Cooling system for server

Abstract

The invention discloses a heat dissipation system for a server, the heat dissipation system comprises a load node group and a heat dissipation node, the load node group comprises a plurality of load nodes, each load node comprises a first shell and a plurality of load modules, a heat dissipation air channel with an air inlet and an air outlet is formed in the first shell, and the load modules are arranged in the first shell; at least part of the load module is located in the heat dissipation air channels, each heat dissipation air channel is internally provided with at least one air multiplication structure, an air flow channel and a jet flow outlet communicating with the air flow channel are formed in each air multiplication structure, and the jet flow outlets are in a slit shape and suitable for jetting airflow in the direction close to the exhaust outlet. The heat dissipation node comprises a second shell and an air supply module, an air supply cavity used for containing the air supply module is formed in the second shell, and the air supply cavity communicates with the air flow channels in the multiple air multiplication structures. According to the heat dissipation system, the requirement for the air volume of the air supply module can be lowered so that the power consumption of the air supply module can be lowered, and the heat dissipation efficiency of the load module can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a heat dissipation system for a server. Background Art

[0002] With the rapid development of the artificial intelligence and big data industries, the demand for computing power has increased dramatically, leading to higher power requirements for server cabinets. The server's cooling system is crucial, directly impacting its stability and lifespan. However, in related technologies, multiple cooling fans are installed at each load node, resulting in the cooling system accounting for a disproportionately high proportion of overall energy consumption. Furthermore, direct cooling through fans is inefficient, leaving room for improvement. Summary of the Invention

[0003] The present application proposes a heat dissipation system for a server, which at least solves the problems of high power consumption and low heat dissipation efficiency of the heat dissipation system in the related art.

[0004] According to an embodiment of the present application, a heat dissipation system for a server includes: a load node group, the load node group includes multiple load nodes, the load node includes a first shell and multiple load modules arranged in the first shell, a heat dissipation duct is formed in the first shell, the heat dissipation duct has an air inlet and an air outlet, at least part of the load module is located in the heat dissipation duct, each of the heat dissipation ducts is provided with at least one air multiplication structure, a gas flow channel is formed in the air multiplication structure, a jet outlet connected to the gas flow channel is formed on the air multiplication structure, the jet outlet is slit-shaped and suitable for spraying air flow toward a direction close to the exhaust port; a heat dissipation node, the heat dissipation node is arranged outside the first shell and includes a second shell and an air supply module, an air supply cavity for accommodating the air supply module is formed in the second shell, and the air supply cavity is connected to the gas flow channels in the multiple air multiplication structures.

[0005] According to the heat dissipation system for servers according to the embodiments of the present application, by providing an air multiplication structure within each heat dissipation duct, the airflow within the gas flow duct can be ejected into the heat dissipation duct at high speed through the jet outlet, which can drive a large amount of airflow from the air inlet to the air outlet to increase the air intake volume within the heat dissipation duct. At the same time, it can improve the stability and uniformity of the airflow within the heat dissipation duct, reduce the air volume requirement for the air supply module to reduce the power consumption of the air supply module, and improve the heat dissipation efficiency of the load module. In addition, the airflow ejected from the jet outlet is relatively small, and the vibration amplitude caused is small, which can prevent vibration from causing failure of load modules such as hard drives, thereby reducing the vibration noise of the server heat dissipation system and improving the stability of load node operation.

[0006] According to some embodiments of the present application, the direction of airflow flowing from the air inlet toward the air outlet is a first direction, and along the first direction, the distance between the air multiplying structure and the air inlet is smaller than the distance between the air multiplying structure and the air outlet; and / or, the jet outlet is arranged at one end of the air multiplying structure close to the air inlet.

[0007] According to some embodiments of the present application, the direction of the air flow from the air inlet toward the air outlet is the first direction, and each of the heat dissipation ducts is provided with a plurality of the air multiplication structures arranged at intervals along the second direction, and the gas flow channels of the plurality of air multiplication structures are all connected to the air supply cavity, and the second direction is perpendicular to the first direction.

[0008] According to some embodiments of the present application, an air inlet channel is defined between at least part of two adjacent air multiplication structures, the jet outlet is located on the side of the air multiplication structure facing the air inlet channel, and the width of the air inlet channel in the second direction gradually increases in the direction from the air inlet to the air outlet.

[0009] According to some embodiments of the present application, the jet outlet is arranged at the air inlet end of the air inlet duct, the central area of the air inlet duct in the second direction is the first central area, and in the direction from the air inlet to the air outlet, the jet outlet extends obliquely toward the direction close to the first central area.

