Wafer cell door opening and closing assembly and leveling method

Abstract

This invention proposes a door assembly and leveling method for a wafer cassette. The assembly includes: a door panel with a sealing gasket on its side facing the wafer transport port, the lower section of which is connected to a connecting block via fasteners; the connecting block is connected to a connecting base plate via fastening bolts, and the connecting base plate is slidably connected to a carrier plate; the connecting base plate is connected to the output end of a cylinder assembly; the output end of the cylinder assembly moves along the X direction; several adjusting bolts, all threadedly connected to the connecting block, with their lower ends passing through the connecting block and abutting against the upper surface of the connecting base plate; adjusting bolts along the X direction closer to the door panel extending beyond the connecting block along the Z direction by a length L1; adjusting bolts along the X direction farther from the door panel extending beyond the connecting block along the Z direction by a length L2, where L2 > L1. This invention achieves a uniform sealing effect by increasing the deformation of the door panel.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment technology, and particularly relates to a switch door assembly and leveling method for a wafer cassette. Background Technology

[0002] Vertical furnace heat treatment equipment is an important process equipment in semiconductor manufacturing processes.

[0003] The vertical furnace heat treatment equipment is equipped with a wafer transfer area for transferring wafers.

[0004] A robotic arm is needed to move the wafers from the wafer box to the wafer boat;

[0005] The crystal boat is fed into the furnace tube via a lifting mechanism;

[0006] After the process is completed, the crystal boat is removed from the furnace tube by a lifting mechanism;

[0007] The wafers in the crystal boat are transferred to the wafer box using a robotic arm;

[0008] During the wafer transfer stage, the wafer is completely exposed to the wafer transfer area. Under high temperature conditions, the wafer surface will react with oxygen in the air, affecting the coating yield.

[0009] Therefore, the wafer transport area requires a relatively sealed environment. Nitrogen gas is injected to replace the oxygen in the area, thus maintaining a nitrogen environment in the wafer transport area.

[0010] In order to transfer the wafer, there is a wafer transfer port between the wafer cassette and the wafer transfer area. The transfer port is opened when the wafer is loaded and closed after loading is completed.

[0011] It is necessary to prevent gas exchange between the wafer transfer area and the outside environment through the wafer transfer port in order to ensure that a nitrogen environment is maintained in the wafer transfer area.

[0012] In the existing technology, a door opening and closing assembly that can move back and forth is designed to open or close the transmission port as needed.

[0013] The drawback of the existing technology is that, due to the need to avoid the wafer transport path, the door opening and closing device is a cantilever structure, and the sealing effect will decrease as the length of the cantilever (door panel 5) increases. Summary of the Invention

[0014] The purpose of this invention is to provide a door opening and closing assembly and a leveling method for a wafer cassette. In the open state, the door panel 5 maintains a certain angle with the wafer transfer port 13. When the door is closed, a uniform sealing effect is achieved by increasing the deformation of the door panel 5. The technical solution adopted is as follows:

[0015] A wafer cassette door opening and closing assembly includes:

[0016] Door panel 5 has a sealing gasket 12 on the side facing the wafer transfer port 13, and its lower section is connected to the connecting block 4 by fasteners; the connecting block 4 is connected to the connecting base plate 3 by fastening bolts 9, the outer diameter of the fastening bolts 9 is smaller than the inner diameter of the mounting holes on the connecting plate 3, and the fastening bolts 9 are threadedly connected to the connecting block 4; the connecting base plate 3 can move along the X direction.

[0017] Several adjusting bolts 8 are threadedly connected to the connecting block 4, with their lower ends passing through the connecting block 4 and abutting against the upper surface of the connecting base plate 3; the adjusting bolts 8 that are close to the door panel 5 along the X direction extend out of the connecting block 4 by a length L1 along the Z direction; the adjusting bolts 8 that are far away from the door panel 5 along the X direction extend out of the connecting block 4 by a length L2 along the Z direction, where L2 > L1.

[0018] Preferably, the connecting block 4 is provided with a plurality of adjusting screws 6, the adjusting screws 6 being threadedly connected to the connecting block 4; the adjusting screws 6 abut against and are perpendicular to the adjusting bolt 8.

[0019] Preferably, the connecting block 4 is provided with a plurality of fastening screws 7, which abut against and are perpendicular to the fastening bolt 9.

[0020] Preferably, the connecting base plate 3 and the carrier plate 1 are connected by a linear guide unit 2.

