Liquid cooling device and server

Abstract

The invention relates to a liquid cooling device and a server. The heat conduction substrate is used for being thermally coupled to the heating element and is provided with at least one heat exchange cavity. The covering plate is provided with a liquid inlet and a liquid outlet. And the liquid inlet and the liquid outlet are respectively used for feeding and discharging cooling liquid. The flow guide plate is arranged between the covering plate and the heat conduction substrate. The side, close to the covering plate, of the guide plate is provided with a liquid inlet main flow channel, a liquid outlet main flow channel, at least one liquid inlet secondary flow channel and at least one liquid outlet secondary flow channel, wherein the liquid inlet main flow channel and the liquid outlet main flow channel are parallel to each other. The at least one liquid inlet secondary flow channel and the at least one liquid outlet secondary flow channel are located between the liquid inlet main flow channel and the liquid outlet main flow channel, and the at least one liquid inlet secondary flow channel and the liquid inlet main flow channel are not parallel to each other. And the liquid inlet main runner and the liquid outlet main runner are respectively communicated with the liquid inlet and the liquid outlet. The at least one liquid inlet secondary flow channel is communicated with the liquid inlet main flow channel and the at least one heat exchange cavity, and the at least one liquid outlet secondary flow channel is communicated with the liquid outlet main flow channel and the at least one heat exchange cavity.

Description

Technical Field

[0001] The present application relates to a liquid cooling device and a server, and in particular to a liquid cooling device and a server with a diversion function. Background Art

[0002] With the rapid development of electronic component technology, the heat generated by heat sources in servers, such as central processing units (CPUs) or graphics processing units (GPUs), continues to increase. In view of this, manufacturers often use liquid cooling components, such as water blocks, to dissipate heat from heat sources in servers, effectively dissipating the heat generated by the heat sources through cooling fluid.

[0003] However, current liquid cooling systems suffer from the effects of long fins and high coolant viscosity, which reduces the heat transfer capacity of the coolant as it flows through the fins. Therefore, effectively improving the heat transfer capacity of liquid cooling components has become a major challenge in liquid cooling system design. Summary of the Invention

[0004] The present invention provides a liquid cooling device and a server, thereby effectively improving the heat exchange capacity of the liquid cooling device.

[0005] One embodiment of the present invention provides a liquid cooling device for thermally coupling to a heating element. The liquid cooling device includes a heat-conducting substrate, a cover plate, and a guide plate. The heat-conducting substrate is used for thermally coupling to the heating element and has at least one heat exchange chamber. The cover plate has a liquid inlet and a liquid outlet. The liquid inlet and the liquid outlet are respectively used for supplying a cooling liquid in and out. The guide plate is arranged between the cover plate and the heat-conducting substrate. The guide plate has a liquid inlet main channel and a liquid outlet main channel arranged in parallel to each other, and at least one liquid inlet secondary channel and at least one liquid outlet secondary channel arranged in parallel to each other on one side close to the cover plate. The at least one liquid inlet secondary channel and the at least one liquid outlet secondary channel are located between the liquid inlet main channel and the liquid outlet main channel, and the at least one liquid inlet secondary channel and the liquid inlet main channel are not parallel to each other. The liquid inlet main channel and the liquid outlet main channel are connected to the liquid inlet and the liquid outlet, respectively. At least one liquid inlet secondary channel connects the liquid inlet main channel to at least one heat exchange chamber. At least one liquid outlet secondary channel communicates with the liquid outlet primary channel and at least one heat exchange chamber.

[0006] One embodiment of the present invention provides a server comprising a housing, a heating element, and a liquid cooling device. The heating element is disposed within the housing. The liquid cooling device comprises a heat-conducting substrate, a cover plate, and a guide plate. The heat-conducting substrate is thermally coupled to the heating element and has at least one heat exchange chamber. The cover plate has a liquid inlet and a liquid outlet. The liquid inlet and the liquid outlet are respectively used to allow a coolant to enter and exit. The guide plate is disposed between the cover plate and the heat-conducting substrate. The guide plate comprises a liquid inlet main channel and a liquid outlet main channel arranged parallel to each other, and at least one liquid inlet secondary channel and at least one liquid outlet secondary channel arranged parallel to each other on a side near the cover plate. The at least one liquid inlet secondary channel and the at least one liquid outlet secondary channel are located between the liquid inlet main channel and the liquid outlet main channel, and the at least one liquid inlet secondary channel and the liquid inlet main channel are not parallel to each other. The liquid inlet main channel and the liquid outlet main channel are connected to the liquid inlet and the liquid outlet, respectively. The at least one liquid inlet secondary channel connects the liquid inlet main channel to the at least one heat exchange chamber. At least one liquid outlet secondary channel is connected to the liquid outlet primary channel and at least one heat exchange chamber.

