement position of the semiconductor device; a plurality of first detection devices, mounted on the machine body and located behind the position correction mechanism, the detection devices being used to perform circuit detection on the semiconductor devices on the placement station; a shielding device, wherein the shielding device is located between adjacent first detection devices; a plurality of second inspection devices, mounted on the machine body and located behind the first inspection device, the second inspection devices being used to perform appearance inspection on the semiconductor device; a marking device for marking semiconductor devices that have passed the inspection; a second clamping device; The second clamping device clamps the marked semiconductor device and places it on the blanking device; Desiccant delivery device; The packaging device is used to package the semiconductor devices and desiccant that have passed the inspection in the unloading device.

[0005] Furthermore, the loading device includes a loading tray and a loading channel, and the loading channel is connected to the loading tray; the first clamping device is located at the end of the loading channel, clamping the semiconductor device on the loading channel and placing it on the placement station.

[0006] Furthermore, the rotating device includes a rotating disk, and a plurality of coaxial placement stations are installed on the circumference of the rotating disk.

[0007] Furthermore, the position correction mechanism includes a position detector for detecting the semiconductor device on the placement station, and a position correction component is provided on one side of the position detector. The position correction component includes a pushing cylinder, and the driving connection of the pushing cylinder is connected to a pushing rod, and the end of the pushing rod has an angle corresponding to the edge corner of the semiconductor device.

[0008] Furthermore, the first detection device includes an upper mounting frame and a lower mounting frame, wherein coils are respectively mounted on the upper mounting frame and the lower mounting frame to form a detection space, and the placement station is located in the detection space; The first detection device also includes a circuit detection component, which includes a downward pressure cylinder, a connecting arm and a clamping claw detector. The downward pressure cylinder is installed on one side of two mounting frames, and the output end of the downward pressure cylinder is connected to the connecting arm. The clamping claw detector is installed at the end of the connecting arm; the downward pressure cylinder drives the connecting arm to move downward to drive the clamping claw detector to contact the root of the semiconductor device.

[0009] Furthermore, the shielding device located between adjacent first detection devices includes a clamping cylinder, on which two shielding plates are installed. When the first detection device detects the semiconductor device placed on the workstation, the relative movement of the clamping cylinder drives the two shielding plates to close, thereby performing electromagnetic shielding on the adjacent detection stations.

[0010] Furthermore, the shielding plate is made of Permalloy.

[0011] Furthermore, the second detection device includes a side CCD and a front CCD, the side CCD detects the foot of the semiconductor device, and the front CCD detects the appearance of the semiconductor device.

[0012] Furthermore, the unloading device includes a servo motor, a material pipe connected to the servo motor, a material distribution pipe, a good material box, a non-good material box, and a unloading channel; the rotating end of the servo motor is connected to the material pipe, the material distribution pipe is arranged in a fan shape in front of the material pipe, the good material box and the non-good material box are connected to the material distribution pipe, and the unloading channel is located below the good material box; The lower end of the good material box is connected to an opening and closing leaf, and a rotating mechanism for opening the opening and closing leaf is provided on one side of the good material box; the rotating mechanism includes a telescopic cylinder and an articulated arm, one end of the articulated arm is hinged to the telescopic cylinder, and the other end of the articulated arm is hinged to the opening and closing leaf.

[0013] Furthermore, the packaging device includes a bag placing mechanism, a bag moving mechanism, a clamping mechanism and a bag sealing mechanism installed in the machine body; the bag placing mechanism is provided with a first suction nozzle for adsorbing the bag; the bag moving mechanism includes a moving track and a moving arm slidably installed on the moving track, and the moving arm is provided with a second suction nozzle for adsorbing and moving the bag out of the first suction nozzle to the unloading device; the clamping mechanism is arranged on both sides of the discharge end of the unloading device, and the clamping mechanism clamps the bag on the moving arm; after the unloading and bagging is completed, the moving arm adsorbs the bag through the second suction nozzle and moves it to the bag sealing mechanism for sealing.

