Electronic module, method for manufacturing electronic module, and apparatus for manufacturing electronic module

Abstract

Provided is an electronic module in which resin leakage does not easily occur during a sealing step despite the use of a plate-shaped power terminal. This electronic module is provided with: a substrate (110); electronic elements (120A, 120B) disposed on the substrate (110); and a flat plate-shaped power terminal (160) provided upright from the substrate (110), in which the substrate (110), the electronic components (120A, 120B), and the power terminal (160) are sealed by a sealing member (190), the power terminal (160) is electrically connected to the substrate (110), at least the tip of the power terminal (160) protrudes from the sealing member (190), and the power terminal (160) has, at a position in contact with the surface of the sealing member (190), a crush section (160) that is recessed than other sections.

Description

Technical Field

[0001] The present invention relates to an electronic module, a method for manufacturing an electronic module, and a device for manufacturing an electronic module. Background Art

[0002] In the past, it is known that there is an electronic module having pin terminals provided upright from a substrate and sealed by a sealing member (for example, see Patent Document 1).

[0003] In the conventional electronic module 900, Figure 11 As shown, since pin terminals 972 and 974 protrude from sealing resin 990, resin sealing is performed using a mold having a pair of sliding portions 922. Specifically, during the electronic module manufacturing process, after pin terminals 972 and 974 are placed in the mold, the pair of sliding portions 922 slide to clamp the pin terminals 972 and 974, thereby preventing sealing resin 990 from flowing outside the pair of sliding portions 922 and performing resin sealing. In conventional electronic module 900, recesses 963 corresponding to the front ends of the pair of sliding portions 922 are formed on the pin terminals 972 and 974.

[0004]

Prior Technical Literature

[0005] [Patent Document 1] International Publication No. 2020 / 129195

[0006] In recent years, the industry has demanded electronic modules capable of handling high currents flowing through electrical equipment. To address this, plate-shaped power terminals with a larger cross-sectional area for the current path can be considered instead of pin terminals. However, when using plate-shaped power terminals, the large contact surface between the sliding portion and the power terminal, as well as the collapsed or fractured surfaces formed when shearing the sheet material to manufacture the power terminal, can create a gap between the mold (sliding portion) and the power terminal, potentially causing resin leakage.

[0007] Therefore, the present invention has been made in view of the above-mentioned circumstances, and an object thereof is to provide an electronic module in which resin leakage is unlikely to occur during a sealing process even when a plate-shaped power terminal is used. Summary of the Invention

[0008] The electronic module of the present invention is characterized in that it includes: a substrate; an electronic component arranged on the substrate; and a flat-plate-shaped power terminal upright from the substrate, wherein the substrate, the electronic component, and the power terminal are sealed by a sealing member, at least the front end portion of the power terminal protrudes from the sealing member, and has a crushed portion that is recessed compared to other portions at a position where it contacts the surface of the sealing member.

[0009] The manufacturing method of the electronic module of the present invention is characterized in that it includes: an assembly forming step, in which a flat-plate power terminal is uprightly arranged on a substrate configured with an electronic component to form an assembly having the substrate, the electronic component and the power terminal; a receiving step, in which the substrate, the electronic component and the first portion of the substrate side of the power terminal are received in a first mold cavity of a mold, and the second portion of the front end side of the power terminal is received in a power terminal receiving hole extending from the inner surface of the first mold cavity; and a sealing step, in which the substrate, the electronic component and the first portion of the power terminal are sealed by flowing a sealing member into the first mold cavity, wherein in the receiving step, after the second portion of the power terminal is inserted into the power terminal receiving hole, the front end portions of a pair of sliding portions provided on the mold are protruded from the inner periphery of the power terminal receiving hole and the power terminal is clamped by the pair of sliding portions, and the front end portion of the second portion of the power terminal is separated from the first mold cavity while the front end portions of the pair of sliding portions bite into the outer periphery of the second portion of the power terminal, thereby forming a crushed portion.

[0010] The manufacturing device of the electronic module of the present invention is used to implement the manufacturing method of the electronic module according to claim 8, and is characterized in that it includes: a first mold, having the power terminal insertion hole and the pair of sliding parts; and a second mold, opposite to the first mold, wherein one surface of the power terminal is a collapsed edge surface with a collapsed edge formed at the end, and the other surface of the power terminal is a burr surface connected to the fracture surface of the side, and when viewed from above, recesses corresponding to the cross-sections of the power terminals are respectively formed at the front ends of the pair of sliding parts, and the shape of the bottom of the recess of the sliding part that abuts the collapsed edge surface in the pair of sliding parts corresponds to the shape of the collapsed edge surface, and the shape of the bottom of the recess of the sliding part that abuts the burr surface in the pair of sliding parts is formed to form convex portions on both side walls of the recess.

[0011] Effects of the Invention

[0012] According to the electronic module of the present invention, since the power terminal has a depressed portion at the location where it contacts the surface of the sealing member, which is recessed relative to the rest of the portion, gaps are less likely to form between the mold (sliding portion) and the power terminal during resin sealing using a mold, thereby preventing resin leakage. Consequently, the electronic module of the present invention is less likely to experience resin leakage during the sealing process, despite the use of plate-shaped power terminals.

[0013] In addition, according to the manufacturing method and manufacturing device of the electronic module of the present invention, since the power terminal is clamped by a pair of sliding parts, the front end portion of the power terminal is separated from the first mold cavity, and the front end portions of the pair of sliding parts bite into the outer periphery of the second part of the power terminal to form a crushed portion, it is not easy to generate a gap between the mold (sliding part) and the power terminal, thereby preventing resin leakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 1 is a perspective view of the electronic module 100 according to the embodiment. Figure 1 (a) is a perspective view of the electronic module 100, Figure 1 (b) is a front view of the electronic module 100.

