Partition shielding packaging structure and manufacturing method thereof

Abstract

The invention discloses a partition shielding packaging structure and a manufacturing method thereof, and the method comprises the steps: mounting a chip on the front surface of a substrate, mounting a plurality of passive components in a region, which needs to be subjected to partition electromagnetic shielding, on the front surface of the substrate, and enabling the passive components to be connected with a grounding welding pad on the substrate; putting the substrate on which the plurality of chips and the plurality of passive components are attached into a reflow oven for reflow soldering, wherein the plurality of passive components after reflow soldering form an electromagnetic shielding wall between the chips needing electromagnetic shielding; and forming a plastic package layer on the front surface of the substrate, wherein the plastic package layer covers the chip and the electromagnetic shielding wall. The electromagnetic shielding effect between the chips in the packaging structure can be improved, the technological process is shortened, and the technological cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and more particularly, to a partitioned shielding packaging structure and a manufacturing method thereof. Background Art

[0002] As mobile phone functions increase, the number of components integrated inside the phone continues to increase, and the RF chips on the mobile phone motherboard are developing towards modularization and miniaturization. Modular RF chips have serious electromagnetic interference between modules, which will affect the RF functions of the components. In order to protect the normal operation of the devices, it is necessary to introduce a partitioned electromagnetic shielding structure.

[0003] Currently, partitioned shielding is primarily achieved by creating metal trenches in the plastic package or by vertically connecting metal wires between components. These methods suffer from complex packaging processes, long production cycles, high costs, and poor shielding effectiveness. Summary of the Invention

[0004] The purpose of the present invention is to provide a partitioned shielding packaging structure and a manufacturing method thereof, so as to improve the electromagnetic shielding effect between chips in the packaging structure, shorten the process flow and reduce the process cost.

[0005] To achieve the above objectives, in a first aspect, the present invention proposes a method for manufacturing a partitioned shielding packaging structure, comprising: Mounting a chip on the front side of the substrate, and mounting a plurality of passive components on the front side of the substrate in the area where electromagnetic shielding is required, wherein the passive components are connected to the ground pads on the substrate; placing the substrate mounted with the plurality of chips and the plurality of passive components into a reflow furnace for reflow soldering, wherein the plurality of passive components after reflow soldering form an electromagnetic shielding wall between the chips that need to be electromagnetically shielded; A plastic packaging layer is formed on the front surface of the substrate, and the plastic packaging layer covers the chip and the electromagnetic shielding wall.

[0006] Optionally, the passive component includes a shell, a first electrode and a second electrode are respectively provided at both ends of the shell, the direction from the first electrode to the second electrode is the length direction of the passive component, and a metal intermediate layer structure connecting the first electrode and the second electrode is provided inside the shell.

[0007] Optionally, the metal intermediate layer structure includes a plurality of metal sheets, two ends of the metal sheets are respectively connected to the first electrode and the second electrode, and the plurality of metal sheets are arranged parallel to each other and spaced apart in the housing; Alternatively, the metal intermediate layer structure includes a plurality of metal columns, two ends of the metal columns are respectively connected to the first electrode and the second electrode, and the plurality of metal columns are arranged in parallel and spaced apart in the housing.

[0008] Optionally, mounting multiple passive components in an area requiring partitioned electromagnetic shielding includes: printing solder paste on a plurality of ground pads located in a partitioned electromagnetic shielding area on a substrate; The passive component is mounted laterally on the ground pad through solder paste, so that part of the first electrode is wrapped by the solder paste, one end of the passive component where the second electrode is provided is left empty, and the length direction of the passive component is parallel to the surface of the substrate.

[0009] Optionally, during the reflow soldering process, the solder particles in the solder paste melt into liquid solder balls. Under the action of the surface tension and volume contraction of the liquid solder balls, one end of the passive component provided with the second electrode is lifted up. After cooling and solidification, the length direction of the passive component is basically perpendicular to the surface of the substrate. The multiple upright passive components form the electromagnetic shielding wall, and the top of the electromagnetic shielding wall is higher than the top surface of the chip.

[0010] Optionally, after forming the plastic sealing layer on the front surface of the substrate, the method further includes: Grinding and thinning the plastic packaging layer to expose at least the second electrode of the passive component; A metal material is formed to cover the surface and sidewalls of the plastic packaging layer, and the metal material is brought into contact with the second electrode to form an electromagnetic shielding layer.