[0010] According to some embodiments of the present application, a connecting harness is provided in the heat dissipation duct, and along the first direction, the load modules located on opposite sides of the air multiplication structure are electrically connected through the connecting harness, and a wiring space is defined between at least part of the two adjacent air multiplication structures. At least part of the connecting harness is routed along the wiring space, and the jet outlet is located on the side of the air multiplication structure away from the wiring space.

[0011] According to some embodiments of the present application, the two opposite side surfaces of the routing space along the second direction are respectively the first side surface and the second side surface. Along the first direction, the first side surface and the second side surface are inclined and extended toward each other in the direction from the two ends to the center.

[0012] According to some embodiments of the present application, a plurality of distribution flow channels connected to the air supply chamber are also formed in the second shell, and the plurality of distribution flow channels are located on the downstream side of the air supply chamber. The plurality of distribution flow channels are the same in number as the plurality of gas flow channels in the same load node and are connected one-to-one.

[0013] According to some embodiments of the present application, the plurality of load nodes are arranged along a third direction, the gas flow channel extends along the third direction, and along the third direction, the two ends of the gas flow channel respectively extend to the opposite side surfaces of the first shell, and the gas flow channels corresponding to the plurality of load nodes are connected in sequence to form a delivery flow channel, and the air supply chamber is connected to one end of the delivery flow channel.

[0014] According to some embodiments of the present application, two heat dissipation nodes are provided, and two ends of the delivery flow channel along the third direction are respectively connected to the air supply cavities of the two heat dissipation nodes.

[0015] According to some embodiments of the present application, the heat dissipation nodes and the load node group are arranged along the third direction.

[0016] According to some embodiments of the present application, a buffer material piece is provided between the heat dissipation node and the load node.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of a heat dissipation system for a server according to the first embodiment of the present application;

[0019] Figure 2 1 is a schematic diagram of the internal structure of a load node of a heat dissipation system for a server according to an embodiment of the present application;

[0020] Figure 3 1 is a schematic diagram of the connection between the heat dissipation node and the gas flow channel of the heat dissipation system for a server according to an embodiment of the present application;

[0021] Figure 4 1 is a schematic diagram of an air multiplication structure of a heat dissipation system for a server according to an embodiment of the present application;

[0022] Figure 5 is a top view of the internal structure of a load node of a heat dissipation system for a server according to an embodiment of the present application;

[0023] Figure 6 1 is a schematic diagram of the internal structure of a heat dissipation node of a heat dissipation system for a server according to an embodiment of the present application;

[0024] Figure 7 is a schematic diagram of a heat dissipation system for a server according to a second embodiment of the present application;

[0025] Figure 8 The present invention is a schematic diagram of the construction process of a heat dissipation system for a server according to an embodiment of the present application.

[0026] Reference numerals:

[0027] 100. Cooling system for servers;

[0028] 1. Load node; 11. First housing; 111. Cooling duct; 112. Air inlet; 113. Air outlet; 12. Load module; 12a. Motherboard; 12b. Processor; 12c. Hard disk; 13. Air multiplication structure; 131. Gas flow channel; 132. Jet outlet; 14. Wiring space; 15. Delivery channel;

[0029] 2. Heat dissipation node; 21. Second housing; 211. Air supply cavity; 212. Distribution channel; 22. Air supply module;

[0030] 3. Power supply node. DETAILED DESCRIPTION

[0031] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0032] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating positions or positional relationships, are based on the positions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present application. The terms "mounted", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two elements. The terms "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0033] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0034] A heat dissipation system 100 for a server according to an embodiment of the present application will be described below with reference to the accompanying drawings.

[0035] like Figures 1 to 4As shown, a heat dissipation system 100 for a server according to an embodiment of the present application includes: a load node group and a heat dissipation node 2, wherein the load node group includes multiple load nodes 1, the load node 1 includes a first shell 11 and multiple load modules 12 arranged in the first shell 11, a heat dissipation duct 111 is formed in the first shell 11, the heat dissipation duct 111 has an air inlet 112 and an air outlet 113, at least part of the load module 12 is located in the heat dissipation duct 111, and the air flow can enter the heat dissipation duct 111 through the air inlet 112, and be discharged through the air outlet 113 after absorbing the heat of the load module 12, thereby achieving cooling of the load module 12.

