Electroplating copper ball monitoring device and supplementing early warning method

Abstract

The invention relates to an electroplating copper ball monitoring device and a supplementing early warning method, and the device comprises an electroplating titanium basket, the top of which is provided with an opening used for feeding a copper ball; the floating ball is movably arranged in the electroplating titanium basket, the floating ball comprises an upper shell and a lower shell which are detachable, the upper shell is made of a transparent material, the lower shell is provided with a deformation part capable of elastically deforming, and the upper shell and the lower shell jointly form a sealed cavity; the signal generation module is packaged in the sealing cavity, and a trigger switch of the signal generation module is correspondingly arranged on the inner side surface of the deformation part; when the deformation part of the lower shell generates preset deformation under the action of external pressure, the deformation part triggers the trigger switch to change an output signal of the signal generation module. According to the electroplating titanium basket, the movable floating ball is arranged in the electroplating titanium basket, and the allowance condition of the copper balls in the electroplating titanium basket can be accurately monitored in real time by utilizing the position change of the floating ball along with the change of the amount of the copper balls and the change of the pressure borne by the deformation part of the lower shell.

Description

Technical Field

[0001] The present invention relates to the field of circuit board electroplating, and in particular to a monitoring device for electroplated copper balls and a supplementary early warning method. Background Art

[0002] Electroplating titanium blue is used in the circuit board electroplating process. A number of copper balls are loaded into the titanium basket, which acts as an anode. Copper is deposited on the circuit board through the electroplating solution, increasing the copper thickness of the circuit board. As the reaction changes, the copper balls are consumed, gradually becoming smaller until they are completely dissolved in the electroplating solution and transferred and deposited on the circuit board. When the copper balls are consumed to a certain extent, if they are not replenished in time, the copper ion content in the electroplating solution will decrease, affecting the uniformity of copper plating and causing quality problems for the circuit board. Currently, the method for monitoring copper balls in the electroplated titanium basket is for the operator to patrol the line every day to check each titanium basket, observe the consumption of copper balls, and replenish them accordingly. However, in actual production, an electroplating line is often equipped with more than 30 groups of electroplating sub-tanks, and each group of sub-tanks has more than 50 electroplated titanium baskets. This results in a large workload for the operator to check every day and wastes manpower. Summary of the Invention

[0003] In view of this, the present invention provides an electroplating copper ball monitoring device and a replenishment warning method using an information-based early warning solution to achieve scientific and accurate reminders for replenishing electroplating copper balls.

[0004] The purpose of the present invention is achieved through the following technical solutions: In one aspect, a device for monitoring an electroplated copper ball is provided, comprising: an electroplated titanium basket with an opening formed in the top for dropping the copper balls; A float is movably disposed inside the electroplated titanium basket. The float comprises a detachable upper shell and a lower shell. The upper shell is made of a transparent material. The lower shell has an elastically deformable deformation portion. The upper shell and the lower shell together form a sealed cavity. A signal generating module is encapsulated in the sealed cavity, and a trigger switch thereof is correspondingly arranged on the inner surface of the deformable portion; When the deformation portion of the lower shell generates a preset deformation amount under the action of external pressure, the deformation portion triggers the trigger switch to change the output signal of the signal generating module.

[0005] In the above technical solution, by installing a movable float in the titanium electroplating basket, the remaining copper balls in the basket can be accurately monitored in real time by utilizing the position change of the float as the copper ball quantity changes, as well as the pressure change on the deformed portion of the lower shell. As the copper ball quantity decreases, the float moves downward, and the pressure on the deformed portion changes accordingly. Once the preset deformation value is reached, the signal generation module is triggered, providing timely feedback on the remaining copper balls. This provides scientific reminders of the remaining copper balls and allows for precise positioning and replenishment. This avoids problems such as electroplating process interruptions or unstable product quality caused by insufficient copper balls, thereby improving production efficiency and product quality stability.

[0006] Optionally, in a possible implementation, the signal generating module includes a circuit board, a pressure sensor integrated on the circuit board, a wireless transmission unit, and a signal alarm, and the pressure sensor is electrically connected to the wireless transmission unit and the signal alarm, respectively.