[0015] Figure 2 1 is a diagram showing the internal structure of the electronic module 100 according to the embodiment. Figure 2 (a) is a front view of the electronic module 100 with the sealing member 190 omitted. Figure 2 (b) is a plan view of the electronic module 100 with the sealing member 190 omitted. Figure 2 (c) is a plan view of the electronic module 100 in which the sealing member 190 and the first connecting frame 190 are omitted.

[0016] Figure 3 This is a diagram of the power terminal 160 in this embodiment. Figure 3 (a) is a front view of the power terminal 160, Figure 3 (b) is a plan view of the power terminal 160, Figure 3 (c) means Figure 3 (a) is an enlarged planar cross-sectional view of the A1-A1 section, Figure 3 (d) Yes Figure 3 A2-A2 cross-section of (a).

[0017] Figure 4 1 and 2 are diagrams illustrating the steps of manufacturing the power terminal 160 according to the present embodiment. Figure 4 (a)~ Figure 4 (d) is a diagram of each process.

[0018] Figure 5 1 is a flowchart illustrating a method for manufacturing an electronic module according to this embodiment.

[0019] Figure 6 1 is a diagram illustrating a process for housing components in the mold 1 in the embodiment. Figure 6 (a) is a front cross-sectional view of the process of accommodating the components in the mold 1, Figure 6 (b) is a side cross-sectional view when the components are housed in the mold 1.

[0020] Figure 7 This is a diagram illustrating a process of clamping the power terminal 160 by a pair of sliding parts 24 in the embodiment. Figure 7 (a) is a front cross-sectional view of the process of clamping the power terminal 160 with a pair of sliding parts 24, Figure 7 (b) is a side cross-sectional view of the process of clamping the power terminal 160 by the pair of sliding parts 24.

[0021] Figure 8 It is a plan view showing a state where the sliding portion 24 clamps the power terminal 160 during the housing step.

[0022] Figure 9 It is an enlarged plan view of a main part showing a state where the sliding portion 24 clamps the power terminal 160 in the housing step.

[0023] Figure 10 It is a figure which shows the state of a sealing process. Figure 10 (a) is a front cross-sectional view showing the sealing process. Figure 10 (b) is a side cross-sectional view of the sealing process.

[0024] Figure 11 This is a cross-sectional view for explaining a resin sealing process in a conventional electronic module. Reference numeral 910 denotes a substrate, reference numeral 920 denotes an electronic component, reference numerals 932 and 942 denote connection frames, and reference numeral 952 denotes an internal connection frame. DETAILED DESCRIPTION

[0025] The following describes the electronic module, electronic module manufacturing method, and electronic module manufacturing apparatus of the present invention based on the embodiments illustrated in the accompanying drawings. The embodiments described below do not limit the inventions set forth in the claims. Furthermore, not all elements and combinations described in the embodiments are essential to the solutions provided by the present invention.

[0026] [Implementation Method]

[0027] 1. Electronic Module 100 of Embodiment

[0028] First, the electronic module 100 according to the embodiment will be described. Figure 1 and Figure 2 As shown, the electronic module 100 of the embodiment includes a substrate 110, electronic components 120A and 120B, a first terminal 130, a second terminal 140, a power terminal 160, a first connecting frame 132, a second connecting frame 142, an internal connecting frame 142, an internal connecting frame 152, and pin terminals 172, 174, 182, 184.

[0029] In the following description, the longitudinal direction of the electronic module 100 is referred to as the front-to-back direction, and the transverse direction is referred to as the left-to-right direction. Furthermore, the height direction of the electronic module 100 is referred to as the up-down direction. The terms front, back, left, right, top, and bottom are for ease of description and do not limit the orientation in which the electronic module 100 can be installed.

[0030] like Figure 1 As shown, the electronic module 100 of the embodiment is resin-sealed by a sealing member 190 , and the first terminals 130 , the second terminals 140 , the power terminals 160 , the tip portions of the pin terminals 172 , 174 , 182 , 184 , and the substrate 110 (heat dissipation metal plate 113 ) are exposed from the sealing member 190 .

[0031] like Figure 1 and Figure 2 As shown, the electronic module 100 according to this embodiment forms a half-bridge circuit comprising electronic components (semiconductor elements) 120A and 120B connected in series. Second terminal 140 is connected to an external high voltage, and first terminal 130 is connected to a reference potential. Power terminal 160 is a midpoint terminal connected to the midpoint between the source electrode of electronic component 120A and the drain electrode of electronic component 120B. The circuit forming electronic module 100 may be a full-bridge circuit or another suitable circuit.

[0032] like Figure 2 As shown in (a), substrate 110 is a DCB substrate having an insulating substrate (ceramic substrate) 112, circuit wiring 111 formed on the upper surface of insulating substrate (ceramic substrate) 112, and a metal plate 113 for heat dissipation formed on the lower surface (back surface) of insulating substrate (ceramic substrate) 112. Substrate 110 may also be a suitable substrate such as a printed circuit board.

[0033] Electronic components 120A and 120B are arranged on the die pads of circuit wiring 111. Each of electronic components 120A and 120B is a MOSFET, with a drain electrode formed on the substrate 110 side and a source electrode and gate electrode formed on the side opposite the substrate. Alternatively, electronic components 120A and 120B may be other semiconductor components such as IGBTs, triacs, and diodes, or may be non-semiconductor electronic components such as capacitors and inductors. Furthermore, the number of electronic components is not limited to two and may be one or three or more.