[0036] At least one air multiplication structure 13 is provided in each heat dissipation duct 111, and a gas flow channel 131 is formed in the air multiplication structure 13. A jet outlet 132 connected to the gas flow channel 131 is formed on the air multiplication structure 13. The jet outlet 132 is slit-shaped and is suitable for spraying air in a direction close to the exhaust port 113. The heat dissipation node 2 is arranged outside the first shell 11 and includes a second shell 21 and an air supply module 22. An air supply cavity 211 for accommodating the air supply module 22 is formed in the second shell 21. The air supply cavity 211 is connected to the gas flow channels 131 in multiple load nodes 1.

[0037] It should be noted that the load module 12 refers to the functional components of the load node 1 used for computing, storage, and the like, such as the motherboard 12a, processor 12b, and hard disk 12c. The air supply module 22 can be any device capable of driving air flow to deliver air into the gas flow channel 131, such as a fan, or an air conditioning system with cooling capabilities. The type of air supply module 22 is not specifically limited. In one specific example, the air supply module 22 is a fan, which can reduce the cost of the heat dissipation node 2.

[0038] That is, the air supply chamber 211 is connected to the heat dissipation ducts 111 in the multiple load nodes 1 through the multiple gas flow channels 131 and the jet outlets 132. The air supply module 22 can drive the gas in the air supply chamber 211 into the gas flow channel 131. The gas flow channel 131 is connected to the heat dissipation duct 111 through the jet outlet 132. The gas entering the gas flow channel 131 enters the heat dissipation duct 111 through the jet outlet 132. It can be understood that since the jet outlet 132 is in the shape of a slit, the size of the jet outlet 132 can be well reduced, and the flow rate of the gas discharged through the jet outlet 132 can be increased. That is, the airflow in the gas flow channel 131 can be sprayed into the heat dissipation duct 111 at a high speed through the jet outlet 132. Figure 4 As shown, according to Bernoulli's principle, the gas ejected from the jet outlet 132 (i.e. Figure 4The faster the flow rate (the primary airflow shown in ), the lower the pressure in the jet outlet 132 area. Moreover, since the airflow ejected from the jet outlet 132 flows in the direction close to the exhaust port 113, a significant pressure difference is formed between the jet outlet 132 area and the air inlet 112 under the action of the Coanda effect. That is, the air pressure in the area close to the air inlet 112 of the air multiplication structure 13 is greater than the airflow at the jet outlet 132 and the area downstream of the jet outlet 132. Therefore, under the action of the pressure difference, the airflow ejected through the jet outlet 132 can drive a large amount of airflow to flow from the air inlet 112 toward the exhaust port 113 (that is, Figure 4 ), that is, a relatively small airflow at the jet outlet 132 drives a larger amount of airflow within the heat dissipation duct 111, thereby increasing the air intake within the heat dissipation duct 111. This can reduce the air volume requirement for the air supply module 22, thereby reducing the power consumption of the air supply module 22 and improving the heat dissipation efficiency of the load module 12. Furthermore, the relatively small airflow ejected from the jet outlet 132 causes a small vibration amplitude, which can prevent vibration-induced failures of load modules 12 such as hard disks 12c. This can reduce the vibration noise of the server cooling system 100 and improve the operational stability of the load node 1.

[0039] Furthermore, a single heat dissipation node 2 can simultaneously deliver airflow to the gas flow channels 131 within multiple load nodes 1, thereby significantly reducing the number of heat dissipation nodes 2 and thereby reducing the cost of the heat dissipation system 100 for the server. Furthermore, since the heat dissipation node 2 is disposed outside the first housing 11, i.e., the air supply module 22 is disposed outside the load node 1, compared to conventional solutions in which the heat dissipation fan is directly disposed on the motherboard, the space occupied by the air supply module 22 on the motherboard 12a of the load node 1 can be reduced. This allows for the placement of more load modules 12 with computing functions, such as processors 12b, or storage functions, such as hard disks 12c, on the motherboard 12a, thereby increasing the computing power density of the load node 1. Furthermore, the transfer of vibration and heat generated during the operation of the air supply module 22 to the load module 12 can be avoided, thereby improving the operational stability of the load node 1.

[0040] According to the heat dissipation system 100 for a server according to the first embodiment of the present application, by providing an air multiplication structure 13 within each heat dissipation duct 111, the air flow within the gas flow duct 131 can be ejected into the heat dissipation duct 111 at high speed through the jet outlet 132, thereby driving a large amount of air flow from the air inlet 112 toward the air outlet 113 to increase the air intake volume within the heat dissipation duct 111. At the same time, the smoothness and uniformity of the air flow within the heat dissipation duct 111 can be improved, the air volume requirement for the air supply module 22 can be reduced to reduce the power consumption of the air supply module 22, and the heat dissipation efficiency of the load module 12 can be improved. Furthermore, the air flow ejected from the jet outlet 132 is relatively small, and the vibration amplitude caused is small, which can prevent vibration from causing failure of the load module 12, such as the hard disk 12c, thereby reducing the vibration noise of the heat dissipation system 100 for the server and improving the operational stability of the load node 1.