[0021] Preferably, the linear guide unit 2 includes:

[0022] The guide rail is fixed to the upper surface of the carrier plate 1;

[0023] The slider is fixed to the lower surface of the connecting base plate 3, and a groove adapted to the guide rail is formed on it.

[0024] Preferably, the connecting base plate (3) is connected to the output end of the cylinder assembly (14); the output end of the cylinder assembly (14) moves along the X direction; the cylinder assembly 14 includes:

[0025] A rotary cylinder, the cylinder body of which is fixed to the carrier plate 1, and its output shaft passes through the carrier plate 1 along the Z direction and extends to the connection between the base plate 3 and the carrier plate 1;

[0026] The swing arm is sleeved on the output shaft of the rotary cylinder and connected to the output shaft of the rotary cylinder by fasteners. It is also connected to the connecting base plate 3 by fasteners.

[0027] A leveling method for a wafer cassette door assembly, based on the aforementioned wafer cassette door assembly, includes the following steps:

[0028] Step 1: Tighten the connecting block 4 to the mounting hole of the base plate 3 using the fastening bolt 9 until the fastening bolt 9 abuts against the groove on the step of the connecting block 4; then tighten the adjusting bolt 8 to the connecting block 4.

[0029] Step 2: Tighten the fastening bolt 9 in the reverse direction. At this time, the lower end of the fastening bolt 9 moves up to the lower end face of the mounting hole of the base plate 3.

[0030] Step 3: Adjust the adjusting bolts 8 so that the length of the adjusting bolts 8 that are closer to the door panel 5 along the X direction extending out of the connecting block 4 along the Z direction is less than the length of the adjusting bolts 8 that are farther away from the door panel 5 along the X direction extending out of the connecting block 4 along the Z direction.

[0031] Compared with the prior art, the advantages of the present invention are:

[0032] 1. When the door is open, the door switch panel and the transmission port maintain a certain angle. When the door is closed, the door panel 5 is deformed to achieve a uniform seal.

[0033] The principle of achieving uniform sealing is as follows: the reason why existing technologies cannot seal is because the cantilever structure and the pressure at the top are insufficient, resulting in insufficient deformation of the sealing gasket to seal.

[0034] In this invention, adjusting the preset angle allows for sufficient pressure at the top. When the final pressure exceeds a threshold, the maximum compression of the sealing gasket is achieved. Preferably, even when the force exceeds the threshold, uniform deformation can still be achieved.

[0035] 2. No thread-locking adhesive is needed. A set screw is used to hold the fastening bolt in place, and the set screw and the fastening bolt interlock to prevent loosening. In the existing technology, due to frequent opening and closing and the vibration caused by collisions, the fastening bolts of the door opening and closing assembly are prone to loosening after long-term use, requiring periodic maintenance and tightening. If thread-locking adhesive is used, the adhesive will release impurities, affecting the coating quality. Attached Figure Description

[0036] Figure 1 Side view of the wafer transport port after the wafer cassette is closed by the switch door assembly;

[0037] Figure 2 for Figure 1 The main view;

[0038] Figure 3 Force analysis diagram for the switch door assembly used in wafer cassettes;

[0039] Figure 4 A diagram showing the state of a wafer cassette door assembly before closing the wafer transfer port;

[0040] Figure 5(a) is a schematic diagram of the installation of adjusting and fastening set screws;

[0041] Figure 5(b) is a side view of Figure 5(a);

[0042] Figure 6 This is a modified diagram of the door opening and closing assembly for a wafer cassette.

[0043] Among them, 1-carrier plate, 2-linear rail unit, 3-connecting base plate, 4-connecting block, 5-door panel;

[0044] 6-Adjusting set screw, 7-Tightening set screw, 8-Adjusting bolt, 9-Tightening bolt;

[0045] 10-Wafer transfer area frame, 11-Wafer box, 12-Sealing gasket, 13-Wafer transfer port, 14-Cylinder assembly. Detailed Implementation

[0046] The wafer cassette door assembly and leveling method of the present invention will now be described in more detail with reference to the schematic diagrams, which illustrate preferred embodiments of the invention. It should be understood that those skilled in the art can modify the invention described herein while still achieving its advantageous effects. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the invention.