[0011] In a second aspect, the present invention further proposes a partitioned shielding packaging structure, characterized in that it includes: A substrate, wherein a plurality of chips are provided on the front side of the substrate; A plurality of passive components are arranged in the partitioned electromagnetic shielding area between the chips on the front side of the substrate, the passive components are connected to the ground pads on the substrate, and the plurality of passive components form an electromagnetic shielding wall; The plastic packaging layer covers the front surface of the substrate and covers the multiple chips and the multiple passive components.

[0012] Optionally, the passive component includes a housing, a first electrode and a second electrode are respectively provided at two ends of the housing, a direction from the first electrode to the second electrode is a length direction of the passive component, a metal intermediate layer structure is provided inside the housing, and two ends of the metal intermediate layer structure are respectively connected to the first electrode and the second electrode; The first electrode is connected to the ground pad located in the partitioned electromagnetic shielding area through soldering, and the length direction of the passive component is perpendicular to the surface of the substrate.

[0013] Optionally, the metal intermediate layer structure includes a plurality of metal sheets, two ends of the metal sheets are respectively connected to the first electrode and the second electrode, and the plurality of metal sheets are arranged parallel to each other and spaced apart in the housing; Alternatively, the metal intermediate layer structure includes a plurality of metal columns, two ends of the metal columns are respectively connected to the first electrode and the second electrode, and the plurality of metal columns are arranged in parallel and spaced apart in the housing.

[0014] Optionally, an electromagnetic shielding layer is further included, wherein the electromagnetic shielding layer covers the surface and side walls of the plastic packaging layer, and the electromagnetic shielding layer is electrically connected to the second electrode of the passive component.

[0015] The beneficial effects of the present invention are: The present invention adopts SMT surface mounting technology in the packaging process. By mounting multiple passive components in the area that needs to be shielded on the substrate, multiple grounded passive components are used as electromagnetic shielding walls to improve the electromagnetic shielding effect between chips. At the same time, the packaging method adopted by the present invention can complete the production of the electromagnetic shielding structure at the SMT site. All components, functional devices and substrate connections are completed at the SMT site, without the need for new sites, thereby shortening the process flow. Furthermore, after the plastic packaging is completed, the plastic cover is ground and thinned to expose the plastic packaging layer on the upper end of the passive component. Then, in the subsequent process, a metal shell covering the outer layer is manufactured to connect the passive components and complete the production of the grounding path. The metal intermediate layer structure inside the internal passive component, the grounding pad of the substrate and the metal layer on the outer surface of the package are combined into an electromagnetic shielding structure, thereby further improving the electromagnetic shielding effect.

[0016] The system of the present invention has other features and advantages that will be apparent from or will be described in detail in the accompanying drawings and subsequent detailed description incorporated herein, which together serve to explain the specific principles of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, in which like reference numerals generally represent like components.

[0018] Figure 1 This is a schematic structural diagram of a passive component in Example 1 of the present invention.

[0019] Figure 2 This is a schematic structural diagram of another passive component in Example 1 of the present invention.

[0020] Figure 3 This is a top view of the chip and passive components mounted on the substrate in Example 1 of the present invention.

[0021] Figure 4 This is a side view of the chip and passive components mounted on the substrate in Example 1 of the present invention.

[0022] Figure 5 This is a top view of the substrate after reflow soldering in Example 1 of the present invention.

[0023] Figure 6 This is a side view of the substrate after reflow soldering in Example 1 of the present invention.

[0024] Figure 7 This is a cross-sectional view of forming a plastic encapsulation layer on the front surface of the substrate in Example 1 of the present invention.

[0025] Figure 8 This is a cross-sectional view of the plastic sealing layer after thinning in Example 2 of the present invention.

[0026] Figure 9 This is a cross-sectional view after an electromagnetic shielding layer is formed on the plastic packaging layer in Example 2 of the present invention.