[0041] In some embodiments, the air multiplying structure 13 is integrally formed with the first housing 11. Thus, the integrally formed structure not only ensures the structural and performance stability of the air multiplying structure 13 and the first housing 11, but also facilitates molding and simplifies manufacturing. Furthermore, the assembly parts and connection steps used to connect the air multiplying structure 13 and the first housing 11 are eliminated, resulting in low production costs and greatly improved assembly efficiency of the air multiplying structure 13 and the first housing 11, ensuring a reliable connection between the air multiplying structure 13 and the first housing 11. Furthermore, the integrally formed structure has higher overall strength and stability, and a longer lifespan.

[0042] According to some embodiments of the present application, the direction of airflow from the air inlet 112 toward the air outlet 113 is a first direction. Along the first direction, the distance between the air multiplying structure 13 and the air inlet 112 is smaller than the distance between the air multiplying structure 13 and the air outlet 113. In other words, the air multiplying structure 13 is disposed closer to the air inlet 112 than to the air outlet 113. It is understood that the closer the distance between the air multiplying structure 13 and the air inlet 112, the more stably a pressure differential can be formed between the air inlet 112 and the downstream side of the air multiplying structure 13, thereby more efficiently driving the airflow at the air inlet 112 toward the air outlet 113. Therefore, by shortening the distance between the air multiplying structure 13 and the air inlet 112, the air intake efficiency within the heat dissipation duct 111 can be improved, thereby enhancing the heat dissipation effect on the load module 12.

[0043] In a specific example, multiple load modules 12 include at least a motherboard 12a, a processor 12b, and a hard disk 12c. The processor 12b and the hard disk 12c are both disposed on the motherboard 12a. The processor 12b is disposed adjacent to the exhaust port 113, and the hard disk 12c is disposed adjacent to the air inlet 112. The air multiplication structure 13 is disposed between the processor 12b and the hard disk 12c. It is understood that in related art, a cooling fan is disposed between the processor and the hard disk. That is, the air multiplication structure 13 in this application is disposed in the area on the motherboard 12a for mounting a cooling fan, which can reduce modifications to the original internal architecture of the load node 1.

[0044] According to some embodiments of the present application, the jet outlet 132 is provided at one end of the air multiplication structure 13 close to the air inlet 112. Thus, the distance between the jet outlet 132 and the air inlet 112 can be shortened, and a pressure difference can be formed more stably between the air inlet 112 and the downstream side of the air multiplication structure 13, so as to more efficiently drive the air flow at the air inlet 112 toward the air outlet 113, thereby improving the air intake efficiency in the heat dissipation duct 111 and improving the heat dissipation effect on the load module 12. In addition, the arrangement of the structure at the jet outlet 132 is facilitated, such as Figure 4 As shown in FIG, to ensure that the airflow ejected through jet outlet 132 can flow along the outer wall of the air multiplying structure 13 to form a wall attachment effect, jet outlet 132 needs to be located at the end of the air multiplying structure 13 near the air inlet 112. Furthermore, in the direction from the air inlet 112 toward the air outlet 113, jet outlet 132 needs to be deflected toward the center of the gas flow channel 131. Therefore, by locating jet outlet 132 at the end of the air multiplying structure 13 near the air inlet 112, the shape of jet outlet 132 is facilitated to ensure the stability of the air multiplying structure 13.

[0045] According to some embodiments of the present application, the direction of airflow from the air inlet 112 toward the air outlet 113 is a first direction. Along the first direction, the distance between the air multiplying structure 13 and the air inlet 112 is smaller than the distance between the air multiplying structure 13 and the air outlet 113. The jet outlet 132 is located at the end of the air multiplying structure 13 near the air inlet 112. This shortens the distance between the air multiplying structure 13 and the air inlet 112, improves the air intake efficiency within the heat dissipation duct 111, and enhances the heat dissipation effect on the load module 12. Furthermore, the shape of the jet outlet 132 is conveniently configured to ensure the stability of the air multiplying structure 13.