[0034] In the electronic element 120A, the source electrode is connected to the first terminal 130 via the internal connection terminal 134 and the first connection frame 132. Furthermore, a wiring or circuit wiring (not shown) is connected to the pin terminal 174 serving as the sensing terminal via the wiring. The gate electrode is connected to the pin terminal 172 via the connection terminal 176 and the circuit wiring. The drain electrode (not shown) is connected to the power terminal 160 via the circuit wiring 111, and the power terminal 160 is electrically connected to the internal connection frame 152. In addition, Figure 1 In the example shown in FIG. 1 , the internal connection terminal 134 has a circular cross-section.

[0035] In the electronic element 120B, the source electrode is connected to the internal connection frame 152 via the internal connection terminal 154, and the internal connection frame 152 is connected to the power terminal 160. It is also connected to the pin terminal 184 serving as the sensing terminal via a wire or circuit wiring (not shown). The gate electrode is connected to the pin terminal 182 via the connection terminal 186 and the circuit wiring. The drain electrode (not shown) is electrically connected to the second terminal 140 via the circuit wiring 111, the connection member 178, and the second connection frame 142. In addition, Figure 1 In the example shown in FIG. 1 , the internal connection terminal 154 has a circular cross-section, and the connection member 178 has a rectangular cross-section.

[0036] like Figure 1 and Figure 2 As shown, the first terminal 130 is arranged at the front of the electronic module 100 in the front-to-back direction. The first terminal 130 is formed of a conductive flat material, such as a copper plate. The first terminal 130 has a through hole 131 extending vertically through the first terminal 130. When viewed vertically, the through hole 131 has a circular shape, for example.

[0037] The first connection frame 132 is electrically connected to the first terminal 130. The first connection frame 132 is embedded in the sealing member 190. In the electronic module 100, the first connection frame 132 is integrally formed of the same plate material as the first terminal 130.

[0038] The first connecting frame 132 has a through-hole (noted) extending vertically therethrough. The through-hole is circular when viewed vertically. The upper end of the internal connecting terminal 134 engages within the through-hole. The internal connecting terminal 134 is secured to the first connecting frame 132, for example, by press-fitting, and connects the first connecting frame 132 to the source electrode of the electronic component 120A.

[0039] The second terminal 140 is disposed at the rear of the electronic module 100 in the front-to-back direction. The second terminal 140 is a plate-shaped member made of a conductive flat material, such as a copper plate. The second terminal 140 has a through hole 141 extending vertically through the second terminal 140. The through hole 141 is, for example, circular in shape when viewed vertically.

[0040] The second connection frame 142 (internal connection frame) is electrically connected to the second terminal 140. The second connection frame 142 is embedded in the sealing member 190. In the electronic module 100, the second connection frame 142 is integrally formed with the same plate material as the second terminal 140.

[0041] The internal connection frame 152 has a through hole (abbreviated symbol) and a long hole 156 (see Figure 2 (b)) The plate-shaped member supports the power terminals 160 and electrically connects the electronic components 120A and 120B to the power terminals 160. The internal connection frame 152 is arranged on the same plane as the first connection frame 132 and the second connection frame 142.

[0042] The through hole is circular in shape when viewed from the top and bottom, and the upper end of the internal connection terminal 154 is fitted therein. The internal connection frame 152 and the source electrode of the electronic component 120A are connected via the internal connection terminal 154. The long hole 156 extends in the front-to-back direction. The first portion of the power terminal 160 (see the following) Figure 3 The symbol 166) is pressed into it.

[0043] like Figures 1 to 3 As shown, the power terminal 160 is a flat plate-shaped member erected from the substrate 110, arranged in a manner such that the left-right direction is the plate thickness direction, and is in a strip shape with the up-down direction as the length direction. Figure 3 As shown, the power terminal 160 has: a first portion 166 located closer to the substrate side than the internal connection frame 152 and pressed into the long hole 156; and a second portion 164 located on the side of the internal connection frame 152 opposite to the substrate 110 side and formed to be wider than the first portion 166.

[0044] The substrate-side tip of first portion 166 is electrically connected to substrate 110, forming part of the circuit wiring connecting electronic component 120A and electronic component 120B. First portion 166 is sealed by sealing member 190. Alternatively, power terminal 160 and substrate 110 may not be directly electrically bonded.

[0045] The second portion 164 is connected to the first portion 166, and has a connecting portion 164a whose width (width in the front-to-back direction) gradually increases as it moves away from the first portion 166 when viewed from the left and right directions, and an exposed portion 164b (front end portion) in a roughly rectangular shape that is connected to the connecting portion 164a and extends upward.

[0046] Connecting portion 164a includes supporting portion 167 that supports power terminal 160 by contacting internal connecting frame 152, and protruding portion 162 that protrudes from one surface and the other surface of power terminal 160 and whose lower surface contacts internal connecting frame 152. Connecting portion 164a is sealed by sealing member 190.

[0047] Exposed portion 164b has a crushed portion 163 that is recessed relative to the rest of the portion where opening 161 formed in the center and the surface of sealing member 190 (the portion connected to connecting portion 164a) meet. Exposed portion 164b is exposed from sealing member 190. Crushed portion 163 is formed to surround power terminal 160.

[0048] The power terminal 160 is formed by shearing a conductive flat material such as a metal plate. Figure 3 As shown in (c), one surface 165a of the power terminal 160 is a collapsed surface with a collapsed edge 168a formed at the end, and the other surface 165b of the power terminal 160 is a burred surface connected to the fracture surface 168b of the side surface. In the crushed portion 163, the end of the other surface 165b of the power terminal 160 is recessed compared to the other portion of the other surface 165b of the power terminal 160 (see Figure 3 (d)).