[0027] Figure 10 Schematic diagram of the arrangement of multiple passive components in other embodiments of the present invention. DETAILED DESCRIPTION

[0028] The present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention may be implemented in various forms and is not limited to the embodiments set forth herein. Rather, these embodiments are provided to make the present invention more thorough and complete and to fully convey the scope of the present invention to those skilled in the art. Example 1

[0029] This embodiment provides a method for manufacturing a partitioned shielding packaging structure, including: S1: Mounting a chip 3 on the front surface of a substrate 1, and mounting a plurality of passive components 2 on the front surface of the substrate 1 in the area where electromagnetic shielding is required, wherein the passive components 2 are connected to the ground pads 4 on the substrate 1; In this embodiment, the package structure to be manufactured is a radio frequency module, and the corresponding chip 3 is a radio frequency chip 3. Chip 3 mounting areas are provided on the provided substrate 1 at intervals, and solder pads corresponding to the device pins of the chip 3 are provided in the chip 3 mounting areas. Based on the distribution of multiple chips 3 in the designed radio frequency module, adjacent chips 3 with electromagnetic interference can be determined, thereby determining the areas on the substrate 1 that require partitioned electromagnetic shielding. Corresponding ground pads 4 are pre-fabricated in the partitioned electromagnetic shielding areas on the substrate 1 for mounting passive components 2. One passive component 2 can be mounted using one or two solder pads.

[0030] The passive component 2 in this embodiment includes a housing 201, with a first electrode 202 and a second electrode 203 provided at both ends of the housing 201. The direction from the first electrode 202 to the second electrode 203 is the length direction of the passive component 2. A metal intermediate layer structure 204 connecting the first electrode 202 and the second electrode 203 is provided inside the housing 201. The passive component 2 mainly realizes electromagnetic shielding function through its internal intermediate metal layer. In one example, Figure 1 As shown, the metal intermediate layer structure 204 includes a plurality of metal sheets, both ends of which are connected to the first electrode 202 and the second electrode 203 respectively, and the plurality of metal sheets are arranged parallel to each other and spaced apart in the housing 201. In another example, as Figure 2 As shown, the metal intermediate layer structure 204 may also include a plurality of metal pillars, the two ends of which are respectively connected to the first electrode 202 and the second electrode 203, and the plurality of metal pillars are arranged parallel to each other and spaced apart in the housing 201. The structure of the intermediate metal layer of the passive component 2 in this embodiment can select one of the above two structures, or some of the multiple passive components 2 constituting the electromagnetic shielding wall can adopt Figure 1 The metal sheet intermediate layer structure shown in FIG. 2 is used as the passive component 2. Figure 2 The metal pillar intermediate layer structure shown.

[0031] The housing 201 of the passive component 2 is made of insulating material, such as ceramic, and the materials of the first electrode 202 , the second electrode 203 and the metal intermediate layer structure 204 can be selected from metal materials such as copper, aluminum, gold, and silver.

[0032] like Figure 3 and Figure 4As shown, this step performs SMT mounting, printing solder paste 5 on multiple grounding pads 4 located in the partitioned electromagnetic shielding area on the substrate 1; then the passive component 2 is horizontally mounted on the grounding pad 4 through the solder paste 5, so that part of the first electrode 202 is wrapped by the solder paste 5, and one end of the passive component 2 on which the second electrode 203 is provided is left empty, and the length direction of the passive component 2 is parallel to the surface of the substrate 1.

[0033] This step completes the mounting of all chips 3 simultaneously, that is, the solder paste 5 is printed on the pads in the mounting area of the chip 3 at the same time, and then the multiple chips 3 are mounted on the corresponding pads in sequence.

[0034] It should be noted that the reason why the passive components 2 are mounted horizontally on the substrate 1 in this step is that the passive components 2 are usually placed horizontally in the carrier tape, so the passive components are all mounted horizontally. This can improve the efficiency and success rate of mounting the passive components 2. If the passive components are mounted vertically on the substrate, the following problems will occur: (1) The contact surface between the vertically placed passive components and the carrier is large, making it difficult to remove them from the carrier during mounting; (2) Vertical placement of passive components requires the use of thicker carrier tapes, which shortens the length of the carrier tape carried by a single reel and reduces placement efficiency; (3) The top leakage area of the vertical passive components is small, and a smaller suction nozzle is required during placement. This makes it difficult to ensure the vacuum degree of the suction nozzle, and it is easy to fail to successfully remove the passive components from the carrier tape; (4) When taking out the passive components placed vertically in the carrier tape for placement, the passive components are prone to tilting due to the instability of the vertical components, which affects the placement success rate.