[0046] According to some embodiments of the present application, Figure 5As shown, the direction of airflow from the air inlet 112 toward the air outlet 113 is the first direction. Each heat dissipation duct 111 is provided with multiple air multiplier structures 13 spaced apart along the second direction. The gas flow channels 131 of the multiple air multiplier structures 13 are all connected to the air supply cavity 211. The second direction is perpendicular to the first direction. In other words, the air supply module 22 can deliver airflow through the air supply cavity 211 to the gas flow channels 131 of the multiple air multiplier structures 13 within the same load node 1. Furthermore, the multiple jet outlets 132 of the multiple air multiplier structures 13 can deliver high-speed jet airflow from multiple locations in the second direction toward the direction near the air outlet 113, thereby driving the airflow at the air inlet 112 from multiple locations in the second direction into the heat dissipation duct 111. This effectively increases the air volume within the heat dissipation duct 111 and ensures uniform airflow distribution in the second direction, thereby improving the heat dissipation effect on the load module 12.

[0047] In a specific embodiment, the first direction is the front-to-back direction, the second direction is the left-to-right direction, and multiple load nodes 1 are arranged along the up-down direction. Compared with the height dimension, the load nodes 1 are larger in the front-to-back direction and the left-to-right direction. The multiple air multiplication structures 13 in each heat dissipation duct 111 are arranged along the left-to-right direction, which can increase the coverage area in the left-to-right direction to improve the heat dissipation effect.

[0048] According to some embodiments of the present application, an air inlet duct is defined between at least some adjacent air multiplying structures 13, and the jet outlet 132 is located on the side of the air multiplying structure 13 facing the air inlet duct. The width of the air inlet duct in the second direction gradually increases from the air inlet 112 to the air outlet 113. In other words, the flow area of the air inlet duct gradually increases from the air inlet 112 to the air outlet 113. This effectively reduces the resistance to airflow along the air inlet duct, thereby effectively increasing the air volume flowing through the air inlet duct to the load module 12, thereby improving the heat dissipation effect.

[0049] According to some embodiments of the present application, the jet outlet 132 is provided at the air inlet end of the air inlet duct. The central region of the air inlet duct in the second direction is the first central region. In the direction from the air inlet 112 to the air outlet 113, the jet outlet 132 extends obliquely toward the direction close to the first central region. This effectively reduces the deflection angle of the airflow in the gas flow channel 131 as it passes through the jet outlet 132 and enters the air inlet duct, thereby reducing air volume loss at the jet outlet 132.

[0050] According to some embodiments of the present application, Figure 4 and Figure 5As shown, a connecting harness is provided within the heat dissipation duct 111. Along a first direction, the load modules 12 located on opposite sides of the air multiplier structure 13 are electrically connected via the connecting harness. A wiring space 14 is defined between at least a portion of two adjacent air multiplier structures 13. At least a portion of the connecting harness is routed along the wiring space 14, and the jet outlet 132 is located on the side of the air multiplier structure 13 facing away from the wiring space 14. Thus, the defined wiring space 14 allows for better avoidance of the connecting harness. At the same time, the air multiplier structures 13 located on opposite sides of the wiring space 14 provide a good positioning effect for the connecting harness, ensuring the positional stability of the connecting harness after routing. Furthermore, the connecting harness can be prevented from obstructing the airflow discharged through the jet outlet 132, thereby ensuring that the air multiplier structure 13 enhances the reliability of the airflow within the heat dissipation duct 111.

[0051] In a specific embodiment, the air multiplying structures 13 are provided with a plurality of groups arranged at intervals along the second direction, each group includes two air multiplying structures 13 arranged at intervals along the second direction, a wiring space 14 is defined between the two air multiplying structures 13 in each group, and the sides of the two air multiplying structures 13 in each group that are opposite to each other along the second direction extend obliquely toward each other in the direction from the air inlet 112 toward the air outlet 113.

[0052] According to some embodiments of the present application, the two opposing side surfaces of the wiring space 14 along the second direction are respectively a first side surface and a second side surface. Along the first direction, the first side surface and the second side surface extend obliquely toward each other from the ends to the center. In other words, along the first direction, the wiring space 14 is wide at the ends and narrow in the middle, which can increase the width of the wiring space 14 at both ends, thereby reducing the difficulty of the connecting wire harness passing into the wiring space 14 from both ends, thereby reducing the difficulty of arranging the connecting wire harness.

[0053] In one specific embodiment, along the second direction, multiple air multiplying structures 13 define a plurality of alternating air inlet ducts and wiring spaces 14. That is, one side of any air multiplying structure 13 in the second direction serves as an air inlet duct, and the other side serves as a wiring space 14. In other words, the air inlet duct and wiring space 14 are located on opposite sides of the air multiplying structure 13 in the second direction. This ensures a regular layout of the multiple air inlet ducts and wiring spaces 14, while preventing the wiring from interfering with air flow within the air inlet duct, thereby ensuring adequate air flow within the air inlet duct.