[0007] According to the liquid cooling device and server provided in the above-mentioned embodiments, since the guide plate structure of this liquid cooling device has a main liquid inlet channel and a secondary liquid inlet channel, the cooling fluid can first pass through the main liquid inlet channel of the guide plate and then flow into the secondary liquid inlet channel, thereby achieving the effect of diverting the cooling fluid, thereby enhancing the heat exchange capacity of the liquid cooling device.

[0008] The above description of the content of the present invention and the following description of the embodiments are intended to demonstrate and explain the principles of the present invention, and to provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 3D schematic diagram of a liquid cooling device and a server according to an embodiment of the present invention.

[0010] Figure 2 for Figure 1 Schematic diagram of the decomposition.

[0011] Figure 3 for Figure 2 A partial three-dimensional schematic diagram of .

[0012] Figure 4 For the Figure 3 Schematic diagram of the cross section drawn by the 4-4 cutting line.

[0013] Figure 5 for Figure 2 A partial three-dimensional schematic diagram of .

[0014] Figure 6 For the Figure 5 Schematic cross-sectional view drawn by the 6-6 cutting line.

[0015] Figures 7 to 10for Figure 1 Flow diagram of the liquid cooling device.

[0016] Description of the accompanying drawings:

[0017] 30. Heating element

[0018] 11. Thermally conductive substrate

[0019] 111. Heat exchange chamber

[0020] 112. Shell

[0021] 113. Separator

[0022] 114. Heat sink fin assembly

[0023] 115. Thermal contact surface

[0024] 1121. Groove

[0025] 12. Covering plate

[0026] 121. Liquid inlet

[0027] 122. Liquid outlet

[0028] 13. Deflector

[0029] 131. Liquid inlet main channel

[0030] 132. Main outlet channel

[0031] 133. Liquid inlet secondary flow channel

[0032] 134. Liquid outlet secondary channel

[0033] 135. Guide channel group DETAILED DESCRIPTION

[0034] See also Figure 1 . Figure 1 The figure is a perspective schematic diagram of a liquid cooling device and server according to an embodiment of the present invention. The server 1 of this embodiment includes a housing 20, a heating element 30, and a liquid cooling device 10. The heating element 30 can be, for example, a central processing unit (CPU) mounted on a motherboard or a graphics processor (GPU) mounted on a graphics card. The heating element 30 is disposed within the housing 20.

[0035] See also Figure 2 . Figure 2 for Figure 1Schematic diagram of an exploded view. The liquid cooling device 10 of this embodiment may be, for example, a water-cooled plate. The liquid cooling device 10 includes a heat-conducting substrate 11, a cover plate 12, and a guide plate 13. The heat-conducting substrate 11 is thermally coupled to the heating element 30 and has a heat exchange chamber 111 and a thermal contact surface 115. The thermal contact surface faces away from the heat exchange chamber 111. The thermal contact surface 115 is thermally coupled to the heating element 30.

[0036] The cover plate 12 has a liquid inlet 121 and a liquid outlet 122. The liquid inlet 121 and the liquid outlet 122 are respectively used for supplying and discharging a cooling liquid (not shown). The cooling liquid can be, for example, a refrigerant or water.