[0007] In this technical solution, the pressure sensor transmits the received pressure signal to the signal alarm via a wireless transmission unit. This allows direct and accurate capture of pressure changes caused by changes in the copper ball's residual volume within the deformed portion of the lower housing. The introduction of the wireless transmission unit enables wireless communication between the signal generation module and an external monitoring system or management terminal. The signal alarm immediately emits an audible and visual alarm signal when the pressure sensor detects that the pressure reaches a preset threshold.

[0008] Optionally, in a possible implementation, a conductive switch is provided on the inner surface of the deformation portion, the sensing end of the pressure sensor is configured as a trigger switch of the signal generating module, and the sensing end of the pressure sensor and the conductive switch constitute a contact switch structure.

[0009] In this technical solution, the sensing end of the pressure sensor serves as the trigger switch, forming a contact switch structure with the conductive switch on the inner surface of the deformable part. This makes the triggering action more precise and reliable. The pressure sensor can sense the pressure changes on the deformable part in real time and convert them into electrical signals, allowing the device to respond promptly to even the slightest change in the copper ball's remaining weight, avoiding production problems caused by undetected remaining weight changes.

[0010] Optionally, in a possible implementation, the signal alarm is an LED signal light, a buzzer, or a voice broadcasting device.

[0011] In the above technical solution, different signal alarms can be used according to different application scenarios. For example, in a quiet operating environment, a slight buzzer sound or a flashing LED signal light is enough to attract the operator's attention; in a noisy workshop, the voice broadcast equipment can clearly convey the alarm information to ensure that the operator will not miss it.

[0012] Optionally, in a possible implementation, both the outer circumference and the bottom of the titanium electroplating basket are provided with a mesh structure for allowing electrolyte to pass through.

[0013] In this technical solution, a mesh structure is provided on the outer periphery and bottom of the titanium electroplating basket, allowing the electrolyte to flow freely around and under the basket. During the electroplating process, the electrolyte flow promotes uniform distribution of copper ions, avoiding uneven current distribution caused by excessively high or low copper ion concentrations in localized areas of the basket.

[0014] Optionally, in a possible implementation, the lower shell is opposite to the bottom of the electroplated titanium basket, a handle is provided on the outer side of the upper shell, and the handle can be extended from the opening of the electroplated titanium basket.

[0015] In this technical solution, a handle is provided on the outside of the upper shell and extends from the opening of the electroplated titanium basket, providing a convenient foothold for the operator. When installing or removing the electroplated copper ball monitoring device, the operator simply grasps the handle to easily place the device in or remove it from the electroplated titanium basket, making operation simple and convenient.

[0016] Optionally, in a possible implementation, the handle is made of a flexible insulating material, an anti-drop hook is provided at the end of the handle, and a snap ring that cooperates with the hook is provided at the opening edge of the electroplated titanium basket.

[0017] In the above technical solution, strong electric fields and leakage risks may exist around the titanium plating basket in electroplating production environments. The handle is made of a flexible insulating material, effectively isolating the current and preventing electric shock accidents when the operator holds the handle to install, remove, or move the monitoring device. The anti-detachment hook at the end of the handle cooperates with the retaining ring on the edge of the opening of the titanium plating basket to form a reliable fixing mechanism, improving the stability of the float.

[0018] On the other hand, a copper ball replenishment early warning method is provided, comprising the following steps: S1, assembling the electroplating unit, fixing the electroplating titanium basket vertically in the electroplating tank, and filling the electroplating titanium basket with copper balls until the stacking height of the copper balls reaches a preset threshold; S2, positioning and calibrating the float: placing the float in the electroplated titanium basket, adjusting the float so that its bottom surface contacts the top surface of the copper ball stack, and compressing and deforming the deformed portion of the lower shell under the support force of the copper balls; S3, status monitoring and early warning, when the copper ball consumption has not reached the replenishment threshold, the top surface of the copper ball stack is always in contact with the float, the deformation part maintains the deformation state, and the signal generating module is in the inactive state; when the copper ball consumption reaches the replenishment threshold, the top surface of the copper ball stack is not in contact with the float, the deformation part is not deformed, and the signal generating module is in the active state, indicating that copper balls need to be replenished.

