A concrete MiC modular connection analysis system and deformation monitoring method

Abstract

The application discloses a concrete MiC modular connection analysis system and a deformation monitoring method, relates to the field of building engineering, and solves the problem of poor monitoring effect of the existing concrete MiC modular structure system, and comprises a data acquisition module, a data analysis module and a connection evaluation module. The data acquisition module is used for acquiring a target integrated building model, creating an integrated building space coordinate system, performing installation coordinate deviation analysis on each module connection area, obtaining preliminary monitoring data of a connection point, the data analysis module is used for setting a plurality of temperature test scenes, performing connection point deformation monitoring on the target integrated building model in each temperature test scene, and obtaining connection point deformation monitoring data according to the monitoring result, and the connection evaluation module is used for evaluating the connection stability of the concrete MiC corresponding to the target integrated building model according to the connection point deformation monitoring data. The application can improve the comprehensiveness and accuracy of concrete MiC connection point deformation monitoring.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of building engineering, and relates to MiC technology, and particularly relates to a concrete MiC modular connection analysis system and a deformation monitoring method. BACKGROUND

[0002] The existing concrete MiC modular structure system has the following defects when monitoring the quality of module connection:

[0003] 1. The existing concrete MiC modular structure system cannot perform three-dimensional modeling on the concrete MiC, and cannot create a spatial coordinate system to monitor the installation position deviation of each connection point, so that the connection point stability monitoring result lacks comprehensiveness.

[0004] 2. The existing concrete MiC cannot set a plurality of temperature test scenes for the three-dimensional modeling of the concrete MiC, and cannot perform connection point deformation monitoring on the target integrated building model in each temperature test scene, so it is difficult to monitor the deformation deviation of the concrete MiC under different temperature environments, resulting in a lack of accuracy of the connection point stability monitoring result.

[0005] Therefore, the application provides a concrete MiC modular connection analysis system and a deformation monitoring method. SUMMARY

[0006] In view of the deficiencies of the prior art, the application aims to provide a concrete MiC modular connection analysis system and a deformation monitoring method, which aims to improve the comprehensiveness and accuracy of the concrete MiC connection point deformation monitoring.

[0007] In order to achieve the above-mentioned purpose, the application adopts the following technical scheme: a concrete MiC modular connection analysis system, and the specific working process of each module is as follows:

[0008] The data acquisition module is used to acquire the target integrated building model, acquire each module connection area in the target integrated building model, create an integrated building spatial coordinate system to analyze the installation coordinate deviation of each module connection area, and acquire the connection point preliminary monitoring data according to the analysis result.

[0009] The data analysis module is used to set a plurality of temperature test scenes for the target integrated building model, perform connection point deformation monitoring on the target integrated building model in each temperature test scene according to the connection point preliminary monitoring data, and obtain the connection point deformation monitoring data according to the monitoring result.

[0010] The connection evaluation module is used to evaluate the connection stability of the concrete MiC corresponding to the target integrated building model according to the connection point deformation monitoring data.

[0011] Further, the connection point preliminary monitoring data is acquired, and the specific process is as follows:

[0012] The model of the concrete MiC is created, the modular integrated building model is obtained, and the modular integrated building model is named as a target integrated building model;

[0013] The spatial coordinate system is created in the target integrated building model, and the integrated building spatial coordinate system is obtained;

[0014] The plurality of module connection areas existing in the target integrated building model are acquired, and a sample module connection area is randomly selected from the plurality of module connection areas;

[0015] The installation error of the building connection points existing in the sample module connection area is analyzed, and the connection point coordinate deviation data corresponding to the sample module connection area is acquired according to the analysis result;

[0016] The connection point coordinate deviation data corresponding to each module connection area is acquired, and the connection point preliminary monitoring data is obtained.

[0017] Further, the integrated building spatial coordinate system is created, and the specific process is as follows:

[0018] A feature point on the ground of the target integrated building model is randomly selected as a coordinate origin, and a plane where the ground of the target integrated building model is located is marked as a first building plane, a straight line is drawn through the coordinate origin in the first building plane, and a first building straight line is obtained, and a straight line perpendicular to the first building straight line is drawn through the coordinate origin, and a second building straight line is obtained;

[0019] A plane perpendicular to the first building plane is drawn through the first building straight line, and a second building plane is obtained, a straight line perpendicular to the first building straight line is drawn through the coordinate origin in the second building plane, and a third building straight line is obtained, the first building straight line is marked as a coordinate x-axis, the second building straight line is marked as a coordinate y-axis, and the third building straight line is marked as a coordinate z-axis;

[0020] The spatial coordinate system determined by the coordinate origin, the coordinate x-axis, the coordinate y-axis, and the coordinate z-axis is marked as the integrated building spatial coordinate system.

[0021] Further, the connection point coordinate deviation data is acquired, and the specific process is as follows:

[0022] A plurality of building connection points are randomly selected in the sample module connection area, and the plurality of building connection points are marked as L1 building connection point to La building connection point;

[0023] When the target integrated building model is in the benchmark temperature environment, three-dimensional coordinate values of the L1 building connection point to the La building connection point in the integrated building space coordinate system are obtained respectively, and the L1 connection point actual coordinates La connection point actual coordinates are obtained.

[0024] The building BIM model corresponding to the target integrated building model is obtained, and a space coordinate system with the same relative position as the integrated building space coordinate system is created in the building BIM model, obtaining the BIM space coordinate system.

[0025] According to the building BIM model, the coordinate values of the L1 building connection point to the La building connection point in the BIM space coordinate system are obtained respectively, and the L1 connection point preset coordinates La connection point preset coordinates are obtained.