[0014] Compared with the prior art, the present application has the beneficial effect of enabling relatively dispersed functions or manual operations to be processed by a single packaging machine, thereby achieving rapid and stable packaging of semiconductor devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The following drawings are merely provided for illustrative purposes and explanation of the present application and are not intended to limit the scope of the present application. Figure 1 A three-dimensional schematic diagram of this application; Figure 2 This is the front view of this application; Figure 3 for Figure 2 A top view of Figure 4 This is a three-dimensional schematic diagram of an embodiment of the present application; Figure 5 for Figure 4 A magnified view of part A in FIG; Figure 6 This is a three-dimensional schematic diagram of an embodiment of the present application; Figure 7 for Figure 4 A magnified view of part B in FIG; Figure 8 This is a three-dimensional schematic diagram of the first detection device in this application; Figure 9 A three-dimensional schematic diagram of the position correction mechanism in this application; Figure 10 It is a three-dimensional schematic diagram of the packaging device in this application.

[0016] Reference numerals: a. semiconductor device; b. bag body; 1. machine body; 2. loading device; 3. first clamping device; 4. rotating device; 5. position correction mechanism; 6. first detection device; 7. shielding device; 8. marking device; 9. second clamping device; 10. unloading device; 11. desiccant conveying device; 12. packaging device; 13. side CCD; 14. front CCD; 21. loading tray; 22. loading channel; 41. rotating tray; 42. placement station; 51. position detector; 52. pushing cylinder; 53. pushing rod; 61. upper mounting frame; 62. lower mounting frame; 63. coil; 64. Detection space; 65. Circuit detection component; 66. Down-pressure cylinder; 67. Connecting arm; 68. Gripper detector; 71. Gripper cylinder; 72. Shielding plate; 100. Servo motor; 101. Material pipe; 102. Material distribution pipe; 103. Good material box; 104. Non-good material box; 105. Material discharge channel; 106. Opening and closing leaf; 107. Telescopic cylinder; 108. Articulated arm; 120. Bag placement mechanism; 121. Bag moving mechanism; 122. Gripper mechanism; 123. Bag sealing mechanism; 124. First suction nozzle; 125. Moving track; 126. Moving arm; 127. Second suction nozzle. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solutions, design methods and advantages of this application more clear, the following is a further detailed description of this application through specific embodiments in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain this application and are not used to limit this application.

[0018] The present application is a semiconductor device packaging machine, including a body 1; a loading device 2, a first clamping device 3, a rotating device 4, a position correction mechanism 5, multiple first detection devices 6, a shielding device 7, a marking device 8, a second clamping device 9, a unloading device 10, a desiccant conveying device 11, a packaging device 12, and a display screen and a CNC screen.

[0019] Specific reference Figures 1-9As shown, the loading device 2 is installed on the machine body 1; the first clamping device 3 is installed on the machine body 1 and is located at the output end of the loading device 2; the rotating device 4 is installed on the machine body 1, and the rotating device 4 has a plurality of placement stations 42 for placing semiconductor devices a, and the first clamping device 3 clamps the semiconductor devices a on the loading device 2 and places them on the placement stations 42; the position correction mechanism 5 is installed on the machine body 1 in the rotation direction of the rotating device 4, and is used to detect and correct the placement position of the semiconductor devices a; a plurality of first detection devices 6 is installed on the body 1 and is located behind the position correction mechanism 5, and the detection device 6 is used to perform circuit detection on the semiconductor device a on the placement station 42; the shielding device 7 is located between adjacent first detection devices 6; multiple second detection devices are installed on the body 1 and are located behind the first detection device 6, and the second detection devices are used to perform appearance detection on the semiconductor device; the marking device 8 marks the semiconductor device that has passed the inspection; the second clamping device 9 clamps the marked semiconductor device and places it on the unloading device 10; the packaging device 12 is used to package the semiconductor devices that have passed the inspection in the unloading device 10 and the desiccant conveyed by the desiccant conveying device 11 together; the detection and packaging functions or processes can be realized through a packaging machine to achieve a rapid and stable packaging effect for semiconductor devices.

[0020] As an embodiment of this application, refer to Figure 1-Figure 5 As shown, the loading device 2 includes a loading tray 21 and a loading channel 22, and the loading channel 22 is connected to the loading tray 21; the first clamping device 3 is located at the end of the loading channel 22, and the first clamping device 3 clamps the semiconductor device on the loading channel 22 and places it on the placement station 42.