[0019] In the above technical solution, copper balls serve as the anode material during the electroplating process, and the stability of their supply directly affects the composition of the electroplating solution and the progress of the electroplating reaction. The use of an electroplating copper ball monitoring device to implement a copper ball replenishment warning method can promptly issue an early warning when copper ball consumption reaches the replenishment threshold, reminding the operator to replenish copper balls in a timely manner. This ensures a continuous and stable supply of copper ions during the electroplating process, thereby maintaining the chemical balance of the electroplating solution and the stability of the electroplating reaction, ensuring the quality and performance consistency of the electroplated product, and reducing electroplating defects caused by insufficient copper balls, such as uneven coating thickness and rough surface.

[0020] Optionally, in one possible implementation, when there are sufficient copper balls, part of the float is immersed in the electroplating solution. At this time, the buoyancy of the float is less than its own gravity. As the copper balls are consumed, the volume of the float immersed in the electroplating solution will increase until the buoyancy is equal to its own gravity.

[0021] In this technical solution, the float is partially immersed in the plating solution when the number of copper balls is sufficient, and its buoyancy is less than that of gravity. As the copper balls are consumed, the volume of the float increases. This process can sensitively reflect subtle changes in the height of the copper ball stack. Because the volume of the float immersed in the liquid is closely related to the height of the copper ball stack, any decrease in the number of copper balls will cause the float to move downward in the liquid and increase the volume of the float immersed, making this method more accurate in monitoring copper ball consumption.

[0022] Optionally, in a possible implementation, the electroplating cylinder is connected to a liquid level maintaining device to keep the electroplating liquid level line in the electroplating cylinder unchanged.

[0023] In this technical solution, a stable electroplating liquid level ensures consistent contact area and depth between all parts of the workpiece and the plating solution during the electroplating process. During electroplating, a stable liquid level ensures even current distribution across the workpiece surface, preventing areas of excessive or insufficient current density due to liquid level fluctuations. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 Schematic diagram of the structure of a monitoring device for electroplated copper balls according to an embodiment.

[0026] Figure 2 Schematic diagram of the structure of the copper ball changing state in the electroplating copper ball monitoring device according to one embodiment.

[0027] Reference numerals: 1 - electroplating titanium basket; 2 - float; 21 - upper shell; 22 - lower shell; 3 - copper ball; 4 - handle; 5 - electroplating liquid level line. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0030] Please refer to Figure 1 and Figure 2 The present embodiment provides a monitoring device for electroplating copper balls 3, comprising: an electroplating titanium basket 1, a float 2, and a signal generating module; an opening for dropping the copper balls 3 is formed at the top of the electroplating titanium basket 1; the float 2 is movably arranged inside the electroplating titanium basket 1, and the float 2 includes a detachable upper shell 21 and a lower shell 22, the upper shell 21 is made of a transparent material, such as organic glass or polycarbonate, and the lower shell 22 has an elastically deformable deformation portion, which can be made of elastic rubber, and the upper shell 21 and the lower shell 22 together form a sealed cavity; the signal generating module is encapsulated in the sealed cavity, and its trigger switch is correspondingly arranged on the inner surface of the deformation portion; wherein, when the deformation portion of the lower shell 22 is subjected to external pressure to generate a preset deformation amount, the deformation portion triggers the trigger switch to change the output signal of the signal generating module.

[0031] This embodiment, by disposing a movable float 2 within the titanium electroplating basket 1, utilizes the position change of the float 2 as the amount of copper balls 3 changes, as well as the pressure change on the deformed portion of the lower shell 22, to accurately and in real time monitor the remaining copper balls 3 within the titanium electroplating basket 1. As the amount of copper balls 3 decreases, the float 2 moves downward, and the pressure on the deformed portion changes accordingly. Once the preset deformation amount is reached, the signal generation module is triggered, providing timely feedback on the remaining copper balls 3. This provides scientific reminders of the remaining copper balls 3 and allows for precise positioning and replenishment. This avoids problems such as electroplating process interruptions or unstable product quality caused by insufficient copper balls 3, thereby improving production efficiency and product quality stability.

[0032] Furthermore, the float 2 features a removable upper shell 21 and lower shell 22, which can be quickly connected using a snap-on design. The joint is sealed with a rubber seal. This not only facilitates installation, maintenance, and replacement of the internal signal generator module, reducing maintenance costs and complexity, but also creates a simple and clear overall structure, minimizing potential malfunctions associated with complex structures. Furthermore, the upper shell 21 is made of a transparent material, allowing operators to visually observe the internal conditions of the float 2 and the operating status of the signal generator module, further enhancing the reliability and maintainability of the device.