[0026] The L1 connection point actual coordinates and the L1 connection point preset coordinates are calculated to obtain the L1 installation coordinate deviation.

[0027] The installation coordinate deviations corresponding to the L2 building connection point to the La building connection point are obtained respectively, and the L2 installation coordinate deviation to the La installation coordinate deviation is obtained.

[0028] The L1 installation coordinate deviation to the La installation coordinate deviation is defined as the connection point coordinate deviation data corresponding to the sample module connection area.

[0029] Further, the L1 installation coordinate deviation is obtained, specifically as follows:

[0030] The L1 connection point actual coordinates and the L1 connection point preset coordinates are calculated to obtain the installation coordinate deviation of the L1 building connection point, and the L1 installation coordinate deviation is named.

[0031] The L1 installation coordinate deviation is calculated.

[0032] Further, the connection point deformation monitoring data is obtained, specifically as follows:

[0033] In the process of testing the target integrated building model, a plurality of temperature monitoring time periods with the same time length are marked, and the marked time periods are marked as D1 temperature monitoring time period to Db temperature monitoring time period in chronological order.

[0034] When the target integrated building model is in the D1 temperature monitoring time period, the environment temperature of the target integrated building model is adjusted to T1 characteristic temperature, and the time period end interpretation time value corresponding to the D1 temperature monitoring time period is marked as D1 characteristic time point.

[0035] When the target integrated building model is in the D2 temperature monitoring period, the ambient temperature where the target integrated building model is located is adjusted to the T2 characteristic temperature, and the time value at the end of the period corresponding to the D2 temperature monitoring period is marked as the D2 characteristic time point;

[0036] By analogy, when the target integrated building model is in the Db temperature monitoring period, the ambient temperature where the target integrated building model is located is adjusted to the Tb characteristic temperature, and the time value at the end of the period corresponding to the Db temperature monitoring period is marked as the Db characteristic time point;

[0037] Obtain the connection point preliminary monitoring data, and obtain the connection point coordinate deviation data corresponding to the sample module connection area according to the connection point preliminary monitoring data;

[0038] According to the connection point coordinate deviation data, the connection point deformation monitoring of the sample module connection area is performed, and the deformation monitoring coefficient corresponding to the sample module connection area is obtained.

[0039] The process of obtaining the deformation monitoring coefficient corresponding to the sample module connection area is repeated, and the deformation monitoring coefficient corresponding to each module connection area is obtained, and the connection point deformation monitoring data is obtained.

[0040] Further, the deformation monitoring coefficient is obtained, and the specific process is as follows:

[0041] The deformation monitoring of the sample module connection area in the D1 temperature monitoring period is performed, and the D1 time deformation deviation is obtained.

[0042] The time deformation deviation corresponding to the sample module connection area at the D2 characteristic time point to the Db characteristic time point is obtained, and the D2 time deformation deviation to the Db time deformation deviation is obtained.

[0043] The ambient temperature value corresponding to the reference temperature environment is obtained, and the environmental reference temperature value is obtained.

[0044] The difference between the T1 characteristic temperature and the environmental reference temperature value is obtained, and the absolute value of the obtained temperature difference is obtained, and the T1 characteristic temperature deviation to the Tb characteristic temperature deviation is obtained.

[0045] The D1 time deformation deviation to the Db time deformation deviation and the T1 characteristic temperature deviation to the Tb characteristic temperature deviation are calculated to obtain the deformation monitoring coefficient corresponding to the sample module connection area.

[0046] The deformation monitoring coefficient corresponding to the sample module connection area is calculated.

[0047] The deformation monitoring coefficient corresponding to each module connection area is obtained by repeating the deformation monitoring coefficient obtaining process, and the connection point deformation monitoring data is obtained.

[0048] Further, the deformation deviation at D1 is obtained, specifically as follows:

[0049] According to the connection point coordinate deviation data, the installation coordinate deviation corresponding to the L1 building connection point to the La building connection point is obtained, and the L1 installation coordinate deviation to the La installation coordinate deviation is obtained.

[0050] The installation coordinate deviation of the L1 building connection point to the La building connection point at the D1 feature time point is obtained, and the L1 monitoring coordinate deviation to the La monitoring coordinate deviation is obtained.

[0051] The L1 installation coordinate deviation to the La installation coordinate deviation is obtained, the difference between the L1 monitoring coordinate deviation and the L1 installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken to obtain the L1 deformation deviation. The difference between the L2 monitoring coordinate deviation and the L2 installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken to obtain the L2 deformation deviation. Similarly, the difference between the La monitoring coordinate deviation and the La installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken to obtain the La deformation deviation.

[0052] The L1 deformation deviation to the La deformation deviation is calculated, and the deformation deviation at D1 is obtained.

[0053] Further, the connection stability of the target integrated building model corresponding to the concrete MiC is evaluated, specifically as follows:

[0054] The connection point deformation monitoring data is obtained, the deformation monitoring coefficient corresponding to each module connection area is obtained according to the connection point deformation monitoring data, and the average of the obtained multiple deformation monitoring coefficients is calculated to obtain the average of the deformation monitoring coefficient corresponding to the target integrated building model.

[0055] The deformation monitoring coefficient preset qualified interval is obtained, if the average of the deformation monitoring coefficient is in the deformation monitoring coefficient preset qualified interval, it is judged that the connection stability of the concrete MiC corresponding to the target integrated building model is qualified, if the average of the deformation monitoring coefficient is not in the deformation monitoring coefficient preset qualified interval, it is judged that the connection stability of the concrete MiC corresponding to the target integrated building model is unqualified.