[0021] As an embodiment of this application, refer to Figures 1-8 As shown, the rotating device 4 includes a rotating disk 41, and a plurality of coaxial placement stations 42 are installed on the circumferential side of the rotating disk 41. Each placement station 42 is provided with two limit plates, and the outer side surfaces of the two limit plates are arranged perpendicularly to each other at 90°, so that the position correction mechanism can correct the semiconductor device a.

[0022] As an embodiment of this application, refer to Figure 1-Figure 3As shown, the position correction mechanism 5 includes a position detector 51 for detecting the semiconductor device on the placement station 42. A position correction component is provided on one side of the position detector 51. The position correction component includes a pushing cylinder 52. The driving connection of the pushing cylinder 52 is a pushing rod 53. The end of the pushing rod 53 has an angle corresponding to the corner of the semiconductor device, which is 90°. The position detector 51 is an optical fiber sensor, which can monitor the position of the semiconductor device a on the placement station 42. If the position of the semiconductor device a is offset, the position detector 51 will send a monitoring signal to the controller, and then the pushing cylinder 52 will drive the pushing rod 53 to push the semiconductor device a, so that the semiconductor device a can be in the correct position.

[0023] As an embodiment of this application, refer to Figures 1-9 As shown, the first detection device 6 includes an upper mounting frame 61 and a lower mounting frame 62, and a coil 63 is installed on the upper mounting frame 61 and the lower mounting frame 62 to form a detection space 64, and the placement station 42 is located in the detection space 64; the first detection device 6 also includes a circuit detection component 65, and the circuit detection component 65 includes a downward pressure cylinder 66, a connecting arm 67 and a clamping claw detector 68, the downward pressure cylinder 66 is installed on one side of the two mounting frames, the output end of the downward pressure cylinder 66 is connected to the connecting arm 67, and the clamping claw detector 68 is installed at the end of the connecting arm 67; the downward pressure cylinder 6 6 drives the connecting arm 67 to move downward, driving the clamping detector 68 to contact the root of the semiconductor device and energize it, and then the upper and lower coils 63 are also energized and detect, wherein the magnetic field strength of the upper and lower coils ranges from 100 to 200 gauss; the number of the first detection devices 6 is 6, so that 6 stations can perform detection simultaneously. After 6 semiconductor devices a are placed on the placement station on the turntable, it rotates so that the placement station 42 where the semiconductor devices a are placed is placed in the detection space 64 of the six first detection devices 6 at the same time, so as to realize the simultaneous detection of multiple semiconductor devices a and determine whether the product is good or bad.

[0024] As an embodiment of this application, refer to Figures 1-9As shown, it is characterized in that the shielding device 7 located between adjacent first detection devices 6 includes a clamping cylinder 71, and two shielding plates 72 are installed on the clamping cylinder 71. When the first detection device 6 detects the semiconductor device placed on the station 42, the relative movement of the clamping cylinder 71 drives the two shielding plates 72 to close, thereby electromagnetically shielding the adjacent detection stations; the shielding plates 72 are permalloy; during the six-station detection process, the clamping cylinders 71 between adjacent detection stations will move toward each other, and the two shielding plates connected to the clamping cylinders will tend to approach and close. By utilizing the special properties of the shielding plates 72 being permalloy, the magnetic field between adjacent detection stations can be shielded to avoid magnetic field interference between adjacent detection stations.

[0025] As an embodiment of this application, refer to Figure 1 、 Figure 2 As shown, the second detection device includes a side CCD13 and a front CCD14, the side CCD13 detects the root of the semiconductor device, and the front CCD14 detects the appearance of the semiconductor device; the side CCD13 mainly shoots the root of the semiconductor device a, and judges whether the root of the semiconductor device a has height inconsistency during the detection process according to the shooting results; the front CCD14 shoots from the top of the semiconductor device a, and judges whether the appearance of the semiconductor device a is damaged during the detection process according to the shooting results; according to the combined shooting results of the two situations, the product is judged as a good product or a bad product, so as to facilitate the subsequent classification by the unloading device 10.