[0037] Please also see Figure 3 and Figure 4 . Figure 3 for Figure 2 A partial three-dimensional schematic diagram of . Figure 4 For the Figure 3 The cross-sectional schematic diagram is drawn by the 4-4 cutting line of the cover plate 12. The guide plate 13 is arranged between the cover plate 12 and the heat-conducting substrate 11. The guide plate 13 has a liquid inlet main channel 131 and a liquid outlet main channel 132 arranged parallel to each other and a plurality of liquid inlet sub-channels 133 and a plurality of liquid outlet sub-channels 134 arranged parallel to each other on the side close to the cover plate 12. The above-mentioned parallel to each other means exactly parallel or slightly non-parallel due to manufacturing tolerances. The plurality of liquid inlet sub-channels 133 and the plurality of liquid outlet sub-channels 134 are between the liquid inlet main channel 131 and the liquid outlet main channel 132, and the plurality of liquid inlet sub-channels 133 and the liquid inlet main channel 131 are not parallel to each other, for example, they are perpendicular. In addition, a liquid inlet sub-channel 133 and two liquid outlet sub-channels 134 adjacent to each other together constitute a guide channel group 135. The number of guide channel groups 135 can be multiple, and these guide channel groups 135 are side by side with each other.

[0038] The liquid inlet main channel 131 and the liquid outlet main channel 132 respectively connect the liquid inlet 121 and the liquid outlet 122. The plurality of liquid inlet sub-channels 133 connect the liquid inlet main channel 131 and the heat exchange chamber 111. The plurality of liquid outlet sub-channels 134 connect the liquid outlet main channel 132 and the heat exchange chamber 111.

[0039] In this embodiment, the guide plate 13 includes a supporting plate portion 136, an annular protrusion 137, a diverter rib 138, a converging rib 139 and a plurality of separating ribs 140. The annular protrusion 137 protrudes from the supporting plate portion 136 and has two opposite side wall portions 1361. The diverter rib 138 and the converging rib 139 are arranged side by side between the two side wall portions 1361. The diverter rib 138 and the converging rib 139 respectively surround the main liquid inlet channel 131 and the main liquid outlet channel 132 with the two side wall portions 1361. The opposite ends of these separating ribs 140 are respectively connected to the diverter rib 138 and the converging rib 139, and these separating ribs 140 respectively block between any two adjacent liquid inlet sub-channels 133 and liquid outlet sub-channels 134.

[0040] In this embodiment, the diverter rib 138 has a plurality of first stop protrusions 1381 and a plurality of diverter recesses 1382. The first stop protrusions 1381 and the diverter recesses 1382 are arranged alternately, and the first stop protrusions 1381 correspond to the liquid outlet secondary flow channels 134. The diverter recesses 1382 correspond to the liquid inlet secondary flow channels 133, so that the liquid inlet main flow channel 131 is connected to the liquid inlet secondary flow channels 133 through the diverter recesses 1382. The liquid inlet main flow channel 131 is stopped by the first stop protrusions 1381 and is disconnected from the liquid outlet secondary flow channels 134.

[0041] In this embodiment, the converging rib 139 has a plurality of second stop protrusions 1391 and a plurality of converging recesses 1392. The second stop protrusions 1391 and the converging recesses 1392 are arranged in a staggered manner, and the second stop protrusions 1391 correspond to the liquid inlet sub-channels 133. The converging recesses 1392 correspond to the liquid outlet sub-channels 134, so that the liquid outlet main channel 132 communicates with the liquid outlet sub-channels 134 through the converging recesses 1392. The liquid outlet main channel 132 is stopped by the second stop protrusions 1391 and is disconnected from the liquid inlet sub-channels 133.

[0042] See also Figure 5 and Figure 6 . Figure 5 for Figure 2 A partial three-dimensional schematic diagram of . Figure 6 For the Figure 5 Schematic cross-sectional view drawn by the 6-6 cutting line.

[0043] In this embodiment, the number of at least one heat exchange chamber 111 can be multiple. These heat exchange chambers 111 are arranged side by side and correspond to the liquid inlet sub-flow channels 133 and the liquid outlet sub-flow channels 134, respectively. For example, the thermally conductive substrate 11 includes a shell 112 and a plurality of partition elements 113. The shell 112 has a recess 1121. The plurality of partition elements 113 are located within the recess 1121 and divide the recess 1121 into a plurality of heat exchange chambers 111.