[0056] A concrete MiC module deformation monitoring method, characterized in that it comprises:

[0057] Step S1: obtaining a target integrated building model, and obtaining each module connection area in the target integrated building model, creating an integrated building space coordinate system, performing installation coordinate deviation analysis on each module connection area, and obtaining preliminary monitoring data of the connection points according to the analysis results;

[0058] Step S2: setting a plurality of temperature test scenes for the target integrated building model, performing connection point deformation monitoring on the target integrated building model in each temperature test scene according to the preliminary monitoring data of the connection points, and obtaining connection point deformation monitoring data according to the monitoring results;

[0059] Step S3: performing connection stability evaluation on the concrete MiC corresponding to the target integrated building model according to the connection point deformation monitoring data.

[0060] In summary, due to the adoption of the above technical solutions, the beneficial effects of the present application are:

[0061] 1. The present application can improve the lack of comprehensiveness of the connection point stability monitoring results by three-dimensional modeling of the concrete MiC and creating a space coordinate system to monitor the installation position deviation of each connection point.

[0062] 2. The present application can effectively monitor the deformation deviation of the concrete MiC under different temperature environments and improve the accuracy of the connection point stability monitoring results by setting a plurality of temperature test scenes for the three-dimensional modeling of the concrete MiC and performing connection point deformation monitoring on the target integrated building model in each temperature test scene. BRIEF DESCRIPTION OF DRAWINGS

[0063] In order to facilitate the understanding of those skilled in the art, the present application will be further described below with reference to the accompanying drawings.

[0064] Figure 1 is the overall system block diagram of the present application;

[0065] Figure 2 is the implementation step diagram of the present application;

[0066] Figure 3 is the integrated building space coordinate system diagram in the present application. DETAILED DESCRIPTION

[0067] The technical solutions of the present application will be described below in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0068] Embodiment one

[0069] Please refer to Figure 1 The application provides a technical scheme: a concrete MiC modular connection analysis system, comprising a data acquisition module, a data analysis module, a connection evaluation module and a server, the data acquisition module, the strength data module and the connection evaluation module are connected with the server respectively, and the server controls the data acquisition module, the strength data module and the connection evaluation module respectively;

[0070] The data acquisition module acquires a target integrated building model, acquires each module connection area in the target integrated building model, creates an integrated building space coordinate system, performs installation coordinate deviation analysis on each module connection area, and acquires preliminary monitoring data of the connection point according to the analysis result;

[0071] A model of the concrete MiC is created to obtain a modular integrated building model, which is named as the target integrated building model;

[0072] It should be noted here that:

[0073] The concrete MiC referred to here is a concrete modular integrated building;

[0074] The target integrated building model referred to here is a building model of the concrete modular integrated building reduced to scale for connection point error monitoring in the application;

[0075] Please refer to Figure 3 A feature point is randomly selected as a coordinate origin on the ground of the target integrated building model, and a plane where the ground of the target integrated building model is located is marked as a first building plane, a straight line is drawn through the coordinate origin in the first building plane to obtain a first building straight line, and a straight line perpendicular to the first building straight line is drawn through the coordinate origin to obtain a second building straight line;

[0076] A plane perpendicular to the first building plane is drawn through the first building straight line to obtain a second building plane, a straight line perpendicular to the first building straight line is drawn through the coordinate origin in the second building plane to obtain a third building straight line, the first building straight line is marked as a coordinate x-axis, the second building straight line is marked as a coordinate y-axis, and the third building straight line is marked as a coordinate z-axis;

[0077] The space coordinate system determined by the coordinate origin, the coordinate x-axis, the coordinate y-axis and the coordinate z-axis is marked as an integrated building space coordinate system;

[0078] A plurality of module connection areas existing in the target integrated building model are acquired, and a sample module connection area is randomly selected from the plurality of acquired module connection areas;

[0079] An installation error analysis is performed on the building connection points in the sample module connection area, and the connection point coordinate deviation data corresponding to the sample module connection area is obtained according to the analysis result;

[0080] Specifically as follows:

[0081] A plurality of building connection points are selected in the sample module connection area, and the plurality of building connection points are respectively marked as L1 building connection point to La building connection point;

[0082] It should be noted here that:

[0083] In this application, L refers to the symbol corresponding to the building connection point, and a refers to the number value corresponding to the building connection point, and a is an integer greater than 0.

[0084] When the target integrated building model is in a reference temperature environment, the three-dimensional coordinate values of L1 building connection point to La building connection point in the integrated building space coordinate system are obtained, and L1 connection point actual coordinate La connection point actual coordinate are obtained.

[0085] It should be noted here that:

[0086] In this application, the reference temperature environment specifically refers to the standard temperature condition in the design and analysis process of the prototype building corresponding to the target integrated building model. The reference temperature environment provides a unified reference for the performance evaluation of structures, materials and building systems.

[0087] An architectural BIM model corresponding to the target integrated building model is obtained, and a space coordinate system with the same relative position as the integrated building space coordinate system is created in the architectural BIM model, obtaining a BIM space coordinate system;

[0088] It should be noted here that:

[0089] In this application, the spatial scale of the architectural BIM model and the target integrated building model is 1:1.

[0090] In this application, the architectural BIM model refers to the spatial modeling of the prototype building corresponding to the target integrated building model. The architectural BIM model integrates the preset installation positions of different components of the prototype building.

[0091] The coordinate values of L1 building connection point to La building connection point in the BIM space coordinate system are obtained according to the architectural BIM model, and L1 connection point preset coordinate to La connection point preset coordinate are obtained.