[0047] like Figures 1-4 A wafer cassette door opening and closing assembly, comprising:

[0048] Door panel 5 has a sealing gasket 12 on the side facing the wafer transfer port 13, and its lower section is connected to connecting block 4 by fasteners; connecting block 4 is connected to connecting base plate 3 by fastening bolts 9, fastening bolts 9 and connecting plate 3 are clearance-fitted, and connecting block 4 is threaded; connecting base plate 3 is slidably connected to carrier plate 1; connecting base plate 3 is connected to the output end of cylinder assembly 14; the output end of cylinder assembly 14 moves along the X direction;

[0049] Several adjusting bolts 8 are threadedly connected to the connecting block 4, with their lower ends passing through the connecting block 4 and abutting against the upper surface of the connecting base plate 3; the adjusting bolts 8 that are close to the door panel 5 along the X direction extend out of the connecting block 4 by a length L1 along the Z direction; the adjusting bolts 8 that are far away from the door panel 5 along the X direction extend out of the connecting block 4 by a length L2 along the Z direction, where L2 > L1 and L1 is greater than 0.

[0050] As shown in Figure 5(b), Figure 4 As shown, the adjusting bolt 8 on the left is the adjusting bolt near the door panel 5.

[0051] Furthermore, the connecting block 4 is provided with several adjusting screws 6, which are threadedly connected to the connecting block 4; the adjusting screws 6 abut against the adjusting bolt 8 and are perpendicular to the adjusting bolt 8.

[0052] Several fastening screws 7 are provided on the connecting block 4. The fastening screws 7 abut against the fastening bolts 9 and are perpendicular to the fastening bolts 9.

[0053] In this embodiment, the base plate 3 and the carrier plate 1 are connected by a linear guide unit 2.

[0054] Linear rail unit 2 includes:

[0055] The guide rail is fixed to the upper surface of the carrier plate 1;

[0056] The slider is fixed to the lower surface of the connecting base plate 3, and a groove adapted to the guide rail is opened on it.

[0057] Cylinder assembly 14 includes:

[0058] A rotary cylinder, the cylinder body of which is fixed to the carrier plate 1, and its output shaft passes through the carrier plate 1 along the Z direction and extends to the connection between the base plate 3 and the carrier plate 1;

[0059] The swing arm is sleeved on the output shaft of the rotary cylinder and connected to the output shaft of the rotary cylinder by fasteners. It is also connected to the connecting base plate 3 by fasteners.

[0060] That is, the rotating cylinder generates a component force along the X direction.

[0061] To facilitate wafer transfer, one or more wafer transfer ports 13 are provided on the wafer transfer area frame 10. When transferring wafers, the wafer box 11 blocks the wafer transfer ports 13, and the wafer transfer area formed by the wafer transfer area frame 10 remains sealed. When not transferring wafers, a wafer box is required to block the wafer transfer ports 13 using a door opening and closing assembly.

[0062] like Figure 4 As shown, the wafer cassette door opening and closing assembly is a moving component. When not transferring wafers, it needs to move to the wafer transfer port 13 to block the wafer transfer port 13. When transferring wafers, the wafer transfer port needs to be opened. Figure 4 In the middle, after the door opening and closing assembly is leveled, the door panel 5 is in a forward tilting state, and the arrow indicates the tilting process of the door panel 5.

[0063] Figure 4 When the door is open, the door panel maintains a certain angle with the transmission port. When the door is closed, the sealing effect is achieved by increasing the deformation of the door panel.

[0064] The carrier board 1 serves as the base for the switch door assembly for the wafer box and is fixed to the wafer transport area frame 10. All other parts are mounted on the carrier board 1.

[0065] The cylinder assembly 14 serves as the drive assembly for the wafer cell's door opening and closing mechanism, controlling the opening and closing of the wafer cell's door opening and closing mechanism.

[0066] The linear guide unit 2 is mounted on the carrier plate 1 and serves as a guide component for the wafer box door opening and closing assembly, controlling the movement direction of the wafer box door opening and closing assembly.

[0067] A connecting base plate 3 is installed above the linear guide unit 2 for transition and to support the adjusting bolts 8 of the connecting block 4.

[0068] The connecting block 4 is installed on the connecting base plate 3 and is fixed to the connecting base plate 3 by fastening bolts 9.

[0069] Door panel 5 is a sealing component of the wafer box's opening and closing assembly, used to seal the wafer transfer port 13.

[0070] A sealing gasket 12 is embedded in the door panel. Since both the door panel and the wafer transfer area frame are metal parts, it is impossible to guarantee a complete fit, so a sealing gasket is required.