[0044] In this embodiment, the thermally conductive substrate 11 further includes a plurality of heat dissipation fin assemblies 114 . The heat dissipation fin assemblies 114 are respectively disposed in the heat exchange chambers 111 .

[0045] Next, the flow of the cooling fluid when the liquid cooling device 10 dissipates heat from the heating element 30 will be described. Figures 7 to 10 . Figures 7 to 10 for Figure 1 Flow diagram of the liquid cooling device.

[0046] First, if Figure 7 As shown, the cooling fluid is driven to flow into the liquid inlet 121 along the direction A, and then flows from the liquid inlet 121 into the liquid inlet main channel 131 of the guide plate 13. Figure 7 and Figure 8 As shown, after the cooling fluid flows along direction B and is evenly diffused in the main liquid inlet channel 131, it flows along direction C through the diversion recess 1382 of the diversion rib 138 to the secondary liquid inlet channels 133 to achieve the diversion effect. Figure 7 and Figure 9 As shown, the cooling fluid then flows downwardly along direction D to the heat exchange chamber 111, so as to spray the cooling fluid toward each fin 114 in the heat exchange chamber 111 and improve the heat exchange efficiency of the cooling fluid to the fin 114. Figure 9 As shown, the cooling fluid sprayed toward the fins 114 is then diffused along the direction E so that the cooling fluid can fully exchange heat with the fins 114. Figure 9 and Figure 10 As shown, the fluid to be cooled flows to the opposite ends of the fins 114 in each heat exchange chamber 111, and then flows upward along the direction F to the liquid outlet sub-channel 134. Figure 8 and Figure 10 As shown, the cooling fluid in the secondary outlet channel 134 flows along the direction G through the converging recess 1392 of the converging rib 139 to the primary outlet channel 132 to achieve the converging effect. Figure 8 and Figure 10 As shown, the cooling fluid flowing into the liquid outlet main channel 132 is then gathered along the direction H to continue flowing out from the liquid outlet 122 along the direction I.

[0047] In the above embodiment, each flow channel group 135 is composed of one liquid inlet sub-flow channel 133 and two liquid outlet sub-flow channels 134, but the present invention is not limited thereto. In other embodiments, each flow channel group is composed of one liquid inlet sub-flow channel and one liquid outlet sub-flow channel.

[0048] According to the liquid cooling device and server provided in the above-described embodiment, the guide plate structure of the liquid cooling device comprises a primary inlet channel and a secondary inlet channel. This allows the cooling fluid to flow through the guide plate's primary inlet channel before flowing into the secondary inlet channel, thereby effectively dividing the cooling fluid. Furthermore, the recess is divided into multiple heat exchange chambers by a partitioning element, and the fins are correspondingly divided into multiple sections, shortening the fin lengths to enhance the heat exchange capacity of the liquid cooling device.

[0049] Although the present invention is disclosed above with respect to the aforementioned embodiments, it is not intended to limit the present invention. Any person skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification. The various technical features of the above-mentioned embodiments can be combined in any manner. To simplify the description, not all possible combinations of the various technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. A liquid cooling device for thermally coupling to a heating element, characterized in that: The liquid cooling device comprises: a heat-conducting substrate, the heat-conducting substrate being used for thermally coupling to the heating element and having at least one heat exchange chamber; a cover plate having a liquid inlet and a liquid outlet, wherein the liquid inlet and the liquid outlet are respectively used for supplying and discharging a cooling liquid; and a guide plate disposed between the cover plate and the heat-conducting substrate, the guide plate having, on a side close to the cover plate, a liquid inlet main channel and a liquid outlet main channel disposed in parallel with each other, and at least one liquid inlet secondary channel and at least one liquid outlet secondary channel disposed in parallel with each other, the at least one liquid inlet secondary channel and the at least one liquid outlet secondary channel being located between the liquid inlet main channel and the liquid outlet main channel, and the at least one liquid inlet secondary channel and the liquid inlet main channel being non-parallel to each other; Among them, the liquid inlet main channel and the liquid outlet main channel are connected to the liquid inlet and the liquid outlet respectively, the at least one liquid inlet secondary channel is connected to the liquid inlet main channel and the at least one heat exchange chamber, and the at least one liquid outlet secondary channel is connected to the liquid outlet main channel and the at least one heat exchange chamber.