[0054] According to some embodiments of the present application, Figure 6As shown, the second housing 21 further includes a plurality of distribution channels 212 in communication with the air supply cavity 211. The plurality of distribution channels 212 are located downstream of the air supply cavity 211. The plurality of distribution channels 212 are identical in number to the plurality of gas flow channels 131 within the same load node 1, and are in one-to-one communication with each other. In other words, the air supply cavity 211 is connected to the corresponding plurality of gas flow channels 131 via the plurality of distribution channels 212. Therefore, after the air flow in the air supply chamber 211 is driven by the air supply module 22 to enter the multiple distribution channels 212, diversion can be achieved through the multiple distribution channels 212, so as to better ensure the uniformity of the air flow distribution in the multiple distribution channels 212, that is, before the air flow in the air supply chamber 211 enters the multiple gas channels 131, the air flow can be evenly dispersed through the multiple distribution channels 212, so as to ensure the uniformity of the air flow distribution entering the multiple gas channels 131, thereby improving the uniformity of the air flow distribution in the heat dissipation duct 111 to ensure the uniformity of the heat dissipation of the load module 12 in the heat dissipation duct 111.

[0055] In one specific embodiment, the air supply module 22 is a fan, and each fan corresponds to multiple distribution channels 212, that is, each fan can drive airflow into the corresponding multiple distribution channels 212. As a result, the number of air supply modules 22 can be effectively saved, thereby reducing the cost of the heat dissipation node 2. In addition, the multiple distribution channels 212 are arranged at intervals along the second direction, the air supply cavity 211 and the multiple distribution channels 212 are arranged along the first direction, and the multiple air supply modules 22 are arranged in the air supply cavity 211 along the second direction, so that each air supply module 22 can better take into account the multiple distribution channels 212 and reduce the difficulty of connecting the multiple distribution channels 212 with the multiple gas channels 131.

[0056] According to some embodiments of the present application, Figure 1 and Figure 7 As shown, multiple load nodes 1 are arranged along a third direction, and the gas flow channels 131 extend along the third direction. Along the third direction, the two ends of the gas flow channels 131 extend to the opposite side surfaces of the first housing 11, respectively. The gas flow channels 131 corresponding to the multiple load nodes 1 are sequentially connected to form a delivery channel 15, and the air supply cavity 211 is connected to one end of the delivery channel 15. In other words, the heat dissipation node 2 delivers airflow to the gas flow channels 131 of the multiple load nodes 1 through the delivery channel 15 formed by the multiple gas flow channels 131. As a result, the pipeline connecting the air supply cavity 211 and the gas flow channels 131 can be eliminated, which can reduce the cost of the heat dissipation system 100 for the server and simplify the structure of the heat dissipation system 100 for the server, thereby improving the space utilization of the heat dissipation system 100 for the server.

[0057] In some embodiments, a locking structure is provided at the connection position of two adjacent gas flow channels 131 , and the locking structure can better maintain the connection position between the two gas flow channels 131 to improve the stability of the connection between the two adjacent gas flow channels 131 .

[0058] In some embodiments, a sealing structure is provided at the connection position of two adjacent gas flow channels 131 , thereby better improving the airtightness of the delivery channel 15 and enhancing the heat dissipation effect.

[0059] In some embodiments, the number of distribution channels 212 and the delivery channels 15 are the same and they are connected one-to-one. There is an arc transition between the distribution channels 212 and the corresponding delivery channels 15, which can reduce the flow resistance of the airflow in the distribution channel 212 when it enters the delivery channel 15, thereby reducing the air volume loss during the airflow delivery process.

[0060] According to some embodiments of the present application, Figure 7 As shown, two heat dissipation nodes 2 are provided, and the two ends of the delivery channel 15 along the third direction are respectively connected to the air supply cavities 211 of the two heat dissipation nodes 2. That is, along the third direction, one end of the delivery channel 15 is connected to the air supply cavity 211 of one of the heat dissipation nodes 2, and the other end of the delivery channel 15 is connected to the air supply of the other heat dissipation node 2, so that airflow can be delivered from both ends of the delivery channel 15 into the delivery channel 15 through the two heat dissipation nodes 2. It can be understood that when the number of load nodes 1 is too large, only providing a heat dissipation node 2 on one side of the load node group will result in a smaller air volume at the load node 1 farthest from the heat dissipation node 2. Therefore, by having two heat dissipation nodes 2 deliver airflow from both ends of the delivery channel 15 into the delivery channel 15, the uniformity of airflow distribution within multiple load nodes 1 can be better ensured, thereby ensuring uniform heat dissipation of multiple load nodes 1, thereby improving the reliability of the heat dissipation system 100 for the server.