[0071] The door opening and closing assembly moves forward and backward along the X-axis under the drive of the cylinder assembly along the linear guide unit 2. Each time the door closes, it will collide and squeeze with the wafer transfer area frame 10, compressing the sealing gasket 12, which will generate vibration.

[0072] Prolonged vibration will cause the fastening bolt 9 to loosen. Therefore, a fixing screw (fixing screw 7) is added laterally to the fastening bolt. The fixing screw and the fastening bolt 9 are perpendicular to each other and interlock to create a mechanical interlock.

[0073] The connecting block 4 will only loosen when both types of bolts (fastening bolt 9 and adjusting bolt 8) are loosened simultaneously.

[0074] Specifically, the front end of the adjusting set screw is pressed against the thread of the adjusting bolt.

[0075] Because of the mechanical interlock, the fastening bolts and the fixing screws of the fastening bolts will not loosen even with frequent vibration, eliminating the need for periodic maintenance and thread sealant.

[0076] Since the area where the wafer transfer port is located is on the path of the robot arm handling the wafer, there cannot be any driving or fixing components in front of the wafer transfer port (away from the wafer box, i.e., the wafer transfer area). The opening and closing door assembly needs to adopt a cantilever structure.

[0077] When a wafer needs to be transferred, the opening and closing door assembly moves along the X direction to open the wafer transfer port 13 and moves to the outside of the space facing the wafer cassette opening.

[0078] The space that the wafer box opening faces is the wafer transport area.

[0079] The wafers inside the wafer case need to be horizontally removed, and there must be no mechanical structures within the space facing the opening of the wafer case. The cantilever structure is designed to place the door opening assembly outside the space facing the wafer case opening.

[0080] In existing technologies, such as Figure 3 As shown in the middle left figure, the door panel 5, driven by the cylinder, presses against the wafer transfer area frame 10 along the linear guide unit.

[0081] At this moment, the linear guide unit is located at point a, and the force applied to point a by the cylinder assembly is Fa.

[0082] The lower edge of the door panel corresponds to point b, the distance of which is L(ab), and the preload force at this point is Fb. Fb is the force applied to the door panel 5 by the wafer transfer area frame 10 at point b.

[0083] The position at the upper edge of the door panel corresponds to point c, the distance of which is L(ac), and the reaction force generated by the wafer transfer area frame 10 on the door panel 5 at this point is Fc.

[0084] Fc, or point c, is the force applied by the wafer transport region frame 10 to the door plate 5.

[0085] "Lower edge of door panel" and "upper edge of door panel" both refer to the position where the sealing gasket 12 contacts the wafer transfer port 13.

[0086] "Location of linear guide unit" refers to the location where cylinder assembly 14 is installed.

[0087] According to: Torque M = Force F × Distance L

[0088] Therefore, force F = torque M / distance L

[0089] like Figure 3 As shown in the left-middle diagram, the sealing torque for the entire door panel 5, from bottom to top, is constant and all comes from the rotary cylinder. That is, the torque at points a, b, and c is the same, all originating from the cylinder assembly.

[0090] Because the upper edge of the door panel is far from the cylinder, the reaction force for the sealing effect is very small. In other words, only a small force is needed to cause the door panel to deform and bend, resulting in seal failure and leakage.

[0091] To improve the sealing effect, the reaction force generated by the wafer transfer area frame 10 on the door plate 5 needs to be increased. As mentioned above, relying solely on the torque provided by the cylinder assembly cannot increase the reaction force of the wafer transfer area frame 10 on the door plate 5.

[0092] Given that L(ac) is much larger than L(ab) and the distance is fixed, the reaction force cannot be increased by reducing the distance; the reaction force can only be increased through other means.

[0093] When the door panel deforms, the door panel 5 itself has plasticity.

[0094] Specifically, when the door panel 5 is driven by the cylinder and presses against the wafer transfer area frame 10 along the linear guide unit, the wafer transfer area frame 10 will apply force to the door panel 5, and the door panel 5 will generate a reaction force in the opposite direction. The magnitude of the reaction force will increase with the deformation size.

[0095] According to: Deformation Y = Force F × Distance L × Distance L × Distance L / (3 × E × I)

[0096] Therefore, force F = deformation Y × 3 × E × I / (distance L × distance L × distance L)

[0097] Increasing the deformation Y increases the force F, such as... Figure 6 .

[0098] Therefore, an adjusting bolt 8 is added to the connecting block 4. By adjusting the bolt 8, the door panel is tilted toward the wafer transfer area frame 10, resulting in a pre-deformation.