2. The liquid cooling device according to claim 1, characterized in that The number of the at least one liquid outlet sub-flow channel is two, and the at least one liquid inlet sub-flow channel is located between the two liquid outlet sub-flow channels, and together they constitute at least one flow guide channel group.

3. The liquid cooling device according to claim 2, characterized in that There are multiple at least one flow guide channel group, and the flow guide channel groups are arranged side by side.

4. The liquid cooling device according to claim 3, characterized in that The guide plate includes a supporting plate portion, an annular convex portion, a diverter rib, a converging rib and a plurality of separating ribs. The annular convex portion protrudes from the supporting plate portion and has two opposite side wall portions. The diverter rib and the converging rib are arranged side by side between the two side wall portions. The diverter rib and the converging rib respectively surround the main liquid inlet channel and the main liquid outlet channel with the two side wall portions. The opposite ends of the separating rib are respectively connected to the diverter rib and the converging rib, and the separating ribs respectively block between any two adjacent liquid inlet sub-channels and the liquid outlet sub-channels.

5. The liquid cooling device according to claim 4, characterized in that: The diverter rib has a plurality of first stop protrusions and a plurality of diverter recesses, the first stop protrusions and the diverter recesses are arranged alternately, and the first stop protrusions correspond to the liquid outlet secondary flow channels, respectively, and the diverter recesses correspond to the liquid inlet secondary flow channels, respectively, so that the liquid inlet main flow channel is connected with the liquid inlet secondary flow channel through the diverter recesses, and the liquid inlet main flow channel is stopped by the first stop protrusions and is not connected with the liquid outlet secondary flow channel.

6. The liquid cooling device according to claim 5, characterized in that The converging rib has a plurality of second stop protrusions and a plurality of converging recesses, the second stop protrusions and the converging recesses are arranged alternately, and the second stop protrusions correspond to the liquid inlet sub-flow channels respectively, and the converging recesses correspond to the liquid outlet sub-flow channels respectively, so that the liquid outlet main channel is connected with the liquid outlet sub-flow channel through the converging recesses, and the liquid outlet main channel is stopped by the second stop protrusions and is not connected with the liquid inlet sub-flow channel.

7. The liquid cooling device according to claim 6, characterized in that There are multiple heat exchange chambers, which are arranged side by side and correspond to the liquid inlet sub-flow channel and the liquid outlet sub-flow channel respectively.

8. The liquid cooling device according to claim 7, characterized in that: The thermally conductive substrate comprises: a shell portion having a groove; and A plurality of partition elements are located in the groove and divide the groove into the heat exchange chambers.

9. The liquid cooling device according to claim 8, characterized in that The heat-conducting substrate further includes a plurality of heat-dissipating fin groups, and the heat-dissipating fin groups are respectively disposed in the heat exchange chambers.

10. A server, characterized in that: include: a housing; a heating element disposed in the housing; as well as A liquid cooling device comprising: a heat-conducting substrate, the heat-conducting substrate being used for thermally coupling to the heating element and having at least one heat exchange chamber; a cover plate having a liquid inlet and a liquid outlet, wherein the liquid inlet and the liquid outlet are respectively used for supplying and discharging a cooling liquid; and a guide plate disposed between the cover plate and the heat-conducting substrate, the guide plate having, on a side close to the cover plate, a liquid inlet main channel and a liquid outlet main channel disposed in parallel with each other, and at least one liquid inlet secondary channel and at least one liquid outlet secondary channel disposed in parallel with each other, the at least one liquid inlet secondary channel and the at least one liquid outlet secondary channel being located between the liquid inlet main channel and the liquid outlet main channel, and the at least one liquid inlet secondary channel and the liquid inlet main channel being non-parallel to each other; Among them, the liquid inlet main channel and the liquid outlet main channel are connected to the liquid inlet and the liquid outlet respectively, the at least one liquid inlet secondary channel is connected to the liquid inlet main channel and the at least one heat exchange chamber, and the at least one liquid outlet secondary channel is connected to the liquid outlet main channel and the at least one heat exchange chamber.

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