[0035] Therefore, adopting the method of horizontally mounting the passive components 2 can effectively avoid the above problems and improve the mounting efficiency and success rate.

[0036] In addition, since the interior of the passive component 2 is basically a hollow structure, it is light in weight. After being horizontally mounted, the passive component can be more easily pulled up by the surface tension of the solder paste in the subsequent reflow soldering step to complete the "tombstone erection".

[0037] S2: placing the substrate 1 mounted with the plurality of chips 3 and the plurality of passive components 2 into a reflow furnace for reflow soldering, wherein the plurality of passive components 2 after reflow soldering form an electromagnetic shielding wall between the chips 3 that need to be electromagnetically shielded; In this step, the substrate 1 that has completed the mounting step is put into the reflow furnace for reflow soldering. During the reflow soldering process, the solder particles in the solder paste 5 melt into liquid solder balls. Under the action of the surface tension and volume contraction of the liquid solder balls, one end of the passive component 2 provided with the second electrode 203 is tilted. After cooling and solidification, the length direction of the passive component 2 is basically perpendicular to the surface of the substrate 1. The multiple passive components 2 that are erected form the electromagnetic shielding wall, and the top of the electromagnetic shielding wall is higher than the top surface of the chip 3. The structure after reflow soldering is as shown in FIG. Figure 5 and Figure 6 shown.

[0038] Specifically, the passive component 2 that has been mounted has solder paste 5 located below one end of the first electrode 202, while the other end located at the second electrode 203 is left empty. After reflow, soldering occurs on one side of the solder paste 5 of the passive component 2. Under the action of temperature and surface tension, the solder ball melts and the overall volume shrinks, causing the empty end of the passive component 2 to tilt up and then be fixed in an approximately vertical shape after cooling. When the passive component 2 is soldered to the substrate 1, the internal metal intermediate layer structure 204 is connected to the ground pad 4 on the substrate 1 through the first electrode 202, and multiple passive components 2 are combined to form an electromagnetic shielding wall structure between the chips 3. The first electrode 202 can be connected to one ground pad 4, or the two ends of the first electrode 202 can be connected to two ground pads 4 respectively. When the metal intermediate layer structure 204 inside the passive component 2 uses multiple metal sheets, the plane of the metal sheet is perpendicular to the connection line between the chips 3 that need to be shielded.

[0039] In this embodiment, multiple passive components 2 are arranged to form a straight electromagnetic shielding wall. In other embodiments, such as Figure 10 As shown, the arrangement shape of multiple passive components 2 can also be arranged into L-shape, C-shape, ring, rectangle, etc. according to actual needs, so as to surround or semi-surround a chip 3 to enhance the electromagnetic shielding effect.

[0040] S3: forming a plastic packaging layer 6 on the front surface of the substrate 1 , wherein the plastic packaging layer 6 covers the chip 3 and the electromagnetic shielding wall.

[0041] Specific as Figure 7 As shown, the chip 3 and multiple passive components 2 are packaged together through a plastic packaging layer 6, and an electromagnetic shielding wall is formed by multiple grounded passive components 2 to achieve a partitioned electromagnetic shielding effect between the chips 3.

[0042] The method of this embodiment adopts SMT surface mounting technology during the packaging process. By mounting multiple passive components 2 in the area where partition shielding is required on the substrate 1, and using multiple grounded passive components 2 as electromagnetic shielding walls, the electromagnetic shielding effect between the chips 3 is improved. At the same time, this packaging method can complete the production of the electromagnetic shielding structure at the SMT site. The connection between all components and functional devices and the substrate 1 is completed at the SMT site, without the need for adding new sites, thereby shortening the process flow. Example 2

[0043] This embodiment, based on the first embodiment, adds an additional electromagnetic shielding layer 7 on the plastic packaging layer 6 to connect with the passive components to form a grounding path, and combines the metal intermediate layer structure 204 inside the passive component 2, the grounding pad 4 of the substrate 1 and the metal electromagnetic shielding layer 7 on the outer surface of the package into an electromagnetic shielding structure. Figure 7 The package structure shown includes the following steps: S4: Grinding and thinning the plastic packaging layer 6 to expose at least the second electrode 203 of the passive component 2; like Figure 8 As shown, in this step, after the plastic encapsulation is completed, the top surface of the plastic encapsulation layer 6 is ground and thinned to expose the end of the second electrode 203 of the passive component 2. In a specific implementation, the plastic encapsulation layer 6 can be ground and thinned by mechanical grinding or CMP process. To ensure sufficient contact between the subsequent electromagnetic shielding layer 7 and the metal intermediate layer inside the passive component 2, it is preferred that the second electrode 203 on the passive component 2 is partially or completely ground so that the intermediate layer of the passive component 2 is exposed from the plastic encapsulation layer 6.