[0099] When the door panel presses against the wafer transfer area frame, the door panel is flattened by the wafer transfer area frame under the action of the cylinder.

[0100] like Figure 3 As shown in the middle right figure, the door panel 5, driven by the cylinder, presses against the wafer transfer area frame 10 along the linear guide unit.

[0101] like Figure 3 As shown, in the prior art, when the door panel 5 is in the open state, it is vertical. When closed, the door panel 5 is tilted to the rear, and the door panel 5 and the wafer transfer area frame 10 are tilted at an angle. The sealing ring between the door panel 5 and the wafer transfer area frame 10 cannot produce the same amount of compression deformation, so it cannot be sealed.

[0102] In this embodiment, the door panel 5 has a preset forward tilt angle. When closed, the door panel 5 is vertical, and the door panel 5 and the wafer transfer area frame 10 are parallel. The sealing gasket is compressed evenly, and the amount of compression is just the same.

[0103] Figure 3 In the diagram, state A represents the state before the gate panel 5 closes the wafer transfer port 13 (open state); state B represents the state after the gate panel 5 closes the wafer transfer port 13 (closed state).

[0104] When pre-deformed, the wafer transport region frame 10 will generate a large reaction force on the gate plate 5 at point c, allowing the gate plate to press firmly against the wafer transport region frame 10, such as... Figure 6 As shown.

[0105] In summary, the sealing gasket 12 needs to be in complete contact with the wafer transport area frame 10 and the sealing gasket 12 needs to deform uniformly in order to create a seal.

[0106] Therefore, after closing, the door panel needs to be vertical, and the force exerted by the door panel on the wafer transfer area frame 10 at points a, b, and c must be the same.

[0107] The force at points a, b, and c can be of two types: one is provided by the cylinder, which is a torque force, that is...

[0108] According to: Torque M = Force F × Distance L

[0109] Therefore, force F = torque M / distance L

[0110] Because the distances are different, the forces at the three points are also different.

[0111] Therefore, another force is needed to make the forces acting on the three points the same.

[0112] This is the reaction force generated by deformation.

[0113] According to: Deformation Y = Force F × Distance L × Distance L × Distance L / (3 × E × I)

[0114] Therefore, force F = deformation Y × 3 × E × I / (distance L × distance L × distance L)

[0115] Increasing the deformation Y increases the force F.

[0116] The distances between the three points are different, and therefore the deformation amounts are also different. Adjusting the pre-deformation amount can adjust the reaction force.

[0117] By ensuring that the two forces at the three points are equal, the sealing gasket 12 can be made to fully contact the door frame and deform uniformly.

[0118] Similarly, prolonged vibration will cause the adjusting bolt to loosen. Therefore, a fixing screw (adjusting screw 6) is added laterally to the adjusting bolt. The fixing screw and the fastening bolt are perpendicular to each other and interlock mechanically.

[0119] Because of the mechanical interlock, the adjusting bolt and the adjusting bolt fixing screw will not loosen even with frequent vibration, eliminating the need for periodic maintenance and thread sealant.

[0120] The leveling method for the wafer box using the door opening and closing assembly:

[0121] Step 1: Pre-tighten the connecting block 4 to the base plate 3 using the fastening bolt 9. Tighten the adjusting bolt 8 to the connecting block 4.

[0122] After the fastening bolt 9 is tightened onto the base plate 3, the fastening bolt 9 contacts all the threads in the threaded hole of the connecting block 4 and extends out of the threaded hole.

[0123] The fastening bolt 9 abuts against the groove on the step of the connecting block 4.

[0124] That is, the step ends when the fastening bolt 9 abuts against the groove on the connecting block 4.

[0125] In this step, the lower end of the adjusting bolt 8 is located inside the connecting block 4.

[0126] Step 2: Tighten the fastening bolt 9 in the reverse direction. At this time, the lower end of the fastening bolt 9 moves up to the lower end face of the mounting hole of the base plate 3, as shown in Figure 5(a).

[0127] After the reverse screwing is completed, several threads of the fastening bolt 9 will disengage from the threaded hole of the connecting block 4, allowing the subsequent adjusting bolt 8 to push out of the connecting block 4 smoothly.

[0128] The outer diameter of the fastening bolt 9 is smaller than the inner diameter of the mounting hole. The mounting hole is located on the base plate 3 and is a smooth hole used to install the fastening bolt 9.