[0092] The L1 connection point actual coordinate and the L1 connection point preset coordinate are connected through calculation to obtain the installation coordinate deviation of the L1 building connection point, and the installation coordinate deviation of the L1 is named as L1 installation coordinate deviation;

[0093] The L1 installation coordinate deviation is calculated, and the specific formula is as follows:

[0094]

[0095] Wherein, Lpy1 is the L1 installation coordinate deviation, (x s1 ,y s1 ,z s1 ) is the L1 connection point actual coordinate, (x y1 ,y y1 ,z y1 ) is the L1 connection point actual coordinate;

[0096] It should be noted here that:

[0097] In the specific implementation, the following experimental data exists:

[0098] The L1 connection point actual coordinate is (34, 56, 65), the L1 connection point actual coordinate is (35, 58, 65), and the L1 installation coordinate deviation can be calculated as 2.24 cm;

[0099] The L2 connection point actual coordinate is (38, 66, 65), the L2 connection point actual coordinate is (35, 67, 65), and the L2 installation coordinate deviation can be calculated as 3.16 cm;

[0100] The L3 connection point actual coordinate is (77, 66, 65), the L2 connection point actual coordinate is (75, 64, 69), and the L2 installation coordinate deviation can be calculated as 4.90 cm.

[0101] The process of obtaining the installation coordinate deviation corresponding to the L1 building connection point is repeated, and the installation coordinate deviation corresponding to the L2 building connection point to the La building connection point is obtained, to obtain the L2 installation coordinate deviation to the La installation coordinate deviation;

[0102] The L1 installation coordinate deviation to the La installation coordinate deviation is defined as the connection point coordinate deviation data corresponding to the sample module connection area;

[0103] The process of obtaining the connection point coordinate deviation data corresponding to the sample module connection area is repeated, and the connection point coordinate deviation data corresponding to each module connection area is obtained, to obtain the connection point preliminary monitoring data;

[0104] The data acquisition module obtains the connection point preliminary monitoring data and transmits it to the data analysis module;

[0105] The data analysis module sets a plurality of temperature test scenarios for the target integrated building model, monitors the deformation of the connecting points of the target integrated building model in each temperature test scenario according to the preliminary monitoring data of the connecting points, and obtains the deformation monitoring data of the connecting points according to the monitoring results;

[0106] Specifically as follows:

[0107] In the process of testing the target integrated building model, a plurality of temperature monitoring time periods with the same length are marked, and the marked temperature monitoring time periods are marked as D1 temperature monitoring time period to Db temperature monitoring time period in chronological order;

[0108] It should be noted that:

[0109] In the present application, D herein refers to a symbol corresponding to the temperature monitoring time period, b refers to a quantity value corresponding to the temperature monitoring time period, and b is an integer greater than 0;

[0110] When the target integrated building model is in the D1 temperature monitoring time period, the ambient temperature of the target integrated building model is adjusted to T1 characteristic temperature, and the time period end interpretation time value corresponding to the D1 temperature monitoring time period is marked as the D1 characteristic time point;

[0111] It should be noted that:

[0112] In the present application, T1 characteristic temperature herein needs to be set at the time period start time point of the D1 temperature monitoring time period.

[0113] When the target integrated building model is in the D2 temperature monitoring time period, the ambient temperature of the target integrated building model is adjusted to T2 characteristic temperature, and the time period end interpretation time value corresponding to the D2 temperature monitoring time period is marked as the D2 characteristic time point;

[0114] By analogy, when the target integrated building model is in the Db temperature monitoring time period, the ambient temperature of the target integrated building model is adjusted to Tb characteristic temperature, and the time period end interpretation time value corresponding to the Db temperature monitoring time period is marked as the Db characteristic time point;

[0115] The connecting point preliminary monitoring data is obtained, and the connecting point coordinate deviation data corresponding to the connecting region of the sample module is obtained according to the connecting point preliminary monitoring data;

[0116] The deformation of the connecting points of the connecting region of the sample module is monitored according to the connecting point coordinate deviation data, and the deformation monitoring coefficient corresponding to the connecting region of the sample module is obtained;

[0117] Specifically as follows:

[0118] According to the connection point coordinate deviation data, installation coordinate deviations corresponding to the L1 building connection point to the La building connection point are obtained, and L1 installation coordinate deviations to La installation coordinate deviations are obtained.

[0119] The installation coordinate deviations corresponding to the L1 building connection point to the La building connection point at the D1 feature time point are obtained, and L1 monitoring coordinate deviations to La monitoring coordinate deviations are obtained.

[0120] The L1 installation coordinate deviations to the La installation coordinate deviations are obtained, the difference between the L1 monitoring coordinate deviation and the L1 installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken, to obtain the L1 deformation deviation, the difference between the L2 monitoring coordinate deviation and the L2 installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken, to obtain the L2 deformation deviation, and so on, the difference between the La monitoring coordinate deviation and the La installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken, to obtain the La deformation deviation.

[0121] The L1 deformation deviation to the La deformation deviation is calculated, and the D1 moment deformation deviation is obtained.

[0122] The D1 moment deformation deviation is repeatedly obtained, and the moment deformation deviations corresponding to the sample module connection area at the D2 feature time point to the Db feature time point are obtained, to obtain the D2 moment deformation deviation to the Db moment deformation deviation.

[0123] The environment temperature value corresponding to the reference temperature environment is obtained, and the environment reference temperature value is obtained.