[0026] As an embodiment of this application, refer to Figure 1-Figure 5 As shown, the unloading device 10 includes a servo motor 100, a material pipe 101 connected to the servo motor 100, a distribution pipe 102, a good material box 103, a non-good material box 104 and a unloading channel 105; the rotating end of the servo motor 100 is connected to the material pipe 101, and the distribution pipe 102 is fan-shaped in front of the material pipe 101, the good material box 103 and the non-good material box 104 are connected to the distribution pipe 102, and the unloading channel 105 is located below the good material box 103; the lower end of the good material box 103 is connected to an opening and closing leaf 106, and a rotating mechanism for opening the opening and closing leaf 106 is provided on one side of the good material box 103; the rotating mechanism includes a telescopic cylinder 107 and an articulated arm 108, one end of the articulated arm 108 is hinged to the telescopic cylinder 107, and the other end of the articulated arm 108 is hinged to the opening and closing leaf 106.

[0027] In the above embodiment, when unloading, the second clamping device 9 will place the good / non-good semiconductor device a on the placement station 42 into the material tube 101. According to whether the semiconductor device a is good or non-good, the servo motor 100 will drive the material tube 101 to rotate to the good or non-good distribution tube accordingly, and unload the material into the good box or the non-good box; among them, there are at least two good distribution tubes, and the rest are non-good distribution tubes. A unloading channel 105 is provided under the good distribution tube. When the good semiconductor device a enters the good material box 103 and is stored, after reaching a certain amount, the telescopic cylinder 107 will move downward to drive the articulated arm 108 to rotate, and the articulated arm 108 drives the opening and closing leaf 106 to open. The good semiconductor device a will be transported from the unloading channel 105 to the packaging device 12 for packaging. At the same time, the desiccant conveying device 11 will transport the desiccant to the unloading channel 105 together, and it will be bagged together with the good semiconductor devices.

[0028] refer to Figure 1 and Figure 10 As shown, as an embodiment of the present application, the packaging device 12 includes a bag placing mechanism 120, a bag moving mechanism 121, a clamping mechanism 122 and a bag sealing mechanism 123 installed in the machine body 1; the bag placing mechanism 120 is provided with a first suction nozzle 124 for adsorbing the bag b; the bag moving mechanism 121 includes a moving track 125 and a moving arm 126 slidably installed on the moving track 125, and the moving arm 126 is provided with a second suction nozzle 127 for adsorbing and moving the bag b out of the first suction nozzle 124 to the unloading device 10; the clamping mechanism 122 is arranged on both sides of the discharge end of the unloading device 10, and the clamping mechanism 122 clamps the bag b on the moving arm 126; after the unloading and bagging is completed, the moving arm 126 adsorbs the bag b through the second suction nozzle 127 and moves it to the bag sealing mechanism 123 for sealing the bag.

[0029] While various embodiments of the present application have been described above, the above descriptions are illustrative, non-exhaustive, and not intended to be limiting of the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or technological improvements in the marketplace, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A semiconductor device packaging machine, characterized in that: include, Body (1); A feeding device (2) is mounted on the machine body (1); A first clamping device (3) is installed on the machine body (1) and is located at the output end of the feeding device (2); A rotating device (4) is installed on the machine body (1), the rotating device (4) has a plurality of placement stations (42) for placing semiconductor devices (a), and the first clamping device (3) clamps the semiconductor device (a) on the loading device (2) and places it on the placement station (42); A position correction mechanism (5) is mounted on the body (1) in the rotation direction of the rotating device (4) and is used to detect and correct the placement position of the semiconductor device (a); a plurality of first detection devices (6) mounted on the machine body (1) and located behind the position correction mechanism (5), the detection devices (6) being used to perform circuit detection on the semiconductor device (a) on the placement station (42); a shielding device (7), the shielding device (7) being located between adjacent first detection devices (6); a plurality of second detection devices, mounted on the machine body (1) and located behind the first detection device (6), the second detection devices being used to perform appearance inspection on semiconductor devices; A marking device (8), wherein the marking device (8) marks the semiconductor devices that have passed the inspection; A second clamping device (9); A blanking device (10), wherein the second clamping device (9) clamps the marked semiconductor device and places it on the blanking device (10); Desiccant delivery device (11); The packaging device (12) is used to package the qualified semiconductor devices and desiccant detected in the unloading device (10).

2. A semiconductor device packaging machine according to claim 1, characterized in that: The loading device (2) comprises a loading tray (21) and a loading channel (22), wherein the loading channel (22) is connected to the loading tray (21); the first clamping device (3) is located at the end of the loading channel (22), and the first clamping device (3) clamps the semiconductor device on the loading channel (22) and places it on the placement station (42).