[0129] Step 3: Adjust the adjusting bolts 8 so that the length of the adjusting bolts 8 that are closer to the door panel 5 along the X direction extending out of the connecting block 4 along the Z direction is less than the length of the adjusting bolts 8 that are farther away from the door panel 5 along the X direction extending out of the connecting block 4 along the Z direction.

[0130] In this step, as the adjusting bolt 8 is pushed out, the lower end of the fastening bolt 9 continues to move upward along the Z direction, but the fastening bolt 9 never disengages from the mounting hole of the base plate 3.

[0131] During the adjustment process, the fastening bolt 9 is tilted within the mounting hole in the base plate 3.

[0132] At this time, the state of adjusting bolt 8 and tightening bolt 9 is as follows: Figure 1 As shown.

[0133] Step 4: Tighten the adjusting screw 6 and the fastening screw 7, as shown in Figure 5(a) and Figure 5(b).

[0134] The above are merely preferred embodiments of the present invention and do not constitute any limitation on the present invention. Any equivalent substitutions or modifications made by those skilled in the art to the technical solutions and content disclosed in the present invention without departing from the scope of the present invention shall be deemed to have remained within the scope of protection of the present invention.

Claims

1. A door opening and closing assembly for a wafer cassette, characterized in that, include: A door panel (5) has a sealing gasket (12) on its side facing the wafer transfer port (13), and its lower section is connected to the connecting block (4) by fasteners; the connecting block (4) is connected to the connecting base plate (3) by fastening bolts (9), the outer diameter of the fastening bolts (9) is smaller than the inner diameter of the mounting hole on the connecting base plate (3), and the fastening bolts (9) are threadedly connected to the connecting block (4); the connecting base plate (3) can move along the X direction; Several adjusting bolts (8) are threadedly connected to the connecting block (4), with their lower ends passing through the connecting block (4) and abutting against the upper surface of the connecting base plate (3); the adjusting bolts (8) that are close to the door panel (5) along the X direction extend out of the connecting block (4) by a length of L1 along the Z direction; the adjusting bolts (8) that are far away from the door panel (5) along the X direction extend out of the connecting block (4) by a length of L2 along the Z direction, where L2 > L1.

2. The wafer cassette door assembly according to claim 1, characterized in that, The connecting block (4) is provided with several adjusting screws (6), which are threadedly connected to the connecting block (4); the adjusting screws (6) abut against the adjusting bolt (8) and are perpendicular to the adjusting bolt (8).

3. The wafer cassette door assembly according to claim 1, characterized in that, The connecting block (4) is provided with several fastening screws (7), which abut against and are perpendicular to the fastening bolt (9).

4. The wafer cassette door assembly according to claim 1, characterized in that, The connecting base plate (3) and the carrier plate (1) are connected by a linear guide unit (2).

5. The wafer cassette door assembly according to claim 4, characterized in that, The linear guide unit (2) includes: The guide rail is fixed to the upper surface of the carrier plate (1); The slider is fixed to the lower surface of the connecting base plate (3), and a groove adapted to the guide rail is opened on it.

6. The wafer cassette door assembly according to claim 1, characterized in that, The connecting base plate (3) is connected to the output end of the cylinder assembly (14); the output end of the cylinder assembly (14) moves along the X direction; The cylinder assembly (14) includes: A rotary cylinder, the cylinder body of which is fixed to the carrier plate (1), and its output shaft passes through the carrier plate (1) along the Z direction and extends to the space between the connecting base plate (3) and the carrier plate (1); The swing arm is sleeved on the output shaft of the rotary cylinder and connected to the output shaft of the rotary cylinder through fasteners. It is connected to the connecting base plate (3) through fasteners.

7. A leveling method for a wafer cassette door assembly, based on the wafer cassette door assembly according to any one of claims 1-6, characterized in that, Includes the following steps: Step 1: Tighten the connecting block (4) to the mounting hole of the base plate (3) by tightening the fastening bolt (9) until the fastening bolt (9) abuts against the groove on the step of the connecting block (4); tighten the adjusting bolt (8) to the connecting block (4). Step 2: Tighten the fastening bolt (9) in the reverse direction. At this time, the lower end of the fastening bolt (9) moves up to the lower end face of the mounting hole of the base plate (3); Step 3: Adjust the adjusting bolts (8) so that the length of the adjusting bolts (8) that are close to the door panel (5) along the X direction and extend out of the connecting block (4) along the Z direction is less than the length of the adjusting bolts (8) that are far away from the door panel (5) along the X direction and extend out of the connecting block (4) along the Z direction.

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