[0049] Sealing member 190 seals electronic components 120A and 120B, the lower surface of first terminal 130, the lower surface of second terminal 140, first connecting frame 132, second connecting frame 142, and power terminal 160 (connecting portion 164a between first portion 166 and second portion). Sealing member 190 is made of a thermosetting molding material primarily composed of epoxy resin and supplemented with silica fillers, and protects electronic components 120 from environmental influences such as heat, light, and humidity.

[0050] The sealing member 190 has a base covering portion 192 that covers the base of the portion of the power terminal 160 protruding from the sealing member 190 (the base of the portion of the power terminal 190 protruding from the height position of the surface of the sealing member 190 other than the base covering portion 192) (see FIG. Figure 1). In addition, it also has a base that covers the portion of the pin terminals 172, 174 or the pin terminals 182, 184 protruding from the sealing member 190 (the pin terminal base covering portion 193 of the pin terminals 172, 174 or the pin terminals 182, 184 protruding from the base of the pin terminals of the sealing member 190. The base portion of the portion protruding at a height position on the surface of the area other than the base covering portion 193) The base covering portion 192 and the pin terminal base covering portion 193 are formed into a shape that protrudes more than other portions of the sealing member 190. In addition, the pin terminal base covering portion 193 collectively covers the bases of two pin terminals, but it can also cover them one by one, or it can cover four pin terminals collectively.

[0051] Next, we will refer to Figure 3 and Figure 4 The horizontal cross-sectional structure of the power terminal 160 and the cross-sectional structure of the crushed portion 163 will be described.

[0052] The power terminal 160 is manufactured by stamping a conductive flat plate (eg, a metal flat plate). Figure 4 As shown in (a), a metal plate 160' is placed on a die 210 having an opening, and punch 200 is used to punch the metal plate 160'. At this time, tensile stress is generated in the portion of the metal plate 160' close to the punch 200 and the edge of the die 210, and a collapsed edge 168a is generated on the surface (see Figure 4 (c)). When the load of the punch 200 is further increased, the metal plate 160' is broken, thereby forming a fracture surface 168b. As the load is further increased, the metal plate 160' and the power terminal 160 are separated (refer to Figure 4 (c)), the power terminal 160 can be manufactured (refer to Figure 4 (d)). At this time, burrs may be formed on the sheared surface, but these burrs are removed by grinding. In this way, power terminal 160 is formed.

[0053] As described above, since the power terminal 160 is manufactured by shearing a metal plate, a burred surface and a collapsed surface are formed. One surface 165a of the power terminal 160 is a collapsed surface, and the other surface 165b of the power terminal 160 is a burred surface.

[0054] like Figure 3 As shown in (c), one surface 165a of power terminal 160 is a collapsed edge surface with a smoothly rounded or inclined collapsed edge 168a formed at the end. Another surface 165b of power terminal 160 is a burred surface connected to a side fracture surface 168b. The end of 165b is relatively flat. Fracture surface 168b is formed on the side of power terminal 160 and is an inclined surface with the burred surface side recessed from the side surface on the collapsed edge 168a side.

[0055] The crushed portion 163 is formed so as to surround the power terminal 160. In the crushed portion 163, one surface 165a of the power terminal 160 is formed in a shape obtained by directly crushing the collapsed surface of the other portion.

[0056] The other surface 165b of the power terminal 160 is formed with a recessed portion 168c whose end portion is recessed relative to the rest of the other surface of the power terminal 160. Furthermore, a relief portion 169 is formed on the side of the power terminal 160. This relief portion 169 allows the crushed material to be squeezed out to the side when the crushed portion 163 of the power terminal 160 is formed (when the power terminal 160 is clamped by the pair of sliding portions 24 in the sealing process described later).

[0057] 2. Electronic Module Manufacturing Method and Electronic Module Manufacturing Apparatus 1 (Mold) According to Embodiment

[0058] Next, a method for manufacturing an electronic module according to an embodiment will be described. Figure 5 As shown, the method for manufacturing an electronic module according to this embodiment includes an assembly forming step, a housing step, and a sealing step in sequence.

[0059] (Assembly Forming Step)

[0060] First, a flat-plate-shaped power terminal 160 is erected on a substrate 110 on which electronic components 120A and 120B are arranged, forming an assembly having the substrate 110, electronic components 120A and 120B, a first terminal 130, a second terminal 140, a first connecting frame 132, a second connecting frame 142, an internal connecting frame 152, and the power terminal 160.

[0061] Specifically, electronic components 120A and 120B are arranged on circuit wiring 111 of substrate 110 via a conductive bonding material (e.g., solder). Next, a lead frame is prepared, which surrounds first terminal 130, second terminal 140, first connecting frame 132, second connecting frame 142, and internal connecting frame 152 with a frame portion (not shown), and is arranged above circuit wiring 111. Furthermore, the through-holes of first connecting frame 132 and the through-holes of internal connecting frame 152 are positioned so as to be located over the electrodes (source electrodes) of electronic components 120A and 120B, respectively.

[0062] Next, first portion 166 of power terminal 160 is inserted into slot 156 of the lead frame (internal connection frame), internal connection terminals 134 and 154 are inserted into the through-holes, and pin terminals 172, 174, 182, and 184 are inserted into designated locations of the lead frame. Power terminal 160 and the pin terminals are brought into contact with substrate 110, and internal connection terminals 134 and 154 are brought into contact with the source electrodes of electronic components 120A and 120B. Alternatively, power terminal 160, internal connection terminals 134 and 154, and the pin terminals may be pre-inserted into the lead frame and then positioned on substrate 110 and electronic components 120A and 120B for each lead frame.