[0061] According to some embodiments of the present application, the heat dissipation nodes 2 and the load node group are arranged along a third direction. That is, the arrangement direction of the heat dissipation nodes 2 and the load node group is consistent with the arrangement direction of the multiple load nodes 1, and the heat dissipation nodes 2 are located to one side of the multiple load nodes 1 in the third direction. This reduces the space occupied by the heat dissipation nodes 2 in a direction perpendicular to the third direction, resulting in a compact structure and a reasonable layout. Furthermore, it reduces the risk of vibrations generated during the operation of the heat dissipation nodes 2 being transmitted to the load nodes 1, thereby improving the operational stability of the load nodes 1.

[0062] According to some embodiments of the present application, a buffer material piece is provided between the heat dissipation node 2 and the load node 1. That is, the buffer material piece separates the heat dissipation node 2 and the load node 1 to prevent direct hard contact between the heat dissipation node 2 and the load node 1. Therefore, during the operation of the air supply module 22 of the heat dissipation node 2, when the air supply module 22 vibrates, causing the heat dissipation node 2 to vibrate, the buffer material piece can absorb the impact force generated by the vibration of the heat dissipation node 2 through flexible deformation to prevent the vibration from being transmitted to the load node 1. In other words, the buffer material piece can prevent the vibration generated during the operation of the heat dissipation node 2 from being transmitted to the load node 1, thereby preventing the vibration from damaging the load module 12, thereby improving the operational stability of the load node 1.

[0063] Among them, the buffer material piece can be made of rubber or sound-absorbing cotton and other materials that can absorb impact force through flexible deformation. The buffer material piece can be a gasket, a foot pad and other structures. The specific material and structure of the buffer material piece can be flexibly adjusted according to the specific usage scenario, and no specific restrictions are made here.

[0064] It should be noted that in the description of this application, the first direction, the second direction, and the third direction are perpendicular to each other. In a specific embodiment, the first direction is the front-to-back direction, the second direction is the left-to-right direction, and the third direction is the up-down direction. Multiple load nodes 1 are arranged in the up-down direction. Each heat dissipation duct 111 is provided with multiple air multiplication structures 13 arranged in the left-to-right direction. The gas flow channel 131 extends in the up-down direction, and the upper and lower ends of the gas flow channel 131 extend to the upper and lower surfaces of the first shell 11 respectively. Multiple load nodes 1 are stacked in sequence to form multiple delivery channels 15 extending in the up-down direction and arranged at intervals in the left-to-right direction. Two heat dissipation nodes 2 are provided, one heat dissipation node 2 is provided on the lower side of the load node 1 located at the bottom, and the other heat dissipation node 2 is provided on the upper side of the load node 1 located at the top.

[0065] In addition, the server cooling system 100 also includes two power supply nodes 3, one located at the top and one at the bottom of the load node group. This allows power to be supplied to multiple load nodes 1 and heat dissipation nodes 2 arranged vertically via the two power supply nodes 3. Specifically, one heat dissipation node 2 is disposed between the topmost load node 1 and the upper power supply node 3, while the other heat dissipation node 2 is disposed between the bottommost load node 1 and the lower power supply node 3, allowing the two heat dissipation nodes 2 to draw power from the two power supply nodes 3, respectively.

[0066] Specifically, if Figure 8As shown, the process for constructing a server cooling system 100 is as follows: First, based on the server's cooling requirements, the number of cooling nodes 2 and their placement within the cabinet are selected. It is understood that the higher the server's cooling requirements, the more cooling nodes 2 are required. Furthermore, since different locations on a server generate different amounts of heat, cooling nodes 2 can be placed in high-heat areas of the server to ensure effective cooling. This allows the server's temperature to be controlled within a safe range, improving server operational stability.

[0067] The second step is to determine the number of air supply modules 22 within the heat dissipation node 2 and the number of distribution channels 212, ensuring that the number of distribution channels 212 is the same as and corresponds one-to-one with the number of gas channels 131 within the load node 1. Thus, by determining the number of air supply modules 22 within the heat dissipation node 2, the air volume that the heat dissipation node 2 can be determined. By ensuring that the number of distribution channels 212 is the same as and corresponds one-to-one with the number of gas channels 131 within a single load node 1, airflow can be stably delivered to multiple gas channels 131 through multiple distribution channels 212.