[0124] The difference between the T1 feature temperature to the Tb feature temperature and the environment reference temperature value is obtained, and the absolute value of the obtained multiple temperature differences is taken, to obtain the T1 feature temperature deviation to the Tb feature temperature deviation.

[0125] The D1 moment deformation deviation to the Db moment deformation deviation and the T1 feature temperature deviation to the Tb feature temperature deviation are calculated to obtain the deformation monitoring coefficient corresponding to the sample module connection area.

[0126] The deformation monitoring coefficient corresponding to the sample module connection area is calculated, and the specific formula is as follows:

[0127]

[0128] Wherein, Xbx is the deformation monitoring coefficient corresponding to the sample module connection area, Pxi is the Di moment deformation deviation, Tei is the Ti feature temperature deviation, and b is the number value corresponding to the temperature monitoring period.

[0129] It should be noted here that:

[0130] In the present application, the following experimental data exist:

[0131] If Px1 is 21 mm, Px2 is 24 mm, Px3 is 31 mm, Te1 is 25℃, Te2 is 15℃, and Te3 is 5℃, Xbx can be calculated as 0.15;

[0132] It should be noted here that:

[0133] In the present application, the deformation monitoring coefficient referred to here is specifically an index value representing the change of the building connection point in the sample module connection area with the change of the environmental temperature, reflecting the change rate of the deformation deviation with the change of the temperature, and can further reflect the connection structure stability of the sample module connection area.

[0134] The process of obtaining the deformation monitoring coefficient corresponding to the sample module connection area is repeated to obtain the deformation monitoring data of the connection point corresponding to each module connection area;

[0135] The connection evaluation module evaluates the connection stability of the concrete MiC corresponding to the target integrated building model according to the connection point deformation monitoring data;

[0136] Specifically as follows:

[0137] Obtain the deformation monitoring data of the connection point, obtain the deformation monitoring coefficient corresponding to each module connection area according to the deformation monitoring data of the connection point, and calculate the average of the obtained multiple deformation monitoring coefficients to obtain the average value of the deformation monitoring coefficient corresponding to the target integrated building model;

[0138] Obtain the deformation monitoring coefficient preset qualified interval, if the average value of the deformation monitoring coefficient is in the deformation monitoring coefficient preset qualified interval, it is judged that the connection stability of the concrete MiC corresponding to the target integrated building model is qualified, if the average value of the deformation monitoring coefficient is not in the deformation monitoring coefficient preset qualified interval, it is judged that the connection stability of the concrete MiC corresponding to the target integrated building model is unqualified;

[0139] It should be noted here that:

[0140] In the present application, the connection stability qualified here includes the interval boundary corresponding to the deformation monitoring coefficient preset qualified interval;

[0141] In the present application, the lower limit of the deformation monitoring coefficient preset qualified interval is 0, i.e. the target integrated building model does not exist deformation;

[0142] In the present application, the seismic resistance of the concrete MiC with qualified connection stability is higher than that of the concrete MiC with unqualified connection stability

[0143] The upper limit of the deformation monitoring coefficient preset qualified interval is obtained, specifically as follows:

[0144] Obtain a plurality of connection stability qualified concrete MiC, respectively, for each concrete MiC corresponding to the deformation monitoring coefficient average value is obtained, and the plurality of deformation monitoring coefficient average value is calculated, and the deformation monitoring coefficient preset qualified interval upper limit is obtained.

[0145] In this application, if the corresponding calculation formula appears, the above calculation formula is to take its numerical value calculation, the weight coefficient, the proportion coefficient and other coefficients existing in the formula, the size of the setting is to obtain a result value by quantifying each parameter, the size of the weight coefficient and the proportion coefficient, as long as it does not affect the proportional relationship between the parameters and the result value.

[0146] Example two

[0147] Please refer to Figure 2 Based on the same invention, another concept is proposed, a concrete MiC module deformation monitoring method is proposed, applied to a concrete MiC modular connection analysis system, the deformation monitoring method comprises the following steps:

[0148] Step S1: obtaining a target integrated building model, and obtaining each module connection area in the target integrated building model, creating an integrated building space coordinate system, installing coordinate deviation analysis on each module connection area, and obtaining connection point preliminary monitoring data according to the analysis result;

[0149] The step S1 further comprises the following steps:

[0150] Step S11: create a model for concrete MiC, obtain a modular integrated building model, and name it as a target integrated building model;

[0151] Step S11: create a space coordinate system in the target integrated building model, and obtain an integrated building space coordinate system;

[0152] The step S11 further comprises the following steps:

[0153] A feature point is randomly selected as the coordinate origin at the ground of the target integrated building model, and the plane where the ground of the target integrated building model is located is marked as the first building plane, in the first building plane, any straight line is made through the coordinate origin, and the first building straight line is obtained, and the straight line perpendicular to the first building straight line is made through the coordinate origin, and the second building straight line is obtained;

[0154] A plane perpendicular to the first building plane is drawn through the first building straight line to obtain a second building plane, a straight line perpendicular to the first building straight line is drawn through the coordinate origin in the second building plane to obtain a third building straight line, the first building straight line is marked as the coordinate x-axis, the second building straight line is marked as the coordinate y-axis, and the third building straight line is marked as the coordinate z-axis;

[0155] The space coordinate system determined by the coordinate origin, the coordinate x-axis, the coordinate y-axis, and the coordinate z-axis is marked as the integrated building space coordinate system;

[0156] Step S13: Obtain a plurality of module connection areas existing in the target integrated building model, and randomly select a sample module connection area from the plurality of obtained module connection areas;

[0157] Step S14: Perform installation error analysis on the building connection points existing in the sample module connection area, and obtain connection point coordinate deviation data corresponding to the sample module connection area according to the analysis result;