[0063] Next, the substrate 110, electronic components 120A and 120B, first terminals 130, second terminals 140, first connecting frame 132, second connecting frame 142, internal connecting frame 152, and power terminals 160 are electrically connected by appropriately bonding them. For example, a method of electrical bonding can be considered in which a conductive bonding material (solder) is preliminarily disposed at the connection portion, the components are brought into contact, and the conductive bonding material is melted by reflow or the like to achieve bonding.

[0064] (Structure of Mold 1)

[0065] Before explaining the housing process, first, the mold 1 of the electronic module manufacturing apparatus as an embodiment of the housing assembly will be explained. Figure 6 As shown, the mold 1 includes a first mold 10 , a second mold 20 opposite to the first mold 10 , and a driving member 30 , and each of the molds can move in the up and down directions.

[0066] The first mold 10 includes a first recess 11 formed on a surface facing the second mold 20 and a placement portion on which a frame portion of a lead frame (not shown) is placed.

[0067] The second mold 20 has a second recess 21 formed on the surface facing the first mold 10, and power terminal accommodating holes 22 and pin terminal accommodating holes 23 extending upward from the second recess 21. Sliders 24 (24A-24D) are provided inside the power terminal accommodating holes 22 and the pin terminal accommodating holes 23. By moving the second mold 20 toward the first mold 10, the first and second molds 10 and 20 are aligned, forming a first mold cavity C1 by the first recess 11 and the second recess 21.

[0068] A pair of sliding members 24 are provided inside the power terminal receiving hole 22 and the pin terminal receiving hole 23. The pair of sliding members 24 slide horizontally, causing their front ends to protrude from the inner periphery of the power terminal receiving hole 22. This allows the pair of sliding members 24 to clamp the power terminal 160 and the pin terminals received in the power terminal receiving hole 22 and the pin terminal receiving hole 23. This isolates the front end 28 of each of the power terminal receiving hole 22 and the pin terminal receiving hole 23 from the first mold cavity C1 on the substrate side. The front ends of the pair of sliding members 24 are tapered.

[0069] like Figure 9 As shown, when viewed from above, recesses 25A and 25B corresponding to the cross-section of the power terminal 160 are formed on the front end portions 28 of the pair of sliding portions 24A and 24B, respectively. The shape of the bottom of the recess 25B of the sliding portion 24B that contacts the power terminal 165A (collapsed edge surface) of the pair of sliding portions 24A and 24B corresponds to the shape of the collapsed edge surface, and the shape of the bottom of the recess 25A of the sliding portion 24A that contacts the power terminal 165B (burred surface) is formed so that protrusions 26 are formed on both side walls of the recess 25B. In addition, a shoulder portion of at least one of the recesses 25A and 25B is provided for forming an escape portion 169 (see FIG. Figure 4 ) incision 29.

[0070] The driving member 30 has a main body 31 and a pressing portion 32. The main body 31 is arranged on the second mold 20 (on the side opposite to the first mold 10) and is configured to be movable in the up and down directions. The pressing portion 32 abuts against the inclined surface 27 on the base end side of the sliding portion 24. When the main body 31 of the driving member 30 approaches the second mold 20, the pressing portion 32 pushes the inclined surface 27 on the base end side of the sliding portion 24 (on the side opposite to the front end side of the power terminal), thereby causing the pair of sliding portions 24 to slide toward the power terminal 160. In addition, by pulling out the separation pin (not shown), the pressing portion 32 (driving member 30) moves upward toward the inclined surface 27 on the base end side, and causes the pair of sliding portions 24 to slide in a direction of separation from each other.

[0071] (Containment Process)

[0072] Next, the storage process is explained. Figure 6 As shown, in the accommodation process, the substrate 110, the electronic components 120A, 120B and the first part 166 of the substrate side of the power terminal 160 are accommodated in the first mold cavity C1 of the mold 1, and the second part 164 (to be precise, the exposed part 164b) on the front end side of the power terminal 160 is accommodated in the power terminal accommodation hole 22 of the mold 1 extending from the inner surface of the first mold cavity C1.

[0073] Specifically, first, the frame portion (not shown) of the lead frame (not shown) is placed on the opposite surface of the first mold 10, and the assembly is arranged in the first recess 11 of the first mold 10. At this time, the heat dissipation metal plate 113 of the substrate 110 is arranged in contact with the first recess 11. Figure 6 As shown, the second mold 20 is overlapped with the first mold 10. In this state, a first mold cavity C1 is formed, which is formed by the first recess 11 of the first mold 10 and the second recess 21 of the second mold 20. The first mold cavity C1 accommodates the substrate 110, the electronic components 120A and 120B, the first terminals 130, the second terminals 140, the first connecting frame 132, the second connecting frame 142, the internal connecting frame 152, and the first portion 166 of the power terminal 160. In addition, the upper portion (exposed portion 164b) of the second portion 164 of the power terminal 160 is accommodated in the power terminal receiving hole 22 of the second mold 20 extending from the inner surface of the first mold cavity C1, and the upper portions of the pin terminals 172, 174, 182, and 184 are accommodated in the pin terminal receiving hole 23 of the second mold 20 extending from the inner surface of the first mold cavity C1.