[0044] S5 : forming a metal material covering the surface and sidewall of the plastic packaging layer 6 , and making the metal material contact the second electrode 203 to form an electromagnetic shielding layer 7 .

[0045] like Figure 9 As shown, in this step, an electromagnetic shielding layer 7 is formed on the thinned plastic encapsulation layer 6, connecting to the passive component 2, completing the ground path. The electromagnetic shielding layer 7 can be formed by sputtering a metal material such as aluminum or copper. The electromagnetic shielding layer 7, the metal intermediate layer structure 204 inside the passive component, and the grounding pad 4 are combined to form an electromagnetic shielding structure. By using the passive component 2 as an EMI-enhancing ground path, the electromagnetic shielding effect is further enhanced while achieving a partitioned shielding effect. Example 3

[0046] like Figure 7 As shown, this embodiment provides a partitioned shielding packaging structure, including: A substrate 1, with a plurality of chips 3 provided on the front surface of the substrate 1; A plurality of passive components 2 are arranged in a partitioned electromagnetic shielding area between the chips 3 on the front side of the substrate 1. The passive components 2 are connected to the ground pads 4 on the substrate 1. The plurality of passive components 2 form an electromagnetic shielding wall. The plastic packaging layer 6 covers the front surface of the substrate 1 and covers the multiple chips 3 and the multiple passive components 2.

[0047] In which, the passive component 2 includes a shell 201, and a first electrode 202 and a second electrode 203 are respectively provided at both ends of the shell 201. The direction from the first electrode 202 to the second electrode 203 is the length direction of the passive component. A metal intermediate layer structure 204 is provided inside the shell 201, and the two ends of the metal intermediate layer structure 204 are respectively connected to the first electrode 202 and the second electrode 203; the first electrode 202 is connected to the grounding pad 4 located in the partitioned electromagnetic shielding area through soldering, and the length direction of the passive component 2 is perpendicular to the surface of the substrate 1.

[0048] In one example, if Figure 1 As shown, the metal intermediate layer structure 204 includes a plurality of metal sheets, both ends of which are connected to the first electrode 202 and the second electrode 203 respectively, and the plurality of metal sheets are arranged parallel to each other and spaced apart in the housing 201; In another example, Figure 2 As shown, the metal intermediate layer structure 204 includes a plurality of metal pillars, both ends of which are connected to the first electrode 202 and the second electrode 203 respectively, and the plurality of metal pillars are arranged in parallel and spaced apart in the housing 201 .

[0049] The partitioned shielding packaging structure of this embodiment can be obtained by the manufacturing method of the above-mentioned embodiment 1. Example 4

[0050] like Figure 9 As shown, this embodiment provides another partitioned shielding packaging structure. Based on Example 3, this embodiment further adds an electromagnetic shielding layer 7, which covers the surface and side walls of the plastic packaging layer 6, and the electromagnetic shielding layer 7 is electrically connected to the second electrode 203 of the passive component 2.

[0051] By adding an additional electromagnetic shielding layer 7 on the plastic packaging layer 6 and connecting it to the passive components to form a grounding path, the metal intermediate layer structure 204 inside the passive component 2, the grounding pad 4 of the substrate 1 and the metal electromagnetic shielding layer 7 on the outer surface of the package are combined into an electromagnetic shielding structure, thereby increasing the electromagnetic shielding effect.

[0052] The partitioned shielding packaging structure of this embodiment can be obtained through the manufacturing method of Example 2.