3. The semiconductor device packaging machine according to claim 1, characterized in that: The rotating device (4) comprises a rotating disk (41), and a plurality of coaxial placement stations (42) are installed on the circumference of the rotating disk (41).

4. The semiconductor device packaging machine according to claim 1, characterized in that: The position correction mechanism (5) includes a position detector (51) for detecting the semiconductor device on the placement station (42), a position correction component is provided on one side of the position detector (51), and the position correction component includes a push cylinder (52), the drive of the push cylinder (52) is connected to a push rod (53), and the end of the push rod (53) has an angle corresponding to the corner of the semiconductor device.

5. The semiconductor device packaging machine according to claim 1, characterized in that: The first detection device (6) comprises an upper mounting frame (61) and a lower mounting frame (62), wherein coils (63) are respectively mounted on the upper mounting frame (61) and the lower mounting frame (62) to form a detection space (64), and the placement station (42) is located in the detection space (64); The first detection device (6) further includes a circuit detection component (65), the circuit detection component (65) includes a downward pressure cylinder (66), a connecting arm (67) and a clamping claw detector (68), the downward pressure cylinder (66) is installed on one side of two mounting frames, the output end of the downward pressure cylinder (66) is connected to the connecting arm (67), and the clamping claw detector (68) is installed at the end of the connecting arm (67); the downward pressure cylinder (66) drives the connecting arm (67) to move downward, driving the clamping claw detector (68) to contact the root of the semiconductor device.

6. The semiconductor device packaging machine according to claim 5, characterized in that: The shielding device (7) located between adjacent first detection devices (6) includes a clamping cylinder (71), and two shielding plates (72) are installed on the clamping cylinder (71). When the first detection device (6) detects the semiconductor device on the placement station (42), the relative movement of the clamping cylinder (71) drives the two shielding plates (72) to close, thereby performing electromagnetic shielding on the adjacent detection station.

7. The semiconductor device packaging machine according to claim 6, characterized in that: The shielding plate (72) is made of Permalloy.

8. The semiconductor device packaging machine according to claim 1, characterized in that: The second detection device comprises a side CCD (13) and a front CCD (14), wherein the side CCD (13) detects the base of the semiconductor device, and the front CCD (14) detects the shape of the semiconductor device.

9. The semiconductor device packaging machine according to claim 1, characterized in that: The unloading device (10) comprises a servo motor (100), a material pipe (101) connected to the servo motor (100), a material distribution pipe (102), a good material box (103), a non-good material box (104), and a unloading channel (105); the rotating end of the servo motor (100) is connected to the material pipe (101), the material distribution pipe (102) is arranged in a fan shape in front of the material pipe (101), the good material box (103) and the non-good material box (104) are connected to the material distribution pipe (102), and the unloading channel (105) is located below the good material box (103); The lower end of the good material box (103) is connected to an opening and closing leaf (106), and a rotating mechanism for opening the opening and closing leaf (106) is provided on one side of the good material box (103); the rotating mechanism includes a telescopic cylinder (107) and an articulated arm (108), one end of the articulated arm (108) is hinged to the telescopic cylinder (107), and the other end of the articulated arm (108) is hinged to the opening and closing leaf (106).

10. The semiconductor device packaging machine according to claim 1, characterized in that: The packaging device (12) comprises a bag placing mechanism (120), a bag moving mechanism (121), a clamping mechanism (122) and a bag sealing mechanism (123) installed in the machine body (1); the bag placing mechanism (120) is provided with a first suction nozzle (124) for adsorbing the bag (b); the bag moving mechanism (121) comprises a moving track (125) and a moving arm (126) slidably installed on the moving track (125); the moving arm (126 ... 6) is provided with a second suction nozzle (127) for sucking and moving the bag body (b) discharged from the first suction nozzle (124) to the unloading device (10); the clamping mechanism (122) is provided on both sides of the discharge end of the unloading device (10), and the clamping mechanism (122) clamps the bag body (b) on the movable arm (126); after the unloading and bagging are completed, the movable arm (126) sucks the bag body (b) through the second suction nozzle (127) and moves it to the bag sealing mechanism (123) for sealing.

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