[0074] In the receiving process, after the power terminal 160 and each pin terminal are received in the power terminal receiving hole 22 and the pin terminal receiving hole 23, the pair of sliding portions 24 are slid (protruded) from the inner periphery of the power terminal receiving hole 22 and each pin terminal receiving hole 23 to clamp the second portion 164 of the power terminal 160 and each pin terminal (see Figure 7 The position where the sliding portion 24 clamps the power terminal 160 is a position in the second portion 164 that is separated from the internal connection frame 152 by a predetermined length.

[0075] When the sliding portion 24 holds the power terminal 160, the main body 31 of the driving member 30 moves toward the second die 20 (see Figure 7 and Figure 8 ). Thus, the pressing portion 32 presses the inclined surface 27 on the base end side of the pair of sliding portions 24, so that the sliding portions 24 slide simultaneously and can simultaneously clamp the power terminal 160. Similarly, the pair of sliding portions 24 can simultaneously clamp each pin terminal.

[0076] At this time, the front ends of the pair of sliding parts 24 (sliding parts 24A, 24B) bite into the outer periphery of the power terminal 160, thereby forming the crushed portion 163. In addition, when the pair of sliding parts 24 clamp the power terminal 160, the second cavity C2 is formed in the space associated with the first cavity C1, which is surrounded by the inner periphery of the power terminal receiving hole 22 and the sliding parts 24 (see Figure 7 In addition, the space covering the exposed portion 166 a of the power terminal 160 is isolated from the second cavity C2 by the sliding portion 24 .

[0077] Similarly, regarding the pin terminals, the front end portions of the pair of sliding portions 24 (sliding portions 24C, 24D) bite into the outer periphery of each pin terminal to form a recessed portion (the structure of the recessed portion is shown in FIG. Figure 11 963). With the pin terminals clamped by the pair of sliders 24 (sliders 24C and 24D), a third cavity C3 is formed within the space associated with the first cavity C1, surrounded by the inner periphery of the pin terminal receiving hole 23 and the sliders 24. Furthermore, the sliders 24 isolate the space surrounding the front ends of the pin terminals from the third cavity C3.

[0078] (Sealing process)

[0079] Next, the sealing member 190 (resin) is poured into the first cavity C1, thereby sealing the substrate 110, the electronic element 120, and the first portion 166 of the power terminal 160 (see FIG. 1 ). Figure 10 ). In addition, the sealing member 190 (resin) flows from the first cavity C1 into the second cavity C2 to form the base covering portion 192, and the sealing member 190 (resin) also flows into the third cavity C3 to form the pin terminal base covering portion 193.

[0080] After the resin constituting the sealing member 190 (including the base covering portion 192 and the pin terminal base covering portion 193) is cured, the electronic module 100 is removed from the mold 1. Then, the frame portion of the lead frame (not shown) is separated. In this way, the electronic module 100 is manufactured.

[0081] 3. Effects of the Electronic Module 100, the Electronic Module Manufacturing Method, and the Manufacturing Apparatus 1 of the Embodiment

[0082] In the electronic module 100 of the embodiment, the power terminal 160 has a crushed portion 163 recessed relative to the rest of the portion where it contacts the surface of the sealing member 190. This reduces the likelihood of a gap forming between the mold 1 (sliding portion 24) and the power terminal 160 during sealing using the mold 1, thereby preventing resin leakage. This ensures that the electronic module 100 of the embodiment is less susceptible to resin leakage during the sealing process, despite the use of a plate-shaped power terminal 160.

[0083] Furthermore, according to the electronic module 100 and the method for manufacturing the electronic module of the embodiment, since the elongated hole 156 (see Figure 2Internal connection frame 152, a flat plate-shaped member (b), supports the power terminals and electrically connects electronic components 120A and 120B to power terminals 160. This stably supports plate-shaped power terminals 160. Furthermore, since internal connection frame 152 and power terminals 160 form a circuit layout, the wiring area on the substrate can be reduced, enabling a more compact electronic module. Furthermore, since circuit layout can be arranged in a three-dimensional space, the electronic module offers a high degree of design freedom.

[0084] Furthermore, according to the electronic module 100 of the embodiment, in the power terminal 160, since the first portion 166 of the internal connection frame 152 located on the substrate side is pressed into the elongated hole 156, the power terminal 160 can be stably supported, and the tightness between the internal connection frame 152 and the power terminal 160 can be improved. Furthermore, since the second portion 164 located on the side of the internal connection frame 152 opposite the substrate side is formed wider than the first portion 166, the cross-sectional area of the current path is increased, making it easier for large currents to flow.

[0085] Furthermore, in the electronic module 100 of the embodiment, since the end of the other surface 165b (burred surface) of the power terminal 160 in the crushed portion 163 is recessed relative to the rest of the other surface 165b of the power terminal 160, the sliding portion 24 can bite into the other surface 165b of the power terminal 160 during the sealing process, reliably preventing resin leakage from the fractured surface, etc. Furthermore, even if the entire burred surface is crushed to remove the burr near the fractured surface (the portion that is retracted inward from the end of the burred surface), the crushed portion will not adhere to the burr. However, by making the end of the other surface 165b (burred surface) of the power terminal 160 more recessed relative to the rest of the other surface 165b of the power terminal 160, the burr can be filled.

[0086] Furthermore, according to the electronic module 100 of the embodiment, since the crushing portion 163 is formed to surround the power terminal 160 , the sliding portion 24 bites into the entire plate-shaped power terminal 160 during the sealing process, thereby more reliably preventing resin leakage.