[0053] While various embodiments of the present invention have been described above, the above description is intended to be illustrative, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A method for manufacturing a partitioned shielding packaging structure, characterized in that: include: Mounting a chip on the front side of the substrate, and mounting a plurality of passive components on the front side of the substrate in the area where electromagnetic shielding is required, wherein the passive components are connected to the ground pads on the substrate; placing the substrate mounted with the plurality of chips and the plurality of passive components into a reflow furnace for reflow soldering, wherein the plurality of passive components after reflow soldering form an electromagnetic shielding wall between the chips that need to be electromagnetically shielded; A plastic packaging layer is formed on the front surface of the substrate, and the plastic packaging layer covers the chip and the electromagnetic shielding wall.

2. The method for manufacturing a partitioned shielding packaging structure according to claim 1, characterized in that: The passive component includes a shell, a first electrode and a second electrode are respectively provided at both ends of the shell, the direction from the first electrode to the second electrode is the length direction of the passive component, and a metal intermediate layer structure connecting the first electrode and the second electrode is provided inside the shell.

3. The method for manufacturing a partitioned shielding packaging structure according to claim 2, wherein: The metal intermediate layer structure includes a plurality of metal sheets, two ends of which are respectively connected to the first electrode and the second electrode, and the plurality of metal sheets are arranged parallel to each other and spaced apart in the housing; Alternatively, the metal intermediate layer structure includes a plurality of metal columns, two ends of the metal columns are respectively connected to the first electrode and the second electrode, and the plurality of metal columns are arranged in parallel and spaced apart in the housing.

4. The method for manufacturing a partitioned shielding packaging structure according to claim 2, wherein: Mounting multiple passive components in areas requiring zoned electromagnetic shielding includes: printing solder paste on a plurality of ground pads located in a partitioned electromagnetic shielding area on a substrate; The passive component is mounted laterally on the ground pad through solder paste, so that part of the first electrode is wrapped by the solder paste, one end of the passive component where the second electrode is provided is left empty, and the length direction of the passive component is parallel to the surface of the substrate.

5. The method for manufacturing a partitioned shielding packaging structure according to claim 4, characterized in that: During the reflow soldering process, the solder particles in the solder paste melt into liquid solder balls. Under the action of the surface tension and volume contraction of the liquid solder balls, one end of the passive component with the second electrode is lifted up. After cooling and solidification, the length direction of the passive component is basically perpendicular to the surface of the substrate. The multiple upright passive components form the electromagnetic shielding wall, and the top of the electromagnetic shielding wall is higher than the top surface of the chip.

6. The method for manufacturing a partitioned shielding packaging structure according to claim 5, characterized in that: After forming the plastic sealing layer on the front side of the substrate, the following steps are also included: Grinding and thinning the plastic packaging layer to expose at least the second electrode of the passive component; A metal material is formed to cover the surface and sidewalls of the plastic packaging layer, and the metal material is brought into contact with the second electrode to form an electromagnetic shielding layer.

7. A partitioned shielding packaging structure, characterized in that: include: A substrate, wherein a plurality of chips are provided on the front side of the substrate; A plurality of passive components are arranged in the partitioned electromagnetic shielding area between the chips on the front side of the substrate, the passive components are connected to the ground pads on the substrate, and the plurality of passive components form an electromagnetic shielding wall; The plastic packaging layer covers the front surface of the substrate and covers the multiple chips and the multiple passive components.

8. The partitioned shielding packaging structure according to claim 7, characterized in that: The passive component includes a housing, a first electrode and a second electrode are respectively provided at two ends of the housing, a direction from the first electrode to the second electrode is a length direction of the passive component, a metal intermediate layer structure is provided inside the housing, and two ends of the metal intermediate layer structure are respectively connected to the first electrode and the second electrode; The first electrode is connected to the ground pad located in the partitioned electromagnetic shielding area through soldering, and the length direction of the passive component is perpendicular to the surface of the substrate.

9. The partitioned shielding packaging structure according to claim 8, characterized in that: The metal intermediate layer structure includes a plurality of metal sheets, two ends of which are respectively connected to the first electrode and the second electrode, and the plurality of metal sheets are arranged parallel to each other and spaced apart in the housing; Alternatively, the metal intermediate layer structure includes a plurality of metal columns, two ends of the metal columns are respectively connected to the first electrode and the second electrode, and the plurality of metal columns are arranged in parallel and spaced apart in the housing.

10. The partitioned shielding packaging structure according to claim 8, characterized in that: It also includes an electromagnetic shielding layer, which covers the surface and side walls of the plastic packaging layer and is electrically connected to the second electrode of the passive component.

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