[0033] In this embodiment, the signal generating module includes a circuit board, a pressure sensor integrated on the circuit board, a wireless transmission unit, and a signal alarm. The pressure sensor is electrically connected to the wireless transmission unit and the signal alarm, respectively. Specifically, the signal generating module needs to be connected to an external power source for power. When the shape of the deformable portion of the lower housing 22 changes, the signal received by the pressure sensor also changes synchronously, thereby transmitting the corresponding signal to the signal alarm via the wireless transmission unit.

[0034] The pressure sensor transmits the received pressure signal to the signal alarm via a wireless transmission unit. This directly and accurately captures the pressure changes caused by the change in the margin of copper ball 3 within the deformed portion of the lower housing 22. The introduction of the wireless transmission unit enables wireless communication between the signal generation module and an external monitoring system or management terminal. The signal alarm immediately emits an audible and visual alarm signal when the pressure sensor detects that the pressure reaches a preset threshold.

[0035] Specifically, a conductive switch is provided on the inner surface of the deformation part, the sensing end of the pressure sensor is configured as a trigger switch of the signal generating module, and the sensing end of the pressure sensor and the conductive switch constitute a contact switch structure. Among them, the conductive switch can be an elastic paddle-type switch, on which a conductive contact is provided that matches the sensing end of the pressure sensor. The trigger logic of the signal generating module can be set as follows: when the deformation part is squeezed and deformed, the conduction between the trigger switch and the sensing end of the pressure sensor is disconnected, and the signal alarm is not triggered at this time, indicating that the number of copper balls 3 is sufficient. When the deformation part is squeezed and restored to its original state, the conduction between the trigger switch and the sensing end of the pressure sensor is re-established, and the signal alarm is triggered at this time, indicating that the number of copper balls 3 is insufficient.

[0036] In this embodiment, the sensing end of the pressure sensor serves as a trigger switch, forming a contact switch structure with the conductive switch on the inner surface of the deformable part. This ensures more accurate and reliable triggering. The pressure sensor can sense changes in pressure on the deformable part in real time and convert them into electrical signals, allowing the device to respond promptly to even the slightest change in the balance of copper ball 3, avoiding production problems caused by unnoticed balance changes.

[0037] It should be noted that the signal alarm can be an LED signal light, a buzzer, or a voice broadcast device. Preferably, an LED signal light is used, and the color is set to red, so that it is easier to attract the operator's attention. In addition, different signal alarms can be used according to different application scenarios. For example, in a quiet operating environment, a slight buzzer sound or a flashing LED signal light is sufficient to attract the operator's attention; while in a noisy workshop, a voice broadcast device can clearly convey the alarm information to ensure that the operator will not miss it.

[0038] In this embodiment, the outer periphery and bottom of the titanium electroplating basket 1 are provided with a mesh structure for electrolyte flow. The basket 1 has an overall cylindrical mesh structure. The mesh structure on the outer periphery and bottom of the basket allows the electrolyte to flow freely around and under the basket. During the electroplating process, the flow of electrolyte promotes uniform distribution of copper ions, avoiding uneven current distribution caused by excessively high or low copper ion concentrations in localized areas of the basket.

[0039] In this embodiment, the lower housing 22 is opposite to the bottom of the electroplated titanium basket 1. A handle 4 is provided on the outer side of the upper housing 21, and the handle 4 can extend from the opening of the electroplated titanium basket 1. The handle 4 is made of a flexible insulating material, and the end of the handle 4 is provided with an anti-drop hook. The opening edge of the electroplated titanium basket 1 is provided with a snap ring that cooperates with the hook.

[0040] A handle 4 is provided on the outside of the upper housing 21 and extends from the opening of the titanium electroplating basket 1, providing a convenient foothold for the operator. When installing or removing the monitoring device for the electroplated copper balls 3, the operator simply grasps the handle 4 to easily place the device in or remove it from the titanium electroplating basket 1, making operation simple and convenient.