[0158] In the step S14, the following steps are further included:

[0159] A plurality of building connection points are randomly selected in the sample module connection area, and the plurality of obtained building connection points are marked as L1 building connection point to La building connection point;

[0160] When the target integrated building model is in a reference temperature environment, three-dimensional coordinate values of the L1 building connection point to the La building connection point in the integrated building space coordinate system are obtained, and L1 connection point actual coordinates to La connection point actual coordinates are obtained;

[0161] An architectural BIM model corresponding to the target integrated building model is obtained, and a space coordinate system having the same relative position as the integrated building space coordinate system is created in the architectural BIM model to obtain a BIM space coordinate system;

[0162] According to the architectural BIM model, coordinate values of the L1 building connection point to the La building connection point in the BIM space coordinate system are obtained, and L1 connection point preset coordinates to La connection point preset coordinates are obtained;

[0163] L1 installation coordinate deviation is obtained by performing coordinate calculation on the L1 connection point actual coordinates and the L1 connection point preset coordinates;

[0164] The L1 installation coordinate deviation corresponding to the L1 building connection point is obtained by calculating the L1 connection point actual coordinates and the L1 connection point preset coordinates, and is named as L1 installation coordinate deviation;

[0165] The L1 installation coordinate deviation is calculated, and the specific formula is as follows:

[0166]

[0167] wherein Lpy1 is the L1 installation coordinate deviation, (x s1 ,y s1 ,z s1 ) is the L1 connection point actual coordinate, (x y1 ,y y1 ,z y1 ) is the L1 connection point actual coordinate;

[0168] respectively, to obtain the L2 installation coordinate deviation to the La installation coordinate deviation;

[0169] the L1 installation coordinate deviation to the La installation coordinate deviation is defined as the connection point coordinate deviation data corresponding to the sample module connection area;

[0170] Step S15: Obtain the connection point coordinate deviation data corresponding to each module connection area to obtain the connection point preliminary monitoring data;

[0171] Step S2: Set a plurality of temperature test scenarios for the target integrated building model, and perform connection point deformation monitoring on the target integrated building model in each temperature test scenario according to the connection point preliminary monitoring data, and obtain connection point deformation monitoring data according to the monitoring result;

[0172] The step S2 further includes the following steps:

[0173] Step S21: In the process of testing the target integrated building model, mark a plurality of temperature monitoring time periods with the same time length, and mark them in time sequence as D1 temperature monitoring time period to Db temperature monitoring time period;

[0174] Step S22: When the target integrated building model is in the D1 temperature monitoring time period, adjust the environment temperature of the target integrated building model to T1 characteristic temperature, and mark the time period end interpretation time value corresponding to the D1 temperature monitoring time period as D1 characteristic time point;

[0175] Step S23: When the target integrated building model is in the D2 temperature monitoring time period, adjust the environment temperature of the target integrated building model to T2 characteristic temperature, and mark the time period end interpretation time value corresponding to the D2 temperature monitoring time period as D2 characteristic time point;

[0176] Step S24: Similarly, when the target integrated building model is in the Db temperature monitoring time period, adjust the environment temperature of the target integrated building model to Tb characteristic temperature, and mark the time period end interpretation time value corresponding to the Db temperature monitoring time period as Db characteristic time point.

[0177] Step S25: Obtain the connection point preliminary monitoring data, and obtain the connection point coordinate deviation data corresponding to the sample module connection area according to the connection point preliminary monitoring data;

[0178] Step S26: Perform connection point deformation monitoring on the sample module connection area according to the connection point coordinate deviation data, and obtain the deformation monitoring coefficient corresponding to the sample module connection area;

[0179] In the step S26, the following steps are further included:

[0180] According to the connection point coordinate deviation data, the installation coordinate deviations corresponding to the L1 building connection point to the La building connection point are obtained, and the L1 installation coordinate deviation to the La installation coordinate deviation are obtained.

[0181] The installation coordinate deviations corresponding to the L1 building connection point to the La building connection point at the D1 feature time point are obtained, and the L1 monitoring coordinate deviation to the La monitoring coordinate deviation are obtained.

[0182] The L1 installation coordinate deviation to the La installation coordinate deviation are obtained, the difference between the L1 monitoring coordinate deviation and the L1 installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken to obtain the L1 deformation deviation. The difference between the L2 monitoring coordinate deviation and the L2 installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken to obtain the L2 deformation deviation. Similarly, the difference between the La monitoring coordinate deviation and the La installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken to obtain the La deformation deviation.

[0183] The L1 deformation deviation to the La deformation deviation are averaged to obtain the D1 time point deformation deviation.

[0184] The time point deformation deviations corresponding to the sample module connection area at the D2 feature time point to the Db feature time point are obtained, and the D2 time point deformation deviation to the Db time point deformation deviation are obtained.

[0185] The environmental temperature value corresponding to the reference temperature environment is obtained, and the environmental reference temperature value is obtained.

[0186] The differences between the T1 feature temperature to the Tb feature temperature and the environmental reference temperature value are obtained, and the absolute values of the obtained multiple temperature differences are taken to obtain the T1 feature temperature deviation to the Tb feature temperature deviation.

[0187] The D1 time point deformation deviation to the Db time point deformation deviation and the T1 feature temperature deviation to the Tb feature temperature deviation are calculated to obtain the deformation monitoring coefficient corresponding to the sample module connection area.