[0068] The third step is to adjust the structure of the air multiplier structure 13 based on the flow field distribution analysis. The flow field distribution analysis can reveal the airflow distribution of the heat dissipation duct 111 under the influence of the air multiplier structure 13. Adjusting the structure of the air multiplier structure 13, such as the size and airflow direction of the jet outlet 132, can improve heat dissipation efficiency and achieve uniform airflow.

[0069] The fourth step is to seal each node connection within the server cabinet and perform an airtightness check on the entire cabinet. These node connections include the connection between the gas flow channels 131 of two adjacent load nodes 1 and the connection between the air supply cavity 211 of the heat dissipation node 2 and the gas flow channel 131 of the load node 1. This ensures the overall airtightness of the server cooling system 100, preventing air leakage at the node connections that could affect airflow efficiency, thereby improving the cooling efficiency of the server cooling system 100.

[0070] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0071] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A heat dissipation system for a server, characterized in that: include: A load node group, the load node group including a plurality of load nodes, the load nodes including a first housing and a plurality of load modules disposed within the first housing, a heat dissipation duct formed within the first housing, the heat dissipation duct having an air inlet and an air outlet, at least a portion of the load modules being located within the heat dissipation duct, each heat dissipation duct being provided with at least one air multiplier structure, a gas flow channel formed within the air multiplier structure, a jet outlet formed on the air multiplier structure communicating with the gas flow channel, the jet outlet being slit-shaped and adapted to eject airflow toward a direction close to the air outlet; A heat dissipation node is arranged outside the first shell and includes a second shell and an air supply module. An air supply cavity for accommodating the air supply module is formed in the second shell, and the air supply cavity is connected to the gas flow channels in multiple load nodes.

2. The heat dissipation system for a server according to claim 1, characterized in that: The direction of air flow from the air inlet toward the air outlet is a first direction. Along the first direction, the distance between the air multiplying structure and the air inlet is smaller than the distance between the air multiplying structure and the air outlet; and / or, the jet outlet is arranged at one end of the air multiplying structure close to the air inlet.

3. The heat dissipation system for a server according to claim 1, wherein: The direction of air flow from the air inlet toward the air outlet is the first direction, and each of the heat dissipation ducts is provided with a plurality of air multiplication structures arranged at intervals along the second direction. The gas flow channels of the plurality of air multiplication structures are all connected to the air supply cavity, and the second direction is perpendicular to the first direction.

4. The heat dissipation system for a server according to claim 3, characterized in that: An air inlet channel is defined between at least two adjacent air multiplying structures, and the jet outlet is located on the side of the air multiplying structure facing the air inlet channel. In the direction from the air inlet to the air outlet, the width of the air inlet channel in the second direction gradually increases.

5. The heat dissipation system for a server according to claim 4, characterized in that: The jet outlet is arranged at the air inlet end of the air inlet duct, and the central area of the air inlet duct in the second direction is the first central area. In the direction from the air inlet to the air outlet, the jet outlet extends obliquely toward the direction close to the first central area.

6. The heat dissipation system for a server according to claim 3, characterized in that: A connecting harness is provided in the heat dissipation duct. Along the first direction, the load modules located on opposite sides of the air multiplication structure are electrically connected through the connecting harness. A wiring space is defined between at least part of the two adjacent air multiplication structures. At least part of the connecting harness is routed along the wiring space, and the jet outlet is located on the side of the air multiplication structure away from the wiring space.

7. The heat dissipation system for a server according to claim 6, characterized in that: The two opposite side surfaces of the wiring space along the second direction are respectively a first side surface and a second side surface. Along the first direction, the first side surface and the second side surface are inclined and extended toward each other in the direction from the two ends to the center.

8. The heat dissipation system for a server according to claim 3, characterized in that: A plurality of distribution flow channels connected to the air supply cavity are also formed in the second shell. The plurality of distribution flow channels are located on the downstream side of the air supply cavity. The plurality of distribution flow channels are the same in number as the plurality of gas flow channels in the same load node and are connected one-to-one.

9. The heat dissipation system for a server according to claim 1, characterized in that: The multiple load nodes are arranged along the third direction, and the gas flow channel extends along the third direction. Along the third direction, the two ends of the gas flow channel respectively extend to the opposite side surfaces of the first shell. The gas flow channels corresponding to the multiple load nodes are connected in sequence to form a conveying flow channel, and the air supply chamber is connected to one end of the conveying flow channel.

10. The heat dissipation system for a server according to claim 9, characterized in that: There are two heat dissipation nodes, and the two ends of the delivery channel along the third direction are respectively connected to the air supply cavities of the two heat dissipation nodes; and / or, the heat dissipation node and the load node group are arranged along the third direction.

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