[0041] Furthermore, in electroplating production environments, strong electric fields and the risk of electrical leakage may exist around the titanium basket 1. The handle 4, made of a flexible insulating material, effectively isolates the current, preventing electric shock accidents when the operator holds the handle 4 to install, remove, or move the monitoring device. The anti-detachment hook at the end of the handle 4 cooperates with the retaining ring on the edge of the opening of the titanium basket 1, forming a reliable fixing mechanism and improving the stability of the float 2.

[0042] This embodiment also provides an early warning method for adding copper balls 3 using the above-mentioned electroplated copper ball 3 monitoring device, comprising the following steps: S1, assemble the electroplating unit, fix the electroplating titanium basket 1 vertically in the electroplating tank, and fill the electroplating titanium basket 1 with copper balls 3 until the stacking height of the copper balls 3 reaches a preset threshold; S2. Position and calibrate the float 2. Place the float 2 in the titanium electroplating basket 1 and adjust its position so that its bottom surface contacts the top surface of the stack of copper balls 3. The deformed portion of the lower shell 22 is compressed and deformed by the support force of the copper balls 3. In the initial state, only part of the lower structure of the float 2 is immersed in the electroplating solution, while the majority of the float remains above the electroplating solution. Therefore, the initial buoyancy force on the float is relatively small, requiring the support of the copper balls 3 to maintain balance. S3, status monitoring and early warning, when the consumption of copper balls 3 has not reached the replenishment threshold, the top surface of the copper ball 3 stack is always in contact with the float 2, and the deformation part maintains the deformation state. At this time, the signal generating module is in the inactive state; when the consumption of copper balls 3 reaches the replenishment threshold, the top surface of the copper ball 3 stack is not in contact with the float 2, and the deformation part is not deformed. At this time, the signal generating module is in the active state, prompting that copper balls 3 need to be replenished.

[0043] Copper balls 3 serve as the anode material during the electroplating process, and their supply stability directly impacts the composition of the electroplating solution and the progress of the electroplating reaction. A monitoring device for electroplated copper balls 3 provides an early warning for replenishing copper balls 3. This method can issue an early warning when copper ball 3 consumption reaches a replenishment threshold, prompting the operator to replenish copper balls 3 promptly. This ensures a continuous and stable supply of copper ions during the electroplating process, thereby maintaining the chemical balance of the electroplating solution and the stability of the electroplating reaction. This ensures the quality and performance consistency of the electroplated product and reduces electroplating defects caused by insufficient copper balls 3, such as uneven coating thickness and surface roughness.

[0044] It can be understood that when the number of copper balls 3 in the electroplating titanium basket 1 is sufficient or normal, the buoyancy of the electroplating liquid on the float 2 is less than the gravity of the float 2 body, causing the lower shell 22 of the float 2 to contact with the copper balls 3 and receive the upward supporting force of the copper balls 3. The lower shell 22 of the float 2 feeds the force back to the inside of the float 2. At this time, the signal generator is not started and the signal light is not lit. When the copper balls 3 in the electroplating titanium basket 1 are gradually dissolved in the electroplating solution, the stacking height of the copper balls 3 gradually decreases until the copper balls 3 are separated from the float 2 and no longer in contact (the electroplating liquid level is continuously replenished and remains unchanged). At this time, the buoyancy of the electroplating solution on the float 2 is balanced by the gravity of the float body, and the small air below the float 2 is not subjected to the upward force of the copper balls 3. At this time, the pressure sensor inside the float 2 is activated and sends an early warning to the electroplating line operator through the wireless transmission unit that the copper balls 3 need to be replenished. At the same time, the signal alarm inside the float 2 is also triggered. At this time, the operator can use the triggered signal alarm to replenish the copper balls 3 to the electroplating titanium basket 1 where the float 2 is located, thereby achieving scientific reminders and precise positioning of replenishment.

[0045] It should be noted that when the number of copper balls 3 is sufficient, part of the float 2 is immersed in the electroplating solution. At this time, the buoyancy of the float 2 is less than its own gravity. As the copper balls 3 are consumed, the volume of the float 2 immersed in the electroplating solution will increase until the buoyancy is equal to its own gravity.

[0046] When the number of copper balls 3 is sufficient, the float 2 is partially immersed in the plating solution, and its buoyancy is less than the force of gravity. As the copper balls 3 are consumed, the volume of the float 2 increases. This process can very sensitively reflect subtle changes in the stacking height of the copper balls 3. Because the volume of the float 2 immersed in the liquid is closely related to the stacking height of the copper balls 3, any decrease in the number of copper balls 3 will cause the float 2 to move downward in the liquid and increase its immersed volume, making this method more accurate in monitoring the consumption of copper balls 3.