[0188] The deformation monitoring coefficient corresponding to the sample module connection area is calculated, and the specific formula is as follows:

[0189]

[0190] Wherein, Xbx is the deformation monitoring coefficient corresponding to the sample module connection area, Pxi is the deformation deviation at Di moment, Tei is Ti characteristic temperature deviation, and b is the number value corresponding to the temperature monitoring period.

[0191] Step S27: Obtain the deformation monitoring coefficient corresponding to each module connection area respectively to obtain the connection point deformation monitoring data.

[0192] Step S3: Perform connection stability evaluation on the concrete MiC corresponding to the target integrated building model according to the connection point deformation monitoring data.

[0193] In the step S3, the following steps are further included:

[0194] Step S31: Obtain the connection point deformation monitoring data, obtain the deformation monitoring coefficient corresponding to each module connection area respectively according to the connection point deformation monitoring data, and perform average number calculation on the obtained multiple deformation monitoring coefficients to obtain the deformation monitoring coefficient average value corresponding to the target integrated building model.

[0195] Step S32: Obtain the deformation monitoring coefficient preset qualified interval, if the deformation monitoring coefficient average value is in the deformation monitoring coefficient preset qualified interval, it is judged that the concrete MiC connection stability corresponding to the target integrated building model is qualified, if the deformation monitoring coefficient average value is not in the deformation monitoring coefficient preset qualified interval, it is judged that the concrete MiC connection stability corresponding to the target integrated building model is unqualified.

[0196] The preferred embodiments disclosed above are only used to help explain the present application. The preferred embodiments do not describe all the details, nor limit the present application to the specific embodiments. Obviously, according to the content of the present application, many modifications and changes can be made. The present application is selected and described in detail, in order to better explain the principles and practical application of the present application, so that the person skilled in the art can well understand and utilize the present application. The present application is limited by the claims and their entire scope and equivalents.

Claims

1. A concrete MiC modular connection analysis system, characterized by, The method comprises the following steps: A data acquisition module: obtain the target integrated building model, and obtain each module connection area in the target integrated building model. Create an integrated building space coordinate system, and analyze the installation coordinate deviation of each module connection area. Obtain preliminary monitoring data of the connection points according to the analysis results. A data analysis module: set a plurality of temperature test scenarios for the target integrated building model. According to the preliminary monitoring data of the connection points, monitor the deformation of the connection points in each temperature test scenario. Obtain the deformation monitoring data of the connection points according to the monitoring results. A connection evaluation module: evaluate the connection stability of the concrete MiC corresponding to the target integrated building model according to the deformation monitoring data of the connection points. During the testing of the target integrated building model, mark a plurality of temperature monitoring periods with the same time length, and mark them in chronological order as D1 temperature monitoring period to Db temperature monitoring period to obtain the D1 time deformation deviation. Repeat the process of obtaining the D1 time deformation deviation to obtain the D2 time deformation deviation to the Db time deformation deviation corresponding to the sample module connection area at the D2 feature time point to the Db feature time point. Obtain the environmental reference temperature value corresponding to the reference temperature environment. Obtain the difference between the T1 feature temperature and the environmental reference temperature value, and take the absolute value of the obtained plurality of temperature differences to obtain the T1 feature temperature deviation to the Tb feature temperature deviation. Calculate the deformation monitoring coefficient corresponding to the sample module connection area by using the D1 time deformation deviation to the Db time deformation deviation and the T1 feature temperature deviation to the Tb feature temperature deviation. Calculate the deformation monitoring coefficient corresponding to the sample module connection area, and the specific formula is as follows: ； Where Xbx is the deformation monitoring coefficient corresponding to the sample module connection area, Pxi is the Di time deformation deviation, Tei is the Ti feature temperature deviation, and b is the number value corresponding to the temperature monitoring period. Obtain the deformation monitoring coefficient corresponding to each module connection area, and calculate the average of the obtained plurality of deformation monitoring coefficients to obtain the deformation monitoring coefficient average value corresponding to the target integrated building model. Obtain the deformation monitoring coefficient preset qualified interval. If the deformation monitoring coefficient average value is in the deformation monitoring coefficient preset qualified interval, it is judged that the connection stability of the concrete MiC corresponding to the target integrated building model is qualified. If the deformation monitoring coefficient average value is not in the deformation monitoring coefficient preset qualified interval, it is judged that the connection stability of the concrete MiC corresponding to the target integrated building model is unqualified.

2. A concrete MiC modular connection analysis system according to claim 1, characterized in that, Obtain the preliminary monitoring data of the connection points, as follows: Create a model of the concrete MiC to obtain the target integrated building model. Create a space coordinate system in the target integrated building model to obtain an integrated building space coordinate system. Obtain a plurality of module connection areas in the target integrated building model, and select a sample module connection area from the plurality of module connection areas. The installation error of the building connection point in the sample module connection area is analyzed, and the connection point coordinate deviation data is obtained according to the analysis result; The connection point coordinate deviation data corresponding to each module connection area is obtained, and the connection point preliminary monitoring data is obtained.

3. A concrete MiC modular connection analysis system according to claim 2, wherein, The integrated building space coordinate system is created, as follows: A feature point is randomly selected as the coordinate origin on the ground of the target integrated building model, and the ground of the target integrated building model is marked as the first building plane. In the first building plane, a straight line is drawn through the coordinate origin to obtain the first building straight line. A straight line is drawn through the coordinate origin perpendicular to the first building straight line to obtain the second building straight line. A plane perpendicular to the first building plane is drawn through the first building straight line to obtain the second building plane. In the second building plane, a straight line is drawn through the coordinate origin perpendicular to the first building straight line to obtain the third building straight line. The first building straight line is marked as the coordinate x-axis, the second building straight line is marked as the coordinate y-axis, and the third building straight line is marked as the coordinate z-axis. The space coordinate system determined by the coordinate origin, the coordinate x-axis, the coordinate y-axis, and the coordinate z-axis is marked as the integrated building space coordinate system.