[0087] In addition, according to the electronic module 100 of the embodiment, since an escape portion 169 protruding outward is formed on the side of the power terminal 160 in the crushing portion 163, during the accommodation process, the material of the plate crushed by the sliding portion 24 is crushed to the escape portion 169, thereby preventing the material from being squeezed out to an unexpected location and deforming the power terminal 160, and preventing the formation of a gap between the sliding portion 24 and the power terminal 160 and causing resin leakage.

[0088] Furthermore, in the electronic module 100 of the embodiment, since the sealing member 190 includes the base covering portion 192, which covers the base of the portion of the power terminal 160 protruding from the sealing member 190, the creepage distance of portions of the sealing member 190, such as the pin terminals 172 adjacent to the power terminal 160, exposed from the sealing member 190 can be increased, thereby reducing malfunctions. Furthermore, the portions of the power terminal 160 that are vulnerable to shock and exposed from the sealing member 190 can be protected, resulting in an electronic module with high shock resistance.

[0089] Furthermore, according to the electronic module 100 of this embodiment, since it includes pin-shaped pin terminals 172 and the like extending upright from the substrate 110, and the sealing member 190 includes a pin terminal base covering portion 193 that covers the base of the portions of the pin terminals 172 and the like protruding from the sealing member 190, the creepage distance between the power terminals 160 and other pin terminals adjacent to the pin terminals 172 and the like that are exposed from the sealing member 190 can be extended, thereby reducing malfunctions. Furthermore, since the portions of the pin terminals 172 and the like that are exposed from the sealing member 190 are protected against shock, the electronic module can be said to have high shock resistance.

[0090] According to the manufacturing method of the electronic module of the embodiment, the power terminal 160 is clamped by a pair of sliding parts 24, so that the front end portion of the power terminal 160 is separated from the first mold cavity C1, and when the power terminal 160 is clamped by the pair of sliding parts 24, the front end portions of the pair of sliding parts 24A and 24B protruding from the inner periphery of the power terminal accommodating hole 22 bite into the outer periphery of the second part 164 of the power terminal 160 to form a crushing portion 163. Therefore, it is not easy to generate a gap between the mold 1 (sliding part 24) and the power terminal 160, which can prevent resin leakage.

[0091] Furthermore, according to the electronic module manufacturing method of the embodiment, since the distal ends of the pair of sliding portions 24 are both formed into a tapered shape, during the sealing process, crushed portions 163 are easily formed on the power terminals 160 when the power terminals 160 are clamped, allowing the sliding portions 24 to bite into the power terminals 160. This reduces the likelihood of a gap forming between the power terminals 160 and the sliding portions 24.

[0092] In addition, according to the manufacturing method and manufacturing device of the electronic module of the embodiment, since in the accommodating process, a pair of sliding parts 24 of the mold 1 have recesses 25A and 25B at the front end portion respectively corresponding to the cross-section of the power terminal 160 when viewed from above, the shape of the bottom of the recess 25A of the sliding part 24A of the pair of sliding parts 24 that abuts against one surface (collapsed edge surface) 165a corresponds to the shape of one surface (collapsed edge surface) 165a, and the recess 25B of the sliding part 24B of the pair of sliding parts 24 that abuts against the burr surface is formed to have a shape with a convex portion 26 formed on both side walls of the recess 25B, it is possible to form a crushing part 163 corresponding to the difference between the collapsed edge surface and the burr surface, thereby more reliably preventing resin leakage.

[0093] In addition, according to the manufacturing method of the electronic module of the embodiment, since a notch 29 is provided in the shoulder portion of the recessed portion 25A, 25B of at least one side (sliding portion 24B) of a pair of sliding portions 24, when the power terminal 160 is clamped by the sliding portion 24 and a crushed portion is formed during the accommodation process, the material of the power terminal 160 can move to the portion of the notch 29, thereby forming an escape portion 169.

[0094] The present invention has been described above based on the above embodiment, but the present invention is not limited to the above embodiment and can be implemented in various forms within the scope of the present invention. For example, the following modifications are possible.

[0095] (1) The positions, connections, numbers, etc. described in the above-mentioned embodiments (including various modified examples, the same applies hereinafter) are merely examples and can be changed without impairing the effects of the present invention.

[0096] (2) In the above embodiment, the present invention is applied to an electronic module using pin terminals, but the present invention is not limited thereto and can also be applied to an electronic module not using pin terminals.

[0097] (3) In the above embodiment, the present invention is applied to a terminal serving as a midpoint terminal as a power terminal, but the present invention is not limited thereto and can also be applied to terminals other than the midpoint terminal (eg, the first terminal and the second terminal).

[0098] (4) In the above embodiment, the present invention is applied to an electronic module without an internal connection frame, but the present invention is not limited thereto. The present invention can also be applied to an electronic module without an internal connection frame.

[0099] (5) In the above embodiment, the first mold serves as the upper mold and the second mold serves as the lower mold, but the present invention is not limited to this. The first mold may serve as the lower mold and the second mold may serve as the upper mold. In this case, the lead frame is arranged on the opposite surface of the second mold with the power terminals and pin terminals of the components inserted into the power terminal receiving holes 22 and the pin terminal receiving holes 23 of the second mold. In addition, the driving member is also arranged below the second mold, and the pair of sliding parts are moved in the horizontal direction by moving the pressing part upward.

[0100] Explanation of symbols

[0101] 1…manufacturing device (mold); 22…power terminal accommodating hole; 24, 24a, 24B, 24C, 24D…sliding portion; 25A, 25B…recess; 26…convex portion; 29…cutout; 100…electronic module; 110, 120A, 120B…electronic component; 152…internal connection frame; 153…long hole; 160…power terminal; 163…crushing portion; 165A…one surface; 165b…the other surface; 168a…collapsed edge; 168b…fracture surface; 168…recessed portion; 169…escape portion; 170…sealing member; 172, 174, 182, 184…pin terminal; 190…sealing member; 192…base covering portion; 193…pin terminal base covering portion; C1…first mold cavity.