[0047] Furthermore, the electroplating tank is connected to a liquid-level maintenance device that maintains a constant plating liquid level line 5 within the tank. This stable plating liquid level line 5 ensures consistent contact area and depth between all parts of the workpiece and the plating solution during the electroplating process. During electroplating, this stable liquid level ensures even current distribution across the workpiece surface, preventing issues such as excessive or insufficient current density in certain areas due to liquid-level fluctuations.

[0048] In the description of the present invention, it should be understood that terms such as "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0050] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A monitoring device for electroplated copper balls, characterized in that: include: an electroplated titanium basket with an opening formed in the top for dropping the copper balls; A float is movably disposed inside the electroplated titanium basket. The float comprises a detachable upper shell and a lower shell. The upper shell is made of a transparent material. The lower shell has an elastically deformable deformation portion. The upper shell and the lower shell together form a sealed cavity. A signal generating module is encapsulated in the sealed cavity, and a trigger switch thereof is correspondingly arranged on the inner surface of the deformable portion; When the deformation portion of the lower shell generates a preset deformation amount under the action of external pressure, the deformation portion triggers the trigger switch to change the output signal of the signal generating module.

2. The electroplated copper ball monitoring device according to claim 1, characterized in that: The signal generating module includes a circuit board, a pressure sensor integrated on the circuit board, a wireless transmission unit and a signal alarm. The pressure sensor is electrically connected to the wireless transmission unit and the signal alarm respectively.

3. The electroplated copper ball monitoring device according to claim 2, characterized in that: A conductive switch is provided on the inner surface of the deformation portion, the sensing end of the pressure sensor is configured as a trigger switch of the signal generating module, and the sensing end of the pressure sensor and the conductive switch form a contact switch structure.

4. The electroplated copper ball monitoring device according to claim 2, characterized in that: The signal alarm is an LED signal light, a buzzer, or a voice broadcast device.

5. The electroplated copper ball monitoring device according to claim 1, characterized in that: The outer circumference and bottom of the titanium electroplating basket are both provided with a mesh structure for electrolyte to pass through.

6. The electroplated copper ball monitoring device according to claim 1, characterized in that: The lower shell is opposite to the bottom of the electroplating titanium basket. A handle is provided on the outer side of the upper shell, and the handle can be extended from the opening of the electroplating titanium basket.

7. The electroplated copper ball monitoring device according to claim 6, characterized in that: The handle is made of a flexible insulating material, an anti-drop hook is provided at the end of the handle, and a clamping ring that cooperates with the hook is provided at the opening edge of the electroplated titanium basket.

8. A copper ball replenishing warning method using the monitoring device according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1, assembling the electroplating unit, fixing the electroplating titanium basket vertically in the electroplating tank, and filling the electroplating titanium basket with copper balls until the stacking height of the copper balls reaches a preset threshold; S2, positioning and calibrating the float: placing the float in the electroplated titanium basket, adjusting the float so that its bottom surface contacts the top surface of the copper ball stack, and compressing and deforming the deformed portion of the lower shell under the support force of the copper balls; S3, status monitoring and early warning, when the copper ball consumption has not reached the replenishment threshold, the top surface of the copper ball stack is always in contact with the float, the deformation part maintains the deformation state, and the signal generating module is in the inactive state; when the copper ball consumption reaches the replenishment threshold, the top surface of the copper ball stack is not in contact with the float, the deformation part is not deformed, and the signal generating module is in the active state, indicating that copper balls need to be replenished.

9. The copper ball replenishment early warning method according to claim 8, characterized in that: When the number of copper balls is sufficient, part of the float is immersed in the electroplating solution. At this time, the buoyancy of the float is less than its own gravity. As the copper ball is consumed, the volume of the float immersed in the plating solution increases until the buoyancy force it receives is equal to its own weight.

10. The copper ball replenishment early warning method according to claim 8, characterized in that: The electroplating cylinder is connected to a liquid level maintaining device to keep the electroplating liquid level line in the electroplating cylinder unchanged.

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