4. A concrete MiC modular connection analysis system according to claim 2, wherein, The connection point coordinate deviation data is obtained, as follows: A plurality of building connection points are randomly selected in the sample module connection area, and the obtained plurality of building connection points are marked as L1 building connection point to La building connection point. When the target integrated building model is in the reference temperature environment, the three-dimensional coordinate values of L1 building connection point to La building connection point in the integrated building space coordinate system are obtained, and L1 connection point actual coordinate to La connection point actual coordinate are obtained. The building BIM model corresponding to the target integrated building model is obtained, and a space coordinate system with the same relative position as the integrated building space coordinate system is created in the building BIM model, and a BIM space coordinate system is obtained. The coordinate values of L1 building connection point to La building connection point in the BIM space coordinate system are obtained according to the building BIM model, and L1 connection point preset coordinate to La connection point preset coordinate are obtained. The installation coordinate deviation corresponding to L1 building connection point to La building connection point is obtained, and L1 installation coordinate deviation to La installation coordinate deviation are obtained. L1 installation coordinate deviation to La installation coordinate deviation are defined as the connection point coordinate deviation data corresponding to the sample module connection area.

5. A concrete MiC modular connection analysis system according to claim 4, wherein, L1 installation coordinate deviation is obtained, as follows: The installation coordinate deviation corresponding to L1 building connection point is obtained by calculating L1 connection point actual coordinate and L1 connection point preset coordinate, and is named as L1 installation coordinate deviation. L1 installation coordinate deviation is calculated.

6. A concrete MiC modular connection analysis system according to claim 1, wherein, D1 time deformation deviation is obtained, as follows: The installation coordinate deviation corresponding to L1 building connection point to La building connection point is obtained according to the connection point coordinate deviation data, and L1 installation coordinate deviation to La installation coordinate deviation are obtained. The installation coordinate deviation of L1 building connection point to La building connection point corresponding to D1 feature time point is obtained, and L1 monitoring coordinate deviation to La monitoring coordinate deviation are obtained. The L1 installation coordinate deviation is obtained, the difference between the L1 monitoring coordinate deviation and the L1 installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken to obtain the L1 deformation deviation; similarly, the difference between the La monitoring coordinate deviation and the La installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken to obtain the La deformation deviation; The L1 installation coordinate deviation is obtained, the difference between the L1 monitoring coordinate deviation and the L1 installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken to obtain the L1 deformation deviation; similarly, the difference between the La monitoring coordinate deviation and the La installation coordinate deviation is calculated, and the absolute value of the obtained difference is taken to obtain the La deformation deviation; 7. A method for monitoring deformation of a concrete MiC module, applicable to a system for analyzing modular connection of concrete MiC according to any one of claims 1-6, characterized in that, The monitoring method comprises: Step S1: Obtain the target integrated building model, and obtain each module connection area in the target integrated building model; create an integrated building space coordinate system, perform installation coordinate deviation analysis on each module connection area, and obtain preliminary monitoring data of the connection points according to the analysis result; Step S2: A plurality of temperature test scenarios are set for the target integrated building model, the connection point deformation of the target integrated building model in each temperature test scenario is monitored according to the preliminary monitoring data of the connection points, and connection point deformation monitoring data is obtained according to the monitoring result; Step S3: The connection stability of the concrete MiC corresponding to the target integrated building model is evaluated according to the connection point deformation monitoring data; In the process of testing the target integrated building model, a plurality of temperature monitoring time periods with the same length are marked, and the marked time periods are marked as D1 temperature monitoring time period to Db temperature monitoring time period in chronological order to obtain D1 time period deformation deviation; The process of obtaining the D1 time period deformation deviation is repeated to obtain the time period deformation deviation of the sample module connection area corresponding to the D2 feature time point to the Db feature time point, and the D2 time period deformation deviation to the Db time period deformation deviation are obtained; The environment reference temperature value corresponding to the reference temperature environment is obtained, and the environment reference temperature value is obtained; The difference between the T1 feature temperature and the environment reference temperature value is obtained, and the absolute value of the plurality of temperature differences is obtained, and the T1 feature temperature deviation to the Tb feature temperature deviation is obtained; The D1 time period deformation deviation to the Db time period deformation deviation and the T1 feature temperature deviation to the Tb feature temperature deviation are calculated to obtain the deformation monitoring coefficient corresponding to the sample module connection area; The deformation monitoring coefficient corresponding to the sample module connection area is calculated, and the specific formula is as follows: ； Wherein, Xbx is the deformation monitoring coefficient corresponding to the sample module connection area, Pxi is the Di time period deformation deviation, Tei is the Ti feature temperature deviation, and b is the quantity value corresponding to the temperature monitoring time period; The deformation monitoring coefficient corresponding to each module connection area is obtained, and the average of the plurality of deformation monitoring coefficients is calculated to obtain the deformation monitoring coefficient average value corresponding to the target integrated building model; the deformation monitoring coefficient preset qualified interval is obtained, if the deformation monitoring coefficient average value is in the deformation monitoring coefficient preset qualified interval, it is judged that the concrete MiC connection stability corresponding to the target integrated building model is qualified, if the deformation monitoring coefficient average value is not in the deformation monitoring coefficient preset qualified interval, it is judged that the concrete MiC connection stability corresponding to the target integrated building model is unqualified.

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