Claims

1. An electronic module, characterized in that: include: substrate; electronic components disposed on the substrate; as well as A flat-plate-shaped power terminal is erected from the substrate. wherein the substrate, the electronic element, and the power terminal are sealed by a sealing member, At least a front end portion of the power terminal protrudes from the sealing member, and has a crushed portion recessed relative to other portions at a position where the terminal contacts a surface of the sealing member.

2. The electronic module according to claim 1, wherein: Further including: The internal connection frame is a flat plate-shaped member having long holes, which supports the power terminals and electrically connects the electronic components to the power terminals. wherein the sealing member seals the substrate, the electronic element, the internal connection frame, and the power terminal, In the power terminal, The first portion of the internal connection frame located on the substrate side is pressed into the long hole, A second portion of the internal connection frame located on the opposite side to the substrate side is formed to be wider than the first portion.

3. The electronic module according to claim 1 or 2, characterized in that: One surface of the power terminal is a collapsed edge surface with a collapsed edge formed at the end. The other side of the power terminal is a burr surface connected to the fracture surface of the side. In the crushed portion, an end portion of the other surface of the power terminal is recessed relative to other portions of the other surface of the power terminal.

4. The electronic module according to claim 1 or 2, characterized in that: The crushing portion is formed to surround the power terminal.

5. The electronic module according to claim 1 or 2, characterized in that: An escape portion protruding outward is formed on a side surface of the power terminal at the crushed portion.

6. The electronic module according to claim 1 or 2, characterized in that: The sealing member has a base covering portion that covers a base of a portion of the power terminal protruding from the sealing member.

7. The electronic module according to claim 1 or 2, characterized in that: Further including: A pin-shaped pin terminal is erected from the substrate and at least the front end thereof protrudes from the sealing member. The sealing member includes a pin terminal base covering portion that covers a base of a portion of the pin terminal protruding from the sealing member.

8. A method for manufacturing an electronic module, characterized in that: include: An assembly forming step of vertically arranging a flat-plate power terminal on a substrate on which an electronic component is arranged to form an assembly having the substrate, the electronic component, and the power terminal; a receiving step of receiving the substrate, the electronic component, and the first portion of the substrate side of the power terminal in a first cavity of a mold, and receiving the second portion of the front end side of the power terminal in a power terminal receiving hole extending from an inner surface of the first cavity; as well as a sealing step of sealing the substrate, the electronic component, and the first portion of the power terminal by flowing a sealing member into the first cavity; In which, in the accommodation process, after the second part of the power terminal is inserted into the power terminal accommodation hole, the front end portions of a pair of sliding parts provided on the mold are made to protrude from the inner periphery of the power terminal accommodation hole and the power terminal is clamped by the pair of sliding parts, and the front end portion of the second part of the power terminal is separated from the first mold cavity while the front end portions of the pair of sliding parts bite into the outer periphery of the second part of the power terminal, thereby forming a crushed portion.

9. The method for manufacturing an electronic module according to claim 8, wherein: The front end portions of the pair of sliding portions are each formed in a tapered shape.

10. The method for manufacturing an electronic module according to claim 8 or 9, characterized in that: One surface of the power terminal is a collapsed edge surface with a collapsed edge formed at the end. The other side of the power terminal is a burr surface connected to the fracture surface of the side. In the receiving step, the front ends of the pair of sliding portions of the mold are respectively formed with recesses corresponding to the cross sections of the power terminals when viewed from above. The shape of the bottom of the recessed portion of the sliding portion in contact with the collapsed edge surface among the pair of sliding portions corresponds to the shape of the collapsed edge surface. The shape of the bottom of the recessed portion of the sliding portion in contact with the burred surface among the pair of sliding portions is formed with convex portions on both side walls of the recessed portion.

11. The method for manufacturing an electronic module according to claim 8 or 9, characterized in that: A notch is provided in a shoulder portion of the recessed portion of at least one of the pair of sliding portions.

12. The method for manufacturing an electronic module according to claim 8 or 9, characterized in that: In the assembly forming step, an internal connection frame is assembled together. The internal connection frame is a flat plate-shaped member having an elongated hole. The internal connection frame supports the power terminal and electrically connects the electronic component to the power terminal. The first portion of the power terminal is pressed into the elongated hole, thereby supporting the power terminal and electrically connecting the electronic component to the power terminal. In the sealing step, the substrate, the electronic components, the internal connection frame, and the power terminals are sealed with a sealing member. The second portion of the power terminal is formed to be wider than the first portion.

13. An electronic module manufacturing device, used for implementing the electronic module manufacturing method according to claim 8, characterized in that: include: A first mold having the power terminal insertion hole and the pair of sliding parts; as well as A second mold, opposite to the first mold, One surface of the power terminal is a collapsed surface with a collapsed edge formed at the end. The other side of the power terminal is a burr surface connected to the fracture surface of the side. In a plan view, a recessed portion corresponding to the cross section of the power terminal is formed at the front end portion of the pair of sliding portions. The shape of the bottom of the recessed portion of the sliding portion in contact with the collapsed edge surface among the pair of sliding portions corresponds to the shape of the collapsed edge surface. The shape of the bottom of the recessed portion of the sliding portion in contact with the burred surface among the pair of sliding portions is formed with convex portions on both side walls of the recessed portion.

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